JP4324442B2 - Component data generation device and electronic component mounting device - Google Patents

Description

  The present invention relates to a component data generation device and an electronic component mounting device, and more specifically, includes a device that generates component data for positioning an electronic component in which irregularly arranged electrodes are arranged, and the data generation device. The present invention relates to an electronic component mounting apparatus.

  2. Description of the Related Art Conventionally, there is known an electronic component mounting apparatus that produces a substrate by sucking an electronic component (hereinafter simply referred to as a component) supplied from a component supply device with a suction nozzle and mounting it on a predetermined position of a circuit board. Component data required for mounting, such as mounting position, is created in advance for each component to be mounted, and the mounter recognizes the component based on the component data, that is, the component's suction posture (positional deviation, angular deviation). Then, the components are positioned and the components are mounted on a predetermined board position.

  When the component is, for example, a BGA (ball grid array) component 40 as shown in FIG. 7A, the solder electrodes 40a are arranged in a grid at equal pitches in the vertical and horizontal directions. When creating component data, you can generate the component data by inputting specifications such as the number of electrodes, electrode diameter, and electrode pitch interval in the vertical and horizontal directions, and setting the presence or absence of the electrode arrangement pattern. The machine recognizes and mounts parts using the data. Further, as shown in FIG. 7B, in the case of the component 41 in which the arrangement of the electrodes 41a is not on the lattice arrangement, for example, the center position coordinates of each electrode is set to (0, 0) as the center position coordinates of the component 41. The component data is generated by defining the component, and the component is recognized and mounted by using the component data in the mounting machine.

It is also known that when creating part data, an image of the part is displayed along with the dimension value based on the entered part specifications so that the generated part data can be verified to be accurate. (Patent Document 1).
JP 2003-115700 A (Claim 1, FIG. 3)

  However, in the case of a component 42 having a large number of electrodes 42a that are not on the grid array as shown in FIG. 8 (FIG. 8 shows 100 electrodes, but a component having more than 1000 electrodes may be included. In reality, when the positions of the respective electrode coordinates are input, it takes a very long time to create data, and there is a problem that the efficiency of data creation is very poor.

  In addition, the electrode coordinate data may be known as CAD data or the like. However, if even the coordinate data does not exist, it is necessary to input the coordinates after measuring the coordinates using three-dimensional measurement. It took a considerable amount of time to create. In addition, when data cannot be correctly recognized due to a data input error or a measurement error, there is a problem in that data generation must be performed from the beginning, resulting in a loss of time in data generation.

  The present invention solves such a problem, and even electronic parts having complicated electrode arrangements can create part data reliably and accurately, enabling high-precision part recognition and part positioning. It is an object of the present invention to provide a component data creation device and an electronic component mounting device including the component data creation device.

The present invention (Claim 1)
In a component data generation device that generates component data for recognizing an electronic component in which electrodes are arranged,
Imaging means for imaging electronic components;
Teach the position of at least two points by a cursor on the image electronic components of the image, into image at the reference angle 0 °, to measure the specifications of the electrode with respect to the image at the reference angle 0 ° Setting means for setting the area;
Data generation means for measuring the specifications of the electrodes in the set area and generating data relating to the specifications of the electrodes;
A storage device for storing data relating to the specifications of the generated electrodes ;
Means for processing the image of the electronic component and confirming whether the component can be recognized,
When the electronic component is mounted on the circuit board, the data is read from the storage device, and the electronic component is recognized based on the read data.

The present invention (Claim 3)
In an electronic component mounting apparatus that produces electronic circuit boards by adsorbing electronic components with electrodes arranged by suction nozzles,
Imaging means for picking up an electronic component by picking up the electronic component with a suction nozzle before the start of substrate production;
Teach the position of at least two points by a cursor on the image electronic components of the image, into image at the reference angle 0 °, to measure the specifications of the electrode with respect to the image at the reference angle 0 ° Setting means for setting the area;
A data generation device that measures the specifications of the electrodes in the set area and generates data relating to the specifications of the electrodes;
A storage device for storing data relating to the specifications of the generated electrodes;
Means for processing the image of the electronic component and confirming whether the component can be recognized;
Control means for reading the generated data from the storage device during board production, recognizing the electronic component based on the read data, and controlling the mounting of the electronic component on the circuit board;
It is provided with.

  According to the present invention, an electronic component is directly imaged by an imaging means, the image is processed to measure specifications such as the coordinate position and dimensions of the electrode, and component data for component recognition and component positioning is created. Therefore, even for a part having a large number of electrodes with no regular arrangement, data necessary for recognition of the part can be easily generated.

  Further, in the present invention, the actual part is sucked by the suction nozzle, and data for recognizing the part is generated from the image of the sucked part. Whether or not the component can be recognized can be verified, and the reliability of the data can be improved.

  The present invention makes it possible to automatically generate data of parts having no regularity in electrode arrangement, greatly reducing data generation time by an operator, and enabling data generation without mistakes. By providing this data generation device in an electronic component mounting machine, even a component having an irregular electrode arrangement can be easily and reliably recognized and mounted. Hereinafter, the present invention will be described in detail according to embodiments shown in the drawings.

  FIG. 1 is a schematic diagram of an electronic component mounting apparatus provided with a component data generation apparatus. As shown in FIG. 1, the electronic component mounting apparatus 1 is configured to carry a circuit board that extends in the left-right direction slightly behind the center. A path 15, a component supply unit 11 that is disposed on the front portion (lower side in the drawing) of the device 1 and supplies components mounted on the circuit board 10, and an X-axis movement disposed on the front portion of the device 1 A mechanism 12 and a Y-axis moving mechanism 13 are provided.

  The X-axis moving mechanism 12 moves the suction head unit 13 including the suction nozzle 13a for sucking parts in the X-axis direction, and the Y-axis moving mechanism 13 moves the X-axis moving mechanism 12 and the suction head unit 13 to the Y-axis. Move in the direction. The mounting head unit 13 includes a Z-axis moving mechanism that moves the suction nozzle 13a up and down in the vertical direction (Z-axis direction), and a θ-axis movement mechanism that rotates the suction nozzle about the nozzle axis (suction axis). It has. In addition, the suction head unit 13 is mounted with a substrate recognition camera 17 that images a substrate mark formed on the circuit substrate 10 so as to be attached to a support member. In addition, a component recognition camera (imaging unit) 16 that images the component sucked by the suction nozzle 13a from below is disposed on the side of the component supply unit 11.

  FIG. 2 shows the configuration of the control system of the electronic component mounting apparatus. Reference numeral 20 denotes a microcomputer (CPU) that controls the entire apparatus, and a controller (control means) that includes a RAM, a ROM, and the like. The following configurations 21 to 31 are connected to the controller to control each.

  The X-axis motor 21 is a driving source for the X-axis moving mechanism 12 and moves the suction head unit 13 in the X-axis direction. The Y-axis motor 22 is a driving source for the Y-axis moving mechanism 13 and is an X-axis moving mechanism. 12 is driven in the Y-axis direction, so that the suction head unit 13 can move in the X-axis direction and the Y-axis direction.

  The Z-axis motor 23 is a drive source for a Z-axis drive mechanism (not shown) that moves the suction nozzle 13a up and down, and moves the suction nozzle 13a up and down in the Z-axis direction (height direction). The θ-axis motor 24 is a drive source for a θ-axis rotation mechanism (not shown) of the suction nozzle 13a, and rotates the suction nozzle 13a around the nozzle center axis (suction axis).

  The image recognition device 27 performs image recognition of the component 18 sucked by the suction nozzle 13a, and includes an A / D converter 27a, a memory 27b, and a CPU 27c. The analog image signal output from the component recognition camera 16 that captured the picked-up component 18 is converted into a digital signal by the A / D converter 27a and stored in the memory 27b, and the CPU 27c is based on the image data. Recognize sucked parts. That is, the image recognition device 27 calculates the component center and the suction angle, and recognizes the suction posture of the component. In addition, the image recognition device 27 calculates the substrate mark position by processing the image of the substrate mark captured by the substrate recognition camera 17.

  Further, the image recognition device 27 processes the image data of the component 18 imaged by the component recognition camera 16 and measures the component specifications such as the coordinate values (coordinate positions) of the electrodes arranged on the component and the dimensions of the electrodes. It also has a function of data generation means for generating data for component recognition performed at the time of component mounting.

  The keyboard 28 and mouse 29 are used for inputting data such as component data.

  The storage device 30 is configured by a flash memory or the like, and stores component data generated by the data generation unit, component data input by the keyboard 28 and the mouse 29, component data supplied from a host computer (not shown), and the like. Used for

  The display device (monitor) 31 displays component data, calculation data, an image of the component 18 captured by the component recognition camera 16, and the like on the display surface 31a.

  Hereinafter, a generation procedure for generating data of a component having a complicated electrode arrangement (electrode arrangement without regularity) in the component mounting machine will be described according to the flow of FIG. This procedure is sequentially executed by a data generation program stored in the ROM or RAM of the controller 20 before the start of board production.

  In the electronic component mounting apparatus 1, the suction head unit 13 moves to the component supply unit 11 under the control of the controller 20, and moves to the component recognition camera 16 after the suction nozzle 13 a sucks the component 18 for which data is to be created. The component 18 is picked up by the component recognition camera 16, and the image is displayed on the screen 31 a of the display device 31.

  When the data generation program is activated, a parameter selection screen is displayed on the display device 31, and parameters such as a ball electrode or a land electrode are input (step S1).

  Since the image of the component 18 and the cross cursors 31b and 31c are displayed on the screen 31a of the display device 31 as shown in FIG. 4 (step S2), the cross cursors are used to display FIGS. 4A and 4B. As shown in FIG. 4, the position of at least two points (electrodes) 18a and 18b at which the inclination of the component 18 is adjusted to 0 ° is taught, and as shown in FIG. 4C, a line 31d connecting these two points 18a and 18b. Is taught as the inclination of the image of the part (corresponding to the suction inclination of the part by the suction nozzle) (step S3). Then, by rotating the θ-axis motor 24 so that the line 31d coincides with the horizontal cursor line 31b, the suction nozzle 13a is rotated to rotate the component image. As a result, the image of the component 18 is corrected to an image having an inclination of 0 °, that is, a reference angle, and the side of the component sucked when the component is mounted on the substrate is relative to the reference line (for example, one side of the substrate). The image is converted into an image having an angle (reference angle) at which the formed angle is 0 °. Component data is generated based on the image data with the position serving as the reference angle as a reference position. The image data of a part may be rotated without rotating the part 18.

  After the component is thus adjusted to the reference angle (inclination 0 °), the center position 18 'of the component 18 is taught by the cross cursor as shown in FIG. 5A (step S4). In this case, the part center may be set by moving the window cursor or the actual part.

  After the component center position 18 ′ is determined, a measurement start command is executed (step S5), the window cursor 32 is displayed on the screen (step S6), and the electrode coordinates are measured as shown in FIG. 5B. An area is selected by the window cursor 32, and the measurement area is taught and set (step S7, area setting means). At this time, the window cursor may be set to be displayed multiple times so that only electrodes that require coordinate measurement are selected, and if there is a part that is not to be measured, an area to be excluded can be set It may be. Such a process is illustrated in steps S6 to S9.

  As described above, the measurement start command is executed after setting the center position of the component and the area for measuring the coordinates of the electrodes (step S10). Thereby, the CPU 27c of the image recognition device 27 processes the data in the image set by the window cursor 32 among the component images (converted to the reference angle image) captured in the memory 27b, and The position coordinate and electrode size of each electrode are measured, and the coordinate value and electrode size data of each electrode are generated.

  Hereinafter, when the electrode is a component (BGA) which is a ball electrode, a method of measuring the coordinates of the ball electrode and the ball diameter will be described.

  The image recognition device 27 sequentially reads the image data of the measurement region set by the window cursor 32 from the left side for each pixel along one line of the image data, as indicated by the arrow line 33 in FIG. When the density data of the pixel is detected to be higher than a preset threshold value, the coordinate value of the pixel data is recorded, and when the value is lower than the threshold value, the coordinate value of the pixel data is also recorded. To do. When such processing is completed for one line, the same processing is performed for the next line, and the density data is sequentially examined for each pixel of each line.

  For example, as shown in FIG. 6B, in the pixel data on the line 33a, the density data first exceeds the threshold when the pixel at the upper edge of the ball electrode 18c is processed. is there. Therefore, first, the edge of the ball electrode 18c is detected. For example, when each pixel on the line 33b is read, the edge of the ball electrode 18d is detected, but the coordinate value of the pixel on this edge is far away from that of the electrode 18c, so that it is not recorded. By comparing the density data for each pixel of each line with a threshold value in such a process, the coordinate value of each pixel along the circumference (edge) of the ball electrode 18c is obtained and recorded. Can do.

  When the edge position of the electrode is detected in this way, the pixel position having the maximum coordinate value Y2 in the vertical direction (Y direction) is the upper end of the electrode and the minimum coordinate value Y1 among the pixels of each edge. Is the lower end of the electrode, the pixel position having the maximum coordinate value X2 in the horizontal direction (X direction) is the right end of the electrode, and the pixel position having the minimum coordinate value X1 is the left end of the electrode . Therefore, the average value of Y1 and Y2 is the Y coordinate of the center of the electrode, and the average value of X1 and X2 is the X coordinate of the center of the electrode. The diameter of the electrode is (Y2-Y1) or (X2-X1), or the average value of (Y2-Y1) and (X2-X1).

  When the center position and diameter of one ball electrode are obtained in this way, the edge data of the electrode is detected again by comparing the density data with the threshold value for each pixel from the first line. At this time, if the electrode data (electrode specifications) already detected is filled and the same position is not detected twice, it will not be erroneously detected.

  There is also a method using projection for detecting the edge position of the electrode. First, by thinning the image, the electrode of the image is compressed, and an image having a density of approximately one pixel at the center of the electrode is created. The pixel having the density by the thinning process points to the approximate center position of the electrode, so the area where the image is scanned from the pixel position in the vertical and horizontal directions in the original image, and the projection is created from the density change To decide. In this region, the size and center position of the electrode are obtained using vertical and horizontal projections. At this time, if the edge cannot be detected in the preset area, the projection area may be expanded until the edge can be detected.

  As described above, when all measurements are completed, a measurement completion command is output (step S11), and the image recognition device 27 converts the coordinate values and dimensions of the measured electrodes into a data format that allows component recognition, and The data is stored in the storage device 30. In addition, after the component data is generated, the image recognition device 27 processes the image of the component 18 and calculates the center position and inclination of the component 18 according to a known algorithm based on the generated component data. Whether or not is confirmed (step S12). At the time of component recognition, the center position and inclination are detected in advance as the teaching position and inclination (reference angle) are detected. If the position deviation (position deviation between the center of the component and the suction center) and the angle deviation are almost zero, they are generated. The part data thus obtained is correct (YES in step S13, step S14), and at this stage, the part data generation program ends. If image recognition cannot be performed normally (NO in step S13), that is, if a positional deviation or angular deviation occurs, data generation is performed by selecting an electrode that is easy to recognize by executing data generation from the beginning. Run again.

  The above is the process before the start of board production, but in the stage where the production of the board is actually started and the parts are mounted on the circuit board, the parts supplied from the part supply device 11 are sucked by the suction nozzle 13a. The suction head unit 13 is moved to the upper part of the component recognition camera 16, and the component is imaged by the camera. The captured image of the component is subjected to image processing by the image recognition device 27, the component data of the component is read from the storage device 30, and the component center and the inclination of the component are calculated based on the component data. The suction posture is recognized. When there is a positional deviation between the component center and the suction center and an angular deviation is detected, these positional deviation and angular deviation are corrected by driving the X-axis motor 21, Y-axis motor 22, and θ-axis motor 24. Then, the component is mounted in a correct posture (reference angle) at a predetermined circuit board position.

  In the above-described embodiment, the data generation in the component mounting machine is shown. However, the data for component recognition is dedicated to the configuration of the imaging device, the image input device, and the personal computer that captures the component in addition to the creation of the component recognition data. It is also possible to generate the data by using the data generator, and it is also possible to use the component data created from the dedicated data generator with the mounting machine.

It is the perspective view which showed the schematic structure of the whole electronic component mounting apparatus. It is the block diagram which showed the structure of the control system of an electronic component mounting apparatus. It is a flowchart which shows the flow of production | generation of component data. It is the screen figure which showed the flow which converts an image into a reference angle. (A) is the screen figure which showed the state which teaches the center position of components, (B) is the screen figure which showed the state which sets a measurement area | region. (A) is the screen figure which showed the state which scans an image and detects an electrode, (B) is the enlarged view. (A) is a plan view of a component in which electrodes are regularly arranged, and (B) is a plan view of a component in which electrodes are irregularly arranged. It is a top view of the components which arranged many electrodes irregularly.

Explanation of symbols

13 Suction head
13a Suction nozzle 16 Component recognition camera 20 Controller 27 Image recognition device 30 Storage device

Claims (4)

In a component data generation device that generates component data for recognizing an electronic component in which electrodes are arranged,
Imaging means for imaging electronic components;
Teach the position of at least two points by a cursor on the image electronic components of the image, into image at the reference angle 0 °, to measure the specifications of the electrode with respect to the image at the reference angle 0 ° Setting means for setting the area;
Data generation means for measuring the specifications of the electrodes in the set area and generating data relating to the specifications of the electrodes;
A storage device for storing data relating to the specifications of the generated electrodes ;
Means for processing the image of the electronic component and confirming whether the component can be recognized,
A component data generation device, wherein when the electronic component is mounted on a circuit board, the data is read from a storage device, and the electronic component is recognized based on the read data.   The component data generation apparatus according to claim 1, wherein the specification of the electrode is an electrode coordinate value and / or an electrode dimension. In an electronic component mounting device that produces electronic circuit boards by adsorbing electronic components with electrodes arranged with a suction nozzle and mounting them on a circuit board,
Imaging means for picking up an electronic component by picking up the electronic component with a suction nozzle before the start of substrate production;
Teach the position of at least two points by a cursor on the image electronic components of the image, into image at the reference angle 0 °, to measure the specifications of the electrode with respect to the image at the reference angle 0 ° Setting means for setting the area;
A data generation device that measures the specifications of the electrodes in the set area and generates data relating to the specifications of the electrodes;
A storage device for storing data relating to the specifications of the generated electrodes;
Means for processing the image of the electronic component and confirming whether the component can be recognized;
Control means for reading the generated data from the storage device during board production, recognizing the electronic component based on the read data, and controlling the mounting of the electronic component on the circuit board;
An electronic component mounting apparatus comprising:   4. The electronic component mounting apparatus according to claim 3, wherein the specification of the electrode is an electrode coordinate value and / or an electrode dimension.

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