1310084 0950035 19740tw£doc/e 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種極性元件的檢測方法，且特別是 有關於一種基板上極性元件之極性方向的自動檢測方法。 【先前技術】 一般而言，印刷電路板(如主機板)上配置著許多利用 表面黏著技術（Surface Mount Technology，SMT)與雙排腳 封裝（Dual Inline package，DIP)以組裝至印刷電路板的電 子几件，其中雙排腳封裝的電子元件仍多是以人工手插= 組裝方式以插置於印刷電路板。 另以主機板為例，雙排腳封裝電子元件中之電解電容的 :ί位置正、負極性的方向和元件是非常是否破損仍都 :賴人工目視做_。若在（工目檢時沒發現主機板上呈 中—個電解電容的的極性方向是相反時機 =線路靜態測WemtT伽，ICT)的電㈣二 燒I主機板會因電解電容的正、負極性位置反向而爆炸 沾十^人工目視來檢測電解電容的正、負極性方向，詳細 才欢’則人員需事先製作一具有多個貫穿孔的遮罩板 標準樣本，而遮罩板❹個貫穿孔的位置與大小 機上的電解電容的位置與大小而定。遮罩板上 當檢測ΙίΪί:標註著電解電容的正、負極性的方向。 t制a。‘4·欢一待測之主機板上的電解電容極性時， w/、㉟主機板與鮮板崎位並將鮮板覆套於 1310084 0950035 19740twf.doc/e 電解電容凸出於遮罩板以方便利用雙眼去檢 測母-個電解電容的正、負極性的方向是否正確。檢 恭於檢測人員所需檢測的元件並不僅止於電解 插置位置或是正、件t需要檢測其個別的 、 員柽! 生方向疋否正確。長時間工作易 及的i檢f人員難免會因粗心而沒有檢測到之極性方向相 = 因此，在測試員將具有極性方向相反之電 :其上之部分元件損傷或燒毁，讓產品的良 此外，若是對主機板進行修復，修 :=rr:的主機板相同，因此產品的= Γ有效降低。另外’若具有極性方向相反的電解電容之 機板是在出貨至客戶端後’客戶使科才發生爆炸或捧 鲛，將會讓客戶對產品失去信賴感。 —疋 【發明内容】 測方的是提供一種極性元件之極性方向自動檢 搞从，，、利用電腦代替人工目檢的方式，因此可以減少 ^讀之極性方向錯誤的情形，使產品維 率’進而減少成本。 — 為達上述或是其他目的，本發明提出一種極性元件之 元自方法’其用以檢測—具有多個待測極性 =相基板。此方法包括下列之步驟：料，取得— 不，樣本，記錄多個極性元件之位置座標與極性方向。然 1310084 0950035 19740twf.doc/e 後，擷取待測基板之一待測影像，並記錄為一待測樣本， 其包含各個該待測極性元件之位置座標與極性方向。最 後，比較標準樣本與待測樣本。 在本發明之一實施例中，更包括由一資料或擷取標準 基板之標準影像以取得該標準樣本的步驟，而此資料記錄 多個極性元件配置於標準基板上的位置座標與極性方向。 在本發明之一實施例中，更包括使每一極性元件之 何座標轉換為畫素座標。 在本發明之一實施例中，更包含校準待測基板。 一在本發明之一實施例中，更包括使標準影像中之極性 元件的顏色二值化以取得其極性方向。 根據上述實施例，使待測影像的顏色二值化之方 括下列步驟：首先，彻電顧選制影財，極性 然ί ’設定"^值(Threshold) ’且電腦判 里素耗圍内之多個晝素^素的灰階值是否大於閥值 值的於:值的晝素元素之顏色輸出為白色，而小於閥 值的旦素70素之顏色輸出為黑色。 在本剌之—實_巾，上狀姉 自動檢測綠更包括於待測影像中，標示 性方向不相符於鮮影像的待測極性元件 本之極 在本發明之-實施例中，上ϋ 自動檢測方法更包括顯示待測樣本之極亟財向 準樣本之待咖性元件㈣素座標。 13不相付於標 本發明將習知利用人工目視的方式來檢測配置於基板 1310084 0950035 19740twf.doc/e 上之極性元件的極性方向，利用電腦來自動檢測。如此一 來’不但可以減少人事成本，還可以減少極性元件配置於 基板上時，極性凡件之極性方向的錯誤，進而提升產品的 良率。此外’還可以避免基板因為極性元件配置於基板之 極性方向錯誤，使基板在進行電氣測試時爆炸或燒毁，減 少基板修復或重新製作的成本。 為讓本發明之上述和其他目的、特徵和優點能更明顯 賴，下文特舉-實施例’並配合所附圖式，作詳細說明 ® 如下。 【實施方式】 圖1為本發明之極性元件的極性方向檢測方法的流程 圖、圖2為本實施例之標準基板的局部示意圖，而圖3為 圖2之標準基板的影像示意圖。請同時參考圖丨、圖2及 圖3，首先如步驟S110,取得一標準樣本，其中取得標準 樣本之方式包括擷取標準基板1〇〇之影像n，並記錄為標 準樣本，其中標準樣本包含多個極性元件配置於標準基板 # 上的位置座標與極性方向。在本實施例中，標準基板100 為主機板，且標準基板100上配設有多個電子元件或是其 他需要以手插置的極性元件110，而這些極性元件11〇例 如疋電解電容等雙排腳封裝電子元件。為求圖示簡潔，圖 2中僅繪出極性元件110示意，未繪示其他電子元件。 一般而言，上述之極性元件110的外層裹有一層標示 極性元件U0之極性方向dl(極性標誌)及極性元件110特 性的保護膜112’也就是業界俗稱的焦皮。在本實施例中， 1310084 0950035 I9740twf.doc/e 各個極性元件no依據其配置在標準基板勘上之位置的 不同’其極性方向dl也有所不同。為了方便辨別極性元件 ϋ0的極性方向dl ’常見的作法是將保護膜112大致分成 深不同的兩種顏色以便區別。舉例來說，保護膜m大 j刀的顏色為深綠色，而其中較淺的顏色如自色即是用以 標不極性元件110的極性方向dl。 3在本實施例中，我們是利用互補式金氧半導體(CMOS) 相模組或是電餘合元件(CCD)照相獅來操取標 ^反1〇0之影像11，並利用形狀框圈選標準基板100之 /择UG %像’同時取得在影像11中，極性元件110 伴t板1〇0上的位置座標與極性方向dl，並將極性元 9錄2位置座標及極性方向dl輸人電腦的資料庫中，以 11〇^/測之㈣標準樣本。上述之影像11中極性元件 、立置座標是利用晝素座標來記錄。 以取利用照相模組榻取標準基板1GG的影像11 λ, 我們也可以利用電腦讀入一資料來取得 記:標準基板100上每-個極性元 性方向dl 丁 卜更5己錄母一個極性元件110的極 的示：圖為2 2狀框圈選標準基板之影像中-極性元件 :;; SU;參:圖4’在取得影像咖 的範圍，it靜用祕框來圈選影像11中極性元件110 框= Ϊ出極性元件UG的極性方⑽，而形狀 夕艺疋矩形。此時，亦可再調整每一個形狀框 )J〇t _一 的位置和大小，使極性元件110的中心與形狀框的中心相 同。 另外在擷取景>像π之後，我們可以對照影像n的 晝素座標與標準基板之幾何座標，計算出關係式，以 將極性元件110的幾何座標轉換為晝素座標，並且將極性 元件110的晝素座標έ己錄於標準樣本中，如步驟Μ I〗。 一然後，如步驟S120,將記錄標準基板1〇〇上各個極性 兀件1U)的畫素鋪、極性方向的標準樣本存於資料庫中。 圖5為本貫施例之待測基板的局部示意圖，而圖6為 圖5之待測基板的影像示意圖。接著如步驟si3〇，提供待 測基板2GG ’其中待測基板2〇〇上的極性元件2lQ的配置 位置應各別對應於標準基板1〇〇上的極性元件11〇。 然後，利用照相模組擷取待測基板2〇〇的影像12，並 且取得待測基板200之待測極性元件21〇的晝素座標。 ⑨值得注意的是，在利用照相模組以取得待測基板2〇〇 之影像12時，照相模組擷取標準基板1〇〇及待測基板2〇〇 •的角度需相同’以避免因為視角角度的不同而使影像n與 12中’極性元件11〇及極性元件21〇的畫素範圍相差過大， 進而影響後續之檢測作業。 ,_接著如步驟S140 ’檢測待測基板2〇〇上的每個待測極 [^件210的極性方向d2是否正確。詳細地來說，是先利 =電腦讀取儲存於資料料的鮮樣本，錢對應搜尋影 12_中，相似晝素範圍的極性元件21〇的位置，並且判斷 極性元件210的極性方向d2是否正確。 i3i〇QM5 19740twf.doc/e 圖7為將圖6之極性元件的晝素元素二值化後的示意 圖。請參考圖7，在本實施例中，判斷極性元件21〇的極 性方向d2是否正確包含下列步驟。首先如步驟s 142 ,利 用影像處理的方式將影像U中的待測極性元件21〇的畫素，' 乾圍一值化（Binary Image)。 詳細地來說，利用一程式將影像二值化如下列之步 驟。首先在程式中設定一個閥值。然後，電腦讀取影像12 中’待測晝素範圍内每個晝素元素的灰階值，並且利用程 瞻 式判斷晝素元素的灰階值是否大於此閥值。在本實施例 中，當晝素元素的灰階值大於閥值時，晝素元素的顏色被 輸出為白色；相對地，當晝素元素的灰階值小於閥值時， 晝素元素的顏色被輸出為黑色。如此一來，二值化後的影 像12僅有黑、白兩色，電腦便可以滑楚地顯示每個極性元 件210的極性方向d2。 之後如步驟S144，比較標準樣本與待測樣本中，相對 應之極性元件110及210的極性方向dl及（12，以判斷相 鲁 對應之極性元件210與極性元件11〇的極性方向dl、d2 是否相同。 最後如步驟S146’當檢測到極性元件21〇，的極性方向 d2錯誤時，我們可以藉由電腦來標示出影像12中，極性 =向d2錯誤的極性元件21〇,的位置。此外，電腦也可以 疋直接顯示出極性方向d2錯誤的極性元件21〇,的晝素座 標。因此’我們便可以將極性方向d2相反的極性元^ 2'1〇， 從待測基板200上拔起，修正其極性方向汜，並重新插置 1310084 0950035 19740twf.doc/e ^寺測基板200上。如此—來，便可以避免在對待測基板 進行電氣測試時，待測基板2⑻會爆炸或燒毁。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method of detecting a polar component, and more particularly to an automatic detection method for the polarity direction of a polar component on a substrate. [Prior Art] In general, printed circuit boards (such as motherboards) are equipped with a number of Surface Mount Technology (SMT) and Dual Inline package (DIP) for assembly to printed circuit boards. Several pieces of electronic components, in which the electronic components of the double-row package are still mostly inserted in the printed circuit board by manual insertion = assembly. Taking the motherboard as an example, the double-row package encapsulates the electrolytic capacitor in the electronic component: ί position positive, negative polarity direction and components are very damaged or not: rely on manual visual _. If (in the visual inspection, the polarity of the electrolytic capacitor is not found on the motherboard is opposite) = the static measurement of the line static WemtT gamma, ICT) (4) The second motherboard is due to the positive and negative electrodes of the electrolytic capacitor. The position of the sex is reversed and the explosion is dimmed. The manual direction is used to detect the positive and negative directions of the electrolytic capacitor. In detail, the personnel must prepare a standard sample of the mask with multiple through holes in advance, and the mask plate The position of the through hole depends on the position and size of the electrolytic capacitor on the sizing machine. On the mask board When detecting ΙίΪί: Mark the direction of the positive and negative polarity of the electrolytic capacitor. t system a. '4·When the polarity of the electrolytic capacitor on the motherboard is to be tested, w/, 35 motherboard and fresh board are covered and the fresh board is covered on 1310084 0950035 19740twf.doc/e Electrolytic capacitor protrudes from the mask It is convenient to use both eyes to detect whether the positive and negative polarities of the mother-electrode capacitor are correct. Check that the components that the inspector needs to detect are not only at the position of the electrolytic insertion or the positive, the t, and the individual, the member, and the direction of the student. It is inevitable that the personnel who have been working for a long time will not be detected by the carelessness of the polarity direction phase. Therefore, the tester will have the opposite polarity of electricity: some of the components on it are damaged or burned, so that the product is good. In addition, if the motherboard is repaired, the repair:=rr: is the same, so the product = Γ is effectively reduced. In addition, if the board with the opposite polarity of electrolytic capacitors is shipped to the client, the customer will explode or hold the board, which will make the customer lose trust in the product. —疋 [Summary of the invention] The tester provides an automatic detection of the polar direction of the polar component, and uses the computer instead of the manual visual inspection. Therefore, the polarity of the reading can be reduced, and the product dimension can be reduced. Thereby reducing costs. - For the above or other purposes, the present invention proposes a meta-method of a polar component which is used to detect - having a plurality of polarity to be tested = phase substrate. The method includes the following steps: material, acquisition - no, sample, recording position coordinates and polarity directions of multiple polar components. After 1310084 0950035 19740twf.doc/e, one image to be tested of the substrate to be tested is captured and recorded as a sample to be tested, which includes the position coordinates and the polarity direction of each of the components to be tested. Finally, compare the standard sample with the sample to be tested. In an embodiment of the invention, the method further comprises the step of obtaining a standard sample from a data or a standard image of the standard substrate, wherein the data records a position coordinate and a polarity direction of the plurality of polar elements disposed on the standard substrate. In one embodiment of the invention, it is further included to convert the coordinates of each polar component to a pixel coordinate. In an embodiment of the invention, the calibration of the substrate to be tested is further included. In one embodiment of the invention, the method further includes binarizing the color of the polar component in the standard image to obtain its polarity direction. According to the above embodiment, the method for binarizing the color of the image to be tested includes the following steps: First, the selection of the film is made by the driver, and the polarity is set to "Threshold" and the computer calculates the cost. Whether the gray scale value of the plurality of halogen elements in the interior is greater than the threshold value: the color of the halogen element of the value is white, and the color of the color of the light of less than the threshold is black. In the present invention, the automatic detection of the green is included in the image to be tested, and the polarity of the component to be tested whose marking direction does not conform to the fresh image is in the present invention - in the embodiment, the upper jaw The automatic detection method further includes displaying the to-be-to-coffee element (four) prime coordinates of the extremely wealthy sample of the sample to be tested. 13 does not cope with the standard The present invention uses a manual visual method to detect the polarity direction of a polar component disposed on a substrate 1310084 0950035 19740twf.doc/e, and automatically detects it by a computer. In this way, not only can the personnel cost be reduced, but also the polarity of the polarity component can be reduced when the polar component is placed on the substrate, thereby improving the yield of the product. In addition, the substrate can be prevented from being erroneous in the polarity direction of the polar component disposed on the substrate, causing the substrate to explode or burn during electrical testing, thereby reducing the cost of substrate repair or remanufacturing. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims. 1 is a flow chart of a method for detecting a polarity direction of a polar component of the present invention, FIG. 2 is a partial schematic view of a standard substrate of the present embodiment, and FIG. 3 is a schematic view of a standard substrate of FIG. Referring to FIG. 2, FIG. 2 and FIG. 3, first, in step S110, a standard sample is obtained. The method for obtaining the standard sample includes capturing the image n of the standard substrate and recording it as a standard sample, wherein the standard sample includes The plurality of polar elements are arranged on the position coordinates and the polarity direction on the standard substrate #. In this embodiment, the standard substrate 100 is a motherboard, and the standard substrate 100 is provided with a plurality of electronic components or other polar components 110 that need to be manually inserted, and these polar components 11 such as tantalum electrolytic capacitors The legs are packaged with electronic components. For simplicity of illustration, only the polar component 110 is illustrated in FIG. 2, and other electronic components are not shown. In general, the outer layer of the polar component 110 is covered with a protective film 112' which indicates the polarity direction dl (polarity mark) of the polar component U0 and the polarity of the polar component 110. In the present embodiment, 1310084 0950035 I9740twf.doc/e each of the polar elements no differs in the polarity direction dl depending on the position at which the standard substrate is placed. In order to facilitate the discrimination of the polarity direction dl0 of the polar element dl0, it is common practice to divide the protective film 112 into two substantially different colors for distinction. For example, the color of the protective film m large j knife is dark green, and the lighter color such as self color is used to mark the polarity direction dl of the non-polar element 110. 3 In this embodiment, we use a complementary metal oxide semiconductor (CMOS) phase module or a CCD photographic lion to fetch the image 11 of the image and use the shape frame. Selecting the standard substrate 100/selecting the UG% image' is simultaneously obtained in the image 11, the polar element 110 with the position coordinate and the polarity direction dl on the t-plate 1〇0, and the polarity element 9 is recorded as the position coordinate and the polarity direction dl is input. In the database of the human computer, the standard sample is measured by 11〇^/(4). In the image 11 described above, the polar elements and the vertical coordinates are recorded using the pixel coordinates. In order to take the image 11 λ of the standard substrate 1GG using the camera module, we can also use the computer to read in a data to obtain the record: each polarity direction of the standard substrate 100 dl Ding 5 more recorded mother a polarity The pole of the component 110 is shown in the figure: the image of the 2nd frame ring is selected as the standard substrate - the polar component:;; SU; the reference: Fig. 4' in the range of obtaining the image coffee, it uses the secret frame to circle the image 11 The middle polarity element 110 box = the polar side of the polarity element UG (10), and the shape of the epoch rectangle. At this time, the position and size of each shape frame J 〇 t _ can also be adjusted so that the center of the polar element 110 is the same as the center of the shape frame. In addition, after capturing the image > like π, we can calculate the relationship between the pixel coordinates of the image n and the geometric coordinates of the standard substrate to convert the geometric coordinates of the polar component 110 into pixel coordinates, and the polar component 110 The morpheme coordinates have been recorded in the standard sample, as in step Μ I. Then, in step S120, the pixel samples of the respective polarities 1U of the standard substrate 1 are recorded, and the standard samples of the polar directions are stored in the database. FIG. 5 is a partial schematic view of the substrate to be tested according to the embodiment, and FIG. 6 is a schematic diagram of the image of the substrate to be tested of FIG. Next, as in step si3, the substrate to be tested 2GG' is disposed such that the arrangement positions of the polar elements 2lQ on the substrate 2' to be tested respectively correspond to the polar elements 11'' on the standard substrate 1''. Then, the image 12 of the substrate 2 to be tested is captured by the camera module, and the pixel coordinates of the polarity component 21 to be tested of the substrate 200 to be tested are obtained. 9 It is worth noting that when the camera module is used to obtain the image 12 of the substrate to be tested, the camera module needs to capture the standard substrate 1 and the angle of the substrate to be tested. The difference in viewing angle causes the pixel ranges of the 'polar element 11' and the polar element 21' in the images n and 12 to be too large, which in turn affects the subsequent detection operation. Then, as in step S140', it is detected whether or not the polarity direction d2 of each of the electrodes to be tested on the substrate 2 to be tested is correct. In detail, it is the first profit = the computer reads the fresh sample stored in the data material, and the money corresponds to the position of the polar element 21〇 in the search image 12_, and determines whether the polarity direction d2 of the polar element 210 is correct. I3i〇QM5 19740twf.doc/e Fig. 7 is a schematic diagram showing the binarization of the halogen element of the polar element of Fig. 6. Referring to Fig. 7, in the present embodiment, it is judged whether or not the polar direction d2 of the polar element 21A correctly includes the following steps. First, as step s 142, the pixel of the polarity component 21 to be tested in the image U is image-processed, and the 'Binary Image' is used. In detail, the image is binarized using a program as follows. First set a threshold in the program. Then, the computer reads the grayscale value of each element in the range of the pixels to be measured in the image 12, and uses the program to determine whether the grayscale value of the element is greater than the threshold. In this embodiment, when the grayscale value of the halogen element is greater than the threshold, the color of the halogen element is outputted as white; relatively, when the grayscale value of the halogen element is less than the threshold, the color of the halogen element It is output as black. In this way, the binarized image 12 has only black and white colors, and the computer can smoothly display the polarity direction d2 of each polarity element 210. Then, in step S144, comparing the polarity directions d1 and (12 of the corresponding polar elements 110 and 210 in the standard sample and the sample to be tested, to determine the polarity directions dl, d2 of the polar element 210 and the polar element 11 对应 corresponding to the phase Finally, if the polarity direction d2 of the polar component 21 is detected as wrong in step S146', we can indicate by the computer the position of the polarity element = the wrong polarity element 21〇 to d2. The computer can also directly display the polar coordinates of the polar component 21〇 in the polarity direction d2. Therefore, we can pull up the polarity element 2'1〇 from the polarity direction d2 from the substrate 200 to be tested. , correct the polarity direction 汜, and re-insert 1310084 0950035 19740twf.doc / e ^ Temple substrate 200. So - to avoid the electrical test of the substrate to be tested, the substrate 2 (8) to be tested will explode or burn .
由於本發明是利用掏取標準基板及待測基板的影像， ^且將記賴準純及待板上之姉元件的幾何座 “、晝素鋪的鮮樣本及御彳樣本輪人㈣庫中以利存 =α此^們更可·先製作多個標準樣本，並將標準 樣本先輸人資料庫中。#需要檢測另—種其他不同之待測 基板3寸僅$將其所對應之標準樣本的資料調出，便能夠 甩以檢測其他制樣本巾，極性元件的極性方向。所以， 本發明之極性元狀姉方向自動檢财域具有便於更 換標準基板的諸及可應麟檢測錄待職板之優點。 綜上所述，本發明極性元件之極性方向自動檢測方法 至少具有下列優點： 一、 利用自動檢測方式代替人工目檢，可以節省人事 成本、降低極性方向配置錯誤的機率、提昇產品 的良率以及減少基板修復或重製的成本。Since the invention utilizes the image of the standard substrate and the substrate to be tested, and will be recorded in the geometrical seat of the element and the element on the plate, the fresh sample of the 昼素铺 and the sample of the 彳 彳 ( (4) To save the profit = α this ^ can be more than first to make a number of standard samples, and the standard sample first into the database. # Need to detect another - different substrate to be tested 3 inch only $ corresponding to it When the data of the standard sample is recalled, it is possible to detect the polarity direction of the other component sample towel and the polar component. Therefore, the polarity detection direction of the polarity element of the present invention has an easy-to-replace standard substrate and can be detected by the lining test. Advantages of the standby board. In summary, the method for automatically detecting the polarity direction of the polar component of the present invention has at least the following advantages: 1. Using the automatic detection method instead of the manual visual inspection, the personnel cost can be saved, the probability of misalignment in the polarity direction can be reduced, Improve product yield and reduce the cost of substrate repair or rework.
點。 二、 僅需更新標準樣本’便可以對不同之待測樣本進 行自動檢測，具有使用便利及應用範圍廣泛之優 雖然本發明已以一實施例揭露如上，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神^ 範圍内，當可作些許之更動與潤飾，因此本發明之:蠖二 圍當視後附之申請專利範圍所界定者為準。 ,、^ 【圖式簡單說明】 12 ϊ31〇〇〇845 19740twf.doc/e 圖1為本發明之極性元件的極性方向檢測方法的流程 圖。 圖2為本實施例之標準基板的局部示意圖。 圖3為圖2之標準基板的影像示意圖。 圖4為利用形狀框圈選標準基板之影像中一極性元件 的示意圖。 圖5為本實施例之待測基板的局部示意圖。 圖6為圖5之待測基板的影像示意圖。 鲁 圖7為將圖6之極性元件的晝素元素二值化後的示意 圖。 【主要元件符號說明】 100 :標準基板 110、210 :極性元件 112 :保護膜 200 :待測基板 210’ ：極性方向錯誤之極性元件point. Second, only need to update the standard sample, it can automatically detect different samples to be tested, and it has the advantages of convenience and wide application. Although the present invention has been disclosed in an embodiment, it is not intended to limit the present invention. Those skilled in the art will be able to make some modifications and refinements without departing from the spirit of the invention, and therefore the invention is defined by the scope of the appended claims. , , ^ [Simple description of the drawing] 12 ϊ31〇〇〇845 19740twf.doc/e Figure 1 is a flow chart showing the polar direction detecting method of the polar component of the present invention. 2 is a partial schematic view of a standard substrate of the present embodiment. 3 is a schematic view of the image of the standard substrate of FIG. 2. Figure 4 is a schematic illustration of a polar component in an image of a standard substrate circled by a shape frame. FIG. 5 is a partial schematic view of the substrate to be tested of the embodiment. FIG. 6 is a schematic diagram of the image of the substrate to be tested of FIG. 5. Lutu 7 is a schematic diagram of binarizing the elemental elements of the polar element of Fig. 6. [Description of main component symbols] 100: Standard substrate 110, 210: Polar component 112: Protective film 200: Substrate to be tested 210': Polar component with wrong polarity direction
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