JP2014049574A - Component mounting method, component mounting device, and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for correction of a component mounting position, by measuring the print deviation amount of solder paste in a component mounting process by the configuration of an existing component mounting device.SOLUTION: A component mounting device captures the image of a predetermined area on a substrate where a component is mounted by using means for recognizing the substrate, specifies a position in the predetermined area where the component is mounted and a position where a solder paste is printed, calculates the difference between the mounting position thus specified and the position where a solder paste is printed, corrects the mounting position by using the difference of position thus specified, and then mounts the component at a position corrected, thus enhancing the accuracy of mounting position of a component.

Description

  The present invention relates to a technique for mounting a component on a printed board, and more particularly to a component mounting method, a component mounting apparatus, and a program for mounting an electronic component on a substrate.

  For example, it is necessary to mount many small components on a printed circuit board used for an electrical product or the like, and a component mounting apparatus (chip mounter) that mechanically mounts components on the printed circuit board or the like is usually used. . This makes it possible to efficiently perform the component mounting operation with high throughput. On the other hand, in recent years, along with demands for downsizing electronic devices and the complexity of circuit configuration, miniaturization of printed circuit boards and electronic parts to be mounted on them, and a wide variety of parts are progressing. . For example, it is also required that a plurality of types of minute electronic components are mounted in units of hundreds on a printed circuit board of several centimeters square.

  In a component mounting apparatus for mounting such minute electronic components, components are generally arranged so as to be placed on a solder paste printed in advance at electrode positions on a printed circuit board. For the arranged components, a technique is adopted in which the solder is melted by a reflow apparatus employing a reflow method and the components are mounted.

  At this time, the printing of the solder paste may be shifted with respect to the electrode position on the printed circuit board. When the component is placed on the electrode position in this state, the component is not evenly placed on the solder paste. At this time, if the component to be mounted is, for example, a minute and lightweight component having two terminals, the component is greatly drawn or tilted to one terminal side due to the surface tension of the solder paste that has shifted during reflow, There may be a case where each terminal is not mounted in a state where it is correctly bonded to the electrode.

  Therefore, the amount of misalignment of the solder paste is measured in advance using an inspection head or solder printing inspection machine in the component mounting device, and the component is not positioned at the electrode position but at the position of the solder paste when mounting the component. A technique is known in which each terminal is correctly bonded to an electrode by a self-alignment effect due to the surface tension of the solder paste at the time of reflow by correcting the mounting position so as to be mounted.

  As a technology related to this, for example, Japanese Patent Laid-Open No. 2010-3824 (Patent Document 1) discloses that “a cream solder is printed on a circuit board through a printing mask and an electronic circuit component is printed on the circuit board based on the mounting position data”. An electronic circuit manufacturing method in which an electronic circuit component is temporarily fixed to a circuit board with cream solder printed by placing the solder paste on the circuit board, and then the solder paste is soldered to the circuit board pad by melting the cream solder. Detecting the relative position between the provided mask reference mark and the substrate reference mark provided on the circuit board, and estimating the printing position on the circuit board of the cream solder printed on the circuit board based on the detected relative position, A technique is described in which mounting position data is corrected based on the estimated printing position and an electronic circuit component is mounted on a circuit board.

  Further, for example, in US Patent Application Publication No. 2010/0152877 (Patent Document 2), “a component mounting method for mounting components on a board, in which mounting of components on a predetermined board is repeated” A determination step of determining whether or not a component to be mounted is a predetermined component, and (i) mounting of the predetermined component when it is determined in the determination step that the component to be mounted is the predetermined component. After completion, a technique is described in which the mounting state of the predetermined component is inspected, and (ii) the mounting surface state of the predetermined component is inspected before mounting of the predetermined component is started. ing.

JP 2010-3824 A US Patent Application Publication No. 2010/0152877

  In the component mounting apparatus, it is necessary to further improve the mounting accuracy while maintaining the production efficiency, the throughput, and the like as the components to be mounted are further downsized. On the other hand, for example, in the technique described in Patent Document 1 described above, when a component is actually mounted, the printed circuit board is inspected in advance by an inspection device or the like to measure the amount of printing deviation of the solder paste. It is necessary to keep. In addition, it is necessary for the component mounting apparatus to acquire in advance information on the measured displacement amount from the inspection apparatus or the like. As a result, there is a problem in that the printed circuit board production tact becomes long.

  In this regard, in the technique described in Patent Document 2 described above, an inspection head is provided on the opposite side of the component mounting head across the printed circuit board, and the inspection head is in the process of picking up and transporting the component. Will inspect and measure the amount of misprinting of the solder paste at the position where the parts are to be mounted.

  However, in such a configuration, it is necessary to provide an inspection head separately from the component mounting head in the component mounting apparatus. That is, in a commonly used multi-head component mounting apparatus (for example, one having one component mounting head on both sides of a printed circuit board), one of the component mounting heads is replaced with an inspection head. As a result, the production efficiency drops accordingly.

  On the other hand, it is also conceivable to adopt a configuration in which an inspection head is coupled to a component mounting head in a conventional component mounting apparatus. However, the inspection head normally requires a large illumination system in order to inspect many inspection items such as solder printing and inspection after reflow. Therefore, when the component mounting head and the inspection head are simply coupled, the structure of the component mounting head becomes too large, which may hinder the operation. In addition, in order to avoid illumination, it is necessary to keep a certain distance between the component mounting nozzle of the component mounting head and the camera of the inspection head, and the mounting of the component on the component mounting head and the inspection by the inspection head (imaging with the camera) ) May be difficult at the same time.

  Therefore, an object of the present invention is to provide a component according to the configuration of the existing component mounting device without adding a new configuration such as providing an inspection device in addition to the component mounting device, or providing a test head to the component mounting device. A component mounting apparatus, a component mounting method, a component mounting control program, which can measure the amount of printing deviation of the solder paste on the printed circuit board in the process of mounting on the printed circuit board, and correct the component mounting position based on this And providing a component mounting system.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  The present invention has a component mounting head equipped with a means for recognizing a board, and a component mounting method for mounting an electronic component on a board using the component mounting head, wherein the means for recognizing the board is used. Imaging a predetermined region to which a component on the board is to be mounted, identifying a position where the component in the predetermined region is to be mounted and a position where the solder paste is printed, and the specified position to be mounted And calculating the difference between the printed positions of the solder paste, correcting the position to be mounted using the identified difference in position, and mounting the component to the corrected position; It is characterized by having.

  The present invention is a component mounting apparatus for mounting a plurality of types of electronic components supplied from a component feeder block made up of one or more component feeders on a substrate, wherein one of the component feeder blocks and an area including the substrate are mounted. One or more component mounting heads that are movable above and have a plurality of component mounting members; a substrate recognition camera that can image the substrate; substrate design data that holds design information on the substrate; The path information for holding information related to the procedure and movement path of each component mounting head on the board, and the correction target part whose component mounting position needs to be corrected among the parts to be mounted on the board A storage device that holds a correction target terminal list that holds information relating to the terminal position, and each of the component mounting heads includes the component feeder block in the component feeder block. A component holding cycle in which a predetermined component is held and taken out by a component mounting member from a driver and a component mounting cycle in which the component taken out in the component holding cycle is mounted at a predetermined component mounting position on the substrate are repeatedly executed. A control unit that controls the control unit, and the control unit is further included in the correction target terminal list based on imaging data obtained by imaging a predetermined area of the substrate by the substrate recognition camera at a predetermined timing. Measure the solder paste printing deviation amount for each electrode terminal at the component mounting position on the board of the correction target component, and mount the correction target part on the board based on the printing deviation amount A position correction amount is calculated, and the mounting position correction amount is registered in the correction target terminal list in association with the correction target component. In the component mounting cycle, for each mounting target component to be mounted by each component mounting head, the mounting target component is registered in the correction target terminal list, and information on the corresponding mounting position correction amount is registered. If there is, the component mounting position on the board of the component to be mounted is corrected and mounted based on the mounting position correction amount.

  The present invention can also be applied to a component mounting method in the component mounting apparatus as described above, a program for causing a computer to operate as the component mounting apparatus as described above, and a component mounting system having the component mounting apparatus as described above. it can.

  According to the present invention, it is possible to improve the accuracy of mounting components.

It is the top view which showed the outline | summary about the structural example of the component mounting apparatus which is Embodiment 1 of this invention. It is the bottom view which showed the outline | summary about the structural example of the component mounting head in Embodiment 1 of this invention. It is the figure which showed the outline | summary about the structural example of the component mounting system which has the component mounting apparatus in Embodiment 1 of this invention. It is the figure which showed the outline | summary about the structural example of the control part of the component mounting apparatus in Embodiment 1 of this invention. It is the flowchart which showed the outline | summary about the example of the flow of the component mounting process by the component mounting program in Embodiment 1 of this invention. It is the figure shown about the example of the processing flow in case the some component mounting head operate | moves in parallel in the component mounting process in Embodiment 1 of this invention. It is the figure which simplified and showed the outline | summary about the example of the printed circuit board in Embodiment 1 of this invention. It is a figure which shows an outline | summary about the example of the parallel operation | movement by the some component mounting head in Embodiment 1 of this invention. It is a figure explaining an outline | summary about the printing shift | offset | difference amount of the solder paste with respect to the printed circuit board electrode in Embodiment 1 of this invention. It is the figure which showed the outline | summary about the example of the correction object terminal list which updated the value of the correction amount in the component mounting position of each component in Embodiment 1 of this invention. It is a figure which shows an outline | summary about the example of the parallel operation | movement by the some component mounting head in Embodiment 1 of this invention. It is a figure which shows an outline | summary about the example of the parallel operation | movement by the some component mounting head in Embodiment 1 of this invention. It is a figure explaining an outline | summary about the example of the method of estimating the mounting coordinate correction amount of the components in Embodiment 1 of this invention. It is a figure which shows an outline | summary about the example of the parallel operation | movement by the some component mounting head in Embodiment 1 of this invention. It is the figure which showed the outline | summary about the example in case the component mounting head in Embodiment 2 of this invention images a printed circuit board during a movement. It is the flowchart which showed the outline | summary about the example of the flow of the component mounting process by the component mounting program in Embodiment 2 of this invention. It is the flowchart which showed the outline | summary about the example of the flow of a process which images a component mounting position during the movement of the component mounting head in Embodiment 2 of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

  A component mounting apparatus (chip mounter) according to an embodiment of the present invention is an apparatus that enables a large number of components such as a plurality of types of electronic components to be mounted on an object such as a printed circuit board. . At this time, in consideration of printing deviation of the solder paste with respect to the printed board, the mounting accuracy is improved by correcting the mounting position of the component on the printing position of the solder paste. In addition, in order to obtain the effect of improving the mounting accuracy by mounting the component on the printed solder paste, a component capable of obtaining the self-alignment effect by the solder paste melted at the time of reflow (for example, a light and small size of two terminals) Parts).

  In order to mount a component at the position of the solder paste printed on the printed circuit board, as described above, it is necessary to inspect and measure the amount of misprinting of the solder paste at the mounting position of the target component. In the present embodiment, the addition or change of the configuration such as providing an inspection device or the like different from the component mounting device, providing an inspection head to the component mounting device, or connecting the inspection head to the component mounting head, etc. Measure print misalignment without doing it. In order to realize this, a camera for recognizing a substrate position and an illumination attached to a component mounting head in an existing component mounting apparatus are also used to measure the amount of solder paste printing deviation.

  In other words, unlike general inspection equipment and inspection heads, the board recognition camera that can image on the printed circuit board can be used as an alternative by using the object and purpose of inspection / measurement to measure the amount of misprinting of the solder paste. It can be used. As a result, since the distance between the component mounting nozzle of the component mounting head and the board recognition camera can be kept close, the mounting of the component on the component mounting head and the inspection by the board recognition camera should be performed at the timing from the holding of the component to the mounting. Is possible. This also eliminates the need for operations required for inspection and measurement of print misalignment in parts mounting heads, etc., and measures print misalignment in parallel during normal component mounting processes. It becomes possible to do. Therefore, it is possible to improve the mounting accuracy of component mounting while maintaining production efficiency.

<Embodiment 1>
FIG. 1 is a top view showing an outline of a configuration example of a component mounting apparatus according to the first embodiment of the present invention. FIG. 1 shows a configuration example of a part related to a mechanism for performing component mounting in the component mounting apparatus 100. The horizontal direction in the drawing is the X-axis direction and the vertical direction is the Y-axis direction. The state seen from above is shown.

  The component mounting apparatus 100 includes, for example, a component feeder block 110 (two component feeder blocks A (110a) and B (100b) in the example of FIG. 1), a Y beam 120, and an X beam 130 (an X beam in the example of FIG. 1). A (130a) and B (130b), the component recognition camera 140 (two components recognition cameras A (140a) and B (140b) in the example of FIG. 1), and the component mounting head 150 (example of FIG. 1). In FIG. 1, the component mounting heads A (150a) and B (150b) are two), the board recognition camera 160 (two board recognition cameras A (160a) and B (160b) in the example of FIG. 1), the printed board conveyance path 170, and the like. It has each part.

  On the printed board conveyance path 170, a printed board 180 to which components are to be mounted is fixed and arranged. The printed circuit board may be any board as long as the board can be mounted with a component mounting apparatus such as a flexible board. In addition, a plurality of substrate recognition marks 181 and a plurality of printed circuit board electrodes 182 are provided on the printed circuit board 180, and a solder paste 183 is printed on each printed circuit board electrode 182 by a printing device or the like in advance. Yes.

  In the example of FIG. 1, the components are mounted on the component mounting head 150, one on each side in the Y axis direction, with respect to the printed circuit board conveyance path 170 that conveys the printed circuit board 180 in the X axis direction and fixes the printed circuit board 180 at a predetermined position. The component feeder blocks 110 for supplying the components are respectively arranged. Each component feeder block 110 includes a plurality of component feeders 111 that hold a plurality of predetermined types of components in the X-axis direction, and can supply a plurality of types of components to the component mounting head 150. Is possible.

  Further, a set of Y beams 120 are disposed along the Y-axis direction on both sides of each component feeder block 110 in the X-axis direction. Further, one or more (two in the example of FIG. 1) X beams 130 are arranged along the X-axis direction orthogonal to the Y beam 120. The angle between the Y beam and the X beam is orthogonal, but may include a mechanical error. In addition, one component mounting head 150 is attached to each X beam 130. In addition, a component recognition camera 140 is disposed between the printed circuit board conveyance path 170 and each component feeder block 110.

  The printed circuit board conveyance path 170 conveys and fixes the printed circuit board 180 in the X-axis direction so that the printed circuit board 180 is disposed between the pair of Y beams 120 under the control of a control unit described later. Each X beam 130 and component mounting head 150 correspond to each component feeder block 110, and each X beam 130 is an upper part including the corresponding component feeder block 110 and printed circuit board 180 under the control of the control unit. This region has a stroke that can move in the Y-axis direction along the Y beam 120. Each component mounting head 150 has a stroke that can move in the X-axis direction along the X beam 130 in the region between the pair of Y beams 120 under the control of the control unit.

  By combining the stroke in the Y-axis direction of the X beam 130 and the stroke in the X-axis direction of the component mounting head 150, for example, the component mounting head A (150a) is placed on a predetermined component feeder 111 in the component feeder block A (110a). After removing the component by suction or the like, it can be moved to a predetermined position on the printed circuit board 180 to mount the component. Similarly, the component mounting head B (150b) is moved onto a predetermined component feeder 111 in the component feeder block B (110b), taken out, and then moved to a predetermined position on the printed circuit board 180 for mounting. Is possible.

  FIG. 2 is a bottom view showing an outline of a configuration example of the component mounting head 150. The component mounting head 150 takes out a plurality (types) of components from one or more component feeders 111 in the component feeder block 110, and mounts the extracted components at predetermined positions on the printed circuit board 180. For example, a plurality of (12 in the example of FIG. 2) component mounting nozzles 151, a board recognition camera 160, and a ring illumination 162 are provided.

  The component mounting head 150 is attached to the X beam 130 and is driven by the X beam 130 to have a stroke that can move in the X axis direction. Further, the target component mounting nozzle 151 is moved so that the nozzle for taking out and mounting the component among the plurality of component mounting nozzles 151 is arranged at a predetermined operable position. In the example of FIG. 2, since the component mounting nozzles 151 are arranged in a circular shape, these components are rotated on the XY plane to sequentially move the target component mounting nozzle 151 to a predetermined operable position. Note that the arrangement configuration and number of the component mounting nozzles 151 are not limited to those in the example of FIG. For example, it may be arranged in a plurality of rows instead of a circle.

  Further, the component mounting head 150 has a stroke in which a part or all of the component mounting head 150 including the component mounting nozzle 151 can be moved in the vertical direction in order to take out and mount components by the target component mounting nozzle 151. That is, by such movement or the like, the component is taken out by suction or the like (for example, using air pressure or the like) at the tip of the component mounting nozzle 151, and the posture of the held component is adjusted and released at a predetermined position on the printed circuit board 180. It is possible to install the parts. The component mounting nozzle 151 may be appropriately replaceable with a different characteristic depending on the type of component to be sucked.

  In this embodiment, the component mounting head 150 uses a component mounting nozzle 151 that picks up and holds a component as a member (component mounting member) that picks up and holds the component and mounts the component. The member is not limited to this. For example, the component can be held even by component mounting means using a chuck or the like that takes out and holds the component. Further, a method for driving the component mounting head 150 and the component mounting nozzle 151 (and other drive mechanisms in the component mounting apparatus 100) is not particularly limited. For example, in addition to a rack and pinion mechanism, a piezo actuator, a linear motor, or the like. Various known techniques can be used as appropriate.

  A board recognition camera 160 is attached to the component mounting head 150. In addition, a ring illumination 162 is provided as a light source for imaging with the substrate recognition camera 160. These configurations are for imaging the board recognition mark 181 on the printed board 180 and recognizing the position of the printed board 180 by image processing. Therefore, a large-scale configuration such as a high-performance camera or a large illumination used in an inspection apparatus, an inspection head, or the like is not required, and the configuration can be downsized. As a result, it can arrange | position in the vicinity of the component mounting nozzle 151, and can make the field | area near the position where the component mounting nozzle 151 mounts a component on the printed circuit board 180 into a visual field.

  In the present embodiment, as described above, the object to be imaged by the board recognition camera 160 is not limited to the board recognition mark 181, and the printed board electrode 182 is measured in order to measure the amount of printing deviation of the solder paste 183 with respect to the printed board electrode 182. The solder paste 183 is also imaged. Therefore, in the present embodiment, the performance of the board recognition camera 160 may be as much as necessary to achieve the above-mentioned purpose, and the light source having a simple configuration such as the ring illumination 162 is used. It can be used as appropriate.

  FIG. 3 is a diagram showing an outline of a configuration example of a component mounting system having the component mounting apparatus 100 of the present embodiment. The component mounting system 1 includes the component mounting apparatus 100 described above and a component mounting setting server 300 for generating control information for the component mounting apparatus 100 to perform mounting processing. In addition to the structure shown in FIGS. 1 and 2, the component mounting apparatus 100 includes a control unit 200 described later that controls the operation of each structure related to the component mounting process.

  In the component mounting apparatus 100, a large amount of minute electronic components are mounted on the printed circuit board 180. For this reason, the component mounting apparatus 100 needs to be given control information indicating which type of component is mounted at which position on the printed circuit board 180. At this time, in particular, in the component mounting apparatus 100 having the plurality of component mounting heads 150 as in the present embodiment, the operation of the plurality of heads can be efficiently mounted so as not to interfere with each other. It is necessary to optimize and control the head operation path and the component mounting order.

  In the present embodiment, the optimum route searching unit 310 of the component placement setting server 300 receives as input the board design data 401 and the like designed and created by the board design system 400 such as a CAD (Computer Aided Design) system. It is assumed that the operation path of the head 150 is optimized and output as optimum path information 311. The board design data 401 includes, for example, the dimensions of the printed board 180, the coordinate origin position of the printed board 180, the coordinates from the origin of the board recognition mark 181 attached to the printed board 180, for each type of the printed board 180, Information such as the type, type, shape, body width, body length, body height, number of terminals, terminal shape, position, terminal width, terminal length, terminal height, mounting coordinates, and angle of the parts to be mounted on the printed circuit board 180 Shall be included.

  Various techniques for optimizing the operation path of each component mounting head 150 have been researched and developed. In the present embodiment, these existing techniques, algorithms, and the like can be appropriately selected and used. . The output optimum path information 311 and the board design data 401 generated by the board design system 400 are input to the control unit 200 of the component mounting apparatus 100.

  Furthermore, in the present embodiment, the correction target terminal list generation unit 320 of the component mounting setting server 300 corrects the component mounting position based on the printing deviation amount of the solder paste 183 among all components mounted on the printed circuit board 180. A list of target parts is generated and output as a correction target terminal list 321. As described above, it is a small and lightweight component mainly having a plurality of terminals that is likely to have a problem when the component is mounted due to the printing deviation of the solder paste 183. Therefore, in the present embodiment, based on the board design data 401, a component to be corrected for the printing position (for example, a two-terminal component smaller than a predetermined size and weight) is extracted and a correction target terminal list to be described later. 321 is generated and output. Each unit including the optimum route searching unit 310 and the correction target terminal list generating unit 320 in the component mounting setting server 300 can be implemented as a software program, for example.

  FIG. 4 is a diagram illustrating an outline of a configuration example of the control unit 200 of the component mounting apparatus 100. The control unit 200 includes, for example, an interface 201, an MPU (Micro-Processing Unit) 202, a RAM (Random Access Memory) 203, a ROM (Read Only Memory) 204, an external storage device 205, an LCD (Liquid Crystal Display) touch panel 206, a bar A code reader 207, a board recognition image processing circuit 208, a solder print image processing circuit 209, a part recognition image processing circuit 210, a part feeder driving circuit 211, a part mounting head driving circuit 213, a board conveying path driving circuit 215, and the like.

  When the power of the control unit 200 is turned on, the activation program stored in the ROM 204 is executed by the MPU 202. In the startup process, each device or circuit connected to the interface 201 is initialized, and then each driving unit (a component feeder driving unit 212, a component mounting head driving unit 214, a board conveyance path driving unit 216, etc.) is operated. Then, each mechanism unit such as each component feeder 111 and component mounting head 150 is stopped at a predetermined standby position. Thereafter, the component mounting program held in the external storage device 205 is executed by the MPU 202.

  The component mounting program inputs component supply information (for example, which type of component is held in which component feeder 111) by the barcode reader 207 or the like, and the type and number of printed circuit boards 180 to be produced by the LCD touch panel 206. Then, it enters a waiting state for receiving an input such as a production start instruction. When a production start instruction is received via the LCD touch panel 206 or the like, a process for mounting components on the printed circuit board 180 is started according to the following processing flow.

  FIG. 5 is a flowchart showing an outline of an example of the flow of component mounting processing by the component mounting program. Here, an example of the flow of processing when a component is mounted on one printed board 180 will be described. Therefore, in order to continuously execute the mounting of the components on the plurality of printed circuit boards 180, the series of processes shown in the process flow of FIG. 5 is repeated as appropriate.

  First, before starting the component mounting process, as an initial process, input of various setting information from a person in charge of operation of the component mounting apparatus 100 (hereinafter sometimes simply referred to as “user”) is received and externally stored. It is held in the device 205 (S01). For example, the size of the component for each component model, the type of the component mounting nozzle 151 that can be used, the speed and acceleration in the X-axis and Y-axis directions when the component is transported by the component mounting head 150, and the component mounting nozzle 151 are moved up and down. Component information including information such as the speed and acceleration at the time of falling, the height at the time of lowering, and the like is stored in the external storage device 205. Similarly, information such as an image recognition method by the board recognition camera 160 and the component recognition camera 140, and an image recognition method by the board recognition image processing circuit 208, the solder print image processing circuit 209, and the part recognition image processing circuit 210 are also stored. .

  Further, a component feeder 111 that holds components to be mounted on the printed circuit board 180 for each type (type) is arranged in advance as a component feeder block 110 by the user. In addition, any type of component (component feeder 111) can be obtained by the user reading the component type information affixed to the component feeder 111 supplied from the component manufacturer by the barcode reader 207 or inputting it via the LCD touch panel 206. Is acquired in which position in the parts feeder block 110 is acquired. Based on the information and the above component information, for each component type, the component mounting nozzle 151 of the component mounting head 150 calculates in advance the stop coordinates when the component is taken out from the component feeder 111 in the component feeder block 110, and the external Saved in the storage device 205.

  Further, as shown in FIG. 3, the board design data 401 generated by the board design system 400 or the like, the optimum path information 311 generated by the optimum path search unit 310 of the component mounting setting server 300, and the correction target terminal list generation Information on the correction target terminal list 321 generated by the unit 320 is also stored in the external storage device 205. Further, according to the dimensions of the printed circuit board 180, a position where the printed circuit board 180 is fixed on the printed circuit board conveyance path 170 is set, or the input of the information from the user is accepted. And may be stored in the external storage device 205.

  The component mounting on the printed circuit board 180 is realized by repeating a component mounting cycle constituted by a component suction cycle and a component mounting cycle until all necessary components are mounted on the printed circuit board 180, as will be described later. . In the component suction cycle, the component mounting head 150 is moved onto the component feeder block 110, and a plurality of specified components are sucked from the component feeder 111 by the specified component mounting nozzle 151. In the component mounting cycle, after the orientation of each sucked component is measured, the component mounting head 150 is moved onto the printed circuit board 180, and each sucked component is mounted at a designated position on the printed circuit board 180.

  Here, in each component mounting cycle, the procedure by which the component mounting head 150 sucks components in each component suction cycle and the procedure by which the component mounting head 150 mounts components in each component mounting cycle Such information is determined in advance based on the board design data 401, the optimum route information 311 and the like, and these pieces of information are stored in the external storage device 205 as component mounting cycle information.

  In this information, for example, in each component suction cycle, the component mounting head 150 is moved to which position on the component feeder block 110, and in which order the component mounting nozzle 151 is used and which component feeder 111 is suctioned. Information on whether or not to be performed, imaging conditions of the component recognition camera 140 for measuring the posture of the component after suction, a recognition method, and the like are included. Further, in each component mounting cycle, the component mounting head 150 is moved to which position, and in which order the component suction nozzle 151 is mounted to which position on the printed circuit board 180 and in which direction. Contains information.

  When various setting information is held in the external storage device 205, the user inputs information such as a model via the LCD touch panel 206 as information for specifying the printed circuit board 180 to be produced, and instructs the start of production. Production by mounting parts to 180 is started (S02). When production is started, first, component mounting cycle information held in the external storage device 205, board design data 401 for a specified printed circuit board 180, a correction target terminal list 321 and the like are read and stored in the RAM 203. (S03). Next, the printed circuit board 180 is conveyed on the printed circuit board conveyance path 170 in accordance with the information on the fixed position of the printed circuit board 180 set in the read circuit board design data 401 and the like, and the printed circuit board 180 is fixed to the designated fixed position. (S04).

  In the subsequent processing, when the component mounting apparatus 100 has a plurality of component mounting heads 150 as shown in FIG. 1, in principle, each component mounting head 150 operates individually and in parallel. It is assumed that the component mounting heads 150 are controlled so as not to interfere with each other based on the component mounting cycle information based on the contents such as 311. Details of the parallel operation between the plurality of component mounting heads 150 will be described later.

  First, based on the board design data 401, the optimum path information 311, the correction target terminal list 321 and the like, the component mounting head 150 at the time of recognition of a board recognition mark 181 on a printed circuit board 180, which will be described later, out of the parts targeted for mounting position correction. An imaging terminal list that is a list of parts (terminals) capable of measuring the printing displacement amount of the solder paste 183 is created at each movement destination (S05). That is, when the board recognition camera 160 attached to the component mounting head 150 by the process described later takes an image of the board recognition mark 181 in order to grasp the position of the printed board 180, a component (terminal) included in the imaging data (that is, a terminal) Among the components (terminals) included in the field of view of the board recognition camera 160, those included in the correction target terminal list 321 are extracted and used as the imaging terminal list when the printed board 180 is recognized.

  After that, before the start of the component mounting cycle, a predetermined board recognition mark 181 on the printed board 180 is imaged by the board recognition camera 160 attached to the predetermined component mounting head 150 as necessary, and the printed board conveyance path 170 is obtained. The position of the printed circuit board 180 fixed on the top is grasped. In this process, as described above, when there are a plurality of component mounting heads 150, different board recognition marks 181 can be individually recognized in parallel. For example, the number of component mounting heads 150 If there are more than the number of board recognition marks 181, there is a case where it is not executed depending on the component mounting head 150.

  In grasping the position of the printed circuit board 180, first, according to the coordinate information of the circuit board recognition mark 181 of the printed circuit board 180 defined in the circuit board design data 401, the target circuit board recognition mark 181 prints the designated component mounting head 150. It is moved to the vicinity of the position (the position where the board recognition mark 181 enters the field of view of the board recognition camera 160 attached to the component mounting head 150) (S06). Thereafter, the image is picked up by the board recognition camera 160, the position of the board recognition mark 181 is detected from the picked-up data by the image processing of the board recognition image processing circuit 208, and the coordinate information is stored in the RAM 203 (S07). As a result, the origin position of the coordinate system for arranging components on the printed circuit board 180 is grasped.

  At the same time, as will be described later, the components (terminals) included in the imaging terminal list created in step S05 are processed by the image processing of the solder print image processing circuit 209 from the data captured by the board recognition camera 160. The amount of printing deviation between the printed circuit board electrode 182 and the solder paste 183 is measured, and the correction amount of the mounting position for the component is calculated (S07). The calculated correction amount information is added and registered in the entry of the target component (terminal) in the correction target terminal list 321, for example. If one component mounting head 150 needs to detect a plurality of board recognition marks 181, the processes of steps S 06 and S 07 are repeated.

  Thereafter, loop processing of the component mounting cycle is started (S08). First, as a preparation process, the component mounting head 150 is moved to a predetermined position on the corresponding component feeder block 110 as necessary (S09). When the component mounting head 150 already exists on the component feeder block 110, such as in an initial state immediately after the component mounting apparatus 100 is activated, this processing is not necessary.

  Thereafter, based on the component mounting cycle information read in step S03, first, a loop process of the component suction cycle is started (S10). In the component adsorption cycle, first, the component mounting head 150 is designated in the component feeder block 110 by driving the X beam 130 in the Y axis direction by the Y beam 120 and driving the component mounting head 150 in the X axis direction by the X beam 130. It moves on the part feeder 111 that has been made (S11). Next, the component mounting head 150 drives and lowers the component mounting nozzle 151 with respect to the specified component feeder 111 in the component feeder block 110, and the specified component is picked up by the component mounting nozzle 151 and taken out ( S12).

  Here, when the suction of all the components to be mounted in one component mounting cycle is not completed (there is a component mounting nozzle 151 in a state where the components should not be sucked yet), the suction of all the components is The above-described component adsorption cycle loop process is repeated until completion (S13, S10). When the suction of all the components is completed, the loop processing of the component suction cycle is finished (S13), and the suction posture of the component sucked by each component mounting nozzle 151 is measured (S14). Here, the component mounting head 150 is moved onto the component recognition camera 140, and each sucked component is imaged by the component recognition camera 140. With respect to the obtained imaging data, the orientation such as the suction center position of the component is calculated by image processing in the component recognition image processing circuit 210, and the result is stored in the RAM 203.

  Next, in the same manner as in the above step S05, based on the board design data 401, the optimum route information 311 and the correction target terminal list 321, the component mounting in the component mounting cycle, which will be described later, among the components subject to mounting position correction. Sometimes, at each destination of the component mounting head 150, an imaging terminal list including components (terminals) capable of measuring the printing deviation amount of the solder paste 183 is created (S15). That is, when the board recognition camera 160 attached to the part mounting head 150 captures an image on the printed circuit board 180 at the time of component mounting described later, the component (terminal) included in the imaging data (that is, included in the field of view of the board recognition camera 160). Components (terminals)) that are included in the correction target terminal list 321 and that are not mounted are extracted and used as an imaging terminal list at the time of mounting the component. In the case of recognition of the printed circuit board 180 described above, since all components are not mounted, it is not necessary to determine whether or not they are mounted.

  Next, the component mounting cycle loop process is started based on the component mounting cycle information read in step S03 (S16). In the component mounting cycle, first, the component mounting head 150 is designated on the printed circuit board 180 by driving the Y beam 120 in the Y axis direction of the X beam 130 and driving the component mounting head 150 in the X axis direction by the X beam 130. (S17). At this time, if the component (terminal) to be mounted is included in the correction target terminal list 321, the correction amount of the mounting position for the component is acquired from the correction target terminal list 321, and based on this, the component mounting head is acquired. The movement position of 150 is corrected. It should be noted that the position of the component sucked by the component mounting nozzle 151 is also determined by referring to posture information such as the suction center position of the component measured in step S14.

  Thereafter, the component mounting head 150 drives and lowers the component mounting nozzle 151 with respect to the solder paste 183 printed at the mounting position of the target component (terminal) on the printed circuit board 180 to mount the sucked component. (S18). At the same time, the printed circuit board 180 is imaged by the board recognition camera 160. As will be described later, the printed circuit board for the components (terminals) included in the imaging terminal list created in step S15 by the image processing of the solder print image processing circuit 209 from the obtained imaging data in the same manner as the processing in step S07. The amount of printing deviation between the electrode 182 and the solder paste 183 is measured, and the correction amount of the mounting position for the component is calculated (S18). The calculated correction amount information is added and registered in the entry of the target component (terminal) in the correction target terminal list 321, for example.

  Here, when the mounting of all the components to be mounted in one component mounting cycle has not been completed (there is a component mounting nozzle 151 in a state in which the components are still sucked), the above-described operation is performed until the mounting of all the components is completed. The component mounting cycle loop process is repeated (S19, S16). If the mounting of all the components is completed, the loop processing of the component mounting cycle is finished (S19). At this time, if all the component mounting cycles are not completed, the above-described component mounting cycle processing is repeated until all the component mounting cycles are completed (S20, S08). When all the component mounting cycles are completed, the loop processing of the component mounting cycle is ended (S20), and thereby the component mounting processing for one printed circuit board 180 is completed.

  FIG. 6 is a diagram showing an example of a processing flow when a plurality of component mounting heads 150 operate in parallel in the component mounting process. Here, the processing after step S05 in the processing flow of FIG. 5 will be described by taking as an example the case where the component mounting head A (150a) and the component mounting head B (150b) in the example of FIG. .

  FIG. 7 is a diagram showing a simplified outline of an example of a printed circuit board 180 on which components are to be mounted in the example of the processing flow of FIG. In order to enable the component mounting apparatus 100 to recognize the position when the printed circuit board 180 is fixed on the printed circuit board conveyance path 170, a plurality of circuit board recognition marks 181 (in the example of FIG. Marks 1 to 3 (three of 181-1 to 3)) are previously attached by printing or the like. It is assumed that the board recognition mark 181 is mainly attached to the end of the printed circuit board 180. In this embodiment, three or more board recognition marks 181 are attached in order to improve the accuracy of the position recognition of the printed circuit board 180. It shall be. In addition, component mounting positions 184 are defined for all components mounted on the printed circuit board 180. Each component mounting position 184 includes a printed circuit board electrode 182 and a solder paste 183 printed thereon, as shown.

  In FIG. 6, in the parallel operation, the component mounting head A (150a) and the component mounting head B (150b) first create an imaging terminal list at the time of board recognition (S31, S51). Here, in the present embodiment, in the recognition of the printed circuit board 180 shown in FIG. 7, the component mounting head A (150a) uses the board recognition mark 1 (181-1) and the board recognition mark 2 (181-2). The component mounting head B (150b) captures and recognizes the board recognition mark 3 (181-3).

  Accordingly, in step S31, among the components (terminals) included in the correction target terminal list 321, the substrate recognition camera 160A (160a) attached to the component mounting head A (150a) is replaced with the substrate recognition mark 1 (181-1). And, in order to recognize the board recognition mark 2 (181-2), the parts (terminals) included in the field of view when the vicinity is imaged are output as an imaging terminal list. In step S51, the board recognition camera 160B (160b) attached to the component mounting head B (150b) among the parts (terminals) included in the correction target terminal list 321 is the board recognition mark 3 (181-3). In order to recognize the component, a part (terminal) included in the field of view when the vicinity is imaged is output as an imaging terminal list.

  Thereafter, as shown in FIG. 8, the component mounting head A (150a) performs processing for recognizing the substrate recognition mark 1 (181-1), and in parallel with this, the component mounting head B (150b) Processing for recognizing the recognition mark 3 (181-3) is performed.

  For the component mounting head A (150a), the substrate recognition mark 1 (181-1) is set by the substrate recognition camera A (160a) from the initial position (for example, a predetermined position on the component feeder block A (110a)). Move to a position where imaging is possible (S32). At that position, the board recognition camera A (160a) images the board recognition mark 1 (181-1) (S33), and the board recognition image processing circuit 208 determines the position of the board recognition mark 1 (181-1) from the imaging data. Measure (S34).

  Further, components (terminals) included in the imaging data, that is, components (terminals) included in the board recognition camera A field of view 161a, which are included in the imaging terminal list, are subjected to solder paste 183 by the solder print image processing circuit 209. The printing position is measured, and based on this, the printing deviation amount of the solder paste 183 with respect to the printed circuit board electrode 182 is measured (S35). Further, the correction amount of the mounting position in the target component (component mounting position 184) is calculated based on the measured printing deviation amount, and the entry of the target component in the correction target terminal list 321 is updated (S36).

  FIG. 9 is a diagram for explaining the outline of the printing deviation amount of the solder paste 183 with respect to the printed circuit board electrode 182. Corresponding solder pastes 183-1 and 183-2 are shifted and printed with respect to the printed circuit board electrodes 182-1 and 182-2 respectively corresponding to the two terminals of the component 185 (shaded portions in the component 185 in the figure). It shows the state being done. Here, the amount of printing deviation is represented, for example, by the deviation in the x-axis direction and the y-axis direction of the center position coordinates of each terminal between the printed board electrode 182 and the solder paste 183. In the example of FIG. 9, the shapes of the printed circuit board electrode 182 and the solder paste 183 are rectangular, and the center position coordinates are indicated accordingly. However, in the case of other shapes, the center position coordinates are appropriately set accordingly. do it.

  FIG. 10 is a diagram showing an outline of an example of the correction target terminal list 321 in which the value of the correction amount at each component mounting position is updated. As described above, the correction target terminal list 321 is a table that holds information on components that need to be corrected and their correction amounts, and is generated by the correction target terminal list generation unit 320 of the component mounting setting server 300. , Input to the control unit 200 of the component mounting apparatus 100.

  The correction target terminal list 321 includes items such as a part number, a terminal number, a terminal center coordinate, a printing center coordinate, and a mounting coordinate correction amount, for example. The part number item holds information such as an ID and a sequence number that uniquely specify a part on the printed circuit board 180. The terminal number item holds information on numbers set for each terminal in order to identify each terminal in the target component. In the example of FIG. 10, the case where the component to be corrected has two terminals is shown.

  The items of the terminal center coordinate and the printing center coordinate are respectively the center position of the terminal of the printed circuit board electrode 182 acquired from the circuit board design data 401 and the solder paste 183 recognized by image processing from the image data captured by the circuit board recognition camera 160. Holds information on the x and y coordinates of the center position calculated for the terminal portion. The item “mounting coordinate correction amount” holds information on the correction amount of the mounting position calculated based on the printing deviation amount obtained based on the item of terminal center coordinates and printing center coordinates for the target component. Note that in the correction target terminal list 321 in the initial state, values are set only for the above-described part number, terminal number, and terminal center coordinate items, and the other items thereafter are blank.

  In the example of FIG. 10, the component mounting positions of the components with the component numbers “1” and “3” are imaged by the substrate recognition camera 160, and the center coordinates of the terminals of the printed circuit board electrodes 182 and the terminal portions of the solder paste 183 are calculated. In addition, the attached coordinate correction amount is calculated based on these values. In the present embodiment, the mounting coordinate correction amount is expressed by, for example, dx and dy that are correction amounts in the x-axis direction and the y-axis direction with respect to the center position coordinates of the entire component, and dθ that is a rotation angle on the xy plane. And For example, for the component with the part number “1”, the center coordinates ((x11, y11) and (x12, y12)) of each terminal of the printed circuit board electrode 182 and the center coordinates ((sx11, sy11) of the corresponding solder paste 183. ) And (sx12, sy12)), the correction amounts dx1, dy1, and dθ1 can be obtained by the following equations.

  On the other hand, in FIG. 6, similarly, the component mounting head B (150b) is recognized by the substrate recognition camera B (160b) from the initial position (for example, a predetermined position on the component feeder block B (110b)). The mark 3 (181-3) is moved to a position where it can be imaged (S52). At that position, the substrate recognition mark 3 (181-3) is imaged by the substrate recognition camera B (160b) (S53), and the position of the substrate recognition mark 3 (181-3) is determined by the substrate recognition image processing circuit 208 from the imaging data. Measure (S54).

  Further, components (terminals) included in the imaging data, that is, components (terminals) included in the board recognition camera B field of view 161b, included in the imaging terminal list, are applied by the solder print image processing circuit 209 to the solder paste 183. The printing position is measured, and based on this, the printing deviation amount of the solder paste 183 with respect to the printed circuit board electrode 182 is measured (S55). Further, the mounting coordinate correction amount at the target component (component mounting position 184) is calculated based on the measured printing deviation amount, and the entry of the target component in the correction target terminal list 321 is updated (S56).

  Thereafter, as shown in FIG. 11, the component mounting head A (150a) performs processing for recognizing the board recognition mark 2 (181-2), and in parallel with this, the component mounting head B (150b) performs component processing. A component suction cycle is performed in which the components are sucked and taken out from the feeder block B (110b).

  As for the component mounting head A (150a), the board recognition mark 2 (181-2) can be imaged by the board recognition camera A (160a) from the position where the board recognition mark 1 (181-1) is recognized, as described above. (S37). At that position, the substrate recognition mark 2 (181-2) is imaged by the substrate recognition camera A (160a) (S38), and the position of the substrate recognition mark 2 (181-2) is determined from the imaging data by the substrate recognition image processing circuit 208. Measure (S39).

  Further, components (terminals) included in the imaging data, that is, components (terminals) included in the board recognition camera A field of view 161a, which are included in the imaging terminal list, are subjected to solder paste 183 by the solder print image processing circuit 209. The printing position is measured, and based on this, the printing deviation amount of the solder paste 183 with respect to the printed circuit board electrode 182 is measured (S40). Further, a mounting coordinate correction amount at the target component (component mounting position 184) is calculated based on the measured printing deviation amount, and the entry of the target component in the correction target terminal list 321 is updated (S41).

  On the other hand, the component mounting head B (150b) is moved onto the component feeder block B (110b) from the position where the board recognition mark 3 (181-3) is recognized in order to execute the component adsorption cycle (S57), 1 The components are sucked and taken out from two or more predetermined component feeders 111 (S58). Thereafter, the component mounting head B (150b) is moved onto the component recognition camera B (140b) (S59), and each sucked component is imaged by the component recognition camera B (140b), and the posture such as the suction center position of the component is determined. Measure (S60). Since the component mounting head B (150b) does not stop on the printed circuit board 180 in the component adsorption cycle, the component mounting position is not imaged by the substrate recognition camera B (160b).

  After that, as shown in FIG. 12, a component suction cycle is performed in which the components are picked up from the component feeder block A (110a) by the component mounting head A (150a). Since the processing here (steps S42 to S45 in FIG. 6) is the same as the component adsorption cycle (steps S57 to S60) of the component mounting head B (150b) described above, description thereof will be omitted. In parallel with the component adsorption cycle of the component mounting head A (150a), the component mounting cycle for mounting the component at a predetermined component mounting position on the printed circuit board 180 is executed by the component mounting head B (150b).

  For the component mounting head B (150b), first, an imaging terminal list at the time of component mounting is created (S61). Here, a component (terminal) that is included in the field of view when the printed circuit board 180 is imaged by the substrate recognition camera B (160b) and is not mounted at the component mounting position 184 where the component is to be mounted in the component mounting cycle. Output as an imaging terminal list.

  Thereafter, in order to execute a component mounting cycle, the component is moved from the position where the component is imaged on the component recognition camera B (140b) to a predetermined component mounting position on the printed circuit board 180 specified by the component mounting cycle information (S62). . At this time, if the component (terminal) to be mounted is included in the correction target terminal list 321, the mounting coordinate correction value (dx, dy, dθ) in the entry is acquired, and the component mounting is performed based on this. The movement position of the head B (150b) is corrected.

  At this time, the component (terminal) to be mounted is included in the correction target terminal list 321, but there may be a case where the value of the mounting coordinate correction amount is not registered in the entry. In particular, when the component mounting process has not started, since there are few component mounting positions 184 whose mounting coordinate correction amounts have already been measured by imaging by the board recognition camera 160, the mounting coordinate correction amount has not been measured. Is likely to occur.

  In the present embodiment, the correction amount is estimated so that the mounting position can be corrected as much as possible even in such a case. FIG. 13 is a diagram for explaining an outline of an example of a method for estimating the component mounting coordinate correction amount. Here, the amount of correction for an unmeasured part (terminal) is estimated from the amount of correction for a plurality of measured parts (terminals) that are present in the vicinity of the unmeasured part (terminal) whose mounting position is to be estimated To do.

  In the example of FIG. 13, the mounting coordinate correction amount has already been measured for the component having the terminal 1 (x1, y1) and the terminal 2 (x2, y2), but the component having the terminal 3 (x3, y3). Indicates a state in which it is not measured. When trying to mount a part including the terminal 3 in this state, the mounting position correction cannot be performed because the mounting coordinate correction amount is not registered in the correction target terminal list 321. Therefore, in the present embodiment, two or more measured parts (parts each having the terminal 1 and the terminal 2 in the example of FIG. 13) are selected in the order from the terminal 3, and the correction amount in each of these parts is selected. It shall be estimated by interpolation or extrapolation according to the positional relationship (distance) between components (terminals).

  For example, for the correction amount dx in the x-axis direction, the x coordinate x3 of the terminal 3 is set between the correction amount dx1 with respect to the x coordinate x1 of the terminal 1 and the correction amount dx2 with respect to the x coordinate x2 of the terminal 2, as shown in the figure. Interpolation is performed to obtain a correction amount dx3. Similarly, with respect to the correction amount dy in the y-axis direction, as shown in the drawing, the correction amount dy2 for the y coordinate y2 of the terminal 2 and the correction amount dy1 for the y coordinate y1 of the terminal 1 with respect to the y coordinate y3 of the terminal 3 Is extrapolated to obtain a correction amount dy3. The correction amount for the rotation angle correction amount dθ can be obtained by the same method. The above estimation method is merely an example, and the present invention is not limited to this. Further, the correction amount obtained by the estimation may be registered in the correction target terminal list 321 so as to be a reference for estimation in other components (terminals), or by the board recognition camera 160 without being registered. Only the correction amount measured by actual imaging may be used as a reference.

  Thereafter, referring to the posture information such as the suction center position of the component measured in step S60, the position of the component sucked by the component mounting nozzle 151 is corrected (S63), and the component is placed on the solder paste 183 at the position. (S64). Then, the board | substrate recognition camera B (160b) images the area | region of the said component mounting position 184 vicinity on the printed circuit board 180 (S65).

  Thereafter, components (terminals) included in the imaging data, that is, components (terminals) included in the board recognition camera B field of view 161b, which are included in the imaging terminal list at the time of component mounting, are processed by the solder print image processing circuit 209. The printing position of the solder paste 183 is measured, and based on this, the printing deviation amount of the solder paste 183 with respect to the printed circuit board electrode 182 is measured (S66). Further, the mounting coordinate correction amount at the target component (component mounting position 184) is calculated based on the measured printing deviation amount, and the entry of the target component (terminal) in the correction target terminal list 321 is updated (S67).

  After that, as shown in FIG. 14, a component mounting cycle is executed by the component mounting head A (150a) (S46-), and in parallel with this, a component suction cycle is executed by the component mounting head B (150b). (S68-). Thereafter, in principle, the above-described component adsorption cycle and component mounting cycle are alternately repeated until the mounting of all components is completed.

  In such a series of processes, in the component mounting apparatus 100, the substrate recognition camera 160 that is normally provided integrally with or attached to the component mounting head 150 is used to perform unnecessary processing and mechanism part. Without performing the operation as much as possible, it is possible to measure the printing deviation amount of the solder paste 183 and obtain the mounting coordinate correction amount at the time of mounting the component, thereby improving the accuracy of component mounting.

  In the example of FIG. 6, imaging of the component mounting position 184 (for example, step S65) by the board recognition camera 160 is performed after component mounting (for example, step S64), but the component mounting head 150 is stopped. If so, it may be before component mounting. In this case, it is theoretically possible to calculate the mounting coordinate correction amount (for example, steps S66 and S67) for the target component and immediately correct the position of the component mounting head 150 before mounting the component. The above is possible, and in this case, the mounting coordinate correction amount estimation process as described above is not necessary. However, in terms of mounting, it is practically difficult to cope with the component mounting head 150 of the general component mounting apparatus 100 due to the relationship of the operation speed in the mechanical structure.

  In the present embodiment, as described above, in the component mounting cycle, the target component mounting position 184 is imaged by the board recognition camera 160, and the mounting coordinate correction amount is calculated for the component (terminal) included in the imaging data. This information is used after the next component mounting cycle including other component mounting heads 150. Accordingly, it is possible to calculate the mounting coordinate correction amount and correct the mounting position using the same without adversely affecting the movement of the component mounting head 150 and the mounting process.

  In the present embodiment, as shown in the example of FIG. 1, one component feeder block 110 is arranged symmetrically on both sides of the printed circuit board conveyance path 170 and the printed circuit board 180 in the Y-axis direction, and corresponds to each. The two-head configuration has the component mounting head 150 to be used. Thus, the degree of parallelism of processing is increased, the production throughput is improved, and the apparatus configuration is reduced in size. However, the number of component mounting heads 150 is not limited to this. The number of component mounting heads 150 can be further expanded to four, six, etc. to further increase the parallelism of processing, and the number of component mounting heads 150 (and component feeder blocks 110) can be reduced to one. It is also possible to reduce the size of the configuration.

  When the number of component mounting heads 150 is one, the parallel operation of alternately performing the component suction cycle and the component mounting cycle as described above with the plurality of component mounting heads 150 is not possible. That is, the information of the mounting coordinate correction amount measured in the component mounting cycle in one component mounting head 150 cannot be referred to in the subsequent component mounting cycle in the other component mounting head 150. However, when the number of component mounting heads 150 is one, the mounting position correction can be performed by referring to the mounting coordinate correction amount measured in a certain component mounting cycle in the subsequent component mounting cycles of the component mounting head 150. There is no difference in technique in that it can be done. Therefore, even when the number of component mounting heads 150 is one, it is possible to improve the component mounting accuracy without degrading the processing performance by applying the method of the present embodiment.

<Embodiment 2>
In the component mounting apparatus 100 according to the first embodiment described above, component mounting is performed from the imaging data of the printed circuit board 180 obtained by the substrate recognition camera 160 when the substrate recognition mark 181 is detected and when each component mounting head 150 mounts a component. The amount of printing deviation of the solder paste 183 at the position 184 is measured to calculate the component mounting coordinate correction amount. However, there are cases where the number of components (terminals) whose mounting coordinate correction amount can be measured in one cycle or process is small, and the mounting coordinate correction for the target component (terminal) is included in the correction target terminal list 321 when mounting the component. It tends to occur when the amount is not measured. In this case, as described above, it is possible to infer from the mounting coordinate correction amount in a nearby measured component (terminal), but the accuracy is more than the correction amount obtained by actually measuring the printing deviation amount. Inferior.

  Therefore, the component mounting apparatus 100 according to the second embodiment of the present invention is not limited to the timing as in the first embodiment, that is, the component mounting head 150 is stopped, as shown in FIG. Even when the head 150 is moving, the printed circuit board 180 is imaged, and the component mounting coordinate correction amount is calculated based on the obtained imaging data. As a result, the number of measurement points for measuring the printing deviation amount of the solder paste 183, that is, the number of components (terminals) for which the mounting coordinate correction amount is calculated is increased, and the number of cases where the mounting position can be corrected based on the correction amount at the time of component mounting is increased. The component mounting accuracy can be further improved.

  As shown in FIG. 15, in order to take an image of the printed circuit board 180 while the component mounting head 150 is moving, the ring illumination 162 attached to the board recognition camera 160 is flashed (lighted for a short time) at the time of imaging. Thereby, even when the component mounting head 150 and the board recognition camera 160 are moving, it is possible to capture an image in a state close to a still image without blurring. Of course, it is also possible to take multiple images on the movement path of the component mounting head 150.

  In the present embodiment, the configuration example of the component mounting apparatus 100 and the component mounting system 1 is the same as that shown in the example of FIGS.

  FIG. 16 is a flowchart showing an outline of an example of the flow of component mounting processing by the component mounting program. The flow of the component mounting process of the present embodiment is basically the same as that shown in the example of FIG. 5 in the first embodiment, but the component mounting head 150 moves on the printed circuit board 180 as described above. In this case, an image is taken, and a printing deviation amount of the solder paste 183 at a component mounting position included in the field of view (imaging data) of the board recognition camera 160 is measured to calculate a mounting coordinate correction amount.

  Specifically, when the component mounting head 150 is moved to the position of the board recognition mark 181 (step S06), the component mounting cycle (steps S16 to S19) ends, and the next component suction cycle (steps S10 to S13) is performed. When the component mounting head 150 is moved to the component feeder block 110 for execution (S09), and when the component mounting head 150 is moved to the target component mounting position in the component mounting cycle (S17), the component mounting head 150 is used. At the timing of movement, the printed board 180 is imaged by the board recognition camera 160, and the amount of printing deviation of the solder paste 183 is measured. Note that it is not necessary to capture images at all of these timings, and if imaging is performed at any one or more timings, an effect of improving the accuracy of component mounting can be obtained.

  In order to capture images at these timings, when creating the imaging terminal list (steps S05 and S15), not only the components (terminals) included in the field of view of the board recognition camera 160 when the component mounting head 150 is stopped, but also the components The components (terminals) included in the movement path of the mounting head 150 (the visual field of the substrate recognition camera 160) are also included.

  FIG. 17 is a flowchart showing an outline of an example of a flow of processing for imaging the component mounting position by the board recognition camera 160 while the component mounting head 150 is moving. When the processing is started, first, the component mounting head 150 is moved toward a target position (for example, the board recognition mark 181, the component mounting position, the component feeder block 110, etc.) (S 101). During movement, it is determined whether or not a component (terminal) included in the imaging terminal list has entered the field of view of the board recognition camera 160 attached to the component mounting head 150 (S102). If not, the process proceeds to step S106.

  In step S102, when a component (terminal) included in the imaging terminal list enters the visual field of the board recognition camera 160, the ring illumination 162 is flashed, and the board recognition camera 160 takes an image of the printed board 180, and the imaging data. Is obtained (S103). Further, among the components (terminals) included in the imaging data, that is, the components (terminals) included in the field of view of the board recognition camera 160, those included in the imaging terminal list are applied by the solder print image processing circuit 209 to the solder paste 183. The printing position is measured, and based on this, the printing deviation amount of the solder paste 183 with respect to the printed circuit board electrode 182 is measured (S104). Further, the mounting coordinate correction amount for the target component is calculated based on the measured printing deviation amount, and the entry of the target component (terminal) in the correction target terminal list 321 is updated (S105).

  Thereafter, the process proceeds to step S106, and it is determined whether or not the component mounting head 150 has reached the target position (S106). If the target position has not been reached, the process returns to step S101, and the movement of the component mounting head 150 toward the target position is continued. If the target position has been reached, the component mounting head 150 is stopped to end the movement.

  It should be noted that when determining whether or not it is time to perform imaging with the board recognition camera 160 while the component mounting head 150 is moving, instead of the determination method as in step S102 described above, for example, an imaging terminal list is used. Coordinate information or the like of the stop position of the component mounting head 150 for imaging the target component (terminal) may be calculated in advance.

  Thus, in the component mounting apparatus 100 according to the present embodiment, not only the timing at which the component mounting head 150 is stopped as in the first embodiment, but also the printed circuit board 180 is moved while the component mounting head 150 is moving. The component mounting coordinate correction amount can be calculated based on the obtained imaging data. As a result, the number of components (terminals) for which the mounting coordinate correction amount is calculated can be increased, and the number of cases where the mounting position can be corrected based on the correction amount at the time of component mounting can be increased to further improve the accuracy of component mounting. .

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Further, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  Each of the above-described configurations, functions, processing units, processing means, and the like may be realized by hardware by designing a part or all of them with, for example, an integrated circuit. Each of the above-described configurations, functions, and the like may be realized by software by interpreting and executing a program that realizes each function by the processor. Information such as programs, tables, and files that realize each function can be stored in a recording device such as a memory, a hard disk, or an SSD (Solid State Drive), or a recording medium such as an IC card or a DVD.

  Moreover, in each said figure, the control line and the information line have shown what is considered necessary for description, and do not necessarily show all the control lines and information lines on mounting. Actually, it may be considered that almost all the components are connected to each other.

1 ... Component mounting device,
DESCRIPTION OF SYMBOLS 100 ... Component mounting apparatus, 110 (110a, b) ... Component feeder block (component feeder block A, B), 111 ... Component feeder, 120 ... Y beam, 130 (130a, b) ... X beam (X beam A, B) ), 140 (140a, b) ... Component recognition cameras (component recognition cameras A, B), 150 (150a, b) ... Component mounting heads (component mounting heads A, B), 160 (160a, b) ... Board recognition cameras (Substrate recognition cameras A and B), 161 (161a, b) ... Substrate recognition camera field of view (Substrate recognition camera A field of view, Substrate recognition camera B field of view), 170 ... Printed circuit board transport path, 180 ... Printed circuit board, 181 (181- 1 to 3) ... board recognition marks (board recognition marks 1 to 3), 182 (182-1, 2) ... printed circuit board electrodes, 183 (183, 1, 2) ... solder paste Strike, 184 ... component mounting position, 185 ... parts,
DESCRIPTION OF SYMBOLS 200 ... Control part, 201 ... Interface, 202 ... MPU, 203 ... RAM, 204 ... ROM, 205 ... External storage device, 206 ... LCD touch panel, 207 ... Bar code reader, 208 ... Board recognition image processing circuit, 209 ... Solder printing Image processing circuit 210 ... Part recognition image processing circuit 211 ... Part feeder driving circuit 212 ... Part feeder driving unit 213 ... Part mounting head driving circuit 214 ... Part mounting head driving unit 215 ... Substrate transport path driving circuit, 216... Substrate transport path drive unit,
300 ... Component mounting setting server, 310 ... Optimal route search unit, 311 ... Optimal route information, 320 ... Correction target terminal list generation unit, 321 ... Correction target terminal list,
400: Board design system, 401: Board design data.

Claims (15)

A component mounting method having a component mounting head equipped with means for recognizing a substrate, and mounting an electronic component on the substrate using the component mounting head,
Using a means for recognizing the board, imaging a predetermined area to which a component is mounted on the board, and identifying a position where the component in the predetermined area is to be mounted and a position where the solder paste is printed; ,
Calculating the difference between the identified position to be mounted and the position where the solder paste is printed;
Correcting the position to be mounted using the identified difference in position, and mounting the component to the corrected position;
A component mounting method characterized by comprising: The component mounting method according to claim 1,
The imaging of the predetermined area is
A component mounting method comprising imaging the predetermined area on a path on which the component mounting head performs component mounting. The component mounting method according to claim 1,
A component mounting method, wherein information for specifying a component for correcting a position to be mounted among the components is stored in the storage unit in advance. A component mounting apparatus having a component mounting head equipped with means for recognizing a substrate, and mounting an electronic component on the substrate using the component mounting head,
Means for recognizing a position on which a component on the substrate is to be mounted and a position in which the component is to be mounted in the predetermined region and a position on which the solder paste is printed using means for recognizing the substrate; ,
Means for calculating a difference between the specified position to be mounted and a position at which the solder paste is printed;
Means for correcting the position to be mounted using the identified difference in position, and mounting the component to the corrected position;
A component mounting apparatus comprising: The component mounting device according to claim 4,
The imaging of the predetermined area is
A component mounting apparatus that images the predetermined area on a path on which the component mounting head performs component mounting. The component mounting device according to claim 4,
Information for specifying a component for correcting a position to be mounted among the components is stored in the storage unit in advance. A program for causing a computer to specify a position where an electronic component is mounted on a substrate using a component mounting head equipped with means for recognizing the substrate,
A procedure for imaging a predetermined region to which a component on the substrate is to be mounted using the means for recognizing the substrate and identifying a position where the component in the predetermined region is to be mounted and a position where the solder paste is printed; ,
A procedure for calculating a difference between the identified position to be mounted and a position at which the solder paste is printed;
Using the identified difference in position, correcting the position to be mounted, and mounting the component to the corrected position;
The program characterized by having. A program according to claim 7, wherein
The imaging of the predetermined area is
A program characterized in that the predetermined area is imaged on a path on which the component mounting head performs component mounting. A program according to claim 7, wherein
A program characterized in that information for specifying a component for correcting a position to be mounted among the components is stored in the storage unit in advance. A component mounting apparatus for mounting a plurality of types of electronic components supplied from a component feeder block including one or more component feeders on a board,
One or more component mounting heads which are movable above one of the component feeder blocks and the area including the substrate, and have a plurality of component mounting members and a substrate recognition camera capable of imaging the substrate;
Among the board design data that holds the design information of the board, the path information that holds information related to the procedure and movement path of each component mounting head to mount the component on the board, and the components that are to be mounted on the board, A storage device that holds a correction target component that needs to correct the component mounting position and a correction target terminal list that holds information related to the position of the terminal;
Each of the component mounting heads holds and extracts a predetermined component from the component feeder in the component feeder block by the component mounting member, and a component extracted in the component holding cycle is predetermined on the substrate. A control unit that performs control to repeatedly execute a component mounting cycle that is mounted at each component mounting position;
The control unit further includes a component on the substrate of the correction target component included in the correction target terminal list based on imaging data obtained by imaging a predetermined region of the substrate by the substrate recognition camera at a predetermined timing. Measure the amount of printing misalignment of the solder paste for each electrode terminal at the mounting position, and calculate the mounting position correction amount when mounting the correction target component on the substrate based on the amount of printing misalignment. A position correction amount is registered in the correction target terminal list in association with the correction target component,
In the component mounting cycle, for each mounting target component to be mounted by each component mounting head, the mounting target component is registered in the correction target terminal list, and the corresponding mounting position correction amount information is registered. If so, a component mounting apparatus that corrects and mounts the component mounting position on the board of the component to be mounted based on the mounting position correction amount. In the component mounting apparatus according to claim 10,
In the component mounting cycle, when the mounting target component is registered in the correction target terminal list and the corresponding mounting position correction amount information is not registered in the component mounting cycle, , Based on the positional relationship between the plurality of components in which the mounting position correction amount is registered, selected in order from the mounting target component, and the contents of the mounting position correction amount in the plurality of components, A component mounting apparatus that estimates a value of the mounting position correction amount in a mounting target component. In the component mounting apparatus according to claim 10,
The predetermined timing when the control unit captures an image of the predetermined area of the board with the board recognition camera is in the field of view of the board recognition camera on the movement path while the component mounting head is moving on the board. A component mounting apparatus characterized in that it is the timing when the correction target component registered in the correction target terminal list is included. In the component mounting apparatus according to claim 12,
2. The component mounting apparatus according to claim 1, wherein the movement of the component mounting head is a movement to the position of the substrate recognition mark for detecting the substrate recognition mark on the substrate. In the component mounting apparatus according to claim 12,
The component mounting head is moved to a component mounting position for mounting a component on the substrate or moved to the component feeder block. In the component mounting apparatus according to claim 10,
The component mounting apparatus, wherein the correction target component registered in the correction target terminal list is a component having a plurality of terminals and having a self-alignment effect at the time of soldering by a reflow method.

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