JP2012004606A - Component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method for a component mounting device that can reduce a tact loss.SOLUTION: The component mounting method comprises: an adsorption step (S116) in which an implementation head 213a adsorbs a component supplied from a component supply part 211b; an implementation step (S120) in which components adsorbed by the implementation head 213a in the adsorption step is implemented on the basal plate 20; and an evacuation step (S112) in which the implementation head 213b evacuates to a position in which the implementation head 213b does not interfere with the implementation head 213a when the implementation head 213a adsorbs the components in the adsorption step (S116).

Description

  The present invention relates to a component mounting method for a component mounter in which a mounting head sucks a component supplied from a component supply unit and mounts the component on a substrate.

  2. Description of the Related Art Conventionally, a so-called alternating component mounting machine having two mounting heads that suck and move components has been provided. Such a component mounting machine includes two sub-equipment on the front side and the rear side, and each sub-equipment has a mounting head and a component supply unit that supplies components to the mounting head. Each mounting head repeats alternately or in parallel to pick up one or more components supplied from the component supply unit, move them onto the substrate, and mount them.

  In such a component mounting method of the component mounter, the front mounting head sucks components from the front component supply unit, and the rear mounting head sucks components from the rear component supply unit. The mounting head that sucks the component alternately mounts the component on one substrate (see, for example, Patent Document 1). By doing so, the components can be adsorbed from the component supply unit in a short time and can be mounted on the substrate without interference between both mounting heads.

  There is also known a component mounting machine in which one sub-equipment is provided with a mounting head, and the other sub-equipment is provided with a working head such as an inspection head or a coating head. Similarly, in the component mounting method of such a component mounter, the mounting head sucks a component from the component supply unit on the side where the mounting head is provided, and mounts the component on the board. This also allows the component to be adsorbed from the component supply unit in a short time and mounted on the substrate while avoiding interference between the mounting head and the working head.

JP 2006-245139 A

  However, in the conventional component mounting method, there is a problem that a loss of mounting time (tact) for mounting a plurality of predetermined components on the board occurs as follows. The tact loss refers to the time that is excessively long when a component is mounted on a substrate.

  In the case of an alternating component mounting machine having two mounting heads, the rear mounting head mounts the components on the substrate while the front mounting head sucks the components. Further, while the front mounting head mounts the component on the substrate, the rear mounting head sucks the component. By doing in this way, components can be efficiently mounted on a board and a tact can be shortened.

  However, there are cases in which tact loss occurs due to the two mounting heads alternately adsorbing components and losing balance when mounting on the substrate.

  For example, it may take time for the rear mounting head to pick up the components, and a waiting time may occur in the front mounting head. In particular, when the component attracted by the rear mounting head is a tray component placed on a tray disposed in the rear component supply unit, a waiting time may occur in the front mounting head. That is, it may take time for the tray on which the tray component is placed to be raised and lowered by the elevator for raising and lowering and to be placed at a predetermined position in the component supply unit. This waiting time is a tact loss.

  During this waiting time, the front mounting head can suck the components from the front component supply unit and mount them on the board. However, the front mounting head continuously picks up components from the front component supply unit and mounts them on the board. For this reason, parts are mounted in an order different from the order of mounting parts optimized to minimize the tact, and the tact may not be shortened. That is, in this case, tact loss occurs.

  In addition, for example, even when it is desired to mount a larger number of components than the components supplied from the front component supply unit with the front mounting head, it is possible to arrange a predetermined number or more components in the front component supply unit. Can not. Therefore, in this case, it is necessary to place the component in the rear component supply unit and mount it with the rear mounting head. However, when it is necessary to replace the suction nozzle of the rear mounting head in order to suck the component, it takes time to replace the nozzle. This nozzle replacement time is a loss of tact.

  Further, there is a case where a suction nozzle that can suck the component cannot be disposed on the rear mounting head, or the rear head is a working head that does not have a suction nozzle such as an inspection head or a coating head. In this case, the component cannot be mounted on the board with the rear head. For this reason, it is necessary to arrange another component mounting machine in order to mount the component, and the time for transporting and producing the board to the other component mounting machine is a tact loss.

  As described above, the conventional component mounting method has a problem that tact loss occurs.

  Therefore, the present invention has been made in view of such problems, and an object thereof is to provide a component mounting method for a component mounter that can reduce tact loss.

  In order to achieve the above object, a component mounting method according to the present invention is a component mounting method for a component mounter in which a mounting head adsorbs a component and mounts the component on a board, and the component mounter is the mounting head. A sub-equipment having a first head and a first supply unit that supplies parts to the first head, and a second head that is a working head arranged to face the first head and parts are supplied. A sub-equipment having a second supply unit, wherein the component mounting method includes an adsorption step in which the first head adsorbs a component supplied from the second supply unit, and the first head in the adsorption step. A mounting step for mounting the component sucked on the substrate, and a retracting step for retracting the second head to a position that does not interfere with the first head when the first head sucks the component in the suction step. Including It is characterized in.

  As a result, when the first head sucks the component, the second head retracts to a position where the first head does not interfere with the first head, thereby reducing time loss when the first head sucks the component. Therefore, tact loss can be reduced.

  Further, the second supply unit includes a tray on which components are placed, the second head is a mounting head that sucks tray components that are components placed on the tray, and the component mounting method includes: Furthermore, the tray includes a tray suction step in which the second head sucks the tray components when the second head is retracted in the retracting step. The component mounting method further includes a component suction determination step for determining whether or not the first head needs to suck a component supplied from the second supply unit, and a plurality of predetermined plurality of predetermined steps. A tact calculating step for calculating a mounting time required for mounting the component on the substrate, wherein the tact calculating step is a mounting time when the first head sucks the component supplied from the first supply unit. A first tact and a second tact which is a mounting time when the first head sucks a component supplied from the second supply unit are calculated, and in the component sucking determination step, When the length is shorter than the first tact, it is determined that the first head needs to suck the component supplied from the second supply unit, and in the suction step, the component suction determination step , If it is deemed necessary, the first head, characterized in that to pick up the components supplied from the second supply unit.

  As a result, if there is a waiting time in the first head while the second head is sucking the tray parts, the imbalance between the operating times of the first head and the second head is eliminated. Loss can be reduced. That is, if the tact is not shortened even when the first head mounts the component supplied from the first supply unit while the second head is sucking the tray component, the first head is not connected to the second supply unit. Tact can be shortened by mounting the components supplied from. In addition, even when the first head mounts a component supplied from the first supply unit and the tact time is shortened while the second head is sucking the tray component, the first head is supplied from the second supply unit. The tact can be further shortened by mounting the parts to be processed. This can reduce tact loss when the second head sucks the tray components.

  The present invention can be realized not only as such a component mounting method, but also as a component mounter for mounting components according to the method, a program for causing the component mounter to mount components, and storing the program. It can also be realized as a storage medium.

  The component mounting method of the present invention is a component mounter that mounts components on a substrate and can reduce tact loss, so that the practical value of the present invention is extremely high.

1 is an external view showing a configuration of a component mounting system that realizes a component mounting method according to the present invention. It is a top view which shows the main structures inside a component mounting machine. It is a schematic diagram which shows the positional relationship of a mounting head and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated components. It is a block diagram which shows the function structure of the control system of the component mounting machine in this Embodiment. It is a figure which shows an example of NC data. It is a figure which shows an example of a component library. It is a figure explaining an example of the component mounting method in this Embodiment. It is a figure explaining an example of the component mounting method in this Embodiment. It is a flowchart which shows an example of the component mounting method in this Embodiment. It is a figure explaining an example of the component mounting method concerning the modification 1. 10 is a flowchart illustrating an example of a component mounting method according to Modification 1. It is a figure explaining an example of the component mounting method concerning the modification 2. 10 is a flowchart illustrating an example of a component mounting method according to Modification 2.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a component mounting system 10 that realizes a component mounting method according to the present invention.

  The component mounting system 10 is a system that mounts components on a substrate 20 to produce a circuit board, and includes a control device 100 and a component mounter 200.

  The control device 100 determines a component mounting condition or the like by the component mounting machine 200, and controls the component mounting machine 200 so that the mounting is performed according to the mounting condition.

  The component mounter 200 receives the substrate 20 from the upstream side, and the mounting head absorbs the component and mounts the component on the substrate 20 in accordance with the mounting condition determined by the control device 100. And the board | substrate 20 with which components were mounted is sent out downstream.

  FIG. 2 is a plan view showing the main configuration inside the component mounter 200.

  The component mounter 200 includes two mounting units (sub-equipment) 210 a and 210 b that mount components on the substrate 20. The two mounting units 210a and 210b cooperate with each other to perform a mounting operation on one board 20. In addition, let the conveyance direction of the board | substrate 20 be an X-axis direction, and let the direction perpendicular | vertical to the X-axis direction in a horizontal surface be a Y-axis direction. The two mounting units 210a and 210b are arranged side by side in the Y-axis direction.

  The mounting unit 210a includes a component supply unit 211a, a mounting head 213a, a component recognition camera 214a, and a nozzle station 215a.

  The component supply unit 211a includes an array of a plurality of component cassettes 212a that store component tapes. In addition, the component cassettes 212a of the component supply unit 211a are arranged along the X-axis direction. The component tape is, for example, a plurality of components of the same component type arranged evenly on a tape (carrier tape) and supplied in a state of being wound around a reel or the like. The parts arranged on the part tape are, for example, chips, and specifically, 0402 chip parts and 1005 chip parts.

  The mounting head 213a is a mounting head called a multi mounting head, for example, and can include a plurality of suction nozzles. For example, ten components can be sucked and mounted on the substrate 20 from the component supply unit 211a. Such a mounting head 213a is slidably attached to a beam 231a configured in a shaft shape. Therefore, the mounting head 213a moves along the beam 231a by driving, for example, a motor.

  The beam 231a is slidably attached in the Y axis direction on a pair of beam driving robots 240 arranged in parallel to each other along the Y axis direction. Therefore, the beam 231a moves on the pair of beam driving robots 240 along the Y-axis direction by driving a motor or the like, for example. That is, the mounting head 213a is moved in the X-axis direction and the Y-axis direction by the beam driving robot 240 and the beam 231a. Here, the mounting head 213a can move to a position where the components supplied from the component cassette 212b in the mounting unit 210b can be sucked.

  The component recognition camera 214a is used to photograph the component sucked by the mounting head 213a and inspect the suction state of the component two-dimensionally or three-dimensionally.

  The nozzle station 215a has a replacement suction nozzle. The suction nozzle for replacement is a suction nozzle for replacement when there is a part that cannot be sucked by the suction nozzle provided in the mounting head 213a or when there is an abnormality in the suction nozzle.

  Similarly to the mounting unit 210a, the mounting unit 210b includes a component supply unit 211b, a mounting head 213b, a component recognition camera 214b, and a nozzle station 215b.

  Here, the component supply unit 211b includes a tray 216 and an array of a plurality of component cassettes 212b for storing component tapes.

  The tray 216 is raised and lowered by an elevator for raising and lowering (not shown), and is disposed at a predetermined position of the component supply unit 211b. In addition, a large component that cannot be stored in the component cassette 212b (hereinafter referred to as a tray component) is placed on the tray 216. Specifically, the tray components are stored in a storage recess formed continuously in a plurality of times in the vertical and horizontal directions on the tray 216.

  The mounting head 213b is, for example, a multi-mounting head, and can suck components from the tray 216 of the component supply unit 211b or the component cassette 212b and mount them on the substrate 20. Similar to the mounting head 213a, such a mounting head 213b is moved in the X-axis direction and the Y-axis direction by the beam driving robot 240 and the beam 231b.

  Here, the mounting head 213b is attached so that it can move to a position where it does not interfere with the mounting head 213a when the mounting head 213a picks up a component from the component cassette 212b. Specifically, the mounting head 213b is attached so that it can be retracted backward (the one with the larger coordinate value in the Y-axis direction) on the component supply unit 211b so as not to interfere with the mounting head 213a. Further, the mounting head 213b can move on the tray 216 in order to suck the tray components placed on the tray 216.

  The detailed configuration of the other mounting unit 210b is the same as that of the mounting unit 210a, and will not be described.

  FIG. 3 is a schematic diagram showing the positional relationship between the mounting head 213a and the component cassette 212a. As described above, for example, a maximum of ten suction nozzles nz can be attached to the mounting head 213a. The mounting head 213a to which the ten suction nozzles nz are attached can suck components from each of a maximum of ten component cassettes 212a at the same time (by one up and down movement).

  Similarly, the mounting head 213b can simultaneously pick up components from each of the component cassettes 212b (by a single up-and-down motion) and can suck tray components from the tray 216.

  FIG. 4 is a diagram illustrating an example of a component tape and a reel that contain components.

  Components such as chip-type electronic components are housed in a housing recess 221a formed continuously at a predetermined interval on a carrier tape 221 shown in FIG. 4, and are covered with a cover tape 222 attached to the upper surface. The carrier tape 221 with the cover tape 222 attached in this way is supplied to the user in a taping form wound around the reel 223 by a predetermined quantity. The carrier tape 221 and the cover tape 222 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  The mounting unit 210a of such a component mounting machine 200 moves the mounting head 213a to the component supply unit 211a and causes the mounting head 213a to attract the component supplied from the component supply unit 211a. Then, the mounting unit 210a moves the mounting head 213a onto the component recognition camera 214a at a constant speed, causes the component recognition camera 214a to capture images of all the components sucked by the mounting head 213a, and accurately determines the component suction position. To detect.

  Moreover, the mounting unit 210a can also adsorb the components supplied from the component supply unit 211b to the mounting head 213a. In this case, the mounting unit 210a moves the mounting head 213a to the component supply unit 211b and causes the mounting head 213a to attract the component supplied from the component supply unit 211b. Then, the mounting unit 210a moves the mounting head 213a onto the component recognition camera 214b at a constant speed, causes the component recognition camera 214b to capture images of all the components sucked by the mounting head 213a, and accurately determines the suction position of the component. Let it be detected.

  Then, the mounting unit 210 a moves the mounting head 213 a to the substrate 20 and sequentially mounts all the sucked components on the mounting points of the substrate 20. The mounting unit 210a mounts all the predetermined components on the board 20 by repeatedly performing such operations of suction, movement, and mounting by the mounting head 213a.

  In addition, the mounting unit 210b moves the mounting head 213b to the component supply unit 211b, and causes the component supplied from the component supply unit 211b to attract the mounting head 213b. Note that the components supplied from the component supply unit 211b are components supplied from the component cassette 212b and tray components placed on the tray 216. The mounting unit 210b also mounts all the predetermined components on the substrate 20 by repeatedly executing an operation in which the mounting head 213b moves to the substrate 20 and mounts the components, similarly to the mounting unit 210a. .

  Then, each of the mounting unit 210a and the mounting unit 210b picks up a component from the component supply unit when the counterpart mounting unit is mounting the component, and conversely, the counterpart mounting unit picks up the component from the component supply unit. When mounting the components, the components are alternately mounted on the board 20 so as to mount the components. In other words, the component mounter 200 is configured as a so-called alternating component mounter.

  When the mounting unit 210a causes the mounting head 213a to attract the component supplied from the component supply unit 211b, the mounting unit 210b retracts the mounting head 213b backward on the component supply unit 211b. Thereby, it is possible to prevent the mounting head 213a and the mounting head 213b from interfering with each other. The mounting unit 210b can attract the tray component placed on the back side of the tray 216 (the side with the larger coordinate value in the Y-axis direction) to the mounting head 213b retracted backward.

  That is, when the mounting unit 210b sucks the tray component placed on the back side of the tray 216 to the mounting head 213b, the mounting unit 210a sucks the component supplied from the component supply unit 211b to the mounting head 213a. Can be made.

  Note that when the suction nozzle needs to be replaced, the mounting head 213a moves to the nozzle station 215a and replaces the suction nozzle. Similarly, when the suction head needs to be replaced, the mounting head 213b moves to the nozzle station 215b and replaces the suction nozzle.

  FIG. 5 is a block diagram showing a functional configuration of a control system of the component mounter 200 in the present embodiment.

  The component mounter 200 according to the present embodiment includes an input unit 251, a display unit 252, a determination unit 253, a head control unit 254, a control unit 255, a communication unit 256, and a storage unit 257.

  The input unit 251 includes, for example, a keyboard and a mouse. The input unit 251 receives an operation from the operator and notifies the determination unit 253, the head control unit 254, the control unit 255, and the like of the operation result.

  The display unit 252 is configured by, for example, a liquid crystal display, and displays a result determined by the determination unit 253, an operation state of the head control unit 254, and data stored in the storage unit 257 or the like. To do.

  The control unit 255 controls the component recognition cameras 214a and 214b, the display unit 252, the determination unit 253, the head control unit 254, and the like according to the operation received by the input unit 251 and the data received by the communication unit 256. To do. Further, the control unit 255 controls a motor or the like for transporting the substrate 20 and transports the substrate 20 to an appropriate position.

  The communication unit 256 communicates with the control device 100. For example, the communication unit 256 includes NC data 257a indicating information on each mounting point of the board 20, a component library 257b indicating information on each component, mounting conditions such as an arrangement of component cassettes 212a and 212b, and a component mounting order. Is acquired from the control device 100 and stored in the storage unit 257.

  The storage unit 257 stores the NC data 257a, the component library 257b, and the mounting condition data 257c acquired by the communication unit 256.

  FIG. 6 is a diagram illustrating an example of the NC data 257a.

The NC data 257a is a collection of information indicating mounting points of all components to be mounted. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 257b shown in FIG. 7, the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board 20), and the control data is , The restriction information (mounting nozzle type that can be used, the maximum movement acceleration of the mounting head, etc.) regarding the mounting of the component is shown. The mounting angle θi indicates an angle at which the suction nozzle that picks up the component of the component type ci should rotate. NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  FIG. 7 is a diagram illustrating an example of the component library 257b.

  The component library 257b is a library in which unique information about all component types that can be handled by the component mounter 200 is collected. As shown in FIG. 7, the component library 257b includes a component size for each component type (component name), tact (tact specific to the component type under a certain condition), and other constraint information (types of usable suction nozzles). , Recognition method by component recognition camera, maximum acceleration ratio of mounting head, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library 257b may include information such as the color and shape of the component.

  The mounting condition data 257c indicates the arrangement of the component cassettes 212a and 212b in the component supply units 211a and 211b, the mounting order in which the mounting heads 213a and 213b mount the components on the board 20, and the like. This component includes a tray component.

  The determination unit 253 determines whether or not the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  Specifically, the determination unit 253 determines whether or not a waiting time is generated in the mounting head 213a while the mounting head 213b sucks the tray components placed on the tray 216. Here, the waiting time waits for the mounting head 213a to start mounting the component on the substrate 20 because the mounting head 213b does not finish sucking the tray component even if the mounting head 213a sucks the component. It's time.

  When the determination unit 253 determines that a waiting time occurs, the tact (first tact) when the mounting head 213a sucks the component supplied from the component supply unit 211a and the component supply unit 211b supply the tact. A tact (second tact) when the mounting head 213a sucks the component is calculated. The tact is the time for mounting a plurality of predetermined components on the board. That is, the first tact is a time for mounting a plurality of predetermined components on the board when the mounting head 213a sucks the components supplied from the component supply unit 211a during the waiting time. Similarly, the second tact is a time for mounting a plurality of predetermined components on the board when the mounting head 213a sucks the components supplied from the component supply unit 211b during the waiting time. .

  For example, when the component cassettes are arranged in the descending order of the number of components, the tact calculation is performed such that the components are mounted from the components having the smallest number of components. As a result, the total time of suction, movement, and mounting of the mounting head can be shortened, and a shorter tact can be calculated.

  Then, when the second tact is shorter than the first tact, the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  The head control unit 254 controls the motor or the like based on the determination result of the determination unit 253, thereby moving the mounting heads 213a and 213b to attract the component, or mounting the component on the mounting point on the substrate 20. To do.

  Further, the head control unit 254 retracts the mounting head 213b to a position where it does not interfere with the mounting head 213a when the mounting head 213a picks up a component supplied from the component supply unit 211b. Specifically, the head control unit 254 retracts the mounting head 213b rearward on the component supply unit 211b. As described above, when the mounting head 213a sucks a component, the mounting head 213b retreats to a position where it does not interfere with the mounting head 213a, thereby reducing time loss when the mounting head 213a sucks the component. Therefore, tact loss can be reduced.

  Then, the head controller 254 causes the mounting head 213b to attract the tray components placed on the tray 216 when the mounting head 213b is retracted.

  In the present embodiment, the head control unit 254 has functions of a suction control unit and a mounting control unit.

  8 and 9 are diagrams for explaining an example of a component mounting method according to the present embodiment.

  FIG. 8 is a diagram for explaining an example of a component mounting method of the component mounter 200.

  As shown in FIG. 8A, the tray 216 of the component mounter 200 is raised and lowered by an elevator for raising and lowering and is disposed at a predetermined position of the component supply unit 211b. Here, it may take time for the tray 216 to be lifted and lowered by the elevator and disposed at a predetermined position. For this reason, it takes time for the mounting head 213b to suck the tray components.

  In such a case, if the mounting head 213b mounts the component on the substrate 20 after the mounting head 213b mounts the tray component on the substrate 20, a tact loss may occur.

  Therefore, the mounting head 213a in the present embodiment mounts the component on the substrate 20 when a waiting time occurs in the mounting head 213a while the mounting head 213b sucks the tray component. In other words, the mounting head 213 a sucks the component supplied from the component supply unit 211 a and mounts the component on the substrate 20 without waiting for the mounting head 213 b to mount the tray component on the substrate 20.

  Furthermore, even when the mounting head 213a sucks a component from the component supply unit 211a, a tact loss may occur.

  In this case, as shown in FIG. 8B, the mounting head 213a according to the present embodiment is mounted on the mounting head 213b when a waiting time occurs in the mounting head 213a while the mounting head 213b sucks the tray components. A component to be mounted is mounted on the substrate 20. That is, the mounting head 213 a sucks the component supplied from the component supply unit 211 b and mounts the component on the substrate 20 without waiting for the mounting head 213 b to mount the tray component on the substrate 20.

  As described above, the determination unit 253 determines whether or not a waiting time is generated in the mounting head 213a while the mounting head 213b sucks the tray components placed on the tray 216.

  When the determination unit 253 determines that a waiting time occurs, the tact (first tact) when the mounting head 213a sucks the component supplied from the component supply unit 211a and the component supply unit 211b supply the tact. A tact (second tact) when the mounting head 213a sucks the component is calculated.

  Then, when the second tact is shorter than the first tact, the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  Based on this determination, the head controller 254 first retracts the mounting head 213b so that the mounting head 213b can suck the tray component at a position where it does not interfere with the mounting head 213a.

  Then, the head control unit 254 causes the tray component to be attracted to the mounting head 213b. The head control unit 254 causes the component supplied from the component supply unit 211b to be attracted to the mounting head 213a and mounted on the substrate 20.

  Thereby, it is possible to reduce the tact loss that occurs when the mounting head 213b sucks the tray components.

  FIG. 9 is a diagram illustrating an example of determination performed by the determination unit 253 in order to reduce tact loss in the component mounting method illustrated in FIG.

  In FIG. 9, for convenience of explanation, two tasks for mounting components supplied from the component cassette 212a of the component supply unit 211a and tray components placed on the tray 216 of the component supply unit 211b are mounted. It is assumed that a component is mounted on the board 20 by one task and two tasks for mounting a component supplied from the component cassette 212b of the component supply unit 211b. Here, the task means a series of operations in which the mounting heads 213a and 213b suck and move one or more components and mount the sucked one or more components on the substrate 20.

  FIG. 9A is a diagram for explaining a conventional case where two mounting heads 213a and 213b alternately mount components on the substrate 20. FIG.

  First, the mounting head 213b sucks components from the component cassette 212b (B1) and mounts them on the substrate 20 (B2). Then, while the mounting head 213b mounts the component on the substrate 20 (B2), the mounting head 213a sucks the component from the component cassette 212a (A1) and mounts it on the substrate 20 (A2).

  Then, while the mounting head 213a mounts the component on the substrate 20 (A2), the mounting head 213b sucks the tray component (B3) and mounts it on the substrate 20 (B4). However, it takes time to suck the tray component (B3) by the mounting head 213b. For this reason, conventionally, the mounting head 213a picks up the component from the component cassette 212a (A3), and then waits for the mounting head 213b to mount the tray component on the substrate 20 (B4) before mounting the component on the substrate 20. (A4).

  However, if the mounting head 213a has time to mount the component on the substrate 20 while the mounting head 213b sucks the tray component (B3), the time is a tact loss.

  FIG. 9B and FIG. 9C are diagrams for explaining a case where the mounting of components onto the board 20 by the two mounting heads 213a and 213b according to the present invention is not necessarily alternate.

  FIG. 9B is a diagram illustrating a case where the mounting head 213a mounts the component supplied from the component supply unit 211a on the substrate 20 when the mounting head 213b sucks the tray component.

  While the mounting head 213b sucks the tray component (B3), the mounting head 213a sucks the component supplied from the component supply unit 211a (A3). Then, the mounting head 213a mounts the component on the substrate 20 (A4) without waiting for the mounting head 213b to mount the tray component on the substrate 20 (B4).

  Then, the mounting head 213b mounts the tray component on the substrate 20 (B4). Further, the mounting head 213b sucks the component (B5), mounts it on the substrate 20 (B6), and the process is finished.

  In this way, the tact time can be shortened compared with the case where the mounting head 213a shown in FIG. 9A waits for the mounting of the tray component by the mounting head 213b.

  Further, while the mounting head 213b sucks the tray component (B3), the mounting head 213a can mount the component supplied from the component supply unit 211b on the substrate 20.

  FIG. 9C illustrates a case where the mounting head 213a mounts a component supplied from the component supply unit 211b when the mounting head 213b sucks the tray component as illustrated in FIG. 8B. FIG.

  While the mounting head 213b sucks the tray component (B3), the mounting head 213a sucks the component supplied from the component supply unit 211b (B5). If there is a waiting time for the mounting head 213a to start mounting the component on the substrate 20, the mounting head 213b mounts the component on the substrate 20 without waiting for the mounting head 213b to mount the tray component on the substrate 20 (B4). (B6).

  Then, the mounting head 213b mounts the tray component on the substrate 20 (B4). Then, while the mounting head 213b mounts the component on the substrate 20 (B4), the mounting head 213a sucks the component (A3), mounts the component on the substrate 20 (A4), and the process ends.

  Thereby, a tact can be shortened rather than the case where the mounting head 213a shown in FIG.9 (b) mounts the components supplied from the component supply part 211a.

  When the tact as shown in FIG. 9C can be shortened, the determination unit 253 determines that the mounting head 213a needs to suck a component supplied from the component supply unit 211b. The determination performed by the determination unit 253 in such a case will be specifically described below.

  First, the determination unit 253 determines whether or not a waiting time is generated in the mounting head 213a while the mounting head 213b sucks the tray component (B3). Here, when the waiting time occurs, the mounting head 213b does not finish the tray component suction (B3) even if the mounting head 213a sucks the component (B5 in FIG. 9C). This is a case where the head 213a can start mounting of the component (B6 in FIG. 9C).

  If the determination unit 253 determines that a waiting time occurs, the determination unit 253 calculates the tact in the case illustrated in FIGS. 9B and 9C. That is, the determination unit 253 calculates the tact (first tact) when the mounting head 213a mounts the component supplied from the component supply unit 211a on the substrate 20 as shown in FIG. 9B. Further, the determination unit 253 calculates a tact (second tact) when the mounting head 213a mounts a component supplied from the component supply unit 211b as illustrated in FIG.

  Then, the determination unit 253 determines whether the mounting head 213a sucks the component supplied from the component supply unit 211a or the component supply unit 211b and can reduce the tact loss. That is, the determination unit 253 determines which of the first tact shown in FIG. 9B and the second tact shown in FIG. 9C is shorter.

  If the determination unit 253 determines that the second tact is shorter than the first tact, the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  FIG. 10 is a flowchart showing an example of a component mounting method in the present embodiment.

  In FIG. 10, for convenience, the mounting head 213a is shown as a first head, the mounting head 213b as a second head, the component supply unit 211a as a first supply unit, and the component supply unit 211b as a second supply unit.

  First, the determination unit 253 determines whether or not a waiting time occurs in the mounting head 213a while the mounting head 213b sucks the tray component (S104).

  If the determination unit 253 determines that a waiting time is generated in the mounting head 213a (YES in S104), a tact (first tact) when the mounting head 213a sucks a component supplied from the component supply unit 211a. Is calculated (S106). Further, the determination unit 253 calculates a tact (second tact) when the mounting head 213a picks up a component supplied from the component supply unit 211b (S108).

  Then, the determination unit 253 determines whether or not the second tact is shorter than the first tact (S110). If the determination unit 253 determines that the second tact is shorter (YES in S110), the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  In this case, the head controller 254 first retracts the mounting head 213b so that the mounting head 213b can suck the tray component at a position where it does not interfere with the mounting head 213a (S112). Then, the head controller 254 causes the tray component to be attracted to the mounting head 213b (S114). Then, the head control unit 254 causes the component supplied from the component supply unit 211b to be attracted to the mounting head 213a (S116) and mounted on the substrate 20 (S120).

  If the determination unit 253 determines that the second tact is longer than the first tact (NO in S110), the head control unit 254 transfers the component supplied from the component supply unit 211a to the mounting head 213a. It is adsorbed (S118) and mounted on the substrate 20 (S120).

  Further, the head controller 254 causes the mounting head 213b to mount the sucked tray component on the substrate 20 (S120).

  Until all the mounting points are completed (S122), the next mounting point is determined (S102, S122).

  If the determination unit 253 determines that the waiting time does not occur in the mounting head 213a (NO in S104), the next mounting point is determined (S102, S122).

  Thereby, it is possible to reduce the tact loss that occurs when the mounting head 213b sucks the tray components.

(Modification 1)
Here, a first modification of the present embodiment will be described. In the above embodiment, the loss of tact due to the suction of the tray parts is reduced. However, in this modification, tact loss due to replacement of the suction nozzle is reduced.

  FIG. 11 is a diagram for explaining an example of a component mounting method according to this modification.

  As shown in FIG. 11A, the component mounter 200 is an alternating component mounter including two mounting heads 213a and 213b having different suction nozzles.

  The mounting head 213b sucks the components supplied from the component supply unit 211b and mounts them on the substrate 20. However, depending on the components supplied from the component supply unit 211b, the mounting head 213b may not be able to suck the component with the suction nozzle provided in the mounting head 213b.

  In this case, the mounting head 213b moves to the nozzle station 215b and replaces the suction nozzle so that the part can be sucked. The mounting head 213b sucks the component and mounts it on the substrate 20.

  However, since it takes time to replace the suction nozzle of the mounting head 213b, this time is a tact loss.

  Here, there are cases where the suction nozzle of the mounting head 213a can suck a component that cannot be sucked by the suction nozzle of the mounting head 213b. In this case, as shown in FIG. 11B, the mounting head 213 a can suck the component supplied from the component supply unit 211 b and mount it on the substrate 20.

  Therefore, the determination unit 253 first determines whether or not the suction nozzle needs to be replaced in order for the mounting head 213b to pick up the components supplied from the component supply unit 211b.

  If the determination unit 253 determines that the suction nozzle needs to be replaced, the determination unit 253 determines whether the mounting head 213a includes a suction nozzle that can suck the component.

  When the determination unit 253 determines that the mounting head 213a includes the suction nozzle, the determination unit 253 determines whether or not the mounting head 213a sucks the component reduces the tact time. If the determination unit 253 determines that the tact time is shortened, the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  Based on this determination, first, the head control unit 254 retracts the mounting head 213b to a position where it does not interfere with the mounting head 213a when the mounting head 213a picks up the components supplied from the component supply unit 211b.

  The head control unit 254 causes the component supplied from the component supply unit 211b to be attracted to the mounting head 213a and mounted on the substrate 20.

  Thereby, the tact loss which occurs when the mounting head 213b replaces the suction nozzle can be reduced.

  FIG. 12 is a flowchart showing an example of a component mounting method according to this modification.

  In FIG. 12, for convenience, as in FIG. 10, the mounting head 213a is the first head, the mounting head 213b is the second head, the component supply unit 211a is the first supply unit, and the component supply unit 211b is the second supply. Shown as part.

  First, the determination unit 253 determines whether or not the suction nozzle needs to be replaced in order for the mounting head 213b to suck the component supplied from the component supply unit 211b (S204). If the determination unit 253 determines that the suction nozzle needs to be replaced (YES in S204), the determination unit 253 determines whether the mounting head 213a includes a suction nozzle that can suck the component (S206).

  If the determination unit 253 determines that the mounting head 213a includes the suction nozzle (YES in S206), the determination unit 253 calculates a tact when the mounting head 213a sucks the component (S208).

  Then, the determination unit 253 determines whether or not the mounting head 213a adsorbs the component is shorter in tact than the mounting head 213b replaces the adsorption nozzle (S210). If the determination unit 253 determines that the tact time is short (YES in S210), the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  In this case, the head controller 254 first retracts the mounting head 213b to a position where the mounting head 213b does not interfere with the mounting head 213a (S212). The head controller 254 causes the component supplied from the component supplier 211b to be attracted to the mounting head 213a (S214) and mounted on the substrate 20 (S220).

  If the determination unit 253 determines that the suction nozzle of the mounting head 213b does not need to be replaced (NO in S204), the head control unit 254 causes the mounting head 213b to suck the component (S216) and causes the substrate 20 to Wear (S220).

  When the determination unit 253 determines that the mounting head 213a does not include a suction nozzle that can suck the component (NO in S206), the head control unit 254 causes the mounting head 213b to replace the suction nozzle (S218). . Then, the head control unit 254 causes the mounting head 213b to attract the component (S216) and mount the component on the substrate 20 (S220).

  Further, when the determination unit 253 determines that the tact time is not shortened even when the mounting head 213a sucks the component (NO in S210), the head control unit 254 causes the mounting head 213b to replace the suction nozzle (S218). ). Then, the head control unit 254 causes the mounting head 213b to attract the component (S216) and mount the component on the substrate 20 (S220).

  Until all the mounting points are completed (S222), the next mounting point is determined (S202, S222).

  In this manner, tact loss that occurs when the mounting head 213b replaces the suction nozzle can be reduced.

(Modification 2)
Here, a second modification of the present embodiment will be described. In the above-described embodiment and the first modification, the loss of tact due to sucking tray components and replacing the suction nozzle is reduced. However, in this modification, tact loss due to the fact that all components cannot be arranged in one component supply unit is reduced.

  FIG. 13 is a diagram for explaining an example of a component mounting method according to this modification.

  As shown in FIG. 13A, the component mounter 200 is an alternating component mounter. When a large number of large components are mounted on the substrate 20, it may not be possible to arrange all the large components using only one component supply unit. Here, a component cassette 212a storing large components is arranged in the component supply unit 211a, and the mounting head 213a mounts the large components. If the mounting head 213b can suck this large component, the component cassette 212c in which the large component is stored can also be arranged in the component supply unit 211b.

  However, if it is necessary to replace the suction nozzle in order for the mounting head 213b to suck a large component, the time for replacing the nozzle is a tact loss.

  Moreover, the mounting head 213b may not be provided with a suction nozzle that can suck a large component. That is, when the mounting head 213b includes only a small suction nozzle for sucking a chip component or a small deformed component, it cannot be replaced with a large suction nozzle that can suck a large component. Specifically, when the mounting head 213a capable of sucking a large component is a mounting head having three large suction nozzles, the mounting head 213b is a mounting head having eight small suction nozzles. Etc.

  In this case, even if the component cassette 212c in which a large component is stored in the component supply unit 211b is arranged, the mounting head 213b cannot adsorb the component. Therefore, another component mounting machine is used to mount the large component. There is no choice but to arrange. For this reason, it takes time to transport the board 20 to the other component mounting machine for production, resulting in a tact loss.

  Here, as shown in FIG. 11B, if the mounting head 213a can adsorb a large component supplied from the component supply unit 211b and mount it on the substrate 20, the loss of these tacts can be reduced. Can do.

  For this reason, first, the determination unit 253 determines whether or not a component for which the mounting head 213a should be mounted on the substrate 20 (only the mounting head 213a can be mounted on the substrate 20) is arranged in the component supply unit 211a. to decide.

  If the determination unit 253 determines that no component is arranged, the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  Based on this determination, first, the head control unit 254 retracts the mounting head 213b to a position where it does not interfere with the mounting head 213a when the mounting head 213a picks up the components supplied from the component supply unit 211b.

  The head control unit 254 causes the component supplied from the component supply unit 211b to be attracted to the mounting head 213a and mounted on the substrate 20.

  As a result, it is possible to reduce tact loss that occurs when the mounting head 213b replaces the suction nozzle or transports the substrate 20 to another component mounting machine for production. Further, it is not necessary to arrange another component mounting machine for mounting the components, and excessive facilities can be eliminated.

  FIG. 14 is a flowchart showing an example of a component mounting method according to this modification.

  In FIG. 14, for convenience, as in FIG. 10, the mounting head 213a is the first head, the mounting head 213b is the second head, the component supply unit 211a is the first supply unit, and the component supply unit 211b is the second supply. Shown as part.

  First, the determination unit 253 determines whether or not a component for mounting the mounting head 213a on the substrate 20 is arranged in the component supply unit 211a (S304). If the determination unit 253 determines that no component is arranged (NO in S304), the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b.

  In this case, the head controller 254 first retracts the mounting head 213b to a position where the mounting head 213b does not interfere with the mounting head 213a (S306). The head controller 254 causes the component supplied from the component supplier 211b to be attracted to the mounting head 213a (S308) and mounted on the substrate 20 (S312).

  In addition, when the determination unit 253 determines that the component for mounting the mounting head 213a on the substrate 20 is disposed in the component supply unit 211a (YES in S304), the head control unit 254 determines that the component supply unit 211a The components supplied from the head are attracted to the mounting head 213a (S310) and mounted on the substrate 20 (S312).

  Until all the mounting points are completed (S314), the next mounting point is determined (S302, S314).

  In this way, it is possible to reduce the tact loss that occurs when the mounting head 213b replaces the suction nozzle or transports the substrate 20 to another component mounting machine for production.

  As mentioned above, although the component mounting method concerning this invention was demonstrated using the said embodiment and its modification, this invention is not limited to this.

  For example, in the present embodiment and its modification, the mounting head 213a sucks a component supplied from the component supply unit 211b, but the mounting head 213b sucks a component supplied from the component supply unit 211a. It is good.

  In the present embodiment and its modification, the determination unit 253 is provided in the component mounter 200. However, the determination unit 253 is provided in the control device 100, and the determination provided in the control device 100. The component mounter 200 may acquire the NC data 257a created based on the determination of the unit 253, and the component mounter 200 may mount the component on the board 20 based on the NC data 257a.

  In the present embodiment, the determination unit 253 determines that the mounting head 213a needs to suck the component supplied from the component supply unit 211b when the second tact is shorter than the first tact. It was decided. However, when the mounting head 213a sucks components from the component supply unit 211b and completes the mounting on the substrate 20 by the time the mounting head 213b finishes sucking the tray components from the tray 216, the determination unit 253 completes the mounting head 213a. However, it may be determined that it is necessary to suck the component supplied from the component supply unit 211b. This determination is made by comparing the time for the mounting head 213a to pick up the component from the component supply unit 211b and mount it on the substrate 20, and the time for the mounting head 213b to suck the tray component. Thereby, since the imbalance of the operating time when the two mounting heads perform alternating hitting is eliminated, tact loss can be reduced.

  In the second modification, when the determination unit 253 determines that the component that the mounting head 213a should be mounted on the substrate 20 is not arranged in the component supply unit 211a, the mounting head 213a detects the component supply unit 211b. It was decided that it was necessary to adsorb the parts supplied from the factory. However, when the determination unit 253 determines that the component that the mounting head 213a should be mounted on the substrate 20 (only the mounting head 213a can be mounted on the substrate 20) is disposed in the component supply unit 211b. The mounting head 213a may determine that it is necessary to suck the component supplied from the component supply unit 211b.

  In the second modification, the component mounting machine 200 is an alternating component mounting machine including two mounting heads. However, the mounting head 213b may not be a mounting head, and may be an application head or an inspection head. The present invention can also be applied to a working head such as a head. In this case, the mounting head 213a attracts the components supplied from the component supply unit 211b, so that it is not necessary to arrange another component mounting machine, and the tact loss can be reduced.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a component mounting method of a component mounter that mounts components on a substrate, and in particular, can be applied to a component mounting method that can reduce tact loss.

DESCRIPTION OF SYMBOLS 10 Component mounting system 20 Board | substrate 100 Control apparatus 200 Component mounting machine 210a, 210b Mounting unit 211a, 211b Component supply part 212a, 212b Component cassette 213a, 213b Mounting head 215a, 215b Nozzle station 216 Tray 251 Input part 252 Display part 253 Judgment part 254 Head control unit 255 Control unit 256 Communication unit 257 Storage unit 257a NC data 257b Component library 257c Mounting condition data

Claims (1)

A component mounting method for a component mounting machine in which a mounting head adsorbs a component and mounts the component on a board,
The component mounter includes a sub-equipment having a first head that is the mounting head and a first supply unit that supplies components to the first head, and a working head that is disposed to face the first head. A sub-equipment having a second head and a second supply part for supplying parts,
The component mounting method includes:
An adsorption step in which the first head adsorbs a component supplied from the second supply unit;
A mounting step in which the first head mounts the component sucked in the suction step on the substrate;
A component mounting method comprising: a retracting step in which the second head retracts to a position that does not interfere with the first head when the first head sucks a component in the sucking step.

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