JP2016219472A - Component extracting device, component extracting method and component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component extracting device, a component extracting method and a component mounting device that are excellent in versatility, low in cost and bring high production efficiency.SOLUTION: In extraction of a component by a component extraction device used for a component mounting device, plural components as extraction targets are supplied under an irregular posture, the supplied plural components are imaged by a first camera, extractable plural components out of the plural components are detected based on an image captured by the first camera, plural components to be extracted are selected among the plural detected extractable components, the plural components to be extracted are respectively held and extracted by plural component holding units, and the process of extracting these plural components passes through a state under which the plural components to be extracted are simultaneously held by the plural component holding units.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a component take-out apparatus and a component take-out method used in the component mounting field for mounting a component on a board, and a component mounting apparatus using the component take-out apparatus.

  In a component mounting line in which electronic components are mounted on a substrate to produce an electronic substrate, various types of components are mounted on the substrate by a component mounting apparatus. These components include small chip-type components and surface mount components such as QFP that are solder-bonded to the electrode surface of the circuit board, as well as mounting holes formed on the circuit board that have leads for connection such as power transistors and connector parts. There is an insertion part that is mounted by inserting a lead into the board. For mounting such an insertion component on a substrate, conventionally, a method in which a worker manually inserts a lead or a method using dedicated equipment prepared for each component has been employed (for example, see Patent Document 1). ).

  In the prior art shown in this patent document example, there is shown an example of a component insertion device that mounts an axial component with leads extending from the component main body on both sides in the axial direction on a substrate. Then, in the component mounting operation, the axial component supplied in the form of taping component series in which both ends of the lead are held with tape is delivered to the component transport mechanism in a vertical posture where the lead is upright, and further separated from the taping component sequence. Is transferred to the component insertion mechanism.

JP 2014-063937 A

  However, in the prior art using the dedicated equipment for each part including the above-mentioned patent document examples, there are the following inconveniences from the viewpoint of versatility of the parts to be applied. In other words, in the dedicated equipment used in the prior art, the parts are regularly arranged / posted, such as a form in which the parts are supplied in a predetermined posture by taping as a form for supplying a plurality of parts, or a form in which the parts are stored in a tray-like holder. It was necessary to supply with.

  For this reason, it is difficult to pick out multiple types of parts with different shapes and sizes of common equipment, and it is difficult to produce parts manually by mounting parts, or dedicated equipment for each part type. It has been forced to select one of the work modes having a high equipment cost to be prepared, and there has been a demand for a component take-out technique that is excellent in versatility and can realize high production efficiency at low cost. This problem is common not only to the inserted parts but also to so-called deformed parts that are difficult to supply by taping or trays.

  Accordingly, an object of the present invention is to provide a component take-out device, a component take-out method, and a component mounting device that are excellent in versatility and can realize high production efficiency at low cost.

  The component take-out device of the present invention includes a component supply unit that supplies a plurality of components to be taken out in an irregular posture, a camera that images the plurality of components supplied by the component supply unit, and an image picked up by the camera. A component detection unit that detects a plurality of parts that can be taken out of the plurality of parts, and a plurality of parts that should be taken out of the plurality of parts that can be taken out detected by the part detection unit, based on the obtained image. A component selection unit to be selected, and a component conveyance unit that holds and takes out the plurality of components to be taken out selected by the component selection unit by a plurality of component holding units, and the plurality of parts to be taken out by the component conveyance unit. In the process of taking out the parts, the plurality of parts to be taken out are simultaneously held by the plurality of part holding parts.

  The component picking method of the present invention includes a component supplying step of supplying a plurality of components to be picked up in an irregular posture, an imaging step of picking up the supplied plurality of components with a camera, and an image picked up by the camera A component detection step for detecting a plurality of parts that can be taken out of the plurality of parts based on an image, and a part selection step for selecting a plurality of parts to be taken out of the detected plurality of parts that can be taken out And picking out the plurality of parts to be taken out in the process of taking out the plurality of parts to be picked up in the parts transporting step. A plurality of power components are simultaneously held by the plurality of component holding portions.

  A component mounting apparatus according to the present invention is a component mounting apparatus that transfers and mounts a component taken out by a component removing device onto a substrate held by a substrate holding unit, and the component removing device includes claims 1 to 2. 5. The component take-out device according to claim 5.

  According to the present invention, it is possible to realize high production efficiency with excellent versatility and low cost in taking out components in a component mounting apparatus.

The perspective view of the component mounting apparatus with which the component picking_out | removing apparatus of one embodiment of this invention was integrated The fragmentary perspective view of the components pick-up apparatus of one embodiment of this invention Structure explanatory drawing of the components holding | maintenance part (1st Example) used for the components pick-up apparatus of one embodiment of this invention The fragmentary top view of the components pick-up apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus with which the component pick-up apparatus of one embodiment of this invention was integrated Explanatory drawing of component basic shape, surface identification, and component attitude | position data in the component pick-up apparatus of one embodiment of this invention Explanatory drawing of the overlap determination data in the component pick-up apparatus of one embodiment of this invention Explanatory drawing of the extraction area | region data in the components extraction apparatus of one embodiment of this invention Explanatory drawing of movement distance and time calculation in the component picking-up apparatus of one embodiment of this invention Explanatory drawing of the component direction data in the component pick-up apparatus of one embodiment of this invention The flowchart which shows the component mounting operation | movement by the component mounting apparatus with which the component pick-up apparatus of one embodiment of this invention was integrated Operation | movement explanatory drawing which shows the components picking_out | removing method of one embodiment of this invention Operation | movement explanatory drawing which shows the components picking_out | removing method of one embodiment of this invention Explanatory drawing of the component mounting operation | movement by the component mounting apparatus with which the component pick-up apparatus of one embodiment of this invention was integrated Structure explanatory drawing of the components holding part (2nd Example) used for the components pick-up apparatus of one embodiment of this invention Operation | movement explanatory drawing of the components holding part (2nd Example) used for the components pick-up apparatus of one embodiment of this invention Structure explanatory drawing of the components supply part in the components pick-up apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1, the overall configuration of a component mounting apparatus 1 in which a component picking device according to the present embodiment is incorporated will be described. In FIG. 1, a substrate transport mechanism 3 is disposed on the upper surface of the base 2 in the X direction (substrate transport direction). The board transport mechanism 3 receives the board 4 to be mounted from the upstream device (not shown), transports it in the X direction, and positions and holds it at a mounting work position by the component mounting mechanism described below. That is, the substrate transport mechanism 3 serves as a substrate holding unit that positions and holds the substrate 4.

  A component supply unit 5 is disposed on one side of the substrate transport mechanism 3. A tray feeder 6 is disposed in the component supply unit 5, and the tray feeder 6 supplies the tray 7 in which the component 8 to be mounted is stored to the take-out position by the component take-out head 13 provided in the component mounting mechanism. A first camera 9 is disposed above the tray 7 with the imaging direction facing downward. The tray feeder 6 provided in the component supply unit 5 used in the present embodiment does not supply the components to be taken out in a grid-like regular arrangement like a generally used tray feeder, but the components 8 to be taken out. The supply form is irregular.

  A Y-axis drive table 11 is disposed in the Y direction on the upper surface of a pair of frame portions 10 disposed at both ends in the Y direction of the base 2, and an X-axis drive installed on the Y-axis drive table 11. A component picking head 13 is mounted on the table 12 so as to be movable in the X direction. Each of the Y-axis drive table 11 and the X-axis drive table 12 includes a linear motor driven linear motion mechanism. By driving the Y-axis drive table 11 and the X-axis drive table 12, the component picking head 13 moves in the X direction and the Y direction, and the substrate 4 in which the component 8 taken out from the tray 7 is positioned and held by the substrate transport mechanism 3. To be loaded.

  In the present embodiment, the Y-axis drive table 11, the X-axis drive table 12, and the component pick-up head 13 constitute a component transport unit 15 that transports the component 8 taken out from the tray 7, and in the present embodiment, the component transport. The unit 15 also functions as a component mounting mechanism. That is, the component picking head 13 has a function as a mounting head for transferring and mounting the component 8 on the substrate 4.

  A second camera 16 is disposed in a transfer path along which the component pickup head 13 that has extracted the component 8 from the tray 7 transfers the substrate 8 to the substrate 4. The second camera 16 lowers the component 8 held by the component pickup head 13 in the process of transferring the component 8 to the substrate 4 held by the substrate transfer mechanism 3 which is a substrate holding unit by the component pickup head 13. Take an image from.

  As shown in FIG. 2, by imaging the tray 7 with the first camera 9 disposed above the tray 7 (arrow a), an image of the component 8 supplied in an irregular posture on the tray 7 can be obtained. Can be acquired. That is, the first camera 9 (camera) images the plurality of components 8 supplied by the component supply unit 5. The component picking head 13 includes a plurality of (three in this example) chuck units 14 extending downward from the lower surface side, and the chuck unit 14 moves the component 8 from both sides by a pair of chuck claws 17. It has a function of holding and holding.

  The configuration and function of the chuck unit 14 will be described with reference to FIG. As shown in FIG. 3A, the chuck unit 14 includes an elevating / rotating shaft 14 b that extends upward from the main body 14 a and is coupled to the component picking head 13. By driving an elevating mechanism and a θ rotating mechanism (both not shown) incorporated in the component picking head 13, the chuck unit 14 is moved up and down (arrow c), and further rotated around the elevating / rotating shaft 14b by θ (arrow d). ).

  The main body portion 14a is provided with a pair of chuck claws 17 extending downward so as to be able to turn around a horizontal turning shaft 17a. By driving an opening / closing mechanism (not shown) built in the main body portion 14a, the pair of chuck claws 17 move toward and away from each other (arrow e). It can be held and held by the chuck claw 17. Further, a pushing mechanism 18 is provided on the front surface of the main body portion 14a, and a pushing member 18b is coupled to the lower end portion of the elevating shaft 18a extending downward from the pushing mechanism 18.

  As shown in FIG. 3 (b), by driving a claw turning mechanism (not shown) built in the main body 14a, the pair of chuck claws 17 turn around the turning shaft 17a (arrow f). Thereby, the chuck unit 14 can change the posture of the component 8 held in the horizontal posture to the vertical posture. Further, by driving the pushing mechanism 18, the pushing member 18 b moves up and down (arrow g), whereby the component 8 held in the vertical posture by the chuck claw 17 is pushed down by the pushing member 18 b, and the lead 8 b is inserted into the substrate 4. It is inserted into the hole 4a (see FIG. 14).

  When the components 8 are picked up from the tray 7 by the component pickup head 13, the recognition result of the first camera 9 is recognized by the recognition processing unit 19 (see FIG. 5), whereby the positions of the individual components 8 in the tray 7 are detected. And posture is acquired. Then, by controlling the component picking head 13 and the chuck unit 14 based on these recognition results, the component 8 can be held by each chuck unit 14 and taken out from the tray 7 (arrow b) (see FIG. 12). .

  As shown in FIG. 4, the component 8 accommodated in the tray 7 is a so-called insertion component having a configuration in which a plurality of leads 8 b extend from a rectangular component main body portion 8 a such as a power transistor. An insertion hole 4 a into which the lead 8 b is inserted is formed in the substrate 4 positioned and held by the substrate transport mechanism 3. When the component 8 is mounted on the substrate 4, the component pick-up head 13 holding the component 8 by each chuck unit 14 moves above the second camera 16, so that the second camera 16 removes the component 8. Take an image from below.

  And the position of the lead 8b in each component 8 is recognized by carrying out recognition processing of the image pick-up result by the 2nd camera 16 by the recognition process part 19 (refer FIG. 5). When the component 8 is mounted on the substrate 4 by the component take-out head 13 moved above the substrate 4, the lead 8b is aligned with the insertion hole 4a based on the recognition result described above (see FIG. 14).

  In component replenishment work for storing the component 8 in the tray 7, in principle, the operator can deploy the component 8 on the component placement surface 7 a of the tray 7 in a state of only one layer without overlapping each other. Perform leveling. At this time, the direction and the front and back of each part 8 are irregular in the tray 7, and there are parts in a reversed state (indicated by reference numeral 8 *) and two parts 8 partially overlapped. To do. In taking out the components according to the present embodiment, the following configuration is used in order to take out the components 8 supplied in such an irregular posture as efficiently as possible.

  Here, the configuration of the control system will be described with reference to FIG. In FIG. 5, the control device 20 built in the component mounting apparatus 1 controls work operations by the component supply unit 5, the component transport unit 15, and the board transport mechanism 3 shown in FIG. 1. Further, the control device 20 is connected to the recognition processing unit 19, and the recognition processing unit 19 recognizes the imaging results obtained by the first camera 9 and the second camera 16 and transmits the recognition results to the control device 20. The recognition processing unit 19 recognizes the imaging result of the first camera 9, whereby the position and orientation of the component 8 on the tray 7 are determined. The recognition processing unit 19 recognizes the component 8 held by the chuck unit 14 of the component pick-up head 13 by performing recognition processing on the imaging result obtained by the second camera 16.

  The control device 20 includes a control processing unit 21, a program storage unit 25, and a data storage unit 29. The control processing unit 21 further includes a mounting control unit 22, a component detection unit 23, and a component selection unit 24 as internal control functions. The mounting control unit 22 controls a component mounting operation for mounting the component 8 taken out from the component supply unit 5 on the substrate 4 positioned and held by the substrate transport mechanism 3. The component mounting operation is controlled by executing the mounting operation program 26 stored in the program storage unit 25 while referring to the mounting data 30 stored in the data storage unit 29. In this control, the component mounting mechanism is controlled based on the recognition result of the component 8 by the recognition processing unit 19 to mount the component 8 on the substrate 4.

  The component detection unit 23 performs component detection processing for detecting a plurality of components 8 that can be taken out of the plurality of components 8 stored in the tray 7 based on the image captured by the first camera 9. This component detection processing is performed by executing the component detection processing program 27 stored in the program storage unit 25 while referring to the take-out availability determination data 31 stored in the data storage unit 29.

  The component selection unit 24 performs a component selection process for selecting a plurality of components 8 to be taken out of the plurality of extractable components 8 detected by the component detection unit 23. This component selection processing is performed by executing the component selection processing program 28 stored in the program storage unit 25 while referring to the component selection data 32 stored in the data storage unit 29. Then, the plurality of parts 8 to be taken out selected by the part selection unit 24 are held and taken out by the chuck units 14 as the plurality of part holding units provided in the part picking head 13. That is, the component transport unit 15 having the above-described configuration has a function of holding and extracting the plurality of components 8 selected by the component selection unit 24 by the plurality of component holding units.

  In the present embodiment, in the process of taking out the plurality of parts 8 to be taken out by the parts transport unit 15, a state in which the plurality of parts 8 to be taken out is simultaneously held by the chuck unit 14 as a plurality of part holding parts is surely passed. I am doing so. Thereby, a plurality of parts 8 can be taken out by one operation of the part picking head 13, and the work efficiency of picking up the parts can be improved.

  Among the components shown in FIG. 5, elements for mounting the component 8 taken out from the component supply unit 5 in the component mounting apparatus 1 on the substrate 4 (specifically, the second camera 16, the mounting control unit 22, The components excluding the mounting operation program 26 and the mounting data 30) constitute the component take-out device in the present embodiment.

  Hereinafter, the basic component shape data 31a, the component orientation data 31b, the surface identification data 31c, and the overlap determination data 31d that are referred to in the component detection process performed by the component pickup apparatus having the above-described configuration will be described.

  FIG. 6A shows component basic shape data 31a of the component 8 to be extracted. That is, the component basic shape data 31a indicates the planar dimensions A and B of the component main body portion 8a constituting the component 8, the width b of the lead 8b, the lead length l and the lead pitch p. By referring to the component basic shape data 31a, it is determined from the dimension / shape surface whether or not the component 8 can be held by the chuck unit 14 provided in the component pick-up head 13.

  In the component posture data 31b shown in FIG. 6B, the basic posture pattern in a state where the component 8 is planarly placed on the component placement surface 7a of the tray 7 and the recognition corresponding to each posture pattern. Correspondence with images, that is, images acquired by the first camera 9 is shown. First, FIGS. 6B and 1A show a component posture in which the component main body portion 8a is completely in contact with the component placement surface 7a and the surface 8c is placed in a horizontal state. In this state, the shape of the surface 8c and the lead 8b appears as they are in the recognition image by the first camera 9. FIGS. 6B and 6B show the component posture in which the component main body portion 8a is inclined on the component placement surface 7a and the tip of the lead 8b is in contact with the component placement surface 7a. In this state, a shape in which the surface 8c and the lead 8b are inclined appears in the recognition image.

  6 (b) (3), 6 (b) and 4 (4) show the postures in which the component 8 is placed on the component placement surface 7a in a state where the front and back are reversed, and FIG. 6 (b) ( 1) corresponds to the states shown in FIGS. 6B and 6B. FIGS. 6B and 6C show the component posture in which the component main body portion 8a is placed in a state where the component main body portion 8a is in full contact with the component placement surface 7a with the back surface 8d facing upward. In this state, in the recognition image by the first camera 9, the shapes of the back surface 8d and the lead 8b appear as they are. 6B and 6B show the component posture in which the component main body portion 8a is inclined on the component placement surface 7a with the back surface 8d facing upward, and the tip of the lead 8b is in contact with the component placement surface 7a. Is shown. In this state, a shape in which the back surface 8d and the lead 8b are inclined appears in the recognition image.

  By preparing and storing such component orientation data 31b in advance, it is possible to determine the actual orientation of the component 8 based on the recognition result imaged by the first camera 9, and can it be taken out? Whether or not can be determined with high accuracy. Note that the example shown in FIG. 6B is an example of the component posture, and various posture patterns can be set according to the characteristics of the target component type and shape.

  Further, by referring to the image of the component 8 shown in FIG. 6B, it is possible to identify whether the component 8 is placed with the front surface 8c or the back surface 8d on the upper surface side. Therefore, the data shown in FIG. 6B is surface identification data for identifying the front and back surfaces of the component 8.

  Next, the overlap determination data 31d will be described with reference to FIG. As described above, the components 8 are placed on the component placement surface 7a of the tray 7 in a uniform manner so as to be in a state of only one layer without overlapping each other. However, the parts leveling work is not always complete, and there are cases where parts are partially overlapped. At this time, not all the parts that are overlapped with each other are excluded from the object to be taken out, and depending on the overlapping state, there are cases where the parts can be taken out. The overlap determination data 31d is reference data that is referred to when determining whether or not such parts can be taken out.

  First, in the example shown in FIG. 7 (a), even when other components (8) partially overlap among the components 8 supplied to the component placement surface 7a of the tray 7, the components can be taken out. An example is shown. That is, in FIGS. 7A and 7A, in the component 8 in the state shown in FIGS. 6B and 6A, the lead 8b is partially described as another component (component (8) and the component to be taken out. 8 is shown in a state where the component main body portion 8a is overlapped. At this time, if the clamping side surface 8e which is the clamping surface of the chuck unit 14 of the chuck unit 14 in the component 8 is free, the component 8 may be able to be taken out.

  Similarly, FIGS. 7A and 7B show a state in which the component main body portion 8a of the other component (8) partially overlaps the lead 8b in the component 8 in the state shown in FIGS. Show. Even in this case, the component 8 may be able to be taken out if the clamping side surface 8e by the chuck claw 17 is free. 7 (a) and 7 (3) show a state where the lead 8b of another component (8) partially overlaps the lead 8b in the component 8 in the state shown in FIGS. 6 (b) and (1). . Even in this case, the component 8 may be able to be taken out if the clamping side surface 8e by the chuck claw 17 is free. In this way, in the state shown in FIG. 7A, the component detection unit 23 determines that the component 8 can be taken out.

  That is, the component detection unit 23 can extract a plurality of components 8 out of a plurality of components 8 supplied by the component supply unit 5, at least a part of which is not concealed by another component (8). 8 is detected. Here, an example is shown in which the chuck unit 14 that holds the component 8 by the chuck claw 17 is used as the component holding portion, but a nozzle unit configured to suck and hold the component 8 by the suction nozzle as the component holding portion (for example, FIG. 15). When the nozzle unit 40) shown in FIG. 16 is used, it is often sufficient that the suction surface by the suction nozzle is exposed so that the part 8 can be taken out. The probability that it is determined that the part 8 not concealed by (8) is the part 8 that can be taken out is increased.

  Further, when determining whether or not to take out, as described above, at least a part is not concealed by other components, and the surface of the component 8 facing the first camera 9 is the same surface (the front surface 8c or the back surface 8d). ) May be detected as the removable parts 8. That is, in this case, the overlap determination data 31d and the surface identification data 31c are combined to determine whether or not extraction is possible.

  On the other hand, FIG. 7B shows an example in which the component cannot be taken out when the other component (8) partially overlaps among the components 8 supplied to the component placement surface 7a of the tray 7. Is shown. That is, in FIGS. 7B, 1, and 2, in the component 8 in the state shown in FIGS. 6B and 6, the component body of the other component (8) is partially placed on the component body 8 a. The state where the part 8a overlaps is shown.

  In this state, the clamping side surface 8e of the chuck unit 14 by the chuck claw 17 is concealed by another component (8), and the component 8 cannot be clamped by the chuck claw 17, so that the component 8 cannot be taken out. . In other words, the component detection unit 23 determines whether or not the component 8 to be picked up is covered with the other component (8) by the clamping side surface 8e of the chuck claw 17 of the chuck unit 14 by the other component (8). It is determined whether or not it can be taken out.

  Next, a component selection process executed by the component selection unit 24 executing the component selection processing program 28 will be described. In the present embodiment, in this component selection process, a plurality of modes of the first mode 28a, the second mode 28b, the third mode 28c, the fourth mode 28d, and the fifth mode 28e are executed alone or in combination. I have to. When executing the plurality of modes, data stored in the part selection data 32 is referred to.

  First, the first mode 28a (area limitation) executed with reference to the extraction area data 32a shown in FIG. 8 will be described. In the first mode 28a, the component selection unit 24 selects, as a plurality of components 8 to be extracted, a component that exists in a specific region among the plurality of components 8 that can be extracted detected by the component detection unit 23. Here, the specific area is an area obtained by dividing the tray 7 as an area to be taken out according to some rule, and the rule used here can be set as appropriate.

  For example, as shown in FIG. 8A, in the tray 7 in which the parts 8 to be taken out are supplied in an irregular posture, the region in the tray 7 is changed based on a geometric rule (for example, quadrant division). The region may be specified by being divided into the first region R1 to the fourth region R4. Further, as shown in FIG. 8B, the areas R11, R12, and R13 where it is determined that the parts 8 in the posture that can be taken out are concentrated are found by visual observation, and the areas are input via the recognition processing unit 19. The specific area may be defined by

  Next, the second mode 28b (minimum travel distance) and the third mode 28c (shortest travel time) will be described with reference to the travel distance / time calculation data 32b shown in FIG. Here, based on the moving distance or moving time of the component pick-up head 13 by the component transport unit 15 in the component pick-up operation in which the component 8 is held by each of a plurality (three in this case) of the component pick-up head 13 and picked up. This shows an example of selecting a plurality of parts to be taken out.

  First, referring to FIG. 9A, based on the moving distance of the component picking head 13 in the component picking operation, more specifically, a plurality of components to be picked up so that the moving distance of the component picking head 13 becomes the shortest. An example of selecting is described. FIG. 9A shows parts 8 (1), (2), (3) (indicated by hatching) among the plurality of parts 8 to be taken out supplied by the tray 7, and three chuck units 14 ( The movement path and movement distance of the component pick-up head 13 when it is assumed that the pick-up target is taken out sequentially by 1), (2), and (3) are shown.

  9A, the head center HC indicates the center position of the component picking head 13, and the chuck centers C (1), (2), and (3) are the chuck units 14 (1), (2), ( The center points of the component holding positions according to 3) are respectively shown. When the component take-out operation is started, first, the chuck center C (1) is moved (arrow i) so as to hold the component 8 (1) by the chuck unit 14 (1), and is positioned above the component 8 (1). Therefore, the head center HC is moved to the head center HC1 (arrow h).

  The moving distance of the component picking head 13 at this time is D1. Next, in order to hold the part 8 (2) by the chuck unit 14 (2), the chuck center C (2) is moved (arrow k) to position the head center HC above the part 8 (2). The head center HC1 is moved to the head center HC2 (arrow j). The moving distance of the component picking head 13 at this time is D2.

  Further, in order to hold the part 8 (3) by the chuck unit 14 (3), the chuck center C (3) is moved (arrow m) to position the head center HC above the part 8 (3). The head is moved from the head center HC2 to the head center HC3 (arrow l). The moving distance of the component picking head 13 at this time is D3. As a result, the total movement distance ΣD = D1 + D2 + D3 of the component pick-up head 13 when the components 8 (1), (2), and (3) are taken out of the plurality of pickable components 8 is obtained by calculation.

  By executing this movement distance calculation for all combinations of the plurality of parts 8 that can be extracted, a combination of the parts 8 that gives the minimum total movement distance ΣD is obtained, and the plurality of parts 8 given by this combination are A plurality of parts 8 that have the shortest moving distance of the pick-up head 13 are obtained.

  Next, referring to FIG. 9B, based on the movement time of the component pick-up head 13 in the component pick-up operation, more specifically, a plurality of pieces to be picked up so that the movement time of the component pick-up head 13 is minimized. An example of selecting parts will be described. FIG. 9B illustrates a speed pattern showing a temporal change in the moving speed when the part picking head 13 moves from one part 8 to be picked up to the next part 8 to be picked up.

  In the movement of the component pick-up head 13, the speed V changes in a substantially trapezoidal speed pattern, and the area within the trapezoid (see the hatched portion) corresponds to the predetermined movement distance Di. That is, when the vehicle accelerates at a preset acceleration α1 from the stop state and reaches a specified maximum speed VM, the vehicle moves at a constant speed, starts decelerating at a preset braking acceleration α2 before reaching the stop position, and starts moving. And then stop after moving by the moving distance Di.

  In this stop operation, the complete stop timing is delayed by the settling time TS required until the feedback pulse from the drive servo system converges to the number of pulses corresponding to the commanded travel distance Di. That is, the movement time Ti required for the unit moving operation in which the component extraction head 13 moves from one component 8 to be extracted to the next component 8 to be extracted is not necessarily proportional to the movement distance Di. In other words, the time required for the operation of taking out the plurality of parts 8 by the part take-out head 13, that is, the total movement time ΣTi in the unit movement operation of the part take-out head 13 differs depending on the combination of the parts 8 to be taken out.

  Therefore, the total movement time ΣTi of the component pick-up head 13 when a specific three component 8 among the plurality of pickable components 8 is taken out is obtained by calculation. By executing this movement time calculation for all combinations of a plurality of parts 8 that can be extracted, a combination of the parts 8 that gives the shortest time ΣTi is obtained. The plurality of parts 8 having the shortest movement time of 13 are obtained.

  Next, the fourth mode 28d (part direction limitation) executed with reference to the part direction data 32c shown in FIG. 10 will be described. Among the plurality of components 8 stored in the tray 7, there are many components that are determined to be removable by the component detection unit 23 and have different component directions at random. Here, as shown in FIG. 10 (a), the orientation of the component refers to a reference line 8g indicating the longitudinal direction of the component main body portion 8a of the component 8 (through the center point 8f of the component main body portion 8a, the length of the component main body portion 8a). A straight line parallel to the direction) is represented by an angle θ formed with respect to the reference direction (here, the X direction) in the tray 7.

  During the component mounting operation, rotational position correction is required to align the orientation of the component in the mounting direction defined in advance by the mounting data. Therefore, when the component 8 is removed from the tray 7, the orientation of these components is significantly different. If so, the amount of rotation correction required at the time of rotational position correction increases. When this rotational position correction amount is large, it takes time to correct the rotational position, thereby reducing the mounting operation efficiency.

  If the rotational speed at the time of rotational position correction is increased in order to prevent this reduction in efficiency, the part 8 becomes unstable due to inertial force acting on the part 8 during acceleration / deceleration of the rotational operation. In particular, when a suction nozzle that holds the component 8 by vacuum suction is used as a component holding portion that is mounted on the component pick-up head 13 (see FIGS. 15 and 16), the suction nozzle holding surface tends to slip. Problems such as misalignment due to inertial force become large.

  In order to prevent such a problem at the time of rotational position correction as much as possible, in the component pick-up shown in the present embodiment, as shown in FIG. 10B, according to each of the component types Pa, Pb, Pc. , The takeable angle ranges θa, θb, θc... Are set in advance, and the orientation of the component shown in FIG. 10A, that is, the angle θ is set to the takeable angle ranges θa, θb, θc. Only the parts within the range of possible takeout angles are set as the parts 8 to be taken out. That is, the component selection unit 24 selects a plurality of components 8 in which the orientation of the component 8 is within a predetermined range among a plurality of components 8 detected by the component detection unit 23 as a plurality of components 8 to be extracted. Like to do.

  Next, the fifth mode 28e (extraction surface limitation) will be described. In this component take-out mode, out of a plurality of components 8 housed in an irregular posture on the tray 7, only the component 8 whose surface facing the first camera 9 is the same surface is taken out. . Here, the surface identification data 31c shown in FIG. 6B is referred to, and only the component 8 whose front surface 8c is the upper surface or only the component 8 whose rear surface 8d is the upper surface is taken out. In other words, in this case, the component selection unit 24 selects a plurality of components 8 whose surfaces facing the first camera 9 from the plurality of components 8 detected by the component detection unit 23 are the same surface. A plurality of parts 8 to be taken out are selected.

  The component mounting apparatus 1 in which the component take-out device of the present embodiment is incorporated is configured as described above. Each component mounting operation executed by the component mounting apparatus 1 will be described with reference to the flowchart of FIG. Will be described with reference to FIG. In the component mounting operation shown here, a component extraction method using a component extraction apparatus is used.

  In the component supply unit 5, a plurality of components 8 to be extracted by the component extraction head 13 are supplied in an irregular posture on the tray 7 (component supply process) (ST1). Here, the tray 7 in which the plurality of components 8 are stored in an irregular posture in advance is supplied to the component extraction position by the component extraction head 13 by the tray feeder 6. Next, the plurality of supplied parts 8 are imaged by the first camera 9 (imaging process) (ST2).

  Based on the captured image, the component 8 that can be taken out by the component detector 23 is detected (component detection step) (ST3). That is, based on the result of recognition processing of the captured image by the recognition processing unit 19, the component detection unit 23 executes the component detection processing program 27 and refers to the above-described take-out availability determination data 31, whereby the individual component 8 It is determined whether or not can be taken out.

  Next, a plurality of parts to be taken out are selected from the detected parts that can be taken out (part selection step) (ST4). That is, the component selection unit 24 executes the component selection processing program 28 and refers to the component selection data 32 for the component 8 determined to be extractable by the component detection unit 23 in the component detection process. Select multiple parts to be used.

  In this part selection, a pattern for selecting a plurality of parts 8 to be taken out based on a moving distance or a moving time in a part picking operation in a part transporting process described below, or a part among a plurality of parts 8 that can be taken out. Various patterns can be applied, such as a pattern for selecting a plurality of components 8 whose orientations are within a predetermined range to be taken out.

  Then, the selected plurality of parts 8 are respectively held and taken out by the chuck unit 14 which is a plurality of parts holding parts (part conveying step) (ST5). FIG. 12 shows a component removal operation by the chuck unit 14. That is, as shown in FIG. 12A, the chuck unit 14 with the chuck claw 17 in the open state and the pushing member 18b in the raised position is moved above the component 8 positioned on the component placement surface 7a of the tray 7. And lowered with respect to the component 8 (arrow n).

  Here, the component 8 is placed on the component placing surface 7a with the surface 8c of the component main body portion 8a facing upward, and the sandwiching side surfaces 8e on both sides of the component main body portion 8a are in a free state. ing. In the process of lowering the chuck unit 14 with respect to the component 8, the chuck claw 17 performs positioning so that the clamping side surface 8 e can be clamped. In this state, the chuck unit 14 is lowered with respect to the component 8 to cause the chuck claw 17 to perform a closing operation, whereby the chuck unit 14 is moved by the chuck claw 17 to the component main body portion as shown in FIG. The clamping side surface 8e of 8a is clamped from both sides. Thereby, the holding of the component 8 by the chuck unit 14 is completed.

  Then, the chuck unit 14 in this state is raised and moved in the take-out direction (arrow o). In this process, by rotating the chuck claw 17 by 90 degrees in the clockwise direction, the component 8 sandwiched by the chuck claw 17 is converted into a posture in which the lead 8b is directed downward. As a result, the removal of the component 8 by one chuck unit 14 provided in the component removal head 13 is completed.

  This component take-out operation is sequentially executed for a plurality (three in this case) of chuck units 14 provided in the component take-out head 13, thereby providing the component take-out head 13 as shown in FIG. In each of the three chuck units 14 (1), (2), (3), the component 8 is held in a posture with the lead 8 b facing downward. That is, in the component take-out apparatus shown in the present embodiment, in the process of taking out the plurality of components 8 to be taken out by the component carrying unit 15 in the component carrying step, the chuck unit that is a plurality of component holding units. 14 (1), (2), and (3) are in the form of being held simultaneously.

  Thereafter, the chuck unit 14 holding the taken-out component 8 is moved above the second camera 16 (ST6). That is, as shown in FIG. 13B, the component pick-up head 13 holding the component 8 in each of the chuck units 14 (1), (2), and (3) is moved above the second camera 16, and the first The parts 8 held by the respective chuck units 14 (1), (2), and (3) are imaged from below by the two cameras 16 (ST7). Next, the positional deviation of the component 8 is recognized based on the captured image (ST8). In other words, the recognition processing unit 19 performs recognition processing on the imaging result, thereby recognizing the positional deviation of the held lead 8b of the component 8 from the normal position where it should be originally positioned.

  Based on these recognition results, the positional deviation is corrected and the component 8 is mounted on the board 4 (ST9). That is, as shown in FIG. 14A, the chuck unit 14 holding and holding the component 8 with the lead 8b facing downward by the chuck claws 17 is aligned with the mounting position of the component 8 on the substrate 4 and lowered. (Arrow p). Here, the positional deviation of the lead 8b detected by the component recognition is corrected so as to coincide with the insertion hole 4a. Next, as shown in FIG. 14 (b), the pushing mechanism 18 is operated to lower the pushing member 18b (arrow q), whereby the component body 8a is pushed down by the pushing member 18b, and the lead 8b is inserted into the insertion hole 4a. Insert inside. Thereby, the mounting operation for mounting one component 8 on the substrate 4 is completed.

  In the above-described component mounting operation, the form in which the extracted component 8 is mounted on the substrate 4 by the component extraction head 13 that extracts the component 8 from the tray 7 of the component supply unit 5 is shown. However, the component that extracts the component 8 from the tray 7 is shown. A configuration in which a mounting head dedicated to mounting components on the substrate 4 may be provided separately from the take-out head 13. In this configuration, the component take-out head 13 places the component 8 taken out from the tray 7 on the component delivery stage, holds the placed component 8 by the mounting head, transfers it to the substrate 4 and mounts it. In this case, the process until the part take-out head 13 places the part 8 taken out from the tray 7 on the part delivery stage corresponds to the part take-out operation.

  Next, with reference to FIGS. 15 and 16, the configuration and function of the component picking head 13A of the second example of the present embodiment will be described. The component take-out head 13A is different in that a suction nozzle type nozzle unit 40 that holds the component 8 by vacuum suction is used instead of the mechanical chuck type chuck unit 14 used in the component take-out head 13.

  As shown in FIG. 15A, the component picking head 13A includes a plurality of (here, three) nozzle units 40 (1), (2), and (3). The nozzle unit 40 includes a nozzle body 41 that sucks and holds components by a suction nozzle 42 at the lower end. Further, the nozzle unit 40 is provided with a pushing mechanism 43 for pushing the lead of the component held by the suction nozzle 42 into the insertion hole of the board to be mounted.

  The function of the nozzle unit 40 will be described with reference to FIG. The nozzle unit 40 includes an elevating mechanism for moving the nozzle body 41 up and down (arrow r), a turning mechanism for turning the nozzle body 41 around the shaft fulcrum 41a (arrow s), and rotating the nozzle body 41 around the θ axis (arrow). t) A θ rotation mechanism is provided. Note that the lifting mechanism, the turning mechanism, and the θ rotation mechanism are not shown. By lowering the nozzle body 41, the suction nozzle 42 comes into contact with the upper surface of the component 8 stored in the tray 7 and sucks and holds it. By driving the θ rotation mechanism, the rotation position of the component 8 held by the suction nozzle 42 can be changed.

  Then, by driving the turning mechanism with the suction nozzle 42 holding the component 8, the suction nozzle 42 is changed in posture from the downward posture to the horizontal posture together with the held component 8. Further, the pushing mechanism 43 includes a pushing shaft 43a extending downward. By driving a pressing mechanism (not shown) built in the pressing mechanism 43, the pressing shaft 43a is lowered (arrow u), and the component 8 in a state of being held in the suction nozzle 42 and changed to the horizontal posture is sucked. It can be pushed down.

  FIG. 16 schematically shows a component mounting operation in which the component 8 is mounted on the substrate 4 by the component picking head 13 </ b> A having the nozzle unit 40. First, as shown in FIG. 16A, the component take-out head 13A is moved to the tray 7 of the component supply unit 5, and the component 8 is taken out from the tray 7 by the nozzle unit 40 (arrow v). That is, the nozzle body 41 is moved up and down, and the component body 8 a of the component 8 is sucked and held by the suction nozzle 42 and taken out from the tray 7. Next, as shown in FIG. 16B, the nozzle body 41 is turned (arrow w) to convert the posture of the component 8 held by the suction nozzle 42 into a posture with the lead 8b facing downward.

  After the components 8 are held by all the nozzle units 40, the component picking head 13A is moved above the second camera 16 and held in the respective nozzle units 40, as in the state shown in FIG. The captured component 8 is imaged from below. Next, based on the captured image, the positional deviation of the held lead 8b of the component 8 is recognized.

  Thereafter, the component take-out head 13A is moved onto the substrate 4, and the component 8 with the lead 8b facing downward is mounted at the mounting position on the substrate 4 as shown in FIG. That is, the positional deviation of the lead 8b is corrected based on the recognition result so as to coincide with the insertion hole 4a at the mounting position. Next, the pushing mechanism 43 is operated to lower the pushing shaft 43a (arrow x), and the component main body portion 8a is pushed down by the pushing shaft 43a to insert the lead 8b into the insertion hole 4a. Thereby, the mounting operation for mounting one component 8 on the substrate 4 is completed.

  Since the nozzle unit 40 in the second embodiment described above uses the nozzle body 41 that holds the component 8 by vacuum suction, the range of the shape and size of the component 8 that can be held is large. There is an advantage of excellent versatility. That is, in the chuck unit 14 shown in the first embodiment, since the mechanical chuck system is used, the shape and size of the component 8 to be held is restricted, whereas in the vacuum suction system, a suction surface having a certain size or more is required. If secured, shape and size constraints are greatly relaxed.

  For this reason, according to the component pick-up head 13A provided with the nozzle unit 40, even when a plurality of types of parts having different shapes and sizes are stored as in the tray 7A shown in FIG. The plurality of types of parts can be picked up by 13A. For example, the tray 7A shown in FIG. 17A is divided into three sections of component storage sections 71, 72, and 73. The component storage sections 71, 72, and 73 include parts 8A, 8B, Each 8C is stored in an irregular posture.

  FIG. 17B shows a take-out mode when taking out the three types of parts 8A, 8B, and 8C supplied from the part placing surface 7a by the part take-out head 13A having the above-described configuration. That is, in the example shown in FIGS. 17B and 17A, the nozzle units 40 (1), (2), and (3) provided in the component pickup head 13A take out the same type of component 8A. ing. Moreover, in the example shown to FIG.17 (b) (2), the example which takes out component 8A, 8B, 8C from which a kind differs by each of nozzle unit 40 (1), (2), (3) is shown. That is, according to the component pick-up head 13A provided with the vacuum suction nozzle unit 40, the range of the shape and type of the parts to be picked up is expanded, and the degree of freedom in the picking order in the part picking operation is increased. It is possible to realize a component picking device with excellent versatility.

  As described above, in the component take-out apparatus and the component take-out method used in the component mounting apparatus 1 shown in the present embodiment, a plurality of parts 8 to be taken out are supplied in an irregular posture, and the supplied plurality of parts are removed. The part 8 is picked up by the first camera 9, and based on the image picked up by the first camera 9, a plurality of parts 8 that can be picked up are detected, and the plurality of picked up parts that can be picked up are detected. In the process of picking out the plurality of parts 8 to be picked out, picking up the selected parts 8 to be picked up by holding the parts by the plurality of parts holding parts, and taking out these parts 8 The configuration is such that the plurality of power components 8 are simultaneously held by the plurality of component holding portions.

  Further, when selecting a plurality of parts 8 to be taken out, a plurality of parts 8 to be taken out are selected based on a moving distance of a part picking head 13 which is a part transporting part in the part picking operation, or a plurality of parts 8 that can be taken out are selected. Among them, a plurality of parts 8 whose parts are within a predetermined range are selected as a plurality of parts to be taken out. Further, out of the detected plurality of parts 8 that can be taken out, it is selected as a plurality of parts 8 that should be taken out in a specific area defined in advance, and the surfaces facing the first camera 9 are the same. It is also possible to select a plurality of parts 8 to be taken out.

  With such a configuration, it is possible to take out multiple types of parts with different shapes and sizes of parts in a common facility, and by setting various conditions that define the part removal operation, Production efficiency can be improved. Accordingly, it is possible to realize high production efficiency at a low cost with excellent versatility in the component picking work in the component mounting field.

  In the above-described embodiment, the component 8 to be taken out is the component 8 which is an insertion component having a shape in which a plurality of leads 8b extend from the component main body portion 8a, but the object of the present invention is as described above. It is not limited to a simple insertion part. In other words, any deformed part that is not suitable for a part supply form using a taping or a tray is applicable to the present invention.

  The component take-out device, the component take-out method, and the component mounting device of the present invention have the effect of being excellent in versatility and realizing high production efficiency at a low cost. This is useful in the field of component mounting.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Board | substrate conveyance mechanism 4 Board | substrate 5 Component supply part 6 Tray feeder 7 Tray 8 Parts 8a Component main-body part 8b Lead 9 1st camera 13, 13A Component pick-up head 15 Component conveyance part 16 2nd camera 40 Nozzle unit 41 Nozzle body part 42 Adsorption nozzle

Claims (8)

A component supply unit for supplying a plurality of components to be taken out in an irregular posture;
A camera that images the plurality of components supplied by the component supply unit;
A component detector that detects a plurality of components that can be taken out of the plurality of components based on an image captured by the camera;
Of the plurality of parts that can be taken out detected by the part detection unit, a part selection unit that selects a plurality of parts to be taken out;
A component transport unit that holds and takes out the plurality of components to be taken out selected by the component selection unit by a plurality of component holding units,
In the process of taking out the plurality of parts to be taken out by the parts conveying unit, the part taking-out apparatus passes through a state in which the plurality of parts to be taken out are simultaneously held by the plurality of part holding units.   The component selection unit selects, as the plurality of components to be extracted, a plurality of components whose surfaces facing the camera are the same surface among the detected plurality of components that can be extracted. The component take-out device described.   The component extraction device according to claim 1, wherein the component selection unit selects, as the plurality of components to be extracted, a component that exists in a specific region among the plurality of detected components that can be extracted.   2. The component detection unit according to claim 1, wherein the component detection unit detects a plurality of components, at least a part of which is not concealed by another component, among the plurality of components supplied as the plurality of extractable components. Parts take-out device.   The component detection unit is capable of taking out a plurality of components in which at least some of the supplied components are not concealed by other components and the surfaces facing the camera are the same surface. The part picking-up apparatus according to claim 1, wherein the part picking-up apparatus detects the part as a plurality of parts. A component supply process for supplying a plurality of parts to be taken out in an irregular posture;
An imaging step of imaging the supplied plurality of parts with a camera;
A component detection step of detecting a plurality of components that can be taken out of the plurality of components based on an image captured by the camera;
A part selection step for selecting a plurality of parts to be taken out of the detected parts that can be taken out,
A part transporting step of picking up the selected plurality of parts to be taken out by holding them by a plurality of parts holding parts, respectively,
In the process of taking out the plurality of parts to be taken out in the part conveying step, the part taking-out method passes through a state in which the plurality of parts to be taken out are simultaneously held by the plurality of part holding units. A component mounting device for transferring and mounting a component taken out by a component take-out device onto a substrate held by a substrate holding unit,
The component picking device is a component picking device according to any one of claims 1 to 5. A second camera that images the component held by the component mounting mechanism in the process of transferring the component to the substrate held by the substrate holding unit;
A recognition processing unit for recognizing the component in the held state based on the imaging result of the second camera;
The component mounting apparatus according to claim 7, further comprising: a mounting control unit that controls the component mounting mechanism based on a recognition result by the recognition processing unit and mounts the component on the substrate.

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