WO2020183516A1 - Mounting data generation assistance device, mounting data generation assistance method, appearance inspection machine, and component mounting system - Google Patents

Mounting data generation assistance device, mounting data generation assistance method, appearance inspection machine, and component mounting system Download PDF

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Publication number
WO2020183516A1
WO2020183516A1 PCT/JP2019/009272 JP2019009272W WO2020183516A1 WO 2020183516 A1 WO2020183516 A1 WO 2020183516A1 JP 2019009272 W JP2019009272 W JP 2019009272W WO 2020183516 A1 WO2020183516 A1 WO 2020183516A1
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WO
WIPO (PCT)
Prior art keywords
component
mounting
shape
substrate
board
Prior art date
Application number
PCT/JP2019/009272
Other languages
French (fr)
Japanese (ja)
Inventor
一希 齋藤
聡浩 道添
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2019/009272 priority Critical patent/WO2020183516A1/en
Priority to JP2021504606A priority patent/JP7427652B2/en
Publication of WO2020183516A1 publication Critical patent/WO2020183516A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a technique for supporting the creation of mounting data indicating a procedure for mounting a component on a board.
  • the component mounting machine produces a completed board in which the components are mounted on the board by transferring the components supplied by the feeder to the board by the mounting head. Further, as shown in Patent Document 1, the component mounting machine mounts a component on a substrate according to a procedure indicated by the mounting data, and information on the shape of the component is required to create the mounting data.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a technique for supporting the creation of mounting data by reducing the burden on the operator required to acquire the height of the parts mounted on the board.
  • the mounting data creation support device is a mounting data creation support device that supports the creation of mounting data indicating a procedure for mounting components on a board, and is a completed board having a board and parts mounted on the board. It is equipped with an acquisition unit that acquires the completed board information including the shape measurement result and a calculation unit that obtains the component shape information indicating the shape of the component based on the completed board information.
  • the completed board information indicates the three-dimensional shape of the completed board. Of the three-dimensional data and the two-dimensional data indicating the two-dimensional shape, at least the three-dimensional data is included, and the arithmetic unit obtains the height of the component from the board based on the three-dimensional data, so that the component including the height of the component is included. Obtain shape information.
  • the mounting data creation support method is a mounting data creation support method that supports the creation of mounting data indicating a procedure for mounting components on a board, and is a completed board having a board and components mounted on the board. It includes a process of acquiring the shape measurement result as completed board information and a process of obtaining part shape information indicating the shape of the part based on the completed board information.
  • the completed board information is three-dimensional data indicating the three-dimensional shape of the completed board. Of the two-dimensional data indicating the two-dimensional shape, at least the three-dimensional data is included, the height of the component from the substrate is obtained based on the three-dimensional data, and the component shape information including the height of the component is obtained.
  • the visual inspection machine has a shape measuring unit for obtaining at least completed board information indicating the shape of a finished board having a board and a component mounted on the board by measuring the shape of the finished board, and a shape of the part. It is provided with a calculation unit that obtains the component shape information indicating the component shape information based on the completed board information, and the completed board information is the three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed board and the two-dimensional data indicating the two-dimensional shape. At least including, the calculation unit obtains the component shape information including the height of the component by obtaining the height of the component from the board based on the three-dimensional data.
  • the component mounting system is a computing device and a feeder that obtains component shape information indicating the shape of a component based on completed board information including a measurement result of the shape of a completed substrate having a substrate and a component mounted on the substrate. It is equipped with a component mounting machine that holds the components supplied to the component supply position by the mounting head and transfers them to the board, and the completed board information includes three-dimensional data indicating the three-dimensional shape of the finished board and two dimensions. Of the two-dimensional data indicating the shape, at least three-dimensional data is included, and the arithmetic unit obtains the part shape information including the height of the part by obtaining the height of the part from the board based on the three-dimensional data. The mounting machine mounts the component on the board according to the procedure indicated by the mounting data including the component shape information.
  • the measurement result of the shape of the completed substrate having the substrate and the components mounted on the substrate is measured.
  • the completed board information including, component shape information indicating the shape of the component is required.
  • the completed substrate information includes at least three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed substrate and the two-dimensional data indicating the two-dimensional shape. Then, by obtaining the height of the component from the substrate based on the three-dimensional data, the component shape information including the height of the component can be obtained. This makes it possible to reduce the burden on the operator required to acquire the height of the parts mounted on the board and support the creation of mounting data.
  • the arithmetic unit may configure the mounting data creation support device so as to estimate the type of the part by referring to the shape of the part indicated by the part shape information obtained based on the three-dimensional data. With such a configuration, it is possible to accurately estimate the type of parts based on the three-dimensional data.
  • the completed board information includes two-dimensional data
  • the calculation unit creates mounting data so that the component type is estimated by referring to the component shape indicated by the component shape information obtained by using the two-dimensional data together.
  • a support device may be configured. In such a configuration, it is possible to accurately estimate the type of parts by also using two-dimensional data.
  • the arithmetic unit searches for a registered part having a shape similar to the shape of the part indicated by the part shape information as a candidate part from the parts library in which the shapes of a plurality of registered parts of different types are registered for each registered part.
  • the mounting data creation support device may be configured so as to estimate the type of the component based on the result. In such a configuration, it is possible to accurately estimate the type of parts based on the parts library.
  • the arithmetic unit associates the component shape indicated by the component shape information with the component and adds it to the mounted component information regarding the component mounted on the board on the completed board.
  • the mounting data creation support device may be configured. In such a configuration, when the completed board contains a component that is not in the component library, this component can be added to the mounted component information.
  • the arithmetic unit resembles the shape of the part indicated by the part shape information from the parts list showing the shape of a plurality of different types of target parts mounted on the board for the production of the completed board for each target part.
  • the mounting data creation support device may be configured so as to estimate the type of the component based on the result of searching for the target component having a shape as a candidate component. With such a configuration, it is possible to accurately estimate the type of parts based on the parts list.
  • the arithmetic unit obtains component feature information indicating the features of the component in addition to the shape of the component from the completed board information, and the component feature information indicates from the plurality of candidate components.
  • the mounting data creation support device may be configured so as to estimate the type of the component based on the result of searching for one candidate component having a feature. With such a configuration, it is possible to accurately estimate the type of the part based on the characteristics of the part other than the shape of the part.
  • the calculation unit extracts the protruding portion protruding from the board from the three-dimensional data included in the completed board information, identifies the protruding portion as a component, and identifies the position of the protruding portion as the mounting position.
  • the mounting data creation support device may be configured. In such a configuration, the mounting position of the component can be accurately specified based on the three-dimensional data, the burden on the operator required to specify the mounting position of the component can be reduced, and the creation of the mounting data can be supported. It has become.
  • the arithmetic unit may configure the mounting data creation support device so as to specify the mounting position based on the mark attached to the board.
  • the mounting position of the component can be specified with reference to the mark attached to the substrate.
  • the arithmetic unit may configure a mounting data creation support device so that the mounting angle of the component in the rotation direction centered on the virtual straight line parallel to the normal of the board can be obtained from the completed board information.
  • the arithmetic unit may configure the mounting data creation support device so as to obtain the component shape information including the existence range of the upper surface of the component having a uniform height from the substrate based on the three-dimensional data.
  • the upper surface of the component can be accurately obtained based on the three-dimensional data.
  • the arithmetic unit may configure a mounting data creation support device so as to determine the type of nozzle for sucking the component in order to mount the component on the substrate based on the existence range of the upper surface.
  • the arithmetic unit may configure the mounting data creation support device so as to determine the suction position for sucking the component by the nozzle in order to mount the component on the substrate from the existing range on the upper surface.
  • the mounting data includes the angle of the component at the component supply position in the rotation direction centered on the virtual straight line parallel to the normal line of the board, and the component mounting machine recognizes the angle of the component supplied by the feeder.
  • the component mounting system may be configured so as to determine whether or not it matches the angle of the component at the component supply position included in the mounting data and determine the suitability of the mounting data. In such a configuration, the suitability of the angle of the component supplied to the component supply position indicated by the mounting data can be confirmed by the component mounting machine.
  • the component mounting machine may configure the component mounting system so as to correct the mounting data when it determines that the mounting data is inappropriate. In such a configuration, components can be appropriately mounted on the board based on the modified mounting data.
  • the block diagram which shows the substrate production system provided with the control device which corresponds to an example of the mounting data creation support device which concerns on this invention.
  • the figure which shows an example of the parts library schematically.
  • the block diagram which schematically exemplifies the appearance inspection machine.
  • the perspective view which shows the specific example of the information extracted by the flowchart of FIG.
  • a flowchart showing an example of a method for identifying a part.
  • the flowchart which shows an example of the calculation method of the component adsorption information.
  • FIG. 1 is a block diagram showing a substrate production system provided with a control device corresponding to an example of the mounting data creation support device according to the present invention.
  • the board production system 1 includes a control device 2, a database 4, a visual inspection machine 6, and a component mounting machine 8.
  • the control device 2 is composed of, for example, a personal computer, and includes a calculation unit 21, a storage unit 22, a UI (User Interface) 23, and a communication unit 24.
  • the calculation unit 21 is, for example, a processor composed of a CPU (Central Processing Unit), and is responsible for calculation by the control device 2.
  • the storage unit 22 is composed of, for example, an HDD (Hard Disk Drive), and stores various data used in calculations by the control device 2. Specifically, as will be described in detail later, the three-dimensional measurement result R obtained by measuring the three-dimensional shape of the completed substrate Bc with the visual inspection machine 6 and the component C mounted on the substrate B in the completed substrate Bc.
  • the mounting component information Im and the mounting data Dm indicating the procedure for mounting the component on the component mounting machine 8 are stored in the storage unit 22.
  • the UI 23 is composed of, for example, a touch panel display, accepts input operations from the operator, and presents information to the operator.
  • the communication unit 24 is responsible for communication with the external database 4, the visual inspection machine 6, and the component mounting machine 8.
  • the database 4 stores a component library Lc that indicates component information Ic related to component C mounted on the component mounting machine 8 for each component C.
  • FIG. 2 is a diagram schematically showing an example of a parts library.
  • the part library Lc a plurality of parts C of different types are identified by the part ID, and the part information Ic of the part C identified by the part ID is associated with the part C.
  • the component information Ic includes the component shape information Ics of the component C identified by the corresponding component ID, the component adsorption information Ica, and the like.
  • the component shape information Ics indicates the package and size (length, width, height) of the component C
  • the component suction information Ica is a nozzle for sucking the component C in the component mounting machine 8 and a component for supplying the component C.
  • the packing shape (rotation angle) of C and the suction position where the component C is sucked by the nozzle are shown.
  • the mounted component information Im corresponds to the component information Ic of the component C mounted on the substrate B in the completed substrate Bc, and the component shape method Ics included in the mounted component information Im is input with reference to the component library Lc. Information.
  • FIG. 3 is a block diagram schematically illustrating a visual inspection machine.
  • XYZ Cartesian coordinates composed of the Z direction parallel to the vertical direction, the X direction parallel to the horizontal direction, and the Y direction are appropriately shown.
  • the visual inspection machine 6 of FIG. 3 controls the conveyor 61, the inspection head 62, and the drive mechanism 63 by the inspection control unit 64, thereby mounting the substrate B (printed circuit board) and the component C mounted on the substrate B (“mounting component”).
  • the shape of the completed substrate Bc having "C" as appropriate) is measured.
  • the transport conveyor 61 transports the completed substrate Bc along a predetermined transport path. Specifically, the conveyor 61 carries the completed substrate Bc before shape measurement to the inspection position in the visual inspection machine 6 and holds the completed substrate Bc horizontally at the inspection position. In this way, the completed substrate Bc is fixed in a state where the main surface (upper surface) of the substrate B on which the component C is mounted faces upward. Further, when the shape measurement of the completed substrate Bc at the inspection position is completed, the conveyor 61 carries out the completed substrate Bc after the shape measurement to the outside of the visual inspection machine 6.
  • the inspection head 62 has an imaging camera 621 that images the inside of the imaging field of view V from above, and a part of the completed substrate Bc carried into the inspection position is stored in the imaging field of view V and imaged by the imaging camera 621. Further, the inspection head 62 has a projector 624 that projects a striped pattern light whose light intensity distribution changes in a sinusoidal manner onto an imaging field of view V.
  • the projector 624 has a light source such as an LED (Light Emitting Diode) and a digital micromirror device that reflects the light from the light source toward the imaging field V.
  • the projector 624 can project a plurality of pattern lights having different phases to the imaging field of view V. That is, the inspection head 62 takes an image with the imaging camera 621 while changing the phase of the pattern light projected from the projector 624, and acquires a three-dimensional image of the completed substrate Bc in the imaging field of view V by the phase shift method. , Three-dimensional shape can be measured.
  • the inspection head 62 has eight projectors 624 (in FIG. 3, two projectors 624 are represented as representatives for simplification of illustration).
  • the eight projectors 624 are arranged so as to surround the periphery of the image pickup camera 621, and are arranged at equal pitches in a circumferential shape centered on the vertical direction Z. Then, each projector 624 projects the pattern light from diagonally above with respect to the imaging field of view V of the imaging camera 621. Therefore, the pattern light can be projected onto the imaging field of view V from one projector 624 having an appropriate positional relationship with the component C among the plurality of projectors 624.
  • the drive mechanism 63 supports the inspection head 62 and drives the inspection head 62 in the horizontal direction and the vertical direction by a motor. By driving the drive mechanism 63, the inspection head 62 moves above the completed substrate Bc, and a part B of the completed substrate Bc can be captured in the imaging field of view V, and the tertiary of the completed substrate Bc in the imaging field of view V can be captured.
  • the original shape can be measured.
  • the inspection control unit 64 has a calculation unit 641 which is a processor composed of a CPU, and the calculation unit 641 controls the control of each unit of the device to execute the inspection.
  • the inspection control unit 64 includes a projection control unit 642 that controls the projector 624, an image pickup control unit 643 that controls the image pickup camera 621, a drive control unit 644 that controls the drive mechanism 63, a storage unit 645 composed of an HDD and the like, and control. It has a communication unit 646 that communicates with the communication unit 24 of the device 2.
  • the calculation unit 641 controls the drive mechanism 63 by the drive control unit 644 to move the inspection head 62 above the completed substrate Bc.
  • a part of the completed substrate Bc fits within the imaging field of view V of the imaging camera 621.
  • the calculation unit 641 captures the pattern light projected on the imaging field V by the imaging camera 621 while projecting the pattern light from the projector 624 onto the imaging field V including a part B of the completed substrate Bc (pattern imaging operation). ).
  • the calculation unit 641 measures the three-dimensional shape of the imaging field V by the phase shift method by repeating the pattern imaging operation while changing the phase of the pattern light. Such shape measurement is performed on the entire completed substrate Bc while changing the imaging field of view V. In this way, the result of measuring the three-dimensional shape of the completed substrate Bc is stored in the storage unit 645 as the three-dimensional measurement result R.
  • FIG. 4 is a plan view schematically showing an example of a component mounting machine.
  • the component mounting machine 8 includes a mounting control unit 81 that comprehensively controls the entire device.
  • the mounting control unit 81 includes a calculation unit 811, a storage unit 812, and a communication unit 813.
  • the calculation unit 811 is a processor composed of a CPU and a RAM, and is responsible for a calculation function in the component mounting machine 8.
  • the storage unit 812 is composed of an HDD or the like, and stores various data such as mounting data Dm indicating a procedure for mounting the component C on the board B in order to produce the completed board Bc.
  • the communication unit 813 communicates with the communication unit 24 of the control device 2.
  • the component mounting machine 8 includes a board transporting unit 82 that transports the board B in the X direction (board transport direction).
  • the substrate transfer unit 82 has a pair of conveyors 821 arranged in parallel in the X direction, and the substrate B is conveyed in the X direction by the conveyor 821.
  • the distance between the conveyors 821 can be changed in the Y direction (width direction) orthogonal to the X direction, and the substrate transport unit 82 adjusts the distance between the conveyors 821 according to the width of the substrate B to be conveyed.
  • the board transfer unit 82 carries the board B to a predetermined mounting work position 822 from the upstream side in the X direction, which is the board transfer direction, and mounts the board B on which the component C is mounted at the mounting work position 822 at the mounting work position 822. Carry out from to the downstream side in the X direction.
  • Two component supply units 83 are arranged in the X direction on both sides of the board transfer unit 82 in the Y direction, and a plurality of tape feeders 831 are arranged in the X direction in each component supply unit 83.
  • the component supply unit 83 is provided with a plurality of component supply positions 832 arranged in the X direction, and a tape feeder 831 for supplying the component C to be supplied to each component supply position 832 is associated with each component supply position 832. It is attached detachably.
  • a component supply reel around which a carrier tape containing small pieces C such as integrated circuits, transistors, capacitors, etc. is housed at predetermined intervals is arranged, and each tape feeder 831 has. By intermittently feeding out the carrier tape drawn from the component supply reel, the component C is supplied to the component supply position 832 at the tip thereof.
  • a pair of Y-axis rails 841 extending in the Y direction, a Y-axis ball screw 842 extending in the Y direction, and a Y-axis motor 843 that rotationally drives the Y-axis ball screw 842 are used. It is provided. Then, the X-axis beam 844 extending in the X direction is fixed to the nut of the Y-axis ball screw 842 in a state of being movably supported by the pair of Y-axis rails 841 in the Y direction.
  • An X-axis ball screw 845 extending in the X direction and an X-axis motor 846 for rotationally driving the X-axis ball screw 845 are attached to the X-axis beam 844, and the head unit 85 is attached to the X-axis beam 844 in the X direction. It is fixed to the nut of the X-axis ball screw 845 in a state where it is movably supported. Therefore, the mounting control unit 81 rotates the Y-axis ball screw 842 by the Y-axis motor 843 to move the head unit 85 in the Y direction, or rotates the X-axis ball screw 845 by the X-axis motor 846 to rotate the head unit 85 to X. It can be moved in a direction.
  • the head unit 85 has a plurality of mounting heads 851 arranged linearly in the X direction.
  • Each mounting head 851 is movable in the Z direction and the R direction independently of each other.
  • the R direction is a direction of rotation about a rotation axis parallel to the Z direction. Therefore, the mounting control unit 81 can raise and lower the mounting head 851 in the Z direction by the Z-axis motor (not shown), and can rotate the mounting head 851 in the R direction by the R-axis motor (not shown).
  • a recognition camera 86 that captures an image of the lower side is attached to the head unit 85, and the recognition camera 86 moves with the head unit 85.
  • Each mounting head 851 of the head unit 85 mounts the component C on the substrate B by the nozzle N attached to the lower end thereof. That is, the mounting head 851 abuts the nozzle N on the component C supplied by the tape feeder 831 to the component supply position 832 by lowering the nozzle N while positioning the nozzle N at the lower end thereof above the component supply position 832. Let me. Then, when the mounting head 851 applies a negative pressure to the nozzle N and attracts the component C by the nozzle N, the nozzle N is raised. The mounting head 851 moves above the substrate B at the mounting work position 822 while attracting and holding the component C picked up from the component supply position 832 by the nozzle N.
  • the mounting head 851 lowers the nozzle N and brings the component C into contact with the substrate B, the negative pressure of the nozzle N is released and the component C is placed on the substrate B.
  • the component C picked up from the component supply unit 83 is mounted at the mounting work position by using the mounting head 851 that moves between the component supply unit 83 that supplies the component C and the mounting work position 822.
  • the component mounting to be transferred to the board B of 822 is executed. Note that this component mounting is executed according to the procedure specified in the mounting data Dm based on the control of the mounting control unit 81.
  • the control device 2 obtains the component information Ic based on the three-dimensional shape (three-dimensional measurement result R) of the completed substrate Bc measured by the visual inspection machine 6, thereby creating the mounting data Dm. Assist.
  • FIG. 5 is a flowchart showing an example of the implementation data creation support method.
  • steps S101 to S102 are executed by the visual inspection machine 6
  • steps S103 to S114 are executed by the calculation unit 21 of the control device 2
  • steps S115 are executed by the component mounting machine 8.
  • step S101 the visual inspection machine 6 measures the three-dimensional shape of the completed substrate Bc in the same manner as described above, thereby acquiring the three-dimensional measurement result R.
  • the three-dimensional measurement result R is transferred from the visual inspection machine 6 to the control device 2 (step S102).
  • the control device 2 when the communication unit 24 acquires the three-dimensional measurement result R from the appearance inspection machine 6, the storage unit 22 stores the three-dimensional measurement result R, and the calculation unit 21 relates to the component C included in the completed board Bc.
  • the mounted component information Im is extracted from the three-dimensional measurement result R (step S103).
  • FIG. 6 is a flowchart showing an example of a method for extracting mounted component information
  • FIG. 7 is a perspective view schematically showing a specific example of the information extracted by the flowchart of FIG.
  • the flowchart of FIG. 6 is executed by the calculation unit 21 of the control device 2.
  • the height information of the completed substrate Bc is acquired from the three-dimensional measurement result R of the completed substrate Bc.
  • the height information of the completed substrate Bc indicates the height of the uneven surface formed by the upper surface Bu of the substrate B and the component C mounted on the upper surface Bu.
  • the upper surface Bu of the substrate B is the main surface of both main surfaces of the substrate B that faces upward when the shape is measured by the visual inspection machine 6.
  • step S202 the height of the upper surface Bu (that is, the lowest plane in which the component C does not exist) of the substrate B among the completed substrates Bc is estimated based on the height information of the completed substrate Bc (step). S202). Then, a portion higher than the upper surface Bu of the substrate B (in other words, a protruding portion protruding upward from the upper surface Bu of the substrate B) is extracted as the component C (step S203). Based on the extraction result of the component C in step S203, the component shape information Ics indicating at least the package type, width Cw, length Cl, and height Ch of the component C is acquired (step S204).
  • the component shape information Ics is acquired for all the components C included in the completed board Bc, and is stored in the storage unit 22 as the mounted component information Im. Then, the following steps S104 to S113 are executed for each of all the parts C. However, since the contents are the same for each component C, one component C will be described.
  • FIG. 8 is a flowchart showing an example of a method for identifying parts.
  • the flowchart of FIG. 8 is executed by the calculation unit 21 of the control device 2.
  • step S301 the component shape information Ics included in the mounted component information Im stored in the storage unit 22 is read out.
  • step S302 the component shape information Ics included in the mounted component information Im and the component shape information Ics registered in the component library Lc are collated.
  • the component C (candidate component) of the component ID corresponding to the component shape information Ics that satisfies the predetermined relationship (for example, the relationship that the size difference is less than the predetermined value) with the component shape information Ics included in the mounted component information Im is a candidate. Is selected as (step S303).
  • step S105 of FIG. 5 the number of selected candidate parts C is determined. If the number of candidate parts C is one, steps S106 to S108 are omitted, and the process proceeds to step S109. If the number of candidate parts C is zero, steps S106 to S107 are omitted. The process proceeds to step S108, and if the number of candidate parts C is a plurality, the process proceeds to step S106.
  • step S106 component feature information indicating the features of component C, which is not included in the component shape information Ics, is acquired.
  • This component feature information includes the characters described in the component C, the color of the component C, the silk characters described on the substrate B in close proximity to the mounting position of the component C, and the like, and is associated with the component ID in the component library Lc. It is registered in advance.
  • the component feature information regarding the component C included in the completed substrate Bc is extracted from the image information (the above three-dimensional image) used for the three-dimensional measurement. If a two-dimensional image of the component C has been acquired, component feature information may be extracted from the two-dimensional image.
  • step S107 among the component feature information associated with the plurality of candidate components C in the component library Lc, the component feature information that matches the component feature information extracted from the three-dimensional measurement result R is searched for. Then, when the corresponding component feature information exists, it is determined that the component C of the component ID associated with the component C is the component C included in the completed board Bc (“YES” in step S107), and the step Proceed to S109.
  • step S108 is executed.
  • the component information Ic is newly created based on the component shape information Ics indicated by the mounted component information Im extracted in step S103.
  • the component information Ic thus created is added to the mounting component information Im of the target completed board Bc.
  • step S109 the component information Ic of the component C included in the completed substrate Bc is determined. Specifically, when it is determined in step S105 that the number of candidate parts C is one, the part information Ic associated with the part ID of the candidate part C is included in the completed board Bc. It is determined to be information Ic. If "YES" is determined in step S107, the component information Ic associated with the component ID of the candidate component C determined in step S107 is the component information Ic of the component C included in the completed board Bc. Is decided. Further, when step S108 is executed, it is determined that the component information Ic newly registered in the component library Lc in step S108 is the component information Ic of the component C included in the completed board Bc.
  • step S110 the mounting position of the component C whose component information Ic is determined in step S109 is specified based on the three-dimensional measurement result R. Specifically, in the same manner as described above, the protruding portion protruding from the substrate B is extracted from the three-dimensional measurement result R, and the position of the protruding portion is specified as the mounting position. Further, in step S111, the mounting angle and the direction of the polarity of the component C for which the component information Ic has been determined are specified based on the three-dimensional measurement result R.
  • the mounting angle is the angle of the component C mounted on the board B in the rotation direction centered on the virtual straight line parallel to the normal line of the board B (in other words, the Z direction).
  • step S112 it is determined whether or not the component adsorption information Ica of the component C whose component information Ic is determined in step S109 exists in the component library Lc. If the corresponding component adsorption information Ica exists (when “YES” in step S112), step S113 is omitted and the process proceeds to step S114. On the other hand, when the corresponding component adsorption information Ica does not exist (in the case of step S112 “NO”), step S113 is executed and then the process proceeds to step S114.
  • step S113 the component adsorption information Ica of the component C for which the component information Ic has been determined is calculated.
  • FIG. 9 is a flowchart showing an example of a method of calculating the component suction information
  • FIG. 10 is a diagram showing an example of the positional relationship between the nozzle and the component considered in the calculation of the component suction information. The flowchart of FIG. 9 is executed by the calculation unit 21 of the control device 2.
  • step S401 the three-dimensional measurement result R is read out, and in step S402, the upper surface Cu of the corresponding component C is extracted from the three-dimensional measurement result R.
  • the upper surface Cu of the component C is extracted by specifying the existence range of a plane having a uniform height from the upper surface Bu of the substrate B in the component C. As shown in FIG. 10, when the component C has a step, a plurality of upper surface Cu having different heights are extracted.
  • step S403 it is tentatively determined that the component C is adsorbed by the nozzle N having the largest nozzle hole among the plurality of nozzles N of different types.
  • step S404 the suction position of the component C by the nozzle N is searched from inside the upper surface Cu. At this time, the positional relationship between the suction hole of the nozzle N and the upper surface Cu, the interference between the flange Nf of the nozzle N and the step of the component C, and the like are confirmed, and the suction position that meets the conditions is searched for.
  • step S405 it is determined whether the suction position searched in step S404 is appropriate. For example, if it is not possible to search for a suction position where interference between the nozzle N and the component C does not occur, or if the suction position is separated from the center of the component C by a predetermined distance or more, it is determined to be inappropriate (NO) in step S405. Then, the process returns to step S403. Then, the nozzle N for sucking the component C is changed to a nozzle N having a smaller nozzle hole, and steps S404 to S405 are repeated.
  • steps S403 and S404 are executed to determine the nozzle N for sucking the component C and the suction position of the component C by the nozzle N. Further, if there is a nozzle N having a smaller nozzle hole for the nozzle N that sucks the component C, the nozzle N is changed and steps S404 to S405 are repeated to extract a plurality of nozzles N that can be sucked.
  • the nozzle N having the largest nozzle hole for which the suction is stable may be selected from the nozzles N extracted so that the suction is possible, or the balance with the nozzle N used for suction of the other component C is balanced.
  • the nozzle N may be selected so as to suppress the time loss such as reducing the number of times the nozzle N is replaced.
  • the packing style of the component C supplied to the component supply position 832 cannot be determined from the three-dimensional measurement result R, so it is tentatively determined. In this way, the component adsorption information Ica is calculated.
  • step S114 of FIG. 5 the order of mounting the plurality of components C required for the production of the completed substrate Bc on the substrate B is calculated. Specifically, the time required to complete the mounting of the plurality of components C while changing the mounting order of the plurality of components C on the substrate B, that is, the production time of the completed substrate Bc is predicted. Then, the mounting order that minimizes the production time is calculated.
  • FIG. 11 is a diagram showing an example of the positional relationship between the nozzle and the component considered in the calculation of the mounting order.
  • FIG. 11 shows an example in which two parts C1 and C2 having different heights are mounted adjacent to each other, and the order in which the parts C1 lower than the parts C2 are mounted after the parts C2 are mounted on the board B is shown. It is shown. In this order, the flange Nf of the nozzle N that attracts the component C1 interferes with the component C2 mounted on the substrate B.
  • the mounting order in which the production time is the shortest is required.
  • the component information Ic, mounting position, mounting angle and polarity of each of the plurality of components C to be mounted on the board B for the production of the completed board Bc, and the mounting order of the plurality of components C are shown.
  • the mounting data Dm is created and transferred from the control device 2 to the component mounting machine 8. Then, the component mounting machine 8 starts mounting the component C on the board B based on the mounting data Dm.
  • FIG. 12 is a flowchart showing an example of a method of checking / correcting the packing style. The flowchart of FIG. 12 is executed by the mounting control unit 81 of the component mounting machine 8.
  • step S501 the component information Ic referred to in the mounting data Dm is read out.
  • step S502 the recognition camera 86 is moved above the component C supplied to the component supply position 832, and the packing shape of the component C is confirmed based on the image of the component C captured by the recognition camera 86.
  • the packing shape of the component C is the angle of the component C at the component supply position 832 in the rotation direction centered on the virtual straight line parallel to the normal line of the substrate B (in other words, the Z direction).
  • the mounting control unit 81 determines whether the angle of the component C supplied to the component supply position 832 by the tape feeder 831 matches the angle of the component C at the component supply position 832 indicated by the mounting data Dm. , The suitability of the mounting data Dm is determined (step S503). When these do not match and the mounting data Dm is inappropriate (when “NO” in step S503), the mounting control unit 81 corrects the mounting data Dm to match them.
  • the present invention is based on the three-dimensional measurement result R which is the measurement result of the shape of the completed substrate Bc having the substrate B and the component C (mounted component C) mounted on the substrate B.
  • the component shape information Ics indicating the shape of the mounted component C is obtained (step S103).
  • the three-dimensional measurement result R is three-dimensional data indicating the three-dimensional shape of the completed substrate Bc. Then, by obtaining the height of the component C from the substrate B based on the three-dimensional data, the component shape information Ics including the height of the component C can be obtained. As a result, it is possible to reduce the burden on the operator required to acquire the height of the component C mounted on the board B and support the creation of the mounting data Dm.
  • the calculation unit 21 estimates the type (part ID) of the mounted component C by referring to the shape of the mounted component C indicated by the component shape information Ics obtained based on the three-dimensional measurement result R (three-dimensional data) (step). S104). In such a configuration, the type of the component C mounted on the substrate B can be accurately estimated based on the three-dimensional measurement result R.
  • the calculation unit 21 mounts the component shape information Ics from the component library Lc in which the shapes of a plurality of registered components C (components C identified by the component IDs) of different types are registered for each registered component C.
  • the type of the mounted component C is estimated based on the result of searching for the registered component C having a shape similar to the shape of the component C as the candidate component C (step S104). In such a configuration, it is possible to accurately estimate the type of component C mounted on the substrate B based on the component library Lc.
  • the calculation unit 21 determines the shape of the mounting component C indicated by the component shape information Ics. It is added to the mounted component information Im in association with the mounted component C (step S108). In such a configuration, when the mounted component C not included in the component library Lc is included in the completed board Bc, this mounted component C can be added to the mounted component information Im.
  • the calculation unit 21 is a component showing the characteristics of the mounted component C in addition to the shape of the mounted component C.
  • the feature information is obtained from the three-dimensional measurement result R (step S106), and the type of the mounted component C is estimated based on the result of searching for one candidate component C having the feature indicated by the component feature information from the plurality of candidate components C. (Step S107).
  • the calculation unit 21 specifies the mounting position on which the component C is mounted on the board B based on the three-dimensional measurement result R (step S110). With such a configuration, it is possible to reduce the burden on the operator required to specify the mounting position of the component C on the substrate B and support the creation of the mounting data Dm.
  • the calculation unit 21 extracts the protruding portion protruding from the substrate B from the three-dimensional measurement result R, specifies that the protruding portion is the component C, and specifies that the position of the protruding portion is the mounting position.
  • the mounting position of the component C on the substrate B can be accurately specified based on the three-dimensional measurement result R.
  • the method of identifying the mounting component C from the two-dimensional image obtained by capturing the completed substrate Bc in a plan view if the contrast is low, the peripheral edge of the component C on the substrate B becomes unclear, and the component C can be accurately identified. It may not be possible to identify.
  • the method of extracting the protruding portion from the substrate B from the three-dimensional measurement result R there is an advantage that the component C on the substrate B can be accurately identified.
  • the mounting data Dm indicates a mounting order indicating the order in which the plurality of components C are mounted when the operation of sucking the component C by the nozzle N and mounting the component C on the substrate B is repeated to mount the plurality of components C on the substrate B. Including. Then, the calculation unit 21 determines whether or not there is interference between the nozzle N that attracts one component C1 among the plurality of components C and another component C2 mounted on a substrate B different from the one component C1. The mounting order is determined based on (step S114). Specifically, while changing the mounting order, the presence or absence of interference was predicted based on the mounting positions of these parts C1 and C2 and the heights of these parts C1 and C2 included in the part shape information Ics.
  • the mounting order is determined.
  • the mounting order in which the component C attracted by the nozzle N and heading for the mounting position does not interfere with the component C already mounted on the board B is obtained, and the component C is appropriately mounted on the board B according to this mounting order. Can be implemented in.
  • the calculation unit 21 obtains the mounting angle of the component C from the three-dimensional measurement result R (step S111). With such a configuration, it is possible to reduce the burden on the operator required to specify the mounting angle of the component C and support the creation of the mounting data Dm.
  • the calculation unit 21 obtains the component shape information Ics including the existence range of the upper surface Cu having a uniform height from the substrate B in the mounting component C based on the three-dimensional measurement result R (step S203).
  • the upper surface Cu of the mounting component C can be accurately obtained based on the three-dimensional measurement result R.
  • the calculation unit 21 determines the type of the nozzle N that attracts the component C in order to mount the component C on the substrate B based on the existence range of the upper surface Cu (step S113). With such a configuration, it is possible to reduce the burden on the operator required to determine the nozzle N suitable for adsorbing the upper surface Cu of the component C, and to support the creation of the mounting data Dm.
  • the calculation unit 21 determines the suction position for sucking the component C by the nozzle N in order to mount the component C on the substrate B from the existence range of the upper surface Cu (step S113). With such a configuration, it is possible to reduce the burden on the operator required to determine the suction position of the component C by the nozzle N and support the creation of the mounting data Dm.
  • the mounting data Dm includes the angle of the component C at the component supply position 832.
  • the component mounting machine 8 recognizes the angle of the component C supplied to the component supply position 832 by the tape feeder 831, and the result is the angle of the component C at the component supply position 832 included in the mounting data Dm. It is determined whether they match, and the suitability of the mounting data Dm is determined (steps S501 to S503). In such a configuration, the component mounting machine 8 can confirm the suitability of the angle of the component C at the component supply position 832 indicated by the mounting data Dm.
  • the component mounting machine 8 determines that the mounting data Dm is inappropriate, the component mounting machine 8 corrects the mounting data Dm.
  • the component C can be appropriately mounted on the substrate B based on the modified mounting data Dm.
  • control device 2 corresponds to an example of the "mounting data creation support device” and the “calculation device” of the present invention
  • the component mounting machine 8 corresponds to an example of the “component mounting machine” of the present invention.
  • the control device 2 and the component mounting machine 8 constitute the "component mounting system” of the present invention
  • the calculation unit 21 corresponds to an example of the "calculation unit” of the present invention
  • the communication unit 24 is the "acquisition” of the present invention.
  • the mounting data Dm corresponds to an example of the "mounting data” of the present invention
  • the substrate B corresponds to an example of the "board” of the present invention
  • the completed substrate Bc corresponds to the "completed substrate” of the present invention.
  • the upper surface Cu corresponds to an example of the "upper surface” of the present invention
  • the three-dimensional measurement result R corresponds to the "completed substrate information" of the present invention
  • the parts library Lc corresponds to an example of the "parts library” of the present invention
  • the nozzle N corresponds to an example of the "nozzle” of the present invention
  • the part feature information is the present.
  • the mounting position corresponds to an example of the "mounting position” of the present invention
  • the mounting order corresponds to an example of the "mounting order” of the present invention
  • the mounting angle corresponds to the present invention.
  • the suction position corresponds to an example of the "suction position" of the present invention.
  • the present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention.
  • the measurement result acquired by the control device 2 in step S102 is not limited to the three-dimensional measurement result R. Therefore, the control device 2 acquires the two-dimensional data indicating the two-dimensional shape of the completed substrate Bc acquired from the two-dimensional image of the completed substrate Bc obtained by imaging the completed substrate Bc from the plan view together with the three-dimensional data.
  • the embodiment can be modified.
  • the calculation unit 21 can obtain the component shape information Ics of the component C included in the completed substrate Bc by using the two-dimensional data and the three-dimensional data (completed substrate information) of the completed substrate Bc together. For example, the mounting position of the component C on the substrate B and the width Cw and the length Cl of the component C are extracted from the two-dimensional data, while the height of the component C from the substrate B is extracted from the three-dimensional data. The part shape information Ics may be obtained. Then, the mounting data creation support of FIG. 5 can be executed based on the completed board information including the two-dimensional data and the three-dimensional data. Such a configuration is particularly suitable when two-dimensional data having a clear contrast can be obtained.
  • step S104 the calculation unit 21 estimates the type of the mounting component C by referring to the shape of the mounting component C indicated by the component shape information Ics obtained by using the two-dimensional data together. In such a configuration, it is possible to accurately estimate the type of component C mounted on the substrate B by also using two-dimensional data.
  • the specification of the component C in step S104 can be performed without using the component library Lc. That is, a component list showing the shapes of a plurality of target components C of different types mounted on the substrate B for the production of the completed substrate Bc may be obtained for each target component C.
  • the calculation unit 21 selects the target component C having a shape similar to the shape of the mounting component C indicated by the component shape information Ics extracted from the three-dimensional measurement result R in step S103 as a candidate component from the component list.
  • the type of mounting component C can be estimated based on the result of searching as C. With such a configuration, it is possible to accurately estimate the type of component C mounted on the substrate B based on the component list.
  • Step S108 may be modified.
  • the mounted component C when the mounted component C not included in the component list is included in the completed board Bc, the mounted component C can be added to the mounted component information Im.
  • the parts list and the parts library Lc may be used together. Specifically, when there is no candidate component C corresponding to the component list, the candidate component C may be searched from the component library Lc.
  • step S106 if the component feature information related to the component C included in the completed substrate Bc cannot be extracted from the three-dimensional measurement result R, the operator may be notified of the input of the component feature information.
  • the substrate B is provided with a fiducial mark (mark) indicating the position. Therefore, the calculation unit 21 can specify the mounting position with reference to this mark attached to the substrate B.
  • the position of the fiducial mark may be specified based on the above-mentioned three-dimensional data or may be specified based on the above-mentioned two-dimensional data.
  • step S115 the mounting control unit 81 automatically corrects the mounting data Dm.
  • the mounting control unit 81 may notify the operator of the correction of the mounting data Dm using, for example, a UI such as a display. .. With such a configuration, the operator can accurately grasp that the mounting data Dm needs to be modified.
  • the mounting control unit 81 may notify the operator of the modified content of the mounting data Dm by the UI. With such a configuration, it is possible to reduce the burden on the operator required for modifying the mounting data Dm and support the creation of the mounting data Dm.
  • the visual inspection machine 6 corresponds to an example of the "visual inspection machine" of the present invention.
  • the method for measuring the three-dimensional shape of the completed substrate Bc is not limited to the phase shift method, and for example, stereo matching may be used.
  • Control device mounting data creation support device, arithmetic unit, component mounting system
  • Calculation unit 24
  • Communication unit acquisition unit
  • 8 Parts mounting machine (parts mounting system)
  • B Board
  • Bc Completed board
  • C Parts Cu
  • Top surface Dm
  • Mounting data Lc Parts library
  • Nozzle R Three-dimensional measurement results (completed board information, three-dimensional data)

Abstract

Component shape information Ics indicating the shape of a substrate B is acquired on the basis of a three-dimensional measurement result R which is a measurement result on the shape of a complete substrate Bc having the substrate B and a component C mounted on the substrate B (step S103). In this case, the three-dimensional measurement result R is three-dimensional data indicating the three-dimensional shape of the complete substrate Bc. The component shape information Ics including the height of the substrate B is acquired by calculating, on the basis of the three-dimensional data, the height of the component C from the substrate B. Thus, the burden on an operator in acquiring the height of the component C mounted on the substrate B can be reduced, and generation of mounting data Dm can be assisted.

Description

実装データ作成支援装置、実装データ作成支援方法、外観検査機、部品実装システムMounting data creation support device, mounting data creation support method, visual inspection machine, component mounting system
　この発明は、部品を基板に実装する手順を示す実装データの作成を支援する技術に関する。 The present invention relates to a technique for supporting the creation of mounting data indicating a procedure for mounting a component on a board.
　部品実装機は、フィーダーにより供給した部品を実装ヘッドによって基板に移載することで、基板に部品を実装した完成基板を生産する。また、特許文献１に示されるように、部品実装機は、実装データが示す手順に従って基板に部品を実装し、この実装データの作成には部品の形状に関する情報が必要となる。 The component mounting machine produces a completed board in which the components are mounted on the board by transferring the components supplied by the feeder to the board by the mounting head. Further, as shown in Patent Document 1, the component mounting machine mounts a component on a substrate according to a procedure indicated by the mounting data, and information on the shape of the component is required to create the mounting data.
特許第３７７３９８５号公報Japanese Patent No. 3773985
　ところで、部品実装機を用いて完成基板を生産する作業者においては、詳細な部品の形状データの提供を必ずしも受けることができず、部品が実装された基板のみを提示されて、これと同一の完成基板を生産するように依頼される場合がある。かかる場合、完成基板の生産に用いられる、部品の形状を示す部品形状情報を作業者において作成する必要がある。この際、平面視における二次元的な部品の形状は、例えば上方から撮像した画像に対してエッジ検出等の画像処理を施すことで取得できる。しかしながら、部品の高さを取得することは必ずしも容易ではなく、実装データの作成に要する作業者の負担が大きかった。 By the way, a worker who produces a finished board using a component mounting machine cannot always receive detailed component shape data, and is presented with only a board on which components are mounted, which is the same as this. You may be asked to produce a finished board. In such a case, it is necessary for the operator to create component shape information indicating the shape of the component used in the production of the finished substrate. At this time, the shape of the two-dimensional component in the plan view can be obtained by performing image processing such as edge detection on the image captured from above, for example. However, it is not always easy to obtain the height of the component, and the burden on the operator required to create the mounting data is heavy.
　この発明は上記課題に鑑みなされたものであり、基板に実装された部品の高さの取得に要する作業者の負担を軽減して、実装データの作成を支援する技術の提供を目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique for supporting the creation of mounting data by reducing the burden on the operator required to acquire the height of the parts mounted on the board.
　本発明に係る実装データ作成支援装置は、基板に部品を実装する手順を示す実装データの作成を支援する実装データ作成支援装置であって、基板と基板に実装された部品とを有する完成基板の形状の計測結果を含む完成基板情報として取得する取得部と、部品の形状を示す部品形状情報を完成基板情報に基づき求める演算部とを備え、完成基板情報は、完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、三次元データを少なくとも含み、演算部は、基板からの部品の高さを三次元データに基づき求めることで、部品の高さを含む部品形状情報を求める。 The mounting data creation support device according to the present invention is a mounting data creation support device that supports the creation of mounting data indicating a procedure for mounting components on a board, and is a completed board having a board and parts mounted on the board. It is equipped with an acquisition unit that acquires the completed board information including the shape measurement result and a calculation unit that obtains the component shape information indicating the shape of the component based on the completed board information. The completed board information indicates the three-dimensional shape of the completed board. Of the three-dimensional data and the two-dimensional data indicating the two-dimensional shape, at least the three-dimensional data is included, and the arithmetic unit obtains the height of the component from the board based on the three-dimensional data, so that the component including the height of the component is included. Obtain shape information.
　本発明に係る実装データ作成支援方法は、基板に部品を実装する手順を示す実装データの作成を支援する実装データ作成支援方法であって、基板と基板に実装された部品とを有する完成基板の形状の計測結果を完成基板情報として取得する工程と、部品の形状を示す部品形状情報を完成基板情報に基づき求める工程とを備え、完成基板情報は、完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、三次元データを少なくとも含み、基板からの部品の高さが三次元データに基づき求められて、部品の高さを含む部品形状情報が求められる。 The mounting data creation support method according to the present invention is a mounting data creation support method that supports the creation of mounting data indicating a procedure for mounting components on a board, and is a completed board having a board and components mounted on the board. It includes a process of acquiring the shape measurement result as completed board information and a process of obtaining part shape information indicating the shape of the part based on the completed board information. The completed board information is three-dimensional data indicating the three-dimensional shape of the completed board. Of the two-dimensional data indicating the two-dimensional shape, at least the three-dimensional data is included, the height of the component from the substrate is obtained based on the three-dimensional data, and the component shape information including the height of the component is obtained.
　本発明に係る外観検査機は、基板と基板に実装された部品とを有する完成基板の形状を少なくとも示す完成基板情報を、完成基板の形状を計測することで求める形状計測部と、部品の形状を示す部品形状情報を完成基板情報に基づき求める演算部とを備え、完成基板情報は、完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、三次元データを少なくとも含み、演算部は、基板からの部品の高さを三次元データに基づき求めることで、部品の高さを含む部品形状情報を求める。 The visual inspection machine according to the present invention has a shape measuring unit for obtaining at least completed board information indicating the shape of a finished board having a board and a component mounted on the board by measuring the shape of the finished board, and a shape of the part. It is provided with a calculation unit that obtains the component shape information indicating the component shape information based on the completed board information, and the completed board information is the three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed board and the two-dimensional data indicating the two-dimensional shape. At least including, the calculation unit obtains the component shape information including the height of the component by obtaining the height of the component from the board based on the three-dimensional data.
　本発明に係る部品実装システムは、基板と基板に実装された部品とを有する完成基板の形状の計測結果を含む完成基板情報に基づき、部品の形状を示す部品形状情報を求める演算装置と、フィーダーにより部品供給位置に供給した部品を実装ヘッドにより保持して基板に移載する動作を実行する部品実装機とを備え、完成基板情報は、完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、三次元データを少なくとも含み、演算装置は、基板からの部品の高さを三次元データに基づき求めることで、部品の高さを含む部品形状情報を求め、部品実装機は、部品形状情報を含む実装データが示す手順に従って、基板に部品を実装する。 The component mounting system according to the present invention is a computing device and a feeder that obtains component shape information indicating the shape of a component based on completed board information including a measurement result of the shape of a completed substrate having a substrate and a component mounted on the substrate. It is equipped with a component mounting machine that holds the components supplied to the component supply position by the mounting head and transfers them to the board, and the completed board information includes three-dimensional data indicating the three-dimensional shape of the finished board and two dimensions. Of the two-dimensional data indicating the shape, at least three-dimensional data is included, and the arithmetic unit obtains the part shape information including the height of the part by obtaining the height of the part from the board based on the three-dimensional data. The mounting machine mounts the component on the board according to the procedure indicated by the mounting data including the component shape information.
　このように構成された本発明（実装データ作成支援装置、実装データ作成支援方法、外観検査機、部品実装システム）では、基板と基板に実装された部品とを有する完成基板の形状の計測結果を含む完成基板情報に基づき、部品の形状を示す部品形状情報が求められる。この際、完成基板情報は、完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、三次元データを少なくとも含む。そして、基板からの部品の高さを三次元データに基づき求めることで、部品の高さを含む部品形状情報が求められる。これによって、基板に実装された部品の高さの取得に要する作業者の負担を軽減して、実装データの作成を支援することが可能となっている。 In the present invention (mounting data creation support device, mounting data creation support method, visual inspection machine, component mounting system) configured in this way, the measurement result of the shape of the completed substrate having the substrate and the components mounted on the substrate is measured. Based on the completed board information including, component shape information indicating the shape of the component is required. At this time, the completed substrate information includes at least three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed substrate and the two-dimensional data indicating the two-dimensional shape. Then, by obtaining the height of the component from the substrate based on the three-dimensional data, the component shape information including the height of the component can be obtained. This makes it possible to reduce the burden on the operator required to acquire the height of the parts mounted on the board and support the creation of mounting data.
　また、演算部は、三次元データに基づき求めた部品形状情報が示す部品の形状を参照して部品の種類を推定するように、実装データ作成支援装置を構成しても良い。かかる構成では、三次元データに基づき、部品の種類を的確に推定することが可能となる。 Further, the arithmetic unit may configure the mounting data creation support device so as to estimate the type of the part by referring to the shape of the part indicated by the part shape information obtained based on the three-dimensional data. With such a configuration, it is possible to accurately estimate the type of parts based on the three-dimensional data.
　また、完成基板情報は、二次元データも含み、演算部は、二次元データを併用して求めた部品形状情報が示す部品の形状を参照して部品の種類を推定するように、実装データ作成支援装置を構成しても良い。かかる構成では、二次元データも併用して、部品の種類を的確に推定することが可能となる。 In addition, the completed board information includes two-dimensional data, and the calculation unit creates mounting data so that the component type is estimated by referring to the component shape indicated by the component shape information obtained by using the two-dimensional data together. A support device may be configured. In such a configuration, it is possible to accurately estimate the type of parts by also using two-dimensional data.
　また、演算部は、種類の異なる複数の登録部品の形状が登録部品ごとに登録された部品ライブラリのうちから、部品形状情報が示す部品の形状に類似する形状を有する登録部品を候補部品として探索した結果に基づき、部品の種類を推定するように、実装データ作成支援装置を構成しても良い。かかる構成では、部品ライブラリに基づき、部品の種類を的確に推定することが可能となる。 Further, the arithmetic unit searches for a registered part having a shape similar to the shape of the part indicated by the part shape information as a candidate part from the parts library in which the shapes of a plurality of registered parts of different types are registered for each registered part. The mounting data creation support device may be configured so as to estimate the type of the component based on the result. In such a configuration, it is possible to accurately estimate the type of parts based on the parts library.
　また、演算部は、部品ライブラリのうちから候補部品を探索できない場合には、部品形状情報が示す部品の形状を部品と関連付けて、完成基板において基板に実装される部品に関する実装部品情報に追加するように、実装データ作成支援装置を構成しても良い。かかる構成では、部品ライブラリに無い部品が完成基板に含まれる場合には、この部品を実装部品情報に追加することができる。 If the calculation unit cannot search for a candidate component from the component library, the arithmetic unit associates the component shape indicated by the component shape information with the component and adds it to the mounted component information regarding the component mounted on the board on the completed board. As described above, the mounting data creation support device may be configured. In such a configuration, when the completed board contains a component that is not in the component library, this component can be added to the mounted component information.
　また、演算部は、完成基板の生産のために基板に実装される種類の異なる複数の対象部品の形状を対象部品ごとに示す部品リストのうちから、部品形状情報が示す部品の形状に類似する形状を有する対象部品を候補部品として探索した結果に基づき、部品の種類を推定するように、実装データ作成支援装置を構成しても良い。かかる構成では、部品リストに基づき、部品の種類を的確に推定することが可能となる。 Further, the arithmetic unit resembles the shape of the part indicated by the part shape information from the parts list showing the shape of a plurality of different types of target parts mounted on the board for the production of the completed board for each target part. The mounting data creation support device may be configured so as to estimate the type of the component based on the result of searching for the target component having a shape as a candidate component. With such a configuration, it is possible to accurately estimate the type of parts based on the parts list.
　また、演算部は、複数の候補部品が探索された場合には、部品の形状以外に部品の特徴を示す部品特徴情報を完成基板情報から求め、複数の候補部品のうちから部品特徴情報が示す特徴を有する一の候補部品を探索した結果に基づき、部品の種類を推定するように、実装データ作成支援装置を構成しても良い。かかる構成では、部品の形状以外の部品の特徴に基づき、部品の種類を的確に推定することが可能となる。 Further, when a plurality of candidate parts are searched, the arithmetic unit obtains component feature information indicating the features of the component in addition to the shape of the component from the completed board information, and the component feature information indicates from the plurality of candidate components. The mounting data creation support device may be configured so as to estimate the type of the component based on the result of searching for one candidate component having a feature. With such a configuration, it is possible to accurately estimate the type of the part based on the characteristics of the part other than the shape of the part.
　また、演算部は、完成基板情報に含まれる三次元データから、基板から突出した突出部分を抽出して、突出部分が部品である特定するとともに、突出部分の位置が実装位置であると特定するように、実装データ作成支援装置を構成しても良い。かかる構成では、三次元データに基づき、部品の実装位置を的確に特定することができ、部品の実装位置の特定に要する作業者の負担を軽減して、実装データの作成を支援することが可能となっている。 In addition, the calculation unit extracts the protruding portion protruding from the board from the three-dimensional data included in the completed board information, identifies the protruding portion as a component, and identifies the position of the protruding portion as the mounting position. As described above, the mounting data creation support device may be configured. In such a configuration, the mounting position of the component can be accurately specified based on the three-dimensional data, the burden on the operator required to specify the mounting position of the component can be reduced, and the creation of the mounting data can be supported. It has become.
　また、演算部は、基板に付されたマークを基準に実装位置を特定するように、実装データ作成支援装置を構成しても良い。かかる構成では、基板に付されたマークを基準に部品の実装位置を特定することができる。 Further, the arithmetic unit may configure the mounting data creation support device so as to specify the mounting position based on the mark attached to the board. In such a configuration, the mounting position of the component can be specified with reference to the mark attached to the substrate.
　また、演算部は、基板の法線に平行な仮想直線を中心とする回転方向における部品の実装角度を、完成基板情報から求めるように、実装データ作成支援装置を構成しても良い。かかる構成では、部品の実装角度の特定に要する作業者の負担を軽減して、実装データの作成を支援することが可能となっている。 Further, the arithmetic unit may configure a mounting data creation support device so that the mounting angle of the component in the rotation direction centered on the virtual straight line parallel to the normal of the board can be obtained from the completed board information. With such a configuration, it is possible to reduce the burden on the operator required to specify the mounting angle of the component and support the creation of mounting data.
　また、演算部は、部品における基板からの高さが均一な上面の存在範囲を含む部品形状情報を三次元データに基づき求めるように、実装データ作成支援装置を構成しても良い。かかる構成では、三次元データに基づき、部品の上面を的確に求めることができる。 Further, the arithmetic unit may configure the mounting data creation support device so as to obtain the component shape information including the existence range of the upper surface of the component having a uniform height from the substrate based on the three-dimensional data. In such a configuration, the upper surface of the component can be accurately obtained based on the three-dimensional data.
　また、演算部は、部品を基板に実装するために部品を吸着するノズルの種類を上面の存在範囲に基づき決定するように、実装データ作成支援装置を構成しても良い。かかる構成では、部品の上面を吸着するのに適したノズルの決定に要する作業者の負担を軽減して、実装データの作成を支援することが可能となっている。 Further, the arithmetic unit may configure a mounting data creation support device so as to determine the type of nozzle for sucking the component in order to mount the component on the substrate based on the existence range of the upper surface. With such a configuration, it is possible to reduce the burden on the operator required to determine a nozzle suitable for adsorbing the upper surface of the component, and to support the creation of mounting data.
　また、演算部は、部品を基板に実装するために部品をノズルにより吸着する吸着位置を上面の存在範囲のうちから決定するように、実装データ作成支援装置を構成しても良い。かかる構成では、ノズルによる部品の吸着位置の決定に要する作業者の負担を軽減して、実装データの作成を支援することが可能となっている。 Further, the arithmetic unit may configure the mounting data creation support device so as to determine the suction position for sucking the component by the nozzle in order to mount the component on the substrate from the existing range on the upper surface. With such a configuration, it is possible to reduce the burden on the operator required to determine the suction position of the component by the nozzle and support the creation of mounting data.
　また、実装データは、基板の法線に平行な仮想直線を中心とする回転方向における部品供給位置での部品の角度を含み、部品実装機は、フィーダーにより供給される部品の角度を認識した結果が、実装データに含まれる部品供給位置での部品の角度と一致するかを判断して、実装データの適否を判定するように、部品実装システムを構成しても良い。かかる構成では、実装データが示す、部品供給位置に供給される部品の角度の適否を部品実装機において確認することができる。 Further, the mounting data includes the angle of the component at the component supply position in the rotation direction centered on the virtual straight line parallel to the normal line of the board, and the component mounting machine recognizes the angle of the component supplied by the feeder. However, the component mounting system may be configured so as to determine whether or not it matches the angle of the component at the component supply position included in the mounting data and determine the suitability of the mounting data. In such a configuration, the suitability of the angle of the component supplied to the component supply position indicated by the mounting data can be confirmed by the component mounting machine.
　また、部品実装機は、実装データが不適切であると判定すると、実装データを修正するように、部品実装システムを構成しても良い。かかる構成では、修正された実装データに基づき、基板に部品を適切に実装することができる。 Further, the component mounting machine may configure the component mounting system so as to correct the mounting data when it determines that the mounting data is inappropriate. In such a configuration, components can be appropriately mounted on the board based on the modified mounting data.
　本発明によれば、基板に実装された部品の高さの取得に要する作業者の負担を軽減して、実装データの作成を支援することが可能となる。 According to the present invention, it is possible to reduce the burden on the operator required to acquire the height of the parts mounted on the board and support the creation of mounting data.
本発明に係る実装データ作成支援装置の一例に相当する制御装置を備えた基板生産システムを示すブロック図。The block diagram which shows the substrate production system provided with the control device which corresponds to an example of the mounting data creation support device which concerns on this invention. 部品ライブラリの一例を模式的に示す図。The figure which shows an example of the parts library schematically. 外観検査機を模式的に例示するブロック図。The block diagram which schematically exemplifies the appearance inspection machine. 部品実装機の一例を模式的に示す平面図。A plan view schematically showing an example of a component mounting machine. 実装データ作成支援方法の一例を示すフローチャート。A flowchart showing an example of an implementation data creation support method. 実装部品情報の抽出方法の一例を示すフローチャート。A flowchart showing an example of a method for extracting mounting component information. 図６のフローチャートにより抽出される情報の具体例を模式的に示す斜視図。The perspective view which shows the specific example of the information extracted by the flowchart of FIG. 部品の特定方法の一例を示すフローチャート。A flowchart showing an example of a method for identifying a part. 部品吸着情報の算出方法の一例を示すフローチャート。The flowchart which shows an example of the calculation method of the component adsorption information. 部品吸着情報の算出で考慮されるノズルと部品の位置関係の一例を示す図。The figure which shows an example of the positional relationship between a nozzle and a component considered in the calculation of component suction information. 実装順序の算出で考慮されるノズルと部品との位置関係の一例を示す図。The figure which shows an example of the positional relationship between a nozzle and a component considered in the calculation of a mounting order. 荷姿の確認・修正方法の一例を示すフローチャート。A flowchart showing an example of how to check / correct the packing style.
　図１は本発明に係る実装データ作成支援装置の一例に相当する制御装置を備えた基板生産システムを示すブロック図である。この基板生産システム１は、制御装置２、データベース４、外観検査機６および部品実装機８を備える。 FIG. 1 is a block diagram showing a substrate production system provided with a control device corresponding to an example of the mounting data creation support device according to the present invention. The board production system 1 includes a control device 2, a database 4, a visual inspection machine 6, and a component mounting machine 8.
　制御装置２は、例えばパーソナルコンピューターで構成され、演算部２１、記憶部２２、ＵＩ(User Interface)２３および通信部２４を備える。演算部２１は、例えばＣＰＵ（Central Processing Unit）で構成されたプロセッサーであり、制御装置２での演算を担う。記憶部２２は例えばＨＤＤ(Hard Disk Drive)で構成され、制御装置２での演算で用いられる各種のデータを記憶する。具体的には、後に詳述するように、外観検査機６で完成基板Ｂｃの三次元形状を計測することで得られる三次元計測結果Ｒや、完成基板Ｂｃにおいて基板Ｂに実装された部品Ｃに関する実装部品情報Ｉｍや、部品実装機８での部品実装の手順を示す実装データＤｍが記憶部２２に記憶される。ＵＩ２３は、例えばタッチパネルディスプレイにより構成され、作業者からの入力操作を受け付けり、作業者へ情報を提示したりする。通信部２４は、外部のデータベース４、外観検査機６および部品実装機８との通信を担う。 The control device 2 is composed of, for example, a personal computer, and includes a calculation unit 21, a storage unit 22, a UI (User Interface) 23, and a communication unit 24. The calculation unit 21 is, for example, a processor composed of a CPU (Central Processing Unit), and is responsible for calculation by the control device 2. The storage unit 22 is composed of, for example, an HDD (Hard Disk Drive), and stores various data used in calculations by the control device 2. Specifically, as will be described in detail later, the three-dimensional measurement result R obtained by measuring the three-dimensional shape of the completed substrate Bc with the visual inspection machine 6 and the component C mounted on the substrate B in the completed substrate Bc. The mounting component information Im and the mounting data Dm indicating the procedure for mounting the component on the component mounting machine 8 are stored in the storage unit 22. The UI 23 is composed of, for example, a touch panel display, accepts input operations from the operator, and presents information to the operator. The communication unit 24 is responsible for communication with the external database 4, the visual inspection machine 6, and the component mounting machine 8.
　データベース４は、部品実装機８で実装される部品Ｃに関する部品情報Ｉｃを部品Ｃごとに示す部品ライブラリＬｃを記憶する。図２は部品ライブラリの一例を模式的に示す図である。部品ライブラリＬｃでは、種類の異なる複数の部品Ｃが部品ＩＤで識別されており、部品ＩＤで識別される部品Ｃの部品情報Ｉｃが関連付けられている。部品情報Ｉｃは、対応する部品ＩＤで識別される部品Ｃの部品形状情報Ｉｃｓおよび部品吸着情報Ｉｃａ等を含む。部品形状情報Ｉｃｓは、部品Ｃのパッケージおよびサイズ（長さ、幅、高さ）を示し、部品吸着情報Ｉｃａは、部品実装機８において部品Ｃを吸着するノズル、部品Ｃを供給する際の部品Ｃの荷姿（回転角度）およびノズルにより部品Ｃを吸着する吸着位置を示す。なお、実装部品情報Ｉｍは、完成基板Ｂｃにおいて基板Ｂに実装される部品Ｃの部品情報Ｉｃに相当し、実装部品情報Ｉｍに含まれる部品形状方法Ｉｃｓは部品ライブラリＬｃを参照して入力された情報である。 The database 4 stores a component library Lc that indicates component information Ic related to component C mounted on the component mounting machine 8 for each component C. FIG. 2 is a diagram schematically showing an example of a parts library. In the part library Lc, a plurality of parts C of different types are identified by the part ID, and the part information Ic of the part C identified by the part ID is associated with the part C. The component information Ic includes the component shape information Ics of the component C identified by the corresponding component ID, the component adsorption information Ica, and the like. The component shape information Ics indicates the package and size (length, width, height) of the component C, and the component suction information Ica is a nozzle for sucking the component C in the component mounting machine 8 and a component for supplying the component C. The packing shape (rotation angle) of C and the suction position where the component C is sucked by the nozzle are shown. The mounted component information Im corresponds to the component information Ic of the component C mounted on the substrate B in the completed substrate Bc, and the component shape method Ics included in the mounted component information Im is input with reference to the component library Lc. Information.
　図３は外観検査機を模式的に例示するブロック図である。同図では、鉛直方向に平行なＺ方向、水平方向に平行なＸ方向およびＹ方向で構成されるＸＹＺ直交座標を適宜示す。図３の外観検査機６は、搬送コンベア６１、検査ヘッド６２および駆動機構６３を検査制御部６４によって制御することで、基板Ｂ（プリント基板）と基板Ｂに実装された部品Ｃ（「実装部品Ｃ」と適宜称する）とを有する完成基板Ｂｃの形状を計測する。 FIG. 3 is a block diagram schematically illustrating a visual inspection machine. In the figure, XYZ Cartesian coordinates composed of the Z direction parallel to the vertical direction, the X direction parallel to the horizontal direction, and the Y direction are appropriately shown. The visual inspection machine 6 of FIG. 3 controls the conveyor 61, the inspection head 62, and the drive mechanism 63 by the inspection control unit 64, thereby mounting the substrate B (printed circuit board) and the component C mounted on the substrate B (“mounting component”). The shape of the completed substrate Bc having "C" as appropriate) is measured.
　搬送コンベア６１は、完成基板Ｂｃを所定の搬送経路に沿って搬送する。具体的には、搬送コンベア６１は、形状計測前の完成基板Ｂｃを外観検査機６内の検査位置に搬入し、完成基板Ｂｃを検査位置で水平に保持する。こうして、部品Ｃが実装された基板Ｂの主面（上面）が上方へ向いた状態で、完成基板Ｂｃが固定される。また、検査位置における完成基板Ｂｃの形状計測が終了すると、搬送コンベア６１は、形状計測後の完成基板Ｂｃを外観検査機６の外へ搬出する。 The transport conveyor 61 transports the completed substrate Bc along a predetermined transport path. Specifically, the conveyor 61 carries the completed substrate Bc before shape measurement to the inspection position in the visual inspection machine 6 and holds the completed substrate Bc horizontally at the inspection position. In this way, the completed substrate Bc is fixed in a state where the main surface (upper surface) of the substrate B on which the component C is mounted faces upward. Further, when the shape measurement of the completed substrate Bc at the inspection position is completed, the conveyor 61 carries out the completed substrate Bc after the shape measurement to the outside of the visual inspection machine 6.
　検査ヘッド６２は、撮像視野Ｖ内を上方から撮像する撮像カメラ６２１を有しており、検査位置に搬入された完成基板Ｂｃの一部を撮像視野Ｖに収めて撮像カメラ６２１によって撮像する。さらに、検査ヘッド６２は、光強度分布が正弦波状に変化する縞状のパターン光を撮像視野Ｖに投影するプロジェクター６２４を有する。プロジェクター６２４は、ＬＥＤ(Light Emitting Diode)等の光源と、光源からの光を撮像視野Ｖへ向けて反射するデジタル・マイクロミラー・デバイスとを有している。かかるプロジェクター６２４は、デジタル・マイクロミラー・デバイスの各マイクロミラーの角度を調整することで、互いに位相の異なる複数のパターン光を撮像視野Ｖに投影できる。つまり、検査ヘッド６２は、プロジェクター６２４から投影するパターン光の位相を変化させながら撮像カメラ６２１により撮像を行って、位相シフト法によって撮像視野Ｖ内の完成基板Ｂｃの三次元画像を取得することで、三次元形状を計測することができる。 The inspection head 62 has an imaging camera 621 that images the inside of the imaging field of view V from above, and a part of the completed substrate Bc carried into the inspection position is stored in the imaging field of view V and imaged by the imaging camera 621. Further, the inspection head 62 has a projector 624 that projects a striped pattern light whose light intensity distribution changes in a sinusoidal manner onto an imaging field of view V. The projector 624 has a light source such as an LED (Light Emitting Diode) and a digital micromirror device that reflects the light from the light source toward the imaging field V. By adjusting the angle of each micromirror of the digital micromirror device, the projector 624 can project a plurality of pattern lights having different phases to the imaging field of view V. That is, the inspection head 62 takes an image with the imaging camera 621 while changing the phase of the pattern light projected from the projector 624, and acquires a three-dimensional image of the completed substrate Bc in the imaging field of view V by the phase shift method. , Three-dimensional shape can be measured.
　ちなみに、検査ヘッド６２は、８個のプロジェクター６２４を有している（図３では、図示を簡便化するために２個のプロジェクター６２４が代表して示されている）。８個のプロジェクター６２４は、撮像カメラ６２１の周囲を囲むように配置されており、鉛直方向Ｚを中心として円周状に等ピッチで並ぶ。そして、各プロジェクター６２４は、撮像カメラ６２１の撮像視野Ｖに対して斜め上方からパターン光を投影する。したがって、複数の方プロジェクター６２４のうち、部品Ｃとの位置関係が適切な一のプロジェクター６２４から、撮像視野Ｖにパターン光を投影することができる。 By the way, the inspection head 62 has eight projectors 624 (in FIG. 3, two projectors 624 are represented as representatives for simplification of illustration). The eight projectors 624 are arranged so as to surround the periphery of the image pickup camera 621, and are arranged at equal pitches in a circumferential shape centered on the vertical direction Z. Then, each projector 624 projects the pattern light from diagonally above with respect to the imaging field of view V of the imaging camera 621. Therefore, the pattern light can be projected onto the imaging field of view V from one projector 624 having an appropriate positional relationship with the component C among the plurality of projectors 624.
　駆動機構６３は、検査ヘッド６２を支持しつつ、モーターによって水平方向および鉛直方向へ検査ヘッド６２を駆動させる。この駆動機構６３の駆動によって、検査ヘッド６２は完成基板Ｂｃの上方に移動して、完成基板Ｂｃの一部Ｂを撮像視野Ｖ内に捉えることができ、撮像視野Ｖ内の完成基板Ｂｃの三次元形状を計測できる。 The drive mechanism 63 supports the inspection head 62 and drives the inspection head 62 in the horizontal direction and the vertical direction by a motor. By driving the drive mechanism 63, the inspection head 62 moves above the completed substrate Bc, and a part B of the completed substrate Bc can be captured in the imaging field of view V, and the tertiary of the completed substrate Bc in the imaging field of view V can be captured. The original shape can be measured.
　検査制御部６４は、ＣＰＵで構成されたプロセッサーである演算部６４１を有しており、演算部６４１が装置各部の制御を統括することで、検査が実行される。この検査制御部６４は、プロジェクター６２４を制御する投影制御部６４２、撮像カメラ６２１を制御する撮像制御部６４３、駆動機構６３を制御する駆動制御部６４４、ＨＤＤ等で構成された記憶部６４５および制御装置２の通信部２４と通信を行う通信部６４６を有する。 The inspection control unit 64 has a calculation unit 641 which is a processor composed of a CPU, and the calculation unit 641 controls the control of each unit of the device to execute the inspection. The inspection control unit 64 includes a projection control unit 642 that controls the projector 624, an image pickup control unit 643 that controls the image pickup camera 621, a drive control unit 644 that controls the drive mechanism 63, a storage unit 645 composed of an HDD and the like, and control. It has a communication unit 646 that communicates with the communication unit 24 of the device 2.
　搬送コンベア６１が検査位置に完成基板Ｂｃを搬入すると、演算部６４１は、駆動制御部６４４により駆動機構６３を制御して、完成基板Ｂｃの上方へ検査ヘッド６２を移動させる。これによって、撮像カメラ６２１の撮像視野Ｖ内に完成基板Ｂｃの一部が収まる。　続いて、演算部６４１は、プロジェクター６２４から完成基板Ｂｃの一部Ｂを含む撮像視野Ｖへパターン光を投影しつつ撮像視野Ｖに投影されたパターン光を撮像カメラ６２１により撮像する（パターン撮像動作）。演算部６４１は、パターン光の位相を変更しつつパターン撮像動作を繰り返すことで、位相シフト法により撮像視野Ｖの三次元形状を計測する。かかる形状計測は、撮像視野Ｖを変更しながら完成基板Ｂｃの全体に対して実行される。こうして、完成基板Ｂｃの三次元形状を計測した結果が三次元計測結果Ｒとして記憶部６４５に記憶される。 When the conveyor 61 carries the completed substrate Bc to the inspection position, the calculation unit 641 controls the drive mechanism 63 by the drive control unit 644 to move the inspection head 62 above the completed substrate Bc. As a result, a part of the completed substrate Bc fits within the imaging field of view V of the imaging camera 621. Subsequently, the calculation unit 641 captures the pattern light projected on the imaging field V by the imaging camera 621 while projecting the pattern light from the projector 624 onto the imaging field V including a part B of the completed substrate Bc (pattern imaging operation). ). The calculation unit 641 measures the three-dimensional shape of the imaging field V by the phase shift method by repeating the pattern imaging operation while changing the phase of the pattern light. Such shape measurement is performed on the entire completed substrate Bc while changing the imaging field of view V. In this way, the result of measuring the three-dimensional shape of the completed substrate Bc is stored in the storage unit 645 as the three-dimensional measurement result R.
　図４は部品実装機の一例を模式的に示す平面図である。部品実装機８は、装置全体を統括的に制御する実装制御部８１を備える。実装制御部８１は、演算部８１１、記憶部８１２および通信部８１３を有する。演算部８１１は、ＣＰＵやＲＡＭで構成されたプロセッサーであり、部品実装機８における演算機能を担う。記憶部８１２はＨＤＤ等で構成され、完成基板Ｂｃを生産するために基板Ｂに部品Ｃを実装する手順を示す実装データＤｍ等の各種データを記憶する。通信部８１３は制御装置２の通信部２４と通信を行う。 FIG. 4 is a plan view schematically showing an example of a component mounting machine. The component mounting machine 8 includes a mounting control unit 81 that comprehensively controls the entire device. The mounting control unit 81 includes a calculation unit 811, a storage unit 812, and a communication unit 813. The calculation unit 811 is a processor composed of a CPU and a RAM, and is responsible for a calculation function in the component mounting machine 8. The storage unit 812 is composed of an HDD or the like, and stores various data such as mounting data Dm indicating a procedure for mounting the component C on the board B in order to produce the completed board Bc. The communication unit 813 communicates with the communication unit 24 of the control device 2.
　部品実装機８は、基板ＢをＸ方向（基板搬送方向）に搬送する基板搬送部８２を備える。この基板搬送部８２は、Ｘ方向に並列に配置された一対のコンベア８２１を有し、コンベア８２１によって基板ＢをＸ方向に搬送する。これらコンベア８２１の間隔は、Ｘ方向に直交するＹ方向（幅方向）に変更可能であり、基板搬送部８２は、搬送する基板Ｂの幅に応じてコンベア８２１の間隔を調整する。この基板搬送部８２は、基板搬送方向であるＸ方向の上流側から所定の実装作業位置８２２に基板Ｂを搬入するとともに、実装作業位置８２２で部品Ｃが実装された基板Ｂを実装作業位置８２２からＸ方向の下流側に搬出する。 The component mounting machine 8 includes a board transporting unit 82 that transports the board B in the X direction (board transport direction). The substrate transfer unit 82 has a pair of conveyors 821 arranged in parallel in the X direction, and the substrate B is conveyed in the X direction by the conveyor 821. The distance between the conveyors 821 can be changed in the Y direction (width direction) orthogonal to the X direction, and the substrate transport unit 82 adjusts the distance between the conveyors 821 according to the width of the substrate B to be conveyed. The board transfer unit 82 carries the board B to a predetermined mounting work position 822 from the upstream side in the X direction, which is the board transfer direction, and mounts the board B on which the component C is mounted at the mounting work position 822 at the mounting work position 822. Carry out from to the downstream side in the X direction.
　基板搬送部８２のＹ方向の両側それぞれでは２つの部品供給部８３がＸ方向に並んでおり、各部品供給部８３では、複数のテープフィーダー８３１がＸ方向に並ぶ。部品供給部８３では、Ｘ方向に並ぶ複数の部品供給位置８３２が設けられており、各部品供給位置８３２に供給すべき部品Ｃを供給するテープフィーダー８３１が、各部品供給位置８３２に対応付けられて着脱可能に装着される。各テープフィーダー８３１に対しては、集積回路、トランジスター、コンデンサー等の小片状の部品Ｃを所定間隔おきに収容したキャリアテープが巻き付けられた部品供給リールが配置されており、各テープフィーダー８３１は部品供給リールから引き出されたキャリアテープを間欠的に送り出すことで、その先端部の部品供給位置８３２に部品Ｃを供給する。 Two component supply units 83 are arranged in the X direction on both sides of the board transfer unit 82 in the Y direction, and a plurality of tape feeders 831 are arranged in the X direction in each component supply unit 83. The component supply unit 83 is provided with a plurality of component supply positions 832 arranged in the X direction, and a tape feeder 831 for supplying the component C to be supplied to each component supply position 832 is associated with each component supply position 832. It is attached detachably. For each tape feeder 831, a component supply reel around which a carrier tape containing small pieces C such as integrated circuits, transistors, capacitors, etc. is housed at predetermined intervals is arranged, and each tape feeder 831 has. By intermittently feeding out the carrier tape drawn from the component supply reel, the component C is supplied to the component supply position 832 at the tip thereof.
　また、部品実装機８では、Ｙ方向に延設された一対のＹ軸レール８４１と、Ｙ方向に延設されたＹ軸ボールネジ８４２と、Ｙ軸ボールネジ８４２を回転駆動するＹ軸モーター８４３とが設けられている。そして、Ｘ方向に延設されたＸ軸ビーム８４４が一対のＹ軸レール８４１にＹ方向に移動可能に支持された状態で、Ｙ軸ボールネジ８４２のナットに固定されている。Ｘ軸ビーム８４４には、Ｘ方向に延設されたＸ軸ボールネジ８４５と、Ｘ軸ボールネジ８４５を回転駆動するＸ軸モーター８４６とが取り付けられており、ヘッドユニット８５がＸ軸ビーム８４４にＸ方向に移動可能に支持された状態でＸ軸ボールネジ８４５のナットに固定されている。したがって、実装制御部８１は、Ｙ軸モーター８４３によりＹ軸ボールネジ８４２を回転させてヘッドユニット８５をＹ方向に移動させたり、Ｘ軸モーター８４６によりＸ軸ボールネジ８４５を回転させてヘッドユニット８５をＸ方向に移動させたりすることができる。 Further, in the component mounting machine 8, a pair of Y-axis rails 841 extending in the Y direction, a Y-axis ball screw 842 extending in the Y direction, and a Y-axis motor 843 that rotationally drives the Y-axis ball screw 842 are used. It is provided. Then, the X-axis beam 844 extending in the X direction is fixed to the nut of the Y-axis ball screw 842 in a state of being movably supported by the pair of Y-axis rails 841 in the Y direction. An X-axis ball screw 845 extending in the X direction and an X-axis motor 846 for rotationally driving the X-axis ball screw 845 are attached to the X-axis beam 844, and the head unit 85 is attached to the X-axis beam 844 in the X direction. It is fixed to the nut of the X-axis ball screw 845 in a state where it is movably supported. Therefore, the mounting control unit 81 rotates the Y-axis ball screw 842 by the Y-axis motor 843 to move the head unit 85 in the Y direction, or rotates the X-axis ball screw 845 by the X-axis motor 846 to rotate the head unit 85 to X. It can be moved in a direction.
　ヘッドユニット８５は、Ｘ方向に直線状に並ぶ複数の実装ヘッド８５１を有する。各実装ヘッド８５１は、互いに独立してＺ方向およびＲ方向へ可動である。ここで、Ｒ方向はＺ方向に平行な回転軸を中心に回転する方向である。したがって、実装制御部８１は、Ｚ軸モーター（不図示）により実装ヘッド８５１をＺ方向に昇降させたり、Ｒ軸モーター（不図示）により実装ヘッド８５１をＲ方向に回転させたりすることができる。また、ヘッドユニット８５には、下方を撮像する認識カメラ８６が取り付けられており、認識カメラ８６は、ヘッドユニット８５に伴って移動する。 The head unit 85 has a plurality of mounting heads 851 arranged linearly in the X direction. Each mounting head 851 is movable in the Z direction and the R direction independently of each other. Here, the R direction is a direction of rotation about a rotation axis parallel to the Z direction. Therefore, the mounting control unit 81 can raise and lower the mounting head 851 in the Z direction by the Z-axis motor (not shown), and can rotate the mounting head 851 in the R direction by the R-axis motor (not shown). Further, a recognition camera 86 that captures an image of the lower side is attached to the head unit 85, and the recognition camera 86 moves with the head unit 85.
　ヘッドユニット８５が有する各実装ヘッド８５１は、その下端に取り付けられたノズルＮにより、基板Ｂへの部品Ｃの実装を行う。つまり、実装ヘッド８５１は、その下端のノズルＮを部品供給位置８３２の上方に位置させつつノズルＮを下降させることで、テープフィーダー８３１が部品供給位置８３２に供給する部品ＣにノズルＮを当接させる。そして、実装ヘッド８５１は、ノズルＮ内に負圧を与えてノズルＮにより部品Ｃを吸着すると、ノズルＮを上昇させる。実装ヘッド８５１は、こうして部品供給位置８３２からピックアップした部品ＣをノズルＮによって吸着・保持しつつ、実装作業位置８２２の基板Ｂの上方へ移動する。そして、実装ヘッド８５１は、ノズルＮを下降させて部品Ｃを基板Ｂに接触させると、ノズルＮの負圧を解除して、部品Ｃを基板Ｂに載置する。このように、部品実装機８では、　部品Ｃを供給する部品供給部８３と実装作業位置８２２との間を移動する実装ヘッド８５１を用いて、部品供給部８３からピックアップした部品Ｃを実装作業位置８２２の基板Ｂに移載する部品実装が実行される。なお、この部品実装は、実装制御部８１の制御に基づき、実装データＤｍに規定された手順で実行される。 Each mounting head 851 of the head unit 85 mounts the component C on the substrate B by the nozzle N attached to the lower end thereof. That is, the mounting head 851 abuts the nozzle N on the component C supplied by the tape feeder 831 to the component supply position 832 by lowering the nozzle N while positioning the nozzle N at the lower end thereof above the component supply position 832. Let me. Then, when the mounting head 851 applies a negative pressure to the nozzle N and attracts the component C by the nozzle N, the nozzle N is raised. The mounting head 851 moves above the substrate B at the mounting work position 822 while attracting and holding the component C picked up from the component supply position 832 by the nozzle N. Then, when the mounting head 851 lowers the nozzle N and brings the component C into contact with the substrate B, the negative pressure of the nozzle N is released and the component C is placed on the substrate B. In this way, in the component mounting machine 8, the component C picked up from the component supply unit 83 is mounted at the mounting work position by using the mounting head 851 that moves between the component supply unit 83 that supplies the component C and the mounting work position 822. The component mounting to be transferred to the board B of 822 is executed. Note that this component mounting is executed according to the procedure specified in the mounting data Dm based on the control of the mounting control unit 81.
　こうして部品実装機８で参照される実装データＤｍの作成には、完成基板Ｂｃの生産のために基板Ｂに実装する部品Ｃに関する部品情報Ｉｃが必要となる。そこで、基板生産システム１は、外観検査機６で計測した完成基板Ｂｃの三次元形状（三次元計測結果Ｒ）に基づき、制御装置２が部品情報Ｉｃを求めることで、実装データＤｍの作成を支援する。 In order to create the mounting data Dm referred to by the component mounting machine 8 in this way, the component information Ic related to the component C to be mounted on the substrate B for the production of the completed substrate Bc is required. Therefore, in the substrate production system 1, the control device 2 obtains the component information Ic based on the three-dimensional shape (three-dimensional measurement result R) of the completed substrate Bc measured by the visual inspection machine 6, thereby creating the mounting data Dm. Assist.
　図５は実装データ作成支援方法の一例を示すフローチャートである。このフローチャートのうち、ステップＳ１０１～Ｓ１０２は外観検査機６により実行され、ステップＳ１０３～Ｓ１１４は制御装置２の演算部２１により実行され、ステップＳ１１５は部品実装機８により実行される。 FIG. 5 is a flowchart showing an example of the implementation data creation support method. In this flowchart, steps S101 to S102 are executed by the visual inspection machine 6, steps S103 to S114 are executed by the calculation unit 21 of the control device 2, and steps S115 are executed by the component mounting machine 8.
　ステップＳ１０１では、上述した要領で、外観検査機６が完成基板Ｂｃの三次元形状を計測することで、三次元計測結果Ｒを取得する。この三次元計測結果Ｒは外観検査機６から制御装置２に転送される（ステップＳ１０２）。制御装置２では、通信部２４が外観検査機６から三次元計測結果Ｒを取得すると、記憶部２２が三次元計測結果Ｒを保存するとともに、演算部２１が完成基板Ｂｃに含まれる部品Ｃに関する実装部品情報Ｉｍをこの三次元計測結果Ｒから抽出する（ステップＳ１０３）。 In step S101, the visual inspection machine 6 measures the three-dimensional shape of the completed substrate Bc in the same manner as described above, thereby acquiring the three-dimensional measurement result R. The three-dimensional measurement result R is transferred from the visual inspection machine 6 to the control device 2 (step S102). In the control device 2, when the communication unit 24 acquires the three-dimensional measurement result R from the appearance inspection machine 6, the storage unit 22 stores the three-dimensional measurement result R, and the calculation unit 21 relates to the component C included in the completed board Bc. The mounted component information Im is extracted from the three-dimensional measurement result R (step S103).
　図６は実装部品情報の抽出方法の一例を示すフローチャートであり、図７は図６のフローチャートにより抽出される情報の具体例を模式的に示す斜視図である。図６のフローチャートは、制御装置２の演算部２１により実行される。ステップＳ２０１では、完成基板Ｂｃの高さ情報が完成基板Ｂｃの三次元計測結果Ｒから取得される。この完成基板Ｂｃの高さ情報は、基板Ｂの上面Ｂｕと、当該上面Ｂｕに実装された部品Ｃとで構成された凹凸形状の表面の高さを示す。ここで基板Ｂの上面Ｂｕとは、基板Ｂの両主面のうち、外観検査機６での形状計測の際に上方を向いていた主面である。 FIG. 6 is a flowchart showing an example of a method for extracting mounted component information, and FIG. 7 is a perspective view schematically showing a specific example of the information extracted by the flowchart of FIG. The flowchart of FIG. 6 is executed by the calculation unit 21 of the control device 2. In step S201, the height information of the completed substrate Bc is acquired from the three-dimensional measurement result R of the completed substrate Bc. The height information of the completed substrate Bc indicates the height of the uneven surface formed by the upper surface Bu of the substrate B and the component C mounted on the upper surface Bu. Here, the upper surface Bu of the substrate B is the main surface of both main surfaces of the substrate B that faces upward when the shape is measured by the visual inspection machine 6.
　ステップＳ２０２では、完成基板Ｂｃのうちの基板Ｂの上面Ｂｕ（すなわち、部品Ｃが存在しない、最も高さの低い平面）の高さが、完成基板Ｂｃの高さ情報に基づき推定される（ステップＳ２０２）。そして、基板Ｂの上面Ｂｕより高い部分（換言すれば、基板Ｂの上面Ｂｕから上方へ突出した突出部分）が部品Ｃとして抽出される（ステップＳ２０３）。このステップＳ２０３での部品Ｃの抽出結果に基づき、当該部品Ｃのパッケージの種類、幅Ｃｗ、長さＣｌおよび高さＣｈを少なくとも示す部品形状情報Ｉｃｓが取得される（ステップＳ２０４）。 In step S202, the height of the upper surface Bu (that is, the lowest plane in which the component C does not exist) of the substrate B among the completed substrates Bc is estimated based on the height information of the completed substrate Bc (step). S202). Then, a portion higher than the upper surface Bu of the substrate B (in other words, a protruding portion protruding upward from the upper surface Bu of the substrate B) is extracted as the component C (step S203). Based on the extraction result of the component C in step S203, the component shape information Ics indicating at least the package type, width Cw, length Cl, and height Ch of the component C is acquired (step S204).
　この部品形状情報Ｉｃｓは、完成基板Ｂｃに含まれる全部品Ｃについて取得され、実装部品情報Ｉｍとして記憶部２２に記憶される。そして、続くステップＳ１０４～Ｓ１１３は、当該全部品Ｃのそれぞれについて実行される。ただし、その内容は各部品Ｃで同様であるので、１個の部品Ｃについて説明を行うこととする。 The component shape information Ics is acquired for all the components C included in the completed board Bc, and is stored in the storage unit 22 as the mounted component information Im. Then, the following steps S104 to S113 are executed for each of all the parts C. However, since the contents are the same for each component C, one component C will be described.
　図５のフローチャートに示すように、実装部品情報Ｉｍの抽出が完了すると（ステップＳ１０３）、部品の特定が実行される（ステップＳ１０４）。図８は部品の特定方法の一例を示すフローチャートである。図８のフローチャートは、制御装置２の演算部２１により実行される。ステップＳ３０１では、記憶部２２に記憶された実装部品情報Ｉｍに含まれる部品形状情報Ｉｃｓが読み出される。ステップＳ３０２では、実装部品情報Ｉｍに含まれる部品形状情報Ｉｃｓと、部品ライブラリＬｃに登録されている部品形状情報Ｉｃｓとが照合される。そして、実装部品情報Ｉｍに含まれる部品形状情報Ｉｃｓと所定関係（例えば、サイズの差が所定値未満となる関係）を満たす部品形状情報Ｉｃｓに対応する部品ＩＤの部品Ｃ（候補部品）が候補として選定される（ステップＳ３０３）。 As shown in the flowchart of FIG. 5, when the extraction of the mounted component information Im is completed (step S103), the component identification is executed (step S104). FIG. 8 is a flowchart showing an example of a method for identifying parts. The flowchart of FIG. 8 is executed by the calculation unit 21 of the control device 2. In step S301, the component shape information Ics included in the mounted component information Im stored in the storage unit 22 is read out. In step S302, the component shape information Ics included in the mounted component information Im and the component shape information Ics registered in the component library Lc are collated. Then, the component C (candidate component) of the component ID corresponding to the component shape information Ics that satisfies the predetermined relationship (for example, the relationship that the size difference is less than the predetermined value) with the component shape information Ics included in the mounted component information Im is a candidate. Is selected as (step S303).
　図５のステップＳ１０５では、選定された候補部品Ｃの個数が判断される。候補部品Ｃの個数が１個である場合には、ステップＳ１０６～Ｓ１０８を省略して、ステップＳ１０９に進み、候補部品Ｃの個数がゼロ個である場合には、ステップＳ１０６～Ｓ１０７を省略してステップＳ１０８に進み、候補部品Ｃの個数が複数である場合には、ステップＳ１０６に進む。 In step S105 of FIG. 5, the number of selected candidate parts C is determined. If the number of candidate parts C is one, steps S106 to S108 are omitted, and the process proceeds to step S109. If the number of candidate parts C is zero, steps S106 to S107 are omitted. The process proceeds to step S108, and if the number of candidate parts C is a plurality, the process proceeds to step S106.
　ステップＳ１０６では、部品形状情報Ｉｃｓに含まれない、部品Ｃの特徴を示す部品特徴情報が取得される。この部品特徴情報は、部品Ｃに記載された文字、部品Ｃの色あるいは部品Ｃの実装位置に近接して基板Ｂに記載されるシルクの文字等を含み、部品ＩＤに関連付けて部品ライブラリＬｃに予め登録されている。これに対して、ステップＳ１０６では、完成基板Ｂｃに含まれる部品Ｃに関する部品特徴情報が三次元計測に用いた画像情報（上記の三次元画像）から抽出される。なお、部品Ｃの二次元画像が取得されているような場合には、部品特徴情報を、この二次元画像から抽出してもよい。 In step S106, component feature information indicating the features of component C, which is not included in the component shape information Ics, is acquired. This component feature information includes the characters described in the component C, the color of the component C, the silk characters described on the substrate B in close proximity to the mounting position of the component C, and the like, and is associated with the component ID in the component library Lc. It is registered in advance. On the other hand, in step S106, the component feature information regarding the component C included in the completed substrate Bc is extracted from the image information (the above three-dimensional image) used for the three-dimensional measurement. If a two-dimensional image of the component C has been acquired, component feature information may be extracted from the two-dimensional image.
　ステップＳ１０７では、部品ライブラリＬｃで複数の候補部品Ｃに関連付けられた部品特徴情報のうち、三次元計測結果Ｒから抽出された部品特徴情報に一致する部品特徴情報が探索される。そして、該当する部品特徴情報が存在した場合には、これに関連付けられた部品ＩＤの部品Ｃが、完成基板Ｂｃに含まれる部品Ｃであると確定して（ステップＳ１０７で「ＹＥＳ」）、ステップＳ１０９に進む。 In step S107, among the component feature information associated with the plurality of candidate components C in the component library Lc, the component feature information that matches the component feature information extracted from the three-dimensional measurement result R is searched for. Then, when the corresponding component feature information exists, it is determined that the component C of the component ID associated with the component C is the component C included in the completed board Bc (“YES” in step S107), and the step Proceed to S109.
　一方、該当する部品特徴情報が存在しない場合（ステップＳ１０７で「ＮＯ」の場合）や、ステップＳ１０５で候補部品Ｃの個数がゼロと判断された場合には、ステップＳ１０８が実行される。このステップＳ１０８では、ステップＳ１０３で抽出された実装部品情報Ｉｍが示す部品形状情報Ｉｃｓに基づき、部品情報Ｉｃが新たに作成される。こうして作成された部品情報Ｉｃが対象の完成基板Ｂｃの実装部品情報Ｉｍに追加される。 On the other hand, if the corresponding component feature information does not exist ("NO" in step S107), or if the number of candidate components C is determined to be zero in step S105, step S108 is executed. In this step S108, the component information Ic is newly created based on the component shape information Ics indicated by the mounted component information Im extracted in step S103. The component information Ic thus created is added to the mounting component information Im of the target completed board Bc.
　ステップＳ１０９では、完成基板Ｂｃに含まれる部品Ｃの部品情報Ｉｃが決定される。具体的には、ステップＳ１０５で候補部品Ｃの個数が１個と判断された場合には、当該候補部品Ｃの部品ＩＤに関連付けられた部品情報Ｉｃが、完成基板Ｂｃに含まれる部品Ｃの部品情報Ｉｃであると決定される。ステップＳ１０７で「ＹＥＳ」と判断された場合には、このステップＳ１０７で確定された候補部品Ｃの部品ＩＤに関連付けられた部品情報Ｉｃが、完成基板Ｂｃに含まれる部品Ｃの部品情報Ｉｃであると決定される。また、ステップＳ１０８が実行された場合には、ステップＳ１０８で部品ライブラリＬｃに新規登録された部品情報Ｉｃが、完成基板Ｂｃに含まれる部品Ｃの部品情報Ｉｃであると決定される。 In step S109, the component information Ic of the component C included in the completed substrate Bc is determined. Specifically, when it is determined in step S105 that the number of candidate parts C is one, the part information Ic associated with the part ID of the candidate part C is included in the completed board Bc. It is determined to be information Ic. If "YES" is determined in step S107, the component information Ic associated with the component ID of the candidate component C determined in step S107 is the component information Ic of the component C included in the completed board Bc. Is decided. Further, when step S108 is executed, it is determined that the component information Ic newly registered in the component library Lc in step S108 is the component information Ic of the component C included in the completed board Bc.
　ステップＳ１１０では、ステップＳ１０９で部品情報Ｉｃが決定された部品Ｃの実装位置が、三次元計測結果Ｒに基づき特定される。具体的には、上述と同じ要領で、基板Ｂから突出した突出部分が三次元計測結果Ｒから抽出され、この突出部分の位置が実装位置であると特定される。さらに、ステップＳ１１１では、部品情報Ｉｃが決定された部品Ｃの実装角度および極性の向きが三次元計測結果Ｒに基づき特定される。ここで、実装角度は、基板Ｂの法線（換言すればＺ方向）に平行な仮想直線を中心とする回転方向における、基板Ｂに実装される部品Ｃの角度である。 In step S110, the mounting position of the component C whose component information Ic is determined in step S109 is specified based on the three-dimensional measurement result R. Specifically, in the same manner as described above, the protruding portion protruding from the substrate B is extracted from the three-dimensional measurement result R, and the position of the protruding portion is specified as the mounting position. Further, in step S111, the mounting angle and the direction of the polarity of the component C for which the component information Ic has been determined are specified based on the three-dimensional measurement result R. Here, the mounting angle is the angle of the component C mounted on the board B in the rotation direction centered on the virtual straight line parallel to the normal line of the board B (in other words, the Z direction).
　ステップＳ１１２では、ステップＳ１０９で部品情報Ｉｃが決定された部品Ｃの部品吸着情報Ｉｃａが部品ライブラリＬｃに存在するかが判断される。該当の部品吸着情報Ｉｃａが存在する場合（ステップＳ１１２で「ＹＥＳ」の場合）には、ステップＳ１１３を省略して、ステップＳ１１４に進む。一方、該当の部品吸着情報Ｉｃａが存在しない場合（ステップＳ１１２「ＮＯ」の場合）には、ステップＳ１１３を実行してから、ステップＳ１１４に進む。 In step S112, it is determined whether or not the component adsorption information Ica of the component C whose component information Ic is determined in step S109 exists in the component library Lc. If the corresponding component adsorption information Ica exists (when “YES” in step S112), step S113 is omitted and the process proceeds to step S114. On the other hand, when the corresponding component adsorption information Ica does not exist (in the case of step S112 “NO”), step S113 is executed and then the process proceeds to step S114.
　ステップＳ１１３では、部品情報Ｉｃが決定された部品Ｃの部品吸着情報Ｉｃａが算出される。図９は部品吸着情報の算出方法の一例を示すフローチャートであり、図１０は部品吸着情報の算出で考慮されるノズルと部品の位置関係の一例を示す図である。図９のフローチャートは、制御装置２の演算部２１により実行される。 In step S113, the component adsorption information Ica of the component C for which the component information Ic has been determined is calculated. FIG. 9 is a flowchart showing an example of a method of calculating the component suction information, and FIG. 10 is a diagram showing an example of the positional relationship between the nozzle and the component considered in the calculation of the component suction information. The flowchart of FIG. 9 is executed by the calculation unit 21 of the control device 2.
　ステップＳ４０１では、三次元計測結果Ｒが読み出されて、ステップＳ４０２では、三次元計測結果Ｒのうちから該当部品Ｃの上面Ｃｕが抽出される。部品Ｃの上面Ｃｕは、部品Ｃにおける基板Ｂの上面Ｂｕからの高さが均一な平面の存在範囲を特定することで、抽出される。図１０に示すように、部品Ｃが段差を有する場合には、高さの異なる複数の上面Ｃｕが抽出される。 In step S401, the three-dimensional measurement result R is read out, and in step S402, the upper surface Cu of the corresponding component C is extracted from the three-dimensional measurement result R. The upper surface Cu of the component C is extracted by specifying the existence range of a plane having a uniform height from the upper surface Bu of the substrate B in the component C. As shown in FIG. 10, when the component C has a step, a plurality of upper surface Cu having different heights are extracted.
　ステップＳ４０３では、種類の異なる複数のノズルＮのうち、最大のノズル孔を有するノズルＮで部品Ｃを吸着すると仮に決定する。ステップＳ４０４では、このノズルＮによる部品Ｃの吸着位置が、上面Ｃｕ内から探索される。この際、ノズルＮの吸着孔と上面Ｃｕとの位置関係や、ノズルＮのフランジＮｆと部品Ｃの段差等との干渉等を確認して、条件に合う吸着位置が探索される。 In step S403, it is tentatively determined that the component C is adsorbed by the nozzle N having the largest nozzle hole among the plurality of nozzles N of different types. In step S404, the suction position of the component C by the nozzle N is searched from inside the upper surface Cu. At this time, the positional relationship between the suction hole of the nozzle N and the upper surface Cu, the interference between the flange Nf of the nozzle N and the step of the component C, and the like are confirmed, and the suction position that meets the conditions is searched for.
　ステップＳ４０５では、ステップＳ４０４で探索された吸着位置が適正かが判断される。例えば、ノズルＮと部品Ｃとの干渉が生じない吸着位置が探索できなかったり、吸着位置が部品Ｃの中心から所定距離以上離れていたりする場合には、ステップＳ４０５で不適正（ＮＯ）と判断されて、ステップＳ４０３に戻る。そして、部品Ｃを吸着するノズルＮを、より小さいノズル孔を有するノズルＮに変更して、ステップＳ４０４～Ｓ４０５を繰り返す。こうして、ステップＳ４０５で「ＹＥＳ」と判断されると、ステップＳ４０３、Ｓ４０４が実行されることで、部品Ｃを吸着するノズルＮおよび当該ノズルＮによる部品Ｃの吸着位置が決定される。さらに、部品Ｃを吸着するノズルＮを、より小さいノズル孔を有するノズルＮが存在する場合、ノズルＮを変更してステップＳ４０４～Ｓ４０５を繰り返し、吸着可能な複数のノズルＮを抽出する。ノズルＮの選定方法は、吸着可能として抽出したノズルＮのうち、吸着が安定する最もノズル孔の大きいノズルＮを選定しても良いし、他の部品Ｃの吸着に用いるノズルＮとのバランスを考慮し、ノズルＮの交換回数を少なくする等タイムロスを抑えるようにノズルＮを選定しても良い。なお、部品供給位置８３２に供給される部品Ｃの荷姿については、三次元計測結果Ｒから決定できないため、仮に決定される。こうして、部品吸着情報Ｉｃａが算出される。 In step S405, it is determined whether the suction position searched in step S404 is appropriate. For example, if it is not possible to search for a suction position where interference between the nozzle N and the component C does not occur, or if the suction position is separated from the center of the component C by a predetermined distance or more, it is determined to be inappropriate (NO) in step S405. Then, the process returns to step S403. Then, the nozzle N for sucking the component C is changed to a nozzle N having a smaller nozzle hole, and steps S404 to S405 are repeated. In this way, if "YES" is determined in step S405, steps S403 and S404 are executed to determine the nozzle N for sucking the component C and the suction position of the component C by the nozzle N. Further, if there is a nozzle N having a smaller nozzle hole for the nozzle N that sucks the component C, the nozzle N is changed and steps S404 to S405 are repeated to extract a plurality of nozzles N that can be sucked. As a method for selecting the nozzle N, the nozzle N having the largest nozzle hole for which the suction is stable may be selected from the nozzles N extracted so that the suction is possible, or the balance with the nozzle N used for suction of the other component C is balanced. In consideration, the nozzle N may be selected so as to suppress the time loss such as reducing the number of times the nozzle N is replaced. The packing style of the component C supplied to the component supply position 832 cannot be determined from the three-dimensional measurement result R, so it is tentatively determined. In this way, the component adsorption information Ica is calculated.
　図５のステップＳ１１４では、完成基板Ｂｃの生産に要する複数の部品Ｃを基板Ｂに実装する順序が算出される。具体的には、複数の部品Ｃの基板Ｂへの実装順序を変更しつつ、複数の部品Ｃの実装を完了するのに要する時間、すなわち完成基板Ｂｃの生産時間が予測される。そして、生産時間が最短となる実装順序が算出される。 In step S114 of FIG. 5, the order of mounting the plurality of components C required for the production of the completed substrate Bc on the substrate B is calculated. Specifically, the time required to complete the mounting of the plurality of components C while changing the mounting order of the plurality of components C on the substrate B, that is, the production time of the completed substrate Bc is predicted. Then, the mounting order that minimizes the production time is calculated.
　ただし、実装順序は、図１１に例示するノズルＮと部品Ｃとの干渉が生じない範囲で求められる。図１１は実装順序の算出で考慮されるノズルと部品との位置関係の一例を示す図である。図１１では、高さの異なる２個の部品Ｃ１、Ｃ２が隣接して実装される例が示されており、部品Ｃ２を基板Ｂに実装した後に、部品Ｃ２より低い部品Ｃ１を実装する順序が示されている。この順序では、部品Ｃ１を吸着するノズルＮのフランジＮｆが、基板Ｂに実装済みの部品Ｃ２に干渉する。したがって、実装済みの部品ＣとノズルＮとの干渉を防止するためには、部品Ｃ１を実装した後に、部品Ｃ２を実装する必要がある。かかる干渉の有無は、部品Ｃ１、Ｃ２それぞれの実装位置と、実装部品情報Ｉｍの部品形状情報Ｉｃｓに含まれる部品Ｃ１、Ｃ２それぞれの高さとに基づき判断することができる。そして、実装済みの部品ＣとノズルＮとの干渉が生じない実装順序のうちから、生産時間が最短となる実装順序が求められる。 However, the mounting order is determined within a range in which the nozzle N illustrated in FIG. 11 and the component C do not interfere with each other. FIG. 11 is a diagram showing an example of the positional relationship between the nozzle and the component considered in the calculation of the mounting order. FIG. 11 shows an example in which two parts C1 and C2 having different heights are mounted adjacent to each other, and the order in which the parts C1 lower than the parts C2 are mounted after the parts C2 are mounted on the board B is shown. It is shown. In this order, the flange Nf of the nozzle N that attracts the component C1 interferes with the component C2 mounted on the substrate B. Therefore, in order to prevent interference between the mounted component C and the nozzle N, it is necessary to mount the component C2 after mounting the component C1. The presence or absence of such interference can be determined based on the mounting positions of the parts C1 and C2 and the heights of the parts C1 and C2 included in the part shape information Ics of the mounted part information Im. Then, from the mounting order in which the mounted component C and the nozzle N do not interfere with each other, the mounting order in which the production time is the shortest is required.
　こうして実装順序が算出されると、完成基板Ｂｃの生産のために基板Ｂに実装する複数の部品Ｃそれぞれの部品情報Ｉｃ、実装位置、実装角度および極性や、複数の部品Ｃの実装順序を示す実装データＤｍが作成され、制御装置２から部品実装機８に転送される。そして、部品実装機８は、実装データＤｍに基づき基板Ｂへの部品Ｃの実装を開始する。 When the mounting order is calculated in this way, the component information Ic, mounting position, mounting angle and polarity of each of the plurality of components C to be mounted on the board B for the production of the completed board Bc, and the mounting order of the plurality of components C are shown. The mounting data Dm is created and transferred from the control device 2 to the component mounting machine 8. Then, the component mounting machine 8 starts mounting the component C on the board B based on the mounting data Dm.
　特に、部品実装機８の実装制御部８１は、最初に部品Ｃを基板Ｂに実装する前に（つまり、部品実装の開始前に）、部品Ｃの荷姿の確認と修正を実行する（ステップＳ１１５）。図１２は荷姿の確認・修正方法の一例を示すフローチャートである。図１２のフローチャートは、部品実装機８の実装制御部８１により実行される。 In particular, the mounting control unit 81 of the component mounting machine 8 executes confirmation and correction of the packing shape of the component C before first mounting the component C on the substrate B (that is, before the start of component mounting) (step). S115). FIG. 12 is a flowchart showing an example of a method of checking / correcting the packing style. The flowchart of FIG. 12 is executed by the mounting control unit 81 of the component mounting machine 8.
　ステップＳ５０１では、実装データＤｍにおいて参照される部品情報Ｉｃが読み出される。ステップＳ５０２では、部品供給位置８３２に供給された部品Ｃの上方に認識カメラ８６を移動させて、部品Ｃを認識カメラ８６で撮像した画像に基づき、部品Ｃの荷姿が確認される。ここで、部品Ｃの荷姿とは、基板Ｂの法線（換言すればＺ方向）に平行な仮想直線を中心とする回転方向における、部品供給位置８３２での部品Ｃの角度である。そして、実装制御部８１は、テープフィーダー８３１により部品供給位置８３２に供給された部品Ｃの角度が、実装データＤｍが示す部品供給位置８３２での部品Ｃの角度と一致するかを判断することで、実装データＤｍの適否を判定する（ステップＳ５０３）。これらが一致せず、実装データＤｍが不適切である場合（ステップＳ５０３で「ＮＯ」の場合）には、実装制御部８１は、実装データＤｍを修正することで、これらを一致させる。 In step S501, the component information Ic referred to in the mounting data Dm is read out. In step S502, the recognition camera 86 is moved above the component C supplied to the component supply position 832, and the packing shape of the component C is confirmed based on the image of the component C captured by the recognition camera 86. Here, the packing shape of the component C is the angle of the component C at the component supply position 832 in the rotation direction centered on the virtual straight line parallel to the normal line of the substrate B (in other words, the Z direction). Then, the mounting control unit 81 determines whether the angle of the component C supplied to the component supply position 832 by the tape feeder 831 matches the angle of the component C at the component supply position 832 indicated by the mounting data Dm. , The suitability of the mounting data Dm is determined (step S503). When these do not match and the mounting data Dm is inappropriate (when “NO” in step S503), the mounting control unit 81 corrects the mounting data Dm to match them.
　このように、以上に説明した実施形態では、基板Ｂと基板Ｂに実装された部品Ｃ（実装部品Ｃ）とを有する完成基板Ｂｃの形状の計測結果である三次元計測結果Ｒに基づき、当該実装部品Ｃの形状を示す部品形状情報Ｉｃｓが求められる（ステップＳ１０３）。この際、三次元計測結果Ｒは、完成基板Ｂｃの三次元形状を示す三次元データである。そして、基板Ｂからの部品Ｃの高さをこの三次元データに基づき求めることで、この部品Ｃの高さを含む部品形状情報Ｉｃｓが求められる。これによって、基板Ｂに実装された部品Ｃの高さの取得に要する作業者の負担を軽減して、実装データＤｍの作成を支援することが可能となっている。 As described above, in the embodiment described above, the present invention is based on the three-dimensional measurement result R which is the measurement result of the shape of the completed substrate Bc having the substrate B and the component C (mounted component C) mounted on the substrate B. The component shape information Ics indicating the shape of the mounted component C is obtained (step S103). At this time, the three-dimensional measurement result R is three-dimensional data indicating the three-dimensional shape of the completed substrate Bc. Then, by obtaining the height of the component C from the substrate B based on the three-dimensional data, the component shape information Ics including the height of the component C can be obtained. As a result, it is possible to reduce the burden on the operator required to acquire the height of the component C mounted on the board B and support the creation of the mounting data Dm.
　また、演算部２１は、三次元計測結果Ｒ（三次元データ）に基づき求めた部品形状情報Ｉｃｓが示す実装部品Ｃの形状を参照して実装部品Ｃの種類（部品ＩＤ）を推定する（ステップＳ１０４）。かかる構成では、三次元計測結果Ｒに基づき、基板Ｂに実装された部部品Ｃの種類を的確に推定することができる。 Further, the calculation unit 21 estimates the type (part ID) of the mounted component C by referring to the shape of the mounted component C indicated by the component shape information Ics obtained based on the three-dimensional measurement result R (three-dimensional data) (step). S104). In such a configuration, the type of the component C mounted on the substrate B can be accurately estimated based on the three-dimensional measurement result R.
　また、演算部２１は、種類の異なる複数の登録部品Ｃ（部品ＩＤで識別される部品Ｃ）の形状が登録部品Ｃごとに登録された部品ライブラリＬｃのうちから、部品形状情報Ｉｃｓが示す実装部品Ｃの形状に類似する形状を有する登録部品Ｃを候補部品Ｃとして探索した結果に基づき、当該実装部品Ｃの種類を推定する（ステップＳ１０４）。かかる構成では、部品ライブラリＬｃに基づき、基板Ｂに実装された部品Ｃの種類を的確に推定することが可能となる。 Further, the calculation unit 21 mounts the component shape information Ics from the component library Lc in which the shapes of a plurality of registered components C (components C identified by the component IDs) of different types are registered for each registered component C. The type of the mounted component C is estimated based on the result of searching for the registered component C having a shape similar to the shape of the component C as the candidate component C (step S104). In such a configuration, it is possible to accurately estimate the type of component C mounted on the substrate B based on the component library Lc.
　また、演算部２１は、部品ライブラリＬｃのうちから候補部品Ｃを探索できない場合（ステップＳ１０５で、候補部品Ｃの個数がゼロの場合）には、部品形状情報Ｉｃｓが示す実装部品Ｃの形状を当該実装部品Ｃと関連付けて実装部品情報Ｉｍに追加する（ステップＳ１０８）。かかる構成では、部品ライブラリＬｃに無い実装部品Ｃが完成基板Ｂｃに含まれる場合には、この実装部品Ｃを実装部品情報Ｉｍに追加することができる。 Further, when the calculation unit 21 cannot search for the candidate component C from the component library Lc (when the number of candidate components C is zero in step S105), the calculation unit 21 determines the shape of the mounting component C indicated by the component shape information Ics. It is added to the mounted component information Im in association with the mounted component C (step S108). In such a configuration, when the mounted component C not included in the component library Lc is included in the completed board Bc, this mounted component C can be added to the mounted component information Im.
　また、演算部２１は、複数の候補部品Ｃが探索された場合（ステップＳ１０５で、候補部品Ｃの個数が複数の場合）には、実装部品Ｃの形状以外に実装部品Ｃの特徴を示す部品特徴情報を三次元計測結果Ｒから求め（ステップＳ１０６）、複数の候補部品Ｃのうちから部品特徴情報が示す特徴を有する一の候補部品Ｃを探索した結果に基づき、実装部品Ｃの種類を推定する（ステップＳ１０７）。かかる構成では、基板Ｂに実装された部品Ｃの形状以外の特徴に基づき、当該部品Ｃの種類を的確に推定することが可能となる。 Further, when a plurality of candidate parts C are searched for (when the number of candidate parts C is a plurality in step S105), the calculation unit 21 is a component showing the characteristics of the mounted component C in addition to the shape of the mounted component C. The feature information is obtained from the three-dimensional measurement result R (step S106), and the type of the mounted component C is estimated based on the result of searching for one candidate component C having the feature indicated by the component feature information from the plurality of candidate components C. (Step S107). With such a configuration, it is possible to accurately estimate the type of the component C based on features other than the shape of the component C mounted on the substrate B.
　また、演算部２１は、三次元計測結果Ｒに基づき、基板Ｂにおいて部品Ｃが実装された実装位置を特定する（ステップＳ１１０）。かかる構成では、基板Ｂにおける部品Ｃの実装位置の特定に要する作業者の負担を軽減して、実装データＤｍの作成を支援することが可能となっている。 Further, the calculation unit 21 specifies the mounting position on which the component C is mounted on the board B based on the three-dimensional measurement result R (step S110). With such a configuration, it is possible to reduce the burden on the operator required to specify the mounting position of the component C on the substrate B and support the creation of the mounting data Dm.
　この際、演算部２１は、基板Ｂから突出した突出部分を三次元計測結果Ｒから抽出して、突出部分が部品Ｃである特定するとともに、突出部分の位置が実装位置であると特定する。かかる構成では、三次元計測結果Ｒに基づき、基板Ｂにおける部品Ｃの実装位置を的確に特定することができる。 At this time, the calculation unit 21 extracts the protruding portion protruding from the substrate B from the three-dimensional measurement result R, specifies that the protruding portion is the component C, and specifies that the position of the protruding portion is the mounting position. In such a configuration, the mounting position of the component C on the substrate B can be accurately specified based on the three-dimensional measurement result R.
　特に、完成基板Ｂｃを平面視で撮像した二次元画像から実装部品Ｃを特定する方法では、コントラストが低いと、基板Ｂ上における部品Ｃの周縁が不明確となって、当該部品Ｃを的確に特定できない場合がある。これに対して、基板Ｂからの突出部分を三次元計測結果Ｒから抽出する方法によれば、基板Ｂ上の部品Ｃを的確に特定できるといった利点がある。 In particular, in the method of identifying the mounting component C from the two-dimensional image obtained by capturing the completed substrate Bc in a plan view, if the contrast is low, the peripheral edge of the component C on the substrate B becomes unclear, and the component C can be accurately identified. It may not be possible to identify. On the other hand, according to the method of extracting the protruding portion from the substrate B from the three-dimensional measurement result R, there is an advantage that the component C on the substrate B can be accurately identified.
　また、実装データＤｍは、部品ＣをノズルＮにより吸着して基板Ｂに実装する動作を繰り返して複数の部品Ｃを基板Ｂに実装するにあたって、複数の部品Ｃを実装する順序を示す実装順序を含む。そして、演算部２１は、複数の部品Ｃのうち、一の部品Ｃ１を吸着するノズルＮと、一の部品Ｃ１と異なる基板Ｂに実装された他の部品Ｃ２との干渉の有無を判断した結果に基づき、実装順序を決定する（ステップＳ１１４）。具体的には、実装順序を変更しつつ、これらの部品Ｃ１、Ｃ２それぞれの実装位置と、部品形状情報Ｉｃｓに含まれるこれらの部品Ｃ１、Ｃ２それぞれの高さとに基づき、干渉の有無を予測した結果から、実装順序が決定される。かかる構成では、ノズルＮにより吸着されて実装位置へ向かう部品Ｃと、基板Ｂに既に実装された部品Ｃとの干渉が生じない実装順序を求めて、この実装順序に従って基板Ｂに部品Ｃを適切に実装することができる。 Further, the mounting data Dm indicates a mounting order indicating the order in which the plurality of components C are mounted when the operation of sucking the component C by the nozzle N and mounting the component C on the substrate B is repeated to mount the plurality of components C on the substrate B. Including. Then, the calculation unit 21 determines whether or not there is interference between the nozzle N that attracts one component C1 among the plurality of components C and another component C2 mounted on a substrate B different from the one component C1. The mounting order is determined based on (step S114). Specifically, while changing the mounting order, the presence or absence of interference was predicted based on the mounting positions of these parts C1 and C2 and the heights of these parts C1 and C2 included in the part shape information Ics. From the result, the mounting order is determined. In such a configuration, the mounting order in which the component C attracted by the nozzle N and heading for the mounting position does not interfere with the component C already mounted on the board B is obtained, and the component C is appropriately mounted on the board B according to this mounting order. Can be implemented in.
　また、演算部２１は、部品Ｃの実装角度を三次元計測結果Ｒから求める（ステップＳ１１１）。かかる構成では、部品Ｃの実装角度の特定に要する作業者の負担を軽減して、実装データＤｍの作成を支援することが可能となっている。 Further, the calculation unit 21 obtains the mounting angle of the component C from the three-dimensional measurement result R (step S111). With such a configuration, it is possible to reduce the burden on the operator required to specify the mounting angle of the component C and support the creation of the mounting data Dm.
　また、演算部２１は、実装部品Ｃにおける基板Ｂからの高さが均一な上面Ｃｕの存在範囲を含む部品形状情報Ｉｃｓを三次元計測結果Ｒに基づき求める（ステップＳ２０３）。かかる構成では、三次元計測結果Ｒに基づき、実装部品Ｃの上面Ｃｕを的確に求めることができる。 Further, the calculation unit 21 obtains the component shape information Ics including the existence range of the upper surface Cu having a uniform height from the substrate B in the mounting component C based on the three-dimensional measurement result R (step S203). In such a configuration, the upper surface Cu of the mounting component C can be accurately obtained based on the three-dimensional measurement result R.
　また、演算部２１は、部品Ｃを基板Ｂに実装するために部品Ｃを吸着するノズルＮの種類を上面Ｃｕの存在範囲に基づき決定する（ステップＳ１１３）。かかる構成では、部品Ｃの上面Ｃｕを吸着するのに適したノズルＮの決定に要する作業者の負担を軽減して、実装データＤｍの作成を支援することが可能となっている。 Further, the calculation unit 21 determines the type of the nozzle N that attracts the component C in order to mount the component C on the substrate B based on the existence range of the upper surface Cu (step S113). With such a configuration, it is possible to reduce the burden on the operator required to determine the nozzle N suitable for adsorbing the upper surface Cu of the component C, and to support the creation of the mounting data Dm.
　また、演算部２１は、部品Ｃを基板Ｂに実装するために部品ＣをノズルＮにより吸着する吸着位置を上面Ｃｕの存在範囲のうちから決定する（ステップＳ１１３）。かかる構成では、ノズルＮによる部品Ｃの吸着位置の決定に要する作業者の負担を軽減して、実装データＤｍの作成を支援することが可能となっている。 Further, the calculation unit 21 determines the suction position for sucking the component C by the nozzle N in order to mount the component C on the substrate B from the existence range of the upper surface Cu (step S113). With such a configuration, it is possible to reduce the burden on the operator required to determine the suction position of the component C by the nozzle N and support the creation of the mounting data Dm.
　また、実装データＤｍは、部品供給位置８３２での部品Ｃの角度を含む。これに対して、部品実装機８は、テープフィーダー８３１により部品供給位置８３２に供給される部品Ｃの角度を認識した結果が、実装データＤｍに含まれる部品供給位置８３２での部品Ｃの角度と一致するかを判断して、実装データＤｍの適否を判定する（ステップＳ５０１～Ｓ５０３）。かかる構成では、実装データＤｍが示す、部品供給位置８３２での部品Ｃの角度の適否を部品実装機８において確認することができる。 Further, the mounting data Dm includes the angle of the component C at the component supply position 832. On the other hand, the component mounting machine 8 recognizes the angle of the component C supplied to the component supply position 832 by the tape feeder 831, and the result is the angle of the component C at the component supply position 832 included in the mounting data Dm. It is determined whether they match, and the suitability of the mounting data Dm is determined (steps S501 to S503). In such a configuration, the component mounting machine 8 can confirm the suitability of the angle of the component C at the component supply position 832 indicated by the mounting data Dm.
　また、部品実装機８は、実装データＤｍが不適切であると判定すると、実装データＤｍを修正する。かかる構成では、修正された実装データＤｍに基づき、基板Ｂに部品Ｃを適切に実装することができる。 Further, when the component mounting machine 8 determines that the mounting data Dm is inappropriate, the component mounting machine 8 corrects the mounting data Dm. In such a configuration, the component C can be appropriately mounted on the substrate B based on the modified mounting data Dm.
　このように本実施形態では、制御装置２が本発明の「実装データ作成支援装置」および「演算装置」の一例に相当し、部品実装機８が本発明の「部品実装機」の一例に相当し、制御装置２と部品実装機８とが本発明の「部品実装システム」を構成し、演算部２１が本発明の「演算部」の一例に相当し、通信部２４が本発明の「取得部」の一例に相当し、実装データＤｍが本発明の「実装データ」の一例に相当し、基板Ｂが本発明の「基板」の一例に相当し、完成基板Ｂｃが本発明の「完成基板」の一例に相当し、部品Ｃが本発明の「部品」の一例に相当し、上面Ｃｕが本発明の「上面」の一例に相当し、三次元計測結果Ｒが本発明の「完成基板情報」および「三次元データ」の一例に相当し、部品ライブラリＬｃが本発明の「部品ライブラリ」の一例に相当し、ノズルＮが本発明の「ノズル」の一例に相当し、部品特徴情報が本発明の「部品特徴情報」の一例に相当し、実装位置が本発明の「実装位置」の一例に相当し、実装順序が本発明の「実装順序」の一例に相当し、実装角度が本発明の「実装角度」の一例に相当し、吸着位置が本発明の「吸着位置」の一例に相当する。 As described above, in the present embodiment, the control device 2 corresponds to an example of the "mounting data creation support device" and the "calculation device" of the present invention, and the component mounting machine 8 corresponds to an example of the "component mounting machine" of the present invention. Then, the control device 2 and the component mounting machine 8 constitute the "component mounting system" of the present invention, the calculation unit 21 corresponds to an example of the "calculation unit" of the present invention, and the communication unit 24 is the "acquisition" of the present invention. The mounting data Dm corresponds to an example of the "mounting data" of the present invention, the substrate B corresponds to an example of the "board" of the present invention, and the completed substrate Bc corresponds to the "completed substrate" of the present invention. Corresponds to an example of the "part" of the present invention, the upper surface Cu corresponds to an example of the "upper surface" of the present invention, and the three-dimensional measurement result R corresponds to the "completed substrate information" of the present invention. And "three-dimensional data", the parts library Lc corresponds to an example of the "parts library" of the present invention, the nozzle N corresponds to an example of the "nozzle" of the present invention, and the part feature information is the present. The mounting position corresponds to an example of the "mounting position" of the present invention, the mounting order corresponds to an example of the "mounting order" of the present invention, and the mounting angle corresponds to the present invention. Corresponds to an example of the "mounting angle" of the above, and the suction position corresponds to an example of the "suction position" of the present invention.
　なお、本発明は上記実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて上述したものに対して種々の変更を加えることが可能である。例えば、ステップＳ１０２で制御装置２が取得する計測結果は、三次元計測結果Ｒに限られない。したがって、平面視から完成基板Ｂｃを撮像した当該完成基板Ｂｃの二次元画像から取得した当該完成基板Ｂｃの二次元形状を示す二次元データを制御装置２が三次元データとともに取得しするように、実施形態を変形できる。 The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, the measurement result acquired by the control device 2 in step S102 is not limited to the three-dimensional measurement result R. Therefore, the control device 2 acquires the two-dimensional data indicating the two-dimensional shape of the completed substrate Bc acquired from the two-dimensional image of the completed substrate Bc obtained by imaging the completed substrate Bc from the plan view together with the three-dimensional data. The embodiment can be modified.
　この変形例では、演算部２１は、完成基板Ｂｃの二次元データおよび三次元データ（完成基板情報）を併用して、完成基板Ｂｃに含まれる部品Ｃの部品形状情報Ｉｃｓを求めることができる。例えば、基板Ｂにおける部品Ｃの実装位置や、部品Ｃの幅Ｃｗおよび長さＣｌを二次元データから抽出する一方、基板Ｂからの部品Ｃの高さを三次元データから抽出することで、当該部品形状情報Ｉｃｓを求めれば良い。そして、二次元データおよび三次元データを含む完成基板情報に基づき、図５の実装データ作成支援を実行することができる。かかる構成は、コントラストがはっきりした二次元データが得られる場合に特に好適となる。 In this modification, the calculation unit 21 can obtain the component shape information Ics of the component C included in the completed substrate Bc by using the two-dimensional data and the three-dimensional data (completed substrate information) of the completed substrate Bc together. For example, the mounting position of the component C on the substrate B and the width Cw and the length Cl of the component C are extracted from the two-dimensional data, while the height of the component C from the substrate B is extracted from the three-dimensional data. The part shape information Ics may be obtained. Then, the mounting data creation support of FIG. 5 can be executed based on the completed board information including the two-dimensional data and the three-dimensional data. Such a configuration is particularly suitable when two-dimensional data having a clear contrast can be obtained.
　また、演算部２１は、ステップＳ１０４では、二次元データを併用して求めた部品形状情報Ｉｃｓが示す実装部品Ｃの形状を参照して、実装部品Ｃの種類を推定する。かかる構成では、二次元データも併用して、基板Ｂに実装された部品Ｃの種類を的確に推定することが可能となる。 Further, in step S104, the calculation unit 21 estimates the type of the mounting component C by referring to the shape of the mounting component C indicated by the component shape information Ics obtained by using the two-dimensional data together. In such a configuration, it is possible to accurately estimate the type of component C mounted on the substrate B by also using two-dimensional data.
　また、ステップＳ１０４での部品Ｃの特定は、部品ライブラリＬｃを用いずに行うこともできる。つまり、完成基板Ｂｃの生産のために基板Ｂに実装される種類の異なる複数の対象部品Ｃの形状を対象部品Ｃごとに示す部品リストが得られる場合がある。このような場合、演算部２１は、ステップＳ１０３で三次元計測結果Ｒから抽出した部品形状情報Ｉｃｓが示す実装部品Ｃの形状に類似する形状を有する対象部品Ｃを、部品リストのうちから候補部品Ｃとして探索した結果に基づき、実装部品Ｃの種類を推定できる。かかる構成では、部品リストに基づき、基板Ｂに実装された部品Ｃの種類を的確に推定することが可能となる。 Further, the specification of the component C in step S104 can be performed without using the component library Lc. That is, a component list showing the shapes of a plurality of target components C of different types mounted on the substrate B for the production of the completed substrate Bc may be obtained for each target component C. In such a case, the calculation unit 21 selects the target component C having a shape similar to the shape of the mounting component C indicated by the component shape information Ics extracted from the three-dimensional measurement result R in step S103 as a candidate component from the component list. The type of mounting component C can be estimated based on the result of searching as C. With such a configuration, it is possible to accurately estimate the type of component C mounted on the substrate B based on the component list.
　この際、演算部２１は、部品リストのうちから候補部品Ｃを探索できない場合には、部品形状情報Ｉｃｓが示す実装部品Ｃの形状を部品Ｃと関連付けて実装部品情報Ｉｍに追加するように、ステップＳ１０８を変形しても良い。かかる構成では、部品リストに無い実装部品Ｃが完成基板Ｂｃに含まれる場合には、この実装部品Ｃを実装部品情報Ｉｍに追加することができる。 At this time, when the calculation unit 21 cannot search for the candidate component C from the component list, the arithmetic unit 21 associates the shape of the mounted component C indicated by the component shape information Ics with the component C and adds it to the mounted component information Im. Step S108 may be modified. In such a configuration, when the mounted component C not included in the component list is included in the completed board Bc, the mounted component C can be added to the mounted component information Im.
　さらに、部品リストと部品ライブラリＬｃとを併用しても良い。具体的には、部品リストに該当する候補部品Ｃがなかった場合に、部品ライブラリＬｃから候補部品Ｃの探索を行うようにしても良い。 Furthermore, the parts list and the parts library Lc may be used together. Specifically, when there is no candidate component C corresponding to the component list, the candidate component C may be searched from the component library Lc.
　また、ステップＳ１０６において、完成基板Ｂｃに含まれる部品Ｃに関する部品特徴情報が三次元計測結果Ｒから抽出できない場合には、作業者に部品特徴情報の入力を報知しても良い。 Further, in step S106, if the component feature information related to the component C included in the completed substrate Bc cannot be extracted from the three-dimensional measurement result R, the operator may be notified of the input of the component feature information.
　また、部品Ｃの実装位置の具体的な特定方法は種々考えられる。例えば、基板Ｂには、位置を示すフィデューシャルマーク（マーク）が付されている。そこで、演算部２１は、基板Ｂに付されたこのマークを基準に実装位置を特定することができる。このフィデューシャルマークの位置は、上述の三次元データに基づき特定しても良いし、上述の二次元データに基づき特定しても良い。 In addition, various specific methods for specifying the mounting position of component C can be considered. For example, the substrate B is provided with a fiducial mark (mark) indicating the position. Therefore, the calculation unit 21 can specify the mounting position with reference to this mark attached to the substrate B. The position of the fiducial mark may be specified based on the above-mentioned three-dimensional data or may be specified based on the above-mentioned two-dimensional data.
　また、ステップＳ１１５では、実装制御部８１が自動で実装データＤｍの修正を行っていた。しかしながら、実装制御部８１は、実装データＤｍが不適切であると判定すると（ステップＳ５０３で「ＮＯ」）、例えばディスプレイ等のＵＩを用いて実装データＤｍの修正を作業者に報知しても良い。かかる構成では、作業者は、実装データＤｍの修正が必要であることを的確に把握することができる。 Further, in step S115, the mounting control unit 81 automatically corrects the mounting data Dm. However, if the mounting control unit 81 determines that the mounting data Dm is inappropriate (“NO” in step S503), the mounting control unit 81 may notify the operator of the correction of the mounting data Dm using, for example, a UI such as a display. .. With such a configuration, the operator can accurately grasp that the mounting data Dm needs to be modified.
　この際、実装制御部８１は、実装データＤｍの修正内容をＵＩにより作業者に併せて報知しても良い。かかる構成では、実装データＤｍの修正に要する作業者の負担を軽減して、実装データＤｍの作成を支援することが可能となっている。 At this time, the mounting control unit 81 may notify the operator of the modified content of the mounting data Dm by the UI. With such a configuration, it is possible to reduce the burden on the operator required for modifying the mounting data Dm and support the creation of the mounting data Dm.
　また、外観検査機６と制御装置２とを別体に構成する必要は無く、外観検査機６に制御装置２を内蔵しても良い。かかる変形例では、外観検査機６が本発明の「外観検査機」の一例に相当する。 Further, it is not necessary to separately configure the visual inspection machine 6 and the control device 2, and the control device 2 may be built in the visual inspection machine 6. In such a modified example, the visual inspection machine 6 corresponds to an example of the "visual inspection machine" of the present invention.
　また、完成基板Ｂｃの三次元形状を計測する方法は、位相シフト法に限られず、例えばステレオマッチングでも良い。 Further, the method for measuring the three-dimensional shape of the completed substrate Bc is not limited to the phase shift method, and for example, stereo matching may be used.
　２…制御装置（実装データ作成支援装置、演算装置、部品実装システム）
　２１…演算部
　２４…通信部（取得部）
　８…部品実装機（部品実装システム）
　Ｂ…基板
　Ｂｃ…完成基板
　Ｃ…部品
　Ｃｕ…上面
　Ｄｍ…実装データ
　Ｌｃ…部品ライブラリ
　Ｎ…ノズル
　Ｒ…三次元計測結果（完成基板情報、三次元データ）
  2 ... Control device (mounting data creation support device, arithmetic unit, component mounting system)
21 ... Calculation unit 24 ... Communication unit (acquisition unit)
8 ... Parts mounting machine (parts mounting system)
B ... Board Bc ... Completed board C ... Parts Cu ... Top surface Dm ... Mounting data Lc ... Parts library N ... Nozzle R ... Three-dimensional measurement results (completed board information, three-dimensional data)

Claims (16)

  1. 　基板に部品を実装する手順を示す実装データの作成を支援する実装データ作成支援装置であって、
    　前記基板と前記基板に実装された前記部品とを有する完成基板の形状の計測結果を含む完成基板情報として取得する取得部と、
    　前記部品の形状を示す部品形状情報を前記完成基板情報に基づき求める演算部と
    を備え、
    　前記完成基板情報は、前記完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、前記三次元データを少なくとも含み、
    　前記演算部は、前記基板からの前記部品の高さを前記三次元データに基づき求めることで、前記部品の高さを含む前記部品形状情報を求める実装データ作成支援装置。     It is a mounting data creation support device that supports the creation of mounting data that shows the procedure for mounting components on a board.
    An acquisition unit to be acquired as completed board information including the measurement result of the shape of the finished board having the board and the component mounted on the board.
    It is provided with a calculation unit that obtains component shape information indicating the shape of the component based on the completed board information.
    The completed substrate information includes at least the three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed substrate and the two-dimensional data indicating the two-dimensional shape.
    The calculation unit is a mounting data creation support device that obtains the component shape information including the height of the component by obtaining the height of the component from the substrate based on the three-dimensional data.
  2. 　前記演算部は、前記三次元データに基づき求めた前記部品形状情報が示す前記部品の形状を参照して前記部品の種類を推定する請求項１に記載の実装データ作成支援装置。 The mounting data creation support device according to claim 1, wherein the calculation unit estimates the type of the component by referring to the shape of the component indicated by the component shape information obtained based on the three-dimensional data.
  3. 　前記完成基板情報は、前記二次元データも含み、
    　前記演算部は、前記二次元データを併用して求めた前記部品形状情報が示す前記部品の形状を参照して前記部品の種類を推定する請求項２に記載の実装データ作成支援装置。     The completed substrate information also includes the two-dimensional data.
    The mounting data creation support device according to claim 2, wherein the calculation unit estimates the type of the component by referring to the shape of the component indicated by the component shape information obtained by using the two-dimensional data together.
  4. 　前記演算部は、種類の異なる複数の登録部品の形状が前記登録部品ごとに登録された部品ライブラリのうちから、前記部品形状情報が示す前記部品の形状に類似する形状を有する前記登録部品を候補部品として探索した結果に基づき、前記部品の種類を推定する請求項２または３に記載に実装データ作成支援装置。 The calculation unit can select the registered component having a shape similar to the shape of the component indicated by the component shape information from the component library in which the shapes of a plurality of registered components of different types are registered for each registered component. The mounting data creation support device according to claim 2 or 3, wherein the type of the component is estimated based on the result of searching as a component.
  5. 　前記演算部は、前記部品ライブラリのうちから前記候補部品を探索できない場合には、前記部品形状情報が示す前記部品の形状を前記部品と関連付けて、前記完成基板において前記基板に実装される部品に関する実装部品情報に追加する請求項４に記載の実装データ作成支援装置。 When the candidate component cannot be searched from the component library, the calculation unit associates the shape of the component indicated by the component shape information with the component, and relates to a component mounted on the substrate in the completed substrate. The mounting data creation support device according to claim 4, which is added to the mounting component information.
  6. 　前記演算部は、前記完成基板の生産のために前記基板に実装される種類の異なる複数の対象部品の形状を前記対象部品ごとに示す部品リストのうちから、前記部品形状情報が示す前記部品の形状に類似する形状を有する前記対象部品を候補部品として探索した結果に基づき、前記部品の種類を推定する請求項２ないし５のいずれか一項に記載の実装データ作成支援装置。 From the parts list showing the shapes of a plurality of different types of target parts mounted on the board for the production of the completed board for each target part, the calculation unit of the parts indicated by the part shape information. The mounting data creation support device according to any one of claims 2 to 5, which estimates the type of the component based on the result of searching for the target component having a shape similar to the shape as a candidate component.
  7. 　前記演算部は、複数の候補部品が探索された場合には、前記部品の形状以外に前記部品の特徴を示す部品特徴情報を前記完成基板情報から求め、前記複数の候補部品のうちから前記部品特徴情報が示す特徴を有する一の候補部品を探索した結果に基づき、前記部品の種類を推定する請求項４ないし６のいずれか一項に記載の実装データ作成支援装置。 When a plurality of candidate parts are searched for, the arithmetic unit obtains component feature information indicating the features of the component in addition to the shape of the component from the completed board information, and the component is among the plurality of candidate components. The mounting data creation support device according to any one of claims 4 to 6, which estimates the type of the component based on the result of searching for one candidate component having the feature indicated by the feature information.
  8. 　前記演算部は、前記完成基板情報に含まれる前記三次元データから、前記基板から突出した突出部分を抽出して、前記突出部分が前記部品である特定するとともに、前記突出部分の位置が前記実装位置であると特定する請求項１ないし７のいずれか一項に記載の実装データ作成支援装置。 The calculation unit extracts a protruding portion protruding from the board from the three-dimensional data included in the completed board information to identify the protruding portion as the component, and the position of the protruding portion is the mounting. The implementation data creation support device according to any one of claims 1 to 7, which identifies the position.
  9. 　前記演算部は、前記基板に付されたマークを基準に前記実装位置を特定する請求項８に記載の実装データ作成支援装置。 The mounting data creation support device according to claim 8, wherein the calculation unit specifies the mounting position based on a mark attached to the board.
  10. 　前記演算部は、前記基板の法線に平行な仮想直線を中心とする回転方向における前記部品の実装角度を、前記完成基板情報から求める請求項１ないし９のいずれか一項に記載の実装データ作成支援装置。 The mounting data according to any one of claims 1 to 9, wherein the calculation unit obtains the mounting angle of the component in the rotation direction about a virtual straight line parallel to the normal of the board from the completed board information. Creation support device.
  11. 　前記演算部は、前記部品における前記基板からの高さが均一な上面の存在範囲を含む前記部品形状情報を前記三次元データに基づき求め、前記部品を前記基板に実装するために前記部品を吸着するノズルの種類を前記上面の前記存在範囲に基づき決定するとともに、前記部品を前記基板に実装するために前記部品をノズルにより吸着する吸着位置を前記上面の前記存在範囲のうちから決定する請求項１ないし１０のいずれか一項に記載の実装データ作成支援装置。 The calculation unit obtains the component shape information including the existence range of the upper surface of the component having a uniform height from the substrate based on the three-dimensional data, and adsorbs the component in order to mount the component on the substrate. A claim that determines the type of nozzle to be used based on the existing range of the upper surface, and determines the suction position for sucking the component by the nozzle in order to mount the component on the substrate from the existing range of the upper surface. The mounting data creation support device according to any one of 1 to 10.
  12. 　基板に部品を実装する手順を示す実装データの作成を支援する実装データ作成支援方法であって、
    　前記基板と前記基板に実装された前記部品とを有する完成基板の形状の計測結果を完成基板情報として取得する工程と、
    　前記部品の形状を示す部品形状情報を前記完成基板情報に基づき求める工程と
    を備え、
    　前記完成基板情報は、前記完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、前記三次元データを少なくとも含み、
    　前記基板からの前記部品の高さが前記三次元データに基づき求められて、前記部品の高さを含む前記部品形状情報が求められる実装データ作成支援方法。     It is a mounting data creation support method that supports the creation of mounting data that shows the procedure for mounting components on a board.
    The process of acquiring the measurement result of the shape of the completed substrate having the substrate and the component mounted on the substrate as the completed substrate information, and
    It is provided with a step of obtaining component shape information indicating the shape of the component based on the completed board information.
    The completed substrate information includes at least the three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed substrate and the two-dimensional data indicating the two-dimensional shape.
    A mounting data creation support method in which the height of the component from the substrate is obtained based on the three-dimensional data, and the component shape information including the height of the component is obtained.
  13. 　基板と前記基板に実装された部品とを有する完成基板の形状を少なくとも示す完成基板情報を、前記完成基板の形状を計測することで求める形状計測部と、
    　前記部品の形状を示す部品形状情報を前記完成基板情報に基づき求める演算部と
    を備え、
    　前記完成基板情報は、前記完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、前記三次元データを少なくとも含み、
    　前記演算部は、前記基板からの前記部品の高さを前記三次元データに基づき求めることで、前記部品の高さを含む前記部品形状情報を求める外観検査機。     A shape measuring unit that obtains completed board information indicating at least the shape of a finished board having a board and components mounted on the board by measuring the shape of the finished board.
    It is provided with a calculation unit that obtains component shape information indicating the shape of the component based on the completed board information.
    The completed substrate information includes at least the three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed substrate and the two-dimensional data indicating the two-dimensional shape.
    The calculation unit is an appearance inspection machine that obtains the component shape information including the height of the component by obtaining the height of the component from the substrate based on the three-dimensional data.
  14. 　基板と前記基板に実装された部品とを有する完成基板の形状の計測結果を含む完成基板情報に基づき、前記部品の形状を示す部品形状情報を求める演算装置と、
    　フィーダーにより部品供給位置に供給した前記部品を実装ヘッドにより保持して前記基板に移載する動作を実行する部品実装機と
    を備え、
    　前記完成基板情報は、前記完成基板の三次元形状を示す三次元データおよび二次元形状を示す二次元データのうち、前記三次元データを少なくとも含み、
    　前記演算装置は、前記基板からの前記部品の高さを前記三次元データに基づき求めることで、前記部品の高さを含む前記部品形状情報を求め、
    　前記部品実装機は、前記部品形状情報を含む実装データが示す手順に従って、前記基板に前記部品を実装する部品実装システム。     An arithmetic unit that obtains component shape information indicating the shape of the component based on the completed substrate information including the measurement result of the shape of the completed substrate having the substrate and the component mounted on the substrate.
    It is provided with a component mounting machine that holds the component supplied to the component supply position by the feeder by the mounting head and executes an operation of transferring the component to the board.
    The completed substrate information includes at least the three-dimensional data among the three-dimensional data indicating the three-dimensional shape of the completed substrate and the two-dimensional data indicating the two-dimensional shape.
    The arithmetic unit obtains the component shape information including the height of the component by obtaining the height of the component from the substrate based on the three-dimensional data.
    The component mounting machine is a component mounting system for mounting the component on the board according to a procedure indicated by mounting data including the component shape information.
  15. 　前記実装データは、前記基板の法線に平行な仮想直線を中心とする回転方向における前記部品供給位置での前記部品の角度を含み、
    　前記部品実装機は、前記フィーダーにより供給される前記部品の角度を認識した結果が、前記実装データに含まれる前記部品供給位置での前記部品の角度と一致するかを判断して、前記実装データの適否を判定する請求項１４に記載の部品実装システム。     The mounting data includes the angle of the component at the component supply position in the rotation direction about a virtual straight line parallel to the normal of the substrate.
    The component mounting machine determines whether the result of recognizing the angle of the component supplied by the feeder matches the angle of the component at the component supply position included in the mounting data, and determines that the mounting data The component mounting system according to claim 14, wherein the suitability of the component mounting system is determined.
  16. 　前記部品実装機は、前記実装データが不適切であると判定すると、前記実装データを修正する請求項１５に記載の部品実装システム。 The component mounting system according to claim 15, wherein the component mounting machine corrects the mounting data when it determines that the mounting data is inappropriate.
PCT/JP2019/009272 2019-03-08 2019-03-08 Mounting data generation assistance device, mounting data generation assistance method, appearance inspection machine, and component mounting system WO2020183516A1 (en)

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