JP6715714B2 - Inspection support apparatus and inspection support method - Google Patents

Description

The present invention relates to an inspection support device applied to a component mounter that mounts electronic components on a circuit board.

As shown in Patent Document 1, a component mounter sucks an electronic component at a supply position with a suction nozzle and mounts this electronic component at a predetermined coordinate position (mounting position) on a circuit board. The circuit board on which a plurality of electronic components are mounted by the component mounter is automatically inspected for the mounting state of the electronic component by an appearance inspection device located on the downstream side of the component mounter in the production line (see Patent Document 2). The mounting state of the electronic component includes the displacement amount of the electronic component with respect to the mounting position, the posture of the electronic component, the presence or absence of damage, and the like.

Further, the inspection of the circuit board includes visual inspection by an operator who targets the circuit board being mounted, in addition to automatic inspection by the visual inspection apparatus which targets the already mounted circuit board as described above. The visual inspection is required, for example, when an electronic component that requires particularly high mounting accuracy or an electronic component that is easily damaged is mounted. In the visual inspection, the operator visually checks the electronic component to be inspected mounted on the circuit board and determines the quality of the mounted state.

Patent Document 1: Japanese Patent Laid-Open No. 2013-026278 Patent Document 2: Japanese Patent Laid-Open No. 2002-299900

However, in the visual inspection by the component mounter, it may not be easy to judge whether the mounting state is good or not, depending on factors such as the fineness of the electronic component. Then, the time required for the visual inspection becomes long, and the inspection time may affect the production efficiency of the component mounter.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an inspection support device that improves the efficiency of inspection of the mounting state of electronic components in a component mounter.

The inspection support apparatus according to claim 1 is applied to a component mounter including a transfer device that holds an electronic component supplied to a supply position and transfers the electronic component to a mounting position on a circuit board. The inspection support device supports the inspection of the mounting state performed on the electronic component mounted on the circuit board. The transfer device includes a movable base supported so as to be movable relative to a base, and a mounting head that supports a plurality of suction nozzles holding the electronic components and is provided on the movable base. The inspection support device is a target of the inspection among the electronic components in a mounting process performed by a camera, which is provided on the movable table provided with the head, so that the circuit board can be imaged, and the component mounter. An imaging control unit that controls the imaging process of the camera when the inspection component is mounted on the circuit board to acquire image data in which the inspection component is stored. The suction nozzle is a position that depends on the immediately preceding operation, and the suction nozzle is moved up and down while moving from the current position corresponding to the position of the suction nozzle at the time when the immediately previous operation is finished to above the mounting position, The operation of the transfer device that mounts the inspection component held by the suction nozzle at the mounting position and that is executed in the order according to the control program is defined as a mounting operation. The camera is a position that depends on the immediately preceding operation, and the camera is capable of imaging the inspection component mounted at the mounting position from the current position corresponding to the position of the board camera at the time when the immediately preceding operation is completed. The operation of the transfer device that moves the mounting position above is defined as an imaging operation. The imaging control unit sets an execution order of operations of the transfer device including a plurality of times of the mounting operation and a plurality of times of the imaging operation corresponding to the mounting operation, and a total movement of the movable table in the execution order. distance so that short, or operating time of the total required for the mounting operation and the imaging operation in the execution sequence is optimized to shorten.

The inspection support method according to a ninth aspect is applied to a component mounter including a transfer device that holds an electronic component supplied to a supply position and transfers the electronic component to a mounting position on a circuit board. The inspection support method supports the inspection of the mounting state performed on the electronic component mounted on the circuit board. The transfer device includes a movable base supported so as to be movable relative to a base, and a mounting head that supports a plurality of suction nozzles holding the electronic components and is provided on the movable base. The suction nozzle is a position that depends on the immediately preceding operation, and the suction nozzle is moved up and down while moving from the current position corresponding to the position of the suction nozzle at the time of ending the immediately previous operation to above the mounting position, The operation of the transfer device that mounts the inspection component held by the suction nozzle at the mounting position and that is executed in the order according to the control program is defined as a mounting operation. From the current position corresponding to the position of the board camera at the time when the immediately preceding operation is completed, the camera provided on the movable table provided with the head so as to be able to image the circuit board is a position depending on the immediately preceding operation. An operation of the transfer device that moves the inspection component mounted at the mounting position above the mounting position where the camera can capture an image is defined as an image capturing operation. In the inspection support method, the execution order of the operations of the transfer device including the plurality of mounting operations and the plurality of imaging operations corresponding to the mounting operations is performed by a total movement of the movable table in the execution order. Optimized so that the distance is shortened or the total operation time required for the mounting operation and the imaging operation in the execution sequence is shortened , and the target of the inspection among the electronic components in the mounting process by the component mounter When the inspection component is attached to the circuit board, the image pickup process of the camera is controlled to acquire the image data in which the inspection component is stored.

According to the configurations of the inventions according to claims 1 and 9, the inspection support apparatus enables the inspection of the mounting state based on the image data by the image pickup of the camera provided inside the component mounter. Further, with respect to the mounting operations executed in the order set in advance by the control program, the timing for executing the imaging operation is determined based on the moving distance of the movable table or the required time (operation time required for the mounting operation and the imaging operation). Optimized. As a result, the necessary image data can be acquired efficiently, so that the efficiency of inspection of the mounted state can be improved.

It is an overall view showing a component mounting machine in an embodiment. It is a block diagram showing a control device of a component mounter to which an inspection support device is applied. It is a figure which shows operation|movement of the component transfer apparatus in mounting operation. It is a figure which shows operation|movement of the component transfer apparatus in imaging operation. It is a flow chart which shows mounting processing by a component mounting machine. It is a flowchart which shows the optimization process of the execution order of a mounting operation and an imaging operation. It is a figure which shows the relationship between the execution order of mounting operation|movement and imaging operation, and the moving distance of a mobile stand.

Embodiments embodying the inspection support apparatus and the inspection support method of the present invention will be described below with reference to the drawings. The inspection support device and the inspection support method are applied to a component mounter and support the inspection in the component mounter. The component mounter is a device that sucks an electronic component at a supply position with a suction nozzle and mounts the electronic component at a predetermined coordinate position (mounting position) on a circuit board.

<Embodiment> (1. Overall Configuration of Component Mounter 1) The configuration of the component mounter 1 will be described with reference to FIG. As shown in FIG. 1, the component mounter 1 includes a substrate transfer device 11, a component supply device 12, a component transfer device 13, a component camera 15, a substrate camera 16, and a control device 30. In the following description, the horizontal width direction of the component mounter 1 (the direction from the upper left to the lower right in FIG. 1) is defined as the X-axis direction, and the horizontal longitudinal direction of the component mounter 1 (the direction from the upper right to the lower left in FIG. 1). Is the Y-axis direction, and the vertical direction (vertical direction in FIG. 1) perpendicular to the X-axis and the Y-axis is the Z-axis direction.

The board transfer device 11 is composed of a belt conveyor or the like, and sequentially transfers the circuit boards 40 in the transfer direction. The board transfer device 11 positions the circuit board 40 at a predetermined position in the mounter 1. Then, the board transfer device 11 carries out the circuit board 40 to the outside of the component mounter 1 after the mounting process by the component mounter 1 is executed.

The component supply device 12 supplies the electronic component mounted on the circuit board 40 to the supply position Sp. In the present embodiment, the electronic components include electronic components housed in a carrier tape at a predetermined pitch and chips obtained by cutting the wafer Wf in component units. The carrier tape is fed and moved by a feeder detachably set in a plurality of slots of the component supply device 12. As a result, the component supply device 12 supplies the electronic component at the take-out portion on the front end side of the feeder.

The component supply device 12 also includes a wafer supply device 12a for supplying the chips of the wafer Wf. A large number of chips are formed, for example, in a lattice on the wafer body, and are cut into individual parts by a laser cutter or the like in the state of being attached to an adhesive sheet. The electronic component housed in the carrier tape and the chip of the wafer Wf correspond to the "electronic component" of the present invention.

The component transfer device 13 is configured to be movable in the X-axis direction and the Y-axis direction. The component transfer device 13 is arranged from the rear side (the upper right side in FIG. 1) in the longitudinal direction of the component mounter 1 to a position above the component supply device 12 on the front side. The component transfer device 13 includes a head drive device 21, a moving base 22, and a mounting head 23. The head drive device 21 is configured to be able to move the moving table 22 in the XY axis directions by a linear movement mechanism.

The mounting head 23 is detachably provided on the moving base 22 of the head drive device 21. The mounting head 23 also supports a plurality of suction nozzles 24 that are detachably provided on the plurality of nozzle holders. The mounting head 23 supports the suction nozzles 24 so as to be rotatable about an R axis parallel to the Z axis and capable of moving up and down.

Each of the suction nozzles 24 is controlled to move up and down with respect to the mounting head 23 (position in the Z-axis direction), angle, and supply state of negative pressure. When the suction nozzle 24 is supplied with a negative pressure, the suction nozzle 24 sucks and holds the electronic components supplied in the take-out portion of the feeder and the chips of the wafer Wf supplied by the wafer supply device 12a.

The component camera 15 and the substrate camera 16 are digital image pickup devices having image pickup elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor). The component camera 15 and the board camera 16 perform imaging of a range within the field of view of the camera based on a control signal from the control device 30 communicatively connected, and send the image data acquired by the imaging to the control device 30.

The component camera 15 is fixed to the base 2 of the component mounter 1 so that the optical axis is in the vertical direction (Z-axis direction), and is capable of capturing an image from below the component transfer device 13. More specifically, the component camera 15 is configured to be able to image the lower surface of the electronic component held by the suction nozzle 24. Specifically, the lens unit of the component camera 15 is set so that an object located at a certain distance from the image sensor is focused. The camera field of view of the lens unit of the component camera 15 is set to a size in which all the suction nozzles 24 supported by the mounting head 23 can be accommodated.

The board camera 16 (corresponding to the “camera” of the present invention) is provided on the moving base 22 of the component transfer device 13 so that the optical axis is in the vertical direction (Z-axis direction). The board camera 16 is configured to be able to image the circuit board 40. The control device 30 that has acquired the image data from the board camera 16 recognizes the positioning state of the circuit board 40 by the board transporting device 11 by recognizing, for example, a positioning mark attached to the board by image processing. Then, the control device 30 corrects the position of the movable table 22 according to the positioning state of the circuit board 40 and controls the mounting process so as to mount the electronic component.

Further, in the present embodiment, the board camera 16 executes an imaging process for acquiring image data used for inspection in the component mounter 1. In this inspection, of the electronic components mounted on the circuit board 40, the inspection component 50 to be inspected is targeted, and the quality of the mounting state of the electronic component is determined. That is, the board camera 16 is used not only for acquiring the image data used for the mounting process but also for acquiring the image data used for the inspection. The board camera 16 constitutes an inspection support device 90 that supports the inspection of the mounting state. The above inspection includes automatic inspection and visual inspection by an operator.

The control device 30 is mainly configured by a CPU, various memories, and a control circuit, and controls the mounting process of the electronic components on the circuit board 40 based on the image data acquired by the image pickup by the component camera 15 and the board camera 16. As shown in FIG. 2, the control device 30 has an input/output interface 36 connected to a mounting control unit 31, an image processing unit 32, an imaging control unit 33, a display control unit 34, and a storage device 35 via a bus. ing. A motor control circuit 37 and an image pickup control circuit 38 are connected to the input/output interface 36.

The mounting control unit 31 controls the position of the mounting head 23 and the operation of the suction mechanism via the motor control circuit 37. More specifically, the mounting control unit 31 inputs information output from various sensors provided in the component mounter 1 and results of various recognition processes. Then, the mounting control unit 31 sends a control signal to the motor control circuit 37 based on the control program stored in the storage device 35, information from various sensors, and the result of image processing and recognition processing. As a result, the position and rotation angle of the suction nozzle 24 supported by the mounting head 23 are controlled.

The image processing unit 32 acquires image data captured by the component camera 15 and the board camera 16 via the image capturing control circuit 38, and executes image processing according to the application. This image processing can include, for example, binarization of image data, filtering, hue extraction, super-resolution processing, and the like.

The imaging control unit 33 sends a control signal to each device so that a predetermined object is imaged by the component camera 15 and the board camera 16. Specifically, when the image pickup control unit 33 acquires the image data in which the positioning marks provided on the circuit board 40 are stored, the board control camera 16 provided on the moving table 22 with respect to the component supply device 12 is used. A control signal is sent to move the above the positioning mark. Then, the imaging control unit 33 sends a control signal to the board camera 16 that has moved above the positioning mark so as to execute the imaging process.

In the present embodiment, the imaging control unit 33 controls the imaging process for acquiring the image data used for the inspection in the component mounter 1. Further, the imaging control unit 33 optimizes the timing of executing the imaging process of the board camera 16 which is also used to acquire the image data used for the inspection. Details of the above-mentioned optimization processing by the imaging control unit 33 will be described later.

The display control unit 34 causes the display device 17 to display the image data captured by the board camera 16. The display device 17 is, for example, a liquid crystal monitor or a touch screen arranged on the operation panel of the control device 30 (see FIG. 4B). The display control unit 34 displays the image data that has been subjected to various kinds of image processing by the image processing unit 32.

The storage device 35 is configured by an optical drive device such as a hard disk device or a flash memory. The storage device 35 includes a control program for operating the component mounter 1, image data transferred from the component camera 15 and the board camera 16 to the control device 30 via a bus or a communication cable, and processing by the image processing unit 32. Temporary data of is stored. The input/output interface 36 is interposed between the CPU or the storage device 35 and the control circuits 76 and 77, and adjusts the data format conversion and the signal strength.

The motor control circuit 37 is used to control each axis motor provided in the component transfer device 13 based on the control signal from the mounting control unit 31. As a result, the mounting head 23 is positioned in each axial direction. Further, by controlling the motors of the respective axes, a predetermined elevation position (Z-axis direction position) and rotation angle of the suction nozzle 24 are determined.

The imaging control circuit 38 controls the imaging by the component camera 15 and the board camera 16 based on the imaging control signal sent by the imaging control unit 33. Further, the image pickup control circuit 38 acquires image data obtained by the image pickup by the component camera 15 and the board camera 16, and stores the image data in the storage device 35 via the input/output interface 36.

(2. Configuration of Inspection Assistance Device 90) In the present embodiment, the inspection assistance device 90 that assists the inspection is configured to include the board camera 16 in the component mounter 1 and the imaging control unit 33. The inspection support device 90 supports automatic inspection or visual inspection of the mounting state of the target inspection component 50 among the electronic components mounted on the circuit board 40 by the component mounter 1. Specifically, the inspection support device 90 supports the above-described inspection by optimizing the operation sequence of a plurality of mounting operations and a plurality of imaging operations.

(2-1. Definition of Mounting Operation and Imaging Operation) Here, the suction nozzle 24 is moved from the current position NCp to above the mounting position Mp, and the suction nozzle 24 is moved up and down and held by the suction nozzle 24. The operation of the component transfer device 13 that mounts the inspection component 50 at the mounting position Mp is defined as "mounting motion". The mounting operation is executed in the order according to the control program.

Specifically, as shown in FIG. 3, when the suction nozzle 24 is at the first current position NCp1, the mounting operation is such that the suction nozzle 24 moves XY from the first current position NCp1 to above the mounting position Mp. The operation corresponds to a descending operation for mounting the inspection component 50 held by the suction nozzle 24 on the circuit board 40 and an ascending operation for returning the suction nozzle 24 to the original height.

The current position NCp of the suction nozzle 24 is a position that depends on the immediately preceding operation of the component transfer device 13, and corresponds to the position of the suction nozzle 24 at the time when this immediately preceding operation ends. Therefore, even in the mounting operation of mounting the inspection component 50 at the predetermined mounting position Mp, the current position NCp of the suction nozzle 24 may be different if the immediately preceding operation is different. Further, the immediately preceding operation of the component transfer device 13 is changed, for example, when the imaging operation is inserted immediately before the mounting operation.

As a result, the suction nozzle 24 may be located at different first current position NCp1, second current position NCp2, or the like, even in the same mounting operation. Here, when the distance LN1 from the upper position of the mounting position Mp to the first current position NCp1 and the distance LN2 from the upper position of the mounting position Mp to the second current position NCp2 are different, the movable table in the mounting operation is performed. The movement distance of 22 and the operation time (required time) required for the mounting operation are different.

Further, the operation of the component transfer device 13 that moves the board camera 16 from the current position CCp to above the mounting position Mp so that the board camera 16 can image the inspection component 50 mounted at the mounting position Mp is an “imaging operation”. It is defined as. Specifically, as shown in FIG. 4, when the board camera 16 is at the first current position CCp1, the imaging operation is an operation in which the board camera 16 moves XY from the first current position CCp1 to above the mounting position Mp. Equivalent to. In the image pickup operation, the board camera 16 does not necessarily need to be moved right above the mounting position Mp. That is, the board camera 16 is moved to an area in which the inspection component 50 fits in the camera visual field by the imaging operation.

The current position CCp of the board camera 16 is a position that depends on the immediately preceding operation of the component transfer device 13, and corresponds to the position of the board camera 16 at the time when the immediately preceding operation ends. Therefore, even in the imaging operation of imaging the inspection component 50 mounted at the predetermined mounting position Mp, the current position CCp of the board camera 16 may be different if the immediately preceding operation is different. The immediately preceding operation of the component transfer device 13 is changed, for example, when another imaging operation is inserted immediately before the imaging operation.

As a result, the board camera 16 may be located at different first current position CCp1, second current position CCp2, or the like even in the same imaging operation. Here, when the distance LC1 from the upper position of the mounting position Mp to the first current position CCp1 and the distance LC2 from the upper position of the mounting position Mp to the second current position CCp2 are different, the movable table in the imaging operation is performed. The movement distance of 22 and the operation time (required time) required for the imaging operation are different.

(2-2. Mounting Process by Component Mounter 1) The mounting process of electronic components by the component mounter 1 will be described with reference to FIG. In the mounting process, the mounting control unit 31 first causes the plurality of suction nozzles 24 to sequentially suck the electronic components, and holds the electronic components (step 11 (hereinafter, “step” is referred to as “S”)). To execute. Next, the image pickup control unit 33 moves the mounting head 23 above the component camera 15 by the operation of the component transfer device 13, and executes an image pickup process (S12) for picking up images of a plurality of sucked electronic components.

After that, the mounting control unit 31 executes a mounting process (S13) for sequentially mounting the electronic components on the circuit board 40. Then, the mounting control unit 31 determines, based on the control program, whether or not the mounting process of all the electronic components has been completed (S14). The control device 30 repeatedly executes the above processes (S11 to S13) until the mounting process is completed.

Further, in the mounting process by the component mounter 1, the mounting control unit 31 controls the movement of the suction nozzle 24 in accordance with the suction state of the electronic component by the suction nozzle 24 in order to improve the mounting accuracy. Therefore, the mounting control unit 31 performs image processing on the image data acquired by the imaging process (S12) in the image processing unit 32 so that the suction state of the electronic component by the suction nozzle 24 is recognized.

Here, in order to execute the operation from the holding of a plurality of supplied electronic components by the component transfer device 13 to the end of the mounting operation for the number of times equal to the held number, that is, the processing (S11 to S13) The operation of the component transfer device 13 is defined as a "mounting cycle". When the mounting head 23 supports twelve suction nozzles 24, one mounting cycle is an operation from suctioning a maximum of twelve electronic components to completion of mounting all these electronic components. ..

(2-3. Optimization process by inspection support device 90) The optimization process of the execution sequence of the mounting operation and the imaging operation by the imaging control unit 33 included in the inspection support device 90 will be described with reference to FIGS. 6 and 7. To do. In the present embodiment, the imaging control unit 33 optimizes the execution order for the mounting operation included in one mounting cycle and the imaging operation corresponding to the mounting operation. Further, in the mounting cycle, an example is shown in which all of the 12 suction nozzles 24 supported by the mounting head 23 suck and hold electronic components, and the electronic components are mounted at different mounting positions Mp.

The imaging control unit 33 first acquires the mounting position Mp and the execution order of the mounting operation corresponding to the 12 mounting operations based on the control program (S21). The first mounting operation MV1 to the twelfth mounting operation MV12 in the mounting cycle are continuously performed as shown in the uppermost stage of FIG. It is executed sequentially.

Here, the horizontal width of each mounting operation MV1 to MV12 in FIG. 7 indicates the movement distance of the movable table 22 in each mounting operation when the mounting process is continuously executed in this execution order. That is, in the fifth mounting operation MV5 to the eighth mounting operation MV8 having a relatively small width, the mounting positions Mp corresponding to each are close to each other. On the other hand, in the ninth mounting operation MV9 to the twelfth mounting operation MV12 having a relatively large lateral width, the mounting positions Mp corresponding to each are located far from each other.

Next, the inspection support device 90 specifies the inspection component to be inspected among the electronic components held in each suction nozzle 24 based on the inspection information stored in the storage device 35 of the control device 30 ( S22). Here, it is assumed that all 12 electronic components are the targets of inspection. Therefore, the imaging control unit 33 determines in what order the first imaging operation IV1 to the twelfth imaging operation IV12 corresponding to the first mounting operation MV1 to the twelfth mounting operation MV12 are executed in the mounting cycle. It is determined by the process of.

The imaging control unit 33 calculates a pattern (hereinafter, referred to as an “execution pattern”) of the execution order of the 12 mounting operations MV1 to MV12 and the 12 imaging operations IV1 to IV12 (S23). Here, in order for the above execution pattern to be established, it is a condition that the imaging operation IVn corresponding to the mounting operation MVn to be executed n-th is executed after the mounting operation MVn. It is permissible that the mounting operation continues in the order according to the control program, or the imaging operation continues under the above conditions.

The imaging control unit 33, for the execution pattern calculated as a candidate for the optimum execution order, the movement distance of the movable table 22 in the execution order (including the mounting operation and the imaging operation), or the mounting operations MV1 to MV12 in the execution order. The operation time required for the imaging operations IV1 to IV12 is calculated. In the present embodiment, the imaging control unit 33 calculates the movement distance of the moving table 22 for each execution pattern (S24).

Specifically, assuming that the mounting operations MV1 to MV12 and the imaging operations IV1 to IV12 are performed in a specific order, the current position NCp of the suction nozzle 24 and the current position CCp of the board camera 16 in each operation, and the mounting operation The moving distance in the execution pattern is calculated by adding the distance to the position Mp. The imaging control unit 33 determines whether or not the moving distance of the moving table 22 has been calculated for all the execution patterns (S25), and repeats the above processing (S24) until the calculation of the moving distance of the moving table 22 is completed.

Subsequently, the imaging control unit 33 selects the most efficient execution pattern from the plurality of execution patterns based on the movement distance of the moving table 22 calculated for each execution pattern (S26). As a result, the execution sequence of the twelve mounting operations MV1 to MV12 and the twelve and twelve imaging operations IV1 to IV12 is optimized.

The execution pattern of the execution order optimized by the above processing will be described below. Here, a continuous part of the mounting operations included in the mounting cycle is referred to as a “mounting group”. Further, when the mounting operations executed in the order according to the control program are already optimized, the execution order of the imaging operations in the mounting group is (1) the imaging operations are executed in the same order after the mounting operations are executed. , (2) the imaging operation is performed in the reverse order after the mounting operation is performed, and (3) the mounting operation and the imaging operation are alternately performed.

The “same order” in the above pattern (1) means that the order is the same as the execution order of the plurality of mounting operations, and the “reverse order” in the pattern (2) is the execution order and the reverse order of the plurality of mounting operations. It means that. In FIG. 7, the above patterns (1) to (3) are shown for each mounting group.

The first mounting group Mg1 including the first mounting operation MV1 to the fourth mounting operation MV4 includes pattern (2), that is, the first mounting operation MV1 to the fourth mounting operation VM4, as shown in the upper part of FIG. After the execution, when the first imaging operation IV1 to the fourth imaging operation IV4 corresponding to these are executed in series and in the reverse order of the mounting operation, the moving distance of the movable table 22 becomes the shortest.

The second mounting group Mg2 including the fifth mounting motion MV5 to the eighth mounting motion MV8 has a pattern (1), that is, the fifth mounting motion MV5 to the eighth mounting motion VM8, as shown in the middle part of FIG. When the fifth imaging operation IV5 to the eighth imaging operation IV8 corresponding to these are executed in series and in the same order as the mounting operation after executing, the moving distance of the movable table 22 becomes the shortest.

The third mounting group Mg3 including the ninth mounting motion MV9 to the twelfth mounting motion MV12 includes pattern (3), that is, the mounting motion and the imaging motion are alternately set as shown in the lower part of FIG. When it is executed, the moving distance of the moving table 22 becomes the shortest. Therefore, the execution order optimized by the above processing is as follows: "Pattern (2) of the first mounting group Mg1", "Pattern (1) of the second mounting group Mg2", and "Pattern of the third mounting group Mg3 ( 3)” is connected to the execution order.

In this way, the movement distance of the movable table 22 changes by appropriately changing the execution order of the mounting operation and the imaging operation in each mounting group. This is due to the relationship between the corresponding mounting positions Mp and the distance from the suction nozzle 24 to the optical axis of the substrate camera 16. Therefore, the imaging control unit 33 sets a plurality of mounting groups and calculates an execution pattern based on the mounting position Mp corresponding to each mounting operation MV1 to MV12 and the execution order of the mounting operation acquired in S21 (S23). May be performed. As a result, it becomes possible to more efficiently calculate the movement distance (S24) than to calculate all the execution patterns.

(2-4. Interruption of imaging process for inspection in mounting process) The inspection support apparatus 90 performs a plurality of mounting operations and a plurality of mounting operations based on a preset condition while the mounting control unit 31 is executing the mounting process. A process for optimizing the execution order of the single imaging operation is executed. Here, in the present embodiment, the preset condition is the type of component to be mounted, the current time, the number of mounting operations performed, or the time from the previous inspection to the present.

That is, when at least one of these conditions is satisfied, the imaging control unit 33 of the examination support device 90 executes the optimization process. The "component type scheduled to be mounted" is subject to a condition that a specific component type is to be inspected and an electronic component of the component type is scheduled to be mounted in the period from the present to the specified time. Further, when the mounting process by the component mounter 1 reaches the execution of the mounting cycle including the mounting of the inspection component, the imaging control unit 33 causes the substrate camera 16 to perform the imaging process according to the optimized execution sequence of the imaging operation. Interrupt the implementation process.

Here, in the automatic inspection or the visual inspection in the component mounter 1, if the mounting state is determined to be defective, the subsequent mounting operation may be canceled from the viewpoint of preventing waste of electronic components. .. That is, after the image data of the inspection component 50 is acquired by the imaging control unit 33, the mounting operation is temporarily stopped until the inspection result of quality is input. The inspection support device 90 uses this period to execute a preliminary operation for the next mounting operation.

More specifically, when the inspection in the component mounter 1 is a visual inspection by an operator, first, the display control unit 34 of the control device 30 displays the image data acquired by the control of the imaging process by the imaging control unit 33. Display on the device 17. The operator refers to the displayed image data to determine whether the mounting state of the inspection component 50 is good or bad, and inputs the result of the determination. At this time, the imaging control unit 33 moves the suction nozzle 24 from the current position NCp to above the mounting position Mp in the next mounting operation during the period from the acquisition of the image data to the input of the inspection result. To move.

In this way, by performing the preliminary operation for the next mounting operation during the inspection, for example, when the result that the mounting state is good is input, the suction nozzle is lowered to promptly move to the next electronic component. The mounting operation can be executed. On the other hand, when a result indicating that the mounting state is poor is input, the subsequent mounting operation is canceled, so that waste of electronic components is prevented.

(3. Effect of Configuration of Embodiment) In the embodiment, the inspection support device 90 holds the electronic component supplied to the supply position S and transfers the electronic component to the mounting position Mp on the circuit board 40. The present invention is applied to the component mounter 1 including the mounting device (component transfer device 13). The inspection support device 90 supports the inspection of the mounting state performed on the electronic components mounted on the circuit board 40. The transfer device includes a moving base 22 supported so as to be movable relative to the base 2, and a mounting head 23 provided on the moving base 22 that supports a plurality of suction nozzles 24 holding electronic components. The inspection support device 90 includes a camera (substrate camera 16) provided on the moving table 22 so that the circuit board 40 can be imaged, and an inspection component 50 to be inspected among electronic components in the mounting process by the component mounter 1. An image pickup control unit 33 that controls the image pickup process of the camera when mounted on the circuit board 40 and acquires the image data in which the inspection component 50 is stored. By the operation of the transfer device that moves the suction nozzle 24 from the current position NCp to above the mounting position Mp and moves the suction nozzle 24 up and down to mount the inspection component 50 held by the suction nozzle 24 at the mounting position Mp. Therefore, the operation executed in the order according to the control program is defined as the mounting operation. The operation of the transfer device that moves the camera from the current position CCp to above the mounting position Mp so that the camera can image the inspection component 50 mounted at the mounting position Mp is defined as an imaging operation. The imaging control unit 33 determines the execution order of the plurality of mounting operations and the plurality of imaging operations based on the moving distance of the movable table 22 in the execution order or the operation time required for the mounting operation and the imaging operation in the execution order. Optimize.

In the inspection support method according to the embodiment, the execution order of the plurality of mounting operations and the plurality of imaging operations is the movement distance of the movable table 22 in the execution order, or the operation required for the mounting operation and the imaging operation in the execution order. Controlling the imaging process of the camera (the substrate camera 16) when the inspection component 50, which is an electronic component to be inspected in the mounting process by the component mounter 1, is optimized on the basis of time and is mounted on the circuit board 40. Then, the image data containing the inspection component 50 is acquired.

With such a configuration, the inspection support device 90 and the inspection support method (S21 to S26) enable the inspection of the mounting state based on the image data captured by the board camera 16 provided inside the component mounter 1. .. Here, in order to acquire the image data containing the inspection component 50, the imaging process of the substrate camera 16 is executed after the inspection component 50 is mounted on the circuit board 40. In this imaging process, it is necessary to move the moving table 22 so that the inspection component 50 fits within the camera field of view of the board camera 16.

However, if the mounting operation and the image capturing operation are executed in series, or if the mounting operation and the image capturing operation are alternately executed, the mounting position Mp corresponding to each of the plurality of mounting operations, the suction nozzle 24, and the substrate camera. It has been found that the moving distance of the movable table 22 becomes long depending on the relationship with the distance of 16 to the optical axis, and the efficiency of the image pickup processing decreases.

Therefore, the inspection support device 90 and the inspection support method are based on the moving distance of the movable table 22 in the execution pattern for the mounting operation executed in the order preset by the control program, as illustrated in the present embodiment. Thus, the timing of executing the imaging operation is optimized. As a result, the necessary image data can be acquired efficiently, so that the efficiency of inspection of the mounted state can be improved.

In addition, the operation from the holding of a plurality of supplied electronic components by the transfer device (component transfer device 13) to the end of the mounting operation for the number of times equal to the held number is defined as a mounting cycle. The imaging control unit 33 optimizes the execution order for the mounting operation included in the mounting cycle and the imaging operation corresponding to the mounting operation. According to such a configuration, the execution sequence of a plurality of mounting operations and a plurality of imaging operations is optimized with the mounting cycle as one unit. Therefore, when a plurality of inspection components 50 are included in the electronic components mounted in one mounting cycle, the necessary imaging is performed while suppressing the influence on the mounting process in the mounting cycle without affecting other mounting cycles. Can perform processing.

Further, the plurality of imaging operations (first mounting group Mg1 and second mounting group Mg2) corresponding to each of the plurality of consecutive mounting operations in the mounting cycle are executed in series after the plurality of mounting operations are completed. According to such a configuration, for example, when the mounting positions Mp of the plurality of inspection components 50 mounted by the second mounting group Mg2 are relatively close to each other, the mounting operation corresponding to these inspection components 50 is performed in series. After that, a plurality of imaging operations are collectively executed in a series. As a result, the moving distance of the moving table 22 due to the execution of the image pickup process can be shortened.

Further, the plurality of imaging operations corresponding to each of the plurality of mounting operations are executed in the reverse order of the execution order of the plurality of mounting operations. With this configuration, for example, when the suction nozzle 24 is located above the mounting position Mp corresponding to the last mounting operation in the first mounting group Mg1, the position of the substrate camera 16 in this state is the first mounting position. When it is closer to the mounting position Mp corresponding to the last mounting operation than the mounting position Mp corresponding to the position Mp, the mounting operations corresponding to these inspection components 50 are executed in the reverse order of the mounting operation. As a result, the moving distance of the moving table 22 due to the execution of the image pickup process can be shortened.

Further, the plurality of imaging operations (third mounting group Mg3) corresponding to each of the plurality of consecutive mounting operations in the mounting cycle are executed after the corresponding mounting operation is executed. With such a configuration, when the mounting positions Mp of the plurality of inspection components 50 mounted by the mounting group Mg3 are relatively far, the mounting operation and the imaging operation corresponding to these inspection components 50 are alternately executed. As a result, it is possible to prevent the movement distance of the movable table 22 from being extended due to the execution of the imaging process.

In addition, the image pickup control unit 33 executes processing for optimizing the execution sequence of a plurality of mounting operations and a plurality of image pickup operations based on a preset condition during execution of the mounting processing by the mounter 1. Then, the imaging process of the camera (board camera 16) is interrupted in the mounting process. According to such a configuration, it becomes possible to inspect an electronic component of a component type for which mounting accuracy is particularly required or perform a regular inspection. Therefore, the quality of the circuit board 40 product is maintained.

In addition, the preset conditions are the type of parts to be mounted, the current time, the number of mounting operations performed, or the time from the previous inspection to the present. With such a configuration, the inspection can be performed at any timing by the operator. Thereby, the quality of the product of the circuit board 40 is preferably maintained.

In addition, the imaging control unit 33 reserves for moving the suction nozzle 24 from the current position NCp to above the mounting position Mp in the next mounting operation during the period from the acquisition of the image data to the input of the inspection result. Perform an action. As a result, for example, when a result indicating that the mounting state is good is input, the suction nozzle 24 can be lowered to quickly execute the mounting operation for the next electronic component. Therefore, it is possible to suppress a decrease in throughput due to the execution of the imaging process. Further, when the result indicating that the mounting state is poor is input, the subsequent mounting operation is canceled, so that waste of electronic components can be prevented.

<Modification of Embodiment> In the embodiment, the imaging control unit 33 of the inspection support apparatus 90 calculates the movement distance of the movable table 22 in the execution sequence of the mounting operation and the imaging operation for the plurality of execution patterns calculated in S23. Yes (S24). On the other hand, the imaging control unit 33 may calculate the operation time (required time) required for the mounting operations MV1 to MV12 and the imaging operations IV1 to IV12 in the execution order for a plurality of execution patterns.

That is, in S26, the imaging control unit 33 selects the optimum execution order based on the time required to execute each execution order instead of the movement distance of the movable table 22. Here, although there is a correlation between the moving distance of the movable table 22 and the required time, it is not necessarily proportional. This is because the required time includes the time required for acceleration and deceleration in the operation of the component transfer device 13, the movement operation of the moving table 22 and the operation of the mounting head 23 (for example, the indexing operation of the suction nozzle 24). Can be executed in parallel.

Therefore, the imaging control unit 33 may be configured to optimize the execution order based on the required time. As a result, it is possible to more accurately optimize the execution sequence of the mounting operation and the imaging operation, as compared with the case based on the moving distance of the moving table 22. Further, from the viewpoint of reducing the processing load due to optimization, the aspect exemplified in the embodiment is preferable.

Further, in the embodiment, the inspection support device 90 targets one mounting cycle for optimization. On the other hand, the inspection support apparatus 90 may collectively target a plurality of mounting cycles for optimization, or may target a mounting group that is a part of the mounting cycle for optimization. With such a configuration, the same effect as that of the embodiment can be obtained.

1: Component mounter 2: Base 13: Component transfer device (transfer device) 22: Moving table, 23: Mounting head, 24: Suction nozzle 16: Substrate camera (camera) 30: Control device, 33: Imaging Control unit, 40: circuit board, 50: inspection component (electronic component) 90: inspection support device Sp: supply position, Mp: mounting position NCp: current position NCp1: first current position, NCp2: second current position CCp: current Position CCp1: first current position, CCp2: second current position Mg1: first mounting group Mg2: second mounting group Mg3: third mounting group

Claims (9)

Applied to a component mounter equipped with a transfer device that holds an electronic component supplied at a supply position and transfers the electronic component to a mounting position on a circuit board,
An inspection support device for supporting an inspection of a mounting state performed on the electronic component mounted on the circuit board,
The transfer device,
A moving base supported so that it can move relative to the base,
A plurality of suction nozzles for holding the electronic component are supported, and a mounting head provided on the movable table,
The inspection support device,
A camera provided on the movable table provided with the head so that the circuit board can be imaged ;
In the mounting process by the component mounter, when the inspection component to be inspected among the electronic components is mounted on the circuit board, the imaging process of the camera is controlled to store the inspection component. An imaging control unit for acquiring image data,
The suction nozzle is a position that depends on the immediately preceding operation, and the suction nozzle is moved up and down while moving from the current position corresponding to the position of the suction nozzle at the time when the immediately previous operation is finished to above the mounting position, The operation of the transfer device for mounting the inspection component held by the suction nozzle at the mounting position, wherein the operation executed in the order according to the control program is defined as a mounting operation,
The pre-Symbol camera, a dependent position immediately before the operation, from a current position corresponding to the position of the board camera at the time immediately before this operation is completed, the test components mounted on the mounting position the camera capable imaging The operation of the transfer device for moving the mounting position above is defined as an imaging operation,
The imaging control unit sets the execution order of the operations of the transfer device including the plurality of mounting operations and the plurality of imaging operations corresponding to the mounting operations, and the total movement of the movable table in the execution order. An inspection support apparatus that is optimized so that the distance is shortened or the total operation time required for the mounting operation and the imaging operation in the execution sequence is shortened . The operation from the holding of a plurality of the supplied electronic components by the transfer device to the repetition of the mounting operation for a number of times equal to the held number is defined as a mounting cycle. The inspection support apparatus according to claim 1, wherein the execution order is optimized for the mounting operation included in a cycle and the imaging operation corresponding to the mounting operation. The inspection support apparatus according to claim 2, wherein the plurality of imaging operations corresponding to each of the plurality of consecutive mounting operations in the mounting cycle are executed in series after the plurality of mounting operations are completed. The inspection support apparatus according to claim 3, wherein the plurality of imaging operations corresponding to each of the plurality of mounting operations are executed in a reverse order of an execution order of the plurality of mounting operations. The inspection according to any one of claims 2 to 4, wherein the plurality of imaging operations corresponding to each of the plurality of consecutive mounting operations in the mounting cycle are executed after the corresponding mounting operation is executed. Support device. The imaging control unit executes processing for optimizing an execution sequence of the mounting operation and the imaging operation a plurality of times based on a preset condition during execution of the mounting processing by the mounter. The inspection support apparatus according to claim 1, wherein the imaging process of the camera is interrupted in the mounting process. The inspection support apparatus according to claim 6, wherein the preset condition is a component type scheduled to be mounted, a current time, the number of times of the mounting operation executed, or a time from the previous inspection to the present. The imaging control unit reserves for moving the suction nozzle from the current position to above the mounting position in the next mounting operation during a period from the acquisition of the image data to the input of the inspection result. The inspection support apparatus according to claim 1, which performs an operation. Applied to a component mounter equipped with a transfer device that holds an electronic component supplied at a supply position and transfers the electronic component to a mounting position on a circuit board, and targets the electronic component mounted on the circuit board. And a plurality of suction nozzles for holding the electronic components, the moving apparatus being supported so as to be movable relative to a base. And a mounting head provided on the movable table, the suction nozzle being a position depending on the immediately preceding operation, and the mounting from the current position corresponding to the position of the suction nozzle at the time when the immediately preceding operation is completed. An operation of the transfer device that moves the suction nozzle up and down while moving the suction nozzle to the position above and mounts the inspection component held by the suction nozzle at the mounting position, in an order according to a control program. The operation to be executed is defined as a mounting operation, and the camera provided on the movable table provided with the head so as to be able to capture an image of the circuit board is a position that depends on the immediately preceding operation, and the immediately preceding operation is completed. An operation of the transfer device that moves the inspection component mounted at the mounting position above the mounting position where the camera can image from the current position corresponding to the position of the board camera at the time point is defined as an imaging operation. However , the inspection support method, the execution sequence of the operation of the transfer apparatus including a plurality of times of the mounting operation and a plurality of times of the imaging operation corresponding to the mounting operation, the total of the movable table in the execution order. as the moving distance is short, or optimized to operate the total time required for the mounting operation and the imaging operation in the execution sequence becomes shorter, the inspection of the electronic component in the mounting process by the component mounter The inspection support method for controlling the imaging process of the camera to acquire the image data containing the inspection component when the inspection component to be targeted is attached to the circuit board.