JP2501085Y2 - Chip circuit component mounting device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for mounting chip-shaped circuit components on a circuit board.

[0002]

2. Description of the Related Art Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been carried out as follows using an automatic mounting device. That is, the chip-shaped circuit components that are stored in bulk in a plurality of containers are taken out one by one into a plurality of guide tubes that are piped to a distributor, and then stored in a storage recess formed at a predetermined position of the template. Send each and collect in there.
The storage recess is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board. Then, by the component moving means having the suction unit, the chip-shaped circuit component stored in the storage recess is moved and mounted on the circuit board while maintaining the relative position when stored.
As a result, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board. On the circuit board, apply adhesive in advance to the position where the chip-shaped circuit component should be mounted,
Soldering is performed in a state where the mounted circuit components are temporarily fixed with this adhesive.

In the template, a recess for receiving the chip-shaped circuit component is formed. Therefore, as shown in FIG. 3, a guide case 61 is mounted on the base board 60 of the template 6, and a through hole 63 is formed in the bottom of the guide case 61. Has been established. When the template 6 is inserted directly below the distributor of the multimounter device, the template 6
The vacuum case 4 is applied to the lower side of the template 6, and the lower surface side of the template 6 is maintained at a negative pressure by the operation of a vacuum blower (not shown) connected through the exhaust duct 5. In this state, the guide tube 21 of the distributor 2
The chip-shaped circuit component a falling through the guide case 61 is received. At this time, air is drawn from the guide tube 21 to the back side of the template 6 through the through hole 63 formed at the bottom of the guide case 61, and the chip-shaped circuit component a is sent to the guide case 61 by the flow of this air. Thereafter, the template 6 moves to the suction head (suction head), where the chip-shaped circuit component a received in the guide case 61 is sucked by the set nozzle of the suction head and mounted on the above-mentioned circuit board.

[0004]

However, the chip-shaped circuit component a falling from the distributor 2 side is charged with static electricity while falling in the guide tube 21 in front of it. Then, as the guide case 61 successively receives the charged chip-shaped circuit components a, the guide case 61 is also charged with the same charge as that of the chip-shaped circuit components. Then, the guide tube 21
A repulsive force is generated between the charged chip-shaped circuit component a sent thereafter through the guide case 61 and the chip-shaped circuit component a as shown by a two-dot chain line in FIG. There is a situation where it sticks to and it does not fit in the guide case. Therefore, the present invention
It was made based on the above-mentioned attention, and its purpose is to solve the problems of the conventional template and to reliably receive a chip-shaped circuit component partially using a magnetic material in a storage recess. To provide.

[0005]

In order to achieve the above object, the present invention provides a plurality of containers in which chip-shaped electronic components are stored in bulk and a chip-shaped electronic component accommodated in each container. Distribution and supply distributors,
A template in which a concave portion for receiving a chip-shaped electronic component supplied from the distributor is arranged at a predetermined position, and an electronic component accommodated in the concave portion of the template is adsorbed from the concave portion and moved to the circuit board. In a chip-shaped electronic component mounting device equipped with a suction unit to be mounted as a through hole, a through hole is provided at the bottom of the concave portion of the template.
Along with this template, this template is sandwiched between the distribution
The lower side of the template on the lower side facing the
A suction means for making a negative pressure is arranged, and it is located on the suction means side.
Thus, a chip-shaped circuit component mounting device is provided in which magnets are arranged below the through holes respectively corresponding to the recesses .

[0006]

According to the present invention, the bottom of the recess of the template is
A through hole is provided in the
On the lower side facing the distributor,
Since the suction means that makes the lower surface side of the gat a negative pressure is arranged,
Extract from the top side of the template to the bottom side through the through holes.
A stream of air is created. Furthermore, this suction means side
Under the through hole that corresponds to the recess for receiving the chip-shaped circuit component of
Since a magnet is provided on the side, chip-shaped circuit parts that use magnetic material members, such as nickel electrodes, in addition to the above-mentioned transportation assistance means for chip-shaped circuit parts by the flow of container air Has a magnetic attraction force.
In particular, a suction means in which the magnet applies a negative pressure to the lower surface of the template.
On the lower side of the through hole, the magnetic force
The suction force of the chip-shaped electronic component due to
It acts in the same direction as the resulting air flow. For this reason, even if the chip-shaped circuit component is attracted to the distributor side due to static electricity, the air generated through the through hole is
Pulled into the housing recess a chip-like circuit component and the magnetic force due to flow-induced and magnets against both thereto. As a result, the chip-shaped circuit component can be reliably received in the storage recess.

[0007]

Embodiments of the present invention will now be specifically described with reference to the drawings. FIG. 2 shows an outline of the entire mounting device for chip-shaped circuit parts to which the present invention is applied. That is, a plurality of containers 1 in which chip-shaped circuit components are stored in a bulk form are arranged, and a delivery section 11 which is an escapement is connected to the containers 1 via tubes 10.
Further, the distributor 2 is provided under the sending unit 11.
Is arranged.

[0008] The distributor 2 has an upper frame 23 which is fixed under the delivery section 11, disposed parallel to the lower, and a lower frame 22 in which the template 6 on the lower surface side is detachably attached Have these
The upper frame 23 and lower frame 22, the four corners thereof with four columns are connected to one another. Further, flexible guide tubes 21, 21 for guiding and carrying the chip-shaped circuit component between the upper frame 23 and the lower frame 22.
... is piped.

Below the lower frame 22, a template 6 having a guide case 61 arranged at a mounting position of a chip-shaped circuit component on a circuit board is inserted and fixed. At this time, the lower end of the guide tube 21 connected to the lower frame 22 is positioned above each guide case 61 of the template 6. At this time, the vacuum case 4 is placed under the template 6 and the exhaust duct 5
The lower surface side of the template 6 is maintained at a negative pressure by the operation of a vacuum blower (not shown) connected through the.

Directly below the distributor 2, the template 6 inserts chip-shaped circuit parts into predetermined guide cases 61, respectively.
Then, the template 6 moves to below the suction head 8. Then, the chip-shaped circuit components received in the guide case 61 are attracted to the suction head 8. After that, the template is retracted from under the suction head 8, and the circuit board 9 conveyed by the conveyor 7 is inserted under the template. Then, the suction head 8 mounts the chip-shaped circuit component sucked on the tip of the set nozzle on the circuit board 9.

As described above, the template 6 has a concave portion for receiving the chip-shaped circuit component formed thereon, so that the template 6 is guided onto the base board 60 of the template 6 as shown in FIG. A case 61 is attached. At the bottom of the guide case 61, a through hole 63 is formed through which the back surface of the base board 60 is pulled out. In the illustrated case, the bottom surface of the storage recess 61 has a slope such that one end side becomes lower. , The bottom surface is biased to the lower side, and the suction hole 63
Has been established. .

Further, when the template 6 is inserted under the distributor 2, the base board 60 is attached to the vacuum case 4 placed under the front template 6.
A magnet 62 is provided below the through hole 63 so as to correspond to each of the upper guide cases 61. The magnet 62 is, for example, an electromagnet, and is connected to a power source 64 by a limit switch 65 and excited when the template 6 is inserted immediately below the distributor 2 as shown in FIG.
As a result, the guide tube 2 is
When the chip-shaped circuit component a containing the magnetic material falls from 1, the chip-shaped circuit component a is attracted by magnetic force and is fixed on the bottom of the guide case 61. After that, when the template 6 moves to the side of the suction unit 8 described above, the limit switch 65 is turned off and the magnet 62 is demagnetized. By doing so, the magnetic force of the magnet 62 can be applied to the chip-shaped circuit component a only when necessary. However, the magnet 62 may be a permanent magnet, and in that case, magnetic force always acts on the chip-shaped circuit component a.

[0013]

As described above, according to the present invention, the chip-shaped circuit component a of the template 6 can be reliably received in the recess, and the chip-shaped circuit component a cannot be received due to the static electricity. That trouble can be reduced.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional side view of a main part of a template portion showing an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing a chip-shaped circuit component mounting device.

FIG. 3 is a vertical sectional side view of a main part of a template portion showing a conventional example.

[Explanation of symbols]

 6 Template 60 Baseboard 61 Guide case 62 Magnet

Claims (1)

(57) [Reference number] 0020944-01 [Claims for utility model registration] 1. A plurality of containers in which chip-shaped electronic components are stored in bulk, a distributor that distributes and supplies the chip-shaped electronic components stored in each container, and chips supplied from the distributor. A template in which a concave portion for receiving the electronic component is arranged at a predetermined position, and an adsorption unit for adsorbing the electronic component accommodated in the concave portion of the template from the concave portion and moving and mounting the electronic component on the circuit board. In a chip-shaped electronic component mounting device provided with a through hole provided in the bottom of the recess of the template,
Face distributor with this template
The lower side of the template absorbs the negative pressure on the lower side of the template.
The pulling means is arranged, and on the suction means side,
A chip-shaped circuit component mounting device , wherein magnets are arranged below the corresponding through holes .