JP5052302B2 - Component mounting method and apparatus - Google Patents

Description

  The present invention relates to a component mounting method and apparatus for mounting a component supplied from a component supply apparatus on a substrate by adsorbing the component by a replaceable nozzle mounted on a movable mounting head. Even for odd-shaped parts such as shield parts for noise countermeasures that have been processed, the appropriate nozzles are automatically set according to the shape and part dimensions of the part suction part when creating or mounting a production program (file) for a part mounting device. The present invention relates to a component mounting method and apparatus capable of performing the above.

  In the component mounting apparatus, as exemplified in Patent Document 1, a detachable suction nozzle is mounted on a movable mounting head, moved to a component supply position of the component supply device, the mounting head is lowered to the component, and suction is performed. The inside of the hole is evacuated, the components are sucked, the components are picked up, moved onto the transported substrate, and the sucked components are mounted at predetermined positions on the substrate.

  In such a component mounting apparatus, it is necessary to select an optimum nozzle in accordance with the component. Therefore, in Patent Document 2, a nozzle capable of obtaining a stable suction surface with a sufficient area is set as the optimum nozzle from the external dimensions of the components to be mounted.

  In Patent Document 3, the selected nozzle is displayed on the monitor, the photographed image is moved, and the nozzle and the suction position are aligned.

JP-A-2005-183412 (FIGS. 1 to 3) Japanese Patent Laid-Open No. 10-329073 JP 2004-146661 A

  However, as illustrated in FIGS. 1 and 2, which are frequently used in the mounting industry in recent years, the shield parts for noise countermeasures, etc., which are made of sheet metal, are thinned for weight reduction, and the accuracy of the surface cutting process. The suction position and the suction area tend to be limited by various factors such as those having a low surface area or bumps on the surface. As a result, the nozzle discriminated from the external dimensions of the component as in Patent Document 2 is not necessarily optimal, and it has been necessary to reset the nozzle in consideration of the shape of the suction position of the component. For this reason, conventionally, an operator has actually measured the dimensions of the component suction portion using a measuring instrument such as a caliper, or has read the component dimensions from the drawing to select an optimum nozzle. However, these methods have problems that work time for measuring the dimensions and reading from the drawings occurs, and that when a selection error occurs, the parts cannot be stably adsorbed. Was.

  The present invention has been made to solve the above-mentioned conventional problems, and it is possible to accurately select a nozzle suitable for the shape of the component suction portion even in atypical parts such as a noise countermeasure shield part processed from a sheet metal. This is the issue.

  The present invention relates to a component mounting method for mounting a component supplied from a component supply device on a substrate by adsorbing a component supplied from a component mounting head by a replaceable nozzle mounted on a movable mounting head. Thus, the shape of the component suction portion is detected, and a nozzle suitable for the shape of the component suction portion is selected from the detection result to solve the above problem.

  Here, the image of the suction hole of the selected nozzle can be displayed so as to overlap the image of the component suction part.

  The present invention also provides a component mounting apparatus in which a component supplied from a component supply apparatus is adsorbed by a replaceable nozzle mounted on a movable mounting head and mounted on a substrate. Provided is a component mounting apparatus comprising: means for detecting a shape of a component suction portion at a supply position; and means for selecting a nozzle suitable for the shape of the component suction portion from a detection result. .

  According to the present invention, the shape of the component suction portion is detected at the component suction position of the component supply device, and the nozzle suitable for the detected shape is selected. Even for parts, it is possible to create a production program that enables stable production in a short time, and stable production in a short time.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 3 is a schematic diagram of the component mounting apparatus. As shown in FIG. 3, the component mounting apparatus 1 includes a board conveyance path 15 extending in the left-right direction slightly rearward from the center portion, and a front portion ( A component supply device (feeder) 11 for supplying components mounted on a circuit board (simply referred to as a substrate) 10 disposed on the lower side of the figure, and an X-axis moving mechanism disposed on the front portion of the device 1 12 and a Y-axis moving mechanism 13. The X-axis moving mechanism 12 moves the mounting head 17 having a plurality of suction nozzles 17a for sucking parts in the X-axis direction, and the Y-axis moving mechanism 13 moves the X-axis moving mechanism 12 and the mounting head 17 to the Y-axis. Move in the direction.

  As shown in detail in FIG. 4, the mounting head 17 includes a Z-axis moving mechanism 18 that moves the suction nozzle 17a up and down in the vertical direction (Z-axis direction), and a suction nozzle and a nozzle shaft (suction shaft). As many as the number of suction nozzles (three in the illustrated example) is provided. Further, the mounting head 17 is attached with a height sensor 30 that applies laser light to the component supply device, receives the reflected light, and determines the component height or the component position (component center), and the component supply device. A component recognition camera 32 for imaging the component at the suction position is attached. A component recognition camera similar to the component recognition camera 32 is not provided with a reference numeral but is also provided on the right side.

  Furthermore, laser aligners (laser recognition devices) 33 are attached to the mounting head 17 by the number of suction nozzles. The laser aligning device 33 includes a laser light emitting unit 33 a that emits a laser and a laser light receiving unit 33 b that receives a laser from the laser light emitting unit 33 a, and the suction nozzle 17 a sucks a component at the suction position from the component supply device 11. After that, the suction nozzle descends toward the opening 33c of the laser aligner 33, and the θ-axis rotating mechanism 19 rotates the suction component in the laser beam from the laser light emitting unit 33a by the θ-axis to make a laser beam shadow. Light is received by the light receiving unit 33b. An arithmetic unit (CPU) of a control unit, which will be described later, calculates the component position (component center and component inclination) by calculating the maximum and minimum values of the shadow of the component received by the laser light receiving unit. Deviation and adsorption inclination are obtained.

  In addition, as shown in FIG. 3, the component mounting apparatus 1 is provided with a component recognition camera 16 that is fixed, and picks up the suction component from below. The picked-up image of the component is processed by an image processing unit to be described later, the component position (component center and component inclination) is calculated, and the deviation between the component center and the suction center and the suction tilt are obtained. This component recognition camera 16 is mainly used for recognizing components such as IC components that require high mounting accuracy, and the position of small components such as chip components is recognized by the laser aligner 33 described above. .

  In addition, as shown in FIG. 3, the component mounting apparatus includes a CRT monitor 2 that displays component images, input data, and calculation data captured by the component recognition cameras 16 and 32, and a liquid crystal monitor 3 that displays an operation screen. A keyboard 4 is provided for inputting commands, data, and the like.

  FIG. 5 shows the configuration of the control system of the component mounting apparatus 1. The component mounting apparatus 1 includes a CPU 21a that controls the entire component mounting, a ROM 21c that stores various control programs and data, and a control unit (control means) 21 that includes a RAM 21b that stores control data and processing data and provides a work area. have. Further, the component mounting apparatus 1 is provided with a data transmission / reception unit 26 capable of transmitting / receiving data to / from a host computer (not shown), and the production program transmitted from the host computer is the data transmission / reception unit 26. And is stored in the data storage unit 25. The control unit 21 uses the X / Y drive unit 22 to move the X-axis moving mechanism 12 and the Y-axis according to the production program data transmitted from the host computer and the data input via the data input unit 27 (keyboard 4 or the like). The mechanism 13 is controlled to move the mounting head 17 in the X and Y directions. Further, the control unit 21 controls the Z-axis moving mechanism 18 and the θ-axis rotating mechanism 19 by the other driving unit 23 to rotate the suction nozzle about the Z-axis direction (height direction) and the suction axis (θ). .

  Further, the control unit 21 moves the mounting head 17 in the X and Y directions on the component supply device to cross-scan the component at the suction position with the laser beam from the height sensor 30, and the CPU (calculation means) 21a The signal is taken in and the height of the part and the center position of the part are calculated. Further, the CPU 21a of the control unit 21 calculates the position (part center) of the component adsorbed at the adsorption position by obtaining the maximum value and the minimum value of the shadow of the component received by the laser light receiving unit of the laser aligner 33. The position shift between the center and the suction center and the suction slope are obtained.

  On the other hand, the image processing unit 24 takes in the image of the component at the suction position of the component supply device captured by the component recognition camera 32 and calculates the position of the component (component center). Further, the image processing unit 24 processes the image from the component recognition camera 16 to calculate the position of the component sucked by the suction nozzle, and obtains the positional deviation between the component center and the suction center and the suction inclination. The positional deviation and suction inclination required by the component recognition camera 16 are corrected by the X-axis moving mechanism 12, the Y-axis moving mechanism 13, and the θ-axis rotating mechanism 19 while the mounting head 17 moves to the circuit board. It is mounted on the substrate 10 in a posture.

  Hereinafter, the processing procedure of the first embodiment will be described in detail with reference to FIG.

  The component mounting apparatus 1 picks up a component from a predetermined position of the component supply apparatus 11 and mounts it on a mounting designation position on the substrate 10. Normally, a plurality of component supply devices 11 are mounted on the component supply device mounting portion 11a in the component mounting device 1, and the suction positions of the components supplied from each component supply device 11 are registered (step 100). .

  The center of the component recognition camera 32 which is an imaging device is moved so as to match the suction position set in the above operation (step 110), the image is taken (step 120), and the obtained image is displayed on the monitor 2. FIG. 7A shows a monitor display example of the component suction portion shown in FIG. 1, and FIG. 8A shows a monitor display example of the component suction portion shown in FIG.

  Then, as illustrated in FIG. 7B and FIG. 8B, the adjusted window W is adjusted so that a predetermined window W having a shape corresponding to the nozzle suction hole, such as a circle or a rectangle, fits in the component suction portion. Then, the vertical and horizontal lengths x and y are measured, and the area S in the window W is obtained (step 130). Here, since the component part of the captured image is normally reflected and brightly reflected, the area of the component adsorption portion can be obtained from the sum of bright pixels.

  Based on the dimensions x and y and the area S obtained above, the component mounting apparatus 1 to be used is compared with, for example, tabulated nozzle information data, and after securing a suction position deviation margin, the area is the largest. A nozzle is selected (step 140). If the optimum nozzle cannot be detected (step 150), a message to that effect is displayed (step 160). Further, when the component mounting apparatus (also referred to as a mounter) 1 does not have a matching nozzle among the standard nozzle replacement tables provided in the mounter (step 170), a message to that effect is displayed. (Step 180).

  If the optimum nozzle is present in the mounter, the optimum mounting control parameter is selected from the component outer dimensions and the suction part dimensions (step 190). Specifically, when the size of the suction hole of the nozzle selected as described above is greatly different from the size of the entire part, the moving speed of the mounting head 17 is changed. That is, for example, when the nozzle selected from the size of the suction part of a certain large component is smaller than the optimum nozzle for the component size, if the nozzle is moved at a high speed, the suction position of the component slips or the component falls due to the influence of acceleration. There is a risk of being affected. Therefore, in such a case, the moving speed of the mounting head and the lifting / lowering speed and rotation speed of the shaft having the nozzle are set to low speeds.

  Then, in order to present information to the operator, the detected optimum nozzle information and the determined mounting control parameter are displayed on the monitor 2 (step 200). Further, in order to visually confirm the nozzle, as shown in FIGS. 7C and 8C, an overlay image N of the nozzle is displayed at the center of the image that is the suction position.

  Here, when the setting button is pressed (step 210) and the nozzle information is updated, the suction nozzle is reset (step 220).

  In this embodiment, the parameters for controlling the moving speed of the mounting head that picks up the component and moves it to the mounting position, as well as the lifting and rotating speed of the shaft with the nozzle, are automatically determined from the external dimensions of the component and the suction part size. It can be set and is highly safe.

  In the first embodiment, the window W shown in FIGS. 7B and 8B is set in the component suction portion. However, the window shown in FIGS. 7D and 8D is used. As in the second embodiment, it is possible to automatically detect the size of the suction portion by inspecting the pixels radially outward from the set suction position and detecting the shape of the outer periphery of the suction portion. is there. The optimum nozzle can be selected using the dimensions measured in this way.

  Further, when the illumination is not reflected due to the material of the component during the recognition process, for example, a triangulation having a light projecting unit 30a and a light receiving unit 30b as exemplified in FIG. 9 as in the third embodiment described below. Using the height sensor 30 of the system, as shown in FIG. 10, the height is measured along, for example, eight scanning lines 30S sandwiching the suction position, and the shape of the part is determined by the difference in values other than the part portion and the part. To determine the dimensions. For example, when the horizontal suction part dimension of the component as shown in FIG. 10 is obtained by height measurement, the height sensor 30 is moved as shown in FIG. As shown in FIG. 11 (b), since the difference between the bottom of the tape T that accommodates the component P and the surface of the component P is obtained, the length of the portion from which the height is obtained is determined as the obtained value. The dimensions can be as follows.

  In the above-described embodiments, the component recognition camera 32 or the height sensor 30 measures the size of the suction portion without contacting the component, so that the component is not accidentally damaged. In addition, the method of detecting the shape of a component adsorption | suction part is not limited to these.

Plan view showing an example of the shape of a part Plan view showing another example of the shape of a part The perspective view which cuts off one part which shows the whole structure of the component mounting apparatus with which this invention is applied The perspective view which similarly shows the mounting head part The block diagram which similarly shows the structure of a control part The flowchart which shows the process sequence in 1st Embodiment of this invention. The figure which shows the example of the monitor display of the components shown in FIG. The figure which shows the example of the monitor display of the components shown in FIG. The figure which shows the principle of the height sensor used in 3rd Embodiment of this invention. The top view which shows a mode that height is measured by 3rd Embodiment Similarly (a) Front view and (b) Diagram showing examples of height sensor output

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus 2 ... Monitor 10 ... (Circuit) board 11 ... Component supply apparatus 17 ... Mounting head 17a ... Adsorption nozzle 21 ... Control part 30 ... Height sensor 32 ... Component recognition camera P ... Component T ... Tape

Claims (3)

In a component mounting method in which a component supplied from a component supply device is adsorbed by a replaceable nozzle mounted on a movable mounting head and mounted on a substrate.
Detect the shape of the component suction part at the component supply position of the component supply device,
A component mounting method, wherein a nozzle suitable for the shape of a component suction portion is selected from a detection result.   The component mounting method according to claim 1, wherein an image of the suction hole of the selected nozzle is displayed so as to overlap the image of the component suction portion. In a component mounting device that sucks a component supplied from a component supply device by a replaceable nozzle mounted on a movable mounting head and mounts it on a substrate.
Means for detecting the shape of the component suction portion at the component supply position of the component supply device;
Means for selecting a nozzle suitable for the shape of the component suction part from the detection result;
A component mounting apparatus comprising:

Images