JP2019071477A - Device for optimizing component mounting line and method for optimizing component mounting line - Google Patents

Abstract

To properly evaluate a result of optimization processing executed before starting production of substrates in a component mounting line, or clarify the setting state of a processing condition set variable in the optimization processing, thereby making full use of intrinsic performance of a device.SOLUTION: A component mounting line optimization device comprises: a cycle time calculation unit that calculates a cycle time required for each of component mounting machines to attach a component of a component type allocated through optimization processing to one substrate; a shortest time calculation unit that calculates a shortest cycle time in which each of the component mounting machines can attach the component of the component type allocated through the optimization processing to one substrate in an attachment execution condition in which attachment efficiency is assumed to be highest; an operation efficiency calculation unit that calculates operation efficiency representing the degree in which the cycle time comes closer to the shortest cycle time for each of the component mounting machines; and an operation efficiency display unit that displays the operation efficiency.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting line in which a plurality of component mounters are arranged in series, and in particular, performs optimization processing based on process conditions that can be changed before starting production of a substrate on the component mounting line. The present invention relates to an optimization device and an optimization method.

  As equipment for producing a substrate on which a large number of components are mounted, there are a solder printer, a component mounter, a reflow machine, a substrate inspection device, and the like. It is common practice to connect these facilities to construct a substrate production line. Furthermore, component mounting lines are often configured by arranging a plurality of component mounters in series. In order to efficiently produce a substrate by fully utilizing the original device performance of the component mounting line, a technology for performing optimization processing before the start of production has been developed. In optimization processing, a large number of components to be mounted on a substrate are allocated to a plurality of component mounters, and the cycle time required for mounting components on one substrate by each component mounter is shortened and equalized, A simulation is performed. In the simulation, changeable processing conditions are set in consideration of the properties of the substrate to be produced. Examples of techniques related to this kind of optimization processing are disclosed in Patent Documents 1 and 2.

  The production information automatic collection system of Patent Document 1 acquires the working time for each worker in a production line in which a plurality of workers are arranged in order, and calculates and displays the line balance efficiency of the working time. According to this, the line balance efficiency can be grasped in real time during production, the factor which inhibits the production can be grasped, and the improvement of the production efficiency can be dealt with in real time. That is, although there is a difference between the worker and the component mounting machine, the purpose of improving the efficiency of the production line by equalizing the work load is common, and the line balance efficiency is used as an index of evaluation.

  Moreover, the monitoring method of the mounting tact of patent document 2 collects and monitors the mounting tact performance value (performance value of cycle time) in operation from a component mounting machine, and there is no loss of the mounting tact performance value and the component mounting machine. The tact loss is calculated based on the standard mounting tact at the time of operation, and the cause of the decrease in the mounting tact actual value is analyzed. Furthermore, according to the description of the embodiment, it is disclosed to perform theoretical calculation of the mounting tact and tact loss instead of the mounting tact actual value. Furthermore, theoretical calculation of mounting tact balance in a component mounting line is also disclosed, and line balance efficiency is obtained by simulation.

JP, 2008-217451, A Patent No. 3583121 gazette

  By the way, there are cases where components of a specific component type are allocated differently from others in the structure of some of the component mounting machines that make up the component mounting line. For example, there is a line configuration in which many component mounters include feeder devices, and some component mounters include tray devices. In this case, the large parts supplied from the tray device are limitedly allocated to some part mounting machines. Further, for example, there is a line configuration in which only a specific component mounting machine has a suction nozzle for deformation and only a special deformation component is allocated.

  In such a line configuration, a component mounting machine to which components of a specific component type are allocated tends to have a reduced number of component mounting points and a short cycle time. This degrades the line balance efficiency and makes it difficult to evaluate the optimization process. In addition, in a component mounting machine to which components of a specific component type are allocated, the component allocation can not be changed, and it is difficult to improve line balance efficiency. Therefore, when evaluating the optimization result and the line balance efficiency, it is preferable to consider excluding the component mounting machine to which the component of the specific component type is allocated.

  On the other hand, the processing conditions set in the optimization processing are not always set optimally. For example, an upper limit time is set as a default value so that the optimization time that can be spent for the optimization process does not become an excessive processing time. Due to this limitation, it has been apt to occur that the optimization processing is discontinued and production is shifted before excellent optimization results are obtained, and the inherent device performance of the component mounting line can not be utilized. In addition, as the processing conditions, default conditions on the safety side that do not cause any problem in the production of substrates are initialized, and adverse effects due to the operator's forgetting to set are prevented. Therefore, although the operator may set appropriate processing conditions in accordance with the substrate type of the substrate to be produced, it has also occurred that the optimization processing is performed with the default conditions.

  Furthermore, even if the optimization result is obtained, it is difficult to determine whether the optimization result is good or not, and it is difficult to determine whether the optimization result is good, because it is unclear whether the optimum processing conditions have been set. It is also difficult. As a result, the component mounting line can not take advantage of the original device performance. Therefore, it is extremely important to set appropriate processing conditions, carry out optimization processing, and properly evaluate the optimization results.

  The present invention has been made in view of the problems in the background art, and appropriately evaluates the result of optimization processing performed before starting production of a substrate on a component mounting line, or performs optimization processing The problem to be solved is to provide an optimization apparatus and an optimization method of a component mounting line in which setting conditions of processing conditions which are variably set are clarified to make it possible to utilize an original apparatus performance.

  The optimization apparatus of the component mounting line according to the present invention picks up the components from the substrate transport apparatus for carrying in, positions and unloads the substrate at the mounting implementation position, a component supply apparatus for sequentially supplying components, and the component supply apparatus. A component transfer device for mounting on a positioned substrate, and when manufacturing the substrate on a component mounting line in which a plurality of component mounters including a plurality of component mounters are arranged in series, optimum for production based on process conditions that can be changed. An optimization apparatus for a component mounting line that performs an optimization process, wherein each of the component mounters calculates the cycle time required to mount a component type of a component type allocated by the optimization process on a single substrate Cycle time calculation unit, and parts of parts types allocated by the optimization process by each of the part mounters under the virtual mounting condition under which the mounting efficiency is maximized. A shortest time computing unit for computing the shortest cycle time that can be mounted on a substrate; an operating efficiency computing unit for computing the operating efficiency indicating the degree to which the cycle time approaches the shortest cycle time for each of the component mounting machines; And an operation efficiency display unit for displaying the efficiency.

  Further, according to the method for optimizing a component mounting line of the present invention, a substrate transfer apparatus for loading, positioning and carrying out a substrate to a mounting implementation position, a component supply apparatus for sequentially supplying components, and collecting the components from the component supply apparatus And a component transfer apparatus for mounting on a substrate positioned on the substrate, and when manufacturing the substrate on a component mounting line in which a plurality of component mounters provided in series are arranged, production is performed based on process conditions that can be changed. A method of optimizing the component mounting line for performing the optimization processing related to step-by-step, the cycle time required for each of the component mounters to mount the component types of the component types allocated by the optimization processing on a single substrate It is assumed that the cycle time calculation step to calculate each and the part type parts allocated by the optimization processing by each of the component mounting machines are virtually mounted with the highest mounting efficiency. Operation efficiency calculation for calculating the operation efficiency indicating the degree to which the cycle time approaches the shortest cycle time for each of the component mounting machines, and the shortest time calculation step for calculating the shortest cycle time mountable on one substrate under each condition And an operation efficiency display step for displaying the operation efficiency.

  According to the optimization apparatus and optimization method of the component mounting line described above, the operation efficiency indicating the degree to which the cycle time approaches the shortest cycle time is calculated and displayed for each component mounting machine. Therefore, the operator can confirm the operation efficiency of each component mounting machine and appropriately evaluate the result of the optimization process. In addition, when the operation efficiency is low, the operator corrects the setting improperness and setting omission of the processing condition which is the cause, performs the optimization process again, and obtains an excellent optimization result. Device performance can be exploited.

It is a top view which shows typically the structural example of the component mounting line used as the object of the optimization apparatus of embodiment. It is a perspective view showing two parts mounters. It is a block diagram which shows the apparatus structure and functional structure of the optimization apparatus of the component mounting line of embodiment. It is a figure of a processing flow explaining processing contents of a line balance processing unit. It is a figure of the example of a display which illustrates and illustrates the processing result of a line balance processing part. It is a figure of the example of a display which illustrates and illustrates the processing result of an operating efficiency processing part. It is a figure of the example of a display which illustrates and illustrates the processing result of an effective process part.

(1. Configuration example of component mounting line 1 and component mounting machine 2)
First, configuration examples of the component mounting line 1 and the component mounter 2 will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view schematically showing a configuration example of a component mounting line 1 which is a target of the optimization device 7 of the embodiment. As illustrated, the component mounting line 1 is configured by arranging ten first to tenth component mounters 21 to 2A in series. The first component mounter 21 on the left side in the figure is on the upstream side, and the tenth component mounter 2A on the right side is on the downstream side. Also, as shown by the XY coordinate axes in the figure, the direction in which the substrate K is transported in order to the first to tenth component mounters 21 to 2A is the X axis direction, and the direction orthogonal to the X axis direction in the horizontal plane is Y Axial direction. FIG. 2 is a perspective view showing two component mounters 2. The component mounter 2 is configured by assembling a substrate transfer device 3, a component supply device 4, a component transfer device 5, a component camera 61, a nozzle station 62, a control device, and the like to a machine base 69.

  The substrate transfer apparatus 3 is disposed near the center of the component mounter 2 in the longitudinal direction (Y-axis direction). The substrate transfer device 3 is a so-called double conveyor type device in which the first transfer device 31 and the second transfer device 32 are arranged in parallel. Each of the first and second transfer devices 31 and 32 has a pair of guide rails, a pair of conveyor belts, and a backup device, which are not shown. The pair of guide rails are arranged to extend in the transport direction (X-axis direction). A pair of endless annular conveyor belts are juxtaposed on the inner sides of the pair of guide rails. The pair of conveyor belts places and rotates the substrate K on the conveyor conveyance surface, and carries the substrate K into and out of the mounting implementation position. A backup device is disposed below the mounting implementation position. The backup device pushes up the substrate K, clamps it in a horizontal posture, and positions it at the mounting implementation position.

  The component supply device 4 is provided at the front in the longitudinal direction of the component mounter 2 (left front side in FIG. 2). The component supply device 4 is configured by arranging a plurality of feeder devices 41 in a row. The feeder device 41 has a main body portion 42, a supply reel 43 rotatably and detachably mounted at the rear of the main body portion 42, and a component supply portion 44 provided at an upper end portion of the main body portion 42. A carrier tape holding components at regular intervals is wound around the supply reel 43. The tip of the carrier tape is pulled out to the component supply unit 44 to supply the components.

  The component transfer device 5 is a so-called XY robot type device movable in the X-axis direction and the Y-axis direction. The component transfer device 5 is disposed from the rear in the longitudinal direction of the component mounter 2 (right back side in FIG. 2) to the upper side of the component supply device 4. The component transfer device 5 includes a head drive mechanism 51, a mounting head 52, and the like. The mounting head 52 detachably holds one or a plurality of suction nozzles for suctioning and mounting components. The head drive mechanism 51 drives the mounting head 52 in the X-axis direction and the Y-axis direction.

  The component camera 61 is provided upward on the upper surface of the machine base 69 between the component supply device 4 and the first conveyance device 31. The component camera 61 picks up an image of the state of the component sucked by the suction nozzle while the mounting head 52 moves from the component supply device 4 onto the substrate K. Further, a nozzle station 62 is disposed on the machine base 69 adjacent to the component camera 61. The nozzle station 62 exchangeably holds the suction nozzles in the plurality of nozzle holding holes.

  The control device (not shown) holds the type and the mounting order of the components to be mounted on the substrate K, and the mounting sequence specifying the feeder device 41 or the like for supplying the components. The control device controls the component mounting operation in accordance with the mounting sequence based on the imaging data of the component camera 61 and the detection data of the sensor (not shown). Further, the control device sequentially collects and updates operation status data such as the number of production of the substrate K whose production has been completed, the mounting time required for mounting the component, and the number of occurrences of component suction errors. The control device has a monitor device 63 disposed on the upper front side of the upper cover 68. The monitor device 63 has a display unit for displaying information to the operator and an input unit for performing input setting by the operator.

  The first to ninth component mounters 21 to 29 constituting the component mounting line 1 are provided with the component supply device 4 including the plurality of feeder devices 41 described above. Only the tenth component supply device 2A on the most downstream side is provided with a component supply device 4A consisting of a tray device 47 (shown in FIG. 1). The tray device 47 mounts and supplies large deformed parts on the replaceable tray 48. Further, the mounting head 52 of the component transfer device 5 of the tenth component supply device 2A holds a dedicated special shape suction nozzle for suctioning the irregular shape component. Therefore, the number of types of component types and the number of components allocated to the tenth component supply device 2A are smaller than those of the first to ninth component mounters 21 to 29. And, between the tenth component supply device 2A and the other first to ninth component mounters 21 to 29, the component types to be allocated can not be interchanged.

(2. Configuration of Optimization Device 7 of Component Mounting Line of Embodiment)
Next, the structure of the optimization apparatus 7 of the component mounting line of embodiment is demonstrated. FIG. 3 is a block diagram showing an apparatus configuration and a functional configuration of the optimization apparatus 7 of the component mounting line of the embodiment. The optimization device 7 includes a computer 71 and software operating on the computer 71. The computer device 71 includes an input unit 72, a display unit 73, a memory unit 74, and a communication unit 75. The input unit 72 is a part for performing input setting by the operator. The display unit 73 is a part that displays information to the operator. The memory unit 74 is a unit that stores various software, processing conditions at the time of software execution, processing results, and the like. The communication unit 75 is a unit that exchanges information with an external memory device or another computer device through communication.

  In the present embodiment, the computer device 71 is connected to the job database 76 via the communication unit 75. The monitor devices 63 of the first to tenth component mounters 21 to 2A can also access the job database 76. The job database 76 holds information used when the computer device 71 performs optimization processing. For example, the job database 76 holds information on the substrate K to be produced, information on parts to be mounted, and information on dimensions and performance of the first to tenth component mounters 21 to 2A constituting the component mounting line 1 doing. The present invention is not limited to this, and the information used when performing the optimization process may be held in the memory unit 74.

  The optimization device 7 functionally includes a processing selection unit 81, an optimization processing unit 82, a line balance processing unit 83, an operation efficiency processing unit 84, an execution degree processing unit 85, and a common display unit 86. The processing selection unit 81 is a part that selects and executes any one of the optimization processing unit 82, the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85. This selection can be performed manually by the operator from the input unit 72. Also, the processing selection unit 81 may automatically perform this selection. For example, each time a job to be optimized is updated in the job database 76, the processing selection unit 81 can select the optimization processing unit 82 to perform optimization processing of the job. The processing selection unit 81 can select and implement a plurality of the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85. In this case, the common display unit 86 functions.

  Before starting the production of the substrate K in the component mounting line 1, the optimization processing unit 82 carries out the optimization processing related to production based on the processing conditions whose setting can be changed. Prior to performing the optimization process, the operator sets processing conditions. The set processing conditions are held in the memory unit 74. The memory unit 74 initially holds default conditions so that the optimization process can be performed without delay even if the operator does not set the process conditions. As the default conditions, the conditions on the safe side are initially set so as not to affect the production regardless of the substrate type of the substrate K.

  As processing conditions that can be changed in setting, handling conditions of the substrate K and handling conditions of parts can be exemplified. The handling condition of the substrate K means the condition under which the substrate transfer device 3 of the first to tenth component mounters 21-2A handles the substrate K. As the handling conditions of the substrate K, the transport speed and the transport acceleration of the substrate K, the operating condition at the time of positioning of the substrate K by the backup device, and the like correspond. The default values of the transport speed of the substrate K and the transport acceleration are set to somewhat smaller values so that reliable transport can be performed with any substrate type. In addition, the default value of the operating condition at the time of positioning of the substrate K is the maximum height Hmax so that no problem occurs even if the substrate K is a double-sided mounting substrate and a component with the maximum height Hmax is mounted on the lower surface. It is set in consideration of.

  Moreover, the handling conditions of components mean the conditions when the component transfer device 5 of the first to tenth component mounting machines 21-2A handles components. Component handling conditions include the type of suction nozzle used for suctioning the component, the vertical operation speed and acceleration when the suction nozzle sucks and mounts the component, and the component supply device with the suction nozzle sucking the component The operation speed and the acceleration in the horizontal direction when moving from 4 to the substrate K at the mounting implementation position are applicable. The type of suction nozzle is set within the maximum range in which the target part can be held by suction. For the vertical and horizontal motion speeds and accelerations, the fastest values in the component transfer device 5 are taken as default values. However, setting values different from the default values may be set in accordance with the component transfer devices of other models. The appropriate operating speed and acceleration also differ depending on the type of suction nozzle used by the component transfer device 5.

  Here, the handling conditions of the substrate K and components are not necessarily fixed conditions, and the substrate K can be produced even if the setting is changed within a certain range. Therefore, changing the setting of the handling conditions in accordance with the actual conditions of the substrate K to be actually produced and the parts to be mounted increases the chances of obtaining an even better optimization result. As a result, the original device performance of the component mounting line 1 can be utilized.

  Furthermore, optimization time that can be spent for optimization processing is included in the processing conditions that can be changed. The default value for optimization time is a short minimum time to allow smooth transition to production without much processing time. However, if production can not be rushed, it is preferable to change the setting of the optimization time to a long time and execute the optimization process with sufficient time.

  As an object item to carry out the optimization process, for example, there is an allocation method of allocating the component types and the number of components of a large number of components mounted on the substrate K to the first to tenth component mounting machines 21-2A. Here, the tenth component mounter 2A differs from the other in the structure of the component supply device 4A, and the components to be allocated are limited to the specific component types supplied from the tray device 47. On the other hand, there is no limitation in the kind of parts allocated to the 1st-9th parts mounting machines 21-29. Therefore, it is an object of the optimization processing to appropriately allocate the majority of the remaining component types to the first to ninth component mounting machines 21 to 29 and shorten and equalize their cycle times.

  In addition, the mounting order of the components allocated to the first to tenth component mounters 21 to 2A, and the arrangement order of the feeder devices 41 of the first to ninth component mounters 21 to 29 are also subjected to the optimization processing. It is a target item. Depending on the mounting order of parts and the order of arrangement of the feeder devices 41, the operation efficiency of the parts transfer device 5 fluctuates and affects the cycle time.

  The optimization result obtained by the optimization process is temporarily stored in the memory unit 74. When the optimization processing is performed a plurality of times, the best optimization result is held in the memory unit 74. The final optimization result is transferred to the control device of the first to tenth component mounters 21 to 2A through the communication unit 75 and used for the production of the substrate K. Note that various known methods can be applied as appropriate for the specific implementation method of the optimization process.

(3. Function of the line balance processing unit 83)
The line balance processing unit 83 calculates and displays the line balance efficiency LBE based on the optimization result obtained by the optimization processing unit 82, excluding a part of specific component mounting machines. The line balance processing unit 83 includes a cycle time calculation unit 831, an exclusion machine setting unit 832, a balance efficiency calculation unit 833, and a balance efficiency display unit 834. FIG. 4 is a diagram of a processing flow for explaining the processing content of the line balance processing unit 83. As shown in FIG. FIG. 5 is a view of a display example for explaining the processing result of the line balance processing unit 83.

  In step S1 of FIG. 4, the cycle time calculation unit 831 has cycle time tc required for each component mounting machine 21 to 2A to mount the component type of the component type allocated by the optimization processing on one substrate K. Calculate At this time, the cycle time calculation unit 831 uses the set processing conditions in addition to the various information of the job database 76. As shown by the bar graph in the display example of FIG. 5, the cycle times tc of the first to ninth component mounters 21 to 29 are substantially equalized with some differences. On the other hand, the cycle time tc of the tenth mounter 2A is considerably shorter than the others.

  In the next step S2, the exclusion machine setting unit 832 sets so as to exclude a specific part of the component mounting machines from the subsequent arithmetic processing. Specifically, the exclusion machine setting unit 832 is a component mounting machine having a cycle time tc shorter than others, a component mounting machine having a smaller number of types of component types or a smaller number of components than others, and a component supply device 4A and component transfer mounting. The structure of at least one of the devices 5 is different from the others, and any one of the mounters to which a part of a specific part type is allocated is excluded. The exclusion machine setting unit 832 excludes the tenth component mounting machine 2A that corresponds to any of the exclusion conditions.

  The number of excluded machines is not limited to one, and may be more than one. For example, the total number of components mounted on the substrate K may be small, and components may not be allocated to the eighth component mounter 28. Then, the eighth component mounter 28 only carries through the substrate K, and the cycle time tc becomes extremely short. In this case, the exclusion machine setting unit 832 excludes the eighth component mounter 28 and the tenth component mounter 2A.

In steps S3 to S5, the balance efficiency calculation unit 833 calculates the line balance efficiency LBE, which represents the degree to which the cycle time of the component mounting machine that has not been excluded is equalized, according to the following equation 1.
LBE (%) = (Tsum ÷ Tmax) × 100 ...... (Equation 1)

  Specifically, in step S3, the balance efficiency computing unit 833 calculates a total value Tsum obtained by summing up the cycle times tc of the first to ninth component mounters 21 to 29 not excluded. In step S4, the balance efficiency calculation unit 833 multiplies the maximum value tmax of the cycle time tc by the number N of component mounting machines not excluded, to calculate Tmax. In the display example of FIG. 5, the maximum value tmax of the cycle time tc is generated in the third mounter 23. In addition, the number N of the first to ninth component mounters 21 to 29 not excluded is N = 9. In step S5, the balance efficiency calculation unit 833 calculates the line balance efficiency LBE by Equation 1.

The line balance efficiency LBE may be calculated using Equation 2 below, which is a modification of Equation 1.
LBE (%) = (tav ÷ tmax) × 100 (Equation 2)
However, it is the average value tav which averaged the cycle time tc of the 1st-9th component mounting machines 21-29 which were not excluded, and is the maximum value tmax (value of 3rd component mounting machine 23) of cycle time tc.

  In the next step S6, the balance efficiency display unit 834 displays the line balance efficiency LBE together with the bar graph of the cycle time tc. In the display example of FIG. 5, “LBE = 96.5% (excluding No. 10)” is displayed, and the value of the line balance efficiency LBE and the exclusion machine are shown.

  If the tenth component mounting machine 2A is not excluded, the line balance efficiency LBE deteriorates to about 92%. Even if the operator sees the deteriorated line balance efficiency LBE, it is difficult to evaluate the optimization result. On the other hand, in view of the good line balance efficiency LBE of 96.5% when the tenth component mounting machine 2A is excluded, the operator makes the cycle times tc of the first to ninth component mounting machines 21 to 29 substantially equal. Can be evaluated properly.

(4. Function of operating efficiency processing unit 84)
The operating efficiency processing unit 84 calculates and displays the operating efficiencies M of the first to tenth component mounters 21 to 2A based on the optimization result obtained by the optimization processing unit 82. The operating efficiency processing unit 84 includes a cycle time computing unit 841, a shortest time computing unit 842, an operating efficiency computing unit 843, and an operating efficiency display unit 844. The cycle time calculation unit 841 performs the same calculation processing as the cycle time calculation unit 831 of the line balance processing unit 83, and calculates the cycle time tc of each of the component mounting machines 21 to 2A.

  On the other hand, the shortest time calculation unit 842 can mount the parts of the part type allocated to each of the mounters 21 to 2A on one board K under the virtual mounting condition under which the mounting efficiency is maximized. The shortest cycle times tmin are respectively calculated. The virtual mounting execution conditions mean conditions under which the component mounting can be completed in the shortest time without being restricted by the processing conditions set by the optimization processing unit 82. Therefore, for example, the transport speed and acceleration of the substrate K, and the operating speed and acceleration of the suction nozzle are set to the mounting implementation conditions at the maximum allowable values. Also, for example, under the assumed mounting implementation conditions, the types of suction nozzles that can be used for suctioning components are expanded to the maximum, and the number of times of suction nozzle replacement is minimized.

The operation efficiency calculation unit 843 calculates an operation efficiency M, which represents the degree to which the cycle time tc approaches the shortest cycle time tmin, for each of the component mounters 21 to 2A, using Equation 3 below.
M (%) = (tmin ÷ tc) × 100 ...... (Equation 3)

  FIG. 6 is a view of a display example for illustrating the processing result of the operation efficiency processing unit 84. As shown in FIG. As illustrated, the operating efficiency display unit 844 displays the cycle time tc, the shortest cycle time tmin, and the operating efficiency M of each of the component mounters 21 to 2A. The cycle time tc is indicated by a white bar, the shortest cycle time tmin is indicated by a hatched bar, and the operating efficiency M is indicated by a line graph.

  Although both the cycle time tc and the shortest cycle time tmin are values obtained by simulation, the operating efficiency M is still effective for evaluating the actual mounting operation of each of the component mounters 21 to 2A. When the operating efficiency M is close to 100%, the operator can expect that the component mounting machine concerned will exhibit the original apparatus performance. Conversely, when the operating efficiency M is low, the operator can review the optimization process. That is, the operator investigates the cause of the low operation efficiency M, and corrects the processing conditions and executes the optimization processing again if there is an improper setting or a setting failure of the processing conditions.

(5. Function of effective degree processing unit 85)
The effectiveness degree processing unit 85 calculates and displays the degree of effectiveness of optimization of the set processing conditions after the optimization processing unit 82 performs the optimization processing. However, even after the execution of the optimization processing, if the processing conditions are set by the operator, the effective degree processing unit 85 can operate. The effective degree processing unit 85 includes an effective degree calculation unit 851 and an effective degree display unit 852.

  The effectiveness degree computing unit 851 sets points for each of the plurality of processing conditions individually, and computes and scores the degree of effectiveness of the optimization. The effective degree calculation unit 851 marks a high calculation value when the setting is changed from the default condition and marks a low calculation value when the setting is not changed for some processing conditions. Further, for some processing conditions, the effective degree computing unit 851 scores high computed values if the set processing conditions are good, and scores low computed values if it is not good. There are no particular restrictions on the size of the points assigned to the multiple processing conditions, the number of stages of the calculated values, and the scoring method.

  FIG. 7 is a diagram of a display example for illustrating the processing result of the effective degree processing unit 85. As shown in FIG. The effective degree display unit 852 displays the processing result using, for example, the display format of the list. In the example of FIG. 7, the calculated values and the points are scored for 10 items of the processing conditions 1 to 10. The distribution points for each processing condition are 5 points or 10 points, and the total is 70 points. The effective degree of optimization is indicated by the sum of scored operation values, and is 40 points in the example of FIG.

  For example, the processing condition 6 is to set the height H of the mounted part on the lower surface of the substrate K, and 10 points are allocated. If the height H is properly set in accordance with the properties of the substrate K to be produced, the positioning of the substrate K is performed in a short time, and therefore, it is scored as 10 points in the figure. If the height H has not been changed from the default maximum height Hmax, it takes a long time to position the substrate K, so it is scored as 0. In addition, when the height H is set smaller than the height of the parts actually mounted, there is a concern about interference when transporting the substrate K. At this time, the optimization processing unit 82 displays a setting error without starting the optimization processing, and urges the operator's correction setting.

  Further, for example, the processing condition 7 is to set an optimization time that can be spent for the optimization processing, and 10 points are allocated. If the optimization time is set to unlimited, the optimization process is performed without being interrupted midway, and therefore, a score of 10 points is scored. If the optimization time is set to a certain time due to reasons such as production schedule constraints, it will be scored 5 points. If the optimization time is not changed from the default value of the minimum value, it is feared that sufficient optimization processing will not be performed, and therefore, it is scored as 0 in the figure.

  The operator can comprehensively confirm the effective degree based on the total points of the calculated values, and can determine whether the optimization processing has been performed under appropriate processing conditions. When the total score of the calculated values is low, the operator can check the calculated values of the individual processing conditions, correct the improper setting of the processing conditions as a cause, and forget the setting, and execute the optimization process again.

  As described above, when the processing selection unit 81 selects a plurality of the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85, the common display unit 86 functions. The common display unit 86 simultaneously displays a plurality of items among the line balance efficiency LBE, the operation efficiency M, and the execution degree of optimization (total point of the calculated values). Thus, the operator can accurately determine whether or not an excellent optimization result has been obtained by comprehensively considering the displayed plurality of items.

  For example, the operation efficiency M of each of the component mounters 21 to 2A may be low and the cycle time tc may be long. In this case, if the cycle times tc of the component mounters 21 to 2A are equally long and balanced, the line balance efficiency LBE becomes a high numerical value. However, such optimization results are not appropriate. As a measure to make it easy to see this, the common display unit 86 displays the line balance efficiency LBE and the operation efficiency M of each of the component mounters 21 to 2A together on one screen. This allows the operator to view both the line balance efficiency LBE and the operating efficiency M together and accurately determine that the optimization result is excellent only when both are high.

(Aspect and Effect of Optimization Device 7 of Component Mounting Line of Embodiment)
The optimization apparatus 7 of the component mounting line 1 according to the embodiment includes the substrate transport apparatus 3 for carrying in, positioning and carrying out the substrate K at the mounting implementation position, the component supply apparatus 4 for sequentially supplying components, and Can be changed when the board K is manufactured in the component mounting line 1 in which a plurality of component mounters 2 including the component transfer device 5 mounted on the substrate K sampled and positioned, are arranged in series An optimization apparatus 7 for a component mounting line that performs optimization processing relating to production based on processing conditions, wherein components mounted by the component mounting machines 21 to 2A are optimized by the optimization processing on one board K Cycle time calculation unit 831 for calculating the cycle time tc required for mounting on each of the parts and setting a specific part mounter (10th part mounter 2A) to be excluded from the calculation processing thereafter Balance setting unit 832; balance efficiency calculation unit 833 for calculating the line balance efficiency LBE indicating the degree to which the cycle times tc of the first to ninth component mounters 21 to 29 not excluded are equalized; And a balance efficiency display unit 834 for displaying the efficiency LBE.

  According to this, after a specific component mounter (tenth component mounter 2A) which tends to deteriorate the line balance efficiency LBE is excluded from the arithmetic processing, the line balance efficiency LBE is calculated and displayed . Therefore, the line balance efficiency LBE does not deteriorate due to a specific component mounting machine, and the operator can confirm the effective line balance efficiency LBE and appropriately evaluate the result of the optimization process. In addition, when the line balance efficiency LBE is not good, the operator changes the setting of the processing conditions and executes the optimization process again to obtain an excellent optimization result and utilize the original device performance of the component mounting line 1 be able to.

  Furthermore, some specific component mounting machines excluded by the exclusion machine setting unit 832 are component mounting machines having a shorter cycle time tc than others, the number of kinds of component types to be allocated or the number of parts smaller than others. The structure of at least one of the component supply device 4A and the component transfer device 5 is one of component mounters to which components of a specific component type are allocated unlike the other. According to this, it is possible to accurately calculate the highly effective line balance efficiency LBE by reliably excluding the component mounter (the tenth component mounter 2A) that deteriorates the line balance efficiency LBE.

  Further, the optimization apparatus 7 of the component mounting line 1 according to the embodiment has a cycle time tc required for mounting the components of the component types allocated by the optimization processing on one substrate K by each of the component mounting machines 21 to 2A. Parts of the component types allocated by the optimization processing by the cycle time calculation unit 841 that calculates the respective components and the component mounting machines 21 to 2A, under the assumed mounting implementation condition where the mounting efficiency is the highest, the substrate K The shortest time computing unit 842 which computes the shortest cycle time tmin which can be mounted on each, and the operating efficiency computing unit which computes the operating efficiency M indicating the degree to which the cycle time tc approaches the shortest cycle time tmin for each component mounting machine 21-2A. And 843 and an operation efficiency display unit 844 for displaying the operation efficiency M.

  According to this, the operation efficiency M indicating the degree to which the cycle time tc approaches the shortest cycle time tmin is calculated and displayed for each of the component mounting machines 21 to 2A. Therefore, the operator can confirm the operation efficiency M of each of the component mounters 21 to 2A and appropriately evaluate the result of the optimization process. In addition, when the operation efficiency M is low, the operator corrects the setting improperness and setting omission of the processing condition that is the cause, performs the optimization process again, and obtains an excellent optimization result. The original device performance can be utilized.

  Further, the optimization apparatus 7 of the component mounting line 1 according to the embodiment includes an execution degree operation unit 851 that calculates the execution degree of the optimization of the processing conditions set to perform the optimization process, and the execution degree of the optimization. And an effective degree display unit 852 for displaying the

  According to this, the execution degree of the optimization of the set processing conditions (total point of the operation values) is calculated and displayed. Therefore, the operator can confirm the degree of effectiveness and determine whether the optimization process has been performed under appropriate processing conditions. In addition, when the degree of effectiveness (total points of the calculated values) is low, the operator corrects the improper setting of setting process conditions or causes of the setting to be the cause, performs the optimization process again, and obtains an excellent optimization result. The original device performance of the component mounting line 1 can be utilized.

  Furthermore, the execution degree operation unit 851 is a calculation method that changes the calculation value of the execution degree of the optimization depending on whether the processing conditions are changed from the default conditions or not, and optimization is performed according to the set processing conditions. Use a calculation method that changes the calculation value of the degree of effectiveness. According to this, since the degree of effectiveness of the optimization is known for each of the plurality of processing conditions, the operator can easily correct the improper setting of the processing conditions or the setting omission that causes the reduction of the effective degree.

  In addition, the optimization device 7 of the component mounting line 1 according to the embodiment displays a common display in which a plurality of items among the line balance efficiency LBE, the operation efficiency M, and the optimization degree (total points of operation values) are displayed together. It further comprises a part 86. According to this, the operator can accurately determine whether or not it is an excellent optimization result by comprehensively considering the displayed plurality of items.

  Each aspect of the optimization apparatus 7 of the component mounting line 1 of the embodiment described above can be implemented as an optimization method of the component mounting line 1. The optimization method of the component mounting line 1 according to the embodiment can be realized by replacing at least one function of the optimization processing unit 82, the line balance processing unit 83, and the operation efficiency processing unit 84 with a plurality of processing steps. The effect of the optimization method of the component mounting line 1 of the embodiment is the same as the effect of the optimization device 7.

(7. Application and Modification of Embodiment)
In the embodiment, the optimization device 7 includes the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85, but is not limited thereto. That is, the minimum configuration of the optimization apparatus 7 may include any one of the line balance processing unit 83, the operation efficiency processing unit 84, and the effective degree processing unit 85, and the optimization processing unit 82.

  Furthermore, the line balance efficiency LBE, which represents the degree to which the cycle time tc of the component mounting machine is equalized, may have a definition different from Formula 1 or Formula 2 or a different calculation method. Moreover, although the effectiveness degree calculating part 851 scores a calculation value about ten items of processing conditions 1-10, it is not limited to this. For example, depending on the properties of the substrate K and the operation status of the model of the component mounter 2 or the like, setting to add or omit the processing condition to be scored can be performed, and the number can be increased or decreased from 10 items. The present invention is capable of various other applications and modifications.

1: Component mounting line 2: Component mounting machine 21-2A: 1st to 10th component mounting device 3: Board conveying device 4: Component supply device 4A: Component supply device consisting of tray device 5: Component transfer device 7: Component Implement line optimization device 71: Computer device 81: Process selection unit 82: Optimization processing unit 83: Line balance processing unit 831: Cycle time calculation unit 832: Exclusion machine setting unit 833: Balance efficiency calculation unit 834: Balance efficiency display Unit 84: operating efficiency processing unit 841: cycle time computing unit 842: shortest time computing unit 843: operating efficiency computing unit 844: operating efficiency display unit 85: effective degree processing unit 851: effective degree computing unit 852: effective degree display unit 86 : Common display area

Claims (2)

A substrate transfer apparatus for loading, positioning and unloading a substrate to a mounting implementation position; a component supply apparatus for sequentially supplying components; and a component transfer apparatus for collecting the components from the component supply apparatus and mounting on the positioned substrate An apparatus for optimizing a component mounting line for performing optimization processing relating to production based on processing conditions that can be changed when the substrate is produced in a component mounting line in which a plurality of component mounters provided in series are arranged in series. And
A cycle time calculation unit that calculates the cycle time required for each of the component mounters to mount a component of a component type allocated by the optimization processing on a single substrate;
The shortest time calculation that calculates the shortest cycle time that each of the component mounters can mount the components of the component type allocated by the optimization processing on one board under the virtually assumed mounting execution condition that maximizes the mounting efficiency Department,
An operating efficiency computing unit that computes an operating efficiency that represents the degree to which the cycle time approaches the shortest cycle time for each of the component mounting machines;
And an operation efficiency display unit for displaying the operation efficiency. A substrate transfer apparatus for loading, positioning and unloading a substrate to a mounting implementation position; a component supply apparatus for sequentially supplying components; and a component transfer apparatus for collecting the components from the component supply apparatus and mounting the substrate When manufacturing the substrate in a component mounting line in which a plurality of component mounters including a plurality of component mounting machines are arranged in series, an optimization method of a component mounting line for performing optimization processing relating to production based on processing conditions that can be changed And
A cycle time calculation step in which each of the component mounters calculates a cycle time required to mount a component of a component type allocated by the optimization processing on a single substrate;
The shortest time calculation that calculates the shortest cycle time that each of the component mounters can mount the components of the component type allocated by the optimization processing on one board under the virtually assumed mounting execution condition that maximizes the mounting efficiency Step and
An operation efficiency calculating step of calculating an operation efficiency indicating the degree to which the cycle time approaches the shortest cycle time for each of the component mounting machines;
And D. an operation efficiency display step of displaying the operation efficiency.

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