JPS62128600A - Tape-shape parts assembled unit - Google Patents

Tape-shape parts assembled unit

Info

Publication number
JPS62128600A
JPS62128600A JP60269717A JP26971785A JPS62128600A JP S62128600 A JPS62128600 A JP S62128600A JP 60269717 A JP60269717 A JP 60269717A JP 26971785 A JP26971785 A JP 26971785A JP S62128600 A JPS62128600 A JP S62128600A
Authority
JP
Japan
Prior art keywords
tape
tape body
electronic component
accommodation recess
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60269717A
Other languages
Japanese (ja)
Inventor
真弘 丸山
寛二 秦
一天満谷 英二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60269717A priority Critical patent/JPS62128600A/en
Publication of JPS62128600A publication Critical patent/JPS62128600A/en
Pending legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はチップ型抵抗、チップ型積層コンデンサに代表
される電子部品を、電子回路を構成する基板上に装着す
る電子部品装着機において主に利用されるテープ状部品
集合体に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is mainly used in electronic component mounting machines that mount electronic components, such as chip resistors and chip multilayer capacitors, onto substrates constituting electronic circuits. The present invention relates to a tape-shaped parts assembly.

従来の技術 電子部品装着機として、従来↑、デ開昭55−1186
98号公報に示されるようなテープ状部品集合体を用い
たものが知られている。
Conventional technology As an electronic component mounting machine, conventional ↑,
A device using a tape-shaped component assembly as shown in Japanese Patent No. 98 is known.

そのテープ状部品集合体Pは、第5図に示すように、テ
ープ本体aに所定ピッチで一列に多数の収容凹部1〕を
形成し、ここに電子部品Cを収容するとともに、テープ
本体aの表面にシールテープdを貼着して前記電子部品
Cを保持するように構成されている。
As shown in FIG. 5, the tape-like component assembly P has a large number of housing recesses 1 formed in a row at a predetermined pitch in the tape body a, and stores the electronic components C therein. It is configured to hold the electronic component C by pasting a seal tape d on its surface.

電子部品装着機においては、前記テープ状部品集合体P
を送り装置gにて一方向に間欠的に送り、テープ剥離装
置11にてシールテープを剥離して巻き取り、収容凹部
1〕に収容された電子部品Cを吸着手段iによって吸着
して取り出し、この吸着手段iにて基板j上の所定位置
に装着するように構成されている。
In the electronic component mounting machine, the tape-shaped component assembly P
is intermittently fed in one direction by a feeding device g, the sealing tape is peeled off and wound up by a tape peeling device 11, and the electronic component C housed in the storage recess 1 is sucked and taken out by a suction device i. It is configured to be attached to a predetermined position on the substrate j using this suction means i.

ところで、前記テープ状部品集合体Pにおいて電子部品
Cを保持しているテープ状保持本の只1体的な構成とし
ては従来次のようなものが用いられている。
By the way, as a single structure of the tape-shaped holding book that holds the electronic components C in the tape-shaped component assembly P, the following has been conventionally used.

電子部品が小さい場合には、第6図に示すように肉厚の
テープ本体21に電子部品の収容凹部を形成する切欠2
2を形成し、その裏面に支持テープ23を貼着するとと
もに表面にシールテープ24を貼着したものが用いられ
ている。また、天外い電子部品の場合は、必要な強度を
持たせるために、第7図に示すように合成樹脂製のテー
プ32に収容凹部33をエンボス成形したテープ本体3
1を用い、その表面にシールテープ(図示せず)を貼着
したものが用いられている。さらに、近年は一辺が20
〜3(1mm以上の超大型の電子部品を自動vc着する
場合があり、その場合はtjSS図に示すようにテープ
本体41に開口部42を形成し、この開口部42に接着
面が露出するように裏面に接着テープ43を貼着し、開
口142上に)成せた電子部品44を接着テープ43で
保持するようにしたものが用いられている。
When the electronic component is small, a notch 2 is formed in the thick tape body 21 to form a recess for accommodating the electronic component, as shown in FIG.
2, a supporting tape 23 is attached to the back surface thereof, and a sealing tape 24 is attached to the front surface. In addition, in the case of extraordinary electronic parts, in order to provide the necessary strength, a tape body 3 is made of a synthetic resin tape 32 with a housing recess 33 embossed thereon as shown in FIG.
1 with a sealing tape (not shown) attached to its surface. Furthermore, in recent years, one side is 20
~3 (There are cases where ultra-large electronic components of 1 mm or more are attached by automatic vc bonding. In that case, an opening 42 is formed in the tape body 41 as shown in the tjSS diagram, and the adhesive surface is exposed in this opening 42. In this case, an adhesive tape 43 is attached to the back surface, and an electronic component 44 formed on the opening 142 is held by the adhesive tape 43.

発明が解決しようとする間m点 ところが、第8図のようなテープ状保持体ではこれを巻
き取ると曲率半径の小さい部分でテープ本体41の曲が
りのために電子部品の脚が変形してしまったり、接着が
剥がれた状態になって移送途中で脱落する虞れがある等
の開運があった。これに対しては、第7図に示すような
合成8(脂製のテープ本体31を用いるのが好ましいが
、その場合は前記送り装置g部分で小さな曲率半径で曲
がり難いため、送り装置gの送り歯との保合が外れ易く
、確実に送ることができない虞れがあり、それを回避す
るためには送り装置8部分の曲率半径を大きくしなけれ
ばならず、装置が大型化するばかりでなく他のテープ状
部品集合体の送り装置と共用化できないという問題があ
る。
However, when the tape-shaped holder shown in FIG. 8 is wound up, the legs of the electronic component are deformed due to the bending of the tape body 41 in the part with a small radius of curvature. There was a risk that the product would get stuck or the adhesive would peel off, causing it to fall off during transportation. To deal with this, it is preferable to use a synthetic tape body 31 made of fat (as shown in FIG. There is a risk that the feed dog will easily become uncoupled and the feed will not be carried out reliably, and in order to avoid this, the radius of curvature of the feed device 8 portion must be increased, which will only increase the size of the device. There is a problem in that it cannot be used in common with other feeding devices for tape-like component assemblies.

本発明は上記問題点を解消することを目的とするもので
ある。
The present invention aims to solve the above problems.

問題点を解決するだめの手段 本発明は上記目的を達成するため、部品を収容する収容
凹部をエンボス成形されたテープ本体と、収容凹部の開
口を閉鎖するシールテープとを備えたテープ状部品集合
体において、前記テープ本体の収容凹部を形成する壁面
にテープ本体の長手方向に対してほぼ垂直方向に延びる
スリットまたは凹凸を形成したことを特徴とするもので
ある。
Means for Solving the Problems In order to achieve the above object, the present invention provides a tape-shaped parts assembly comprising a tape body having an embossed accommodation recess for accommodating the parts, and a sealing tape for closing the opening of the accommodation recess. The tape body is characterized in that slits or unevenness extending substantially perpendicularly to the longitudinal direction of the tape body are formed on the wall surface forming the accommodation recess of the tape body.

作用 本発明は上記した構成を有するので、テープ本体の収容
凹部内に電子部品が保持され、電子部品の脚が変形した
り、移送途中で脱落したりする虞れがなく、かつ送り装
置部分ではスリットまたは凹凸により収容凹部を形成す
る壁面が容易に屈曲するため小さな曲率半径で曲げるこ
とができ、確実な送り動作が得られる。
Function Since the present invention has the above-described configuration, the electronic component is held in the storage recess of the tape body, there is no risk that the legs of the electronic component will be deformed or fall off during transportation, and the feeding device part Since the wall surface forming the accommodation recess is easily bent by the slits or unevenness, it can be bent with a small radius of curvature, and a reliable feeding operation can be obtained.

実施例 以下、本発明の一実施例について、Pt&1図〜第図画
第3図しながら説明する。
EXAMPLE Hereinafter, an example of the present invention will be described with reference to Figures Pt & 1 to 3.

第1図において、合成樹脂製のテープ本体1には、所定
ピッチで一列に多数の収容凹部2がエンボス成形されて
おり、このテープ本体1の一側縁部には所定ピッチで送
り穴3が一列に多数形成されている。前記収容凹部2を
形成する壁面にはテープ本体1の長手方向に対して垂直
またはほぼ垂直方向に延びる複数のスリット4が形成さ
れて1.する。
In FIG. 1, a tape body 1 made of synthetic resin is embossed with a large number of accommodation recesses 2 arranged in a row at a predetermined pitch, and one side edge of the tape body 1 is provided with spout holes 3 at a predetermined pitch. Many are formed in a row. A plurality of slits 4 extending perpendicularly or substantially perpendicularly to the longitudinal direction of the tape body 1 are formed on the wall surface forming the accommodation recess 2.1. do.

このテープ本体1の収容凹部2内に、第2図に示すよう
に電子部品5を収容し、収容凹部2の開口部を閉鎖する
ようにテープ本体1の上面にシールテープ6を貼着して
テープ状部品集合体7が構成されている。
As shown in FIG. 2, an electronic component 5 is housed in the accommodation recess 2 of the tape body 1, and a sealing tape 6 is pasted on the top surface of the tape body 1 so as to close the opening of the accommodation recess 2. A tape-shaped parts assembly 7 is constructed.

このテープ状部品集合体7は、第3図に示すような電子
部品装着機にセントされる。この電子部品装着機は、前
記送り穴3に係合する歯輪11を備えた送り装置10と
、前記シールテープ6を211離して巻き取るテープ剥
離装置12と、前記収容凹部2内の電子部品5吸着して
ピックアップし、プリント基板14の所定位置に装着す
る吸着へラド13を備えている。また、電子部品5を取
り出した後のテープ本体1を切断するカッター15が前
記送り装置10の下部に配設されている。
This tape-shaped component assembly 7 is placed into an electronic component mounting machine as shown in FIG. This electronic component mounting machine includes a feeding device 10 equipped with a toothed ring 11 that engages with the feeding hole 3, a tape peeling device 12 that winds up the sealing tape 6 at a distance of 211, and an electronic component in the housing recess 2. 5 is equipped with a suction pad 13 that picks up the printed circuit board 14 by suction and attaches it to a predetermined position on the printed circuit board 14. Further, a cutter 15 for cutting the tape body 1 after removing the electronic component 5 is disposed below the feeding device 10.

以上の構成において、テープ状部品集合体7は、送りv
c装10によって第3図の矢印方向に1ビ・ンチづつ間
欠移動される。その移動する間にまずテープ剥離装置1
2でシールテープ6が剥離され、次いで収容凹部2内の
電子部品5が吸着へ7ド13にてピックアップされ、こ
の吸着へラド13が図の矢印16.17.18の如く移
動してプリント基板14に装着される。電子部品5を取
り出されたテープ本体1は送り装置10のIfT輪11
に巻き付いてテープ状部品集合体7を移動駆動する作用
を果たすとともに反転し、〃イド19に沿って前記カッ
ター15に向かって移動し、切断されて廃又される。
In the above configuration, the tape-shaped component assembly 7 has a feed v
It is intermittently moved one inch at a time in the direction of the arrow in FIG. 3 by the C unit 10. During the movement, first the tape peeling device 1
2, the sealing tape 6 is peeled off, and then the electronic component 5 in the accommodation recess 2 is picked up by the suction pad 13, and the suction pad 13 moves as shown by arrows 16, 17, and 18 in the figure to remove the printed circuit board. It is attached to 14. The tape body 1 from which the electronic parts 5 have been taken out is transferred to the IfT wheel 11 of the feeding device 10.
The tape-shaped parts assembly 7 is wound around the tape-shaped parts assembly 7, and at the same time, it is reversed and moved toward the cutter 15 along the guide 19, where it is cut and discarded.

そして、テープ本体1が前記送り装置10の歯輪1〕を
通過する際には、前記収容凹部2を形成する壁面が前記
スリット4の部分て゛屈曲し、テープ本体1が小さな曲
率半径で曲がり得るため、歯輪11の送り歯とテープ本
体1の送り穴3との係合が外れて移動駆動が不可能にな
ったり、テープ本体1とヴイド19の摩擦抵抗が大きい
ために円滑に移動しなくなるというような虞れはない。
When the tape body 1 passes through the gear wheel 1 of the feeding device 10, the wall surface forming the accommodation recess 2 is bent at the slit 4, and the tape body 1 can be bent with a small radius of curvature. As a result, the feed teeth of the gear wheel 11 and the feed hole 3 of the tape body 1 become disengaged, making it impossible to drive the tape, and the frictional resistance between the tape body 1 and the tape body 19 is large, making it difficult to move smoothly. There is no such fear.

尚、上記実施例ではテープ本体1の収容凹部2を形成す
る壁面にスリ/ト4を設けたものを例示したが、第4図
に示すように凹凸8を形成してもほぼ同様の効果が得ら
れることは、詳細に説明するまでもなく明らかである。
In the above embodiment, slits 4 are provided on the wall surface forming the storage recess 2 of the tape body 1, but substantially the same effect can be obtained by forming unevenness 8 as shown in FIG. What can be obtained is obvious without needing a detailed explanation.

発明の効果 本発明のテープ状電子部品集合体によれば、以上のよう
に前記テープ本体の収容凹部を形成する壁面にテープ本
体の長手方向に対して垂直方向に延びる凹凸またはスリ
ットを形成したので、テープ本体の収容凹部内に電子部
品が保持され、電子部品の脚が変形したり、移送途中で
脱落したりする虞れがなく、かつ送り装置部分ではスリ
ットまたは凹凸により収容凹部を形成する壁面がX’f
易に屈曲するため小さな曲率半径で曲げることができ、
確実な送り動作が得られるという効果がある。
Effects of the Invention According to the tape-shaped electronic component assembly of the present invention, as described above, the unevenness or slit extending perpendicularly to the longitudinal direction of the tape body is formed on the wall surface forming the accommodation recess of the tape body. , the electronic component is held in the storage recess of the tape body, there is no risk that the legs of the electronic component will be deformed or fall off during transportation, and the wall surface that forms the storage recess with slits or unevenness in the feeding device part. is X'f
Because it bends easily, it can be bent with a small radius of curvature.
This has the effect of ensuring reliable feeding operation.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例のテープ本体の斜視図、第2
図はテープ状部品集合体の部分縦断面図、第3図は部品
装着機にセットした状態の部分断面正面図、第4図は他
の実施例の部分縦断面図、第5図は従来例における部品
装着機の部分断面正面図、第6図は従来のテープ状保持
体の斜視図、第7図は他の従来例のテープ本体の斜視図
、第8図は更に別の従来例の斜視図である。 1・・・・・・・・・・・・・・・テープ本体2・・・
・・・・・・・・・・・・収容凹部4・・・・・・・・
・・・・・・・スリット5・・・・・・・・・・・・・
・・電子部品6・・・・・・・・・・・・・・・シール
テープ7・・・・・・・・・・・・・・・テープ状部品
集合体8・・・・・・・・・・・・・・・凹凸。 代理人  弁理士 中尾敏男 はか1名第6図
FIG. 1 is a perspective view of a tape body according to an embodiment of the present invention, and FIG.
The figure is a partial longitudinal cross-sectional view of a tape-shaped component assembly, FIG. 3 is a partial cross-sectional front view of the tape-shaped component assembly set in a component mounting machine, FIG. 4 is a partial vertical cross-sectional view of another embodiment, and FIG. 5 is a conventional example. 6 is a perspective view of a conventional tape-shaped holder, FIG. 7 is a perspective view of another conventional tape body, and FIG. 8 is a perspective view of yet another conventional example. It is a diagram. 1...Tape body 2...
......Accommodation recess 4...
・・・・・・Slit 5・・・・・・・・・・・・・・・
...Electronic component 6...Seal tape 7...Tape-shaped parts assembly 8...・・・・・・・・・Unevenness. Agent: Patent attorney Toshio Nakao (1 person) Figure 6

Claims (1)

【特許請求の範囲】[Claims] (1)部品を収容する収容凹部をエンボス成形されたテ
ープ本体と、収容凹部の開口を閉鎖するシールテープと
を備えたテープ状部品集合体において、前記テープ本体
の収容凹部を形成する壁面にテープ本体の長手方向に対
してほぼ垂直方向に延びるスリットまたは凹凸を形成し
たことを特徴とするテープ状部品果合体。
(1) In a tape-shaped parts assembly comprising a tape body having an embossed accommodation recess for accommodating components and a sealing tape for closing the opening of the accommodation recess, tape is attached to the wall surface forming the accommodation recess of the tape body. A combination of tape-shaped parts, characterized in that a slit or unevenness is formed extending substantially perpendicularly to the longitudinal direction of the main body.
JP60269717A 1985-11-29 1985-11-29 Tape-shape parts assembled unit Pending JPS62128600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60269717A JPS62128600A (en) 1985-11-29 1985-11-29 Tape-shape parts assembled unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60269717A JPS62128600A (en) 1985-11-29 1985-11-29 Tape-shape parts assembled unit

Publications (1)

Publication Number Publication Date
JPS62128600A true JPS62128600A (en) 1987-06-10

Family

ID=17476183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60269717A Pending JPS62128600A (en) 1985-11-29 1985-11-29 Tape-shape parts assembled unit

Country Status (1)

Country Link
JP (1) JPS62128600A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01240415A (en) * 1988-03-18 1989-09-26 Matsushita Electric Ind Co Ltd Method for manufacturing a series of electronic parts
JP5835825B1 (en) * 2014-11-19 2015-12-24 上野精機株式会社 Carrier tape traveling device and electronic component conveying device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01240415A (en) * 1988-03-18 1989-09-26 Matsushita Electric Ind Co Ltd Method for manufacturing a series of electronic parts
JP5835825B1 (en) * 2014-11-19 2015-12-24 上野精機株式会社 Carrier tape traveling device and electronic component conveying device
WO2016080162A1 (en) * 2014-11-19 2016-05-26 上野精機株式会社 Carrier tape-running device and electronic part-conveying apparatus

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