JP2009224764A - Mounting condition determining method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting condition determining method of quantitatively determining which mode between a synchronous mode and an asynchronous mode is suitable before a component mounter equipped with a plurality of conveyance conveyors disposed in parallel starts producing component mounted substrates. <P>SOLUTION: The mounting condition determining method includes: an acquisition step (S1) of obtaining mounting information including information related to consecutiveness of component mounting operations scheduled to be performed in parallel; a calculation step (S2) of calculating information showing production efficiencies when the component mounter operates respectively in the synchronous mode wherein a substrate having been mounted with components is carried out synchronously among the conveyance conveyors and in the asynchronous mode wherein a substrate is carried in and the substrate having been mounted with the components is carried out independently by the conveying conveyors; and a selection step (S3) of selecting a production mode of higher production efficiency between the synchronous mode and asynchronous mode from the calculated information indicating the production efficiencies. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting condition determination method for determining a mounting condition for a component mounter including a plurality of transport conveyors arranged in parallel, and more particularly to processing related to selection of a production mode that is a kind of mounting condition.

  2. Description of the Related Art Conventionally, there is a component mounter as a device for mounting an electronic component (hereinafter simply referred to as “component”) on a substrate such as a printed wiring board.

  In recent years, there is a component mounting machine that includes a plurality of transfer conveyors arranged in parallel, and performs component mounting in parallel with a substrate transferred by each of these transfer conveyors. That is, there is a component mounter that has a plurality of lanes that are transport paths for mounting components on a board and executes component mounting operations in parallel.

  By using a component mounting machine having a plurality of lanes, it is possible to increase the number of component mounting boards produced per unit area compared to using a component mounting machine having only one lane.

  Further, for example, when focusing on one mounting head of a component mounting machine having a plurality of lanes, when component mounting is finished on a board on a certain lane, the other lane is not waited for the next board on that lane. The mounting of components on the upper board can be started.

  That is, it is possible to reduce the time consumed for transporting the substrate. In other words, the waiting time of the mounting head can be reduced.

  A technology related to such a component mounter having a plurality of lanes is also disclosed. For example, a technique for a production line in which a plurality of component mounters having two lanes are connected is disclosed (for example, see Patent Document 1).

  According to this technique, whether to use each of the two lanes of each component mounting machine as a mounting stage for mounting components or as a bypass for performing only conveyance is controlled by a program.

  This makes it possible for the subsequent substrate to pass the preceding substrate without providing a bypass-dedicated substrate transport mechanism, and it is possible to cope with various mounting forms.

  In addition, in a component mounter having two lanes, a technique for matching the order of board loading and the order of unloading is also disclosed (for example, see Patent Document 2).

  According to this technique, a distribution conveyor that distributes a board to two lanes is arranged before and after the component mounter. Also, the carry-out order when the carry-out sorting conveyor carries the board downstream is determined according to the board-loading order of the board to the component mounting machine by the carry-out sorting conveyor.

As a result, the substrate transfer order in the production lot can be maintained according to the principle of first-in / first-out, and the product history can be tracked correctly.
JP 2003-204191 A JP 2003-204192 A

  The production mode when producing a component mounting board with a component mounting machine having a plurality of lanes having such characteristics is roughly divided into two according to the timing of board transportation in each of the plurality of lanes.

  For example, a component mounter having a plurality of lanes can be operated so as to synchronize the carry-out of the substrate after component mounting between the lanes. Such a production mode is called, for example, a synchronous mode, and can suppress the occurrence of intermediate inventory.

  FIG. 33A is a diagram for explaining a synchronization mode in a component mounter having two lanes.

  The component mounting machine shown in FIG. 33 (A) includes two transport conveyors arranged in parallel, and includes two mounting heads facing each other with the transport conveyor interposed therebetween. In addition, two lanes for component mounting are formed by each conveyor, which are a first lane and a second lane, respectively.

  When the substrate is transported to the substrate placement area in each of the first lane and the second lane, components are mounted on each substrate by the two mounting heads. Further, when the component mounting on these two boards is completed, the two boards are carried out simultaneously. That is, two substrates are treated as if they were one substrate.

  For example, it is assumed that one board unit is completed by combining a plurality of types of component mounting boards. In this case, by producing these plural types of component mounting boards in parallel in the synchronous mode, it is possible to suppress the occurrence of intermediate inventory at the production site of the board unit.

  Also, unlike the above-mentioned synchronous mode, when component mounting on a board on a certain lane is completed, the board on which the component is mounted is taken out regardless of whether or not the component mounting on the board on another lane is completed. At the same time, the component mounter can be operated to carry in the next board. Such a production mode is called, for example, an asynchronous mode.

  FIG. 33B is a diagram for explaining the asynchronous mode in the component mounter having two lanes.

  The component mounter shown in FIG. 33 (B) includes two lanes and two mounting heads as in the component mounter shown in FIG. 33 (A).

  However, in the asynchronous mode, as shown in FIG. 33 (B), for example, while the components are mounted on the board on the second lane by two mounting heads, in the first lane, the component mounting board is unloaded, An unmounted board is carried in.

  When the mounting of the component on the board on the second lane is completed, the board is immediately carried out, and the mounting of the component by the two mounting heads on the board on the first lane is started.

  Here, in the synchronous mode, component mounting is started from the point in time when the two boards arrive at their board placement areas. Therefore, it is possible to operate the two mounting heads so that components are mounted only on the boards on the side lanes close to each other. The production mode in which the two mounting heads are operated in this way is called an independent mode, for example.

  Further, in the asynchronous mode, the substrates on each lane are transported independently, so that it is rare that the substrates arrive together in each substrate placement area.

  Therefore, in the case of the asynchronous mode, from the viewpoint of production efficiency, it is possible to cause the component mounting machine to execute a so-called alternating driving mode in which components are mounted alternately by two mounting heads in the order of arrival in the substrate mounting area for each substrate. It is common.

  Thus, when two mounting heads perform alternating hitting, the movement distance of each mounting head in the Y-axis direction is smaller than when each mounting head mounts a component only on the board on the side lane close to itself. become longer.

  The movement distance of the mounting head is an important factor that directly affects the production tact (production time) per substrate. Therefore, the production tact is generally shorter in the synchronous mode in which components are mounted on only the board on the side lane close to the mounting head than in the asynchronous mode.

  Therefore, when component mounting is performed in parallel on a large number of boards, it is considered that it is advantageous to select the synchronous mode because the throughput increases.

  However, the component mounting operation in any lane may be stopped due to some factors while components are sequentially mounted on a plurality of boards. The effect on the production efficiency due to the suspension of the component mounting work in each lane is greater in the synchronous mode than in the asynchronous mode.

  FIG. 34 is a diagram for explaining a difference in influence on production efficiency due to suspension of the mounting work in the synchronous mode and the asynchronous mode.

  In the synchronous mode, after the component mounting on the board on each lane is completed, the board after the component mounting is carried out. Therefore, as shown in FIG. 34, for example, when the component mounting in the second lane is stopped due to the replacement of the component cassette, the board on at least the first lane is not carried out. That is, the component mounting work in the first lane stops.

  However, in the asynchronous mode, the component mounting work is executed independently in each lane. Therefore, as shown in FIG. 34, even when the second lane is stopped, the component mounting work is continued in the first lane. That is, the asynchronous mode is a production mode that is resistant to failures.

  As described above, in the synchronous mode, it is possible to reduce the intermediate inventory, and it is advantageous in that the throughput can be made larger than that in the asynchronous mode. However, it can be said that the asynchronous mode is more advantageous in consideration of the fact that component mounting work in any lane stops for some reason.

  Therefore, before starting the production of a component mounting board, when it is determined which of the synchronous mode and the asynchronous mode is advantageous from the viewpoint of production efficiency, it is necessary to determine on a case-by-case basis.

  Therefore, in the past, such determination is mostly dependent on, for example, a rule of thumb of a skilled operator. This leads to a situation where the judgment is different when the operator changes.

  Such a situation can be a major factor that causes a decrease in production efficiency, contrary to the requirement to produce a large number and types of component mounting boards in the shortest possible time.

  The conventional technique described in Patent Document 1 is a technique that makes it possible to change the order of substrates transported on two lanes while a production line is operating in, for example, an asynchronous mode.

  On the other hand, in the conventional technique described in Patent Document 2, for example, when a component is mounted on two types of substrates by a component mounter, the substrate can be easily traced by realizing a mounting mode close to the synchronous mode by a sorting conveyor. Technology.

  Therefore, the above two conventional technologies are technologies that can be involved in either the synchronous mode or the asynchronous mode, respectively, and can facilitate the production management. However, it is not a solution to the problem of whether to select a synchronous mode or an asynchronous mode.

  In the present invention, in consideration of the above-described conventional problems, either a synchronous mode or an asynchronous mode is appropriate before a component mounting machine including a plurality of conveyors arranged in parallel starts production of a component mounting board. It is an object to provide a mounting condition determination method that quantitatively determines whether or not there is.

  In order to achieve the above object, the mounting condition determination method of the present invention includes a plurality of transport conveyors arranged in parallel, and performs component mounting operations on the boards transported to the plurality of transport conveyors in parallel. A mounting condition determination method for determining mounting conditions for a component mounter capable of acquiring acquisition information including information related to continuity of each component mounting work scheduled to be performed in parallel, and Using the mounting information acquired in the acquisition step, the component mounter synchronizes the transfer of the board after mounting the components between the respective conveyors, and the board transfer and the board transfer after mounting the components. A calculation step for calculating information indicating production efficiency when operating in each of the asynchronous modes to be performed independently on each conveyor, and the calculation step The information indicating the production efficiency calculated Te, and a selection step of selecting the production mode having higher production efficiency of the synchronous mode and the asynchronous mode.

  As described above, according to the mounting condition determination method of the present invention, mounting information including information related to continuity of component mounting work is acquired. Furthermore, the production mode with the higher production efficiency of the synchronous mode and the asynchronous mode is selected from the acquired mounting information.

  In other words, the mounting condition determination method of the present invention can select a production mode in which production efficiency is advantageous based on the acquired objective fact by quantitative judgment.

  Thereby, before starting the production of the component mounting board, it is possible to determine whether the synchronous mode or the asynchronous mode is appropriate as the production mode of the component mounting machine without depending on the operator.

  Further, in the calculation step, the stop time of each component mounting work scheduled to be performed in parallel in the synchronous mode and the asynchronous mode, using information related to the continuity included in the mounting information. It is also possible to calculate a predicted stop time that is a predicted value of and to calculate information indicating the production efficiency of each of the synchronous mode and the asynchronous mode using the calculated predicted stop time.

  In this way, the production efficiency of each production mode may be obtained using the predicted stoppage time that can be calculated from the acquired information. For example, for each production mode, the production efficiency value corresponding to the predicted stop time (for example, production can be performed by stopping from the production efficiency value for non-stop (for example, the number of production per unit time)). By subtracting (the number of sheets to be lost), information indicating the production efficiency of each production mode is obtained.

  In addition, the component mounter includes a replaceable component supply unit that stores a plurality of types of components. In the acquisition step, one board is used in each component mounting operation scheduled to be performed in parallel. Obtaining the mounting information including the number of parts used for each type of parts mounted around and the number of stored parts of each of the plurality of part supply means as information related to the continuity, and in the calculating step The predicted stop time due to component shortage may be calculated using the number of uses and the number of stored components.

  That is, by using information such as the number of parts used, a predicted stop time due to a part shortage, for example, a predicted value of a stop time associated with replacement of a part supply means when a part shortage occurs, is calculated. Information indicating the production efficiency of each production mode may be calculated from the value.

  In this way, for example, when using a component tape that cannot be joined together while the component mounter is in operation, select a production mode suitable for the component mounter under that situation. Can do.

  Further, in the obtaining step, the mounting information including an adsorption rate or a mounting rate of components mounted on a substrate in each component mounting operation scheduled to be performed in parallel as information related to the continuity is acquired, In the calculating step, the predicted stop time due to the suction error or the mounting error may be calculated using the suction rate or the mounting rate.

  That is, a predicted stop time caused by a suction error or mounting error, for example, a predicted value of a stop time associated with post-processing such as disposal of parts when a suction error or mounting error occurs, is calculated from each predicted value. Information indicating the production efficiency in the production mode may be calculated.

  In this way, by using information obtained from past results of component suction rate and mounting rate, it is possible to select a production mode suitable for a component mounting machine in a situation where suction or mounting error occurs. it can.

  Further, in the obtaining step, the mounting information including information indicating an operation rate of the component mounting machine corresponding to each of the component mounting operations performed in parallel by the component mounting machine is acquired as information related to the continuity. In the calculation step, information indicating the production efficiency in each of the synchronous mode and the asynchronous mode may be calculated using information indicating the operation rate included in the mounting information.

  Thereby, for example, when there is some problem in stopping the component mounting operation in the component mounter itself, it is possible to select a production mode for obtaining better production efficiency with such a component mounter.

  The component mounter further includes two mounting heads and two component supply units that supply components to the two mounting heads. In the selection step, when the synchronization mode is selected, the component mounting is performed. As a production mode to be executed by the machine together with the synchronous mode, each of the two mounting heads is closest to a component supply unit that is a supply source of components to each mounting head of the plurality of conveyors. When the independent mode in which components are mounted only on the board conveyed by the conveyor is selected and the asynchronous mode is selected, the component mounting machine further includes the two mounting heads as a production mode to be executed together with the asynchronous mode. Even if the alternate driving mode for alternately mounting components on the board conveyed by the plurality of conveyors is selected. There.

  Thereby, two types of production modes are selected in a combination that is advantageous in terms of production efficiency.

  Further, in the obtaining step, the mounting information including data related to a board or a component used in the scheduled component mounting operation is acquired, and the mounting condition determining method further includes the alternating mode and the independent mode. Including a determination step of determining which production mode is suitable for the scheduled component mounting operation using the mounting information acquired in the acquisition step. In the determination step, the selection step includes: When the synchronous mode is selected, it is determined whether or not the component mounter can be operated in the independent mode. When it is determined that the component mounter can be operated in the independent mode, the synchronous mode is determined. Is determined to be suitable for the scheduled component mounting operation and cannot be operated in the independent mode. If it is determined, overturned selection results in the selection step may be to determining that the asynchronous mode is suitable for the component mounting operations that are the expected.

  As a result, even if it is determined that the synchronous mode is appropriate, if the independent mode cannot be executed, the asynchronous mode is selected.

  In other words, when the component mounter cannot be operated in the independent mode, in other words, when the component mounter can be operated only in the alternating mode, the asynchronous mode advantageous from the viewpoint of production efficiency is selected. Selected.

  Furthermore, the present invention can be realized as a mounting condition determining apparatus that executes characteristic processing steps in the mounting condition determining method of the present invention. Further, the present invention can be realized as a component mounter that includes the mounting condition determination device of the present invention and performs component mounting according to the determination.

  Furthermore, the present invention can be realized as a program for causing a computer to execute the characteristic processing steps in the mounting condition determination method of the present invention, or can be realized as a storage medium such as a CD-ROM storing the program, It can also be realized as an integrated circuit. The program can also be distributed via a transmission medium such as a communication network.

  The present invention provides a mounting condition for quantitatively determining which one of a synchronous mode and an asynchronous mode is appropriate before a component mounter including a plurality of conveyors arranged in parallel starts production of a component mounting board. A determination method can be provided.

  According to the present invention, for example, a production mode with high production efficiency is selected from the synchronous mode and the asynchronous mode for one component mounting machine including a plurality of conveyors and a production line in which a plurality of these component mounting machines are connected. The

  Furthermore, the selection of the production mode by the mounting condition determination method of the present invention can be performed before the start of the production of the component mounting board. Thereby, before the said start, according to the selected production mode, preparations, such as matching with the kind of board | substrate and a conveyance conveyor, and the allocation of the components to a component supply part, can be started, and production can be started. .

  Therefore, there is no need to change, for example, from the synchronous mode to the asynchronous mode or vice versa during the production of the component mounting board. That is, it is not necessary to perform complicated control such as changing the timing of loading the board into the component mounting machine during the production of the component mounting board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
First, the structure of the component mounting machine 100 in Embodiment 1 of this invention is demonstrated using FIGS.

  FIG. 1 is a schematic diagram showing an outline of a component mounter 100 according to the first embodiment.

  As shown in FIG. 1, the component mounter 100 according to the first embodiment includes a plurality of transport conveyors arranged in parallel, and performs component mounting operations on the boards transported to the plurality of transport conveyors in parallel. It is a component mounter that can

  Specifically, the component mounting machine 100 includes two lanes that are transport paths for mounting components on a board by including two transport conveyors. The component mounter 100 can perform component mounting on each of the boards on these two lanes in parallel.

  FIG. 2 is a schematic top view showing the lane configuration of component mounter 100 in the first embodiment.

  As shown in FIG. 2, the component mounting machine 100 has a mounting head 104 and a mounting head 107 that face each other as a mechanism for mounting a component on each substrate that is conveyed, and components that supply components to these. A supply unit 106 and a component supply unit 109 are provided.

  Furthermore, the component mounting machine 100 includes a first conveyor 101 and a second conveyor 102 arranged in parallel between the component supply unit 106 and the component supply unit 109.

  As shown in FIG. 2, in the component mounter 100, the first conveyor 101 forms a front (F) lane that is a lane on the front side (lower side in FIG. 2). Further, the second conveyor 102 forms a rear (R) lane which is a rear lane (upper side in FIG. 2).

  Each of the first conveyor 101 and the second conveyor 102 can change its own width according to the width of the substrate to be transported (the length of the substrate in the Y-axis direction).

  Specifically, the first conveyor 101 includes a fixed rail 101a and a movable rail 101b, and the width of the first conveyor 101 can be changed by moving the movable rail 101b in the Y-axis direction.

  Similarly, the second conveyor 102 includes a fixed rail 102a and a movable rail 102b, and the width of the second conveyor 102 can be changed by moving the movable rail 102b in the Y-axis direction.

  Since the widths of the first conveyor 101 and the second conveyor 102 are variable in this way, the component mounting machine 100 can mount components on substrates of various dimensions.

  In each of the F lane and the R lane, the substrate is transferred from the left side of FIG. 2 that is the upstream side toward the right side of FIG. 2 that is the downstream side.

  One or more nozzles can be attached to both the front mounting head 104 and the rear mounting head 107. Further, when a plurality of nozzles are attached, a plurality of components can be sucked together.

  Further, the mounting head 104 mounts the component sucked from the component supply unit 106 on the substrate. The mounting head 107 mounts the component sucked from the component supply unit 109 on the substrate.

  In the first embodiment, each of the component supply unit 106 and the component supply unit 109 can be attached with one or more component cassettes storing a plurality of one type of components.

  The mounting head 104 can move along the beam 105 in the X-axis direction, and the mounting head 107 can move along the beam 108 in the X-axis direction. Furthermore, each of the beam 105 and the beam 108 can move independently in the Y-axis direction.

  With this configuration, each of the mounting head 104 and the mounting head 107 moves on the XY plane within a predetermined range independently of each other.

  By moving the mounting head 104 and the mounting head 107 in this way, components can be mounted on the two substrates conveyed to the substrate placement area by the first conveyor 101 and the second conveyor 102.

  In addition, the component mounting machine 100, as a production mode when producing a component mounting board, a synchronous mode for synchronizing the carry-out of the board after the component mounting between the respective conveyors, and the board loading after the board loading and the component mounting. Any of asynchronous modes in which unloading is performed independently by each conveyor can be employed.

  For example, two substrates carried on the F lane and the R lane are assumed to be an F substrate and an R substrate as shown in FIG. In this case, the combination of the substrate and the mounting head in each of the synchronous mode and the asynchronous mode is as follows.

  In the synchronous mode, in principle, the front mounting head 104 mounts components on the F board, and the rear mounting head 107 mounts components on the R board. That is, the independent mode is executed.

  This is because the movement distance of the mounting head 104 and the mounting head 107 in the Y-axis direction is shorter in the independent mode than in the alternating mode, and as a result, the production tact is shortened.

  In the asynchronous mode, in principle, the mounting head 104 and the mounting head 107 alternately mount components on both the F substrate and the R substrate. That is, the alternating mode is executed.

  This is because when the mounting head 104 and the mounting head 107 are operated in the alternating mode, the mounting work interruption period due to the suction operation of the components of the mounting head 104 and the mounting head 107 is short, resulting in a reduction in production tact. It is.

  For example, it is assumed that the F substrate and the R substrate are transported in the asynchronous mode, and the mounting head 104 and the mounting head 107 are operated in the independent mode. In this case, only the mounting head 104 is mounted on the F substrate. Therefore, the mounting operation on the F substrate is interrupted while the mounting head 104 is sucking the component. At this time, if the R substrate is not on the mounting stage, a wasteful waiting time is generated in the mounting head 107.

  However, when the mounting head 104 and the mounting head 107 are operated in the alternating mode, the mounting head 107 can mount the component on the F substrate while the mounting head 104 is sucking the component. Therefore, the interruption of the component mounting operation for the F board can be minimized.

  Even if the combination of the F board and the R board, the mounting head 104, and the mounting head 107 in the synchronous mode is other than the above, it is possible to mount components on the board. However, from the viewpoint of production efficiency, the above combination is adopted as a combination suitable for the synchronous mode.

  FIG. 3 is a schematic diagram showing the positional relationship between the mounting head 104 and the component supply unit 106.

  One or more nozzles can be attached to the mounting head 104 as described above, and in the first embodiment, a maximum of eight nozzles can be attached.

  In addition, eight nozzles are arranged in four rows of four nozzles arranged in one row. Therefore, it is possible to simultaneously pick up components from each of up to four component cassettes 110 (by one up and down movement).

  In the first embodiment, each component cassette 110 is loaded with one component reel PT. The component reel PT is a state in which a component tape storing a plurality of one type of components is wound, and components are supplied from the component reel PT to the component mounter 100 via the component cassette 110.

  Each of the plurality of component cassettes 110 is an example of a component storage unit in the mounting condition determination method of the present invention. Further, instead of the component cassette 110, a component feeder, a component tray, or the like may be used as the component storage means.

  In addition, the mounting head 107 has the same configuration as the mounting head 104, and can absorb components from each of the plurality of component cassettes 110 set in the component supply unit 109 and mount them on the substrate.

  The component configuration for component mounting included in the component mounter 100 described with reference to FIGS. 1 to 3 is the same for the component mounter 200 in the second embodiment and the component mounter 300 in the third embodiment to be described later. It is.

  FIG. 4 is a functional block diagram showing the main functional configuration of the component mounter 100 according to the first embodiment.

  As shown in FIG. 4, the component mounting machine 100 includes a mounting condition determination device 120, a mounting information storage unit 130, and a mechanism control unit 140 in addition to a mechanism unit 150 including the mounting head 104 and the like.

  The mounting condition determination device 120 is a device that determines the mounting conditions of the component mounting machine 100. In the first embodiment, a production mode which is a kind of mounting condition is determined.

  Specifically, the mounting condition determining apparatus 120 selects a production mode suitable for the component mounting operation from the synchronous mode and the asynchronous mode before starting a series of component mounting operations.

  As illustrated in FIG. 4, the mounting condition determination device 120 includes a communication unit 121, an acquisition unit 122, a calculation unit 123, and a selection unit 124.

  The communication unit 121 is a processing unit for exchanging information between the mounting condition determining device 120 and other components in the component mounter 100 and other external devices.

  The acquisition unit 122 is a processing unit that acquires various types of mounting information including information related to continuity of component mounting operations such as substrate transport, component suction, and component mounting on a substrate.

  In the first embodiment, the acquisition unit 122 acquires component information including information related to continuity of component mounting work stored in the mounting information storage unit 130.

  The mounting information stored in the mounting information storage unit 130 will be described later with reference to FIG.

  The calculation unit 123 is a processing unit that uses the mounting information acquired by the acquisition unit 122 to calculate information indicating the production efficiency when the component mounter 100 operates in each of the synchronous mode and the asynchronous mode.

  The selection unit 124 is a processing unit that selects a higher production efficiency of the synchronous mode and the asynchronous mode from information indicating the production efficiency calculated by the calculation unit 123 using the mounting information.

  The mounting condition determination device 120 gives various instructions to the mechanism control unit 140 so that the component mounting machine 100 operates in the production mode determined by such selection.

  The mechanism control unit 140 controls operations of the first conveyor 101 and the second conveyor 102 included in the mechanism unit 150 in accordance with these instructions.

  The determination result by the mounting condition determination device 120 is transmitted via the communication unit 121 to, for example, a stocker (not shown) that inputs a plurality of stored boards into the component mounting machine 100.

  The stocker puts each of the plurality of boards on each conveyor of the component mounter 100 at a timing corresponding to the determined production mode.

  Note that the processing of the communication unit 121, the acquisition unit 122, the calculation unit 123, and the selection unit 124 included in the mounting condition determination device 120 of the first embodiment is, for example, a central processing unit (CPU), a storage device, and information input / output It is realized by a computer having an interface for performing the above.

  For example, the CPU acquires mounting information via the interface. The CPU further calculates the production efficiency in each production mode, selects the production mode based on the calculation result, and the like. Such processing of the computer is realized, for example, when the computer executes the program of the present invention.

  FIG. 5 is a diagram illustrating a first example of the data configuration of the mounting information in the first embodiment.

  As illustrated in FIG. 5, the mounting information storage unit 130 stores component information and board information as mounting information including information related to continuity of component mounting work.

  The component information is information relating to components mounted on various boards by the component mounter 100.

  The data item “cassette number” is information for identifying the type of the component cassette 110. For example, it is indicated that a component whose component type is “0603” is stored in the component cassette 110 having the cassette number “C01”.

  The number is the number of parts stored. That is, the component cassette 110 of “C01” indicates that “2000” components having the component type “0603” are stored.

  The data item “continuous supply” is information indicating whether or not the component can be continuously supplied without causing the component to run out.

  For example, when the component tape on the component reel PT loaded in the component cassette 110 approaches a component-out state, the component tape is connected to a new component tape so as not to cause a component-out. Is possible.

  In addition, the technology for connecting component tapes or connecting component tapes in this way is called, for example, tape splicing.

  In the first embodiment, the component cassette 110 for which the continuous supply of data items is “1” is the component cassette 110 capable of preventing the occurrence of component failure in principle by tape splicing.

  Further, the component cassette 110 whose data item is continuously supplied “0” is a component cassette 110 that cannot be subjected to tape splicing due to a problem such as a tape width and becomes out of components when a number of components are adsorbed.

  The “stop time” of the data item is the stop time of the component mounting work accompanying the replacement of the component cassette 110, and the unit is second / time.

  For example, it is indicated that when the component cassette 110 with the cassette number “C04” has run out of components, it is necessary to stop the component mounting operation for 240 seconds.

  That is, after the component cassette 110 of “C04” is out of components and the component mounting operation is stopped in the lane on which the component cassette 110 is arranged, the operator purchases a new component cassette 110 of “C04” and This means that a time of about 240 seconds is required until replacement and the component mounting work is resumed.

  In addition, for the component cassette 110 whose data item is continuously supplied, “0” is recorded as the stop time because the component is not run out by tape splicing as described above.

  The board information is information on a board on which a component is mounted by the component mounter 100, and information is recorded for each type of board.

  Specifically, information indicating the used components, which are components to be mounted, for each type of board, and the number of uses for each type of component per board are recorded.

  For example, it is shown that it is necessary to mount 20 components with the component type “D32QFP” on the A board. In addition, the number of use per one A board is also shown for other component types.

  The mounting condition determining apparatus 120 acquires the above-described component information and board information, and calculates information indicating the production efficiency when the component mounter 100 operates in the synchronous mode and the asynchronous mode. Also, the production mode with higher production efficiency is selected from the calculation result.

  Note that the above-mentioned “type of substrate” is specified by the mounting position of the component or the type of component to be mounted. That is, even if two boards are physically separated, they are of the same type as long as the types and positions of the components to be mounted are the same.

  Further, even if the board is physically a single board, the board is a double-sided board on which components are mounted on both sides, and if the type or mounting position of the parts to be mounted on each side differs, Depending on which side the component is mounted on, it is handled as a different type of board.

  Next, operations of the component mounting machine 100 and the mounting condition determining apparatus 120 in the first embodiment will be described with reference to FIGS.

  First, the basic operation when the component mounter 100 operates in the synchronous mode and when operated in the asynchronous mode will be described with reference to FIGS.

  The following explanation will be given assuming that the component mounting machine 100 mounts components on the A board and the B board shown in the board information of FIG.

  In this case, since the component mounter 100 has two lanes, for example, as shown in FIG. 6, the F lane is assigned to the A board and the R lane is assigned to the B board.

  FIG. 6 is a diagram illustrating an arrangement example of the component cassette 110 and an example of board assignment in the component mounter 100 according to the first embodiment.

  As shown in FIG. 6, the component cassettes C01 to C05 shown in the component information of FIG. 5 can be set in the component supply unit 106 and the component supply unit 109, respectively.

  In the first embodiment, the same type of component cassette 110 set in each of the component supply unit 106 and the component supply unit 109 stores the number of components shown in the component information of FIG. It is assumed that production of the component mounting board is started in this state.

  FIG. 7A is a diagram for explaining an outline of the synchronous mode in the component mounter 100 of the first embodiment, and FIG. 7B is an asynchronous mode in the component mounter 100 of the first embodiment. It is a figure for demonstrating an outline | summary.

  First, an outline of the operation when the component mounter 100 operates in the synchronous mode will be described with reference to FIG.

  [1] When the substrate A arrives at the substrate placement area on the F lane and the substrate B arrives at the substrate placement area on the R lane, mounting of components on the substrate A and the substrate B is started.

  Specifically, the mounting head 104 mounts components on the board A on the F lane, and the mounting head 107 mounts components on the board B on the R lane.

  [2] When the mounting of the component on the substrate A is completed and the mounting of the component on the substrate B is completed, the substrate A and the substrate B are simultaneously carried out to the downstream side.

  Thereafter, the operations [1] and [2] are repeated until a predetermined production number is reached.

  As described above, in the synchronous mode, the mounting of the components is started when the two substrates are aligned, and the two components are unloaded when the mounting of the components on the two substrates is completed.

  Therefore, for example, when one board unit is configured by the A board and the B board, the intermediate stock can be minimized. Further, when the A board and the B board are in a front and front relation with one double-sided board, the intermediate stock can be minimized as well.

  In addition, each of the mounting head 104 and the mounting head 107 mounts a component only on the board closer to itself among the two boards. That is, the mounting head 104 and the mounting head 107 operate in the independent mode, and thereby the movement distance in the Y-axis direction is relatively short.

  Next, an outline of the operation when the component mounter 100 operates in the asynchronous mode will be described with reference to FIG.

  FIG. 7B shows a state after a predetermined period has elapsed since the component mounting operation for the substrates A and B was started.

  [1] When the mounting of the components on the board A on the F lane is completed, the board A is carried out to the downstream side regardless of the progress of the component mounting work on the R lane.

  [2] The mounting head 104 and the mounting head 107 mount components on the board B on the R lane while cooperating. During this time, the substrate A is transported to the substrate placement area on the F lane.

  [3] When the mounting of the components on the board B is completed, the board B is carried out downstream. Further, the mounting head 104 and the mounting head 107 start mounting components on the board A that has already arrived at the board placement area on the F lane.

  [4] While the components are mounted on the substrate A on the F lane, the substrate B is transported to the substrate placement area on the R lane.

  Thereafter, independent component mounting operations in the F lane and the R lane are repeated until a predetermined production number is reached.

  As described above, in the asynchronous mode, component mounting operations such as board transportation, component mounting, and unloading on each lane are performed regardless of the progress of the component mounting operations in other lanes.

  Therefore, even if the component mounting operation in one lane is stopped, the component mounting operation in another lane is continued.

  However, in the asynchronous mode, components are mounted on one board in an alternating mode, so that the moving distance of the mounting head 104 and the mounting head 107 in the Y-axis direction becomes long. As a result, as described above, the production tact becomes longer than when the mounting head 104 and the mounting head 107 mount components only on a board close to itself.

  Therefore, when the throughput of the synchronous mode and the asynchronous mode are compared, in principle, the synchronous mode is considered to have a larger throughput.

  FIG. 8 is a diagram illustrating an example of throughput values in each of the synchronous mode and the asynchronous mode according to the first embodiment.

  As shown in FIG. 8, for example, the production tact time of the A board and the B board in the synchronous mode is set to 32 seconds. In addition, the production tact for the A substrate in the asynchronous mode is 40, and the production tact for the B substrate is 36 seconds.

  In the synchronous mode, the A board and the B board after the completion of component mounting are carried out in synchronization. Therefore, for example, even if the production tact when considering only the B substrate is 25 seconds, if the production tact of the A substrate is 32 seconds, the production tact for both substrates is 32 seconds.

  Under these assumptions, the total number of sheets produced for each mode of the A board and the B board in each mode is 225 in the synchronous mode and 190 in the asynchronous mode.

  However, this calculation result is a calculation result on the assumption that the component mounting operation does not stop in any lane. In reality, there is a case where component mounting work in at least one of the lanes has to be stopped due to component shortage or the like.

  Thus, when the component mounting work in any lane is stopped, the influence of the stop time on the throughput is greater in the synchronous mode than in the asynchronous mode.

  FIG. 9A is a diagram for explaining the magnitude of the influence on the throughput of the stop time of the component mounting work in the synchronous mode, and FIG. 9B is a diagram of the component mounting work in the asynchronous mode. It is a figure for demonstrating the magnitude | size of the influence with respect to the throughput of stop time.

  As shown in FIG. 9A, while the component mounter 100 is operating in the synchronous mode, for example, one component cassette 110 of the component supply unit 106 is out of components, and the component mounting operation in the F lane is stopped for X seconds. Assume a case.

  In this case, at least the substrate B cannot be carried out in the R lane. That is, the component mounting work is stopped for X seconds in both the F lane and the R lane.

  Thereafter, when the component mounting work in the R lane stops for Y seconds, similarly, the component mounting work for both the F lane and the R lane stops for Y seconds.

  As a result, both the component mounting work stop periods in the F lane and the R lane are (X + Y) seconds.

  On the other hand, in the asynchronous mode, stopping of each lane does not affect other lanes.

  For example, as shown in FIG. 9B, when the component mounting work in the F lane stops for X seconds while the component mounting machine 100 is operating in the asynchronous mode, the component mounting work in the R lane is stopped during the stop. Will continue.

  Thereafter, when the component mounting work in the R lane stops for Y seconds, the component mounting work in the F lane is continued during the stop.

  As a result, the suspension period of the component mounting work in the F lane is X seconds, and the suspension period of the component mounting work in the R lane is Y seconds. That is, each is shorter than in the synchronous mode.

  From the above, the actual operation time of each of the F lane and the R lane decreases more in the synchronous mode than in the asynchronous mode as the stop time (X and Y) becomes longer. That is, the throughput is greatly reduced.

  FIG. 10 is a diagram illustrating a correlation between the throughput and the stop time in each of the synchronous mode and the asynchronous mode.

  As shown in FIG. 10, if the stop time is 0, the throughput is larger in the synchronous mode. For example, as shown in FIG. 8, the synchronous mode throughput is 225 sheets / hour, and the synchronous mode throughput is 190 sheets / hour.

  However, as the suspension time of component mounting work in the F lane and the R lane becomes longer, the throughput in the synchronous mode and the asynchronous mode becomes closer, and when the break-even point is exceeded, the throughput in the asynchronous mode becomes larger.

  Therefore, the mounting condition determining apparatus 120 according to the first embodiment is configured to start the production of the component mounting board based on the information indicating the continuity of the component mounting work before starting the production of the component mounting board by the component mounting machine 100. The production mode with the higher production efficiency is selected from the synchronous mode and the asynchronous mode.

  In addition, various instructions are given to the mechanism control unit 140 so that the component mounter 100 operates in the selected production mode.

  Various types of information processing performed by the mounting condition determining apparatus 120 according to the first embodiment will be described with reference to FIGS.

  FIG. 11 is a flowchart illustrating a first example of a process flow related to production mode selection by the mounting condition determining apparatus 120 according to the first embodiment.

  First, the acquisition unit 122 of the mounting condition determination apparatus 120 receives mounting information including information related to continuity of each component mounting work scheduled to be performed in parallel from the mounting information storage unit 130 via the communication unit 121. Obtain (S1).

  Specifically, the board information about the A board and the B board, which are the target of component mounting, and the part information about the parts to be mounted on these boards are acquired.

  Using the mounting information, the calculation unit 123 calculates information indicating the production efficiency when the component mounter 100 operates in each of the synchronous mode and the asynchronous mode (S2).

  For example, the predicted stop time of the component mounting work in each of the F lane and the R lane is obtained, and the throughput when the component mounter 100 is operated in each production mode is calculated from the obtained predicted stop time.

  The selection unit 124 selects the higher production efficiency of the synchronous mode and the asynchronous mode from the information indicating the production efficiency calculated by the calculation unit 123 (S3).

  That is, when the production efficiency is higher in the synchronous mode (synchronized in S4), the synchronous mode is selected (S5). Further, when the production efficiency is higher in the asynchronous mode (asynchronous in S4), the asynchronous mode is selected (S6).

  The mounting condition determination device 120 gives various instructions to the mechanism control unit 140 so that the component mounting machine 100 operates in the production mode determined by such selection.

  12A is a diagram showing a specific example of information about the substrate A used in the process shown in FIG. 11, and FIG. 12B is a diagram showing the information about the substrate B used in the process shown in FIG. It is a figure which shows the specific example of information.

  Various numerical values shown in FIGS. 12A and 12B are numerical values included in the component information and board information shown in FIG. 5 and numerical values calculated by these numerical values.

  The calculation unit 123 calculates a predicted stop time per board for each board from the numerical values indicated in the component information and board information acquired by the acquisition unit 122.

  Specifically, the unit stop time for each component type is calculated from the stop frequency due to the component being out of components to be mounted on each board and the stop time accompanying replacement of the component cassette 110. Furthermore, the unit stop time for each component cassette 110 is added together for each board.

  For example, for the A board, the component cassette 110 with the cassette numbers “C02” and “C03” has a continuous supply of “1”, so that there is no out of components. Therefore, both unit stop times are “0”.

  The component cassette 110 with the cassette number “C04” has a continuous supply of “0” and a quantity of 200. The number of D32QFP used on the A board is 20 per sheet.

  From these, it can be seen that when 20 D32QFPs are mounted on each of the 10 substrates A, it stops once. That is, the stop frequency is 10 sheets / time.

  The stop time when the component cassette 110 of “C04” is out of components is 240 seconds. That is, it stops for 240 seconds per 10 substrates A.

  When this is converted per substrate A, the stop time is 24 seconds. That is, the unit stop time for the component cassette 110 of “C04” is 24 seconds / sheet.

  Further, by the same calculation method, the unit stop time for the component cassette 110 of “C05” is calculated as 6 seconds / sheet. From the above, the predicted stop time per substrate A is calculated as 30 seconds / sheet.

  Further, for the B substrate, the unit stop time is obtained for each component cassette 110, and the predicted stop time per one substrate B is calculated as 17 seconds / sheet.

  Further, the calculation unit 123 calculates information indicating the production efficiency in each of the synchronous mode and the asynchronous mode, using the predicted stop time for each of the A and B substrates.

  In the asynchronous mode, as described in the description of FIG. 7B, both the mounting head 104 and the mounting head 107 mount components on both the A board and the B board.

  Therefore, D32QFP mounted on the A board and the B board can be supplied from the two “C04” component cassettes 110 set in the component supply unit 106 and the component supply unit 109. The same applies to connectors that are components mounted on the A board and the B board.

  In this case, the unit stop time for each of the A board and the B board is different from the values shown in FIG.

  However, in order to clearly describe the feature of the present invention, even in the asynchronous mode, the component cassette 110 of “C04” set in the component supply unit 106 is placed on the board A transported on the F lane. It is assumed that the connector supplied from the component cassette 110 of “C05” set in the component supply unit 106 is mounted.

  Further, D32QFP supplied from the component cassette 110 of “C04” set in the component supply unit 109 is mounted on the board B transported on the R lane, and “C05” set in the component supply unit 109 is mounted. The following description will be made on the assumption that a connector supplied from the component cassette 110 is mounted.

  FIG. 13 is a diagram illustrating a first example of information indicating the production efficiency in each of the synchronous mode and the asynchronous mode calculated by the calculation unit 123.

  In the case of the synchronous mode, if there is no stop, the production tact for each of the A board and the B board is 32 seconds / piece (see FIG. 8).

  However, as shown in FIG. 12, the estimated stop time per board due to a component shortage is 30 seconds / board for the A board and 17 seconds / board for the B board.

  In the case of the synchronous mode, as shown in FIG. 9A, the stop time of the component mounting work in each lane is a sum of the stop times in each lane.

  Therefore, the calculation unit 123 calculates 32+ (30 + 17) = 79 seconds as a production tact per substrate for each of the A substrate and the B substrate in consideration of the predicted stop time.

  That is, the component mounting operation for one A board and one B board is completed in 79 seconds. From this result, the calculation unit 123 calculates the production tact Ts per substrate in the synchronous mode as 39.5 seconds.

  On the other hand, in the asynchronous mode, if there is no stop, the production tact for the A board is 40 seconds / piece, and the production tact for the B board is 36 seconds / piece (see FIG. 8).

  In the asynchronous mode, as shown in FIG. 9B, the stop time of the component mounting work in each lane does not affect the stop time of the component mounting work in other lanes.

  Therefore, the calculation unit 123 calculates the production tact per substrate for the A substrate in consideration of the predicted stop time as 40 + 30 = 70 seconds. In addition, the production tact per substrate in consideration of the estimated stop time of the B substrate is calculated as 36 + 17 = 53 seconds.

  That is, in 3710 seconds, which is the least common multiple of 70 seconds and 53 seconds, the component mounting operation for 123 boards consisting of 53 A boards and 70 B boards is completed. Therefore, the calculation unit 123 calculates the production tact Ta per substrate in the asynchronous mode as about 30.2 seconds obtained from 3710 ÷ 123.

  The selection unit 124 selects the production mode with the higher production efficiency from the information indicating the production efficiency by the calculation unit 123.

  Specifically, when the production tact Ts in the synchronous mode and the production tact Ta in the asynchronous mode are compared, Ta is shorter. This also means that the throughput in the asynchronous mode is larger than the throughput in the synchronous mode. From the above results, the selection unit 124 selects the asynchronous mode.

  The mounting condition determining apparatus 120 determines which one of the synchronous mode and the asynchronous mode is appropriate before the component mounter 100 starts production of the component mounting board by information processing as described above. Also, various instructions are given to the mechanism control unit 140 so that the component mounter 100 operates in the determined production mode.

  Moreover, the determination result of the production mode by the mounting condition determining device 120 is displayed on, for example, a display device provided in the component mounter 100. The operator sets various component cassettes 110 in the component supply unit 106 and the component supply unit 109 according to the displayed production mode.

  The mechanism control unit 140 receives, for example, various instructions from the mounting condition determining device 120 or receives an instruction to start production by the operator, and thereby performs component mounting work on the F lane and parts on the R lane. The mechanism unit 150 is controlled so that the mounting operation is executed asynchronously.

  As described above, the mounting condition determining apparatus 120 according to the first embodiment determines which of the production efficiency in the synchronous mode and the asynchronous mode is appropriate before the component mounter 100 starts production of the component mounting board. It can be determined based on quantitative judgment.

  The component information and the board information can be obtained by performing the component mounting work by replacing the number of the component cassettes 110 that are the suppliers of the components to be mounted on the board, the number of the components used per board, and the replacement of the component cassette 110. Including time to stop. Moreover, the predicted value of the stop time of the component mounting work can be calculated from these numbers and the like.

  Therefore, the component information and the board information are mounting information including information related to the continuity of the component mounting work.

  Such mounting information is not limited to the component information and board information shown in FIG. For example, when a component picking mistake or mounting mistake occurs, the work for handling the mistake may stop the substantial component mounting operation of mounting the component on the board.

  Further, the substantial component mounting work may be stopped due to not only a defect related to the component and the board but also a hardware and software defect of the component mounter 100.

  That is, information indicating various performance values such as the component adsorption rate and mounting rate, and the operation rate of the component mounting machine 100 is also information related to the continuity of the component mounting operation.

  Therefore, the mounting condition determination device 120 can also determine the production mode of the component mounting machine 100 based on these pieces of information.

  FIG. 14 is a diagram illustrating a second example of the data configuration of the mounting information according to the first embodiment.

  In the example illustrated in FIG. 14, component information including an adsorption rate and a mounting rate, operation rate information, and board information are stored as mounting information including information related to continuity of component mounting work.

  Here, the board information shown in FIG. 14 is the same as the board information shown in FIG. However, the component information shown in FIG. 14 is different from the component information shown in FIG. 5 in that the adsorption rate and mounting rate for each component type are recorded.

  These adsorption rate and mounting rate are values obtained from past results. For example, the component type “0603” has an adsorption rate of “98%”. This means that some mistakes have occurred in the adsorption of the component type “0603” at the rate of twice per 100 times within the past predetermined period.

  Instead of the adsorption rate, an adsorption error rate may be stored. Further, a mounting error rate may be stored instead of the mounting rate.

  Further, these adsorption rates and the like may not be stored for each component type. For example, an adsorption rate or the like may be stored for each type of nozzle. In this case, by using the information indicating the correspondence between the nozzles of the mounting head 104 and the mounting head 107 and the components sucked by the nozzles, and the substrate information, the frequency of occurrence of a suction error or mounting error per substrate. Etc. are specified.

  Further, the operation rate information illustrated in FIG. 14 includes information indicating the operation rate for each lane. That is, these operating rates are the operating rates of the component mounter 100 corresponding to the component mounting operations performed in parallel, and are values obtained from past results.

  For example, the operation rate of F lane is “98%”. This is the rate of 2 hours per 100 hours in the operation results for a predetermined period due to the failure of the first conveyor 101, for example. This means that the component mounting work in the F lane has been stopped.

  Note that each operation rate shown in FIG. 14 is a value that does not take into account the stop time due to component shortage, suction error, and mounting error.

  The acquisition unit 122 of the mounting condition determination apparatus 120 acquires these pieces of information from the mounting information storage unit 130 via the communication unit 121. The calculation unit 123 calculates information indicating the production efficiency when the component mounter 100 operates in the synchronous mode and the asynchronous mode from these pieces of information.

  FIG. 15 is a flowchart illustrating a second example of a process flow relating to production mode selection by the mounting condition determining apparatus 120 according to the first embodiment.

  As in the flowchart shown in FIG. 11, the following description will be given assuming that the component mounting machine 100 selects a production mode when mounting components on a plurality of A boards and B boards, respectively.

  First, the acquisition unit 122 of the mounting condition determining apparatus 120 acquires mounting information including information indicating the suction rate or mounting rate for each type of component mounted in each component mounting operation scheduled to be performed in parallel ( S11).

  Or the acquisition part 122 acquires the mounting information containing the information which shows the operation rate of the component mounting machine 100 corresponding to each of the component mounting work performed in parallel with the component mounting machine 100 (S11).

  Specifically, the acquisition unit 122 acquires component information and substrate information including a suction rate for components mounted on the A substrate and the B substrate from the mounting information storage unit 130 via the communication unit 121. Alternatively, the operation rate information is acquired from the mounting information storage unit 130.

  Here, assuming that the acquisition unit 122 acquires component information and board information, the subsequent processing will be described.

  The calculation unit 123 uses the suction rate or mounting rate for each component type included in the component information to obtain a predicted stop time of component mounting work in each lane caused by a suction error or mounting error. Further, information indicating the production efficiency when the component mounter 100 is operated in each production mode is calculated from the obtained predicted stop time (S12).

  The selection unit 124 selects the higher production efficiency of the synchronous mode and the asynchronous mode from the information indicating the production efficiency calculated by the calculation unit 123 (S13).

  That is, if the production efficiency is higher in the synchronous mode (synchronized in S14), the synchronous mode is selected (S15). If the production efficiency is higher in the asynchronous mode (asynchronous in S14), the asynchronous mode is selected (S16).

  The mounting condition determination device 120 gives various instructions to the mechanism control unit 140 so that the component mounting machine 100 operates in the production mode determined by such selection.

  16A is a diagram showing a specific example of information about the substrate A used in the process shown in FIG. 15, and FIG. 16B is a diagram showing the information about the substrate B used in the process shown in FIG. It is a figure which shows the specific example of information.

  Note that the various numerical values shown in FIGS. 16A and 16B are numerical values included in the component information and board information shown in FIG. 15 and numerical values calculated from these numerical values.

  For example, the calculation unit 123 calculates the number of suction mistakes for each component type per substrate from the suction rate for the components to be mounted on each substrate. A unit stop time for each component type is calculated from the calculated number and the stop time of the component mounting work due to a mistake in picking up one component. Furthermore, the unit stop time for each component type is added for each board.

  For example, for the A board, the number of “1005” components used is 200, and the adsorption rate for the “1005” components is 99%. Therefore, the number of suction mistakes for the component “1005” per A board is calculated as 2 pieces / piece.

  Further, the stop time of the component mounting operation due to the occurrence of a suction error for one component, for example, the time required to discard one component that has not been suctioned in the correct posture is 2 seconds.

  This means that in the F lane in which the component is mounted on the A board, the substantial component mounting operation is stopped for about 2 seconds by the operation of the mechanism unit 150 for discarding the single component.

  From these, the unit stop time for the component “1005” is calculated to be 4 seconds / sheet.

  Further, the unit stop time for other component types is also calculated by the same calculation method, and by adding these, the predicted stop time for one board A is calculated as 16 seconds / piece.

  Further, for the B board, the unit stop time is obtained for each component type, and the predicted stop time per board B is calculated as 15 seconds / piece.

  In the first embodiment, the stop time of component mounting work due to the occurrence of a suction error for one component is a value common to all component types, and is a value acquired by the calculation unit 123 in advance.

  However, this stop time may be different for each component type. For example, it may be stored in the mounting information storage unit 130. In this case, the calculation unit 123 may acquire the stop time via the acquisition unit 122.

  The calculation unit 123 calculates information indicating the production efficiency in each of the synchronous mode and the asynchronous mode using the predicted stop time for each of the A board and the B board calculated by the above processing.

  FIG. 17 is a diagram illustrating a second example of information indicating production efficiency in each of the synchronous mode and the asynchronous mode calculated by the calculation unit 123.

  In the case of the synchronous mode, if there is no stop, the production tact for each of the A board and the B board is 32 seconds / piece (see FIG. 8).

  However, as shown in FIG. 16, the estimated stop time per board due to component shortage is predicted to be 16 seconds / board for the A board and 15 seconds / board for the B board.

  In the case of the synchronous mode, as shown in FIG. 9A, the stop time of the component mounting work in each lane is a value obtained by adding the stop times of the lanes.

  Therefore, the calculation unit 123 calculates 32+ (16 + 15) = 63 seconds as the production tact per substrate for each of the A substrate and the B substrate in consideration of the predicted stop time.

  That is, the component mounting operation for one A board and one B board is completed in 63 seconds. From this result, the calculation unit 123 calculates the production tact Ts per substrate in the synchronous mode as 31.5 seconds.

  On the other hand, in the asynchronous mode, if there is no stop, the production tact for the A board is 40 seconds / piece, and the production tact for the B board is 36 seconds / piece (see FIG. 8).

  In the asynchronous mode, as shown in FIG. 9B, the stop time of the component mounting work in each lane does not affect the stop time of the component mounting work in other lanes.

  Accordingly, the calculation unit 123 calculates the production tact per substrate for the A substrate in consideration of the predicted stop time as 40 + 16 = 56 seconds. Also, the production tact per substrate for the B substrate in consideration of the estimated stop time is calculated as 36 + 15 = 51 seconds.

  That is, in 2856 seconds, which is the least common multiple of 56 seconds and 51 seconds, the component mounting operation for 107 substrates including 51 A substrates and 56 B substrates is completed. Therefore, the calculation unit 123 calculates the production tact Ta per substrate in the asynchronous mode as about 26.7 seconds obtained from 2856 ÷ 107.

  The selection unit 124 selects a production mode with higher production efficiency from the calculation result by the calculation unit 123.

  Specifically, when the production tact Ts in the synchronous mode and the production tact Ta in the asynchronous mode are compared, Ta is shorter. This also means that the throughput in the asynchronous mode is larger than the throughput in the synchronous mode. From the above results, the selection unit 124 selects the asynchronous mode.

  The mounting condition determining apparatus 120 is based on quantitative determination of whether the synchronous mode or the asynchronous mode is appropriate before the component mounter 100 starts production of the component mounting board by the information processing as described above. To decide.

  In addition, also when using the mounting | wearing rate of components, a production mode is determined by the process similar to the case where said adsorption | suction rate is used.

  For example, the calculation unit 123 obtains a predicted stop time per board from the mounting rate for each component type and the stop time of the component mounting work per component when a mounting error occurs.

  The stop time of the component mounting work per component when a mounting error occurs is, for example, the time required for the disposal work of the component when the component does not leave the nozzle when the component is mounted and the so-called take-out of the component occurs It is demanded from.

  Further, a production tact taking into account the predicted stop time in the synchronous mode and the asynchronous mode is calculated from the production tact for each substrate in the case of non-stop and the predicted stop time.

  The calculation method is the same as the calculation method shown in FIG. 17, and in the case of the synchronous mode, the production tact per one board is the production tact in the case of non-stop (32 seconds / piece). Is added to the estimated stop time for each board.

  Further, in the asynchronous mode, the production tact per A board is added to the production tact (40 seconds / sheet) when there is no stop, and the predicted stop time per A board is added. Further, the production tact per B board is added to the production tact (36 seconds / sheet) in the case of non-stop by adding the estimated stop time per B board.

  From these results, Ts and Ta, which are production tacts in the synchronous mode and the asynchronous mode, are calculated. Further, a production mode with high production efficiency is selected from the calculated Ts and Ta.

  Further, when the production mode is determined using the operation rate, the following processing is performed.

  For example, as shown in FIG. 14, the operation rate of the component mounter 100 for the component mounting operation in the F lane is 98%, and the operation rate operation rate of the component mounter 100 for the component mounting operation in the R lane is A case of 96% is assumed.

  In this case, the predicted stop time per hour (3600 seconds) is 72 seconds for the F lane and 144 seconds for the R lane.

  That is, in the synchronous mode, the calculation unit 123 calculates the predicted stop time of component mounting work in the F lane and the R lane as 72 + 144 = 216 seconds.

  Here, assuming that the production tact for each of the A board and the B board in the synchronous mode is 32 seconds / sheet, the throughput Ps in the synchronous mode is obtained by the following (Equation 1).

  Ps = ((3600-216) / 32) + ((3600-216) / 32) (Formula 1)

  When this is calculated, it is about 212 sheets / hour.

  Further, assuming that the production tacts of the A substrate and the B substrate in the asynchronous mode are 40 seconds / 36 seconds / sheet, the throughput Pa in this case is obtained by the following (Equation 2).

  Pa = ((3600-72) / 40) + ((3600-144) / 36) (Formula 2)

  When this is calculated, it is about 184 sheets / hour.

  Since Ps and Pa are in a relationship of Ps> Pa, the selection unit 124 selects a synchronous mode in which the throughput is larger than the other as the production mode of the component mounter 100.

  Note that the operating rate used in this calculation does not take into account the downtime caused by components or boards, such as the downtime due to out of components.

  Therefore, for example, when all the used parts can be continuously supplied by tape splicing, and there are very few mistakes in picking up and mounting parts, the stop time caused by the problem of the parts mounting machine 100 itself is The method of selecting the production mode using the operation rate as described above is effective when it becomes dominant with respect to the stop time of the mounting work.

  Similarly, when the frequency of component cutout is very low and the component mounter 100 itself is very unlikely to cause any error, an occurrence of a component suction error or mounting error may occur. The method of selecting the production mode using the component adsorption rate or mounting rate is effective.

  In addition, the production mode of the component mounter 100 can be determined by superimposing various information related to the continuity of the component mounting operation.

  For example, information indicating the production efficiency in each of the synchronous mode and the asynchronous mode may be calculated by using a numerical value obtained by adding the predicted stop time due to component shortage and the predicted stop time due to suction error. .

  In other words, if any one of the various events that affect the continuity of the component mounting operation is dominant (for example, the component is out), the synchronization mode is used by using the stop time caused by the event. Information indicating the production efficiency in each of the asynchronous mode and the asynchronous mode may be calculated.

  Also, if it affects the continuity of the component mounting work to the extent that none of the multiple events can be ignored, the value obtained by adding the stop time etc. due to the multiple events will be used for each of the synchronous mode and asynchronous mode. What is necessary is just to calculate the information which shows the production efficiency in case.

  As described above, the mounting condition determining apparatus 120 according to the first embodiment can determine the production mode based on information unique to various elements used for production of a component mounting board, such as component information. Therefore, an appropriate production mode is determined based on quantitative judgment without depending on the operator.

  Further, since this determination can be made before the production of the component mounting board is started, it is not necessary to perform complicated control such as changing the timing of loading the board with respect to each conveyor after the production is started.

  In the first embodiment, the mounting condition determining device 120 selects a production mode suitable for the component mounting machine 100 including two transport conveyors arranged in parallel.

  However, the mounting condition determination device 120 may select a production mode suitable for a component mounting machine including three or more conveyors arranged in parallel.

  For example, a case is assumed in which a production mode is selected for a component mounter including three transfer conveyors, that is, a component mounter that performs component mount board production in three lanes in parallel.

  In this case, the calculation unit 123 produces the component mounting board from the mounting information such as the number of various component cassettes 110, the number of each board used for each component type, and the correspondence between each board and the lane in which the boards are transported. Before the start of the calculation, a predicted stop time for each lane is calculated.

  Furthermore, the calculation unit 123 calculates information indicating the production efficiency in each of the synchronous mode and the asynchronous mode using these predicted stop times. This makes it possible to determine which of the synchronous mode and the asynchronous mode has higher production efficiency.

  In the first embodiment, the mounting condition determination apparatus 120 selects a production mode when one component mounter 100 produces a component mounting board.

  However, the mounting condition determination apparatus 120 is suitable for a production line when a plurality of component mounting machines 100 are connected to form a single production line having two parallel lanes. You can also select a mode.

  For example, assume a production line in which two component mounting machines 100 are connected. Furthermore, the stop time of the F lane of the upstream component mounter 100 is X, and the stop time of the R lane is Y. Further, the stop time of the F lane of the component mounting machine 100 on the downstream side is W, and the stop time of the R lane is Z.

  In this case, in the synchronous mode, the predicted stop time for the entire F lane and the entire R lane is in principle X + Y + W + Z.

  In the asynchronous mode, the predicted stop time for the entire F lane is X + W in principle, and the predicted stop time for the entire R lane is Y + Z in principle.

  From these, the throughput in each of the synchronous mode and the asynchronous mode of the entire F lane and the entire R lane is obtained. Furthermore, the throughput in each of the synchronous mode and the asynchronous mode as the entire production line can be obtained.

  Therefore, by comparing these throughputs, it can be determined which of the synchronous mode and the asynchronous mode has higher production efficiency.

(Embodiment 2)
The structure of the component mounting machine 200 in Embodiment 2 of this invention is demonstrated using FIGS. 18-22.

  In addition, since the apparatus structure for component mounting with which the component mounter 200 is provided is the same as the component mounter 100 in Embodiment 1 demonstrated using FIGS. 1-3, the description is abbreviate | omitted.

  In addition, the component mounter 200 can employ either the independent mode or the alternating mode as a production mode when producing the component mounting board.

  The independent mode means that only the board conveyed to the mounting head 104 and the mounting head 107 by the transport conveyor close to the component supply unit, which is the component supply source, of the first conveyor 101 and the second conveyor 102, respectively. Is a production mode that implements

  That is, in the independent mode, the mounting head 104 mounts components only on the board conveyed by the first conveyor 101 close to the component supply unit 106 that is a component supply source to the mounting head 104. In addition, the mounting head 107 mounts components only on the board conveyed by the second conveyor 102 close to the component supply unit 109 that is a supply source of the components to the mounting head 107.

  The alternating mode is a production mode in which the mounting head 104 and the mounting head 107 are alternately mounted with components on both boards conveyed by the first conveyor 101 and the second conveyor 102.

  For example, two substrates carried on the F lane and the R lane are assumed to be an F substrate and an R substrate as shown in FIG. In this case, the combination of the substrate and the mounting head in each of the independent mode and the alternating driving mode is as follows.

  In the independent mode, only the front mounting head 104 mounts components on the F board, and only the rear mounting head 107 mounts components on the R board.

  In the alternate driving mode, the mounting head 104 and the mounting head 107 alternately mount components on both the F substrate and the R substrate.

  FIG. 18 is a functional block diagram showing the main functional configuration of the component mounter 200 in the second embodiment.

  As illustrated in FIG. 18, the component mounter 200 includes a mounting condition determination device 220, a mounting information storage unit 130, and a mechanism control unit 140 in addition to the mechanism unit 150 including the mounting head 104 and the like.

  The mounting condition determination device 220 is a device that determines the mounting conditions of the component mounting machine 200. In the second embodiment, a production mode that is a kind of mounting condition is determined.

  Specifically, before the start of a series of component mounting operations, a production mode suitable for the component mounting operation is selected from the independent mode and the alternating mode.

  As illustrated in FIG. 18, the mounting condition determination device 220 includes a communication unit 221, an acquisition unit 222, a determination unit 223, and a selection unit 224.

  The communication unit 221 is a processing unit for exchanging information between the mounting condition determination device 220 and other components in the component mounter 200 and external devices.

  The acquisition unit 222 is a processing unit that acquires various types of mounting information including information related to a board or a component used for a component mounting operation scheduled to be performed by the component mounting machine 200.

  In the second embodiment, the acquisition unit 222 acquires board data 130a and the like stored in the mounting information storage unit 130 as the various types of mounting information.

  The mounting information storage unit 130 is a storage device that stores board data 130a, a component library 130b, supply unit data 130c, and nozzle data 130d.

  Various mounting information stored in the mounting information storage unit 130 will be described later with reference to FIGS.

  The determination unit 223 is a processing unit that uses the mounting information acquired by the acquisition unit 222 to determine which of the independent mode and the alternating mode is a production mode suitable for a component mounting operation that is planned.

  The selection unit 224 is a processing unit that selects, as the production mode of the component mounter 200, the production mode that is determined to be suitable for the component mounter 200 by the determination unit 223.

  The mounting condition determination device 220 gives various instructions to the mechanism control unit 140 so that the component mounting machine 200 operates in the production mode determined by such selection.

  The mechanism control unit 140 controls the operation of the mounting head 104 and the mounting head 107 included in the mechanism unit 150 in accordance with these instructions.

  The processing of the communication unit 221, the acquisition unit 222, the determination unit 223, and the selection unit 224 included in the mounting condition determination device 220 according to the second embodiment is, for example, a central processing unit (CPU), a storage device, and information input / output It is realized by a computer having an interface for performing the above.

  For example, the CPU acquires mounting information via the interface. The CPU further determines the suitability of each production mode for the component mounting operation, selects the production mode based on the determination result, and the like. Such processing of the computer is realized, for example, when the computer executes the program of the present invention.

  FIG. 19 is a diagram illustrating an example of a data configuration of the board data 130a according to the second embodiment.

  The board data 130a is an example of data related to a board or a component in the mounting condition determination method of the present invention. As shown in FIG. 19, information on various boards that are the target of component mounting by the component mounter 200. Is included in the data.

  Specifically, the substrate data 130a includes the length (L) and width (W) values (unit: mm) of each of the plurality of types of substrates. Further, the type and number of components to be mounted per board for each board type are included.

  The length (L) of the substrate is the length in the substrate transport direction, that is, the length in the X-axis direction, and the width (W) of the substrate is the length in the Y-axis direction of the substrate.

  Although not shown in FIG. 19, the board data 130a also includes information indicating the types of components to be mounted for each type of board and their mounting positions.

  The above-mentioned “type of board” is specified by the mounting position of the component or the type of component to be mounted. That is, even if two boards are physically separated, they are of the same type as long as the types and positions of the components to be mounted are the same.

  Further, even if the board is physically a single board, the board is a double-sided board on which components are mounted on both sides, and if the type or mounting position of the parts to be mounted on each side differs, Depending on which side the component is mounted on, it is handled as a different type of board.

  FIG. 20 is a diagram illustrating an example of a data configuration of the component library 130b according to the second embodiment.

  As shown in FIG. 20, the component library 130b is a library in which unique information about each of a plurality of component types that can be handled by the component mounter 200 is collected.

  Specifically, the part library 130b includes part dimensions for each part type (part name), tact (tact specific to the part type under a certain condition), and other constraint information (usable nozzle types, part recognition). Camera recognition method, maximum acceleration ratio of mounting head, etc.) and appearance data of each component.

  FIG. 21 is a diagram illustrating an example of a data configuration of the supply unit data 130c according to the second embodiment.

  As shown in FIG. 21, the supply unit data 130c is data that includes various types of information about the component cassette 110, the component supply unit 106, and the component supply unit 109, which are information related to components.

  Specifically, the component cassette data indicating the attribute of the component cassette 110 storing the components used for the scheduled component mounting operation, and the mounting width indicating the maximum total mounting width of the component supplying unit 106 and the component supplying unit 109 Data and are included.

  As shown in FIG. 21, the component cassette data includes a cassette ID, a component name, a mounting pitch, and a stock quantity for each component cassette 110.

  The cassette ID is an identifier that identifies the type of the component cassette 110. The component name is information for identifying the type of component stored in the component cassette 110. The mounting pitch is a value indicating a width necessary for mounting the component cassette 110 to the component supply unit 106 or the component supply unit 109.

  The stock quantity is the stock quantity of the component cassette 110. That is, it is the number of the component cassettes 110 that can be used for component mounting work by the component mounting machine 200. In addition, the number of stocks can be updated by communicating with an external device, for example.

  For example, the component cassette 110 with the cassette ID “C16” stores a plurality of components called LLCCAP, and when the component cassette 110 is attached to the component supply unit 106 or the component supply unit 109, a width of “42 mm” is required. is there.

  Since the stock quantity is “1”, it can be attached only to either the component supply unit 106 or the component supply unit 109.

  The attachment width data includes a value indicating the maximum total attachment width when the component cassette 110 is attached to each of the component supply unit 106 and the component supply unit 109.

  Note that “F” in the mounting width data means the component supply unit 106 that is the front-side component supply unit, and “R” means the component supply unit 109 that is the rear-side component supply unit.

  In the attachment width data shown in FIG. 21, the maximum total attachment width is “567 mm” for both the component supply unit 106 and the component supply unit 109.

  That is, in the component supply unit 106 and the component supply unit 109, 567 ÷ 21 = 27 component cassettes 110 can be mounted if both component cassettes 110 have a mounting pitch of 21 mm.

  In addition, for example, 21 component cassettes 110 having an attachment pitch of 21 mm and 21 component cassettes 110 having an attachment pitch of 42 mm can be attached to the component supply unit 106 and the component supply unit 109.

  FIG. 22 is a diagram illustrating an example of a data configuration of the nozzle data 130d according to the second embodiment.

  As shown in FIG. 22, the nozzle data 130 d is data including information about a nozzle that sucks a component, which is information related to the component. Specifically, the nozzle data 130d includes information indicating the type and number of nozzles attached to the mounting head 104 and the mounting head 107.

  The mounting head [F] means the mounting head 104 that is the front mounting head, and the mounting head [R] means the mounting head 107 that is the rear mounting head.

  For example, the nozzle data 130d shown in FIG. 22 indicates that the mounting head 107 has two S nozzles and two L nozzles attached thereto.

  Further, the contents of the nozzle data 130d are updated by, for example, the mechanism control unit 140 when the nozzles of the mounting head 104 and the mounting head 107 are attached, removed, or replaced.

  The mounting condition determining apparatus 220 according to the second embodiment uses the various mounting information stored in the mounting information storage unit 130 to determine which of the independent mode and the alternating mode is to be performed by the component mounting machine 200. It can be judged whether it is suitable for the mounting work.

  Next, the operation or processing of the component mounter 200 and the mounting condition determination device 220 according to the second embodiment will be described with reference to FIGS.

  First, a basic process of the mounting condition determining apparatus 220 will be described with reference to FIG.

  FIG. 23 is a flowchart illustrating a basic processing flow related to production mode selection by the mounting condition determining apparatus 220 according to the second embodiment.

  First, the acquisition unit 222 of the mounting condition determination apparatus 220 acquires mounting information including data related to a board or a component used for a planned component mounting operation from the mounting information storage unit 130 via the communication unit 221 ( S10).

  Specifically, the acquisition unit 222 acquires the board data 130a, the component library 130b, the supply unit data 130c, and the nozzle data 130d from the mounting information storage unit 130.

  For each of the board data 130a, the component library 130b, and the supply unit data 130c, not all the information is acquired, but only the parts used for the scheduled component mounting work or the parts related to the board are acquired. Also good.

  Using the mounting information, the determination unit 223 determines which one of the independent mode and the alternating mode is suitable for the component mounting work (S20). Details of the suitability determination process will be described later with reference to FIGS.

  The selection unit 224 selects the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S30).

  That is, when it is determined that the independent mode is more suitable for the component mounting work (independent in S20), the independent mode is selected (S31). If it is determined that the alternate placement mode is more suitable for the component mounting work (alternate placement in S20), the alternate placement mode is selected (S32).

  The mounting condition determination device 220 gives various instructions to the mechanism control unit 140 so that the component mounting machine 200 operates in the production mode determined by such selection.

  The mechanism control unit 140 controls the operation of the mechanism unit 150 in accordance with an instruction from the mounting condition determination device 220.

  FIG. 24 is a flowchart showing a detailed process flow relating to production mode selection by the mounting condition determining apparatus 220 according to the second embodiment.

  With reference to FIG. 24, the details of the production mode suitability determination process by the determination unit 223 will be described.

  First, the determination unit 223 places the board for component mounting in the restricted area of the component mounting machine 200 in the independent mode from the dimensions of the board to be mounted in the component included in the acquired board data 130a. It is determined whether or not (S21).

  Here, the restricted area is an area in which when one of the mounting head 104 and the mounting head 107 exists, the other is not allowed to enter.

  This is an area provided to prevent the mounting head 104 and the mounting head 107 from interfering with each other, and is also referred to as an interference area.

  The determination unit 223 acquires the position information of the restricted area in the component mounter 200 from the mechanism control unit 140, for example. Further, the determination unit 223 can capture the positional relationship between the board and the restricted area from the acquired position information and the width dimension of the board indicated in the board data 130a.

  Since the movable ranges of the mounting head 104 and the mounting head 107 are different between the independent mode and the alternating mode, this limited region is also different in each mode.

  FIG. 25 is a diagram showing an example of a restricted area in the alternate beating mode in the second embodiment.

  In the alternate driving mode, each of the mounting head 104 and the mounting head 107 has a wide range of movement because components are mounted on both the F substrate and the R substrate.

  Therefore, as shown in FIG. 25, for example, when the mounting head 107 enters the restricted area sandwiched between dotted lines, the mounting head 104 is prohibited from entering the restricted area until the mounting head 107 moves out of the restricted area. Is done.

  Similarly, when the mounting head 104 enters the restricted area, entry of the mounting head 107 into the restricted area is similarly prohibited.

  On the other hand, in the independent mode, the mounting head 104 may mount components only on the F substrate, and the mounting head 107 may mount components only on the R substrate. For this reason, the movable ranges of the mounting head 104 and the mounting head 107 are narrower than in the alternating mode.

  Therefore, the restricted area in the independent mode is smaller than the restricted area in the alternating mode.

  FIG. 26 (A) and FIG. 26 (B) are diagrams showing examples of restricted areas in the independent mode. FIG. 26A shows a state in which neither the F substrate nor the R substrate is placed in the restricted area because the F substrate and the R substrate are relatively small.

  FIG. 26B shows a state in which both the F substrate and the R substrate are both placed in the restricted region because the F substrate and the R substrate are relatively large.

  When the widths of the F substrate and the R substrate are as shown in FIG. 26A, the mounting head 104 that moves to mount the component on the F substrate and the mounting that moves to mount the component on the R substrate There is no interference with the head 107.

  That is, the mechanism control unit 140 only needs to control the mounting head 104 and the mounting head 107 so that components are mounted on the boards in charge of the mounting head 104 and the mounting head 107, and does not need to perform control in consideration of the position of each other.

  Therefore, when the F board and the R board are not placed in the restricted area, the determination unit 223 performs a primary determination that the independent mode is suitable for the component mounting work (not in S21).

  However, as shown in FIG. 26B, the F substrate and the R substrate are relatively wide substrates. Therefore, at least a part of each of the F substrate and the R substrate is both placed in the restricted region. Assuming that In this case, there is a possibility that the mounting head 104 and the mounting head 107 interfere with each other.

  Therefore, as shown in FIG. 26B, when the determination unit 223 places at least a part of both boards in the restricted area in the independent mode, the alternating mode is suitable for the component mounting work. (It is S21).

  The selection unit 224 selects the alternating mode as the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S32).

  For example, when the distance in the Y-axis direction between the first conveyor 101 and the second conveyor 102 is sufficiently large, or the variable width of the first conveyor 101 and the second conveyor 102 is small, the F substrate and the R Assume that the substrate is not close enough to interfere with the mounting heads. In this case, there is no restriction area in the independent mode. However, in the second embodiment, it is assumed that there is a limited area in the case of the independent mode.

  Further, even when a part of each of the F substrate and the R substrate is located in the restricted region, if the mounting position does not exist in the restricted region, the mounting head 104 and the mounting head 107 are not in the restricted region. Components are not mounted inside. Therefore, interference between the mounting head 104 and the mounting head 107 does not occur.

  Therefore, for example, information indicating the mounting positions of the F board and the R board is obtained from the board data 130a, and the production mode is determined depending on whether or not the portion including the mounting positions of the F board and the R board is placed in the restricted area. It may be judged whether or not.

  That is, when it is determined that the portion including the mounting position of each of the F board and the R board is placed within the restricted region, it may be determined that the alternate mounting mode is suitable for the component mounting work scheduled. .

  If the determination unit 223 makes a primary determination that the independent mode is suitable for the component mounting operation (not S21), the determination unit 223 further determines the first conveyor 101 from the arrangement state or possibility of arrangement of the components and nozzles. Supply of components of the type (hereinafter referred to as “common components”) to be mounted in common on the F substrate conveyed to the second conveyor 102 and the R substrate conveyed to the second conveyor 102 and mounting on the substrate are both It is determined whether it is possible on the lane side (S22).

  Specifically, the determination unit 223 first uses the board data 130a and the supply unit data 130c acquired by the acquisition unit 222 to determine whether both the component supply unit 106 and the component supply unit 109 can supply a common component. Judge whether or not.

  Further, the determination unit 223 uses the component library 130b and the nozzle data 130d acquired by the acquisition unit 222 to determine whether both the mounting head 104 and the mounting head 107 can mount the common component on each substrate. To do.

  If the determination unit 223 determines that the supply of the common component and the mounting on the board are possible in both lanes, the determination unit 223 determines that the independent mode is suitable for the component mounting operation (possible in S22).

  The selection unit 224 selects the independent mode as the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S31).

  In addition, when the determination unit 223 determines that at least one of the supply of the common component and the mounting on the board is not possible in at least one of both lanes, the determination unit 223 determines that the alternating mode is suitable for the component mounting operation. (Not possible in S22).

  The selection unit 224 selects the alternating mode as the production mode of the component mounter 200 according to the determination result by the determination unit 223 (S32).

  FIG. 27 is a diagram illustrating an example of component placement in the component mounter 200. FIG. 28 is a diagram illustrating another example of component placement in the component mounter 200.

  A specific example of a determination process performed by the determination unit 223 as to whether or not both the component supply unit 106 and the component supply unit 109 can supply a common component will be described with reference to FIGS. 27 and 28.

  In addition, each symbol of ae shown to FIG. 27 and FIG. 28, and (alpha), (beta), and (gamma) represents the kind of components. Each of a to e is a small part, and each of α, β, and γ is a large part.

  First, as shown in FIG. 27, components to be mounted on the F board are a, b, c, d, and e, and components to be mounted on the R board are a, c, α, β, and γ. Assume a case.

  In this case, a and c are common components that need to be mounted on both the F substrate and the R substrate.

  The determination unit 223 refers to the substrate data 130a regarding the F substrate and the R substrate acquired by the acquisition unit 222. Thereby, these common components and the components used for each substrate other than the common components are specified.

  Considering that components are mounted on such F and R boards in an independent mode, a, b, c, d, e are arranged in the component supply unit 106, and a, c are arranged in the component supply unit 109. , Α, β, γ need to be arranged.

  Here, each of a, b, c, d, and e is a small component, and the mounting pitch of the component cassette 110 that stores these components is a relatively small value.

  For example, the maximum total mounting width of the component supply unit 106 is “100”, and the mounting pitch of the component cassettes 110 for a, b, c, d, and e is “15”. In this case, the total mounting pitch of these five component cassettes 110 is “75”. Accordingly, the determination unit 223 can attach all necessary component cassettes 110 to the component supply unit 106, including the component cassette 110 in which common components are stored (hereinafter referred to as “common component cassette 110”). It is judged that.

  On the other hand, each of α, β, and γ, which are essential components only for the R board, to be supplied by the component supply unit 109 is a large component, and the mounting pitch of the component cassette 110 that stores these components is a relatively large value. It is.

  Therefore, the two component cassettes 110 that store the common components a and c may not be attached to the component supply unit 109.

  For example, the maximum total mounting width of the component supply unit 109 is “100”, and the mounting pitch of the component cassettes 110 for α, β, and γ is “30”.

  In this case, the determination unit 223 subtracts the total “90” of the mounting pitches of the component cassettes 110 of α, β, and γ, which are component cassettes 110 of components other than the common component, from the maximum total mounting width of “100”. . Thereby, “10” which is the remaining mounting width is calculated.

  Further, the determination unit 223 compares “10” that is the remaining mounting width with “15” that is the mounting pitch of each of the component cassettes 110 of a and c. Accordingly, it is determined that the component cassettes 110 a and c cannot be attached to the component supply unit 109.

  Accordingly, the determination unit 223 determines that only the component supply unit 106 can supply common components.

  As described above, the determination unit 223 determines whether or not the common component cassette 110 can be attached to both the component supply unit 106 and the component supply unit 109 in consideration of the dimension of the component cassette 110 called the attachment pitch.

  Here, even if the common component cassette 110 can be dimensionally attached to both the component supply unit 106 and the component supply unit 109, it is determined whether or not there is a common component cassette 110 that can be used. There is a problem.

  Therefore, the determination unit 223 further determines whether it can be attached to both the component supply unit 106 and the component supply unit 109 in consideration of the number of common component cassettes 110 that can be used.

  It should be noted that either the determination of the attachment possibility of the common component cassette 110 from the viewpoint of dimensions or the determination of the attachment possibility of the common component cassette 110 from the viewpoint of the usable number may be first. .

  For example, as shown in FIG. 28, it is assumed that the components to be mounted on the F substrate are a, d, e, and f, and the components to be mounted on the R substrate are a, b, and c.

  In this case, a is a common component that needs to be mounted on both the F substrate and the R substrate.

  Under such assumptions, when components are mounted on the F board and the R board in the independent mode, a, d, e, and f are arranged in the component supply unit 106, and a, b are arranged in the component supply unit 109. , C need to be arranged.

  However, when only one component cassette 110 can be prepared, specifically, when the number of inventory of the component cassette 110 a shown in the supply unit data 130c is 1, the component supply unit 106 and the component supply unit 109 are used. The component cassette 110 of a cannot be attached to both.

  That is, the determination unit 223 specifies the number of stocks of the common component cassette 110 from the supply unit data 130 c acquired by the acquisition unit 222. Further, if the stock quantity is “1”, it is determined that the component cassette 110 of “a” can be attached to only one of the component supply unit 106 and the component supply unit 109.

  Accordingly, the determination unit 223 determines that only one of the component supply unit 106 and the component supply unit 109 can supply the common component.

  Here, if the component mounter 200 is operated in the independent mode in the component arrangement state shown in FIG. 27 or FIG. 28, the component mounter 200 is once attached to the board on which the component arrangement is complete. All necessary parts can be mounted just by passing.

  Specifically, all necessary components are mounted on the F board in the case of FIG. 27 and the R board in the case of FIG.

  However, in any case, all the necessary components are not mounted on the other board only by passing the component mounting machine 200 once. For this reason, it is necessary to input the component mounter 200 again and mount an unmounted component.

  Alternatively, it is necessary to connect another component mounter downstream of the component mounter 200 and mount an unmounted component on this component mounter.

  That is, operating the component mounter 200 in the independent mode when the combination of the component arrangement state and the board is the combination shown in FIG. 27 or FIG. 28 is not significant from the viewpoint of time or economy. Absent.

  Therefore, when only one of the component supply unit 106 and the component supply unit 109 can supply the common component, the determination unit 223 indicates that the alternating mode is suitable for component mounting work on the F substrate and the R substrate. Judgment is made (impossible at S22 in FIG. 24).

  In other words, even if two common component cassettes 110 can be prepared, the determination unit 223 cannot be attached to either the component supply unit 106 or the component supply unit 109 in dimension, and the alternate beating mode is the F substrate. And the R board are determined to be suitable for component mounting work.

  Further, even if the determination unit 223 can attach the common component cassette 110 to both the component supply unit 106 and the component supply unit 109 in terms of dimensions, when only one common component cassette 110 can be prepared, It is determined that the alternating mode is suitable for component mounting work on the F board and the R board.

  The determination unit 223 can prepare two common component cassettes 110 from the board data 130a and the supply unit data 130c, and can be attached to both the component supply unit 106 and the component supply unit 109 in terms of dimensions. If it is determined, the nozzle determination process is performed next.

  Specifically, based on the types of nozzles attached to the mounting head 104 and the mounting head 107, the mounting head 104 can suck the common component and mount it on the F substrate, and the mounting head 107 sucks the common component and R It is determined whether or not it can be mounted on the board.

  FIG. 29 is a diagram illustrating an example of an arrangement state of nozzles of the mounting head 104 and the mounting head 107.

  As shown in FIG. 29, it is assumed that the components to be mounted on the F substrate are c, α, and β, and the components to be mounted on the R substrate are a, b, and α. In this case, α is a common component that needs to be mounted on both the F substrate and the R substrate.

  Further, as shown in the figure, it is assumed that the mounting head 104 has two L nozzles and two S nozzles, and the mounting head 107 has eight S nozzles. .

  The L nozzle is a nozzle for large parts, and the S nozzle is a nozzle for small parts.

  The determining unit 223 refers to the nozzle data 130d acquired by the acquiring unit 222, and identifies the type and number of these nozzles attached to the mounting head 104 and the mounting head 107, respectively.

  Under the above assumption, the mounting head 104 can be sucked and mounted on the F substrate, whether it is a large component or a small component. However, only the S nozzle for small parts is attached to the mounting head 107.

  Therefore, the mounting head 104 can mount the common component α on the F substrate, but the mounting head 107 cannot mount the common component α on the R substrate.

  In other words, when the component mounter 200 is operated in the independent mode in the case of such a combination of the nozzle arrangement state and the substrate, all necessary components are passed through the F substrate only by passing the component mounter 200 once. Will be implemented. However, not all of the necessary components are mounted on the R board only by passing the component mounting machine 200 once.

  Therefore, it is necessary to perform the component mounting operation on the R board again by the component mounter 200 or another component mounter. In other words, selecting the independent mode in such a case is not significant from a time or economic viewpoint.

  Therefore, when only one of the mounting head 104 and the mounting head 107 can mount the common component on the substrate, the determination unit 223 determines that the alternating mode is suitable for the component mounting operation (FIG. 24). Not possible at S22).

  Further, when both the mounting head 104 and the mounting head 107 can mount a common component on the board, the determination unit 223 determines that the independent mode is suitable for the component mounting work (possible in S22 in FIG. 24). .

  The selection unit 224 selects either the alternating mode or the independent mode as the production mode of the component mounting machine 200 according to the determination result of the determination unit 223.

  The mounting condition determination device 220 gives various instructions to the mechanism control unit 140 so that the component mounting machine 200 operates in the production mode determined by such selection.

  The component mounter 200 receives a production start instruction from an operator or an external device, or triggered by the mechanism control unit 140 receiving a production mode instruction from the mounting condition determination device 220. The operation in the production mode determined by the apparatus 220 is started.

  Note that the determination as to whether or not both the mounting head 104 and the mounting head 107 can mount the common component described with reference to FIG. 29 is performed using the component supply unit 106 and the component supply described with reference to FIGS. The determination may be made prior to determining whether both of the units 109 can supply common parts.

  The process shown in FIG. 24 is based on the premise that the component mounter 200 can adopt both the synchronous mode and the asynchronous mode.

  However, when it is known in advance that the component mounter 200 does not operate in the synchronous mode, that is, when it is assumed that the asynchronous mode is adopted, the component mounter 200 is changed as described in the first embodiment. It is advantageous from the viewpoint of production efficiency to operate in the alternating mode.

  Therefore, when the asynchronous mode is assumed, the determination regarding the restricted area (S21) may be omitted. Further, in this case, instead of determining whether or not the independent mode is appropriate (S22), it is determined whether or not the alternating mode is appropriate, for example, whether a component to be mounted on the R board is arranged in the component supply unit 106 on the F lane side. What is necessary is just to process.

  When it is assumed that the component mounting machine 200 adopts the synchronous mode, in the process shown in FIG. 24, at least a part of each of the F board and the R board is placed in the restricted area (in S21). Yes), the alternating mode is selected (S32).

  However, even when at least a part of each of the F substrate and the R substrate is both placed in the restricted region, the alternating hit mode is controlled by controlling to avoid interference between the mounting head 104 and the mounting head 107. Although it is one embodiment, the mounting head 104 and the mounting head 107 can be operated in a modified alternating driving mode (described later) in which the basic alternating driving mode is partially modified.

  For example, when one of the mounting head 104 and the mounting head 107 enters the restricted area, the other performs control such as stopping the mounting of the component on the board and waiting at a predetermined position outside the restricted area. It is possible.

  FIG. 30 is a diagram illustrating an example of exclusive operation control for the mounting head 104 and the mounting head 107.

  For example, as shown in FIG. 30, the mounting head 104 causes the mounting head 107 to perform a component suction operation while mounting the component on the F substrate. After that, the mounting head 107 causes the mounting head 104 to perform a component suction operation while mounting the component on the R substrate.

  That is, when the mounting head 104 and the mounting head 107 alternately perform component mounting operations, the mounting head 104 mounts components only on the F substrate while the mounting head 107 mounts components only on the R substrate, while maintaining the characteristics of the alternating mode. The mounting head 104 and the mounting head 107 are operated in a mode that incorporates the feature of the independent mode of mounting a component (hereinafter referred to as “deformation alternate hitting mode”). As a result, interference between the mounting head 104 and the mounting head 107 is always prevented.

  Therefore, when the synchronous mode is a prerequisite, such as when the number of production in the F lane and the number of production in the R lane are the same in the production plan, what is the relationship between the restricted area and each board? Regardless of whether or not it is such, it may be determined that the deformation alternating mode is suitable for the component mounting operation.

  The alternate beating mode that is not the deformation alternate beating mode is a mode in which two mounting heads alternately mount components on the F substrate and two mounting heads alternately mount components on the R substrate. That is. Such an operation of the two mounting heads is a basic operation of the alternating driving mode.

  Further, when at least a part of each of the F board and the R board is placed in the restricted area (S21), the components are arranged so that the mounting head 104 and the mounting head 107 do not enter the restricted area at the same time. It may be possible to optimize the mounting order in consideration of the mounting position.

  Such measures such as optimization of the mounting order make it possible to mount components on both boards in the independent mode in the state shown in FIG.

  However, if it is assumed that both the synchronous mode and the asynchronous mode are adopted, another problem such as a delay in processing or occurrence of complication may occur due to the adoption of the modified independent mode, for example. Therefore, in the second embodiment, the production mode is determined in consideration of the possibility that both the mounting head 104 and the mounting head 107 enter the restricted area at the same time.

  As described above, the mounting condition determination device 220 uses the information such as the board data 130a and the component library 130b before the component mounter 200 starts the component mounting operation, and either the independent mode or the alternating mode is scheduled. It is possible to determine whether it is suitable for the component mounting work to be performed.

  In other words, the mounting condition determining device 220 acquires information such as the type and dimensions of the components and the elements such as the board used for the scheduled component mounting work, and processes the information to obtain the independent mode and the alternating mode. Select one of them.

  Therefore, the mounting condition determination device 220 can determine a production mode suitable for a scheduled component mounting operation by a quantitative determination without depending on the operator.

  In the second embodiment, the determination unit 223 determines whether the common component cassette 110 can be attached to the component supply unit 106 and the component supply unit 109. It is determined whether or not both can supply common parts.

  However, the determination unit 223 can supply the common component by both the component supply unit 106 and the component supply unit 109 depending on whether or not the common component cassette 110 is attached to both the component supply unit 106 and the component supply unit 109. It may be determined whether or not.

  In other words, the component arrangement state at the time of this determination may be confirmed, and the production mode may be determined according to the arrangement state.

  For example, when the determination unit 223 determines which of the independent mode and the alternating driving mode is suitable for the component mounting operation to be started thereafter, the acquisition unit 222 at that time, the component supply unit 106 and the component supply unit 109 For example, information indicating the type and number of component cassettes 110 attached to is acquired from the component mounter 200.

  The determination unit 223 determines whether the common component cassette 110 is attached to the component supply unit 106 and the component supply unit 109 from this information and the board data 130a.

  When it is determined from these pieces of information that the common component cassette 110 is attached to only one of the component supply unit 106 and the component supply unit 109, the determination unit 223 is suitable for the component mounting operation. Judge that

  When it is determined that the common component cassette 110 is attached to both the component supply unit 106 and the component supply unit 109, the determination process for the nozzle described above is performed next.

  The mounting condition determination apparatus 220 can determine an appropriate production mode also by such information processing.

  Further, when determining that the common component cassette 110 is attached to only one of the component supply unit 106 and the component supply unit 109, the determination unit 223 determines that the alternating mode is suitable for the component mounting operation. Instead, it may be determined whether or not the common component cassette 110 can be attached to both the component supply unit 106 and the component supply unit 109.

  For example, it is assumed that the determination unit 223 determines that the common component cassette 110 is attached only to the component supply unit 106.

  In this case, it means that the common component cassette 110 is not attached to the component supply unit 109 at the time of this determination. However, if there is a dimensional margin in which the common component cassette 110 can be attached to the component supply unit 109 and the number of stocks of the common component cassette 110 is one or more, the common component cassette 110 also exists in the component supply unit 109. Can be attached.

  In this case, the determination unit 223 refers to the supply unit data 130c and determines whether the common component cassette 110 can be attached to the component supply unit 109 in terms of dimensions and quantity.

  If the determination unit 223 determines that the common component cassette 110 can be attached to the component supply unit 109, the determination unit 223 further performs a determination process for the nozzle.

  When the determination unit 223 determines that both the mounting head 104 and the mounting head 107 can mount the common component on the board, the selection unit 224 selects the independent mode as the production mode of the component mounting machine 200.

  In this case, for example, the mounting condition determination device 220 displays that the independent mode is possible by attaching the common component cassette 110 to the component supply unit 109 on the display device included in the component mounter 200.

  Thereby, the operator of the component mounting machine 200 can produce the component mounting board while operating the component mounting machine 200 in the independent mode by attaching the common component cassette 110 to the component supply unit 109.

  Further, for example, when the determination unit 223 determines that the component supply unit 109 has no dimensional allowance for mounting the common component cassette 110, the determination unit 223 determines that the component mounting operation to be started at that time It may be confirmed whether or not an unnecessary component cassette 110 is attached to the component supply unit 109.

  In this case, the determination unit 223 determines whether or not the common component cassette 110 can be attached when the unnecessary component cassette 110 is removed from the component supply unit 109, and whether or not the common component cassette 110 can be attached, Judgment is made by comparing the mounting pitch of the common component cassette 110.

  Further, when it is determined that the common component cassette 110 can be attached by removing the unnecessary component cassette 110 from the component supply unit 109, the mounting condition determination device 220 is, for example, a display device included in the component mounter 200. A message to that effect is displayed.

  Thereby, the operator of the component mounting machine 200 removes an unnecessary component cassette 110 from the component supply unit 109 and attaches the common component cassette 110 to the component supply unit 109, thereby operating the component mounting machine 200 in the independent mode. The production of component mounting boards can be performed.

  Further, in the second embodiment, the determination unit 223 determines whether or not a kind of nozzle (hereinafter referred to as “common nozzle”) capable of attracting common components to the mounting head 104 and the mounting head 107 and mounting them on the substrate is attached. Thus, both the mounting head 104 and the mounting head 107 determine whether or not a common component can be mounted on the substrate.

  However, the determination unit 223 can mount the common component on the substrate by both the mounting head 104 and the mounting head 107 depending on whether or not the common nozzle can be mounted on both the mounting head 104 and the mounting head 107. It may be determined whether or not.

  For example, as shown in FIG. 29, when the L nozzle is not attached to the mounting head 107, it is not determined that the alternating driving mode is suitable for the component mounting work. It is confirmed by communicating with the component mounter 200 whether or not the L nozzle is held in a station (not shown).

  Further, the determination unit 223 determines whether or not the mounting head 107 can mount necessary components on the R board even when the nozzle is replaced.

  For example, it is assumed that in order to attach one L nozzle to the mounting head 107, it is necessary to remove three S nozzles.

  In this example, since eight S nozzles are attached to the mounting head 107, even when three S nozzles and one L nozzle are exchanged, the mounting head 107 is a, b, α All of the above can be mounted on the R substrate.

  Therefore, when the L nozzle is held in the nozzle station, the mounting condition determination device 220 instructs the mechanism control unit 140 to set the three S nozzles at predetermined positions attached to the mounting head 107 to the L Replace with nozzle.

  Alternatively, as in the parts cassette data (see FIG. 21), the nozzle data 130d includes the types of nozzles that can be attached to the mounting head 104 and the mounting head 107, and the number of stocks (numbers that can be used) for each type. Keep it.

  Further, when the L nozzle is not attached to the mounting head 107, it is determined whether or not the L nozzle can be attached to the mounting head 107 by checking the nozzle data 130d.

  For example, if the number of L nozzles in stock is 1, a display indicating that the independent mode is possible is displayed on the display device included in the component mounter 200 by attaching the L nozzles to the mounting head 107.

  Thus, the operator of the component mounting machine 200 can produce the component mounting board while operating the component mounting machine 200 in the independent mode by attaching the L nozzle to the mounting head 107.

  The mounting condition determination apparatus 220 can determine an appropriate production mode also by such information processing.

  In the second embodiment, the mounting condition determination device 220 is provided in the component mounter 200 and determines the production mode for only the component mounter 200.

  However, the mounting condition determining device 220 may be realized as a device independent of the component mounting machine 200. In addition, various types of data regarding components, boards, and the like used for the component mounting work performed by each of the plurality of component mounters may be acquired to determine the production mode of the plurality of component mounters.

  In this case, since various data used in common by a plurality of component mounters can be used in common, the total amount of data required for determining the production mode for the plurality of component mounters is reduced.

  In addition, as described above, depending on the structure of the component mounter, there may be no restriction area in the independent mode. Therefore, in this case, the mounting condition determining apparatus 220 does not need to determine the relationship between the restricted area and the board (S21 in FIG. 24).

  In addition, it is clear that all necessary components are arranged in both the component supply unit 106 and the component supply unit 109, and necessary nozzles are attached to both the mounting head 104 and the mounting head 107. If it is clear that it is clear, it is not necessary to determine whether or not common parts can be supplied and mounted (S22 in FIG. 24).

(Embodiment 3)
In the third embodiment, a mounting condition determining device 320 having the functions of both the mounting condition determining device 120 of the first embodiment and the mounting condition determining device 220 of the second embodiment will be described.

  First, the main functional configuration of the component mounter 300 according to the third embodiment will be described with reference to FIG.

  In addition, since the device configuration for component mounting included in the component mounter 300 is the same as that of the component mounter 100 in the first embodiment described with reference to FIGS. 1 to 3, description thereof is omitted.

  FIG. 31 is a functional block diagram showing the main functional configuration of the component mounter 300 in the third embodiment.

  As shown in FIG. 31, the component mounter 300 includes a mounting condition determination device 320, a mounting information storage unit 130, and a mechanism control unit 140 in addition to the mechanism unit 150 including the mounting head 104 and the like.

  The mounting condition determination device 320 is a device that determines the mounting conditions of the component mounting machine 300. Specifically, before the start of a series of component mounting operations, the production mode suitable for the component mounting operation is determined from the synchronous mode and the asynchronous mode by the same processing as the mounting condition determining apparatus 120 of the first embodiment. (First judgment)

  The mounting condition determination device 320 further performs production suitable for the component mounting operation from the independent mode and the alternating mode in the same process as the mounting condition determination device 220 of the second embodiment when the synchronous mode is selected. The mode is judged (second judgment).

  When the mounting condition determination device 320 selects the independent mode as a result of the second determination, the mounting condition determination device 320 finally selects the synchronous mode as the result of the first determination. As a result, the component mounter 300 operates in the synchronous mode and the independent mode.

  However, when the alternating mode is selected as a result of the second determination, the mounting condition determining device 320 overturns the result of the first determination and finally selects the asynchronous mode. As a result, the component mounter 300 operates in an asynchronous mode and an alternating mode.

  This is because, as a result of the second determination, it is determined that the operation in the independent mode is impossible. In this case, the alternating mode in which the actual operation is possible is selected.

  As illustrated in FIG. 31, the mounting condition determination device 320 includes a communication unit 321, an acquisition unit 322, a first determination unit 330, and a second determination unit 340.

  The communication unit 321 is a processing unit for exchanging information between the mounting condition determining device 320 and other components in the component mounter 300 and external devices.

  The acquisition unit 322 is a processing unit that acquires various types of mounting information related to component mounting work scheduled to be performed by the component mounting machine 300.

  The first determination unit 330 includes a calculation unit 331 and a first selection unit 332. The calculation unit 331 is a processing unit having a production efficiency calculation function that the calculation unit 123 according to the first embodiment has. The first selection unit 332 is a processing unit that has a function of comparing two production efficiencies included in the selection unit 124 in the first embodiment and a function of selecting a production mode.

  The second determination unit 340 includes an aptitude determination unit 341 and a second selection unit 342. The aptitude determination unit 341 is a processing unit having a production mode suitability determination function included in the determination unit 223 according to the second embodiment. The second selection unit 342 is a processing unit having a production mode selection function included in the selection unit 224 according to the second embodiment.

  The second determination unit 340 is an example of a processing unit that executes a determination step in the mounting condition determination method of the present invention.

  The mounting information storage unit 130 is a storage device that stores various mounting information. Specifically, the component information and board information shown in FIG. 5 and the board data 130a to nozzle data 130d shown in FIGS. 19 to 22 are stored.

  The acquisition unit 322 reads the mounting information necessary for each of the first determination unit 330 and the second determination unit 340 from the mounting information storage unit 130 and outputs the mounting information to the first determination unit 330 or the second determination unit 340.

  Next, a flow of processing relating to production mode selection by the mounting condition determining apparatus 320 in the third embodiment will be described.

  FIG. 32 is a flowchart showing a flow of processing relating to production mode selection by the mounting condition determining apparatus 320 according to the third embodiment.

  As shown in FIG. 32, in the mounting condition determination device 320, the first determination (S110) and the second determination (S120) are executed after the acquisition of the mounting information (S100).

  The second determination (S120) corresponds to the processing in the determination step in the mounting condition determination method of the present invention.

  In the first determination (S110), the first determination unit 330 performs the same information processing as that of the mounting condition determination device 120 of the first embodiment.

  Specifically, the calculation unit 331 calculates information indicating production efficiency when operating in each of the synchronous mode and the asynchronous mode (S111).

  The first selection unit 332 selects the higher production efficiency of the synchronous mode and the asynchronous mode from the information indicating the production efficiency calculated by the calculation unit 331 (S112).

  That is, if the production efficiency is higher in the synchronous mode (synchronized in S112), the synchronous mode is selected (S113). Further, when the production efficiency is higher in the asynchronous mode (asynchronous in S112), the asynchronous mode is selected (S114).

  Note that, when selecting the asynchronous mode, the first selection unit 332 selects an alternating mode in which the mounting head 104 and the mounting head 107 cooperatively mount components on the F substrate and the R substrate, respectively. That is, the first selection unit 332 selects the asynchronous mode and the alternating mode as the production mode of the component mounter 300.

  When the synchronization mode is selected by the first selection unit 332, next, the second determination unit 340 determines whether or not the independent mode and the alternating mode are appropriate, similar to the mounting condition determination device 220 of the second embodiment. The

  In other words, even when the synchronous mode is selected in order to improve production efficiency, it is possible to execute the independent mode that realizes the substrate transfer mode to fully demonstrate the high production efficiency of the synchronous mode. I don't know whether or not.

  Therefore, the mounting condition determining apparatus 320 further determines whether or not the independent mode can be executed when the synchronous mode is selected.

  Specifically, when the synchronization mode is selected by the first determination unit 330, the suitability determination unit 341 determines the component mounter 300 in the independent mode based on the dimensions of the board to be mounted included in the board data 130a. It is determined whether or not the board is placed for component mounting within the restricted area (S121).

  As in the second embodiment, aptitude determination unit 341 may determine whether or not the production mode is appropriate based on whether or not a portion including the mounting positions of the F substrate and the R substrate is placed in the restricted area. .

  When determining that the board is not placed for component mounting within the restricted area of the component mounter 300 in the independent mode (not in S121), the aptitude determination unit 341 further supplies common components and mounts them on the board. Is determined on both lanes side (S122).

  The availability determination (S122) uses the supply unit data 130c, the component library 130b, the nozzle data 130d, and the like, as in the availability determination (S22 in FIG. 24) in the second embodiment.

  The aptitude determination unit 341 determines that the independent mode is suitable for the component mounting operation when it is determined that the supply of the common component and the mounting on the board can be performed in both lanes (possible in S122).

  Therefore, the second selection unit 342 finally selects the synchronous mode and the independent mode as the production mode of the component mounter 300 (S123).

  In addition, when determining that the supply of the common component and the mounting on the board are not possible in both lanes (not possible in S122), the aptitude determination unit 341 determines that the alternating mode is suitable for the component mounting operation. .

  Further, when the suitability determination unit 341 determines that the board is placed for component mounting within the restricted area of the component mounter 300 in the independent mode (in S121), the alternate beating mode is the component. Judged to be suitable for mounting work.

  When the alternating mode is selected from these determination results, it means that the operation in the independent mode is impossible as described above. Therefore, the second selection unit 342 finally selects the asynchronous mode and the alternating mode as the production mode of the component mounting machine 300 (S124).

  If it is determined that the board is placed in the restricted area (S121), it is determined whether the supply of common components and mounting on the board are possible in both lanes without selecting the asynchronous mode. (S122).

  That is, as described with reference to FIG. 30, the mounting head 104 and the mounting head 107 are operated in the deformation alternate driving mode, so that the mounting head can be used regardless of the relationship between the restricted area and each substrate. Interference between 104 and the mounting head 107 is prevented.

  Therefore, even when the second determination unit 340 determines that the substrate is placed in the restricted area (S121), the second determination unit 340 does not immediately select the asynchronous mode but supplies the common component and the substrate. If mounting on both lanes is possible (possible in S122), a selection of a synchronous mode and a modified alternating mode may be performed.

  INDUSTRIAL APPLICABILITY The present invention can be used as a component mounting machine including a plurality of conveyors arranged in parallel and a method for determining an optimal mounting condition for a production line in which these are connected. Specifically, a production mode suitable for a scheduled component mounting operation can be determined based on quantitative judgment among the synchronous mode and the asynchronous mode.

  Therefore, the present invention is particularly useful as a mounting condition determination method or the like for improving the production efficiency when the production of component mounting boards is performed in parallel. The present invention is also useful as a mounting condition determining device that determines such mounting conditions.

FIG. 1 is a schematic diagram showing an outline of a component mounter in the first embodiment. FIG. 2 is a schematic top view showing the lane configuration of the component mounter in the first embodiment. FIG. 3 is a schematic diagram showing a positional relationship between the mounting head and the component supply unit in the first embodiment. FIG. 4 is a functional block diagram showing the main functional configuration of the component mounter in the first embodiment. FIG. 5 is a diagram illustrating a first example of the data configuration of the mounting information in the first embodiment. FIG. 6 is a diagram illustrating an arrangement example of component cassettes and an example of board allocation in the component mounter according to the first embodiment. FIG. 7A is a diagram for explaining the outline of the synchronous mode in the component mounter of the first embodiment, and FIG. 7B shows the outline of the asynchronous mode in the component mounter of the first embodiment. It is a figure for demonstrating. FIG. 8 is a diagram illustrating an example of throughput values in each of the synchronous mode and the asynchronous mode according to the first embodiment. FIG. 9A is a diagram for explaining the magnitude of the influence of the stop time of component mounting work on the throughput in the synchronous mode in the first embodiment, and FIG. 9B is a diagram illustrating the first embodiment. It is a figure for demonstrating the magnitude | size of the influence with respect to the through-put of the stop time of the component mounting operation | work in the case of asynchronous mode. FIG. 10 is a diagram illustrating a correlation between the throughput and the stop time in each of the synchronous mode and the asynchronous mode in the first embodiment. FIG. 11 is a flowchart illustrating a first example of a process flow relating to production mode selection by the mounting condition determining apparatus according to the first embodiment. 12A is a diagram showing a specific example of information about the substrate A used in the process shown in FIG. 11, and FIG. 12B is a diagram showing the information about the substrate B used in the process shown in FIG. It is a figure which shows the specific example of information. FIG. 13 is a diagram illustrating a first example of information indicating production efficiency in each of the synchronous mode and the asynchronous mode calculated by the calculation unit according to the first embodiment. FIG. 14 is a diagram illustrating a second example of the data configuration of the mounting information according to the first embodiment. FIG. 15 is a flowchart illustrating a second example of a process flow relating to production mode selection by the mounting condition determining apparatus according to the first embodiment. 16A is a diagram showing a specific example of information about the substrate A used in the process shown in FIG. 15, and FIG. 16B is a diagram showing the information about the substrate B used in the process shown in FIG. It is a figure which shows the specific example of information. FIG. 17 is a diagram illustrating a second example of information indicating production efficiency in each of the synchronous mode and the asynchronous mode calculated by the calculation unit according to the first embodiment. FIG. 18 is a functional block diagram showing the main functional configuration of the component mounter in the second embodiment. FIG. 19 is a diagram illustrating an example of a data configuration of substrate data in the second embodiment. FIG. 20 is a diagram illustrating an example of a data configuration of a part library according to the second embodiment. FIG. 21 is a diagram illustrating an example of a data configuration of supply unit data according to the second embodiment. FIG. 22 is a diagram illustrating an example of a data configuration of nozzle data according to the second embodiment. FIG. 23 is a flowchart showing a basic processing flow related to production mode selection by the mounting condition determining apparatus of the second embodiment. FIG. 24 is a flowchart showing a detailed processing flow relating to production mode selection by the mounting condition determining apparatus according to the second embodiment. FIG. 25 is a diagram showing an example of a restricted area in the alternate beating mode in the second embodiment. FIG. 26A is a diagram illustrating a state in which neither the F substrate nor the R substrate is placed in the restricted region in the independent mode, and FIG. 26B is a diagram in the restricted region in the independent mode. FIG. 6 is a diagram illustrating a state in which a part of each of the F substrate and the R substrate is placed on the substrate. FIG. 27 is a diagram illustrating an example of component placement in the component mounter of the second embodiment. FIG. 28 is a diagram illustrating another example of component placement in the component mounter of the second embodiment. FIG. 29 is a diagram illustrating an example of a nozzle arrangement state in each mounting head according to the second embodiment. FIG. 30 is a diagram illustrating an example of exclusive operation control for two mounting heads according to the second embodiment. FIG. 31 is a functional block diagram showing the main functional configuration of the component mounter in the third embodiment. FIG. 32 is a flowchart showing the flow of processing relating to production mode selection by the mounting condition determining apparatus of the third embodiment. FIG. 33A is a diagram for explaining a synchronous mode in a conventional component mounting machine having two lanes, and FIG. 33B shows an asynchronous mode in a conventional component mounting machine having two lanes. It is a figure for demonstrating. It is a figure for demonstrating the difference in the influence on production efficiency by the stop of the mounting operation in synchronous mode and asynchronous mode.

100, 200, 300 Component mounting machine 101 First conveyor 101a, 102a Fixed rail 101b, 102b Movable rail 102 Second conveyor 104, 107 Mounting head 105, 108 Beam 106, 109 Component supply unit 110 Component cassette 120, 220, 320 Mounting Condition determining device 121, 221, 321 Communication unit 122, 222, 322 Acquisition unit 123, 331 Calculation unit 124, 224 Selection unit 130 Mounting information storage unit 130 a Substrate data 130 b Component library 130 c Supply unit data 130 d Nozzle data 140 Mechanism control unit 150 Mechanism unit 223 determination unit 330 first determination unit 332 first selection unit 340 second determination unit 341 suitability determination unit 342 second selection unit

Claims (11)

A mounting condition determination method for determining a mounting condition of a component mounting machine that includes a plurality of transfer conveyors arranged in parallel and that can perform component mounting operations on a board transferred to each of the plurality of transfer conveyors in parallel. And
An acquisition step for acquiring mounting information including information related to continuity of each component mounting work scheduled to be performed in parallel;
Using the mounting information acquired in the acquiring step, the component mounter synchronizes the transfer of the substrate after mounting the components between the respective conveyors, and the substrate transfer and the substrate transfer after mounting the components. A calculation step for calculating information indicating production efficiency when operating in each of the asynchronous modes in which each conveyor is independently performed;
A mounting condition determination method including: a selection step of selecting a production mode having a higher production efficiency of the synchronous mode and the asynchronous mode from information indicating the production efficiency calculated in the calculation step. In the calculating step,
Using information related to the continuity included in the mounting information, a predicted stop that is a predicted value of a stop time of each component mounting work scheduled to be performed in parallel in the synchronous mode and the asynchronous mode Calculate the time,
The mounting condition determination method according to claim 1, wherein information indicating production efficiency of each of the synchronous mode and the asynchronous mode is calculated using the calculated predicted stop time. The component mounter includes a replaceable component storage means in which a plurality of types of components are stored,
In the acquisition step, in each component mounting operation scheduled to be performed in parallel, the number of uses, which is the number for each type of component mounted per board, and the number of components stored in each of the plurality of component storage means, To acquire the implementation information including information related to the continuity,
The mounting condition determination method according to claim 2, wherein, in the calculating step, the predicted stop time due to component shortage is calculated using the number of uses and the number of stored components. In the acquisition step, the mounting information including the suction rate or mounting rate of components mounted on a substrate in each component mounting operation scheduled to be performed in parallel as information related to the continuity is acquired,
The mounting condition determining method according to claim 2, wherein in the calculating step, the predicted stop time due to a suction error or a mounting error is calculated using the suction rate or the mounting rate. In the obtaining step, the mounting information including information indicating an operation rate of a component mounting machine corresponding to each of the component mounting operations performed in parallel on the component mounting machine is acquired as information related to the continuity,
The mounting condition determining method according to claim 1, wherein in the calculating step, information indicating production efficiency in each of the synchronous mode and the asynchronous mode is calculated using information indicating the operation rate included in the mounting information. The component mounter includes two mounting heads and two component supply units that supply components to the two mounting heads.
In the selection step,
When the synchronous mode is selected, the component mounting machine as a production mode to be executed together with the synchronous mode is further provided with a component to each mounting head of the plurality of transfer conveyors. Select the independent mode to mount the components only on the board conveyed by the conveyor that is closest to the component supply unit that is the supply source of
When the asynchronous mode is selected, as the production mode to be executed by the component mounter together with the asynchronous mode, the two mounting heads alternately mount components on the boards conveyed by the plurality of conveyors. The mounting condition determination method according to claim 1, wherein a hit mode is selected. The component mounter includes two mounting heads and two component supply units that supply components to the two mounting heads.
In the acquiring step, the mounting information including data related to a board or a component used for the scheduled component mounting operation is acquired;
The mounting condition determination method further includes:
The alternate mounting mode in which the two mounting heads alternately mount components on the substrate transported by the two transport conveyors, and the two mounting heads, respectively, of the two transport conveyors, Which production mode of the independent mode in which the components are mounted only on the board conveyed by the conveyance conveyor closer to the component supply unit that is the component supply source to the mounting head is suitable for the scheduled component mounting operation. A determination step of determining whether or not using the mounting information acquired in the acquisition step,
In the determining step, when the synchronous mode is selected in the selecting step, it is determined whether or not the component mounter can be operated in the independent mode;
If it is determined that it is possible to operate in the independent mode, it is determined that the synchronous mode is suitable for the scheduled component mounting work,
The mounting condition according to claim 1, wherein if it is determined that the operation in the independent mode is not possible, the selection result in the selection step is overturned and it is determined that the asynchronous mode is suitable for the scheduled component mounting operation. Decision method. A mounting condition determining apparatus that includes a plurality of conveyors arranged in parallel and that determines a mounting condition of a component mounting machine capable of performing component mounting operations on a board conveyed to each of the plurality of conveyors in parallel. And
Obtaining means for obtaining mounting information including information related to continuity of each component mounting work scheduled to be performed in parallel;
Using the mounting information acquired by the acquisition means, the component mounter synchronizes the transfer of the substrate after mounting the components between the conveyors, and the substrate transfer and the substrate transfer after mounting the components. Calculating means for calculating information indicating the production efficiency when operating in each of the asynchronous modes to independently perform each on the conveyor,
A mounting condition determining apparatus comprising: selection means for selecting a production mode having a higher production efficiency of the synchronous mode and the asynchronous mode from information indicating the production efficiency calculated by the calculation means. A component mounting machine comprising a plurality of conveyors arranged in parallel, and capable of performing component mounting operations in parallel on a substrate transported to each of the plurality of conveyors,
The mounting condition determining device according to claim 8,
A mounting head that sucks the component and mounts the sucked component on each type of substrate that has been transported by the plurality of transport conveyors;
Control means for operating the component mounting machine in a production mode selected by the mounting condition determining device of the synchronous mode and the asynchronous mode by controlling the operations of the plurality of transfer conveyors and the mounting head; Component mounter equipped. A component mounting method for performing component mounting on a plurality of boards in parallel,
The conveyance step which conveys a board | substrate to each of these several conveyance conveyor according to the production mode selected by the mounting condition determination method of any one of the said synchronous mode and the said asynchronous mode. ,
A component mounting method comprising: a mounting step of mounting a component on a substrate transported by each of the plurality of transport conveyors according to the selected production mode. A program for determining mounting conditions of a component mounting machine that includes a plurality of transport conveyors arranged in parallel and that can perform component mounting work on a board transported to each of the plurality of transport conveyors in parallel. ,
An acquisition step for acquiring mounting information including information related to continuity of each component mounting work scheduled to be performed in parallel;
Using the mounting information acquired in the acquiring step, the component mounter synchronizes the transfer of the substrate after mounting the components between the respective conveyors, and the substrate transfer and the substrate transfer after mounting the components. A calculation step for calculating information indicating production efficiency when operating in each of the asynchronous modes in which each conveyor is independently performed;
A program for causing a computer to execute a selection step of selecting a production mode having a higher production efficiency of the synchronous mode and the asynchronous mode from information indicating the production efficiency calculated in the calculation step.

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