JP2020068217A5 - Component mounting device and component supply method - Google Patents

Description

The present invention relates to a component mounting device and a component supply method for picking up components supplied by a tape feeder by a mounting head and mounting them on a substrate.

Therefore, the present invention provides a component mounting device and a component supply method capable of preventing various losses from occurring due to parts falling off from the carrier tape while improving tact by postponing the carrier tape. The purpose.

The component mounting device of the present invention is a component mounting device that mounts a component on a substrate to produce a mounting board, and performs a tape feeding operation of pitch-feeding a carrier tape containing the component to deliver the component to a component supply position. a tape feeder for test sheet, the components and mounting heads for picking up the supplied component supply position, before Symbol the mounting head component tape feeder is supplied to the component supply position is mounted on the substrate from the pickup The tape feeder includes an operation control unit that operates the tape feeder so that the tape feeder supplies the next component to the component supply position, and the operation control unit supplies the component supplied to the component supply position. After the mounting head picks up, the picked-up component is finally supplied by the tape feeder in the production of the mounting board before the tape feeder is operated to supply the next component to the component supply position. It determines whether or not to correspond to the final part, as a result, when the part where the mounting head is picked up is determined to correspond to the final part is not carried out the operation.
The component supply method of the present invention is a component supply method of supplying components to a component mounting device that mounts components on a substrate using a mounting head to produce a mounting board, and pitch-feeds a carrier tape containing the components. After the mounting head picks up the parts supplied to the component supply position by the tape feeder that performs the tape feed operation, the pickup is performed before the tape feeder is made to supply the next component to the component supply position. When it is determined whether or not the finished component corresponds to the final component supplied by the tape feeder in the production of the mounting board, and when it is determined that the component picked up by the mounting head corresponds to the final component, the above is described. If the tape feeder does not supply the next component to the component supply position and determines that the component picked up by the mounting head does not correspond to the final component, the mounting head picks up the component and then the mounting head picks up the component. The next component is supplied to the component supply position by the tape feeder until it is mounted on the substrate.

As described above, in the component mounting device 1 (component supply method by the component mounting device 1) in the present embodiment, the mounting head 15 picks up the component BH supplied by the tape feeder 13 to the component supply position 13a, and then the substrate. In operating the tape feeder 13 so that the tape feeder 13 supplies the next component BH to the component supply position 13a before mounting on the KB, the component BH picked up by the mounting head 15 is supplied by the tape feeder 13. When it is determined that the final component (the component BH to be supplied last by the tape feeder 13 in the production of the mounting board) is determined, the tape feeder 13 is not operated to supply the next component BH to the component supply position 13a. (The final component is mounted on the board KB by the mounting head 15 without being forced to do so ). Therefore, the component BH does not remain at the component supply position 13a at the end of production. Therefore, according to the component mounting device 1 in the present embodiment, the carrier tape 23 is postponed to improve the tact, and the component BH is prevented from falling off from the carrier tape 23 to cause various losses. it can.

Provided are a component mounting device and a component supply method capable of preventing various losses from occurring due to a component falling off from the carrier tape while improving tact by postponing the carrier tape.

Claims (4)

A component mounting device that mounts components on a board to produce a mounting board.
A tape feeder for supply feeding the components to the component supply position of the carrier tape accommodating the components performing tape feeding operation of pitch feed,
A mounting head for picking up components said supplied to the component supply position,
Said tape as said tape feeder between the components before Symbol tape feeder is supplied to the component supply position from the pick-up the mounting head until mounted on the substrate to supply the next component in the component supply position Equipped with an operation control unit that operates the feeder
The motion control unit
After the mounting head picks up the components supplied to the component supply position, the picked-up components are mounted on the mounting board before the tape feeder is operated to supply the next component to the component supply position. the tape feeder in the production it is determined whether corresponding to the last supply the final part, as a result, when the part where the mounting head is picked up is determined to correspond to the final part is not carried out the operation Component mounting device. The operation control unit, when said final part has detected that were not successfully mounted on the substrate, said tape feeder to feed to the component supply position as the final part for retrying the next component controls, the mounting head component mounting apparatus according to請Motomeko 1 you mounted on the substrate the final part to pick up for the retry. It is a component supply method that supplies components to a component mounting device that manufactures a mounting board by mounting components on a board using a mounting head.
After the mounting head picks up the parts supplied to the component supply position by the tape feeder that performs the tape feed operation to pitch-feed the carrier tape containing the components, the tape feeder is made to supply the next component to the component supply position. Before the operation is performed, it is determined whether the picked-up component is the final component supplied by the tape feeder in the production of the mounting board.
When it is determined that the component picked up by the mounting head corresponds to the final component, the tape feeder does not supply the next component to the component supply position.
When it is determined that the component picked up by the mounting head does not correspond to the final component, the next component is mounted by the tape feeder between the time when the mounting head picks up the component and the time when the component is mounted on the substrate. A component supply method for supplying to the component supply position. The component supply method according to claim 3, wherein when it is detected that the final component is not normally mounted on the substrate, the next component is supplied to the component supply position as a final component for retry.