JPH01113400U

JPH01113400U -

Info

Publication number: JPH01113400U
Application number: JP801788U
Authority: JP
Priority date: 1988-01-25
Filing date: 1988-01-25
Publication date: 1989-07-31

Description

[Brief explanation of drawings]

第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図で、ａは側面図、ｂはａ
のＥ矢示図、第３図のａ１〜ａ４は本考案の動作
説明図、第４図は従来の説明図で、ａは側面図、
ｂは概要説明図、ｃ，ｄ１，ｄ２は要部説明図を
示す。図において、１は昇降機構、２はブロツク、３
はノズル、４は半導体素子、５はチヤツク機構、
６はアタチメント、７は突起部、８はエア、４Ａ
は側面、１５は位置決め機構を示す。 Fig. 1 is an explanatory diagram of the principle of the present invention, and Fig. 2 is an explanatory diagram of an embodiment of the present invention, where a is a side view and b is a
A1 to a4 in FIG. 3 are explanatory diagrams of the operation of the present invention, FIG. 4 is an explanatory diagram of the conventional method, and a is a side view;
b shows a schematic explanatory diagram, and c, d1, and d2 show main part explanatory diagrams. In the figure, 1 is a lifting mechanism, 2 is a block, and 3 is a lifting mechanism.
is a nozzle, 4 is a semiconductor element, 5 is a chuck mechanism,
6 is attachment, 7 is protrusion, 8 is air, 4A
15 shows a side surface, and 15 shows a positioning mechanism.

Claims

[Claims for Utility Model Registration] A nozzle 3 that attracts a semiconductor element 4 by suctioning air 8, and a block 2 provided with the nozzle 3.
A hand mechanism is provided with a lifting mechanism 1 that lifts and lowers the semiconductor element 4, and is configured to hold the semiconductor element 4 by the nozzle 3 by lifting and lowering the lifting mechanism 1. A chuck mechanism 5 that drives a protrusion 7 that holds the protrusion 7 in a diagonal direction and an attachment 6 provided with the protrusion 7.
The semiconductor element 4 is formed by the nozzle 3.
A hand mechanism characterized by comprising a positioning mechanism 15 for positioning the holding position of the hand to a predetermined position.