JP2008060268A - Part mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a part mounting method for improving production efficiency by reducing production time including part suction time and part mounting time. <P>SOLUTION: The part mounting method includes: a first descent step S118 for lowing a next head to standby height according to operation time until the previous head descends to take out parts, when time required for operating a multi-attachment head from the time when parts are taken out by the previous head until other parts are taken out by the vertical movement of the next head; a second descent step S122 for translating the multi-attachment head after the parts are taken out by the previous head and lowering the next head to other parts; and a mounting step S124 for mounting the parts that have been taken out to the previous and next heads. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for mounting a component on a substrate, and more particularly, to a component mounting method for mounting a component on a substrate using a multi-mounting head having a plurality of heads.

  2. Description of the Related Art Conventionally, a component mounter including a multi-mounting head that is movable in the horizontal direction has been provided. The multi-mounting head includes a plurality of heads that move up and down.

  In such a component mounting method using a component mounter, first, the multi-mounting head moves horizontally toward the component supply unit of the component mounter. Therefore, the multi-mounting head moves horizontally on the component supply unit. At this time, when each of the plurality of heads of the multi-mounting head is disposed on a predetermined component supply port, the plurality of heads descend and pick up and take out the components supplied from the component supply port. The multi-mounting head that has picked up a plurality of components moves horizontally toward a board installed inside the component mounting machine. The multi-mounting head moves horizontally on the substrate. At this time, when the plurality of heads adsorbing the components are each positioned on a predetermined mounting point, the heads are lowered and the components are mounted on the mounting points. When the head descends and picks up or mounts the component, the head is set in advance at an angle corresponding to the component to be picked up or mounted, for example, when the multi-mounting head is moving horizontally. It is rotated.

  The component mounter repeatedly mounts such a series of operations to mount a number of components on a substrate and produce a mounting substrate.

  Here, all the heads of the multi-mounting head are at a reference height (hereinafter referred to as the reference height) except when picking up and mounting the parts, and when picking up and mounting the parts Then, it descends from its reference height.

  On the other hand, the multi-mounting head may move horizontally by a minute distance from the position where the previous head descends in the order of adsorption to adsorb the component so that the next head descends and adsorbs the component. Similarly, the multi-mounting head may move horizontally by a minute distance from the position where the previous head descends in the mounting order to mount the component and the next head descends to mount the component.

  As a result, when the small distance of the multi mounting head is extremely shorter than the reference height, the descending time of the next head is significantly longer than the moving time of the multi mounting head (including the rotation time of the next head). It may end up. That is, even if the suction or mounting by the previous head is completed and the horizontal movement of the multi mounting head and the lowering of the next head are started at the same time for the suction or mounting of the next head, While the movement of only the distance is completed quickly, the next head continues to descend for a while after that. Therefore, the descending time of the next head is wasted, and the production time of the mounting board including the component suction time and the component mounting time becomes long.

Therefore, a component mounting method has been proposed in which the height of the next head is lowered in advance to a predetermined height (see, for example, Patent Document 1).
JP-A-11-330786

  However, even the component mounting method disclosed in Patent Document 1 has a problem that the production time cannot be sufficiently shortened.

  That is, in the component mounting method disclosed in Patent Document 1, the predetermined height of the next head is fixed regardless of the horizontal movement distance of the multi-mounting head. When the height is extremely shorter than the predetermined height, the production time becomes long as described above, and the production efficiency is lowered.

  Therefore, the present invention has been made in view of such problems, and an object thereof is to provide a component mounting method that shortens the production time including the component adsorption time and the component mounting time to improve the production efficiency. To do.

  In order to achieve the above object, a component mounting method according to the present invention uses a multi-mounting head including first and second heads, horizontally moves the multi-mounting head, and the first and second heads. Is moved up and down to cause the first and second heads to take out the first and second components from the component supply unit and mount them on the board, wherein the first head causes the first and second parts to be mounted. When the time required for the operation of the multi-mounting head from the time when one part is taken out until the second part can be taken out by the vertical movement of the second head is taken as the operation time, A first lowering step of lowering the second head to a standby height corresponding to the operation time until the first head is lowered and the first component is taken out; A second lowering step of horizontally moving the multi-mounting head and lowering the second head to the second part after the first part is taken out by one head; A mounting step of mounting the first and second components picked up by the first and second heads on a substrate with respect to the second head. For example, in the first lowering step, the second head is lowered to the standby height that becomes lower as the operation time is shorter.

  As a result, the second head is lowered to the standby height before the first head is lowered and the first part is taken out. Here, when the operation time of the multi mounting head is short, the standby height is low. Therefore, in the second descending step, the multi mounting head performs horizontal movement and the like, and the second head moves up and down. The timing at which the second head reaches the second component can be brought closer to the timing at which the second component can be removed. In other words, even after the multi-mounted head has finished the operation such as the horizontal movement, it is possible to save time that the second head continues to descend for a while. As a result, it is possible to shorten the part adsorption time, that is, the production time and improve the production efficiency.

  The component mounting method may further include a height calculation step of calculating the standby height based on the operation time. For example, in the height calculation step, the height from the surface of the second component corresponding to the distance that the second head can descend during the operation time is calculated as the standby height. Alternatively, the component mounting method further includes a time specifying step of specifying a time required for horizontal movement of the multi-mounting head or rotation of the second head as the operation time.

  Thereby, in the second descending step, the timing at which the second head reaches the second component can be more accurately approximated to the timing at which the second component can be taken out.

  In the height calculation step, a height separated from the surface of the second component by a distance that the second head can descend during a total time of a predetermined margin time and the operation time is set. The standby height may be calculated.

  As a result, the timing at which the second head reaches the second component is later than the timing at which the above-mentioned second component can be taken out, so that the second head is incomplete. Can be prevented from reaching the second part, and the second part can be taken out accurately and safely.

The component mounting method further includes a determination step of determining whether the first and second heads can simultaneously suck and take out the first and second components,
When it is determined in the determination step that the suction cannot be performed at the same time, the second head is lowered in the first lowering step, and the multi-mounting head is horizontally moved in the second lowering step. In addition, the second head may be lowered.

  For example, when the first and second components supplied from the component supply unit are arranged at equal intervals with the first and second heads of the multi-mounting head, the first and second components The head can simultaneously suck and take out the first and second parts (simultaneous suction). However, when the arrangement of the first and second components is slightly shifted, the position of the multi-mounting head for sucking the first component and the multi-mounting head for sucking the second component Must be separated from the position by a small distance. That is, in such a case (in the case of quasi-simultaneous adsorption), the problem as in the conventional case is remarkably generated.

  Therefore, in the present invention, it is determined whether or not the first and second parts can be simultaneously sucked and taken out, that is, whether or not simultaneous suction is possible. Is lowered to the standby height, so that the first and second parts are also determined when it is determined that simultaneous suction cannot be performed on the first and second parts scheduled to be simultaneously sucked. The time required to adsorb and take out each can be brought close to the time required for simultaneous adsorption.

  The component mounting method further includes a grouping step for grouping a plurality of heads provided in the multi-mounting head, and for all the heads belonging to the group for each group generated in the grouping step. And a simultaneous suction step for simultaneously picking up and taking out parts, wherein the simultaneous suction step includes the first and second lowering steps, and the first lowering step includes the first head. The group including the second head is lowered to a standby height corresponding to the operation time until the plurality of parts are taken out by lowering, and in the second lowering step, the group including the first head After the plurality of parts are taken out, the multi-mounting head is moved horizontally and the second head It may be characterized by lowering the group comprising up to several other components.

  As a result, the plurality of heads provided in the multi-mounted head are classified into groups of heads that can be sucked simultaneously. For example, all the heads in the group pick up at the same time, and the group that picks up first descends. In parallel with this, the group that performs the next suction is lowered to the standby height. Therefore, the component suction time can be further shortened by causing the plurality of heads of the multi-mounting head to actively perform simultaneous suction.

  The present invention can be realized not only as such a component mounting method, but also as a component mounter that performs component mounting by the method, a program, and a storage medium that stores the program.

  The component mounting method of the present invention has an effect that the production time including the component adsorption time and the component mounting time can be shortened to improve the production efficiency.

  Hereinafter, a component mounter for mounting a component on a substrate using the component mounting method according to the embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a component mounter according to an embodiment of the present invention.

  The component mounting machine 100 according to the present embodiment improves the productivity of the mounting substrate by shortening the component adsorption time and the mounting time, and includes two component mounting units 100a and 100b for mounting components. Note that the mounting board is a board on which components are mounted.

  The component mounting unit 100 a includes two component supply units 102 that supply a plurality of components, and mounts components supplied from these component supply units 102 on the board 2 that is carried in from the carry-in port 101. And the component mounting unit 100a carries out the board | substrate 2 with which the component was mounted in the component mounting unit 100b.

  The component mounting unit 100b has substantially the same configuration as the component mounting unit 100a. That is, the component mounting unit 100b includes two component supply units 102 that supply a plurality of components, and the components supplied from these component supply units 102 are unloaded from the component mounting unit 100a and loaded into the component mounting unit 100b. It mounts with respect to the board | substrate 2 made. And the component mounting unit 100b carries out the board | substrate 2 with which the component was mounted out of the component mounting unit 100b.

  FIG. 2 is an internal configuration diagram of the component mounting unit 100 a of the component mounter 100. That is, FIG. 2 shows a configuration on the upper surface side of the component mounting unit 100a from which the housing is removed.

  The component mounting unit 100a includes two component supply units 102, a base 103, X-axis tables 104a and 104b, Y-axis tables 105a and 105b, two transport paths 106, and two multi-mounting heads 110. Two component recognition cameras 120 are provided.

  In FIG. 2, the arrangement direction of the component mounting units 100a and 100b is the X-axis direction, and the direction perpendicular to the X-axis direction along the horizontal plane is the Y-axis direction.

  The two transport paths 106 are disposed on the base 103 so as to be parallel to each other along the X-axis direction. Such a conveyance path 106 guides the substrate 2 so that the substrate 2 is conveyed along the X-axis direction. That is, the conveyance path 106 guides the board 2 carried in from the carry-in port 101 to the mounting stage at the substantially central portion of the base 103, and guides the board 2 on which the components are mounted to the component mounting unit 100b.

  The Y-axis tables 105a and 105b are arranged on both edge sides of the base 103 so as to be parallel along the Y-axis direction.

  The X-axis tables 104a and 104b are parallel to each other along the X-axis direction and are slidably installed along the Y-axis tables 105a and 105b. The X-axis tables 104a and 104b move in the Y-axis direction by driving a Y-axis motor (not shown).

  The multi-mounting head 110 takes out components supplied from the component supply unit 102 and mounts them on the substrate 2 arranged on the mounting stage, and is slidably installed on each of the X-axis tables 104a and 104b. Yes. The multi-mounting head 110 moves in the X-axis direction by driving an X-axis motor (not shown). That is, the multi mounting head 110 moves in the X axis direction and the Y axis direction (horizontal direction) by driving the X axis motor and the Y axis motor.

  The multi-mounting head 110 includes eight heads 112 and a board recognition camera 111.

  The eight heads 112 are arranged in 4 (X-axis direction) × 2 (Y-axis direction). These heads 112 absorb the components supplied from the component supply unit 102 by taking the negative pressure inside the head 112 and take out the components. A nozzle suitable for the part to be sucked is attached to the tip of each head 112. Accordingly, each head 112 sucks a component through a nozzle attached to the tip.

  The board recognition camera 111 recognizes the position of the board 2 placed on the mounting stage, and images the board recognition mark formed on the board 2 in order to mount the component at an accurate position on the board 2.

  Such a multi-mounting head 110 sucks the components supplied from the component supply unit 102 and moves them to the substrate 2, mounts the sucked components one by one on the substrate 2, and moves to the component supply unit 102 again. To do. A series of operations by the multi mounting head 110 is called a turn. When the multi-mounting head 110 moves from the component supply unit 102 to the board 2, it passes over the component recognition camera 120.

  Also, one of the two component mounting units 110 is assigned to one of the two multi mounting heads 110, and the other of the two component mounting units 102 is allocated to the other of the two multi mounting heads 110. The other is assigned. That is, one multi mounting head 110 does not perform an operation of taking out components from each of the two component supply units 102, and takes out components from only one component supply unit 102 assigned in advance.

  Further, the two multi-mounting heads 110 perform so-called alternating driving. That is, when one of the multi mounting heads 110 mounts a component on the board 2, the other multi mounting head 110 takes out the component from the component supply unit 102, and conversely, the other multi mounting head 110 mounts the component. When mounted on the substrate 2, one multi mounting head 110 takes out a component from the component supply unit 102.

  The component recognition camera 120 captures an image of the component sucked by each head 112 of the multi-mounting head 110 from below. This imaging result indicates a shift between the head 112 and the component, and is used for determining a component suction position for suppressing the shift after the next turn.

  The two component supply units 102 are arranged to face each other with the two conveyance paths 106 interposed therebetween.

  The component supply unit 102 includes a plurality of component cassettes 200 for pulling out the component tape from the component reel on which the component tape is wound.

  FIG. 3 is a diagram showing a component reel and a component tape.

  A component tape 211 that holds the component P is wound around the component reel 210. The component tape 211 includes, for example, a carrier tape 212 in which a plurality of storage recesses 212a are formed, and a cover tape 213 that is attached to the upper surface of the carrier tape 212 in a state where the component P is stored in the storage recess 212a. That is, the plurality of parts P are packaged by the carrier tape 212 and the cover tape 213.

  Note that the component tape 211 may be composed of a member other than the carrier tape 212 and the cover tape 213 as shown in FIG. For example, instead of the carrier tape 212, an adhesive tape or a paper tape that adheres and fixes components may be used.

  FIG. 4 is a diagram showing a component cassette 200 and a component reel 210 provided in the component supply unit 102.

  The component cassette 200 pulls out the component tape 211 from the component reel 210 as described above from the front end side thereof, and peels the cover tape 213 of the pulled out component tape 211 from the carrier tape 212. In the component cassette 200, the components P in the storage recess 212 a exposed by peeling the cover tape 213 are arranged one by one below the component supply port 201 of the component cassette 200.

  As a result, the components P stored in the storage recess 212 a of the carrier tape 212 appear in order from the component supply port 201 of the component cassette 200 and are supplied as components that are attracted to the multi-mounting head 110.

  FIG. 5 is a diagram illustrating a positional relationship between each head 112 of the multi-mounting head 110 and each component cassette 200 of the component supply unit 102.

  The head 112 moves in the up-down direction, that is, the Z-axis direction (direction perpendicular to the X-axis direction and the Y-axis direction) by driving a Z-axis motor (not shown), and the θ-axis motor (not shown). By driving, the head 112 rotates around the rotation axis C along the Z-axis direction. Further, as described above, the nozzle 113 suitable for the component to be attracted is attached to the tip of the head 112.

  The multi mounting head 110 and the component supply unit 102 simultaneously suck a plurality of components of the component supplying unit 102 by the movement (horizontal movement) of the multi mounting head 110 in the X-axis direction and the Y-axis direction. It is configured to be able to.

  That is, the interval d between the adjacent heads 112 arranged along the X-axis direction of the multi-mounting head 110 is equal to the interval between the component supply ports 201 of the adjacent component cassettes 200 arranged along the X-axis direction. .

  Therefore, the multi-mounting head 110 moves in the horizontal direction, so that the four heads 112 (nozzles 113) arranged along the X-axis direction are replaced by the four component cassettes 200 arranged along the X-axis direction. It can be made to oppose the component supply port 201.

  As a result, if the component P of the component cassette 200 is correctly arranged, the four heads 112 are simultaneously lowered to bring the tip of the nozzle 113 into contact with the upper surface of the component P, and the component P is sucked and raised. can do. That is, the multi-mounting head 110 can simultaneously pick up the four components P and take them out from the component supply unit 102.

  In such a component mounting machine 100 (component mounting units 100a and 100b) in the present embodiment, when quasi-simultaneous suction and quasi-simultaneous mounting described later are performed, the head 112 is lowered in the suction order or mounting order. At the same time, it is characterized in that the next head 112 is lowered to a standby height corresponding to the operation time of the multi-mounted head 110. The operation time of the multi mounting head 110 described above is a time required for horizontal movement of the multi mounting head 110 and rotation of the next head 112.

  FIG. 6 is a diagram showing a functional configuration of a control system of the component mounting unit 100a in the present embodiment. In FIG. 6, only the functional configuration necessary for performing component mounting using one multi mounting head 110 in the component mounting unit 100 a is shown.

  The component mounting unit 100a includes a control unit 130, a component mounting data storage unit 131, a component arrangement data storage unit 132, a board recognition camera 111, a component recognition camera 120, a deviation amount detection unit 135, and a standby height calculation. Unit 136, operation time specifying unit 137, quasi-simultaneous adsorption determination unit 138, quasi-simultaneous mounting determination unit 139, motor control unit 140, X-axis motor 141, Y-axis motor 142, and Z-axis motor 143 And a θ-axis motor 144.

  As described above, the X-axis motor 141 moves the multi mounting head 110 in the X-axis direction along the X-axis table 104a.

  As described above, the Y-axis motor 142 moves the X-axis table 104a, that is, the multi-mounting head 110 attached to the X-axis table 104a, in the Y-axis direction along the Y-axis tables 105a and 105b.

  As described above, the Z-axis motor 143 moves each head 112 of the multi-mounting head 110 in the Z-axis direction, and the θ-axis motor 144 rotates each head 112 of the multi-mounting head 110 around the rotation axis C. .

  The motor control unit 140 drives the X-axis motor 141, the Y-axis motor 142, the Z-axis motor 143, and the θ-axis motor 144 based on instructions from the control unit 130.

  The component mounting data storage unit 131 stores in advance component mounting data indicating the name, mounting point, orientation, and the like of the component P to be mounted on the board 2. This mounting point indicates the position on the substrate 2 where the component P is to be mounted.

  The component arrangement data storage unit 132 stores in advance component arrangement data indicating the name and position of the component P supplied from the component supply unit 102.

  The deviation amount detection unit 135 detects the deviation amount of the component P attracted to the head 112 based on the imaging result of the component recognition camera 120 in association with the component cassette 200 that supplied the component P. Such a displacement amount of the component P is used to adjust the component suction position of the multi-mounting head 110 and the component suction angle of the head 112. Here, the component suction position is a position on the XY plane where the multi mounting head 110 should be positioned in order for the multi mounting head 110 to suck the component P from the component supply unit 102. The component adsorption angle is an angle that the head 112 of the multi-mounting head 110 should rotate about the rotation axis C in order to adsorb the component P from the component supply unit 102. Further, the displacement amount of the component P includes a horizontal displacement width with respect to the nozzle 113 of the head 112 sucking the component P, and an inclination (an angle of displacement) of the component P with respect to the nozzle 113.

  For example, if a part P is taken out from a predetermined part cassette 200 and a deviation amount with respect to the part P is detected, the deviation amount will be eliminated when the part P is taken out from the predetermined part cassette 200 in the future. In addition, the component suction position of the multi-mounting head 110 and the component suction angle of the head 112 are adjusted.

  The quasi-simultaneous suction determination unit 138 determines whether or not to perform quasi-simultaneous suction on the plurality of heads 112 that are determined to perform the simultaneous suction based on component mounting data, component arrangement data, and the like. Here, the quasi-simultaneous adsorption means that a plurality of heads 112 that are scheduled to perform simultaneous adsorption cannot perform simultaneous adsorption due to the above-described displacement or inclination of the component P, and those heads 112 are mounted in multiple positions. This means that the component P is sucked with the horizontal movement of the head 110 by a minute distance.

  The semi-simultaneous mounting determination unit 139 determines whether or not semi-simultaneous mounting is performed on the multi-mounting head 110 that is sucking the component P. Here, the quasi-simultaneous mounting means that the plurality of heads 112 that are sucking the component P mount the component P on the substrate 2 with the horizontal movement of the multi-mounting head 110 by a minute distance.

  The operation time specifying unit 137 specifies the operation time of the multi-mounting head 110 when quasi-simultaneous adsorption or quasi-simultaneous mounting is performed.

  That is, when quasi-simultaneous suction is performed, the operation time specifying unit 137 only moves the head 112 to be sucked next after the head 112 to be picked up before the multi-mounting head 110 sucks the component P. The operation time of the multi-mounting head 110 required until the other parts P can be picked up is specified. Specifically, the operation time specifying unit 137 determines the X direction in which the multi-mounting head 110 should move in the X-axis direction in order to suck the next head 112 semi-simultaneously after the previous head 112 sucks the component P. The movement time, the Y-direction movement time for the multi-mounted head 110 to move in the Y-axis direction, and the rotation time for the next head 112 to rotate about the rotation axis C are specified. Then, the operation time specifying unit 137 specifies the longest time among the X direction movement time, the Y direction movement time, and the rotation time as the operation time of the multi mounting head 110.

  Further, when quasi-simultaneous mounting is performed, the operation time specifying unit 137 performs only the vertical movement of the head 112 to be mounted next after the head 112 to be mounted before the multi-mounting head 110 mounts the component P. The operation time of the multi-mounting head 110 required until a state where another component P can be mounted is specified. Specifically, the operation time specifying unit 137 moves the multi mounting head 110 in the X-axis direction in order to mount the next head 112 semi-simultaneously after the previous head 112 has mounted the component P on the substrate 2. The X direction movement time, the Y direction movement time for the multi-mounted head 110 to move in the Y axis direction, and the rotation time for the next head 112 to rotate around the rotation axis C are specified. Then, the operation time specifying unit 137 specifies the longest time among the X direction movement time, the Y direction movement time, and the rotation time as the operation time of the multi mounting head 110.

  The standby height calculation unit 136 determines the standby height in the Z-axis direction of the head 112 to be suctioned or mounted next to the multi-mounting head 110 when quasi-simultaneous suction or quasi-simultaneous mounting is performed. Is calculated based on the operation time specified by.

  In other words, when the quasi-simultaneous suction is performed, the standby height calculation unit 136, when the head 112 to be sucked first picks up the component P, the head 112 to be picked up next is the head 112 that should be waiting. Is determined based on the operation time at that time. The standby height here is indicated as a distance in the Z-axis direction from the surface of the component P arranged in each component supply port 201 of the component supply unit 102 to the lower end of the nozzle 113 of the head 112.

  When semi-simultaneous mounting is performed, when the head 112 to be mounted first mounts the component P, the standby height calculation unit 136 causes the head 112 to be mounted next to wait. Is determined based on the operation time at that time. The standby height here is indicated as the distance in the Z-axis direction from the surface of the substrate 2 to the lower surface of the component P sucked by the nozzle 113 of the head 112.

  FIG. 7 is an explanatory diagram for explaining a method by which the standby height calculation unit 136 calculates the standby height.

  The standby height calculation unit 136 adds a predetermined margin time tb to the operation time ta specified by the operation time specification unit 137. Then, the standby height calculation unit 136 calculates, as the standby height h0, the distance that the next head 112 can descend during the total time that is the addition result. That is, the standby height calculation unit 136 calculates the standby height h0 = ((operation time ta + room time tb) × head 112 descending speed v). Further, when the standby height h0 becomes higher than the reference height h1 as a result of the calculation, the standby height calculation unit 136 sets the standby height to h1. That is, in this case, the head 112 moves as in the conventional case.

  The reference height h1 is the height of the head 112 that should be normally arranged at the time of suction and mounting. This reference height h1 is the distance in the Z-axis direction from the surface of the component P arranged at each component supply port 201 of the component supply unit 102 to the lower end of the nozzle 113 of the head 112 during suction, similarly to the standby height h0. As shown. Further, the reference height h1 is indicated as a distance in the Z-axis direction from the surface of the substrate 2 to the lower surface of the component P attracted to the nozzle 113 of the head 112 at the time of mounting, similarly to the standby height h0.

  Therefore, as shown in FIG. 7, the standby height h0 is proportional to the operation time ta between the times ta1 and ta4, and increases monotonously with the increase in the operation time ta. In a range where the operating time ta is equal to or longer than the time ta4, the standby height h0 is the reference height h1.

  The standby height calculation unit 136 calculates the standby height h0 as the height h01 when the operation time ta is between the times ta1 and ta2, and the standby height h0 when the operation time ta is between the times ta2 and ta3. May be calculated as the height h02, and the standby height h0 may be calculated as the height h03 when the operation time ta is between the times ta3 and ta4. Further, the distance that the multi-mounting head 112 moves in the X-axis direction or the Y-axis direction during the time ta4 during the suction is, for example, 1 mm.

  From the component mounting data, the component arrangement data, and the like, the control unit 130 mounts each component P so that productivity (throughput) is improved, for example, and a group of components P to be mounted in one turn (hereinafter referred to as a task). ) And so on. Furthermore, the control unit 130 specifies a plurality of heads 112 that can be sucked simultaneously for each task.

  Further, when the component P is picked up by the multi-mounting head 110, the control unit 130 specifies the coordinates of the part P to be picked up supplied from the part supply unit 102 from the part arrangement data, and uses the coordinates of the part P. The component suction position of the multi mounting head 110 is calculated. Then, the control unit 130 instructs the motor control unit 140 to drive the multi mounting head 110 by notifying the motor control unit 140 of the component suction position. Here, when the shift amount is detected by the shift amount detection unit 135, the control unit 130 adjusts the component suction position and the component suction angle according to the shift amount, and the adjusted component suction position and the component suction are adjusted. The motor controller 140 is notified of the angle.

  As a result, the motor control unit 140 controls the motors 141 to 144 according to the adjusted component suction position, thereby moving the multi-mounting head 110 to an appropriate position and setting the head 112 to an appropriate angle. The component P is accurately attracted to the head 112 of the multi-mounting head 110 by rotating.

  When the control unit 130 simultaneously picks up a plurality of components P on the multi-mounting head 110, the shift detected by the shift amount detection unit 135 with respect to each component cassette 200 storing the components P to be simultaneously picked up. The amount is acquired, and the component suction position and the component suction angle for simultaneous suction are calculated so that the shift amount of all the components P to be simultaneously suctioned will be eliminated in the future based on the amount of shift.

  Further, when the component P is mounted on the board 2 by the multi-mounting head 110, the control unit 130 specifies the mounting point and orientation of the part P to be mounted on the board 2 from the component mounting data. Then, the control unit 130 notifies the motor control unit 140 of the mounting point and orientation, thereby instructing the motor control unit 140 to drive the multi mounting head 110.

  As a result, the motor control unit 140 first controls the motors 141 to 144 to move the multi mounting head 110 onto the substrate 2 and causes the substrate recognition camera 111 of the multi mounting head 110 to recognize the substrate 2. The mark for the image is taken. Then, the motor control unit 140 moves the multi-mounting head 110 so that the component P attracted to the head 112 is positioned on the mounting point notified from the control unit 130 with reference to the position of the mark. . At this time, the motor control unit 140 rotates the head 112 so that the direction of the component P attracted to the head 112 is directed to the direction notified from the control unit 130. Then, the motor control unit 140 lowers the head 112 to accurately mount the component P attracted by the head 112 at the mounting point.

  In the present embodiment, the first lowering means is composed of the control unit 130, the motor control unit 140, and the Z-axis motor 143, and the second lowering means and the mounting means are the control unit 130 and the motor control unit 140. And motors 141 to 144.

  FIG. 8 is an explanatory diagram for explaining the simultaneous adsorption and the quasi-simultaneous adsorption in the present embodiment.

  For example, as shown in FIG. 8A, the control unit 130 has four heads 112 arranged in the X-axis direction of the multi-mounting head 110 continuously based on component mounting data and component arrangement data. It is determined that the parts P supplied from the four arranged part cassettes 200 (part cassettes 200a, 200b, 200c, 200d) should be picked up simultaneously.

  Here, each component P supplied from the four component cassettes 200 is arranged without deviating from a predetermined position or orientation in the component supply port 201.

  Therefore, the control unit 130 acquires a deviation amount indicating 0 for each component cassette 200 from the deviation amount detection unit 135. As a result, the control unit 130 determines that the multi-mounting head 110 is configured such that the tips of the nozzles 113 of the four heads 112 arranged in the X-axis direction face the centers of the four parts P, respectively, based on the part arrangement data. The component suction position is calculated.

  In FIG. 8, the position of the multi-mounting head 110 is shown by projecting a straight line L <b> 1 connecting the tip centers of the four nozzles 113 onto the component supply unit 102. That is, the control unit 130 calculates the component suction position of the multi-mounting head 110 such that the projected straight line L1 overlaps the center of the four components P when all the deviation amounts are zero.

  Here, the semi-simultaneous suction determination unit 138 should perform simultaneous suction based on the component suction position calculated by the control unit 130 and the shift amount calculated for each component cassette 200 by the shift amount detection unit 135. It is determined whether or not the previous judgment should be changed, that is, whether or not the quasi-simultaneous adsorption should be performed. In the case of the above-described example, since all the deviation amounts are 0, the quasi-simultaneous adsorption determination unit 138 determines that quasi-simultaneous adsorption should not be performed.

  When the control unit 130 receives the determination that the quasi-simultaneous suction determination unit 138 should not perform quasi-simultaneous suction, the control unit 130 notifies the motor control unit 140 of the calculated component suction position.

  As a result, when the multi-mounting head 110 is disposed at the above-described component suction position, the four heads 112 of the multi-mounting head 110 can be simultaneously lowered to simultaneously suck the four components P.

  On the other hand, when the amount of deviation in the horizontal direction with respect to each component cassette 200 calculated by the deviation amount detection unit 135 is not zero, the control unit 130 calculates the component supply position for simultaneous suction as described above. That is, the control unit 130 adjusts the component suction position, and the distances da and db between the straight line L1 projected on the component supply unit 102 and the center of each component P as shown in FIG. , Dc, dd are calculated so that the component suction position becomes as small as possible.

  The quasi-simultaneous suction determination unit 138 has predetermined distances da, db, dc, and dd based on the component suction position calculated by the control unit 130 and the shift amount detected for each component cassette 200. It is determined whether or not the value is below the threshold value. That is, the semi-simultaneous adsorption determination unit 138 determines that it should not be semi-simultaneous adsorption without changing the previous determination that it should be simultaneously adsorbed if it is below the threshold, and if it is not below the threshold, The previous judgment that the simultaneous adsorption should be performed is changed to determine that the semi-simultaneous adsorption should be performed. The above threshold value is, for example, 10% of the dimension of the component P. If the dimension of the component P is 0.5 mm, the threshold value is 0.05 mm.

  When the controller 130 receives the determination that the quasi-simultaneous adsorption determination unit 138 should not perform quasi-simultaneous adsorption, as described above, the controller 130 notifies the motor controller 140 of the component adsorption position adjusted as described above.

  As a result, when the multi-mounting head 110 is disposed at the above-described component suction position, the four heads 112 of the multi-mounting head 110 can be simultaneously lowered to simultaneously suck the four components P. At this time, the deviation width between the nozzle 113 of the head 112 and the component P is equal to or less than the threshold value.

  By the way, when the variation becomes large in the horizontal shift amount with respect to each component cassette 200 calculated by the shift amount detection unit 135, the above-mentioned distance da, There are cases where db, dc, and dd cannot be kept below the threshold.

  In such a case, the semi-simultaneous adsorption determination unit 138 changes the previous determination that the simultaneous adsorption should be performed and determines that the semi-simultaneous adsorption should be performed.

  For example, as shown in FIG. 8C, when the component P of the component cassette 200b is far away from the components P of the other component cassettes 200a, 200c, and 200d, the calculation is performed as described above. At one component suction position, all the distances da, db, dc, and dd cannot be kept below the threshold value.

  Therefore, when the control unit 130 receives the determination that the quasi-simultaneous adsorption determination unit 138 should perform the quasi-simultaneous adsorption, it recalculates a plurality of component adsorption positions. That is, the control unit 130 divides the four heads 112 that are supposed to be simultaneously picked up into a plurality of groups that can actually be picked up at the same time, and calculates a part picking position for each group. Such calculation of the component suction position is repeatedly performed until the quasi-simultaneous suction determination unit 138 determines that the distances da, db, dc, and dd are within the threshold value.

  As a result, for example, as shown in FIG. 8C, the control unit 130 determines that distances da, dc, and dd between the straight line L1a projected on the component supply unit 102 and the center of each component P are equal to or less than a threshold value. The first component suction position that falls within the range is calculated. Furthermore, the control unit 130 calculates a second component suction position such that the distance db between the straight line L1b projected on the component supply unit 102 and the center of the component P of the component cassette 200b is within a threshold value.

  That is, the control unit 130 divides the four heads 112 into two groups, sets the three heads 112 corresponding to the component cassettes 200a, 200c, and 200d as one group that can be picked up simultaneously, and sets one head corresponding to the component cassette 200b. Let the head 112 be one group capable of simultaneous suction. Note that simultaneous suction is impossible with only one head 112, but even with only one head 112, it is formally divided into the above groups.

  As a result, the multi-mounting head 110 moves to the above-described first component suction position, where the three heads 112 are simultaneously lowered to simultaneously suck the three components P of the component cassettes 200a, 200c, and 200d. Thereafter, the multi-mounting head 110 horizontally moves to the above-described second component suction position by a minute distance, where one head 112 sucks the component P of the component cassette 200b. In this way, quasi-simultaneous adsorption by the four heads 112 is performed.

  FIG. 9 is an explanatory diagram for explaining the movement of the multi-mounting head 110 quasi-simultaneously sucking four parts P. FIG. FIG. 8 shows an example of the quasi-simultaneous suction performed when the position of the component supplied from the component cassette 200 is shifted in the Y-axis direction, but in FIG. 9, the position of the component is in the X-axis direction. An example of quasi-simultaneous adsorption performed when there is a deviation is shown.

  First, the multi-mounting head 110 is moved horizontally to the component suction position calculated by the control unit 130, so that the nozzles of the three heads 112 (heads 112a, 112b, and 112c) as shown in FIG. The center of the tip of 113 is opposed to the center of the component P supplied from the three component cassettes 200 (component cassettes 200a, 200b, 200c).

  At this time, the four heads 112 (heads 112a, 112b, 112c, and 112d) are at a height indicated by the reference height h1 in the Z-axis direction from the surface of each component P of the component supply unit 102. That is, the height from the surface of each component P to the tips of the nozzles 113 of the four heads 112 is standardized to the reference height h1. For example, the reference height h1 is 8 mm. At this time, the center of the tip of the nozzle 113 of the head 112d is shifted by a minute distance d1 in the X-axis direction without facing the center of the component P of the component cassette 200d.

  Then, as shown in FIG. 8B, the heads 112a, 112b, and 112c are respectively lowered toward the component P, and the head 112d is lowered to the standby height h0. That is, the height from the surface of the component P to the tip of the nozzle 113 of the head 112d is the standby height h0.

  Next, as shown in FIG. 8C, the multi-mounting head 110 moves by a minute distance d1 in the X-axis direction at the timing when the heads 112a, 112b, and 112c are lifted by sucking the parts P, respectively. At this time, the head 112d descends simultaneously with the movement of the multi-mounting head 110, and sucks the component P of the component cassette 200d. When the component P of the component cassette 200d is tilted, the head 112d rotates simultaneously with the movement of the multi-mounting head 110.

  FIG. 10 is a diagram illustrating the operation timing of the vertical movement of the four heads 112 and the horizontal movement of the multi-mounting head 110. 10A shows the vertical movement of the head 112a shown in FIG. 9, and FIG. 10B shows the vertical movement of the head 112b shown in FIG. 10C shows the vertical movement of the head 112c shown in FIG. 9, and FIG. 10D shows the vertical movement of the head 112d shown in FIG. Further, FIG. 10E shows the horizontal movement of the multi mounting head 110 shown in FIG.

  As shown in FIGS. 10A, 10B, and 10C, each of the heads 112a, 112b, and 112c starts descending from the reference height h1 at time t1, and the nozzles of the heads at time t3. The tip of 113 abuts against the component P. The heads 112a, 112b, and 112c respectively pick up the component P and start rising at time t4, and return to the original reference height h1 at time t9.

  On the other hand, as shown in FIG. 10 (d), the head 112d starts descending from the reference height h1 at time t1 simultaneously with the heads 112a, 112b, 112c, and reaches the standby height h0 at time t2. To do. Then, the head 112d waits for a while at the standby height h0, and starts to descend again at time t5 immediately after the heads 112a, 112b, and 112c start to rise. This standby height h0 is a height calculated by the standby height calculation unit 136 based on the X-direction movement time during which the multi-mounting head 110 moves by a minute distance d1 in the X-axis direction.

  Here, as shown in FIG. 10E, the multi-mounting head 110 is moved from the component suction position X1 to the component suction position X2 at the same time when the head 112d is lowered from the standby height h0, that is, at time t5. Begins axial movement. The multi-mounting head 110 moves from the component suction position X1 by a minute distance d1, and reaches the component suction position X2 at time t6.

  As shown in FIG. 10D, the nozzle 113 of the head 112d contacts the component P of the component cassette 200d at time t7 immediately after the multi-mounting head 110 reaches the component suction position X2. Then, the head 112d picks up the component P, starts to rise at time t8, and returns to the original reference height h1 at time t11.

  By the way, conventionally, the head 112d starts to descend from the reference height h1 at time t5 when the multi-mounted head 110 starts moving in the X-axis direction, as indicated by a broken line in FIG. As a result, the head 112d continues to descend even though the multi-mounting head 110 has already reached the component suction position X2 at time t6. As a result, the nozzle 113 of the head 112d comes into contact with the component P of the component cassette 200d at a time t10 for a while after the time t6.

  That is, in the present embodiment, the component suction time in one turn can be shortened by the time from time t7 to time t10.

  FIG. 11 is a flowchart showing an operation in which the component mounting unit 100a according to the present embodiment performs component mounting. In addition, FIG. 11 shows the operation | movement which adsorb | sucks the component P in detail.

  First, the control unit 130 prescribes a plurality of heads 112 to be sucked simultaneously from the eight heads 112 of the multi-mounting head 110 based on the component mounting data and the component arrangement data. (Selected simultaneous suction head) is selected (step S100).

  Next, the deviation amount detection unit 135 detects the deviation amount based on the imaging result of the component recognition camera 120 (step S102). Then, the quasi-simultaneous adsorption determination unit 138 determines whether or not the quasi-simultaneous adsorption should be performed on the plurality of specified simultaneous adsorption heads selected in Step S100 based on the deviation amount detected in Step S102 (Step S100). S104).

  Here, when it is determined that the quasi-simultaneous adsorption should not be performed, that is, the simultaneous adsorption should be performed as defined in advance (N in Step S104), the control unit 130 determines according to the amount of deviation detected in Step S102. Then, the multi-mounting head 110 is driven by the motor control unit 140 or the like (step S106). That is, the control unit 130 horizontally moves the multi-mounting head 110 to the component suction position corresponding to the shift amount detected in step S102, and rotates the specified simultaneous suction head to the component suction angle corresponding to the shift amount. Then, the control unit 130 causes all the prescribed simultaneous suction heads to perform the simultaneous suction operation (step S108). That is, the control unit 130 simultaneously lowers all the specified simultaneous suction heads from the reference height h1, and sucks the component P on each of the specified simultaneous suction heads.

  On the other hand, when it is determined in step S104 that quasi-simultaneous adsorption should be performed, that is, actual simultaneous adsorption cannot be performed (Y in step S104), the control unit 130 selects a plurality of specified simultaneous adsorption heads selected in step S100. Is treated as a semi-simultaneous suction head. Then, the control unit 130 classifies the plurality of quasi-simultaneous adsorption heads into a plurality of groups (simultaneous adsorption groups) that can actually be simultaneously adsorbed based on the above-described deviation amount (step S110).

  Hereinafter, description will be made on the assumption that all the quasi-simultaneous adsorption heads are classified into a plurality of simultaneous adsorption groups, and a plurality of heads 112 belong to each simultaneous adsorption group.

  The controller 130 causes the motor controller 140 or the like to drive the multi-mounting head 110 for simultaneous suction by the previous simultaneous suction group in the suction order (step S112). That is, the control unit 130 horizontally moves the multi-mounted head 110 to the component suction position corresponding to the shift amount of the previous simultaneous suction group, and moves each head 112 of the previous simultaneous suction group to the component corresponding to the shift amount. Rotate to suction angle.

  Here, the operation time specifying unit 137 specifies the operation time of the multi-mounting head 110 necessary for the simultaneous suction by the next simultaneous suction group in the suction order (step S114). When the operation time is specified, the standby height calculation unit 136 calculates the standby height h0 of the next simultaneous suction group according to the operation time (step S116).

  Next, the control unit 130 causes the previous simultaneous suction group to perform the simultaneous suction operation, and simultaneously lowers the other simultaneous suction groups including the next simultaneous suction group to the standby height h0 calculated in step S116 ( Step S118). That is, the heads 112 belonging to all other simultaneous suction groups other than the previous simultaneous suction group start to descend simultaneously with the lowering of the heads 112 belonging to the previous simultaneous suction group, and stop at the above-described standby height h0. .

  Here, the control unit 130 determines whether or not there is a next simultaneous adsorption group (step S120). Further, when it is determined that there is a next simultaneous adsorption group (Y in step S120), the control unit 130, the operation time specifying unit 137, and the standby height calculation unit 136 repeatedly execute the operations from step S112. At this time, in the execution processing of the next steps S112 to S118, “next simultaneous suction group” in the previous execution processing of steps S112 to S118 is updated to “previous simultaneous suction group”. “Suction group” is updated to “next simultaneous suction group” and executed. When the operation from step S112 is repeatedly executed, the operation of step S112 and the operations of steps S114, S116, and S118 are executed in parallel. Further, when the operation from step S112 is repeatedly executed, when a standby height equal to or higher than the original standby height is calculated in step S116 for the simultaneous suction group that has already been lowered to the standby height, In step S118, the control unit 130 stops the simultaneous suction group at the original standby height without moving up and down.

  On the other hand, when it is determined in step S120 that there is no further simultaneous suction group (N in step S120), the control unit 130 sends the multi mounting head 110 to the motor control unit 140 or the like for the next simultaneous suction group. And the next simultaneous adsorption group is caused to perform the simultaneous adsorption operation (step S122). That is, the control unit 130 horizontally moves the multi-mounting head 110 by a minute distance to the component suction position according to the shift amount of the next simultaneous suction group, and sets each head 112 of the next simultaneous suction group to the shift amount. Rotate to the corresponding component suction angle. Further, in parallel with the horizontal movement and rotation described above, the control unit 130 simultaneously lowers the heads 112 of the next simultaneous suction group from the standby height h0 and causes the heads 112 to suck the parts P.

  Finally, the control unit 130 moves the multi-mounting head 110 that has attracted the component P in steps S108, S118, and S122 onto the substrate 2, and mounts the component P on each head 112 of the multi-mounting head 110 (step). S124).

  In the above-described example, in step S110, all the quasi-simultaneous adsorption heads are classified into a plurality of simultaneous adsorption groups, and a plurality of heads 112 belong to each simultaneous adsorption group. However, one head 112 that cannot perform simultaneous suction with any other head 112 may be classified into one simultaneous suction group. In this case, the adsorption operation of the simultaneous adsorption group in steps S118 and S122 is not a simultaneous adsorption operation but a single adsorption operation.

  In the above example, in step S118, all the simultaneous adsorption groups including the next simultaneous adsorption group are lowered to the standby height h0 calculated for the next simultaneous adsorption group. Only the group may be lowered to its standby height h0.

  Here, the mounting operation in step S124 shown in FIG. 11 will be described in detail below.

  FIG. 12 is an explanatory diagram for explaining the quasi-simultaneous mounting in the present embodiment.

  When one turn of the component P is attracted to the multi-mounting head 110, the control unit 130 of the component mounting unit 100a mounts each component P at a mounting point indicated by the component mounting data in a predetermined mounting order. Then, the multi mounting head 110 is moved to each component mounting position on the board 2. The component mounting position refers to a horizontal position of the multi mounting head 110 where the multi mounting head 110 should be positioned in order for one head 112 to mount the component P on the mounting point. Further, the control unit 130 rotates the head 112 that sucks the component P to a component mounting angle corresponding to the orientation of the mounting point indicated by the component mounting data. The component mounting angle is an angle at which the head 112 of the multi mounting head 110 should rotate around the rotation axis C in order to mount the component P in the direction of the mounting point indicated by the component mounting data. is there.

  Here, the quasi-simultaneous mounting determination unit 139 (see FIG. 6) determines whether or not quasi-simultaneous mounting is performed on the multi-mounting head 110 that sucks a plurality of components P based on the component mounting data. judge.

  For example, the quasi-simultaneous mounting determination unit 139 uses a component mounting position for mounting a component by the previous head 112 in the mounting order with respect to the multi mounting head 110 that sucks a plurality of components P, and the next head 112. It is determined that quasi-simultaneous mounting is performed when the distance in the X-axis direction and the Y-axis direction between the component mounting positions for component mounting is equal to or less than a predetermined threshold (hereinafter referred to as quasi-simultaneous mounting determination value). To do. The semi-simultaneous mounting determination value is 6 mm, for example.

  When the quasi-simultaneous mounting determination unit 139 determines that the quasi-simultaneous mounting is performed, the control unit 130 groups the heads 112 that are picking up the components P of the multi-mounting head 110 into the quasi-simultaneous mounting group (quasi-simultaneous mounting Implementation group). For example, the control unit 130 classifies the above-described head 112 and the next head 112 into one semi-simultaneous mounting group.

  Specifically, each of the eight heads 112 of the multi-mounting head 110 sucks the component P as shown in FIG. At this time, the control unit 130 uses the quasi-simultaneous mounting determination value and the like to move the eight heads 112 into a quasi-simultaneous mounting group indicated by “1” and a quasi-simultaneous mounting group indicated by “5”. Classify into: Further, the control unit 130 determines that the head 112 indicated by “2”, the head 112 indicated by “3”, and the head 112 indicated by “4” do not belong to the quasi-simultaneous mounting group.

  Then, the control unit 130 moves the multi-mounting head 110 to the component mounting position corresponding to the head 112 in order to cause the first head 112 of the semi-simultaneous mounting group indicated by “1” to mount the component. Then, the control unit 130 starts quasi-simultaneous mounting from the component mounting position, and causes all heads 112 included in the quasi-simultaneous mounting group indicated by “1” to mount components ((1) in FIG. 12). reference).

  That is, the first head 112 in the mounting order performs component mounting by descending at the above-described component mounting position. Thereafter, the multi-mounting head 110 moves to a component mounting position corresponding to the next head 112 in the mounting order by a minute distance (below the quasi-simultaneous mounting determination value). The next head 112 performs component mounting by rotating and lowering in parallel with the movement of the multi-mounting head 110. After that, as described above, the multi mounting head 110 further moves by a minute distance (below the quasi-simultaneous mounting determination value) to the component mounting position corresponding to the next head 112 in the mounting order. Further, the next head 112 performs component mounting by rotating and lowering in parallel with the movement of the multi-mounting head 110. In this way, semi-simultaneous mounting is performed.

  In the present embodiment, when such semi-simultaneous mounting is performed, the control unit 130 lowers the next head 112 to the above-described standby height when the previous head 112 is lowered and component mounting is performed. Let me. The standby height is calculated by the standby height calculation unit 136 based on a minute distance between the component mounting positions. Thereby, in this Embodiment, component mounting time can be shortened.

  Next, the control unit 130 responds to the component mounting position corresponding to the head 112 indicated by “2”, the component mounting position corresponding to the head 112 indicated by “3”, and the head 112 indicated by “4”. The multi mounting head 110 is sequentially moved to the component mounting position. Then, the control unit 130 lowers the head 112 at each component mounting position and causes the head 112 to mount components (see (2), (3), and (4) in FIG. 12).

  Further, the control unit 130 moves the multi-mounting head 110 to a component mounting position corresponding to the head 112 in order to cause the first head 112 of the semi-simultaneous mounting group indicated by “5” to mount the component. Then, as described above, the control unit 130 starts quasi-simultaneous mounting from the component mounting position, and causes all the heads 112 included in the quasi-simultaneous mounting group indicated by “5” to mount components (in FIG. 12). (See (5)).

  FIG. 13 is an explanatory diagram for explaining the movement in which the three heads 112 belonging to the quasi-simultaneous mounting group perform quasi-simultaneous mounting. Note that FIG. 13 shows a movement in which the three heads 112 of the quasi-simultaneous mounting group indicated by “1” in FIG. 12 perform quasi-simultaneous mounting.

  First, the multi-mounting head 110 moves horizontally to the component mounting position calculated by the control unit 130, so that the component P adsorbed by the head 112a is moved onto the substrate 2 as shown in FIG. The mounting point corresponding to the component P is opposed.

  At this time, the four heads 112 (heads 112a, 112b, 112c, and 112d) are at a height indicated by the reference height h1 in the Z-axis direction from the surface of the substrate 2. That is, the height from the surface of the substrate 2 to the lower surface of the component P attracted by the four heads 112 is unified to the reference height h1. For example, the reference height h1 is 8 mm.

  Then, as shown in FIG. 13B, the head 112a is lowered toward the mounting point on the substrate 2, and the heads 112c and 112d are lowered to the standby height h02. That is, the height from the surface of the substrate 2 to the lower surface of the component P attracted by the heads 112c and 112d is the standby height h02. Since the head 112b does not belong to the quasi-simultaneous mounting group indicated by “1”, the head 112b is maintained at the reference height h1.

  The standby height h02 at this time is based on the distance (the distance d11 shown in FIG. 13C) that the multi-mounting head 110 moves to the component mounting position for mounting the next head 112c in the mounting order. Calculated.

  Next, as shown in FIG. 13C, the multi-mounting head 110 moves to the next component mounting position in the X-axis direction (leftward in FIG. 13) at the timing when the head 112a mounts and lifts the component P. Move by distance d11. At this time, the head 112 c rotates and descends simultaneously with the movement of the multi-mounting head 110 to mount the sucked component P on the mounting point on the substrate 2. Further, the head 112d is lowered to the standby height h01 simultaneously with the lowering of the head 112c. That is, the height from the surface of the substrate 2 to the lower surface of the component P attracted to the head 112d is the standby height h01.

  The standby height h01 at this time is based on the distance (the distance d12 shown in FIG. 13D) that the multi mounting head 110 moves to the component mounting position for mounting the next head 112d in the mounting order. Is calculated.

  Then, as shown in FIG. 13D, the multi-mounting head 110 further moves to the next component mounting position in the X-axis direction (rightward in FIG. 13) at the timing when the head 112c mounts and lifts the component P. Move by distance d12. At this time, the head 112d rotates and descends simultaneously with the movement of the multi mounting head 110, and mounts the sucked component P on the mounting point on the substrate 2.

  FIG. 14 is a diagram illustrating operation timings of the vertical movement of the three heads 112 belonging to the quasi-simultaneous mounting group and the horizontal movement of the multi-mounting head 110. 14A shows the vertical movement of the head 112a shown in FIG. 13, FIG. 14B shows the vertical movement of the head 112c shown in FIG. 13, and FIG. The vertical movement of the head 112d shown in FIG. 13 is shown. Further, FIG. 14D shows horizontal movement of the multi mounting head 110 shown in FIG.

  As shown in FIG. 14A, the head 112a starts descending from the reference height h1 at time t1, and at time t3, the lower surface of the component P attracted by the head 112a is placed on the substrate 2. To the implementation point. The head 112a mounts the component P on the mounting point, starts to rise at time t4, and returns to the original reference height h1 at time t10.

  As shown in FIG. 14B, the head 112c starts descending from the reference height h1 at time t1 simultaneously with the head 112a, and reaches the standby height h02 at time t2. The head 112c waits for a while at the standby height h02, and starts to descend again at time t5 immediately after the head 112a starts to rise.

  Here, as shown in FIG. 14 (d), the multi mounting head 110 is moved from the component mounting position X3 to the component mounting position X1 at the same time as the head 112c descends from the standby height h02, that is, at time t5. Begins axial movement. The multi-mounting head 110 moves from the component mounting position X3 by a minute distance d11, and reaches the component mounting position X1 at time t7.

  As shown in FIG. 14 (b), the head 112c removes the lower surface of the component P attracted by the head 112c on the substrate 2 at time t8 immediately after the multi mounting head 110 reaches the component mounting position X1. Hit the mounting point. The head 112c mounts the component P at the mounting point, starts to rise at time t9, and returns to the original reference height h1 at time t16.

  As shown in FIG. 14C, the head 112d starts descending from the reference height h1 at the time t1 simultaneously with the heads 112a and 112c, and reaches the standby height h02 at the time t2. Then, similarly to the head 112c, the head 112d waits for a while at the standby height h02, and starts to descend again at time t5 immediately after the head 112a starts to rise. As a result, the head 112d reaches the standby height h01 at time t6. Here, the head 112d waits for a while at the standby height h01, and starts to descend again at time t10 immediately after the head 112c starts to rise.

  Here, as shown in FIG. 14 (d), the multi-mounting head 110 moves from the component mounting position X1 to the component mounting position X2 at the same time as the head 112d descends from the standby height h01, that is, at time t10. Begins axial movement. The multi-mounting head 110 moves from the component mounting position X1 by a minute distance d12, and reaches the component mounting position X2 at time t11.

  As shown in FIG. 14C, the head 112d mounts the lower surface of the component P attracted to the head 112d on the substrate 2 at time t12 immediately after the multi mounting head 110 reaches the component mounting position X2. Hit the point. The head 112d mounts the component P at the mounting point, starts to rise at time t14, and returns to the original reference height h1 at time t17.

  Conventionally, the head 112c starts to descend from the reference height h1 at time t5 when the multi-mounted head 110 starts moving in the X-axis direction, as shown by the broken line in FIG. As a result, the head 112c continues to descend even though the multi-mounting head 110 has already reached the component mounting position X1 at time t7. As a result, the lower surface of the component P attracted to the head 112c comes into contact with the mounting point on the substrate 2 at time t11 after a while from time t7.

  Thereby, as shown by the broken line in FIG. 14D, the multi-mounting head 110 is changed from the component mounting position X1 to the component mounting position X2 at the time t14 immediately after the component mounting by the head 112c is completed (time t13). The movement in the X-axis direction is started. At time t15, the multi mounting head 110 reaches the component mounting position X2.

  Furthermore, the head 112d starts to descend from the reference height h1 at time t14 when the multi-mounting head 110 starts moving in the X-axis direction, as indicated by a broken line in FIG. As a result, the head 112d continues to descend even though the multi-mounting head 110 has already reached the component mounting position X2 at time t15. As a result, the lower surface of the component P attracted by the head 112d comes into contact with the mounting point on the substrate 2 at time t17 after a while from time t15.

  That is, in this embodiment, the component mounting time in one turn can be shortened by the time from time t12 to time t17. Further, at the time of component adsorption, as described with reference to FIG. 10, since the component adsorption time in one turn is shortened, in this embodiment, the overall work time (production of the multi-mounting head 110 in one turn is produced. Time) can be greatly reduced.

  FIG. 15 is a flowchart showing an operation in which the component mounting unit 100a according to the present embodiment performs component mounting. FIG. 15 shows the operation of mounting the component P, that is, the operation of mounting the component P on the board 2 in detail.

  First, the quasi-simultaneous mounting determination unit 139 determines whether there is a plurality of heads 112 that perform quasi-simultaneous mounting among the plurality of heads 112 that attract the component P in the multi-mounting head 110, as component mounting data or the like. Based on the determination (step S200).

  Here, when it is determined that there is no head 112 that performs quasi-simultaneous mounting (N in Step S200), the control unit 130 causes the multi-mounting head 110 to mount the component P by a normal mounting method. In other words, the control unit 130 causes the component P sucked by one head 112 (hereinafter referred to as a mounting head) that should be mounted first to face the mounting point on the substrate 2 in the opposite direction. Then, the multi-mounting head 110 is driven by the motor control unit 140 or the like (step S202). Specifically, the control unit 130 moves the multi-mounting head 110 in the horizontal direction and rotates the mounting head to a component mounting angle corresponding to the direction of the mounting point.

  Next, the control unit 130 causes the mounting head to perform a mounting operation (step S204). That is, the control unit 130 lowers the mounting head from the reference height h1, and mounts the component P attracted by the mounting head on the mounting point on the substrate 2.

  When the mounting operation is completed, the control unit 130 determines whether or not there is a head 112 to be mounted next among the heads 112 included in the multi-mounting head 110 (step S206). When determining that there is a head 112 to be mounted next (Y in Step S206), the control unit 130 repeatedly executes the operation from Step S202, and when determining that there is no head 112 to be mounted next (N in Step S206). The component mounting operation is finished.

  On the other hand, when it is determined in step S200 that there is a head 112 that performs semi-simultaneous mounting (Y in step S200), the control unit 130 performs semi-mounting of the plurality of heads 112 that are attracting the component P in the multi-mounting head 110. Classification into a plurality of semi-simultaneous mounting groups in which simultaneous mounting is performed (step S208).

  Hereinafter, the description will be made on the assumption that all the heads 112 adsorbing the component P are classified into a plurality of quasi-simultaneous mounting groups, and a plurality of heads 112 belong to each quasi-simultaneous mounting group.

  The control unit 130 selects the earliest quasi-simultaneous mounting group in the mounting order from a plurality of quasi-simultaneous mounting groups (step S210). Then, the control unit 130 causes the motor control unit 140 or the like to drive the multi-mounting head 110 for component mounting by the head 112 that precedes the mounting order in the quasi-simultaneous mounting group (step S212). That is, the control unit 130 horizontally moves the multi-mounting head 110 to the component mounting position corresponding to the previous head 112, and moves the head 112 to the component mounting angle corresponding to the orientation of the mounting point corresponding to the previous head 112. Rotate.

  Then, the operation time specifying unit 137 specifies the operation time of the multi-mounting head 110 necessary for component mounting by the next head 112 in the mounting order (step S214). When the operation time is specified, the standby height calculation unit 136 calculates the standby height of the next head 112 according to the operation time (step S216).

  Next, the control unit 130 causes the previous head 112 to perform a mounting operation, and simultaneously lowers the other heads 112 including the next head 112 to the standby height calculated in step S216 (step S218). That is, all the heads 112 other than the previous head 112 included in the quasi-simultaneous mounting group start descending simultaneously with the previous head 112 descending, and stop at the above-described standby height.

  Here, the control unit 130 determines whether or not there is a head 112 to be mounted further in the mounting order in the quasi-simultaneous mounting group selected in step S210 (step S220). Further, when it is determined that there is a head 112 to be mounted next (Y in step S220), the control unit 130 repeatedly executes the operation from step S212. At this time, in the execution processing of the next steps S212 to S218, the “next head 112” in the execution processing of the previous steps S212 to S218 is updated to “the previous head 112”, and “the head to be mounted next” 112 ”is updated to“ next head 112 ”and executed. When the operation from step S212 is repeatedly executed, the operation of step S212 and the operations of steps S214, S216, and S218 are executed in parallel. Further, when the operation from step S212 is repeatedly executed, when a standby height higher than the original standby height is calculated in step S216 for the head 112 that has already been lowered to the standby height, step S216 is performed. In S218, the control unit 130 stops the head 112 at the original standby height without moving it up and down.

  On the other hand, when it is determined in step S220 that there is no further head 112 (N in step S220), the control unit 130 sends a multi-mounted head to the motor control unit 140 or the like for component mounting by the next head 112. 110 is driven to cause the next head 112 to perform a mounting operation (step S222). That is, the control unit 130 horizontally moves the multi-mounting head 110 to a component mounting position corresponding to the next head 112 by a minute distance, and at a component mounting angle corresponding to the orientation of the mounting point corresponding to the next head 112. The head 112 is rotated. Further, in parallel with the horizontal movement and rotation described above, the control unit 130 lowers the next head 112 from the standby height and mounts the sucked component P on the mounting point described above.

  Here, the control unit 130 determines whether there is a quasi-simultaneous mounting group that is not performing a mounting operation (step S224). When it is determined that there is a quasi-simultaneous mounting group (Y in step S224), the control unit 130 repeatedly executes the operation from step S210. When it is determined that there is no quasi-simultaneous mounting group (N in step S224), the component The mounting operation ends.

  In the above example, it is assumed that in step S208, all the heads 112 that are attracting components are classified into a plurality of semi-simultaneous mounting groups, and a plurality of heads 112 belong to each semi-simultaneous mounting group. However, one head 112 that does not perform quasi-simultaneous mounting with any other head 112 may be classified into one quasi-simultaneous mounting group. In this case, the previous head 112 in steps S212 to S220 is treated as one head 112, and it is assumed that the next head 112, further next head 112, and other heads 112 in steps S212 to S220 do not exist. Be treated. That is, for such a quasi-simultaneous mounting group, component mounting is performed by a normal mounting method as shown in steps S202 and S204.

  In the above example, in step S218, all the heads 112 including the next head 112 are lowered to the standby height h0 calculated for the next head 112, but only the next head 112 is moved to the standby height h0. It may be lowered to the standby height h0.

  As mentioned above, although the component mounting method concerning this invention was demonstrated using the said embodiment, this invention is not limited to these.

  For example, in the present embodiment, the next head 112 is lowered to the standby height in each of the quasi-simultaneous adsorption and the quasi-simultaneous mounting. 112 may be lowered to a standby height.

  In the present embodiment, when quasi-simultaneous mounting is performed, the next head 112 is always lowered to the standby height, but the component P attracted to the next head 112 is already mounted on the substrate 2. In the case of interference with P, a clamp, or the like, the next head 112 may not be lowered to the standby height, but may be lowered to a height at which such interference does not occur. The clamp is a member disposed on both edges along the X-axis direction of the substrate 2 in order to fix the substrate 2 on the mounting stage.

  In this embodiment, the quasi-simultaneous mounting determination value is used to determine whether or not quasi-simultaneous mounting is performed, but instead of the determination value, another scale is used, or the determination value and other Whether or not quasi-simultaneous implementation is performed may be determined using a scale together. Other measures include, for example, the rotation angle of the head 112.

  In this embodiment, the component mounting machine 100 (component mounting units 100a and 100b) itself specifies the operation time and calculates the standby height. However, for example, a personal computer or the like that determines the control conditions of the multi mounting head 110 is used. The apparatus which consists of may perform specification of operation time and calculation of standby height. In such a case, the apparatus notifies the component mounter 100 of the calculated standby height and instructs the head 112 to descend to the standby height.

  The component mounting method of the present invention has the effect of shortening the production time including the component adsorption time and the component mounting time and improving the production efficiency. For example, a component for mounting a component such as an electronic component on a substrate It can be applied to mounting machines.

It is a perspective view of the component mounting machine in embodiment of this invention. It is an internal block diagram of the component mounting unit of a component mounting machine same as the above. It is a figure which shows a component reel and component tape same as the above. It is a figure which shows the component cassette and component reel with which the component supply part same as the above was equipped. It is a figure which shows the positional relationship of each head of a multi mounting head same as the above and each component cassette of a component supply part. It is a figure which shows the function structure of the control system of a component mounting unit same as the above. It is explanatory drawing for demonstrating the method a standby height calculation part same as the above calculates a standby height. It is explanatory drawing for demonstrating simultaneous adsorption | suction and quasi-simultaneous adsorption | suction same as the above. It is explanatory drawing for demonstrating the motion in which the multi mounting head same as the above adsorbs four components P semi-simultaneously. It is a figure which shows the operation | movement timing with the vertical movement of four heads same as the above, and the horizontal movement of a multi mounting head. It is a flowchart which shows the operation | movement which the component mounting unit same as the above performs component mounting. It is explanatory drawing for demonstrating semi-simultaneous mounting same as the above. It is explanatory drawing for demonstrating the motion which three heads which belong to a semi-simultaneous mounting group same as the above perform semi-simultaneous mounting. It is a figure which shows the operation | movement timing of the up-and-down movement of three heads which belong to a semi-simultaneous mounting group same as the above, and the horizontal movement of a multi mounting head. It is a flowchart which shows the operation | movement which the component mounting unit same as the above performs component mounting.

Explanation of symbols

2 Substrate 100 Component mounting machine 100a, 100b Component mounting unit 102 Component supply unit 110 Multi mounting head 111 Substrate recognition camera 112 Head 113 Nozzle 120 Component recognition camera 130 Control unit 131 Component mounting data storage unit 132 Component array data storage unit 136 Standby height Length calculation unit 137 operation time identification unit 138 quasi-simultaneous suction determination unit 139 quasi-simultaneous mounting determination unit 140 motor control unit 200 component cassette 201 component supply port 210 component reel 211 component tape P component

Claims (13)

By using a multi mounting head having first and second heads, the multi mounting head is moved horizontally and the first and second heads are moved up and down to move the first and second heads to the first and second heads. A component mounting method in which the first and second components are taken out of the component supply unit and mounted on the substrate,
Time required for the operation of the multi-mounting head from when the first part is taken out by the first head to when the second part can be taken out by the vertical movement of the second head. Is the operating time,
A first lowering step of lowering the second head to a standby height corresponding to the operation time until the first head is lowered and the first component is taken out;
A second lowering step of horizontally moving the multi-mounting head after the first component is taken out by the first head and lowering the second head to the second component;
A mounting step of mounting the first and second components picked up by the first and second heads on a substrate with respect to the first and second heads. . 2. The component mounting method according to claim 1, wherein, in the first lowering step, the second head is lowered to the standby height that decreases as the operation time becomes shorter. The component mounting method further includes:
The component mounting method according to claim 2, further comprising a height calculation step of calculating the standby height based on the operation time. In the height calculation step, the height from the surface of the second component corresponding to the distance that the second head can descend during the operation time is calculated as the standby height. The component mounting method according to claim 3. In the height calculation step, the standby is set to a height separated from the surface of the second component by a distance that allows the second head to descend during a total time of a predetermined margin time and the operation time. The component mounting method according to claim 4, wherein the component mounting method is calculated as a height. The component mounting method further includes:
The component mounting method according to claim 3, further comprising a time specifying step of specifying a time required for horizontal movement of the multi-mounting head or rotation of the second head as the operation time. The component mounting method further includes:
Determining whether the first and second heads can simultaneously suck and take out the first and second parts;
When it is determined in the determination step that suction cannot be performed simultaneously, the second head is lowered in the first lowering step, and the multi-mounting head is horizontally moved in the second lowering step. The component mounting method according to claim 1, wherein the second head is lowered. The component mounting method further includes:
A grouping step of grouping a plurality of heads provided in the multi-mounted head;
For each group generated in the grouping step, for all the heads belonging to the group, a simultaneous suction step for simultaneously sucking and taking out components,
The simultaneous adsorption step includes the first and second descending steps,
In the first lowering step, the group including the second head is lowered to a standby height corresponding to the operation time until the group including the first head is lowered and a plurality of parts are taken out.
In the second descending step, after the plurality of parts are taken out by the group including the first head, the multi-mounting head is horizontally moved, and the group including the second head is moved to another plurality of parts. The component mounting method according to claim 1, wherein the component is lowered to the component. By using a multi mounting head having first and second heads, the multi mounting head is moved horizontally and the first and second heads are moved up and down to move the first and second heads to the first and second heads. A method for determining a control condition of the multi-mounting head in order to take out the first and second components from the component supply unit and mount them on the substrate,
Time required for the operation of the multi-mounting head from when the first part is taken out by the first head to when the second part can be taken out by the vertical movement of the second head. A time specifying step for specifying as an operating time;
And a height determining step of determining, as the control condition, a stand-by height of the second head that decreases as the operation time becomes shorter. By using a multi mounting head having first and second heads, the multi mounting head is moved horizontally and the first and second heads are moved up and down to move the first and second heads to the first and second heads. A component mounter that takes out the first and second components from the component supply unit and mounts them on a board,
Time required for the operation of the multi-mounting head from when the first part is taken out by the first head to when the second part can be taken out by the vertical movement of the second head. Is the operating time,
First lowering means for lowering the second head to a standby height corresponding to the operation time until the first head is lowered and the first component is taken out;
A second lowering means for horizontally moving the multi-mounting head and lowering the second head to the second part after the first part is taken out by the first head;
A mounting device for mounting the first and second components picked up by the first and second heads on a substrate with respect to the first and second heads. . By using a multi mounting head having first and second heads, the multi mounting head is moved horizontally and the first and second heads are moved up and down to move the first and second heads to the first and second heads. A control condition determining device for determining a control condition of the multi-mounting head in order to take out the first and second components from the component supply unit and mount them on the substrate;
Time required for the operation of the multi-mounting head from when the first part is taken out by the first head to when the second part can be taken out by the vertical movement of the second head. Operating time specifying means for specifying as an operating time;
A control condition determining apparatus comprising: a standby height determining unit that determines, as the control condition, a standby height of the second head that decreases as the operation time decreases. By using a multi mounting head having first and second heads, the multi mounting head is moved horizontally and the first and second heads are moved up and down to move the first and second heads to the first and second heads. A program for causing the first and second components to be taken out from the component supply unit and mounted on the board,
Time required for the operation of the multi-mounting head from when the first part is taken out by the first head to when the second part can be taken out by the vertical movement of the second head. Is the operating time,
A first lowering step of lowering the second head to a standby height corresponding to the operation time until the first head is lowered and the first component is taken out;
A second lowering step of horizontally moving the multi-mounting head after the first component is taken out by the first head and lowering the second head to the second component;
And a mounting step of mounting the first and second components picked up by the first and second heads on a substrate with respect to the first and second heads. program. By using a multi mounting head having first and second heads, the multi mounting head is moved horizontally and the first and second heads are moved up and down to move the first and second heads to the first and second heads. A program for determining control conditions for the multi-mounting head in order to take out the first and second components from the component supply unit and mount them on the board,
Time required for the operation of the multi-mounting head from when the first part is taken out by the first head to when the second part can be taken out by the vertical movement of the second head. A time specifying step for specifying as an operating time;
A program for causing a computer to execute a height determination step of determining, as the control condition, a standby height of the second head that decreases as the operation time becomes shorter.

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