JP6338169B2 - Recognition apparatus, recognition method, mounting apparatus, and mounting method - Google Patents

Description

  The present invention relates to a recognition device, a recognition method, a mounting device, and a mounting method.

  In an apparatus (Die-Bonder, Mounter) used in a post-process of manufacturing a semiconductor product, as a position estimation method for mounting a semiconductor chip, a bump and a reference mark on the semiconductor chip are imaged by a semiconductor chip recognition line sensor. Is estimated (see, for example, Patent Document 1).

  During this imaging, the illumination mechanism irradiates the semiconductor chip surface and the reference mark. In general, the illumination mechanism is composed of coaxial illumination and angle illumination (see, for example, Patent Documents 2 and 3), and in the position estimation described above, it is necessary to adjust the amount of light so that both the bump and the reference mark are well imaged. is there.

JP 2013-123020 A Japanese Patent No. 4670375 Japanese Patent No. 4381764

  However, in the case of using the control method of the illumination mechanism described in Patent Document 1, Patent Document 2, etc., the illumination condition for imaging only the bumps does not necessarily match the illumination condition for imaging only the reference marks. Therefore, it has been a hindrance to good semiconductor chip recognition and position estimation.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a recognition device, a recognition method, a mounting device, and a mounting method that enable good semiconductor chip recognition and position estimation in a short time. And

In order to solve the above problems, a recognition apparatus of the present invention includes an imaging unit that images a moving recognition object, a first illumination unit that irradiates light from a direction perpendicular to a main surface of the recognition object, A second illumination unit that irradiates light from an oblique direction of the main surface, and an illumination device that illuminates the recognition target when imaging by the imaging unit, and an image captured by the imaging unit A signal processing unit for recognizing the position of the recognition object based on a notification signal from a motion controller that moves the recognition object, and a plurality of signals in the recognition object notification signal switching notifying the switching of the imaging region is input, the irradiation of light to the main surface before Symbol first illumination unit and the second illumination unit, the illumination controller for controlling according to said switching information signal that it has And features.

According to another recognition apparatus of the present invention, the recognition object is a semiconductor chip, and a plurality of areas to be imaged in the recognition object have a first area where a reference mark is provided and a bump adsorbed. A second region, and the lighting controller turns on the first lighting unit and turns off the second lighting unit in the first region, and turns on the first lighting unit in the second region. The illumination unit is turned off and the second illumination unit is turned on according to the switching notification signal .

The mounting device of the present invention mounts the recognition target object on a predetermined circuit board by performing predetermined correction control related to the position and angle of the recognition target object based on the recognition result by the recognition device. And

The recognition method of the present invention includes an imaging unit that images a moving recognition object, a first illumination unit that irradiates light from a direction perpendicular to the main surface of the recognition object, and an oblique direction of the main surface. A second illumination unit that emits light from a direction, and an illumination device that illuminates the recognition object when the imaging unit performs imaging, and the recognition target based on an image captured by the imaging unit A signal processing unit for recognizing the position of an object, and a notification signal from a motion controller that moves the object to be recognized, and a switching notification signal for notifying switching of a plurality of imaged areas in the object to be recognized lighting controllers are input is irradiated with light from the front Symbol first illumination unit and the second illumination unit to the main surface, and controls in accordance with the switching notification signal, it is characterized.

According to another recognition method of the present invention, the recognition object is a semiconductor chip, and a plurality of areas to be imaged in the recognition object have a first area where a reference mark is provided and a bump adsorbed. A second region, and the lighting controller turns on the first lighting unit and turns off the second lighting unit in the first region, and turns on the first lighting unit in the second region. The illumination unit is turned off and the second illumination unit is turned on according to the switching notification signal .

The mounting method of the present invention is characterized in that the recognition target is mounted on a predetermined circuit board by performing predetermined correction control related to the position and angle of the recognition target based on the recognition result by the recognition method. And

  According to the present invention, the illumination condition when imaging the reference mark and the illumination condition when imaging the bump on the semiconductor chip are changed in real time with respect to the imaging time of the moving recognition object. The first area where the reference mark is provided and the second area where the bumps are attracted can be imaged under respective optimum illumination conditions. Therefore, according to the present invention, it is possible to provide a recognition device, a recognition method, a mounting device, and a mounting method that enable good semiconductor chip recognition and position estimation in a short time based on a captured image captured under optimal illumination conditions. can do.

It is a schematic diagram for demonstrating the structural example of the mounting apparatus 100 as one Embodiment of this invention. 2 is a perspective view schematically showing a positional relationship among a chip camera 2, a zoom lens 33, and an IC chip 4 shown in FIG. It is a schematic diagram for demonstrating an example of the picked-up image by the chip camera 2 shown in FIG. It is a schematic diagram for demonstrating the structural example of the illuminating device shown in FIG. It is a block diagram for demonstrating the internal structural example of the mounting apparatus 100 shown in FIG. 5 is a flowchart showing a flow of operation of the mounting apparatus 100. It is a figure for demonstrating the process of step S104 of FIG. It is a timing chart for demonstrating switching operation | movement of an illuminating device. It is a figure for demonstrating the example of the picked-up image by the chip camera 2 shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram for explaining a configuration example of a mounting apparatus 100 (recognition apparatus) as an embodiment of the present invention. A mounting apparatus 100 shown in FIG. 1 is an apparatus for mounting an IC (Integrated Circuit) chip 4 (semiconductor chip) on a circuit board 8. The mounting apparatus 100 includes a signal processing unit 1, a chip camera 2, a zoom lens 33, a moving unit 6, a motion controller 61, a substrate stage 7, a fixed base 7 a, a place camera 10, an illumination controller 51, a chip camera illumination device 52, and a place. A camera lighting device 53 and the like are provided.

  The signal processing unit 1 performs predetermined recognition processing on each image signal acquired from the chip camera 2 and the place camera 10, and performs motion according to the result of the recognition processing, design information of the IC chip 4 and the circuit board 8, and the like. The controller 61 and the like are controlled. This signal processing unit 1 is connected to a motion controller 61 via a cable 41. Further, the signal processing unit 1 is connected to the chip camera 2 via a cable 42. Further, the signal processing unit 1 is connected to the place camera 10 via a cable 43. The signal processing unit 1 is connected to the zoom lens 33 via the cable 44.

  The motion controller 61 is configured to have a drive mechanism using a motor or the like, and moves the moving unit 6 in the XYZ axial directions indicated by arrows or circles in accordance with instructions from the signal processing unit 1. The direction θ is changed on the XY plane. That is, the moving unit 6 can move a predetermined length in the depth front-rear direction (X direction), left-right direction (Y direction), and vertical direction (Z direction) toward the drawing, and the direction θ of the suction head 5 can be changed. It is possible to change within a predetermined angle range. The positive direction of the X axis is the direction from the back to the front, and the positive directions of the Y and Z axes are the directions of the arrows.

  In addition, the motion controller 61 starts and ends the imaging of the chip camera 2 and the place camera 10 in accordance with encoder pulses (signals representing their positions on the XYZ axes) output from an encoder (not shown) in FIG. Control signals (control signals Trigger_C and Trigger_P described later) are output. Therefore, the motion controller 61 is connected to the chip camera 2 via the cable 48 and to the place camera 10 via the cable 49. The motion controller 61 is connected to the illumination controller 51 via the cable 45. The illumination controller 51 is connected to the chip camera illumination device 52 and the place camera illumination device 53 via cables 46 and 47.

  The illumination controller 51 generates a control signal (control signals Trigger_I1, I2 described later) based on a control signal (control signal Trigger_M described later) generated from the encoder pulse by the motion controller 61, and the chip camera via the cables 46, 47. Output to the lighting device 52 and the lighting device 53 for the place camera. The chip camera illumination device 52 and the place camera illumination device 53 control the start and switching of illumination by each illumination device, the illumination end timing, and the like based on a control signal input from the illumination controller 51.

  The moving unit 6 has a suction head 5 at the tip. The suction head 5 sucks the IC chip 4. In FIG. 1, a single moving unit 6 sucks and lifts the IC chip 4 from the chip cassette 3 (left moving unit 6), and passes over the chip camera 2 (central moving unit 6). ) And the state of moving onto the circuit board 8 (the moving unit 6 on the right side). The chip cassette 3, the chip camera 2, the circuit board 8, the place camera 10, and the like are arranged with the positional relationship as shown in FIG.

  The suction head 5 has a suction surface 5a made of, for example, a porous metal. The suction head 5 sucks the IC chip 4 on the suction surface 5a using negative pressure. Further, the suction head 5 is heated in a state where the IC chip 4 is placed on the circuit board 8, and a plurality of solder bumps of the IC chip 4 are thermocompression bonded to predetermined contacts on the circuit board 8. The suction surface 5a is marked with a reference mark for recognizing the suction state of the IC chip 4.

  The chip cassette 3 is a container that stores a plurality of IC chips 4. The chip cassette 3 has an open upper surface (that is, upward in the Z axis).

  The IC chip 4 is a semiconductor integrated circuit chip. In the present embodiment, the IC chip 4 has a structure called a so-called WLCSP (Wafer Level Chip Size (or Scale) Package). A plurality of solder bumps are formed on the back surface of the IC chip 4 (the downward surface in the figure, that is, the surface opposite to the surface to which the suction head 5 sucks). The IC chip 4 is sucked by the suction head 5 from the state stored in the chip cassette 3 and lifted upward in the Z direction. Then, the IC chip 4 moves in the Y direction, passes through the upper part of the chip camera 2 in that state, and then is conveyed to the upper part of the circuit board 8.

  The circuit board 8 is placed on the substrate stage 7. The substrate stage 7 is supported on the fixed base 7a so as to be finely adjustable in the XY directions.

  The place camera 10 is a camera that captures an image of the surface on which the IC chip 4 of the circuit board 8 is mounted. Based on the image signal acquired from the place camera 10, the signal processing unit 1 performs a position recognition process on the periphery of the connection part with the IC chip 4, and calculates a positional deviation and an angular deviation amount of the circuit board 8 from a predetermined reference. calculate.

  The chip camera 2 picks up an image of the back surface of the IC chip 4 being moved while being sucked by the suction head 5, and outputs the picked-up image signal to the signal processing unit 1. The chip camera 2 is provided at a predetermined position between the installation location of the chip cassette 3 and the installation location of the circuit board 8. The chip camera 2 images the back surface of the IC chip 4 through the zoom lens 33. The zoom lens 33 has a plurality of lenses and a lens moving mechanism, can arbitrarily change the focal length of the lens group within a certain range, and does not move the focal plane (that is, does not shift the focus). A group. The zoom lens 33 varies the focal length according to a predetermined control signal input from the outside.

  The signal processing unit 1 transmits a predetermined control signal via the cable 44 to change the focal length of the zoom lens 33 (that is, the imaging magnification of the chip camera 2). FIG. 2 is a perspective view schematically showing the positional relationship among the chip camera 2, the zoom lens 33 and the IC chip 4. In addition, the same code | symbol is used for the same structure in each drawing, such as FIG. 1, FIG. Also, the directions of the XYZ arrows shown in FIG. 2 correspond to the directions of the XYZ axes shown in FIG. In FIGS. 1 and 2, the chip camera 2 and the zoom lens 33 are illustrated as separated from each other, but the chip camera 2 and the zoom lens 33 may be configured integrally.

  The chip camera 2 includes a line sensor 21. The line sensor 21 is configured by arranging a plurality of imaging pixels made of solid-state imaging devices such as a CMOS (Complementary Metal Oxide Semiconductor), a CCD (Conference of Committee on Disarmament), or the like in order to secure an exposure time. It is configured. The chip camera 2 repeatedly outputs each pixel value, which is a value representing the magnitude of an electrical signal obtained by photoelectric conversion of incident light to each pixel constituting the line sensor 21, at a predetermined period. The line sensor 21 outputs a monochrome multi-value gradation (that is, gray scale) image signal.

  Therefore, the pixel value of each pixel output from the line sensor 21 represents a luminance value. In the present embodiment, the back surface of the IC chip 4, that is, the surface on which the bumps 4 a are formed with the surface on which the plurality of bumps 4 a are arranged facing downward (that is, on the chip camera 2 side) The opposite surface (that is, the surface of the IC chip 4) is attracted to the suction surface 5a of the suction head 5. The chip camera 2 outputs the output of each pixel of the line sensor 21 at a predetermined cycle while the IC chip 4 is moving at a predetermined speed in the direction indicated by the arrow (that is, the Y direction) as the IC chip moving direction in FIG. Output multiple times repeatedly.

  FIG. 3 schematically shows an example of an image 200 captured by the chip camera 2. In FIG. 3, the directions of the XYZ axes shown in FIG. 1 correspond to the directions indicated by the XY arrows and the Z circles. In FIG. 3, the positive direction of each axis is XY as the direction of the arrow and Z as the direction from the front to the back. In the example illustrated in FIG. 3, the captured image 200 includes an image of the entire back surface of the IC chip 4 and an image of substantially the entire surface of the suction surface 5a. A pair of symbols 5b and a line 5c representing the reference region are marks actually drawn on the suction surface 5a. These marks are marks that serve as a reference when recognizing the suction state (relative suction position with respect to the reference mark) of the IC chip 4. However, it is not always necessary to provide both the symbol 5b and the reference line 5c (hereinafter collectively referred to as the reference mark 5m). In the example shown in FIG. 3, the IC chip 4 has a plurality of bumps 4a arranged at equal intervals in the XY direction.

Next, the structure of the illuminating device in this embodiment is demonstrated with reference to drawings. FIG. 4 is a schematic diagram for explaining a configuration example of the illumination device shown in FIG. 1. 4A shows a configuration example of the chip camera illumination device 52, and FIG. 4B shows a configuration example of the place camera illumination device 53.
As shown in FIG. 4A, the chip camera illumination device 52 includes a chip camera coaxial illumination 52a (first illumination unit) and a chip camera angle illumination 52b (second illumination unit). Composed.
The light emitted by the chip camera coaxial illumination 52a is reflected by the half mirror 2b provided in the chip camera lens 2a, and is reflected on the main surface of the IC chip 4 (recognition target) (the back surface of the IC chip 4 to be imaged). Incident light is incident as coaxial illumination from the vertical direction. Then, the light reflected by the IC chip 4 is emitted in a direction perpendicular to the main surface of the IC chip 4 and enters the chip camera 2 through a half mirror.

  On the other hand, the light irradiated by the chip camera angle illumination 52b enters from an oblique direction having a predetermined angle with respect to a line perpendicular to the main surface of the IC chip 4. The reflected light is emitted in a direction perpendicular to the main surface of the IC chip 4 in accordance with the mounting angle of the chip camera angle illumination 52b, and enters the chip camera 2 through the half mirror. This mounting angle is set in advance so that when light is reflected on the lower surface (camera side) of the solder bump of the IC chip 4, the reflected light is emitted in a direction perpendicular to the main surface of the IC chip 4. Is set.

  That is, when the IC chip 4 is picked up, light is emitted from the chip camera coaxial illumination 52a and the chip camera angle illumination 52b, the region where the reference mark 5m is provided (first region), and the bump. Switching is made between the adsorbed area (second area). When imaging the first area and the second area, by changing the light irradiation, the illumination condition at the time of imaging can be set to an optimum condition for each of the reference mark 5m and the solder bump.

Similarly, as shown in FIG. 4B, the place camera illumination device 53 includes a place camera coaxial illumination 53a (first illumination unit) and a place camera angle illumination 53b (second illumination unit). It is comprised including.
The light emitted by the place camera coaxial illumination 53a is reflected by the half mirror 10b provided in the place camera lens 10a, and is coaxial from the vertical direction to the main surface of the circuit board 8 (the surface on which the IC chip 4 is mounted). Incident light as illumination. Then, the light reflected by the circuit board 8 is emitted in a direction perpendicular to the main surface of the circuit board 8 and enters the place camera 10 through a half mirror.

  On the other hand, the light emitted by the place camera angle illumination 53 b enters from an oblique direction having a predetermined angle with respect to a line perpendicular to the main surface of the circuit board 8. The reflected light is emitted in a direction perpendicular to the main surface of the circuit board 8 in accordance with the mounting angle of the place camera angle illumination 53b, and enters the place camera 10 through the half mirror. This mounting angle is such that when light is reflected by the curved surface of the end portion that becomes a contact point with the solder ball of the circuit board 8, the reflected light is emitted in a direction perpendicular to the main surface of the circuit board 8. It is set in advance.

  That is, when the circuit board 8 is imaged, light is emitted from the coaxial illumination 53a for the place camera and the angle illumination 53b for the place camera, the area where the reference mark is provided (first area), and the circuit board 8 In the area where the IC chip 4 is mounted (second area). When imaging the first area and the second area, by changing the light irradiation, the illumination conditions at the time of imaging can be made optimal for each of the reference mark and the chip mounting scheduled area. .

  Next, an example of an internal configuration related to the control operation of the mounting apparatus 100 described with reference to FIG. 1 will be described with reference to FIG. The signal processing unit 1 includes a host computer 11, an input unit 12, an output unit 13, and a storage unit 14. The host computer 11 includes a main memory 11a, and the main memory 11a includes an image memory 11b. The host computer 11 has a CPU (Central Processing Unit) inside, and controls each unit by executing a predetermined program stored in the storage unit 14 or the like. The input unit 12 is an interface for inputting signals from the place camera 10 and the chip camera 2 to the host computer 11. Image data representing captured images is input to the input unit 12 from the place camera 10 and the chip camera 2.

  The output unit 13 is an interface for outputting a signal from the host computer 11 to the motion controller 61 and the zoom lens 33. From the output unit 13, information indicating a correction amount for correcting and controlling the position shift and the angle shift of the moving unit 6 with respect to the motion controller 61 (a correction amount corresponding to ΔX, ΔY, and Δθ (or a signal indicating the correction amount). )) Is output. Further, the output unit 13 outputs a signal for changing the focal length of the zoom lens 33.

  Here, information ΔX, ΔY, and Δθ representing correction amounts for correcting the positional deviation and the angular deviation will be described with reference to FIG. In FIG. 3, the reference point P <b> 0 is a point corresponding to the rotation center of the suction head 5 in the θ direction. The coordinate value of the reference point P0 can be calculated based on the reference symbol 5b and the reference line 5c on the suction surface 5a. The center point Pc is a point corresponding to the center point (or centroid point) of the IC chip 4. The coordinates of the center point Pc are based on the coordinate values of the plurality of bumps 4a recognized from the captured image of the chip camera 2 and the design value of the IC chip 4 (or the actual measurement value of the other IC chip 4 serving as a reference). Can be calculated. ΔX represents the amount of deviation in the X direction between the reference point P0 and the center point Pc. ΔY represents the amount of deviation in the Y direction between the reference point P0 and the center point Pc.

  ΔX and ΔY are calculated as deviations of the coordinate values of the reference point P0 and the center point Pc. Δθ is calculated as a difference between the reference orientation of the IC chip 4 and the actual orientation. Δθ is based on the coordinate values of the plurality of bumps 4a recognized from the captured image of the chip camera 2, and the design values of the coordinates and arrangement relation of the bumps 4a (or the actual measurement values of other IC chips 4 serving as a reference). Can be calculated.

  Returning to FIG. 5, the storage unit 14 is, for example, a non-volatile memory, and is information used for designating the design information 14 a of the chip cassette 3, the IC chip 4, the circuit board 8, and the like and the focal length of the zoom lens 33. Some focal length control information and the like are stored. This focal length control information is configured, for example, as a table that stores the correspondence between the identification number of the IC chip 4, information indicating the specifications of the chip camera 2, and the focal length to be set.

  Although not shown in FIG. 1, in addition to the above configuration, the signal processing unit 1 is, for example, an interface for transmitting a predetermined control signal to the place camera 10 or the chip camera 2 or a predetermined amount from the motion controller 61. Including an interface for receiving the control signal. The storage unit 14 also stores information necessary for controlling the motion controller 61. The design information 14a can include information indicating the outer shape of the chip cassette 3, the IC chip 4, the circuit board 8, etc., the reference mark, the shape and position of each connection terminal, the set value at the time of thermocompression bonding, and the like. The design information is not limited to the design value on the drawing, but may be, for example, an actual measurement value of the actual IC chip 4 serving as a reference.

  The chip camera 2 includes a line sensor 21, an A / D converter (analog / digital converter) 22, and an output unit 23. The A / D converter 22 converts the analog pixel value of each pixel output from the line sensor 21 into a digital signal. The output unit 23 converts the digital signal sequence output from the A / D converter 22 into a digital image signal having a predetermined format and outputs the digital image signal. The image signal output from the output unit 23 is directly stored in the image memory 11b via the input unit 12 by, for example, a DMA (Direct Memory Access) method.

  Further, as shown in FIG. 5, the motion controller 61 is connected to the chip camera 2 and the place camera 10 by cables 48 and 49, respectively. The motion controller 61 sends the control signal Trigger_C to the chip camera 2 during a period in which the area where the reference mark 5m is provided and the area where the bumps are attracted are within the imaging range of the chip camera 2 corresponding to the position indicated by the encoder pulse. Send. As a result, the chip camera 2 starts imaging the area where the reference mark 5m is provided and the area where the bumps are attracted, and ends imaging after the period during which the control signal Trigger_C is input.

  The motion controller 61 controls the control signal during a period in which the area where the reference mark is provided and the area where the IC chip 4 is mounted on the circuit board 8 are within the imaging range of the place camera 10 corresponding to its position indicated by the encoder pulse. Trigger_P is transmitted to the place camera 10. As a result, the place camera 10 starts imaging the area where the reference mark is provided and the area where the IC chip 4 is mounted on the circuit board 8, and ends the imaging after the period during which the control signal Trigger_P is input. .

  In addition, the illumination controller 51 receives the control signal Trigger_M via the cable 45. The control signal Trigger_M indicates that the motion controller 61 corresponds to its own position indicated by the encoder pulse so that the imaging area of the chip camera 2 changes from the area where the reference mark 5m is provided to the area where the bump is attracted or This is a signal notifying the illumination controller that the suction area is switched to the area where the reference mark 5m is provided. The control signal Trigger_M indicates that the motion controller 61 corresponds to its own position indicated by the encoder pulse, and the imaging area of the place camera 10 is an area where the IC chip 4 is mounted on the circuit board 8 from the area where the reference mark is provided. Or a signal that notifies the illumination controller that the area of the circuit board 8 where the IC chip 4 is mounted is switched to the area where the reference mark is provided.

The illumination controller 51 is connected to the chip camera illumination device 52 and the cable 46, and to the place camera illumination device 53 and the cable 47, respectively.
The chip camera illumination device 52 turns on (turns on) the chip camera angle illumination 52b while the control signal Trigger_I1C is input from the illumination controller 51, and the chip camera coaxial illumination during the period when the control signal Trigger_I2C is input. 52a is turned on (off).
Further, the place camera illumination device 53 lights the place camera angle illumination 53b while the control signal Trigger_I1P is input from the illumination controller 51, and turns on the place camera coaxial illumination 53a while the control signal Trigger_I2P is input. Lights up.

  Next, an operation example of the mounting apparatus 100 described with reference to FIGS. 1 and 5 will be described with reference to FIGS. FIG. 6 is a flowchart showing the operation flow of the mounting apparatus 100. FIG. 7 is a diagram for explaining the process of step S104 of FIG. FIG. 8 is a timing chart for explaining the switching operation of the lighting device.

  The signal processing unit 1 is prepared at a predetermined position of the chip cassette 3 containing the IC chip 4 and the circuit board 8 and information for specifying the IC chip 4 and the circuit board 8 via a predetermined input device (not shown). After the setting is made, when the operator performs a predetermined instruction operation, the mounting apparatus 100 starts to operate accordingly. When the operation is started, the signal processing unit 1 outputs a predetermined control signal to the motion controller 61, thereby moving the moving unit 6 above the IC chip 4 to be sucked on the chip cassette 3 (step S101). ).

  Next, according to the instruction from the signal processing unit 1, the motion controller 61 picks the IC chip 4 from the chip cassette 3 with the suction head 5 (step S102).

  Next, according to the instruction from the signal processing unit 1, the motion controller 61 starts to move the moving unit 6 toward the substrate stage 7 (step S103).

  In accordance with an instruction from the motion controller 61, the chip camera 2 images the IC chip 4 (step S104). Here, the process of step S104 will be described with reference to FIGS. In FIG. 8, as shown in FIG. 4A, in accordance with the moving direction of the motion controller 61, the imaging region by the chip camera 2 is changed from the reference mark region (region where the reference mark 5m is provided) to the next bump region. The figure shows changes in the levels of the control signals Trigger_C, Trigger_I1C, and Trigger_I2C when the area is finally switched to the reference mark area.

  The motion controller 61 enables the control signal Trigger_P (step S201). When the reference mark area enters the imaging range of the chip camera 2, the motion controller 61 changes the control signal Trigger_C from the low (L) level to the high (H) level as shown at time t1 in FIG. 2 starts imaging.

The illumination controller 51 invalidates the control signal Trigger_I1C and validates the control signal Trigger_I2C (step S202).
As shown in FIG. 8, since the reference mark area is imaged, the illumination controller 51 maintains the control signal Trigger_I2C at the H level and maintains the control signal Trigger_I1C at the L level. Thereby, in the period during which the reference mark area is imaged, the chip camera coaxial illumination 52a is turned on and the chip camera angle illumination 52b is turned off.

  The chip camera 2 images the reference mark (step S203). The reference mark area including the reference mark 5m is imaged by the chip camera 2 while being irradiated with light from the chip camera coaxial illumination 52a.

The illumination controller 51 validates the control signal Trigger_I1C and invalidates the control signal Trigger_I2C (step S204).
The motion controller 61 outputs a control signal Trigger_M indicating switching from the reference mark area to the bump area to the illumination controller 51. As shown in FIG. 8, the illumination controller 51 changes the control signal Trigger_I1C from L level to H level at time t2, and changes the control signal Trigger_I2C from H level to L level at time t3. As a result, the chip camera coaxial illumination 52a is turned off, and the chip camera angle illumination 52b is turned on.

  The chip camera 2 images the bump (step S205). The bump area is imaged by the chip camera 2 in a state where light from the chip camera angle illumination 52b is irradiated.

  The illumination controller 51 invalidates the control signal Trigger_I1C and validates the control signal Trigger_I2C (step S206). The motion controller 61 outputs a control signal Trigger_M indicating that the bump area is switched to the reference mark area to the illumination controller 51. As shown in FIG. 8, the illumination controller 51 changes the control signal Trigger_I2C from L level to H level at time t4, and changes the control signal Trigger_I1C from H level to L level at time t5. As a result, the chip camera angle illumination 52b is turned off, and the chip camera coaxial illumination 52a is turned on.

The chip camera 2 images the reference mark (step S207). The reference mark area including the reference mark 5m is imaged by the chip camera 2 while being irradiated with light from the chip camera coaxial illumination 52a. When the reference mark area is out of the imaging range of the chip camera 2, the motion controller 61 changes the control signal Trigger_C from the H level to the L level and ends the imaging of the chip camera 2.
Note that both the chip camera coaxial illumination 52a and the chip camera angle illumination 52b are lit during the time between the time t2 and the time t3 and the time between the time t4 and the time t5. It is good also as a period which turns off.

Returning to FIG. 6, next, the signal processing unit 1 calculates the positional deviation amount of the IC chip 4 and the like based on the captured image of the chip camera 2 (step S105).
In step S105, the signal processing unit 1 calculates the positional deviation amount and the angular deviation amount of the IC chip 4 as follows, for example. (1) First, the signal processing unit 1 refers to information for correcting previously confirmed luminance variations and lens aberrations, and the gray scale luminance and lens of a predetermined pixel of the captured image captured by the chip camera 2. Image processing for correcting aberration is executed. However, this correction process may be omitted depending on the configuration. (2) Next, the signal processing unit 1 sets a recognition target area corresponding to each bump 4 a based on the design value of the IC chip 4 read from the storage unit 14. (3) Next, the signal processing unit 1 obtains the barycentric position of the luminance value from the luminance value (= pixel value) of each pixel for each recognition target area set in step S202. (4) Next, the signal processing unit 1 obtains the deviation amount ΔX in the X direction, the deviation amount ΔY in the Y direction, and the angular deviation amount Δθ of the IC chip 4 based on the X coordinate and the Y coordinate of each bump 4a.

  Here, the signal processing unit 1 estimates the arrangement direction of the bumps 4a using, for example, the least square method based on the X and Y coordinate values of the plurality of bumps 4a. Next, the coordinates of the center point Pc of the IC chip 4 are obtained based on the estimated arrangement direction of the bumps 4a. In addition, the signal processing unit 1 recognizes the reference point 5b and the reference line 5c described with reference to FIG. 3, and based on the reference point 5b, determines the reference point P0 and the reference direction when obtaining the angle deviation amount θ. Ask. Then, the signal processing unit 1 determines the deviation amount ΔX in the X direction and the deviation amount ΔY in the Y direction based on the obtained arrangement direction of the bumps 4a, the coordinates of the center point Pc, the coordinates of the reference point P0, and the reference direction. And an angle deviation amount Δθ.

  Next, the signal processing unit 1 outputs a predetermined instruction to the motion controller 61, and the motion controller 61 moves the moving unit 6 above the mounting position of the IC chip 4 on the circuit board 8 on the substrate stage 7 (step). S106).

  Next, according to the instruction of the signal processing unit 1, the place camera 10 images the mounting area of the IC chip 4 on the circuit board 8 (step S107). At this time, the imaging process and the switching process of the illumination device shown in step S104 may be performed. With respect to the reference mark, the substrate stage 7 is moved in the XY directions so as to enter the imaging region of the place camera 10 and imaged.

  The signal processing unit 1 recognizes the displacement amount and the angular displacement of the mounting position in the XY direction in the mounting region of the IC chip 4 with respect to the captured image of the place camera 10 (step S108).

  Next, the signal processing unit 1 calculates each correction amount of the moving unit 6 based on the positional deviation and the angular deviation amount of the IC chip 4 and the mounting region positional deviation amount of the circuit board 8 calculated in step S105 described above. (Step S109). The signal processing unit 1 is moved so that each deviation amount (ΔX, ΔY, ΔZ, Δθ) of the IC chip 4 matches the reference position and orientation as much as possible in consideration of the recognition result for the circuit board 8. The amount of correction when adjusting the position and angle θ of the unit 6 in the XYZ directions is calculated.

  Next, the signal processing unit 1 transmits a signal indicating each correction amount obtained in step S109 to the motion controller 61 (step S110).

  Then, after the motion controller 61 corrects the positional deviation and the angular deviation of the moving part 6, the moving part 6 lowers the height, places the IC chip 4 on the connection part of the circuit board 8, and thermocompression-bonds (step S111). .

  As described above, in the present embodiment, the mounting apparatus 100 (recognition apparatus) has the chip camera 2 or the place camera 10 (imaging unit) that images the moving IC chip 4 or the circuit board 8 (recognition target object). . Further, the mounting apparatus 100 includes a chip camera coaxial illumination 52a or a place camera coaxial illumination 53a (first illumination unit) that emits light from a direction perpendicular to the main surface of the recognition target, and light from an oblique direction of the main surface. (Second illuminating unit), and a chip camera illuminating device 52 or a place camera illuminating device 53 (illuminating device) that illuminates the recognition target when the image capturing unit captures an image. Furthermore, the mounting apparatus 100 includes a signal processing unit 1 that recognizes the position of the recognition target object based on an image captured by the imaging unit. The mounting apparatus 100 controls the irradiation of light from the first illumination unit and the second illumination unit to the main surface according to a plurality of imaging regions in the recognition target object.

  The mounting apparatus 100 of the present embodiment having the above configuration has the effects described below. FIG. 9 is a diagram for explaining an example of an image captured by the chip camera 2 shown in FIG. FIG. 9 shows an image captured by the chip camera 2 for the reference mark area and the bump area described with reference to the timing chart of FIG. A captured image of an area including the reference mark 5m ahead of the chip movement direction in the reference mark 5m illustrated in FIG. 4 is illustrated as a front side fiducial area in FIG. 9A. In addition, a captured image of a region including the solder balls included in the IC chip 4 illustrated in FIG. 4 is illustrated as Solder Bump Area in FIG. 9B.

  Also, a captured image of an area including the reference mark 5m located behind the chip movement direction in the reference mark 5m shown in FIG. 4 is shown as Back Side Fidential Area in FIG. 9C. Further, in each of FIGS. 9A to 9C, the captured image when only the chip camera coaxial illumination 52 a is turned on is shown as Core, and only the chip camera angle illumination 52 b is turned on and taken. The captured image is indicated by Angle.

  As shown in FIGS. 9A and 9C, when angle illumination is used in the reference mark area, light from the angle illumination is reflected on the reference mark and is not incident on the chip camera 2. The reference mark 5m is not imaged. On the other hand, as shown in each core of FIGS. 9A and 9C, when coaxial illumination is used, the light from the coaxial illumination is reflected by the reference mark and then enters the chip camera 2; 5m is imaged. That is, it can be seen that it is desirable to enable the coaxial illumination in order to image the reference mark and recognize its position.

9B, when coaxial illumination is used in the bump area, the light from the coaxial illumination is reflected on the ground (semiconductor chip or film coated on the surface), and then the chip camera 2 Therefore, the shape of the solder bump, in particular its outline, is not clearly imaged as compared with the case where coaxial illumination is used. On the other hand, as shown in Angle of FIG. 9B, when angle illumination is used, the light reflected from the convex portion (curved surface) of the solder ball enters the chip camera 2, so that the shape of the solder ball, particularly its contour, is obtained. The part can be clearly imaged.
In the mounting apparatus 100 of the present embodiment, referring to FIG. 9, a captured image indicated by Core in FIG. 9A, a captured image indicated by Angle in FIG. 9B, and a captured image indicated by Core in FIG. 9C. Will be imaged.

  That is, according to the mounting apparatus 100 of the present embodiment, the moving reference mark and solder bump (recognition) between the illumination condition when imaging the reference mark 5m and the illumination condition when imaging the bump on the semiconductor chip are recognized. By changing in real time with respect to the imaging time of the (object), the first area where the reference mark is provided and the second area where the bumps are attracted can be imaged under respective optimal illumination conditions. . Therefore, according to the present invention, it is possible to provide a recognition device, a recognition method, a mounting device, and a mounting method that enable good semiconductor chip recognition and position estimation in a short time based on a captured image captured under optimal illumination conditions. can do. In addition, since the response speed at the time of switching is sufficiently high by using LED illumination as the lighting device, the influence of brightness unevenness due to switching of illumination can be reduced even during imaging by the line sensor 21. Therefore, the combination with the real-time recognition by the line sensor 21 makes it possible to improve both the position estimation accuracy and the recognition rate and shorten the mounting processing time.

  In the present embodiment, the lens magnification adjusting mechanism is configured to be automatically adjustable, such as an electric zoom, so that it can automatically cope with a change in the layout of the target IC chip 4. However, the focal length of the zoom lens 33 may be set manually, for example.

  In the present embodiment, the recognition target is the solder bump 4a on the IC chip 4, but the position recognition by the chip camera 2 is performed by, for example, a semiconductor chip other than CSP, other circuit mounting components, passive It can also be applied to parts and the like. In addition to the mounting device, for example, it may be configured as a device used in the inspection process of the bumps 4a in a stage before being stored in the chip cassette 3. The chip camera 2 can also be configured using an area sensor instead of the line sensor 21.

  In the present embodiment, the number of control signals for the illumination controller is two. However, when the angle of the angle illumination is composed of a plurality of channels, the number may be increased by the number of channels. In this embodiment, the illumination device is configured by coaxial illumination and angle illumination. However, a channel configuration may be used for illumination wavelength and light quantity. In this embodiment, the description is limited to the chip camera, but a channel configuration may be used for the place camera.

DESCRIPTION OF SYMBOLS 1 ... Signal processing part, 2 ... Chip camera (imaging part), 3 ... Chip cassette, 4 ... IC chip (recognition target object), 4a ... Bump (1st recognition object), 5 ... Adsorption head, 6 ... Moving part, DESCRIPTION OF SYMBOLS 7 ... Substrate stage, 8 ... Circuit board, 11 ... Host computer, 33 ... Zoom lens, 51 ... Illumination controller, 52 ... Chip camera illumination device, 52a ... Chip camera coaxial illumination, 52b ... Chip camera angle illumination, 53 ... Place camera illumination device, 53a ... Place camera coaxial illumination, 53b ... Place camera angle illumination, 61 ... Motion controller, 100 ... Mounting device

Claims (6)

An imaging unit for imaging a moving recognition object;
A first illuminating unit that irradiates light from a direction perpendicular to the main surface of the recognition object; and a second illuminating unit that irradiates light from an oblique direction of the main surface. An illumination device for illuminating the recognition object when performing,
A signal processing unit for recognizing the position of the recognition object based on an image captured by the imaging unit;
A recognition device comprising:
A notification signal from a motion controller that moves the recognition target object, and a switching notification signal for notifying switching of a plurality of imaged areas in the recognition target object is input, and the first illumination unit and the second lighting unit are input. A recognition apparatus comprising: an illumination controller that controls light irradiation from the illumination unit to the main surface according to the switching notification signal. The recognition object is a semiconductor chip;
The plurality of imaged areas in the recognition object include a first area where a reference mark is provided and a second area where a bump is attracted,
The lighting controller
In the first region, the first illumination unit is turned on, the second illumination unit is turned off,
In the second region, the first illumination unit is turned off and the second illumination unit is turned on according to the switching notification signal.
The recognition apparatus according to claim 1. Mounting the recognition object on a predetermined circuit board by performing a predetermined correction control related to the position and angle of the recognition object based on the recognition result by the recognition device according to claim 1 or 2;
A mounting apparatus characterized by that. An imaging unit for imaging a moving recognition object;
A first illuminating unit that irradiates light from a direction perpendicular to the main surface of the recognition object; and a second illuminating unit that irradiates light from an oblique direction of the main surface. An illumination device for illuminating the recognition object when performing,
A signal processing unit for recognizing the position of the recognition object based on an image captured by the imaging unit;
A lighting controller that is a notification signal from a motion controller that moves the recognition target object, and that receives a switching notification signal for notifying switching of a plurality of imaging regions in the recognition target object.
Controlling irradiation of light from the first illumination unit and the second illumination unit to the main surface according to the switching notification signal;
A recognition method characterized by the above. The recognition object is a semiconductor chip;
The plurality of imaged areas in the recognition object include a first area where a reference mark is provided and a second area where a bump is attracted,
The lighting controller
In the first region, the first illumination unit is turned on, the second illumination unit is turned off,
In the second region, the first illumination unit is turned off and the second illumination unit is turned on according to the switching notification signal.
The recognition method according to claim 4. Mounting the recognition object on a predetermined circuit board by performing a predetermined correction control on the position and angle of the recognition object based on the recognition result by the recognition method according to claim 4 or 5.
An implementation method characterized by that.

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