JPS637291A - Holder - Google Patents

Holder

Info

Publication number
JPS637291A
JPS637291A JP61147349A JP14734986A JPS637291A JP S637291 A JPS637291 A JP S637291A JP 61147349 A JP61147349 A JP 61147349A JP 14734986 A JP14734986 A JP 14734986A JP S637291 A JPS637291 A JP S637291A
Authority
JP
Japan
Prior art keywords
component
holding member
suction
holding
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61147349A
Other languages
Japanese (ja)
Inventor
隆憲 舟橋
井上 利勅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP61147349A priority Critical patent/JPS637291A/en
Publication of JPS637291A publication Critical patent/JPS637291A/en
Pending legal-status Critical Current

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  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は保持装置に関し、電子部品等の部品を非接触な
状態で吸着保持し種々な方式で無理なく位置決めできる
保持装置に関するものである。この保持装置は、電子部
品を吸着保持して回路基板に装着する部品装着機等に好
適に適用し得るものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a holding device, and more particularly to a holding device that can suction-hold components such as electronic components in a non-contact manner and easily position them using various methods. This holding device can be suitably applied to a component mounting machine, etc., which sucks and holds electronic components and mounts them on a circuit board.

従来の技術 一般に、ICなどの電子部品を回路基板に装着する電子
部品装着機においては、第8図に示すように、所定の移
送経路の前端部に歯輪を配設してなる移送装置Fにてテ
ープ状部品集合体Aを一方向に間欠的に移送し、前記移
送経路上を移送される間に、テープ剥離装置りにて被覆
テープCを剥離して巻き取り、テープ状部品集合体Aの
収容凹部Bに収容された電子部品Pを保持装置Eによっ
て吸着保持して取り出すとともに、この保持装置Eにて
回路基板G上の所定位置に装着するように構成されてい
る。
2. Description of the Related Art In general, in an electronic component mounting machine that mounts electronic components such as ICs onto a circuit board, as shown in FIG. The tape-shaped parts assembly A is intermittently transferred in one direction, and while being transported on the transfer path, the covering tape C is peeled off and wound up by a tape peeling device, and the tape-shaped parts assembly A is transported in one direction intermittently. The electronic component P accommodated in the housing recess B of A is suction-held and taken out by a holding device E, and is mounted on a predetermined position on a circuit board G by the holding device E.

ところで、電子部品Pを回路基板Gの所定位置に正確に
装着するためには、保持装置Eの軸心に対して電子部品
Pの中心が一敗するように保持する必要がある。そこで
、従来、第9図に示すように、吸着ノズルHの周囲に、
密着状態で吸着保持した電子部品の位置を規正する位置
規正爪Iを開閉可能に配設した保持装置Eが提案されて
いる。又、電子部品Pが4方向にリードを有するICの
場合には、4方向からの位置規正が必要であり、第9図
の如く2対の位置規正爪Iが設けられている。
By the way, in order to accurately mount the electronic component P at a predetermined position on the circuit board G, it is necessary to hold the electronic component P so that the center of the electronic component P is aligned with the axis of the holding device E. Therefore, conventionally, as shown in FIG. 9, around the suction nozzle H,
A holding device E has been proposed in which a position regulating claw I for regulating the position of an electronic component held by suction in a close contact state is arranged to be openable and closable. Further, when the electronic component P is an IC having leads in four directions, position adjustment from four directions is required, and two pairs of position adjustment claws I are provided as shown in FIG.

発明が解決しようとする問題点 ところが、上記のようにノズルHに密着状態で吸着保持
されている部品Pを位置規正爪Iによって強制的に位置
規正するために、ノズルHと部品Pとの間に強い摩擦が
生じ、その摩擦力やそれを上まわる位置規正力を部品P
に及ぼすために、部品Pを損傷することがある。また部
品Pの位置規正にも限界があって例えば4方向にリード
を有するICの場合でリードのピッチが0.8mm以下
になると位置精度の限界のために適正に装着することが
できない。
Problems to be Solved by the Invention However, in order to forcibly position the part P, which is suctioned and held in close contact with the nozzle H, with the position adjustment claw I, the gap between the nozzle H and the part P is strong friction occurs, and that frictional force and the positioning force exceeding it are applied to the part P.
This may cause damage to the part P. There is also a limit to the positioning of the component P. For example, in the case of an IC having leads in four directions, if the pitch of the leads is less than 0.8 mm, the component P cannot be properly mounted due to the limit in positional accuracy.

本発明は部品を非接触な状態で吸着保持して無理なく簡
単に位置決めでき上記従来の問題点を解消し得る保持装
置の提供を目的とするものである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a holding device that can hold parts by suction in a non-contact manner and easily position them without strain, and can solve the above-mentioned conventional problems.

問題点を解決するための手段 本発明は上記目的を達成するために、第1の発明として
保持部材の端面に、部品を保持するための吸着部と、吸
着保持する部品を保持部材から浮かせるための気体噴出
口とを設け、部品を非接触で吸着保持するようにしたこ
とを特徴とするものである。
Means for Solving the Problems In order to achieve the above object, the present invention provides, as a first invention, a suction portion for holding a component on an end face of a holding member, and a suction portion for lifting the component to be held by suction from the holding member. The device is characterized in that it is provided with a gas jet port, so that parts can be held by suction in a non-contact manner.

又第2の本発明は、第1の発明に対し保持部材の端面に
部品を隙間を持って受入れる凹部を設け、吸着部は前記
凹部に部品を受入れて吸着保持すよるように設けた点、
および気体噴出口を前記凹部の奥底面および周囲に設け
て部品を凹部内で保持部材から浮かせるようにした点を
特徴とするものである。
A second aspect of the present invention is that, in contrast to the first aspect, a concave portion is provided on the end face of the holding member to receive the component with a gap, and the suction portion is provided so as to receive the component in the concave portion and hold the component by suction.
The present invention is characterized in that a gas outlet is provided on the inner bottom surface of the recess and around the recess so that the component is floated from the holding member within the recess.

第3の発明は、第1の発明に対し吸着部を磁石による磁
性吸着部とし、磁性吸着部は部品の周囲に突設された磁
性体よりなる突起物に対向する突起片とそれを磁化させ
る磁石とからなることを特徴とするものである。
A third invention differs from the first invention in that the attraction part is a magnetic attraction part using a magnet, and the magnetic attraction part includes a protrusion piece facing a protrusion made of a magnetic material protruding around the component and magnetizing it. It is characterized by consisting of a magnet.

さらに第4の発明は、第3の発明に対し保持部材の端面
に、気体圧により突出可能でかつその突出側端部に気体
噴出用の穴を有した物品を離脱させるためのピストンと
を設けた点を特徴とするものである。
Furthermore, the fourth invention is different from the third invention by providing a piston on the end surface of the holding member that can be projected by gas pressure and has a hole for blowing out gas at the projecting end for releasing the article. It is characterized by the following points.

作用 第1の発明では、保持部材に吸着保持する部品を、気体
噴出口から噴出させる気体の圧ないし気体流によって保
持部材から浮かせるので、部品を保持部材に非接触な状
態で吸着保持することができる。
In the first aspect of the invention, since the component to be suctioned and held on the holding member is floated from the holding member by the pressure or gas flow of the gas ejected from the gas outlet, the component can be suctioned and held in a non-contact state with the holding member. can.

第2の発明では、部品を保持部材の端面に設けた凹部に
隙間を持って受入れて吸着保持し、その凹部の奥底面お
よび周囲の気体噴出口から噴出させる気体の圧ないし気
体流によって部品を凹部内で保持部材から浮かせるとと
もに安定させることができる。これにより部品を保持部
材に非接触な状態で吸着保持することができるのに加え
、凹部への受入れによって適当な位置決めをも行うこと
ができる。また凹部自体は部品保持力を全く持たないの
で、吸着解除によって部品をその自重だけでスムーズに
離脱させることができる。
In the second invention, the component is received with a gap in a recess provided on the end surface of the holding member and held by suction, and the component is held by the pressure or gas flow of gas ejected from the deep bottom surface of the recess and the surrounding gas outlet. It can be floated from the holding member and stabilized within the recess. As a result, not only can the component be suction-held without contacting the holding member, but also appropriate positioning can be achieved by receiving the component into the recess. Further, since the recess itself has no component holding force, the component can be smoothly removed by its own weight by releasing the suction.

第3の発明では、部品は磁石の吸着力により吸着保持さ
れるとともに、気体噴出口から噴出する気体流の作用で
保持部材の端面に対して非接触状態となり、浮動状態で
吸着保持され、かつ磁化された突起片に部品の突起物が
吸引されることにより、部品の突起物が突起片の中心位
置に対向するように部品が位置決めされ、正確に部品位
置を規正することができる。
In the third invention, the component is attracted and held by the attraction force of the magnet, and is brought into a non-contact state with the end surface of the holding member by the action of the gas flow ejected from the gas outlet, so that the part is attracted and held in a floating state, and By attracting the protrusion of the component to the magnetized protrusion, the component is positioned so that the protrusion of the component faces the center position of the protrusion, and the position of the component can be accurately regulated.

又、保持していた部品を保持解除する際に、噴出気体の
流速を速くすると保持部材の端面と部品間の圧力が低下
して部品がさらに吸着されるような現象を生ずることが
あり、円滑に保持解除できない場合があるが、第4の本
発明によれば、ピストンにて部品を押圧して瞬間的に保
持部材の端面から離間させることができるため、正確か
つ確実に保持解除することができ、しかも穴から噴出す
る気体流にてピストンは部品に対して非接触で押圧する
ので、ピストンと部品の接触によるショックやピストン
の移動振れによって規正位置がずれてしまうというよう
な虞れもない。
In addition, when releasing the held part, if the flow rate of the ejected gas is increased, the pressure between the end face of the holding member and the part may decrease, causing a phenomenon in which the part is further attracted. However, according to the fourth aspect of the invention, since the piston can press the component and instantly separate it from the end surface of the holding member, the holding can be released accurately and reliably. Moreover, since the piston is pressed against the part by the gas flow ejected from the hole without contacting the part, there is no risk of the regulated position being shifted due to shock due to contact between the piston and the part or movement of the piston. .

実施例 以下、本発明の実施例について第1図〜第8図を参照し
ながら説明する。
EXAMPLES Hereinafter, examples of the present invention will be described with reference to FIGS. 1 to 8.

第1図に示す第1実施例において、1は、横断面形状が
吸着保持すべき電子部品の平面形状にほぼ一致する方形
状の保持部材であって、軸心部には吸引通路2が形成さ
れるとともにその周囲に複数の気体送給通路3が形成さ
れており、それぞれ保持部材1の端面4で吸引口(吸着
部)5及び気体噴出口6として開口している。
In the first embodiment shown in FIG. 1, reference numeral 1 denotes a rectangular holding member whose cross-sectional shape almost matches the planar shape of the electronic component to be held by suction, and a suction passage 2 is formed in the axial center. At the same time, a plurality of gas supply passages 3 are formed around the holding member 1, and are opened as a suction port (adsorption portion) 5 and a gas jet port 6 at the end surface 4 of the holding member 1, respectively.

以上の構成において、保持部材1の吸引通路2及び気体
送給通路3にそれぞれ図外の吸引源及び圧力気体源を連
通させた状態で、保持部材lの端面4を吸着保持すべき
電子部品Pに近付けると、電子部品Pは吸引口5による
真空吸引力による吸着力によって保持部材lの端面4に
吸着されるとともに、気体噴出口6から噴出する気体流
にて端面4に対して非接触状態となり、電子部品Pは浮
動状態で吸着保持される。
In the above configuration, the electronic component P to be held by suction is attached to the end surface 4 of the holding member 1 with a suction source and a pressure gas source (not shown) communicated with the suction passage 2 and the gas supply passage 3 of the holding member 1, respectively. , the electronic component P is attracted to the end surface 4 of the holding member L by the suction force generated by the vacuum suction force of the suction port 5, and is kept in a non-contact state with respect to the end surface 4 by the gas flow ejected from the gas jet port 6. Therefore, the electronic component P is held by suction in a floating state.

ここで図示しないが前記した第9図に示すような位置規
正爪等を利用して電子部品Pを位置決めする場合でも、
電子部品Pと保持部材1との摩擦抵抗なしに無理なく確
実に行うことができ、電子部品Pを損傷させるようなこ
とがないし、位置規正が小さな規正力で正確に行える。
Although not shown here, even when positioning the electronic component P using a positioning claw or the like as shown in FIG. 9 described above,
This can be done easily and reliably without any frictional resistance between the electronic component P and the holding member 1, the electronic component P will not be damaged, and the position can be adjusted accurately with a small regulating force.

次いで、電子部品Pを回路基板に装着する際には、吸引
口5の吸引源との接続を断つことによって、電子部品P
は気体噴出口6から噴出する気体流にて電子部品Pを迅
速確実に離脱させることができる。しかし気体噴出口6
からの気体噴出を停止させておいても電子部品Pは自重
でスムーズに離脱することができる。
Next, when mounting the electronic component P on the circuit board, the electronic component P is disconnected from the suction source of the suction port 5.
The electronic component P can be quickly and reliably removed by the gas flow ejected from the gas outlet 6. However, gas outlet 6
Even if the gas jetting from the electronic component P is stopped, the electronic component P can be smoothly removed by its own weight.

第2図に示す本発明の第2実施例は、保持部材1の端面
4に電子部品Pを若干の隙間を持って受入れる凹部4a
を形成し、凹部4aの奥底面中央に前記吸引口5を、ま
た凹部4aの奥底面4aの吸引口5のまわりと凹部4a
の周囲とに前記気体噴出口6をそれぞれ設けである。
The second embodiment of the present invention shown in FIG.
The suction port 5 is formed in the center of the deep bottom surface of the recess 4a, and the suction port 5 is formed in the center of the deep bottom surface of the recess 4a, and the suction port 5 is formed in the center of the deep bottom surface 4a of the recess 4a.
The gas ejection ports 6 are provided around the periphery of the periphery.

この場合、第1の実施例に加え、電子部品Pの吸着保持
を凹部4aに電子部品Pを受入れた状態で行うことがで
きるので、その凹部4aによって電子部品Pの位置決め
を行うことができるので、特別な位置規正手段が要らな
い。しかも吸着される電子部品Pは凹部4a内でそのま
わりに気体噴出口6から噴出される気体の圧ないし気体
流によって凹部4aの内面から浮いた非接触な状態にあ
るので、凹部4aとの嵌り合いによって傷ついたりしな
いし、吸着解除によって電子部品Pは自動だけでも凹部
4aからスムーズに離脱するから電子基板等への装着も
無理なく fl!実に行われる。
In this case, in addition to the first embodiment, since the electronic component P can be held by suction while the electronic component P is received in the recess 4a, the electronic component P can be positioned by the recess 4a. , no special positioning means is required. Furthermore, the electronic component P to be attracted is in a non-contact state floating from the inner surface of the recess 4a due to the pressure or gas flow of the gas ejected around it from the gas outlet 6 within the recess 4a. It will not be damaged due to contact, and the electronic component P can be easily removed from the recess 4a even if it is only automatic by releasing the suction, so it is easy to attach it to the electronic board, etc. fl! It is actually done.

第3図から第5図に示す第3実施例では、第1実施例で
の前記保持部材1の四周面には、鉄などの強磁性体から
なる規正板7が配設されている。この規正板7の端部は
保持部材1の端面4より突出するとともに電子部品Pの
周縁に適当な隙間をあけて嵌合するように切欠部8が形
成されている。又、この規正板7の外面には磁極を多数
並列して着磁された永久磁石9が貼着されており、さら
にこの永久磁石9の外面に磁性板10が貼着されている
。この磁性板lOの端面には前記電子部品Pの周囲に突
出されたリードなどの多数の突起物Qに対応する多数の
突起片11を突出形成された位置決め部材12が固着さ
れている。13は前記磁性板10の外面を取り囲むよう
に配設された支持枠である。14は吸引源との接続口で
前記吸引通路2と連通している。又、15は圧力気体源
との接続口で前記気体送給通路3と連通している。
In the third embodiment shown in FIGS. 3 to 5, regulating plates 7 made of a ferromagnetic material such as iron are provided on the four circumferential surfaces of the holding member 1 in the first embodiment. The end of the regulating plate 7 protrudes from the end surface 4 of the holding member 1, and a notch 8 is formed so as to fit into the periphery of the electronic component P with an appropriate gap. Further, a permanent magnet 9 magnetized with a large number of parallel magnetic poles is attached to the outer surface of the regulation plate 7, and a magnetic plate 10 is further attached to the outer surface of this permanent magnet 9. A positioning member 12 is fixed to the end face of the magnetic plate IO, and has a large number of protruding pieces 11 projecting thereon corresponding to a large number of protrusions Q such as leads protruding around the electronic component P. Reference numeral 13 denotes a support frame arranged so as to surround the outer surface of the magnetic plate 10. Reference numeral 14 is a connection port with a suction source, which communicates with the suction passage 2. Further, reference numeral 15 is a connection port to a pressure gas source, which communicates with the gas supply passage 3.

前記永久磁石9および磁性板10は吸引口5とは別の吸
着部品をなし、位置決め部材12、電子部品の突起物Q
及び規正板7とともに磁気回路を構成している。又、保
持部材1の端面4に対して適当な隙間をあけて電子部品
Pが吸着保持された状態で、規正板7の端面と電子部品
Pの突起物Qとの間、及び位置決め部材12の突起片1
1と突起物Qとの間に適当な隙間が形成されるように規
正板7及び位置決め部材12が配置されている。
The permanent magnet 9 and the magnetic plate 10 constitute a suction component separate from the suction port 5, and the positioning member 12 and the protrusion Q of the electronic component
Together with the regulating plate 7, it constitutes a magnetic circuit. In addition, in a state where the electronic component P is suctioned and held with an appropriate gap between the end surface 4 of the holding member 1, the space between the end surface of the regulating plate 7 and the protrusion Q of the electronic component P, and between the positioning member 12 Projection piece 1
The regulation plate 7 and the positioning member 12 are arranged so that an appropriate gap is formed between the projection 1 and the protrusion Q.

以上の構成において、保持部材1の吸引通路2及び気体
送給通路3にそれぞれ図外の吸引源及び圧力気体源を連
通させた状態で、保持部材lの端面4を吸着保持すべき
電子部品Pに近付けると、電子部品Pは吸引口5による
真空吸引力と永久磁石9による突起物Qに対する吸着力
によって保持部材1の端面4に吸着されるとともに、気
体噴出口6から噴出する気体流にて端面4に対して非接
触状態となり、電子部品Pは浮動状態で吸着保持される
。又、その際電子部品Pの突起物Qは位置決め部材12
の突起片11の中心に向かって吸着されるため、電子部
品Pは自動的に正確に位置決めされることになる。なお
、電子部品Pはその周縁が規正板7の切欠部品8にて概
ね位置規正されているので、突起物Qの配置ピッチ以上
に位置ずれすることもない次いで、電子部品Pを回路基
板に装着する際には、吸引源との接続を断つことによっ
て、電子部品Pは気体噴出口6から噴出する気体流にて
永久磁石9による吸着力に抗して押圧されて電子部品P
の保持は解除される。その際、吸引口5からも圧力気体
を噴出させるようにすると、さらに確実に電子部品Pを
押し出すことができる。
In the above configuration, the electronic component P to be held by suction is attached to the end surface 4 of the holding member 1 with a suction source and a pressure gas source (not shown) communicated with the suction passage 2 and the gas supply passage 3 of the holding member 1, respectively. , the electronic component P is attracted to the end surface 4 of the holding member 1 by the vacuum suction force of the suction port 5 and the attraction force of the permanent magnet 9 to the protrusion Q, and is also attracted by the gas flow ejected from the gas jet port 6. The end face 4 is in a non-contact state, and the electronic component P is held by suction in a floating state. In addition, at this time, the protrusion Q of the electronic component P is located at the positioning member 12.
Since the electronic component P is attracted toward the center of the protruding piece 11, the electronic component P is automatically and accurately positioned. In addition, since the position of the electronic component P is generally regulated by the notch part 8 of the regulation plate 7, the position of the electronic component P is not deviated beyond the arrangement pitch of the projections Q. Next, the electronic component P is mounted on the circuit board. When doing so, by cutting off the connection with the suction source, the electronic component P is pressed by the gas flow ejected from the gas outlet 6 against the attraction force of the permanent magnet 9, and the electronic component P is
The hold will be released. At this time, if the pressure gas is also ejected from the suction port 5, the electronic component P can be pushed out more reliably.

尚、電子部品Pを吸着保持するのに、永久磁石9の吸着
力だけを利用し、吸引口5による真空吸引は省略しても
よい。
Note that in order to attract and hold the electronic component P, only the attraction force of the permanent magnet 9 may be used, and the vacuum suction by the suction port 5 may be omitted.

上記実施例では、永久磁石9を用いたものを例示したが
、第4図に示す第4実施例のように、電磁石16を用い
ることもできる。第4図において、磁性板10の周囲に
はコイル17が巻回され、かつ規正板7と磁性板10と
が前記端面4とは反対側の端部で互いに磁気結合されて
おり、規正板7と磁性板10とコイル17にて電磁石1
6が構成されている。この場合、コイル17に対する通
電を停止することによって磁力による吸着保持力を無く
すことができ、電子部品Pの保持を解除して押し出すの
に好都合である。
In the above embodiment, a permanent magnet 9 is used, but an electromagnet 16 can also be used as in the fourth embodiment shown in FIG. In FIG. 4, a coil 17 is wound around the magnetic plate 10, and the regulating plate 7 and the magnetic plate 10 are magnetically coupled to each other at the end opposite to the end surface 4, and the regulating plate 7 Electromagnet 1 with magnetic plate 10 and coil 17
6 are configured. In this case, by stopping the current supply to the coil 17, the attraction and holding force due to the magnetic force can be eliminated, which is convenient for releasing the hold on the electronic component P and pushing it out.

次に、第7図及び第8図に基いて第5実施例を説明する
。この実施例は、上記第4実施例における吸引通路2を
無くして、その代わりに吸着保持した電子部品Pを押し
出すピストン18を設けたものである。即ち、保持部材
1の軸心位置に圧力気体送給通路19を形成するととも
に、前記端面4側の端部にピストン18を配設して成り
、このピストン18の端面には小さな穴20が穿設され
、この穴20から圧力気体が噴出するように構成されて
いる。
Next, a fifth embodiment will be described based on FIGS. 7 and 8. In this embodiment, the suction passage 2 in the fourth embodiment is omitted, and in its place is provided a piston 18 for pushing out the electronic component P held by suction. That is, a pressure gas supply passage 19 is formed at the axial center position of the holding member 1, and a piston 18 is disposed at the end on the end surface 4 side, and a small hole 20 is bored in the end surface of the piston 18. The hole 20 is configured such that pressurized gas is blown out from the hole 20.

この実施例では吸着保持した電子部品Pを押し出す場合
には、圧力気体送給通路19に圧力気体源を接続する。
In this embodiment, when pushing out the electronic component P held by suction, a pressure gas source is connected to the pressure gas supply passage 19.

すると、圧力気体にてピストン18が保持部材1の端面
4から突出付勢され、かつその際穴20から気体が噴出
する。そのためピストン18と電子部品Pとの間に噴出
気体流にて隙間が形成され、電子部品Pはピストン18
と非接触状態で押し出されて吸着保持が円滑に解除され
、ピストン18と電子部品Pの接触によるショックやピ
ストン18の移動振れによって電子部品Pの規正位置が
ずれてしまう虞れもないのである。
Then, the piston 18 is urged to protrude from the end surface 4 of the holding member 1 by the pressure gas, and at this time, the gas is ejected from the hole 20. Therefore, a gap is formed between the piston 18 and the electronic component P by the ejected gas flow, and the electronic component P
The electronic component P is pushed out in a non-contact state, and suction/holding is smoothly released, and there is no risk of the electronic component P being displaced from its normal position due to shock caused by contact between the piston 18 and the electronic component P or vibration of the piston 18.

本発明は上記実施例に限定されるものではな(、その他
種々の実施態様で実施することができる。
The present invention is not limited to the above embodiments (but can be implemented in various other embodiments).

発明の効果 本発明の保持装置によれば、部品は吸着保持されるとと
もに、気体噴出口から噴出する気体流の作用で保持部材
の端面に対して非接触状態となって浮動状態で吸着保持
されるので、位置規正の際保持部材との摩擦が回避でき
部品に撰傷を与えないし位置規正を簡単に正確に行える
Effects of the Invention According to the holding device of the present invention, the component is not only held by suction, but also held by suction in a floating state without contacting the end surface of the holding member due to the effect of the gas flow ejected from the gas outlet. Therefore, when adjusting the position, friction with the holding member can be avoided, the parts will not be damaged, and the position can be adjusted easily and accurately.

また第2の発明によれば前記非接触な吸着保持を凹部で
行うことによって特別な位置規正手段なしにその凹部だ
けで部品の位置決めを行うことができるとともに、吸着
解除による部品の離脱もよく部品装着に支障がない。
Further, according to the second invention, by performing the non-contact suction holding in the recess, it is possible to position the component using only the recess without any special positioning means, and it is also possible to easily remove the component by releasing the suction. There is no problem with installation.

さらに第3の発明によれば部品の非接触な吸着保持を、
磁化された突起片に部品の突起物を吸引させることによ
り行うことで、部品の突起物が突起片の中心位置に対向
するように部品が正確に位置決めされ、多数のリードを
持った電子部品でもそれを利用して部品位置を正確に規
正をすることができる。
Furthermore, according to the third invention, parts can be held by suction in a non-contact manner.
By attracting the protrusions of the component to the magnetized protrusion, the component is accurately positioned so that the protrusion of the component faces the center position of the protrusion, and even electronic components with a large number of leads can be easily positioned. Using this, it is possible to accurately regulate the position of parts.

第4の発明によれば、磁性吸着により保持している部品
でもそれを装着すべく保持解除する際に、ピストンにて
部品を押圧して瞬間的に保持部材の端面から離間させる
ことができ、正確かつ確実に保持解除することができ、
しかもピストンの穴から噴出する気体流にてピストンは
部品に対して非接触で押圧するので、ピストンと部品の
接触によるショックやピストンの移動振れによって規正
位置がずれてしまう虞れもないという効果がある。
According to the fourth invention, when releasing a component held by magnetic attraction in order to mount it, the piston can press the component and instantly separate it from the end surface of the holding member, Can be held and released accurately and reliably,
Moreover, since the piston presses the component without contacting it with the gas flow ejected from the piston hole, there is no risk of the regulated position being shifted due to shock caused by contact between the piston and the component or vibration of the piston. be.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の第1実施例を示す断面図、第2図は本
発明の第2実施例の断面図、第3図から第5図は本発明
の第3実施例を示し、第3図は斜視図、第4図は縦断正
面図、第5図は第年図のm−m断面図、第6図は本発明
の第4実施例の縦断正面図、第7図及び第8図は本発明
の第5実施例を示し、第7図は部分縦断正面図、第8図
は動作状態の部分断面正面図、第9図は従来例の斜視図
、第10図は部品装着機の概略構成の説明図である。 1−・−・・・−−−−一・−・−・−・−・−−−−
−一・・・−保持部材4−・−・・−一−−−・・・−
・・・−・−・−・−−−−−〜・−端面4a・−・−
・・・−−−〜−・・−・−・−・−・−・−・−凹部
6−〜−−−−−−・−・・・・・・−・・−・−・−
・−気体噴出口5−・・・・−・−−−一−−・−−−
−−一−−−−−−−−−−−−−・−吸引口(吸着部
)18・・・・・−・−・−・・−−−−一・・−・・
−−一−−−・−−−−−−ピストン20−・−・・・
・−・−・−・−−−−−−−−−−−−−−一・・・
・穴P−・−・−−−−一−−・・・・−・・・・−・
・−一一一−−−−・−電子部品Q・−・・・・−・・
−・・・−−−−−・・・−・−−m−−・・−・突起
物。 第1図 第2図 第7図   第8図
FIG. 1 is a sectional view showing a first embodiment of the invention, FIG. 2 is a sectional view of a second embodiment of the invention, and FIGS. 3 to 5 show a third embodiment of the invention. 3 is a perspective view, FIG. 4 is a longitudinal sectional front view, FIG. The figures show a fifth embodiment of the present invention, FIG. 7 is a partially longitudinal front view, FIG. 8 is a partially sectional front view in an operating state, FIG. 9 is a perspective view of a conventional example, and FIG. 10 is a component mounting machine. FIG. 2 is an explanatory diagram of the schematic configuration of 1−・−・−−−−1・−・−・−・−・−−−−
-1...-Holding member 4-----1---
・・・−・−・−・−−−−−~・−End face 4a・−・−
...--
・−Gas outlet 5−・・・・−・−−−1−−・−−−
−−1−−−−−−−−−−−−−・−Suction port (adsorption part) 18・・・・−・−・−・・−−−−1・・−・・
−−1−−−・−−−−−Piston 20−・−・・
・−・−・−・−−−−−−−−−−−−−−1...
・Hole P−・−・−−−−1−−・・・・−・・・・−・
・−111−−−−・−Electronic parts Q・−・・・・−・・
−・・−−−−−・−・−−m−−・・−・Protrusion. Figure 1 Figure 2 Figure 7 Figure 8

Claims (5)

【特許請求の範囲】[Claims] (1)保持部材の端面に、部品を保持するための吸着部
と、吸着保持する部品を保持部材から浮かせるための気
体噴出口とを設け、部品を非接触で吸着保持するように
したことを特徴とする保持装置。
(1) The end face of the holding member is provided with a suction portion for holding the component and a gas outlet for lifting the component to be suctioned and held from the holding member, so that the component can be suctioned and held without contact. Features a holding device.
(2)保持部材の端面に部品を隙間を持って受入れる凹
部と、この凹部に部品を受入れて保持するための吸着部
を形成するとともに、前記凹部の奥底面および周囲に部
品を保持部材から浮かせるための気体噴出口を設け、部
品を凹部に受入れ非接触で吸着保持するようにしたこと
を特徴とする保持装置。
(2) Forming a recess on the end surface of the holding member to receive the component with a gap, and a suction portion for receiving and holding the component in this recess, and floating the component from the holding member on the inner bottom surface and around the recess. What is claimed is: 1. A holding device characterized in that a gas outlet is provided for receiving a part in a recess and holding the part by suction in a non-contact manner.
(3)保持部材の端面に、部品を保持するための磁性吸
着部と、吸着保持する部品を保持部材から浮かせるため
の気体噴出口とを設け、磁性吸着部は部品の周囲に突設
された磁性体よりなる突起物に対向する突起片とそれを
磁化させる磁石とからなることを特徴とする保持装置。
(3) A magnetic adsorption part for holding the component and a gas outlet for lifting the part to be adsorbed and held from the holding member are provided on the end face of the holding member, and the magnetic adsorption part is provided protruding around the part. A holding device comprising a protrusion piece that faces a protrusion made of a magnetic material and a magnet that magnetizes the protrusion piece.
(4)磁石が電磁石からなる特許請求の範囲第3項記載
の保持装置。
(4) The holding device according to claim 3, wherein the magnet is an electromagnet.
(5)保持部材の端面に、部品を保持するための磁性吸
着部と、吸着保持する部品を保持部材から浮かせるため
の気体噴出口と、気体圧により突出可能でかつその突出
側端部に気体噴出用の穴を有した物品を離脱させるため
のピストンとを設け、磁性吸着部は部品の周囲に突設さ
れた磁性体よりなる突起物に対向する突起片とそれを磁
化させる磁石とからなることを特徴とする保持装置。
(5) On the end face of the holding member, there is a magnetic adsorption part for holding the component, a gas outlet for lifting the part to be adsorbed and held from the holding member, and a gas outlet that can be protruded by gas pressure and has a gas at the protruding end. A piston having a spouting hole for releasing the article is provided, and the magnetic adsorption part is composed of a protrusion piece facing a protrusion made of a magnetic material protruding around the part and a magnet for magnetizing it. A holding device characterized by:
JP61147349A 1986-06-24 1986-06-24 Holder Pending JPS637291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61147349A JPS637291A (en) 1986-06-24 1986-06-24 Holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61147349A JPS637291A (en) 1986-06-24 1986-06-24 Holder

Publications (1)

Publication Number Publication Date
JPS637291A true JPS637291A (en) 1988-01-13

Family

ID=15428172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61147349A Pending JPS637291A (en) 1986-06-24 1986-06-24 Holder

Country Status (1)

Country Link
JP (1) JPS637291A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113400U (en) * 1988-01-25 1989-07-31
JPH01220500A (en) * 1988-02-29 1989-09-04 Toshiba Corp Transfer head for positioning thin component
JPH02177600A (en) * 1988-12-28 1990-07-10 Matsushita Electric Ind Co Ltd Component sucking method and piece
JPH0572199U (en) * 1992-02-29 1993-09-28 太陽誘電株式会社 Suction position correction device for chip-shaped circuit component suction nozzle
JPH0572200U (en) * 1992-02-29 1993-09-28 太陽誘電株式会社 Suction position correction device for chip-shaped circuit component suction nozzle
JP2007030139A (en) * 2005-07-29 2007-02-08 Seiko Instruments Inc Vacuum chuck
JP2010264584A (en) * 2009-05-13 2010-11-25 Utechzone Co Ltd Non-contact holding method for workpiece and non-contact holding device
JP2011210297A (en) * 2010-03-29 2011-10-20 International Manufacturing & Engineering Services Co Ltd Adsorption nozzle of chip mounter
WO2013124964A1 (en) * 2012-02-21 2013-08-29 富士機械製造株式会社 Suction nozzle
WO2015011806A1 (en) * 2013-07-24 2015-01-29 富士機械製造株式会社 Assembly machine, holding member, and inspection jig
US9435946B2 (en) 2013-07-23 2016-09-06 National Institute Of Advanced Industrial Science And Technology Interlayer light wave coupling device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113400U (en) * 1988-01-25 1989-07-31
JPH01220500A (en) * 1988-02-29 1989-09-04 Toshiba Corp Transfer head for positioning thin component
JPH02177600A (en) * 1988-12-28 1990-07-10 Matsushita Electric Ind Co Ltd Component sucking method and piece
JPH0572199U (en) * 1992-02-29 1993-09-28 太陽誘電株式会社 Suction position correction device for chip-shaped circuit component suction nozzle
JPH0572200U (en) * 1992-02-29 1993-09-28 太陽誘電株式会社 Suction position correction device for chip-shaped circuit component suction nozzle
JP4544529B2 (en) * 2005-07-29 2010-09-15 セイコーインスツル株式会社 Vacuum chuck
JP2007030139A (en) * 2005-07-29 2007-02-08 Seiko Instruments Inc Vacuum chuck
JP2010264584A (en) * 2009-05-13 2010-11-25 Utechzone Co Ltd Non-contact holding method for workpiece and non-contact holding device
JP2011210297A (en) * 2010-03-29 2011-10-20 International Manufacturing & Engineering Services Co Ltd Adsorption nozzle of chip mounter
WO2013124964A1 (en) * 2012-02-21 2013-08-29 富士機械製造株式会社 Suction nozzle
JPWO2013124964A1 (en) * 2012-02-21 2015-05-21 富士機械製造株式会社 Suction nozzle
US9435946B2 (en) 2013-07-23 2016-09-06 National Institute Of Advanced Industrial Science And Technology Interlayer light wave coupling device
WO2015011806A1 (en) * 2013-07-24 2015-01-29 富士機械製造株式会社 Assembly machine, holding member, and inspection jig
JPWO2015011806A1 (en) * 2013-07-24 2017-03-02 富士機械製造株式会社 Assembly machine, holding member, and inspection jig

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