WO2019116530A1 - Component mounting system and component mounting method - Google Patents

Component mounting system and component mounting method Download PDF

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Publication number
WO2019116530A1
WO2019116530A1 PCT/JP2017/045053 JP2017045053W WO2019116530A1 WO 2019116530 A1 WO2019116530 A1 WO 2019116530A1 JP 2017045053 W JP2017045053 W JP 2017045053W WO 2019116530 A1 WO2019116530 A1 WO 2019116530A1
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WO
WIPO (PCT)
Prior art keywords
mounting
substrate
component
distributed
component mounting
Prior art date
Application number
PCT/JP2017/045053
Other languages
French (fr)
Japanese (ja)
Inventor
大介 春日
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2017/045053 priority Critical patent/WO2019116530A1/en
Priority to CN201780096431.4A priority patent/CN111295938B/en
Priority to JP2019558823A priority patent/JP6831479B2/en
Priority to KR1020207007744A priority patent/KR102282096B1/en
Publication of WO2019116530A1 publication Critical patent/WO2019116530A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Definitions

  • the present invention relates to a technology for mounting components on a substrate at a plurality of mounting stages aligned in the substrate transfer direction while transferring the substrate in the substrate transfer direction.
  • a component mounting system provided with a plurality of mounting portions aligned in the transport direction of a substrate.
  • mounting of components on one board can be shared by a plurality of mounting units. That is, the substrate is sequentially stopped at the plurality of mounting portions while being transported in the transport direction, and each mounting portion mounts the part in charge on the substrate being stopped. This can improve the efficiency of component mounting.
  • the substrate first carried into the component mounting system is stopped at the most upstream mounting stage (mounting portion) in the transport direction, and the mounting of components is received at this mounting stage.
  • the operation rate of the component mounting system is lower than that in the case where the mounting stage on the downstream operates. And such a fall of the operation rate becomes remarkable especially when there are few substrates conveyed by a component mounting system.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a technology capable of suppressing a decrease in operation rate of a component mounting system in a component mounting system in which a plurality of mounting stages are arranged in the substrate transfer direction.
  • the component mounting system has M (M is an integer of 2 or more) mounting stages arranged in the substrate transfer direction, and L sheets (L is an integer larger than M) in order in the substrate transfer direction. It is provided corresponding to a conveyance unit to be conveyed, M mounting stages corresponding to M mounting stages, and M mounting units capable of mounting the same kind of component on a substrate stopped at each corresponding mounting stage, and provided on one substrate A mounting stage in which component mounting for a plurality of mounting target points is distributed among M mounting stages, and the one substrate is transported by the transport unit in the substrate transport direction while the component mounting is distributed among the M mounting stages And a control unit for performing component mounting distributed to the corresponding mounting stage to the one substrate stopped at the mounting stage corresponding to the mounting unit, the mounting stage including the distributed component mounting But The transferred substrate is transported to the downstream side of the substrate transport direction, and the control unit initially sets the transport order N (N is an integer of 1 or more) of the L substrates to the substrate transport direction to the substrate less than M.
  • N is an integer of 1 or more
  • Component mounting is performed in the mounting mode, and component mounting is performed in the normal mounting mode for substrates having a transport order N of M or more, and in the initial mounting mode, of the M mounting stages for the substrate with the transport order N Component mounting on the substrate is selectively distributed to the mounting stage downstream of the (M ⁇ N) th mounting stage counted from the upstream side of the substrate transport direction, and the substrate is up to the (M ⁇ N) th mounting stage Components are mounted to a plurality of mounting target points on the board in the mounting stage downstream of the (M ⁇ N) th mounting stage, and in the normal mounting mode, each of the M mounting stages Component mounting on the board is distributed Will stop in order to M implementation stages, each component mounting to a plurality of mounting object point of the substrate sequentially in the M mounting stage is executed.
  • L transport substrates (L is an integer larger than M) are transported in order by the transport unit having M (M is an integer of 2 or more) mounting stages arranged in the substrate transport direction.
  • the step of transporting in the direction and component mounting for a plurality of mounting target points provided on one substrate are distributed among the M mounting stages, and the one substrate is transported by the transport unit in the substrate transport direction while the M Stopping at the mounting stage to which the component mounting is distributed among the mounting stages, and performing the component mounting distributed to the mounting stage to the one substrate stopped at the mounting stage;
  • Component mounting is performed in the initial mounting mode for substrates whose transport order N (N is an integer of 1 or more) is less than M among the above, and for substrates whose transport order N is M or more, Component mounting in mounting mode
  • the substrate is transferred to the mounting stage downstream of the (MN) -th mounting stage counted from the upstream side in the substrate transfer direction.
  • Component mounting is selectively distributed, and the substrate passes through the (M ⁇ N) th mounting stage, and a plurality of mounting targets of the substrate are mounted in the mounting stage downstream of the (M ⁇ N) th mounting stage Component mounting to a point is performed.
  • component mounting to the substrate is distributed to each of the M mounting stages, and the substrate is sequentially stopped to the M mounting stages, and M mounting stages are performed.
  • Component mounting to a plurality of mounting target points of the substrate is sequentially performed in each of the above.
  • component mounting for a plurality of mounting target points provided on one substrate is distributed among M mounting stages. Then, the one of the M mounting stages is stopped at the mounting stage to which the component mounting is distributed while being transported in the substrate transfer direction, and the one board stopped at the mounting stage is distributed to the mounting stage. Component mounting is performed. At this time, component mounting is performed in the initial mounting mode on a substrate having a transport order N of less than M in the substrate transport direction among the L substrates, and the normal mounting is performed on a substrate having a transport order N of M Component mounting is performed in the mode.
  • component mounting on the substrate at the mounting stage downstream of the (M ⁇ N) th mounting stage counted from the upstream side of the substrate transport direction among the M mounting stages are selectively distributed, the substrate passes through the (M ⁇ N) th mounting stage, and the mounting target points on the substrate at the mounting stage downstream of the (M ⁇ N) th mounting stage Component mounting is performed.
  • component mounting on the substrate is distributed to each of the M mounting stages, the substrate is sequentially stopped at the M mounting stages, and the substrate is sequentially printed on each of the M mounting stages. Component mounting to a plurality of mounting points is performed.
  • component mounting is performed as follows about M board
  • I1 and I2 are integers of 1 or more
  • I1 and I2 are integers of 1 or more
  • the transport unit further includes a standby stage disposed between the mounting stages adjacent in the substrate transport direction, and among the M mounting stages in the substrate transport direction, the mounting stages other than the most downstream mounting stage are When the component mounting is performed at the downstream mounting stage adjacent to each other, the distributed component mounting completed substrate is carried out to the downstream standby stage, and the component mounting to the distributed mounting target point is incomplete.
  • the component mounting system may be configured to carry in the substrate from the upstream side in the substrate transfer direction. In this configuration, the mounting stages other than the most downstream mounting stage promptly carry out the distributed component mounting completed substrate onto the standby stage, and the next substrate whose component mounting is incomplete is taken from the upstream side of the substrate transport direction It can be carried in. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system.
  • component mounting on the substrate is distributed to each of the M mounting stages such that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is less than or equal to one
  • the (M ⁇ N + 1) th mounting stage counted from the upstream side in the substrate conveyance direction with respect to the substrate in the conveyance order N is counted from the first from the upstream side in the substrate conveyance direction in the normal mounting mode
  • the component mounting system may be configured such that component mounting distributed to the (M ⁇ N + 1) th mounting stages is distributed.
  • the normal mounting mode is executed for a substrate whose transport order N is less than M, it is distributed to the first to (M ⁇ N + 1) th mounting stages counted from the upstream side in the substrate transport direction.
  • Component mounting is distributed to the (M ⁇ N + 1) th mounting stage in the initial mounting mode. That is, in the initial mounting mode, with respect to the substrate in transport order N, component mounting at the mounting stage on the upstream side of the (M ⁇ N + 1) th mounting stage is omitted, but this component mounting is the (M ⁇ N + 1) th It is possible to execute reliably at the implementation stage.
  • control unit executes component mounting in the final mounting mode for substrates having a transportation order N of (L ⁇ M + 2) or more among the L substrates, and in the final mounting mode, the substrate for the transportation order N is
  • the component mounting on the substrate is selectively distributed to the first to (L-N + 1) th mounting stages counted from the upstream side of the substrate transfer direction among the M mounting stages, and from the first to (L-N + 1)
  • the component mounting system may be configured such that component mounting to a plurality of mounting target points of the substrate is performed at the first to the third mounting stages.
  • component mounting on the substrate is distributed to each of the M mounting stages such that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is less than or equal to one
  • the final mounting mode with respect to the substrate in the conveyance order N, counting from the upstream side of the substrate conveyance direction from the upstream side in the substrate conveyance direction, counting from the upstream side of the substrate conveyance direction in the normal mounting mode (L-N + 1)
  • the component mounting system may be configured such that component mounting distributed to the first to Mth mounting stages is distributed.
  • the normal mounting mode is executed for a substrate having a transport order N of (L ⁇ M + 2) or more, the (L ⁇ N + 1) th to the Mth from the upstream side in the substrate transport direction are counted.
  • the component mounting distributed to the mounting stage is distributed to the (L ⁇ N + 1) th mounting stage in the final mounting mode. That is, in the final mounting mode, with respect to the substrate in transport order N, component mounting at the mounting stage downstream of the (L ⁇ N + 1) th mounting stage is omitted, but this component mounting is the (L ⁇ N + 1) th It is possible to execute reliably at the implementation stage.
  • control unit in the normal mounting mode, one mounting stage and the other mounting stage according to the progress of component mounting in at least one of the one mounting stage and the other mounting stage among the M mounting stages.
  • the component mounting system may be configured to adjust the distribution of component mounting among the components. In such a configuration, when the progress of component mounting in one mounting stage is, for example, later than scheduled, it is possible to distribute the component mounting to be distributed to one mounting stage to another mounting stage.
  • the present invention in the component mounting system in which a plurality of mounting stages are arranged in the substrate transfer direction, it is possible to suppress a decrease in operation rate of the component mounting system.
  • FIG. 1 is a plan view schematically showing an example of a component mounting system according to the present invention.
  • 11 is a flow chart showing an example of a loading determination process executed when performing component mounting on a substrate while transporting the substrate in the substrate transfer direction.
  • 7 is a flowchart illustrating an example of a mounting completion determination process which is performed when performing component mounting on a substrate while transporting in the substrate transport direction.
  • FIG. 6 schematically shows a first example of an operation performed according to the flowcharts of FIGS. 2 and 3;
  • FIG. 7 schematically shows a second example of the operation performed according to the flowcharts of FIG. 2 and FIG. 3.
  • FIG. 7 schematically shows a second example of the operation performed according to the flowcharts of FIG. 2 and FIG. 3.
  • FIG. 7 is a flowchart illustrating an example of a component mounting process capable of performing recovery of the component mounting progress.
  • FIG. 8 is a flowchart showing an example of recovery necessity determination in the component mounting process shown in FIG. 7;
  • FIG. 9 schematically shows an example of an operation performed in accordance with the flowcharts of FIG. 7 and FIG. 8.
  • FIG. 1 is a plan view schematically showing an example of a component mounting system according to the present invention.
  • XYZ orthogonal coordinate axes configured of a substrate conveyance direction X, a width direction Y, and a vertical direction Z are appropriately used.
  • the substrate transport direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the substrate transport direction X and the width direction Y.
  • the component mounting system 1 is configured of one component mounter 10 which mounts components on the substrate B carried in from the upstream side in the substrate conveyance direction X and carries it out downstream in the substrate conveyance direction X.
  • a plurality of mounting target points Bp are provided on the substrate B, and the control unit 100 provided in the component mounting machine 10 controls the respective components of the component mounting machine 10 to place the component Wp on each mounting target point Bp.
  • each component Wp is a bare chip of the diced wafer W and has the same configuration.
  • the component mounter 10 includes a transport unit 2 that transports the substrate B in the substrate transport direction X.
  • the transport unit 2 has a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and an unloading conveyor 25 arranged in this order in the substrate conveyance direction X, and these conveyors 21 to 25 cooperate with each other to
  • the substrate B can be transported in the transport direction X.
  • the standby conveyor 21 causes the substrate B carried in from the outside of the component mounting system 1 to stand by, or delivers the substrate B to the mounting conveyor 22.
  • the mounting conveyor 22 is provided for the mounting position Pm1 located on the downstream side of the substrate conveyance direction X of the standby conveyor 21 and fixes the substrate B received from the standby conveyor 21 to the mounting position Pm1 or delivers it to the standby conveyor 23 .
  • the standby conveyor 23 is provided for the standby position Pw located downstream of the mounting position Pm1 in the substrate transfer direction X, and makes the substrate B received from the mounting conveyor 22 stand by at the standby position Pw or delivers it to the mounting conveyor 24 .
  • the mounting conveyor 24 is provided for the mounting position Pm2 located downstream of the standby position Pw in the substrate transfer direction X, and fixes the substrate B received from the standby conveyor 23 to the mounting position Pm2 or delivers it to the unloading conveyor 25 .
  • the unloading conveyor 25 is provided at a position downstream of the mounting position Pm 2 in the substrate transfer direction X, and discharges the substrate B received from the mounting conveyor 24 to the outside of the component mounting system 1.
  • M mounting positions Pm 1 and Pm 2 are provided side by side in the substrate transport direction X, and the standby position Pw is disposed between the mount positions Pm 1 and Pm 2 adjacent in the substrate transport direction X It is done.
  • mounting positions Pm1 and Pm2 are not distinguished from one another, they will be referred to as mounting positions Pm.
  • the component mounter 10 further includes a component supply mechanism 3 for supplying the component Wp.
  • the component supply mechanism 3 has a wafer storage unit 31 capable of storing a plurality of wafers W, and a wafer extraction unit 33 for extracting the wafer W from the wafer storage unit 31 to the wafer supply position Pp.
  • the wafer storage unit 31 arranges a plurality of wafer holders Wh for holding the wafers W in the vertical direction Z and raises and lowers a rack for storing the wafers W at a height at which the wafer lead-out unit 33 can receive the wafers W.
  • the wafer holder Wh can be pushed out to the wafer drawing portion 33 by positioning the wafer holder Wh.
  • the wafer lead-out portion 33 includes a wafer support table 331 supporting the wafer holder Wh, a fixed rail 332 supporting the wafer support table 331 movably in the width direction Y, and is provided in the width direction Y and attached to the wafer support table 331 And a Y-axis motor 334 for driving the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in FIG. 1, the wafer storage unit 31 and the wafer supply position Pp are disposed so as to sandwich the transfer unit 2 in the width direction Y, and the wafer support table 331 passes below the transfer unit 2.
  • the wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the reception position adjacent to the wafer storage unit 31 and moves from the reception position to the wafer supply position Pp away from the wafer storage unit 31 in the width direction Y. Thus, the wafer W is pulled out to the wafer supply position Pp.
  • the component supply mechanism 3 has a component extraction unit 35 for extracting the component Wp from the wafer supply position Pp.
  • the component pickup unit 35 has a pickup head 36 for picking up the component Wp from the wafer supply position Pp, and can drive the pickup head 36 in the X and Y directions. That is, the component pickup unit 35 supports the support member 351 for supporting the pickup head 36 movably in the substrate conveyance direction X, and the X-axis motor 352 for driving a ball screw provided in the substrate conveyance direction X and attached to the pickup head 36.
  • the take-out head 36 can be moved in the substrate transfer direction X by driving the ball screw by the X-axis motor 352.
  • the component pick-up portion 35 also drives a fixed rail 353 for supporting the support member 351 so as to be movable in the width direction Y, a ball screw 354 provided in the width direction Y and attached to the fixed rail 353, and Y for driving the ball screw 354. And an axial motor 355. Therefore, by driving the ball screw 354 by the Y-axis motor 355, the take-out head 36 can be moved in the width direction Y together with the support member 351.
  • the takeout head 36 has a bracket 361 extending in the substrate transport direction X, and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 is positioned at either the suction position facing downward or the delivery position facing upward (position in FIG. 1) by rotating around a rotation axis parallel to the substrate transfer direction X. In addition, the bracket 361 can move up and down with each nozzle 362.
  • the component supply mechanism 3 When the nozzle 362 located at the suction position faces the component Wp on the wafer supply position Pp from the upper side, the component supply mechanism 3 lowers the nozzle 362 to contact the component Wp. Furthermore, the component supply mechanism 3 sucks the component Wp from the wafer supply position Pp by raising the nozzle 362 while applying a negative pressure to the nozzle 362. Then, the component supply mechanism 3 supplies the component Wp by positioning the nozzle 362 at the delivery position.
  • the component mounter 10 includes mounting portions 4A and 4B for mounting the component Wp thus supplied by the component supply mechanism 3 on the substrate B.
  • the mounting portions 4A and 4B are mounted so as to be movable in the substrate transfer direction X by the support member 41 movable along the fixed rail provided in the width direction Y on the ceiling of the component mounter 10 and the support member 41
  • the mounting head 42 can be moved in the X and Y directions.
  • the mounting head 42 has two nozzles 421 facing downward.
  • each of the mounting portions 4A and 4B moves above the takeout head 36 and makes the nozzle 421 face the component Wp held by the nozzle 362 located at the delivery position from above. And the nozzle 421 is lowered to contact the part Wp. Subsequently, the component supply mechanism 3 releases the negative pressure of the nozzle 362, and the mounting portions 4A and 4B raise the nozzle 421 while applying a negative pressure to the nozzle 421.
  • the mounting unit 4A mounts the component Wp on the mounting target point Bp of the substrate B fixed at the corresponding mounting position Pm1, and the mounting unit 4B corresponds to the corresponding mounting position P4.
  • the component Wp is mounted on the mounting target point Bp of the fixed substrate B.
  • the mounting units 4A and 4B mount the single type of component Wp on the substrate B.
  • the mounting units 4A and 4B are not distinguished from one another, they will be referred to as the mounting unit 4.
  • the control unit 100 can perform component mounting on the substrate B at the mounting positions Pm1 and Pm2.
  • the control part 100 distributes component mounting with respect to several mounting object point Bp provided in the one board
  • the mounting part 4 performs component mounting distributed to the corresponding mounting position Pm with respect to the said one board
  • the control unit 100 distributes the component mounting of the mounting target point Bp on the upstream half of the substrate conveying direction X among the plurality of mounting target points Bp on the substrate B to the mounting position Pm1, and the downstream of the substrate conveying direction X
  • the component mounting of the mounting target point Bp on the side half is distributed to the mounting position Pm2 (normal mounting mode).
  • the transport unit 2 transports the one substrate B to the mounting position Pm1, and the mounting target point Bp on the upstream half of the substrate transport direction X of the substrate B at which the mounting unit 4A stops at the mounting position Pm1 Mount the component Wp at the distribution point).
  • the transport unit 2 transports the substrate B from the mounting position Pm1 to the mounting position Pm2, and the downstream of the substrate transport direction X of the substrate B where the mounting portion 4B stops at the mounting position Pm2.
  • the component Wp is mounted on the mounting target point Bp (normal distribution point) on the side half. That is, in the normal mounting mode, one substrate B is stopped at the mounting positions Pm1 and Pm2 in order, and one substrate B stopping at each mounting position Pm1 and Pm2 is distributed to the mounting positions Pm1 and Pm2 Execute component mounting. Then, the control unit 100 can execute the normal mounting mode on each of the substrates B while sequentially transporting the plurality of substrates B in the substrate transport direction X.
  • the conveyance order N of the substrates B is used. Dynamically change the distribution of component mounting to the mounting positions Pm1 and Pm2. This point will be described in detail with reference to FIGS. In the following, the downstream or upstream of the substrate transport direction X is simply referred to as “downstream” or “upstream” as appropriate.
  • FIG. 2 is a flow chart showing an example of a carrying-in determination process performed when performing component mounting on a substrate while conveying the substrate in the substrate conveyance direction
  • FIG. 3 is component mounting on the substrate while conveying in the substrate conveyance direction
  • FIG. 4 is a flow chart showing an example of an implementation completion determination process executed upon execution
  • FIG. 4 is a view schematically showing a first example of an operation executed according to the flow charts of FIG. 2 and FIG.
  • the control unit 100 executes the operation of FIG. 4 by performing the carrying-in and mounting completion determination process shown in the flowcharts of FIGS. 2 and 3 for each of the mounting positions Pm1 and Pm2.
  • the component Wp is not mounted among the plurality of mounting target points Bp of the substrate B1. It is determined whether there is a mounting point (step S102). Since there is an unmounted point on the substrate B1 ("YES" in step S102), the process proceeds to step S103. In step S103, it is determined whether this mounting position Pm1 is the most downstream mounting position Pm among the M mounting positions Pm1 and Pm2.
  • step S104 it is determined whether component mounting on the substrate B1 can be performed at the mounting position Pm2 downstream from the main mounting position Pm1. Since there is no board B scheduled to perform component mounting at the mounting position Pm2 and the mounting position Pm2 can execute component mounting on the board B1 ("YES" in step S104), the process proceeds to step S105. Then, in step S105, the control unit 100 determines not to distribute the component mounting of the substrate B1 to the main mounting position Pm1 but to distribute to the downstream mounting position Pm2.
  • step S105 the substrate B1 is transported to the mounting position Pm2 past the mounting position Pm1.
  • step S102 the presence of an unmounted point of the substrate B1 is determined (step S102). Since there is an unmounted point on the substrate B1 ("YES" in step S102), it is determined in step S103 whether the main mounting position Pm2 is the most downstream mounting position Pm. Since the mounting position Pm2 is the most downstream mounting position Pm ("YES" in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting of the substrate B1 is to be distributed to the main mounting position Pm2.
  • the normal distribution point (upstream half) to the mounting position Pm1 through which the substrate B1 passes without stopping, and the normal distribution point (downstream half) to the mounting position Pm2 to which the substrate B1 is loaded The component mounting for is distributed to the mounting position Pm2.
  • the substrate B1 is carried to the mounting position Pm2, and component mounting on all mounting target points Bp of the substrate B1 is distributed to the mounting position Pm2.
  • step S102 When the downstream end of the second substrate B2 is carried to the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on the substrate B2 (YES), and further in step S103 It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since component mounting is scheduled to be performed on the previous board B1 at the downstream mounting position Pm2, in step S104 it is determined that the component mounting of the board B2 can not be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to distribute the component mounting of the substrate B2 to the mounting position Pm1.
  • the substrate B2 is carried to the mounting position Pm1, and components to the normal distribution point (upstream half) of the mounting position Pm1 among all mounting target points Bp of the substrate B2 The mounting is distributed to the mounting position Pm1.
  • step S201 when the component mounting distributed at the mounting position Pm1 is completed on the substrate B2 ("YES" in step S201), it is determined whether there is an unmounted point on the substrate B2 (Step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B2 ("YES" in step S202), the process proceeds to step S203.
  • step S203 it is determined whether the substrate B is present on the upstream side of the mounting position Pm1, that is, the standby conveyor 21. Since the third substrate B3 exists on the standby conveyor 21 ("YES" in step S203), the process proceeds to step S204.
  • step S204 it is determined whether the substrate B is present on the downstream side of the mounting position Pm1, ie, the standby position Pw. Since the substrate B does not exist at the standby position Pw ("NO" in step S204), the process proceeds to step S205. Then, in step S205, the substrate B2 is unloaded to the downstream of the mounting position Pm1, that is, to the standby position Pw, and the conveyance of the substrate B3 to the downstream is started.
  • step S102 When the downstream end of the third substrate B3 is carried to the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on the substrate B3 (YES), and further the step It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since component mounting is being performed on the previous board B1 at the downstream mounting position Pm2, in step S104, it is determined that the component mounting of the board B3 can not be mounted at the mounting position Pm2 (NO). Then, in step S106, the control unit 100 determines to distribute the component mounting of the substrate B3 to the mounting position Pm1. As a result, as shown in the column of operation A103 in FIG. 4, the board B3 is carried to the mounting position Pm1, and components to the normal distribution point (upstream half) of the mounting position Pm1 among all mounting target points Bp The mounting is distributed to the mounting position Pm1.
  • step S202 Since the component Wp is mounted on all mounting target points Bp of the substrate B1 ("NO" in step S202), the substrate B1 is unloaded downstream from the mounting position Pm2, as shown in the column of the operation A105 in FIG. And transport of the substrate B2 to the downstream is started (step S205).
  • step S201 if the component mounting distributed at the mounting position Pm1 is completed on the substrate B3 (“YES” in step S201), is there an unmounted point on the substrate B3? Is determined (step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B3 (“YES” in step S202), is the substrate B present on the upstream side of the mounting position Pm1, ie, the standby conveyor 21? Is determined (step S203). Since the fourth substrate B4 exists in the standby conveyor 21 ("YES” in step S203), the process proceeds to step S204.
  • step S204 it is determined whether the substrate B is present on the downstream side of the mounting position Pm1, ie, the standby position Pw. Since the substrate B2 is unloaded from the standby position Pw as the substrate B1 is unloaded from the mounting position Pm2, in step S204, it is determined that the substrate B does not exist at the standby position Pw (NO), and the process proceeds to step S205. move on. Then, as shown in the column of operation A105 in FIG. 4, the substrate B3 is unloaded from the mounting position Pm1 to the standby position Pw, and conveyance of the substrate B4 to the downstream is started (step S205).
  • step S102 When the downstream end of the substrate B2 is carried to the mounting position Pm2 ("YES" in step S101), the presence of an unmounted point of the substrate B2 is determined (step S102).
  • the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B2 ("YES" in step S102), so the mounting position Pm2 is the most downstream mounting position Pm in step S103. It is judged. Since the mounting position Pm2 is the most downstream mounting position Pm ("YES" in step S103), the process proceeds to step S106.
  • step S106 the control unit 100 determines to distribute the component mounting on the unmounted point of the substrate B2 to the main mounting position Pm2.
  • the substrate B2 is carried to the mounting position Pm2, and components to the normal distribution point (downstream half) of the mounting position Pm2 among all mounting target points Bp of the substrate B2 The mounting is distributed to the mounting position Pm2.
  • step S102 When the downstream end of the fourth substrate B4 is carried to the mounting position Pm1 ("YES" in step S101), it is determined in step S102 that there is an unmounted point on the substrate B4 (YES), and step S103. Then, it is determined that the present mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since the downstream mounting position Pm2 is to perform component mounting on the previous substrate B2, in step S104, it is determined that the component mounting of the substrate B4 can not be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to distribute the component mounting of the substrate B4 to the mounting position Pm1.
  • the board B4 is carried to the mounting position Pm1, and a component to the normal distribution point (upstream half) of the mounting position Pm1 among all mounting target points Bp of the board B4 The mounting is distributed to the mounting position Pm1.
  • step S201 when the component mounting distributed at the mounting position Pm2 is completed on the substrate B2 (“YES” in step S201), it is determined whether there is an unmounted point on the substrate B2 (Step S202). Since the component Wp is mounted on all mounting target points Bp of the substrate B2 ("NO" in step S202), the substrate B2 is unloaded downstream from the mounting position Pm2, as shown in the column of operation A107 in FIG. The transport of the substrate B3 to the downstream is started (step S205).
  • Step S202 Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B4 (“YES” in step S202), does the substrate B exist on the upstream side of the mounting position Pm1, ie, the standby conveyor 21? Is determined (step S203). Since the substrate B does not exist on the standby conveyor 21 ("NO" in step S203), the process proceeds to step S206.
  • step S206 the control unit 100 determines to distribute the component mounting of the substrate B4 to the mounting position Pm1.
  • the substrate B4 remains at the mounting position Pm1 and component mounting to the normal distribution point (downstream half) of the mounting position Pm2 among all mounting target points Bp of the substrate B4. Are distributed to the mounting position Pm1.
  • step S102 When the downstream end of the substrate B3 is carried to the mounting position Pm2 ("YES" in step S101), the presence of an unmounted point of the substrate B3 is determined (step S102).
  • the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B3 ("YES" in step S102), so the mounting position Pm3 is the most downstream mounting position Pm in step S103. It is judged. Since the mounting position Pm2 is the most downstream mounting position Pm ("YES" in step S103), the process proceeds to step S106.
  • step S106 the control unit 100 determines that the component mounting on the unmounted point of the substrate B3 is to be distributed to the main mounting position Pm2.
  • the board B3 is carried to the mounting position Pm2, and component mounting to the normal distribution point (downstream half) of the mounting position Pm2 among all mounting target points Bp of the board B3 is performed. It is distributed to the mounting position Pm2.
  • step S201 when the component mounting distributed at the mounting position Pm2 is completed on the substrate B3 ("YES" in step S201), it is determined whether there is an unmounted point on the substrate B3. (Step S202). Since the component Wp is mounted on all mounting target points Bp of the substrate B3 ("NO" in step S202), the substrate B3 is unloaded downstream from the mounting position Pm2 (step S205).
  • Step S202 Since the component Wp is mounted on all mounting target points Bp of the substrate B4 ("NO” in step S202), the substrate B4 is unloaded downstream from the mounting position Pm1 (step S205). Furthermore, when the downstream end of the substrate B4 is carried to the mounting position Pm2 ("YES" in step S101), it is determined whether there is an unmounted point on the substrate B4 (step S102). Since the component Wp is mounted on all mounting target points Bp of the substrate B4 ("NO" in step S102), the substrate B4 is unloaded downstream from the mounting position Pm1 in step S107.
  • the number M of the mounting positions Pm is “2”, and the number L of the substrates B is “4”. That is, component mounting with respect to a plurality of mounting target points Bp provided on one substrate B is distributed between two mounting positions Pm1 and Pm2. Then, the first substrate B is stopped at the mounting position Pm at which the component mounting is distributed among the two mounting positions Pm1 and Pm2 while being transported in the substrate transfer direction X, and the first substrate B is stopped at the mounting position Pm. The component mounting distributed to the mounting position Pm is performed.
  • component mounting is performed in the initial mounting mode (operation with respect to the substrate B1 in the operations A101 to A104) on the substrate B1 having a conveyance order N in the substrate conveyance direction X of less than M among the four substrates B1 to B4.
  • the component mounting is performed in the normal mounting mode (the operation on the substrate B3 in the operations A103 to A108) on the substrate B3 having the transport order N of M or more and less than (L ⁇ M + 2).
  • the board B1 at the mounting position Pm2 on the downstream side of the first mounting position Pm1 among the two mounting positions Pm1 and Pm2 with respect to the board B1 in the conveyance order 1 is counted from the upstream side Component mounting on is selectively distributed.
  • the substrate B1 passes the first mounting position Pm1, and component mounting to a plurality of mounting target points Bp of the substrate B1 is performed at the mounting position Pm2 downstream of the first mounting position Pm1.
  • component mounting on the substrate B3 is distributed to each of the two mounting positions Pm1 and Pm2, and the substrate B3 is stopped at the two mounting positions Pm1 and Pm2 in order, and the two mountings are performed.
  • Component mounting to a plurality of mounting target points Bp of the substrate B3 is sequentially performed at each of the positions Pm1 and Pm2.
  • component mounting is performed on the first two substrates out of the four substrates in the following manner. That is, the first substrate B1 is transported to the second mounting position Pm2 from the upstream side in the substrate transport direction X in the initial mounting mode, and the second substrate B2 is in the substrate transport direction X in the normal mounting mode. From the upstream side to the first mounting position Pm1.
  • the substrates B2 and B1 can be transported to the two mounting positions Pm1 and Pm2, respectively, and component mounting on the substrates B2 and B1 can be started at the mounting positions Pm1 and Pm2. By this, it is possible to suppress a decrease in the operation rate of the component mounting system 1.
  • the transport unit 2 further includes a standby position Pw disposed between the mounting positions Pm1 and Pm2 adjacent to each other in the substrate transport direction X. Then, among the two mounting positions Pm1 and Pm2 in the substrate transport direction X, the mounting position Pm1 other than the mounting position Pm2 at the most downstream is the part mounting at the mounting position Pm2 adjacent on the downstream side.
  • the distributed component mounting completed substrate B is carried out to the standby position Pw on the downstream side, and the substrate B for which the distributed component mounting is incomplete is carried in from the upstream side in the substrate transport direction X (substrates of operations A102 to A103 B2, B3 etc.).
  • the difference in the number of mounting target points Bp on which the component Wp is mounted at each of the mounting positions Pm1 and Pm2 is 1 or less (in the above embodiment, the number difference is zero).
  • Component mounting on the substrate B is distributed to each of the two mounting positions Pm1 and Pm2).
  • the second mounting position Pm2 from the upstream side in the substrate conveyance direction X with respect to the substrate B1 in the conveyance order 1 is the first from the upstream side in the substrate conveyance direction X in the normal mounting mode.
  • the component mountings distributed to the second to the second mounting positions Pm1 and Pm2 are distributed.
  • the mounting time at each mounting position Pm1 and Pm2 is equalized.
  • the numbers of mounting target points Bp at the mounting positions Pm1 and Pm2 are approximately equal, conveyance of the substrate B from the mounting positions Pm1 and Pm2 can be substantially simultaneously performed.
  • the number of mounting target points Bp at each mounting position Pm1 and Pm2 may be determined so that the mounting time itself of each mounting position Pm1 and Pm2 is equalized.
  • the mounting target points at the mounting positions Pm1 and Pm2 can be reduced so as to suppress the difference between the mounting times at the mounting positions Pm1 and Pm2. You may decide the number of Bp.
  • control unit 100 performs component mounting in the final mounting mode (operation on the substrate B4 in operations A105 to A108) on the substrate B4 having a conveyance order N of 4 or more among the four substrates B1 to B4. .
  • component mounting on the substrate B4 is selective at the first mounting position Pm1 of the two mounting positions Pm1 and Pm2 counting from the upstream side in the substrate conveyance direction X.
  • component mounting to a plurality of mounting target points Bp of the substrate B4 is performed at the first mounting position Pm1.
  • the two mounting positions Pm1 and Pm2 from the upstream side in the substrate transport direction X Component mounting on the substrate B4 is selectively distributed to the first mounting position Pm1 and component mounting on a plurality of mounting target points Bp of the substrate B4 is executed at the first mounting position Pm1.
  • the first mounting position Pm1 is operated, and the transfer order N is (L ⁇ M + 2) or more Component mounting can be efficiently performed on the substrate B4 of As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system 1.
  • the first mounting position Pm1 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B4 in the conveyance order 4 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode.
  • the component mountings distributed to the second to the second mounting positions Pm1 and Pm2 are distributed.
  • the normal mounting mode is executed for the substrate B4 having the transport order N equal to or greater than (L ⁇ M + 2)
  • the first to the second mounting positions counted from the upstream side in the substrate transport direction X The component mounting distributed to Pm1 and Pm2 is distributed to the first mounting position Pm1 in the final mounting mode.
  • FIGS. 5 and 6 schematically show a second example of the operation performed in accordance with the flowcharts of FIGS. 2 and 3.
  • the standby conveyor 26 and the mounting conveyor 27 are provided in this order in the substrate transport direction X between the mounting conveyor 24 and the unloading conveyor 25 (FIG. 1).
  • the standby conveyor 26 stops and fixes the substrate B at the standby position Pw2, and the mounting conveyor 27 stops and fixes the substrate B at the mounting position Pm3. That is, in the transport unit 2, the M mounting positions Pm1, Pm2, and Pm3 are provided side by side in the substrate transport direction X, and the standby position Pw1 is disposed between the mount positions Pm1 and Pm2 adjacent in the substrate transport direction X The standby position Pw2 is disposed between the mounting positions Pm2 and Pm3 adjacent to each other in the substrate transfer direction X.
  • mounting positions Pm1, Pm2, and Pm3 are not distinguished, they are referred to as mounting positions Pm, and when the standby positions Pw1 and Pw2 are not distinguished from each other, they are referred to as waiting positions Pw.
  • the mounting position Pm 1 according to the conveyance order N of the substrate B , Pm2, Pm3 dynamically change the distribution of component mounting.
  • the mounting target points Bp distributed to the mounting positions Pm1, Pm2, and Pm3 in the normal mounting mode differ from the first example according to the difference in the number of the mounting positions Pm.
  • the component Wp is mounted at the mounting position Pm1 on the upstream one-third mounting target point Bp (normal distribution point), and the mounting position Pm2 is central at the center
  • the component Wp is mounted to the mounting target point Bp (normal distribution point) of 1/3
  • the mounting position Pm3 is the part Wp to the mounting target point Bp (normal distribution point) on the downstream side.
  • control unit 100 executes the operations of FIG. 5 and FIG. 6 by executing the carrying-in / mounting completion determination process shown in the flowcharts of FIGS. .
  • the details of the determination based on the flowcharts of FIGS. 2 and 3 are the same as those of the first example described above, and thus the description thereof will be omitted as appropriate.
  • the loading determination process is executed at each of the mounting positions Pm1, Pm2, and Pm3 with respect to the substrate B1.
  • the substrate B1 passes the mounting positions Pm1 and Pm2 and is carried to the mounting position Pm3, and the component mounting on the substrate B1 is distributed to the mounting position Pm3.
  • the component mounting at the normal distribution point to the mounting positions Pm1 and Pm2 through which the substrate B1 passes without stopping and the normal distribution point to the mounting position Pm3 to which the substrate B1 is carried is the mounting position Pm3.
  • Distributed to As a result, component mounting on all mounting target points Bp of the substrate B1 is distributed to the mounting position Pm3.
  • the substrate B2 passes the mounting position Pm1. Is carried into the mounting position Pm2, and component mounting on the substrate B2 is distributed to the mounting position Pm2. Specifically, component mounting for the normal distribution point to the mounting position Pm1 through which the substrate B2 passes without stopping and the normal distribution point to the mounting position Pm2 to which the substrate B2 is carried is distributed to the mounting position Pm2 Be done. As a result, component mounting on the two thirds of the mounting target points Bp on the upstream side of the substrate B2 is distributed to the mounting position Pm2.
  • the loading determination process is performed on the substrate B3 at the mounting position Pm1.
  • the substrate B3 is transported to the mounting position Pm1 and is transferred to the substrate B3.
  • the component mounting is distributed to the mounting position Pm1.
  • component mounting for the normal distribution point of the mounting position Pm1 is distributed to the mounting position Pm1.
  • component mounting on the upstream one-third mounting target point Bp (normal distribution point) on the upstream side of the substrate B3 is distributed to the mounting position Pm1.
  • the conveyance of the fourth substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is carried to the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1.
  • the substrate B4 is carried to the mounting position Pm1, and the component mounting on the substrate B4 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B4 at the mounting position Pm1. Be done.
  • the mounting completion determination process is executed at the mounting position Pm2.
  • the substrate B2 is unloaded from the mounting position Pm2 to the standby position Pw2.
  • transport of the substrate B3 to the downstream is started, and when the downstream end of the substrate B3 is carried into the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2.
  • the substrate B3 is carried to the mounting position Pm2, and the component mounting on the substrate B3 is distributed to the mounting position Pm2.
  • the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B3 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B3 at the mounting position Pm2. Be done.
  • the mounting completion determination process is executed at the mounting position Pm1.
  • the substrate B4 is unloaded from the mounting position Pm1 to the standby position Pw1.
  • the conveyance of the fifth substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is carried into the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1.
  • the substrate B5 is carried to the mounting position Pm1, and the component mounting on the substrate B5 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B5 at the mounting position Pm1. Be done.
  • the mounting completion determination process is executed at the mounting position Pm3.
  • the substrate B1 is unloaded from the mounting position Pm3.
  • transport of the substrate B2 to the downstream is started, and when the downstream end of the substrate B2 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3.
  • the substrate B2 is carried to the mounting position Pm3, and the component mounting on the substrate B2 is distributed to the mounting position Pm3.
  • the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B2 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B2 at the mounting position Pm3. Be done.
  • the mounting completion determination process is executed at the mounting position Pm2.
  • the substrate B3 is unloaded from the mounting position Pm2 to the standby position Pw2.
  • transport of the substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is carried into the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2.
  • the substrate B4 is carried into the mounting position Pm2, and the component mounting on the substrate B4 is distributed to the mounting position Pm2.
  • the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B4 at the mounting position Pm2. Be done.
  • the mounting completion determination process is executed at the mounting position Pm1.
  • the substrate B5 is unloaded from the mounting position Pm1 to the standby position Pw1.
  • downstream conveyance of the sixth substrate B6 is started, and when the downstream end of the substrate B6 is carried into the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1.
  • the substrate B6 is carried to the mounting position Pm1, and the component mounting on the substrate B6 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B6 at the mounting position Pm1. Be done.
  • the mounting completion determination process is executed at the mounting position Pm3.
  • the substrate B2 is unloaded from the mounting position Pm3.
  • transport of the substrate B3 to the downstream is started, and when the downstream end of the substrate B3 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3.
  • the substrate B3 is carried to the mounting position Pm3, and the component mounting on the substrate B3 is distributed to the mounting position Pm3.
  • the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B3 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B3 at the mounting position Pm3. Be done.
  • the mounting completion determination process is executed at the mounting position Pm2.
  • the substrate B4 is unloaded from the mounting position Pm2 to the standby position Pw2.
  • transport of the substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is carried to the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2.
  • the substrate B5 is carried into the mounting position Pm2, and the component mounting on the substrate B5 is distributed to the mounting position Pm2.
  • the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B5 at the mounting position Pm2. Be done.
  • the mounting completion determination process is executed at the mounting position Pm1.
  • the substrate B6 is unloaded from the mounting position Pm1 to the standby position Pw1.
  • the conveyance of the seventh substrate B7 to the downstream is started, and when the downstream end of the substrate B7 is carried to the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1.
  • the substrate B7 is carried to the mounting position Pm1, and the component mounting on the substrate B7 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B7 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B7 at the mounting position Pm1. Be done.
  • the mounting completion determination process is executed at the mounting position Pm3.
  • the substrate B3 is unloaded from the mounting position Pm3.
  • transport of the substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3.
  • the substrate B4 is carried to the mounting position Pm3, and the component mounting on the substrate B4 is distributed to the mounting position Pm3.
  • the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B4 at the mounting position Pm3. Be done.
  • the mounting completion determination process is executed at the mounting position Pm2.
  • the substrate B5 is unloaded from the mounting position Pm2 to the standby position Pw2.
  • transport of the substrate B6 to the downstream is started, and when the downstream end of the substrate B6 is carried to the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2.
  • the substrate B6 is carried to the mounting position Pm2, and the component mounting on the substrate B6 is distributed to the mounting position Pm2.
  • the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B6 at the mounting position Pm2. Be done.
  • the mounting completion determination process is executed at the mounting position Pm1.
  • the substrate B7 is unloaded from the mounting position Pm1 to the standby position Pw1.
  • the conveyance of the eighth substrate B8 to the downstream is started, and when the downstream end of the substrate B8 is carried to the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1.
  • the substrate B8 is carried to the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B8 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B8 at the mounting position Pm1. Be done.
  • the mounting completion determination process is executed at the mounting position Pm3.
  • the substrate B4 is unloaded from the mounting position Pm3.
  • transport of the substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3.
  • the substrate B5 is carried to the mounting position Pm3, and the component mounting on the substrate B5 is distributed to the mounting position Pm3.
  • component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm3, and at the mounting position Pm3, this component mounting starts to the substrate B5. Be done.
  • the mounting completion determination process is executed at the mounting position Pm2.
  • the substrate B6 is unloaded from the mounting position Pm2 to the standby position Pw2.
  • downstream conveyance of the substrate B7 is started, and when the downstream end of the substrate B7 is carried into the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2.
  • the substrate B7 is carried to the mounting position Pm2, and the component mounting on the substrate B7 is distributed to the mounting position Pm2.
  • component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B7 is distributed to the mounting position Pm2, and this component mounting starts to the substrate B7 at the mounting position Pm2. Be done.
  • the mounting completion determination process is executed at the mounting position Pm1.
  • the substrate B8 remains at the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B8 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B8 at the mounting position Pm1. Be done.
  • the mounting completion determination process is executed at the mounting position Pm3.
  • the substrate B5 is unloaded from the mounting position Pm3.
  • transport of the substrate B6 to the downstream is started, and when the downstream end of the substrate B6 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3.
  • the substrate B6 is carried to the mounting position Pm3, and the component mounting on the substrate B6 is distributed to the mounting position Pm3.
  • the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B6 at the mounting position Pm3. Be done.
  • the mounting completion determination process is executed at the mounting position Pm2.
  • the substrate B7 remains at the mounting position Pm2, and the component mounting on the substrate B7 is distributed to the mounting position Pm2.
  • the component mounting at the normal distribution point to the mounting position Pm3 is distributed to the mounting position Pm2, and the component mounting is started on the substrate B7 at the mounting position Pm2.
  • the mounting completion determination process is executed at the mounting position Pm1.
  • the substrate B8 remains at the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1.
  • the component mounting to the normal distribution point to the mounting position Pm3 is distributed to the mounting position Pm1, and the component mounting is started on the board B8 at the mounting position Pm3.
  • the number M of the mounting positions Pm is “3”, and the number L of the substrates B is “8”. That is, component mounting with respect to a plurality of mounting target points Bp provided on one substrate B is distributed among the three mounting positions Pm1, Pm2, and Pm3. Then, one of the three mounting positions Pm1, Pm2, and Pm3 is stopped at the mounting position Pm at which the component mounting is distributed, and is stopped at the mounting position Pm while conveying the one substrate B in the substrate conveyance direction X Component mounting distributed to the mounting position Pm with respect to the substrate B is performed.
  • the substrates B1 and B2 having a transport order N in the substrate transport direction X less than M in the initial mounting mode (operations on the substrates B1 and B2 in operations A201 to A208)
  • Component mounting is performed, and components mounting is performed in the normal mounting mode (operations on substrates B3 to B6 in operations A201 to A216) for substrates B3 to B6 having a transport order N of M or more and less than (L ⁇ M + 2) Is executed.
  • the mounting position Pm3 on the downstream side of the second mounting position Pm2 is counted from the upstream side of the substrate conveyance direction X.
  • Component mounting on the substrate B1 is selectively distributed. Therefore, the board B1 passes the first and second mounting positions Pm1 and Pm2, and the component mounting to the plurality of mounting target points Bp of the board B1 is executed at the mounting position Pm3 downstream of the second mounting position Pm2. Be done.
  • the substrates are mounted at mounting positions Pm2 and Pm3 on the downstream side of the first mounting position Pm1 counting from the upstream side Component mounting to B2 is selectively distributed. Therefore, the substrate B1 passes the first mounting position Pm1, and component mounting to the plurality of mounting target points Bp of the substrate B2 is performed at the mounting positions Pm2 and Pm3 downstream of the first mounting position Pm1. .
  • component mounting on the substrates B3 to B6 is distributed to each of the three mounting positions Pm1, Pm2 and Pm3, and the substrates B3 to B6 are sequentially arranged at the three mounting positions Pm1, Pm2 and Pm3.
  • component mounting to a plurality of mounting target points Bp of the substrates B3 to B6 is executed in order at each of the three mounting positions Pm1, Pm2 and Pm3.
  • component mounting is performed on the first three substrates out of the eight substrates in the following order. That is, the first substrate B1 is transported to the third mounting position Pm3 from the upstream side in the substrate transport direction X in the initial mounting mode, and the second substrate B2 is in the substrate transport direction X in the initial mounting mode.
  • the third substrate B3 is transported to the first mounting position Pm1 from the upstream side in the substrate transfer direction X in the normal mounting mode by counting from the upstream side of the substrate and being transported to the second mounting position Pm2.
  • the substrates B3, B2, B1 are transported to the three mounting positions Pm1, Pm2, Pm3 respectively, and component mounting on the substrates B3, B2, B1 can be started at the mounting positions Pm1, Pm2, Pm3. it can. By this, it is possible to suppress a decrease in the operation rate of the component mounting system 1.
  • the transport unit 2 further includes standby positions Pw1 and Pw2 disposed between the mounting positions Pm1, Pm2 and Pm3 adjacent to each other in the substrate transport direction X.
  • the mounting positions Pm1 and Pm2 other than the mounting position Pm3 at the most downstream are component mounting at mounting positions Pm2 and Pm3 adjacent on the downstream side
  • the substrate B for which the distributed component mounting has been completed is carried out to the standby positions Pw1 and Pw2 on the downstream side, and the substrate B for which the distributed component mounting is incomplete is carried in from the upstream side of the substrate transport direction X (Substrates B2 and B4 of operations A204 to A205, etc.).
  • the difference in the number of mounting target points Bp on which the component Wp is mounted at each of the mounting positions Pm1, Pm2 and Pm3 is 1 or less (in the above embodiment, the difference in the number is Component mounting on the substrate B is distributed to each of the three mounting positions Pm1, Pm2 and Pm3).
  • the third mounting position Pm3 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B1 in the conveyance order 1 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode
  • the component mounting distributed to the third to third mounting positions Pm1, Pm2, and Pm3 is distributed.
  • the normal mounting mode is executed on a substrate B1 having a transport order 1 less than M
  • the first to third mounting positions Pm1, Pm2, and Pm3 counted from the upstream side in the substrate transport direction X
  • the component mounting distributed to is distributed to the third mounting position Pm3 in the initial mounting mode. That is, in the initial mounting mode, with regard to the substrate B1 of transport order 1, although component mounting at the mounting positions Pm1 and Pm2 upstream of the third mounting position Pm3 is omitted, this component mounting is performed at the third mounting position Pm3 It is possible to execute with
  • the second mounting position Pm2 from the upstream side in the substrate conveyance direction X with respect to the substrate B2 in the conveyance order 2 is the first from the upstream side in the substrate conveyance direction X in the normal mounting mode.
  • the component mountings distributed to the second to the second mounting positions Pm1 and Pm2 are distributed.
  • the normal mounting mode is executed for a substrate B2 having a transport order 2 less than M
  • distribution to the first to second mounting positions Pm1 and Pm2 counted from the upstream side in the substrate transport direction X is performed.
  • Component mounting is distributed to the second mounting position Pm2 in the initial mounting mode.
  • control unit 100 sets the final mounting mode for substrates B7 and B8 having a transport order N of (L ⁇ M + 2) or higher among the eight substrates B1 to B8 (for substrates B7 and B8 in operations A209 to A216).
  • Execute component mounting in (operation) That is, in the final mounting mode, of the three mounting positions Pm1, Pm2 and Pm3 with respect to the substrate B7 in the conveyance order 7, the first to second mounting positions Pm1 and Pm2 from the upstream side in the substrate conveyance direction X Component mounting on the substrate B7 is selectively distributed, and component mounting on a plurality of mounting target points Bp of the substrate B7 is executed at the first to second mounting positions Pm1 and Pm2.
  • the first to second mounting positions Pm1 and Pm2 are operated, and the transfer order N is 7
  • Component mounting can be efficiently performed on the board B7 of Further, with regard to the substrate B8 in the transport order 8, among the three mounting positions Pm1, Pm2 and Pm3, the component mounting on the substrate B8 is selectively distributed to the first mounting position Pm1 counting from the upstream side in the substrate transport direction X.
  • component mounting to a plurality of mounting target points Bp of the substrate B8 is performed at the first mounting position Pm1.
  • the first mounting position Pm1 is operated, and the substrate B8 having the eighth conveyance order N is Component mounting can be performed efficiently. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system.
  • the second mounting position Pm2 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B7 in the conveyance order 7 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode
  • the component mounting distributed to the third to third mounting positions Pm2 and Pm3 is distributed.
  • the normal mounting mode is executed for the substrate B7 in the conveyance order 7
  • the implementation is distributed to the second implementation position Pm2 in the final implementation mode.
  • the first mounting position Pm1 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B8 in the conveyance order 8 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode
  • the component mounting distributed to the third to third mounting positions Pm1, Pm2, and Pm3 is distributed.
  • the normal mounting mode is executed for the substrate B8 in the transport order 8
  • Component mounting is distributed to the first mounting position Pm1 in the final mounting mode.
  • the progress of component mounting at any mounting position Pm may be delayed from a schedule. Therefore, as shown below, it may be configured to recover such a delay in progress.
  • FIG. 7 is a flowchart showing an example of component mounting processing capable of executing recovery of the progress of component mounting
  • FIG. 8 is a flowchart showing an example of recovery necessity determination in the component mounting processing shown in FIG. 8 schematically shows an example of an operation performed according to the flowcharts of FIG. 7 and FIG.
  • the transport unit 2 is provided with two mounting positions Pm1 and Pm2.
  • the control unit 100 executes the operations of FIGS. 9 and 10 by executing the flowcharts of FIGS. 7 and 8 for each of the mounting positions Pm1 and Pm2. That is, as shown in FIG. 7, when the component mounting process is started, the substrate B is carried to the mounting position Pm (step S301) and the component mounting is distributed to the mounting position Pm as in the first example described above. (Step S302). Then, when component mounting is completed at any mounting position Pm (step S303), recovery necessity determination is performed for each mounting position Pm (step S304, FIG. 8).
  • the operations up to the operation A103 are performed in the same manner as the first example described above. That is, the board B1 on which the component Wp is mounted is carried to the mounting position Pm2 at the normal distribution point (upstream half) to the mounting position Pm1, and at the standby position Pw, the normal distribution point to the mounting position Pm1 (upstream The substrate B2 on which the component Wp is mounted is on standby, and the substrate B3 is carried to the mounting position Pm1.
  • component mounting to the normal distribution point (downstream half) to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B1 is distributed, and at the mounting position Pm1, a plurality of mountings of the substrate B3 Component mounting to the normal distribution point (upstream half) of the target point Bp to the mounting position Pm1 is distributed.
  • step S304 (FIG. 8) is executed for each of the mounting positions Pm1 and Pm2.
  • step S401 it is determined whether or not the substrate B is present downstream of the mounting position Pm2 (step S401). Since the substrate B does not exist downstream of the mounting position Pm2 ("NO" in step S401), it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm2. Since the progress is not delayed ("NO" in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG.
  • step S304 of FIG. 7 the process branches to “unnecessary”, and the mounting completion determination process (FIG. 3) is executed for each mounting position Pm2 (step S306).
  • the substrate B1 is unloaded from the mounting position Pm2, and the substrate B2 is loaded from the standby position Pw to the mounting position Pm2.
  • component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B2 is distributed to the mounting position Pm2.
  • step S401 it is determined whether or not the substrate B exists downstream of the mounting position Pm1 (step S401).
  • the board B2 at the standby position Pw is transported to the mounting position Pm2 along with unloading of the board B1 (“NO” in step S401), so it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm1.
  • Ru At the mounting position Pm1, there is a delay in the progress of component mounting on the substrate B3 (“YES” in step S402). Therefore, in step S403, whether the remaining mounting points are at least a threshold (for example, half the number of normal distribution points) Is judged.
  • step S404 If the remaining mounting score is less than the threshold (in the case of "NO” in step S403), it is determined in step S404 that recovery is unnecessary. On the other hand, as in this example, if the remaining mounting score is equal to or greater than the threshold (in the case of “YES” in step S403), it is determined in step S405 that recovery is necessary, and the process returns to the flowchart of FIG.
  • step S304 of FIG. 7 the process branches to "necessary", and component mounting is redistributed (step S305). Specifically, for the substrate B3 stopped at the mounting position Pm1, part (here, half) of the normal distribution point of the mounting position Pm1 is moved from the mounting position Pm1 to the mounting position Pm2. Then, the mounting completion determination process (FIG. 3) is executed for the mounting position Pm1 (step S306). As a result, as shown in the column of operation A112, the substrate B3 remains at the mounting position Pm1. Further, at the mounting position Pm1, the component mounting to the half of the normal distribution point to the mounting position Pm1 is distributed among the plurality of mounting target points Bp of the substrate B3, and the process returns from step S306 to step S303.
  • step S303 when the component mounting distributed at the mounting position Pm1 is completed on the substrate B3 (step S303), recovery necessity determination is performed for each mounting position Pm1 and Pm2. Since there is no delay in the progress of component mounting at any of the mounting positions Pm1 and Pm2 (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG. Then, for each of the mounting positions Pm1 and Pm2, the process branches to “unnecessary” in step S304, and “mounting completion determination processing” is executed in step S306. As a result, as shown in the column of operation A114 in FIG.
  • the substrate B3 is carried out to the standby position Pw, and the substrate B4 is carried in to the mounting position Pm1. Further, at the mounting position Pm1, among the plurality of components Wp of the substrate B4, component mounting to the normal distribution point at the mounting position Pm1 is distributed.
  • step S303 when the component mounting distributed at the mounting position Pm2 is completed on the substrate B2 (step S303), recovery necessity determination is performed for each mounting position Pm1 and Pm2. Since there is no delay in the progress of component mounting at any of the mounting positions Pm1 and Pm2 (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG. Then, for each of the mounting positions Pm1 and Pm2, the process branches to “unnecessary” in step S304, and “mounting completion determination processing” is executed in step S306. As a result, as shown in the column of operation A116 in FIG. 9, the substrate B3 is carried into the mounting position Pm2.
  • the component Wp (the hatched component Wp) with respect to the distribution point of half of the normal distribution point to the mounting position Pm1 is the substrate B3.
  • control unit 100 selects one of M mounting positions Pm 1 and Pm 2 according to the progress of component mounting at one mounting position Pm 1 and at least one other mounting position Pm 2 of mounting positions Pm 1 and Pm 2.
  • the distribution of component mounting between the mounting position Pm1 and the other mounting position Pm2 is adjusted.
  • the component mounting that is scheduled to be distributed to one mounting position Pm1 can be distributed to another mounting position Pm2. This makes it possible to balance the progress of component mounting at each of the mounting positions Pm1 and Pm2.
  • the component mounting system 1 corresponds to an example of the "component mounting system” of the present invention
  • the transport unit 2 corresponds to an example of the "transport unit” of the present invention
  • the mounting units 4, 4A, 4B corresponds to an example of the "mounting unit” of the present invention
  • the control unit 100 corresponds to an example of the "control unit” of the present invention
  • the mounting conveyors 22, 24, 27 disposed at the mounting positions Pm1, Pm2, Pm3.
  • the substrate transfer direction X is This corresponds to an example of the “substrate transfer direction” in the present invention.
  • the present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the scope of the invention.
  • the number M of the mounting positions Pm and the number L of the substrates B transported in order in the substrate transport direction X can be changed as appropriate.
  • FIGS. 7 and 8 are not limited to the case where the number M of mounting positions Pm is two, and is applicable to the case where the number M is three or more.
  • the component mounting system 1 described above is configured of one component mounting machine 10.
  • the component mounting system 1 may be configured by arranging a plurality of component mounters 10 each having a single mounting position in the transport direction X.
  • the transport unit 2 transports the substrate B sequentially to the plurality of component mounters 10 while stopping / fixing the substrate B at the mounting position Pm in each component mounter 10, and each component mounter 10 And mount the component Wp on the substrate B fixed at the mounting position Pm.

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Abstract

In this invention, for the first two boards in the order of transport among four boards, component mounting is executed in the following manner: the first board B1 is transported, in an initial mounting mode, to the second mounting position Pm2 from the upstream side in a board transport direction X, and the second board B2 is transported, in a regular mounting mode, to the first mounting position Pm1 from the upstream side in the board transport direction X. This allows the boards B2 and B1 to be transported respectively to the two mounting positions Pm1 and Pm2, and the component mounting onto the boards B2 and B1 to be started at each of the mounting positions Pm1 and Pm2. As a result, a drop in the operational capacity of a component mounting system 1 can be suppressed.

Description

部品実装システム、部品実装方法Component mounting system, component mounting method
　この発明は、基板搬送方向に基板を搬送しつつ、基板搬送方向に並ぶ複数の実装ステージで基板に部品を実装する技術に関する。 The present invention relates to a technology for mounting components on a substrate at a plurality of mounting stages aligned in the substrate transfer direction while transferring the substrate in the substrate transfer direction.
　従来、基板の搬送方向に並ぶ複数の実装部を備えた部品実装システムが知られている。また、特許文献１に示されるように、このような部品実装システムでは、１枚の基板に対する部品の実装を複数の実装部で分担することができる。つまり、基板は搬送方向に搬送されつつ複数の実装部に順番に停止し、各実装部は停止中の基板に対して担当する部品の実装を行う。これによって、部品実装の効率化を図ることができる。 BACKGROUND Conventionally, there is known a component mounting system provided with a plurality of mounting portions aligned in the transport direction of a substrate. In addition, as disclosed in Patent Document 1, in such a component mounting system, mounting of components on one board can be shared by a plurality of mounting units. That is, the substrate is sequentially stopped at the plurality of mounting portions while being transported in the transport direction, and each mounting portion mounts the part in charge on the substrate being stopped. This can improve the efficiency of component mounting.
特開２０１７－３７９０２号公報JP, 2017-37902, A
　しかしながら、状況によっては、かかる手法が必ずしも効率的でない場合がある。つまり、部品実装システムに最初に搬入される基板は、搬送方向の最上流の実装ステージ（実装部）に停止して、この実装ステージにおいて部品の実装を受ける。この間、最上流の実装部よりも搬送方向の下流側の実装ステージは稼動しないため、部品実装システムの稼働率は、下流側の実装ステージが稼動する場合と比較して低くなる。そして、このような稼働率の低下は、部品実装システムで搬送する基板が少ない場合に特に顕著となる。 However, depending on the circumstances, such an approach may not always be efficient. That is, the substrate first carried into the component mounting system is stopped at the most upstream mounting stage (mounting portion) in the transport direction, and the mounting of components is received at this mounting stage. During this time, since the mounting stage on the downstream side in the transport direction does not operate than the most upstream mounting unit, the operation rate of the component mounting system is lower than that in the case where the mounting stage on the downstream operates. And such a fall of the operation rate becomes remarkable especially when there are few substrates conveyed by a component mounting system.
　この発明は上記課題に鑑みなされたものであり、複数の実装ステージが基板搬送方向に並ぶ部品実装システムにおいて、部品実装システムの稼働率の低下を抑制可能とする技術の提供を目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a technology capable of suppressing a decrease in operation rate of a component mounting system in a component mounting system in which a plurality of mounting stages are arranged in the substrate transfer direction.
　本発明に係る部品実装システムは、基板搬送方向に並ぶＭ個（Ｍは２以上の整数）の実装ステージを有し、Ｌ枚（ＬはＭより大きい整数）の基板を順番に基板搬送方向に搬送する搬送部と、Ｍ個の実装ステージに対応して設けられて、それぞれ対応する実装ステージに停止する基板に同一種類の部品を実装可能なＭ個の実装部と、一の基板に設けられた複数の実装対象点に対する部品実装をＭ個の実装ステージの間で分配し、当該一の基板を搬送部によって基板搬送方向に搬送しつつＭ個の実装ステージのうち部品実装を分配した実装ステージに停止させて、実装部に対応する実装ステージで停止する当該一の基板に対して対応する実装ステージに分配された部品実装を実行させる制御部とを備え、実装ステージは、分配された部品実装が完了した基板を基板搬送方向の下流側に搬送し、制御部は、Ｌ枚の基板のうち基板搬送方向への搬送順序Ｎ（Ｎは１以上の整数）がＭ未満の基板に対しては初期実装モードで部品実装を実行し、搬送順序ＮがＭ以上の基板に対しては通常実装モードで部品実装を実行し、初期実装モードでは、搬送順序Ｎの基板に関して、Ｍ個の実装ステージのうち基板搬送方向の上流側から数えて（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージに基板への部品実装が選択的に分配され、基板は（Ｍ－Ｎ）番目までの実装ステージを通過して、（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージで基板の複数の実装対象点への部品実装が実行され、通常実装モードでは、Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、基板はＭ個の実装ステージに順番に停止して、Ｍ個の実装ステージのそれぞれで順番に基板の複数の実装対象点への部品実装が実行される。 The component mounting system according to the present invention has M (M is an integer of 2 or more) mounting stages arranged in the substrate transfer direction, and L sheets (L is an integer larger than M) in order in the substrate transfer direction. It is provided corresponding to a conveyance unit to be conveyed, M mounting stages corresponding to M mounting stages, and M mounting units capable of mounting the same kind of component on a substrate stopped at each corresponding mounting stage, and provided on one substrate A mounting stage in which component mounting for a plurality of mounting target points is distributed among M mounting stages, and the one substrate is transported by the transport unit in the substrate transport direction while the component mounting is distributed among the M mounting stages And a control unit for performing component mounting distributed to the corresponding mounting stage to the one substrate stopped at the mounting stage corresponding to the mounting unit, the mounting stage including the distributed component mounting But The transferred substrate is transported to the downstream side of the substrate transport direction, and the control unit initially sets the transport order N (N is an integer of 1 or more) of the L substrates to the substrate transport direction to the substrate less than M. Component mounting is performed in the mounting mode, and component mounting is performed in the normal mounting mode for substrates having a transport order N of M or more, and in the initial mounting mode, of the M mounting stages for the substrate with the transport order N Component mounting on the substrate is selectively distributed to the mounting stage downstream of the (M−N) th mounting stage counted from the upstream side of the substrate transport direction, and the substrate is up to the (M−N) th mounting stage Components are mounted to a plurality of mounting target points on the board in the mounting stage downstream of the (M−N) th mounting stage, and in the normal mounting mode, each of the M mounting stages Component mounting on the board is distributed Will stop in order to M implementation stages, each component mounting to a plurality of mounting object point of the substrate sequentially in the M mounting stage is executed.
　本発明に係る部品実装方法は、基板搬送方向に並ぶＭ個（Ｍは２以上の整数）の実装ステージを有する搬送部によって、Ｌ枚（ＬはＭより大きい整数）の基板を順番に基板搬送方向に搬送する工程と、一の基板に設けられた複数の実装対象点に対する部品実装をＭ個の実装ステージの間で分配し、当該一の基板を搬送部によって基板搬送方向に搬送しつつＭ個の実装ステージのうち部品実装を分配した実装ステージに停止させて、実装ステージで停止する当該一の基板に対して実装ステージに分配された部品実装を実行する工程とを備え、Ｌ枚の基板のうち基板搬送方向への搬送順序Ｎ（Ｎは１以上の整数）がＭ未満の基板に対しては初期実装モードで部品実装を実行し、搬送順序ＮがＭ以上の基板に対しては通常実装モードで部品実装を実行し、初期実装モードでは、搬送順序Ｎの基板に関して、Ｍ個の実装ステージのうち基板搬送方向の上流側から数えて（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージに基板への部品実装が選択的に分配され、基板は（Ｍ－Ｎ）番目までの実装ステージを通過して、（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージで基板の複数の実装対象点への部品実装が実行され、通常実装モードでは、Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、基板はＭ個の実装ステージに順番に停止して、Ｍ個の実装ステージのそれぞれで順番に基板の複数の実装対象点への部品実装が実行される。 In the component mounting method according to the present invention, L transport substrates (L is an integer larger than M) are transported in order by the transport unit having M (M is an integer of 2 or more) mounting stages arranged in the substrate transport direction. The step of transporting in the direction and component mounting for a plurality of mounting target points provided on one substrate are distributed among the M mounting stages, and the one substrate is transported by the transport unit in the substrate transport direction while the M Stopping at the mounting stage to which the component mounting is distributed among the mounting stages, and performing the component mounting distributed to the mounting stage to the one substrate stopped at the mounting stage; Component mounting is performed in the initial mounting mode for substrates whose transport order N (N is an integer of 1 or more) is less than M among the above, and for substrates whose transport order N is M or more, Component mounting in mounting mode In the initial mounting mode, regarding the substrate in transport order N, among the M mounting stages, the substrate is transferred to the mounting stage downstream of the (MN) -th mounting stage counted from the upstream side in the substrate transfer direction. Component mounting is selectively distributed, and the substrate passes through the (M−N) th mounting stage, and a plurality of mounting targets of the substrate are mounted in the mounting stage downstream of the (M−N) th mounting stage Component mounting to a point is performed. In the normal mounting mode, component mounting to the substrate is distributed to each of the M mounting stages, and the substrate is sequentially stopped to the M mounting stages, and M mounting stages are performed. Component mounting to a plurality of mounting target points of the substrate is sequentially performed in each of the above.
　このように構成された本発明（部品実装システム、部品実装方法）では、一の基板に設けられた複数の実装対象点に対する部品実装がＭ個の実装ステージの間で分配される。そして、当該一の基板を基板搬送方向に搬送しつつＭ個の実装ステージのうち部品実装を分配した実装ステージに停止させて、実装ステージで停止する当該一の基板に対して実装ステージに分配された部品実装が実行される。この際、Ｌ枚の基板のうち基板搬送方向への搬送順序ＮがＭ未満の基板に対しては初期実装モードで部品実装が実行され、搬送順序ＮがＭ以上の基板に対しては通常実装モードで部品実装が実行される。初期実装モードでは、搬送順序Ｎの基板に関して、Ｍ個の実装ステージのうち基板搬送方向の上流側から数えて（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージに基板への部品実装が選択的に分配され、基板は（Ｍ－Ｎ）番目までの実装ステージを通過して、（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージで基板の複数の実装対象点への部品実装が実行される。一方、通常実装モードでは、Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、基板はＭ個の実装ステージに順番に停止して、Ｍ個の実装ステージのそれぞれで順番に基板の複数の実装対象点への部品実装が実行される。 In the present invention (component mounting system, component mounting method) configured as described above, component mounting for a plurality of mounting target points provided on one substrate is distributed among M mounting stages. Then, the one of the M mounting stages is stopped at the mounting stage to which the component mounting is distributed while being transported in the substrate transfer direction, and the one board stopped at the mounting stage is distributed to the mounting stage. Component mounting is performed. At this time, component mounting is performed in the initial mounting mode on a substrate having a transport order N of less than M in the substrate transport direction among the L substrates, and the normal mounting is performed on a substrate having a transport order N of M Component mounting is performed in the mode. In the initial mounting mode, with respect to the substrate in transport order N, component mounting on the substrate at the mounting stage downstream of the (M−N) th mounting stage counted from the upstream side of the substrate transport direction among the M mounting stages Are selectively distributed, the substrate passes through the (M−N) th mounting stage, and the mounting target points on the substrate at the mounting stage downstream of the (M−N) th mounting stage Component mounting is performed. On the other hand, in the normal mounting mode, component mounting on the substrate is distributed to each of the M mounting stages, the substrate is sequentially stopped at the M mounting stages, and the substrate is sequentially printed on each of the M mounting stages. Component mounting to a plurality of mounting points is performed.
　したがって、Ｌ枚の基板のうち搬送順序が最初のＭ枚の基板については、次のようにして部品実装が実行される。つまり、１番目から（Ｍ－１）番目の基板は、初期実装モードによって、基板搬送方向の上流側から数えてＭ番目から２番目の実装ステージに搬送され、Ｍ番目の基板は、通常実装モードによって、基板搬送方向の上流側から数えて１番目の実装ステージに搬送される。こうして、Ｍ個の実装ステージのそれぞれに基板を搬送して、各実装ステージで基板への部品実装を開始することができる。これによって、部品実装システムの稼働率の低下を抑制することが可能となっている。 Therefore, component mounting is performed as follows about M board | substrates whose conveyance order is the first among L board | substrates. That is, the first to the (M-1) th substrates are transported to the Mth to the second mounting stages counted from the upstream side in the substrate transport direction in the initial mounting mode, and the Mth substrate is in the normal mounting mode Thus, the substrate is transported to the first mounting stage counting from the upstream side in the substrate transport direction. Thus, the substrate can be transported to each of the M mounting stages, and component mounting on the substrate can be started at each mounting stage. This makes it possible to suppress a drop in the operation rate of the component mounting system.
　なお、本明細書では、Ｉ１番目からＩ２番目との表記（Ｉ１、Ｉ２は１以上の整数である）において、Ｉ１とＩ２とが等しい場合には、当該表記はＩ１番目を示すものとする。 In the present specification, in the notation of I1 to I2 (I1 and I2 are integers of 1 or more), when I1 and I2 are equal, the notation indicates I1.
　また、搬送部は、基板搬送方向に隣り合う実装ステージの間に配置された待機ステージをさらに有し、基板搬送方向において、Ｍ個の実装ステージのうち、最下流の実装ステージ以外の実装ステージは、下流側で隣り合う実装ステージで部品実装が実行する場合には、分配された部品実装が完了した基板を下流側の待機ステージに搬出して、分配された実装対象点への部品実装が未完の基板を基板搬送方向の上流側から搬入するように、部品実装システムを構成しても良い。かかる構成では、最下流の実装ステージ以外の実装ステージは、分配された部品実装が完了した基板を速やかに待機ステージに搬出して、部品実装が未完の次の基板を基板搬送方向の上流側から搬入することができる。その結果、部品実装システムの稼働率の低下をより効果的に抑制することが可能となっている。 The transport unit further includes a standby stage disposed between the mounting stages adjacent in the substrate transport direction, and among the M mounting stages in the substrate transport direction, the mounting stages other than the most downstream mounting stage are When the component mounting is performed at the downstream mounting stage adjacent to each other, the distributed component mounting completed substrate is carried out to the downstream standby stage, and the component mounting to the distributed mounting target point is incomplete. The component mounting system may be configured to carry in the substrate from the upstream side in the substrate transfer direction. In this configuration, the mounting stages other than the most downstream mounting stage promptly carry out the distributed component mounting completed substrate onto the standby stage, and the next substrate whose component mounting is incomplete is taken from the upstream side of the substrate transport direction It can be carried in. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system.
　また、通常実装モードでは、実装ステージのそれぞれで部品が実装される実装対象点の個数の差が１個以下となるように、Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、初期実装モードでは、搬送順序Ｎの基板に関して、基板搬送方向の上流側から数えて（Ｍ－Ｎ＋１）番目の実装ステージには、通常実装モードで基板搬送方向の上流側から数えて１番目から（Ｍ－Ｎ＋１）番目までの実装ステージに分配される部品実装が分配されるように、部品実装システムを構成しても良い。かかる構成では、仮に搬送順序ＮがＭ未満の基板に対して通常実装モードを実行した場合に、基板搬送方向の上流側から数えて１番目から（Ｍ－Ｎ＋１）番目までの実装ステージに分配される部品実装が、初期実装モードにおいて当該（Ｍ－Ｎ＋１）番目の実装ステージに分配される。つまり、初期実装モードでは、搬送順序Ｎの基板に関して、（Ｍ－Ｎ＋１）番目の実装ステージより上流側の実装ステージでの部品実装が省略されるものの、この部品実装を（Ｍ－Ｎ＋１）番目の実装ステージで確実に実行することが可能となっている。 In the normal mounting mode, component mounting on the substrate is distributed to each of the M mounting stages such that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is less than or equal to one, In the initial mounting mode, the (M−N + 1) th mounting stage counted from the upstream side in the substrate conveyance direction with respect to the substrate in the conveyance order N is counted from the first from the upstream side in the substrate conveyance direction in the normal mounting mode The component mounting system may be configured such that component mounting distributed to the (M−N + 1) th mounting stages is distributed. In this configuration, if the normal mounting mode is executed for a substrate whose transport order N is less than M, it is distributed to the first to (M−N + 1) th mounting stages counted from the upstream side in the substrate transport direction. Component mounting is distributed to the (M−N + 1) th mounting stage in the initial mounting mode. That is, in the initial mounting mode, with respect to the substrate in transport order N, component mounting at the mounting stage on the upstream side of the (M−N + 1) th mounting stage is omitted, but this component mounting is the (M−N + 1) th It is possible to execute reliably at the implementation stage.
　また、制御部は、Ｌ枚の基板のうち搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板に対しては終期実装モードで部品実装を実行し、終期実装モードでは、搬送順序Ｎの基板に関して、Ｍ個の実装ステージのうち基板搬送方向の上流側から数えて１番目から（Ｌ－Ｎ＋１）番目までの実装ステージに基板への部品実装が選択的に分配され、１番目から（Ｌ－Ｎ＋１）番目までの実装ステージで基板の複数の実装対象点への部品実装が実行されるように、部品実装システムを構成しても良い。かかる構成では、Ｌ枚の基板のうち搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板に対しては、Ｍ個の実装ステージのうち基板搬送方向の上流側から数えて１番目から（Ｌ－Ｎ＋１）番目までの実装ステージに基板への部品実装が選択的に分配され、１番目から（Ｌ－Ｎ＋１）番目までの実装ステージで基板の複数の実装対象点への部品実装が実行される。したがって、基板搬送方向において、（Ｌ－Ｎ＋１）番目より下流側の実装ステージで部品実装を実行中であっても、１番目から（Ｌ－Ｎ＋１）番目までの実装ステージを稼動させて、搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板に対して部品実装を効率的に実行できる。その結果、部品実装システムの稼働率の低下をより効果的に抑制することが可能となっている。 In addition, the control unit executes component mounting in the final mounting mode for substrates having a transportation order N of (L−M + 2) or more among the L substrates, and in the final mounting mode, the substrate for the transportation order N is The component mounting on the substrate is selectively distributed to the first to (L-N + 1) th mounting stages counted from the upstream side of the substrate transfer direction among the M mounting stages, and from the first to (L-N + 1) The component mounting system may be configured such that component mounting to a plurality of mounting target points of the substrate is performed at the first to the third mounting stages. In such a configuration, among the L substrates, for the substrate having the transport order N of (L−M + 2) or more, the first of the M mounting stages, counting from the upstream side in the substrate transport direction, Component mounting on the substrate is selectively distributed to the (N + 1) th mounting stages, and component mounting to a plurality of mounting target points of the substrate is performed in the first to (L−N + 1) th mounting stages. Therefore, even while component mounting is being performed at the mounting stage downstream of the (L−N + 1) th in the substrate carrying direction, the first to (L−N + 1) th mounting stages are operated, and the carrying order is increased. Component mounting can be efficiently performed on a substrate where N is (L−M + 2) or more. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system.
　また、通常実装モードでは、実装ステージのそれぞれで部品が実装される実装対象点の個数の差が１個以下となるように、Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、終期実装モードでは、搬送順序Ｎの基板に関して、基板搬送方向の上流側から数えて（Ｌ－Ｎ＋１）番目の実装ステージには、通常実装モードで基板搬送方向の上流側から数えて（Ｌ－Ｎ＋１）番目からＭ番目までの実装ステージに分配される部品実装が分配されるように、部品実装システムを構成しても良い。かかる構成では、仮に搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板に対して通常実装モードを実行した場合に、基板搬送方向の上流側から数えて（Ｌ－Ｎ＋１）番目からＭ番目までの実装ステージに分配される部品実装が、終期実装モードにおいて当該（Ｌ－Ｎ＋１）番目の実装ステージに分配される。つまり、終期実装モードでは、搬送順序Ｎの基板に関して、（Ｌ－Ｎ＋１）番目の実装ステージより下流側の実装ステージでの部品実装が省略されるものの、この部品実装を（Ｌ－Ｎ＋１）番目の実装ステージで確実に実行することが可能となっている。 In the normal mounting mode, component mounting on the substrate is distributed to each of the M mounting stages such that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is less than or equal to one, In the final mounting mode, with respect to the substrate in the conveyance order N, counting from the upstream side of the substrate conveyance direction from the upstream side in the substrate conveyance direction, counting from the upstream side of the substrate conveyance direction in the normal mounting mode (L-N + 1) The component mounting system may be configured such that component mounting distributed to the first to Mth mounting stages is distributed. In this configuration, if the normal mounting mode is executed for a substrate having a transport order N of (L−M + 2) or more, the (L−N + 1) th to the Mth from the upstream side in the substrate transport direction are counted. The component mounting distributed to the mounting stage is distributed to the (L−N + 1) th mounting stage in the final mounting mode. That is, in the final mounting mode, with respect to the substrate in transport order N, component mounting at the mounting stage downstream of the (L−N + 1) th mounting stage is omitted, but this component mounting is the (L−N + 1) th It is possible to execute reliably at the implementation stage.
　また、制御部は、通常実装モードにおいて、Ｍ個の実装ステージのうち、一の実装ステージおよび他の実装ステージの少なくとも一方での部品実装の進捗に応じて、一の実装ステージと他の実装ステージとの間での部品実装の分配を調整するように、部品実装システムを構成しても良い。かかる構成では、一の実装ステージでの部品実装の進捗が例えば予定より遅い場合に、一の実装ステージに分配予定であった部品実装を他の実装ステージに分配するといったことができる。 In addition, the control unit, in the normal mounting mode, one mounting stage and the other mounting stage according to the progress of component mounting in at least one of the one mounting stage and the other mounting stage among the M mounting stages. The component mounting system may be configured to adjust the distribution of component mounting among the components. In such a configuration, when the progress of component mounting in one mounting stage is, for example, later than scheduled, it is possible to distribute the component mounting to be distributed to one mounting stage to another mounting stage.
　本発明によれば、複数の実装ステージが基板搬送方向に並ぶ部品実装システムにおいて、部品実装システムの稼働率の低下を抑制することが可能となる。 According to the present invention, in the component mounting system in which a plurality of mounting stages are arranged in the substrate transfer direction, it is possible to suppress a decrease in operation rate of the component mounting system.
本発明に係る部品実装システムの一例を模式的に示す平面図。FIG. 1 is a plan view schematically showing an example of a component mounting system according to the present invention. は基板を基板搬送方向に搬送しつつ基板に部品実装を実行するに際して実行される搬入時判断処理の一例を示すフローチャート。11 is a flow chart showing an example of a loading determination process executed when performing component mounting on a substrate while transporting the substrate in the substrate transfer direction. 基板搬送方向に搬送しつつ基板に部品実装を実行するに際して実行される実装完了時判断処理の一例を示すフローチャート。7 is a flowchart illustrating an example of a mounting completion determination process which is performed when performing component mounting on a substrate while transporting in the substrate transport direction. 図２および図３のフローチャートに従って実行される動作の第１例を模式的に示す図である。FIG. 6 schematically shows a first example of an operation performed according to the flowcharts of FIGS. 2 and 3; 図２および図３のフローチャートに従って実行される動作の第２例を模式的に示す図。FIG. 7 schematically shows a second example of the operation performed according to the flowcharts of FIG. 2 and FIG. 3. 図２および図３のフローチャートに従って実行される動作の第２例を模式的に示す図。FIG. 7 schematically shows a second example of the operation performed according to the flowcharts of FIG. 2 and FIG. 3. 部品実装の進捗のリカバリーを実行可能な部品実装処理の一例を示すフローチャート。7 is a flowchart illustrating an example of a component mounting process capable of performing recovery of the component mounting progress. 図７に示す部品実装処理でのリカバリー要否判定の一例を示すフローチャート。FIG. 8 is a flowchart showing an example of recovery necessity determination in the component mounting process shown in FIG. 7; FIG. 図７および図８のフローチャートに従って実行される動作の一例を模式的に示す図。FIG. 9 schematically shows an example of an operation performed in accordance with the flowcharts of FIG. 7 and FIG. 8.
　図１は本発明に係る部品実装システムの一例を模式的に示す平面図である。図１に示すように、本明細書では、基板搬送方向Ｘ、幅方向Ｙおよび鉛直方向Ｚで構成されるＸＹＺ直交座標軸を適宜用いる。基板搬送方向Ｘおよび幅方向Ｙは水平方向に並行であるとともに互いに直交し、鉛直方向Ｚは基板搬送方向Ｘおよび幅方向Ｙに直交する。 FIG. 1 is a plan view schematically showing an example of a component mounting system according to the present invention. As shown in FIG. 1, in the present specification, XYZ orthogonal coordinate axes configured of a substrate conveyance direction X, a width direction Y, and a vertical direction Z are appropriately used. The substrate transport direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the substrate transport direction X and the width direction Y.
　この部品実装システム１は、基板搬送方向Ｘの上流側から搬入された基板Ｂに対して部品を実装して基板搬送方向Ｘの下流側に搬出する１台の部品実装機１０により構成される。基板Ｂには複数の実装対象点Ｂｐが設けられており、部品実装機１０に具備された制御部１００は、部品実装機１０の各部を制御することで、各実装対象点Ｂｐに部品Ｗｐを１個ずつ実装する。ここで、各部品ＷｐはダイシングされたウェハーＷのベアチップであり、互いに同一の構成を有する。 The component mounting system 1 is configured of one component mounter 10 which mounts components on the substrate B carried in from the upstream side in the substrate conveyance direction X and carries it out downstream in the substrate conveyance direction X. A plurality of mounting target points Bp are provided on the substrate B, and the control unit 100 provided in the component mounting machine 10 controls the respective components of the component mounting machine 10 to place the component Wp on each mounting target point Bp. Implement one by one. Here, each component Wp is a bare chip of the diced wafer W and has the same configuration.
　この部品実装機１０は基板搬送方向Ｘに基板Ｂを搬送する搬送部２を備える。搬送部２は、基板搬送方向Ｘにこの順番で並ぶ、待機コンベア２１、実装コンベア２２、待機コンベア２３、実装コンベア２４および搬出コンベア２５を有し、これらのコンベア２１～２５が協働して基板搬送方向Ｘに基板Ｂを搬送することができる。待機コンベア２１は、部品実装システム１の外部から搬入した基板Ｂを待機させ、あるいは実装コンベア２２に受け渡す。実装コンベア２２は待機コンベア２１の基板搬送方向Ｘの下流側に位置する実装位置Ｐｍ１に対して設けられ、待機コンベア２１から受け取った基板Ｂを実装位置Ｐｍ１に固定し、あるいは待機コンベア２３に受け渡す。待機コンベア２３は実装位置Ｐｍ１の基板搬送方向Ｘの下流側に位置する待機位置Ｐｗに対して設けられ、実装コンベア２２から受け取った基板Ｂを待機位置Ｐｗで待機させ、あるいは実装コンベア２４に受け渡す。実装コンベア２４は待機位置Ｐｗの基板搬送方向Ｘの下流側に位置する実装位置Ｐｍ２に対して設けられ、待機コンベア２３から受け取った基板Ｂを実装位置Ｐｍ２に固定し、あるいは搬出コンベア２５に受け渡す。搬出コンベア２５は実装位置Ｐｍ２の基板搬送方向Ｘの下流側の位置に対して設けられ、実装コンベア２４から受け取った基板Ｂを部品実装システム１の外部へ搬出する。このように、搬送部２では、Ｍ個の実装位置Ｐｍ１、Ｐｍ２が基板搬送方向Ｘに並んで設けられており、基板搬送方向Ｘに隣り合う実装位置Ｐｍ１、Ｐｍ２の間に待機位置Ｐｗが配置されている。ここで、Ｍは２以上の整数で、図１の例ではＭ＝２である。なお、以下では、実装位置Ｐｍ１、Ｐｍ２を区別しない場合には、実装位置Ｐｍと称する。 The component mounter 10 includes a transport unit 2 that transports the substrate B in the substrate transport direction X. The transport unit 2 has a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and an unloading conveyor 25 arranged in this order in the substrate conveyance direction X, and these conveyors 21 to 25 cooperate with each other to The substrate B can be transported in the transport direction X. The standby conveyor 21 causes the substrate B carried in from the outside of the component mounting system 1 to stand by, or delivers the substrate B to the mounting conveyor 22. The mounting conveyor 22 is provided for the mounting position Pm1 located on the downstream side of the substrate conveyance direction X of the standby conveyor 21 and fixes the substrate B received from the standby conveyor 21 to the mounting position Pm1 or delivers it to the standby conveyor 23 . The standby conveyor 23 is provided for the standby position Pw located downstream of the mounting position Pm1 in the substrate transfer direction X, and makes the substrate B received from the mounting conveyor 22 stand by at the standby position Pw or delivers it to the mounting conveyor 24 . The mounting conveyor 24 is provided for the mounting position Pm2 located downstream of the standby position Pw in the substrate transfer direction X, and fixes the substrate B received from the standby conveyor 23 to the mounting position Pm2 or delivers it to the unloading conveyor 25 . The unloading conveyor 25 is provided at a position downstream of the mounting position Pm 2 in the substrate transfer direction X, and discharges the substrate B received from the mounting conveyor 24 to the outside of the component mounting system 1. Thus, in the transport unit 2, M mounting positions Pm 1 and Pm 2 are provided side by side in the substrate transport direction X, and the standby position Pw is disposed between the mount positions Pm 1 and Pm 2 adjacent in the substrate transport direction X It is done. Here, M is an integer of 2 or more, and in the example of FIG. 1, M = 2. Hereinafter, when the mounting positions Pm1 and Pm2 are not distinguished from one another, they will be referred to as mounting positions Pm.
　また、部品実装機１０は部品Ｗｐを供給する部品供給機構３を備える。部品供給機構３は、複数のウェハーＷを収納可能なウェハー収納部３１と、ウェハー収納部３１からウェハー供給位置ＰｐまでウェハーＷを引き出すウェハー引出部３３とを有する。ウェハー収納部３１は、それぞれウェハーＷを保持する複数のウェハーホルダーＷｈを鉛直方向Ｚに並べて収納するラックを鉛直方向Ｚに昇降させることで、ウェハー引出部３３がウェハーＷを受取可能な高さにウェハーホルダーＷｈを位置させて、このウェハーホルダーＷｈをウェハー引出部３３に押し出すことができる。 The component mounter 10 further includes a component supply mechanism 3 for supplying the component Wp. The component supply mechanism 3 has a wafer storage unit 31 capable of storing a plurality of wafers W, and a wafer extraction unit 33 for extracting the wafer W from the wafer storage unit 31 to the wafer supply position Pp. The wafer storage unit 31 arranges a plurality of wafer holders Wh for holding the wafers W in the vertical direction Z and raises and lowers a rack for storing the wafers W at a height at which the wafer lead-out unit 33 can receive the wafers W. The wafer holder Wh can be pushed out to the wafer drawing portion 33 by positioning the wafer holder Wh.
　ウェハー引出部３３は、ウェハーホルダーＷｈを支持するウェハー支持テーブル３３１と、ウェハー支持テーブル３３１を幅方向Ｙに移動可能に支持する固定レール３３２と、幅方向Ｙに設けられてウェハー支持テーブル３３１に取り付けられたボールネジ３３３と、ボールネジ３３３を駆動するＹ軸モーター３３４とを有する。したがって、Ｙ軸モーター３３４によりボールネジ３３３を回転させることで、ウェハー支持テーブル３３１を固定レール３３２に沿って幅方向Ｙに移動させることができる。なお、図１に示すように、ウェハー収納部３１とウェハー供給位置Ｐｐとは搬送部２を幅方向Ｙから挟むように配置されており、ウェハー支持テーブル３３１は搬送部２の下方を通過する。かかるウェハー支持テーブル３３１は、ウェハー収納部３１に隣接する受取位置でウェハー収納部３１からウェハーホルダーＷｈを受け取って、受取位置よりウェハー収納部３１から幅方向Ｙに離れたウェハー供給位置Ｐｐへと移動することで、ウェハー供給位置ＰｐにウェハーＷを引き出す。 The wafer lead-out portion 33 includes a wafer support table 331 supporting the wafer holder Wh, a fixed rail 332 supporting the wafer support table 331 movably in the width direction Y, and is provided in the width direction Y and attached to the wafer support table 331 And a Y-axis motor 334 for driving the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in FIG. 1, the wafer storage unit 31 and the wafer supply position Pp are disposed so as to sandwich the transfer unit 2 in the width direction Y, and the wafer support table 331 passes below the transfer unit 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the reception position adjacent to the wafer storage unit 31 and moves from the reception position to the wafer supply position Pp away from the wafer storage unit 31 in the width direction Y. Thus, the wafer W is pulled out to the wafer supply position Pp.
　さらに、部品供給機構３は、ウェハー供給位置Ｐｐから部品Ｗｐを取り出す部品取出部３５を有する。部品取出部３５は、ウェハー供給位置Ｐｐから部品Ｗｐを取り出す取出ヘッド３６を有し、取出ヘッド３６をＸＹ方向に駆動可能である。つまり、部品取出部３５は、取出ヘッド３６を基板搬送方向Ｘに移動可能に支持する支持部材３５１と、基板搬送方向Ｘに設けられて取出ヘッド３６に取り付けられたボールネジを駆動するＸ軸モーター３５２とを有し、Ｘ軸モーター３５２によりボールネジを駆動することで、取出ヘッド３６を基板搬送方向Ｘに移動させることができる。また、部品取出部３５は、支持部材３５１を幅方向Ｙに移動可能に支持する固定レール３５３と、幅方向Ｙに設けられて固定レール３５３に取り付けられたボールネジ３５４と、ボールネジ３５４を駆動するＹ軸モーター３５５とを有する。したがって、Ｙ軸モーター３５５によりボールネジ３５４を駆動することで、支持部材３５１とともに取出ヘッド３６を幅方向Ｙに移動させることができる。 Furthermore, the component supply mechanism 3 has a component extraction unit 35 for extracting the component Wp from the wafer supply position Pp. The component pickup unit 35 has a pickup head 36 for picking up the component Wp from the wafer supply position Pp, and can drive the pickup head 36 in the X and Y directions. That is, the component pickup unit 35 supports the support member 351 for supporting the pickup head 36 movably in the substrate conveyance direction X, and the X-axis motor 352 for driving a ball screw provided in the substrate conveyance direction X and attached to the pickup head 36. The take-out head 36 can be moved in the substrate transfer direction X by driving the ball screw by the X-axis motor 352. The component pick-up portion 35 also drives a fixed rail 353 for supporting the support member 351 so as to be movable in the width direction Y, a ball screw 354 provided in the width direction Y and attached to the fixed rail 353, and Y for driving the ball screw 354. And an axial motor 355. Therefore, by driving the ball screw 354 by the Y-axis motor 355, the take-out head 36 can be moved in the width direction Y together with the support member 351.
　取出ヘッド３６は、基板搬送方向Ｘに延設されたブラケット３６１と、ブラケット３６１に回転可能に支持された２個のノズル３６２とを有する。各ノズル３６２は、基板搬送方向Ｘに平行な回転軸を中心に回転することで、下方を向く吸着位置および上方を向く受渡位置（図１の位置）のいずれかに位置する。また、ブラケット３６１は、各ノズル３６２を伴って昇降可能である。 The takeout head 36 has a bracket 361 extending in the substrate transport direction X, and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 is positioned at either the suction position facing downward or the delivery position facing upward (position in FIG. 1) by rotating around a rotation axis parallel to the substrate transfer direction X. In addition, the bracket 361 can move up and down with each nozzle 362.
　かかる部品供給機構３は、吸着位置に位置させたノズル３６２を、ウェハー供給位置Ｐｐ上の部品Ｗｐに上方から対向させると、ノズル３６２を下降させて部品Ｗｐに接触させる。さらに、部品供給機構３はノズル３６２に負圧を与えつつノズル３６２を上昇させることで、ウェハー供給位置Ｐｐから部品Ｗｐを吸着する。そして、部品供給機構３は、ノズル３６２を受渡位置に位置させることで、部品Ｗｐを供給する。 When the nozzle 362 located at the suction position faces the component Wp on the wafer supply position Pp from the upper side, the component supply mechanism 3 lowers the nozzle 362 to contact the component Wp. Furthermore, the component supply mechanism 3 sucks the component Wp from the wafer supply position Pp by raising the nozzle 362 while applying a negative pressure to the nozzle 362. Then, the component supply mechanism 3 supplies the component Wp by positioning the nozzle 362 at the delivery position.
　部品実装機１０は、こうして部品供給機構３によって供給された部品Ｗｐを基板Ｂに実装する実装部４Ａ、４Ｂを備える。特にＭ個の実装位置Ｐｍ１、Ｐｍ２に対して一対一の対応関係で、Ｍ個の実装部４Ａ、４Ｂが設けられている（上述の通り、図１の例ではＭ＝２である）。つまり、実装部４Ａは、実装位置Ｐｍ１に対応して設けられ、実装部４Ｂは、実装位置Ｐｍ２に対応して設けられている。実装部４Ａ、４Ｂは、部品実装機１０の天井に幅方向Ｙに設けられた固定レールに沿って移動可能な支持部材４１と、支持部材４１によって基板搬送方向Ｘに移動可能に支持された実装ヘッド４２とを有し、実装ヘッド４２をＸＹ方向に移動させることができる。実装ヘッド４２は、下方を向く２個のノズル４２１を有する。 The component mounter 10 includes mounting portions 4A and 4B for mounting the component Wp thus supplied by the component supply mechanism 3 on the substrate B. In particular, M mounting portions 4A and 4B are provided in a one-to-one correspondence with M mounting positions Pm1 and Pm2 (as described above, M = 2 in the example of FIG. 1). That is, the mounting unit 4A is provided corresponding to the mounting position Pm1, and the mounting unit 4B is provided corresponding to the mounting position Pm2. The mounting portions 4A and 4B are mounted so as to be movable in the substrate transfer direction X by the support member 41 movable along the fixed rail provided in the width direction Y on the ceiling of the component mounter 10 and the support member 41 The mounting head 42 can be moved in the X and Y directions. The mounting head 42 has two nozzles 421 facing downward.
　部品Ｗｐの吸着・実装に際しては、実装部４Ａ、４Ｂそれぞれは、取出ヘッド３６の上方に移動して、受渡位置に位置するノズル３６２に保持される部品Ｗｐに対してノズル４２１を上方から対向させると、ノズル４２１を下降させて部品Ｗｐに接触させる。続いて、部品供給機構３がノズル３６２の負圧を解除するとともに、実装部４Ａ、４Ｂがノズル４２１に負圧を与えつつノズル４２１を上昇させる。こうして実装ヘッド４２によって部品Ｗｐを吸着すると、実装部４Ａは、対応する実装位置Ｐｍ１に固定された基板Ｂの実装対象点Ｂｐに部品Ｗｐを実装し、実装部４Ｂは、対応する実装位置Ｐ４に固定された基板Ｂの実装対象点Ｂｐに部品Ｗｐを実装する。このように、実装部４Ａ、４Ｂは、単一種類の部品Ｗｐを基板Ｂに実装する。なお、以下では、実装部４Ａ、４Ｂを区別しない場合には、実装部４と称する。 At the time of suction and mounting of the component Wp, each of the mounting portions 4A and 4B moves above the takeout head 36 and makes the nozzle 421 face the component Wp held by the nozzle 362 located at the delivery position from above. And the nozzle 421 is lowered to contact the part Wp. Subsequently, the component supply mechanism 3 releases the negative pressure of the nozzle 362, and the mounting portions 4A and 4B raise the nozzle 421 while applying a negative pressure to the nozzle 421. Thus, when the component Wp is absorbed by the mounting head 42, the mounting unit 4A mounts the component Wp on the mounting target point Bp of the substrate B fixed at the corresponding mounting position Pm1, and the mounting unit 4B corresponds to the corresponding mounting position P4. The component Wp is mounted on the mounting target point Bp of the fixed substrate B. Thus, the mounting units 4A and 4B mount the single type of component Wp on the substrate B. Hereinafter, when the mounting units 4A and 4B are not distinguished from one another, they will be referred to as the mounting unit 4.
　かかる部品実装システム１では、制御部１００は、実装位置Ｐｍ１、Ｐｍ２において基板Ｂに部品実装を実行することができる。この際、制御部１００は、一の基板Ｂに設けられた複数の実装対象点Ｂｐに対する部品実装をＭ個の実装位置Ｐｍ１、Ｐｍ２の間で分配する（換言すれば、分担させる）。つまり、搬送部２は、当該一の基板Ｂを基板搬送方向Ｘに搬送しつつ、Ｍ個の実装位置Ｐｍ１、Ｐｍ２のうち部品実装が分配された実装位置Ｐｍに停止させる。そして、実装部４は、対応する実装位置Ｐｍで停止する当該一の基板Ｂに対して、対応する実装位置Ｐｍに分配された部品実装を実行する。 In the component mounting system 1, the control unit 100 can perform component mounting on the substrate B at the mounting positions Pm1 and Pm2. Under the present circumstances, the control part 100 distributes component mounting with respect to several mounting object point Bp provided in the one board | substrate B among M mounting position Pm1 and Pm2 (in other words, it makes share). That is, the transport unit 2 stops the one of the M mounting positions Pm1 and Pm2 at the mounting position Pm at which the component mounting is distributed, while transporting the one substrate B in the substrate transport direction X. And the mounting part 4 performs component mounting distributed to the corresponding mounting position Pm with respect to the said one board | substrate B which stops at the corresponding mounting position Pm.
　通常は、制御部１００は、基板Ｂの複数の実装対象点Ｂｐのうち、基板搬送方向Ｘの上流側半分の実装対象点Ｂｐの部品実装を実装位置Ｐｍ１に分配し、基板搬送方向Ｘの下流側半分の実装対象点Ｂｐの部品実装を実装位置Ｐｍ２に分配する（通常実装モード）。具体的には、搬送部２は一の基板Ｂを実装位置Ｐｍ１に搬送して、実装部４Ａが実装位置Ｐｍ１に停止する基板Ｂの基板搬送方向Ｘの上流側半分の実装対象点Ｂｐ（通常分配点）に部品Ｗｐを実装する。実装位置Ｐｍ１での部品実装が完了すると、搬送部２は、基板Ｂを実装位置Ｐｍ１から実装位置Ｐｍ２に搬送して、実装部４Ｂが実装位置Ｐｍ２に停止する基板Ｂの基板搬送方向Ｘの下流側半分の実装対象点Ｂｐ（通常分配点）に部品Ｗｐを実装する。つまり、通常実装モードは、一の基板Ｂを実装位置Ｐｍ１、Ｐｍ２に順番に停止させて、各実装位置Ｐｍ１、Ｐｍ２に停止する一の基板Ｂに対して各実装位置Ｐｍ１、Ｐｍ２に分配された部品実装を実行する。そして、制御部１００は、複数の基板Ｂを基板搬送方向Ｘに順番に搬送しつつ、各基板Ｂに対して通常実装モードを実行することができる。 Normally, the control unit 100 distributes the component mounting of the mounting target point Bp on the upstream half of the substrate conveying direction X among the plurality of mounting target points Bp on the substrate B to the mounting position Pm1, and the downstream of the substrate conveying direction X The component mounting of the mounting target point Bp on the side half is distributed to the mounting position Pm2 (normal mounting mode). Specifically, the transport unit 2 transports the one substrate B to the mounting position Pm1, and the mounting target point Bp on the upstream half of the substrate transport direction X of the substrate B at which the mounting unit 4A stops at the mounting position Pm1 Mount the component Wp at the distribution point). When the component mounting at the mounting position Pm1 is completed, the transport unit 2 transports the substrate B from the mounting position Pm1 to the mounting position Pm2, and the downstream of the substrate transport direction X of the substrate B where the mounting portion 4B stops at the mounting position Pm2. The component Wp is mounted on the mounting target point Bp (normal distribution point) on the side half. That is, in the normal mounting mode, one substrate B is stopped at the mounting positions Pm1 and Pm2 in order, and one substrate B stopping at each mounting position Pm1 and Pm2 is distributed to the mounting positions Pm1 and Pm2 Execute component mounting. Then, the control unit 100 can execute the normal mounting mode on each of the substrates B while sequentially transporting the plurality of substrates B in the substrate transport direction X.
　ただし、制御部１００は、Ｌ枚（ＬはＭより大きい整数）の基板Ｂを順番に搬送部２により搬送しつつ各基板Ｂに部品実装を実行するにあたっては、基板Ｂの搬送順序Ｎに応じて実装位置Ｐｍ１、Ｐｍ２への部品実装の分配を動的に変更する。図２～図４を用いて、この点を詳述する。なお、以下では、基板搬送方向Ｘの下流あるいは上流を単に「下流」あるいは「上流」と適宜称する。 However, in order to carry out component mounting on each substrate B while conveying L substrates (L is an integer larger than M) of the substrates B in order by the control unit 100, the conveyance order N of the substrates B is used. Dynamically change the distribution of component mounting to the mounting positions Pm1 and Pm2. This point will be described in detail with reference to FIGS. In the following, the downstream or upstream of the substrate transport direction X is simply referred to as “downstream” or “upstream” as appropriate.
　図２は基板を基板搬送方向に搬送しつつ基板に部品実装を実行するに際して実行される搬入時判断処理の一例を示すフローチャートであり、図３は基板搬送方向に搬送しつつ基板に部品実装を実行するに際して実行される実装完了時判断処理の一例を示すフローチャートであり、図４は図２および図３のフローチャートに従って実行される動作の第１例を模式的に示す図である。図４では、４枚（すなわち、Ｌ＝４）の基板Ｂを基板搬送方向Ｘに順番に搬送しつつ、各基板Ｂに部品実装を実行する例が示されている。また、図４では、Ｌ枚の基板Ｂの搬送順序Ｎ（Ｎ＝１～４）が符号Ｂに付されている。 FIG. 2 is a flow chart showing an example of a carrying-in determination process performed when performing component mounting on a substrate while conveying the substrate in the substrate conveyance direction, and FIG. 3 is component mounting on the substrate while conveying in the substrate conveyance direction. FIG. 4 is a flow chart showing an example of an implementation completion determination process executed upon execution, and FIG. 4 is a view schematically showing a first example of an operation executed according to the flow charts of FIG. 2 and FIG. FIG. 4 shows an example in which component mounting is performed on each of the substrates B while the four substrates (that is, L = 4) are sequentially transported in the substrate transport direction X. Further, in FIG. 4, the transport order N (N = 1 to 4) of the L substrates B is attached to the reference symbol B.
　制御部１００は、実装位置Ｐｍ１、Ｐｍ２のそれぞれについて図２および図３のフローチャートに示す搬入時・実装完了時判断処理を実行することで、図４の動作を実行する。１番目の基板Ｂ１の下流端が実装位置Ｐｍ１に搬入されると（図２のステップＳ１０１で「ＹＥＳ」）、基板Ｂ１の複数の実装対象点Ｂｐのうちに、部品Ｗｐが実装されていない未実装点が存在するかが判断される（ステップＳ１０２）。基板Ｂ１には未実装点が存在するため（ステップＳ１０２で「ＹＥＳ」）、ステップＳ１０３に進む。ステップＳ１０３では、本実装位置Ｐｍ１がＭ個の実装位置Ｐｍ１、Ｐｍ２のうち最下流の実装位置Ｐｍであるかが判断される。実装位置Ｐｍ１は最下流の実装位置Ｐｍでないため（ステップＳ１０３で「ＮＯ」）、ステップＳ１０４に進む。ステップＳ１０４では、本実装位置Ｐｍ１より下流の実装位置Ｐｍ２で、基板Ｂ１への部品実装を実行可能かが判断される。実装位置Ｐｍ２で部品実装を実行予定の基板Ｂは存在せず、実装位置Ｐｍ２が基板Ｂ１への部品実装を実行可能であるため（ステップＳ１０４で「ＹＥＳ」）、ステップＳ１０５へ進む。そして、ステップＳ１０５では、制御部１００は、基板Ｂ１の部品実装を、本実装位置Ｐｍ１に分配せず、下流の実装位置Ｐｍ２に分配すると決定する。 The control unit 100 executes the operation of FIG. 4 by performing the carrying-in and mounting completion determination process shown in the flowcharts of FIGS. 2 and 3 for each of the mounting positions Pm1 and Pm2. When the downstream end of the first substrate B1 is carried to the mounting position Pm1 (“YES” in step S101 in FIG. 2), the component Wp is not mounted among the plurality of mounting target points Bp of the substrate B1. It is determined whether there is a mounting point (step S102). Since there is an unmounted point on the substrate B1 ("YES" in step S102), the process proceeds to step S103. In step S103, it is determined whether this mounting position Pm1 is the most downstream mounting position Pm among the M mounting positions Pm1 and Pm2. Since the mounting position Pm1 is not the most downstream mounting position Pm ("NO" in step S103), the process proceeds to step S104. In step S104, it is determined whether component mounting on the substrate B1 can be performed at the mounting position Pm2 downstream from the main mounting position Pm1. Since there is no board B scheduled to perform component mounting at the mounting position Pm2 and the mounting position Pm2 can execute component mounting on the board B1 ("YES" in step S104), the process proceeds to step S105. Then, in step S105, the control unit 100 determines not to distribute the component mounting of the substrate B1 to the main mounting position Pm1 but to distribute to the downstream mounting position Pm2.
　ステップＳ１０５での決定によって、基板Ｂ１は実装位置Ｐｍ１を通過して実装位置Ｐｍ２へ向けて搬送される。こうして基板Ｂ１の下流端が実装位置Ｐｍ２に搬入されると（ステップＳ１０１で「ＹＥＳ」）、基板Ｂ１の未実装点の存在が判断される（ステップＳ１０２）。基板Ｂ１には未実装点が存在するため（ステップＳ１０２で「ＹＥＳ」）、ステップＳ１０３で、本実装位置Ｐｍ２が最下流の実装位置Ｐｍであるかが判断される。実装位置Ｐｍ２は最下流の実装位置Ｐｍであるため（ステップＳ１０３で「ＹＥＳ」）、ステップＳ１０６へ進む。そして、ステップＳ１０６では、制御部１００は、基板Ｂ１の部品実装を本実装位置Ｐｍ２に分配すると決定する。具体的には、基板Ｂ１が停止せずに通過した実装位置Ｐｍ１への通常分配点（上流側半分）と、基板Ｂ１の搬入先である実装位置Ｐｍ２への通常分配点（下流側半分）とに対する部品実装が、実装位置Ｐｍ２に分配される。これによって、図４の動作Ａ１０１の欄に示すように、基板Ｂ１は実装位置Ｐｍ２に搬入され、基板Ｂ１の全実装対象点Ｂｐへの部品実装が実装位置Ｐｍ２に分配される。 By the determination in step S105, the substrate B1 is transported to the mounting position Pm2 past the mounting position Pm1. When the downstream end of the substrate B1 is thus carried to the mounting position Pm2 ("YES" in step S101), the presence of an unmounted point of the substrate B1 is determined (step S102). Since there is an unmounted point on the substrate B1 ("YES" in step S102), it is determined in step S103 whether the main mounting position Pm2 is the most downstream mounting position Pm. Since the mounting position Pm2 is the most downstream mounting position Pm ("YES" in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting of the substrate B1 is to be distributed to the main mounting position Pm2. Specifically, the normal distribution point (upstream half) to the mounting position Pm1 through which the substrate B1 passes without stopping, and the normal distribution point (downstream half) to the mounting position Pm2 to which the substrate B1 is loaded The component mounting for is distributed to the mounting position Pm2. As a result, as shown in the column of operation A101 in FIG. 4, the substrate B1 is carried to the mounting position Pm2, and component mounting on all mounting target points Bp of the substrate B1 is distributed to the mounting position Pm2.
　２番目の基板Ｂ２の下流端が実装位置Ｐｍ１に搬入されると（ステップＳ１０１で「ＹＥＳ」）、ステップＳ１０２で基板Ｂ２に未実装点が存在する（ＹＥＳ）と判断され、さらにステップＳ１０３で本実装位置Ｐｍ１が最下流の実装位置Ｐｍでない（ＮＯ）と判断され、ステップＳ１０４に進む。下流の実装位置Ｐｍ２では先の基板Ｂ１に部品実装を実行予定であるため、ステップＳ１０４では、実装位置Ｐｍ２では基板Ｂ２の部品実装を実装できない（ＮＯ）と判断され、ステップＳ１０６に進む。そして、ステップＳ１０６では、制御部１００は、基板Ｂ２の部品実装を実装位置Ｐｍ１に分配すると決定する。これによって、図４の動作Ａ１０１の欄に示すように、基板Ｂ２は実装位置Ｐｍ１に搬入され、基板Ｂ２の全実装対象点Ｂｐのうち実装位置Ｐｍ１の通常分配点（上流側半分）への部品実装が実装位置Ｐｍ１に分配される。 When the downstream end of the second substrate B2 is carried to the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on the substrate B2 (YES), and further in step S103 It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since component mounting is scheduled to be performed on the previous board B1 at the downstream mounting position Pm2, in step S104 it is determined that the component mounting of the board B2 can not be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to distribute the component mounting of the substrate B2 to the mounting position Pm1. As a result, as shown in the column of operation A101 in FIG. 4, the substrate B2 is carried to the mounting position Pm1, and components to the normal distribution point (upstream half) of the mounting position Pm1 among all mounting target points Bp of the substrate B2 The mounting is distributed to the mounting position Pm1.
　そして、実装位置Ｐｍ２では、実装位置Ｐｍ１、Ｐｍ２への通常分配点への部品実装が１番目の基板Ｂ１に対して開始され、実装位置Ｐｍ１では、実装位置Ｐｍ１への通常分配点への部品実装が２番目の基板Ｂ２に対して開始される。図４の動作Ａ１０２の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ２に対して完了すると（ステップＳ２０１で「ＹＥＳ」）、基板Ｂ２に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ２の複数の実装対象点Ｂｐのうち下流側半分には部品Ｗｐが実装されていないため（ステップＳ２０２で「ＹＥＳ」）、ステップＳ２０３に進む。ステップＳ２０３では、実装位置Ｐｍ１の上流側、すなわち待機コンベア２１に基板Ｂが存在するかが判断される。待機コンベア２１には３番目の基板Ｂ３が存在するため（ステップＳ２０３で「ＹＥＳ」）、ステップＳ２０４に進む。ステップＳ２０４では、実装位置Ｐｍ１の下流側、すなわち待機位置Ｐｗに基板Ｂが存在するかが判断される。待機位置Ｐｗには基板Ｂが存在しないため（ステップＳ２０４で「ＮＯ」）、ステップＳ２０５に進む。そして、ステップＳ２０５では、基板Ｂ２が実装位置Ｐｍ１の下流、すなわち待機位置Ｐｗに搬出され、基板Ｂ３の下流への搬送が開始される。 Then, at the mounting position Pm2, component mounting to the normal distribution point to the mounting positions Pm1 and Pm2 is started for the first board B1, and at the mounting position Pm1, component mounting to the normal distribution point to the mounting position Pm1 Is started for the second substrate B2. As shown in the column of operation A102 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B2 ("YES" in step S201), it is determined whether there is an unmounted point on the substrate B2 (Step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B2 ("YES" in step S202), the process proceeds to step S203. In step S203, it is determined whether the substrate B is present on the upstream side of the mounting position Pm1, that is, the standby conveyor 21. Since the third substrate B3 exists on the standby conveyor 21 ("YES" in step S203), the process proceeds to step S204. In step S204, it is determined whether the substrate B is present on the downstream side of the mounting position Pm1, ie, the standby position Pw. Since the substrate B does not exist at the standby position Pw ("NO" in step S204), the process proceeds to step S205. Then, in step S205, the substrate B2 is unloaded to the downstream of the mounting position Pm1, that is, to the standby position Pw, and the conveyance of the substrate B3 to the downstream is started.
　３番目の基板Ｂ３の下流端が実装位置Ｐｍ１に搬入されると（ステップＳ１０１で「ＹＥＳ」）、ステップＳ１０２で基板Ｂ３に未実装点が存在する（ＹＥＳ）と判断され、さらにステップＳ１０３で本実装位置Ｐｍ１が最下流の実装位置Ｐｍでない（ＮＯ）と判断され、ステップＳ１０４に進む。下流の実装位置Ｐｍ２は先の基板Ｂ１に部品実装を実行中であるため、ステップＳ１０４では、実装位置Ｐｍ２では基板Ｂ３の部品実装を実装できない（ＮＯ）と判断され、ステップＳ１０６に進む。そして、ステップＳ１０６では、制御部１００は、基板Ｂ３の部品実装を実装位置Ｐｍ１に分配すると決定する。これによって、図４の動作Ａ１０３の欄に示すように、基板Ｂ３が実装位置Ｐｍ１に搬入され、基板Ｂ３の全実装対象点Ｂｐのうち実装位置Ｐｍ１の通常分配点（上流側半分）への部品実装が実装位置Ｐｍ１に分配される。 When the downstream end of the third substrate B3 is carried to the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on the substrate B3 (YES), and further the step It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since component mounting is being performed on the previous board B1 at the downstream mounting position Pm2, in step S104, it is determined that the component mounting of the board B3 can not be mounted at the mounting position Pm2 (NO). Then, in step S106, the control unit 100 determines to distribute the component mounting of the substrate B3 to the mounting position Pm1. As a result, as shown in the column of operation A103 in FIG. 4, the board B3 is carried to the mounting position Pm1, and components to the normal distribution point (upstream half) of the mounting position Pm1 among all mounting target points Bp The mounting is distributed to the mounting position Pm1.
　そして、実装位置Ｐｍ１では、実装位置Ｐｍ１への通常分配点への部品実装が３番目の基板Ｂ３に対して開始される。図４の動作Ａ１０４の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ１に対して完了すると（図３のステップＳ２０１で「ＹＥＳ」）、基板Ｂ１に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ１の全実装対象点Ｂｐに対して部品Ｗｐが実装されているため（ステップＳ２０２で「ＮＯ」）、図４の動作Ａ１０５の欄に示すように、基板Ｂ１が実装位置Ｐｍ２から下流へ搬出され、基板Ｂ２の下流への搬送が開始される（ステップＳ２０５）。 Then, at the mounting position Pm1, component mounting to the normal distribution point to the mounting position Pm1 is started for the third substrate B3. As shown in the column of operation A104 in FIG. 4, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B1 (“YES” in step S201 in FIG. 3), an unmounted point exists on the substrate B1. A decision is made (step S202). Since the component Wp is mounted on all mounting target points Bp of the substrate B1 ("NO" in step S202), the substrate B1 is unloaded downstream from the mounting position Pm2, as shown in the column of the operation A105 in FIG. And transport of the substrate B2 to the downstream is started (step S205).
　また、図４の動作Ａ１０４の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ３に対して完了すると（ステップＳ２０１で「ＹＥＳ」）、基板Ｂ３に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ３の複数の実装対象点Ｂｐのうち下流側半分に部品Ｗｐが実装されていないため（ステップＳ２０２で「ＹＥＳ」）、実装位置Ｐｍ１の上流側、すなわち待機コンベア２１に基板Ｂが存在するかが判断される（ステップＳ２０３）。待機コンベア２１には４番目の基板Ｂ４が存在するため（ステップＳ２０３で「ＹＥＳ」）、ステップＳ２０４に進む。ステップＳ２０４では、実装位置Ｐｍ１の下流側、すなわち待機位置Ｐｗに基板Ｂが存在するかが判断される。実装位置Ｐｍ２から基板Ｂ１が搬出されるのに伴って待機位置Ｐｗから基板Ｂ２が搬出されるため、ステップＳ２０４では、待機位置Ｐｗには基板Ｂが存在しない（ＮＯ）と判断され、ステップＳ２０５に進む。そして、図４の動作Ａ１０５の欄に示すように、基板Ｂ３が実装位置Ｐｍ１から待機位置Ｐｗに搬出されるとともに、基板Ｂ４の下流への搬送が開始される（ステップＳ２０５）。 In addition, as shown in the column of operation A104 in FIG. 4, if the component mounting distributed at the mounting position Pm1 is completed on the substrate B3 (“YES” in step S201), is there an unmounted point on the substrate B3? Is determined (step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B3 (“YES” in step S202), is the substrate B present on the upstream side of the mounting position Pm1, ie, the standby conveyor 21? Is determined (step S203). Since the fourth substrate B4 exists in the standby conveyor 21 ("YES" in step S203), the process proceeds to step S204. In step S204, it is determined whether the substrate B is present on the downstream side of the mounting position Pm1, ie, the standby position Pw. Since the substrate B2 is unloaded from the standby position Pw as the substrate B1 is unloaded from the mounting position Pm2, in step S204, it is determined that the substrate B does not exist at the standby position Pw (NO), and the process proceeds to step S205. move on. Then, as shown in the column of operation A105 in FIG. 4, the substrate B3 is unloaded from the mounting position Pm1 to the standby position Pw, and conveyance of the substrate B4 to the downstream is started (step S205).
　基板Ｂ２の下流端が実装位置Ｐｍ２に搬入されると（ステップＳ１０１で「ＹＥＳ」）、基板Ｂ２の未実装点の存在が判断される（ステップＳ１０２）。基板Ｂ２の複数の実装対象点Ｂｐのうち下流側半分には部品Ｗｐが実装されていないため（ステップＳ１０２で「ＹＥＳ」）、ステップＳ１０３で、本実装位置Ｐｍ２が最下流の実装位置Ｐｍであるかが判断される。実装位置Ｐｍ２は最下流の実装位置Ｐｍであるため（ステップＳ１０３で「ＹＥＳ」）、ステップＳ１０６へ進む。そして、ステップＳ１０６では、制御部１００は、基板Ｂ２の未実装点への部品実装を本実装位置Ｐｍ２に分配すると決定する。これによって、図４の動作Ａ１０５の欄に示すように、基板Ｂ２が実装位置Ｐｍ２に搬入され、基板Ｂ２の全実装対象点Ｂｐのうち実装位置Ｐｍ２の通常分配点（下流側半分）への部品実装が実装位置Ｐｍ２に分配される。 When the downstream end of the substrate B2 is carried to the mounting position Pm2 ("YES" in step S101), the presence of an unmounted point of the substrate B2 is determined (step S102). The component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B2 ("YES" in step S102), so the mounting position Pm2 is the most downstream mounting position Pm in step S103. It is judged. Since the mounting position Pm2 is the most downstream mounting position Pm ("YES" in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines to distribute the component mounting on the unmounted point of the substrate B2 to the main mounting position Pm2. As a result, as shown in the column of operation A105 in FIG. 4, the substrate B2 is carried to the mounting position Pm2, and components to the normal distribution point (downstream half) of the mounting position Pm2 among all mounting target points Bp of the substrate B2 The mounting is distributed to the mounting position Pm2.
　また、４番目の基板Ｂ４の下流端が実装位置Ｐｍ１に搬入されると（ステップＳ１０１で「ＹＥＳ」）、ステップＳ１０２で基板Ｂ４に未実装点が存在する（ＹＥＳ）と判断され、さらにステップＳ１０３で本実装位置Ｐｍ１が最下流の実装位置Ｐｍでない（ＮＯ）と判断され、ステップＳ１０４に進む。下流の実装位置Ｐｍ２は先の基板Ｂ２に部品実装を実行予定であるため、ステップＳ１０４では、実装位置Ｐｍ２では基板Ｂ４の部品実装を実装できない（ＮＯ）と判断され、ステップＳ１０６に進む。そして、ステップＳ１０６では、制御部１００は、基板Ｂ４の部品実装を実装位置Ｐｍ１に分配すると決定する。これによって、図４の動作Ａ１０５の欄に示すように、基板Ｂ４が実装位置Ｐｍ１に搬入され、基板Ｂ４の全実装対象点Ｂｐのうち実装位置Ｐｍ１の通常分配点（上流側半分）への部品実装が実装位置Ｐｍ１に分配される。 When the downstream end of the fourth substrate B4 is carried to the mounting position Pm1 ("YES" in step S101), it is determined in step S102 that there is an unmounted point on the substrate B4 (YES), and step S103. Then, it is determined that the present mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since the downstream mounting position Pm2 is to perform component mounting on the previous substrate B2, in step S104, it is determined that the component mounting of the substrate B4 can not be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines to distribute the component mounting of the substrate B4 to the mounting position Pm1. As a result, as shown in the column of operation A105 in FIG. 4, the board B4 is carried to the mounting position Pm1, and a component to the normal distribution point (upstream half) of the mounting position Pm1 among all mounting target points Bp of the board B4 The mounting is distributed to the mounting position Pm1.
　そして、実装位置Ｐｍ２では、実装位置Ｐｍ２への通常分配点への部品実装が２番目の基板Ｂ２に対して開始され、実装位置Ｐｍ１では、実装位置Ｐｍ１への通常分配点への部品実装が４番目の基板Ｂ４に対して開始される。図４の動作Ａ１０６の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ２に対して完了すると（ステップＳ２０１で「ＹＥＳ」）、基板Ｂ２に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ２の全実装対象点Ｂｐに対して部品Ｗｐが実装されているため（ステップＳ２０２で「ＮＯ」）、図４の動作Ａ１０７の欄に示すように、基板Ｂ２が実装位置Ｐｍ２から下流へ搬出され、基板Ｂ３の下流への搬送が開始される（ステップＳ２０５）。 Then, at the mounting position Pm2, component mounting to the normal distribution point to the mounting position Pm2 is started for the second board B2, and at the mounting position Pm1, component mounting to the normal distribution point to the mounting position Pm1 is 4 The second substrate B4 is started. As shown in the column of operation A106 in FIG. 4, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B2 (“YES” in step S201), it is determined whether there is an unmounted point on the substrate B2 (Step S202). Since the component Wp is mounted on all mounting target points Bp of the substrate B2 ("NO" in step S202), the substrate B2 is unloaded downstream from the mounting position Pm2, as shown in the column of operation A107 in FIG. The transport of the substrate B3 to the downstream is started (step S205).
　図４の動作Ａ１０６の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ４に対して完了すると（ステップＳ２０１で「ＹＥＳ」）、基板Ｂ４に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ４の複数の実装対象点Ｂｐのうち下流側半分に部品Ｗｐが実装されていないため（ステップＳ２０２で「ＹＥＳ」）、実装位置Ｐｍ１の上流側、すなわち待機コンベア２１に基板Ｂが存在するかが判断される（ステップＳ２０３）。待機コンベア２１には基板Ｂが存在しないため（ステップＳ２０３で「ＮＯ」）、ステップＳ２０６に進む。ステップＳ２０６では、制御部１００は、基板Ｂ４の部品実装を実装位置Ｐｍ１に分配すると決定する。これによって、図４の動作Ａ１０７の欄に示すように、基板Ｂ４は実装位置Ｐｍ１に留まり、基板Ｂ４の全実装対象点Ｂｐのうち実装位置Ｐｍ２の通常分配点（下流側半分）への部品実装が実装位置Ｐｍ１に分配される。 As shown in the column of operation A106 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B4 ("YES" in step S201), it is determined whether there is an unmounted point on the substrate B4. (Step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B4 (“YES” in step S202), does the substrate B exist on the upstream side of the mounting position Pm1, ie, the standby conveyor 21? Is determined (step S203). Since the substrate B does not exist on the standby conveyor 21 ("NO" in step S203), the process proceeds to step S206. In step S206, the control unit 100 determines to distribute the component mounting of the substrate B4 to the mounting position Pm1. As a result, as shown in the column of operation A107 in FIG. 4, the substrate B4 remains at the mounting position Pm1 and component mounting to the normal distribution point (downstream half) of the mounting position Pm2 among all mounting target points Bp of the substrate B4. Are distributed to the mounting position Pm1.
　基板Ｂ３の下流端が実装位置Ｐｍ２に搬入されると（ステップＳ１０１で「ＹＥＳ」）、基板Ｂ３の未実装点の存在が判断される（ステップＳ１０２）。基板Ｂ３の複数の実装対象点Ｂｐのうち下流側半分には部品Ｗｐが実装されていないため（ステップＳ１０２で「ＹＥＳ」）、ステップＳ１０３で、本実装位置Ｐｍ３が最下流の実装位置Ｐｍであるかが判断される。実装位置Ｐｍ２は最下流の実装位置Ｐｍであるため（ステップＳ１０３で「ＹＥＳ」）、ステップＳ１０６へ進む。そして、ステップＳ１０６では、制御部１００は、基板Ｂ３の未実装点への部品実装を本実装位置Ｐｍ２に分配すると決定する。これによって、図４の動作Ａ１０７に示すように、基板Ｂ３が実装位置Ｐｍ２に搬入され、基板Ｂ３の全実装対象点Ｂｐのうち実装位置Ｐｍ２の通常分配点（下流側半分）への部品実装が実装位置Ｐｍ２に分配される。 When the downstream end of the substrate B3 is carried to the mounting position Pm2 ("YES" in step S101), the presence of an unmounted point of the substrate B3 is determined (step S102). The component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the substrate B3 ("YES" in step S102), so the mounting position Pm3 is the most downstream mounting position Pm in step S103. It is judged. Since the mounting position Pm2 is the most downstream mounting position Pm ("YES" in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting on the unmounted point of the substrate B3 is to be distributed to the main mounting position Pm2. As a result, as shown in operation A107 of FIG. 4, the board B3 is carried to the mounting position Pm2, and component mounting to the normal distribution point (downstream half) of the mounting position Pm2 among all mounting target points Bp of the board B3 is performed. It is distributed to the mounting position Pm2.
　そして、実装位置Ｐｍ２では、実装位置Ｐｍ２への通常分配点への部品実装が３番目の基板Ｂ３に対して開始され、実装位置Ｐｍ１では、実装位置Ｐｍ２への通常分配点への部品実装が４番目の基板Ｂ４に対して開始される。図４の動作Ａ１０８の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ３に対して完了すると（ステップＳ２０１で「ＹＥＳ」）、基板Ｂ３に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ３の全実装対象点Ｂｐに対して部品Ｗｐが実装されているため（ステップＳ２０２で「ＮＯ」）、基板Ｂ３が実装位置Ｐｍ２から下流へ搬出される（ステップＳ２０５）。 Then, at the mounting position Pm2, component mounting to the normal distribution point to the mounting position Pm2 is started for the third board B3, and at the mounting position Pm1, component mounting to the normal distribution point to the mounting position Pm2 is 4 The second substrate B4 is started. As shown in the column of operation A108 in FIG. 4, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B3 ("YES" in step S201), it is determined whether there is an unmounted point on the substrate B3. (Step S202). Since the component Wp is mounted on all mounting target points Bp of the substrate B3 ("NO" in step S202), the substrate B3 is unloaded downstream from the mounting position Pm2 (step S205).
　図４の動作Ａ１０８の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ４に対して完了すると（ステップＳ２０１で「ＹＥＳ」）、基板Ｂ４に未実装点が存在するかが判断される（ステップＳ２０２）。基板Ｂ４の全実装対象点Ｂｐに対して部品Ｗｐが実装されているため（ステップＳ２０２で「ＮＯ」）、基板Ｂ４が実装位置Ｐｍ１から下流へ搬出される（ステップＳ２０５）。さらに、基板Ｂ４の下流端が実装位置Ｐｍ２に搬入されると（ステップＳ１０１で「ＹＥＳ」）、基板Ｂ４に未実装点が存在するかが判断される（ステップＳ１０２）。基板Ｂ４の全実装対象点Ｂｐに対して部品Ｗｐが実装されているため（ステップＳ１０２で「ＮＯ」）、ステップＳ１０７で基板Ｂ４が実装位置Ｐｍ１から下流へ搬出される。 As shown in the column of operation A108 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B4 ("YES" in step S201), it is determined whether there is an unmounted point on the substrate B4. (Step S202). Since the component Wp is mounted on all mounting target points Bp of the substrate B4 ("NO" in step S202), the substrate B4 is unloaded downstream from the mounting position Pm1 (step S205). Furthermore, when the downstream end of the substrate B4 is carried to the mounting position Pm2 ("YES" in step S101), it is determined whether there is an unmounted point on the substrate B4 (step S102). Since the component Wp is mounted on all mounting target points Bp of the substrate B4 ("NO" in step S102), the substrate B4 is unloaded downstream from the mounting position Pm1 in step S107.
　以上のように構成された実施形態では、実装位置Ｐｍの個数Ｍは「２」であり、基板Ｂの枚数Ｌは「４」である。つまり、一の基板Ｂに設けられた複数の実装対象点Ｂｐに対する部品実装が２個の実装位置Ｐｍ１、Ｐｍ２の間で分配される。そして、当該一の基板Ｂを基板搬送方向Ｘに搬送しつつ２個の実装位置Ｐｍ１、Ｐｍ２のうち部品実装を分配した実装位置Ｐｍに停止させて、実装位置Ｐｍで停止する当該一の基板Ｂに対して実装位置Ｐｍに分配された部品実装が実行される。この際、４枚の基板Ｂ１～Ｂ４のうち基板搬送方向Ｘへの搬送順序ＮがＭ未満の基板Ｂ１に対しては初期実装モード（動作Ａ１０１～Ａ１０４における基板Ｂ１に対する動作）で部品実装が実行され、搬送順序ＮがＭ以上であって（Ｌ－Ｍ＋２）番未満の基板Ｂ３に対しては通常実装モード（動作Ａ１０３～Ａ１０８における基板Ｂ３に対する動作）で部品実装が実行される。初期実装モードでは、搬送順序１の基板Ｂ１に関して、２個の実装位置Ｐｍ１、Ｐｍ２のうち基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１よりも下流側の実装位置Ｐｍ２に基板Ｂ１への部品実装が選択的に分配される。したがって、基板Ｂ１は１番目の実装位置Ｐｍ１を通過して、１番目の実装位置Ｐｍ１よりも下流側の実装位置Ｐｍ２で基板Ｂ１の複数の実装対象点Ｂｐへの部品実装が実行される。一方、通常実装モードでは、２個の実装位置Ｐｍ１、Ｐｍ２のそれぞれに基板Ｂ３への部品実装が分配され、基板Ｂ３は２個の実装位置Ｐｍ１、Ｐｍ２に順番に停止して、２個の実装位置Ｐｍ１、Ｐｍ２のそれぞれで順番に基板Ｂ３の複数の実装対象点Ｂｐへの部品実装が実行される。 In the embodiment configured as described above, the number M of the mounting positions Pm is “2”, and the number L of the substrates B is “4”. That is, component mounting with respect to a plurality of mounting target points Bp provided on one substrate B is distributed between two mounting positions Pm1 and Pm2. Then, the first substrate B is stopped at the mounting position Pm at which the component mounting is distributed among the two mounting positions Pm1 and Pm2 while being transported in the substrate transfer direction X, and the first substrate B is stopped at the mounting position Pm. The component mounting distributed to the mounting position Pm is performed. At this time, component mounting is performed in the initial mounting mode (operation with respect to the substrate B1 in the operations A101 to A104) on the substrate B1 having a conveyance order N in the substrate conveyance direction X of less than M among the four substrates B1 to B4. The component mounting is performed in the normal mounting mode (the operation on the substrate B3 in the operations A103 to A108) on the substrate B3 having the transport order N of M or more and less than (L−M + 2). In the initial mounting mode, the board B1 at the mounting position Pm2 on the downstream side of the first mounting position Pm1 among the two mounting positions Pm1 and Pm2 with respect to the board B1 in the conveyance order 1 is counted from the upstream side Component mounting on is selectively distributed. Therefore, the substrate B1 passes the first mounting position Pm1, and component mounting to a plurality of mounting target points Bp of the substrate B1 is performed at the mounting position Pm2 downstream of the first mounting position Pm1. On the other hand, in the normal mounting mode, component mounting on the substrate B3 is distributed to each of the two mounting positions Pm1 and Pm2, and the substrate B3 is stopped at the two mounting positions Pm1 and Pm2 in order, and the two mountings are performed. Component mounting to a plurality of mounting target points Bp of the substrate B3 is sequentially performed at each of the positions Pm1 and Pm2.
　したがって、４枚の基板のうち搬送順序が最初の２枚の基板については、次のようにして部品実装が実行される。つまり、１番目の基板Ｂ１は、初期実装モードによって、基板搬送方向Ｘの上流側から数えて２番目の実装位置Ｐｍ２に搬送され、２番目の基板Ｂ２は、通常実装モードによって、基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１に搬送される。こうして、２個の実装位置Ｐｍ１、Ｐｍ２のそれぞれに基板Ｂ２、Ｂ１を搬送して、各実装位置Ｐｍ１、Ｐｍ２で基板Ｂ２、Ｂ１への部品実装を開始することができる。これによって、部品実装システム１の稼働率の低下を抑制することが可能となっている。 Therefore, component mounting is performed on the first two substrates out of the four substrates in the following manner. That is, the first substrate B1 is transported to the second mounting position Pm2 from the upstream side in the substrate transport direction X in the initial mounting mode, and the second substrate B2 is in the substrate transport direction X in the normal mounting mode. From the upstream side to the first mounting position Pm1. Thus, the substrates B2 and B1 can be transported to the two mounting positions Pm1 and Pm2, respectively, and component mounting on the substrates B2 and B1 can be started at the mounting positions Pm1 and Pm2. By this, it is possible to suppress a decrease in the operation rate of the component mounting system 1.
　また、搬送部２は、基板搬送方向Ｘに隣り合う実装位置Ｐｍ１、Ｐｍ２の間に配置された待機位置Ｐｗをさらに有する。そして、基板搬送方向Ｘにおいて、２個の実装位置Ｐｍ１、Ｐｍ２のうち、最下流の実装位置Ｐｍ２以外の実装位置Ｐｍ１は、下流側で隣り合う実装位置Ｐｍ２で部品実装が実行する場合には、分配された部品実装が完了した基板Ｂを下流側の待機位置Ｐｗに搬出して、分配された部品実装が未完の基板Ｂを基板搬送方向Ｘの上流側から搬入する（動作Ａ１０２～Ａ１０３の基板Ｂ２、Ｂ３等）。かかる構成では、最下流の実装位置Ｐｍ２以外の実装位置Ｐｍ１では、分配された部品実装が完了した基板Ｂを速やかに待機位置Ｐｗに搬出され、部品実装が未完の次の基板Ｂが基板搬送方向Ｘの上流側から搬入される。その結果、部品実装システム１の稼働率の低下をより効果的に抑制することが可能となっている。 The transport unit 2 further includes a standby position Pw disposed between the mounting positions Pm1 and Pm2 adjacent to each other in the substrate transport direction X. Then, among the two mounting positions Pm1 and Pm2 in the substrate transport direction X, the mounting position Pm1 other than the mounting position Pm2 at the most downstream is the part mounting at the mounting position Pm2 adjacent on the downstream side. The distributed component mounting completed substrate B is carried out to the standby position Pw on the downstream side, and the substrate B for which the distributed component mounting is incomplete is carried in from the upstream side in the substrate transport direction X (substrates of operations A102 to A103 B2, B3 etc.). In such a configuration, at the mounting position Pm1 other than the most downstream mounting position Pm2, the distributed substrate mounting completed components B are promptly carried out to the standby position Pw, and the next substrate B for which component mounting is not completed is in the substrate conveyance direction It is carried in from the upstream side of X. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system 1.
　また、通常実装モードでは、実装位置Ｐｍ１、Ｐｍ２のそれぞれで部品Ｗｐが実装される実装対象点Ｂｐの個数の差が１個以下となるように（上記の実施形態では、個数の差はゼロである）、２個の実装位置Ｐｍ１、Ｐｍ２のそれぞれに基板Ｂへの部品実装が分配される。一方、初期実装モードでは、搬送順序１の基板Ｂ１に関して、基板搬送方向Ｘの上流側から数えて２番目の実装位置Ｐｍ２には、通常実装モードで基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に分配される部品実装が分配される。かかる構成では、仮に搬送順序ＮがＭ未満の基板Ｂ１に対して通常実装モードを実行した場合に、基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に分配される部品実装が、初期実装モードにおいて２番目の実装位置Ｐｍ２に分配される。つまり、初期実装モードでは、搬送順序１の基板Ｂ１に関して、２番目の実装位置Ｐｍ２より上流側の実装位置Ｐｍ１での部品実装が省略されるものの、この部品実装を２番目の実装位置Ｐｍ２で確実に実行することが可能となっている。 Further, in the normal mounting mode, the difference in the number of mounting target points Bp on which the component Wp is mounted at each of the mounting positions Pm1 and Pm2 is 1 or less (in the above embodiment, the number difference is zero). Component mounting on the substrate B is distributed to each of the two mounting positions Pm1 and Pm2). On the other hand, in the initial mounting mode, the second mounting position Pm2 from the upstream side in the substrate conveyance direction X with respect to the substrate B1 in the conveyance order 1 is the first from the upstream side in the substrate conveyance direction X in the normal mounting mode. The component mountings distributed to the second to the second mounting positions Pm1 and Pm2 are distributed. In this configuration, if the normal mounting mode is executed for a substrate B1 having a transport order N less than M, distribution to the first to second mounting positions Pm1 and Pm2 counted from the upstream side in the substrate transport direction X is performed. Component mounting is distributed to the second mounting position Pm2 in the initial mounting mode. That is, in the initial mounting mode, component mounting at the mounting position Pm1 on the upstream side of the second mounting position Pm2 is omitted for the substrate B1 in transport order 1, but this component mounting is assured at the second mounting position Pm2. It is possible to carry out.
　また、通常実装モードにおいて、実装位置Ｐｍ１、Ｐｍ２のそれぞれで部品Ｗｐが実装される実装対象点Ｂｐの個数の差を１個以下とすることで、各実装位置Ｐｍ１、Ｐｍ２での実装時間を均等化できる。すなわち、各実装位置Ｐｍ１、Ｐｍ２での実装対象点Ｂｐの個数がおおよそ均等であれば、各実装位置Ｐｍ１、Ｐｍ２からの基板Ｂの搬送を略同時に実行できる。また、各実装位置Ｐｍ１、Ｐｍ２の実装時間自体が均等化されるように、各実装位置Ｐｍ１、Ｐｍ２での実装対象点Ｂｐの個数を決めても良い。この場合、各実装位置Ｐｍ１、Ｐｍ２での実装時間を完全に等しくできないにしても、各実装位置Ｐｍ１、Ｐｍ２での実装時間の差を抑えるように、各実装位置Ｐｍ１、Ｐｍ２での実装対象点Ｂｐの個数を決めても良い。 Also, by setting the difference in the number of mounting target points Bp on which the component Wp is mounted at each of the mounting positions Pm1 and Pm2 in the normal mounting mode to one or less, the mounting time at each mounting position Pm1 and Pm2 is equalized. Can be That is, if the numbers of mounting target points Bp at the mounting positions Pm1 and Pm2 are approximately equal, conveyance of the substrate B from the mounting positions Pm1 and Pm2 can be substantially simultaneously performed. In addition, the number of mounting target points Bp at each mounting position Pm1 and Pm2 may be determined so that the mounting time itself of each mounting position Pm1 and Pm2 is equalized. In this case, even if the mounting times at the mounting positions Pm1 and Pm2 can not be completely equalized, the mounting target points at the mounting positions Pm1 and Pm2 can be reduced so as to suppress the difference between the mounting times at the mounting positions Pm1 and Pm2. You may decide the number of Bp.
　また、制御部１００は、４枚の基板Ｂ１～Ｂ４のうち搬送順序Ｎが４番以上の基板Ｂ４に対しては終期実装モード（動作Ａ１０５～Ａ１０８における基板Ｂ４に対する動作）で部品実装を実行する。この終期実装モードでは、搬送順序４の基板Ｂ４に関して、２個の実装位置Ｐｍ１、Ｐｍ２のうち基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１に基板Ｂ４への部品実装が選択的に分配され、１番目の実装位置Ｐｍ１で基板Ｂ４の複数の実装対象点Ｂｐへの部品実装が実行される。かかる構成では、４枚の基板Ｂ１～Ｂ４のうち搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板Ｂ４に対しては、２個の実装位置Ｐｍ１、Ｐｍ２のうち基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１に基板Ｂ４への部品実装が選択的に分配され、１番目の実装位置Ｐｍ１で基板Ｂ４の複数の実装対象点Ｂｐへの部品実装が実行される。したがって、基板搬送方向Ｘにおいて、１番目より下流側の実装位置Ｐｍ２で部品実装を実行中であっても、１番目の実装位置Ｐｍ１を稼動させて、搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板Ｂ４に対して部品実装を効率的に実行できる。その結果、部品実装システム１の稼働率の低下をより効果的に抑制することが可能となっている。 In addition, the control unit 100 performs component mounting in the final mounting mode (operation on the substrate B4 in operations A105 to A108) on the substrate B4 having a conveyance order N of 4 or more among the four substrates B1 to B4. . In this final mounting mode, with regard to the substrate B4 in the conveyance order 4, component mounting on the substrate B4 is selective at the first mounting position Pm1 of the two mounting positions Pm1 and Pm2 counting from the upstream side in the substrate conveyance direction X. , And component mounting to a plurality of mounting target points Bp of the substrate B4 is performed at the first mounting position Pm1. In this configuration, for the substrate B4 having a transport order N of (L−M + 2) or more among the four substrates B1 to B4, the two mounting positions Pm1 and Pm2 from the upstream side in the substrate transport direction X Component mounting on the substrate B4 is selectively distributed to the first mounting position Pm1 and component mounting on a plurality of mounting target points Bp of the substrate B4 is executed at the first mounting position Pm1. Therefore, even while component mounting is being performed at the mounting position Pm2 downstream of the first in the substrate transfer direction X, the first mounting position Pm1 is operated, and the transfer order N is (L−M + 2) or more Component mounting can be efficiently performed on the substrate B4 of As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system 1.
　また、終期実装モードでは、搬送順序４の基板Ｂ４に関して、基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１には、通常実装モードで基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に分配される部品実装が分配される。かかる構成では、仮に搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板Ｂ４に対して通常実装モードを実行した場合に、基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に分配される部品実装が、終期実装モードにおいて１番目の実装位置Ｐｍ１に分配される。つまり、終期実装モードでは、搬送順序４の基板Ｂ４に関して、１番目の実装位置Ｐｍ１より下流側の実装位置Ｐｍ２での部品実装が省略されるものの、この部品実装を１番目の実装位置Ｐｍ１で確実に実行することが可能となっている。 In the final mounting mode, the first mounting position Pm1 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B4 in the conveyance order 4 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode. The component mountings distributed to the second to the second mounting positions Pm1 and Pm2 are distributed. In this configuration, if the normal mounting mode is executed for the substrate B4 having the transport order N equal to or greater than (L−M + 2), the first to the second mounting positions counted from the upstream side in the substrate transport direction X The component mounting distributed to Pm1 and Pm2 is distributed to the first mounting position Pm1 in the final mounting mode. That is, in the final mounting mode, with regard to the substrate B4 in the transport order 4, component mounting at the mounting position Pm2 downstream of the first mounting position Pm1 is omitted, but this component mounting is assured at the first mounting position Pm1 It is possible to carry out.
　図５および図６は図２および図３のフローチャートに従って実行される動作の第２例を模式的に示す図である。図５および図６では、８枚（すなわち、Ｌ＝８）の基板Ｂを基板搬送方向Ｘに順番に搬送しつつ、各基板Ｂに部品実装を実行する例が示されている。また、図５および図６では、Ｌ枚の基板Ｂの搬送順序Ｎ（Ｎ＝１～８）が符号Ｂに付されている。 5 and 6 schematically show a second example of the operation performed in accordance with the flowcharts of FIGS. 2 and 3. FIGS. 5 and 6 show an example in which component mounting is performed on each substrate B while sequentially transporting eight substrates B (that is, L = 8) in the substrate transport direction X. Further, in FIG. 5 and FIG. 6, the transport order N (N = 1 to 8) of the L substrates B is given the reference numeral B.
　図５および図６に示すように、搬送部２では、実装コンベア２４と搬出コンベア２５（図１）との間に、待機コンベア２６と実装コンベア２７とが基板搬送方向Ｘにこの順で並べて設けられており、待機コンベア２６は待機位置Ｐｗ２で基板Ｂを停止・固定させ、実装コンベア２７は実装位置Ｐｍ３で基板Ｂを停止・固定させる。つまり、搬送部２では、Ｍ個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３が基板搬送方向Ｘに並んで設けられており、基板搬送方向Ｘに隣り合う実装位置Ｐｍ１、Ｐｍ２の間に待機位置Ｐｗ１が配置され、基板搬送方向Ｘに隣り合う実装位置Ｐｍ２、Ｐｍ３の間に待機位置Ｐｗ２が配置されている。ここで、図５および図６の例ではＭ＝３であり、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に一対一で対応して３個の実装部４が設けられており、各実装部４は対応する実装位置Ｐｍで停止する基板Ｂに対して部品実装を実行する。なお、以下では、実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３を区別しない場合には、実装位置Ｐｍと称し、待機位置Ｐｗ１、Ｐｗ２を区別しない場合には、待機位置Ｐｗと称する。 As shown in FIGS. 5 and 6, in the transport unit 2, the standby conveyor 26 and the mounting conveyor 27 are provided in this order in the substrate transport direction X between the mounting conveyor 24 and the unloading conveyor 25 (FIG. 1). The standby conveyor 26 stops and fixes the substrate B at the standby position Pw2, and the mounting conveyor 27 stops and fixes the substrate B at the mounting position Pm3. That is, in the transport unit 2, the M mounting positions Pm1, Pm2, and Pm3 are provided side by side in the substrate transport direction X, and the standby position Pw1 is disposed between the mount positions Pm1 and Pm2 adjacent in the substrate transport direction X The standby position Pw2 is disposed between the mounting positions Pm2 and Pm3 adjacent to each other in the substrate transfer direction X. Here, in the example of FIGS. 5 and 6, M = 3, and three mounting portions 4 are provided corresponding to the three mounting positions Pm1, Pm2, and Pm3 in a one-to-one manner. Executes component mounting on the substrate B stopped at the corresponding mounting position Pm. Hereinafter, when the mounting positions Pm1, Pm2, and Pm3 are not distinguished, they are referred to as mounting positions Pm, and when the standby positions Pw1 and Pw2 are not distinguished from each other, they are referred to as waiting positions Pw.
　第２例においても、制御部１００は、Ｌ枚の基板Ｂを順番に搬送部２により搬送しつつ各基板Ｂに部品実装を実行するにあたっては、基板Ｂの搬送順序Ｎに応じて実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３への部品実装の分配を動的に変更する。この際、実装位置Ｐｍの個数の違いに応じて、通常実装モードで実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれに分配される実装対象点Ｂｐが第１例と異なる。つまり、基板Ｂの複数の実装対象点Ｂｐのうち、実装位置Ｐｍ１では上流側の３分の１の実装対象点Ｂｐ（通常分配点）に対して部品Ｗｐが実装され、実装位置Ｐｍ２では中央の３分の１の実装対象点Ｂｐ（通常分配点）に対して部品Ｗｐが実装され、実装位置Ｐｍ３では下流側の３分の１の実装対象点Ｂｐ（通常分配点）に対して部品Ｗｐが実装される。 Also in the second example, when the control unit 100 performs component mounting on each substrate B while sequentially conveying L sheets of the substrate B by the conveyance unit 2, the mounting position Pm 1 according to the conveyance order N of the substrate B , Pm2, Pm3 dynamically change the distribution of component mounting. At this time, the mounting target points Bp distributed to the mounting positions Pm1, Pm2, and Pm3 in the normal mounting mode differ from the first example according to the difference in the number of the mounting positions Pm. That is, of the plurality of mounting target points Bp of the substrate B, the component Wp is mounted at the mounting position Pm1 on the upstream one-third mounting target point Bp (normal distribution point), and the mounting position Pm2 is central at the center The component Wp is mounted to the mounting target point Bp (normal distribution point) of 1/3, and the mounting position Pm3 is the part Wp to the mounting target point Bp (normal distribution point) on the downstream side. Implemented.
　そして、制御部１００は、実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれについて図２および図３のフローチャートに示す搬入時・実装完了時判断処理を実行することで、図５および図６の動作を実行する。なお、図２および図３のフローチャートに基づく判断の詳細は上記の第１例と同様であるので、その説明は適宜省略する。 Then, the control unit 100 executes the operations of FIG. 5 and FIG. 6 by executing the carrying-in / mounting completion determination process shown in the flowcharts of FIGS. . The details of the determination based on the flowcharts of FIGS. 2 and 3 are the same as those of the first example described above, and thus the description thereof will be omitted as appropriate.
　図５の動作Ａ２０１の欄に示すように、１番目の基板Ｂ１を基板搬送方向Ｘに搬送しつつ、基板Ｂ１に対して実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれで搬入時判断処理が実行された結果、基板Ｂ１は、実装位置Ｐｍ１、Ｐｍ２を通過して実装位置Ｐｍ３に搬入され、基板Ｂ１への部品実装が実装位置Ｐｍ３に分配される。具体的には、基板Ｂ１が停止せずに通過した実装位置Ｐｍ１、Ｐｍ２への通常分配点と、基板Ｂ１の搬入先である実装位置Ｐｍ３への通常分配点とに対する部品実装が、実装位置Ｐｍ３に分配される。これによって、基板Ｂ１の全実装対象点Ｂｐへの部品実装が実装位置Ｐｍ３に分配される。 As shown in the column of operation A201 of FIG. 5, while carrying the first substrate B1 in the substrate transfer direction X, the loading determination process is executed at each of the mounting positions Pm1, Pm2, and Pm3 with respect to the substrate B1. As a result, the substrate B1 passes the mounting positions Pm1 and Pm2 and is carried to the mounting position Pm3, and the component mounting on the substrate B1 is distributed to the mounting position Pm3. Specifically, the component mounting at the normal distribution point to the mounting positions Pm1 and Pm2 through which the substrate B1 passes without stopping and the normal distribution point to the mounting position Pm3 to which the substrate B1 is carried is the mounting position Pm3. Distributed to As a result, component mounting on all mounting target points Bp of the substrate B1 is distributed to the mounting position Pm3.
　また、２番目の基板Ｂ２を基板搬送方向Ｘに搬送しつつ、基板Ｂ２に対して実装位置Ｐｍ１、Ｐｍ２のそれぞれで搬入時判断処理が実行された結果、基板Ｂ２は、実装位置Ｐｍ１を通過して実装位置Ｐｍ２に搬入され、基板Ｂ２への部品実装が実装位置Ｐｍ２に分配される。具体的には、基板Ｂ２が停止せずに通過した実装位置Ｐｍ１への通常分配点と、基板Ｂ２の搬入先である実装位置Ｐｍ２への通常分配点とに対する部品実装が、実装位置Ｐｍ２に分配される。これによって、基板Ｂ２の上流側の３分の２の実装対象点Ｂｐへの部品実装が実装位置Ｐｍ２に分配される。 In addition, as a result of carrying out determination processing at the loading position Pm1 and Pm2 with respect to the substrate B2 while transporting the second substrate B2 in the substrate transport direction X, the substrate B2 passes the mounting position Pm1. Is carried into the mounting position Pm2, and component mounting on the substrate B2 is distributed to the mounting position Pm2. Specifically, component mounting for the normal distribution point to the mounting position Pm1 through which the substrate B2 passes without stopping and the normal distribution point to the mounting position Pm2 to which the substrate B2 is carried is distributed to the mounting position Pm2 Be done. As a result, component mounting on the two thirds of the mounting target points Bp on the upstream side of the substrate B2 is distributed to the mounting position Pm2.
　さらに、３番目の基板Ｂ３を基板搬送方向Ｘに搬送しつつ、基板Ｂ３に対して実装位置Ｐｍ１で搬入時判断処理が実行された結果、基板Ｂ３は実装位置Ｐｍ１に搬入され、基板Ｂ３への部品実装が実装位置Ｐｍ１に分配される。具体的には、実装位置Ｐｍ１の通常分配点に対する部品実装が、実装位置Ｐｍ１に分配される。これによって、基板Ｂ３の上流側の３分の１の実装対象点Ｂｐ（通常分配点）への部品実装が実装位置Ｐｍ１に分配される。 Furthermore, as the third substrate B3 is transported in the substrate transport direction X, the loading determination process is performed on the substrate B3 at the mounting position Pm1. As a result, the substrate B3 is transported to the mounting position Pm1 and is transferred to the substrate B3. The component mounting is distributed to the mounting position Pm1. Specifically, component mounting for the normal distribution point of the mounting position Pm1 is distributed to the mounting position Pm1. As a result, component mounting on the upstream one-third mounting target point Bp (normal distribution point) on the upstream side of the substrate B3 is distributed to the mounting position Pm1.
　そして、実装位置Ｐｍ３では、実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３への通常分配点への部品実装が１番目の基板Ｂ１に対して開始され、実装位置Ｐｍ２では、実装位置Ｐｍ１、Ｐｍ２への通常分配点への部品実装が２番目の基板Ｂ２に対して開始され、実装位置Ｐｍ１では、実装位置Ｐｍ１への通常分配点への部品実装が１番目の基板Ｂ３に対して開始される。図５の動作Ａ２０２の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ３に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０３の欄に示すように、基板Ｂ３が実装位置Ｐｍ１から待機位置Ｐｗ１に搬出される。これと並行して、４番目の基板Ｂ４の下流への搬送が開始されて、基板Ｂ４の下流端が実装位置Ｐｍ１に搬入されると、実装位置Ｐｍ１で搬入時判断処理が実行される。その結果、図５の動作Ａ２０３の欄に示すように、基板Ｂ４が実装位置Ｐｍ１に搬入され、基板Ｂ４への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、基板Ｂ４の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点への部品実装が分配され、実装位置Ｐｍ１ではこの部品実装が基板Ｂ４に対して開始される。 Then, at the mounting position Pm3, component mounting to the normal distribution points to the mounting positions Pm1, Pm2 and Pm3 is started for the first board B1, and at the mounting position Pm2, normal distribution points to the mounting positions Pm1 and Pm2 Component mounting to the second substrate B2 starts, and at the mounting position Pm1, component mounting to the normal distribution point to the mounting position Pm1 starts to the first substrate B3. As shown in the column of operation A202 of FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B3, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A203 of FIG. 5, the substrate B3 is unloaded from the mounting position Pm1 to the standby position Pw1. At the same time, the conveyance of the fourth substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is carried to the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A203 in FIG. 5, the substrate B4 is carried to the mounting position Pm1, and the component mounting on the substrate B4 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B4 at the mounting position Pm1. Be done.
　図５の動作Ａ２０４の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ２に対して完了すると、実装位置Ｐｍ２で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０５の欄に示すように、基板Ｂ２が実装位置Ｐｍ２から待機位置Ｐｗ２に搬出される。これと並行して、基板Ｂ３の下流への搬送が開始され、基板Ｂ３の下流端が実装位置Ｐｍ２に搬入されると、実装位置Ｐｍ２で搬入時判断処理が実行される。その結果、図５の動作Ａ２０５の欄に示すように、基板Ｂ３が実装位置Ｐｍ２に搬入され、基板Ｂ３への部品実装が実装位置Ｐｍ２に分配される。これによって、実装位置Ｐｍ２には、基板Ｂ３の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配され、実装位置Ｐｍ２ではこの部品実装が基板Ｂ３に対して開始される。 As shown in the column of operation A204 in FIG. 5, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B2, the mounting completion determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A205 in FIG. 5, the substrate B2 is unloaded from the mounting position Pm2 to the standby position Pw2. At the same time, transport of the substrate B3 to the downstream is started, and when the downstream end of the substrate B3 is carried into the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A205 of FIG. 5, the substrate B3 is carried to the mounting position Pm2, and the component mounting on the substrate B3 is distributed to the mounting position Pm2. As a result, the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B3 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B3 at the mounting position Pm2. Be done.
　図５の動作Ａ２０４の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ４に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０５の欄に示すように、基板Ｂ４が実装位置Ｐｍ１から待機位置Ｐｗ１に搬出される。これと並行して、５番目の基板Ｂ５の下流への搬送が開始され、基板Ｂ５の下流端が実装位置Ｐｍ１に搬入されると、実装位置Ｐｍ１で搬入時判断処理が実行される。その結果、図５の動作Ａ２０５の欄に示すように、基板Ｂ５が実装位置Ｐｍ１に搬入され、基板Ｂ５への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、基板Ｂ５の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点への部品実装が分配され、実装位置Ｐｍ１ではこの部品実装が基板Ｂ５に対して開始される。 As shown in the column of operation A204 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed on the board B4, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A205 of FIG. 5, the substrate B4 is unloaded from the mounting position Pm1 to the standby position Pw1. At the same time, the conveyance of the fifth substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is carried into the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A205 in FIG. 5, the substrate B5 is carried to the mounting position Pm1, and the component mounting on the substrate B5 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B5 at the mounting position Pm1. Be done.
　図５の動作Ａ２０６の欄に示すように、実装位置Ｐｍ３で分配された部品実装が基板Ｂ１に対して完了すると、実装位置Ｐｍ３で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０７の欄に示すように、基板Ｂ１が実装位置Ｐｍ３から搬出される。これと並行して、基板Ｂ２の下流への搬送が開始され、基板Ｂ２の下流端が実装位置Ｐｍ３に搬入されると、実装位置Ｐｍ３で搬入時判断処理が実行される。その結果、図５の動作Ａ２０７の欄に示すように、基板Ｂ２が実装位置Ｐｍ３に搬入され、基板Ｂ２への部品実装が実装位置Ｐｍ３に分配される。これによって、実装位置Ｐｍ３には、基板Ｂ２の複数の実装対象点Ｂｐのうち実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ３ではこの部品実装が基板Ｂ２に対して開始される。 As shown in the column of operation A206 in FIG. 5, when the component mounting distributed at the mounting position Pm3 is completed on the substrate B1, the mounting completion determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B1 is unloaded from the mounting position Pm3. At the same time, transport of the substrate B2 to the downstream is started, and when the downstream end of the substrate B2 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B2 is carried to the mounting position Pm3, and the component mounting on the substrate B2 is distributed to the mounting position Pm3. As a result, the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B2 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B2 at the mounting position Pm3. Be done.
　図５の動作Ａ２０６の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ３に対して完了すると、実装位置Ｐｍ２で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０７の欄に示すように、基板Ｂ３が実装位置Ｐｍ２から待機位置Ｐｗ２に搬出される。これと並行して、基板Ｂ４の下流への搬送が開始され、基板Ｂ４の下流端が実装位置Ｐｍ２に搬入されると、実装位置Ｐｍ２で搬入時判断処理が実行される。その結果、図５の動作Ａ２０７の欄に示すように、基板Ｂ４が実装位置Ｐｍ２に搬入され、基板Ｂ４への部品実装が実装位置Ｐｍ２に分配される。これによって、実装位置Ｐｍ２には、基板Ｂ４の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配され、実装位置Ｐｍ２ではこの部品実装が基板Ｂ４に対して開始される。 As shown in the column of operation A206 in FIG. 5, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B3, the mounting completion determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B3 is unloaded from the mounting position Pm2 to the standby position Pw2. At the same time, transport of the substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is carried into the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B4 is carried into the mounting position Pm2, and the component mounting on the substrate B4 is distributed to the mounting position Pm2. As a result, the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B4 at the mounting position Pm2. Be done.
　図５の動作Ａ２０６の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ５に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０７の欄に示すように、基板Ｂ５が実装位置Ｐｍ１から待機位置Ｐｗ１に搬出される。これと並行して、６番目の基板Ｂ６の下流への搬送が開始され、基板Ｂ６の下流端が実装位置Ｐｍ１に搬入されると、実装位置Ｐｍ１で搬入時判断処理が実行される。その結果、図５の動作Ａ２０７の欄に示すように、基板Ｂ６が実装位置Ｐｍ１に搬入され、基板Ｂ６への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、基板Ｂ６の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点への部品実装が分配され、実装位置Ｐｍ１ではこの部品実装が基板Ｂ６に対して開始される。 As shown in the column of operation A206 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed on the board B5, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B5 is unloaded from the mounting position Pm1 to the standby position Pw1. At the same time, downstream conveyance of the sixth substrate B6 is started, and when the downstream end of the substrate B6 is carried into the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B6 is carried to the mounting position Pm1, and the component mounting on the substrate B6 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B6 at the mounting position Pm1. Be done.
　図５の動作Ａ２０８の欄に示すように、実装位置Ｐｍ３で分配された部品実装が基板Ｂ２に対して完了すると、実装位置Ｐｍ３で実装完了時判断処理が実行される。その結果、図６の動作Ａ２０９の欄に示すように、基板Ｂ２が実装位置Ｐｍ３から搬出される。これと並行して、基板Ｂ３の下流への搬送が開始され、基板Ｂ３の下流端が実装位置Ｐｍ３に搬入されると、実装位置Ｐｍ３で搬入時判断処理が実行される。その結果、図５の動作Ａ２０９の欄に示すように、基板Ｂ３が実装位置Ｐｍ３に搬入され、基板Ｂ３への部品実装が実装位置Ｐｍ３に分配される。これによって、実装位置Ｐｍ３には、基板Ｂ３の複数の実装対象点Ｂｐのうち実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ３ではこの部品実装が基板Ｂ３に対して開始される。 As shown in the column of operation A208 in FIG. 5, when the component mounting distributed at the mounting position Pm3 is completed on the substrate B2, the mounting completion determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A209 in FIG. 6, the substrate B2 is unloaded from the mounting position Pm3. At the same time, transport of the substrate B3 to the downstream is started, and when the downstream end of the substrate B3 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A209 in FIG. 5, the substrate B3 is carried to the mounting position Pm3, and the component mounting on the substrate B3 is distributed to the mounting position Pm3. As a result, the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B3 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B3 at the mounting position Pm3. Be done.
　図５の動作Ａ２０８の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ４に対して完了すると、実装位置Ｐｍ２で実装完了時判断処理が実行される。その結果、図５の動作Ａ２０９の欄に示すように、基板Ｂ４が実装位置Ｐｍ２から待機位置Ｐｗ２に搬出される。これと並行して、基板Ｂ５の下流への搬送が開始され、基板Ｂ５の下流端が実装位置Ｐｍ２に搬入されると、実装位置Ｐｍ２で搬入時判断処理が実行される。その結果、図５の動作Ａ２０９の欄に示すように、基板Ｂ５が実装位置Ｐｍ２に搬入され、基板Ｂ５への部品実装が実装位置Ｐｍ２に分配される。これによって、実装位置Ｐｍ２には、基板Ｂ５の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配され、実装位置Ｐｍ２ではこの部品実装が基板Ｂ５に対して開始される。 As shown in the column of operation A208 in FIG. 5, when the component mounting distributed at the mounting position Pm2 is completed on the board B4, the mounting completion determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A209 in FIG. 5, the substrate B4 is unloaded from the mounting position Pm2 to the standby position Pw2. At the same time, transport of the substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is carried to the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A 209 in FIG. 5, the substrate B5 is carried into the mounting position Pm2, and the component mounting on the substrate B5 is distributed to the mounting position Pm2. As a result, the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B5 at the mounting position Pm2. Be done.
　図５の動作Ａ２０８の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ６に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図６の動作Ａ２０９の欄に示すように、基板Ｂ６が実装位置Ｐｍ１から待機位置Ｐｗ１に搬出される。これと並行して、７番目の基板Ｂ７の下流への搬送が開始され、基板Ｂ７の下流端が実装位置Ｐｍ１に搬入されると、実装位置Ｐｍ１で搬入時判断処理が実行される。その結果、図６の動作Ａ２０９の欄に示すように、基板Ｂ７が実装位置Ｐｍ１に搬入され、基板Ｂ７への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、基板Ｂ７の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点への部品実装が分配され、実装位置Ｐｍ１ではこの部品実装が基板Ｂ７に対して開始される。 As shown in the column of operation A208 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B6, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A209 in FIG. 6, the substrate B6 is unloaded from the mounting position Pm1 to the standby position Pw1. In parallel with this, the conveyance of the seventh substrate B7 to the downstream is started, and when the downstream end of the substrate B7 is carried to the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A209 in FIG. 6, the substrate B7 is carried to the mounting position Pm1, and the component mounting on the substrate B7 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B7 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B7 at the mounting position Pm1. Be done.
　図６の動作Ａ２１０の欄に示すように、実装位置Ｐｍ３で分配された部品実装が基板Ｂ３に対して完了すると、実装位置Ｐｍ３で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１１の欄に示すように、基板Ｂ３が実装位置Ｐｍ３から搬出される。これと並行して、基板Ｂ４の下流への搬送が開始され、基板Ｂ４の下流端が実装位置Ｐｍ３に搬入されると、実装位置Ｐｍ３で搬入時判断処理が実行される。その結果、図６の動作Ａ２１１の欄に示すように、基板Ｂ４が実装位置Ｐｍ３に搬入され、基板Ｂ４への部品実装が実装位置Ｐｍ３に分配される。これによって、実装位置Ｐｍ３には、基板Ｂ４の複数の実装対象点Ｂｐのうち実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ３ではこの部品実装が基板Ｂ４に対して開始される。 As shown in the column of operation A210 in FIG. 6, when the component mounting distributed at the mounting position Pm3 is completed on the substrate B3, the mounting completion determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B3 is unloaded from the mounting position Pm3. At the same time, transport of the substrate B4 to the downstream is started, and when the downstream end of the substrate B4 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B4 is carried to the mounting position Pm3, and the component mounting on the substrate B4 is distributed to the mounting position Pm3. As a result, the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B4 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B4 at the mounting position Pm3. Be done.
　図６の動作Ａ２１０の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ５に対して完了すると、実装位置Ｐｍ２で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１１の欄に示すように、基板Ｂ５が実装位置Ｐｍ２から待機位置Ｐｗ２に搬出される。これと並行して、基板Ｂ６の下流への搬送が開始され、基板Ｂ６の下流端が実装位置Ｐｍ２に搬入されると、実装位置Ｐｍ２で搬入時判断処理が実行される。その結果、図６の動作Ａ２１１の欄に示すように、基板Ｂ６が実装位置Ｐｍ２に搬入され、基板Ｂ６への部品実装が実装位置Ｐｍ２に分配される。これによって、実装位置Ｐｍ２には、基板Ｂ６の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配され、実装位置Ｐｍ２ではこの部品実装が基板Ｂ６に対して開始される。 As shown in the column of operation A210 in FIG. 6, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B5, the mounting completion determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B5 is unloaded from the mounting position Pm2 to the standby position Pw2. At the same time, transport of the substrate B6 to the downstream is started, and when the downstream end of the substrate B6 is carried to the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B6 is carried to the mounting position Pm2, and the component mounting on the substrate B6 is distributed to the mounting position Pm2. As a result, the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm2, and the component mounting starts to the substrate B6 at the mounting position Pm2. Be done.
　図６の動作Ａ２１０の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ７に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１１の欄に示すように、基板Ｂ７が実装位置Ｐｍ１から待機位置Ｐｗ１に搬出される。これと並行して、８番目の基板Ｂ８の下流への搬送が開始され、基板Ｂ８の下流端が実装位置Ｐｍ１に搬入されると、実装位置Ｐｍ１で搬入時判断処理が実行される。その結果、図６の動作Ａ２１１の欄に示すように、基板Ｂ８が実装位置Ｐｍ１に搬入され、基板Ｂ８への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、基板Ｂ８の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点への部品実装が分配され、実装位置Ｐｍ１ではこの部品実装が基板Ｂ８に対して開始される。 As shown in the column of operation A210 in FIG. 6, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B7, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B7 is unloaded from the mounting position Pm1 to the standby position Pw1. In parallel with this, the conveyance of the eighth substrate B8 to the downstream is started, and when the downstream end of the substrate B8 is carried to the mounting position Pm1, the carrying-in determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B8 is carried to the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm1 among the plurality of mounting target points Bp of the substrate B8 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B8 at the mounting position Pm1. Be done.
　図６の動作Ａ２１２の欄に示すように、実装位置Ｐｍ３で分配された部品実装が基板Ｂ４に対して完了すると、実装位置Ｐｍ３で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１３の欄に示すように、基板Ｂ４が実装位置Ｐｍ３から搬出される。これと並行して、基板Ｂ５の下流への搬送が開始され、基板Ｂ５の下流端が実装位置Ｐｍ３に搬入されると、実装位置Ｐｍ３で搬入時判断処理が実行される。その結果、図６の動作Ａ２１３の欄に示すように、基板Ｂ５が実装位置Ｐｍ３に搬入され、基板Ｂ５への部品実装が実装位置Ｐｍ３に分配される。これによって、実装位置Ｐｍ３には、基板Ｂ５の複数の実装対象点Ｂｐのうち実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ３ではこの部品実装が基板Ｂ５に対して開始される。 As shown in the column of operation A212 in FIG. 6, when the component mounting distributed at the mounting position Pm3 is completed on the substrate B4, the mounting completion determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B4 is unloaded from the mounting position Pm3. At the same time, transport of the substrate B5 to the downstream is started, and when the downstream end of the substrate B5 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B5 is carried to the mounting position Pm3, and the component mounting on the substrate B5 is distributed to the mounting position Pm3. As a result, component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B5 is distributed to the mounting position Pm3, and at the mounting position Pm3, this component mounting starts to the substrate B5. Be done.
　図６の動作Ａ２１２の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ６に対して完了すると、実装位置Ｐｍ２で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１３の欄に示すように、基板Ｂ６が実装位置Ｐｍ２から待機位置Ｐｗ２に搬出される。これと並行して、基板Ｂ７の下流への搬送が開始され、基板Ｂ７の下流端が実装位置Ｐｍ２に搬入されると、実装位置Ｐｍ２で搬入時判断処理が実行される。その結果、図６の動作Ａ２１３の欄に示すように、基板Ｂ７が実装位置Ｐｍ２に搬入され、基板Ｂ７への部品実装が実装位置Ｐｍ２に分配される。これによって、実装位置Ｐｍ２には、基板Ｂ７の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配され、実装位置Ｐｍ２ではこの部品実装が基板Ｂ７に対して開始される。 As shown in the column of operation A212 in FIG. 6, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B6, the mounting completion determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B6 is unloaded from the mounting position Pm2 to the standby position Pw2. At the same time, downstream conveyance of the substrate B7 is started, and when the downstream end of the substrate B7 is carried into the mounting position Pm2, the carrying-in determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B7 is carried to the mounting position Pm2, and the component mounting on the substrate B7 is distributed to the mounting position Pm2. As a result, component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B7 is distributed to the mounting position Pm2, and this component mounting starts to the substrate B7 at the mounting position Pm2. Be done.
　図６の動作Ａ２１２の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ８に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１３の欄に示すように、基板Ｂ８は実装位置Ｐｍ１に留まり、基板Ｂ８への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、基板Ｂ８の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配され、実装位置Ｐｍ１ではこの部品実装が基板Ｂ８に対して開始される。 As shown in the column of operation A212 of FIG. 6, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B8, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B8 remains at the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B8 is distributed to the mounting position Pm1, and the component mounting starts to the substrate B8 at the mounting position Pm1. Be done.
　図６の動作Ａ２１４の欄に示すように、実装位置Ｐｍ３で分配された部品実装が基板Ｂ５に対して完了すると、実装位置Ｐｍ３で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１５の欄に示すように、基板Ｂ５が実装位置Ｐｍ３から搬出される。これと並行して、基板Ｂ６の下流への搬送が開始され、基板Ｂ６の下流端が実装位置Ｐｍ３に搬入されると、実装位置Ｐｍ３で搬入時判断処理が実行される。その結果、図６の動作Ａ２１５の欄に示すように、基板Ｂ６が実装位置Ｐｍ３に搬入され、基板Ｂ６への部品実装が実装位置Ｐｍ３に分配される。これによって、実装位置Ｐｍ３には、基板Ｂ６の複数の実装対象点Ｂｐのうち実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ３ではこの部品実装が基板Ｂ６に対して開始される。 As shown in the column of operation A214 in FIG. 6, when the component mounting distributed at the mounting position Pm3 is completed on the substrate B5, the mounting completion determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A 215 in FIG. 6, the substrate B5 is unloaded from the mounting position Pm3. At the same time, transport of the substrate B6 to the downstream is started, and when the downstream end of the substrate B6 is carried to the mounting position Pm3, the carrying-in determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A 215 in FIG. 6, the substrate B6 is carried to the mounting position Pm3, and the component mounting on the substrate B6 is distributed to the mounting position Pm3. As a result, the component mounting to the normal distribution point to the mounting position Pm3 among the plurality of mounting target points Bp of the substrate B6 is distributed to the mounting position Pm3, and the component mounting starts to the substrate B6 at the mounting position Pm3. Be done.
　図６の動作Ａ２１４の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ７に対して完了すると、実装位置Ｐｍ２で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１５の欄に示すように、基板Ｂ７は実装位置Ｐｍ２に留まり、基板Ｂ７への部品実装が実装位置Ｐｍ２に分配される。これによって、実装位置Ｐｍ２には、実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ２ではこの部品実装が基板Ｂ７に対して開始される。 As shown in the column of operation A214 of FIG. 6, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B7, the mounting completion determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A 215 in FIG. 6, the substrate B7 remains at the mounting position Pm2, and the component mounting on the substrate B7 is distributed to the mounting position Pm2. As a result, the component mounting at the normal distribution point to the mounting position Pm3 is distributed to the mounting position Pm2, and the component mounting is started on the substrate B7 at the mounting position Pm2.
　図６の動作Ａ２１４の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ８に対して完了すると、実装位置Ｐｍ１で実装完了時判断処理が実行される。その結果、図６の動作Ａ２１５の欄に示すように、基板Ｂ８は実装位置Ｐｍ１に留まり、基板Ｂ８への部品実装が実装位置Ｐｍ１に分配される。これによって、実装位置Ｐｍ１には、実装位置Ｐｍ３への通常分配点への部品実装が分配され、実装位置Ｐｍ３ではこの部品実装が基板Ｂ８に対して開始される。 As shown in the column of operation A 214 in FIG. 6, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B8, the mounting completion determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A 215 in FIG. 6, the substrate B8 remains at the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point to the mounting position Pm3 is distributed to the mounting position Pm1, and the component mounting is started on the board B8 at the mounting position Pm3.
　図６の動作Ａ２１６の欄に示すように、実装位置Ｐｍ３、Ｐｍ２、Ｐｍ１で、それぞれに分配された部品実装が基板Ｂ６、Ｂ７、Ｂ８に対して完了すると、これら基板Ｂ６、Ｂ７、Ｂ８は、実装完了時・搬入時判断処理に従って、搬送部２から搬出される。こうして、Ｌ枚（８枚）の基板Ｂ１～Ｂ８への部品実装が完了する。 As shown in the column of operation A216 in FIG. 6, when the component mounting distributed to each of the mounting positions Pm3, Pm2 and Pm1 is completed with respect to the substrates B6, B7 and B8, these substrates B6, B7 and B8 are It is unloaded from the transport unit 2 in accordance with the completion of mounting and the determination of loading. Thus, component mounting on L (eight) substrates B1 to B8 is completed.
　以上のように構成された実施形態では、実装位置Ｐｍの個数Ｍは「３」であり、基板Ｂの枚数Ｌは「８」である。つまり、一の基板Ｂに設けられた複数の実装対象点Ｂｐに対する部品実装が３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３の間で分配される。そして、当該一の基板Ｂを基板搬送方向Ｘに搬送しつつ３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のうち部品実装を分配した実装位置Ｐｍに停止させて、実装位置Ｐｍで停止する当該一の基板Ｂに対して実装位置Ｐｍに分配された部品実装が実行される。この際、８枚の基板Ｂ１～Ｂ８のうち基板搬送方向Ｘへの搬送順序ＮがＭ未満の基板Ｂ１、Ｂ２に対しては初期実装モード（動作Ａ２０１～Ａ２０８における基板Ｂ１、Ｂ２に対する動作）で部品実装が実行され、搬送順序ＮがＭ以上であって（Ｌ－Ｍ＋２）番未満の基板Ｂ３～Ｂ６に対しては通常実装モード（動作Ａ２０１～Ａ２１６における基板Ｂ３～Ｂ６に対する動作）で部品実装が実行される。初期実装モードでは、搬送順序１の基板Ｂ１に関して、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のうち基板搬送方向Ｘの上流側から数えて２番目の実装位置Ｐｍ２よりも下流側の実装位置Ｐｍ３に基板Ｂ１への部品実装が選択的に分配される。したがって、基板Ｂ１は１～２番目の実装位置Ｐｍ１、Ｐｍ２を通過して、２番目の実装位置Ｐｍ２よりも下流側の実装位置Ｐｍ３で基板Ｂ１の複数の実装対象点Ｂｐへの部品実装が実行される。また、搬送順序１の基板Ｂ２に関して、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のうち基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１よりも下流側の実装位置Ｐｍ２、Ｐｍ３に基板Ｂ２への部品実装が選択的に分配される。したがって、基板Ｂ１は１番目の実装位置Ｐｍ１を通過して、１番目の実装位置Ｐｍ１よりも下流側の実装位置Ｐｍ２、Ｐｍ３で基板Ｂ２の複数の実装対象点Ｂｐへの部品実装が実行される。一方、通常実装モードでは、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれに基板Ｂ３～Ｂ６への部品実装が分配され、基板Ｂ３～Ｂ６は３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に順番に停止して、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれで順番に基板Ｂ３～Ｂ６の複数の実装対象点Ｂｐへの部品実装が実行される。 In the embodiment configured as described above, the number M of the mounting positions Pm is “3”, and the number L of the substrates B is “8”. That is, component mounting with respect to a plurality of mounting target points Bp provided on one substrate B is distributed among the three mounting positions Pm1, Pm2, and Pm3. Then, one of the three mounting positions Pm1, Pm2, and Pm3 is stopped at the mounting position Pm at which the component mounting is distributed, and is stopped at the mounting position Pm while conveying the one substrate B in the substrate conveyance direction X Component mounting distributed to the mounting position Pm with respect to the substrate B is performed. At this time, among the eight substrates B1 to B8, the substrates B1 and B2 having a transport order N in the substrate transport direction X less than M in the initial mounting mode (operations on the substrates B1 and B2 in operations A201 to A208) Component mounting is performed, and components mounting is performed in the normal mounting mode (operations on substrates B3 to B6 in operations A201 to A216) for substrates B3 to B6 having a transport order N of M or more and less than (L−M + 2) Is executed. In the initial mounting mode, of the three mounting positions Pm1, Pm2, and Pm3 with respect to the substrate B1 having the conveyance order 1, the mounting position Pm3 on the downstream side of the second mounting position Pm2 is counted from the upstream side of the substrate conveyance direction X. Component mounting on the substrate B1 is selectively distributed. Therefore, the board B1 passes the first and second mounting positions Pm1 and Pm2, and the component mounting to the plurality of mounting target points Bp of the board B1 is executed at the mounting position Pm3 downstream of the second mounting position Pm2. Be done. Further, with regard to the substrate B2 in transport order 1, among the three mounting positions Pm1, Pm2 and Pm3, the substrates are mounted at mounting positions Pm2 and Pm3 on the downstream side of the first mounting position Pm1 counting from the upstream side Component mounting to B2 is selectively distributed. Therefore, the substrate B1 passes the first mounting position Pm1, and component mounting to the plurality of mounting target points Bp of the substrate B2 is performed at the mounting positions Pm2 and Pm3 downstream of the first mounting position Pm1. . On the other hand, in the normal mounting mode, component mounting on the substrates B3 to B6 is distributed to each of the three mounting positions Pm1, Pm2 and Pm3, and the substrates B3 to B6 are sequentially arranged at the three mounting positions Pm1, Pm2 and Pm3. After stopping, component mounting to a plurality of mounting target points Bp of the substrates B3 to B6 is executed in order at each of the three mounting positions Pm1, Pm2 and Pm3.
　したがって、８枚の基板のうち搬送順序が最初の３枚の基板については、次のようにして部品実装が実行される。つまり、１番目の基板Ｂ１は、初期実装モードによって、基板搬送方向Ｘの上流側から数えて３番目の実装位置Ｐｍ３に搬送され、２番目の基板Ｂ２は、初期実装モードによって、基板搬送方向Ｘの上流側から数えて２番目の実装位置Ｐｍ２に搬送され、３番目の基板Ｂ３は、通常実装モードによって、基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１に搬送される。こうして、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれに基板Ｂ３、Ｂ２、Ｂ１を搬送して、各実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３で基板Ｂ３、Ｂ２、Ｂ１への部品実装を開始することができる。これによって、部品実装システム１の稼働率の低下を抑制することが可能となっている。 Therefore, component mounting is performed on the first three substrates out of the eight substrates in the following order. That is, the first substrate B1 is transported to the third mounting position Pm3 from the upstream side in the substrate transport direction X in the initial mounting mode, and the second substrate B2 is in the substrate transport direction X in the initial mounting mode. The third substrate B3 is transported to the first mounting position Pm1 from the upstream side in the substrate transfer direction X in the normal mounting mode by counting from the upstream side of the substrate and being transported to the second mounting position Pm2. Thus, the substrates B3, B2, B1 are transported to the three mounting positions Pm1, Pm2, Pm3 respectively, and component mounting on the substrates B3, B2, B1 can be started at the mounting positions Pm1, Pm2, Pm3. it can. By this, it is possible to suppress a decrease in the operation rate of the component mounting system 1.
　また、搬送部２は、基板搬送方向Ｘに隣り合う実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３の間に配置された待機位置Ｐｗ１、Ｐｗ２をさらに有する。そして、基板搬送方向Ｘにおいて、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のうち、最下流の実装位置Ｐｍ３以外の実装位置Ｐｍ１、Ｐｍ２は、下流側で隣り合う実装位置Ｐｍ２、Ｐｍ３で部品実装が実行する場合には、分配された部品実装が完了した基板Ｂを下流側の待機位置Ｐｗ１、Ｐｗ２に搬出して、分配された部品実装が未完の基板Ｂを基板搬送方向Ｘの上流側から搬入する（動作Ａ２０４～Ａ２０５の基板Ｂ２、Ｂ４等）。かかる構成では、最下流の実装位置Ｐｍ３以外の実装位置Ｐｍ１、Ｐｍ２では、分配された部品実装が完了した基板Ｂを速やかに待機位置Ｐｗ１、Ｐｗ２に搬出され、部品実装が未完の次の基板Ｂが基板搬送方向Ｘの上流側から搬入される。その結果、部品実装システム１の稼働率の低下をより効果的に抑制することが可能となっている。 The transport unit 2 further includes standby positions Pw1 and Pw2 disposed between the mounting positions Pm1, Pm2 and Pm3 adjacent to each other in the substrate transport direction X. Of the three mounting positions Pm1, Pm2 and Pm3 in the substrate transport direction X, the mounting positions Pm1 and Pm2 other than the mounting position Pm3 at the most downstream are component mounting at mounting positions Pm2 and Pm3 adjacent on the downstream side In the case of execution, the substrate B for which the distributed component mounting has been completed is carried out to the standby positions Pw1 and Pw2 on the downstream side, and the substrate B for which the distributed component mounting is incomplete is carried in from the upstream side of the substrate transport direction X (Substrates B2 and B4 of operations A204 to A205, etc.). In this configuration, at the mounting positions Pm1 and Pm2 other than the most downstream mounting position Pm3, the distributed substrate mounting completed components B are promptly taken out to the standby positions Pw1 and Pw2, and the next substrate B whose component mounting is not completed is completed. Are loaded from the upstream side in the substrate transfer direction X. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system 1.
　また、通常実装モードでは、実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれで部品Ｗｐが実装される実装対象点Ｂｐの個数の差が１個以下となるように（上記の実施形態では、個数の差はゼロである）、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のそれぞれに基板Ｂへの部品実装が分配される。一方、初期実装モードでは、搬送順序１の基板Ｂ１に関して、基板搬送方向Ｘの上流側から数えて３番目の実装位置Ｐｍ３には、通常実装モードで基板搬送方向Ｘの上流側から数えて１番目から３番目までの実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に分配される部品実装が分配される。かかる構成では、仮に搬送順序１がＭ未満の基板Ｂ１に対して通常実装モードを実行した場合に、基板搬送方向Ｘの上流側から数えて１番目から３番目までの実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に分配される部品実装が、初期実装モードにおいて３番目の実装位置Ｐｍ３に分配される。つまり、初期実装モードでは、搬送順序１の基板Ｂ１に関して、３番目の実装位置Ｐｍ３より上流側の実装位置Ｐｍ１、Ｐｍ２での部品実装が省略されるものの、この部品実装を３番目の実装位置Ｐｍ３で確実に実行することが可能となっている。 Further, in the normal mounting mode, the difference in the number of mounting target points Bp on which the component Wp is mounted at each of the mounting positions Pm1, Pm2 and Pm3 is 1 or less (in the above embodiment, the difference in the number is Component mounting on the substrate B is distributed to each of the three mounting positions Pm1, Pm2 and Pm3). On the other hand, in the initial mounting mode, the third mounting position Pm3 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B1 in the conveyance order 1 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode The component mounting distributed to the third to third mounting positions Pm1, Pm2, and Pm3 is distributed. In this configuration, if the normal mounting mode is executed on a substrate B1 having a transport order 1 less than M, the first to third mounting positions Pm1, Pm2, and Pm3 counted from the upstream side in the substrate transport direction X The component mounting distributed to is distributed to the third mounting position Pm3 in the initial mounting mode. That is, in the initial mounting mode, with regard to the substrate B1 of transport order 1, although component mounting at the mounting positions Pm1 and Pm2 upstream of the third mounting position Pm3 is omitted, this component mounting is performed at the third mounting position Pm3 It is possible to execute with
　また、初期実装モードでは、搬送順序２の基板Ｂ２に関して、基板搬送方向Ｘの上流側から数えて２番目の実装位置Ｐｍ２には、通常実装モードで基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に分配される部品実装が分配される。かかる構成では、仮に搬送順序２がＭ未満の基板Ｂ２に対して通常実装モードを実行した場合に、基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に分配される部品実装が、初期実装モードにおいて２番目の実装位置Ｐｍ２に分配される。つまり、初期実装モードでは、搬送順序２の基板Ｂ２に関して、２番目の実装位置Ｐｍ３より上流側の実装位置Ｐｍ１での部品実装が省略されるものの、この部品実装を２番目の実装位置Ｐｍ２で確実に実行することが可能となっている。 In the initial mounting mode, the second mounting position Pm2 from the upstream side in the substrate conveyance direction X with respect to the substrate B2 in the conveyance order 2 is the first from the upstream side in the substrate conveyance direction X in the normal mounting mode. The component mountings distributed to the second to the second mounting positions Pm1 and Pm2 are distributed. In this configuration, if the normal mounting mode is executed for a substrate B2 having a transport order 2 less than M, distribution to the first to second mounting positions Pm1 and Pm2 counted from the upstream side in the substrate transport direction X is performed. Component mounting is distributed to the second mounting position Pm2 in the initial mounting mode. That is, in the initial mounting mode, component mounting at the mounting position Pm1 on the upstream side of the second mounting position Pm3 is omitted for the substrate B2 in transport order 2, but this component mounting is assured at the second mounting position Pm2. It is possible to carry out.
　また、制御部１００は、８枚の基板Ｂ１～Ｂ８のうち搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板Ｂ７、Ｂ８に対しては終期実装モード（動作Ａ２０９～Ａ２１６における基板Ｂ７、Ｂ８に対する動作）で部品実装を実行する。つまり、この終期実装モードでは、搬送順序７の基板Ｂ７に関して、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のうち基板搬送方向Ｘの上流側から数えて１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２に基板Ｂ７への部品実装が選択的に分配され、１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２で基板Ｂ７の複数の実装対象点Ｂｐへの部品実装が実行される。したがって、基板搬送方向Ｘにおいて、２番目より下流側の実装位置Ｐｍ３で部品実装を実行中であっても、１番目から２番目までの実装位置Ｐｍ１、Ｐｍ２を稼動させて、搬送順序Ｎが７番の基板Ｂ７に対して部品実装を効率的に実行できる。また、搬送順序８の基板Ｂ８に関して、３個の実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３のうち基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１に基板Ｂ８への部品実装が選択的に分配され、１番目の実装位置Ｐｍ１で基板Ｂ８の複数の実装対象点Ｂｐへの部品実装が実行される。したがって、基板搬送方向Ｘにおいて、１番目より下流側の実装位置Ｐｍ２、Ｐｍ３で部品実装を実行中であっても、１番目の実装位置Ｐｍ１を稼動させて、搬送順序Ｎが８番の基板Ｂ８に対して部品実装を効率的に実行できる。その結果、部品実装システムの稼働率の低下をより効果的に抑制することが可能となっている。 In addition, the control unit 100 sets the final mounting mode for substrates B7 and B8 having a transport order N of (L−M + 2) or higher among the eight substrates B1 to B8 (for substrates B7 and B8 in operations A209 to A216). Execute component mounting in (operation). That is, in the final mounting mode, of the three mounting positions Pm1, Pm2 and Pm3 with respect to the substrate B7 in the conveyance order 7, the first to second mounting positions Pm1 and Pm2 from the upstream side in the substrate conveyance direction X Component mounting on the substrate B7 is selectively distributed, and component mounting on a plurality of mounting target points Bp of the substrate B7 is executed at the first to second mounting positions Pm1 and Pm2. Therefore, even if component mounting is being performed at the mounting position Pm3 downstream of the second in the substrate transfer direction X, the first to second mounting positions Pm1 and Pm2 are operated, and the transfer order N is 7 Component mounting can be efficiently performed on the board B7 of Further, with regard to the substrate B8 in the transport order 8, among the three mounting positions Pm1, Pm2 and Pm3, the component mounting on the substrate B8 is selectively distributed to the first mounting position Pm1 counting from the upstream side in the substrate transport direction X. Thus, component mounting to a plurality of mounting target points Bp of the substrate B8 is performed at the first mounting position Pm1. Therefore, even while component mounting is being performed at the mounting positions Pm2 and Pm3 downstream of the first in the substrate conveyance direction X, the first mounting position Pm1 is operated, and the substrate B8 having the eighth conveyance order N is Component mounting can be performed efficiently. As a result, it is possible to more effectively suppress the decrease in the operation rate of the component mounting system.
　また、終期実装モードでは、搬送順序７の基板Ｂ７に関して、基板搬送方向Ｘの上流側から数えて２番目の実装位置Ｐｍ２には、通常実装モードで基板搬送方向Ｘの上流側から数えて２番目から３番目までの実装位置Ｐｍ２、Ｐｍ３に分配される部品実装が分配される。かかる構成では、仮に搬送順序７の基板Ｂ７に対して通常実装モードを実行した場合に、基板搬送方向Ｘの上流側から数えて２番目から３番目までの実装位置Ｐｍ２、Ｐｍ３に分配される部品実装が、終期実装モードにおいて２番目の実装位置Ｐｍ２に分配される。つまり、終期実装モードでは、搬送順序７の基板Ｂ７に関して、２番目の実装位置Ｐｍ２より下流側の実装位置Ｐｍ３での部品実装が省略されるものの、この部品実装を２番目の実装位置Ｐｍ２で確実に実行することが可能となっている。 In the final mounting mode, the second mounting position Pm2 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B7 in the conveyance order 7 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode The component mounting distributed to the third to third mounting positions Pm2 and Pm3 is distributed. In this configuration, if the normal mounting mode is executed for the substrate B7 in the conveyance order 7, the components distributed to the second to third mounting positions Pm2 and Pm3 from the upstream side in the substrate conveyance direction X The implementation is distributed to the second implementation position Pm2 in the final implementation mode. That is, in the final mounting mode, with regard to the substrate B7 having the conveyance order 7, component mounting at the mounting position Pm3 downstream from the second mounting position Pm2 is omitted, but this component mounting is assured at the second mounting position Pm2 It is possible to carry out.
　また、終期実装モードでは、搬送順序８の基板Ｂ８に関して、基板搬送方向Ｘの上流側から数えて１番目の実装位置Ｐｍ１には、通常実装モードで基板搬送方向Ｘの上流側から数えて１番目から３番目までの実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に分配される部品実装が分配される。かかる構成では、仮に搬送順序８の基板Ｂ８に対して通常実装モードを実行した場合に、基板搬送方向Ｘの上流側から数えて１番目から３番目までの実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に分配される部品実装が、終期実装モードにおいて１番目の実装位置Ｐｍ１に分配される。つまり、終期実装モードでは、搬送順序８の基板Ｂ８に関して、１番目の実装位置Ｐｍ１より下流側の実装位置Ｐｍ２、Ｐｍ３での部品実装が省略されるものの、この部品実装を１番目の実装位置Ｐｍ１で確実に実行することが可能となっている。 In the final mounting mode, the first mounting position Pm1 counted from the upstream side in the substrate conveyance direction X with respect to the substrate B8 in the conveyance order 8 is counted from the upstream side in the substrate conveyance direction X in the normal mounting mode The component mounting distributed to the third to third mounting positions Pm1, Pm2, and Pm3 is distributed. In this configuration, if the normal mounting mode is executed for the substrate B8 in the transport order 8, it is distributed to the first to third mounting positions Pm1, Pm2, and Pm3 counted from the upstream side in the substrate transport direction X. Component mounting is distributed to the first mounting position Pm1 in the final mounting mode. That is, in the final mounting mode, with regard to the substrate B8 in the conveyance order 8, although the component mounting at the mounting positions Pm2 and Pm3 downstream of the first mounting position Pm1 is omitted, this component mounting is the first mounting position Pm1 It is possible to execute with
　ところで、上述の第１例あるいは第２例の実行中に、いずれかの実装位置Ｐｍでの部品実装の進捗が予定より遅れる場合がある。そこで、次に示すように、かかる進捗の遅れをリカバリーするように構成しても良い。 By the way, during the execution of the first example or the second example described above, the progress of component mounting at any mounting position Pm may be delayed from a schedule. Therefore, as shown below, it may be configured to recover such a delay in progress.
　図７は部品実装の進捗のリカバリーを実行可能な部品実装処理の一例を示すフローチャートであり、図８は図７に示す部品実装処理でのリカバリー要否判定の一例を示すフローチャートであり、図９は図７および図８のフローチャートに従って実行される動作の一例を模式的に示す図である。図９に示すように、ここで示す例では、搬送部２は２個の実装位置Ｐｍ１、Ｐｍ２が設けられている。 FIG. 7 is a flowchart showing an example of component mounting processing capable of executing recovery of the progress of component mounting, and FIG. 8 is a flowchart showing an example of recovery necessity determination in the component mounting processing shown in FIG. 8 schematically shows an example of an operation performed according to the flowcharts of FIG. 7 and FIG. As shown in FIG. 9, in the example shown here, the transport unit 2 is provided with two mounting positions Pm1 and Pm2.
　制御部１００は、実装位置Ｐｍ１、Ｐｍ２のそれぞれについて図７および図８のフローチャートを実行することで、図９および図１０の動作を実行する。つまり、図７に示すように、部品実装処理が開始すると、上述の第１例と同様にして、実装位置Ｐｍに基板Ｂが搬入され（ステップＳ３０１）、実装位置Ｐｍに部品実装が分配される（ステップＳ３０２）。そして、いずれかの実装位置Ｐｍで部品実装が完了すると（ステップＳ３０３）、各実装位置Ｐｍについてリカバリー要否判定が実行される（ステップＳ３０４、図８）。 The control unit 100 executes the operations of FIGS. 9 and 10 by executing the flowcharts of FIGS. 7 and 8 for each of the mounting positions Pm1 and Pm2. That is, as shown in FIG. 7, when the component mounting process is started, the substrate B is carried to the mounting position Pm (step S301) and the component mounting is distributed to the mounting position Pm as in the first example described above. (Step S302). Then, when component mounting is completed at any mounting position Pm (step S303), recovery necessity determination is performed for each mounting position Pm (step S304, FIG. 8).
　図９に示す例では、動作Ａ１０３までは、上記の第１例と同様に実行されている。つまり、実装位置Ｐｍ２には、実装位置Ｐｍ１への通常分配点（上流側半分）へ部品Ｗｐが実装された基板Ｂ１が搬入され、待機位置Ｐｗでは、実装位置Ｐｍ１への通常分配点（上流側半分）へ部品Ｗｐが実装された基板Ｂ２が待機し、実装位置Ｐｍ１には、基板Ｂ３が搬入されている。また、実装位置Ｐｍ２では、基板Ｂ１の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点（下流側半分）への部品実装が分配され、実装位置Ｐｍ１では、基板Ｂ３の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点（上流側半分）への部品実装が分配される。 In the example shown in FIG. 9, the operations up to the operation A103 are performed in the same manner as the first example described above. That is, the board B1 on which the component Wp is mounted is carried to the mounting position Pm2 at the normal distribution point (upstream half) to the mounting position Pm1, and at the standby position Pw, the normal distribution point to the mounting position Pm1 (upstream The substrate B2 on which the component Wp is mounted is on standby, and the substrate B3 is carried to the mounting position Pm1. Further, at the mounting position Pm2, component mounting to the normal distribution point (downstream half) to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B1 is distributed, and at the mounting position Pm1, a plurality of mountings of the substrate B3 Component mounting to the normal distribution point (upstream half) of the target point Bp to the mounting position Pm1 is distributed.
　この状態から、実装位置Ｐｍ１、Ｐｍ２での部品実装を開始した結果が、図９の動作Ａ１１１の欄に示される。実装位置Ｐｍ２では、基板Ｂ１への部品実装が完了している。したがって、この部品実装の完了時点で、ステップＳ３０４（図８）のリカバリー要否判定が実装位置Ｐｍ１、Ｐｍ２のそれぞれについて実行される。 The result of starting component mounting at the mounting positions Pm1 and Pm2 from this state is shown in the column of operation A111 in FIG. At the mounting position Pm2, component mounting on the substrate B1 is completed. Therefore, when the component mounting is completed, the recovery necessity / non-necessity determination in step S304 (FIG. 8) is executed for each of the mounting positions Pm1 and Pm2.
　具体的には、実装位置Ｐｍ２について、実装位置Ｐｍ２の下流に基板Ｂが存在するかが判断される（ステップＳ４０１）。実装位置Ｐｍ２の下流に基板Ｂは存在しないため（ステップＳ４０１で「ＮＯ」）、ステップＳ４０２で、実装位置Ｐｍ２の部品実装の進捗に遅れがあるかが判断される。進捗に遅れはないため（ステップＳ４０２で「ＮＯ」）、ステップＳ４０４でリカバリー不要と判断され、図７フローチャートに戻る。 Specifically, for the mounting position Pm2, it is determined whether or not the substrate B is present downstream of the mounting position Pm2 (step S401). Since the substrate B does not exist downstream of the mounting position Pm2 ("NO" in step S401), it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm2. Since the progress is not delayed ("NO" in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG.
　つまり、図７のステップＳ３０４では「不要」に分岐して、各実装位置Ｐｍ２について、実装完了時判断処理（図３）が実行される（ステップＳ３０６）。その結果、動作Ａ１１２の欄に示すように、基板Ｂ１が実装位置Ｐｍ２から搬出されるとともに、基板Ｂ２が待機位置Ｐｗから実装位置Ｐｍ２に搬入される。また、実装位置Ｐｍ２には、基板Ｂ２の複数の実装対象点Ｂｐのうち実装位置Ｐｍ２への通常分配点への部品実装が分配される。 That is, in step S304 of FIG. 7, the process branches to “unnecessary”, and the mounting completion determination process (FIG. 3) is executed for each mounting position Pm2 (step S306). As a result, as shown in the column of the operation A112, the substrate B1 is unloaded from the mounting position Pm2, and the substrate B2 is loaded from the standby position Pw to the mounting position Pm2. Further, component mounting to the normal distribution point to the mounting position Pm2 among the plurality of mounting target points Bp of the substrate B2 is distributed to the mounting position Pm2.
　さらに、実装位置Ｐｍ１について、実装位置Ｐｍ１の下流に基板Ｂが存在するかが判断される（ステップＳ４０１）。待機位置Ｐｗの基板Ｂ２は、基板Ｂ１の搬出とともに実装位置Ｐｍ２に搬送されるため（ステップＳ４０１で「ＮＯ」）、ステップＳ４０２で、実装位置Ｐｍ１の部品実装の進捗に遅れがあるかが判断される。実装位置Ｐｍ１では、基板Ｂ３での部品実装の進捗に遅れがあるため（ステップＳ４０２で「ＹＥＳ」）、ステップＳ４０３で、残りの実装点数が閾値（例えば、通常分配点の数の半分）以上かが判断される。残りの実装点数が閾値未満である場合（ステップＳ４０３で「ＮＯ」の場合）には、ステップＳ４０４でリカバリー不要と判断される。一方、ここの例のように、残りの実装点数が閾値以上である場合（ステップＳ４０３で「ＹＥＳ」の場合）には、ステップＳ４０５でリカバリーが必要と判断され、図７のフローチャートに戻る。 Further, with regard to the mounting position Pm1, it is determined whether or not the substrate B exists downstream of the mounting position Pm1 (step S401). The board B2 at the standby position Pw is transported to the mounting position Pm2 along with unloading of the board B1 (“NO” in step S401), so it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm1. Ru. At the mounting position Pm1, there is a delay in the progress of component mounting on the substrate B3 (“YES” in step S402). Therefore, in step S403, whether the remaining mounting points are at least a threshold (for example, half the number of normal distribution points) Is judged. If the remaining mounting score is less than the threshold (in the case of "NO" in step S403), it is determined in step S404 that recovery is unnecessary. On the other hand, as in this example, if the remaining mounting score is equal to or greater than the threshold (in the case of “YES” in step S403), it is determined in step S405 that recovery is necessary, and the process returns to the flowchart of FIG.
　つまり、図７のステップＳ３０４では、「必要」に分岐して、部品実装が再分配される（ステップＳ３０５）。具体的には、実装位置Ｐｍ１に停止する基板Ｂ３について、実装位置Ｐｍ１の通常分配点の一部（ここでは、半分）が実装位置Ｐｍ１から実装位置Ｐｍ２へ移される。そして、実装位置Ｐｍ１について、実装完了時判断処理（図３）が実行される（ステップＳ３０６）。その結果、動作Ａ１１２の欄に示すように、基板Ｂ３は実装位置Ｐｍ１に留まる。また、実装位置Ｐｍ１では、基板Ｂ３の複数の実装対象点Ｂｐのうち実装位置Ｐｍ１への通常分配点の半分への部品実装が分配されて、ステップＳ３０６からステップＳ３０３に戻る。 That is, in step S304 of FIG. 7, the process branches to "necessary", and component mounting is redistributed (step S305). Specifically, for the substrate B3 stopped at the mounting position Pm1, part (here, half) of the normal distribution point of the mounting position Pm1 is moved from the mounting position Pm1 to the mounting position Pm2. Then, the mounting completion determination process (FIG. 3) is executed for the mounting position Pm1 (step S306). As a result, as shown in the column of operation A112, the substrate B3 remains at the mounting position Pm1. Further, at the mounting position Pm1, the component mounting to the half of the normal distribution point to the mounting position Pm1 is distributed among the plurality of mounting target points Bp of the substrate B3, and the process returns from step S306 to step S303.
　図９の動作Ａ１１３の欄に示すように、実装位置Ｐｍ１で分配された部品実装が基板Ｂ３に対して完了すると（ステップＳ３０３）、リカバリー要否判定が各実装位置Ｐｍ１、Ｐｍ２について実行される。実装位置Ｐｍ１、Ｐｍ２のいずれにおいても、部品実装の進捗に遅れはないため（ステップＳ４０２で「ＮＯ」）、ステップＳ４０４でリカバリー不要と判断され、図７のフローチャートに戻る。そして、実装位置Ｐｍ１、Ｐｍ２のそれぞれについて、ステップＳ３０４で「不要」に分岐して、ステップＳ３０６で「実装完了時判断処理」が実行される。その結果、図９の動作Ａ１１４の欄に示すように、基板Ｂ３が待機位置Ｐｗに搬出され、基板Ｂ４が実装位置Ｐｍ１に搬入される。また、実装位置Ｐｍ１では、基板Ｂ４の複数の部品Ｗｐのうち、実装位置Ｐｍ１への通常分配点への部品実装が分配される。 As shown in the column of operation A113 in FIG. 9, when the component mounting distributed at the mounting position Pm1 is completed on the substrate B3 (step S303), recovery necessity determination is performed for each mounting position Pm1 and Pm2. Since there is no delay in the progress of component mounting at any of the mounting positions Pm1 and Pm2 (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG. Then, for each of the mounting positions Pm1 and Pm2, the process branches to “unnecessary” in step S304, and “mounting completion determination processing” is executed in step S306. As a result, as shown in the column of operation A114 in FIG. 9, the substrate B3 is carried out to the standby position Pw, and the substrate B4 is carried in to the mounting position Pm1. Further, at the mounting position Pm1, among the plurality of components Wp of the substrate B4, component mounting to the normal distribution point at the mounting position Pm1 is distributed.
　図９の動作Ａ１１５の欄に示すように、実装位置Ｐｍ２で分配された部品実装が基板Ｂ２に対して完了すると（ステップＳ３０３）、リカバリー要否判定が各実装位置Ｐｍ１、Ｐｍ２について実行される。実装位置Ｐｍ１、Ｐｍ２のいずれにおいても、部品実装の進捗に遅れはないため（ステップＳ４０２で「ＮＯ」）、ステップＳ４０４でリカバリー不要と判断され、図７のフローチャートに戻る。そして、実装位置Ｐｍ１、Ｐｍ２のそれぞれについて、ステップＳ３０４で「不要」に分岐して、ステップＳ３０６で「実装完了時判断処理」が実行される。その結果、図９の動作Ａ１１６の欄に示すように、基板Ｂ３が実装位置Ｐｍ２に搬入される。また、実装位置Ｐｍ２では、基板Ｂ３の複数の実装対象点Ｂｐのうち、実装位置Ｐｍ２への通常分配点と、先のステップＳ３０５で写された、実装位置Ｐｍ１への通常分配点の半分の分配点とが分配される。したがって、図９の動作Ａ１１７の欄に示すように、実装位置Ｐｍ２では、実装位置Ｐｍ１への通常分配点の半分の分配点に対して部品Ｗｐ（ハッチングが施された部品Ｗｐ）が、基板Ｂ３に対して実装される。 As shown in the column of operation A115 of FIG. 9, when the component mounting distributed at the mounting position Pm2 is completed on the substrate B2 (step S303), recovery necessity determination is performed for each mounting position Pm1 and Pm2. Since there is no delay in the progress of component mounting at any of the mounting positions Pm1 and Pm2 (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG. Then, for each of the mounting positions Pm1 and Pm2, the process branches to “unnecessary” in step S304, and “mounting completion determination processing” is executed in step S306. As a result, as shown in the column of operation A116 in FIG. 9, the substrate B3 is carried into the mounting position Pm2. Further, at the mounting position Pm2, among the plurality of mounting target points Bp of the substrate B3, distribution of the normal distribution point to the mounting position Pm2 and distribution of half of the normal distribution points to the mounting position Pm1 copied in the previous step S305. Points are distributed. Therefore, as shown in the column of operation A117 in FIG. 9, at the mounting position Pm2, the component Wp (the hatched component Wp) with respect to the distribution point of half of the normal distribution point to the mounting position Pm1 is the substrate B3. Will be implemented for
　このように、制御部１００は、Ｍ個の実装位置Ｐｍ１、Ｐｍ２のうち、一の実装位置Ｐｍ１および他の実装位置Ｐｍ２の少なくとも一方の実装位置Ｐｍ１での部品実装の進捗に応じて、一の実装位置Ｐｍ１と他の実装位置Ｐｍ２との間での部品実装の分配を調整する。かかる構成では、一の実装位置Ｐｍ１での部品実装の進捗が例えば予定より遅い場合に、一の実装位置Ｐｍ１に分配予定であった部品実装を他の実装位置Ｐｍ２に分配するといったことができる。これによって、各実装位置Ｐｍ１、Ｐｍ２での部品実装の進捗のバランスを取ることが可能となっている。 Thus, control unit 100 selects one of M mounting positions Pm 1 and Pm 2 according to the progress of component mounting at one mounting position Pm 1 and at least one other mounting position Pm 2 of mounting positions Pm 1 and Pm 2. The distribution of component mounting between the mounting position Pm1 and the other mounting position Pm2 is adjusted. In such a configuration, when the progress of component mounting at one mounting position Pm1 is later than scheduled, for example, the component mounting that is scheduled to be distributed to one mounting position Pm1 can be distributed to another mounting position Pm2. This makes it possible to balance the progress of component mounting at each of the mounting positions Pm1 and Pm2.
　このように本実施形態では、部品実装システム１が本発明の「部品実装システム」の一例に相当し、搬送部２が本発明の「搬送部」の一例に相当し、実装部４、４Ａ、４Ｂが本発明の「実装部」の一例に相当し、制御部１００が本発明の「制御部」の一例に相当し、実装位置Ｐｍ１、Ｐｍ２、Ｐｍ３に配置された実装コンベア２２、２４、２７が本発明の「実装ステージ」の一例に相当し、待機位置Ｐｗ、Ｐｗ１、Ｐｗ２に配置された待機コンベア２３、２６が本発明の「待機ステージ」の一理絵に相当し、基板搬送方向Ｘが本発明の「基板搬送方向」の一例に相当する。 As described above, in the present embodiment, the component mounting system 1 corresponds to an example of the "component mounting system" of the present invention, the transport unit 2 corresponds to an example of the "transport unit" of the present invention, and the mounting units 4, 4A, 4B corresponds to an example of the "mounting unit" of the present invention, and the control unit 100 corresponds to an example of the "control unit" of the present invention, and the mounting conveyors 22, 24, 27 disposed at the mounting positions Pm1, Pm2, Pm3. Corresponds to an example of the "mounting stage" of the present invention, and the standby conveyors 23, 26 disposed at the standby positions Pw, Pw1, and Pw2 correspond to a part of the "waiting stage" of the present invention, and the substrate transfer direction X is This corresponds to an example of the “substrate transfer direction” in the present invention.
　なお、本発明は上記実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて上述したものに対して種々の変更を加えることが可能である。例えば、実装位置Ｐｍの個数Ｍや、基板搬送方向Ｘに順番に搬送する基板Ｂの枚数Ｌを適宜変更することができる。 The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the scope of the invention. For example, the number M of the mounting positions Pm and the number L of the substrates B transported in order in the substrate transport direction X can be changed as appropriate.
　また、図７および図８のフローチャートは、実装位置Ｐｍの個数Ｍが２の場合に限られず、３以上の場合にも適用可能である。 Further, the flowcharts of FIGS. 7 and 8 are not limited to the case where the number M of mounting positions Pm is two, and is applicable to the case where the number M is three or more.
　また、上記の部品実装システム１は、１台の部品実装機１０で構成されていた。しかしながら、例えば、それぞれ単一の実装位置を具備する複数の部品実装機１０を搬送方向Ｘに並べて部品実装システム１を構成しても良い。かかる構成では、搬送部２は、複数の部品実装機１０に順に基板Ｂを搬送しつつ、各部品実装機１０での実装位置Ｐｍに当該基板Ｂを停止・固定し、各部品実装機１０は、その実装位置Ｐｍに固定された基板Ｂに部品Ｗｐを実装する。 Further, the component mounting system 1 described above is configured of one component mounting machine 10. However, for example, the component mounting system 1 may be configured by arranging a plurality of component mounters 10 each having a single mounting position in the transport direction X. In this configuration, the transport unit 2 transports the substrate B sequentially to the plurality of component mounters 10 while stopping / fixing the substrate B at the mounting position Pm in each component mounter 10, and each component mounter 10 And mount the component Wp on the substrate B fixed at the mounting position Pm.
　１…部品実装システム
　２…搬送部
　２２、２４、２７…実装コンベア
　２３、２６…待機コンベア
　４、４Ａ、４Ｂ…実装部
　１００…制御部
　Ｐｍ１、Ｐｍ２、Ｐｍ３…実装位置
　Ｐｗ、Ｐｗ１、Ｐｗ２…待機位置
　Ｘ…基板搬送方向
  DESCRIPTION OF SYMBOLS 1 ... Component mounting system 2 ... Conveying part 22, 24, 27 ... Mounting conveyor 23, 26 ... Waiting conveyor 4, 4A, 4B ... Mounting part 100 ... Control part Pm1, Pm2, Pm3 ... Mounting position Pw, Pw1, Pw2 ... Standby Position X ... direction of substrate transport

Claims (7)

  1. 　基板搬送方向に並ぶＭ個（Ｍは２以上の整数）の実装ステージを有し、Ｌ枚（ＬはＭより大きい整数）の基板を順番に前記基板搬送方向に搬送する搬送部と、
    　前記Ｍ個の実装ステージに対応して設けられて、それぞれ対応する前記実装ステージに停止する基板に同一種類の部品を実装可能なＭ個の実装部と、
    　一の基板に設けられた複数の実装対象点に対する部品実装を前記Ｍ個の実装ステージの間で分配し、当該一の基板を前記搬送部によって前記基板搬送方向に搬送しつつ前記Ｍ個の実装ステージのうち部品実装を分配した前記実装ステージに停止させて、前記実装部に対応する前記実装ステージで停止する当該一の基板に対して対応する前記実装ステージに分配された部品実装を実行させる制御部と
    を備え、
    　前記実装ステージは、分配された部品実装が完了した基板を前記基板搬送方向の下流側に搬送し、
    　前記制御部は、前記Ｌ枚の基板のうち前記基板搬送方向への搬送順序Ｎ（Ｎは１以上の整数）がＭ未満の基板に対しては初期実装モードで部品実装を実行し、前記搬送順序ＮがＭ以上の基板に対しては通常実装モードで部品実装を実行し、
    　前記初期実装モードでは、前記搬送順序Ｎの基板に関して、前記Ｍ個の実装ステージのうち前記基板搬送方向の上流側から数えて（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージに基板への部品実装が選択的に分配され、基板は前記（Ｍ－Ｎ）番目までの実装ステージを通過して、前記（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージで基板の前記複数の実装対象点への部品実装が実行され、
    　前記通常実装モードでは、前記Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、基板は前記Ｍ個の実装ステージに順番に停止して、前記Ｍ個の実装ステージのそれぞれで順番に基板の前記複数の実装対象点への部品実装が実行される部品実装システム。     A transport unit that has M (M is an integer of 2 or more) mounting stages arranged in the substrate transport direction and transports L sheets (L is an integer greater than M) substrates in the substrate transport direction in order;
    M mounting units provided corresponding to the M mounting stages and capable of mounting the same kind of component on a substrate stopped at the corresponding mounting stages;
    Component mounting for a plurality of mounting target points provided on one substrate is distributed among the M mounting stages, and the one substrate is transported by the transport unit in the substrate transport direction while the M mounts Control for causing the mounting stage to which component mounting is distributed among the stages to be stopped, and to execute the component mounting distributed to the mounting stage corresponding to the one substrate stopped at the mounting stage corresponding to the mounting unit Equipped with
    The mounting stage conveys the distributed component mounting completed substrate to the downstream side of the substrate conveyance direction.
    The control unit executes component mounting in an initial mounting mode on a substrate having a transport order N (N is an integer of 1 or more) in the substrate transport direction of the L sheets of substrates less than M, and the transport is performed Execute component mounting in the normal mounting mode for substrates with order N equal to or greater than M,
    In the initial mounting mode, the substrate in the transport order N is a substrate mounted on the mounting stage downstream of the (M−N) th mounting stage counted from the upstream side of the substrate transport direction among the M mounting stages. Component mounting on the substrate is selectively distributed, and the substrate passes through the (M−N) th mounting stage, and the mounting stage of the substrate at the mounting stage downstream of the (M−N) th mounting stage Component mounting to multiple mounting points is performed.
    In the normal mounting mode, component mounting on a substrate is distributed to each of the M mounting stages, and the substrate is sequentially stopped at the M mounting stages, and sequentially in each of the M mounting stages. A component mounting system in which component mounting to a plurality of mounting target points of a substrate is performed.
  2. 　前記搬送部は、前記基板搬送方向に隣り合う実装ステージの間に配置された待機ステージをさらに有し、
    　前記基板搬送方向において、前記Ｍ個の実装ステージのうち、最下流の実装ステージ以外の実装ステージは、下流側で隣り合う実装ステージで部品実装が実行する場合には、分配された部品実装が完了した基板を下流側の待機ステージに搬出して、分配された前記実装対象点への部品実装が未完の基板を前記基板搬送方向の上流側から搬入する請求項１に記載の部品実装システム。     The transport unit further includes a standby stage disposed between mounting stages adjacent in the substrate transport direction,
    Of the M mounting stages in the substrate transport direction, the mounting stages other than the most downstream mounting stage have completed distributed component mounting when component mounting is performed at the adjacent mounting stages on the downstream side The component mounting system according to claim 1, wherein the substrate is carried out to a standby stage on the downstream side, and the substrate for which component mounting to the distributed mounting target point is incomplete is carried in from the upstream side in the substrate conveyance direction.
  3. 　前記通常実装モードでは、前記実装ステージのそれぞれで部品が実装される前記実装対象点の個数の差が１個以下となるように、前記Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、
    　前記初期実装モードでは、前記搬送順序Ｎの基板に関して、前記基板搬送方向の上流側から数えて（Ｍ－Ｎ＋１）番目の実装ステージには、前記通常実装モードで前記基板搬送方向の上流側から数えて１番目から（Ｍ－Ｎ＋１）番目までの実装ステージに分配される部品実装が分配される請求項１または２に記載の部品実装システム。     In the normal mounting mode, component mounting on a substrate is distributed to each of the M mounting stages such that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is one or less. And
    In the initial mounting mode, the (M−N + 1) th mounting stage counted from the upstream side of the substrate conveyance direction with respect to the substrate in the conveyance order N is counted from the upstream side of the substrate conveyance direction in the normal mounting mode. 3. The component mounting system according to claim 1, wherein component mounting to be distributed to the first to (M−N + 1) th mounting stages is distributed.
  4. 　前記制御部は、前記Ｌ枚の基板のうち前記搬送順序Ｎが（Ｌ－Ｍ＋２）番以上の基板に対しては終期実装モードで部品実装を実行し、
    　前記終期実装モードでは、前記搬送順序Ｎの基板に関して、前記Ｍ個の実装ステージのうち前記基板搬送方向の上流側から数えて１番目から（Ｌ－Ｎ＋１）番目までの実装ステージに基板への部品実装が選択的に分配され、前記１番目から前記（Ｌ－Ｎ＋１）番目までの実装ステージで基板の前記複数の実装対象点への部品実装が実行される請求項１ないし３のいずれか一項に記載の部品実装システム。     The control unit executes component mounting in the final mounting mode on the L sheets of substrates of which the transport order N is (L−M + 2) or more among the L substrates,
    In the final mounting mode, with respect to the substrate in the transport order N, parts of the M mounting stages from the upstream side in the substrate transport direction to the first to (L−N + 1) th mounting stages are components to the substrate The mounting is selectively distributed, and component mounting on the plurality of mounting target points of the substrate is performed in the first to the (L−N + 1) th mounting stages. Component mounting system described in.
  5. 　前記通常実装モードでは、前記実装ステージのそれぞれで部品が実装される前記実装対象点の個数の差が１個以下となるように、前記Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、
    　前記終期実装モードでは、前記搬送順序Ｎの基板に関して、前記基板搬送方向の上流側から数えて（Ｌ－Ｎ＋１）番目の実装ステージには、前記通常実装モードで前記基板搬送方向の上流側から数えて（Ｌ－Ｎ＋１）番目からＭ番目までの実装ステージに分配される部品実装が分配される請求項４に記載の部品実装システム。     In the normal mounting mode, component mounting on a substrate is distributed to each of the M mounting stages such that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is one or less. And
    In the final mounting mode, the (L−N + 1) th mounting stage counted from the upstream side of the substrate conveyance direction with respect to the substrate in the conveyance order N is counted from the upstream side of the substrate conveyance direction in the normal mounting mode. 5. The component mounting system according to claim 4, wherein component mounting to be distributed to (L−N + 1) th to Mth mounting stages is distributed.
  6. 　前記制御部は、前記Ｍ個の実装ステージのうち、一の実装ステージおよび他の実装ステージの少なくとも一方での部品実装の進捗に応じて、一の実装ステージと他の実装ステージとの間での部品実装の分配を調整する請求項１ないし５のいずれか一項に記載の部品実装システム。 The control unit is configured to, between the one mounting stage and the other mounting stage, according to the progress of component mounting in at least one of the one mounting stage and the other mounting stage among the M mounting stages. The component mounting system according to any one of claims 1 to 5, wherein distribution of component mounting is adjusted.
  7. 　基板搬送方向に並ぶＭ個（Ｍは２以上の整数）の実装ステージを有する搬送部によって、Ｌ枚（ＬはＭより大きい整数）の基板を順番に前記基板搬送方向に搬送する工程と、
    　一の基板に設けられた複数の実装対象点に対する部品実装を前記Ｍ個の実装ステージの間で分配し、当該一の基板を前記搬送部によって前記基板搬送方向に搬送しつつ前記Ｍ個の実装ステージのうち部品実装を分配した前記実装ステージに停止させて、前記実装ステージで停止する当該一の基板に対して前記実装ステージに分配された部品実装を実行する工程と
    を備え、
    　前記Ｌ枚の基板のうち前記基板搬送方向への搬送順序Ｎ（Ｎは１以上の整数）がＭ未満の基板に対しては初期実装モードで部品実装を実行し、前記搬送順序ＮがＭ以上の基板に対しては通常実装モードで部品実装を実行し、
    　前記初期実装モードでは、前記搬送順序Ｎの基板に関して、前記Ｍ個の実装ステージのうち前記基板搬送方向の上流側から数えて（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージに基板への部品実装が選択的に分配され、基板は前記（Ｍ－Ｎ）番目までの実装ステージを通過して、前記（Ｍ－Ｎ）番目の実装ステージよりも下流側の実装ステージで基板の前記複数の実装対象点への部品実装が実行され、
    　前記通常実装モードでは、前記Ｍ個の実装ステージのそれぞれに基板への部品実装が分配され、基板は前記Ｍ個の実装ステージに順番に停止して、前記Ｍ個の実装ステージのそれぞれで順番に基板の前記複数の実装対象点への部品実装が実行される部品実装方法。
          Transporting L substrates (L is an integer larger than M) in order in the substrate transport direction by the transport unit having M (M is an integer of 2 or more) mounting stages arranged in the substrate transport direction;
    Component mounting for a plurality of mounting target points provided on one substrate is distributed among the M mounting stages, and the one substrate is transported by the transport unit in the substrate transport direction while the M mounts And stopping the mounting stage to which the component mounting is distributed among the stages, and performing the component mounting distributed to the mounting stage to the one substrate stopped at the mounting stage,
    Component mounting is performed in the initial mounting mode on a substrate having a transport order N (N is an integer of 1 or more) less than M among the L sheets of substrates, and the transport order N is M or more Perform component mounting in the normal mounting mode for
    In the initial mounting mode, the substrate in the transport order N is a substrate mounted on the mounting stage downstream of the (M−N) th mounting stage counted from the upstream side of the substrate transport direction among the M mounting stages. Component mounting on the substrate is selectively distributed, and the substrate passes through the (M−N) th mounting stage, and the mounting stage of the substrate at the mounting stage downstream of the (M−N) th mounting stage Component mounting to multiple mounting points is performed.
    In the normal mounting mode, component mounting on a substrate is distributed to each of the M mounting stages, and the substrate is sequentially stopped at the M mounting stages, and sequentially in each of the M mounting stages. A component mounting method in which component mounting to the plurality of mounting target points of a substrate is performed.
PCT/JP2017/045053 2017-12-15 2017-12-15 Component mounting system and component mounting method WO2019116530A1 (en)

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