WO2014141427A1 - Procédé et dispositif de configuration de montage - Google Patents

Procédé et dispositif de configuration de montage Download PDF

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Publication number
WO2014141427A1
WO2014141427A1 PCT/JP2013/057168 JP2013057168W WO2014141427A1 WO 2014141427 A1 WO2014141427 A1 WO 2014141427A1 JP 2013057168 W JP2013057168 W JP 2013057168W WO 2014141427 A1 WO2014141427 A1 WO 2014141427A1
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WO
WIPO (PCT)
Prior art keywords
component
mounting
height
setting
arrangement position
Prior art date
Application number
PCT/JP2013/057168
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English (en)
Japanese (ja)
Inventor
隆 倉科
浩章 村土
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2013/057168 priority Critical patent/WO2014141427A1/fr
Priority to JP2015505158A priority patent/JPWO2014141427A1/ja
Publication of WO2014141427A1 publication Critical patent/WO2014141427A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines

Definitions

  • the present invention relates to a mounting setting method and a mounting setting device.
  • a step of acquiring the height information of the component and a mounting order of the components are determined based on the height information acquired in this step.
  • a method for determining the order in which components are mounted has been proposed (for example, see Patent Document 1). In this method, the possibility of interference between the component mounted on the substrate and the suction head, which is generated by replacing the supply component, can be detected and avoided in advance.
  • the present invention has been made in view of such problems, and provides a mounting setting method and a mounting setting device that can more reliably mount components on a substrate having a plurality of arrangement positions with different heights.
  • the main purpose is to do.
  • the present invention adopts the following means in order to achieve the main object described above.
  • the implementation setting method of the present invention includes: A mounting setting method for setting an order of arranging the components when performing a mounting process of arranging a plurality of components on a substrate by a suction head, An acquisition step of acquiring height information of the substrate having a plurality of arrangement positions having different heights and size information of the component including the height of the component to be arranged; The height at the placement position of the component is obtained from the height of the obtained board and the size of the obtained part, and the mounting order for placing the components on the board is determined based on the obtained placement position height of the component. An arrangement setting step to be set; Is included.
  • the height information of the arrangement positions of the boards having a plurality of arrangement positions having different heights and the size information of the parts including the heights of the parts to be arranged are obtained, and the height of the obtained arrangement positions is obtained. Then, the height at the component arrangement position is obtained from the component size, and the mounting order for arranging the components on the board is set based on the obtained component arrangement position height. For example, if the mounting order is set considering only the height of the components, the components already arranged on the substrate and the components to be arranged may interfere with each other depending on the arrangement positions having different heights on the substrate.
  • the mounting order of the components on the board is set in consideration of the height of the arrangement position, the components can be more reliably mounted on the board having a plurality of arrangement positions with different heights.
  • the mounting order may be set so that the component having the lower arrangement position height is arranged first.
  • the mounting order may be set so that the component having the higher arrangement position height is arranged later. Note that “interference” includes not only the case where a component that has already been placed is in contact with the component that is to be placed, but also the case where there is a possibility that the component that has already been placed is in contact with the component that is being placed.
  • the first component placed at the first placement position and the second placement position having a height different from the first placement position are adjacent to the first component.
  • a matching second part is extracted, and an arrangement position height of the first part at the first arrangement position and an arrangement position height of the second part at the second arrangement position are obtained.
  • the mounting order may be set so that the lower one is arranged first. In this way, the lower height on the board will be placed first, so the parts already placed on the board and the parts to be placed will not interfere with each other, and the parts will be mounted more reliably. Can do.
  • the first component arranged at the first arrangement position and the second component arranged at the second arrangement position having a height different from the first arrangement position are adjacent to the first component. Extracting and obtaining the arrangement position height of the first part at the first arrangement position and the arrangement position height of the second part at the second arrangement position, and arranging the one with the higher arrangement position height later
  • the mounting order may be set so as to do so.
  • the first part is based on the height of the first component sucked by the suction head and the placement position height of the second component placed at the placement position.
  • the mounting order may be set so that the first component is arranged before two components.
  • a first component arranged at the first arrangement position and a second component adjacent to the first component arranged at a second arrangement position having a height different from the first arrangement position May be extracted to determine whether the first part and the second part interfere with each other.
  • the components can be more reliably mounted.
  • the mounting setting method of the present invention includes a provisional setting step of setting one or more provisional orders in which the plurality of components are arranged in consideration of a moving distance of the suction head on the substrate,
  • the mounting order for arranging the components may be set based on the set temporary order. In this way, since the moving distance of the suction head is taken into account, components can be mounted more efficiently and more reliably.
  • a provisional setting step a plurality of the provisional orders are set, and in the arrangement setting step, a plurality of the implementation orders are set using the plurality of provisional orders, and the implementation is implemented among the plurality of the implementation orders set.
  • a selection step of selecting an mounting order with a shorter processing time may be included. In this way, the mounting processing time can be further shortened, so that components can be mounted more efficiently and more reliably.
  • the mounting setting device of the present invention A mounting setting device for setting an order of arranging the components when performing a mounting process of arranging a plurality of components on a substrate by a suction head, Obtaining means for obtaining height information of the board having a plurality of arrangement positions having different heights and size information of the parts including the height of the parts to be arranged; The height at the placement position of the component is obtained from the height of the obtained board and the size of the obtained part, and the mounting order for placing the components on the board is determined based on the obtained placement position height of the component.
  • An arrangement setting means for setting; It is equipped with.
  • this mounting setting device in the same manner as the mounting setting method described above, in order to set the mounting order of components on the board in consideration of the arrangement position height, for a board having a plurality of arrangement positions with different heights, Components can be mounted more reliably.
  • this mounting setting apparatus various aspects of the mounting setting method described above may be adopted, and a configuration for realizing each function of the mounting setting method described above may be added.
  • the program of the present invention is one in which one or more computers execute the steps of the mounting setting method described above.
  • This program may be recorded on a computer-readable recording medium (for example, hard disk, ROM, FD, CD, DVD, etc.) or from a computer via a transmission medium (communication network such as the Internet or LAN). It may be distributed to another computer, or may be exchanged in any other form. If this program is executed by a single computer or if each step is shared and executed by a plurality of computers, each step of the mounting setting method described above is executed, so that the same effect as this method can be obtained. .
  • FIG. 1 is a schematic explanatory diagram of a component mounting system 1.
  • FIG. The perspective view of the component mounting machine 11.
  • FIG. The block diagram showing the electrical connection relation of the component mounting system.
  • FIG. 5 is an explanatory diagram of mounting information 90 and board information 94 stored in the HDD 83.
  • Explanatory drawing showing an example of the board
  • the flowchart which shows an example of a mounting order setting process routine.
  • substrate 16 which has an arrangement position from which height differs.
  • FIG. 1 is a schematic explanatory diagram of the component mounting system 1
  • FIG. 2 is a perspective view of the component mounting machine 11
  • FIG. 3 is a block diagram showing an electrical connection relationship of the component mounting system 1.
  • 4 is an explanatory diagram of the mounting information 90 and board information 94 stored in the HDD 83
  • FIG. 5 is an explanatory diagram showing an example of the board 16 included in the panel 15 on which components are mounted.
  • the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.
  • the mounting process includes a process of placing, mounting, inserting, joining, and bonding components on a substrate.
  • the component mounting system 1 includes a mounting line 10 and a management computer 80.
  • the mounting line 10 is arranged such that the first to fourth component mounting machines 11a to 11d that respectively perform the first to fourth steps are arranged in ascending order from upstream to downstream.
  • the first to fourth steps are all steps for mounting an electronic component (hereinafter referred to as “component”) on the substrate 16.
  • component an electronic component
  • the component mounting machine 11 includes a base 12, a mounting machine main body 14 installed on the base 12, and a reel unit 56 mounted on the mounting machine main body 14.
  • the base 12 is a heavy object formed in a rectangular parallelepiped, and casters (not shown) are attached to the four corners of the back surface.
  • the mounting machine main body 14 is installed to be replaceable with respect to the base 12.
  • the mounting machine body 14 executes various controls, including a substrate transport device 18 that transports the substrate 16, a suction head 24 that can move on the XY plane, a suction nozzle 40 that is attached to the suction head 24 and can move to the Z axis. And a control device 60 (see FIG. 3).
  • the substrate transport device 18 is provided with support plates 20 and 20 provided at intervals in the front and rear direction of FIG. 2 and extending in the left-right direction, and conveyor belts 22 and 22 provided on the mutually opposing surfaces of the support plates 20 and 20 (FIG. 2 shows only one of them).
  • the conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless.
  • substrate 16 is mounted on the upper surface of a pair of conveyor belts 22 and 22, and is conveyed from the left to the right.
  • the substrate 16 is supported by a large number of support pins 23 erected on the back side.
  • the suction head 24 is attached to the front surface of the X-axis slider 26.
  • the X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction.
  • the Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction.
  • the guide rails 32 and 32 are fixed inside the component mounter 11.
  • a pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction.
  • the suction head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction.
  • Each slider 26 and 30 is driven by a drive motor (not shown).
  • the suction head 24 has a head body 41 that is detachably attached to an X-axis slider 26 (head holding base).
  • a nozzle holder 42 is supported on the head body 41 so as to be intermittently rotatable, and is intermittently rotated by a rotating device using a motor 43 as a drive source.
  • a plurality of nozzle holders 44 are held up and down on the circumference of the nozzle holder 42, and suction nozzles 40 that suck parts are detachably held by these nozzle holders 44.
  • the nozzle holder 44 positioned at a predetermined angular position by intermittent rotation of the nozzle holder 42 is moved in the Z-axis direction (vertical direction) perpendicular to the X-axis and Y-axis directions by a holder lifting device using a Z-axis motor 46 as a drive source.
  • the component can be sucked by the suction nozzle 40 and mounted on the substrate 16. Further, the nozzle holder 44 is rotated (spinned) by a holder rotating device using the motor 47 as a drive source, and the angle of the component sucked by the suction nozzle 40 can be adjusted.
  • the adsorption nozzle 40 uses pressure to adsorb a component to the nozzle tip or to release a component adsorbed to the nozzle tip.
  • the suction nozzle 40 is connected to one of a vacuum pump and an air pipe via a solenoid valve (not shown).
  • the electromagnetic valve is controlled so that the vacuum pump and the suction nozzle communicate with each other.
  • the inside of the suction nozzle 40 becomes negative pressure, and the component is sucked by the tip of the suction nozzle 40.
  • the solenoid valve is controlled so that the air pipe and the suction nozzle 40 communicate with each other. As a result, the inside of the suction nozzle 40 becomes a positive pressure, and the part sucked at the tip of the suction nozzle 40 is removed.
  • the reel unit 56 includes a plurality of reels 57 and is detachably attached to the front side of the mounting machine body 14.
  • a tape is wound around each reel 57, and parts are held on the surface of the tape along the longitudinal direction. These parts are protected by a film covering the surface of the tape.
  • Such a tape is unwound from the reel toward the rear, and is fed to a suction position where the tape is sucked by the suction head 24 in a state where the film is peeled off at the feeder portion 58 and the components are exposed.
  • the parts camera 54 is disposed in front of the support plate 20 on the front side of the substrate transfer device 18.
  • the imaging range of the parts camera 54 is above the parts camera 70.
  • the nozzle stocker 55 is a box that stocks a plurality of types of suction nozzles 40.
  • the suction nozzle 40 is detachably mounted on the nozzle holder 42 of the suction head 24, and is replaced with one suitable for the type of the board 16 on which the component is mounted and the type of the component.
  • the control device 60 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62 that stores processing programs, an HDD 63 that stores various data, a RAM 64 that is used as a work area, an external device and an electrical device. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66.
  • the control device 60 outputs drive signals to the substrate transport device 18, the drive motor for the X-axis slider 26, the drive motor for the Y-axis slider 30, and the motors 43, 46, 47 of the suction head 24. Input an image signal.
  • the control device 60 is connected to the reel unit 56 and the management computer 80 so as to be capable of bidirectional communication.
  • Each slider 26 and 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motor of each slider 26 and 30 while inputting position information from these position sensors.
  • the management computer 80 is configured as a microprocessor centered on a CPU 81, and includes a ROM 82 that stores processing programs, an HDD 83 that stores various information, a RAM 84 that is used as a work area, an external device and an electrical device. An input / output interface 85 for exchanging signals is provided, and these are connected via a bus 86. Further, the management computer 80 can input signals from an input device 87 typified by a mouse and a keyboard via an input / output interface 85, and is connected to the display 88 so that various images can be output. As shown in FIG. 4, the HDD 63 stores mounting information 90 and board information 94.
  • the mounting information 90 stores the type of component to be mounted, component size information 91, arrangement position information 92, and the like as information related to the process of mounting the component on the board 16.
  • the mounting information 90 also stores mounting order information (not set in FIG. 4) selected by the mounting order selection unit 804.
  • the component size information 91 stores information related to the size of the component including, for example, the height, width, and length of the component.
  • the placement position information 92 stores information such as the coordinates of the placement position on the board on which the component is mounted.
  • the board information 94 stores the area of the arrangement position on the board having a plurality of arrangement positions having different heights, and information on the height of the board in the area.
  • the mounting information 90 is transmitted from the management computer 80 to the control device 60 based on the operator's input to the management computer 80, stored in the HDD 63, and used for mounting processing by the component mounter 11.
  • the management computer 80 includes an information acquisition unit 801, a temporary setting unit 802, an arrangement setting unit 803, and a mounting order selection unit 804 as functional blocks.
  • the information acquisition unit 801 has a function of acquiring height information of a substrate having a plurality of arrangement positions with different heights and component size information including the height of the component to be arranged.
  • the temporary setting unit 802 has a function of setting a plurality of temporary orders in which a plurality of components are arranged in consideration of the moving distance of the suction head on the substrate 16.
  • the placement setting unit 803 has a function of setting a plurality of mounting orders for placing components according to the temporary order based on the temporary order set by the temporary setting unit 802.
  • the placement setting unit 803 obtains the height (placement position height) at the placement position of the component from the height of the board and the size of the component, and places the component on the board based on the obtained placement position height of the component. It has a function to set the order.
  • the mounting order selection unit 804 has a function of selecting a mounting order having a shorter mounting processing time from among the plurality of mounting orders set.
  • the management computer 80 uses these functions to set the mounting order for mounting components on the board.
  • the panel 15 includes a plurality of substrates 16.
  • regions such as a concave region 16 b that is a region having a low arrangement position with respect to the reference surface 16 a and a convex region 16 c that is a region having a high arrangement position with respect to the reference surface 16 a are formed.
  • components P1 to P12 and the like are mounted.
  • the board information 94 of the mounting information 90 stores information such as the range and height of each area.
  • the reference plane can be appropriately set according to the substrate, and may be the bottom surface of the substrate 16, a surface having an intermediate height of the substrate 16, or the top surface.
  • FIG. 6 is a flowchart showing an example of a mounting order setting process routine executed by the CPU 81 of the management computer 80.
  • This routine is stored in the HDD 83 of the management computer 80, and is executed by a start instruction from the operator.
  • This routine the mounting order in which components are more reliably mounted on the board 16 having the arrangement positions with different heights is set.
  • This routine is executed by the CPU 81 using the functions of the information acquisition unit 801, temporary setting unit 802, arrangement setting unit 803, and mounting order selection unit 804, for example.
  • the CPU 81 first reads the mounting information 90 and obtains the arrangement position information 92 including the arrangement position of each component (step S100).
  • a temporary order is set based on the arrangement position of the parts (step S110).
  • the provisional order can be set by setting a part closer to the suction position of the part as the first part, a part closer to the first part as a second part, and a part closer to the second part.
  • the third part may be used so as to move the suction head 24 while suppressing reciprocation as much as possible with a single stroke (see FIGS. 9 and 10 to be described later).
  • FIG. 7 is a flowchart illustrating an example of the board interference avoidance order setting processing routine executed by the CPU 81 of the management computer 80.
  • This routine performs a process of setting a mounting order in which there is no interference between components when mounting at placement positions having different heights, and is stored in the HDD 83 of the management computer 80.
  • the CPU 81 first acquires board information 94 including the heights of boards having a plurality of arrangement positions having different heights, and part size information 91 including the heights of the parts to be arranged. (Step S200).
  • the CPU 81 sets a determination target component (step S210).
  • the determination target components may be set in the order of the numbers in the tentative order, for example.
  • it is determined whether or not there is another part in a predetermined proximity region having a height different from the arrangement position of the determination target part (step S220). If there is another part, a comparison target part is set. (Step S230).
  • this proximity region may be determined empirically as a region that is highly likely to interfere with each other when a component mounting process is performed. This proximity region can be defined as a region having a height different from that of the determination target component and within a predetermined proximity distance.
  • the determination process extracts a comparison target component that is adjacent to the determination target component and has a different arrangement position height, obtains a distance between the determination target component and the comparison target component, and uses this distance to compare This can be done by determining whether the part enters the proximity region.
  • the first component (determination target component) arranged at the first arrangement position and the second component adjacent to the first component (the comparison target) arranged at the second arrangement position having a height different from the first arrangement position.
  • the comparison target part when there are a plurality of other parts extracted, that is, when there are a plurality of other parts in adjacent areas having different heights, for example, one of them, such as a part with higher proximity, is used as a comparison target part. Shall be set.
  • FIG. 8 is an explanatory diagram of the mounting process on the board 16 having the arrangement positions with different heights.
  • the arrangement position height can be obtained as the sum of the height of the substrate and the height of the component relative to the reference plane.
  • the sum of the substrate height h3 and the height h2 of the component P8 is the arrangement position height h4.
  • the component height h1 is the arrangement position height h1.
  • the arrangement position height of the component P1 etc. in which the upper surface of the component is equal to or less than the reference plane has a negative value.
  • the maximum value may be the component height.
  • the CPU 81 determines whether or not the determination target component and the comparison target component interfere (step S260).
  • the term “interference” includes not only the case where a component that has already been placed comes into contact with the component that is to be placed, but also the case where there is a possibility that the component that has already been placed will come into contact with the component that is going to be placed.
  • the suction head 24 moves at a predetermined moving speed in the XY direction and then moves while decelerating, while the suction nozzle 40 is set to descend at a predetermined speed in the Z-axis direction. Has been. By so doing, it is difficult for the suction nozzle 40 to move, and the mounting process can be performed efficiently.
  • the suction nozzle 40 that sucks the component enters the component placement position while moving in an oblique direction having a predetermined angle.
  • the determination in step S260 is performed based on, for example, whether the locus drawn by the lower end of the component enters the area occupied by the component arranged on the substrate 16 based on the size of the component sucked by the suction nozzle 40. Can do.
  • the “trajectory drawn by the lower end of the component” includes a predetermined margin.
  • This margin may be determined empirically based on the data of the suction state of the component. Moreover, it is good also considering the width
  • the mounting order is set so that the component with the lower placement position is placed first (step S270). For example, as shown in FIG. 8, when a component P8 with a high placement position is mounted first, there is a high possibility that these components interfere when mounting a component P9 with a low placement position. On the other hand, even if the component P9 having a low placement position is mounted first, the possibility that the component P8 and the component P9 interfere when the component P8 having a high placement position is mounted is low. Therefore, here, the mounting order is set so that the mounting processing is performed first from the component having the low placement position height.
  • Step S280 When there is another part to be compared, the processes after Step S230 are executed. That is, the next comparison target component is set in step S230, and whether or not interference occurs in step S260 is executed based on the arrangement position height. On the other hand, when there is no other comparison target part in step S280, or when there is no other part in the proximity region having a different height in step S220, it is determined whether or not interference has been determined for all parts (step S280). S290). When the determination of interference is not performed for all parts, the processes after step S210 are repeatedly executed.
  • step S210 the next part is set as a determination target part, and it is determined whether there is another part in the proximity region having a different height, so that the already placed part interferes with the part to be placed. It is determined whether or not.
  • the mounting order is set so that the one with the lower placement position is placed first.
  • this routine is terminated.
  • the description returns to the mounting order setting processing routine of FIG.
  • the CPU 81 stores the mounting order set in the board interference avoidance order setting process in the HDD 83 as a mounting order candidate (step S130), and a predetermined time has elapsed from the start of the process. Is determined (step S140).
  • the predetermined time is empirically determined, for example, as a time when a plurality of temporary orders are created in a moderate amount and a plurality of mounting order candidates corresponding thereto are created in a moderate amount.
  • a provisional order condition different from the previous time is set (step S150), and the processing after step S110 is executed.
  • step S110 a temporary order based on a new condition is set, and the board interference avoidance order setting process is executed to newly store a mounting order candidate.
  • the temporary order condition different from the previous time is, for example, changing the part from which the mounting process is started to another part or changing the order of the dense parts group such as parts P2 to P4 and parts P9 to P11 in FIG. It is also possible to include condition changes such as In this way, it is possible to set a plurality of different provisional orders, and it is possible to set implementation order candidates with various contents.
  • step S140 the CPU 81 acquires the mounting time of each mounting order candidate (step S160).
  • This mounting time can be calculated based on, for example, the moving distance of the suction head 24 on the XY plane.
  • step S170 the mounting order candidate with the shortest mounting time is selected as the mounting order to be actually executed (step S170), and the selected content is stored in the mounting information 90 (step S180).
  • This routine is finished as it is. In this way, it is possible to set a mounting order in which mounting processing that prevents component interference can be performed on the boards 16 having different arrangement positions.
  • FIG. 9 is an explanatory diagram illustrating an example of the substrate interference avoidance order setting process
  • FIG. 10 is an explanatory diagram illustrating an example of the substrate interference avoidance order setting process under a provisional order condition different from that in FIG.
  • the provisional order is set in the order of the parts P1 to P12.
  • the mounting order is changed so that the component P5 is arranged before the component P4 having a high arrangement position height and the component P9 is arranged before the component P8.
  • the provisional order conditions are different, and in the provisional order different from FIG. 9, the provisional order is set in the order of components P12, P9, P10, P11, P8 to P1, as shown in FIG. 10A.
  • the arrangement position height is determined in step S270.
  • the mounting order is changed so that the component P6 is arranged before the high component P7.
  • the one having a shorter mounting time is selected as the mounting order based on the moving distance of the suction head 24.
  • the mounting order based on the moving distance of the suction head 24.
  • these interferences are suppressed by setting a component with a low arrangement position height that has a high possibility of interference when moved in a state of being attracted to the suction nozzle 40 to be mounted earlier.
  • more efficient mounting processing is realized by selecting a plurality of provisional orders having the shortest mounting processing time as the mounting order.
  • Step S200 of the present embodiment corresponds to an acquisition step of the present invention
  • step S270 corresponds to an arrangement setting step
  • step S110 corresponds to a temporary setting step
  • step S170 corresponds to a selection step.
  • the information acquisition unit 801 corresponds to an acquisition unit
  • the arrangement setting unit 803 corresponds to an arrangement setting unit.
  • the height information of the arrangement position of the substrate 16 having a plurality of arrangement positions having different heights and the size information of the component including the height of the component to be arranged are obtained and acquired.
  • the height at the placement position of the component is obtained from the height of the placement position and the size of the component, and the mounting order for placing the components on the board 16 is set based on the obtained placement position height of the component. For example, if the mounting order is set considering only the height of the components, the components already arranged on the substrate and the components to be arranged may interfere with each other depending on the arrangement positions having different heights on the substrate.
  • the mounting order of the components on the substrate is set in consideration of the height of the substrate, the components can be more reliably mounted on the substrate having a plurality of arrangement positions with different heights.
  • the first component arranged at the first arrangement position and the second component arranged at a second arrangement position having a height different from the first arrangement position and adjacent to the first component are extracted, and the first arrangement position is extracted.
  • the arrangement position height of the first part and the arrangement position height of the second part at the second arrangement position are obtained, and the one with the lower arrangement position height is arranged first.
  • the component already arranged on the board and the component to be arranged hardly interfere with each other, and the component can be more reliably mounted.
  • the interference between the component already arranged on the substrate and the component to be arranged can be more reliably prevented, so that the component can be more reliably mounted. Furthermore, since the provisional order is set, and the mounting order in which the components are arranged based on the set temporary order is set, the moving distance of the suction head 24 is taken into account, so that the parts are mounted more efficiently and reliably. be able to. And to set a plurality of provisional orders, set a plurality of implementation orders using a plurality of provisional orders and set them as a mounting order candidate, and select a mounting order with a shorter mounting processing time from a plurality of set mounting order candidates. Components can be mounted efficiently and more reliably.
  • the two parts of the determination target part and the comparison target part are extracted, and the one with the lower placement position height is arranged first. If it arrange
  • the interference it is determined whether or not the interference occurs based on the size of the component sucked by the suction head 24 and the size of the component placed at the placement position.
  • Two or more parts in a predetermined proximity region of different arrangement positions may have a high possibility of interference, and one having a low arrangement position height may be arranged first. Even in this case, it is possible to more reliably mount components on a substrate having a plurality of arrangement positions with different heights.
  • a plurality of provisional orders are set in consideration of the movement distance of the suction head 24.
  • the present invention is not particularly limited to this, and a plurality of provisional orders is taken into consideration without considering the movement distance of the suction head 24. May be set. Even in this case, the mounting order with the shortest mounting time is selected from the plurality of candidates in step S170.
  • one provisional order may be set in consideration of the moving distance of the suction head 24 without setting a plurality of provisional orders. At this time, the processing of steps S160 to S180 may be omitted. In this way, the mounting order can be determined with relatively few steps.
  • a plurality of mounting order candidates are created depending on whether or not the predetermined time has passed in step S140 of the mounting order setting processing routine. After the provisional order is set, the processing after step S160 may be executed. Even in this way, a desired number of provisional orders can be set.
  • step S220 of the substrate interference avoidance order setting processing routine it is determined in step S220 of the substrate interference avoidance order setting processing routine whether or not there is another part in a predetermined proximity region having a different arrangement position height.
  • the present invention is particularly limited to this. For example, it may be determined whether there is another part in a predetermined proximity region without considering the height of the arrangement position. Even in this case, the arrangement position height is calculated from the height of the substrate 16 and the height of the component in step S250, and the mounting order is changed when the two components interfere with each other, so that the same effect as the above-described embodiment can be obtained. it can.
  • the mounting order is set so that the component with the lower placement position height is placed earlier in step S270.
  • the component with the higher placement position height is placed later.
  • the mounting order may be set as described above. Even in this case, it is possible to more reliably mount components on a substrate having a plurality of arrangement positions with different heights.
  • the mounting order is arranged so that the part having the lower placement position among the judgment target part and the comparison target part is placed in step S270.
  • the order is held. If so, the order may be such that other parts are inserted between these parts.
  • the mounting order is set in the order of components P9 ⁇ P8 ⁇ P10 ⁇ P11 ⁇ P12.
  • the order of components P9 ⁇ P10 ⁇ P11 ⁇ P8 ⁇ P12 may be set. .
  • the interference is determined including the size of the component sucked by the suction nozzle 40, but this may be omitted. At this time, it is only necessary to determine whether or not the arranged component and the suction nozzle 40 side interfere with each other using the height information of the suction nozzle 40. For example, a predetermined margin based on the component is determined based on the component. The interference may be determined in addition to the height.
  • the management computer 80 has been described as the mounting setting device of the present invention.
  • the present invention is not particularly limited thereto.
  • the control device 60 of the component mounter 11 may set the mounting order. Even in this case, the same effect as that of the above-described embodiment can be obtained.
  • the management computer 80 as the mounting setting apparatus of the present invention has been described.
  • the present invention is not particularly limited to this, and a mounting setting method or a program form thereof may be used.
  • the present invention can be used in the technical field of mounting components on a board.
  • 1 component mounting system 10 mounting line, 11, 11a-11d component mounting machine, 12 base, 14 mounting machine body, 15 panel, 16 substrate, 16a reference plane, 16b concave region, 16c convex region, 18 substrate transport device, 20 support plates, 22 conveyor belts, 23 support pins, 24 suction heads, 26 X-axis sliders, 28 guide rails, 30 Y-axis sliders, 32 guide rails, 40 suction nozzles, 41 head bodies, 42 nozzle holders, 43 motors, 44 nozzle holder, 46 Z-axis motor, 47 motor, 54 parts camera, 55 nozzle stocker, 56 reel unit, 57 reel, 58 feeder section, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 I / O interface, 6 bus, 80 management computer, 81 CPU, 801 information acquisition unit, 802 temporary setting unit, 803 placement setting unit, 804 mounting order selection unit, 82 ROM, 83 HDD, 84 RAM, 85 I / O interface, 86 bus, 87 input Device

Abstract

L'invention concerne un procédé de configuration de montage caractérisé en ce qu'un dispositif (11) de montage de composants obtient des informations concernant les hauteurs de positions de mise en place d'un substrat (16) qui comporte une pluralité de positions de mise en place de hauteurs différentes et des informations de taille de composants comprenant la hauteur d'un composant appelé à être mis en place, détermine la hauteur d'un composant dans une position de mise en place à partir des hauteurs acquises de positions de mise en place et de la taille du composant, et établit un ordre de montage destiné à mettre en place des composants sur le substrat (16) de telle façon qu'un composant pour lequel la hauteur déterminée de position de mise en place est plus basse soit mis en place en premier. À cette occasion, une détermination a lieu concernant le fait qu'un premier composant qui est accroché à une tête (24) d'aspiration interfèrera ou non avec un deuxième composant qui est mis en place dans une position de mise en place, et l'ordre de montage peut être établi de telle façon que le premier composant soit mis en place avant le deuxième composant lorsqu'il est déterminé qu'une interférence va se produire.
PCT/JP2013/057168 2013-03-14 2013-03-14 Procédé et dispositif de configuration de montage WO2014141427A1 (fr)

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PCT/JP2013/057168 WO2014141427A1 (fr) 2013-03-14 2013-03-14 Procédé et dispositif de configuration de montage
JP2015505158A JPWO2014141427A1 (ja) 2013-03-14 2013-03-14 実装設定方法及び実装設定装置

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JP2021190449A (ja) * 2020-05-26 2021-12-13 パナソニックＩｐマネジメント株式会社 部品装着装置、部品装着システム、部品装着方法、ならびに管理装置
JP2021190448A (ja) * 2020-05-26 2021-12-13 パナソニックＩｐマネジメント株式会社 部品装着装置および部品装着方法ならびに管理装置

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JPH07176891A (ja) * 1993-12-21 1995-07-14 Nec Corp 電子部品自動実装装置の実装順序決定方式
JP2001144496A (ja) * 1999-09-03 2001-05-25 Matsushita Electric Ind Co Ltd 部品装着方法及び装置
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