JP6154130B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

  Conventionally, there is a case in which handling of electronic components on a board is manually handled. When such electronic components are manually mounted on the board, there are various problems such as a rise in labor costs, securing of workers, and occurrence of work errors. Accordingly, there is a demand for automation of the production of electronic substrates by the electronic component mounting apparatus.

  As such an electronic component mounting apparatus, for example, there is a suction nozzle that holds the electronic component in a sucked state, and the electronic component is transported to a mounting position on the substrate by the suction nozzle, and the electronic component is mounted on the substrate. The device is mentioned. Further, the structure of such an electronic component mounting device will be specifically described. For example, the electronic component mounting device includes a component supply device for supplying an electronic component, a head unit for mounting a suction nozzle, and a component supply device. A horizontal movement mechanism for horizontally moving the head unit between the suction position and the mounting position on the substrate, a vertical movement mechanism for moving the suction nozzle up and down relative to the head unit, and an axis of the suction nozzle Some include a rotation mechanism that rotates the suction nozzle and a component recognition device that recognizes the suction posture and type of the sucked electronic component. In the above-described component supply apparatus, electronic component feeders that supply electronic components one by one to the suction position are fixed in a line.

  As an outline of the operation of the electronic component mounting apparatus, first, the suction nozzle sucks the electronic component supplied to the suction position by the component supply device. When the suction nozzle sucks the electronic component, the vertical movement mechanism raises the suction nozzle. Next, when the rotation mechanism rotates the suction nozzle around the axis, the mounting posture of the electronic component sucked by the suction nozzle on the substrate is determined. Next, the component recognition apparatus recognizes the suction posture and type of the electronic component sucked by the suction nozzle. Based on the result of this component recognition, the horizontal movement mechanism moves the head unit from the suction position to the mounting position, the vertical movement mechanism lowers the suction nozzle, and the suction nozzle attaches / detaches the electronic component to the board. To do.

  In addition, there is an electronic component mounting apparatus in which a plurality of suction nozzles are provided in a head unit in order to improve the production efficiency of an electronic substrate (see Patent Document 1). In the electronic component mounting apparatus described in Patent Document 1, a plurality of suction nozzles are arranged in parallel in the head unit so as to have the same spacing as the spacing between the suction positions of adjacent electronic component feeders. With such a configuration, each suction nozzle can be lowered at the suction position and pick up a plurality of electronic components. Therefore, when the head unit moves from the suction position to the mounting position once, a plurality of electronic components are picked up. It becomes possible to convey from the position to the mounting position. However, when a plurality of suction nozzles are provided in the head unit as described above, adjacent sucked electronic components may interfere with each other due to the rotation mechanism rotating the suction nozzles. In order to avoid interference between the electronic components, the electronic component mounting apparatus described in Patent Document 1 rotates some of the plurality of suction nozzles first, and the electronic components sucked by the suction nozzles are adjacent to each other. It is rotated at an angle that does not interfere with the electronic component sucked by the matching suction nozzle. Then, the electronic component mounting apparatus rotates the remaining suction nozzles so that the electronic component is mounted. As described above, instead of rotating a plurality of suction nozzles at the same time, rotating some of the suction nozzles first and rotating the remaining suction nozzles with a time difference avoids interference of electronic components. Yes. In addition, the electronic component mounting apparatus described in Patent Document 1 uses an up-and-down moving mechanism to adsorb adjacent suction nozzles in addition to the operation of avoiding interference between electronic components by the rotation operation of the suction nozzles provided with the above time difference. By changing the height of the electronic component, interference of the electronic component during the rotating operation is avoided.

JP 2000-183597 A

  However, the electronic component mounting apparatus described in Patent Document 1 performs an avoidance operation so that electronic components attracted by adjacent suction nozzles do not interfere with each other. The determination as to whether or not the nozzles themselves interfere and the avoidance operation are not performed. When the suction nozzles arranged in parallel in the head unit are detachable and replaceable, when changing the electronic components to be mounted on the substrate, the so-called changeover operation of replacing the suction nozzles corresponding to the electronic components is performed. As a result, adjacent suction nozzles may interfere with each other. The electronic parts have different sizes depending on the types or specifications, and it is necessary to replace the suction nozzles with different sizes or shapes according to the size of the electronic parts. As described above, by mounting the suction nozzles having different sizes or shapes, the suction nozzles themselves may interfere when the suction nozzles rotate.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an electronic component mounting apparatus and an electronic component mounting method capable of avoiding interference between adjacent suction nozzles. .

  An electronic component mounting apparatus according to the present invention for solving the above-described problems is provided in parallel with each other, holds a plurality of electronic components from a component supply unit, and mounts them on a substrate, and the holding A moving mechanism for moving a member from the component supply unit to the mounting position of the electronic component on the substrate, wherein the holding is performed by changing the positions of the plurality of holding members, respectively. A posture changing mechanism that changes the posture of the electronic component held by a member, and a control device that controls the operations of the plurality of holding members, the moving mechanism, and the posture changing mechanism. It is determined whether or not the adjacent holding members interfere with each other, and when it is determined that the adjacent holding members interfere with each other, the adjacent holding members are moved by the posture changing mechanism. Interference so as not to the positions of a plurality of the holding member to perform the interference avoidance operation of changing each one another, characterized by a posture of mounting the electronic component on the substrate.

  Further, in the electronic component mounting apparatus according to the present invention, the posture changing mechanism has a rotation mechanism that rotates the plurality of holding members respectively in a direction around an axis orthogonal to the direction in which the plurality of holding members are arranged in parallel. The control device stores rotation radius information of the holding member when the holding member is rotated by the rotation mechanism, and performs the rotation based on the rotation radius information of the holding member as the interference avoiding operation. The mechanism rotates a part of the plurality of holding members to an angle that does not interfere with the holding members adjacent to the some holding members, and then performs an operation of rotating the remaining holding members. It is characterized by.

  In the electronic component mounting apparatus according to the present invention, the posture changing mechanism includes a linear motion mechanism that moves the plurality of holding members in a direction of an axis perpendicular to the direction in which the plurality of holding members are arranged in parallel. The control device stores dimensional information of the holding member and, as the interference avoiding operation, based on the dimensional information of the holding member, up to a position where the adjacent holding members do not interfere with each other by the linear motion mechanism. It is characterized by direct movement.

  Further, the control device stores rotation radius information of the electronic component when the holding member is rotated by the rotation mechanism, and the rotation radius information of the holding member and the electronic component of the electronic component are stored as the interference avoiding operation. Based on the rotation radius information, the rotation mechanism causes a part of the plurality of holding members to have an angle that does not interfere with the holding member adjacent to the part of the holding members, and the part. The electronic component held by the holding member is rotated to an angle that does not interfere with the electronic component held by the holding member adjacent to the holding member, and then the remaining holding member is rotated. It is preferable to do.

  Further, the control device stores the dimension information of the electronic component, and as the interference avoiding operation, the control device is adjacent by the linear motion mechanism based on the dimension information of the holding member and the dimension information of the electronic component. It is preferable that the holding members are moved directly to a position where they do not interfere with each other and the electronic parts held by the holding members do not interfere with each other.

  In the electronic component mounting apparatus according to the present invention, the control device stores information about the holding member and the electronic component, and before moving the plurality of the holding members to the mounting position, Based on the information on the electronic component, it is determined whether or not the interference avoiding operation is possible. When it is determined that the interference avoiding operation is possible, the holding member that holds the electronic component is moved by the moving mechanism. It is characterized by moving to the mounting position.

  In the electronic component mounting apparatus according to the present invention, the control device stores information related to the holding member and the electronic component, and the interference is performed based on the information related to the holding member and the electronic component at the time of changeover. It is characterized by determining whether an avoidance operation is possible.

  The electronic component mounting apparatus according to the present invention further includes an imaging device that images the holding member and the electronic component, and the control device stores information on the holding member and the electronic component captured by the imaging device. It is characterized by doing.

  In addition, it is preferable that a plurality of the holding members are detachably mounted and a head unit that moves by the moving mechanism is provided.

  An electronic component mounting method according to the present invention for solving the above problems includes a step of holding a plurality of electronic components from a component supply unit, and the holding members adjacent to each other among the plurality of holding members holding the electronic components. Performing an interference avoidance operation for changing the positions of the plurality of holding members so that they do not interfere with each other, and placing the electronic component on the substrate, and arranging the plurality of holding members on the substrate on the substrate The method includes a step of moving the component to a mounting position and a step of mounting the electronic component on the substrate.

  In the electronic component mounting method according to the present invention, as the interference avoiding operation, a part of the plurality of holding members is adjacent to the part of the holding members based on rotation radius information of the holding members. It is characterized by having a step of rotating the remaining holding member after rotating it to an angle that does not interfere with the holding member.

  Further, in the electronic component mounting method according to the present invention, the interference avoiding operation includes a step of linearly moving the adjacent holding members to a position where they do not interfere with each other based on the dimensional information of the holding members. Yes.

  In the electronic component mounting method according to the present invention, a step of determining whether or not the interference avoiding operation is possible based on information about the holding member before moving the plurality of holding members to the mounting position. It is characterized by having.

  According to the present invention, interference between adjacent holding members can be avoided by the interference avoiding operation.

FIG. 1 is an overall external view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a configuration diagram of a driving unit and a suction nozzle installed in the head unit of the electronic component mounting apparatus of FIG. FIG. 3 is a block diagram showing a configuration of a control system in the electronic component mounting apparatus of FIG. FIG. 4 is a flowchart for explaining the operation of the electronic component mounting apparatus of FIG. FIG. 5 is a diagram illustrating the rotation radius of the suction nozzle. FIG. 6 is a diagram for explaining an interference avoidance operation performed by the rotation operation in the θ direction due to the time difference of the suction nozzle. FIG. 7 is a diagram showing the dimensions of the electronic component when interference between adjacent electronic components can be avoided by the rotation operation in the θ direction due to the time difference of the suction nozzle. FIG. 8 is a diagram showing the dimensions of the electronic component when interference between adjacent electronic components cannot be avoided by the rotation operation in the θ direction due to the time difference of the suction nozzle. FIG. 9 is a diagram showing the dimensions of the suction nozzle when interference between adjacent suction nozzles can be avoided by the rotation operation in the θ direction due to the time difference of the suction nozzles. FIG. 10 is a diagram illustrating the dimensions of the suction nozzle when interference between adjacent suction nozzles cannot be avoided by the rotation operation in the θ direction due to the time difference of the suction nozzles. FIG. 11 is a diagram illustrating a case where interference between adjacent electronic components can be avoided by vertical movement of the suction nozzle in the Z-axis direction. FIG. 12 is a diagram illustrating a case where interference between adjacent electronic components cannot be avoided by vertical movement of the suction nozzle in the Z-axis direction. FIG. 13A is a front view of an example of a suction nozzle in which suction units are spaced apart. FIG. 13-2 is a side view of an example of a suction nozzle in which suction units are spaced apart. FIG. 13C is a bottom view of an example of a suction nozzle in which suction portions are spaced apart. FIG. 14 is a diagram illustrating an example of a gripping member. FIG. 15 is a diagram illustrating an example of a gripping member in which chuck portions are spaced apart.

(Configuration of electronic component mounting apparatus 100)
FIG. 1 is an overall external view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration diagram of a drive unit and a suction nozzle installed in a head unit of the electronic component mounting apparatus of FIG. . The configuration of the electronic component mounting apparatus 100 will be described with reference to FIGS. 1 and 2.

  As shown in FIG. 1, an electronic component mounting apparatus 100 includes a base 101, a substrate transport device 102 that transports a substrate 103, suction nozzles 108a to 108d (holding members) that suck electronic components, and suction nozzles 108a to 108a. The head unit 105 to which the 108d is mounted, the XY direction drive mechanism 110 (moving mechanism) for positioning the head unit 105 in the horizontal direction, the component supply device 140 (component supply unit) for supplying electronic components, and the base 101 A control device 200 that is installed inside and controls various actuators (described later) provided in the head unit 105, the XY direction drive mechanism 110, and the like.

  The base 101 constitutes the main body of the electronic component mounting apparatus 100, and the substrate transport apparatus 102, the XY direction drive mechanism 110 for positioning the head unit 105, the component supply apparatus 140, and the like are installed on the upper surface. A control device 200 is installed inside.

  The substrate transfer device 102 is a device that transfers the substrate 103, stops the substrate 103 at a predetermined position on the base 101, and when the operation of mounting the electronic component on the substrate 103 by the head unit 105 is completed, the substrate 103 is transferred to a subsequent process. Transport.

  The XY direction drive mechanism 110 and the X-axis guide member 106 extending in the X-axis direction, which is the transport direction of the substrate transport apparatus 102, extend in the Y-axis direction that is horizontal and orthogonal to the X-axis direction. A Y-axis guide member 107, an X-axis servo motor 201 (shown in FIG. 3), and a Y-axis servo motor 202 (shown in FIG. 3) are provided. The X-axis guide member 106 supports the head unit 105 movably in the X-axis direction, and the Y-axis guide member 107 supports the X-axis guide member 106 movably in the Y-axis direction. The X-axis servo motor 201 moves the head unit 105 in the X-axis direction along the X-axis guide member 106, and the Y-axis servo motor 202 moves the X-axis guide member 106 along the Y-axis guide member 107 in the Y-axis direction. Move to.

  The head unit 105 is a unit that moves in the horizontal direction (X-axis direction and Y-axis direction) by the XY-direction drive mechanism 110. As shown in FIG. 2, the head unit 105 includes four drive units (drive units (nozzle mounting units) 109a to 109a). 109d) is fixed. As shown in FIG. 2, the drive units 109a to 109d have suction nozzles 108a to 108d detachably attached to their lower surfaces, respectively, and Z-axis servomotors 203a to 203d (posture change mechanism, linear motion), which will be described later with reference to FIG. Mechanism) and θ-direction servomotors 204a to 204d (attitude change mechanism, rotation mechanism). Since the suction nozzles 108a to 108d can be detachably attached to the drive units 109a to 109d fixed to the head unit 105, the suction corresponding to the electronic component to be switched when switching the electronic component to be mounted on the substrate 103 is performed. Can be replaced with a nozzle. The head unit 105 includes a component recognition device 205 (shown in FIG. 3) that recognizes electronic components sucked by the suction nozzles 108a to 108d.

  As shown in FIG. 2, the suction nozzles 108a to 108d are close to each other, and the intervals (arrangement intervals) between adjacent suction nozzles are substantially the same. The suction nozzles 108 a to 108 d suck an electronic component from the component supply device 140, remove the electronic component at a mounting position on the substrate 103, and mount the electronic component on the substrate 103. FIG. 2 shows a state where the suction nozzles 108a to 108d suck the electronic components 300a to 300d, respectively.

  The suction nozzles 108a to 108d are not limited to those having the shape shown in FIG. 2, and for example, as shown in FIGS. 13-1 to 13-3, a pair of suction parts 121a that suck electronic components, 121b may be configured to be spaced apart in the horizontal direction. FIG. 13-1 is a front view of an example of the suction nozzle in which suction portions are spaced apart, FIG. 13-2 is a side view of the example of the suction nozzle, and FIG. It is a bottom view of an example. As shown in FIGS. 13-1 and 13-2, the attachment portion 122 is a portion that is detachably attached to the lower surfaces of the drive portions 109a to 109d, and the spring portion 123 is attached when the electronic component is attached. It is a member that relaxes the load in the Z-axis direction on the electronic component by the parts 121a and 121b.

  The Z-axis servo motors 203a to 203d move the suction nozzles 108a to 108d mounted on the drive units 109a to 109d up and down in the Z-axis direction, which is the vertical direction, via a Z-axis direction drive mechanism (not shown). . The θ-direction servomotors 204a to 204d are connected to the suction nozzles 108a to 108d attached to the drive units 109a to 109d via the θ-direction drive mechanism (not shown), respectively. ) In the θ direction, which is the direction around. Since the Z-axis servo motors 203a to 203d and the θ-direction servo motors 204a to 204d can be driven independently of each other, the suction nozzles 108a to 108d are independently moved up and down in the Z-axis direction. A rotation operation in the θ direction is possible.

  The component recognition device 205 is, for example, a detection device using laser light, and is installed in the head unit 105 near the tips of the suction nozzles 108a to 108d, and recognizes the electronic components 300a to 300d sucked by the suction nozzles 108a to 108d. I do. In addition, although the component recognition apparatus 205 shall be installed in the head unit 105, it is not limited to this, An imaging device, such as a CCD camera fixed on the base 101, may be sufficient.

  The component supply device 140 is disposed on both sides of the substrate transfer device 102 and includes a feeder bank 141 and a plurality of electronic component feeders 142. The feeder bank 141 is a member that fixes a plurality of electronic component feeders 142 in a line. The electronic component feeder 142 is, for example, a tape feeder, and each tape feeder stores and holds an electronic component such as an IC or a capacitor at predetermined intervals on a tape led out from the reel. Further, the interval between the suction positions of the adjacent electronic component feeders 142 is substantially the same as the arrangement interval (pitch) of the adjacent suction nozzles described above, and the electronic component feeder 142 has the electronic components separated by the suction nozzles 108a to 108d. The electronic component is supplied to the suction position to be sucked. Further, since the plurality of electronic component feeders 142 are fixed in a line by the feeder bank 141 as described above, when the electronic components are supplied to the suction position, the plurality of electronic components are close to each other and are in the suction position. Will be placed.

  Although the electronic components are picked up from the suction position by the suction nozzles 108a to 108d, the electronic parts are not limited to the suction type, and are driven by, for example, an intake pressure or a compressed pneumatic cylinder as shown in FIG. The holding members 111a to 111d (holding members) provided with a chuck type mechanism for holding an electronic component by the chuck may be used. As shown in FIG. 14, the chuck portion 125 is a member that grips an electronic component, and the attachment portion 126 is a portion that is detachably attached to the lower surfaces of the drive portions 109 a to 109 d. As shown in FIG. 15, the gripping members 111a to 111d may be members in which the chuck portions 125 are spaced apart in the horizontal direction.

  Further, although four suction nozzles are mounted on the head unit 105, the present invention is not limited to this, and any configuration may be used as long as two or more suction nozzles are mounted.

  In addition, the head unit 105 is configured to be moved from the suction position to the mounting position by the XY direction drive mechanism 110, but is not limited to this. For example, the head unit 105 may be moved by an articulated robot or the like. It is good also as a structure moved from a suction position to a mounting position.

(Configuration of control system of electronic component mounting apparatus 100)
FIG. 3 is a block diagram showing a configuration of a control system in the electronic component mounting apparatus according to the embodiment of the present invention. The configuration of the control system of the electronic component mounting apparatus 100 will be described with reference to FIG.

  As illustrated in FIG. 3, the control device 200 of the electronic component mounting apparatus 100 includes a CPU (Central Processing Unit) 210, a RAM (Random Access Memory) 211, a ROM (Read Only Memory) 212, and a driver 213. The units are connected to each other by a system bus so that data communication can be performed. In addition, the component recognition device 205 of the head unit 105 is connected to the system bus and can perform data communication with each other. Further, the suction nozzles 108a to 108d, the Z-axis servo motors 203a to 203d and the θ-direction servo motors 204a to 204d of the head unit 105, and the X-axis servo motor 201 and the Y-axis servo motor 202 of the XY direction drive mechanism 110 are drivers. 213 is connected.

  The CPU 210 receives a recognition signal from the component recognition device 205 in accordance with a control program stored in the ROM 212 and controls the various actuators described above via the driver 213. Specifically, the CPU 210 controls the suction / desorption operation of the suction nozzles 108a to 108d via the driver 213 based on the control program, and the Z-axis servo motors 203a to 203d and the θ-direction servo motors 204a to 204d. The vertical movement of the suction nozzles 108a to 108d in the Z-axis direction and the rotation operation in the θ direction are controlled. Further, the CPU 210 controls the horizontal positioning operation of the head unit 105 by the X-axis servo motor 201 and the Y-axis servo motor 202 of the XY direction drive mechanism 110 via the driver 213 based on the control program.

  The RAM 211 is used as a work area when the control program is executed by the CPU 210.

  The ROM 212 stores the above control program, dimensional information and rotation radius information of each electronic component mounted on the substrate 103 in the electronic component mounting apparatus 100, and dimensional information, rotation radius information and arrangement of the suction nozzle corresponding to each electronic component. Interval information is stored. Here, the rotation radius information of the electronic component is the smallest of the circles in which all parts of the electronic component are contained when the electronic component is sucked by the suction nozzle and rotated in the θ direction by the θ direction servo motor. This is information on the radius of the circle. Also, the rotation radius information of the suction nozzle is the smallest circle among the circles in which all the parts are contained in the Z-axis direction view of the suction nozzle when the suction nozzle is rotated in the θ direction by the θ direction servo motor. Is the radius information.

  Based on the control signal from the CPU 210, the driver 213 performs the suction nozzles 108a to 108d, the Z-axis servo motors 203a to 203d and the θ-direction servo motors 204a to 204d of the drive units 109a to 109d, and the X-axis servo of the XY direction drive mechanism 110. The motor 201 and the Y-axis servo motor 202 are driven.

  When the component recognition device 205 is an imaging device such as a CCD camera, the dimensions or rotation radius of the electronic component and the suction nozzle are measured when the electronic component is recognized, and the measured dimensions of the electronic component and the suction nozzle are measured. The information or the rotation radius information may be stored in a writable storage device such as the RAM 211. And the control apparatus 200 should just use the measured dimension information or rotation radius information of said electronic component and adsorption nozzle.

(Operation of Electronic Component Mounting Device 100)
FIG. 4 is a flowchart for explaining the operation of the electronic component mounting apparatus according to the embodiment of the present invention. Details of the operation of the electronic component mounting apparatus 100 will be described with reference to FIG.

(Step S1)
The control device 200 moves the head unit 105 horizontally by the XY direction drive mechanism 110 and moves it to the electronic component suction position of the component supply device 140. Prior to or simultaneously with the movement operation of the head unit 105, the electronic component feeder 142 of the component supply device 140 supplies the electronic component to the suction position. Then, the process proceeds to step S2.

(Step S2)
The control device 200 lowers the suction nozzles 108a to 108d in the Z-axis direction by the Z-axis servo motors 203a to 203d of the drive units 109a to 109d, and sucks the electronic component placed at the suction position of the component supply device 140. . Then, the process proceeds to step S3.

(Step S3)
The control device 200 requires the necessary vertical movement in the Z-axis direction by the Z-axis servomotors 203a to 203d and the necessary θ direction by the θ-direction servomotors 204a to 204d, which are necessary for placing the electronic component on the board 103. It is determined whether or not the electronic components 300a to 300d or the suction nozzles 108a to 108d interfere with the component recognition device 205 by the rotation operation. The control device 200 performs this determination processing on the dimensional information and rotation radius information of the electronic components 300a to 300d sucked by the suction nozzles 108a to 108d stored in the ROM 212, and the dimension information and rotation radius of the suction nozzles 108a to 108d. Run based on information. As a result of this determination, if the electronic components 300a to 300d or the suction nozzles 108a to 108d interfere with the component recognition device 205, the process proceeds to step S13. If not, the process proceeds to step S4.

(Step S4)
The control device 200 determines whether or not the total value of the rotation radii of adjacent electronic components among the electronic components 300a to 300d sucked by the suction nozzles 108a to 108d exceeds the arrangement interval of the suction nozzles. For the sake of convenience, this determination process will be described by focusing on the suction nozzles 108a and 108b and the electronic components 300a and 300b sucked by them in FIG. The arrangement interval between the suction nozzle 108a and the suction nozzle 108b is P, and when the electronic component 300a rotates in the θ direction, the radius of the smallest circle among the circles in which all the parts fit is r1, and the electronic component 300b is The radius of the smallest circle among the circles that fits all the parts when rotating in the θ direction is r2. The control device 200 executes the above determination process depending on whether or not the following expression (1) is satisfied.

  r1 + r2 ≧ P (1)

  As a result of the determination, if the expression (1) is satisfied, the process proceeds to step S61 in step S6, and if the expression (1) is not satisfied, the process proceeds to step S5.

(Step S5)
FIG. 5 is a diagram illustrating the rotation radius of the suction nozzle. As shown in FIG. 5, suction holes 120a and 120b for sucking air for sucking electronic components are formed below the suction nozzles 108a and 108b, respectively. The control device 200 determines whether or not the total value of the rotation radii of adjacent suction nozzles among the suction nozzles 108a to 108d exceeds the suction nozzle arrangement interval P. For the sake of convenience, this determination process will be described by focusing on the suction nozzles 108a and 108b in FIG. When the suction nozzle 108a rotates in the θ direction, the radius of the smallest circle among the circles in which all the portions of the suction nozzle 108a as viewed in the Z-axis direction are accommodated is R1, and the suction nozzle 108b is viewed in the Z-axis direction. Let R2 be the radius of the smallest circle among the circles in which all the parts fit. The control device 200 executes the above determination process depending on whether or not the following expression (2) is satisfied.

  R1 + R2 ≧ P (2)

  As a result of the determination, if the expression (2) is satisfied, the process proceeds to step S61 in step S6, and if the expression (2) is not satisfied, the process proceeds to step S7.

  The suction nozzles 108a to 108d (here, simply referred to as suction nozzles) are, for example, nozzles in which the pair of suction portions 121a and 121b illustrated in FIGS. 13-1 to 13-3 are spaced apart in the horizontal direction. Or when the chuck | zipper part 125 shown in FIG. 15 is the holding members 111a-111d (here it is only called a holding member) spaced apart, you may determine as follows. That is, for example, the suction nozzle or the gripping member cannot be mounted on the adjacent drive units 109a to 109d (here, simply referred to as the drive unit), and the suction nozzle or the gripping member is mounted on the adjacent drive unit. It is assumed that In this case, the total value of the rotation radii of the suction nozzle or gripping member mounted on the drive unit and the suction nozzle or gripping member mounted on the drive unit adjacent to the drive unit is the two drive units. It is good also as what determines whether it is more than arrangement | positioning space | interval. As a result of this determination, if the total value of the turning radii is greater than or equal to the arrangement interval, the process proceeds to step 61 in step S6, and if the total value of the turning radii is less than the arrangement interval, the process proceeds to step S7.

(Step S6)
The control device 200 is based on the vertical movement in the Z-axis direction by the Z-axis servomotors 203a to 203d and the necessary rotational movement in the θ direction by the θ-direction servomotors 204a to 204d, which are performed to put the electronic component on the board 103. In the process of changing the posture of the electronic component, an interference avoiding operation is performed so that adjacent electronic components and adjacent suction nozzles do not interfere with each other. Step S6 includes steps S61 to S64.

(Step S61)
FIG. 6 is a diagram for explaining an interference avoidance operation performed by the rotation operation in the θ direction due to the time difference of the suction nozzle. FIG. 7 is a diagram showing the dimensions of the electronic component when the interference between adjacent electronic components can be avoided by the rotation operation in the θ direction due to the time difference of the suction nozzle, and FIG. 8 is the rotation in the θ direction due to the time difference of the suction nozzle. It is the figure which showed the dimension of the electronic component when interference of the adjacent electronic component cannot be avoided by operation | movement. FIG. 9 is a diagram showing the dimensions of the suction nozzle when interference between adjacent suction nozzles can be avoided by the rotation operation in the θ direction due to the time difference of the suction nozzle, and FIG. 10 is the θ direction due to the time difference of the suction nozzle. It is the figure which showed the dimension of the suction nozzle when interference of adjacent suction nozzles cannot be avoided by this rotation operation. The control device 200 determines whether or not the interference avoiding operation is possible by the rotation operation in the θ direction due to the time difference of the suction nozzle.

  Here, the interference avoidance operation by the rotation operation in the θ direction due to the time difference of the suction nozzle will be described in detail. When the control device 200 rotates the electronic components 300a to 300d sucked by the suction nozzles 108a to 108d simultaneously in the θ direction by the θ direction servo motors 204a to 204d, the adjacent electronic components or the adjacent suction nozzles are In the case of interference, avoid the interference by the following procedure. First, as shown in FIG. 6, the control device 200 rotates some of the suction nozzles 108 a to 108 d (for example, the suction nozzles 108 b and 108 d) first, and the electronic components sucked by the part of the suction nozzles. However, the rotation is performed until an angle that does not interfere with the electronic component sucked by the adjacent suction nozzle and an angle at which this part of the suction nozzle does not interfere with the adjacent suction nozzle (an angle at which the mounting posture is set). Next, the control device 200 rotates the remaining suction nozzles so that the electronic components sucked by the suction nozzles are placed in the mounting posture. By the above operation, the interference avoidance operation by the rotation operation in the θ direction due to the time difference of the suction nozzle is executed.

  For the sake of convenience, the control device 200 determines whether or not the interference avoidance operation can be performed by the rotation operation in the θ direction due to the time difference of the suction nozzles, focusing on the suction nozzles 108a and 108b in FIGS. I will explain. As shown in FIGS. 7 and 8, in the rectangular electronic components 300a and 300b sucked by the suction nozzles 108a and 108b, the dimensions in the arrangement direction of the suction nozzles 108a and 108b are set to l1 and l2, respectively. As shown in FIGS. 9 and 10, on the rectangular suction surfaces of the suction nozzles 108a and 108b, the dimensions of the suction nozzles 108a and 108b in the arrangement direction are L1 and L2, respectively. The control device 200 determines whether or not the following equations (3) and (4) are satisfied in order to determine whether or not the interference avoiding operation is possible by the rotation operation in the θ direction due to the time difference of the suction nozzle.

(L1 / 2) + r2 ≧ P or (l2 / 2) + r1 ≧ P (3)
(L1 / 2) + R2 ≧ P or (L2 / 2) + R2 ≧ P (4)

  For example, when Expression (3) is satisfied, the electronic component 300a and the electronic component 300b interfere even if either of the suction nozzles 108a and 108b is rotated first. Further, when Expression (4) is satisfied, even if any of the suction nozzles 108a and 108b is rotated first, the suction nozzle 108a and the suction nozzle 108b interfere with each other. Therefore, when it is determined that the expression (3) is satisfied, the control device 200 determines that the electronic component 300a and the electronic component 300b interfere with each other, and determines that the interference avoiding operation cannot be performed by the rotation operation in the θ direction due to the time difference of the suction nozzle. The process proceeds to step S63. Further, when it is determined that the expression (4) is satisfied, the control device 200 determines that the suction nozzle 108a and the suction nozzle 108b interfere with each other, and determines that the interference avoiding operation cannot be performed by the rotation operation in the θ direction due to the time difference between the suction nozzles. The process proceeds to step S63. If it is determined that neither of the expressions (3) and (4) is satisfied, the control device 200 determines that the interference avoiding operation is possible by the rotation operation in the θ direction due to the time difference of the suction nozzle, and step S62. Proceed to If it is determined that neither of the expressions (2) and (3) is satisfied, the control device 200 determines that the interference avoiding operation is possible by the rotation operation in the θ direction due to the time difference of the suction nozzle, and step S62. Proceed to If it is determined that neither of the expressions (1) and (4) is satisfied, the control device 200 determines that the interference avoiding operation is possible by the rotation operation in the θ direction due to the time difference of the suction nozzle, and step S62. Proceed to

  Note that the method for determining whether or not the interference avoiding operation is possible by the rotation operation in the θ direction due to the time difference of the suction nozzle by the control device 200 described above is an exemplification, and whether or not the interference avoiding operation is possible by calculation using other methods. It is good also as what determines.

(Step S62)
The control device 200 uses the Z-axis servomotors 203a to 203d to raise the suction nozzles 108a to 108d in the Z-axis direction and place the electronic components 300a to 300d in the mounting posture in the Z-axis direction. The interference avoidance operation is executed by the rotation operation in the θ direction. Then, the process proceeds to step S9.

(Step S63)
FIG. 11 is a diagram illustrating a case where interference between adjacent electronic components can be avoided by vertical movement of the suction nozzle in the Z-axis direction, and FIG. It is the figure which showed the case where interference cannot be avoided. The control device 200 determines whether or not the interference avoidance operation is possible by the vertical movement of the suction nozzle in the Z-axis direction.

  Here, the interference avoidance operation by the vertical movement of the suction nozzle in the Z-axis direction will be described in detail. First, the control device 200 obtains information on the dimensions (for example, the thickness in the Z-axis direction) information and the dimensions of the suction nozzle (for example, the dimension in the Z-axis direction of the portion that determines the rotation radius) stored in the ROM 212. refer. Next, before the electronic device is rotated in the θ direction by the θ-direction servomotors 204a to 204d, the control device 200 is sucked by the suction nozzles 108a to 108d and the suction nozzles 108a to 108d by the Z-axis servomotors 203a to 203d. The electronic components 300a to 300d are moved in the Z-axis direction. For example, the control device 200 determines that the lowermost part of the electronic component sucked by one suction nozzle is the suction nozzle adjacent to this suction nozzle based on the dimension (for example, thickness in the Z-axis direction) information of the electronic component. The electronic components 300a to 300d sucked by the suction nozzles 108a to 108d are moved in the Z-axis direction so as to be positioned above the uppermost part of the sucked electronic components. Further, the control device 200 determines that the lowermost part of the portion for determining the rotation radius of one suction nozzle is based on the suction nozzle size (for example, the dimension in the Z-axis direction of the portion for determining the rotation radius). The suction nozzles 108a to 108d are respectively moved in the Z-axis direction so as to be positioned above the uppermost portion of the portion that determines the rotation radius of the suction nozzle adjacent to the nozzle. FIG. 11 shows that the control device 200 is sucked by the suction nozzle 108a so that the lowermost part of the electronic component 300b sucked by the suction nozzle 108b is located above the uppermost part of the electronic component 300a sucked by the suction nozzle 108a. An example in which the electronic component 300a is moved in the Z-axis direction is shown. By the above operation, the interference avoidance operation by the vertical movement of the suction nozzle in the Z-axis direction is executed. After that, the control device 200 rotates the suction nozzle by the θ-direction servomotors 204a to 204d to place the electronic component in the mounting posture.

  The process in which the control device 200 determines whether or not the interference avoiding operation can be performed by the vertical movement of the suction nozzle in the Z-axis direction will be described with a focus on the suction nozzles 108a and 108b. First, as described above, the control device 200 has information on the dimensions (for example, the thickness in the Z-axis direction) information of the electronic components stored in the ROM 212 and the dimensions (for example, the Z-axis direction of the portion that determines the rotation radius). Refer to the dimensions) information. When the adjacent suction nozzles 108a and 108b reach the top dead center and the bottom dead center in the Z-axis direction based on the dimensional information of the referenced electronic component and the suction nozzle dimension information, respectively, It is determined whether or not the electronic components 300a and 300b or the portions that determine the rotation radius of the suction nozzles 108a and 108b overlap in the horizontal direction. Here, for example, FIG. 11 shows an example in which the electronic components 300a and 300b sucked by the suction nozzles 108a and 108b do not overlap in the horizontal direction. On the other hand, FIG. 12 shows an example in which the electronic components 300a and 300b sucked by the suction nozzles 108a and 108b overlap in the horizontal direction. As shown in FIG. 12, when the electronic components 300a and 300b overlap each other in the horizontal direction, the electronic components 300a and 300b interfere with each other regardless of how they are rotated in the θ direction in order to put the electronic components 300a and 300b in the mounting posture. become. Therefore, when it is determined that the electronic components 300a and 300b overlap in the horizontal direction, the control device 200 determines that the electronic components 300a and 300b interfere with each other, and the interference avoiding operation is performed by the vertical movement of the suction nozzle in the Z-axis direction. It determines with it not being possible, and progresses to step S13. Further, when the controller 200 determines that the portions that determine the rotation radii of the suction nozzles 108a and 108b overlap in the horizontal direction, the control device 200 determines that the suction nozzles 108a and 108b interfere with each other, and the suction nozzles 108a and 108b in the Z-axis direction. It is determined that the interference avoidance operation cannot be performed by the vertical movement, and the process proceeds to step S13. If it is determined that the electronic components 300a and 300b do not overlap in the horizontal direction, the control device 200 determines that the interference avoiding operation can be performed by the vertical movement of the suction nozzle in the Z-axis direction, and the process proceeds to step S64. When the controller 200 determines that the portions that determine the rotation radii of the suction nozzles 108a and 108b do not overlap in the horizontal direction, the control device 200 determines that the interference avoiding operation is possible by the vertical movement of the suction nozzle in the Z-axis direction. The process proceeds to step S64.

  Note that the method for determining whether or not the interference avoiding operation is possible by the vertical movement of the suction nozzle in the Z-axis direction by the control device 200 described above is an exemplification, and whether or not the interference avoiding operation is possible by calculation using other methods. It is good also as what determines.

(Step S64)
The control device 200 executes the above-described interference avoidance operation by the vertical movement of the suction nozzle in the Z-axis direction, rotates the suction nozzles 108a to 108d by the θ-direction servo motors 204a to 204d, and puts the electronic components 300a to 300d in the mounting posture. To do. Then, the process proceeds to step S9.

(Step S7)
The control device 200 raises the suction nozzles 108a to 108d in the Z-axis direction by the Z-axis servomotors 203a to 203d, and places the electronic components 300a to 300d in the mounting posture in the Z-axis direction. Then, the process proceeds to step S8.

(Step S8)
The control device 200 rotates the suction nozzles 108a to 108d in the θ direction by the θ direction servomotors 204a to 204d, and puts the electronic components 300a to 300d in the mounting posture in the θ direction. Then, the process proceeds to step S9.

(Step S9)
The control device 200 recognizes the electronic components 300a to 300d by the component recognition device 205 after placing the electronic components 300a to 300d in the mounting posture in step S62, step S64 or steps S7 and S8. Then, the process proceeds to step S10.

(Step S10)
The control device 200 executes a correction calculation of the mounting position of the electronic component on the board 103 based on the recognition result by the component recognition device 205. Then, the process proceeds to step S11.

(Step S11)
Based on the result of the correction calculation in step S <b> 10, the control device 200 moves the head unit 105 horizontally by the XY direction driving mechanism 110 and moves it to the corrected mounting position above the substrate 103. Then, the process proceeds to step S12.

(Step S12)
The control device 200 lowers the suction nozzles 108a to 108d in the Z-axis direction by the Z-axis servomotors 203a to 203d of the drive units 109a to 109d, and mounts the electronic components 300a to 300d on the substrate 103. With this mounting operation, one mounting operation of the electronic component to the substrate 103 is completed.

(Step S13)
When it is determined that the electronic component or the suction nozzle interferes with the component recognition device 205 or when it is determined that the interference avoiding operation cannot be performed, the control device 200 safely stops the electronic component mounting device 100. Then, the control device 200 may cause the electronic component or the suction nozzle to interfere with the component recognition device 205 in a combination of electronic components or a combination of the suction nozzles 108a to 108d attached to the head unit 105 by a not-illustrated notification unit. Or that electronic components or suction nozzles may interfere with each other. In this case, the operator can remove the suction nozzle corresponding to the interfering electronic component or the interfering suction nozzle and restart the electronic component mounting apparatus 100 in the changeover work, or replace it with a different suction nozzle. Thus, the electronic component mounting apparatus 100 can be restarted.

  The operation of mounting the electronic component on the substrate 103 in the above steps S1 to S12 is repeated a predetermined number of times.

  By the interference avoiding operation as described above, interference between adjacent electronic components can be avoided and interference between adjacent suction nozzles can be avoided. Accordingly, the plurality of electronic components can be transported from the suction position to the mounting position in one cycle in which the suction nozzles 108a to 108d move from the suction position to the mounting position and return to the suction position again. Therefore, a plurality of electronic components can be mounted on the substrate 103 substantially simultaneously by the suction nozzles 108a to 108d in the above-described cycle, and the electronic components can be mounted efficiently, so that the tact time can be improved. .

  Further, since interference between adjacent suction nozzles can be avoided, damage to the suction nozzles can be prevented, and the operation rate of production of electronic substrates can be reduced by stopping the operation of the electronic component mounting apparatus 100 due to damage to the suction nozzles. The decrease can be suppressed.

  In the present embodiment, the electronic component or the suction nozzle interferes with the component recognition device 205 through steps S3 to S5, S61, and S63 every time the electronic component is picked up by the suction nozzles 108a to 108d in one cycle. It is determined whether or not an interference avoiding operation is possible, but the present invention is not limited to this. That is, when the operator completes the changeover operation for replacing the suction nozzle in order to change the electronic component to be mounted on the substrate 103 when the operation of the electronic component mounting apparatus 100 is stopped, the control device 200 performs the changeover. The dimension information and rotation radius information of the subsequent electronic component, the dimension information and rotation radius information of the suction nozzle after the step change, and the like may be read from the ROM 212. And the control apparatus 200 reads each information from ROM212, performs the determination process in step S3-S5, S61, and S63, and when it determines with an electronic component or a suction nozzle interfering with the components recognition apparatus 205, or interference avoidance When it is determined that the electronic component mounting apparatus 100 cannot be operated, the electronic component mounting apparatus 100 may not be operated. Thereby, when the control device 200 determines that the electronic component or the suction nozzle does not interfere with the component recognition device 205 and determines that the interference avoiding operation is possible, the suction operation of the electronic component by the suction nozzles 108a to 108d is performed. Since it is not necessary to perform the above determination process every time, the processing load of the control device 200 can be reduced.

DESCRIPTION OF SYMBOLS 100 Electronic component mounting apparatus 101 Base 102 Substrate conveyance apparatus 103 Substrate 105 Head unit 106 X-axis guide member 107 Y-axis guide member 108a-108d Adsorption nozzle (holding member)
109a to 109d Drive unit 110 XY direction drive mechanism (moving mechanism)
111a to 111d Holding member (holding member)
120a, 120b Adsorption hole 121a, 121b Adsorption part 122 Attachment part 123 Spring part 125 Chuck part 126 Attachment part 140 Component supply apparatus (component supply part)
141 Feeder Bank 142 Electronic Component Feeder 200 Control Device 201 X Axis Servo Motor 202 Y Axis Servo Motor 203a to 203d Z Axis Servo Motor (Attitude Change Mechanism, Linear Motion Mechanism)
204a to 204d θ direction servo motor (posture changing mechanism, rotating mechanism)
205 Component recognition device 210 CPU
211 RAM
212 ROM
213 Driver 300a-300d Electronic component

Claims (15)

A plurality of holding members that are arranged in close proximity to each other, hold electronic components from the component supply unit, and are mounted on the substrate, and the holding members are placed from the component supply unit to the mounting position of the electronic component on the substrate. An electronic component mounting device including a moving mechanism for moving the electronic component mounting device;
A posture changing mechanism that changes the posture of the electronic component held by the holding member by changing the positions of the plurality of holding members, respectively;
A control device for controlling operations of the plurality of holding members, the moving mechanism, and the posture changing mechanism;
With
The posture changing mechanism includes a rotation mechanism that rotates the plurality of holding members in a direction around an axis that is orthogonal to the direction in which the plurality of holding members are juxtaposed,
The controller is
Storing rotation radius information of the holding member when the holding member is rotated by the rotation mechanism;
Based on the rotation radius information of the holding member, it is determined whether adjacent holding members interfere with each other,
When it is determined that the adjacent holding members interfere with each other, the rotation is performed as an interference avoiding operation in which the posture changing mechanism changes the positions of the plurality of holding members so that the adjacent holding members do not interfere with each other. After rotating a part of the plurality of holding members to an angle that does not interfere with the holding members adjacent to the part of the holding members by a mechanism, an operation of rotating the remaining holding members is performed. An electronic component mounting apparatus characterized in that the electronic component is mounted on the substrate. The posture changing mechanism has a linear motion mechanism that moves the plurality of holding members in the direction of an axis perpendicular to the direction in which the plurality of holding members are arranged side by side,
The controller is
Storing dimension information of the holding member;
Based on the dimensional information of the holding member, it is determined whether adjacent holding members interfere with each other,
2. When it is determined that the adjacent holding members interfere with each other, as the interference avoiding operation, the adjacent moving members are linearly moved to a position where they do not interfere with each other by the linear motion mechanism. The electronic component mounting apparatus described. The controller is
Storing rotation radius information of the electronic component when the holding member is rotated by the rotation mechanism;
Based on the rotation radius information of the holding member and the rotation radius information of the electronic component, it is determined whether or not the adjacent holding members interfere with each other,
When it is determined that adjacent holding members interfere with each other, as the interference avoiding operation, the rotation mechanism causes a part of the plurality of holding members to be adjacent to the part of the holding members. The electronic component held by the part of the holding member is rotated to an angle that does not interfere with the electronic component held by the holding member adjacent to the holding member. The electronic component mounting apparatus according to claim 1, wherein after that, an operation of rotating the remaining holding member is executed. The controller is
Storing dimension information of the electronic component;
Based on the dimension information of the holding member and the dimension information of the electronic component, it is determined whether or not the adjacent holding members interfere with each other,
When it is determined that the adjacent holding members interfere with each other, as the interference avoiding operation, the adjacent holding members are in positions that do not interfere with each other and are held by the holding members by the linear motion mechanism. The electronic component mounting apparatus according to claim 2, wherein the electronic components are linearly moved to a position where they do not interfere with each other. A plurality of holding members that are arranged in close proximity to each other, hold electronic components from the component supply unit, and are mounted on the substrate, and the holding members are placed from the component supply unit to the mounting position of the electronic component on the substrate. An electronic component mounting device including a moving mechanism for moving the electronic component mounting device;
A posture changing mechanism that changes the posture of the electronic component held by the holding member by changing the positions of the plurality of holding members, respectively;
A control device for controlling operations of the plurality of holding members, the moving mechanism, and the posture changing mechanism;
With
The posture changing mechanism has a linear motion mechanism that moves the plurality of holding members in the direction of an axis perpendicular to the direction in which the plurality of holding members are arranged side by side,
The controller is
Storing dimension information of the holding member and dimension information of the electronic component;
Based on the dimension information of the holding member and the dimension information of the electronic component, it is determined whether or not the adjacent holding members interfere with each other,
When it is determined that the adjacent holding members interfere with each other, the posture changing mechanism performs the direct operation as an interference avoiding operation for changing the positions of the plurality of holding members so that the adjacent holding members do not interfere with each other. An operation of moving the electronic components straight to a position where the adjacent holding members do not interfere with each other and a position where the electronic components held by the holding members do not interfere with each other is performed by a moving mechanism. An electronic component mounting apparatus characterized by being placed on a top. The controller is
Storing information on the holding member and the electronic component;
Before moving the plurality of holding members to the mounting position, determine whether the interference avoiding operation is possible based on the information on the holding members and the electronic components,
6. When it is determined that the interference avoiding operation is possible, the holding member that holds the electronic component is moved to the mounting position by the moving mechanism. The electronic component mounting apparatus described. The controller is
Storing information on the holding member and the electronic component;
6. The electronic component according to claim 1, wherein at the time of changeover, whether or not the interference avoiding operation is possible is determined based on the information on the holding member and the electronic component. Mounting device. A plurality of holding members that are arranged in close proximity to each other, hold electronic components from the component supply unit, and are mounted on the substrate, and the holding members are placed from the component supply unit to the mounting position of the electronic component on the substrate. An electronic component mounting device including a moving mechanism for moving the electronic component mounting device;
A posture changing mechanism that changes the posture of the electronic component held by the holding member by changing the positions of the plurality of holding members, respectively;
A control device for controlling operations of the plurality of holding members, the moving mechanism, and the posture changing mechanism;
With
The controller is
Storing information on the holding member and the electronic component;
Determine whether adjacent holding members interfere with each other;
When it is determined that the adjacent holding members interfere with each other, the plurality of the holding members are prevented from interfering with each other by the posture changing mechanism before moving the plurality of holding members to the mounting position. Whether or not an interference avoidance operation for changing the position of each holding member is possible is determined based on the information about the holding member and the electronic component,
When it is determined that the interference avoiding operation is possible, the interference avoiding operation is executed, and the holding member holding the electronic component is moved to the mounting position by the moving mechanism, and the electronic component is moved to the substrate. An electronic component mounting apparatus characterized by being placed on a top. A plurality of holding members that are arranged in close proximity to each other, hold electronic components from the component supply unit, and are mounted on the substrate, and the holding members are placed from the component supply unit to the mounting position of the electronic component on the substrate. An electronic component mounting device including a moving mechanism for moving the electronic component mounting device;
A posture changing mechanism that changes the posture of the electronic component held by the holding member by changing the positions of the plurality of holding members, respectively;
A control device for controlling operations of the plurality of holding members, the moving mechanism, and the posture changing mechanism;
With
The controller is
Storing information on the holding member and the electronic component;
Determine whether adjacent holding members interfere with each other;
When it is determined that the adjacent holding members interfere with each other, an interference avoiding operation for changing the positions of the plurality of holding members by the posture changing mechanism so that the adjacent holding members do not interfere with each other at the time of changeover. Is determined based on the information on the holding member and the electronic component,
When it is determined that the interference avoiding operation is possible, the electronic component mounting apparatus is configured to execute the interference avoiding operation and set the electronic component on the substrate. An image pickup device for picking up an image of the holding member and the electronic component;
10. The electronic component mounting apparatus according to claim 6 , wherein the control device stores information on the holding member and the electronic component imaged by the imaging device.   The electronic component mounting apparatus according to claim 1, further comprising a head unit on which the plurality of holding members are detachably mounted and moved by the moving mechanism. Holding a plurality of electronic components from the component supply unit;
Based on the turning radius information of a plurality of holding members for holding the electronic component, one of the holding member, and determining whether or not step the retaining member adjacent to interfere with each other,
When it is determined that the adjacent holding members interfere with each other, one of the plurality of holding members is used as an interference avoiding operation for changing the positions of the plurality of holding members so that the adjacent holding members do not interfere with each other. The part is rotated to an angle that does not interfere with the holding member adjacent to the part of the holding member, and then the remaining holding member is rotated so that the electronic component is mounted on the substrate. And a process of
Moving the plurality of holding members to the mounting position of the electronic component on the substrate;
Mounting the electronic component on the substrate;
An electronic component mounting method characterized by comprising: Determining whether adjacent holding members interfere with each other based on dimensional information of the holding members;
13. The electronic component mounting method according to claim 12, further comprising a step of linearly moving the adjacent holding members to a position where they do not interfere with each other when it is determined that the adjacent holding members interfere with each other. Before moving the plurality of the holding member to the mounting position, on the basis of information relating to the holding member, according to claim 12, characterized in that comprising the step determining whether or not the interference avoiding action can or 13 electronic component mounting method according to. Holding a plurality of electronic components from the component supply unit;
Determining whether adjacent holding members of the plurality of holding members holding the electronic component interfere with each other; and
When it is determined that the adjacent holding members interfere with each other, the plurality of the holding members are prevented from interfering with each other before the plurality of holding members are moved to the mounting position of the electronic component on the substrate. Determining whether or not an interference avoidance operation for changing the position of each holding member is possible based on information on the holding member;
If it is determined that it is possible the interference avoidance operation, the steps of the posture by performing the interference avoidance operation, mounting the electronic component on the substrate,
A step of moving a plurality of said retaining member to said mounting position,
Mounting the electronic component on the substrate;
An electronic component mounting method characterized by comprising:

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