JP2004327695A - Electronic part installing device and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part installing device and method therefor wherein productivity is improved by reducing a tact time. <P>SOLUTION: The electronic part installing device is for picking up an electronic part and transferring and mounting it to a board 3 from a part supplying part 4 by a transferring head 8A. A part recognition camera 12A for imaging the electronic part P held by the suction nozzle 11 of the transferring head 8A is movable by an independent camera moving means. In image fetching, moving of the camera 12A by this camera moving means is made to synchronously follow moving of the transferring head 8A. Thus, the transferring head 8A can move to the board 3 speedily without passing through a specific route for part recognition so as to reduce the tact time to improve productivity. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component such as a semiconductor chip on a substrate.
[0002]
[Prior art]
2. Description of the Related Art As electronic components such as semiconductor chips are mounted on a substrate, the positional accuracy required for mounting the electronic component on the substrate has been improved, and a method of correcting a positional displacement between the electronic component and the substrate during mounting by image recognition has been widely used. In this method, before mounting the electronic component, the electronic component held in the board or the transfer head is imaged with a camera to recognize the board or the electronic component, and based on the position detection result obtained by this recognition. This is to perform position correction when mounting components.
[0003]
As a method of imaging an electronic component for component recognition, instead of a method generally used conventionally, that is, a method of moving a transfer head holding an electronic component above a camera arranged at a fixed position. There has been proposed a method using a configuration in which a component recognition camera is moved integrally with a transfer head (for example, see Patent Documents 1 and 2). Accordingly, there is an advantage that the component recognition can be performed without changing the movement path during the movement of the transfer head from the component supply unit to the substrate, and the tact time can be reduced.
[0004]
[Patent Document 1]
JP-A-11-298198 [Patent Document 2]
JP 2000-277999 A
[Problems to be solved by the invention]
However, in the above-described prior art, a camera retracting mechanism, that is, a component recognition camera such that a component recognition camera does not interfere with these operations during a component suction operation or a component mounting operation is provided on a movable portion that moves with the transfer head. Since it is necessary to include a mechanism for retracting from below the transfer head, it has been difficult to reduce the weight and size of the movable portion of the transfer head. For this reason, high-speed operation of the transfer head is difficult, and shortening of the tact time may be hindered.
[0006]
Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of shortening tact time and improving productivity.
[0007]
[Means for Solving the Problems]
2. The electronic component mounting apparatus according to claim 1, wherein the electronic component is picked up by a transfer head from a component supply unit and transferred and mounted on a substrate positioned at a substrate positioning unit, and holds the electronic component. A transfer head, a component recognition camera that images an electronic component held by the transfer head, a head moving unit that moves the transfer head between the component supply unit and the substrate positioning unit, Camera moving means for moving the component recognition camera in the horizontal direction, and head moving means and camera moving means for moving the component recognition camera by the camera moving means in synchronization with the movement of the transfer head by the head moving means And electronic component recognition by performing image processing on image data captured by the component recognition camera. And a identification processing means.
[0008]
The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, comprising a plurality of sets of the transfer head and the head moving unit, wherein the plurality of sets are provided by a set of a component recognition camera and a camera moving unit. The electronic components held by the transfer heads are imaged.
[0009]
4. The electronic component mounting method according to claim 3, wherein the electronic component is picked up by a transfer head from a component supply unit and transferred and mounted on a substrate positioned at a positioning unit. A pickup step of holding the components, a component transfer step of moving the transfer head holding the electronic components from the component supply unit to the substrate positioning unit by the head moving unit, and a component recognition camera that is moved by the camera moving unit during the component transfer. An image capturing step of capturing an image of the electronic component held by the transfer head, a recognition processing step of performing image processing on the captured image data to perform image recognition of the electronic component, and transferring based on a recognition processing result. A component mounting step of mounting electronic components on the substrate by moving the head with respect to the substrate. , In the image capturing step, to control the head moving means and the camera moving means so as to follow the movement of the component recognition camera by the camera moving means in synchronism with the movement of the transfer head by the head moving means.
[0010]
5. The electronic component mounting method according to claim 4, wherein the plurality of transfer heads move the component recognition camera by individual head moving means in the image capturing step. To follow each other in synchronization by time sharing.
[0011]
According to the present invention, the component recognition camera for imaging the electronic component held by the transfer head is configured to be movable by the camera moving means, and the movement of the component recognition camera by the camera moving means is used for capturing the image. By following the movement in synchronization with the movement, it is possible to reduce the weight of the movable part that moves together with the transfer head, enable high-speed operation of the transfer head, shorten the tact time, and improve productivity.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
FIG. 1 is a plan view of an electronic component mounting apparatus according to the first embodiment of the present invention, FIG. 2A is a side view of a transfer head of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. FIG. 3 is a side view of a camera unit of the electronic component mounting apparatus according to the first embodiment of the present invention, FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. FIG. 5 is a side view of a transfer head and a camera unit of the electronic component mounting apparatus according to the first embodiment of the present invention.
[0013]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports the substrate 3 and positions the substrate 3 at a predetermined position. Therefore, the transport path 2 is a substrate positioning section. On both sides of the transport path 2, component supply units 4 for supplying electronic components are arranged. A large number of parts feeders 5 are arranged in each component supply unit 4 in the X direction. The parts feeder 5 stores the electronic components and supplies the electronic components to a transfer head described below.
[0014]
Y-axis tables 6A and 6B are provided on both ends of the upper surface of the base 1, and two head X-axis tables 7A and 7B are provided on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the head X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the head X-axis table 7B moves horizontally in the Y direction.
[0015]
Transfer heads 8A and 8B are mounted on the head X-axis tables 7A and 7B, respectively. The transfer heads 8A and 8B are multi-type transfer heads, and have a plurality of suction nozzles 11 for sucking and holding electronic components at the lower end as shown in FIG. Since the transfer heads 8A and 8B have the same symmetrical arrangement, only the transfer head 8A is shown in the drawing.
[0016]
By driving the Y-axis table 6A and the head X-axis table 7A and the Y-axis table 6B and the head X-axis table 7B in combination, the transfer heads 8A and 8B move horizontally in the XY directions, and the respective component supply units 4 are moved. Then, the electronic component is picked up by the suction nozzle 11 and mounted on the substrate 3 positioned on the transport path 2. The Y-axis table 6A and the head X-axis table 7A constitute a first head moving mechanism, and the Y-axis table 6B and the head X-axis table 7B constitute a second head moving mechanism. The first head moving mechanism and the second head moving mechanism are head moving means for moving the transfer heads 8A and 8B between the component supply unit 4 and the transport path 2.
[0017]
Two camera X-axis tables 9A and 9B are mounted on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the camera X-axis table 9A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the camera X-axis table 9B moves horizontally in the Y direction. Camera units 10A and 10B are mounted on the camera X-axis tables 9A and 9B, respectively.
[0018]
As shown in FIG. 2B, the camera units 10A and 10B fix the camera 12A (12B) downward to the frame part 12a mounted on the camera X-axis tables 9A and 9B, and reflect the light downward from the frame part 12a. The configuration is such that the parts 13 are connected via a connecting member 13a. The camera 12A (12B) is an area camera, and captures an image in a visual field of a predetermined size. The reflecting unit 13 includes a reflecting mirror 14a disposed directly below the camera 12A (12B) in an inclined posture, and a reflecting mirror 14b disposed in a position facing the reflecting mirror 14a in an inclined posture. Since the camera units 10A and 10B have the same structure and symmetrical arrangement, only the camera unit 10A is shown in the drawing.
[0019]
By driving the combination of the Y-axis table 6A and the X-axis table 7A, and the Y-axis table 6B and the X-axis table 7B, the camera units 10A and 10B move horizontally in the XY directions. During the imaging operation, the camera units 10A and 10B move following the transfer heads 8A and 8B, respectively, as described later, and image the electronic components held by the suction nozzles 11 of the transfer heads 8A and 8B.
[0020]
The cameras 12A and 12B are a first component recognition camera and a second component recognition camera, respectively. The Y-axis table 6A and the camera X-axis table 9A constitute a first camera moving mechanism for moving the first component recognition camera, and the Y-axis table 6B and the camera X-axis table 9B constitute a second component recognition camera. A second head moving mechanism for moving is constituted. The first head moving mechanism and the second head moving mechanism serve as camera moving means for moving the component recognition camera in the horizontal direction.
[0021]
As the X-axis table and the Y-axis table used as the head moving mechanism and the camera moving mechanism, various feed table mechanisms such as a linear motion mechanism in which a nut is combined with a feed screw driven by a motor and a linear motor are used. be able to.
[0022]
Next, the configuration of the control system will be described with reference to FIG. The control unit 20 is a CPU, and executes a mounting operation and various processes by executing a program stored in the program storage unit 21. When executing the program, the data stored in the data storage unit 22 is referred to. The program storage unit 21 stores a mounting operation program and a camera unit operation program for performing a component recognition operation described later, that is, an operation program for synchronizing and following the movement of the transfer heads 8A and 8B with the camera units 10A and 10B. Various programs are stored. The data storage unit 22 stores mounting position data required for the mounting operation, mounting sequence data, and component data indicating the type and size of the component to be mounted.
[0023]
The image recognition unit 23 recognizes image data captured by the camera 12A as the first component recognition camera and the image data captured by the camera 12B as the second component recognition camera, and is held by the transfer heads 8A and 8B. The electronic component in the state is identified and its position is detected. Therefore, the image recognition unit 23 is a recognition processing unit that recognizes an electronic component by performing image processing on image data captured by the component recognition camera.
[0024]
The mechanism driving unit 24 includes a first head moving mechanism 25A for moving the transfer heads 8A and 8B, a second head moving mechanism 25B, a first camera moving mechanism 26A for moving the camera units 10A and 10B, respectively. The second camera moving mechanism 26B is driven. In driving each unit by the mechanism driving unit 24, the control unit 20 executes the above-described camera unit operation program to realize a component recognition operation. Therefore, the control unit 20 is a control unit that controls the head moving unit and the camera moving unit so that the movement of the component recognition camera by the camera moving unit follows the movement of the transfer head by the head moving unit. .
[0025]
The electronic component mounting apparatus is configured as described above. Next, the electronic component is picked up from the component supply unit 4 by the transfer heads 8A and 8B and transferred and mounted on the substrate 3 positioned at the substrate positioning unit. The mounting method will be described with reference to FIG. Here, only the mounting operation by the transfer head 8A will be described, but in the actual mounting operation, the mounting operation by the transfer head 8A and the mounting operation by the transfer head 8B are alternately and repeatedly executed.
[0026]
First, as shown in FIG. 4A, the transfer head 8A is moved to the component supply unit 4, and the electronic component P to be mounted is sucked and held by the suction nozzle 11 provided on the transfer head 8A (pickup). Process). The transfer head 8A holds a plurality of electronic components P by sequentially repeating the pickup operation for the plurality of suction nozzles 11. At this time, the camera unit 10A is retracted to a position where the pickup operation by the transfer head 8A is not hindered.
[0027]
Next, the transfer head 8A holding the electronic component P is moved from the component supply unit 4 toward the substrate 3 on the transport path 2 by the first head moving mechanism 25A (component transfer step). At the time of component transfer by the transfer head 8A, as shown in FIG. 4B, the camera unit 10A is moved by the first camera moving mechanism 26A, and light is reflected using the reflecting mirrors 14a and 14b. An image of the electronic component P held by the suction nozzle 11 is captured by the camera 12A (image capturing step).
[0028]
In this image capturing step, the first head is moved so that the movement of the component recognition camera 12A by the first camera movement mechanism 26A is synchronized with the movement of the transfer head 8A by the first head movement mechanism 25A. The control unit 20 controls the moving mechanism 25A and the first camera moving mechanism 26A. Accordingly, the camera 12A is in a state of being relatively stopped with respect to the electronic component P held by the transfer head 8A, and it is possible to capture an image while the electronic component P moves together with the transfer head 8A.
[0029]
In this image capture, if the imaging range required to capture the images of the plurality of electronic components held by the transfer head 8A does not fall within the imaging field of view of the camera 12A, the imaging optical axis of the camera 12A The first head moving mechanism 25A and the first camera moving mechanism 26A are controlled so as to relatively move with respect to the transfer head 8A, and images are taken in plural times.
[0030]
Then, the captured image data is subjected to image processing by the image recognition unit 23 to perform image recognition of the electronic component P (recognition processing step). Next, as shown in FIG. 4B, the transfer head 8A is moved with respect to the substrate 3 based on the recognition processing result, and the held electronic component P is mounted on the substrate 3 (component mounting step).
[0031]
In the above electronic component mounting operation, the transfer heads 8A and 8B holding the electronic components P move along a specific path for the recognition of the electronic components as in the case of performing recognition by a conventional fixedly arranged camera. No need. Therefore, no matter which part feeder 5 of the component supply unit 4 picks up the electronic component, the transfer heads 8A and 8B can move onto the substrate 3 via the shortest path, and the head moves at each mounting turn. The time can be reduced, and the tact time can be reduced.
[0032]
In the above example, as the configuration of the camera unit 10A (10B), the component recognition camera 12A (12B) is arranged with the imaging optical axis directed vertically downward, and the transfer head is mounted via the two reflecting mirrors 14a and 14b. Although the configuration example in which the lower surface side of 8A (8B) is imaged is shown, a configuration as shown in FIG. 5 may be used. In the example shown in FIG. 5, the camera 12A is disposed in the camera unit 101A with the imaging optical axis directed obliquely downward, and the lower surface side of the transfer head 8A is imaged by one reflecting mirror 31.
[0033]
(Embodiment 2)
FIG. 6 is a plan view of an electronic component mounting apparatus according to Embodiment 2 of the present invention, and FIG. 7 is a side view of a transfer head and a camera unit of the electronic component mounting apparatus according to Embodiment 2 of the present invention. In the second embodiment, as in the first embodiment, a plurality of sets of transfer heads 8A and 8B and a plurality of head moving means respectively corresponding to these transfer heads are provided. The electronic components held by the plurality of transfer heads are imaged by the means.
[0034]
The electronic component mounting apparatus shown in FIG. 6 has the same configuration as the electronic component mounting apparatus shown in FIG. 1 of the first embodiment except for the camera X-axis table 90 and the camera unit 102. One camera X-axis table 90 is installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the camera X-axis table 90 moves horizontally in the Y direction. The camera unit 102 is mounted on the camera X-axis table 90.
[0035]
As shown in FIG. 7, the camera unit 102 has a camera 12 similar to the cameras 12A and 12B fixed downward to a frame portion 102a mounted on the camera X-axis table 90, and a reflection portion 131 below the frame portion 12a. It is configured to be connected via a connecting member 131a. The reflecting section 131 includes a reflecting mirror 142 disposed immediately below the camera 12 and two reflecting mirrors 141a and 141b disposed at both ends of the base section 131b in an inclined posture with reflecting surfaces facing each other.
[0036]
The reflecting mirror 142 is reversible around a horizontal axis 142b, and by inverting the reflecting mirror 142, the reflecting surface 142a can be opposed to one of the reflecting mirrors 141a and 141b. As shown in FIG. 7, when the reflecting surface 142a of the reflecting mirror 142 faces the reflecting mirror 142a, the camera 12 can image the lower surface side of the transfer head 8A by the camera 12, as in FIG. 4B. . In addition, by inverting the reflecting mirror 142 so that the reflecting surface 142a faces the reflecting mirror 142b, and positioning the reflecting mirror 141b immediately below the transfer head 8B, the camera 12 can image the lower surface side of the transfer head 8B. it can.
[0037]
In the mounting operation, the transfer heads 8A and 8B take out the electronic components from the component supply unit 4 and transfer and mount the electronic components on the substrate 3 on the transport unit 2 as in the first embodiment. During the transfer of the components, an image of the electronic component held by the suction nozzle 11 of each of the transfer heads 8A and 8B is captured, and thereafter, the captured image data is subjected to image processing to perform image recognition of the electronic component. The electronic component is mounted on the substrate by moving the transfer head with respect to the substrate based on the recognition processing result.
[0038]
In this image capturing step, the camera 12, which is a component recognition camera provided in common to the two transfer heads, is moved to the plurality of transfer heads 8A and 8B moved by individual head moving means by time sharing. Synchronize and follow individually. That is, first, the camera unit 90 follows either one of the transfer heads 8A and 8B to capture an image of the electronic component, and when the image capture is completed, the camera unit 90 is immediately reversed in the Y direction and moved to the other side. The image of the electronic component is captured by following the transfer head. This makes it possible to simplify the configuration of the camera moving mechanism and reduce costs.
[0039]
As described above, the present invention adopts a configuration in which the component recognition camera moves together with the transfer head in place of the method of moving the transfer head holding the electronic component above the camera arranged at the fixed position, A component recognition camera for imaging the electronic components held by the transfer head is configured to be movable by independent camera moving means, and the movement of the component recognition camera by the camera moving means is synchronized with the movement of the transfer head in image capturing. It is made to follow.
[0040]
This allows the movable part that moves with the transfer head to have a camera retracting mechanism, that is, the component recognition camera from below the transfer head so that the component recognition camera does not interfere with these operations during component suction operation or component mounting operation. There is no need to provide a retracting mechanism. Therefore, the weight and size of the movable portion of the transfer head can be reduced, the transfer head can operate at high speed, and the tact time can be reduced to improve the productivity. In addition, even when the type of the transfer head is used in the same electronic component mounting apparatus, it can be replaced regardless of the camera unit, so that the versatility corresponding to the type of the target substrate or electronic component is improved. be able to.
[0041]
In the first and second embodiments, an example in which an area camera is used as a component recognition camera has been described. However, in applying the present invention, the type of camera is not limited, and a line camera may be used. In this case, in the control for synchronizing the operation of the transfer head and the camera unit, the operation control is performed so that the transfer head and the camera unit relatively move at the scan speed in the scan direction of the line camera.
[0042]
【The invention's effect】
According to the present invention, the component recognition camera for imaging the electronic component held by the transfer head is configured to be movable by the camera moving means, and the movement of the component recognition camera by the camera moving means is used for capturing the image. Since it is made to follow the movement in synchronization with the movement, it is possible to reduce the weight of the movable portion that moves together with the transfer head, enable high-speed operation of the transfer head, shorten the tact time, and improve the productivity.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention; FIG. 2 (a) a side view of a transfer head of the electronic component mounting apparatus according to the first embodiment of the present invention; FIG. 3 is a side view of a camera unit of the electronic component mounting apparatus according to the first embodiment; FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the first embodiment of the present invention; FIG. 5 is an operation explanatory view of the electronic component mounting method according to the first embodiment. FIG. 5 is a side view of a transfer head and a camera unit of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 7 is a plan view of a component mounting apparatus. FIG. 7 is a side view of a transfer head and a camera unit of the electronic component mounting apparatus according to the second embodiment of the present invention.
3 Board 4 Component supply unit 5 Parts feeder 6A, 6B Y axis table 7A, 7B Head X axis table 8A, 8B Transfer head 9A, 9B Camera X axis table 10A, 10B, 101A, 102 Camera unit 12, 12A, 12B Camera

Claims (4)

An electronic component mounting apparatus for picking up an electronic component by a transfer head from a component supply unit and transferring and mounting the electronic component on a substrate positioned at a substrate positioning unit, wherein the transfer head holding the electronic component, and the transfer head A component recognition camera that images the held electronic component, a head moving unit that moves the transfer head between the component supply unit and the substrate positioning unit, and a camera movement that moves the component recognition camera in the horizontal direction Means for controlling the head moving means and the camera moving means so that the movement of the component recognition camera by the camera moving means follows the movement of the transfer head by the head moving means, and the component recognition camera And recognition processing means for recognizing the electronic component by performing image processing on the image data captured by the That the electronic component mounting apparatus. An electronic component mounting apparatus, comprising: a plurality of sets of the transfer head and the head moving means, wherein one set of the component recognition camera and the camera moving means captures an image of an electronic component held by each of the plurality of transfer heads. An electronic component mounting method of picking up an electronic component by a transfer head from a component supply unit and transferring and mounting the electronic component on a substrate positioned at a positioning unit, wherein a pickup step of holding the electronic component by the transfer head, A component transfer step of moving the held transfer head from the component supply unit to the substrate positioning unit by the head moving unit; and a transfer of the electronic component held by the transfer head by a component recognition camera that is moved by the camera moving unit during the component transfer. An image capturing step of capturing an image, a recognition processing step of performing image processing of the electronic component by performing image processing of the captured image data, and an electronic processing by moving the transfer head with respect to the substrate based on the recognition processing result. And a component mounting step of mounting the component on the board, in the image capturing step, Electronic component mounting method and controlling the head moving means and the camera moving means so as to follow synchronously moving the component recognition camera by serial camera moving means moves the transfer head by the head moving means. 4. The image capturing step according to claim 3, wherein the component recognizing camera is made to individually and synchronously follow the movement of the plurality of transfer heads moved by individual head moving means by time sharing. Electronic component mounting method.

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