JPS59208900A - Method of mounting chip part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application This invention relates to a method for mounting chip components, in which chip components are taken out one by one from a taping package for chip components and mounted on a printed circuit board or the like.

2. Description of the Related Art In order to increase the packaging density of electronic components on printed circuit boards and to reduce their size, electronic components are becoming leadless chip components. Mounting of this type of chip component onto a printed circuit board or the like is normally carried out automatically using a taping package in which the chip component is taped, and for example, conventionally this has been carried out as follows.

First, a long taping package (1
). This is the tape body (made of a long piece of paper, etc.)
2), a thin top tape (3) made of vinyl or the like and a bottom tape (4) attached to the top and bottom surfaces of the top and bottom tapes, and the tape body (2) has multiple parts stored in a series at equal intervals in the longitudinal direction. Holes (5) (5L-) are formed with feed holes (6) (6) for intermittent feeding of the tape that are lined up in a series at the same pitch in parallel with the hole (5L-), and each component storage hole (5) (5) is formed. Taping is performed by storing the chip parts (7) one by one and applying both chips 7' (3) and (4). Both tapes (3) (
4) has its both sides adhered to the tape body (2) using an adhesive or the like, thereby making it easy to peel from the tape body (2).

2nd FI! J and Figure 3 are taping packages (1)
This is a part of an automatic mounting machine that takes out chip components (7) one by one from a tape package (8) is a guide rail that guides the feeding of the taping package (1) in the longitudinal direction. It is configured in a shape that curves semicircularly from the horizontal direction to the bottom wash on the circumference of 8 degrees) and then extends horizontally again.

(9) is a cover that covers the curved part of the guide rail (8) and its vicinity, and includes an upper cover (9a) and a lower cover (9b).
The upper cover (9a) is placed on the guide rail (8) via a spring member (not shown) so as to lightly press the taping pan cage (1), and the lower cover (9a)
b) also serves as a guide for the taping package (1) going down the curved part of the guide rail (8). Upper cover (9a)
is opened at the top tape peeling position P, which also serves as a component removal position, provided on the horizontal part near the upper curved point of the guide rail (8), and this opening (10
), the top tape (3) is peeled off from the tape body (2).
) will be withdrawn. (11) is the guide rail (8)
The feed gear (12) is a ratchet mechanism that intermittently rotates the feed gear (11) in one direction on the side of the curved part of the feed gear (12). 13), a pawl (gear 4) that engages with the teeth of the pinion (13) and regulates its rotational direction, and a pawl that is loosely fitted to the common support shaft (15) of the pinion (13) and feed gear (11). It has a lever (16) and a pawl (17) that pushes up the teeth of the pinion (13) and rotates the pinion (13) by one pitch when the lever (16) rotates in the direction of the chain line in the figure.

The former pawl (14) has a compression spring (18) whose tip end is in constant elastic contact with the pinion (13), and the latter type (17) has a built-in spring (not shown) whose tip end is in constant elastic contact with the pinion (13). In addition, the lever (16) has a spring (19) locked at the rear end.
), the lever (16) is held at the solid line position in the drawing, and when the tape is fed, an external force is applied to the tip of the lever (16).
) rotates by a fixed angle, the feed gear (11) rotates by one pitch via the pinion (13). The teeth of the feed gear (11) (
11') (11'')- fits into the feed hole (6) (6L-) of the tape body (2) on the curved part of the guide rail (8), thereby rotating the feed gear (11) by one pitch. Each time the taping package (1) moves one pitch along the guide rail (8).

When a part of the taping pan cage (1) is sent to the above-mentioned fixed position P, the top tape (3) is sequentially peeled off using the rear edge of the opening (10) and pulled out. . At the same time as the peeling off of the tape (3), a vacuum adsorption nozzle (2o) is inserted from above the opening (1o).
is lowered to suck and take out the chip component (7) from the component storage hole (5) of the tape body (2) immediately after peeling off the I/tub tape at the fixed position P. The nozzle (20) that has adsorbed the chip component (7) rises and moves to the operation of mounting the chip component on an external part such as a printed circuit board (not shown), and when the mounting is completed, the nozzle (20) returns to the top of the opening (10). Go back to. Such an operation is repeated for each pinch of the taping package (1), and the integrated tape body (2) and bottom tape (4) from which the chip components have been removed are removed from the bottom of the guide rail (8). sent outward.

Problems to be Solved by the Invention The above mounting method starts from the tape body (2) to the top tape (3).
) The following troubles sometimes occurred when peeling off. That is, the L-tube tape (3) is adhered to the tape body (2) with a certain degree of strong adhesive force in order to prevent it from being easily peeled off during tape transportation or tape storage. Therefore, when peeling off the 1-butt tape (3) at the fixed position P,
The tape did not always peel off smoothly, and as shown in FIG. 4, it sometimes passed through the fixed position P while remaining attached to the tape body (2), making it impossible to remove the chip component (7). When such top tape peeling and winding occurs, it is necessary to stop all operations and make corrections, which reduces the operating rate of the automatic mounting machine. In addition, the tape body (2) vibrates up and down due to the impact force when the top tape (3) is peeled off, and this vibration tilts the chip component (7), making it difficult for the nozzle (20) to pick up the chip component (7). Otherwise, the chip component (7) may be taken out in an incorrect orientation, making subsequent mounting operations difficult.

Means for Solving Problem 21 The present invention provides a means for solving problem 2, in which adhesive parts on both sides of the top tape in a taping package are cut and separated from the center in advance, and then the center part of the top tape is cut and separated. It is characterized by separating the tape from the tape body and winding it up to take out the chip parts. In this way, the center part of the top tape can be peeled off easily and easily, so chip components can always be removed smoothly.
It becomes possible to mount chi-knob parts with good operation rate.

E. Embodiment A specific example of an apparatus for implementing the present invention which is applicable to the automatic mounting machine shown in FIG. 2 will be explained with reference to FIGS. 5 to 8. In FIGS. 5 and 6, the same reference numerals as in FIGS. 2 and 3 indicate the same parts, and details will be omitted.

The difference is that a pair of cutters (21) (21) are fixedly arranged near the front of the opening (10) of the upper cover (9a). Cutter (21) (21) has an opening (
10) Taping bar cage (1) is sent downward.
) Adhesive parts (3a) on both sides of top tape (3) (3
a) and the central portion (3b), and when the taping package (1) is being fed, only the 1-.tube tape (3) is cut and separated into three pieces from the boundary line. In addition, as a means for enhancing the implementation effect of the present invention, for example, the guide rail (8)
A magnet (22) such as a rubber magnet is fixedly arranged near a fixed position P of the magnet.

The implementation of chip parts with the above structure is Kanku (21)
The process is carried out in the same manner as in the conventional method except that a step of cutting and separating the top tape (3) is added in step (21). That is, the cutters (21) (21) cut and separate the adhesive parts (3a) (3a) on both sides of the top tape (3) from the central part (3b), and then the central part (3b) at a fixed position P.
The chip component (7) is taken out by pulling it out from the opening (10) and winding it up in the direction of the arrow. In this winding drawer, the center part (3b) of the top tape is the tape body (
Since it is completely separated from the top tape (2), it can be pulled out smoothly and effortlessly, and there is no need to worry about vibrations being applied to the tape body (2) when winding the top tape. The component (7) is always held in a stable position and accurately picked up by the nozzle (20) and taken out, and the desired mounting is performed. In addition, the static electricity generated in the top tape (3) electrostatically attracts the chip component (7), and when the top tape center portion (3b) is peeled off and rolled up, the chip component (7) is integrated with the top tape center portion (3b). In some cases, the chip component (7) may be taken out from the component storage hole (5), but this can be done by attracting the chip component (7) with the magnet (22) using a magnetic force that is slightly thicker than the electrostatic attraction force. This can be solved by setting

Incidentally, the example of the device for implementing the present invention is not limited to the above example (.

For example, as shown in FIG. 8, the upper inner surface of the component storage hole (5) of the tape body (2) is expanded into a tapered shape so that the chip component (7)
) Taped package (1'
) is more effective.

1. Effects of the Invention As described above, according to the present invention, the top tape peeling and winding failure when taking out the chip component from the taped package are almost completely eliminated, the operation rate of the chip component mounting apparatus is improved, and good chip quality is achieved. Component mounting becomes possible.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view of a taping package, FIGS. 2 and 3 are a side view and an enlarged cross-sectional view of A-A cotton, and FIG. 4 is a part of FIG. 2. FIGS. 5 and 6 are a side view and an enlarged sectional view taken along the line B-B of FIG. FIG. 8 is a partial enlarged perspective view of the main part, and a partial sectional view showing a modification of the taping package. (1) (1') --- Taping package, (2
〉−・・・Tape body, (3)・・・Top tape,
(5) - Parts storage hole, (7) - Chip parts, p
- Tape removal position. Chrysanthemum 1 figure + 1 [1,, Ri 11 478- 95 width 1s6 sub-λ2 leather 7 Seki No. 811

Claims (1)

[Claims] (11 Chip components are stored in component storage holes formed at equal intervals in the longitudinal direction of the long tape body, and a top tape having a central part along the longitudinal direction and adhesive parts on both sides is attached to the tape body.) In the method of taking out chip parts one by one and mounting them on an external member while sequentially peeling off the top tape, the step of sequentially cutting and separating the top tape into the central part and the adhesive parts on both sides, cutting from the tape main body. A chip component characterized by comprising the steps of: sequentially separating the separated central portions of the top tape to take out the chip components from the component storage opening; and mounting the taken-out depth components at a predetermined position on the external member. How to implement.