CN111295938B

CN111295938B - Component mounting system and component mounting method

Info

Publication number: CN111295938B
Application number: CN201780096431.4A
Authority: CN
Inventors: 春日大介
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2017-12-15
Filing date: 2017-12-15
Publication date: 2021-06-29
Anticipated expiration: 2037-12-15
Also published as: KR102282096B1; JP6831479B2; CN111295938A; KR20200038523A; WO2019116530A1; JPWO2019116530A1

Abstract

The component mounting is performed as follows for the first 2 substrates in the conveyance order among the 4 substrates. That is, the 1 st substrate (B1) is transported to the 2 nd mounting position (Pm2) counted from the upstream side in the substrate transport direction (X) by the initial mounting mode, and the 2 nd substrate (B2) is transported to the 1 st mounting position (Pm1) counted from the upstream side in the substrate transport direction (X) by the normal mounting mode. Thus, the substrates (B2, B1) can be conveyed to each of the 2 mounting positions (Pm1, Pm2), and component mounting to the substrates (B2, B1) can be started at each mounting position (Pm1, Pm 2). This can suppress a decrease in the operation rate of the component mounting system (1).

Description

Component mounting system and component mounting method

Technical Field

The present invention relates to a technique of mounting components on a substrate at a plurality of mounting tables arranged in a substrate conveying direction while conveying the substrate in the substrate conveying direction.

Background

Conventionally, a component mounting system including a plurality of mounting portions arranged in a conveying direction of a substrate is known. In addition, as shown in patent document 1, in such a component mounting system, the mounting of components to 1 substrate can be divided into a plurality of mounting portions. That is, the substrate is transported in the transport direction and sequentially stopped at the plurality of mounting portions, and each mounting portion mounts the component responsible for the substrate being stopped. This makes it possible to achieve efficient component mounting.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2017-37902

Disclosure of Invention

Problems to be solved by the invention

However, depending on the situation, the above-described method may not be efficient. That is, the substrate that is first carried into the component mounting system is stopped at the mounting table (mounting portion) at the most upstream side in the carrying direction, and the component is mounted on the mounting table. During this time, the mounting table on the downstream side in the conveying direction from the mounting portion on the uppermost stream does not operate, and therefore, the component mounting system has a lower operation rate than the case where the mounting table on the downstream side operates. Such a decrease in the operating rate is particularly significant when a small number of substrates are transported in the component mounting system.

The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of suppressing a decrease in the operation rate of a component mounting system in which a plurality of mounting tables are arranged in a substrate conveying direction.

Means for solving the problems

The component mounting system of the present invention includes: a conveying part which is provided with M mounting tables arranged in the substrate conveying direction and conveys L substrates in the substrate conveying direction in sequence, wherein M is an integer more than 2, and L is an integer larger than M; m mounting portions provided corresponding to the M mounting tables and each capable of mounting the same type of component on the substrate stopped on the corresponding mounting table; and a control section that distributes components to a plurality of mounting target points provided on one substrate among the M mounting tables, conveys the one substrate in a substrate conveying direction by the conveying section and stops the one substrate at a mounting table, among the M mounting tables, to which component mounting is distributed, performs component mounting to the one substrate stopped at the mounting table corresponding to the mounting section, the mounting table conveys the substrate after completion of the distributed component mounting to a downstream side in a substrate conveying direction, the control section performs component mounting in an initial mounting mode for a substrate, among the L substrates, in which a conveying order N in the substrate conveying direction is smaller than M, performs component mounting in a normal mounting mode for a substrate in which the conveying order N is M or more, N being an integer of 1 or more, with respect to the substrate in the conveying order N in the initial mounting mode, the component mounting to the substrate is selectively assigned to the mounting table on the downstream side of the (M-N) th mounting table counted from the upstream side in the substrate conveying direction among the M mounting tables, the component mounting to the plurality of mounting target points of the substrate is performed at the mounting table on the downstream side of the (M-N) th mounting table by the substrate passing through the mounting tables up to the (M-N) th mounting table, the component mounting to the substrate is assigned to each of the M mounting tables in the normal mounting mode, the substrate is sequentially stopped at the M mounting tables, and the component mounting to the plurality of mounting target points of the substrate is sequentially performed at each of the M mounting tables.

The component mounting method of the present invention includes the steps of: sequentially conveying L substrates in a substrate conveying direction by using a conveying part provided with M mounting tables arranged in the substrate conveying direction, wherein M is an integer more than or equal to 2, and L is an integer larger than M; and mounting components to be mounted at a plurality of mounting target points provided on one substrate among the M mounting tables, the one substrate being transported in a substrate transport direction by a transport unit and being stopped at one of the M mounting tables to which component mounting is assigned, the one substrate stopped at the mounting table being subjected to component mounting assigned to the mounting table, the component mounting being performed in an initial mounting mode for a substrate in which a transport order N in the substrate transport direction is smaller than M among the L substrates, the component mounting being performed in a normal mounting mode for a substrate in which the transport order N is M or more, N being an integer of 1 or more, the component mounting being selectively assigned to the substrate in the initial mounting mode to a mounting table on a downstream side of a (M-N) th mounting table from an upstream side in the substrate transport direction among the M mounting tables with respect to the transport order N, the substrate passes through the mounting tables up to the (M-N) th mounting table, component mounting to a plurality of mounting target points of the substrate is performed at the mounting table on the downstream side of the (M-N) th mounting table, component mounting to the substrate is assigned to each of the M mounting tables in the normal mounting mode, the substrate is sequentially stopped at the M mounting tables, and component mounting to the plurality of mounting target points of the substrate is sequentially performed at each of the M mounting tables.

In the present invention (component mounting system, component mounting method) configured as described above, component mounting is distributed among M mounting tables for component mounting at a plurality of mounting target points provided on one substrate. And, the one substrate is transported in the substrate transport direction and stopped at a mounting stage assigned with component mounting among the M mounting stages, and component mounting assigned to the mounting stage is performed on the one substrate stopped at the mounting stage. At this time, component mounting is performed in the initial mounting mode for a substrate whose carrying order N in the substrate carrying direction is smaller than M among the L substrates, and component mounting is performed in the normal mounting mode for a substrate whose carrying order N is M or more. In the initial mounting mode, component mounting to the substrate is selectively assigned to a mounting stage on the downstream side of the (M-N) th mounting stage counted from the upstream side in the substrate conveying direction among the M mounting stages for the substrate in the conveying order N, and component mounting to a plurality of mounting target points of the substrate is performed at the mounting stage on the downstream side of the (M-N) th mounting stage by the substrate passing through the (M-N) th mounting stage. On the other hand, in the normal mounting mode, component mounting to the substrate is assigned to each of the M mounting tables, the substrate is sequentially stopped at the M mounting tables, and component mounting to a plurality of mounting target points of the substrate is sequentially performed at each of the M mounting tables.

Therefore, component mounting is performed as follows for the first M substrates in the conveyance order among the L substrates. That is, the 1 st to (M-1) th substrates are transported to the M-th to 2 nd mounting stations counted from the upstream side in the substrate transport direction by the initial mounting mode, and the M-th substrate is transported to the 1 st mounting station counted from the upstream side in the substrate transport direction by the normal mounting mode. In this way, the substrate can be transported to each of the M mounting stations, and component mounting to the substrate can be started at each mounting station. This can suppress a decrease in the operation rate of the component mounting system.

In the present specification, when I1 and I2 are equal in the descriptions of I1 th to I2 (I1 and I2 are integers of 1 or more), the descriptions indicate I1 th.

In the component mounting system, the transport unit may further include a standby table disposed between the mounting tables adjacent to each other in the substrate transport direction, and when component mounting is performed on a mounting table other than the mounting table on the most downstream side among the M mounting tables in the substrate transport direction on the mounting table adjacent to the downstream side, the transport unit may transport the assigned substrate on which component mounting is completed to the standby table on the downstream side, and transport the assigned substrate on which component mounting to the mounting target point is not completed from the upstream side in the substrate transport direction. In this configuration, the mounting tables other than the most downstream mounting table can quickly carry out the substrate after the completion of the mounting of the assigned component to the standby table and carry in the next substrate whose component mounting is not completed from the upstream side in the substrate conveying direction. As a result, the reduction in the operation rate of the component mounting system can be more effectively suppressed.

In the normal mounting mode, the component mounting system may be configured to assign component mounting to each of the M mounting tables such that a difference in the number of mounting target points at which components are mounted at each of the mounting tables is 1 or less, and in the initial mounting mode, the component mounting assigned to the (M-N +1) th mounting table counted from the upstream side in the substrate transport direction in the normal mounting mode may be assigned to the (M-N +1) th mounting table counted from the upstream side in the substrate transport direction in the transport order N for the substrate. In this configuration, when it is assumed that the normal mounting mode is executed for a substrate whose carrying order N is smaller than M, components assigned to the 1 st to (M-N +1) th mounting tables counted from the upstream side in the substrate carrying direction are assigned to the (M-N +1) th mounting table in the initial mounting mode. That is, in the initial mounting mode, with respect to the substrate in the carrying order N, although component mounting at the mounting table on the upstream side of the (M-N +1) th mounting table is omitted, the component mounting can be reliably performed at the (M-N +1) th mounting table.

In the component mounting system, the control unit may perform component mounting in a final stage mounting mode for a substrate having a carrying order N of (L-M +2) or more among the L substrates, and in the final stage mounting mode, component mounting to the substrate may be selectively assigned to the 1 st to (L-N +1) th mounting tables counted from the upstream side in the substrate carrying direction among the M mounting tables for the substrate having the carrying order N, and component mounting to the plurality of mounting target points of the substrate may be performed at the 1 st to (L-N +1) th mounting tables. In this configuration, component mounting to the substrate is selectively assigned to the 1 st to (L-N +1) th mounting tables counted from the upstream side in the substrate conveyance direction among the M mounting tables for the substrate in which the conveyance order N is (L-M +2) th or more among the L substrates, and component mounting to a plurality of mounting target points of the substrate is performed at the 1 st to (L-N +1) th mounting tables. Therefore, even if component mounting is being performed on the mounting tables downstream of the (L-N +1) th mounting table in the substrate conveying direction, the 1 st to (L-N +1) th mounting tables can be operated to efficiently perform component mounting on the substrate having the conveying order N of (L-M +2) or more. As a result, the reduction in the operation rate of the component mounting system can be more effectively suppressed.

In the normal mounting mode, the component mounting system may be configured to assign component mounting to the substrate to each of the M mounting tables such that a difference between the number of mounting target points at which components are mounted on each of the mounting tables is 1 or less, and in the final mounting mode, the component mounting system may be configured to assign component mounting to the (L-N +1) -th mounting table, which is the number of substrates in the transport order N, from the (L-N +1) -th mounting table, which is the number of substrates in the normal mounting mode, from the (L-N +1) -th mounting table, which is the number of substrates in the upstream side in the substrate transport direction. In this configuration, when it is assumed that the normal mounting mode is executed for a substrate having a carrying order N of (L-M +2) or more, components assigned to (L-N +1) -th to M-th mounting tables counted from the upstream side in the substrate carrying direction are assigned to the (L-N +1) -th mounting table in the final-stage mounting mode. That is, in the final stage mounting mode, with respect to the substrate in the carrying order N, although component mounting at the mounting table on the downstream side of the (L-N +1) th mounting table is omitted, the component mounting at the (L-N +1) th mounting table can be reliably performed.

In the component mounting system, the controller may adjust the assignment of component mounting between one of the M mounting tables and the other mounting tables in accordance with the progress of component mounting on at least one of the other mounting tables in the normal mounting mode. In this configuration, when the progress of component mounting at one mounting stage is slower than a predetermined level, for example, component mounting intended for one mounting stage can be distributed to other mounting stages.

Effects of the invention

According to the present invention, in the component mounting system in which the plurality of mounting tables are arranged in the substrate conveying direction, it is possible to suppress a decrease in the operation rate of the component mounting system.

Drawings

Fig. 1 is a plan view schematically showing an example of the component mounting system.

Fig. 2 is a flowchart showing an example of the carry-in determination process executed when the substrate is carried in the substrate carrying direction and mounted on the substrate execution part.

Fig. 3 is a flowchart showing an example of the mounting completion determination process executed when the component is carried in the substrate carrying direction and mounted on the substrate.

Fig. 4 is a diagram schematically showing a first example of the operation executed according to the flowcharts of fig. 2 and 3.

Fig. 5 is a diagram schematically showing a second example of the operation executed according to the flowcharts of fig. 2 and 3.

Fig. 6 is a diagram schematically showing a second example of the operation executed according to the flowcharts of fig. 2 and 3.

Fig. 7 is a flowchart showing an example of component mounting processing capable of executing recovery of the progress of component mounting.

Fig. 8 is a flowchart showing an example of the determination as to whether or not to perform the restoration in the component mounting process shown in fig. 7.

Fig. 9 is a diagram schematically showing an example of the operation executed according to the flowcharts of fig. 7 and 8.

Detailed Description

Fig. 1 is a plan view schematically showing an example of the component mounting system of the present invention. As shown in fig. 1, XYZ orthogonal coordinate axes including a substrate transport direction X, a width direction Y, and a vertical direction Z are appropriately used in the present specification. The substrate transport direction X and the width direction Y are parallel to and orthogonal to the horizontal direction, and the vertical direction Z is orthogonal to the substrate transport direction X and the width direction Y.

The component mounting system 1 is constituted by a 1-stage component mounter 10 which mounts components on a substrate B carried in from the upstream side in the substrate conveying direction X and carries out to the downstream side in the substrate conveying direction X. A plurality of mounting target points Bp are provided on the board B, and the control unit 100 of the component mounter 10 controls each unit of the component mounter 10 to mount 1 component Wp on each mounting target point Bp. Here, each member Wp is a die of the wafer W after dicing, and has the same structure.

The component mounter 10 includes a conveying section 2 that conveys a substrate B in a substrate conveying direction X. The conveying section 2 includes a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and a carry-out conveyor 25 arranged in this order in the substrate conveying direction X, and these conveyors 21 to 25 can cooperate to convey the substrate B in the substrate conveying direction X. The standby conveyor 21 makes the substrate B carried in from outside the component mounting system 1 stand by or hands over the substrate B to the mounting conveyor 22. The mounting conveyor 22 is provided at a mounting position Pm1 located downstream of the standby conveyor 21 in the substrate conveyance direction X, and fixes the substrate B received from the standby conveyor 21 at the mounting position Pm1 or transfers the substrate B to the standby conveyor 23. The standby conveyor 23 is provided at a standby position Pw located downstream of the mounting position Pm1 in the substrate conveyance direction X, and is configured to cause the substrate B received from the mounting conveyor 22 to stand by at the standby position Pw or to be handed over to the mounting conveyor 24. The mounting conveyor 24 is provided at a mounting position Pm2 located downstream of the standby position Pw in the substrate conveying direction X, and fixes the substrate B received from the standby conveyor 23 at the mounting position Pm2 or transfers the substrate B to the carry-out conveyor 25. The carry-out conveyor 25 is provided at a position downstream of the mounting position Pm2 in the substrate conveying direction X, and carries out the substrate B received from the mounting conveyor 24 to the outside of the component mounting system 1. In this way, in the transport unit 2, the M mounting positions Pm1, Pm2 are arranged in line in the substrate transport direction X, and the standby position Pw is arranged between the mounting positions Pm1, Pm2 adjacent in the substrate transport direction X. Here, M is an integer of 2 or more, and in the example of fig. 1, M is 2. In the following, the mounting positions Pm1 and Pm2 are referred to as mounting positions Pm without distinction.

The component mounter 10 further includes a component supply mechanism 3 that supplies components Wp. The component supply mechanism 3 includes a wafer storage unit 31 capable of storing a plurality of wafers W, and a wafer pull-out unit 33 for pulling out the wafers W from the wafer storage unit 31 to the wafer supply position Pp. The wafer storage unit 31 can move up and down in the vertical direction Z a rack for storing a plurality of wafer holders Wh holding wafers W in an aligned manner in the vertical direction Z, thereby positioning the wafer holders Wh at a height at which the wafer pull-out unit 33 can receive the wafers W and pushing out the wafer holders Wh to the wafer pull-out unit 33.

The wafer pull-out unit 33 includes a wafer support table 331 for supporting the wafer holder Wh, a fixed rail 332 for movably supporting the wafer support table 331 in the width direction Y, a ball screw 333 provided in the width direction Y and attached to the wafer support table 331, and a Y-axis motor 334 for driving the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in fig. 1, the wafer storage section 31 and the wafer supply position Pp are disposed so as to sandwich the transport section 2 in the width direction Y, and the wafer support table 331 passes below the transport section 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage 31 at a receiving position adjacent to the wafer storage 31, and moves to a wafer supply position Pp spaced apart from the wafer storage 31 in the width direction Y than the receiving position to pull the wafer W to the wafer supply position Pp.

The component supply mechanism 3 further includes a component take-out portion 35 that takes out the component Wp from the wafer supply position Pp. The part pickup portion 35 has a pickup head 36 capable of picking up the parts Wp from the wafer supply position Pp, and can drive the pickup head 36 in the XY direction. That is, the component pickup unit 35 includes a support member 351 for movably supporting the pickup head 36 in the substrate transport direction X and an X-axis motor 352 for driving a ball screw provided in the substrate transport direction X and attached to the pickup head 36, and the pickup head 36 can be moved in the substrate transport direction X by driving the ball screw by the X-axis motor 352. The component removing unit 35 includes a fixed rail 353 for movably supporting the support member 351 in the width direction Y, a ball screw 354 provided in the width direction Y and attached to the fixed rail 353, and a Y-axis motor 355 for driving the ball screw 354. Therefore, the extraction head 36 can be moved in the width direction Y together with the support member 351 by driving the ball screw 354 by the Y-axis motor 355.

The pickup head 36 includes a carriage 361 extending in the substrate transfer direction X, and 2 suction nozzles 362 rotatably supported by the carriage 361. Each nozzle 362 is positioned at either one of a downward suction position and an upward transfer position (position in fig. 1) by rotating about a rotation axis parallel to the substrate conveyance direction X. The carriage 361 can be lifted and lowered along with each suction nozzle 362.

In the component supply mechanism 3, the suction nozzle 362 in the suction position is moved downward from above to face the component Wp in the wafer supply position Pp, and the suction nozzle 362 is moved downward to contact the component Wp. The component supply mechanism 3 supplies a negative pressure to the suction nozzle 362 to raise the suction nozzle 362, thereby sucking the component Wp from the wafer supply position Pp. Then, the component supply mechanism 3 supplies the components Wp by positioning the suction nozzles 362 at the transfer position.

The component mounter 10 includes mounting

units

4A and 4B for mounting the components Wp supplied by the component supply mechanism 3 on the board B. In particular,

M mounting portions

4A and 4B are provided in a one-to-one correspondence relationship with the M mounting positions Pm1 and Pm2 (as described above, M is 2 in the example of fig. 1). That is, the mount portion 4A is provided corresponding to the mount position Pm1, and the mount portion 4B is provided corresponding to the mount position Pm 2. The mounting

units

4A and 4B include a support member 41 movable along a fixed rail provided on the ceiling of the component mounter 10 in the width direction Y, and a mounting head 42 supported by the support member 41 so as to be movable in the substrate transport direction X, and the mounting head 42 can be moved in the XY direction. The mounting head 42 has 2 suction nozzles 421 facing downward.

When the component Wp is sucked and mounted, the mounting

portions

4A and 4B are moved upward of the pickup head 36, respectively, and the suction nozzle 421 is moved backward from above with respect to the component Wp held by the suction nozzle 362 located at the transfer position, and the suction nozzle 421 is lowered to come into contact with the component Wp. Next, the component supply mechanism 3 releases the negative pressure of the suction nozzle 362, and the mounting

portions

4A and 4B supply the negative pressure to the suction nozzle 421 to raise the suction nozzle 421. When the component Wp is sucked by the mounting head 42 in this manner, the mounting unit 4A mounts the component Wp at the mounting target point Bp of the substrate B fixed at the corresponding mounting position Pm1, and the mounting unit 4B mounts the component Wp at the mounting target point Bp of the substrate B fixed at the corresponding mounting position P4. Thus, the mounting

portions

4A and 4B mount the single type of component Wp on the substrate B. In the following, the mounting

portions

4A and 4B are referred to as the mounting portions 4 without distinction.

In this component mounting system 1, the control section 100 can perform component mounting to the substrate B at the mounting positions Pm1, Pm 2. At this time, the control section 100 allocates (in other words, shares) the component mounting among the M mounting positions Pm1, Pm2 with respect to the plurality of mounting target points Bp provided on one substrate B. That is, the conveying section 2 conveys the one substrate B in the substrate conveying direction X and stops it at the mounting position Pm to which component mounting is assigned among the M mounting positions Pm1, Pm 2. Then, the mounting portion 4 performs component mounting assigned to the corresponding mounting position Pm for the one substrate B stopped at the corresponding mounting position Pm.

Normally, the controller 100 assigns the component mounting at the mounting point Bp on the upstream half in the substrate transport direction X of the plurality of mounting points Bp on the substrate B to the mounting position Pm1, and assigns the component mounting at the mounting point Bp on the downstream half in the substrate transport direction X to the mounting position Pm2 (normal mounting mode). Specifically, the transport unit 2 transports one substrate B to the mounting position Pm1, and the mounting unit 4A mounts the component Wp at a mounting target point Bp (normal distribution point) which is half of the upstream side of the substrate B stopped at the mounting position Pm1 in the substrate transport direction X. When the component mounting at the mounting position Pm1 is completed, the transport section 2 transports the substrate B from the mounting position Pm1 to the mounting position Pm2, and the mounting section 4B mounts the component Wp to a mounting target point Bp (normal distribution point) which is a half of the downstream side of the substrate B stopped at the mounting position Pm2 in the substrate transport direction X. That is, in the normal mounting mode, one substrate B is stopped at the mounting positions Pm1 and Pm2 in order, and component mounting assigned to the respective mounting positions Pm1 and Pm2 is performed on the one substrate B stopped at the respective mounting positions Pm1 and Pm 2. The control unit 100 can sequentially transfer the plurality of substrates B in the substrate transfer direction X, and can execute the normal mounting mode for each substrate B.

However, when L (L is an integer larger than M) substrates B are sequentially conveyed by the conveying unit 2 and component mounting is performed on each substrate B, the control unit 100 dynamically changes the assignment of component mounting to the mounting positions Pm1, Pm2 in accordance with the conveyance order N of the substrates B. This point will be described in detail with reference to fig. 2 to 4. Hereinafter, the downstream or upstream in the substrate transport direction X is simply referred to as "downstream" or "upstream" as appropriate.

Fig. 2 is a flowchart showing an example of the carry-in determination process executed when the substrate is carried in the substrate carrying direction and mounted on the substrate execution component, fig. 3 is a flowchart showing an example of the mounting completion determination process executed when the substrate is carried in the substrate carrying direction and mounted on the substrate execution component, and fig. 4 is a diagram schematically showing a first example of the operation executed according to the flowcharts of fig. 2 and 3. Fig. 4 shows an example in which 4 substrates B (i.e., L is 4) are sequentially conveyed in the substrate conveying direction X and component mounting is performed on each substrate B. In fig. 4, the order N (N is 1 to 4) of carrying the L substrates B is denoted by reference numeral B.

The control unit 100 executes the operation of fig. 4 by executing the entry time/mounting completion time determination processing shown in the flowcharts of fig. 2 and 3 with respect to the mounting positions Pm1 and Pm2, respectively. When the downstream end of the 1 st substrate B1 is carried into the mounting position Pm1 (yes in step S101 of fig. 2), it is determined whether or not there is an unmounted point of the unmounted component Wp among the plurality of mounting target points Bp of the substrate B1 (step S102). Since there is an unmounted point on the substrate B1 (yes in step S102), the process proceeds to step S103. In step S103, it is determined whether or not the present mounting position Pm1 is the most downstream mounting position Pm among the M mounting positions Pm1, Pm 2. Since the mounting position Pm1 is not the most downstream mounting position Pm (no in step S103), the process proceeds to step S104. In step S104, it is determined whether or not component mounting on the board B1 can be performed at the mounting position Pm2 downstream of the present mounting position Pm 1. Since there is no substrate B scheduled to perform component mounting at the mounting position Pm2, the mounting position Pm2 is capable of performing component mounting to the substrate B1 (yes in step S104), so step S105 is advanced. Then, in step S105, the control unit 100 determines that the component mounting on the board B1 is not distributed to the self mounting position Pm1 but distributed to the mounting position Pm2 on the downstream side.

By the decision in step S105, the substrate B1 is conveyed toward the mounting position Pm2 by the mounting position Pm 1. When the downstream end of the substrate B1 is thus carried into the mounting position Pm2 (yes in step S101), it is determined that there is an unmounted point of the substrate B1 (step S102). Since there is an unmounted point on the substrate B1 (yes in step S102), it is determined in step S103 whether or not the present mounting position Pm2 is the most downstream mounting position Pm. Since the mounting position Pm2 is the most downstream mounting position Pm (yes in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines to assign the component mounting of the board B1 to the mounting position Pm 2. Specifically, component mounting at the normal dispensing point (upstream half) of the mounting position Pm1 and at the normal dispensing point (downstream half) of the mounting position Pm2, which is the destination of the transfer of the substrate B1, is dispensed to the mounting position Pm2, without stopping the substrate B1. As a result, as shown in the column of action a101 in fig. 4, the board B1 is carried into the mounting position Pm2, and component mounting at all the mounting target points Bp of the board B1 is allocated to the mounting position Pm 2.

When the downstream end of the 2 nd substrate B2 is carried into the mounting position Pm1 (yes in step S101), it is determined in step S102 that an unmounted point is present on the substrate B2 (yes), it is further determined in step S103 that the present mounting position Pm1 is not the most downstream mounting position Pm (no), and the process proceeds to step S104. Since component mounting is scheduled to be performed on the just-previous substrate B1 at the downstream mounting position Pm2, it is determined in step S104 that component mounting of the substrate B2 cannot be performed at the mounting position Pm2 (no), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to assign the component mounting of the board B2 to the mounting position Pm 1. As a result, as shown in the column of action a101 in fig. 4, the board B2 is carried into the mounting position Pm1, and component mounting to the normal distribution point (the upstream half) of the mounting position Pm1 among all the mounting target points Bp of the board B2 is distributed to the mounting position Pm 1.

Then, at the mounting position Pm2, component mounting to the normal dispensing point of the mounting positions Pm1 and Pm2 is started with respect to the 1 st substrate B1, and at the mounting position Pm1, component mounting to the normal dispensing point of the mounting position Pm1 is started with respect to the 2 nd substrate B2. As shown in the column of action a102 of fig. 4, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B2 (yes in step S201), it is determined whether or not an unmounted point exists on the substrate B2 (step S202). Since the components Wp are not mounted on the downstream half of the plurality of mounting target points Bp of the board B2 (yes in step S202), the process proceeds to step S203. In step S203, it is determined whether or not the substrate B is present on the standby conveyor 21 upstream of the mounting position Pm 1. Since the 3 rd substrate B3 is present on the standby conveyor 21 (yes in step S203), the process proceeds to step S204. In step S204, it is determined whether or not the substrate B is present at the standby position Pw that is downstream of the mounting position Pm 1. Since there is no board B at the standby position Pw (no in step S204), the process proceeds to step S205. Then, in step S205, the substrate B2 is carried out to the standby position Pw that is downstream of the mounting position Pm1, and conveyance of the substrate B3 to the downstream is started.

When the downstream end of the 3 rd substrate B3 is carried into the mounting position Pm1 (yes in step S101), it is determined in step S102 that an unmounted point is present on the substrate B3 (yes), it is further determined in step S103 that the present mounting position Pm1 is not the most downstream mounting position Pm (no), and the process proceeds to step S104. Since the downstream mounting position Pm2 is performing component mounting to the immediately preceding substrate B1, it is determined in step S104 that component mounting of the substrate B3 cannot be performed at the mounting position Pm2 (no), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to assign the component mounting of the board B3 to the mounting position Pm 1. As a result, as shown in the column of action a103 in fig. 4, the board B3 is carried into the mounting position Pm1, and component mounting to the normal distribution point (the upstream half) of the mounting position Pm1 among all the mounting target points Bp of the board B3 is distributed to the mounting position Pm 1.

Then, at the mounting position Pm1, component mounting to the normal dispensing point of the mounting position Pm1 is started with respect to the 3 rd substrate B3. As shown in the column of action a104 of fig. 4, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B1 (yes in step S201 of fig. 3), it is determined whether or not an unmounted point exists on the substrate B1 (step S202). Since the components Wp are mounted on all the mounting target points Bp of the substrate B1 (no in step S202), the substrate B1 is carried out downstream from the mounting position Pm2 and the conveyance of the substrate B2 downstream is started as shown in the column of action a105 of fig. 4 (step S205).

In addition, as shown in the column of action a104 of fig. 4, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B3 (yes in step S201), it is determined whether or not an unterminated point exists on the substrate B3 (step S202). Since the components Wp are not mounted on the downstream half of the mounting target points Bp of the substrate B3 (yes in step S202), it is determined whether or not the substrate B is present on the upstream side of the mounting position Pm1, that is, on the standby conveyor 21 (step S203). Since the 4 th substrate B4 is present on the standby conveyor 21 (yes in step S203), the process proceeds to step S204. In step S204, it is determined whether or not the substrate B is present at the standby position Pw that is downstream of the mounting position Pm 1. Since the substrate B2 is carried out from the standby position Pw along with the carrying out of the substrate B1 from the mounting position Pm2, it is determined in step S204 that the substrate B is not present at the standby position Pw (no), and the process proceeds to step S205. Then, as shown in the column of action a105 in fig. 4, the substrate B3 is carried out from the mounting position Pm1 to the standby position Pw, and the downstream conveyance of the substrate B4 is started (step S205).

When the downstream end of the substrate B2 is carried into the mounting position Pm2 (yes in step S101), it is determined that there is an unmounted point of the substrate B2 (step S102). Since the components Wp are not mounted on the downstream half of the plurality of mounting target points Bp of the board B2 (yes in step S102), it is determined in step S103 whether or not the present mounting position Pm2 is the most downstream mounting position Pm. Since the mounting position Pm2 is the most downstream mounting position Pm (yes in step S103), the process proceeds to step S106. Then, in step S106, the control section 100 determines that component mounting to the non-mounted point of the substrate B2 is assigned to the present mounting position Pm 2. As a result, as shown in the column of action a105 in fig. 4, the board B2 is carried into the mounting position Pm2, and component mounting to the normal distribution point (the downstream half) of the mounting position Pm2 among all the mounting target points Bp of the board B2 is distributed to the mounting position Pm 2.

When the downstream end of the 4 th substrate B4 is carried into the mounting position Pm1 (yes in step S101), it is determined in step S102 that an unmounted point is present on the substrate B4 (yes), it is further determined in step S103 that the present mounting position Pm1 is not the most downstream mounting position Pm (no), and the process proceeds to step S104. Since the downstream mounting position Pm2 is intended to perform component mounting to the board B2 just before, it is determined in step S104 that component mounting of the board B4 cannot be performed at the mounting position Pm2 (no), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to assign the component mounting of the board B4 to the mounting position Pm 1. As a result, as shown in the column of action a105 in fig. 4, the board B4 is carried into the mounting position Pm1, and component mounting to the normal distribution point (the upstream half) of the mounting position Pm1 among all the mounting target points Bp of the board B4 is distributed to the mounting position Pm 1.

Then, at the mounting position Pm2, component mounting to the normal dispensing point of the mounting position Pm2 is started with respect to the 2 nd substrate B2, and at the mounting position Pm1, component mounting to the normal dispensing point of the mounting position Pm1 is started with respect to the 4 th substrate B4. As shown in the column of action a106 of fig. 4, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B2 (yes in step S201), it is determined whether or not an unmounted point exists on the substrate B2 (step S202). Since the components Wp are mounted on all the mounting target points Bp of the substrate B2 (no in step S202), the substrate B2 is carried out downstream from the mounting position Pm2 and the conveyance of the substrate B3 downstream is started as shown in the column of action a107 of fig. 4 (step S205).

As shown in the column of action a106 of fig. 4, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B4 (yes in step S201), it is determined whether or not an unmounted point exists on the substrate B4 (step S202). Since the components Wp are not mounted on the downstream half of the mounting target points Bp of the substrate B4 (yes in step S202), it is determined whether or not the substrate B is present on the upstream side of the mounting position Pm1, that is, on the standby conveyor 21 (step S203). Since there is no substrate B on the standby conveyor 21 (no in step S203), the process proceeds to step S206. In step S206, the control unit 100 determines to assign the component mounting of the board B4 to the mounting position Pm 1. As a result, as shown in the column of action a107 in fig. 4, the board B4 stays at the mounting position Pm1, and component mounting to the normal distribution point (the downstream half) of the mounting position Pm2 among all the mounting target points Bp of the board B4 is distributed to the mounting position Pm 1.

When the downstream end of the substrate B3 is carried into the mounting position Pm2 (yes in step S101), it is determined that there is an unmounted point of the substrate B3 (step S102). Since the components Wp are not mounted on the downstream half of the plurality of mounting target points Bp of the board B3 (yes in step S102), it is determined in step S103 whether or not the present mounting position Pm3 is the most downstream mounting position Pm. Since the mounting position Pm2 is the most downstream mounting position Pm (yes in step S103), the process proceeds to step S106. Then, in step S106, the control section 100 determines that component mounting to the non-mounted point of the substrate B3 is assigned to the present mounting position Pm 2. As a result, as shown in action a107 of fig. 4, the substrate B3 is carried into the mounting position Pm2, and component mounting at the normal distribution point (the downstream half) of the mounting position Pm2 among all the mounting target points Bp of the substrate B3 is distributed to the mounting position Pm 2.

Then, at the mounting position Pm2, component mounting to the normal dispensing point of the mounting position Pm2 is started with respect to the 3 rd substrate B3, and at the mounting position Pm1, component mounting to the normal dispensing point of the mounting position Pm2 is started with respect to the 4 th substrate B4. As shown in the column of action a108 of fig. 4, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B3 (yes in step S201), it is determined whether or not an unmounted point exists on the substrate B3 (step S202). Since the components Wp are mounted on all the mounting target points Bp of the substrate B3 (no in step S202), the substrate B3 is carried out downstream from the mounting position Pm2 (step S205).

As shown in the column of action a108 of fig. 4, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B4 (yes in step S201), it is determined whether or not an unmounted point exists on the substrate B4 (step S202). Since the components Wp are mounted on all the mounting target points Bp of the substrate B4 (no in step S202), the substrate B4 is carried out downstream from the mounting position Pm1 (step S205). Further, when the downstream end of the substrate B4 is carried into the mounting position Pm2 (yes in step S101), it is determined whether or not an unterminated point exists on the substrate B4 (step S102). Since the components Wp are mounted on all the mounting target points Bp of the substrate B4 (no in step S102), the substrate B4 is carried out downstream from the mounting position Pm1 in step S107.

In the embodiment configured as described above, the number M of mounting positions Pm is "2", and the number L of substrates B is "4". That is, the component mounting at the plurality of mounting target points Bp provided on one substrate B is distributed among the 2 mounting positions Pm1, Pm 2. Then, the one substrate B is transported in the substrate transport direction X and stopped at the mounting position Pm where component mounting is allocated among the 2 mounting positions Pm1, Pm2, and component mounting allocated to the mounting position Pm is performed on the one substrate B stopped at the mounting position Pm. At this time, component mounting is performed in the initial mounting mode (the operation with respect to the substrate B1 in the operations a101 to a 104) with respect to the substrate B1 whose carrying order N in the substrate carrying direction X is smaller than M among the 4 substrates B1 to B4, and component mounting is performed in the normal mounting mode (the operation with respect to the substrate B3 in the operations a103 to a 108) with respect to the substrate B3 whose carrying order N is M or more and smaller than (L-M + 2). In the initial mounting mode, with respect to the substrate B1 in the conveyance order 1, component mounting to the substrate B1 is selectively allocated to the mounting position Pm2 on the downstream side of the 1 st mounting position Pm1 counted from the upstream side in the substrate conveyance direction X among the 2 mounting positions Pm1, Pm 2. Therefore, the substrate B1 performs component mounting to the plurality of mounting target points Bp of the substrate B1 at the mounting position Pm2 on the downstream side of the 1 st mounting position Pm1 through the 1 st mounting position Pm 1. On the other hand, in the normal mounting mode, component mounting to the substrate B3 is assigned to each of the 2 mounting positions Pm1, Pm2, the substrate B3 is sequentially stopped at the 2 mounting positions Pm1, Pm2, and component mounting to the plurality of mounting target points Bp of the substrate B3 is sequentially performed at each of the 2 mounting positions Pm1, Pm 2.

Therefore, component mounting is performed as follows with respect to 2 substrates that are the most advanced in the order of conveyance among the 4 substrates. That is, the 1 st substrate B1 is carried to the 2 nd mounting position Pm2 counted from the upstream side in the substrate carrying direction X in the initial mounting mode, and the 2 nd substrate B2 is carried to the 1 st mounting position Pm1 counted from the upstream side in the substrate carrying direction X in the normal mounting mode. In this way, the substrates B2 and B1 can be conveyed to the respective 2 mounting positions Pm1 and Pm2, and component mounting to the substrates B2 and B1 can be started at the respective mounting positions Pm1 and Pm 2. This can suppress a decrease in the operation rate of the component mounting system 1.

The conveying unit 2 further has a standby position Pw disposed between the mounting positions Pm1 and Pm2 adjacent to each other in the substrate conveying direction X. When component mounting is performed at the mounting position Pm2 adjacent on the downstream side at the mounting position Pm1 other than the most downstream mounting position Pm2 among the 2 mounting positions Pm1 and Pm2 in the substrate transport direction X, the assigned substrate B on which component mounting is completed is carried out to the standby position Pw on the downstream side, and the assigned substrate B on which component mounting is not completed is carried in from the upstream side in the substrate transport direction X (the substrates B2, B3, and the like in acts a102 to a 103). In this configuration, at the mounting position Pm1 other than the most downstream mounting position Pm2, the allocated substrate B after component mounting is completed is quickly carried out to the standby position Pw, and the next substrate B after component mounting is not completed is carried in from the upstream side in the substrate conveying direction X. As a result, the reduction in the operation rate of the component mounting system 1 can be more effectively suppressed.

In the normal mounting mode, component mounting to the substrate B is assigned to each of the 2 mounting positions Pm1 and Pm2 so that the difference in the number of mounting target points Bp at which the components Wp are mounted at each of the mounting positions Pm1 and Pm2 is 1 or less (in the above-described embodiment, the difference in the number is zero). On the other hand, in the initial mounting mode, component mounting assigned to the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate transport direction X in the normal mounting mode is assigned to the 2 nd mounting position Pm2 counted from the upstream side in the substrate transport direction X with respect to the substrate B1 in the transport order 1. In this configuration, when assuming that the normal mounting mode is executed for the substrate B1 whose carrying order N is smaller than M, the component mounted at the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate carrying direction X is assigned to the 2 nd mounting position Pm2 in the initial mounting mode. That is, in the initial mounting mode, with respect to the substrate B1 in the conveyance order 1, although component mounting at the mounting position Pm1 on the upstream side from the 2 nd mounting position Pm2 is omitted, the component mounting can be reliably performed at the 2 nd mounting position Pm 2.

In the normal mounting mode, the difference between the number of mounting target points Bp at which the component Wp is mounted at the mounting positions Pm1 and Pm2 is 1 or less, whereby the mounting times at the mounting positions Pm1 and Pm2 can be equalized. That is, when the number of mounting target points Bp at the respective mounting positions Pm1, Pm2 is substantially equal, the conveyance of the substrate B from the respective mounting positions Pm1, Pm2 can be performed substantially simultaneously. The number of mounting target points Bp at the respective mounting positions Pm1 and Pm2 may be determined so that the mounting times at the respective mounting positions Pm1 and Pm2 are equalized. In this case, even if the mounting times at the mounting positions Pm1 and Pm2 cannot be made completely equal, the number of mounting target points Bp at the mounting positions Pm1 and Pm2 can be determined so as to suppress the difference in mounting time at the mounting positions Pm1 and Pm 2.

The controller 100 performs component mounting on the board B4, which is the 4 th or higher board among the 4 boards B1 to B4 in the final mounting mode (operation with respect to the board B4 in the operations a105 to a 108). In the final mounting mode, with respect to the substrate B4 in the conveyance order 4, component mounting to the substrate B4 is selectively allocated to the 1 st mounting position Pm1 counted from the upstream side in the substrate conveyance direction X among the 2 mounting positions Pm1, Pm2, and component mounting to the plurality of mounting target points Bp of the substrate B4 is performed at the 1 st mounting position Pm 1. In this structure, component mounting to the substrate B4 is selectively allocated to the 1 st mounting position Pm1 counted from the upstream side in the substrate conveyance direction X among the 2 mounting positions Pm1, Pm2 with respect to the substrate B4 in which the conveyance order N is the (L-M +2) th or higher among the 4 substrates B1 to B4, and component mounting to the plurality of mounting target points Bp of the substrate B4 is performed at the 1 st mounting position Pm 1. Therefore, even if component mounting is performed at the mounting position Pm2 on the downstream side of the 1 st mounting position Pm1 in the substrate transport direction X, component mounting can be efficiently performed on the substrate B4 whose transport order N is the (L-M +2) th or higher by operating the 1 st mounting position Pm 1. As a result, the reduction in the operation rate of the component mounting system 1 can be more effectively suppressed.

In the final mounting mode, component mounting to the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate transport direction X in the normal mounting mode is assigned to the 1 st mounting position Pm1 counted from the upstream side in the substrate transport direction X with respect to the substrate B4 in the transport order 4. In this configuration, when assuming that the normal mounting mode is executed for the substrate B4 whose carrying order N is the (L-M +2) th or higher, the component mounting to the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate carrying direction X is assigned to the 1 st mounting position Pm1 in the final mounting mode. That is, in the final mounting mode, with respect to the substrate B4 in the conveyance order 4, although component mounting at the mounting position Pm2 on the downstream side of the 1 st mounting position Pm1 is omitted, it is possible to reliably perform component mounting at the 1 st mounting position Pm 1.

Fig. 5 and 6 are diagrams schematically showing a second example of the operation executed according to the flowcharts of fig. 2 and 3. Fig. 5 and 6 show an example in which 8 substrates B (i.e., L is 8) are sequentially transported in the substrate transport direction X and component mounting is performed on each substrate B. In fig. 5 and 6, the order N (N is 1 to 8) of carrying the L substrates B is denoted by reference numeral B.

As shown in fig. 5 and 6, in the conveying section 2, a standby conveyor 26 and a mounting conveyor 27 are arranged in order in the substrate conveying direction X between the mounting conveyor 24 and the carry-out conveyor 25 (fig. 1), the standby conveyor 26 stops and fixes the substrate B at a standby position Pw2, and the mounting conveyor 27 stops and fixes the substrate B at a mounting position Pm 3. That is, in the transport unit 2, M mounting positions Pm1, Pm2, Pm3 are arranged in line in the substrate transport direction X, a standby position Pw1 is disposed between the mounting positions Pm1, Pm2 adjacent in the substrate transport direction X, and a standby position Pw2 is disposed between the mounting positions Pm2, Pm3 adjacent in the substrate transport direction X. Here, in the example of fig. 5 and 6, M is 3, 3 mounting portions 4 are provided in one-to-one correspondence with 3 mounting positions Pm1, Pm2, Pm3, and each mounting portion 4 performs component mounting on the substrate B stopped at the corresponding mounting position Pm. In the following description, the mounting positions Pm1, Pm2, and Pm3 are referred to as mounting positions Pm, and the standby positions Pw1 and Pw2 are referred to as standby positions Pw.

In the second example, when the L substrates B are sequentially transported by the transport unit 2 and component mounting is performed on each substrate B, the control unit 100 dynamically changes the assignment of component mounting to the mounting positions Pm1, Pm2, and Pm3 in accordance with the transport order N of the substrates B. At this time, the mounting target point Bp allocated to each of the mounting positions Pm1, Pm2, and Pm3 in the normal mounting mode differs from that in the first example, according to the difference in the number of mounting positions Pm. That is, with respect to the plurality of mounting target points Bp of the substrate B, the component Wp is mounted to the mounting target point Bp (normal distribution point) of 1 out of 3 on the upstream side at the mounting position Pm1, the component Wp is mounted to the mounting target point Bp (normal distribution point) of 1 out of 3 on the center at the mounting position Pm2, and the component Wp is mounted to the mounting target point Bp (normal distribution point) of 1 out of 3 on the downstream side at the mounting position Pm 3.

The control unit 100 executes the operations of fig. 5 and 6 by executing the entry time/mounting completion time determination processing shown in the flowcharts of fig. 2 and 3 with respect to the mounting positions Pm1, Pm2, and Pm3, respectively. The details of the determination based on the flowcharts of fig. 2 and 3 are the same as those of the first example described above, and therefore the description thereof is omitted as appropriate.

As shown in the operation a201 of fig. 5, as a result of the determination process when the 1 st substrate B1 is transported in the substrate transport direction X and the substrate B1 is carried out at each of the mounting positions Pm1, Pm2, and Pm3, the substrate B1 is carried into the mounting position Pm3 at the mounting positions Pm1 and Pm2, and component mounting on the substrate B1 is allocated to the mounting position Pm 3. Specifically, component mounting at the normal distribution point of the mounting positions Pm1 and Pm2 through which the substrate B1 passes without stopping and at the normal distribution point of the mounting position Pm3 that is the destination of carrying in the substrate B1 is distributed to the mounting position Pm 3. Thus, component mounting to all the mounting target points Bp of the board B1 is assigned to the mounting position Pm 3.

Further, as a result of the determination processing when the 2 nd substrate B2 is conveyed in the substrate conveying direction X and the substrate B2 is carried in at each of the mounting positions Pm1 and Pm2, the substrate B2 is carried in to the mounting position Pm2 by the mounting position Pm1, and component mounting to the substrate B2 is allocated to the mounting position Pm 2. Specifically, component mounting at the normal dispensing point of the mounting position Pm1 through which the substrate B2 passes without stopping and at the normal dispensing point of the mounting position Pm2 that is the destination of carrying in the substrate B2 is dispensed to the mounting position Pm 2. Thus, component mounting to the mounting target point Bp 2/3 on the upstream side of the board B2 is assigned to the mounting position Pm 2.

Further, as a result of carrying the 3 rd substrate B3 in the substrate carrying direction X and performing the carry-in determination process for the substrate B3 at the mounting position Pm1, the substrate B3 is carried into the mounting position Pm1, and component mounting for the substrate B3 is assigned to the mounting position Pm 1. Specifically, component mounting at a normal distribution point with respect to the mounting position Pm1 is distributed to the mounting position Pm 1. Thus, component mounting to the mounting target point Bp (normal dispensing point) of 1/3 on the upstream side of the board B3 is dispensed to the mounting position Pm 1.

Then, at the mounting position Pm3, component mounting to the normal distribution point of the mounting positions Pm1, Pm2, Pm3 is started with respect to the 1 st substrate B1, at the mounting position Pm2, component mounting to the normal distribution point of the mounting positions Pm1, Pm2 is started with respect to the 2 nd substrate B2, and at the mounting position Pm1, component mounting to the normal distribution point of the mounting position Pm1 is started with respect to the 1 st substrate B3. As shown in the column of action a202 of fig. 5, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B3, the mounting completion time judgment processing is performed at the mounting position Pm 1. As a result, as shown in the column of action a203 in fig. 5, the board B3 is carried out from the mounting position Pm1 to the standby position Pw 1. At the same time, the conveyance of the 4 th substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is conveyed to the mounting position Pm1, the conveyance time judgment process is executed at the mounting position Pm 1. As a result, as shown in the column of action a203 in fig. 5, the board B4 is carried into the mounting position Pm1, and the component mounting on the board B4 is distributed to the mounting position Pm 1. Thereby, component mounting to a normal distribution point of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm1, and the component mounting is started with respect to the substrate B4 at the mounting position Pm 1.

As shown in the column of action a204 of fig. 5, when the component mounted with respect to the substrate B2 allocated at the mounting position Pm2, the mounting completion judgment processing is executed at the mounting position Pm 2. As a result, as shown in the column of action a205 of fig. 5, the board B2 is carried out from the mounting position Pm2 to the standby position Pw 2. At the same time, when the downstream end of the substrate B3 is carried into the mounting position Pm2 at the start of the downstream conveyance of the substrate B3, the carry-in determination process is executed at the mounting position Pm 2. As a result, as shown in the column of action a205 of fig. 5, the board B3 is carried into the mounting position Pm2, and the component mounting on the board B3 is distributed to the mounting position Pm 2. Thereby, component mounting to a normal distribution point of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B3 is distributed to the mounting position Pm2, and the component mounting is started with respect to the substrate B3 at the mounting position Pm 2.

As shown in the column of action a204 of fig. 5, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B4, the mounting completion time judgment processing is executed at the mounting position Pm 1. As a result, as shown in the column of action a205 of fig. 5, the board B4 is carried out from the mounting position Pm1 to the standby position Pw 1. At the same time, the conveyance of the 5 th substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is conveyed to the mounting position Pm1, the conveyance time judgment process is executed at the mounting position Pm 1. As a result, as shown in the column of action a205 of fig. 5, the board B5 is carried into the mounting position Pm1, and the component mounting on the board B5 is distributed to the mounting position Pm 1. Thereby, component mounting to a normal distribution point of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm1, and the component mounting is started with respect to the substrate B5 at the mounting position Pm 1.

As shown in the column of action a206 of fig. 5, when the component mounting assigned at the mounting position Pm3 is completed with respect to the substrate B1, the mounting completion time judgment processing is executed at the mounting position Pm 3. As a result, as shown in the column of action a207 of fig. 5, the substrate B1 is carried out from the mounting position Pm 3. At the same time, when the downstream end of the substrate B2 is carried into the mounting position Pm3 at the start of the downstream conveyance of the substrate B2, the carry-in determination process is executed at the mounting position Pm 3. As a result, as shown in the column of action a207 of fig. 5, the board B2 is carried into the mounting position Pm3, and the component mounting on the board B2 is distributed to the mounting position Pm 3. Thereby, component mounting to a normal distribution point of the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B2 is distributed to the mounting position Pm3, and the component mounting is started with respect to the substrate B2 at the mounting position Pm 3.

As shown in the column of action a206 of fig. 5, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B3, the mounting completion time judgment processing is executed at the mounting position Pm 2. As a result, as shown in the column of action a207 of fig. 5, the board B3 is carried out from the mounting position Pm2 to the standby position Pw 2. At the same time, when the downstream end of the substrate B4 is carried into the mounting position Pm2 at the start of the downstream conveyance of the substrate B4, the carry-in determination process is executed at the mounting position Pm 2. As a result, as shown in the column of action a207 of fig. 5, the board B4 is carried into the mounting position Pm2, and the component mounting on the board B4 is distributed to the mounting position Pm 2. Thereby, component mounting to a normal distribution point of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm2, and the component mounting is started with respect to the substrate B4 at the mounting position Pm 2.

As shown in the column of action a206 of fig. 5, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B5, the mounting completion-time determination processing is performed at the mounting position Pm 1. As a result, as shown in the column of action a207 of fig. 5, the board B5 is carried out from the mounting position Pm1 to the standby position Pw 1. At the same time, the conveyance of the 6 th substrate B6 to the downstream is started, and when the downstream end of the substrate B6 is conveyed to the mounting position Pm1, the conveyance time judgment process is executed at the mounting position Pm 1. As a result, as shown in the column of action a207 of fig. 5, the board B6 is carried into the mounting position Pm1, and the component mounting on the board B6 is distributed to the mounting position Pm 1. Thereby, component mounting to a normal distribution point of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm1, and the component mounting is started with respect to the substrate B6 at the mounting position Pm 1.

As shown in the column of action a208 of fig. 5, when the component mounting assigned at the mounting position Pm3 is completed with respect to the substrate B2, the mounting completion time judgment processing is performed at the mounting position Pm 3. As a result, as shown in the operation a209 in fig. 6, the substrate B2 is carried out from the mounting position Pm 3. At the same time, when the downstream end of the substrate B3 is carried into the mounting position Pm3 at the start of the downstream conveyance of the substrate B3, the carry-in determination process is executed at the mounting position Pm 3. As a result, as shown in the operation a209 in fig. 5, the board B3 is carried into the mounting position Pm3, and the component mounting on the board B3 is distributed to the mounting position Pm 3. Thereby, component mounting to a normal distribution point of the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B3 is distributed to the mounting position Pm3, and the component mounting is started with respect to the substrate B3 at the mounting position Pm 3.

As shown in the column of action a208 of fig. 5, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B4, the mounting completion time judgment processing is performed at the mounting position Pm 2. As a result, as shown in the column of action a209 of fig. 5, the board B4 is carried out from the mounting position Pm2 to the standby position Pw 2. At the same time, when the downstream end of the substrate B5 is carried into the mounting position Pm2 at the start of the downstream conveyance of the substrate B5, the carry-in determination process is executed at the mounting position Pm 2. As a result, as shown in the operation a209 in fig. 5, the board B5 is carried into the mounting position Pm2, and the component mounting on the board B5 is distributed to the mounting position Pm 2. Thereby, component mounting to a normal distribution point of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm2, and the component mounting is started with respect to the substrate B5 at the mounting position Pm 2.

As shown in the column of action a208 of fig. 5, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B6, the mounting completion time judgment processing is performed at the mounting position Pm 1. As a result, as shown in the operation a209 in fig. 6, the board B6 is carried out from the mounting position Pm1 to the standby position Pw 1. At the same time, the conveyance of the 7 th substrate B7 to the downstream is started, and when the downstream end of the substrate B7 is conveyed to the mounting position Pm1, the conveyance time judgment process is executed at the mounting position Pm 1. As a result, as shown in the column of action a209 of fig. 6, the board B7 is carried into the mounting position Pm1, and the component mounting on the board B7 is distributed to the mounting position Pm 1. Thereby, component mounting to a normal distribution point of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B7 is distributed to the mounting position Pm1, and the component mounting is started with respect to the substrate B7 at the mounting position Pm 1.

As shown in the column of action a210 of fig. 6, when the component mounting assigned at the mounting position Pm3 is completed with respect to the substrate B3, the mounting completion time judgment processing is executed at the mounting position Pm 3. As a result, as shown in the operation a211 of fig. 6, the substrate B3 is carried out from the mounting position Pm 3. At the same time, when the downstream end of the substrate B4 is carried into the mounting position Pm3 at the start of the downstream conveyance of the substrate B4, the carry-in determination process is executed at the mounting position Pm 3. As a result, as shown in the column of action a211 in fig. 6, the board B4 is carried into the mounting position Pm3, and the component mounting on the board B4 is assigned to the mounting position Pm 3. Thereby, component mounting to a normal distribution point of the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm3, and the component mounting is started with respect to the substrate B4 at the mounting position Pm 3.

As shown in the column of action a210 of fig. 6, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B5, the mounting completion time judgment processing is executed at the mounting position Pm 2. As a result, as shown in the column of action a211 in fig. 6, the board B5 is carried out from the mounting position Pm2 to the standby position Pw 2. At the same time, when the downstream end of the substrate B6 is carried into the mounting position Pm2 at the start of the downstream conveyance of the substrate B6, the carry-in determination process is executed at the mounting position Pm 2. As a result, as shown in the column of action a211 in fig. 6, the board B6 is carried into the mounting position Pm2, and the component mounting on the board B6 is distributed to the mounting position Pm 2. Thereby, component mounting to a normal distribution point of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm2, and the component mounting is started with respect to the substrate B6 at the mounting position Pm 2.

As shown in the column of action a210 of fig. 6, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B7, the mounting completion time judgment processing is executed at the mounting position Pm 1. As a result, as shown in the column of action a211 in fig. 6, the board B7 is carried out from the mounting position Pm1 to the standby position Pw 1. At the same time, the conveyance of the 8 th substrate B8 to the downstream is started, and when the downstream end of the substrate B8 is conveyed to the mounting position Pm1, the conveyance time judgment process is executed at the mounting position Pm 1. As a result, as shown in the column of action a211 in fig. 6, the board B8 is carried into the mounting position Pm1, and the component mounting on the board B8 is distributed to the mounting position Pm 1. Thereby, component mounting to a normal distribution point of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B8 is distributed to the mounting position Pm1, and the component mounting is started with respect to the substrate B8 at the mounting position Pm 1.

As shown in the column of action a212 of fig. 6, when the component mounting assigned at the mounting position Pm3 is completed with respect to the substrate B4, the mounting completion time judgment processing is executed at the mounting position Pm 3. As a result, as shown in the column of action a213 in fig. 6, the substrate B4 is carried out from the mounting position Pm 3. At the same time, when the downstream end of the substrate B5 is carried into the mounting position Pm3 at the start of the downstream conveyance of the substrate B5, the carry-in determination process is executed at the mounting position Pm 3. As a result, as shown in the column of action a213 in fig. 6, the board B5 is carried into the mounting position Pm3, and the component mounting on the board B5 is distributed to the mounting position Pm 3. Thereby, component mounting to a normal distribution point of the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm3, and the component mounting is started with respect to the substrate B5 at the mounting position Pm 3.

As shown in the column of action a212 of fig. 6, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B6, the mounting completion time judgment processing is executed at the mounting position Pm 2. As a result, as shown in the column of action a213 in fig. 6, the board B6 is carried out from the mounting position Pm2 to the standby position Pw 2. At the same time, when the downstream end of the substrate B7 is carried into the mounting position Pm2 at the start of the downstream conveyance of the substrate B7, the carry-in determination process is executed at the mounting position Pm 2. As a result, as shown in the column of action a213 in fig. 6, the board B7 is carried into the mounting position Pm2, and the component mounting on the board B7 is distributed to the mounting position Pm 2. Thereby, component mounting to a normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B7 is distributed to the mounting position Pm2, and the component mounting is started with respect to the substrate B7 at the mounting position Pm 2.

As shown in the column of action a212 of fig. 6, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B8, the mounting completion time judgment processing is executed at the mounting position Pm 1. As a result, as shown in the column of action a213 in fig. 6, the board B8 stays at the mounting position Pm1, and component mounting to the board B8 is distributed to the mounting position Pm 1. Thereby, component mounting to a normal distribution point of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B8 is distributed to the mounting position Pm1, and the component mounting is started with respect to the substrate B8 at the mounting position Pm 1.

As shown in the column of action a214 of fig. 6, after the mounting of the component assigned at the mounting position Pm3 is completed with respect to the substrate B5, the mounting completion judgment processing is performed at the mounting position Pm 3. As a result, as shown in the column of action a215 of fig. 6, the substrate B5 is carried out from the mounting position Pm 3. At the same time, when the downstream end of the substrate B6 is carried into the mounting position Pm3 at the start of the downstream conveyance of the substrate B6, the carry-in determination process is executed at the mounting position Pm 3. As a result, as shown in the column of action a215 of fig. 6, the substrate B6 is carried into the mounting position Pm3, and the component mounting on the substrate B6 is distributed to the mounting position Pm 3. Thereby, component mounting to a normal distribution point of the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm3, and the component mounting is started with respect to the substrate B6 at the mounting position Pm 3.

As shown in the column of action a214 of fig. 6, when the component mounting assigned at the mounting position Pm2 is completed with respect to the substrate B7, the mounting completion time judgment processing is executed at the mounting position Pm 2. As a result, as shown in the column of action a215 of fig. 6, the board B7 stays at the mounting position Pm2, and component mounting on the board B7 is distributed to the mounting position Pm 2. Thereby, component mounting to the normal dispensing point of the mounting position Pm3 is allocated to the mounting position Pm2, and the component mounting is started with respect to the substrate B7 at the mounting position Pm 2.

As shown in the column of action a214 of fig. 6, when the component mounting assigned at the mounting position Pm1 is completed with respect to the substrate B8, the mounting completion time judgment processing is executed at the mounting position Pm 1. As a result, as shown in the column of action a215 of fig. 6, the board B8 stays at the mounting position Pm1, and component mounting on the board B8 is distributed to the mounting position Pm 1. Thereby, component mounting to the normal dispensing point of the mounting position Pm3 is allocated to the mounting position Pm1, and the component mounting is started with respect to the substrate B8 at the mounting position Pm 3.

As shown in the action a216 of fig. 6, when the component mounting to the substrates B6, B7, and B8 assigned to the mounting positions Pm3, Pm2, and Pm1 is completed, the substrates B6, B7, and B8 are carried out from the conveying unit 2 in accordance with the mounting completion time/carrying in time determination process. Thus, the mounting of the components on the L (8) substrates B1 to B8 is completed.

In the embodiment configured as described above, the number M of mounting positions Pm is "3" and the number L of substrates B is "8". That is, the component mounting with respect to the plurality of mounting target points Bp provided on one substrate B is distributed among the 3 mounting positions Pm1, Pm2, Pm 3. And, the one substrate B is transported in the substrate transport direction X and stopped at the mounting position Pm allocated for component mounting among the 3 mounting positions Pm1, Pm2, Pm3, and component mounting allocated to the mounting position Pm is performed on the one substrate B stopped at the mounting position Pm. At this time, component mounting is performed in the initial mounting mode (operations with respect to the substrates B1 and B2 in the operations a201 to a 208) for the substrates B1 and B2 in which the carrying order N in the substrate carrying direction X is smaller than M among the 8 substrates B1 to B8, and component mounting is performed in the normal mounting mode (operations with respect to the substrates B3 to B6 in the operations a201 to a 216) for the substrates B3 to B6 in which the carrying order N is equal to or larger than M and smaller than (L-M + 2). In the initial mounting mode, with respect to the substrate B1 in the conveyance order 1, component mounting to the substrate B1 is selectively allocated to the mounting position Pm3 on the downstream side of the 2 nd mounting position Pm2 counted from the upstream side in the substrate conveyance direction X among the 3 mounting positions Pm1, Pm2, Pm 3. Therefore, the board B1 performs component mounting on the board B1 at the mounting position Pm3 on the downstream side of the 2 nd mounting position Pm2 by the 1 st to 2 nd mounting positions Pm1 and Pm2 at the plurality of mounting target points Bp. Further, regarding the substrate B2 in the conveyance order 1, component mounting to the substrate B2 is selectively allocated to the mounting positions Pm2 and Pm3 on the downstream side of the 1 st mounting position Pm1 counted from the upstream side in the substrate conveyance direction X among the 3 mounting positions Pm1, Pm2 and Pm 3. Therefore, the substrate B1 performs component mounting to the plurality of mounting target points Bp of the substrate B2 at the mounting positions Pm2, Pm3 on the downstream side of the 1 st mounting position Pm1 through the 1 st mounting position Pm 1. On the other hand, in the normal mounting mode, component mounting to the substrates B3 to B6 is assigned to each of the 3 mounting positions Pm1, Pm2, and Pm3, the substrates B3 to B6 are sequentially stopped at the 3 mounting positions Pm1, Pm2, and Pm3, and component mounting to the plurality of mounting target points Bp of the substrates B3 to B6 is sequentially performed at each of the 3 mounting positions Pm1, Pm2, and Pm 3.

Therefore, component mounting is performed as follows for the first 3 substrates in the conveyance order among the 8 substrates. That is, the 1 st substrate B1 is carried to the 3 rd mounting position Pm3 counted from the upstream side in the substrate carrying direction X in the initial mounting mode, the 2 nd substrate B2 is carried to the 2 nd mounting position Pm2 counted from the upstream side in the substrate carrying direction X in the initial mounting mode, and the 3 rd substrate B3 is carried to the 1 st mounting position Pm1 counted from the upstream side in the substrate carrying direction X in the normal mounting mode. In this way, the substrates B3, B2, and B1 are transported to the respective 3 mounting positions Pm1, Pm2, and Pm3, and component mounting to the substrates B3, B2, and B1 can be started at the respective mounting positions Pm1, Pm2, and Pm 3. This can suppress a decrease in the operation rate of the component mounting system 1.

The transport unit 2 further includes standby positions Pw1 and Pw2 disposed between the mounting positions Pm1, Pm2, and Pm3 adjacent to each other in the substrate transport direction X. Further, in the substrate transport direction X, when component mounting is performed at the mounting positions Pm1 and Pm2 adjacent to the downstream side at the mounting position Pm2 and Pm3 with respect to the mounting position Pm3 other than the most downstream mounting position Pm1, Pm2, and Pm3 among the 3 mounting positions Pm1, Pm2, and Pm3, the assigned substrate B after component mounting is completed is transported out to the standby positions Pw1 and Pw2 on the downstream side, and the assigned substrate B whose component mounting is not completed is transported in from the upstream side in the substrate transport direction X (the substrates B2, B4, and the like in acts a204 to a 205). In this configuration, at the mounting positions Pm1 and Pm2 other than the most downstream mounting position Pm3, the allocated substrate B after component mounting is quickly carried out to the standby positions Pw1 and Pw2, and the next substrate B after component mounting is not completed is carried in from the upstream side in the substrate transport direction X. As a result, the reduction in the operation rate of the component mounting system 1 can be more effectively suppressed.

In the normal mounting mode, component mounting on the substrate B is allocated to each of the 3 mounting positions Pm1, Pm2, and Pm3 so that the difference in the number of mounting target points Bp at which the components Wp are mounted at each of the mounting positions Pm1, Pm2, and Pm3 is 1 or less (in the above-described embodiment, the difference in the number is zero). On the other hand, in the initial mounting mode, component mounting allocated to the 1 st to 3 rd mounting positions Pm1, Pm2, Pm3 counted from the upstream side in the substrate transport direction X in the normal mounting mode is allocated to the 3 rd mounting position Pm3 counted from the upstream side in the substrate transport direction X with respect to the substrate B1 in the transport order 1. In this configuration, components assigned to the 1 st to 3 rd mounting positions Pm1, Pm2, Pm3 counted from the upstream side in the substrate conveyance direction X are assigned to the 3 rd mounting position Pm3 in the initial mounting mode, assuming that the normal mounting mode is executed for the substrate B1 whose conveyance order is less than M. That is, in the initial mounting mode, with respect to the substrate B1 in the conveyance order 1, although component mounting at the mounting positions Pm1, Pm2 on the upstream side of the 3 rd mounting position Pm3 is omitted, the component mounting at the 3 rd mounting position Pm3 can be reliably performed.

In the initial mounting mode, component mounting to the 2 nd mounting position Pm2 counted from the upstream side in the substrate transport direction X is assigned to the substrate B2 in the transport order 2 in the normal mounting mode to the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate transport direction X. In this configuration, assuming that the normal mounting mode is executed for the substrate B2 whose carrying order 2 is smaller than M, the component mounted at the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate carrying direction X is assigned to the 2 nd mounting position Pm2 in the initial mounting mode. That is, in the initial mounting mode, with respect to the substrate B2 in the conveyance order 2, although component mounting at the mounting position Pm1 on the upstream side from the 2 nd mounting position Pm3 is omitted, the component mounting can be reliably performed at the 2 nd mounting position Pm 2.

The controller 100 performs component mounting on the boards B7 and B8, among the 8 boards B1 to B8, whose carrying order N is not less than the (L-M +2) th order, in the final mounting mode (operation with respect to the boards B7 and B8 in the operations a209 to a 216). That is, in the final mounting mode, with respect to the substrate B7 in the conveyance order 7, component mounting to the substrate B7 is selectively allocated to the 1 st to 2 nd mounting positions Pm1 and Pm2 counted from the upstream side in the substrate conveyance direction X among the 3 mounting positions Pm1, Pm2 and Pm3, and component mounting to the plurality of mounting target points Bp of the substrate B7 is performed at the 1 st to 2 nd mounting positions Pm1 and Pm 2. Therefore, even if component mounting is being performed at the mounting position Pm3 on the downstream side of the 2 nd mounting position in the substrate transport direction X, component mounting can be efficiently performed on the substrate B7 whose transport order N is 7 by operating the 1 st to 2 nd mounting positions Pm1, Pm 2. In addition, regarding the substrate B8 in the conveyance order 8, component mounting to the substrate B8 is selectively allocated to the 1 st mounting position Pm1 counted from the upstream side in the substrate conveyance direction X among the 3 mounting positions Pm1, Pm2, Pm3, and component mounting to the plurality of mounting target points Bp of the substrate B8 is performed at the 1 st mounting position Pm 1. Therefore, even if component mounting is being performed at the mounting positions Pm2 and Pm3 on the downstream side of the 1 st mounting position in the substrate transport direction X, component mounting can be efficiently performed on the substrate B8 having the transport order N of 8 by operating the 1 st mounting position Pm 1. As a result, the reduction in the operation rate of the component mounting system can be more effectively suppressed.

In the final mounting mode, component mounting to the 2 nd to 3 rd mounting positions Pm2 and Pm3 counted from the upstream side in the substrate transport direction X in the normal mounting mode is assigned to the 2 nd mounting position Pm2 counted from the upstream side in the substrate transport direction X with respect to the substrate B7 in the transport sequence 7. In this configuration, assuming that the normal mounting mode is executed for the substrate B7 in the conveyance order 7, the component mounting to the 2 nd to 3 rd mounting positions Pm2 and Pm3 counted from the upstream side in the substrate conveyance direction X is assigned to the 2 nd mounting position Pm2 in the final mounting mode. That is, in the final mounting mode, with respect to the substrate B7 in the conveyance order 7, although component mounting at the mounting position Pm3 on the downstream side of the 2 nd mounting position Pm2 is omitted, it is possible to reliably perform component mounting at the 2 nd mounting position Pm 2.

In the final mounting mode, component mounting to the 1 st to 3 rd mounting positions Pm1, Pm2, and Pm3 counted from the upstream side in the substrate transport direction X in the normal mounting mode is allocated to the 1 st mounting position Pm1 counted from the upstream side in the substrate transport direction X with respect to the substrate B8 in the transport sequence 8. In this configuration, assuming that the normal mounting mode is executed for the substrate B8 in the conveyance order 8, the component mounting to the 1 st to 3 rd mounting positions Pm1, Pm2, Pm3 counted from the upstream side in the substrate conveyance direction X is distributed to the 1 st mounting position Pm1 in the final mounting mode. That is, in the final mounting mode, with respect to the substrate B8 in the conveyance order 8, although component mounting at the mounting positions Pm2, Pm3 on the downstream side of the 1 st mounting position Pm1 is omitted, the component mounting at the 1 st mounting position Pm1 can be reliably performed.

In the execution of the first example or the second example described above, the progress of component mounting at any one mounting position Pm may sometimes be delayed from a predetermined value. Then, as described below, the delay of the progress may be recovered.

Fig. 7 is a flowchart showing an example of component mounting processing capable of executing restoration of the progress of component mounting, fig. 8 is a flowchart showing an example of determination as to whether or not restoration is required in the component mounting processing shown in fig. 7, and fig. 9 is a diagram schematically showing an example of operation executed in accordance with the flowcharts of fig. 7 and 8. As shown in fig. 9, in the example shown here, the conveying section 2 is provided with 2 mounting positions Pm1, Pm 2.

The control unit 100 executes the operations of fig. 9 and 10 by executing the flowcharts of fig. 7 and 8 on the mounting positions Pm1 and Pm2, respectively. That is, as shown in fig. 7, when the component mounting process is started, the substrate B is carried into the mounting position Pm (step S301) and component mounting is assigned to the mounting position Pm (step S302) as in the first example described above. Then, when component mounting is completed at any one of the mounting positions Pm (step S303), a restoration necessity determination is performed with respect to each mounting position Pm (step S304, fig. 8).

In the example shown in fig. 9, up to action a103, the same procedure as in the first example is performed. That is, the substrate B1 having the component Wp mounted at the normal distribution point (the upstream half) of the mounting position Pm1 is carried into the mounting position Pm2, and the substrate B2 having the component Wp mounted at the normal distribution point (the upstream half) of the mounting position Pm1 is waited for at the standby position Pw and the substrate B3 is carried into the mounting position Pm 1. Further, at the mounting position Pm2, component mounting to a normal distribution point (the downstream side half) of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B1 is distributed, and at the mounting position Pm1, component mounting to a normal distribution point (the upstream side half) of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B3 is distributed.

The results of starting component mounting at the mounting positions Pm1, Pm2 from the state are shown in the action a111 column of fig. 9. At the mounting position Pm2, component mounting to the substrate B1 is completed. Therefore, at the completion time point of the component mounting, the recovery necessity decision of step S304 (fig. 8) is performed with respect to each of the mounting positions Pm1, Pm 2.

Specifically, regarding the mounting position Pm2, it is determined whether or not the substrate B exists downstream of the mounting position Pm2 (step S401). Since there is no substrate B downstream of the mounting position Pm2 (no in step S401), it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm 2. Since there is no delay in the progress (no in step S402), it is determined in step S404 that recovery is not necessary, and the flow returns to the flowchart of fig. 7.

That is, the process branches to "unnecessary" in step S304 in fig. 7, and the mounting completion determination process (fig. 3) is executed with respect to each mounting position Pm2 (step S306). As a result, as shown in the column of action a112, the substrate B1 is carried out from the mounting position Pm2, and the substrate B2 is carried in from the standby position Pw to the mounting position Pm 2. Further, component mounting at a normal distribution point of the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B2 is distributed to the mounting position Pm 2.

Further, with respect to the mounting position Pm1, it is determined whether or not the substrate B exists downstream of the mounting position Pm1 (step S401). Since the substrate B2 at the standby position Pw is conveyed to the mounting position Pm2 as the substrate B1 is carried out (no in step S401), it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm 1. At the mounting position Pm1, there is a delay in the progress of component mounting at the board B3 (yes in step S402), so it is determined in step S403 whether or not the number of remaining mounting points is equal to or greater than a threshold value (for example, half the number of normal distribution points). If the number of remaining mounting points is less than the threshold value (no in step S403), it is determined in step S404 that recovery is not necessary. On the other hand, in the case where the number of remaining mounting points is equal to or greater than the threshold value (in the case of yes in step S403) as in the example here, it is determined in step S405 that recovery is necessary, and the flow chart of fig. 7 is returned to.

That is, in step S304 of fig. 7, branching to "required" is made, and component mounting is assigned again (step S305). Specifically, regarding the substrate B3 stopped at the mounting position Pm1, a part (here, half) of the normal dispensing point of the mounting position Pm1 shifts from the mounting position Pm1 to the mounting position Pm 2. Then, with respect to the mounting position Pm1, the mounting completion time determination processing (fig. 3) is executed (step S306). As a result, as shown in the column of act a112, the substrate B3 stays at the mounting position Pm 1. In addition, at the mounting position Pm1, component mounting to half of the normal distribution point of the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B3 is distributed, and the process returns from step S306 to step S303.

As shown in the column of action a113 of fig. 9, when the component mounting allocated at the mounting position Pm1 is completed with respect to the substrate B3 (step S303), a restoration necessity determination is performed with respect to each of the mounting positions Pm1, Pm 2. Since there is no delay in the progress of component mounting at all of the mounting positions Pm1, Pm2 (no in step S402), it is determined in step S404 that recovery is not necessary, and the flow returns to the flowchart of fig. 7. Then, with respect to each of the mounting positions Pm1, Pm2, branching to "unnecessary" at step S304, the "mounting completion judgment processing" is executed at step S306. As a result, as shown in the column of action a114 in fig. 9, the substrate B3 is carried out to the standby position Pw, and the substrate B4 is carried in to the mounting position Pm 1. In addition, at the mounting position Pm1, component mounting to a normal distribution point of the mounting position Pm1 among the plurality of components Wp of the board B4 is distributed.

As shown in the column of action a115 of fig. 9, when the component mounting allocated at the mounting position Pm2 is completed with respect to the substrate B2 (step S303), a restoration necessity determination is performed with respect to each of the mounting positions Pm1, Pm 2. Since there is no delay in the progress of component mounting at all of the mounting positions Pm1, Pm2 (no in step S402), it is determined in step S404 that recovery is not necessary, and the flow returns to the flowchart of fig. 7. Then, regarding each of the mounting positions Pm1, Pm2, the flow branches to "unnecessary" in step S304, and "mounting completion determination processing" is executed in step S306. As a result, as shown in the column of action a116 in fig. 9, the substrate B3 is carried into the mounting position Pm 2. In addition, at the mounting position Pm2, the normal dispensing point of the mounting position Pm2 among the plurality of mounting object points Bp of the substrate B3 and the dispensing point half the normal dispensing point of the mounting position Pm1 transferred in the immediately preceding step S305 are dispensed. Therefore, as shown in the column of action a117 in fig. 9, at the mounting position Pm2, the component Wp (hatched component Wp) is mounted on the board B3 at the dispensing point half the normal dispensing point of the mounting position Pm 1.

In this way, the control section 100 adjusts the allocation of component mounting between the one mounting position Pm1 and the other mounting position Pm2 in accordance with the progress of component mounting at the mounting position Pm1 of at least one of the one mounting position Pm1 and the other mounting position Pm2 among the M mounting positions Pm1, Pm 2. In this structure, in the case where the progress of component mounting at one mounting position Pm1 is slower than predetermined, for example, it is possible to allocate component mounting scheduled to be allocated to one mounting position Pm1 to the other mounting position Pm 2. This can balance the progress of component mounting at the respective mounting positions Pm1, Pm 2.

As described above, in the present embodiment, the component mounting system 1 corresponds to an example of the "component mounting system" of the present invention, the conveying section 2 corresponds to an example of the "conveying section" of the present invention, the mounting

sections

4, 4A, 4B correspond to an example of the "mounting section" of the present invention, the control section 100 corresponds to an example of the "control section" of the present invention, the mounting

conveyors

22, 24, 27 disposed at the mounting positions Pm1, Pm2, Pm3 correspond to an example of the "mounting table" of the present invention, the

standby conveyors

23, 26 disposed at the standby positions Pw, Pw1, Pw2 correspond to an example of the "standby table" of the present invention, and the substrate conveying direction X corresponds to an example of the "substrate conveying direction" of the present invention.

The present invention is not limited to the above embodiments, and various modifications can be made to the above embodiments without departing from the spirit thereof. For example, the number M of mounting positions Pm and the number L of substrates B sequentially transported in the substrate transport direction X can be appropriately changed.

The flowcharts of fig. 7 and 8 are not limited to the case where the number M of the mounting positions Pm is 2, and may be applied to the case where the number M is 3 or more.

The component mounting system 1 described above is configured by 1 component mounting machine 10. However, for example, the component mounting system 1 may be configured by arranging a plurality of component mounting machines 10 each having a single mounting position in the conveying direction X. In this configuration, the transport unit 2 transports the substrate B to the plurality of component mounters 10 in sequence, stops and fixes the substrate B at a mounting position Pm in the component mounters 10, and the component mounters 10 mount the components Wp on the substrate B fixed at the mounting position Pm.

Description of the reference symbols

1 … parts mounting system

2 … conveying part

22. 24, 27 … installation conveyor

23. 26 … standby conveyor

4. 4A, 4B … mounting part

100 … control part

Pm1, Pm2 and Pm3 … mounting positions

Pw, Pw1, Pw2 … standby position

X … substrate conveying direction

Claims

1. A component mounting system is provided with:

a conveying part which is provided with M mounting tables arranged in a substrate conveying direction and conveys L substrates in the substrate conveying direction in sequence, wherein M is an integer more than or equal to 2, and L is an integer larger than M;

m mounting portions provided corresponding to the M mounting tables and capable of mounting the same type of component on the substrate stopped on the corresponding mounting table; and

a control section that distributes components to be mounted at a plurality of mounting target points provided on one substrate among the M mounting tables, transports the one substrate in the substrate transport direction by the transport section and stops the one substrate at the mounting table to which component mounting is distributed among the M mounting tables, and performs component mounting distributed to the corresponding mounting table for the one substrate stopped at the mounting table corresponding to the mounting section,

the mounting table conveys the substrate on which the assigned component is mounted to a downstream side in the substrate conveying direction,

the control unit performs component mounting in an initial mounting mode for a substrate having a carrying order N in the substrate carrying direction smaller than M among the L substrates, performs component mounting in a normal mounting mode for a substrate having the carrying order N of M or more, N being an integer of 1 or more,

in the initial mounting mode, component mounting to a substrate is selectively assigned to a mounting table on a downstream side of a (M-N) th mounting table counted from an upstream side in the substrate carrying direction among the M mounting tables for the substrate carrying order N, and component mounting to the plurality of mounting target points of the substrate is performed at a mounting table on a downstream side of the (M-N) th mounting table by a substrate passing through the mounting tables up to the (M-N) th mounting table,

in the normal mounting mode, component mounting to a substrate is assigned to each of the M mounting stations, the substrate is sequentially stopped at the M mounting stations, and component mounting to the plurality of mounting target points of the substrate is sequentially performed at each of the M mounting stations.

2. The component mounting system of claim 1,

the conveying portion further includes a standby table disposed between the mounting tables adjacent in the substrate conveying direction,

in the substrate transport direction, when component mounting is performed on a mounting table other than the most downstream mounting table among the M mounting tables at a mounting table adjacent on the downstream side, the assigned substrate on which component mounting is completed is transported out to a standby table on the downstream side, and the assigned substrate on which component mounting to the mounting target point is not completed is transported in from the upstream side in the substrate transport direction.

3. The component mounting system according to claim 1 or 2,

in the normal mounting mode, component mounting to a substrate is assigned to each of the M mounting tables so that a difference in the number of mounting target points at which components are mounted at each of the mounting tables is 1 or less,

in the initial mounting mode, component mounting is assigned to the (M-N +1) th mounting station counted from the upstream side in the substrate transport direction in the normal mounting mode, with respect to the substrate in the transport order N, to the 1 st to (M-N +1) th mounting stations counted from the upstream side in the substrate transport direction.

4. A component mounting system is provided with:

the control unit performs component mounting in an initial mounting mode for a substrate whose carrying order N in the substrate carrying direction is smaller than M among the L substrates, performs component mounting in a normal mounting mode for a substrate whose carrying order N is smaller than (L-M +2) among the substrates whose carrying order N is M or greater, performs component mounting in a final mounting mode for a substrate whose carrying order N is (L-M +2) or greater among the substrates whose carrying order N is M or greater, N being an integer of 1 or greater,

in the normal mounting mode, component mounting to a substrate is assigned to each of the M mounting stations, the substrate is sequentially stopped at the M mounting stations, component mounting to the plurality of mounting target points of the substrate is sequentially performed at each of the M mounting stations,

in the final mounting mode, component mounting to the substrate is selectively assigned to the 1 st to (L-N +1) th mounting tables counted from the upstream side in the substrate transport direction among the M mounting tables with respect to the substrate in the transport order N, and component mounting to the plurality of mounting target points of the substrate is performed at the 1 st to (L-N +1) th mounting tables.

5. The component mounting system of claim 4,

in the final-stage mounting mode, the components mounted on the substrate in the transport order N are assigned to the (L-N +1) th mounting stations counted from the upstream side in the substrate transport direction, and the components mounted on the substrate in the normal mounting mode are assigned to the (L-N +1) th to M-th mounting stations counted from the upstream side in the substrate transport direction.

6. The component mounting system according to any one of claims 1 to 5,

the control unit adjusts the distribution of component mounting between one mounting stage and the other mounting stages in accordance with the progress of component mounting at least one of the M mounting stages and the other mounting stages.

7. A component mounting method comprising the steps of:

sequentially conveying L substrates in a substrate conveying direction by a conveying portion having M mounting tables arranged in the substrate conveying direction, M being an integer of 2 or more, L being an integer larger than M; and

mounting components at a plurality of mounting target points provided on one substrate among the M mounting tables, distributing the one substrate among the M mounting tables, conveying the one substrate in the substrate conveying direction by the conveying section and stopping the one substrate at the mounting table to which component mounting is distributed among the M mounting tables, performing component mounting distributed to the mounting table for the one substrate stopped at the mounting table,

performing component mounting in an initial mounting mode for a substrate of the L substrates whose carrying order N in the substrate carrying direction is smaller than M, performing component mounting in a normal mounting mode for a substrate of which the carrying order N is M or more, N being an integer of 1 or more,