JPS60138999A - Automatic mounting device for electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 1''#'''''I The present invention provides a method for picking out electronic components held in multiple 1:1 form with tape individually and mounting them on a printed circuit board by a mounting head. This invention relates to an automatic mounting device for electronic components that prevents one electronic component from falling off from a pitch-fed tape. 1. Background technology; In general, 11 electronic components such as chip-shaped capacitors and resistors are mounted. To mount electronic components on a printed circuit board, since they are small components, each component is held in multiple tapes, and the mounting head is moved up and down every pitch of the tape to pick out the electronic components. Efforts are being made to improve the certainty of supply and the efficiency of implementation operations.

Then, the electronic components E, E, etc. are individually housed in the recesses 2 of the embossed tape L and the front side is covered with the cover tape 3, or they are housed individually in the through holes of the base tape and exposed. Usually, the back side is covered with a cover tape and stored with a holding tape T (see Figure 1). Also, this tape T is used to remove electronic components through the tape feeding path directly below where the mounting head moves up and down. The Sakai re-drum is equipped to finely feed one pitch at a time, and from the tape T, cover tape 3. It is applied to automatic mounting equipment that mounts electronic components by picking up electronic components with a mounting head after peeling off the board, and moving the mounting head forward from that position toward the mounting table of the printed circuit board to the mounting position of the electronic components. There is.

However, in this automatic mounting device, when the mounting head moves up and down or back and forth, or when the feed drum feeds the tape one pitch, electronic components dance and fall off the holding tape that has peeled off the cover tape due to vibrations, etc. There is a risk that idle operation may occur during the first mounting.

DISCLOSURE OF THE INVENTION An object of the present invention is to provide an improved electronic component mounting apparatus that prevents electronic components from falling off a holding tape and allows reliable mounting work.

That is, in the automatic mounting of electronic components according to the present invention, a shutter that projects or retreats from the side of the tape feeding path onto the running path is provided at the electronic component extraction position of the mounting head.
The mounting head is configured to be able to stop the next electronic component while reciprocating to the mounting position of the electronic component.

Below the example, Figures 2 to 4 are $IK! The explanation is as follows.

A mounting pad 10 for electronic components is installed on the upper frame side of upper and lower frames 12 and 13 placed on the xY table 11. The mounting head 10 is attached to the upper 71/-7-A12 so that it can move up and down at the extraction position MXI by means of a driving cylinder (C) installed in the vertical direction. A vacuum nozzle 14 that sucks electronic components from the vacuum nozzle 14 and a chuck 15 that receives and clamps the electronic components from the vacuum nozzle 14 when ascending are provided. In addition, the mounting) RAD 10 is arranged so that the upper frame 12 can be moved back and forth in the horizontal direction by a drive cylinder (not shown) attached laterally to the lower frame 13, and the extraction position of the electronic component is X! The mounting position S is movably attached to the mounting position x2 where electronic components are mounted on the printed circuit board P.

On the other hand, the tape T that holds the electronic components is the lower frame 1.
3 is supported by a reel R attached to the reel R, and by placing the unwinding tape portion over the tape feeding drum 16 which is driven intermittently through the opposing intervals of the upper and lower frames 12 and 13! Equipped with intermittent feed for each pitch.

From this holding tape T, the vertical movement position Mx of the mounting head IO is
.

The cover tape 3 is gradually peeled off by the winding drum 17 on the front side of the
In I, the vacuum nozzle 14 is capable of suctioning electronic parts.

On the side of the tape feeding path of the lower frame 13, a shutter 18 is formed with a plate portion 18a on the tip 1 side formed in a planar abbreviated shape and protrudes onto the tape feeding path (and is attached so as to be retractable). .This shaft "□-18" is pivoted at its approximately middle side to the one-tape feed path side of the lower frame 13 with a support shaft 19, and a torsion coil spring 20 fitted to the top end of the axis i of the support shaft 19. By fixing one end to the plate surface of the shear j-18, and fixing the other end □ to an appropriate location on the lower frame 13, 1..

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In the electronic component automatic mounting apparatus configured as described above, the mounting head IO stops at the electronic component extraction position It x r:
At this time, the arm 21 protrudingly attached to the upper frame 12 engages with the hook plate portion +8b, thereby causing the shutter 18 to retreat and rotate against the torsion coil spring 20. When in the side state, □ is mounting head 1
0 moves up and down to pick up the electronic component, and when the mounting head 10 starts moving toward the electronic component mounting position x2, the arm 21 moves forward together with the upper frame 12, so the shutter 18 is moved by the torsion coil spring 20 to feed the tape. The plate portion 18a is projected onto the road. The plate portion 18a is located directly above the holding tape T that is fed one pitch by the tape feed drum 16, and is located so as to cover the electronic component E to be extracted next. Therefore, even if the tape feed drum 16 is operated intermittently to feed the holding tape T by one pitch while the mounting head is moving forward, the electronic component E will be 144 + , + in the recess 9 of the holding tape T, tQl. -1-Iso (fp
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Effects of the Invention As described above, according to the electronic component automatic mounting apparatus according to the present invention, the shutter is located above the holding tape from which the cover tape has been peeled off during the operation of the peripheral mechanism section, so that the electronic components are mounted on the holding tape. Since the electronic component does not fall off from the mounting head, it is possible to prevent the electronic component from being removed by the mounting head.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an example of a tape for holding electronic components, FIG. 2 is a side view showing the entire electronic component mounting apparatus according to the present invention, and FIG. 3 is a side view showing an example of the shutter mechanism of the device. FIG. 4 is a partially omitted plan view and an extracted perspective view of the shutter mechanism. T: Holding tape, E, E...: Electronic components, xl:・
Electronic component extraction position, x2: Electronic component mounting position, l
O: Mounting head, 18: Shutter.

Claims (1)

[Claims] A shutter that protrudes or retreats from the side of the tape feed path onto the running path is provided at the lowering position of the mounting head that picks out the electronic components held in multiple rows with tape. , the shutter is configured to be able to stop the next 1::1 electronic component that is removed from the tape during the reciprocating movement to the position where the electronic component is mounted on the mounting head.
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