JP7095089B2 - Mounting machine and mounting system - Google Patents

Description

The present disclosure relates to a mounting machine from which flatness is acquired, and a mounting system including the mounting machine.

The mounting machine described in Patent Document 1 is provided with a floating presence / absence detecting device for detecting the presence / absence of floating of each of a plurality of lead wires of one component held by the component holder of the head. In the floating presence / absence detection device, among the plurality of lead wires of the parts held by the component holder, some of the multiple lead wires irradiated with the slit light from the slit light source are imaged by the camera and based on the captured image. Therefore, the presence or absence of floating of each of a plurality of lead wires is detected.

Japanese Patent Application Laid-Open No. 2008-288336

Issues to be resolved by this disclosure

An object of the present disclosure is to efficiently obtain the flatness of each of a plurality of parts.

Means, actions and effects to solve problems

In the mounting machine of the mounting machine system according to the present disclosure, a pattern is irradiated and imaged on two or more of a part of a plurality of parts held by the rotary head, and a part is imaged based on the captured image. The flatness of each of the two or more parts is acquired. In this way, since the flatness of each of the two or more components is acquired based on the captured image, the pattern is irradiated and imaged for each component, and the flatness is obtained based on the captured image. It is possible to efficiently acquire the flatness of two or more parts as compared with the case where it is acquired. In Patent Document 1, two or more parts of a part of the plurality of parts held by the rotary head are imaged by an image pickup device, and the flatness of the two or more parts is determined based on the captured image. It is not stated that it will be acquired.

It is a figure which conceptually shows the mounting system which concerns on this embodiment. It is a top view of the mounting machine of the above mounting system. It is a figure which conceptually shows the periphery of the rotary head of the component mounting apparatus of the above-mentioned mounting machine. It is a front view of the image pickup unit of the said mounting machine. It is a plan view (conceptual view) of the said image pickup unit. It is a figure which conceptually shows the periphery of the control device of the said mounting machine. It is a flowchart which shows the flatness acquisition program stored in the storage part of the said control device. It is a flowchart which shows the optimization program stored in the storage part of the host PC of the said mounting system. It is a flowchart showing another flatness acquisition program stored in the storage part of the said control device. It is a conceptual diagram which looked at the part held by the rotary head from the lower side. It is a figure which conceptually shows the relative positional relationship between the rotary head and an image pickup unit. (12A) It is a figure showing the change of the irradiation angle of the pattern with the rotation of the component held by the rotary head. (12B) It is a figure which shows the change of the irradiation angle when the above-mentioned other pattern is irradiated. It is a figure which conceptually shows another relative positional relationship between the rotary head and an image pickup unit. (14A) It is a figure which shows the change of the angle of the pattern which the projector 150 irradiates a component with the rotation of the rotary head. (14B) It is a figure which shows the change of the angle of the pattern which irradiates a component by a projector 151. It is a figure which shows the change of the angle of the pattern which irradiates a component with the rotation of the rotary head in the 1st relative position. It is a figure which shows the change of the angle of the pattern which irradiates a component with the rotation of the rotary head in the 2nd relative position. (17A) It is a figure which shows the part held in the rotary head when the optimization was aimed at by the host PC. (17B) It is a figure which shows the part held in the rotary head when the optimization is not aimed at by the host PC. (18A), (18B), (18C) It is a figure which shows the work target part in the said mounting machine.

Form for carrying out disclosure

Hereinafter, the mounting machine system according to the embodiment of the present disclosure will be described in detail with reference to the drawings.

As shown in FIG. 1, the mounting system 2 includes (a) a plurality of mounting machines 4A, 4B ..., (b) a host computer (hereinafter abbreviated as a host PC) 6, (d) a bus 8, and the like. , And each of the plurality of control devices 10A, 10B ... Provided by each of the plurality of mounting machines 4A, 4B ... And the host PC 6 are communicably connected to each other via the bus 8. When distinguishing each of the plurality of mounting machines 4A, 4B ..., The control devices 10A, 10B ..., The symbols A, B, ... Are added to distinguish them. When it is not necessary to distinguish between generic names, the symbols A, B, ..., Etc. are omitted.

As shown in FIG. 2, the plurality of mounting machines 4 mount electronic components (hereinafter abbreviated as components) on a circuit board S (hereinafter abbreviated as a substrate S), and each of the control devices 10 (See FIG. 6), includes a board transfer support device 12, a component supply device 14, a component mounting device 16, an imaging unit 18, and the like.
The board transfer support device 12 transports and holds the substrate S. In FIG. 2, X is the transport direction of the substrate S by the substrate transport support device 12, and Y is the width direction of the substrate S. Further, in FIGS. 3 and 4, Z is the thickness direction of the substrate S. Y is the front-rear direction of the mounting machine 4, Z is the vertical direction, and these X-direction, Y-direction, and Z-direction are orthogonal to each other.

The component supply device 14 supplies components mounted on the substrate S in a state in which they can be delivered to the component mounting device 16. In the present embodiment, the component supply device 14 includes a tape feeder 22 that supplies a plurality of components by using tape, but it may also include a plurality of trays.
As shown in FIGS. 10 and 18A, the component supplied by the component supply device 14 is a component 30 including a component body 26 and a plurality of solder balls 28 as electrode portions formed on the component body 26. As shown in BGA (Ball Grid Array), FIGS. 10 and 18B, the component body 32 and a plurality of lead wires 34 extending from the side surface of the component body 32 and bent into a J shape are included. Includes SOJ (Small Out Line J Lead), which is a lead component 36, and CSP (Chip Size Package), which is a chip-shaped component 38 having electrode portions 37 at both ends, as shown in FIGS. 17A, 17B, and 18C. Is done. Note that FIGS. 10, 17A and 17B show the parts 30, 36 and 38 as viewed from the bottom.

The component mounting device 16 picks up and holds the components supplied by the component supply device 14, and mounts the components on the substrate S which is conveyed and held by the substrate transfer support device 12. As shown in FIGS. 2 and 3, the component mounting device 16 includes a rotary head 40, a head moving device 42 for moving the rotary head 40, and the like. The head moving device 42 includes a head horizontal moving device 44 that moves the rotary head 40 in the x direction and the y direction, a head rotating device 46 that rotates the rotary head 40 around the head center axis (indicated by reference numeral Lh in FIG. 3), and the like. including. As shown in FIG. 2, the head horizontal moving device 44 includes an X-direction moving device 50 and a Y-direction moving device 52. The X-direction moving device 50 includes an X slider 54, an X motor 56 as a drive source, a motion conversion mechanism 58 that converts the rotation of the X motor 56 into linear movement and transmits the rotation to the X slider 54. The Y-direction moving device 52 is provided on the X slider 54, and is a motion conversion mechanism 66 (see FIG. 3) that converts the rotation of the Y slider 62, the Y motor 64 as a drive source, and the Y motor 64 into linear motion and transmits it to the Y slider 62. ) Etc. are included.

On the other hand, the rotary head 40 is rotatably held by the Y slider 62 around its own head center axis Lh by the head rotating device 46. The rotary head 40 includes a head main body 78 and suction nozzles 80a, 80b ... As a plurality of (for example, three or more, eight in this embodiment) component holders. The head body 78 includes a rotation shaft 84 and a nozzle holder 86 provided so as to be rotatable integrally with each other. The suction nozzles 80a, 80b ... Are held by the nozzle bodies 87a, 87b, respectively. The nozzle bodies 87a, 87b, etc. can be relatively rotated and moved up and down at positions on the circumference of the nozzle holder 86 about the head center axis Lh, separated by a central angle of 45 ° from each other. , Will be retained. The suction nozzles 80a, 80b ... Adsorb and hold the component by negative pressure, and the component is held by supplying negative pressure from a negative pressure source (not shown). Hereinafter, when the suction nozzles 80a, 80b ..., The nozzle bodies 87a, 87b ..., Etc. are individually distinguished, the subscripts a, b, c ... If not, the subscripts a, b, c ... Are omitted.

The head rotation device 46 rotates the head body 78 by rotating the rotation shaft 84, and transmits the rotation of the head rotation motor 88 as a drive source and the head rotation motor 88 to the rotation shaft 84 (not shown). Includes a rotation transmission mechanism. By the rotation of the rotation motor 88, the rotation shaft 84, that is, the head body 78 (rotary head 40) is rotated around the head center axis Lh.

The Y slider 62 is provided with a nozzle rotation device 94 as a holder rotation device, a nozzle elevating device 96 for raising and lowering the suction nozzle 80, and the like. The nozzle rotation device 94 is integrated with a rotation motor 130 as a drive source provided in the Y slider 62, a rotation drive shaft 132 provided so as to be rotatable relative to the rotation shaft 84 of the rotary head 40, and a nozzle body 87. Includes a rotated body 134 provided so as to be rotatable. The rotation motor 130, the rotation drive shaft 132, and the rotated body 134 are engaged with each other in a state in which rotation can be transmitted. The rotation of the rotation motor 130 is transmitted to the rotated body 134 via the rotation drive shaft 132, and the plurality of suction nozzles 80 are rotated all at once around the nozzle center axis Ln. The nozzle elevating device 96 includes an elevating motor 140 that is a drive source provided in the Y slider 62, an elevating drive member 142 that can engage with the nozzle body 87 at a predetermined position of the nozzle holder 86, and an elevating motor 140. Includes a motion conversion mechanism 144 and the like that converts the rotation of the vehicle into a linear motion and transmit it to the elevating drive member 142.

The image pickup unit 18 acquires the three-dimensional shape of the component held by the suction nozzle 80 located above, and as shown in FIGS. 4 and 5, two projectors 150 and 151 and a camera as an image pickup device. It includes a 152 and a three-dimensional shape acquisition unit 154 that mainly controls a projector 150, 152 and a camera 152 and acquires a three-dimensional shape of a component.

The camera 152 is an image pickup device having an image pickup device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The camera 152 is provided in a posture in which the axis Lz extends in the Z direction, and the projectors 150 and 151 are provided at positions separated by 90 ° around the axis Lz. As shown in FIG. 12A, the projector 150 irradiates a pattern N that spreads in a plane in which the intensity changes in a sinusoidal manner in the direction of the arrow Fa, and the projector 151 irradiates the pattern N in the direction of the arrow Fb as shown in FIG. 12B. A pattern N that spreads in a plane whose intensity changes in a sinusoidal manner is irradiated. Further, these patterns N are irradiated in the directions inclined with respect to the Z direction and the X and Y directions, and hit the component from diagonally below.

Further, the image pickup region Rc, which is a region where an image can be captured by the camera 152, is included in the irradiation region Rp, which is a region where the pattern is irradiated by the projectors 150 and 151. Therefore, in this embodiment, the common region where the imaging region Rc and the irradiation region Rp overlap is the same as the imaging region (= common region) Rc.

In the image pickup unit 18, the parts whose patterns are irradiated by the projectors 150 and 151 are imaged by the camera 152, and the three-dimensional shape of the parts is acquired by the phase shift method based on the captured images acquired by the three-dimensional shape acquisition unit 154. Will be done. Further, in the present imaging unit 18, the three-dimensional shape of the component located inside the two-dimensionally expanded common region Rc is acquired.

The projectors 150 and 151 irradiate a pattern whose intensity changes in a sinusoidal manner in one direction Fa and Fb a plurality of times with the phase shifted, and each time the pattern is irradiated, the camera 152 in the image pickup region Rc. The captured image which is an image is acquired. In the three-dimensional shape acquisition unit 154, the luminance of each of the pixels constituting the captured image is acquired in each of the captured images, and the phase in the pixel is acquired based on the luminance value in the same pixel in the plurality of captured images. Will be done. Then, by connecting pixels having the same phase, an equiphase line can be obtained. On the other hand, the irradiation angle of the light of that phase (one line constituting the pattern), the position of the pixel on the image pickup element of the camera 152, the optical and geometric parameters of the image pickup unit 18 (optical center coordinates of the projectors 150 and 151, Based on the optical center coordinates of the camera 152 (focal length) and the like, the distances from the image pickup element of the camera 152 to the points on the component corresponding to each of the pixels connected by the equiphase lines are acquired. Then, the three-dimensional shape of the component is acquired based on the distance from each of the plurality of points on the component from the image pickup device.

The three-dimensional shape acquisition method and the pattern irradiated by the projectors 150 and 151 are not limited. For example, not only the phase shift method but also a wide pattern projection method can be used to acquire a three-dimensional shape. Further, in the present embodiment, it is sufficient to acquire the three-dimensional shape of the component located in the predetermined two-dimensional (planar) setting area, and for example, the stereo imaging method can be used. .. When the stereo imaging method is used, a projector is not required, and the three-dimensional shape of the component located in the imaging region Rc is acquired based on the images captured by a plurality of cameras.

The control device 10 is mainly a computer, and as shown in FIG. 6, includes an execution unit 180, a storage unit 182, an input / output unit 184, and the like, and the input / output unit 184 is a three-dimensional image pickup unit 18. The shape acquisition unit 154 is connected, and the board transfer support device 12, the component supply device 14, the component mounting device 16, and the like are connected via the drive circuit 190. Further, a host PC 6 is connected to the control device 10, but as shown in FIG. 1, the host PC 6 includes an execution unit 200, a storage unit 202, an input / output unit 204, and the like, and the input / output unit 204 has an external input. The device 206 and the like are connected.

In the mounting system configured as described above, the operation of the mounting machine 4 will be described first.
In the mounting machine 4, the rotary head 40 is moved above the image pickup unit 18, and the portion of the plurality of components held by the rotary head 40 that is mounted on the substrate S (the side held by the suction nozzle 80). The three-dimensional shape of the target portion (on the opposite side) is acquired, and the flatness of the virtual plane is acquired based on the three-dimensional shape. The target portion is a portion including at least a part of the electrode portion of the component.
For example, in the component 30 shown in FIG. 18A, the portion including the plurality of solder balls 28 is designated as the target portion Ta, and the tips (points) of the plurality of solder balls 28 are set based on the three-dimensional shape of the target portion Ta. The flatness of the formed virtual plane Pa is acquired. In the component 36 shown in FIG. 18B, the portion of the plurality of lead wires 34 including the portion extending to the bottom surface of the component body 32 is referred to as the target portion Tb, and the plurality of lead wires are based on the three-dimensional shape of the target portion Tb. The flatness of the virtual plane Pb formed by a set of predetermined points on the side surface (bottom surface) of the portion extending toward the bottom surface side of the component body 32 of 34 is acquired.

On the other hand, a part of the solder ball 28 may be chipped or the lead wire 34 may be bent due to a manufacturing defect or a trouble during transportation. As described above, when the component 30 in which a part of the solder ball 28 is missing or the component 36 in which the lead wire 34 is bent is mounted on the substrate S, problems such as poor energization of the components 30 and 36 occur. .. Therefore, in this embodiment, the flatness of the target portions of the parts 30 and 36 is acquired, and the parts 30 and 36 are checked. On the other hand, for the component 38 shown in FIG. 18C, it is not necessary to acquire the flatness of the electrode portion 37. Therefore, in this embodiment, the parts 30 and 36 are the parts to be obtained for flatness (hereinafter, may be simply referred to as the target parts), and the parts 38 are not the target parts. Hereinafter, the flatness of the virtual plane formed by a set of predetermined points of the electrode portion of the target portion of the component may be simply referred to as the flatness of the component.

On the other hand, as shown in FIG. 4, in the image pickup unit 18 according to the present embodiment, the common area Rc is narrower than the area including all eight parts held by the rotary head 40. Therefore, it is not possible to acquire a captured image including all eight components held by the rotary head 40.

Further, it is desirable that the three-dimensional shape of the component is acquired by the projector in a state where the patterns N are irradiated from a plurality of different directions. This is because, depending on the direction of the pattern N irradiated on the component, there may be a portion of the component where the pattern does not hit, and it may be difficult to accurately acquire the three-dimensional shape.

Therefore, for example, as shown in FIG. 11, the rotary head 40 is moved by the head horizontal movement device 44, and the relative positions of the rotary head 40 and the image pickup unit 18 are all the suction nozzles 80 provided in the rotary head 40. Two or more parts held by a part of the suction nozzles 80 are set as the first relative position located inside the common region Rc. Then, at this first relative position, the rotary head 40 is intermittently rotated by the head rotation device 46 by a set rotation angle, and the pattern N is irradiated to image the component. Then, the three-dimensional shape of each part is acquired based on the acquired captured image. Specifically, the first relative position is the three parts 36 ₍₁₎ , 36 ₍₂ ) held by the three suction nozzles 80a, 80b, 80c located inside the first region R1 of the rotary head 40. ₎ , 30 ₍₃₎ are relative positions located inside the common region Rc. The first region R1 is a region defined by the central angle of the rotary head 40, and is located in a region (set central angle range) of 0 ° or more and 90 ° or less when the position closest to the x slider 54 is 0 °. It is defined as an area containing three parts held by the three suction nozzles 80. Further, the parts are rotated with the rotation of the rotary head 40, so that the parts are irradiated with the pattern N from different angles.

In this embodiment, as shown in FIG. 11, the projector 150 irradiates the pattern N in the direction indicated by the arrow Fa at the first relative position between the rotary head 40 and the image pickup unit 18. In that case, the irradiation angle (hereinafter, in the plan view) of the pattern N to be irradiated (hit) on the part held in the suction nozzle 80a (hereinafter, may be referred to as the first part) 36 ₍₁₎ in the plan view. The irradiation angle (which may be simply abbreviated as an angle) is set to 0 °, and the angle of the pattern N irradiated to the component held by the suction nozzle 80b (hereinafter, may be referred to as the second component) 36 ₍₂₎ . Is 45 °, and the angle of the pattern N irradiated to the component (sometimes referred to as the third component) 30 ₍₃₎ held by the suction nozzle 80c is 90 °. In this state, the captured image captured by the camera 152 includes images of the three parts 36 ₍₁₎ , 36 ₍₂₎ , and 30 ₍₃₎ , and a pattern is obtained from an angle of 0 ° based on the captured image. The three-dimensional shape of the part 36 ₍₁₎ when N is irradiated, the three-dimensional shape of the part 36 ₍₂₎ when the pattern N is irradiated from an angle of 45 °, and the pattern N when the pattern N is irradiated from an angle of 90 °. The three-dimensional shape of the part 30 ₍₃₎ of the above is acquired.

Next, the projector 151 irradiates the pattern N in the direction indicated by the arrow Fb. The first part 36 ₍₁₎ is irradiated with the pattern N from an angle of 90 ° in a plan view, the second part 36 ₍₂₎ is irradiated with the pattern N from an angle of 135 °, and the third part 30 ₍₃₎ . ₎ Is irradiated with the pattern N from an angle of 180 °. Based on the captured image in this case, the third order when the pattern N is irradiated from the angles 90 °, 135 °, and 180 ° in the plan view for each of the parts 36 ₍₁₎ , 36 ₍₂₎ , and 30 ₍₃₎ . The original shape is acquired.

After that, the rotary head 40 is rotated around the head center axis Lh by 45 ° as a set rotation angle. The part held by the suction nozzle 80h (sometimes referred to as the 8th part) 30 ₍₈₎ , the 1st part 36 ₍₁₎ , and the 2nd part 36 ₍₂₎ are located inside the common area Rc. The third component 30 ₍₃₎ is out of the common area Rc. The 8th part 30 ₍₈₎ , the 1st part 36 ₍₁₎ , and the 2nd part 36 ₍₂₎ have the pattern N from the angles of 0 °, 45 °, and 90 ° in plan view by the projector 150, respectively. After being irradiated, the projector 151 irradiates the pattern N from angles of 90 °, 135 °, and 180 ° in a plan view, and a three-dimensional shape is acquired, respectively. Hereinafter, similarly, the rotary head 40 is rotated by 45 °, and a three-dimensional shape is acquired for each of the three parts located inside the common region Rc. As described above, the set rotation angle (45 °), which is the rotation angle of the rotary head 40 once, is an angle smaller than the set center angle range (90 °) that defines the first region R1. Therefore, when the rotary head 40 is rotated once, all the parts belonging to the first region R1, that is, the parts belonging to the common region Rc when the rotary head 40 and the image pickup unit 18 are in the first relative position may change. Not at least one remains. In other words, the set rotation angle of the rotary head 40 and the set center angle defining the first region R1 are among two or more parts located inside the common region Rc by one rotation of the rotary head 40. It is determined that a part of the common region Rc deviates from the common region Rc and the remaining part remains inside the common region Rc.

When focusing on one component, for example, the first component 36 ₍₁₎ , as shown in FIG. 12A, the rotary head 40 is rotated by 0 °, 45 °, and 90 ° to cause the first component 36. ₍₁₎ is irradiated with the pattern N from the angles of 0 °, 45 °, and 90 ° in the plan view by the projector 150, and as shown in FIG. 12B, the projector 151 irradiates the pattern N in 90 °, 135 °, and 180 ° in the plan view. The pattern N is irradiated from an angle. Therefore, by rotating the rotary head 40 from 0 ° to 90 °, the pattern N of the first component 36 ₍₁₎ is irradiated from the angles of 0 °, 45 °, 90 °, 135 °, and 180 °. Each three-dimensional shape when it is done is acquired. Similarly, for all eight components held in the rotary head 40, patterns from 0 °, 45 °, 90 °, 135 ° 180 ° angles in plan view as the rotary head 40 rotates by 45 °. The captured image when N is irradiated is acquired, and the three-dimensional shape is acquired for each. In FIG. 12, the inside of the first component 36 ₍₁₎ is indicated by an arrow. This is to clearly show the change in the orientation of the component 36 ₍₁₎ and the change in the angle of the pattern N irradiated to the component 36 ₍₁₎ with the rotation of the rotary head 40. The same applies to FIG.

FIG. 15 shows the rotation angle of the rotary head 40 in this case and the irradiation angle of the pattern N on each of the parts. As shown in FIG. 15, as the rotary head 40 rotates, the component located inside the common region Rc changes, and the angle of the pattern N irradiated to the component in the plan view also changes. In FIG. 15, the first component is described as component 1. The same applies to the following parts.

Next, as shown in FIG. 13, the rotary head 40 is moved by the head horizontal movement device 44, and the relative position between the rotary head 40 and the image pickup unit 18 is different from the first region R1 of the rotary head 40. The fifth component 36 ₍₅₎ , the sixth component 30 ₍₆₎ , and the seventh component 30 ₍₇₎ held by the suction nozzles 80e, 80f, and 80 g located inside the two regions R2 are the imaging unit 18. It is a second relative position located in the common area Rc of. In the present embodiment, the second region R2 is a region to which the three parts held by the three suction nozzles located in the range of the central angle of the rotary head 40 of 180 ° or more and 270 ° or less belong. The area of the first region R1 and the second region R2 are the same, but the relative positions with respect to the x slider 54 are different. Then, at the second relative position of the rotary head 40, similarly, the rotary head 40 is intermittently rotated by 45 °, and the three parts are irradiated with the pattern N by the projectors 150 and 151, respectively. Three parts each are imaged by the camera 152.

When focusing on one component 36 ₍₅₎ , as shown in FIG. 14A, the rotary head 40 is rotated by 0 °, 45 °, and 90 °, and the component 36 ₍₅₎ is flattened by the projector 150. The captured image is acquired by the camera 152 while the pattern N is irradiated from an angle of 180 °, 225 °, and 270 ° in the visual sense. Further, as shown in FIG. 14B, the image captured image is acquired by the projector 151 while the pattern N is irradiated to the component 36 ₍₅₎ from an angle of 270 °, 315 °, and 360 ° in a plan view. Similarly, for each of the eight components held in the rotary head 40, as shown in FIG. 16, the angles are 180 °, 225 °, 270 °, and 315 °, respectively, as the rotary head 40 rotates. The pattern N is irradiated from 360 °, the captured image is acquired, and the three-dimensional shape is acquired respectively.

As described above, by rotating the rotary head 40 by 45 ° at each of the first relative position and the second relative position of the rotary head 40, all eight parts held by the rotary head 40 are respectively. A three-dimensional shape is acquired when the pattern N is irradiated from angles 0 °, 45 °, 90 °, 135 °, 180 °, 225 °, 270 °, and 315 ° in a plan view.

The flatness acquisition program in that case will be described with reference to the flowchart of FIG. This program is executed in the control device 10, and every time the rotary head 40 is rotated by 45 °, a three-dimensional shape acquisition command is output to the three-dimensional shape acquisition unit 154. In the image pickup unit 18, the pattern is irradiated by the projectors 150 and 151, and the captured image is acquired by the camera 152. Then, the three-dimensional shape is acquired based on the captured image and supplied to the control device 10.
In step 1 (hereinafter abbreviated as S1; the same applies to other steps), the count value n of the counter for counting the number of rotations is initialized (set to 0), and in S2, the rotary head 40 is first. It is moved to a relative position, and in S3, a three-dimensional shape acquisition command is output to the image pickup unit 18. In the image pickup unit 18, the three-dimensional shapes of the three acquired parts 36 ₍₁₎ , 36 ₍₂₎ , and 30 ₍₃₎ are supplied to the control device 10 and stored. Next, in S4, the rotary head 40 is rotated by 45 ° around the head center axis Lh. In S5, the count value of the count counter is incremented by 1, and in S6, it is determined whether or not the count value is larger than 7. If the determination is NO, S3 to 6 are repeatedly executed. As shown in FIG. 15, the three-dimensional shapes of the three parts are acquired while the rotary head 40 is intermittently rotated by 45 °.

Then, when the rotary head 40 is rotated by 360 ° and the determination in S6 is YES, the count value is reset to 0 in S7, and the rotary head 40 is moved to the second relative position in S8. After that, in S9, the three-dimensional shape acquisition command is output to the three-dimensional shape acquisition unit 154, and S9 to S12 are subsequently executed in the same manner as S3 to S6. At the second relative position, the rotary head 40 is intermittently rotated by 45 °, and as shown in FIG. 16, three-dimensional shapes of three parts are acquired, respectively. Then, when the rotary head 40 is rotated by 360 ° and the determination in S12 becomes YES, in S13, each of the eight parts held by the rotary head 40 is separated from each other by 45 °. The flatness of the virtual planes Pa and Pb is acquired based on the information representing a plurality of three-dimensional shapes when the pattern N is irradiated from different directions. In this embodiment, the optimum 3D shape that most appropriately represents the actual 3D shape of the part is acquired based on the information that represents the plurality of 3D shapes, and the virtual plane is based on the optimum 3D shape. The flatness is acquired. For example, the optimum three-dimensional shape can be obtained by statistically processing information representing a plurality of three-dimensional shapes.

In this way, the flatness of the plurality of parts is acquired while rotating the rotary head 40 around the head center axis Lh. Therefore, the flatness of all the parts can be obtained more efficiently, that is, in a shorter time than in the case where the flatness is obtained while rotating each of the parts around the nozzle center axis Ln.

In the above embodiment, the flatness of each part is the three-dimensional shape acquired when the rotary head 40 is in the first relative position and the three-dimensional shape acquired when the rotary head 40 is in the second relative position. It was supposed to be acquired based on both of the above, but it is acquired based on the three-dimensional shape acquired in either the case of being in the first relative position or the case of being in the second relative position. Can be. For example, only one of S1 to 6, 13 or S7 to 13 may be executed.

Next, a case where the work of one or more mounting machines 4 is optimized in the host PC 6 will be described. In the host PC 6, the optimum arrangement and rotary head of each of the mounting machines 4A, 4B ... The optimum allocation of parts held in 40 is determined. Further, the component information also includes information regarding the target components 30 and 36 whose flatness is to be acquired.

For example, the image pickup unit 18 is not always provided in all the mounting machines 4A, 4B, and so on. In addition, it takes a long time to obtain the flatness. Therefore, it is desirable to arrange a mounting machine for acquiring flatness in the latter half of a series of operations. Further, in the rotary head 40, for example, as shown in FIG. 17B, when the target parts 30 and 36 are held at distant positions, it is inefficient to acquire the flatness of the target parts 30 and 36. ..

Therefore, in this embodiment, in the host PC 6, the optimum arrangement of the mounting machines 4A, 4B ... Is determined, and the optimum allocation of the parts in the rotary head 40 is determined. In the host PC 6, the optimization program shown in the flowchart of FIG. 8 is executed before the series of operations are started in the mounting machines 4A, 4B, and so on. In S21, the part information including the target part information is acquired. In S22, the processing of component information and the like is performed, in S23, the position of the mounting machine 4 from which the flatness is acquired is determined, and in S24, the allocation of a plurality of components in the rotary head 40 is determined.

Then, in the mounting machine 4 in which the mounting machines 4A, 4B ... Are arranged according to the determination of S23 and the flatness is acquired, parts are assigned to each of the plurality of suction nozzles 80 of the rotary head 40 according to the determination of S24. Be done. In this embodiment, as shown in FIG. 17A, the target parts 36 ₍₁₎ , 36 ₍₂₎ , and 30 ₍₃₎ are held by the suction nozzles 80a, 80b, and 80c adjacent to each other. Therefore, it is not necessary to acquire the three-dimensional shape while the rotation angle of the rotary head 40 is from 135 ° to 225 °.

The flatness acquisition program executed in that case is represented by the flowchart of FIG.
In the flowchart of FIG. 9, the steps in which the same execution as that of the flatness acquisition program shown in the flowchart of FIG. 7 is executed are assigned the same step numbers and the description thereof will be omitted. In S1 to 5, the rotary head 40 is rotated by 45 ° at the first relative position, but in S31, whether the number of rotations of the rotary head 40 exceeds 2, that is, whether the rotation angle has reached 135 °. Whether or not it is determined. If the determination is YES, in S32, it is determined whether or not the rotation speed is smaller than 6, that is, whether or not the rotation angle is smaller than 270 °. If the determination is YES, S4, 5, 31, and 32 are repeatedly executed, and the count value of the rotation speed counter is incremented by 1 while the rotary head 40 is rotated by 45 °. Since the target component does not exist in the image pickup region Ra by the camera 152, the pattern N is not irradiated by the projectors 150 and 151, and the image is not captured by the camera 152, so that the three-dimensional shape is acquired. There is no such thing. When the determination in S32 is NO, it is determined in S33 whether or not the number of rotations exceeds 7. If the determination in S33 is NO, S3 to 5 are executed, and the three-dimensional shape is acquired for the parts existing in the common region Rc. When the rotation angle of the rotary head 40 is 270 °, the component 30 ₍₃₎ is located in the common area Rc, so that the three-dimensional shape of the component 30 ₍₃₎ is acquired and the rotation angle of the rotary head 40 is changed. When it is 315 °, the three-dimensional shapes of the parts 30 ₍₃₎ and 36 ₍₂₎ are acquired. After that, if the determination in S33 becomes YES, the flatness is acquired in S13. It is possible to obtain the three-dimensional shape in the same manner by moving the rotary head 40 to the second relative position after the determination of S33 becomes YES, but it is indispensable to do so. is not.

As described above, when the target component for flatness acquisition is held by the suction nozzles 80 located at positions adjacent to each other in the rotary head 40, the time required for flatness acquisition can be shortened.

In the mounting system configured as described above, the part that stores the flatness acquisition program represented by the flowcharts of FIGS. 7 and 9 of the control device 10, the part that acquires the three-dimensional shape of the three-dimensional shape acquisition unit 154, and the like are used. The flatness acquisition unit is configured, the first head horizontal movement control unit is configured by the part that stores S2 of the control device 10, the part that executes it, etc., and the second head horizontal movement is composed of the part that stores S8, the part that executes it, and the like. The control unit is configured. Further, the head movement control unit is composed of the first head horizontal movement control unit, the second head horizontal movement control unit, the portion for storing S4 and S10, the portion for executing, and the like. Further, the image pickup control unit is configured by a portion for storing S3 and S9, a portion for executing S3, and the like. On the other hand, the work control device is configured by the host PC 6, and the optimization work control unit is configured by the part that stores the optimization program shown in the flowchart of FIG. 8 of the host PC 6, the part that executes the optimization program, and the like. The allocation determination unit is composed of a part for storing 24, a part for executing 24, and the like.

In the above embodiment, the case where a part of the parts held by the rotary head 40 is not included in the common area Rc has been described, but all eight parts held by the rotary head 40 are all in the common area Rc. It can be executed in the same way when it is located inside. By allowing the rotary head 40 to acquire the three-dimensional shape while being rotated around the head center axis Lh, the flatness of each of the eight parts can be acquired more accurately. Further, the flatness of eight parts can be efficiently acquired as compared with the case where each of the suction nozzles 80 is rotated around the nozzle center axis Ln and the three-dimensional shape is acquired.

Further, in this embodiment, the case where the flatness is obtained based on a plurality of three-dimensional shapes when the pattern N is irradiated from different angles to each of the plurality of parts has been described. It is not indispensable to acquire it, and the optimum three-dimensional shape can be acquired as flatness. Further, in the image pickup unit 18, it is not essential that the three-dimensional shape is acquired, and the heights of the points at the tips of the plurality of solder balls 28 of the target portion of the component from the image pickup element of each camera 152 and the plurality of leads. The height and the like of the predetermined points of the wire 34 from each image sensor can be acquired. Based on these heights, the flatness of the virtual planes Pa and Pb can be obtained.

Further, the host computer 6 is not indispensable, and the optimization program can be executed in the control device 10 of the mounting machine 4.

Further, the rotation is not limited to the rotation around the head center axis Lh of the rotary head 40, but the suction nozzle 80 can be rotated around the nozzle center axis Ln so that the three-dimensional shape of the component can be acquired. The present invention can be carried out in various modifications based on the knowledge of those skilled in the art.

2: Mounting system 4: Mounting machine 6: Host PC 10: Control device 18: Imaging unit 40: Rotary head 42: Head moving device 44: Head horizontal moving device 46: Head rotating device 80: Suction nozzle 150, 151: Projector 152 : Camera 154: Three-dimensional shape acquisition unit

Claims (8)

It is a mounting machine that includes a rotary head provided with a plurality of component holders provided at intervals, and mounts the plurality of components held by the plurality of component holders provided on the rotary head on a circuit board. hand,
The mounting machine includes an image pickup unit including a projector that irradiates a pattern on a predetermined irradiation area and an image pickup device that acquires an image of a predetermined image pickup area, and the plurality of component holders of the rotary head. Of the plurality of components held in each, the flatness of two or more components located in the common region where the irradiation region and the imaging region overlap is determined by the flatness of the two or more components obtained in the imaging unit. Flatness acquisition unit to be acquired based on the captured image of
A head moving device for moving the rotary head and
A head movement control unit for moving the rotary head by controlling the head movement device is included.
The flatness acquisition unit includes an image pickup control unit that causes the image pickup device to image the two or more components in a state where the rotary head is moved relative to the image pickup unit by the head movement control unit.
The head moving device includes a head rotating device that rotates the rotary head around the head center axis.
The image pickup device is provided with the image pickup control unit in a state where the rotary head is rotated around the head center axis at a predetermined relative position between the rotary head and the image pickup unit by the head movement control unit. It is intended to image the two or more components.
A mounting machine in which the set rotation angle, which is the rotation angle of the rotary head once, is smaller than the set center angle range that defines the common area . The head moving device includes a head horizontal moving device that moves the rotary head in the horizontal direction.
By controlling the head horizontal movement device, the head movement control unit places the rotary head in the common area of the image pickup unit, and the rotary head among the plurality of component holders is predetermined. The implementation according to claim 1 , further comprising a first head horizontal movement control unit for moving two or more parts held by the two or more parts holders located in the first region to a first relative position where the two or more parts are located. Machine. The head movement control unit controls the head horizontal movement device to move the rotary head into the common area of the image pickup unit, which is different from the first area of the plurality of component holders. The implementation according to claim 2 , further comprising a second head horizontal movement control unit for moving two or more parts held by the two or more parts holders located in the second region to a second relative position where the two or more parts are located. Machine. The component includes a component body and a plurality of electrode portions provided on the component body.
Claims 1 to 3 wherein the flatness acquisition unit acquires the flatness of a virtual plane formed by a set of predetermined points of the plurality of electrode portions of the component based on the captured image. The mounting machine described in any one. Two or more target parts to be acquired by the flatness acquisition unit are held by two or more component holders adjacent to each other among the plurality of component holders of the rotary head. The mounting machine according to any one of claims 1 to 4 . One of claims 1 to 5 , wherein the mounting machine includes a substrate transport support device that transports and supports the circuit board, and a component supply device that supplies a plurality of the components in a state in which they can be delivered to the rotary head. The mounting machine described in one. A mounting system including one or more mounting machines according to any one of claims 1 to 6 and a work control device for controlling work in each of the one or more mounting machines.
The work control device provides an optimization work control unit that optimizes the work of the one or more mounting machines based on the component information which is information about a plurality of parts for which work is performed on the one or more mounting machines. Including,
The component information includes information on two or more of the plurality of components, which are the target components for which the flatness acquisition unit obtains the flatness.
A mounting system in which the optimized work control unit includes an allocation unit that allocates the plurality of component holders provided on the rotary head and a plurality of components including the two or more target components. The mounting system according to claim 7 , wherein the allocation unit allocates the two or more target parts to the plurality of component holders of the rotary head adjacent to each other.

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