JPH0259231A - Part installing method - Google Patents

Abstract

PURPOSE:To aim at reduction in the feeding route of a part by holding the part on a feeder, moving it in the upper part, and then lowering it up to a specified height position as shifting in the horizontal direction of up to a mounting position. CONSTITUTION:When a part 1 is taken out of a feeder 2 and installed in a substrate 3, a first this part 1 on the feeder 2 is held and lifted up to height A where the feeder 2 will not interfere. Then, it is made to go up to centering height, while it is moved in the horizontal direction (A B). Afterward, it is horizontally moved up to a centering interval (B C), and it is going to be lowered up to an upper position of the substrate 2 as its horizontal movement being continued (C D). A lower limit position of this D position should be set to a position not interfering with the maximum height of the mounted part. Then, it is horizontally moved and lowered up to the mounting position. Therefore a feed route is thus shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a component mounting method for taking out components from a component feeder and mounting them on a substrate in an automatic assembly device for mounting components on a substrate. It is.

[Prior Art] When electronic components are automatically mounted on a circuit board in a -m, the components are taken out from a feeder that supplies the components, and the components are carried to a predetermined position on the circuit board and mounted.

When taking out a part from the feeder, the part is grasped and moved upward, as shown in FIG. 6(b).
After rising to a predetermined height that does not interfere with the feeder 2, the component 1f! - The component 1 is mounted at a predetermined position on the board 3 by following a path P in which it moves horizontally to above the mounting position and then moves downward.

[Problems to be Solved by the Invention] In the above method, all the parts 1 are transported from the feeder 2 to the substrate 3 along the same route P (so-called tact). Therefore, when mounting components 1 of different heights on the board 3, in order to prevent the newly mounted component 1 from interfering with the component 1 already mounted on the board 3, it is necessary to It is necessary to raise the component 1 to a higher position than the component 1 having the maximum height among the components 1 that are attached to the vehicle. In other words, when installing a short component 1, it is transported along the same path P as the tall component 1, so when transporting a short component 1, there is a waste of travel distance, resulting in a reduction in assembly time. The problem arises that the length becomes long.

The present invention aims to solve the above-mentioned problems, and provides a component mounting method that reduces wasted travel distance and thereby shortens assembly time.

[Means for Solving the Problems] In the present invention, in order to achieve the above object, in the process of transporting the components from above the feeder to above the component mounting position on the board, the present invention moves horizontally to above the component mounting position. A process of lowering the lower limit to a predetermined height position is provided, and the lower limit position during lowering is set at a height that does not interfere with components already mounted on the board.

[Function] According to the above configuration, in the movement process from above the feeder to above the substrate, the parts are moved diagonally toward the substrate while descending, whereas conventionally only the movement was horizontal. The conveyance path is shortened, and the assembly time is shortened.

[Example 1] As shown in FIG. 1 and FIG. 6(a), the component 1 is sucked and taken out from the feeder 2 that supplies the component 1 by a component conveying device (not shown), and transferred to a conveyor (not shown). The component transport device is numerically controlled.

This parts conveying device basically moves parts 1 from feeder 2.
The first step is to suck and take out the component 1 and move it upward to a predetermined height that does not interfere with the feeder 2, the second step is to move it above the component mounting position on the board 3, and the second step is to move it downward to place the component 1 on the board 3. It has a third step of wearing and an operation step. To break it down further, in the first process,
The part 1 is picked up and raised to a height where the feeder 2 does not interfere with it (A>. Next, in the second process, following the first process, it is raised to the centering height, and at the same time it is moved in the horizontal direction (A). -B), here, since part 1 has risen to a height where it does not interfere with feeder 2 in the first process, its horizontal movement until it reaches the centering section (B-C) is not constrained. Therefore, the shortest route can be taken while traveling to the centering section.

That is, after picking up the component 1, the centering section can be reached in a shorter time than when moving horizontally after rising to the centering height.

In the second process, when the centering section is reached, the upward movement is stopped, and the movement continues only in the horizontal direction for a predetermined centering time tc. In this centering section, the component 1 is positioned in the horizontal direction according to its center position, and the orientation of the component 1 is adjusted. After the centering time tc has elapsed, the robot moves downward to above the substrate 3 while continuing to move in the horizontal direction from C to D or C-+D'.
), and then moves horizontally to above the component mounting position on the board 3 as required (D'→E'). Here, the lower limit height position when descending from the centering section to above the board 3 is the lower limit height position of the component 1 existing on the movement path from the centering section to the component mounting position on the board 3, as described later. It is set so as not to interfere with the component 1 having the maximum height. In addition, if the component mounting position is close to the component transport device, it will move almost linearly from the centering section to above the component mounting position (C-D')
, if the component mounting position is far from the component transport device, it is set so that it descends from the centering section to above the board 3 and then moves horizontally to reach above the component mounting position (C-4D'→E ') After reaching above the component mounting position in this way, in the third step, the component 1 is moved downward and the component 1 is mounted on the board 3.

In order to realize the above-mentioned operation, the parts conveying device is controlled by the following parameters as shown in FIG. That is, machine-specific parameters that are constant values regardless of the type of part 1 include the height ZF of the feeder 2, the height Zo of the conveyor, the centering time tc, and the centering height Z. In the first process, First, in order to take out the component 1, a component suction height Z+ (=Zr+hp), which is the sum of the height ZF of the feeder 2 and the height of the component 1, is required as a parameter. In addition, since it is necessary to raise the component 1 picked up by the component transport device to a height that does not interfere with the feeder 2, the component pickup height Z+, the height of the component 1, and the margin α must be increased. A transportable height Z2 (=Z, +hP+α) is required.

The margin α only needs to be set so that the component 1 being sucked does not interfere with the feeder 2, so it is set to a value as small as possible. In this way, the parts suction height is 2. If the part 1 is picked up based on the height Z2 and the part transportable height z2, and the picked up part 1 rises to a height where it does not interfere with the feeder 2, the centering height Z and the centering time tc set in advance are Centering work in the second process is performed.

In order to reach above the component mounting position after the centering work in the second process, the horizontal position coordinates (Xo, Yo) regarding the component mounting position, the orientation Ro of the component 1, and the components already mounted on the board 3 are required. The setting of the 6 component mounting preparation height 2 degrees, which requires the component mounting preparation height Z4 as the lower limit position at which the component 1 picked up by the component transport device does not interfere with 1, will be described later.

In the third process, the substrate height Z p (= Z c + S
), and the component mounting height Z o (=Z p + h p), which is the board height ZP plus the height hp of the component 1.

Regarding each of the above-mentioned parameters, the data that the operator actually inputs are horizontal coordinates (X o , Y O) and orientation Ro, which are parameters related to the component mounting position;
The height of part 1, which is a parameter specific to part 1, and the size of part 1 in the horizontal plane (XP.

Yp) and the thickness S of the substrate 3, which is a parameter related to the substrate 3, and other parameters other than machine-specific parameters are automatically set by calculation.

The component mounting preparation height Z is set according to the following procedure. That is, first, the horizontal coordinates of the component mounting position (
Xo, Yo), direction Ro, height hp, size (XP, Y
, ) are input. Furthermore, the mounting order of each component 1 is also set. Next, the component mounting preparation height Z4 is calculated for each component 1 in the order of mounting.

Regarding the component 1 to be mounted first, since there is no interfering component on the board 3, the component mounting preparation height Z is given as the sum of the component mounting height zo, the component height, and the margin β. It will be done. In this way, for the component 1 to be mounted first on the board 3, the occupied area and the component mounting preparation height Z4 are
is written as an implementation map. Here, the horizontal coordinates (X o, y 6') of the mounting position of component 1 are set corresponding to one point at the center position of component 1, as shown in FIG. The direction R6 is determined by the relationship between the longitudinal direction of the component 1 and the substrate 3. Regarding the component 1 to be mounted thereafter, the component 1 already mounted on the board 3 is placed between the centering section and the component mounting position.
The existence of is checked based on the implementation map. That is, as shown in FIG. 4(b), if there is a mounted component 1 on the path P to the component mounting position, the component 1 being transported is different from the mounted component 1. Since it is necessary to prevent interference, the component mounting preparation height 2. is the component mounting preparation height Z for the component 1 to be mounted first, and the height h of the component 1 having the maximum height among the mounted components 1 existing on the transport path.
It is set as the value plus p. With this setting, when the component 1 is transported, the newly mounted component 1 will not interfere with the component 1 already mounted on the board 3. Furthermore, as shown in FIG. 4(a), if there is no mounted component 1 on the transport path P, the mounting preparation height Z is set to the same value as the first mounted component 1. Ru. As described above, the mounting map is completed according to the mounting order of the components 1, and the component mounting preparation height Z4 for each component is calculated. If this calculation is performed sequentially during the mounting of component 1, the movement of component 1 will stop during the calculation time, so in order to prevent such inconvenience, the calculation is performed during the mounting of component 1 by batch processing. The component 1 is mounted on the board 3 according to the completed mounting map.

FIG. 5 is a flowchart describing the operation of the parts transport device based on changes in parameters, and a diagram showing the correspondence between the operation of the parts transport device corresponding to each routine in the flow chart, and shows the X, Y, and R axes. is an axis that moves the component 1 in the horizontal direction and adjusts the orientation of the component 1, and the Z axis indicates an axis that moves the component 1 in the height direction. First, the first
In the process, after picking up component 1, it is determined whether the component transportable height Z2 has been reached during the upward movement, and when the component transportable height Z2 is reached, it continues to rise and head toward the component mounting position. With the addition of horizontal movement, part 1
The orientation is set. During this operation, when the height reaches the centering height Z, the movement in the height direction continues for a centering time t. It stops for a while and then begins to descend. When the height reaches the component mounting preparation height Z4 set by the above calculation by descending, the downward movement stops, and if the component mounting value ff (xo, yo, Ro) has been reached at that point,
The component 1 is mounted on the board 3 by descending to the component mounting height Zo. Also, when the component mounting preparation height Z4 is reached, the component mounting value! If (X,,Y,,R,) has not been reached, the movement in the horizontal direction is continued and the component mounting value rl(xo.

Y,,R,), and then descends to the component mounting height zo to mount the component 1 on the board 3.

Through the above operations, the component 1 is taken out from the feeder 2 and mounted on the board 3 on the conveyor. Since the movement in the direction and the movement in the horizontal direction are partially overlapped, the path P for transporting the part 1 is shortened compared to the conventional path (broken line), as shown by the solid line in FIG. 6(a). In automatic assembly, the time required to mount the component 1 can be reduced compared to the conventional method. Furthermore, each part 1
Since the parameters are set to the optimal value for each component, the time required to mount component 1 is reduced compared to the conventional case where every component 1 is transported along the same route. It is.

[Effects of the Invention] As described above, in the process of transporting components from above the feeder to above the component mounting position on the board, the present invention simultaneously lowers horizontally to a predetermined height position above the component mounting position. The lower limit position when descending is set at a height that does not interfere with parts already mounted on the board.In the process of moving from above the feeder to above the board, conventionally Instead of only moving, it now moves horizontally and lowers, so the transport route for parts is shorter than in the past, which has the advantage of shortening assembly time.

In addition, since the descending distance is set at a height that does not interfere with components already mounted on the board, the optimal transport route can be set for each component, making the transport route uniform. This method has the advantage of improved work efficiency compared to conventional methods.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing the basic operation of the present invention, Fig. 2 is an explanatory diagram showing each parameter in the same as above, Fig. 3 is an explanatory diagram showing an example of the component mounting position in the same as above, Fig. 4 (a)
(b) is an explanatory diagram showing an example of the transport route when mounting components in the same as above, and FIG. 5 is an explanatory diagram of the operation in the same as above,
FIGS. 6(a) and 6(b) are a perspective view showing a component transport route in the present invention and a perspective view showing a component transport route in a conventional example, respectively. 1... Parts, 2... Feeder, 3... Board. Agent Patent Attorney Ishi 1) Chief Seven 3... Board Figure 2 (Xo, Yo, Ro) Figure 3 Figure 4 (b)

Claims (1)

[Claims] (1) A first step of grasping the component on the feeder that supplies the component and moving it upward to a position where it does not interfere with the feeder;
A component mounting method comprising: a second step of moving the component to a position above the component mounting position on the board placed separately from the feeder; and a third step of moving the component downward to mount the component on the board. includes a process of moving horizontally to above the component mounting position and lowering to a predetermined height position, and the lower limit position in the second process is set at a height that does not interfere with components already mounted on the board. A parts mounting method characterized by: