CN112165853A - PCB solder paste printing quality inspection method, device and system - Google Patents

PCB solder paste printing quality inspection method, device and system Download PDF

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Publication number
CN112165853A
CN112165853A CN202011041657.4A CN202011041657A CN112165853A CN 112165853 A CN112165853 A CN 112165853A CN 202011041657 A CN202011041657 A CN 202011041657A CN 112165853 A CN112165853 A CN 112165853A
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China
Prior art keywords
printing
pixel point
value
image
coordinate
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CN202011041657.4A
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Chinese (zh)
Inventor
唐海富
李靖
石雨卉
陈彪
陈智
滕明锋
刘祖雪
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Huaihua Jiannan Machinery Factory Co ltd
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Huaihua Jiannan Machinery Factory Co ltd
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Priority to CN202011041657.4A priority Critical patent/CN112165853A/en
Publication of CN112165853A publication Critical patent/CN112165853A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817Monitoring of soldering processes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646Soldering

Abstract

The application discloses a PCB solder paste printing quality inspection method, which comprises the following steps: reading an image reference point of the PCB; reading a preset pixel point value of a current printing area; acquiring a printing image of the current printing area according to the image reference point; calculating the number of pixel points of the printed image to obtain a value of a printed pixel point; obtaining an absolute value of a difference between a printing pixel point value and a preset pixel point value to form a pixel point ratio; and if the pixel point ratio is greater than the pixel point threshold value, outputting detection early warning information. The PCB solder paste printing quality inspection method can automatically judge whether the coverage area of solder paste printing is qualified or not, is simple and effective, and solves the problems that the probability of misjudgment or missed judgment is large, the time demand is large, and the labor cost is high due to the fact that manual detection is adopted in the prior art.

Description

PCB solder paste printing quality inspection method, device and system
Technical Field
The application relates to the technical field of electronic product quality detection, in particular to a PCB solder paste printing quality detection method, device and system.
Background
In the field of manufacturing electric meters or water meters, the Surface Mount Technology (SMT) is widely used, the main mode of the mounting technology is to attach components to a PCB, namely, attaching the components to the PCB, before attaching the components to the PCB, a proper amount of solder paste needs to be printed on a circuit board, the solder paste is a material used for connecting electrodes of the components and bonding pads of the circuit board, the main component is a tin alloy, and the solder paste can play a role in conducting the electrodes of the components and the PCB after sintering, so that the solder paste printing process is a very critical part in the whole production process flow, and the detection of the quality of solder paste printing is very important.
The solder paste printing quality detection has many indexes, one of which is the coverage area, most of the existing methods adopt a manual detection mode to judge whether the coverage area reaches a preset standard, so that the probability of misjudgment or missed judgment is high, the time demand is high, and the labor cost is high.
Therefore, designing a PCB solder paste printing quality inspection method capable of automatically judging the coverage area of solder paste printing is a problem to be solved by technical personnel in the field.
Disclosure of Invention
In order to solve the technical problem, the application provides a PCB solder paste printing quality inspection method, which can automatically judge the position deviation of the coverage area, is simple and effective, and solves the problems that the probability of misjudgment or missed judgment is higher, the time demand is higher and the labor cost is higher due to the adoption of manual detection in the prior art.
The technical scheme provided by the application is as follows:
a PCB solder paste printing quality inspection method comprises the following steps:
reading an image reference point of the PCB;
reading a preset pixel point value of a current printing area;
acquiring a printing image of the current printing area according to the image reference point;
calculating the number of pixel points of the printed image to obtain a value of a printed pixel point;
acquiring an absolute value of a difference between the printing pixel point value and the preset pixel point value to form a pixel point ratio;
and if the pixel point ratio is greater than the pixel point threshold value, outputting detection early warning information.
Preferably, the first and second liquid crystal materials are,
the calculating the number of the pixel points of the printing image to obtain the printing pixel point value specifically comprises the following steps,
obtaining qualified pixel points with the gray values larger than a preset gray value in the printed image;
taking the qualified pixel points as the number of the pixel points;
and counting the sum of the pixel points to obtain the printing pixel point value.
Preferably, if the pixel point ratio is greater than the pixel point threshold, after the detection early warning information is output, the method further includes the following steps:
reading a pre-brushing coordinate of a current printing area;
acquiring the printing coordinates of the printing image according to the image reference point;
acquiring an absolute value of a difference between the printing coordinate and the pre-brushing coordinate to form a coordinate ratio;
and if the coordinate ratio is larger than the coordinate preset value, outputting detection alarm information.
Preferably, the outputting of the detection early warning information specifically includes:
if the pixel point ratio is larger than the pixel point threshold value, recording an internal detection early warning once, and carrying out probability statistics according to the internal detection early warning to obtain a probability statistical result;
and if the probability statistical result is greater than the probability statistical preset value, outputting detection early warning information.
Preferably, the first and second liquid crystal materials are,
before reading the image reference point of the PCB, selecting a printing area with the smallest area label as a current printing area;
and deleting the area label of the current printing area after the detection alarm information is output.
Further, the area numbers are serial numbers formed according to the sequence of traversing each printing area.
A PCB board tin cream printing quality inspection device includes:
the setting module is used for reading the image reference points of the PCB;
the reading module is used for reading a preset pixel point value of the current printing area;
the image acquisition module is used for acquiring a printing image of the current printing area according to the image reference point;
the pixel acquisition module is used for calculating the number of pixel points of the printed image to obtain a value of a printed pixel point;
the comparison module is used for acquiring the absolute value of the difference between the printing pixel point value and the preset pixel point value to form a pixel point ratio;
the output module is used for outputting detection state information according to the printing pixel point value and the preset pixel point value;
and if the printing pixel point value is larger than the preset pixel point value, the detection state information is detection early warning information.
Further, the method also comprises the following steps:
the coordinate acquisition module is used for acquiring a printing seat of the printing image according to the image reference point;
wherein the content of the first and second substances,
the reading module is also used for reading the pre-brushing coordinates of the current printing area;
the comparison module is also used for acquiring the distance between the printing coordinate and the pre-brushing coordinate to form a coordinate ratio;
the output module is further used for outputting detection state information according to the printing coordinates and the pre-brushing coordinates;
and if the printing coordinate is larger than the pre-brushing coordinate, the detection state information is detection alarm information.
The utility model provides a PCB board tin cream printing quality inspection system, includes any PCB board tin cream printing quality inspection device of above-mentioned, still includes:
and the camera is used for shooting the printing image of the current printing area and sending the image to the image acquisition module.
The PCB solder paste printing quality inspection method provided by the invention is characterized in that the preset pixel point values of each printing area are stored in advance, after the solder paste is printed, the image reference points are set, the printing pixel point values are obtained according to the printing image, then the absolute value of the difference between the printing pixel point values and the pre-brushing coordinates is used as the pixel point ratio to be compared with the pixel point threshold, and the coverage area of the solder paste printing is judged to be within the normal range meeting the requirements of the printing areas. Whether the coverage area of solder paste printing is qualified or not is judged automatically, the method is simple and effective, and the problems that in the prior art, manual detection is adopted, the probability of misjudgment or missed judgment is high, the time demand is high, and the labor cost is high are solved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a PCB solder paste printing quality inspection method according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for inspecting a solder paste printed product of a PCB according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a PCB solder paste printing quality inspection apparatus according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a PCB solder paste print quality inspection system according to an embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings are only used for matching the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the practical limit conditions of the present application, so that the modifications of the structures, the changes of the ratio relationships, or the adjustment of the sizes, do not have the technical essence, and the modifications, the changes of the ratio relationships, or the adjustment of the sizes, are all within the scope of the technical contents disclosed in the present application without affecting the efficacy and the achievable purpose of the present application.
Embodiments of the present invention are written in a progressive manner.
The embodiment discloses a PCB solder paste printing quality inspection method, as shown in FIG. 1, comprising the following steps:
s1, reading an image reference point of a PCB;
s2, reading a preset pixel point value of the current printing area;
s3, acquiring a printing image of the current printing area according to the image reference point;
s4, calculating the number of pixel points of the printed image to obtain a value of the printed pixel point;
s5, obtaining an absolute value of a difference between a printing pixel point value and a preset pixel point value to form a pixel point ratio;
and S6, if the pixel point ratio is greater than the pixel point threshold value, outputting detection early warning information.
It should be noted that, the order of the steps may be changed, for example, step S1 to step S3, the three steps may be performed sequentially according to different orders, and certainly may be performed synchronously at the same time interval, and this embodiment adopts the sequential implementation of step S1 to step S6 as an example.
In practical application, the specific operations and cautions of each step are as follows:
and step S1, setting image reference points of the PCB according to the current PCB which needs to be subjected to solder paste printing, so that subsequent pixel point reading and image acquisition can be based on the same image reference point, and the error comparison result of the acquired value and the preset value caused by different reference points is avoided.
Step S2, before solder paste printing, the preset pixel point values of each printing area are stored in advance, and when necessary, the preset pixel point values are directly read for the current printing area, and the preset pixel point values do not need to be temporarily obtained.
Step S3, after the printing is completed, acquiring a print image of the current print area according to the image reference point, wherein the print image may be a direct static photograph, or a specific frame image in a dynamic video, or a final image with enhanced definition after performing denoising processing on multiple frames.
Step S4, when calculating the number of pixels according to the print image, calibration still needs to be performed according to the image reference point, that is, the image reference point is used as a coordinate origin or a coordinate reference point, so as to avoid an error caused by calculation at the same base point as the pre-brushing coordinate. In addition, the specific acquisition method and the number of the printing coordinates may be selected according to the actual acquisition method and the requirement for precision, and are not specifically described herein.
Step S5, calculating a pixel point ratio between the printing pixel point value and the corresponding preset pixel point value. For example, the value of the printed pixel point is 800, the value of the preset pixel point is 1000, and then the absolute value of the difference between the two is 200, that is, the ratio of the pixel points of the printed image is 200.
Step S6, reading a pixel threshold of the printing area, comparing the pixel ratio obtained in step S5 with the pixel threshold, where the pixel ratio is 200 and the corresponding pixel threshold is 100, which represents that the printed image has exceeded a standard gap range defined by the pixel threshold, that is, a situation of abnormal coverage area has occurred, at this time, outputting detection warning information, and then returning to step S1 to circulate if the image acquisition position changes according to the state of image acquisition, and of course, directly returning to step S2 to circulate if the image acquisition position does not change, and the subsequent circulation state is not detailed any more.
It should be noted that the absolute value of the difference between the printed pixel point value and the predetermined pixel point value in step S6 is because the coverage area may be too large or too small during solder paste printing, and the absolute value can effectively represent the substantial difference between the two values, and at the same time, the problem of too large or too small determination is satisfied.
The PCB solder paste printing quality inspection method provided by the embodiment is characterized in that preset pixel point values of each printing area are stored in advance, after solder paste printing is carried out, image reference points are set, the printing pixel point values are obtained according to printing images, then the absolute value of the difference between the printing pixel point values and pre-brushing coordinates is used as a pixel point ratio to be compared with a pixel point threshold value, and the coverage area of solder paste printing is judged to be within a normal range meeting the requirements of the printing areas. Whether the coverage area of solder paste printing is qualified or not is judged automatically, the method is simple and effective, and the problems that in the prior art, manual detection is adopted, the probability of misjudgment or missed judgment is high, the time demand is high, and the labor cost is high are solved.
In particular, the method comprises the following steps of,
step S4 is to calculate the number of pixels of the printed image, to obtain the specific value of the printed pixel,
s41, acquiring qualified pixel points of which the gray values are larger than a preset gray value in the printed image;
s42, taking qualified pixel points as the number of the pixel points;
s43, counting the sum of the pixel points to obtain the value of the printing pixel point.
When the number of the pixel points is calculated, whether each printing pixel point is larger than a preset gray level value or not can be judged firstly, if the number of the printing pixel points is larger than the preset gray level value, the printing pixel points are represented as qualified pixel points, and if the number of the printing pixel points is smaller than or equal to the preset gray level value, the printing pixel points are probably the pixel points which are not covered by the solder paste on the PCB and cannot be identified as solder paste covering points, so that the influence of irrelevant pixel points on subsequent judgment results is avoided.
Preferably, in step S6, if the pixel point ratio is greater than the pixel point threshold, after the detection warning information is output, as shown in fig. 2, the method further includes the following steps:
s7, reading the pre-brushing coordinates of the current printing area;
s8, acquiring printing coordinates of the printing image according to the image reference points;
s9, obtaining the distance between the printing coordinate and the pre-brushing coordinate to form a coordinate ratio;
and S10, if the coordinate ratio is larger than the coordinate preset value, outputting detection alarm information.
In the solder paste print inspection, in addition to the detection of the coverage area, there are other factors to be detected, and another important factor to be detected is the offset position, and if the offset position is more than a certain degree, for example, the offset position is excessively shifted to the left or right or excessively shifted to the up or down direction, the solder brushing is regarded as being unqualified, so the present embodiment is performed for the offset position.
In a specific operation, step S7 is to read the pre-brushing coordinates of the current printing area, then obtain the printing coordinates of the printing image through step S8, obtain the distance between the two at step S9 to form a coordinate ratio, and step S10 compares the coordinate ratio with a preset coordinate value, and if the coordinate ratio is greater than the preset coordinate value, outputs detection alarm information.
It should be noted that, in the preceding embodiment, when the pixel point ratio is greater than the pixel point threshold, the detection warning information is output, and in this embodiment, the further coordinate ratio is greater than the coordinate preset value, the detection warning information is output, which means that only when the coverage area is abnormal, the warning is performed, and when the coordinate ratio detected in the subsequent process is greater than the coordinate preset value, that is, the offset position is also synchronously unqualified, the detection warning information is output.
Preferably, the output detection early warning information in S6 is specifically:
if the pixel point ratio is larger than the pixel point threshold value, recording an internal detection early warning once, and carrying out probability statistics according to the internal detection early warning to obtain a probability statistical result;
and if the probability statistical result is greater than the probability statistical preset value, outputting detection early warning information.
In some cases, in order to more accurately obtain the coverage area, multiple times of obtaining of printed images can be carried out, and for the situation that due to external factors, for example, interference is received during image obtaining, the pixel point ratio obtained at a certain moment is abnormal, so that the pixel point threshold value is caused, and the pixel point ratio obtained at the next moment normally operates, the early warning operation is not required to be executed due to occasional change, so that the pixel point ratio obtained at a certain time is larger than the pixel point threshold value and is recorded as one-time internal detection early warning, probability statistics is carried out according to the times of occurrence of the internal detection early warning, and when the probability statistics result reaches a certain critical value, it is shown that the accidental external factors do not cause the internal detection early warning, but the risk of abnormal coverage area objectively exists in solder paste printing.
Preferably, the first and second liquid crystal materials are,
before the step S1 of reading the image reference point of the PCB, selecting the printing area with the smallest area label as the current printing area;
and deleting the area label of the current printing area after the detection alarm information is output.
In actual operation, each printed area is labeled according to needs in advance, each quality inspection step starts from the printed area with the smallest area label, after detection alarm information is output, the printed area corresponding to the area label is shown, meanwhile, the situations of position deviation and coverage area failure occur, namely, the solder paste printing of the printed area is unqualified, in order to avoid unnecessary detection of the printed area being repeated next time, the corresponding area label is directly deleted, and the next detection circulation step can be directly executed from the next undetected printed area.
Of course, instead of deleting the area label, one kind of label may be directly set to the area label in advance, for example, a quality check label, 1 is a detection-pass, 0 is a detection-fail, and empty or full l is not yet detected, and in this case, the quality check label is read first before step S1, and the quality check with the quality check label of 0 is selected.
Further, the area numbers are serial numbers formed according to the order of traversing each printing area.
During the actual traversal, a principle of top to bottom and left to right is adopted, each printing area on the PCB board is assigned with a corresponding sequence number as an area label, and of course, other traversal modes can be adopted according to the type of the detection device, and the description is not repeated here.
The embodiment also provides a printed product inspection device of solder paste of a PCB, as shown in fig. 3, including:
the setting module 1 is used for reading an image reference point of the PCB;
the reading module 2 is used for reading a preset pixel point value of the current printing area;
the image acquisition module 3 is used for acquiring a printing image of the current printing area according to the image reference point;
the pixel acquisition module 4 is used for calculating the number of pixel points of the printed image to obtain a value of a printed pixel point;
the comparison module 5 is used for acquiring an absolute value of a difference between a printing pixel point value and a preset pixel point value to form a pixel point ratio;
the output module 6 is used for printing the pixel point values and the preset pixel point values and outputting the detection state information;
and if the printing pixel point value is larger than the preset pixel point value, detecting the state information as detection early warning information.
After the setting module 1 reads an image reference point of the PCB, the reading module 2 reads a preset pixel point value of a current printing area and sends the preset pixel point value to the comparison module 5, the image obtaining module 3 obtains a printing image of the current printing area according to the image reference point and sends the printing image to the pixel obtaining module 4, the pixel obtaining module 4 calculates the number of pixel points of the printing image, obtains the printing pixel point value and sends the printing pixel point value to the comparison module 5, the comparison module 5 obtains an absolute value of a difference between the printing pixel point value and the preset pixel point value, forms a pixel point ratio and sends the pixel point ratio to the output module 6, the output module 6 outputs detection state information according to the printing pixel point value and the preset pixel point value, wherein if the printing pixel point value is greater than the preset pixel point value, the detection state.
Further, as shown in fig. 3, the method further includes:
a coordinate acquiring module 7, configured to acquire a printing coordinate of the printing image according to the image reference point;
wherein the content of the first and second substances,
the reading module 2 is also used for reading the pre-brushing coordinates of the current printing area;
the comparison module 5 is also used for acquiring the distance between the printing coordinate and the pre-brushing coordinate to form a coordinate ratio;
the output module 6 is further used for outputting detection state information according to the coordinate ratio and the pre-brushing coordinate;
and if the coordinate ratio is greater than the coordinate preset value, detecting the state information as detection alarm information.
The coordinate acquisition module 7 acquires printing coordinates of a printing image according to the image reference points and sends the printing coordinates to the comparison module 5, the reading module 2 reads pre-brushing coordinates of a current printing area and sends the pre-brushing coordinates to the comparison module 5, the comparison module 5 acquires the distance between the printing coordinates and the pre-brushing coordinates, a coordinate ratio is formed and sent to the output module 6, the output module 6 outputs detection state information according to the coordinate ratio and a coordinate preset value, and if the coordinate ratio is larger than the coordinate preset value, the detection state information is detection alarm information.
This embodiment also provides a PCB board tin cream printing quality inspection system, including any PCB board tin cream printing quality inspection device of above-mentioned, as shown in fig. 4, still includes:
and the camera 9 is used for shooting a printing image of the current printing area and sending the printing image to the image acquisition module.
In actual use, the camera 9 can be installed above the PCB through the rail, and can also be connected with the camera by a manipulator to move, and the specific implementation mode can be selected according to actual conditions, and the type of the camera can also be selected according to needs, which is not described herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, positional terms such as "upper", "lower", "left", "right", and the like are used solely to distinguish one object from another object without necessarily requiring or implying any actual positional limiting relationship between such objects. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Claims (9)

1. A PCB solder paste printing quality inspection method is characterized by comprising the following steps:
reading an image reference point of the PCB;
reading a preset pixel point value of a current printing area;
acquiring a printing image of the current printing area according to the image reference point;
calculating the number of pixel points of the printed image to obtain a value of a printed pixel point;
acquiring an absolute value of a difference between the printing pixel point value and the preset pixel point value to form a pixel point ratio;
and if the pixel point ratio is greater than the pixel point threshold value, outputting detection early warning information.
2. The PCB solder paste printing quality inspection method of claim 1,
the calculating the number of the pixel points of the printing image to obtain the printing pixel point value specifically comprises the following steps,
obtaining qualified pixel points with the gray values larger than a preset gray value in the printed image;
taking the qualified pixel points as the number of the pixel points;
and counting the sum of the pixel points to obtain the printing pixel point value.
3. The PCB solder paste printing quality inspection method of claim 1, wherein after outputting detection early warning information if the pixel point ratio is greater than the pixel point threshold, the PCB solder paste printing quality inspection method further comprises the following steps:
reading a pre-brushing coordinate of a current printing area;
acquiring the printing coordinates of the printing image according to the image reference point;
acquiring an absolute value of a difference between the printing coordinate and the pre-brushing coordinate to form a coordinate ratio;
and if the coordinate ratio is larger than the coordinate preset value, outputting detection alarm information.
4. The PCB solder paste printing quality inspection method according to claim 1, wherein the outputting of the detection early warning information specifically comprises:
if the pixel point ratio is larger than the pixel point threshold value, recording an internal detection early warning once, and carrying out probability statistics according to the internal detection early warning to obtain a probability statistical result;
and if the probability statistical result is greater than the probability statistical preset value, outputting detection early warning information.
5. The PCB solder paste printing quality inspection method of claim 3,
before reading the image reference point of the PCB, selecting a printing area with the smallest area label as a current printing area;
and deleting the area label of the current printing area after the detection alarm information is output.
6. The PCB solder paste printing inspection method of claim 5, wherein the area labels are serial numbers formed according to a sequence formed by traversing each printing area.
7. The utility model provides a PCB board tin cream printing quality inspection device which characterized in that includes:
the setting module is used for reading the image reference points of the PCB;
the reading module is used for reading a preset pixel point value of the current printing area;
the image acquisition module is used for acquiring a printing image of the current printing area according to the image reference point;
the pixel acquisition module is used for calculating the number of pixel points of the printed image to obtain a value of a printed pixel point;
the comparison module is used for acquiring the absolute value of the difference between the printing pixel point value and the preset pixel point value to form a pixel point ratio;
the output module is used for outputting detection state information according to the printing pixel point value and the preset pixel point value;
and if the printing pixel point value is larger than the preset pixel point value, the detection state information is detection early warning information.
8. The PCB solder paste printing quality inspection device of claim 7, further comprising:
the coordinate acquisition module is used for acquiring the printing coordinates of the printing image according to the image reference point;
wherein the content of the first and second substances,
the reading module is also used for reading the pre-brushing coordinates of the current printing area;
the comparison module is further used for acquiring an absolute value of a difference between the printing coordinate and the pre-brushing coordinate to form a coordinate ratio;
the output module is also used for outputting detection state information according to the coordinate ratio and a coordinate preset value;
and if the coordinate ratio is larger than the coordinate preset value, the detection state information is detection alarm information.
9. A PCB solder paste print inspection system comprising the PCB solder paste print inspection apparatus of claim 7 or claim 8, further comprising:
and the camera is used for shooting the printing image of the current printing area and sending the image to the image acquisition module.
CN202011041657.4A 2020-09-28 2020-09-28 PCB solder paste printing quality inspection method, device and system Pending CN112165853A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
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WO2022242369A1 (en) * 2021-05-20 2022-11-24 上海望友信息科技有限公司 Spray pattern generation method and system, and electronic device and storage medium

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