JP2006066426A - Component recognition device and surface-mounting machine equipped with it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component recognition device where time required for component recognition can be shortened as much as possible, and to provide a surface-mounting machine provided with the device. <P>SOLUTION: The component recognition device is provided with a control means which performs the adsorption/desorption operation of an electronic component C by driving an adsorption nozzle 16a, and relatively displaces an image pickup device 19 and a head unit 6 so that the base of the electronic component C adsorbed by the suction nozzle 16a is sequentially image-picked up. The control means calculates an interference region L extending around the axis of the adsorption member on it based on information on a relative position of the suction nozzle 16a and the electronic component C and information on shapes of the suction nozzle 16a and the electronic component C, and controls driving of the image pickup device 19 or the suction nozzle 16a so that the image pickup device 19 does not enter the interference region L. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component recognition apparatus for recognizing the posture or the like of an electronic component sucked by a suction nozzle and a surface mounter equipped with the same.

  Conventionally, a head unit movable on a specific plane and a suction nozzle provided on the head unit are provided, and an electronic component such as an IC chip sucked by the suction nozzle is conveyed to a printed circuit board or the like. A surface mounter for mounting is known.

  In such a surface mounter, a component recognition device that recognizes the posture or the like of an electronic component sucked by the suction nozzle in order to detect a positional shift at the time of suction generated between the suction nozzle and the electronic component It is common to have.

  As this type of component recognition device, there is a device in which an imaging device having a CCD and mirror for imaging a component is attached to a head unit (for example, Patent Document 1).

  In the component recognition apparatus of Patent Document 1, the mirror is configured to be relatively displaceable with respect to the head unit between a reflection position arranged below the suction nozzle and a retreat position retracted from below the suction nozzle. The bottom image of the electronic component sucked by the suction nozzle is guided to the CCD by the mirror displaced to the reflection position.

On the other hand, when the electronic component is suctioned, the lowering operation of the suction nozzle is executed with the mirror displaced to the retracted position.
JP-A-8-340197

  However, in the component recognition apparatus described in Patent Document 1, since the lowering operation of the suction nozzle is performed after the mirror is driven to a preset retracted position, a loss of time required for component recognition may increase. was there.

  That is, the distance between the mirror and the suction nozzle at the retracted position is a separation distance that is necessary and sufficient for the size of all electronic components to be sucked so as not to interfere with the electronic components sucked by the suction nozzle. Therefore, there is no loss of work time when the electronic parts being sucked are the largest size, but more than necessary when picking up smaller electronic parts. This means that the mirror has moved the distance, and this has caused an extra waiting time.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a component recognition device capable of shortening the time required for component recognition as much as possible and a surface mounter including the component recognition device.

  In order to solve the above-described problem, an invention according to claim 1 includes a head unit that has a suction member capable of sucking an electronic component and is movable on a specific plane, an imaging device attached to the head unit, and The suction members are moved up and down along the axial direction substantially perpendicular to the plane with respect to the head unit to perform the adsorption / desorption operation of the electronic components, while sequentially imaging the bottom surfaces of the electronic components sucked by the suction members. And a control means for moving the imaging device relative to the head unit, the imaging device being arranged on the head unit along a trajectory passing through a component imaging position corresponding to the suction member. The controller is configured to be movable, and the controller causes the operation of moving the suction member up and down and the operation of moving the imaging device along the track to overlap in time. And controlling the position of the suction member along the trajectory from the axis of the suction member based on the information on the relative position between the suction member and the electronic component and the information on the shape of the suction member and the electronic component to be sucked. Thus, an interference area extending on both sides is calculated, and driving of at least one of the imaging device and the suction member is controlled so that the imaging device does not enter the interference area.

  According to a second aspect of the present invention, in the component recognition apparatus according to the first aspect, the control unit calculates a virtual intersection region between the trajectory of the imaging device and the interference region when the suction member is lowered. When it is determined that the imaging device has passed through the intersection area, the suction member is lowered.

  According to a third aspect of the present invention, in the component recognition apparatus according to the second aspect, the control unit calculates the information on the relative position based on imaging data of the bottom image of the electronic component by the imaging device, and Based on the information on the relative position and the information on the shape and the like, a virtual intersection area for the suction member is calculated, and it is determined whether or not the imaging apparatus has passed through the virtual intersection area.

  According to a fourth aspect of the present invention, in the component recognition apparatus according to any one of the first to third aspects, the head unit is provided with a plurality of suction members, and the control means includes preset suction members. Based on the execution order of the suction operations and the drive speed of each suction member, the timing at which the interference region changes from the crossing state to the non-crossing state with respect to the trajectory of the imaging device is calculated for each suction member, and based on these timings Thus, at least one of the drive speed of the image pickup apparatus and the drive start timing is calculated.

  An invention according to claim 5 includes the component recognition device according to any one of claims 1 to 4, a base that movably supports the head, and a component supply unit that supplies an electronic component. The electronic component is adsorbed by the adsorbing member on the printed circuit board placed on the base after the electronic component is adsorbed by the adsorbing member from the component supply unit and imaged by the component recognizing device. Is a surface mounter configured to mount

  According to the present invention, the relative position at the time of suction between the suction member and the electronic component, the electronic component to be suctioned (hereinafter referred to as the target component), the shape of the suction member, and the like are different. Since the drive of the imaging device or the suction member is controlled, the imaging device and the suction member can be driven while maintaining the minimum non-interference distance required for each target component.

  Therefore, in the present invention, the moving distance between the imaging device and the suction member for avoiding the interference can be set to the minimum necessary distance according to the target component, and the time required for component recognition is reduced as much as possible. can do.

  The “information on the relative position at the time of suction between the suction member and the electronic component” is information on the amount of positional deviation between the axis of the suction member and the center (center of gravity) of the electronic component at the time of suction. In the case of storing in advance, the maximum misregistration amount assumed for the attracting member and the target part (hereinafter referred to as an assumed misregistration amount), and in the case of calculating from the imaging data by the imaging means, the actual misregistration amount is calculated. Can be adopted.

  The “information on the shape and the like of the suction member and the electronic component to be sucked” is information on the cross-sectional shape and size of the suction member and the shape and size of the electronic component, and these are stored in advance in the control means. ing.

  In the present invention, when an electronic component is not attracted to the attracting member, an interference region can be calculated based on the cross-sectional shape and dimensions of the attracting member, so that the interference between the attracting member and the imaging device can be calculated. In order to avoid this, the moving distance of the imaging device and the suction member can be further shortened.

  According to the second aspect of the present invention, the suction member can be lowered in accordance with the drive timing of the imaging device that passes through the virtual intersection region calculated based on the interference region. When the suction member is moved while waiting, the waiting time of the suction member can be shortened as much as possible.

  According to the third aspect of the present invention, since the actual displacement amount calculated based on the bottom image of the electronic component by the imaging device can be employed, the electronic component can be displaced with a displacement amount smaller than the assumed displacement amount. Is attracted, the interference area can be set narrower than when the assumed amount of positional deviation is adopted, and the waiting time of the attracting member can be further shortened.

  According to the fourth aspect of the present invention, the imaging device can be moved to the imaging position when the attracting member or the attracted electronic component moves outside the virtual intersection area. When the electronic component adsorbed by the adsorbing member is imaged after adsorbing the image, the imaging timing can be advanced.

  According to the invention of claim 4, it is possible to determine whether or not the electronic component has moved out of the virtual intersection area on the assumption that the electronic component is attracted even after the detachment operation. Therefore, even when the electronic component is accidentally attracted after the detachment operation (hereinafter referred to as a component take-out state), it is possible to prevent interference between the take-out component and the imaging device. Therefore, in the invention of claim 4, it is possible to prevent the imaging apparatus from being damaged even if the electronic component is brought home while the imaging timing is advanced as much as possible.

  According to the fifth aspect of the present invention, the imaging apparatus is arranged so that the imaging apparatus passes through the virtual intersection area until the interference area intersects the trajectory (during the non-intersection state). The drive can be controlled.

  According to the sixth aspect of the present invention, the imaging device can be driven in accordance with the timing at which the interference region changes from the intersecting state to the trajectory to the non-intersecting state. In this case, the standby time of the imaging device can be shortened as much as possible.

  According to the invention which concerns on Claim 7, when mounting an electronic component on a printed circuit board, the surface mounter which can perform component recognition of an electronic component rapidly can be provided.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a surface mounter on which a component recognition apparatus according to the present invention is mounted, FIG. 2 is a bottom view of the head unit of FIG. 1, and FIG. It is III sectional view.

  Referring to each figure, a printed circuit board conveying conveyor 2 is arranged on a base 1 of the surface mounter, and the printed circuit board 3 is conveyed on the conveyor 2 and stopped at a predetermined mounting work position. It is like that.

  On both sides of the conveyor 2, component supply units 4 and 4 are arranged. These component supply units 4 and 4 are provided with a plurality of rows of tape feeders 4a. Each of the tape feeders 4a is configured such that small pieces of chip parts (hereinafter referred to as electronic parts C) such as ICs, transistors, capacitors, etc. are stored and held at predetermined intervals from the reels. The electronic component C is intermittently taken out by a head unit 6 described later.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable across the component supply units 4 and 4 and the component mounting unit on which the printed circuit board 3 is located, and is perpendicular to the specific plane (the X axis direction along the conveyor 2 and the X axis on the horizontal plane). A plane including the Y-axis direction: in this embodiment, the plane can be moved on a horizontal plane).

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The head unit 6 is provided with a plurality of heads 16 each having a suction nozzle (suction member) 16a at the tip. These heads 16 are moved up and down (moving in the Z-axis direction: axial direction) and nozzles with respect to the frame of the head unit 6 by means of rotational driving means such as a Z-axis servomotor 17 shown in FIG. Rotation around the central axis (R axis) is possible. The tip position of the suction nozzle 16a that moves up and down in accordance with the Z-axis servomotor 17 is detected by a lift position detection means 18 (see FIG. 4) including a rotary encoder. In the present embodiment, a configuration is shown in which four heads 16 are arranged in a row in the X-axis direction.

  Furthermore, an imaging device 19 is attached to the head unit 6 so as to be capable of relative displacement along the X-axis direction. That is, the image pickup device 19 has an image pickup device moving motor 23 (see FIG. 4) that has a ball screw shaft 22 that is screwed into a nut portion 21a of a slider 21 that is slidably mounted along a rail 20 on the bottom surface of the head unit 6. ) Is driven in the X-axis direction along the rail 20 and the ball screw shaft 22. In other words, the imaging device 19 is movable with respect to the head unit 6 along a trajectory K (X axis direction: see FIG. 8) passing through the component imaging position corresponding to each suction nozzle 16a on the horizontal plane.

  The slider 21 of the imaging device 19 is disposed away from each suction nozzle 16a in the Y-axis direction, and a frame 24 is attached to the bottom surface thereof. The frame 24 is formed in the shape of a container that opens upward, and its tip extends to a position below the suction nozzle 16a and is inclined upward. A reflection mirror 25 is formed on the inclined upper surface 24a. It is stuck. On the other hand, a camera 26 composed of a line sensor is stored in the base portion of the frame 24. The camera 26 can image the bottom surface of the electronic component C sucked by the suction nozzle 16a through the reflection mirror 25. The imaging range is set so that Further, the frame 24 stores illumination means 27 (see FIG. 4) side by side with the camera 26 in the X-axis direction (the depth direction in FIG. 3). The illumination means 27 passes through the reflection mirror 25. The bottom surface of the electronic component C sucked by the suction nozzle 16a is irradiated with light.

  That is, the imaging device 19 can scan the bottom image of the electronic component C displayed on the reflection mirror 25 by the camera 26 by passing the position below the suction nozzle 16a to be imaged. On the other hand, when the electronic component C is picked up, the imaging device 19 is retreated from the position below the suction nozzle 16a so as not to interfere with the suction nozzle 16a descending from the head unit 6. In this embodiment, the four suction nozzles 16a of the head unit 6 are used as a unit to suck four electronic components C, and these components C are mounted on the printed circuit board 3. Prior to the start of the suction operation or mounting operation of 16a, the imaging device 19 is retracted to any one of the retract positions P1 and P2 deviated in the X-axis direction from the lift position of each suction nozzle 16a.

  By the way, the surface mounting machine described above is provided with the control means 28 shown in FIG. The control means 28 includes a well-known CPU that executes logical operations, a ROM that stores a control program by the CPU in advance, a RAM that temporarily stores various data, and the like.

  Specifically, the control unit 28 includes an axis control unit 29, an imaging device control unit 30, a mounting information storage unit 31, and a calculation unit 32.

  The axis control means 29 drives the servo motors 9, 15 and 17 while referring to the detection information by the lift position detection means 18 based on information such as the mounting order stored in the mounting information storage means 31 described later. The electronic component C is picked up and the electronic component C is mounted on the printed circuit board 3 under control.

  The imaging device control means 30 drives the imaging device moving motor 23 to pass the imaging device 19 to a position below the suction nozzle 16a to be imaged, whereby the electronic component C sucked by the suction nozzle 16a. Is imaged by the camera 26. Further, the image pickup device control means 30 is also electrically connected to an image pickup device position detection means 33 such as a rotary encoder. The image pickup device position detection means 33 uses the current position of the image pickup device 19 (the position in the X-axis direction). ) Is detected. Further, the imaging device control means 30 also functions as an image memory that stores imaging data obtained by the camera 26.

  The mounting information storage unit 31 is information on the order of execution of the suction operation by each suction nozzle 16a and information on the driving speed, information on the cross-sectional shape and size of each suction nozzle 16a (hereinafter abbreviated as information on the shape, etc.), and the suction target. Information such as the shape of the electronic component C and information on the amount of virtual misalignment set for each type of electronic component C are stored. The virtual positional deviation amount is a positional deviation amount between the axis of the suction nozzle 16a and the center (center of gravity) of the electronic component C at the time of suction, and is the maximum position assumed for the suction nozzle 16a and the electronic component C. It is the amount of deviation.

  Based on the virtual positional deviation amount stored in the mounting information storage means 31 and information such as the shape of each suction nozzle 16a and electronic component C, the calculation means 32 determines the trajectory from the axis for each suction nozzle 16a. Interference regions L1 to L4 extending along K (see FIG. 8: hereinafter referred to as L when no distinction is required for each suction nozzle 16a) are calculated, and the axis control means is referred to while referring to these interference regions L. 29 and the drive control of the imaging device control means 30 are executed. Note that the calculation unit 32 uses each actual displacement amount between the suction nozzle 16a and the electronic component C detected based on the image data obtained by the image pickup unit 19 in place of the virtual displacement amount. It is also possible to calculate L.

  Further, the calculation means 32 is a virtual intersection area E1 to E4 between each of the interference areas L and the trajectory K of the imaging means 19 (see FIG. 8: hereinafter referred to as E when it is not necessary to distinguish each suction nozzle 16a). Is calculated for each suction nozzle 16a, and it is determined whether or not the imaging device 19 has passed through these virtual intersection areas E.

  Further, the calculation means 32 is configured so that each interference region L intersects the trajectory K of the imaging device 19 based on the execution order of the suction operations stored in the mounting information storage means 31 and the driving speed of each suction nozzle 16a. Non-intersection timings T1 to T4 (refer to FIG. 9: hereinafter referred to as T when no distinction is required for each suction nozzle 16a) are calculated from the state, and the above-mentioned non-intersection timings T are referred to above. The drive of the imaging device control means 30 is controlled.

  Next, the processing of the control means 28 will be described based on FIG.

  First, the imaging device 19 is moved to either the retreat position P1 or P2 (step S1), and the suction operation by each suction nozzle 16a is executed (step S2).

  When this suction operation is completed, each suction nozzle 16a is displaced to a predetermined ascending position, that is, an upper position that does not interfere with the trajectory K of the imaging device 19, as shown in FIG. Then, the imaging device 19 is moved along the trajectory K (step S3).

  Next, in the imaging operation of the electronic component C, the counter N1 for selecting the target suction nozzle 16a is set to 1 (initial value) (step S4), and the virtual position stored in the mounting information storage means 31 is set. Based on the amount of deviation and information such as the shape of each suction nozzle 16a and electronic component C, an interference region L for the N1th suction nozzle 16a is calculated, and the interference region L and the trajectory K of the imaging device 19 are calculated. Based on this, a virtual intersection area E is calculated (step S5).

  Then, as shown in FIG. 8B, when the imaging device 19 passes the position below the N1th suction nozzle 16a, a bottom image of the electronic component C sucked by the suction nozzle 16a by the camera 26 is displayed. An image is taken (step S6).

  Next, it is determined whether or not the imaging device 19 has moved outside the virtual intersection region E corresponding to the suction nozzle 16a (step S7). Here, it is determined that the imaging device 19 is still within the virtual intersection region E. Then, step S7 is repeatedly executed.

  On the other hand, as shown in FIG. 8C, when it is determined that the imaging device 19 has moved outside the virtual intersection region E (YES in step S7), the N1th suction nozzle 16a is moved to a predetermined stroke. Only protrude from the head unit 6 (step S8).

  Here, the suction nozzle 16a is protruded in order to reduce the stroke that protrudes from the head unit 6 toward the printed circuit board 3 at the time of execution of a mounting operation to be described later. The tact time can be shortened.

  Next, it is determined whether or not the imaging operation has been completed for all the suction nozzles 16a (step S9). If it is determined that there is a suction nozzle 16a that has not yet ended, 1 is added to the counter N1. (Step S10), Step S5 is repeated.

  On the other hand, if it is determined that the imaging operation has been completed for all the suction nozzles 16a (YES in step S9), the attitude of the electronic component C relative to the printed circuit board 3 (the attitude in the R-axis direction) based on the imaging data from the camera 26. ) And position (positions on the X and Y planes), the mounting operation of the electronic component C is executed for each suction nozzle 16a (step S11), and the process ends.

  In the above processing, the imaging operation is executed after the adsorption operation. However, as shown in FIG. 6, the adsorption operation and the imaging operation can be executed in parallel.

  In this process, first, the imaging device 19 is moved to either the retreat position P1 or P2 (step U1), and the interference region L is calculated for all the suction nozzles 16a (step U2).

  Then, as shown in FIG. 9, the interference regions L intersect the trajectory K of the imaging device 19 based on the suction order and driving speed of the suction nozzles 16 a stored in the mounting information storage unit 31. Non-intersection timings T1 to T4 that change from the state to the non-intersection state are calculated (step U3).

  In FIG. 9, the respective suction nozzles 16a are referred to as the first, second, third, and fourth nozzles in order from the retreat position P1 side. The first and fourth nozzles simultaneously suck the electronic component C in sequence, and then the second and third nozzles in turn.

  In this process, based on the non-intersection timings T1 to T4, at least one of the movement start timing and speed of the imaging device 19 is calculated (step U4).

  For example, in step U4, the imaging device 19 is driven at a speed a so as to enter the lower position of the first nozzle in accordance with the non-intersection timing T1 of the first nozzle, and the second and third nozzles do not intersect. The speed at which the imaging device 19 is driven at the speed b is calculated so as to enter the lower positions of the second and third nozzles in the order of the timings T2 and T3.

  In the above example, the movement start timing ST1 is fixed and only the speeds a and b are calculated. However, the present invention is not limited to this. For example, the imaging device 19 is set to be substantially constant. In order to move at the speed b, the movement start timing is delayed as shown in ST2, or the movement start timing of the imaging device 19 is set to ST3 in accordance with the non-crossing timing T3 which is the latest, in the illustrated example, ST3. It is also possible to set the speed to a relatively high speed c (indicated by the alternate long and short dash line in the figure).

  In step U4, the imaging timing by the camera 26 when passing under each suction nozzle 16a is also set at the same time.

  Next, drive control of the imaging device 19 is started based on the speed and movement start timing set in step U4 (step U5), and the target suction nozzle 16a is selected for the suction operation of the electronic component C. The counter N2 is set to 1 (initial value) (step U6).

  Then, the suction operation is executed for the N2th suction nozzle 16a (step U7), and it is determined whether or not this suction operation has been completed for all the suction nozzles 16a (step U8).

  If it is determined that there is a suction nozzle 16a that has not yet completed the suction operation (NO in step U8), 1 is added to the counter N2 (step U9), and step U7 is repeatedly executed.

  On the other hand, if it is determined that the suction operation has been completed for all the suction nozzles 16a (YES in step U8), the posture of the electronic component C with respect to the printed circuit board 3 (the posture in the R-axis direction) based on the imaging data by the camera 26. After adjusting the position (position on the X and Y planes), the suction operation is executed for each suction nozzle 16a (step U10), and the process is terminated.

  In the above embodiment, the bottom image of the electronic component C is picked up by the camera 26 composed of a line sensor. However, the present invention is not limited to this, and the electronic component C is picked up by the camera 26 composed of an area sensor. You may make it do.

  At this time, in the process of FIG. 5, the virtual intersection region E is calculated based on the virtual positional deviation amount stored in advance in the mounting information storage means 31 (step S5). As shown, the virtual intersection area E can also be calculated based on the image data taken by the camera 26.

  That is, after the execution of step S4, a bottom image of the electronic component C sucked by the N1th suction nozzle 16a is taken (step S51), and the actual positions of the suction nozzle 16a and the electronic component C are based on the imaging data. Is calculated, and an interference area L is calculated based on the positional deviation amount and information such as the shape of the suction nozzle 16a and the electronic component C, and the interference area L and the trajectory K of the imaging device 19 are calculated. Based on this, a virtual intersection area E is calculated (step S61). Then, the determination in step S7 is executed for this virtual intersection area E.

  As described above, the surface mounter uses the mounted component recognition device (head unit 6, imaging device 19 and control means 28) to detect the relative position at the time of suction between the suction nozzle 16a and the electronic component C, and the electronic Since the drive of the imaging device 19 or the suction nozzle 16a is controlled based on the interference region L that differs depending on the shape of the component C and the suction nozzle 16a, non-interference that is the minimum necessary for each electronic component C. The imaging device 19 and the suction nozzle 16a can be driven while maintaining the distance.

  For example, after completion of imaging of the picked-up electronic component C, it is effective for advancing the lowering start timing of the suction nozzle 16a for bringing the sucked electronic component C close to the height position of the printed circuit board 3 prior to mounting. It is. Further, when the electronic component C is adsorbed by the lowered adsorbing nozzle 16a and then the adsorbing nozzle 16a is raised, it is effective to advance the timing of imaging the adsorbed electronic component C. Alternatively, after the sucked electronic component C is mounted on the printed circuit board 3 (after the detachment operation is performed), the tip of the suction nozzle 16a is imaged, and there is an obstacle to the suction operation of the next electronic component C by the component supply unit 4. In order to prevent the electronic component C from being taken home, the imaging start timing can be advanced when imaging the tip of the suction nozzle 16a. In this case, the interference region L is calculated on the assumption that the electronic component C is raised while remaining at the tip of the suction nozzle 16a.

  Therefore, in the surface mounter, the moving distance between the imaging device 19 and the suction nozzle 16a can be set to the minimum necessary distance according to the electronic component C, and the time required for component recognition can be reduced. It can be shortened as much as possible.

  On the other hand, in the surface mounting machine, when the electronic component C is not picked up by the suction nozzle 16a, the interference region L can be calculated based on the cross-sectional shape and dimensions of the suction nozzle 16a. When avoiding interference between the imaging device 19 and the imaging device 19, the moving distance of the imaging device 19 and the suction nozzle 16a can be further shortened.

  For example, after confirming that the electronic component C does not exist at the tip of the suction nozzle 16a, the time for the imaging device 19 to pass through the interference region L is reduced when the suction nozzle 16a is lowered to suck the electronic component C. Since the waiting time of the suction nozzle 16a can be shortened by being able to do so, the lowering timing of the suction nozzle 16a can be advanced.

  Further, in the surface mounter, the suction nozzle 16a can be lowered in accordance with the drive timing of the imaging device that passes through the virtual intersection region E calculated based on the interference region L. When the suction nozzle 16a is moved while waiting for movement, the waiting time of the suction nozzle 16a can be shortened as much as possible.

  Furthermore, since the surface mounter can employ the actual displacement amount calculated based on the bottom image of the electronic component C by the imaging device 19, the electronic component can be displaced with a displacement amount smaller than the assumed displacement amount. When C is adsorbed, the interference area L can be set narrower than when the assumed positional deviation amount is adopted, and the waiting time of the adsorption nozzle 16a can be further shortened.

  Further, in the above surface mounter, the imaging device 19 can be moved to the imaging position when the suction nozzle 16a or the electronic component C being sucked moves outside the virtual intersection area E, so the suction nozzle 16a is lowered. When the electronic component C is picked up and then picked up by the picked-up nozzle 16a, the image pickup timing can be advanced.

  Furthermore, in the surface mounting machine, it is assumed that the electronic component C is attracted even after the electronic component C is mounted on the printed circuit board 3 (after the detachment operation), and the electronic component C is outside the virtual intersection region E. Therefore, it is possible to prevent interference between the electronic component C and the imaging device 19 even when the component is brought home after the detachment operation. Therefore, the upper surface mounter can prevent the imaging device 19 from being damaged even if the electronic component C is taken home while the imaging timing is advanced as much as possible.

  In the surface mounter, the imaging device 19 passes through the virtual intersection region E until the interference region L intersects the trajectory K (during the non-intersection state). 19 can be driven and controlled.

  On the other hand, since the imaging device 19 can be driven in accordance with the non-intersection timing T of the interference area L in the surface mounter, the imaging in the case where the imaging device 19 is moved after the suction nozzle 16a is moved. The waiting time of the device 19 can be shortened as much as possible.

  In the above embodiment, the surface mounter is described as an example. However, the present invention is not limited to the surface mounter, and the component recognition device (head unit 6, imaging device 19 and control means 28). Can be mounted on a component testing apparatus for testing an electronic component such as an IC chip, for example.

It is a top view which shows roughly the surface mounting machine with which the component recognition apparatus which concerns on this invention is mounted. It is a bottom view of the head unit of FIG. It is the III-III sectional view taken on the line of FIG. It is a block diagram which shows the electrical structure of the control means of the surface mounting machine of FIG. It is a flowchart which shows the process by the control means of FIG. 4 which performs imaging operation after execution of adsorption | suction operation | movement. It is a flowchart which shows the process by the control means of FIG. 4 which performs adsorption operation and imaging operation in parallel. It is a flowchart which shows the modification of FIG. It is a partial front view showing the operation of each suction nozzle and the imaging device, (a) is a state before driving the imaging device, (b) is a state where the imaging device is located in the interference area of the suction nozzle, (c ) Shows a state where the imaging device is located outside the interference area of the suction nozzle. It is a timing chart which shows the drive timing and speed of each suction nozzle and an imaging device at the time of suction operation.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 3 Printed circuit board 6 Head unit 16a Adsorption nozzle (adsorption member)
19 Imaging device 26 Camera 28 Control means a, b, c Speed of imaging device C Electronic component E Virtual intersection region L Interference region ST1, ST2 Start timing of imaging device T Non-intersection timing

Claims (7)

A head unit having an adsorbing member capable of adsorbing electronic components and movable on a specific plane, an imaging device attached to the head unit, and an axial direction substantially perpendicular to the plane with respect to the head unit Control to move the imaging device relative to the head unit so as to sequentially image the bottom surface of the electronic component adsorbed by each adsorption member while performing the adsorption / desorption operation of the electronic component by raising and lowering each adsorption member. A component recognition device comprising means,
The imaging device is configured to be movable with respect to the head unit along a trajectory passing through a component imaging position corresponding to the suction member,
The control means controls the operation of moving the suction member up and down and the operation of moving the imaging device along the track so as to overlap in time, and sucks the suction member and the electronic component. Based on the information on the relative position at the time and the information such as the shape of the suction member and the electronic component to be sucked, the interference region is calculated for the suction member extending from the axis to both sides along the trajectory. A component recognition device configured to control driving of at least one of the imaging device and the suction member so that the imaging device does not enter the inside.   The control means calculates a virtual intersection region between the trajectory of the imaging device and the interference area when the suction member is lowered, and lowers the suction member when it is determined that the imaging device has passed through the virtual intersection region. The component recognition apparatus according to claim 1, wherein the component recognition apparatus is configured as described above.   The control means calculates the information on the relative position based on the imaging data of the bottom image of the electronic component by the imaging device, and uses the information on the relative position and the information on the shape on the suction member. The component recognition apparatus according to claim 2, wherein a virtual intersection area is calculated and whether or not the imaging apparatus has passed through the virtual intersection area is determined.   The control means calculates a virtual intersection area between the trajectory of the imaging device and the interference area when the suction member is raised, and becomes a separation target when the suction member, the electronic component being sucked, or the current lowering time. Configured to cause the imaging device to enter the virtual intersection area when it is determined that an electronic component that has been picked up by the suction member has moved outside the virtual intersection area The component recognition device according to claim 1, wherein the component recognition device is a component recognition device.   The head unit is provided with a plurality of suction members, and the control means determines that the interference area is based on the preset execution order of the lowering operation of each suction member and the driving speed of each suction member. It is even configured to calculate the timing of the crossing state from the non-crossing state with respect to the trajectory of each of the suction members and calculate at least one of the driving speed of the imaging device and the driving start timing based on these timings. The component recognition apparatus according to claim 1.   The head unit is provided with a plurality of suction members, and the control means determines whether the interference area is an imaging device based on a preset execution order of the lifting operation of the suction members and a driving speed of the suction members. It is configured to calculate the timing at which the trajectory from the crossing state to the non-crossing state is calculated for each suction member, and calculate at least one of the driving speed of the imaging device and the driving start timing based on these timings. The component recognition apparatus according to claim 1, wherein:   A component recognition device according to any one of claims 1 to 6, a base that movably supports the head, and a component supply unit that supplies an electronic component. The electronic component is picked up, and after being picked up by the component recognition device, the electronic component picked up by the suction member is mounted on the printed circuit board placed on the base. Surface mount machine.

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