JPWO2019116530A1 - Component mounting system, component mounting method - Google Patents

Abstract

For the two boards having the first transfer order among the four boards, component mounting is executed as follows. That is, the first board B1 is transported to the second mounting position Pm2 counted from the upstream side of the board transport direction X by the initial mounting mode, and the second board B2 is transported to the board transport direction X by the normal mounting mode. It is transported to the first mounting position Pm1 counting from the upstream side of. In this way, the boards B2 and B1 can be conveyed to the two mounting positions Pm1 and Pm2, respectively, and component mounting on the boards B2 and B1 can be started at the mounting positions Pm1 and Pm2, respectively. This makes it possible to suppress a decrease in the operating rate of the component mounting system 1.

Description

The present invention relates to a technique for mounting a component on a substrate at a plurality of mounting stages arranged in the substrate transport direction while transporting the substrate in the substrate transport direction.

Conventionally, a component mounting system having a plurality of mounting portions arranged in the transport direction of a substrate has been known. Further, as shown in Patent Document 1, in such a component mounting system, mounting of components on one substrate can be shared by a plurality of mounting units. That is, the substrate is sequentially stopped at a plurality of mounting portions while being conveyed in the transport direction, and each mounting portion mounts the component in charge of the stopped board. As a result, the efficiency of component mounting can be improved.

Japanese Unexamined Patent Publication No. 2017-37902

However, in some situations, such an approach may not always be efficient. That is, the board first carried into the component mounting system stops at the most upstream mounting stage (mounting unit) in the transport direction, and receives the component mounting at this mounting stage. During this period, the mounting stage on the downstream side in the transport direction from the most upstream mounting portion does not operate, so that the operating rate of the component mounting system is lower than when the mounting stage on the downstream side operates. Then, such a decrease in the operating rate becomes particularly remarkable when the number of substrates transported by the component mounting system is small.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of suppressing a decrease in the operating rate of a component mounting system in a component mounting system in which a plurality of mounting stages are arranged in a substrate transport direction.

The component mounting system according to the present invention has M mounting stages (M is an integer of 2 or more) arranged in the substrate conveying direction, and L substrates (L is an integer larger than M) are sequentially arranged in the substrate conveying direction. It is provided on one board and M mounting parts that are provided corresponding to M mounting stages and can mount the same type of parts on the boards that stop at the corresponding mounting stages. A mounting stage in which component mounting for a plurality of mounting target points is distributed among M mounting stages, and the component mounting is distributed among the M mounting stages while the one board is transported in the board transport direction by a transport unit. The mounting stage is provided with a control unit that executes component mounting distributed to the corresponding mounting stage for the one board that is stopped at the mounting stage corresponding to the mounting section. The completed substrate is transported to the downstream side in the substrate transport direction, and the control unit performs the transport order N (N is an integer of 1 or more) of the L substrates in the substrate transport direction less than M. In the initial mounting mode, component mounting is executed, and for boards with a transfer order N of M or more, component mounting is executed in the normal mounting mode. In the initial mounting mode, for boards with a transfer order N, M mounting stages Of these, component mounting on the board is selectively distributed to the mounting stage on the downstream side of the (MN) th mounting stage counting from the upstream side in the board transport direction, and the board is mounted up to the (MN) th. After passing through the stage, component mounting is executed at multiple mounting target points on the board at the mounting stage downstream of the (MN) th mounting stage. In normal mounting mode, each of the M mounting stages The component mounting on the board is distributed to the board, the board is stopped in order at the M mounting stages, and the components are sequentially mounted on the plurality of mounting target points of the board at each of the M mounting stages.

In the component mounting method according to the present invention, L substrates (L is an integer larger than M) are sequentially transported by a transport unit having M mounting stages (M is an integer of 2 or more) arranged in the substrate transport direction. The process of transporting in the direction and the component mounting for a plurality of mounting target points provided on one substrate are distributed among M mounting stages, and the one substrate is transported in the substrate transport direction by the transport unit. Of the individual mounting stages, the component mounting is stopped at the distributed mounting stage, and the component mounting distributed to the mounting stage is executed for the one board stopped at the mounting stage. Of these, components are mounted in the initial mounting mode for boards whose transport order N (N is an integer of 1 or more) less than M in the board transport direction, and usually for boards with a transport order N of M or more. In the initial mounting mode, component mounting is performed in the mounting mode, and in the initial mounting mode, with respect to the boards in the transport order N, the side downstream of the (MN) th mounting stage counted from the upstream side in the board transport direction among the M mounting stages. The component mounting on the board is selectively distributed to the mounting stages of, and the board passes through the (MN) th mounting stage and at the mounting stage downstream from the (MN) th mounting stage. Component mounting is executed at multiple mounting target points on the board, and in normal mounting mode, component mounting on the board is distributed to each of the M mounting stages, and the board stops in order at the M mounting stages. , Parts are sequentially mounted on a plurality of mounting target points on the board in each of the M mounting stages.

In the present invention (component mounting system, component mounting method) configured in this way, component mounting for a plurality of mounting target points provided on one board is distributed among M mounting stages. Then, while transporting the one board in the board transport direction, it is stopped at the mounting stage in which component mounting is distributed among the M mounting stages, and is distributed to the mounting stage with respect to the one board stopped at the mounting stage. The component mounting is executed. At this time, component mounting is executed in the initial mounting mode on the L boards whose transport order N in the substrate transport direction is less than M, and normally mounted on the boards whose transport order N is M or more. Component mounting is executed in the mode. In the initial mounting mode, with respect to the board of the transport order N, the components are mounted on the board on the mounting stage on the downstream side of the (MN) th mounting stage from the upstream side in the board transport direction among the M mounting stages. Is selectively distributed, and the board passes through the mounting stages up to the (MN) th mounting stage, and reaches multiple mounting target points of the board at the mounting stage downstream from the (MN) th mounting stage. Component mounting is performed. On the other hand, in the normal mounting mode, component mounting on the board is distributed to each of the M mounting stages, the boards are stopped in order at the M mounting stages, and the boards are sequentially stopped at each of the M mounting stages. Parts are mounted at multiple mounting target points.

Therefore, for the M-boards having the first transfer order among the L-boards, component mounting is performed as follows. That is, the first to (M-1) th boards are transported to the Mth to second mounting stages counted from the upstream side in the board transport direction by the initial mounting mode, and the Mth board is transported to the normal mounting mode. Is transported to the first mounting stage counting from the upstream side in the substrate transport direction. In this way, the board can be conveyed to each of the M mounting stages, and component mounting on the board can be started at each mounting stage. This makes it possible to suppress a decrease in the operating rate of the component mounting system.

In the present specification, in the notation of I1 to I2 (I1 and I2 are integers of 1 or more), when I1 and I2 are equal, the notation shall indicate I1.

Further, the transport unit further has a standby stage arranged between the mounting stages adjacent to each other in the board transport direction, and among the M mounting stages, the mounting stages other than the most downstream mounting stage in the board transport direction are , When component mounting is executed on adjacent mounting stages on the downstream side, the board for which the distributed component mounting is completed is carried out to the standby stage on the downstream side, and the component mounting to the distributed mounting target points is incomplete. The component mounting system may be configured so that the board is carried in from the upstream side in the board transport direction. In such a configuration, the mounting stages other than the most downstream mounting stage promptly carry out the distributed board for which component mounting has been completed to the standby stage, and the next board for which component mounting has not been completed is transferred from the upstream side in the board transport direction. Can be carried in. As a result, it is possible to more effectively suppress a decrease in the operating rate of the component mounting system.

Further, in the normal mounting mode, the component mounting on the board is distributed to each of the M mounting stages so that the difference in the number of mounting target points on which the components are mounted in each mounting stage is 1 or less. In the initial mounting mode, with respect to the boards in the transport order N, the (MN + 1) th mounting stage counted from the upstream side in the board transport direction is in the normal mounting mode from the first count from the upstream side in the board transport direction (M-N + 1). The component mounting system may be configured so that the component mountings distributed to the MN + 1) th mounting stages are distributed. In such a configuration, if the normal mounting mode is executed on a board having a transport order N of less than M, the mounting stages are distributed from the first to the (MN + 1) th from the upstream side in the board transport direction. The component mounting is distributed to the (MN + 1) th mounting stage in the initial mounting mode. That is, in the initial mounting mode, with respect to the board of the transport order N, the component mounting at the mounting stage upstream from the (MN + 1) th mounting stage is omitted, but this component mounting is performed at the (MN + 1) th. It is possible to execute it reliably at the implementation stage.

Further, the control unit executes component mounting in the final mounting mode on the boards having the transport order N of (LM + 2) or higher among the L boards, and in the final mounting mode, the boards having the transport order N are mounted. , The component mounting on the board is selectively distributed to the first to (L-N + 1) th mounting stages counted from the upstream side in the board transport direction among the M mounting stages, and the first to (L-N + 1). The component mounting system may be configured so that component mounting is performed at a plurality of mounting target points on the board at the mounting stage up to the th. In such a configuration, for the boards having the transport order N of (LM + 2) or more among the L substrates, the first (L-) of the M mounting stages counting from the upstream side in the substrate transport direction. The component mounting on the board is selectively distributed to the N + 1) th mounting stages, and the component mounting is executed on the plurality of mounting target points of the board in the first to (L−N + 1) th mounting stages. Therefore, in the substrate transport direction, even if component mounting is being executed at the mounting stage on the downstream side of the (L-N + 1) th, the first to (L-N + 1) th mounting stages are operated to carry out the transfer order. Component mounting can be efficiently performed on a board in which N is (LM + 2) or higher. As a result, it is possible to more effectively suppress a decrease in the operating rate of the component mounting system.

Further, in the normal mounting mode, the component mounting on the board is distributed to each of the M mounting stages so that the difference in the number of mounting target points on which the components are mounted in each mounting stage is 1 or less. In the final mounting mode, with respect to the boards in the transfer order N, the (L-N + 1) th mounting stage counted from the upstream side in the board transfer direction is counted from the upstream side in the board transfer direction in the normal mounting mode (L-N + 1). The component mounting system may be configured so that the component mountings distributed to the th to M mounting stages are distributed. In such a configuration, if the normal mounting mode is executed for a board having a transfer order N of (LM + 2) or more, the order from (L-N + 1) to M is counted from the upstream side in the board transfer direction. The component mounting distributed to the mounting stage is distributed to the (L-N + 1) th mounting stage in the final mounting mode. That is, in the final mounting mode, the component mounting at the mounting stage downstream from the (L-N + 1) th mounting stage is omitted for the board of the transport order N, but this component mounting is the (L-N + 1) th. It is possible to execute it reliably at the implementation stage.

Further, in the normal mounting mode, the control unit has one mounting stage and another mounting stage according to the progress of component mounting of at least one of the one mounting stage and the other mounting stage among the M mounting stages. The component mounting system may be configured to coordinate the distribution of component mounting to and from. In such a configuration, when the progress of component mounting in one mounting stage is slower than planned, for example, the component mounting scheduled to be distributed to one mounting stage can be distributed to other mounting stages.

According to the present invention, in a component mounting system in which a plurality of mounting stages are arranged in the substrate transport direction, it is possible to suppress a decrease in the operating rate of the component mounting system.

The plan view which shows typically an example of the component mounting system which concerns on this invention. Is a flowchart showing an example of a carry-in determination process executed when mounting components on a board while transporting the board in the board transport direction. The flowchart which shows an example of the mounting completion judgment process which is executed when the component mounting is executed on the board while carrying in the board transport direction. It is a figure which shows typically the 1st example of the operation executed according to the flowchart of FIG. 2 and FIG. 2 is a diagram schematically showing a second example of an operation executed according to the flowcharts of FIGS. 2 and 3. 2 is a diagram schematically showing a second example of an operation executed according to the flowcharts of FIGS. 2 and 3. A flowchart showing an example of a component mounting process capable of recovering the progress of component mounting. FIG. 6 is a flowchart showing an example of recovery necessity determination in the component mounting process shown in FIG. 7. FIG. 5 is a diagram schematically showing an example of an operation executed according to the flowcharts of FIGS. 7 and 8.

FIG. 1 is a plan view schematically showing an example of a component mounting system according to the present invention. As shown in FIG. 1, in the present specification, the XYZ orthogonal coordinate axes composed of the substrate transport direction X, the width direction Y, and the vertical direction Z are appropriately used. The substrate transport direction X and the width direction Y are parallel to each other in the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the substrate transport direction X and the width direction Y.

The component mounting system 1 is composed of one component mounting machine 10 that mounts components on a board B carried in from the upstream side of the board transport direction X and carries them out to the downstream side of the board transport direction X. A plurality of mounting target points Bp are provided on the board B, and the control unit 100 provided in the component mounting machine 10 controls each part of the component mounting machine 10 to set the component Wp at each mounting target point Bp. Implement one by one. Here, each component Wp is a bare chip of the diced wafer W and has the same configuration as each other.

The component mounting machine 10 includes a transport unit 2 that transports the substrate B in the substrate transport direction X. The transport unit 2 has a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and a unloading conveyor 25 arranged in this order in the substrate transport direction X, and these conveyors 21 to 25 cooperate with each other to provide a substrate. The substrate B can be transported in the transport direction X. The standby conveyor 21 makes the board B carried in from the outside of the component mounting system 1 stand by, or delivers it to the mounting conveyor 22. The mounting conveyor 22 is provided for the mounting position Pm1 located on the downstream side of the board transport direction X of the standby conveyor 21, and the board B received from the standby conveyor 21 is fixed at the mounting position Pm1 or delivered to the standby conveyor 23. .. The standby conveyor 23 is provided with respect to the standby position Pw located on the downstream side of the substrate transport direction X of the mounting position Pm1, and the substrate B received from the mounting conveyor 22 is made to stand by at the standby position Pw or delivered to the mounting conveyor 24. .. The mounting conveyor 24 is provided for the mounting position Pm2 located on the downstream side of the board transport direction X of the standby position Pw, and the board B received from the standby position 23 is fixed at the mounting position Pm2 or delivered to the unloading conveyor 25. .. The carry-out conveyor 25 is provided at a position on the downstream side of the board transport direction X at the mounting position Pm2, and carries out the board B received from the mounting conveyor 24 to the outside of the component mounting system 1. As described above, in the transport unit 2, M mounting positions Pm1 and Pm2 are provided side by side in the substrate transport direction X, and the standby positions Pw are arranged between the mounting positions Pm1 and Pm2 adjacent to the board transport direction X. Has been done. Here, M is an integer of 2 or more, and in the example of FIG. 1, M = 2. In the following, when the mounting positions Pm1 and Pm2 are not distinguished, they are referred to as mounting positions Pm.

Further, the component mounting machine 10 includes a component supply mechanism 3 for supplying component Wp. The component supply mechanism 3 has a wafer storage unit 31 capable of storing a plurality of wafers W, and a wafer extraction unit 33 that pulls out the wafer W from the wafer storage unit 31 to the wafer supply position Pp. The wafer storage unit 31 raises and lowers a rack for vertically arranging and storing a plurality of wafer holders Wh for holding the wafer W in the vertical direction Z, so that the wafer drawer unit 33 can receive the wafer W. The wafer holder Wh can be positioned and the wafer holder Wh can be pushed out to the wafer drawer 33.

The wafer drawing portion 33 is provided on the wafer support table 331 that supports the wafer holder Wh, the fixed rail 332 that movably supports the wafer support table 331 in the width direction Y, and the wafer support table 331 that is provided in the width direction Y. It has a ball screw 333 and a Y-axis motor 334 that drives the ball screw 333. Therefore, by rotating the ball screw 333 with the Y-axis motor 334, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332. As shown in FIG. 1, the wafer storage unit 31 and the wafer supply position Pp are arranged so as to sandwich the transfer unit 2 from the width direction Y, and the wafer support table 331 passes below the transfer unit 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the receiving position adjacent to the wafer storage unit 31, and moves to the wafer supply position Pp away from the wafer storage unit 31 in the width direction Y from the receiving position. By doing so, the wafer W is pulled out to the wafer supply position Pp.

Further, the component supply mechanism 3 has a component take-out unit 35 that takes out the component Wp from the wafer supply position Pp. The component take-out unit 35 has a take-out head 36 for taking out the component Wp from the wafer supply position Pp, and can drive the take-out head 36 in the XY direction. That is, the component take-out unit 35 has a support member 351 that movably supports the take-out head 36 in the board transport direction X, and an X-axis motor 352 that drives a ball screw provided in the board transport direction X and attached to the take-out head 36. By driving the ball screw with the X-axis motor 352, the take-out head 36 can be moved in the substrate transport direction X. Further, the component take-out portion 35 has a fixed rail 353 that movably supports the support member 351 in the width direction Y, a ball screw 354 provided in the width direction Y and attached to the fixed rail 353, and a Y that drives the ball screw 354. It has a shaft motor 355. Therefore, by driving the ball screw 354 by the Y-axis motor 355, the take-out head 36 can be moved in the width direction Y together with the support member 351.

The take-out head 36 has a bracket 361 extending in the substrate transport direction X and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 rotates about a rotation axis parallel to the substrate transport direction X, and is positioned at either a downward suction position or an upward delivery position (position in FIG. 1). Further, the bracket 361 can be raised and lowered with each nozzle 362.

When the nozzle 362 located at the suction position faces the component Wp on the wafer supply position Pp from above, the component supply mechanism 3 lowers the nozzle 362 and brings it into contact with the component Wp. Further, the component supply mechanism 3 sucks the component Wp from the wafer supply position Pp by raising the nozzle 362 while applying a negative pressure to the nozzle 362. Then, the component supply mechanism 3 supplies the component Wp by locating the nozzle 362 at the delivery position.

The component mounting machine 10 includes mounting units 4A and 4B for mounting the component Wp supplied by the component supply mechanism 3 on the substrate B. In particular, M mounting portions 4A and 4B are provided in a one-to-one correspondence with the M mounting positions Pm1 and Pm2 (as described above, M = 2 in the example of FIG. 1). That is, the mounting unit 4A is provided corresponding to the mounting position Pm1, and the mounting unit 4B is provided corresponding to the mounting position Pm2. The mounting portions 4A and 4B are mounted on the ceiling of the component mounting machine 10 so as to be movable along a fixed rail provided in the width direction Y and supported by the support member 41 so as to be movable in the substrate transport direction X. It has a head 42, and the mounting head 42 can be moved in the XY direction. The mounting head 42 has two nozzles 421 facing downward.

When sucking and mounting the component Wp, each of the mounting portions 4A and 4B moves above the take-out head 36 to face the nozzle 421 from above with respect to the component Wp held by the nozzle 362 located at the delivery position. Then, the nozzle 421 is lowered to bring it into contact with the component Wp. Subsequently, the component supply mechanism 3 releases the negative pressure of the nozzle 362, and the mounting portions 4A and 4B raise the nozzle 421 while applying the negative pressure to the nozzle 421. When the component Wp is attracted by the mounting head 42 in this way, the mounting unit 4A mounts the component Wp at the mounting target point Bp of the board B fixed to the corresponding mounting position Pm1, and the mounting unit 4B mounts the component Wp at the corresponding mounting position P4. The component Wp is mounted at the mounting target point Bp of the fixed board B. In this way, the mounting units 4A and 4B mount a single type of component Wp on the substrate B. In the following, when the mounting units 4A and 4B are not distinguished, they are referred to as mounting units 4.

In such a component mounting system 1, the control unit 100 can execute component mounting on the substrate B at the mounting positions Pm1 and Pm2. At this time, the control unit 100 distributes component mounting to a plurality of mounting target points Bp provided on one board B among M mounting positions Pm1 and Pm2 (in other words, sharing them). That is, the transport unit 2 transports the one substrate B in the substrate transport direction X, and stops at the mounting position Pm in which the component mounting is distributed among the M mounting positions Pm1 and Pm2. Then, the mounting unit 4 executes component mounting distributed to the corresponding mounting position Pm on the one board B that stops at the corresponding mounting position Pm.

Normally, the control unit 100 distributes the component mounting of the mounting target point Bp on the upstream side half of the board transport direction X among the plurality of mounting target points Bp of the board B to the mounting position Pm1 and downstream of the board transport direction X. The component mounting of the mounting target point Bp on the side half is distributed to the mounting position Pm2 (normal mounting mode). Specifically, the transport unit 2 transports one board B to the mounting position Pm1, and the mounting unit 4A stops at the mounting position Pm1. The mounting target point Bp (normally) on the upstream half of the board transport direction X of the board B. The component Wp is mounted at the distribution point). When the component mounting at the mounting position Pm1 is completed, the transport unit 2 transports the board B from the mounting position Pm1 to the mounting position Pm2, and the mounting unit 4B stops at the mounting position Pm2 downstream of the board transport direction X of the board B. The component Wp is mounted at the mounting target point Bp (normal distribution point) on the side half. That is, in the normal mounting mode, one board B is stopped in order at the mounting positions Pm1 and Pm2, and the board B is distributed to the mounting positions Pm1 and Pm2 with respect to the one board B stopped at the respective mounting positions Pm1 and Pm2. Perform component mounting. Then, the control unit 100 can execute the normal mounting mode for each board B while sequentially transporting the plurality of boards B in the board transport direction X.

However, when the control unit 100 executes component mounting on each board B while sequentially transporting L sheets (L is an integer larger than M) by the transfer unit 2, the control unit 100 depends on the transfer order N of the boards B. The distribution of component mounting to the mounting positions Pm1 and Pm2 is dynamically changed. This point will be described in detail with reference to FIGS. 2 to 4. In the following, the downstream or upstream of the substrate transport direction X is simply referred to as "downstream" or "upstream" as appropriate.

FIG. 2 is a flowchart showing an example of a carry-in determination process executed when component mounting is performed on the board while transporting the board in the board transport direction, and FIG. 3 shows component mounting on the board while transporting the board in the board transport direction. It is a flowchart which shows an example of the mounting completion determination process which is executed at the time of execution, and FIG. 4 is a figure which shows typically the 1st example of the operation which is executed according to the flowchart of FIGS. 2 and 3. FIG. 4 shows an example in which components are mounted on each substrate B while sequentially transporting four substrates (that is, L = 4) in the substrate transport direction X. Further, in FIG. 4, the transport order N (N = 1 to 4) of the L substrates B is attached to the reference numeral B.

The control unit 100 executes the operation shown in FIG. 4 by executing the carry-in / mounting completion determination processing shown in the flowcharts of FIGS. 2 and 3 for each of the mounting positions Pm1 and Pm2. When the downstream end of the first board B1 is carried into the mounting position Pm1 (“YES” in step S101 of FIG. 2), the component Wp is not mounted among the plurality of mounting target points Bp of the board B1. It is determined whether a mounting point exists (step S102). Since there is an unmounted point on the substrate B1 (“YES” in step S102), the process proceeds to step S103. In step S103, it is determined whether or not the main mounting position Pm1 is the most downstream mounting position Pm among the M mounting positions Pm1 and Pm2. Since the mounting position Pm1 is not the most downstream mounting position Pm (“NO” in step S103), the process proceeds to step S104. In step S104, it is determined whether or not component mounting on the board B1 can be executed at the mounting position Pm2 downstream of the main mounting position Pm1. Since there is no board B on which the component mounting is scheduled to be executed at the mounting position Pm2 and the component mounting can be executed on the board B1 at the mounting position Pm2 (“YES” in step S104), the process proceeds to step S105. Then, in step S105, the control unit 100 determines that the component mounting of the board B1 is not distributed to the main mounting position Pm1, but is distributed to the downstream mounting position Pm2.

By the determination in step S105, the substrate B1 passes through the mounting position Pm1 and is conveyed toward the mounting position Pm2. When the downstream end of the substrate B1 is carried into the mounting position Pm2 (“YES” in step S101), the existence of an unmounted point on the substrate B1 is determined (step S102). Since there is an unmounted point on the substrate B1 (“YES” in step S102), it is determined in step S103 whether the main mounting position Pm2 is the most downstream mounting position Pm. Since the mounting position Pm2 is the most downstream mounting position Pm (“YES” in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting of the board B1 is distributed to the main mounting position Pm2. Specifically, the normal distribution point (upstream half) to the mounting position Pm1 through which the board B1 has passed without stopping, and the normal distribution point (downstream half) to the mounting position Pm2, which is the loading destination of the board B1. The component mounting for is distributed to the mounting position Pm2. As a result, as shown in the column of operation A101 in FIG. 4, the board B1 is carried into the mounting position Pm2, and the component mounting on all the mounting target points Bp of the board B1 is distributed to the mounting position Pm2.

When the downstream end of the second board B2 is carried into the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on board B2 (YES), and further in step S103 It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since the component mounting is scheduled to be executed on the previous board B1 at the downstream mounting position Pm2, it is determined in step S104 that the component mounting of the board B2 cannot be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting of the board B2 is distributed to the mounting position Pm1. As a result, as shown in the column of operation A101 in FIG. 4, the board B2 is carried into the mounting position Pm1, and among all the mounting target points Bp of the board B2, the components to the normal distribution point (upstream half) of the mounting position Pm1. The mounting is distributed to the mounting position Pm1.

Then, at the mounting position Pm2, component mounting at the mounting positions Pm1 and Pm2 at the normal distribution point is started for the first board B1, and at the mounting position Pm1, component mounting at the normal distribution point at the mounting position Pm1 is started. Is started for the second substrate B2. As shown in the column of operation A102 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B2 (“YES” in step S201), it is determined whether or not there is an unmounted point on the board B2. (Step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the board B2 (“YES” in step S202), the process proceeds to step S203. In step S203, it is determined whether the substrate B exists on the upstream side of the mounting position Pm1, that is, on the standby conveyor 21. Since the standby conveyor 21 has the third substrate B3 (“YES” in step S203), the process proceeds to step S204. In step S204, it is determined whether or not the substrate B exists on the downstream side of the mounting position Pm1, that is, on the standby position Pw. Since the substrate B does not exist at the standby position Pw (“NO” in step S204), the process proceeds to step S205. Then, in step S205, the substrate B2 is carried out downstream of the mounting position Pm1, that is, the standby position Pw, and the transfer to the downstream side of the substrate B3 is started.

When the downstream end of the third substrate B3 is carried into the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on the substrate B3 (YES), and further in step S103 It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since the downstream mounting position Pm2 is executing component mounting on the previous board B1, it is determined in step S104 that the component mounting of the board B3 cannot be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting of the board B3 is distributed to the mounting position Pm1. As a result, as shown in the column of operation A103 in FIG. 4, the board B3 is carried into the mounting position Pm1, and the component to the normal distribution point (upstream half) of the mounting position Pm1 among all the mounting target points Bp of the board B3. The mounting is distributed to the mounting position Pm1.

Then, at the mounting position Pm1, component mounting at the normal distribution point at the mounting position Pm1 is started with respect to the third substrate B3. As shown in the column of operation A104 in FIG. 4, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B1 (“YES” in step S201 of FIG. 3), there is an unmounted point on the board B1. Is determined (step S202). Since the component Wp is mounted on all the mounting target points Bp of the board B1 (“NO” in step S202), the board B1 is carried downstream from the mounting position Pm2 as shown in the column of operation A105 in FIG. Then, the transfer of the substrate B2 to the downstream is started (step S205).

Further, as shown in the column of operation A104 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B3 (“YES” in step S201), is there an unmounted point on the board B3? Is determined (step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the board B3 (“YES” in step S202), is the board B present on the upstream side of the mounting position Pm1, that is, on the standby conveyor 21? Is determined (step S203). Since the fourth substrate B4 exists on the standby conveyor 21 (“YES” in step S203), the process proceeds to step S204. In step S204, it is determined whether or not the substrate B exists on the downstream side of the mounting position Pm1, that is, on the standby position Pw. Since the board B2 is carried out from the standby position Pw as the board B1 is carried out from the mounting position Pm2, in step S204, it is determined that the board B does not exist at the standby position Pw (NO), and in step S205. move on. Then, as shown in the column of operation A105 in FIG. 4, the substrate B3 is carried out from the mounting position Pm1 to the standby position Pw, and the transfer to the downstream of the substrate B4 is started (step S205).

When the downstream end of the substrate B2 is carried into the mounting position Pm2 (“YES” in step S101), the existence of an unmounted point on the substrate B2 is determined (step S102). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the board B2 (“YES” in step S102), the main mounting position Pm2 is the most downstream mounting position Pm in step S103. Is judged. Since the mounting position Pm2 is the most downstream mounting position Pm (“YES” in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting on the non-mounting point of the board B2 is distributed to the main mounting position Pm2. As a result, as shown in the column of operation A105 in FIG. 4, the board B2 is carried into the mounting position Pm2, and among all the mounting target points Bp of the board B2, the components to the normal distribution point (downstream side half) of the mounting position Pm2. The mounting is distributed to the mounting position Pm2.

Further, when the downstream end of the fourth board B4 is carried into the mounting position Pm1 (“YES” in step S101), it is determined in step S102 that there is an unmounted point on the board B4 (YES), and further step S103. It is determined that the mounting position Pm1 is not the most downstream mounting position Pm (NO), and the process proceeds to step S104. Since the downstream mounting position Pm2 is scheduled to execute component mounting on the previous board B2, it is determined in step S104 that the component mounting of the board B4 cannot be mounted at the mounting position Pm2 (NO), and the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting of the board B4 is distributed to the mounting position Pm1. As a result, as shown in the column of operation A105 in FIG. 4, the board B4 is carried into the mounting position Pm1, and among all the mounting target points Bp of the board B4, the components to the normal distribution point (upstream half) of the mounting position Pm1. The mounting is distributed to the mounting position Pm1.

Then, at the mounting position Pm2, component mounting at the normal distribution point at the mounting position Pm2 is started for the second board B2, and at the mounting position Pm1, component mounting at the normal distribution point at the mounting position Pm1 is 4 It is started for the third substrate B4. As shown in the column of operation A106 in FIG. 4, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B2 (“YES” in step S201), it is determined whether or not there is an unmounted point on the board B2. (Step S202). Since the component Wp is mounted on all the mounting target points Bp of the board B2 (“NO” in step S202), the board B2 is carried downstream from the mounting position Pm2 as shown in the column of operation A107 in FIG. Then, the transfer of the substrate B3 to the downstream is started (step S205).

As shown in the column of operation A106 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B4 (“YES” in step S201), it is determined whether or not there is an unmounted point on the board B4. (Step S202). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the board B4 (“YES” in step S202), is the board B present on the upstream side of the mounting position Pm1, that is, on the standby conveyor 21? Is determined (step S203). Since the substrate B does not exist on the standby conveyor 21 (“NO” in step S203), the process proceeds to step S206. In step S206, the control unit 100 determines that the component mounting of the board B4 is distributed to the mounting position Pm1. As a result, as shown in the column of operation A107 in FIG. 4, the board B4 stays at the mounting position Pm1, and the components are mounted at the normal distribution point (downstream half) of the mounting position Pm2 among all the mounting target points Bp of the board B4. Is distributed to the mounting position Pm1.

When the downstream end of the substrate B3 is carried into the mounting position Pm2 (“YES” in step S101), the existence of an unmounted point on the substrate B3 is determined (step S102). Since the component Wp is not mounted on the downstream half of the plurality of mounting target points Bp of the board B3 (“YES” in step S102), the main mounting position Pm3 is the most downstream mounting position Pm in step S103. Is judged. Since the mounting position Pm2 is the most downstream mounting position Pm (“YES” in step S103), the process proceeds to step S106. Then, in step S106, the control unit 100 determines that the component mounting on the unmounted point of the board B3 is distributed to the main mounting position Pm2. As a result, as shown in the operation A107 of FIG. 4, the board B3 is carried into the mounting position Pm2, and the components can be mounted at the normal distribution point (downstream half) of the mounting position Pm2 among all the mounting target points Bp of the board B3. It is distributed to the mounting position Pm2.

Then, at the mounting position Pm2, component mounting at the normal distribution point at the mounting position Pm2 is started for the third board B3, and at the mounting position Pm1, component mounting at the normal distribution point at the mounting position Pm2 is 4 It is started for the third substrate B4. As shown in the column of operation A108 in FIG. 4, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B3 (“YES” in step S201), it is determined whether or not there is an unmounted point on the board B3. (Step S202). Since the component Wp is mounted on all the mounting target points Bp of the board B3 (“NO” in step S202), the board B3 is carried downstream from the mounting position Pm2 (step S205).

As shown in the column of operation A108 in FIG. 4, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B4 (“YES” in step S201), it is determined whether or not there is an unmounted point on the board B4. (Step S202). Since the component Wp is mounted on all the mounting target points Bp of the board B4 (“NO” in step S202), the board B4 is carried downstream from the mounting position Pm1 (step S205). Further, when the downstream end of the substrate B4 is carried into the mounting position Pm2 (“YES” in step S101), it is determined whether or not there is an unmounted point on the substrate B4 (step S102). Since the component Wp is mounted on all the mounting target points Bp of the board B4 (“NO” in step S102), the board B4 is carried downstream from the mounting position Pm1 in step S107.

In the embodiment configured as described above, the number M of the mounting positions Pm is "2", and the number L of the substrates B is "4". That is, component mounting for a plurality of mounting target points Bp provided on one board B is distributed among the two mounting positions Pm1 and Pm2. Then, while transporting the one board B in the board transport direction X, the component mounting is stopped at the distributed mounting position Pm among the two mounting positions Pm1 and Pm2, and the one board B is stopped at the mounting position Pm. The component mounting distributed to the mounting position Pm is executed. At this time, among the four boards B1 to B4, the components are mounted in the initial mounting mode (operation with respect to the board B1 in the operations A101 to A104) for the board B1 in which the transfer order N in the board transfer direction X is less than M. Then, for the substrate B3 whose transport order N is M or more and less than (LM + 2), component mounting is executed in the normal mounting mode (operation with respect to the substrate B3 in operations A103 to A108). In the initial mounting mode, the board B1 is located at the mounting position Pm2 on the downstream side of the first mounting position Pm1 counting from the upstream side of the board transport direction X among the two mounting positions Pm1 and Pm2 with respect to the board B1 in the transport order 1. The component mounting to is selectively distributed. Therefore, the board B1 passes through the first mounting position Pm1 and the components are mounted on the plurality of mounting target points Bp of the board B1 at the mounting position Pm2 on the downstream side of the first mounting position Pm1. On the other hand, in the normal mounting mode, component mounting on the board B3 is distributed to each of the two mounting positions Pm1 and Pm2, and the board B3 stops in order at the two mounting positions Pm1 and Pm2 to mount the two. Parts are sequentially mounted on the plurality of mounting target points Bp of the board B3 at the positions Pm1 and Pm2, respectively.

Therefore, for the two boards having the first transfer order among the four boards, component mounting is performed as follows. That is, the first board B1 is transported to the second mounting position Pm2 counted from the upstream side of the board transport direction X by the initial mounting mode, and the second board B2 is transported to the board transport direction X by the normal mounting mode. It is transported to the first mounting position Pm1 counting from the upstream side of. In this way, the boards B2 and B1 can be conveyed to the two mounting positions Pm1 and Pm2, respectively, and component mounting on the boards B2 and B1 can be started at the mounting positions Pm1 and Pm2, respectively. This makes it possible to suppress a decrease in the operating rate of the component mounting system 1.

Further, the transport unit 2 further has a standby position Pw arranged between the mounting positions Pm1 and Pm2 adjacent to each other in the substrate transport direction X. Then, in the substrate transport direction X, of the two mounting positions Pm1 and Pm2, the mounting positions Pm1 other than the most downstream mounting position Pm2 are mounted at the adjacent mounting positions Pm2 on the downstream side when component mounting is executed. The board B for which the distributed component mounting is completed is carried out to the standby position Pw on the downstream side, and the board B for which the distributed component mounting is not completed is carried in from the upstream side in the board transport direction X (boards of operations A102 to A103). B2, B3, etc.). In such a configuration, at the mounting position Pm1 other than the most downstream mounting position Pm2, the distributed board B for which component mounting has been completed is promptly carried out to the standby position Pw, and the next board B for which component mounting is not completed is in the board transport direction. It is carried in from the upstream side of X. As a result, it is possible to more effectively suppress a decrease in the operating rate of the component mounting system 1.

Further, in the normal mounting mode, the difference in the number of mounting target points Bp on which the component Wp is mounted is one or less at each of the mounting positions Pm1 and Pm2 (in the above embodiment, the difference in the number is zero). There is), the component mounting on the substrate B is distributed to each of the two mounting positions Pm1 and Pm2. On the other hand, in the initial mounting mode, with respect to the substrate B1 in the transport order 1, the second mounting position Pm2 counting from the upstream side of the board transport direction X is the first in the normal mounting mode counting from the upstream side of the board transport direction X. The component mountings distributed to the second mounting positions Pm1 and Pm2 are distributed. In such a configuration, if the normal mounting mode is executed for the board B1 having a transport order N of less than M, it is distributed to the first to second mounting positions Pm1 and Pm2 counting from the upstream side of the board transport direction X. The component mounting to be performed is distributed to the second mounting position Pm2 in the initial mounting mode. That is, in the initial mounting mode, although component mounting at the mounting position Pm1 on the upstream side of the second mounting position Pm2 is omitted for the board B1 in the transport order 1, this component mounting is ensured at the second mounting position Pm2. It is possible to execute it.

Further, in the normal mounting mode, the difference in the number of mounting target points Bp on which the component Wp is mounted is set to 1 or less at each of the mounting positions Pm1 and Pm2, so that the mounting time at each mounting position Pm1 and Pm2 is equalized. Can be changed. That is, if the number of mounting target points Bp at the mounting positions Pm1 and Pm2 is approximately equal, the transfer of the substrate B from the mounting positions Pm1 and Pm2 can be executed substantially at the same time. Further, the number of mounting target points Bp at each mounting position Pm1 and Pm2 may be determined so that the mounting time itself at each mounting position Pm1 and Pm2 is equalized. In this case, even if the mounting times at the mounting positions Pm1 and Pm2 cannot be completely equalized, the mounting target points at the mounting positions Pm1 and Pm2 are suppressed so as to suppress the difference in the mounting time at the mounting positions Pm1 and Pm2. The number of Bp may be determined.

Further, the control unit 100 executes component mounting in the final mounting mode (operation with respect to the board B4 in the operations A105 to A108) for the board B4 having the transport order N of 4 or more among the four boards B1 to B4. .. In this final mounting mode, with respect to the board B4 in the transport order 4, component mounting on the board B4 is selectively performed at the first mounting position Pm1 of the two mounting positions Pm1 and Pm2 counting from the upstream side of the board transport direction X. At the first mounting position Pm1, component mounting is executed at a plurality of mounting target points Bp of the board B4. In such a configuration, for the substrate B4 having the transfer order N of (LM + 2) or more among the four substrates B1 to B4, from the upstream side of the substrate transfer direction X among the two mounting positions Pm1 and Pm2. The component mounting on the board B4 is selectively distributed to the first mounting position Pm1 by counting, and the component mounting on the plurality of mounting target points Bp of the board B4 is executed at the first mounting position Pm1. Therefore, in the board transport direction X, even if component mounting is being executed at the mounting position Pm2 on the downstream side of the first, the first mounting position Pm1 is operated and the transport order N is (LM + 2) or more. It is possible to efficiently implement component mounting on the substrate B4 of the above. As a result, it is possible to more effectively suppress a decrease in the operating rate of the component mounting system 1.

Further, in the final mounting mode, with respect to the substrate B4 in the transport order 4, the first mounting position Pm1 counting from the upstream side of the board transport direction X is the first counting from the upstream side of the board transport direction X in the normal mounting mode. The component mountings distributed to the second mounting positions Pm1 and Pm2 are distributed. In such a configuration, if the normal mounting mode is executed for the board B4 whose transport order N is (LM + 2) or higher, the mounting positions from the first to the second counting from the upstream side of the board transport direction X. The component mounting distributed to Pm1 and Pm2 is distributed to the first mounting position Pm1 in the final mounting mode. That is, in the final mounting mode, although the component mounting at the mounting position Pm2 on the downstream side of the first mounting position Pm1 is omitted for the board B4 in the transport order 4, this component mounting is surely performed at the first mounting position Pm1. It is possible to execute it.

5 and 6 are diagrams schematically showing a second example of an operation executed according to the flowcharts of FIGS. 2 and 3. 5 and 6 show an example in which eight boards (that is, L = 8) are sequentially transported in the substrate transport direction X, and component mounting is performed on each board B. Further, in FIGS. 5 and 6, the transport order N (N = 1 to 8) of the L substrates B is attached to the reference numeral B.

As shown in FIGS. 5 and 6, in the transport unit 2, the standby conveyor 26 and the mount conveyor 27 are provided in this order in the substrate transport direction X between the mounting conveyor 24 and the unloading conveyor 25 (FIG. 1). The standby conveyor 26 stops and fixes the substrate B at the standby position Pw2, and the mounting conveyor 27 stops and fixes the substrate B at the mounting position Pm3. That is, in the transport unit 2, M mounting positions Pm1, Pm2, and Pm3 are provided side by side in the substrate transport direction X, and the standby position Pw1 is arranged between the mounting positions Pm1 and Pm2 adjacent to the board transport direction X. The standby position Pw2 is arranged between the mounting positions Pm2 and Pm3 adjacent to each other in the substrate transport direction X. Here, in the examples of FIGS. 5 and 6, M = 3, and three mounting portions 4 are provided corresponding to the three mounting positions Pm1, Pm2, and Pm3 on a one-to-one basis, and each mounting portion 4 is provided. Executes component mounting on the board B that stops at the corresponding mounting position Pm. In the following, when the mounting positions Pm1, Pm2, and Pm3 are not distinguished, they are referred to as mounting positions Pm, and when the standby positions Pw1 and Pw2 are not distinguished, they are referred to as standby positions Pw.

In the second example as well, when the control unit 100 executes component mounting on each board B while sequentially transporting the L boards B by the transport unit 2, the mounting position Pm1 corresponds to the transport order N of the boards B. , Pm2, Pm3 dynamically change the distribution of component mounting. At this time, the mounting target points Bp distributed to the mounting positions Pm1, Pm2, and Pm3 in the normal mounting mode are different from those in the first example according to the difference in the number of mounting positions Pm. That is, among the plurality of mounting target points Bp of the board B, the component Wp is mounted at the mounting target point Bp (normal distribution point) of the upstream one-third at the mounting position Pm1, and the component Wp is mounted at the center at the mounting position Pm2. The component Wp is mounted on the one-third mounting target point Bp (normal distribution point), and at the mounting position Pm3, the component Wp is mounted on the downstream one-third mounting target point Bp (normal distribution point). Will be implemented.

Then, the control unit 100 executes the operations of FIGS. 5 and 6 by executing the carry-in / mounting completion determination processing shown in the flowcharts of FIGS. 2 and 3 for each of the mounting positions Pm1, Pm2, and Pm3. .. Since the details of the determination based on the flowcharts of FIGS. 2 and 3 are the same as those of the first example above, the description thereof will be omitted as appropriate.

As shown in the column of operation A201 in FIG. 5, while transporting the first substrate B1 in the substrate transport direction X, the carry-in time determination process was executed at each of the mounting positions Pm1, Pm2, and Pm3 with respect to the board B1. As a result, the board B1 passes through the mounting positions Pm1 and Pm2 and is carried into the mounting position Pm3, and the component mounting on the board B1 is distributed to the mounting position Pm3. Specifically, the component mounting on the normal distribution points at the mounting positions Pm1 and Pm2 that the board B1 has passed through without stopping and the normal distribution points at the mounting position Pm3 that is the destination of the board B1 is the mounting position Pm3. Will be distributed to. As a result, component mounting on all mounting target points Bp of the board B1 is distributed to the mounting position Pm3.

Further, as a result of executing the carry-in time determination process at each of the mounting positions Pm1 and Pm2 with respect to the board B2 while transporting the second board B2 in the board transport direction X, the board B2 passes through the mounting position Pm1. It is carried into the mounting position Pm2, and the component mounting on the board B2 is distributed to the mounting position Pm2. Specifically, the component mounting with respect to the normal distribution point to the mounting position Pm1 through which the board B2 has passed without stopping and the normal distribution point to the mounting position Pm2 to which the board B2 is carried in is distributed to the mounting position Pm2. Will be done. As a result, component mounting at the mounting target point Bp on the upstream side of the board B2 is distributed to the mounting position Pm2.

Further, as a result of executing the carry-in time determination process with respect to the board B3 at the mounting position Pm1 while carrying the third board B3 in the board transport direction X, the board B3 is carried into the mounting position Pm1 and transferred to the board B3. The component mounting is distributed to the mounting position Pm1. Specifically, the component mounting with respect to the normal distribution point at the mounting position Pm1 is distributed to the mounting position Pm1. As a result, component mounting at the mounting target point Bp (normal distribution point), which is one-third of the upstream side of the board B3, is distributed to the mounting position Pm1.

Then, at the mounting position Pm3, component mounting on the normal distribution points at the mounting positions Pm1, Pm2, Pm3 is started for the first board B1, and at the mounting position Pm2, the normal distribution points at the mounting positions Pm1, Pm2. The component mounting on the second board B2 is started, and at the mounting position Pm1, the component mounting on the normal distribution point at the mounting position Pm1 is started on the first board B3. As shown in the column of operation A202 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B3, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A203 in FIG. 5, the substrate B3 is carried out from the mounting position Pm1 to the standby position Pw1. In parallel with this, when the fourth substrate B4 is started to be conveyed downstream and the downstream end of the substrate B4 is carried into the mounting position Pm1, the carry-in time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A203 in FIG. 5, the board B4 is carried into the mounting position Pm1, and the component mounting on the board B4 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point at the mounting position Pm1 is distributed to the mounting position Pm1 among the plurality of mounting target points Bp of the board B4, and this component mounting starts with respect to the board B4 at the mounting position Pm1. Will be done.

As shown in the column of operation A204 in FIG. 5, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B2, the mounting completion time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A205 in FIG. 5, the substrate B2 is carried out from the mounting position Pm2 to the standby position Pw2. In parallel with this, the transfer to the downstream of the substrate B3 is started, and when the downstream end of the substrate B3 is carried into the mounting position Pm2, the carry-in time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A205 in FIG. 5, the board B3 is carried into the mounting position Pm2, and the component mounting on the board B3 is distributed to the mounting position Pm2. As a result, component mounting at the normal distribution point at the mounting position Pm2 is distributed to the mounting position Pm2 among the plurality of mounting target points Bp of the board B3, and this component mounting starts with respect to the board B3 at the mounting position Pm2. Will be done.

As shown in the column of operation A204 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B4, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A205 in FIG. 5, the substrate B4 is carried out from the mounting position Pm1 to the standby position Pw1. In parallel with this, the transfer to the downstream of the fifth substrate B5 is started, and when the downstream end of the substrate B5 is carried into the mounting position Pm1, the carry-in time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A205 in FIG. 5, the substrate B5 is carried into the mounting position Pm1, and the component mounting on the substrate B5 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point at the mounting position Pm1 among the plurality of mounting target points Bp of the board B5 is distributed to the mounting position Pm1, and this component mounting starts with respect to the board B5 at the mounting position Pm1. Will be done.

As shown in the column of operation A206 in FIG. 5, when the component mounting distributed at the mounting position Pm3 is completed with respect to the board B1, the mounting completion determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B1 is carried out from the mounting position Pm3. In parallel with this, the transfer to the downstream of the substrate B2 is started, and when the downstream end of the substrate B2 is carried into the mounting position Pm3, the carry-in time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A207 in FIG. 5, the board B2 is carried into the mounting position Pm3, and the component mounting on the board B2 is distributed to the mounting position Pm3. As a result, component mounting at the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm3 among the plurality of mounting target points Bp of the board B2, and this component mounting starts with respect to the board B2 at the mounting position Pm3. Will be done.

As shown in the column of operation A206 in FIG. 5, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B3, the mounting completion time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B3 is carried out from the mounting position Pm2 to the standby position Pw2. In parallel with this, the transfer to the downstream of the substrate B4 is started, and when the downstream end of the substrate B4 is carried into the mounting position Pm2, the carry-in time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A207 in FIG. 5, the board B4 is carried into the mounting position Pm2, and the component mounting on the board B4 is distributed to the mounting position Pm2. As a result, the component mounting at the normal distribution point at the mounting position Pm2 is distributed to the mounting position Pm2 among the plurality of mounting target points Bp of the board B4, and this component mounting starts with respect to the board B4 at the mounting position Pm2. Will be done.

As shown in the column of operation A206 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B5, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A207 in FIG. 5, the substrate B5 is carried out from the mounting position Pm1 to the standby position Pw1. In parallel with this, the sixth board B6 is started to be transported downstream, and when the downstream end of the board B6 is carried into the mounting position Pm1, the carry-in time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A207 in FIG. 5, the board B6 is carried into the mounting position Pm1, and the component mounting on the board B6 is distributed to the mounting position Pm1. As a result, the component mounting at the normal distribution point at the mounting position Pm1 is distributed to the mounting position Pm1 among the plurality of mounting target points Bp of the board B6, and this component mounting starts with respect to the board B6 at the mounting position Pm1. Will be done.

As shown in the column of operation A208 in FIG. 5, when the component mounting distributed at the mounting position Pm3 is completed with respect to the board B2, the mounting completion time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A209 in FIG. 6, the substrate B2 is carried out from the mounting position Pm3. In parallel with this, the transfer to the downstream of the substrate B3 is started, and when the downstream end of the substrate B3 is carried into the mounting position Pm3, the carry-in time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A209 in FIG. 5, the board B3 is carried into the mounting position Pm3, and the component mounting on the board B3 is distributed to the mounting position Pm3. As a result, the component mounting to the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm3 among the plurality of mounting target points Bp of the board B3, and this component mounting starts with respect to the board B3 at the mounting position Pm3. Will be done.

As shown in the column of operation A208 in FIG. 5, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B4, the mounting completion time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A209 in FIG. 5, the substrate B4 is carried out from the mounting position Pm2 to the standby position Pw2. In parallel with this, the transfer to the downstream of the substrate B5 is started, and when the downstream end of the substrate B5 is carried into the mounting position Pm2, the carry-in time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A209 in FIG. 5, the board B5 is carried into the mounting position Pm2, and the component mounting on the board B5 is distributed to the mounting position Pm2. As a result, the component mounting to the normal distribution point at the mounting position Pm2 among the plurality of mounting target points Bp of the board B5 is distributed to the mounting position Pm2, and this component mounting starts with respect to the board B5 at the mounting position Pm2. Will be done.

As shown in the column of operation A208 in FIG. 5, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B6, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A209 in FIG. 6, the substrate B6 is carried out from the mounting position Pm1 to the standby position Pw1. In parallel with this, the transfer to the downstream of the seventh substrate B7 is started, and when the downstream end of the substrate B7 is carried into the mounting position Pm1, the carry-in time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A209 in FIG. 6, the board B7 is carried into the mounting position Pm1, and the component mounting on the board B7 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point at the mounting position Pm1 among the plurality of mounting target points Bp of the board B7 is distributed to the mounting position Pm1, and this component mounting starts with respect to the board B7 at the mounting position Pm1. Will be done.

As shown in the column of operation A210 in FIG. 6, when the component mounting distributed at the mounting position Pm3 is completed with respect to the board B3, the mounting completion time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B3 is carried out from the mounting position Pm3. In parallel with this, the transfer to the downstream of the substrate B4 is started, and when the downstream end of the substrate B4 is carried into the mounting position Pm3, the carry-in time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A211 in FIG. 6, the board B4 is carried into the mounting position Pm3, and the component mounting on the board B4 is distributed to the mounting position Pm3. As a result, component mounting at the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm3 among the plurality of mounting target points Bp of the board B4, and this component mounting starts with respect to the board B4 at the mounting position Pm3. Will be done.

As shown in the column of operation A210 in FIG. 6, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B5, the mounting completion time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B5 is carried out from the mounting position Pm2 to the standby position Pw2. In parallel with this, the transfer to the downstream of the substrate B6 is started, and when the downstream end of the substrate B6 is carried into the mounting position Pm2, the carry-in time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A211 in FIG. 6, the board B6 is carried into the mounting position Pm2, and the component mounting on the board B6 is distributed to the mounting position Pm2. As a result, the component mounting to the normal distribution point at the mounting position Pm2 is distributed to the mounting position Pm2 among the plurality of mounting target points Bp of the board B6, and this component mounting starts with respect to the board B6 at the mounting position Pm2. Will be done.

As shown in the column of operation A210 in FIG. 6, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B7, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A211 in FIG. 6, the substrate B7 is carried out from the mounting position Pm1 to the standby position Pw1. In parallel with this, the transfer to the downstream of the eighth substrate B8 is started, and when the downstream end of the substrate B8 is carried into the mounting position Pm1, the carry-in time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A211 in FIG. 6, the board B8 is carried into the mounting position Pm1, and the component mounting on the board B8 is distributed to the mounting position Pm1. As a result, the component mounting to the normal distribution point at the mounting position Pm1 is distributed to the mounting position Pm1 among the plurality of mounting target points Bp of the board B8, and this component mounting starts with respect to the board B8 at the mounting position Pm1. Will be done.

As shown in the column of operation A212 in FIG. 6, when the component mounting distributed at the mounting position Pm3 is completed with respect to the board B4, the mounting completion time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B4 is carried out from the mounting position Pm3. In parallel with this, the transfer to the downstream of the substrate B5 is started, and when the downstream end of the substrate B5 is carried into the mounting position Pm3, the carry-in time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A213 in FIG. 6, the board B5 is carried into the mounting position Pm3, and the component mounting on the board B5 is distributed to the mounting position Pm3. As a result, the component mounting at the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm3 among the plurality of mounting target points Bp of the board B5, and this component mounting starts with respect to the board B5 at the mounting position Pm3. Will be done.

As shown in the column of operation A212 in FIG. 6, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B6, the mounting completion time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B6 is carried out from the mounting position Pm2 to the standby position Pw2. In parallel with this, the transfer to the downstream of the substrate B7 is started, and when the downstream end of the substrate B7 is carried into the mounting position Pm2, the carry-in time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A213 in FIG. 6, the board B7 is carried into the mounting position Pm2, and the component mounting on the board B7 is distributed to the mounting position Pm2. As a result, component mounting at the normal distribution point at the mounting position Pm2 is distributed to the mounting position Pm2 among the plurality of mounting target points Bp of the board B7, and this component mounting starts with respect to the board B7 at the mounting position Pm2. Will be done.

As shown in the column of operation A212 in FIG. 6, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B8, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A213 in FIG. 6, the substrate B8 stays at the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1. As a result, the component mounting at the normal distribution point at the mounting position Pm2 is distributed to the mounting position Pm1 among the plurality of mounting target points Bp of the board B8, and this component mounting starts with respect to the board B8 at the mounting position Pm1. Will be done.

As shown in the column of operation A214 of FIG. 6, when the component mounting distributed at the mounting position Pm3 is completed with respect to the board B5, the mounting completion time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A215 in FIG. 6, the substrate B5 is carried out from the mounting position Pm3. In parallel with this, the transfer to the downstream of the substrate B6 is started, and when the downstream end of the substrate B6 is carried into the mounting position Pm3, the carry-in time determination process is executed at the mounting position Pm3. As a result, as shown in the column of operation A215 in FIG. 6, the board B6 is carried into the mounting position Pm3, and the component mounting on the board B6 is distributed to the mounting position Pm3. As a result, component mounting at the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm3 among the plurality of mounting target points Bp of the board B6, and this component mounting starts with respect to the board B6 at the mounting position Pm3. Will be done.

As shown in the column of operation A214 of FIG. 6, when the component mounting distributed at the mounting position Pm2 is completed with respect to the board B7, the mounting completion time determination process is executed at the mounting position Pm2. As a result, as shown in the column of operation A215 in FIG. 6, the substrate B7 stays at the mounting position Pm2, and the component mounting on the substrate B7 is distributed to the mounting position Pm2. As a result, the component mounting at the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm2, and this component mounting is started with respect to the substrate B7 at the mounting position Pm2.

As shown in the column of operation A214 of FIG. 6, when the component mounting distributed at the mounting position Pm1 is completed with respect to the board B8, the mounting completion time determination process is executed at the mounting position Pm1. As a result, as shown in the column of operation A215 in FIG. 6, the substrate B8 stays at the mounting position Pm1, and the component mounting on the substrate B8 is distributed to the mounting position Pm1. As a result, component mounting at the normal distribution point at the mounting position Pm3 is distributed to the mounting position Pm1, and this component mounting is started with respect to the board B8 at the mounting position Pm3.

As shown in the column of operation A216 in FIG. 6, when the component mounting distributed to each of the mounting positions Pm3, Pm2, and Pm1 is completed for the boards B6, B7, and B8, the boards B6, B7, and B8 It is carried out from the transport unit 2 according to the determination process at the time of mounting completion / carry-in. In this way, the component mounting of the L sheets (8 sheets) on the boards B1 to B8 is completed.

In the embodiment configured as described above, the number M of the mounting positions Pm is "3", and the number L of the substrates B is "8". That is, component mounting for a plurality of mounting target points Bp provided on one board B is distributed among the three mounting positions Pm1, Pm2, and Pm3. Then, while transporting the one substrate B in the substrate transport direction X, the component mounting is stopped at the distributed mounting position Pm among the three mounting positions Pm1, Pm2, and Pm3, and the one is stopped at the mounting position Pm. The component mounting distributed to the mounting position Pm on the board B is executed. At this time, among the eight boards B1 to B8, the boards B1 and B2 whose transport order N in the board transport direction X is less than M are in the initial mounting mode (operations for the boards B1 and B2 in the operations A201 to A208). Parts are mounted in the normal mounting mode (operations for boards B3 to B6 in operations A201 to A216) for boards B3 to B6 in which the transfer order N is M or more and less than (LM + 2). Is executed. In the initial mounting mode, with respect to the substrate B1 in the transport order 1, the mounting position Pm3 on the downstream side of the second mounting position Pm2 counted from the upstream side of the board transport direction X among the three mounting positions Pm1, Pm2, and Pm3. The component mounting on the board B1 is selectively distributed. Therefore, the board B1 passes through the first and second mounting positions Pm1 and Pm2, and the component mounting of the board B1 at the plurality of mounting target points Bp of the board B1 is executed at the mounting position Pm3 on the downstream side of the second mounting position Pm2. Will be done. Further, regarding the substrate B2 of the transfer order 1, the substrate is placed at the mounting positions Pm2 and Pm3 on the downstream side of the first mounting position Pm1 counting from the upstream side of the substrate transfer direction X among the three mounting positions Pm1, Pm2 and Pm3. The component mounting on B2 is selectively distributed. Therefore, the board B1 passes through the first mounting position Pm1, and the components are mounted on the plurality of mounting target points Bp of the board B2 at the mounting positions Pm2 and Pm3 on the downstream side of the first mounting position Pm1. .. On the other hand, in the normal mounting mode, component mounting on the boards B3 to B6 is distributed to each of the three mounting positions Pm1, Pm2, and Pm3, and the boards B3 to B6 are sequentially placed in the three mounting positions Pm1, Pm2, and Pm3. After stopping, the components are sequentially mounted on the plurality of mounting target points Bp of the boards B3 to B6 at each of the three mounting positions Pm1, Pm2, and Pm3.

Therefore, for the three boards having the first transfer order among the eight boards, component mounting is performed as follows. That is, the first board B1 is transported to the third mounting position Pm3 counting from the upstream side of the board transport direction X by the initial mounting mode, and the second board B2 is transported to the board transport direction X by the initial mounting mode. The third substrate B3 is conveyed to the second mounting position Pm2 counting from the upstream side of the substrate, and the third substrate B3 is conveyed to the first mounting position Pm1 counting from the upstream side in the substrate conveying direction X by the normal mounting mode. In this way, the boards B3, B2, and B1 can be conveyed to the three mounting positions Pm1, Pm2, and Pm3, respectively, and component mounting on the boards B3, B2, and B1 can be started at the respective mounting positions Pm1, Pm2, and Pm3. it can. This makes it possible to suppress a decrease in the operating rate of the component mounting system 1.

Further, the transport unit 2 further has standby positions Pw1 and Pw2 arranged between the mounting positions Pm1, Pm2, and Pm3 adjacent to each other in the substrate transport direction X. Then, in the substrate transport direction X, among the three mounting positions Pm1, Pm2, and Pm3, the mounting positions Pm1 and Pm2 other than the most downstream mounting positions Pm3 are component-mounted at the adjacent mounting positions Pm2 and Pm3 on the downstream side. When executing, the board B for which the distributed component mounting is completed is carried out to the standby positions Pw1 and Pw2 on the downstream side, and the board B for which the distributed component mounting is not completed is carried in from the upstream side in the board transport direction X. (Boards B2, B4, etc. of operations A204 to A205). In such a configuration, at the mounting positions Pm1 and Pm2 other than the most downstream mounting positions Pm3, the distributed board B for which component mounting has been completed is promptly carried out to the standby positions Pw1 and Pw2, and the next board B for which component mounting is not completed is promptly carried out. Is carried in from the upstream side of the substrate transport direction X. As a result, it is possible to more effectively suppress a decrease in the operating rate of the component mounting system 1.

Further, in the normal mounting mode, the difference in the number of mounting target points Bp on which the component Wp is mounted is one or less at each of the mounting positions Pm1, Pm2, and Pm3 (in the above embodiment, the difference in the number is one or less). The component mounting on the substrate B is distributed to each of the three mounting positions Pm1, Pm2, and Pm3 (which is zero). On the other hand, in the initial mounting mode, with respect to the substrate B1 in the transport order 1, the third mounting position Pm3 counting from the upstream side of the board transport direction X is the first in the normal mounting mode counting from the upstream side of the board transport direction X. The component mountings distributed to the third mounting positions Pm1, Pm2, and Pm3 are distributed. In such a configuration, if the normal mounting mode is executed for the substrate B1 whose transfer order 1 is less than M, the mounting positions Pm1, Pm2, and Pm3 from the first to the third from the upstream side in the substrate transfer direction X The component mounting distributed to is distributed to the third mounting position Pm3 in the initial mounting mode. That is, in the initial mounting mode, the component mounting at the mounting positions Pm1 and Pm2 on the upstream side of the third mounting position Pm3 is omitted for the board B1 in the transport order 1, but this component mounting is performed at the third mounting position Pm3. It is possible to execute it reliably with.

Further, in the initial mounting mode, with respect to the board B2 in the transport order 2, the second mounting position Pm2 counted from the upstream side of the board transport direction X is the first in the normal mounting mode counting from the upstream side of the board transport direction X. The component mountings distributed to the second mounting positions Pm1 and Pm2 are distributed. In such a configuration, if the normal mounting mode is executed for the substrate B2 whose transfer order 2 is less than M, it is distributed to the first to second mounting positions Pm1 and Pm2 counting from the upstream side of the substrate transfer direction X. The component mounting to be performed is distributed to the second mounting position Pm2 in the initial mounting mode. That is, in the initial mounting mode, although component mounting at the mounting position Pm1 on the upstream side of the second mounting position Pm3 is omitted for the board B2 in the transport order 2, this component mounting is ensured at the second mounting position Pm2. It is possible to execute it.

Further, the control unit 100 relates to the final mounting mode (for the substrates B7 and B8 in the operations A209 to A216) for the substrates B7 and B8 having the transfer order N (LM + 2) or more among the eight substrates B1 to B8. Execute component mounting in operation). That is, in this final mounting mode, with respect to the board B7 in the transport order 7, the mounting positions Pm1, Pm2 from the first to the second of the three mounting positions Pm1, Pm2, and Pm3 counting from the upstream side of the board transport direction X. The component mounting on the board B7 is selectively distributed, and the component mounting on the plurality of mounting target points Bp of the board B7 is executed at the first to second mounting positions Pm1 and Pm2. Therefore, in the board transport direction X, even if component mounting is being executed at the mounting position Pm3 on the downstream side of the second, the first to second mounting positions Pm1 and Pm2 are operated, and the transport order N is 7. Component mounting can be efficiently performed on the numbered board B7. Further, with respect to the board B8 of the transfer order 8, component mounting on the board B8 is selectively distributed to the first mounting position Pm1 of the three mounting positions Pm1, Pm2, and Pm3 counting from the upstream side of the board transfer direction X. Then, at the first mounting position Pm1, component mounting on the plurality of mounting target points Bp of the board B8 is executed. Therefore, in the substrate transport direction X, even if component mounting is being executed at the mounting positions Pm2 and Pm3 on the downstream side of the first, the first mounting position Pm1 is operated and the board B8 having the transport order N of No. 8 is operated. The component mounting can be performed efficiently. As a result, it is possible to more effectively suppress a decrease in the operating rate of the component mounting system.

Further, in the final mounting mode, with respect to the board B7 in the transfer order 7, the second mounting position Pm2 counting from the upstream side of the board transfer direction X is the second from the upstream side of the board transfer direction X in the normal mounting mode. The component mountings distributed to the third mounting positions Pm2 and Pm3 are distributed. In such a configuration, if the normal mounting mode is executed for the board B7 in the transfer order 7, the components distributed to the second to third mounting positions Pm2 and Pm3 counting from the upstream side of the board transfer direction X. The mounting is distributed to the second mounting position Pm2 in the final mounting mode. That is, in the final mounting mode, although the component mounting at the mounting position Pm3 on the downstream side of the second mounting position Pm2 is omitted for the board B7 in the transport order 7, this component mounting is surely performed at the second mounting position Pm2. It is possible to execute it.

Further, in the final mounting mode, with respect to the board B8 in the transport order 8, the first mounting position Pm1 counting from the upstream side of the board transport direction X is the first counting from the upstream side of the board transport direction X in the normal mounting mode. The component mountings distributed to the third mounting positions Pm1, Pm2, and Pm3 are distributed. In such a configuration, if the normal mounting mode is executed for the board B8 in the transport order 8, the mounting positions Pm1, Pm2, and Pm3 are distributed to the first to third mounting positions counting from the upstream side of the board transport direction X. The component mounting is distributed to the first mounting position Pm1 in the final mounting mode. That is, in the final mounting mode, the component mounting at the mounting positions Pm2 and Pm3 on the downstream side of the first mounting position Pm1 is omitted for the board B8 in the transport order 8, but this component mounting is performed at the first mounting position Pm1. It is possible to execute it reliably with.

By the way, during the execution of the above-mentioned first example or the second example, the progress of component mounting at any mounting position Pm may be delayed from the schedule. Therefore, as shown below, it may be configured to recover from such a delay in progress.

FIG. 7 is a flowchart showing an example of a component mounting process capable of executing recovery of the progress of component mounting, and FIG. 8 is a flowchart showing an example of recovery necessity determination in the component mounting process shown in FIG. 7. FIG. Is a diagram schematically showing an example of an operation executed according to the flowcharts of FIGS. 7 and 8. As shown in FIG. 9, in the example shown here, the transport unit 2 is provided with two mounting positions Pm1 and Pm2.

The control unit 100 executes the operations of FIGS. 9 and 10 by executing the flowcharts of FIGS. 7 and 8 for the mounting positions Pm1 and Pm2, respectively. That is, as shown in FIG. 7, when the component mounting process is started, the substrate B is carried into the mounting position Pm (step S301) and the component mounting is distributed to the mounting position Pm in the same manner as in the first example described above. (Step S302). Then, when the component mounting is completed at any of the mounting positions Pm (step S303), the recovery necessity determination is executed for each mounting position Pm (step S304, FIG. 8).

In the example shown in FIG. 9, up to operation A103 is executed in the same manner as in the first example described above. That is, at the mounting position Pm2, the board B1 on which the component Wp is mounted is carried into the normal distribution point (upstream side half) to the mounting position Pm1, and at the standby position Pw, the normal distribution point (upstream side) to the mounting position Pm1. The board B2 on which the component Wp is mounted stands by (half), and the board B3 is carried into the mounting position Pm1. Further, at the mounting position Pm2, component mounting is distributed to the normal distribution point (downstream half) to the mounting position Pm2 among the plurality of mounting target points Bp of the board B1, and at the mounting position Pm1, a plurality of mountings of the board B3 are distributed. Of the target points Bp, the component mounting at the normal distribution point (upstream half) at the mounting position Pm1 is distributed.

From this state, the result of starting component mounting at the mounting positions Pm1 and Pm2 is shown in the column of operation A111 in FIG. At the mounting position Pm2, component mounting on the board B1 is completed. Therefore, when the component mounting is completed, the recovery necessity determination in step S304 (FIG. 8) is executed for each of the mounting positions Pm1 and Pm2.

Specifically, with respect to the mounting position Pm2, it is determined whether or not the substrate B exists downstream of the mounting position Pm2 (step S401). Since the substrate B does not exist downstream of the mounting position Pm2 (“NO” in step S401), it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm2. Since there is no delay in the progress (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG.

That is, in step S304 of FIG. 7, it branches to "unnecessary" and the mounting completion determination process (FIG. 3) is executed for each mounting position Pm2 (step S306). As a result, as shown in the column of operation A112, the substrate B1 is carried out from the mounting position Pm2, and the board B2 is carried in from the standby position Pw to the mounting position Pm2. Further, the component mounting at the normal distribution point at the mounting position Pm2 is distributed to the mounting position Pm2 among the plurality of mounting target points Bp of the board B2.

Further, with respect to the mounting position Pm1, it is determined whether the substrate B exists downstream of the mounting position Pm1 (step S401). Since the board B2 at the standby position Pw is conveyed to the mounting position Pm2 together with the removal of the board B1 (“NO” in step S401), it is determined in step S402 whether there is a delay in the progress of component mounting at the mounting position Pm1. To. At the mounting position Pm1, there is a delay in the progress of component mounting on the board B3 (“YES” in step S402), so in step S403, is the remaining number of mounting points equal to or greater than the threshold value (for example, half the number of normal distribution points)? Is judged. When the remaining number of mounting points is less than the threshold value (when “NO” in step S403), it is determined in step S404 that recovery is unnecessary. On the other hand, as in the example here, when the remaining number of mounting points is equal to or greater than the threshold value (when “YES” in step S403), it is determined in step S405 that recovery is necessary, and the process returns to the flowchart of FIG.

That is, in step S304 of FIG. 7, the component mounting is redistributed by branching to "necessary" (step S305). Specifically, for the substrate B3 that stops at the mounting position Pm1, a part (here, half) of the normal distribution points at the mounting position Pm1 is moved from the mounting position Pm1 to the mounting position Pm2. Then, the mounting completion determination process (FIG. 3) is executed for the mounting position Pm1 (step S306). As a result, as shown in the column of operation A112, the substrate B3 stays at the mounting position Pm1. Further, at the mounting position Pm1, component mounting is distributed to half of the normal distribution points at the mounting position Pm1 among the plurality of mounting target points Bp of the board B3, and the process returns from step S306 to step S303.

As shown in the column of operation A113 in FIG. 9, when the component mounting distributed at the mounting position Pm1 is completed with respect to the substrate B3 (step S303), the recovery necessity determination is executed for each mounting position Pm1 and Pm2. Since there is no delay in the progress of component mounting at any of the mounting positions Pm1 and Pm2 (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG. Then, each of the mounting positions Pm1 and Pm2 is branched to "unnecessary" in step S304, and the "mounting completion time determination process" is executed in step S306. As a result, as shown in the column of operation A114 in FIG. 9, the substrate B3 is carried out to the standby position Pw, and the board B4 is carried out to the mounting position Pm1. Further, at the mounting position Pm1, among the plurality of component Wp of the substrate B4, the component mounting at the normal distribution point at the mounting position Pm1 is distributed.

As shown in the column of operation A115 in FIG. 9, when the component mounting distributed at the mounting position Pm2 is completed with respect to the substrate B2 (step S303), the recovery necessity determination is executed for each mounting position Pm1 and Pm2. Since there is no delay in the progress of component mounting at any of the mounting positions Pm1 and Pm2 (“NO” in step S402), it is determined in step S404 that recovery is unnecessary, and the process returns to the flowchart of FIG. Then, each of the mounting positions Pm1 and Pm2 is branched to "unnecessary" in step S304, and the "mounting completion time determination process" is executed in step S306. As a result, as shown in the column of operation A116 in FIG. 9, the substrate B3 is carried into the mounting position Pm2. Further, at the mounting position Pm2, of the plurality of mounting target points Bp of the board B3, half of the normal distribution point to the mounting position Pm2 and the normal distribution point to the mounting position Pm1 copied in the previous step S305 are distributed. The points are distributed. Therefore, as shown in the column of operation A117 in FIG. 9, at the mounting position Pm2, the component Wp (hatched component Wp) is the substrate B3 with respect to a distribution point that is half of the normal distribution point to the mounting position Pm1. Is implemented for.

As described above, the control unit 100 has one of the M mounting positions Pm1 and Pm2 according to the progress of component mounting at at least one mounting position Pm1 of one mounting position Pm1 and the other mounting position Pm2. Adjust the distribution of component mounting between the mounting position Pm1 and another mounting position Pm2. In such a configuration, when the progress of component mounting at one mounting position Pm1 is slower than planned, for example, the component mounting scheduled to be distributed to one mounting position Pm1 can be distributed to other mounting positions Pm2. This makes it possible to balance the progress of component mounting at the mounting positions Pm1 and Pm2.

As described above, in the present embodiment, the component mounting system 1 corresponds to an example of the "component mounting system" of the present invention, the transport section 2 corresponds to an example of the "transport section" of the present invention, and the mounting sections 4, 4A, 4B corresponds to an example of the "mounting unit" of the present invention, and the control unit 100 corresponds to an example of the "control unit" of the present invention, and the mounting conveyors 22, 24, 27 arranged at the mounting positions Pm1, Pm2, and Pm3. Corresponds to an example of the "mounting stage" of the present invention, the standby conveyors 23 and 26 arranged at the standby positions Pw, Pw1 and Pw2 correspond to a logical picture of the "standby stage" of the present invention, and the substrate transport direction X is It corresponds to an example of the "board transport direction" of the present invention.

The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, the number M of the mounting positions Pm and the number L of the substrates B to be sequentially transported in the substrate transport direction X can be appropriately changed.

Further, the flowcharts of FIGS. 7 and 8 are applicable not only when the number M of the mounting positions Pm is 2, but also when the number M is 3 or more.

Further, the above-mentioned component mounting system 1 was composed of one component mounting machine 10. However, for example, a plurality of component mounting machines 10 each having a single mounting position may be arranged in the transport direction X to form the component mounting system 1. In such a configuration, the transport unit 2 stops and fixes the board B at the mounting position Pm of each component mounting machine 10 while sequentially transporting the board B to the plurality of component mounting machines 10, and each component mounting machine 10 , The component Wp is mounted on the substrate B fixed at the mounting position Pm.

1 ... Parts mounting system 2 ... Conveyor units 22, 24, 27 ... Mounting conveyors 23, 26 ... Standby conveyors 4, 4A, 4B ... Mounting units 100 ... Control units Pm1, Pm2, Pm3 ... Mounting positions Pw, Pw1, Pw2 ... Standby Position X: Substrate transfer direction

Claims (7)

A transport unit having M mounting stages (M is an integer of 2 or more) arranged in the substrate transport direction and sequentially transporting L (L is an integer larger than M) boards in the substrate transport direction.
M mounting parts provided corresponding to the M mounting stages and capable of mounting the same type of components on a board stopped at the corresponding mounting stages.
The component mounting for a plurality of mounting target points provided on one board is distributed among the M mounting stages, and the M mounting is carried while the one board is transported in the board transport direction by the transport unit. Control in which component mounting is stopped at the mounting stage to which component mounting is distributed among the stages, and component mounting distributed to the mounting stage corresponding to the one board stopped at the mounting stage corresponding to the mounting unit is executed. With a department
The mounting stage transports the board on which the distributed components have been mounted to the downstream side in the board transport direction.
The control unit executes component mounting in the initial mounting mode on a board in which the transfer order N (N is an integer of 1 or more) less than M among the L substrates in the substrate transfer direction, and the transfer is performed. For boards with an order N of M or more, component mounting is performed in normal mounting mode, and
In the initial mounting mode, with respect to the boards in the transport order N, the boards are placed on the mounting stages on the downstream side of the (MN) th mounting stage from the upstream side in the board transport direction among the M mounting stages. The component mounting to the (MN) th mounting stage is selectively distributed, and the board passes through the mounting stages up to the (MN) th mounting stage, and the mounting stage on the downstream side of the (MN) th mounting stage is the mounting stage of the board. Component mounting to multiple mounting target points is executed,
In the normal mounting mode, component mounting on the board is distributed to each of the M mounting stages, the boards are stopped in order at the M mounting stages, and the boards are sequentially stopped at each of the M mounting stages. A component mounting system in which component mounting is performed on the plurality of mounting target points on the board. The transport unit further has a standby stage arranged between mounting stages adjacent to each other in the substrate transport direction.
In the substrate transport direction, among the M mounting stages, the mounting stages other than the most downstream mounting stage complete the distributed component mounting when the component mounting is executed at the adjacent mounting stages on the downstream side. The component mounting system according to claim 1, wherein the board is carried out to a standby stage on the downstream side, and the distributed board for which component mounting is not completed at the mounting target point is carried in from the upstream side in the board transport direction. In the normal mounting mode, component mounting on the board is distributed to each of the M mounting stages so that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is one or less. Being done
In the initial mounting mode, with respect to the substrates of the transfer order N, the (MN + 1) th mounting stage counted from the upstream side in the substrate transfer direction is counted from the upstream side in the substrate transfer direction in the normal mounting mode. The component mounting system according to claim 1 or 2, wherein the component mounting distributed to the first to (MN + 1) th mounting stages is distributed. The control unit executes component mounting in the final mounting mode on the boards having the transport order N of (LM + 2) or more among the L boards.
In the final mounting mode, with respect to the board of the transport order N, the components to the board are placed on the first to (L-N + 1) mounting stages of the M mounting stages counting from the upstream side in the board transport direction. One of claims 1 to 3, wherein the mounting is selectively distributed, and component mounting is executed at the plurality of mounting target points of the board in the first to the (L-N + 1) th mounting stages. The component mounting system described in. In the normal mounting mode, component mounting on the board is distributed to each of the M mounting stages so that the difference in the number of mounting target points on which components are mounted in each of the mounting stages is one or less. Being done
In the final mounting mode, with respect to the boards in the transport order N, the (L-N + 1) th mounting stage counted from the upstream side in the board transport direction is counted from the upstream side in the board transport direction in the normal mounting mode. The component mounting system according to claim 4, wherein the component mounting distributed to the (L-N + 1) th to Mth mounting stages is distributed. The control unit is located between one mounting stage and the other mounting stage according to the progress of component mounting of at least one of the M mounting stages, one mounting stage and the other mounting stage. The component mounting system according to any one of claims 1 to 5, which adjusts the distribution of component mounting. A step of sequentially transporting L sheets (L is an integer larger than M) in the substrate transport direction by a transport unit having M mounting stages (M is an integer of 2 or more) arranged in the substrate transport direction.
The component mounting for a plurality of mounting target points provided on one board is distributed among the M mounting stages, and the M mounting is carried while the one board is transported in the board transport direction by the transport unit. It is provided with a step of stopping the component mounting on the mounting stage to which the component mounting is distributed among the stages, and executing the component mounting distributed to the mounting stage on the one board stopped at the mounting stage.
Of the L boards, the board in which the transfer order N (N is an integer of 1 or more) is less than M is executed in the initial mounting mode, and the transfer order N is M or more. For the board of, component mounting is executed in normal mounting mode,
In the initial mounting mode, with respect to the boards having the transport order N, the boards are placed on the mounting stages on the downstream side of the (MN) th mounting stage from the upstream side in the board transport direction among the M mounting stages. The component mounting to the (MN) th mounting stage is selectively distributed, and the substrate passes through the (MN) th mounting stage, and the mounting stage on the downstream side of the (MN) th mounting stage is the mounting stage of the board. Component mounting to multiple mounting target points is executed,
In the normal mounting mode, component mounting on the board is distributed to each of the M mounting stages, the boards are stopped in order at the M mounting stages, and the boards are sequentially stopped at each of the M mounting stages. A component mounting method in which component mounting is performed on the plurality of mounting target points of the board.

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