JPH0682951B2 - Electronic component mounting equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus capable of gripping an electronic component having a lead wire in a positioned state and mounting it on a substrate.

[Problems to be Solved by Conventional Techniques and Inventions] As is well known, electronic components that have been widely used in recent years are automatically supplied and gripped by a mounting device or the like and placed on a predetermined location such as a substrate. It is general that they are mechanically and electrically connected by being soldered to a predetermined place.

For example, Japanese Utility Model Publication No. 57-23920 or Japanese Patent Publication No. 62-6360 discloses a technique of supplying the electronic component by a storage band and automatically mounting the electronic component on a substrate.

This prior art will be described with reference to FIGS. 16 to 20. On the other hand, a flexible tape-shaped storage band 1 is formed with a storage recess 2 for electronic parts, while the storage band is provided on the edge of the storage band. Is a hole 3 into which a claw of a feed sprocket (not shown) is engaged
When the sprocket is rotated and the storage belt 1 is intermittently sent, and the electronic components stored in the storage recess 2 are sent and stopped at a predetermined position, the suction head 4 is The electronic parts are lowered to this portion, the electronic components are suctioned and gripped, and are conveyed to a predetermined location such as a substrate.

According to this prior art, the electronic component stored in the storage recess may rotate in the storage recess due to vibration or the like that may occur when the storage belt 1 is fed by the sprocket. Even if this rotation occurs, the electronic component to be housed in the housing recess is a chip-type electronic component 7 in which electrodes 6 are formed at both ends of a cylindrical main body 5 as shown in FIG. If it is, it can be gripped by the suction head and mounted on the substrate regardless of the rotation angle, and if it is a square type as shown in FIG. Don't

However, when a plurality of lead wires 8 are provided at one end of the cylindrical main body 5 as shown in FIG. 20, and the lead wires 8 are bent and the chip type electronic component 9 is rotated, When the electronic component 9 is conveyed and placed on a predetermined position on the substrate by the suction head, the lead wire 8 provided on the electronic component 9 is not reliably brought into contact with the land of the substrate, and the electronic component 9 is It becomes difficult to accurately mount the board on the board.

[Object of the Invention] The present invention has been made in view of the above circumstances, and even when the electronic component is rotated when the electronic component is supplied, the electronic component is gripped by the gripping device. It is an object of the present invention to provide an electronic component mounting device capable of correcting the rotation of the electronic component previously.

[Means and Actions for Solving Problems] In order to achieve the above object, the electronic component mounting apparatus of the present invention comprises:
An electronic component storage band having a large number of storage recesses at a predetermined pitch in the longitudinal direction, a mounting portion provided in the storage recess for mounting the outer peripheral surface of the cylindrical electronic component body stored in the storage recess, and the storage recess Transfer the storage area containing the electronic components to the reference surface portion provided in the storage recess for contacting the contact portion of the lead wire extended from the electronic component main body stored in And a transfer section that is provided at a lower position of the storage band guided by the transfer section and magnetically attracts the lead wire of the electronic component stored in the storage recess to rotate the electronic component stored in the storage recess. And magnetic attraction return means for returning the electronic component to the original position and bringing the contact portion of the lead wire into contact with the reference surface portion when the electronic component is lifted or lifted.

With such a configuration, even if the electronic component stored in the storage recess of the storage belt is rotated or lifted before the electronic component supplied to the supply unit is gripped by the gripping device, the magnetic component is magnetic. The lead wire of the electronic component is attracted by the magnetic force of the suction return means, the electronic component is returned to the original position, and the contact portion of the lead wire is brought into contact with the reference surface portion to correct the rotation and the lifting of the electronic component.

Embodiments of the Invention Embodiments of a storage band for electronic components according to the present invention will be described below with reference to the drawings.

1 to 8 relate to an embodiment of the present invention, FIG. 1 is a sectional side view of a main part of the present invention, FIG. 2 is a plan view of a storage band for electronic parts, and FIG. 3 is FIG. III-III line view of FIG. 4, FIG. 4 is a reference perspective view of a storage band for electronic parts, FIG. 5 is a perspective view of a main part of a mounting device for electronic parts, and FIG. FIG. 7 is an operation state explanatory view showing a state in which the position of the electronic component is corrected, and FIG. 8 is an operation state explanatory diagram showing a state in which the electronic component is mounted on the board. is there.

In these figures, reference numeral 11 is a storage band for flexible electronic components, and storage recesses 12 are formed at a predetermined pitch in the longitudinal direction of the storage band 11. This storage recess 12
Is formed on the storage band 11 by means of molding or the like, and a portion of the back surface of the storage band 12 corresponding to the storage recess 12 is a protrusion 11a.

The storage recess 12 has a rectangular plane, and the length of the rectangle is orthogonal to the length of the storage band 11. Further, ribs 11b are formed on the storage belt 11 in the longitudinal direction of the storage recess 12 in the longitudinal direction, and holes 13 are continuously formed in one of the ribs 11b with a predetermined pitch in the longitudinal direction of the storage belt 11. Has been drilled.

The four inner circumferences of the storage recess 12 are the bottom surface 12 of the storage recess 12.
In addition to being formed as a uniform tapered surface that converges toward a, the surfaces facing each other on the left and right in the longitudinal direction of the storage recess 12 are formed with a large taper angle at a constant distance. This surface is the guide portion 14. Further, a flat surface formed in parallel with the bottom surface 12a is formed at a portion of the bottom surface 12a of the storage recess 12 that escapes the guide portion 14, and this surface serves as a reference portion 15.
In this embodiment, the reference portion 15 and the bottom surface 12a are flush with each other.

The housing recess 12 in the above description is for housing the electronic component 17.

In this electronic component 17, for example, a pair of lead wires 18 are projected on one end surface 17b of a cylindrical main body 17a. This lead wire 18
Is bent at a right angle while being extended in a direction away from the end surface 17b, is further bent parallel to the end surface 17b at the tip thereof, and is bent again in a direction away from the end surface 17b at the tip end 18a. In the electronic component 17 used in the present embodiment, the extension of the plane formed by the plurality of bent tip portions 18a is the same as the side portion of the main body 17a of the electronic component 17, and The distance between the tip portions 17b is formed larger than the diameter of the main body 17a.

When the electronic component 17 having such a configuration is stored in the storage recess 12, the axis of the electronic component 17 is stored while being laid in the longitudinal direction of the storage recess 12. In this case, both sides of the main body 17a of the electronic component 17 are brought into contact with the guide portions 14 to position the electronic component 17 in the storage recess 12. The bent tip portions 18a of the lead wires 18 are brought into contact with the reference portions 15 to position the electronic component 17 in the rotating direction.

In the storage band 11, in the state where the above-mentioned electronic components 17 are stored in each storage recess 12, the opening surface of the storage recess 12 is covered with a tape 19 having the same width and length as the storage band 11. It is set in the device body 20.

As shown in FIG. 5, the apparatus main body 20 is provided with a guide member 22 for feeding the storage band 11. A groove 23 is provided in the center of the guide member 22, and the groove 23 is configured as a supply portion, and flanges 24 are formed on both sides of the groove 23, and the protruding portion 11a of the storage band 11 is formed. The ribs 11b of the storage band 11 are engaged with the groove 23 and are in sliding contact with the collar 24, respectively.

In addition, a part of the guide member 22 and the guide member 22
Below the portion where the lead wire 18 of the electronic component 17 housed in the housing recess 12 when the housing band 11 is engaged is an example of magnetic attraction returning means to the lead wire 18. The electromagnet 26 is arranged, and each of the plurality of lead wires 18 passing through this portion is attracted and brought into contact with the reference portion 15, so that the electronic component 17 can be rotated when the electronic component 17 is rotated. Rotation is corrected.

On the other hand, a pulley (not shown) is arranged behind the guide member 22, and the storage band 11 is wound around the pulley. A roller 27 is arranged on the upper surface of the guide member 22, and a winding device 28 is arranged further above the roller 27, and a tape 19 covering the surface of the storage belt 11 is provided on the roller 27. It is peeled off through the winding device and wound around the winding device 28.

A sprocket 29 is arranged in front of the guide member 22. In the center of this sprocket 29 is the above storage band
A concave portion (not shown) is provided to allow the protruding portion 11b of 11 to escape, and the side of the sprocket 29 has the storage belt 11
The engaging claw 29a that is engaged with the hole 13 formed in the rib 11b is provided in a circular shape, and the sprocket 29 is intermittently rotated to pull the storage storage band 11,
The electronic component stored in the storage recess 12 of the storage band 11
17 will be sent. The rotation of the sprocket 29, the rotation of the winding device 28, and the energization of the electromagnet 26 are configured to be synchronized with each other, and the electronic component in the storage recess 12 is moved to a predetermined position. When stopped by being energized, by energizing this electromagnet 26,
The lead wire 18 of the electronic component 17 is sucked and brought into contact with the reference portion 15.

Further, above the guide member 22 and between the roller 27 and the sprocket 29, a suction head 31, which is an example of a gripping means of the electronic component 27, is arranged, and an electronic device is provided by intermittent rotation of the sprocket 29. The part 17 has been moved into place,
When it is stopped, it is configured to descend to this stopped portion. The suction head 31 has a rounded end having the same curvature as the main body 17a of the electronic component 17, and the suction head 31 has a hollow portion 31a at its axial center. The electronic component 17 is gripped by sucking air from the tip through the.

The electronic component 17 held by the suction head 31 is conveyed to the center of the position correction device 32 and stopped. As shown in FIG. 7, the position correction device 32 is provided with a plurality of pressing members 32a which are arranged so as to be aggregated and separated from each other on a plane orthogonal to the axis of the suction head 31. By pressing the pressing member 32a of the electronic component 17 against the four circumferences of the electronic component 17 held by the adsorption head 31 and stopped, the adsorption head of the electronic component 17 is stopped.
Positioning with respect to 31 is further complemented. Further, the electronic component 17 whose position is corrected by the position correcting device 32 is configured to be conveyed to a fixed position of the substrate 33 by the suction head 32, and is conveyed and placed at this fixed position. In this case, the tip ends 18a of the lead wires 18 provided in the electronic component 17 are brought into contact with the lands 33a formed on the substrate 33 and soldered to the lands 33a.

Next, the operation of the embodiment having the above configuration will be described.

A storage band in which electronic components 17 are stored in each of the storage recesses 12.
The protrusion 11a of the groove 11 of the guide member 22 is an example of the supply portion.
The storage band 11 is set in the apparatus main body 20 by engaging with the rib 3b and slidingly contacting the rib 11b of the storage band 11 with the flange 24 of the guide member 22. The storage belt 11 located behind the guide member 22 is wound around a pulley (not shown), while the portion of the storage belt 11 located in front of the guide member 22 is wound around a sprocket 29 and stored. Rib 11 of obi 11
The hole 13 formed in b is engaged with the claw 29a of the sprocket 29.

During this period, the storage band 11 is vibrated, but since the opening of the storage recess 12 is covered with the tape 19, the electronic component 17 stored in the storage recess 12 is vibrated by the vibration. It is not emitted more.

When the storage belt 11 is set in the device body 20, the storage recess is formed.
The tape 19 covering the opening of 12 is peeled off, and the tip of the tape 19 is wound around the winding device 28.

When the operation of the apparatus main body 20 is started in this state, the sprocket 29 is intermittently rotated, and the winding device 28 is rotated in synchronization with this rotation, and the winding device 28 rotates the While the tape 19 is peeled off via the roller 27, the storage band 11 is pulled by the sprocket 29, and the storage band 11 is intermittently fed.

As described above, a plurality of storage recesses 12 are formed in the longitudinal direction of the storage band 11, and the electronic components 17 are stored in each of the storage recesses 12. The part 17 is delivered and then stopped in place.

When the storage belt 11 is sent by the sprocket 29, the sprocket 29 causes the storage belt 11 and the storage recess 12
It is conceivable that the electronic component 17 housed in is vibrated.

Even if the storage band 11 and the electronic component 17 are vibrated, the left and right side surfaces of the electronic component 17 are in contact with the guide portions 14 formed on the left and right in the longitudinal direction of the storage recess 12. Since the positioning is performed, the relative positions of the electronic component 17 and the storage recess 12 are prevented from being displaced.

Further, since the tip end portion 18a of the lead wire 18 of the electronic component 17 is in contact with the reference portion 15 of the storage recess 12, the electronic component 17 is rotated in the storage recess 12 by the above-mentioned vibration. Is prevented as much as possible.

If a situation occurs in which the electronic component 17 is rotated in the storage recess 12, as shown in FIG.
At least one of the end portions 18a of the lead wires 18 of 17 is separated from the reference portion 15. An electromagnet 26, which is an example of a biasing means for the lead wire 18, is arranged at a portion of the guide member 22 where the lead wire 18 is stopped, and for example, a tip portion of the lead wire 18 of the stopped electronic component 15 is provided. Since it is configured to absorb 18a, when the electronic component 17 is stopped at this portion, the electromagnet 26 causes the plurality of tip portions 18
The a is urged toward the reference portion 15 and brought into contact with the reference portion 15 to correct the rotation of the electronic component 17.

In this manner, when the electronic component 17 is positioned with respect to the storage recess 12, when the sprocket 29 moves to a predetermined position and stops, the suction head 31 is lowered,
The electronic component 17 is gripped by the suction force of the suction head 31 and lifted as shown in FIG. Then, as shown in FIG. 7, it is conveyed to the center of the position correction device 32 and stopped. Next, the pressing member 32a of the position correction device 32 moves toward the electronic component 17 and presses the four circumferences of the main body 17a, so that the position of the electronic component 17 with respect to the suction head 31 is further complemented.

When the position of the suction head 31 is corrected in this way, the suction head 31 starts to move further, and the electronic component
The 17 is placed on the substrate 33 at a predetermined position. Then, the tip end portion 18a of the lead wire 18 of the electronic component 17 is brought into contact with the land 33a of the substrate 33. Then, the tip portion 18a and the land 33a are soldered.

When this step is completed, the suction head 31 stops suction and is moved above the guide member 22, and the storage band 11 is moved and stopped by the formation pitch of the storage recess 12 by the action of the sprocket 29. Then, the same operation as described above is repeated.

In this embodiment, since the electronic component 17 is supplied with the side portion of the electronic component 17 being in contact with the guide portion 14 formed in the storage recess 12, the positioning of the electronic component 17 is performed. Since the electronic component 17 is stored in the storage recess 12 in a single number, the electronic component 17 is prevented from being damaged or the like.

In the present embodiment, an example in which the tip end portion 18a of the lead wire 18 is formed to be wider than the diameter of the main body 17 of the electronic component 17 is used, but this storage band 11 is described above. Not only the electronic component 17 having the configuration, but the tip portion 18a can be stored even if the tip portion 18a is formed to have a diameter substantially equal to or smaller than the diameter of the main body 17a, and in this case as well. It goes without saying that the action and effect are exhibited. Further, the storage belt 11 used in this embodiment is configured such that the reference portion 15 is a flat surface and is parallel to the bottom surface 12a of the storage recess 12, but the position and shape of the reference portion 15 are limited to this configuration. However, it is not necessary that the lead wire 18 of the electronic component 17 is brought into contact with the top of the edge, for example, and it is possible to form the reference surface 15 as a flat surface. Also in this case, it is possible to form the bottom surface 12a with a step, or to form the bottom surface 12a with a predetermined angle.

Further, in the present embodiment, an example in which the electromagnet 26 is arranged at an area where the lead wire 18 is stopped as an example of the forced urging means for the lead wire 18 has been described. It is not limited to 26, and may be a permanent magnet or an electromagnetic coil, for example. Furthermore, in this embodiment, these magnets are
Although the example in which the lead wire 18 of 17 is arranged only below the portion where the lead wire 18 is stopped has been described, this magnet is formed in an L shape, and the lead wire is attracted downward and brought into contact with the reference portion 15. At the same time, the lead wire 18 may be sucked in the longitudinal direction of the housing recess 12 and brought into contact with the side wall of the housing recess to position the electronic component 17 with respect to the housing recess 12. .

Further, in the present embodiment, the groove 23 is used as an example of the supply unit, and the example in which the electronic component 17 housed in the housing band 11 is supplied to the groove 23 has been described.
The supply portion to be supplied is not limited to the guide member, and should not be limited to the configuration in which the electronic component 17 is supplied through the storage band 11, and for example, the storage band 11
It is also possible to abolish the above and to configure the supply section as a recess for accommodating a single electronic component 17, or to configure the supply section to slide the electronic component and supply it via a feeding device. Is.

Furthermore, in the present embodiment, the example in which the suction head 31 is provided as the gripping means for the electronic component 17 has been described, but this gripping means should not be limited to the suction head 31.
For example, it may be mechanical.

9 and 10 relate to the second embodiment of the present invention. FIG. 9 is a plan view of the storage recess, and FIG. 10 is a sectional side view of the storage recess. The same members as those used in the above-described first embodiment and members having the same function are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, when the electronic component 17 is stored in the storage recess 12, the side wall of the storage recess 12 opposed to the end surface 17b from which the lead wire 18 of the electronic component 17 is projected is located substantially at the center of the storage recess 12. Is formed so as to project toward the center of the electronic component 17 when the electronic component 17 is stored in the storage recess 12.
The tip end portion 34 is located in the middle of the lead wire 18 protruding in plural, and the tip end portion 34 is located very close to the end surface 17b of the electronic member 17.

With this configuration, even if the storage belt 11 is vibrated, the tip of the protrusion 34 is the end surface 17b of the electronic component 17.
And the tip portion 34a is brought into contact with the inside of the lead wire 18 protruding from the end surface 17b, and the housing recess 12
The effect of more reliably preventing the vibration of the electronic component 17 inside is exhibited.

In this embodiment, the end face of the tip portion 34a is described as an example in which the end face is formed vertically. However, this end face is an inclined face that gradually projects toward the bottom surface 12a of the storage recess 12, and The end surface 17b of the electronic component 17 may be brought into contact with the above.

FIG. 11 is a perspective view of the storage recess according to the third embodiment of the present invention.

In this embodiment, a step is provided between the bottom surface 12a of the housing recess 12 and the reference portion 15 with which the tip portion 18a of the lead wire 18 abuts, for example. An electronic component 17 whose length is shorter than that of the above-described two embodiments and in which the plane formed by the tip portions 18a of the plurality of lead wires 18 and one side surface of the main body 17a of the electronic component 17 do not form the same plane is accommodated. It should be done. With this configuration, the same operational effects as the first embodiment described above are exhibited.

FIG. 12 is a perspective view of a storage recess according to the fourth embodiment of the present invention.

In this embodiment, the electronic component 17 to be stored in the storage recess 12 is used.
Is provided with a single lead wire 18, and a tip end portion 18a of the lead wire 18 is bent and formed in a direction away from the end surface 17b of the electronic component 17.

Further, in the above-mentioned three embodiments, the reference portion 15 with which the tip portion 18a abuts and the bottom surface 12a of the storage recess 12 are formed in parallel or in the same plane, but in the present embodiment, this reference portion is formed.
The lead wire 18 is provided so as to face the lead wire 18 from the side, and the surface forming the reference portion 15 is formed in a tapered shape that widens as it is separated from the bottom surface.

With this configuration, the reference portion 15 is brought into contact with the side of the lead wire 18 and the tip portion 18a of the lead wire 18, and the electronic component 1
The rotation of 7 is prevented.

Further, in this embodiment, since the reference portion 15 formed so as to face each other is formed so as to expand as it is separated from the bottom surface 12a of the storage recess 12, when the electronic component 17 is stored in the storage recess 12. Alternatively, when the electronic component 17 is taken out of the housing recess 12, friction is prevented from occurring between the lead wire 18 and the reference portion 15 as much as possible, and there is an effect that the housing and taking out are easy.

FIG. 13 is a perspective view of a storage recess according to a fifth embodiment of the present invention.

In this embodiment, the electronic component 17 to be stored in the storage recess 12 is used.
The lead wire 18 of the main body 17a is projected from both end surfaces 17b and 17c of the main body 17a, respectively, and the tip end portion 18a is bent, and the reference portion 15 formed in the accommodating recess 12 has a plurality of leads. Two pairs are provided so as to come into lateral contact with each of the lines 18. With this structure, the rotation of the electronic component 17 is prevented.

FIG. 14 is a perspective view of a storage recess according to a sixth embodiment of the present invention.

In this embodiment, the electronic component 17 to be stored in the storage recess 12 is used.
The lead wire 18 is singularly projected from both end surfaces 17b, 17c of the main body 18a, and the tip end portion 18a of the lead wire 18 is bent and formed, and the reference portion 15 provided in the storage recess 12 is provided. A pair is formed in the longitudinal direction of the storage recess 12 in parallel with the bottom surface 12a of the storage recess 12 and having a step.

With this configuration, the tip end portion 18 of the bent lead wire 18 is
By making a parallel to the longitudinal direction of the storage band 11 and placing it on the reference portion 15, the rotation of the electronic component 17 is prevented.

FIG. 15 is a sectional side view of the storage belt 11 according to the seventh embodiment of the present invention.

In this embodiment, the guide portion 14 provided in the storage recess 12 is
Are formed in parallel with each other and face each other.
Tapered part in which the vicinity of the opening of the storage recess 12 of 14 is separated from each other
14a is formed.

With this configuration, the guide portions 14 formed in parallel position the electronic component 17 in the storage recess 12.
Further, since the guide portion 14 is formed with the taper portion 14a, it is easy to store the electronic component 17 in the storage recess 12 and take out the electronic component 17 from the storage recess.

[Effects of the Invention] As described above, according to the electronic component mounting apparatus of the present invention, even if the electronic component is rotated when the electronic component is supplied, the electronic component can be held by the gripping device. Since the rotation of this electronic component is corrected before it is gripped,
This has an effect that the electronic component can be mounted on the substrate easily and accurately.

[Brief description of drawings]

1 to 8 relate to an embodiment of the present invention, FIG. 1 is a sectional side view of a main part of the present invention, FIG. 2 is a plan view of a storage band for electronic parts, and FIG. 3 is FIG. III-III line view of FIG. 4, FIG. 4 is a reference perspective view of a storage band for electronic parts, FIG. 5 is a perspective view of a main part of a mounting device for electronic parts, and FIG. FIG. 7 is an operation state explanatory view showing a state in which the position of the electronic component is corrected, and FIG. 8 is an operation state explanatory diagram showing a state in which the electronic component is mounted on the board. 9 and 10 relate to the second embodiment of the present invention. FIG. 9 is a plan view of the storage recess, FIG. 10 is a sectional side view of the storage recess, and FIG. 11 is the third embodiment of the present invention. FIG. 12 is a perspective view of the storage recess according to the fourth embodiment of the present invention, FIG. 13 is a perspective view of the storage recess according to the fifth embodiment of the present invention, and FIG. Of the present invention A perspective view of the storage recess according to the sixth embodiment, FIG. 15 is a sectional side view of the storage recess according to the seventh embodiment of the present invention, and FIGS. 16 to 20 are related to the prior art,
FIG. 16 is a perspective view of a storage band for storing a cylindrical chip type electronic component, FIG. 17 is a perspective view of a storage band for storing a rectangular chip type electronic component, and FIG. 18 is a cylindrical chip type electronic component. Fig. 19 is a perspective view of a component, Fig. 19 is a perspective view of a rectangular chip-type electronic component, Fig. 20.
The figure is a perspective view of a cylindrical chip-type electronic component having a lead wire. 11 …… storage band 12 …… storage recess 14 …… guide part 15 …… reference part 17 …… electronic part 18 …… lead wire 20 …… device body 23 …… supply part 26 …… forced biasing means 31 …… Gripping device 31 …… Gripping device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuo Baba Ina 165, Ina City, Nagano Prefecture, Shinei Communication Industry Co., Ltd. (72) Inventor Akio Nakamura 165 Ina, Ina City, Nagano Prefecture Shinei Communication Industry Co., Ltd. 72) Inventor Izumi Urano Ina City, Nagano Prefecture, Ina 165, Ina, Shinei Communication Industry Co., Ltd. (72) Inventor, Tetsuya Kurokawachi Ina City, Ina City, Ina, 165, Shinei Communication Industry Co., Ltd. 165 Ina, Ina City, Ina Shin-Etsu Tsushin Kogyo Co., Ltd. (56) Reference JP-A-62-146172 (JP, A) Seki 57-39500 (JP, U) JP-B 62-6360 (JP, B2) Actual public Sho 57-23920 (JP, Y2)

Claims (2)

[Claims] 1. An electronic component storage band having a plurality of storage recesses at a predetermined pitch in a longitudinal direction, and a mounting portion provided in the storage recess for mounting an outer peripheral surface of a cylindrical electronic component main body stored in the storage recess. And a reference surface portion provided in the storage recess for contacting the contact portion of the lead wire extended and bent from the electronic component body stored in the storage recess, and the electronic components are stored in the multiple storage recesses. And a transfer portion for transferring the storage band, and a lead wire of an electronic component stored in the storage recess, which is provided at a lower position of the storage band guided by the transfer part, attracts the lead wire of the electronic component stored in the storage recess by magnetic force, and stores the electron in the storage recess. When the component rotates or floats up, the electronic component is provided with a magnetic attraction restoring means for returning the electronic component to the original position and bringing the contact portion of the lead wire into contact with the reference surface portion. Mounting device. 2. A plurality of storage recesses provided in the electronic component storage belt are directed upward to position the stored electronic components by abutting both outer peripheral side surfaces of a cylindrical electronic component main body stored in the storage recesses. The mounting apparatus for electronic components according to claim 1, wherein the mounting apparatus has a taper portion that is widened toward the end.