JP4891290B2 - Mounting condition determination method - Google Patents

Description

  The present invention relates to a mounting condition determination method for a component mounting machine in which a mounting head sucks a component supplied from a component supply unit and mounts the component on a substrate.

  2. Description of the Related Art Conventionally, there is a component mounter as equipment for mounting electronic components (hereinafter simply referred to as “components”) on a board and producing a circuit board. In the component mounter, the components supplied from the component supply unit are transferred and mounted on the substrate using the mounting head. A suction nozzle for holding a component is mounted on the mounting head in a detachable state. Since there are various forms of components to be mounted on the substrate, various suction nozzles are prepared correspondingly. A plurality of suction nozzles are arranged in the nozzle changer, and the nozzle replacement operation is appropriately performed according to the components to be mounted on the substrate.

As a technique for determining the optimum arrangement of the suction nozzles in the nozzle changer, for example, there is one described in Patent Document 1. In this technique, first, an array of suction nozzles (nozzle array) in a nozzle changer is created, and the number of nozzle replacements when a component is mounted on a substrate with the nozzle array is calculated. The nozzle arrangement is changed, and the number of nozzle replacements when the component is mounted on the board with the changed nozzle arrangement is further calculated. The nozzle arrangement with the smaller number of nozzle replacements calculated is the optimum arrangement.
JP 2003-78289 A

  By the way, in recent years, various components have been mounted on a substrate, and the types of suction nozzles necessary for mounting are diversified. Therefore, how to efficiently arrange the suction nozzles in the nozzle changer, that is, how to reduce the number of suction nozzle resources in the nozzle changer has become an important issue.

  Under such circumstances, in the conventional method for determining the nozzle arrangement, the nozzle arrangement is determined so that a plurality of adsorption nozzles can be exchanged as much as possible in the nozzle exchange. The production tact can be improved by minimizing the time required. However, nothing is mentioned about the number of resources of the suction nozzle. Even if the time for replacing the suction nozzle can be reduced and the production tact can be improved, if the number of suction nozzle resources cannot be reduced, the nozzle changer must maintain the suction nozzle inventory accordingly. Production costs cannot be reduced.

  In view of the above problems, an object of the present invention is to provide a mounting condition determination method capable of reducing the number of suction nozzle resources in a nozzle changer.

  In order to achieve the above object, a mounting condition determination method according to the present invention includes a mounting head for mounting a component on a substrate and a plurality of nozzles that are detachably mounted on the mounting head and each hold the component. A mounting device having a nozzle changer disposed on the nozzle changer, and determining a placement condition of the plurality of nozzles in the nozzle changer as a mounting condition of the mounting device, wherein the mounting head sucks the component. When a series of movements in a series of movements of moving and mounting is repeated as a task, and a set of nozzles used in one of the tasks is a nozzle pattern, it is used in a predetermined task. The nozzle pattern has a positional relationship that matches the positional relationship of the nozzle pattern of the mounting head in the predetermined task. A determination step for determining the arrangement so that each of the nozzle patterns of the two consecutive tasks in which the different nozzle patterns are used are arranged adjacent to each other in the column direction of the nozzle changer; A correction step of extracting a plurality of nozzles of the same type arranged in a row in the determined arrangement and correcting the arrangement so that at least one of the extracted nozzles of the same type is removed; It is characterized by including.

  This minimizes the time for replacement of the suction nozzle and reduces the number of suction nozzle resources in the nozzle changer.

  The present invention also provides a component mounting comprising: a mounting head for mounting a component on a substrate; and a nozzle changer that is detachably attached to the mounting head and in which a plurality of nozzles each holding the component are arranged in a matrix. A method of determining a placement condition of the plurality of nozzles in the nozzle changer as a mounting condition of the component mounter for a machine, wherein the mounting head sucks, moves, and mounts a component. When a series of operations for one iteration is used as a task, the number of nozzles of a predetermined type used in one task is calculated, and the maximum value in all the tasks of the calculated number is calculated. The mounting condition determining method is characterized in that the arrangement is determined so that the predetermined types of nozzles are arranged only for the calculated maximum value. It can be.

  As a result, the number of suction nozzle resources in the nozzle changer can be greatly reduced in a component mounter in which nozzle replacement is not possible during mounting.

  Note that the present invention can be realized not only as such a mounting condition determination method, but also by using an apparatus and a program for determining the mounting condition by the method, a storage medium for storing the program, and the mounting condition determination method. It can also be realized as a component mounting method for mounting components and a component mounter for mounting components by the component mounting method.

  According to the present invention, since the number of suction nozzle resources in the nozzle changer can be reduced and the production cost can be reduced, the practical value of the present invention is extremely high.

  Hereinafter, a mounting condition determination method according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a component mounting system 10 that realizes a mounting condition determination method according to the present invention.

  The component mounting system 10 is a system that mounts components on a substrate 20 to produce a circuit board, and includes a mounting condition determination device 100 and a component mounter 200.

  The mounting condition determination apparatus 100 is a computer that determines the mounting conditions of components by the component mounter 200. For example, the mounting condition determining apparatus 100 determines component placement, nozzle placement, component mounting order, and the like as mounting conditions.

  The component mounting machine 200 receives the substrate 20 from the upstream side, and the mounting head sucks the component and mounts the component on the substrate 20 in accordance with the mounting condition determined by the mounting condition determining apparatus 100. And the board | substrate 20 with which components were mounted is sent out downstream. In the component mounter 200, a plurality of components and suction nozzles are arranged according to the mounting conditions determined by the mounting condition determination apparatus 100.

  FIG. 2 is a plan view showing the main configuration inside the component mounter 200.

  The component mounter 200 includes two mounting units (sub-equipment) 210 a and 210 b that mount components on the substrate 20. The two mounting units 210a and 210b cooperate with each other to perform a mounting operation on one board 20. In addition, let the conveyance direction of the board | substrate 20 be an X-axis direction, and let the direction perpendicular | vertical to the X-axis direction in a horizontal surface be a Y-axis direction. The two mounting units 210a and 210b are arranged side by side in the Y-axis direction.

  The mounting unit 210a includes a component supply unit 211a, a mounting head 213a, a component recognition camera 214a, and a nozzle changer 215a.

  The component supply unit 211a includes an array of a plurality of component cassettes 212a that store component tapes. In addition, the component cassettes 212a of the component supply unit 211a are arranged along the X-axis direction. The component tape is, for example, a plurality of components of the same component type arranged evenly on a tape (carrier tape) and supplied in a state of being wound around a reel or the like. The parts arranged on the part tape are, for example, chips, and specifically, 0402 chip parts and 1005 chip parts.

  The mounting head 213a is a mounting head called a multi mounting head, for example, and can include a plurality of suction nozzles. For example, ten components are sucked and moved from the component supply unit 211a and mounted on the substrate 20. Can do. Such a mounting head 213a is slidably attached to a beam 231a configured in a shaft shape. Therefore, the mounting head 213a moves along the beam 231a, for example, by driving a motor or the like.

  The beam 231a is slidably attached in the Y axis direction on a pair of beam driving robots 240 arranged in parallel to each other along the Y axis direction. Therefore, the beam 231a moves on the pair of beam driving robots 240 along the Y-axis direction by driving a motor or the like, for example. That is, the mounting head 213a is moved in the X-axis direction and the Y-axis direction by the beam driving robot 240 and the beam 231a.

  The component recognition camera 214a is used to photograph the component sucked by the mounting head 213a and inspect the suction state of the component two-dimensionally or three-dimensionally.

  The nozzle changer 215a holds a plurality of suction nozzles for replacement. This suction nozzle for replacement is a suction nozzle for replacement when there is a part that cannot be sucked by the suction nozzle provided in the mounting head 213a, or when there is an abnormality in the suction nozzle.

  Similarly to the mounting unit 210a, the mounting unit 210b includes a component supply unit 211b, a mounting head 213b, a component recognition camera 214b, and a nozzle changer 215b.

  The mounting head 213b is, for example, a multi-mounting head, and can pick up components from the component supply unit 211b and mount them on the substrate 20. Similar to the mounting head 213a, the mounting head 213b moves in the X-axis direction and the Y-axis direction by the beam driving robot 240 and the beam 231b.

  The detailed configuration of the other mounting unit 210b is the same as that of the mounting unit 210a, and will not be described.

  FIG. 3 is a schematic diagram showing the positional relationship between the mounting head 213a and the component cassette 212a. As described above, the mounting head 213a can be detachably attached with a plurality of suction nozzles 216 that suck and hold components. For example, a maximum of ten suction nozzles 216 can be attached. The mounting head 213a to which the ten suction nozzles 216 are attached can suck components from each of a maximum of ten component cassettes 212a simultaneously (by one up and down movement).

  Similarly, the mounting head 213b can simultaneously pick up components from each of the component cassettes 212b (by one up and down movement).

  FIG. 4 is a diagram illustrating an example of a component tape and a reel that contain components.

  Components such as chip-type electronic components are housed in a housing recess 221a formed continuously at a predetermined interval on a carrier tape 221 shown in FIG. 4, and are covered with a cover tape 222 attached to the upper surface. The carrier tape 221 with the cover tape 222 attached in this way is supplied to the user in a taping form wound around the reel 223 by a predetermined quantity. The carrier tape 221 and the cover tape 222 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  FIG. 5 is a schematic diagram showing the positional relationship between the mounting head 213a and the nozzle changer 215a. In the nozzle changer 215a, a plurality of replacement suction nozzles 216 are arranged in a matrix. Since the types of suction nozzles 216 that can be used differ depending on the components to be mounted, it is necessary to replace the suction nozzles 216 during production of one circuit board. Therefore, in the nozzle changer 215a, the suction nozzle 216 is designed so that the time for replacing the suction nozzle 216 is minimized, that is, the mounting head 213a can replace as many suction nozzles 216 as possible at the same time (by one up and down movement). Is arranged. A direction in which the suction nozzles 216 of the mounting head 213a are arranged is a row direction, and a direction perpendicular to the row direction in the horizontal plane is a column direction.

  The mounting unit 210a of such a component mounting machine 200 moves the mounting head 213a to the component supply unit 211a and causes the mounting head 213a to attract the component supplied from the component supply unit 211a. Then, the mounting unit 210a moves the mounting head 213a onto the component recognition camera 214a at a constant speed, causes the component recognition camera 214a to capture images of all the components sucked by the mounting head 213a, and accurately determines the component suction position. To detect.

  Then, the mounting unit 210 a moves the mounting head 213 a to the substrate 20 and sequentially mounts all the sucked components on the mounting points of the substrate 20. The mounting unit 210a mounts all the predetermined components on the substrate 20 by repeatedly performing such operations of suction, movement, and mounting by the mounting head 213a.

  In addition, the mounting unit 210b moves the mounting head 213b to the component supply unit 211b, and causes the component supplied from the component supply unit 211b to attract the mounting head 213b. The mounting unit 210b also mounts all the predetermined components on the substrate 20 by repeatedly executing an operation in which the mounting head 213b moves to the substrate 20 and mounts the components, similarly to the mounting unit 210a. .

  Then, each of the mounting unit 210a and the mounting unit 210b sucks a component from the component supply unit when the other mounting unit is mounting a component, and conversely, the other mounting unit sucks a component from the component supply unit. When mounting the components, the components are alternately mounted on the board 20 so as to mount the components. In other words, the component mounter 200 is configured as a so-called alternating component mounter.

  Note that when the suction nozzle 216 needs to be replaced, the mounting head 213a moves to the nozzle changer 215a and replaces the suction nozzle 216. Similarly, when it is necessary to replace the suction nozzle 216, the mounting head 213b moves to the nozzle changer 215b and replaces the suction nozzle 216.

  FIG. 6 is a block diagram showing a functional configuration of a control system of the mounting condition determining apparatus 100 in the present embodiment.

  The mounting condition determining apparatus 100 according to the present embodiment includes an input unit 251, a display unit 252, an arrangement determining unit 253, an arrangement correcting unit 254, a communication unit 256, and a storage unit 257.

  The input unit 251 includes, for example, a keyboard and a mouse, and accepts an operation from the operator.

  The display unit 252 is configured by, for example, a liquid crystal display, and displays a screen for receiving information from the user, or displays data stored in the storage unit 257 or the like.

  The communication unit 256 communicates with the component mounter 200. For example, the communication unit 256 transmits NC (Numeric Control) data 257a indicating information on each mounting point of the board 20 and a component library 257b indicating information on each component to the component mounting machine 200, thereby transmitting the NC. The component mounter 200 is caused to execute component mounting in accordance with the mounting condition indicated by the data 257a.

  The storage unit 257 stores NC data 257a and a component library 257b.

  FIG. 7 is a diagram illustrating an example of the NC data 257a.

  The NC data 257a is a collection of information indicating mounting points of all components to be mounted. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 257b shown in FIG. 9, the X coordinate and the Y coordinate are coordinates of the mounting point (coordinates indicating a specific position on the board 20), and the control data is , The constraint information (the type of usable suction nozzle, the maximum movement acceleration of the mounting head, etc.) regarding the mounting of the component is shown. The mounting angle θi indicates an angle at which the suction nozzle 216 that sucks a component of the component type ci should rotate.

  Here, the NC data 257a to be finally obtained is an implementation in which, as shown in FIG. 8, the mounting order is optimized and the mounting points are assigned to each task so as to minimize the mounting tact. It is a sequence of points. The task refers to a series of operations in one repetition in a series of operations in which the mounting head picks up, moves, and mounts the component. Specifically, it refers to a series of operations in which the mounting heads 213a and 213b suck and move one or more components and mount the sucked one or more components on the substrate 20. In FIG. 8, “Head 1” corresponds to the mounting head 213a and “Head 2” corresponds to the mounting head 213b. Task 1-1 is a task in which components are picked up, moved, and mounted by the mounting head 213a. Reference numeral -2 denotes a task for picking, moving, and mounting a component by the mounting head 213b. Further, the type of the suction nozzle 216 is indicated by 1001, 1002, 1003, and the like as nozzle types, and the position of the suction nozzle 216 in each of the mounting heads 213a and 213b is indicated by any one of the nozzles 1 to 10 as the nozzle No. The nozzles 1 to 10 indicate positions sequentially arranged from one end of each of the mounting heads 213a and 213b.

  FIG. 9 is a diagram illustrating an example of the component library 257b.

  The component library 257b is a library in which unique information about all component types that can be handled by the component mounter 200 is collected. As shown in FIG. 9, the component library 257b includes a component size for each component type (component name), tact (tact specific to the component type under a certain condition), and other restriction information (types of usable suction nozzles). , Recognition method by component recognition camera, maximum acceleration ratio of mounting head, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library 257b may include information such as the color and shape of the component.

  The arrangement determining unit 253 determines the arrangement of the replacement suction nozzle 216 in the nozzle changers 215a and 215b.

  Specifically, the arrangement determining unit 253 arranges the nozzle patterns used in a predetermined task in the same row of the nozzle changer 215a in a positional relationship that matches the positional relationship of the nozzle pattern of the mounting head 213a in the predetermined task, and The arrangement is determined so that the nozzle patterns of two consecutive tasks in which different nozzle patterns are used are arranged adjacent to each other in the row direction of the nozzle changer 215a (sequentially arranged upward in the row direction of the nozzle changer 215a). To do. Further, the arrangement determining unit 253 also determines the arrangement of the replacement suction nozzle 216 in the same manner as the nozzle changer 215a for the nozzle changer 215b. The nozzle pattern refers to a set of suction nozzles 216 used in one task.

  For example, different nozzle patterns are used in task 1-1 and task 2-1, which are continuous tasks in the head 1 (mounting head 213a) of the NC data 257a in FIG. Therefore, the arrangement determining unit 253 arranges all the nozzle patterns attached to the nozzles 1 to 10 in the task 1-1 in the same row of the nozzle changer 215a and attaches the nozzle patterns to the nozzles 1 to 10 in the task 2-1. Also, the arrangement is determined so that all are arranged in the same row of the nozzle changer 215a. At this time, in the nozzle changer 215a, the nozzle patterns to be attached to the nozzles 1 to 10 in the task 2-1 are arranged in a row one row in the column direction of the nozzle patterns attached to the nozzles 1 to 10 in the task 1-1. Is done. Thereby, in the nozzle changer 215a, the suction nozzle 216 is disposed as shown in FIG.

  The arrangement correction unit 254 corrects the arrangement of the replacement suction nozzle 216 determined by the arrangement determination unit 253.

  Specifically, the arrangement correcting unit 254 extracts a plurality of the same type of suction nozzles 216 that are continuously arranged in the column direction in the arrangement determined by the arrangement determination unit 253, and extracts the plurality of the same type of suction nozzles 216 extracted. Among them, the arrangement is modified so that only the adsorption nozzle 216 (the adsorption nozzle 216 located at the bottom in the row direction) of the nozzle pattern of the earliest task is arranged in the nozzle changers 215a and 215b.

  For example, when the arrangement shown in FIG. 10A is determined by the arrangement determining unit 253, the arrangement correcting unit 254 includes the suction nozzles 216 of the nozzle type 1002 that overlap in the column direction in FIG. 10A. A modification is made to remove all but the bottom one and remove all but the bottom of the suction nozzles 216 of the nozzle type 1001. Thereby, in the nozzle changer 215a, the suction nozzle 216 is arranged as shown in FIG. 10B.

  FIG. 11 is a flowchart illustrating an example of a mounting condition determination method (a method for determining the arrangement of replacement suction nozzles in a nozzle changer) according to the present embodiment.

  First, the arrangement determining unit 253 determines the arrangement in the nozzle changer 215a for the suction nozzles 216 necessary for all the tasks related to the mounting head 213a so that the time for replacement of the suction nozzles 216 is minimized. Similarly, the arrangement determining unit 253 determines the arrangement in the nozzle changer 215b for the suction nozzles 216 necessary for all tasks related to the mounting head 213b (S101).

  Then, the arrangement correcting unit 254 adds correction for removing the suction nozzle 216 that is not necessarily used to the arrangement determined by the arrangement determining unit 253 (S102).

  Thereby, as shown in FIG. 10B, unnecessary suction nozzles 216 of the nozzle changers 215a and 215b can be removed, and the number of resources of the suction nozzles 216 can be reduced.

  FIG. 12 is a flowchart illustrating an example of component mounting (a suction nozzle replacement method) by the component mounting machine 200 according to the present embodiment.

  First, the control unit of the component mounting machine 200 identifies the suction nozzle 216 that needs to be replaced in a continuous task related to the mounting head 213a or 213b (S201). For example, in Task 1-1 and Task 2-1, which are consecutive tasks in the head 1 (mounting head 213a) of the NC data 257a in FIG. 8, since different nozzle types are assigned to the nozzles 10, they need to be replaced. The suction nozzle 216 of the nozzle type 1003 of the nozzle 10 is specified as the suction nozzle 216 having a certain number.

  Then, the control unit of the component mounting machine 200 causes the mounting head 213a or 213b to remove the unnecessary suction nozzle 216 (the suction nozzle specified in S201) (S202). For example, in tasks 1-1 and 2-1 as continuous tasks in the head 1 (mounting head 213a) of the NC data 257a in FIG. 8, the suction nozzle 216 of the nozzle type 1003 of the nozzle 10 is removed, and the nozzle changer 215a. Returned to where it was originally placed.

  Then, the control unit of the component mounting machine 200 newly attaches a new suction nozzle 216 to the position where the suction nozzle 216 of the mounting head 213a or 213b is removed (S203). For example, in task 1-1 and task 2-1 as continuous tasks in the head 1 (mounting head 213a) of the NC data 257a in FIG. 8, the nozzle 10 of the task 2-1 to be performed next to the task 1-1 is set. Since the nozzle type 1001 is assigned, the suction nozzle 216 of the nozzle type 1001 is newly attached at the position of the nozzle 10.

(Modification)
Here, a modification of the present embodiment will be described. In the above embodiment, the arrangement of the suction nozzles in the nozzle changer is determined so that the time for replacement of the suction nozzles is minimized. This produces an effect of improving production tact in a component mounter in which the suction nozzle is replaced during production of one circuit board (hereinafter simply referred to as “component mounter that can be replaced during operation”). . However, in a component mounter (a component mounter that cannot be replaced during operation) in which the suction nozzle is replaced when the circuit board to be produced is switched, that is, the mounting operation is stopped and the suction nozzle is replaced. Does not produce a significant effect. Therefore, in this modification, the type of the component mounter is determined, and if it is determined that the component mounter is a component mounter that can be replaced during operation, the nozzles are moved along S101 and S102 in FIG. The arrangement of the suction nozzles in the changer is determined. On the other hand, if it is determined that the component mounter is not a component mounter that can be replaced during operation, the number of suction nozzles of the same type in the nozzle changer is reduced as much as possible, and only a variety of suction nozzles are arranged. Considering the above, the arrangement of the suction nozzle is determined.

  FIG. 13 is a block diagram showing a functional configuration of a control system of the mounting condition determining apparatus 100 according to this modification.

  The mounting condition determining apparatus 100 in the present modification includes an input unit 251, a display unit 252, an arrangement determining unit 253, an arrangement correcting unit 254, a mounting machine determining unit 255, a communication unit 256, and a storage unit 257.

  The mounting machine determination unit 255 determines the type of the component mounting machine 200 that should determine the arrangement of the suction nozzles 216 in the nozzle changers 215a and 215b. Specifically, the mounter determination unit 255 determines whether the component mounter 200 is a component mounter that can be replaced while the component mounter 200 is operating. For example, the mounter determination unit 255 performs the determination by receiving information about the type of the component mounter 200 from the user via the input unit 251 and the display unit 252.

  When it is determined that the component mounter 200 is a component mounter that can be replaced while the component mounter 200 is in operation, the arrangement determining unit 253 determines that the nozzle pattern used in the predetermined task is the nozzle pattern of the mounting head 213a in the predetermined task Are arranged in the same row in the nozzle changer 215a with a positional relationship that matches the positional relationship, and each of the nozzle patterns of two consecutive tasks in which different nozzle patterns are used are sequentially arranged adjacent to each other in the column direction of the nozzle changer 215a. To determine the placement. Further, the arrangement determining unit 253 also determines the arrangement of the replacement suction nozzle 216 in the same manner as the nozzle changer 215a for the nozzle changer 215b.

  When it is determined that the component mounter 200 is not a component mounter that can be replaced while the component mounter 200 is in operation, the arrangement determining unit 253 calculates the number of predetermined types of suction nozzles 216 used in one task. The maximum value in all the tasks is calculated, and the arrangement is determined so that a predetermined number of nozzles are placed in the nozzle changers 215a and 215b only in the calculated maximum value. That is, the arrangement is determined so that the number of resources of the suction nozzle 216 in the nozzle changers 215a and 215b is minimized.

  Specifically, as shown in FIG. 14, the arrangement determining unit 253 sets the suction nozzles 216 for all tasks for each mounting unit (the mounting unit 210a in FIG. 14), that is, for each mounting head (the mounting head 213a in FIG. 14). The number of suction nozzles 216 used for each type and the maximum value thereof are calculated. In FIG. 14, for example, one nozzle type 1001 is used in task 1-1, two are used in task 2-1, and one is used in task 3-1, and only a maximum of two may be used for any task. It is shown.

  When it is determined that the component mounter 200 is a component mounter that can be replaced while the component mounter 200 is in operation, the layout correcting unit 254 has a plurality of the same types that are continuously arranged in the column direction in the layout determined by the layout determining unit 253 The suction nozzle 216 is extracted, and only the suction nozzle 216 of the nozzle pattern of the earliest task among the plurality of extracted suction nozzles 216 of the same type (the suction nozzle 216 positioned at the bottom in the column direction) is the nozzle changer 215a. And 215b to correct the arrangement.

  FIG. 15 is a flowchart illustrating an example of a mounting condition determination method (a method for determining the arrangement of replacement suction nozzles in a nozzle changer) according to the present modification.

  First, the mounter determination unit 255 determines whether or not the component mounter 200 whose placement of the suction nozzle 216 is to be determined is a component mounter that can be replaced during operation (S301).

  Then, when it is determined that the component mounter 200 is a component mounter that can be replaced while the component mounter 200 is operating (YES in S301), the arrangement determining unit 253 minimizes the time for replacing the suction nozzle 216. Next, the arrangement in the nozzle changers 215a and 215b is determined (S302).

  Then, the arrangement correcting unit 254 adds correction for removing the suction nozzle 216 that is not necessarily used to the arrangement determined by the arrangement determining unit 253 (S303).

  If it is determined that the component mounter 200 is not a component mounter that can be replaced while the component mounter 200 is in operation (NO in S301), the arrangement determining unit 253 has as few resources as possible for the suction nozzle 216 in the nozzle changers 215a and 215b. The arrangement is determined so as to be (S304).

  Thereby, more unnecessary suction nozzles 216 of the nozzle changers 215a and 215b can be removed, and the number of resources of the suction nozzles 216 can be further reduced.

  As mentioned above, although the mounting condition determination method according to the present invention has been described using the above embodiment, the present invention is not limited to this.

  For example, in the above embodiment, the mounting condition determining device 100 and the component mounting machine 200 are provided separately. However, the component mounting machine 200 has the function of the mounting condition determining device 100, and the mounting condition determining device 100 is a component. It may be provided as a part of the mounting machine 200.

  In the above embodiment, the arrangement correcting unit 254 corrects the arrangement determined by the arrangement determining unit 253 and finishes the process of determining the arrangement of the suction nozzles 216. Processing for reducing the number of resources of the suction nozzle 216 as much as possible may be performed.

  In FIG. 15, S304 may be executed even if the component mounting machine is capable of nozzle replacement during operation (YES in S301). Thereby, tact loss at the time of automatic replacement of the suction nozzle occurs, but the number of suction nozzle resources can be further reduced from the placement of the suction nozzles determined in S302 and S303.

  In the above embodiment, the arrangement correcting unit 254 arranges only the suction nozzles 216 of the nozzle pattern of the earliest task among the plurality of extracted suction nozzles 216 of the same type in the nozzle changers 215a and 215b. The layout was modified. However, the arrangement correction unit 254 may correct the arrangement so that at least one of the plurality of extracted nozzles of the same type is removed.

  Moreover, in the said embodiment, although the component mounting machine was an alternating type component mounting machine with two mounting units, it is not limited to what determines the mounting conditions of such a type of component mounting machine. For example, the component mounter may be a component mounter having one mounting unit or three or more mounting units.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a mounting condition determination method for a component mounter that mounts a component on a substrate, and in particular, can be applied to a mounting condition determination method that can reduce production costs.

1 is an external view showing a configuration of a component mounting system that realizes a component mounting method according to the present invention. It is a top view which shows the main structures inside a component mounting machine. It is a schematic diagram which shows the positional relationship of a mounting head and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated components. It is a schematic diagram which shows the positional relationship of a mounting head and a nozzle changer. It is a block diagram which shows the function structure of the control system of a component mounting machine. It is a figure which shows an example of NC data. It is a figure which shows an example of final NC data. It is a figure which shows an example of a component library. It is a figure which shows arrangement | positioning of the suction nozzle in a nozzle changer. It is a flowchart which shows an example of the mounting condition determination method which concerns on this invention. It is a flowchart which shows an example of the component mounting by a component mounting machine. It is a block diagram which shows the function structure of the control system of the component mounting machine which concerns on a modification. It is a figure which shows the determination method of arrangement | positioning of the suction nozzle which concerns on a modification. It is a flowchart which shows an example of the mounting condition determination method which concerns on a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 20 Board | substrate 100 Mounting condition determination apparatus 200 Component mounting machine 210a, 210b Mounting unit 211a, 211b Component supply part 212a, 212b Component cassette 213a, 213b Mounting head 214a, 214b Component recognition camera 215a, 215b Nozzle changer 216 Adsorption nozzle 221 Carrier tape 221a Storage recess 222 Cover tape 223 Reel 231a, 231b Beam 240 Beam drive robot 251 Input unit 252 Display unit 253 Arrangement determination unit 254 Arrangement correction unit 255 Mounting machine determination unit 256 Communication unit 257 Storage unit 257a NC data 257b Parts library

Claims (3)

Component mounting for producing a circuit board, comprising: a mounting head for mounting a component on a substrate; and a nozzle changer that is detachably attached to the mounting head and in which a plurality of nozzles each holding the component are arranged in a matrix A method for determining a mounting condition of the component mounting machine, the arrangement of the plurality of nozzles in the nozzle changer,
A determination step of determining whether or not the suction nozzle is replaced while the component mounter is producing one circuit board;
When it is determined in the determining step that the suction nozzle is to be replaced while the component mounting machine is producing one circuit board, the mounting head picks up, moves, and mounts the component. A set of nozzles used in one task is a nozzle pattern, and the nozzle pattern used in the predetermined task is a mounting head in the predetermined task. The nozzle patterns of the two consecutive tasks in which the nozzle changers are arranged in the same row with a positional relationship that matches the positional relationship of the nozzle patterns and the different nozzle patterns are used are in the column direction of the nozzle changer. The arrangement is determined to be arranged adjacent to each other, and a plurality of lines arranged continuously in the column direction in the determined arrangement A modification step of applying a correction to the arrangement so as to extract a single type of nozzle, at least one of the extracted plurality of the same type of nozzle was removed,
When it is determined in the determining step that the suction nozzle is not replaced while the component mounter is producing one circuit board, the number of nozzles of a predetermined type used in one task is calculated. And calculating a maximum value in all the tasks for the calculated number, and determining the arrangement so that the predetermined type of nozzles is disposed for the calculated maximum value. A mounting condition determination method characterized by that. In the correction step, the arrangement is corrected so that only nozzles of the nozzle pattern used in the earliest task among the plurality of extracted nozzles of the same type are arranged in the nozzle changer.
The mounting condition determination method according to claim 1, wherein: In the correcting step, the number of nozzles of a predetermined type used in one task is further calculated, the maximum value in all the tasks of the calculated number is calculated, and the nozzle of the predetermined type is calculated. Modify the arrangement so that is arranged in the nozzle changer by the number of calculated maximum values.
The mounting condition determination method according to claim 1, wherein:

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