JP3356829B2 - Component supply device and component supply method - Google Patents
Component supply device and component supply methodInfo
- Publication number
- JP3356829B2 JP3356829B2 JP17638593A JP17638593A JP3356829B2 JP 3356829 B2 JP3356829 B2 JP 3356829B2 JP 17638593 A JP17638593 A JP 17638593A JP 17638593 A JP17638593 A JP 17638593A JP 3356829 B2 JP3356829 B2 JP 3356829B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- electronic component
- tape
- magnet
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は電子部品をプリント基板
に装着する電子部品装着機などに使用される部品供給装
置および部品供給方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply apparatus and a component supply method used for an electronic component mounting machine for mounting an electronic component on a printed circuit board.
【0002】[0002]
【従来の技術】従来、電子部品装着機に電子部品を供給
する部品供給装置は、図7に示すように、テープ状部品
集合体31が巻かれたリール32を保持部33で保持す
るとともに、駆動機構を介しテープ状部品集合体31を
引出して、収納された電子部品34を、本体部35のテ
ープ搬送面に沿って部品取出位置36に送り出し、電子
部品装着機に供給する。2. Description of the Related Art Conventionally, a component supply device for supplying an electronic component to an electronic component mounting machine, as shown in FIG. 7, holds a reel 32 on which a tape-shaped component assembly 31 is wound by a holding portion 33, The tape-shaped component assembly 31 is pulled out via the drive mechanism, and the stored electronic components 34 are sent out to the component pick-up position 36 along the tape transport surface of the main body 35 and supplied to the electronic component mounting machine.
【0003】ここで、図5に示すように、テープ状部品
集合体31を上面から抑えるテープ押さえ37には、カ
バーテープ38を分離する剥離部40を設けている。そ
して、カバーテープ38は巻取り部39において巻取ら
れる。Here, as shown in FIG. 5, a tape holder 37 for holding the tape-shaped component assembly 31 from the upper surface is provided with a peeling section 40 for separating the cover tape 38. Then, the cover tape 38 is wound at the winding section 39.
【0004】さらに図6に示すように、テープ押さえ3
7にはシャッタ43が備えられており、図6(a)
(b)のように電子部品吸着時にシャッタ43を開き、
次に、図6(c)(d)のようにテープ状部品集合体3
1が送られる際に、テープ状部品集合体31に収納され
た電子部品34が飛び出さないように、シャッタ先端4
4で電子部品34を上面から抑えながらテープ状部品集
合体31と同期してシャッタ43が動くように構成され
ている。なお、図7における42は電子部品装着機の部
品供給部に部品供給装置を固定するクランパである。Further, as shown in FIG.
7 is provided with a shutter 43, as shown in FIG.
As shown in (b), the shutter 43 is opened when the electronic component is sucked,
Next, as shown in FIG. 6C and FIG.
In order to prevent the electronic components 34 housed in the tape-shaped component assembly 31 from popping out when the first
The shutter 43 is configured to move in synchronism with the tape-shaped component assembly 31 while holding down the electronic component 34 from above at 4. Reference numeral 42 in FIG. 7 denotes a clamper for fixing the component supply device to the component supply unit of the electronic component mounting machine.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、前記従
来例のような構成では、電子部品吸着時にシャッタ43
が開くため、シャッタ43の動作による振動、あるいは
吸着直前の電子部品装着機などからの部品供給装置への
衝撃による振動などで、テープ状部品集合体31の中で
電子部品34が暴れ、電子部品装着機の電子部品吸着を
不安定にさせる。また、図6(e)のように、シャッタ
先端44が動作する範囲のテープ押さえ37の開口部4
5は電子部品34が暴れないように狭くしているため、
さらに、テープ押さえ37から電子部品34側にシャッ
タ先端44がはみ出ても電子部品供給に悪影響をおよぼ
すために、動作するシャッタ43の部品精度やテープ押
さえ37との組立て精度が厳しいなどの課題があった。However, in the configuration as in the above-described conventional example, the shutter 43 is not used when the electronic component is sucked.
Is opened, the electronic component 34 ramps up in the tape-shaped component assembly 31 due to vibration caused by the operation of the shutter 43, or vibration caused by an impact on the component supply device from the electronic component mounting machine immediately before the suction, and the electronic component 34 Destabilizes the pick-up machine's electronic components. Also, as shown in FIG. 6E, the opening 4 of the tape holder 37 in the range where the shutter tip 44 operates.
5 is so narrow that the electronic component 34 does not run away,
Further, even if the shutter tip 44 protrudes from the tape retainer 37 toward the electronic component 34, the supply of the electronic component is adversely affected, so that there is a problem that the precision of the component of the operating shutter 43 and the assembly precision with the tape retainer 37 are severe. Was.
【0006】本発明は、このような課題を解決すること
のできる部品供給装置および部品供給方法を提供せんと
するものである。An object of the present invention is to provide a component supply apparatus and a component supply method that can solve such a problem.
【0007】[0007]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明の請求項1記載の部品供給装置は、電子部
品をテープに収納したテープ状部品集合体を部品取出位
置に搬送する駆動部と、前記テープ状部品集合体を搬送
する面を有する本体部とを備えた部品供給装置であっ
て、前記本体部に設けられ電子部品装着機からの駆動力
を受取る駆動レバーと、前記駆動レバーと連結するレバ
ーと、前記レバーに結合して前記電子部品を前記テープ
を介して吸引するマグネットとを備え、前記電子部品が
前記部品取出位置に搬送された際に、前記駆動レバーが
駆動力を受取ることにより、前記マグネットを前記電子
部品からはなす構成であることを特徴とする。According to a first aspect of the present invention, there is provided a component supply apparatus for transporting a tape-like component assembly containing electronic components to a tape to a component take-out position. A component supply device including a driving unit and a main body having a surface for transporting the tape-shaped component assembly, wherein the driving lever is provided on the main body and receives a driving force from an electronic component mounting machine; a lever connecting the driving lever, the tape the electronic component attached to the lever
And a magnet that is attracted through the electronic component. When the electronic component is conveyed to the component removal position, the drive lever receives a driving force, thereby causing the magnet to move to the electronic component.
It is characterized in that it is configured to be separated from parts .
【0008】請求項2記載の部品供給装置は、請求項1
記載の部品供給装置において、前記電子部品を吸引する
第二のマグネットを、前記テープ状部品集合体を搬送す
る面の前記マグネットの直前の所定の範囲に設けること
を特徴とする。請求項3記載の部品供給方法は、電子部
品をテープに収納したテープ状部品集合体の状態で前記
電子部品を磁力により前記テープに吸引しながら部品取
出位置まで搬送する工程と、部品取出位置に搬送された
前記電子部品に作用する前記磁力による吸引力を開放す
る工程とを有し、前記電子部品を電子部品装着機に供給
することを特徴とする。According to a second aspect of the present invention, there is provided a component supply apparatus.
In the above-described component supply device, a second magnet that attracts the electronic component is provided in a predetermined range immediately before the magnet on a surface that conveys the tape-shaped component assembly. The component supply method according to claim 3, wherein the electronic component is conveyed to a component extraction position while attracting the electronic component to the tape by magnetic force in a state of a tape-shaped component assembly in which the electronic component is stored in a tape; Releasing the attraction force by the magnetic force acting on the transported electronic component, and supplying the electronic component to an electronic component mounting machine.
【0009】[0009]
【作用】この課題解決手段による作用は次のようにな
る。部品取出位置でのテープ状部品集合体の裏側に位置
するように、マグネットを部品供給装置の本体部の搬送
面に備えることにより、電子部品を磁力により吸引固定
しているために、部品吸着時にシャッタが開いても種々
の振動に対して、電子部品の暴れを防止することとな
る。The operation of this means for solving the problems is as follows. A magnet is provided on the transport surface of the main body of the component supply device so that it is located on the back side of the tape-shaped component assembly at the component removal position, and the electronic components are attracted and fixed by magnetic force, so when picking up components Even if the shutter is opened, it is possible to prevent the electronic components from being violent against various vibrations.
【0010】また、前記マグネットを、カバーテープを
分離する剥離位置から部品取出位置までのテープ状部品
集合体の裏側に位置するように本体部の搬送面に備えれ
ば、カバーテープが電子部品を上面から抑えていない範
囲で、電子部品を磁力により前記本体部側に吸引してい
るため、テープ状部品集合体送り時にシャッタがなくと
も電子部品の飛び出しも防止でき、部品精度、組立て精
度の厳しいシャッタが省略でき、部品供給装置としても
構造簡略化が可能となる。Further, if the magnet is provided on the transport surface of the main body so as to be located on the back side of the tape-like component assembly from the peeling position where the cover tape is separated to the component take-out position, the cover tape holds the electronic component. Since the electronic components are attracted to the main body side by magnetic force within a range not suppressed from the upper surface, the electronic components can be prevented from jumping out even if there is no shutter at the time of feeding the tape-shaped component assembly, and strict component accuracy and assembly accuracy are required. The shutter can be omitted, and the structure can be simplified as a component supply device.
【0011】さらに、マグネットを、部品取出位置に設
けられた第一のマグネットと、部品取出位置以前に設け
られた第二のマグネットとに分割配置し、電子部品装着
機の吸着ノズルが部品取出位置上の電子部品に当接した
直後に、電子部品装着機から駆動力を与え、第一のマグ
ネットを前記本体部の搬送面から離す構成、および、取
り出し方式とすることで、電子部品の吸着がさらに容易
となる。Further, the magnet is divided into a first magnet provided at the component pick-up position and a second magnet provided before the component pick-up position. Immediately after abutting on the upper electronic component, a driving force is given from the electronic component mounting machine, the first magnet is separated from the transfer surface of the main body, and the take-out method is adopted, so that the electronic component is attracted. It becomes even easier.
【0012】[0012]
【実施例】以下、本発明の一実施例を図面に基づき説明
する。図1が本実施例の部品供給装置である。図示のよ
うに電子部品4を基材テープに所定間隔に収納し、か
つ、電子部品4の上面にカバーテープ8を有するテープ
状部品集合体1が巻回されたリール2を保持部3で保持
するとともに、電子部品装着機からの駆動力により、駆
動機構を介してテープ状部品集合体1を所定ピッチずつ
引出して、収納された電子部品4を本体部5のテープ搬
送面に沿って所定の部品取出位置6に送り出し、電子部
品装着機に供給する。ここで、テープ状部品集合体1を
上面から抑えるテープ押さえ7には、カバーテープ8を
分離する剥離部10を設けている。そして、カバーテー
プ8は巻取り部9で巻取られる。図中の12は電子部品
装着機の部品供給部に部品供給装置を固定するクランパ
である。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a component supply device of the present embodiment. As shown, the electronic component 4 is housed at predetermined intervals in a base tape, and the reel 2 around which the tape-shaped component assembly 1 having the cover tape 8 on the upper surface of the electronic component 4 is held by the holding unit 3 At the same time, the tape-like component assembly 1 is pulled out at a predetermined pitch by a driving force from the electronic component mounting machine via a driving mechanism, and the stored electronic components 4 are moved along a tape conveying surface of the main body 5 at a predetermined pitch. It is sent to the component take-out position 6 and supplied to the electronic component mounting machine. Here, the tape holder 7 for holding the tape-shaped component assembly 1 from the upper surface is provided with a peeling section 10 for separating the cover tape 8. Then, the cover tape 8 is wound by the winding unit 9. Reference numeral 12 in the figure denotes a clamper for fixing the component supply device to the component supply unit of the electronic component mounting machine.
【0013】これらの構成は前述の従来例と同じ構成で
ある。本実施例の特徴とするところは、本体部5のテー
プ搬送面にマグネット13を設けたことにある。図2は
その要部拡大図を示し、マグネット13は、カバーテー
プ8の剥離部10から部品取出位置6までの範囲で、す
なわち、テープ状部品集合体1の電子部品4が上面から
カバーテープ8で抑えられていない範囲に位置し、電子
部品4を吸引している。このため電子部品装着機が吸着
するまで、種々の振動があっても電子部品4は暴れたり
しない。さらに、シャッタが電子部品4を抑えていなく
とも、テープ状部品集合体1の送り時にも電子部品4が
飛び出たりしないのである。These components are the same as those of the above-described conventional example. This embodiment is characterized in that the magnet 13 is provided on the tape transport surface of the main body 5. FIG. 2 is an enlarged view of a main part of the cover tape 8. The magnet 13 is provided in a range from the peeling portion 10 of the cover tape 8 to the component take-out position 6, that is, the electronic component 4 of the tape-shaped component assembly 1 is covered with the cover tape 8 from the top. The electronic component 4 is located in a range where the electronic component 4 is not suppressed. Therefore, the electronic component 4 does not ramp up even if there are various vibrations until the electronic component mounting machine sucks. Furthermore, even if the shutter does not hold down the electronic component 4, the electronic component 4 does not jump out even when the tape-shaped component assembly 1 is fed.
【0014】図3は本発明の他の実施例の部品供給装置
の要部拡大図である。図3において、11は部品取出位
置6に配置された第一のマグネット、14は部品取出位
置6位前に配置された第二のマグネットであり、前記第
一のマグネット11にはレバー15が連結されている。
さらに、本体部5にはピン18によりL状の駆動レバー
17が回動自在に設けられ、レバー15と駆動レバー1
7とは連結部16で回動可能に連結されている。そし
て、駆動レバー17に電子部品装着機からの駆動力が加
われば、第一のマグネット11が本体部5の搬送面から
離れる構成となっている。なお図中の19は前記駆動力
が解除されたときの第一のマグネット11を復帰させる
スプリング、20は第一のマグネット11の初期位置を
決めるストッパピン、21は吸着ノズルである。FIG. 3 is an enlarged view of a main part of a component supply device according to another embodiment of the present invention. In FIG. 3, reference numeral 11 denotes a first magnet disposed at the component extracting position 6, reference numeral 14 denotes a second magnet disposed before the component extracting position 6, and a lever 15 is connected to the first magnet 11. Have been.
Further, an L-shaped drive lever 17 is rotatably provided on the main body 5 by a pin 18, and the lever 15 and the drive lever 1 are provided.
7 is rotatably connected by a connecting portion 16. When the driving force from the electronic component mounting machine is applied to the driving lever 17, the first magnet 11 is separated from the transfer surface of the main body 5. In the drawing, 19 is a spring for returning the first magnet 11 when the driving force is released, 20 is a stopper pin for determining the initial position of the first magnet 11, and 21 is a suction nozzle.
【0015】つぎに図3および図4で、本実施例の部品
供給装置を用いた電子部品取り出し方法について説明す
る。ここで、電子部品装着機の吸着ノズル21が、部品
供給装置の部品取出位置6に搬送された電子部品4に当
接したときに、電子部品装着機が駆動レバー17に駆動
力を与えると、連結部16、レバー15を介して、部品
取出位置6にある電子部品4を磁力により吸引していた
第一のマグネット11を、図4のように電子部品4から
離すことによりマグネット11の吸引力を解き、吸着ノ
ズル21は電子部品4を取り出しできる。Next, a method of taking out an electronic component using the component supply device of the present embodiment will be described with reference to FIGS. Here, when the suction nozzle 21 of the electronic component mounting machine contacts the electronic component 4 conveyed to the component removal position 6 of the component supply device, when the electronic component mounting machine gives a driving force to the drive lever 17, The first magnet 11 that has magnetically attracted the electronic component 4 at the component extraction position 6 via the connecting portion 16 and the lever 15 is separated from the electronic component 4 as shown in FIG. And the suction nozzle 21 can take out the electronic component 4.
【0016】[0016]
【発明の効果】以上の実施例の説明より明らかなよう
に、本発明は部品取出位置でのテープ状部品集合体の裏
側に位置するように、マグネットを部品供給装置の本体
部の搬送面に備えたことにより、電子部品が磁力により
吸引固定され、部品吸着時にシャッタが開いても、種々
の振動に対して電子部品の暴れを防止できるので、電子
部品装着機への安定供給が実現できる。As is apparent from the above description of the embodiment, according to the present invention, the magnet is mounted on the conveying surface of the main body of the component supply device so as to be located on the back side of the tape-shaped component assembly at the component removal position. With this arrangement, even when the electronic component is attracted and fixed by the magnetic force and the shutter is opened when the component is sucked, the electronic component can be prevented from being violent against various vibrations, so that a stable supply to the electronic component mounting machine can be realized.
【0017】また、マグネットを、カバーテープを分離
する剥離位置から部品取出位置までのテープ状部品集合
体の裏側に位置するように本体部の搬送面に備えれば、
カバーテープが電子部品を上面から抑えていない範囲で
前記電子部品を磁力により本体部側に吸引しているた
め、テープ状部品集合体送り時にシャッタがなくとも前
記電子部品の飛び出しも防止できるので、部品精度、組
立て精度の厳しいシャッタが省略でき、部品供給装置と
しても構造簡略化が可能となるのである。Further, if the magnet is provided on the transport surface of the main body so as to be located on the back side of the tape-like component assembly from the peeling position for separating the cover tape to the component take-out position,
Since the electronic component is attracted to the main body side by magnetic force in a range where the cover tape does not suppress the electronic component from the upper surface, the electronic component can be prevented from jumping out without a shutter when feeding the tape-shaped component assembly, A shutter with strict component accuracy and assembly accuracy can be omitted, and the structure of the component supply device can be simplified.
【0018】さらに、マグネットを、部品取出位置に設
けられた第一のマグネットと、部品取出位置以前に設け
られた第二のマグネットとに分割配置し、電子部品装着
機の吸着ノズルが部品取出位置上の電子部品に当接した
直後に、電子部品装着機から駆動力を与え、前記第一の
マグネットを本体部の搬送面から離す構成、および、取
り出し方式とすることで、電子部品の吸着がさらに容易
となるのである。Further, the magnet is divided into a first magnet provided at the component pick-up position and a second magnet provided before the component pick-up position. Immediately after contacting the upper electronic component, a driving force is given from the electronic component mounting machine, the first magnet is separated from the transfer surface of the main body, and the take-out method is adopted, so that the electronic component is attracted. It is even easier.
【図1】本発明の一実施例の部品供給装置の斜視図FIG. 1 is a perspective view of a component supply device according to an embodiment of the present invention.
【図2】(a)は同要部を拡大した上面図 (b)は同断側面図FIG. 2A is a top view in which the main part is enlarged, and FIG.
【図3】本発明の他の実施例の部品供給装置の要部を拡
大した断側面図FIG. 3 is an enlarged cross-sectional side view of a main part of a component supply device according to another embodiment of the present invention.
【図4】図3の部品供給装置の作用を示す断側面図FIG. 4 is a sectional side view showing the operation of the component supply device of FIG. 3;
【図5】従来例の部品供給装置の要部を拡大した断側面
図FIG. 5 is an enlarged sectional side view of a main part of a conventional component supply device.
【図6】(a)は従来例の部品供給装置のシャッタ部の
上面図 (b)は同断側面図 (c)は同上面図 (d)は同断側面図 (e)は同横断面図6A is a top view of a shutter portion of the conventional component supply device, FIG. 6B is a cross-sectional side view thereof, FIG. 6C is a top view thereof, FIG. 6D is a cross-sectional side view thereof, and FIG.
【図7】従来例の部品供給装置の斜視図FIG. 7 is a perspective view of a conventional component supply device.
1 テープ状部品集合体 2 リール 3 保持部 4 電子部品 5 本体部 6 部品取出位置 7 テープ押さえ 8 カバーテープ 9 巻取り部 10 剥離部 13 マグネット REFERENCE SIGNS LIST 1 tape-like component assembly 2 reel 3 holding unit 4 electronic component 5 main unit 6 component take-out position 7 tape holder 8 cover tape 9 winding unit 10 peeling unit 13 magnet
───────────────────────────────────────────────────── フロントページの続き (72)発明者 平井 弥 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 松村 栄喜 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 実開 昭60−35599(JP,U) 実開 昭57−146399(JP,U) (58)調査した分野(Int.Cl.7,DB名) H05K 13/00 - 13/04 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yasushi Hirai 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (56) References Japanese Utility Model 60-35599 (JP, U) Japanese Utility Model 57-146399 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 13/00-13 / 04
Claims (3)
集合体を部品取出位置に搬送する駆動部と、前記テープ
状部品集合体を搬送する面を有する本体部とを備えた部
品供給装置であって、 前記本体部に設けられ電子部品装着機からの駆動力を受
取る駆動レバーと、 前記駆動レバーと連結するレバーと、 前記レバーに結合して前記電子部品を前記テープを介し
て吸引するマグネットとを備え、前記電子部品が前記部
品取出位置に搬送された際に、前記駆動レバーが駆動力
を受取ることにより、前記マグネットを前記電子部品か
らはなす構成であることを特徴とする部品供給装置。1. A component supply device comprising: a drive unit for transporting a tape-shaped component assembly containing electronic components to a tape to a component pick-up position; and a main body having a surface for transporting the tape-shaped component assembly. A driving lever provided on the main body to receive a driving force from an electronic component mounting machine; a lever connected to the driving lever; and the electronic component connected to the lever via the tape.
And a magnet for attracting the electronic component. When the electronic component is conveyed to the component extraction position, the drive lever receives a driving force to form the magnet from the electronic component . A parts supply device characterized by the above-mentioned.
を、前記テープ状部品集合体を搬送する面の前記マグネ
ットの直前の所定の範囲に設けることを特徴とする請求
項1記載の部品供給装置。2. The component supply according to claim 1, wherein a second magnet for attracting the electronic component is provided in a predetermined area immediately before the magnet on a surface for transporting the tape-shaped component assembly. apparatus.
集合体の状態で前記電子部品を磁力により前記テープに
吸引しながら部品取出位置まで搬送する工程と、 部品取出位置に搬送された前記電子部品に作用する前記
磁力による吸引力を開放する工程とを有し、前記電子部
品を電子部品装着機に供給することを特徴とする部品供
給方法。3. A step of transporting the electronic component to a component pick-up position while attracting the electronic component to the tape by magnetic force in a state of a tape-like component assembly in which the electronic component is stored in a tape; Releasing the attraction force generated by the magnetic force acting on the electronic component, and supplying the electronic component to an electronic component mounting machine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17638593A JP3356829B2 (en) | 1993-07-16 | 1993-07-16 | Component supply device and component supply method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17638593A JP3356829B2 (en) | 1993-07-16 | 1993-07-16 | Component supply device and component supply method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0738286A JPH0738286A (en) | 1995-02-07 |
JP3356829B2 true JP3356829B2 (en) | 2002-12-16 |
Family
ID=16012726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17638593A Expired - Fee Related JP3356829B2 (en) | 1993-07-16 | 1993-07-16 | Component supply device and component supply method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3356829B2 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186487A (en) * | 1995-12-28 | 1997-07-15 | Matsushita Electric Ind Co Ltd | Part supplying device |
JP3258581B2 (en) * | 1996-11-27 | 2002-02-18 | 太陽誘電株式会社 | Component supply method and component supply device |
JPH10163684A (en) * | 1996-12-02 | 1998-06-19 | Taiyo Yuden Co Ltd | Parts supply device |
JPH10190283A (en) * | 1996-12-27 | 1998-07-21 | Taiyo Yuden Co Ltd | Component supply device |
JP3602545B2 (en) * | 1997-01-20 | 2004-12-15 | 松下電器産業株式会社 | Component supply method and device |
JP2000228600A (en) * | 1999-02-05 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Parts supply device |
WO2002003771A1 (en) * | 2000-06-30 | 2002-01-10 | Matsushita Electric Industrial Co., Ltd. | Part feeder |
JP2003121369A (en) * | 2001-08-09 | 2003-04-23 | Matsushita Electric Ind Co Ltd | Polarity-inspecting method for chip-type electronic component |
JP2006100650A (en) * | 2004-09-30 | 2006-04-13 | Hitachi High-Tech Instruments Co Ltd | Component feeder |
JP4595882B2 (en) * | 2006-05-16 | 2010-12-08 | パナソニック株式会社 | Tape feeder |
JP4849082B2 (en) * | 2008-03-03 | 2011-12-28 | パナソニック株式会社 | Tape feeder |
JP4893661B2 (en) * | 2008-03-03 | 2012-03-07 | パナソニック株式会社 | Tape feeder |
JP2014075531A (en) * | 2012-10-05 | 2014-04-24 | Samsung Techwin Co Ltd | Component mounting apparatus |
JP6751845B2 (en) * | 2016-02-04 | 2020-09-09 | パナソニックIpマネジメント株式会社 | Tape feeder |
US20170282238A1 (en) * | 2016-04-04 | 2017-10-05 | Whitesell Formed Components, Inc. | Fastener feed apparatus |
JP6848291B2 (en) * | 2016-09-20 | 2021-03-24 | 日本電気株式会社 | Transfer jig, manufacturing equipment and transfer method |
JP6848292B2 (en) * | 2016-09-20 | 2021-03-24 | 日本電気株式会社 | Transport pallets, parts supply equipment and transport methods |
WO2023228345A1 (en) * | 2022-05-26 | 2023-11-30 | 株式会社Fuji | Feeder |
-
1993
- 1993-07-16 JP JP17638593A patent/JP3356829B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0738286A (en) | 1995-02-07 |
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