WO2020178887A1

WO2020178887A1 - Working machine

Info

Publication number: WO2020178887A1
Application number: PCT/JP2019/008035
Authority: WO
Inventors: 杉山　健二; 一也小谷; 雅史天野
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-03-01
Filing date: 2019-03-01
Publication date: 2020-09-10
Also published as: JP7231706B2; JPWO2020178887A1

Abstract

Provided is a working machine comprising: a workpiece supply device that supplies a plurality of workpieces in irregular posture to a supply area; and a control device that controls collecting operation by a work head on the basis of a result of image processing and makes image processing targeting a partial area in which next and succeeding collecting operation is performed executed in parallel with execution of the collecting operation or working operation by the work head.

Description

Work machine

The present invention relates to a working machine.

The work machine is used, for example, for assembly work using a work in a product production line. Some work supply devices of work machines supply a plurality of works in an irregular posture. Patent Document 1 discloses a component mounting machine as a working machine. In a mounting process for mounting a component on a substrate, the component mounting machine recognizes a plurality of supplied components by image processing, collects the components by a holding member such as a suction nozzle, and mounts the component at a mounting position on the substrate.

JP, 2011-023500, A

With the above configuration, it is necessary to recognize the supply state of components by image processing before the mounting head that supports the holding member operates. However, the image processing may include one that is heavy and takes a long time. When the image processing that takes a long time is adopted, there is a concern that the image processing affects the time required for the mounting processing.

The present specification efficiently executes the image processing for recognizing the supply state of a plurality of works supplied in an irregular posture and the mechanical operation of the work head to reduce the time required for a predetermined work using the works. It is an object to provide a working machine that can do the work.

The present specification describes a work supply device that supplies a plurality of works to a supply area in an irregular posture, and an image that recognizes the supply state of one or more works included in a plurality of partial areas set in the supply area. An image processing unit that executes a process for each of the plurality of partial areas, a work head that collects the work from the partial area, and a work head that performs a predetermined work operation using the collected work, and an image processing unit. The sampling operation by the working head is controlled based on the result, and the image processing for the partial area for performing the sampling operation by the working head or the subsequent sampling operation during execution of the working operation is performed in parallel. Disclosed is a work machine including a control device that is executed.

With this configuration, the image processing required for the next and subsequent sampling operations is executed in parallel while the work head sampling operation or the working operation is being executed. Thereby, the operation of the work head and the image processing overlap, and the mechanical operation of the work head can be efficiently executed. In addition, it is possible to shorten the time required for the predetermined work using the work as a whole.

It is a schematic diagram which shows the structure of the component mounting machine (working machine) in embodiment. It is a side view which shows a part of mounting head (working head) typically. It is an enlarged view which shows the 1st aspect of the component supply device (work supply device) and a partial area. It is an enlarged view which shows the 2nd mode of a component supply apparatus (work supply apparatus) and a partial area. It is an enlarged view which shows the 3rd aspect of a component supply device (work supply device) and a partial area. It is a flowchart which shows the production process of a board|substrate product. It is a flow chart which shows the 1st mode of mounting processing. It is a flow chart which shows the second mode of mounting processing. 7 is a flowchart showing a substrate loading process.

1. Outline of Working Machine An embodiment of the working machine will be described below with reference to the drawings. The work machine collects the work supplied from the work supply device by the work head and executes a predetermined work operation. The above-described work operation may include, for example, a work of assembling a work on an object or a work of aligning the work with respect to the object. In this embodiment, a mode in which the working machine is a component mounting machine used for production of board products is illustrated. In the following description, the working machine will be described as a “component mounting machine”, the work as a “component”, the work supply device as a “component mounting machine”, the work head as a “mounting head”, and a predetermined work operation as a “mounting operation”.

2. Configuration of Component Mounting Machine 1 The component mounting machine 1 executes a mounting process for mounting a component on a board. In the following description, the horizontal direction is the left-right direction of the component mounting machine 1 and the X direction is the horizontal direction orthogonal to the X direction, and the front-back direction of the component mounting machine 1 is the Y direction. The vertical direction (the front-back direction in FIG. 1) orthogonal to each other is defined as the Z direction.

As shown in FIG. 1, the component mounting machine 1 includes a board transfer device 10 that transfers a board 90 in the X direction. The substrate transfer device 10 is composed of a belt conveyor or the like. The substrate transfer device 10 sequentially transfers the substrate 90 in the transfer direction and positions the substrate 90 at a predetermined position in the machine. The board transfer device 10 carries out the board 90 from the component mounting machine 1 after the mounting process is completed.

The component mounting machine 1 includes a component supply device 20 that supplies a component 91 (see FIG. 2) mounted on the substrate 90. In the present embodiment, the component supply device 20 includes a tape feeder 22 and a bulk feeder 60 set in a plurality of slots 21. The tape feeder 22 feeds and moves a carrier tape containing a large number of components 91, and supplies the components 91 in a collectable manner.

The bulk feeder 60 has a stocker 61 and a conveyor 62. The stocker 61 accommodates a plurality of components 91 used for a predetermined work. In this embodiment, the stocker 61 accommodates a plurality of components 91 in a bulk state (a state in which loose components 91 are gathered). An openable and closable opening is provided at the bottom of the stocker 61.

The bulk feeder 60 supplies the parts 91 by opening and closing the opening of the stocker 61. Accordingly, the bulk feeder 60 of the component supply device 20 supplies the plurality of components 91 to the supply area As in an irregular posture. The bulk feeder 60 can adjust the supply amount of the components 91 by, for example, the time for which the opening state of the opening of the stocker 61 is maintained.

The conveyor 62 conveys a plurality of components 91 from the stocker 61 to the movable range Rm of the mounting head 33 (see FIG. 3, etc.). The conveyor 62 has a conveyor belt that rolls along the transport path with a plurality of components 91 placed thereon. The stocker 61 is provided above one end of the conveyor 62. In the present embodiment, the above “supply area As” corresponds to an area that supports the component 91 in the transport path of the conveyor 62. The bulk feeder 60 can adjust the moving amount and moving speed of the component 91 by changing the driving state of the conveyor 62, for example.

The component mounter 1 includes a component transfer device 30 that transfers the component 91 supplied by the component supply device 20 onto the substrate 90. The component transfer device 30 is mounted by transferring the component 91 to a predetermined mounting position on the board 90 carried into the machine by the board transfer device 10. In the present embodiment, the component transfer device 30 moves the moving table 32 in the horizontal direction (X direction and Y direction) by the head driving unit 31 which is a linear motion mechanism. The mounting head 33 is interchangeably fixed to the moving table 32 by a clamp member (not shown).

As shown in FIG. 2, the mounting head 33 supports one or a plurality of holding members that hold the parts 91 supplied by the parts supply device 20 so as to be able to move up and down. The mounting head 33 performs a collecting operation for collecting the component 91 and a mounting operation for mounting the collected component 91 on the board 90. In the present embodiment, the mounting head 33 has eight holding members. As the holding member, for example, a suction nozzle 34 (see FIG. 2) that sucks and holds the component 91 by the supplied negative pressure air, a chuck that clamps and holds the component 91, or the like can be adopted.

The component mounter 1 includes a component camera 41 that captures an image of the component 91 held by the holding member (suction nozzle 34) from below. The component mounter 1 includes a substrate camera 42 that captures an image of the substrate mark Mc attached to the substrate 90. The component camera 41 and the substrate camera 42 are digital type having an image pickup element such as CMOS. The component camera 41 and the board camera 42 perform imaging based on a control signal input from the outside, and send out the image data acquired by the imaging.

The board camera 42 is fixed to the moving table 32 so that the optical axis faces downward in the Z direction, and is provided so as to be integrally movable with the mounting head 33 as the moving table 32 moves. In the present embodiment, the board camera 42 is also used for imaging the supply area As in which the plurality of components 91 are supplied by the bulk feeder 60. The image data acquired by the above imaging is used for the recognition process of the supply state of the component 91 in the supply area As.

The component mounting machine 1 includes a control device 50 that executes a mounting process for mounting the component 91 on the board 90. The control device 50 mainly includes a CPU, various memories, and a control circuit. In the mounting process, the control device 50 controls the operation of the mounting head 33 based on information output from various sensors, measured values, the result of image processing, a control program that specifies the mounting position on the substrate 90, and the like. As a result, the position and angle of the suction nozzle 34 supported by the mounting head 33 are controlled.

In this embodiment, the control device 50 has an image processing unit 51. The image processing unit 51 executes image processing for recognizing the supply states of the plurality of components 91 included in the supply area As. Here, when the parts 91 are supplied by the bulk feeder 60 of the parts supply device 20, as shown in FIG. 3, a plurality of parts 91 are located in the supply area As in an irregular posture. Therefore, the control device 50 controls the sampling operation of the mounting head 33 based on the result of the image processing by the image processing unit 51.

Specifically, the control device 50 acquires image data by imaging with the board camera 42 after moving the board camera 42 above the supply area As. Then, the image processing unit 51 recognizes the position and orientation of the component 91 as the supply state based on the above image data. Note that the above image processing may include processing in which the load such as super-resolution processing described later is relatively high and the required time is long. When the image processing with a long required time is adopted, the image processing may affect the required time of the mounting process if the collecting operation of the mounting head 33 cannot be started until the result of the image processing is obtained.

Here, in the supply processing of the components 91 by the bulk feeder 60, the number of the components 91 exceeding the number of components (that is, the number of the suction nozzles 34) that the mounting head 33 can hold simultaneously can be supplied to the supply area As. Then, for example, when the entire supply area As falls within the camera field of view of the board camera 42, the number of the components 91 whose state is recognized by the image processing greatly exceeds the number of the suction nozzles 34, and the number of the components 91 exceeding the required number is increased. Image processing for recognizing the supply state is being executed.

Therefore, the component mounting machine 1 of the present embodiment efficiently performs image processing for recognizing the supply state of the plurality of components 91 supplied in an irregular posture and mechanical operation (collecting operation and mounting operation) of the mounting head 33. A configuration is adopted that can be executed to reduce the time required for the mounting process. Specifically, the image processing unit 51 executes image processing for each of the plurality of partial areas Ap for recognizing the supply state of one or more components 91 included in the plurality of partial areas Ap set in the supply area As.

Here, the plurality of partial areas Ap set in the supply area As are set so that the target of image processing does not cover the supply area As or the entire field of view of the camera. The appropriate number of parts 91 included in each partial area Ap differs depending on the image processing to be executed and the kind of parts. The plurality of partial areas Ap are set, for example, by the following three modes.

In the first aspect of the partial area Ap, as shown in FIG. 3, the plurality of partial areas Ap are formed by dividing the entire overlapping area Ar into which the supply area As and the movable range Rm of the mounting head 33 overlap. Each is set. At this time, the number of sections of the overlapping area Ar may be two or more. Further, the partial area Ap may be 2 or more in both the X direction and the Y direction. The area including all the partial areas Ap is the overlapping area Ar or more.

In the first aspect of the partial areas Ap, each of the plurality of partial areas Ap is set to have the same area, and is included in each of the partial areas Ap based on the statistics of the variation of the parts 91. The numbers of the components 91 may be appropriately set to be the same. In addition, for each of the plurality of partial areas Ap, for example, the dimensions of the parts 91 are taken into consideration so that the parts 91 located at the boundary portion are not excluded from the state recognition targets in the image processing targeting any of the partial areas Ap. It is set to overlap each other.

The first aspect of the above partial area Ap is a fixed type that does not fluctuate even in different image data regardless of the number of parts 91 in the supply area As and the supply state. According to such a mode, the target area for image processing is always constant, so that the difference between the required times can be reduced. As a result, the accuracy of estimating the total required time is improved and the manageability is improved. In addition, the process of setting the partial area Ap can be simplified as compared with a variation formula that varies the shape of the partial area Ap for each different image data.

In the second aspect of the partial areas Ap, the plurality of partial areas Ap are set so as to include, as shown in FIG. 4, the parts 91 that are equal to or less than the number of the suction nozzles 34 in the supply area As. As a result, the number of parts that can start the collecting operation is secured in each partial area Ap. The partial area Ap of the second aspect is formed in a predetermined shape such as a minimum rectangular shape that includes the required number of components 91.

In the second aspect of the partial area Ap, the control device 50 counts the number of the components 91 in the Y direction with respect to the image data acquired by the image pickup by the substrate camera 42, for example, and a plurality of parts are ensured so that the required number is secured. Set the area Ap. As described above, the partial area Ap of the second aspect is a variable type in which the position and shape are different for each acquired image data, whereas the partial area Ap of the first aspect is a fixed type. With such a configuration, it is possible to efficiently recognize the supply state of the parts 91 required for a series of collection operations.

In the third aspect of the partial area Ap, the plurality of partial area Aps are set so as to include one component 91 of the supply area As, as shown in FIG. That is, the partial area Ap of the third aspect is formed in a predetermined shape such as a minimum rectangular shape in which only one component 91 is included. The shapes of the plurality of partial areas Ap may be the same shape that secures an area considering the shape of the component 91.

In the third aspect of the partial area Ap, the control device 50 searches for the component 91 in the Y direction with respect to the image data acquired by, for example, the image pickup by the substrate camera 42, and locates at the approximate center position of the detected multiple components 91. Each partial area Ap is set. As described above, the partial area Ap of the third aspect is a variable type whose position is different for each acquired image data. According to such a configuration, the area of each partial area Ap can be made relatively small, which is particularly useful when the image processing includes a process in which the load increases according to the area.

Further, in the present embodiment, the image processing by the image processing unit 51 includes super-resolution processing. The super-resolution processing is a process of acquiring high-resolution data having a higher resolution than the original image data based on a plurality of image data acquired by imaging a plurality of times. The image processing unit 51 of the present embodiment employs multi-frame type super-resolution processing. The image processing unit 51 executes the super-resolution processing by using a plurality of pieces of image data acquired by imaging at the imaging positions where the relative positions of the substrate camera 42 with respect to the imaging target component 91 are different from each other as original image data.

In the present embodiment, the image processing by the image processing unit 51 includes state recognition processing. The state recognition process acquires the position and orientation of the component 91 in the partial area Ap as the supply state based on the high-resolution data acquired by the previously executed super-resolution process. With such a configuration, the control device 50 enables the collecting operation of the mounting head 33 corresponding to the supply of the components 91 in the bulk state by the bulk feeder 60.

In this embodiment, the control device 50 has a mark processing unit 52. The mark processing unit 52 executes the mark processing to acquire the position of the substrate 90 positioned inside the machine. Specifically, the mark processing unit 52 first moves the substrate camera 42 to a position where the substrate mark Mc of the substrate 90 positioned inside the machine can be imaged. At this time, although the position of the substrate 90 may include some error, the substrate camera 42 is moved so that the substrate mark Mc is within the camera field of view of the substrate camera 42.

The mark processing unit 52 then acquires image data by capturing an image of the substrate mark Mc with the substrate camera 42. The mark processing unit 52 executes the mark processing for acquiring the position of the substrate based on the acquired image data. Specifically, the mark processing unit 52 acquires the position of the board 90 based on the reference coordinates of the board 90 calculated from the board mark Mc included in the image data and the position coordinates of the board camera 42 at the time of imaging. To do.

3. Production Processing by Component Mounting Machine 1 The production processing of board products by the component mounting machine 1 will be described with reference to FIG. First, the substrate transfer apparatus 10 executes a process of loading the substrate 90 (S10). As a result, the board 90 is carried into the machine and positioned at a predetermined position in the machine. Subsequently, the control device 50 executes a mounting process for mounting the component 91 on the board 90 (S50). After the mounting process (S50) is completed, the control device 50 executes the unloading process of the substrate 90 (S60). As a result, the substrate 90 is unclamped, and the substrate 90 is carried out of the machine.

Here, in order to improve the efficiency of the mounting process (S50), the control device 50 performs the image processing for the partial area Ap that performs the sampling operation by the mounting head 33 or the subsequent sampling operation during the execution of the mounting operation. Are executed in parallel. As described above, the pick-and-place cycle (hereinafter, “PP cycle”) including the collecting operation and the mounting operation by the mounting head 33 and the mounting processing (S50) that executes the image processing in parallel are performed by the following two modes, for example. Will be executed.

3-1. First Mode of Mounting Process In the first mode of the mounting process, the control device 50 causes the current PP cycle and the image processing for the partial area Ap that performs the sampling operation in the next PP cycle to be executed in parallel. .. Here, as shown in FIG. 3, two partial areas Ap, a first partial area Ap1 and a second partial area Ap2, are set in the supply area As where the bulk feeder 60 supplies a plurality of components 91. It will be described as a thing.

In the first aspect of the mounting process, the control device 50 first executes the imaging process (S20) of the supply area As as shown in FIG. Specifically, the control device 50 determines whether or not acquisition of image data for the supply area As is necessary (S21). When the supply state of the plurality of components 91 in the supply area As has changed (S21: Yes), the control device 50 changes the image, for example, when the bulk feeder 60 supplies the component 91 to the supply area As additionally. Data acquisition processing is executed (S22).

In the image data acquisition process (S22), the control device 50 acquires the plurality of image data used in the multi-frame super-resolution process included in the subsequent image process (S40). The movement and the imaging are repeated a specified number of times. Each of the plurality of image data acquired thereby includes the entire area of the overlapping area Ar that overlaps with the movable range Rm of the mounting head 33 in the supply area As. That is, each of the plurality of image data includes both the first partial area Ap1 and the second partial area Ap2.

After the previous imaging process (S20), when only the number of the components 91 collected by the sampling operation is reduced and the positions of the other components 91 are not changed (S21: No), the control device 50 causes the image data to be displayed. The acquisition process (S22) is omitted. Subsequently, the control device 50 is mounted on the board 90 in the number of the components 91 of which the states are recognized among the components 91 in the supply area As (hereinafter, “remaining number Nf”) and this PP cycle (S30). The number of parts 91 of the same type (hereinafter, "the number of mounted parts Np") is compared (S25).

Here, in the state recognition process (S42) described later, the supply state of the number of the components 91 exceeding the maximum number of the components 91 that can be collected in one PP cycle (S30) can be recognized. Therefore, even after the previous PP cycle (S30) is finished, the components 91 in the supply area As may include those whose state is recognized. The number of parts 91 whose state is recognized is the remaining number Nf.

When the remaining number Nf is smaller than the mounted number Np (S25: No), image processing (S40) is executed to acquire the supply state of the component 91 in the supply area As before executing the PP cycle (S30). To do. Further, when the image data acquisition process (S22) is executed, the remaining number Nf is reset to 0, so that the image process (S40) is executed in the same manner. The result of the image processing (S40) is used for the sampling operation (S31) in this PP cycle (S30).

Here, when the partial area Ap performing the sampling operation (S31) in the current PP cycle (S30) is the first partial area Ap1, the image processing (S40) performs the sampling operation (S31) in the current PP cycle (S30). ) Is performed for the first partial area Ap1. Specifically, the image processing unit 51 executes the super-resolution processing on a part of the plurality of image data acquired in S20 corresponding to the first partial area Ap1 (S41). As a result, the image processing unit 51 acquires high-resolution data, a part of which has a higher resolution than the original image data.

Subsequently, the image processing unit 51 executes a state recognition process based on the high resolution data (S42). Thereby, the image processing unit 51 acquires the position and orientation of the component 91 in the first partial area Ap1 as the supply state. Further, the image processing unit 51 counts the number of the parts 91 whose state is recognized in the state recognition process (S42), and inputs the remaining number Nf as an initial value.

Subsequently, the control device 50 executes the PP cycle (S30) and the image processing (S40) in parallel. Here, the result of the above image processing (S40) is used for the collection operation (S31) in the next PP cycle (S30) instead of the current PP cycle (S30). That is, the image processing (S40) executed in parallel targets the second partial area Ap2 in which the collection operation (S31) is performed in the PP cycle (S30) from the next time onward.

Specifically, the image processing unit 51 executes super-resolution processing on a part of the plurality of image data acquired in S20, which corresponds to the second partial area Ap2 (S41). As a result, the image processing unit 51 acquires high-resolution data, a part of which has a higher resolution than the original image data. Subsequently, the image processing unit 51 executes a state recognition process based on the high resolution data (S42). Thereby, the image processing unit 51 acquires the position and orientation of the component 91 in the second partial area Ap2 as the supply state.

Also, in the PP cycle (S30), it is determined whether the number of times the sampling operation (S31) is executed and the number of times the mounting operation (S33) is executed have reached the number of mountings Np (S32, S34). As a result, the number Np of mounted components 91 are collected and mounted on the substrate 90. It should be noted that the mounting operation (S33) in the PP cycle (S30) may include a process of recognizing the holding state of the component 91 based on the image data acquired by imaging the component camera 41 or the head camera unit (not shown). is there.

In the PP cycle (S30) and the image processing (S40) that are executed in parallel as described above, the image processing unit 51 counts the number of the parts 91 whose states are newly recognized in the state recognition processing (S42), and Is added to the remaining number Nf. Further, the image processing unit 51 subtracts the number of mounted Np from the current remaining number Nf with the execution of the PP cycle (S30) this time. When all PP cycles (S30) are not completed (S51: No), the control device 50 repeats the above-described processing (S20, S30, S40) multiple times.

After the second time, if there is no additional supply of the component 91 to the supply area As by the bulk feeder 60, it is determined that the image data acquisition process (S22) is not necessary in the imaging process (S20) (S21: No). Then, when the remaining number Nf of the components 91 of which the state is recognized is equal to or larger than the number Np of mountings in the current PP cycle (S30) (S25: No), the image processing (S40) is omitted.

Further, when the bulk feeder 60 additionally supplies the parts 91 to the supply area As, the imaging process (S20) is executed. Then, the image processing (S40) for one partial area Ap is executed before the PP cycle (S30), and the image processing (S40) for the other partial area Ap is parallel to the PP cycle (S30). Is executed. The control device 50 ends the mounting process (S50) when all the PP cycles (S30) are completed (S51: Yes).

3-2. Second Mode of Mounting Process In the second mode of mounting process, the control device 50 separates a collecting operation for collecting the part 91 from the partial area Ap for which the image processing has been completed in the current PP cycle and an unexecuted collecting operation. The image processing targeting the partial area Ap is executed in parallel. In the second aspect of the mounting process, the control device 50 first executes the imaging process (S20) of the supply area As, as shown in FIG.

Here, in the image processing (S140) described later, the state recognition processing (S145) is executed in which the result is used in the sampling operation (S131) of the next PP cycle (S130). Therefore, there may be a partial area Ap including the part 91 whose state has already been recognized after the last PP cycle (S130) is completed. When there is no partial area Ap for which the state recognition process (S145) has already been executed as described above (S125: No), the control device 50 sets the partial area Ap (S126) and the PP cycle (S130). The image processing (S40) before the execution of is executed.

In the setting process (S126) of the partial area Ap, the number of the components 91 is counted in the Y direction with respect to one of the plurality of image data acquired in the imaging process (S20), and a plurality of parts 91 are obtained so that the necessary number is secured. The partial area Ap of is set. Here, the required number is set to, for example, half of the maximum number of parts 91 that can be collected by the mounting head 33 in one PP cycle (S130). As a result, a plurality of partial areas Ap, that is, a first partial area Ap1, a second partial area Ap2, a third partial area Ap3,... Are set in the supply area As.

When the image data acquisition process (S22) is executed, the partial area Ap setting process (S126) is similarly executed because the plurality of partial areas Ap used in the past have been reset. Here, when the partial area Ap performing the sampling operation (S131) in the current PP cycle (S130) is the first partial area Ap1 and the second partial area Ap2, the image processing (S40) performs the current PP cycle (S130). ), the first partial area Ap1 in which a part of the sampling operation (S31) is performed is targeted.

Subsequently, the control device 50 causes the PP cycle (S130) and the image processing (S140) to be executed in parallel. Here, the result of the above image processing (S140) is used for the collection operation (S131) in the current PP cycle (S130) and the next PP cycle (S130). That is, in the image processing (S140) executed in parallel, the second partial area Ap2 for performing the unexecuted sampling operation (S131) and the third partial area for performing the sampling operation (S131) in the next PP cycle (S130). The target is Ap3.

Specifically, the image processing unit 51 executes the super-resolution processing on a part of the plurality of image data acquired in S20 corresponding to the second partial area Ap2 (S141). As a result, the image processing unit 51 acquires high-resolution data, a part of which has a higher resolution than the original image data. Subsequently, the image processing unit 51 executes a state recognition process based on the high resolution data (S142). Thereby, the image processing unit 51 acquires the position and orientation of the component 91 in the second partial area Ap2 as the supply state.

Further, the control device 50 determines whether or not the number of times of performing the sampling operation (S131) for the first partial area Ap1 has reached half of the number Np of attachments in the PP cycle (S130) (S132). As a result, the collection operation (S131) is repeated, and the half of the mounting number Np of the components 91 are collected. Subsequently, the control device 50 collects half of the number Np of mounted parts 91, and collects the second partial area Ap2 after the state recognition processing (S142) for the second partial area Ap2 is completed. The operation (S133) is executed.

In the subsequent PP cycle (S130), it is determined whether the number of executions of the collection operation (S131, S133) and the number of execution of the mounting operation (S135) have reached the mounting number Np (S134, S136). As a result, the number Np of mounted components 91 are collected and mounted on the substrate 90. Further, in the image processing (S140) executed in parallel with the collecting operation (S133) and the mounting operation (S135), the image processing unit 51 causes the image processing unit 51 to set the plurality of partial areas set in the setting processing (S126) of the partial area Ap. It is determined whether or not there is an Ap that is not the target of the state recognition processing (S143).

When there is a partial area Ap (for example, the third partial area Ap3) for which the state recognition processing has not been executed (S143: Yes), the image processing unit 51 performs super-resolution processing (S144) on the third partial area Ap3 and State recognition processing (S145) is executed. The result of this state recognition processing (S145) is used for the first half sampling operation (S131) in the next PP cycle (S130). When all PP cycles (S130) are not completed (S51: No), the control device 50 repeats the above-mentioned processing (S20, S40, S130, S140) multiple times.

After the second time, if there is no additional supply of the component 91 to the supply area As by the bulk feeder 60, it is determined that the image data acquisition process (S22) is not necessary in the imaging process (S20) (S21: No). Then, when there is a partial area Ap that has already undergone the state recognition process (S145) (S125: Yes), the image process (S140) is omitted.

Further, when the bulk feeder 60 additionally supplies the parts 91 to the supply area As, the imaging process (S20) is executed. Then, the partial area Ap setting process (S126) is executed again, and the image process (S40) for one partial area Ap is executed before the PP cycle (S130). After that, the image processing (S140) for the other partial area Ap is executed in parallel with the PP cycle (S130). The control device 50 ends the mounting process (S50) when all the PP cycles (S130) are completed (S51: Yes).

3-3. Other Aspects of Mounting Process According to the first and second aspects of the mounting process as described above, the PP cycle (S30, S130) and the image processing (S40, S140) are executed in parallel. In any mounting process (S50), for example, in a state immediately after the substrate 90 is loaded into the machine, the state recognition process (S42) needs to be executed before the first PP cycle (S30, S130). That is, the first PP cycle (S30, S130) cannot be started until the first state recognition process (S42) is completed.

On the other hand, the control device 50 may execute the image processing (S40) including the initial state recognition processing (S42) and the mark processing by the mark processing unit 52 in parallel. Specifically, as shown in FIG. 9, the control device 50 executes the loading process of the substrate 90 (S10) and the imaging process of the supply area As (S120) in parallel. That is, while the substrate transfer apparatus 10 is carrying in and positioning the substrate 90 (S11), the substrate camera 42 is moved above the supply area As to execute the imaging process (S120).

Next, the mark processing unit 52 moves the substrate camera 42 to a position where the substrate mark Mc of the substrate 90 can be imaged, and acquires image data by imaging the substrate camera 42 (S12). The mark processing unit 52 acquires the position of the substrate 90 based on the acquired image data (S13). The image processing unit 51 executes the image processing (S240) in parallel with the mark processing (S12, S13).

The above image processing (S240) targets one of a plurality of partial areas Ap when the fixed partial area Ap is adopted as exemplified in the first aspect of the mounting processing. In the image processing (S240), for example, when the variable partial area Ap is adopted as exemplified in the second aspect of the mounting processing, the partial area Ap setting processing (S126) is executed first, One of the plurality of partial areas Ap thus set is targeted.

Further, with respect to the fixed type partial area Ap illustrated in the first aspect of the mounting process, three or more partial areas Ap may be set and the image processing may be sequentially executed in parallel with the PP cycle. Further, with respect to the variable partial areas Ap illustrated in the second mode of the mounting process, a plurality of partial areas Ap are set so as to include half of the number Np of mountings, but may be less than half of the number Np of mountings. However, as shown in FIG. 5, one component 91 may be included.

In the mode in which each of the plurality of partial areas Ap is set to include one component 91, for example, the second mode of the mounting process is performed by grouping by half the number Np of mounted parts of the plurality of partial areas Ap. Can be processed in the same manner as. With such a configuration, it is possible to narrow the range in which image processing having a high processing load such as super-resolution processing is executed.

4. Effects of the Configuration of the Embodiment The component mounting machine 1 of the embodiment controls the sampling operation (S31, S131, S133) by the mounting head 33 based on the result of the image processing (S40, S140, S240), and controls the mounting head 33. The control device 50 is provided for executing in parallel the image processing (S40, S140) for the partial area Ap for the next and subsequent sampling operations during the execution of the sampling operation or the mounting operation (S33, S135).

With such a configuration, image processing required for the next and subsequent sampling operations is executed in parallel while the sampling operation (S31, S131, S133) or the mounting operation (S33, S135) of the mounting head 33 is being executed. Thereby, the operation of the mounting head 33 and the image processing (S40, S140) overlap, and the mechanical operation of the mounting head 33 can be efficiently executed. In addition, the time required for the mounting process (S50) can be shortened as a whole.

5. Modification of Embodiment 5-1. Regarding Image Processing In the embodiment, the image processing includes the super-resolution processing. In the super-resolution processing in the image processing, the resolution of the high resolution data to be generated may be set according to the type and size of the component 91 supplied by the component supply device 20. Along with this, the number of image data acquired in the image capturing process changes. Further, when the dimensions of the supplied component 91 are sufficiently secured, the super-resolution processing in the image processing may be omitted.

In the embodiment, the board camera 42 is also used to acquire image data for the supply area As in image processing. On the other hand, the component mounting machine 1 can apply various cameras as long as the supply area As can be imaged. For example, a head camera unit integrally provided on the mounting head 33 or a dedicated camera provided on the component supply device 20 may be provided.

Note that the dedicated camera may be arranged below the supply area As as well as above the supply area As. In this case, for example, the supply area As corresponds to the support surface of the transparent support base on which the plurality of parts 91 are supplied in an irregular posture by the parts supply device 20. Further, in a configuration including a dedicated camera, when the image processing includes super-resolution processing as illustrated in the embodiment, a moving device for moving the dedicated camera relative to the supply area As is required. The moving device moves at least one of the dedicated camera and the support base.

Further, the bulk feeder 60 of the parts supply device 20 may be provided with a vibration device that applies vibration or the like when the supplied parts 91 overlap or are in contact with each other. In such a configuration, when the vibrating device operates, the control device 50 performs the same process as when the bulk feeder 60 additionally supplies the component 91 to the supply area As, as illustrated in the embodiment. It can be dealt with by doing.

5-2. Regarding Holding Member In the embodiment, the holding member that holds the component 91 is the suction nozzle 34 that holds the component 91 by suction with negative pressure air. On the other hand, the holding member may be a chuck that holds the component 91 by a plurality of claws that can be opened and closed, or an electromagnet that holds the component 91 by magnetic force. Even in such a configuration, the same effect as that of the embodiment can be obtained.

5-3. Working Machine In the embodiment, the working machine is a component mounting machine. On the other hand, the working machine may employ a mode different from that of the component mounting machine that mounts a component on the board. That is, the work machine may collect the work supplied by the work supply device by the work head and perform various predetermined works using the collected work. The above-mentioned predetermined work includes a work of screwing a bolt or the like as a work to the target object, a work of assembling the work to the target object, a work of aligning the parts as the work on a placement tray or the like.

In the above-described mode, the work head performs a collecting operation for collecting a work from a plurality of partial areas Ap set in the supply area As and a predetermined work operation using the collected work. Then, similarly to the embodiment, the control device 50 concurrently executes the image processing for the partial area Ap that performs the subsequent sampling operation during the sampling operation by the working head or the execution of the working operation. As a result, the working machine has the same effect as the configuration illustrated in the embodiment.

1: component mounting machine (working machine), 10: substrate transfer device, 20: component supply device (work supply device), 60: bulk feeder, 30: component transfer device, 33: mounting head (working head), 34: Adsorption nozzle (holding member), 42: substrate camera, 50: control device, 51: image processing unit, 52: mark processing unit, 90: substrate, 91: parts (work), Mc: substrate mark, As: supply area, Ap, Ap1, Ap2, Ap3: partial area, Ar: overlapping area, Rm: movable range

Claims

A work supply device that supplies a plurality of works to the supply area in an irregular posture,
An image processing unit that executes image processing for recognizing the supply state of one or more workpieces included in a plurality of partial areas set in the supply area, for each of the plurality of partial areas,
A work head that performs a collecting operation for collecting the work from the partial area, and a predetermined work operation using the collected work;
The sampling operation by the working head is controlled based on the result of the image processing, and the partial area for performing the sampling operation by the working head or the next and subsequent sampling operations during execution of the working operation is targeted. A control device for executing image processing in parallel,
Working machine equipped with.
In the image processing, super-resolution processing for acquiring high resolution data based on a plurality of image data acquired by imaging a plurality of times, and position of the work in the partial area based on the high resolution data and The work machine according to claim 1, further comprising a state recognition process of acquiring a posture as the supply state.
The work machine according to claim 1 or 2, wherein the plurality of partial areas are set by dividing an entire overlapping area where the supply area and the movable range of the work head overlap into a plurality of areas.
The working head has a plurality of holding members for holding the work,
The work machine according to claim 1 or 2, wherein the plurality of partial areas are set such that the workpieces are equal to or less than the number of the holding members in the supply area.
The work machine according to claim 1 or 2, wherein each of the plurality of partial areas is set to include one of the works in the supply area.
The working machine is a component mounting machine used for production of board products,
The work supply device is a component supply device that supplies a component as the work,
The working machine according to claim 1, wherein the working head is a mounting head that performs a mounting operation as the working operation of mounting the component collected by the collecting operation on a substrate.
The control device executes a mounting process in which a pick-and-place cycle (hereinafter, “PP cycle”) including the collecting operation and the mounting operation by the mounting head is repeated a plurality of times, and in the mounting process, The working machine according to claim 6, wherein the PP cycle and the image processing for the partial area where the collecting operation is performed in the next and subsequent PP cycles are executed in parallel.
The mounting head has a plurality of holding members for holding the component,
The control device executes a mounting process in which a pick-and-place cycle (hereinafter, “PP cycle”) including the collecting operation and the mounting operation by the mounting head is repeated a plurality of times, and in the PP cycle at this time, 7. The collecting operation for collecting the part from the partial area where the image processing is completed and the image processing for another partial area for which the unexecuted collecting operation is performed are executed in parallel. Working machine described in.
The component mounting machine is further provided so as to be movable integrally with the mounting head, and further includes a substrate camera which captures an image of a substrate mark attached to the substrate.
9. The work machine according to claim 6, wherein the board camera is also used for imaging the supply area to acquire image data used for the image processing by the image processing unit.
The component mounter moves the board camera to a position where the board mark can be imaged, and acquires the board position based on image data acquired by the board camera imaging the board mark. Further comprising a mark processing unit for executing the mark processing to
The control device, after acquiring image data by image capturing by the substrate camera that targets the supply area, performs the image processing targeting the partial area by the image processing unit and the mark processing by the mark processing unit. The work machine according to claim 9, wherein processing is executed in parallel.