WO2014141427A1

WO2014141427A1 - Mounting setting method and mounting setting device

Info

Publication number: WO2014141427A1
Application number: PCT/JP2013/057168
Authority: WO
Inventors: 隆倉科; 浩章村土
Original assignee: 富士機械製造株式会社
Priority date: 2013-03-14
Filing date: 2013-03-14
Publication date: 2014-09-18
Also published as: JPWO2014141427A1

Abstract

Provided is a mounting setting method in which a component mounting device (11) obtains information related to the arrangement position heights of a substrate (16) that comprises a plurality of arrangement positions of differing heights and component size information including the height of a component that is to be arranged, determines the height of a component at an arrangement position from the acquired arrangement position heights and the size of the component, and sets a mounting order for arranging components on the substrate (16) so that a component for which the determined arrangement position height is lower is arranged first. On this occasion, it is determined whether a first component that is attached to a suction head (24) will interfere with a second component that is arranged at an arrangement position, and the mounting order may be set so that the first component is arranged prior to the second component when it is determined that interference will occur.

Description

Mounting setting method and mounting setting device

The present invention relates to a mounting setting method and a mounting setting device.

Conventionally, as a mounting setting method, for example, before the suction head transports a component, a step of acquiring the height information of the component and a mounting order of the components are determined based on the height information acquired in this step. A method for determining the order in which components are mounted has been proposed (for example, see Patent Document 1). In this method, the possibility of interference between the component mounted on the substrate and the suction head, which is generated by replacing the supply component, can be detected and avoided in advance.

JP 2006-100594 A

By the way, in recent years, electronic devices have been reduced in size and performance, and electronic components have also been reduced in size and mounted on a substrate at high density. Along with this, for example, for the purpose of reducing the thickness or the like, a substrate having irregularities on the surface and having a plurality of arrangement positions with different heights has been realized. However, in the above-described method, it is not considered to arrange components on a substrate having a plurality of arrangement positions with different heights. For this reason, a component that has already been arranged and a component that is to be arranged may interfere with each other, and there has been a further demand for reliably mounting the component.

The present invention has been made in view of such problems, and provides a mounting setting method and a mounting setting device that can more reliably mount components on a substrate having a plurality of arrangement positions with different heights. The main purpose is to do.

The present invention adopts the following means in order to achieve the main object described above.

The implementation setting method of the present invention includes:
A mounting setting method for setting an order of arranging the components when performing a mounting process of arranging a plurality of components on a substrate by a suction head,
An acquisition step of acquiring height information of the substrate having a plurality of arrangement positions having different heights and size information of the component including the height of the component to be arranged;
The height at the placement position of the component is obtained from the height of the obtained board and the size of the obtained part, and the mounting order for placing the components on the board is determined based on the obtained placement position height of the component. An arrangement setting step to be set;
Is included.

In this mounting setting method, the height information of the arrangement positions of the boards having a plurality of arrangement positions having different heights and the size information of the parts including the heights of the parts to be arranged are obtained, and the height of the obtained arrangement positions is obtained. Then, the height at the component arrangement position is obtained from the component size, and the mounting order for arranging the components on the board is set based on the obtained component arrangement position height. For example, if the mounting order is set considering only the height of the components, the components already arranged on the substrate and the components to be arranged may interfere with each other depending on the arrangement positions having different heights on the substrate. Here, since the mounting order of the components on the board is set in consideration of the height of the arrangement position, the components can be more reliably mounted on the board having a plurality of arrangement positions with different heights. At this time, in the arrangement setting step, the mounting order may be set so that the component having the lower arrangement position height is arranged first. Alternatively, in the arrangement setting step, the mounting order may be set so that the component having the higher arrangement position height is arranged later. Note that “interference” includes not only the case where a component that has already been placed is in contact with the component that is to be placed, but also the case where there is a possibility that the component that has already been placed is in contact with the component that is being placed.

In the mounting setting method of the present invention, in the placement setting step, the first component placed at the first placement position and the second placement position having a height different from the first placement position are adjacent to the first component. A matching second part is extracted, and an arrangement position height of the first part at the first arrangement position and an arrangement position height of the second part at the second arrangement position are obtained. The mounting order may be set so that the lower one is arranged first. In this way, the lower height on the board will be placed first, so the parts already placed on the board and the parts to be placed will not interfere with each other, and the parts will be mounted more reliably. Can do. At this time, if the order relationship of the mounting order between the first component and the second component set as described above is maintained, another third component that does not interfere with the first component and the second component. It is good also as what sets the mounting order which implements. Alternatively, in the arrangement setting step, the first component arranged at the first arrangement position and the second component arranged at the second arrangement position having a height different from the first arrangement position are adjacent to the first component. Extracting and obtaining the arrangement position height of the first part at the first arrangement position and the arrangement position height of the second part at the second arrangement position, and arranging the one with the higher arrangement position height later The mounting order may be set so as to do so.

Alternatively, in the mounting setting method of the present invention, in the placement setting step, the first part is based on the height of the first component sucked by the suction head and the placement position height of the second component placed at the placement position. When the component is moved to the arrangement position, it is determined whether or not the first component adsorbed by the adsorption head interferes with the second component arranged at the arrangement position. The mounting order may be set so that the first component is arranged before two components. By so doing, it is possible to more reliably prevent interference between the component already arranged on the substrate and the component to be arranged, so that the component can be more reliably mounted. At this time, in the arrangement setting step, a first component arranged at the first arrangement position and a second component adjacent to the first component arranged at a second arrangement position having a height different from the first arrangement position, May be extracted to determine whether the first part and the second part interfere with each other. In this way, since the height of the arrangement position is different and the presence / absence of interference between adjacent components is determined, the components can be more reliably mounted.

The mounting setting method of the present invention includes a provisional setting step of setting one or more provisional orders in which the plurality of components are arranged in consideration of a moving distance of the suction head on the substrate, The mounting order for arranging the components may be set based on the set temporary order. In this way, since the moving distance of the suction head is taken into account, components can be mounted more efficiently and more reliably. At this time, in the provisional setting step, a plurality of the provisional orders are set, and in the arrangement setting step, a plurality of the implementation orders are set using the plurality of provisional orders, and the implementation is implemented among the plurality of the implementation orders set. A selection step of selecting an mounting order with a shorter processing time may be included. In this way, the mounting processing time can be further shortened, so that components can be mounted more efficiently and more reliably.

The mounting setting device of the present invention
A mounting setting device for setting an order of arranging the components when performing a mounting process of arranging a plurality of components on a substrate by a suction head,
Obtaining means for obtaining height information of the board having a plurality of arrangement positions having different heights and size information of the parts including the height of the parts to be arranged;
The height at the placement position of the component is obtained from the height of the obtained board and the size of the obtained part, and the mounting order for placing the components on the board is determined based on the obtained placement position height of the component. An arrangement setting means for setting;
It is equipped with.

In this mounting setting device, in the same manner as the mounting setting method described above, in order to set the mounting order of components on the board in consideration of the arrangement position height, for a board having a plurality of arrangement positions with different heights, Components can be mounted more reliably. In this mounting setting apparatus, various aspects of the mounting setting method described above may be adopted, and a configuration for realizing each function of the mounting setting method described above may be added.

The program of the present invention is one in which one or more computers execute the steps of the mounting setting method described above. This program may be recorded on a computer-readable recording medium (for example, hard disk, ROM, FD, CD, DVD, etc.) or from a computer via a transmission medium (communication network such as the Internet or LAN). It may be distributed to another computer, or may be exchanged in any other form. If this program is executed by a single computer or if each step is shared and executed by a plurality of computers, each step of the mounting setting method described above is executed, so that the same effect as this method can be obtained. .

1 is a schematic explanatory diagram of a component mounting system 1. FIG. The perspective view of the component mounting machine 11. FIG. The block diagram showing the electrical connection relation of the component mounting system. FIG. 5 is an explanatory diagram of mounting information 90 and board information 94 stored in the HDD 83. Explanatory drawing showing an example of the board | substrate 16 with which components are mounted. The flowchart which shows an example of a mounting order setting process routine. The flowchart which shows an example of a board | substrate interference avoidance order setting processing routine. Explanatory drawing of the mounting process to the board | substrate 16 which has an arrangement position from which height differs. Explanatory drawing which shows an example of a board | substrate interference avoidance order setting process. Explanatory drawing which shows an example of a board | substrate interference avoidance order setting process.

Preferred embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic explanatory diagram of the component mounting system 1, FIG. 2 is a perspective view of the component mounting machine 11, and FIG. 3 is a block diagram showing an electrical connection relationship of the component mounting system 1. 4 is an explanatory diagram of the mounting information 90 and board information 94 stored in the HDD 83, and FIG. 5 is an explanatory diagram showing an example of the board 16 included in the panel 15 on which components are mounted. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. The mounting process includes a process of placing, mounting, inserting, joining, and bonding components on a substrate.

The component mounting system 1 includes a mounting line 10 and a management computer 80. The mounting line 10 is arranged such that the first to fourth component mounting machines 11a to 11d that respectively perform the first to fourth steps are arranged in ascending order from upstream to downstream. The first to fourth steps are all steps for mounting an electronic component (hereinafter referred to as “component”) on the substrate 16. In the present embodiment, since the first to fourth component mounting machines 11a to 11d have the same configuration, hereinafter, the ordinal numbers and alphabets at the end of the reference numerals are omitted, and only the component mounting machine 11 will be described.

As shown in FIG. 2, the component mounting machine 11 includes a base 12, a mounting machine main body 14 installed on the base 12, and a reel unit 56 mounted on the mounting machine main body 14. The base 12 is a heavy object formed in a rectangular parallelepiped, and casters (not shown) are attached to the four corners of the back surface.

The mounting machine main body 14 is installed to be replaceable with respect to the base 12. The mounting machine body 14 executes various controls, including a substrate transport device 18 that transports the substrate 16, a suction head 24 that can move on the XY plane, a suction nozzle 40 that is attached to the suction head 24 and can move to the Z axis. And a control device 60 (see FIG. 3).

The substrate transport device 18 is provided with

support plates

20 and 20 provided at intervals in the front and rear direction of FIG. 2 and extending in the left-right direction, and

conveyor belts

22 and 22 provided on the mutually opposing surfaces of the support plates 20 and 20 (FIG. 2 shows only one of them). The

conveyor belts

22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the

support plates

20 and 20 so as to be endless. The board | substrate 16 is mounted on the upper surface of a pair of

conveyor belts

22 and 22, and is conveyed from the left to the right. The substrate 16 is supported by a large number of support pins 23 erected on the back side.

The suction head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the component mounter 11. A pair of upper and

lower guide rails

28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The suction head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each

slider

26 and 30 is driven by a drive motor (not shown).

As shown in FIG. 2, the suction head 24 has a head body 41 that is detachably attached to an X-axis slider 26 (head holding base). A nozzle holder 42 is supported on the head body 41 so as to be intermittently rotatable, and is intermittently rotated by a rotating device using a motor 43 as a drive source. A plurality of nozzle holders 44 are held up and down on the circumference of the nozzle holder 42, and suction nozzles 40 that suck parts are detachably held by these nozzle holders 44. The nozzle holder 44 positioned at a predetermined angular position by intermittent rotation of the nozzle holder 42 is moved in the Z-axis direction (vertical direction) perpendicular to the X-axis and Y-axis directions by a holder lifting device using a Z-axis motor 46 as a drive source. The component can be sucked by the suction nozzle 40 and mounted on the substrate 16. Further, the nozzle holder 44 is rotated (spinned) by a holder rotating device using the motor 47 as a drive source, and the angle of the component sucked by the suction nozzle 40 can be adjusted.

The adsorption nozzle 40 uses pressure to adsorb a component to the nozzle tip or to release a component adsorbed to the nozzle tip. The suction nozzle 40 is connected to one of a vacuum pump and an air pipe via a solenoid valve (not shown). In order to suck the parts to the suction nozzle 40, the electromagnetic valve is controlled so that the vacuum pump and the suction nozzle communicate with each other. As a result, the inside of the suction nozzle 40 becomes negative pressure, and the component is sucked by the tip of the suction nozzle 40. On the other hand, in order to remove the component from the suction nozzle 40, the solenoid valve is controlled so that the air pipe and the suction nozzle 40 communicate with each other. As a result, the inside of the suction nozzle 40 becomes a positive pressure, and the part sucked at the tip of the suction nozzle 40 is removed.

As shown in FIG. 2, the reel unit 56 includes a plurality of reels 57 and is detachably attached to the front side of the mounting machine body 14. A tape is wound around each reel 57, and parts are held on the surface of the tape along the longitudinal direction. These parts are protected by a film covering the surface of the tape. Such a tape is unwound from the reel toward the rear, and is fed to a suction position where the tape is sucked by the suction head 24 in a state where the film is peeled off at the feeder portion 58 and the components are exposed.

The parts camera 54 is disposed in front of the support plate 20 on the front side of the substrate transfer device 18. The imaging range of the parts camera 54 is above the parts camera 70. When the suction nozzle 40 that sucks a part passes above the parts camera 70, the part camera 70 captures the state of the part sucked by the suction nozzle 40 and outputs the image to the control device 74.

The nozzle stocker 55 is a box that stocks a plurality of types of suction nozzles 40. The suction nozzle 40 is detachably mounted on the nozzle holder 42 of the suction head 24, and is replaced with one suitable for the type of the board 16 on which the component is mounted and the type of the component.

As shown in FIG. 3, the control device 60 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62 that stores processing programs, an HDD 63 that stores various data, a RAM 64 that is used as a work area, an external device and an electrical device. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66. The control device 60 outputs drive signals to the substrate transport device 18, the drive motor for the X-axis slider 26, the drive motor for the Y-axis slider 30, and the

motors

43, 46, 47 of the suction head 24. Input an image signal. The control device 60 is connected to the reel unit 56 and the management computer 80 so as to be capable of bidirectional communication. Each

slider

26 and 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motor of each

slider

26 and 30 while inputting position information from these position sensors.

As shown in FIG. 3, the management computer 80 is configured as a microprocessor centered on a CPU 81, and includes a ROM 82 that stores processing programs, an HDD 83 that stores various information, a RAM 84 that is used as a work area, an external device and an electrical device. An input / output interface 85 for exchanging signals is provided, and these are connected via a bus 86. Further, the management computer 80 can input signals from an input device 87 typified by a mouse and a keyboard via an input / output interface 85, and is connected to the display 88 so that various images can be output. As shown in FIG. 4, the HDD 63 stores mounting information 90 and board information 94. The mounting information 90 stores the type of component to be mounted, component size information 91, arrangement position information 92, and the like as information related to the process of mounting the component on the board 16. The mounting information 90 also stores mounting order information (not set in FIG. 4) selected by the mounting order selection unit 804. The component size information 91 stores information related to the size of the component including, for example, the height, width, and length of the component. The placement position information 92 stores information such as the coordinates of the placement position on the board on which the component is mounted. The board information 94 stores the area of the arrangement position on the board having a plurality of arrangement positions having different heights, and information on the height of the board in the area. The mounting information 90 is transmitted from the management computer 80 to the control device 60 based on the operator's input to the management computer 80, stored in the HDD 63, and used for mounting processing by the component mounter 11.

The management computer 80 includes an information acquisition unit 801, a temporary setting unit 802, an arrangement setting unit 803, and a mounting order selection unit 804 as functional blocks. The information acquisition unit 801 has a function of acquiring height information of a substrate having a plurality of arrangement positions with different heights and component size information including the height of the component to be arranged. The temporary setting unit 802 has a function of setting a plurality of temporary orders in which a plurality of components are arranged in consideration of the moving distance of the suction head on the substrate 16. The placement setting unit 803 has a function of setting a plurality of mounting orders for placing components according to the temporary order based on the temporary order set by the temporary setting unit 802. The placement setting unit 803 obtains the height (placement position height) at the placement position of the component from the height of the board and the size of the component, and places the component on the board based on the obtained placement position height of the component. It has a function to set the order. The mounting order selection unit 804 has a function of selecting a mounting order having a shorter mounting processing time from among the plurality of mounting orders set. The management computer 80 uses these functions to set the mounting order for mounting components on the board.

Here, the board 16 on which components are mounted by the component mounter 11 will be described. As shown in FIG. 5, the panel 15 includes a plurality of substrates 16. On the substrate 16, for example, regions such as a concave region 16 b that is a region having a low arrangement position with respect to the reference surface 16 a and a convex region 16 c that is a region having a high arrangement position with respect to the reference surface 16 a are formed. In these regions, components P1 to P12 and the like are mounted. The board information 94 of the mounting information 90 stores information such as the range and height of each area. The reference plane can be appropriately set according to the substrate, and may be the bottom surface of the substrate 16, a surface having an intermediate height of the substrate 16, or the top surface.

Next, the operation of the component mounting system 1 of the present embodiment configured as described above, first, processing for setting the mounting order of mounting components on the board 16 in the mounting processing of the component mounting machine 11 will be described. FIG. 6 is a flowchart showing an example of a mounting order setting process routine executed by the CPU 81 of the management computer 80. This routine is stored in the HDD 83 of the management computer 80, and is executed by a start instruction from the operator. In this routine, the mounting order in which components are more reliably mounted on the board 16 having the arrangement positions with different heights is set. This routine is executed by the CPU 81 using the functions of the information acquisition unit 801, temporary setting unit 802, arrangement setting unit 803, and mounting order selection unit 804, for example. When this routine is started, the CPU 81 first reads the mounting information 90 and obtains the arrangement position information 92 including the arrangement position of each component (step S100). Next, a temporary order is set based on the arrangement position of the parts (step S110). For example, the provisional order can be set by setting a part closer to the suction position of the part as the first part, a part closer to the first part as a second part, and a part closer to the second part. The third part may be used so as to move the suction head 24 while suppressing reciprocation as much as possible with a single stroke (see FIGS. 9 and 10 to be described later).

Next, the CPU 61 executes a substrate interference avoidance order setting process using the set provisional order (step S120). FIG. 7 is a flowchart illustrating an example of the board interference avoidance order setting processing routine executed by the CPU 81 of the management computer 80. This routine performs a process of setting a mounting order in which there is no interference between components when mounting at placement positions having different heights, and is stored in the HDD 83 of the management computer 80. When this routine is started, the CPU 81 first acquires board information 94 including the heights of boards having a plurality of arrangement positions having different heights, and part size information 91 including the heights of the parts to be arranged. (Step S200).

Next, the CPU 81 sets a determination target component (step S210). The determination target components may be set in the order of the numbers in the tentative order, for example. Next, it is determined whether or not there is another part in a predetermined proximity region having a height different from the arrangement position of the determination target part (step S220). If there is another part, a comparison target part is set. (Step S230). For example, this proximity region may be determined empirically as a region that is highly likely to interfere with each other when a component mounting process is performed. This proximity region can be defined as a region having a height different from that of the determination target component and within a predetermined proximity distance. In addition, for example, the determination process extracts a comparison target component that is adjacent to the determination target component and has a different arrangement position height, obtains a distance between the determination target component and the comparison target component, and uses this distance to compare This can be done by determining whether the part enters the proximity region. As described above, the first component (determination target component) arranged at the first arrangement position and the second component adjacent to the first component (the comparison target) arranged at the second arrangement position having a height different from the first arrangement position. Part). In addition, when there are a plurality of other parts extracted, that is, when there are a plurality of other parts in adjacent areas having different heights, for example, one of them, such as a part with higher proximity, is used as a comparison target part. Shall be set.

Subsequently, the CPU 81 acquires the board height and the component size of the determination target component and the comparison target component (step S240), and calculates the arrangement position height from the acquired board height and component size (step S240). S250). FIG. 8 is an explanatory diagram of the mounting process on the board 16 having the arrangement positions with different heights. Here, a case where the arrangement position height h4 of the part P8 and the arrangement position height h1 of the part P9 are obtained will be described. The arrangement position height can be obtained as the sum of the height of the substrate and the height of the component relative to the reference plane. For example, in the component P8, the sum of the substrate height h3 and the height h2 of the component P8 is the arrangement position height h4. Further, in the component P9 mounted on the reference plane, the component height h1 is the arrangement position height h1. In addition, as shown in FIG. 5, the arrangement position height of the component P1 etc. in which the upper surface of the component is equal to or less than the reference plane has a negative value. In addition, when the upper surface of the component is not flat or has a step on the upper surface of the component, the maximum value may be the component height.

When calculating the arrangement position height, the CPU 81 determines whether or not the determination target component and the comparison target component interfere (step S260). The term “interference” includes not only the case where a component that has already been placed comes into contact with the component that is to be placed, but also the case where there is a possibility that the component that has already been placed will come into contact with the component that is going to be placed. Here, the suction head 24 moves at a predetermined moving speed in the XY direction and then moves while decelerating, while the suction nozzle 40 is set to descend at a predetermined speed in the Z-axis direction. Has been. By so doing, it is difficult for the suction nozzle 40 to move, and the mounting process can be performed efficiently. In the suction head 24 that moves in this way, as shown in FIG. 8, the suction nozzle 40 that sucks the component enters the component placement position while moving in an oblique direction having a predetermined angle. The determination in step S260 is performed based on, for example, whether the locus drawn by the lower end of the component enters the area occupied by the component arranged on the substrate 16 based on the size of the component sucked by the suction nozzle 40. Can do. At this time, since the component may be attracted to the suction nozzle 40 with its position shifted or rotated, it is more preferable that the “trajectory drawn by the lower end of the component” includes a predetermined margin. This margin may be determined empirically based on the data of the suction state of the component. Moreover, it is good also considering the width | variety and length other than the height using the size information also about the components already arrange | positioned. Further, as shown by the dotted suction nozzle 40 in FIG. 8, the components may not interfere with each other depending on the direction in which the components enter, so the components interfere with each other in consideration of the moving direction of the suction nozzle 40. It is good also as what determines whether to do.

When it is determined in step S260 that there is interference, the mounting order is set so that the component with the lower placement position is placed first (step S270). For example, as shown in FIG. 8, when a component P8 with a high placement position is mounted first, there is a high possibility that these components interfere when mounting a component P9 with a low placement position. On the other hand, even if the component P9 having a low placement position is mounted first, the possibility that the component P8 and the component P9 interfere when the component P8 having a high placement position is mounted is low. Therefore, here, the mounting order is set so that the mounting processing is performed first from the component having the low placement position height. Note that “setting the mounting order so that components with a low placement position are placed first” means that the order relationship of the mounting order between the determination target component and the comparison target component is maintained. Between the determination target component and the comparison target component, a mounting process of another component that does not interfere with these components may enter.

After setting the mounting order in step S270, or after determining that there is no interference in step S260, the CPU 81 determines whether there is another comparison target component for the currently set determination target component. (Step S280) When there is another part to be compared, the processes after Step S230 are executed. That is, the next comparison target component is set in step S230, and whether or not interference occurs in step S260 is executed based on the arrangement position height. On the other hand, when there is no other comparison target part in step S280, or when there is no other part in the proximity region having a different height in step S220, it is determined whether or not interference has been determined for all parts (step S280). S290). When the determination of interference is not performed for all parts, the processes after step S210 are repeatedly executed. That is, in step S210, the next part is set as a determination target part, and it is determined whether there is another part in the proximity region having a different height, so that the already placed part interferes with the part to be placed. It is determined whether or not. When the components interfere with each other, the mounting order is set so that the one with the lower placement position is placed first. On the other hand, when it is determined in step S290 that interference has occurred for all parts, this routine is terminated.

Now, the description returns to the mounting order setting processing routine of FIG. After executing the board interference avoidance order setting process in step S120, the CPU 81 stores the mounting order set in the board interference avoidance order setting process in the HDD 83 as a mounting order candidate (step S130), and a predetermined time has elapsed from the start of the process. Is determined (step S140). The predetermined time is empirically determined, for example, as a time when a plurality of temporary orders are created in a moderate amount and a plurality of mounting order candidates corresponding thereto are created in a moderate amount. When the predetermined time has not elapsed, a provisional order condition different from the previous time is set (step S150), and the processing after step S110 is executed. That is, in step S110, a temporary order based on a new condition is set, and the board interference avoidance order setting process is executed to newly store a mounting order candidate. The temporary order condition different from the previous time is, for example, changing the part from which the mounting process is started to another part or changing the order of the dense parts group such as parts P2 to P4 and parts P9 to P11 in FIG. It is also possible to include condition changes such as In this way, it is possible to set a plurality of different provisional orders, and it is possible to set implementation order candidates with various contents.

On the other hand, when the predetermined time has elapsed in step S140, the CPU 81 acquires the mounting time of each mounting order candidate (step S160). This mounting time can be calculated based on, for example, the moving distance of the suction head 24 on the XY plane. When the mounting time of the mounting order candidate is acquired, the mounting order candidate with the shortest mounting time is selected as the mounting order to be actually executed (step S170), and the selected content is stored in the mounting information 90 (step S180). This routine is finished as it is. In this way, it is possible to set a mounting order in which mounting processing that prevents component interference can be performed on the boards 16 having different arrangement positions.

Here, a specific example of the mounting order setting process will be described with reference to the drawings. FIG. 9 is an explanatory diagram illustrating an example of the substrate interference avoidance order setting process, and FIG. 10 is an explanatory diagram illustrating an example of the substrate interference avoidance order setting process under a provisional order condition different from that in FIG. As shown in FIG. 9A, the provisional order is set in the order of the parts P1 to P12. In this case, it is determined by the interference determination in step S260 that the component P4 and the component P5 and the component P8 and the component P9 are in a predetermined proximity region and interfere with each other, as shown in FIG. 9B. In S270, the mounting order is changed so that the component P5 is arranged before the component P4 having a high arrangement position height and the component P9 is arranged before the component P8. Further, the provisional order conditions are different, and in the provisional order different from FIG. 9, the provisional order is set in the order of components P12, P9, P10, P11, P8 to P1, as shown in FIG. 10A. To do. In this case, it is determined by the interference determination in step S260 that the component P7 and the component P6 are in a predetermined proximity area and interfere with each other, and as shown in FIG. 10B, the arrangement position height is determined in step S270. The mounting order is changed so that the component P6 is arranged before the high component P7. Then, among the plurality of mounting order candidates, for example, the one having a shorter mounting time is selected as the mounting order based on the moving distance of the suction head 24. In this way, by setting a component with a low arrangement position height that has a low possibility of interference when moved in a state of being attracted to the suction nozzle 40, such interference is suppressed. Alternatively, these interferences are suppressed by setting a component with a low arrangement position height that has a high possibility of interference when moved in a state of being attracted to the suction nozzle 40 to be mounted earlier. In addition, more efficient mounting processing is realized by selecting a plurality of provisional orders having the shortest mounting processing time as the mounting order.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. Step S200 of the present embodiment corresponds to an acquisition step of the present invention, step S270 corresponds to an arrangement setting step, step S110 corresponds to a temporary setting step, and step S170 corresponds to a selection step. The information acquisition unit 801 corresponds to an acquisition unit, and the arrangement setting unit 803 corresponds to an arrangement setting unit.

According to the component mounting system 1 described above, the height information of the arrangement position of the substrate 16 having a plurality of arrangement positions having different heights and the size information of the component including the height of the component to be arranged are obtained and acquired. The height at the placement position of the component is obtained from the height of the placement position and the size of the component, and the mounting order for placing the components on the board 16 is set based on the obtained placement position height of the component. For example, if the mounting order is set considering only the height of the components, the components already arranged on the substrate and the components to be arranged may interfere with each other depending on the arrangement positions having different heights on the substrate. Here, since the mounting order of the components on the substrate is set in consideration of the height of the substrate, the components can be more reliably mounted on the substrate having a plurality of arrangement positions with different heights.

In addition, the first component arranged at the first arrangement position and the second component arranged at a second arrangement position having a height different from the first arrangement position and adjacent to the first component are extracted, and the first arrangement position is extracted. The arrangement position height of the first part and the arrangement position height of the second part at the second arrangement position are obtained, and the one with the lower arrangement position height is arranged first. For this reason, the component already arranged on the board and the component to be arranged hardly interfere with each other, and the component can be more reliably mounted. Further, it is determined whether or not the first component sucked by the suction head 24 interferes with the second component arranged at the arrangement position. When it is determined that the interference occurs, the first component is arranged before the second component. Set the mounting order. For this reason, the interference between the component already arranged on the substrate and the component to be arranged can be more reliably prevented, so that the component can be more reliably mounted. Furthermore, since the provisional order is set, and the mounting order in which the components are arranged based on the set temporary order is set, the moving distance of the suction head 24 is taken into account, so that the parts are mounted more efficiently and reliably. be able to. And to set a plurality of provisional orders, set a plurality of implementation orders using a plurality of provisional orders and set them as a mounting order candidate, and select a mounting order with a shorter mounting processing time from a plurality of set mounting order candidates. Components can be mounted efficiently and more reliably.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the two parts of the determination target part and the comparison target part are extracted, and the one with the lower placement position height is arranged first. If it arrange | positions earlier, it will not specifically limit to this. For example, it is good also as what arrange | positions the thing with the lowest arrangement position height among several components first.

In the above-described embodiment, it is determined whether or not the interference occurs based on the size of the component sucked by the suction head 24 and the size of the component placed at the placement position. Two or more parts in a predetermined proximity region of different arrangement positions may have a high possibility of interference, and one having a low arrangement position height may be arranged first. Even in this case, it is possible to more reliably mount components on a substrate having a plurality of arrangement positions with different heights.

In the embodiment described above, a plurality of provisional orders are set in consideration of the movement distance of the suction head 24. However, the present invention is not particularly limited to this, and a plurality of provisional orders is taken into consideration without considering the movement distance of the suction head 24. May be set. Even in this case, the mounting order with the shortest mounting time is selected from the plurality of candidates in step S170. Alternatively, one provisional order may be set in consideration of the moving distance of the suction head 24 without setting a plurality of provisional orders. At this time, the processing of steps S160 to S180 may be omitted. In this way, the mounting order can be determined with relatively few steps. Alternatively, it is assumed that two or more parts in a predetermined proximity region are extracted without setting the provisional order itself, and among the extracted parts, the order of the parts to be placed first and the parts to be placed later is set. Also good. Even in this case, it is possible to more reliably mount components on a substrate having a plurality of arrangement positions with different heights.

In the embodiment described above, a plurality of mounting order candidates are created depending on whether or not the predetermined time has passed in step S140 of the mounting order setting processing routine. After the provisional order is set, the processing after step S160 may be executed. Even in this way, a desired number of provisional orders can be set.

In the above-described embodiment, it is determined in step S220 of the substrate interference avoidance order setting processing routine whether or not there is another part in a predetermined proximity region having a different arrangement position height. However, the present invention is particularly limited to this. For example, it may be determined whether there is another part in a predetermined proximity region without considering the height of the arrangement position. Even in this case, the arrangement position height is calculated from the height of the substrate 16 and the height of the component in step S250, and the mounting order is changed when the two components interfere with each other, so that the same effect as the above-described embodiment can be obtained. it can.

In the embodiment described above, the mounting order is set so that the component with the lower placement position height is placed earlier in step S270. For example, the component with the higher placement position height is placed later. The mounting order may be set as described above. Even in this case, it is possible to more reliably mount components on a substrate having a plurality of arrangement positions with different heights.

In the above-described embodiment, the mounting order is arranged so that the part having the lower placement position among the judgment target part and the comparison target part is placed in step S270. For example, the order is held. If so, the order may be such that other parts are inserted between these parts. For example, in FIG. 9B, the mounting order is set in the order of components P9 → P8 → P10 → P11 → P12. However, for example, the order of components P9 → P10 → P11 → P8 → P12 may be set. .

In the embodiment described above, the interference is determined including the size of the component sucked by the suction nozzle 40, but this may be omitted. At this time, it is only necessary to determine whether or not the arranged component and the suction nozzle 40 side interfere with each other using the height information of the suction nozzle 40. For example, a predetermined margin based on the component is determined based on the component. The interference may be determined in addition to the height.

In the above-described embodiment, the management computer 80 has been described as the mounting setting device of the present invention. However, the present invention is not particularly limited thereto. For example, the control device 60 of the component mounter 11 may set the mounting order. Even in this case, the same effect as that of the above-described embodiment can be obtained.

In the above-described embodiment, the management computer 80 as the mounting setting apparatus of the present invention has been described. However, the present invention is not particularly limited to this, and a mounting setting method or a program form thereof may be used.

The present invention can be used in the technical field of mounting components on a board.

1 component mounting system, 10 mounting line, 11, 11a-11d component mounting machine, 12 base, 14 mounting machine body, 15 panel, 16 substrate, 16a reference plane, 16b concave region, 16c convex region, 18 substrate transport device, 20 support plates, 22 conveyor belts, 23 support pins, 24 suction heads, 26 X-axis sliders, 28 guide rails, 30 Y-axis sliders, 32 guide rails, 40 suction nozzles, 41 head bodies, 42 nozzle holders, 43 motors, 44 nozzle holder, 46 Z-axis motor, 47 motor, 54 parts camera, 55 nozzle stocker, 56 reel unit, 57 reel, 58 feeder section, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 I / O interface, 6 bus, 80 management computer, 81 CPU, 801 information acquisition unit, 802 temporary setting unit, 803 placement setting unit, 804 mounting order selection unit, 82 ROM, 83 HDD, 84 RAM, 85 I / O interface, 86 bus, 87 input Device, 88 display, 90 mounting information, 91 part size information, 92 placement position information, 94 board information, P1-P12 parts.

Claims

A mounting setting method for setting an order of arranging the components when performing a mounting process of arranging a plurality of components on a substrate by a suction head,
An acquisition step of acquiring height information of the substrate having a plurality of arrangement positions having different heights and size information of the component including the height of the component to be arranged;
The height at the placement position of the component is obtained from the height of the obtained board and the size of the obtained part, and the mounting order for placing the components on the board is determined based on the obtained placement position height of the component. An arrangement setting step to be set;
Implementation setting method including.
In the arrangement setting step, a first part arranged at the first arrangement position and a second part arranged at a second arrangement position having a height different from the first arrangement position and adjacent to the first part are extracted. Then, the arrangement position height of the first component at the first arrangement position and the arrangement position height of the second part at the second arrangement position are obtained, and the one with the lower arrangement position height is arranged first. The mounting setting method according to claim 1, wherein the mounting order is set.
In the arrangement setting step, when the first component is moved to the arrangement position based on the height of the first component adsorbed by the adsorption head and the arrangement position height of the second component arranged at the arrangement position. It is determined whether or not the first component sucked by the suction head interferes with the second component arranged at the arrangement position. When it is determined that the interference occurs, the first component is placed before the second component. The mounting setting method according to claim 1, wherein the mounting order is set so as to be arranged.
In the arrangement setting step, a first part arranged at the first arrangement position and a second part arranged at a second arrangement position having a height different from the first arrangement position and adjacent to the first part are extracted. The mounting setting method according to claim 3, wherein it is determined whether or not the first component and the second component interfere with each other.
The mounting setting method according to any one of claims 1 to 4,
A provisional setting step of setting one or more provisional orders in which the plurality of components are arranged in consideration of the moving distance of the suction head on the substrate,
A mounting setting method in which, in the placement setting step, a mounting order in which the components are placed is set based on the set temporary order.
The mounting setting method according to claim 5,
In the temporary setting step, a plurality of the temporary orders are set,
In the arrangement setting step, the plurality of mounting orders are set using the plurality of provisional orders,
A mounting setting method including a selection step of selecting a mounting order having a shorter mounting processing time among the plurality of mounting orders set.
A mounting setting device for setting an order of arranging the components when performing a mounting process of arranging a plurality of components on a substrate by a suction head,
Obtaining means for obtaining height information of the substrate having a plurality of arrangement positions having different heights and size information of the component including the height of the component to be arranged;
The height at the placement position of the component is obtained from the height of the obtained board and the size of the obtained part, and the mounting order for placing the components on the board is determined based on the obtained placement position height of the component. An arrangement setting means for setting;
A mounting setting device.