WO2022059055A1

WO2022059055A1 - Bump position data generation device

Info

Publication number: WO2022059055A1
Application number: PCT/JP2020/034832
Authority: WO
Inventors: 幹也鈴木; 勇太横井
Original assignee: 株式会社Fuji
Priority date: 2020-09-15
Filing date: 2020-09-15
Publication date: 2022-03-24
Also published as: JP7423809B2; JPWO2022059055A1

Abstract

This bump position data generation device comprises: an imaging unit that captures images of a plurality of bumps arranged on a component and acquires image data; an image processing unit that implements image processing on the image data and extracts a plurality of image bumps, which are images of each of the bumps included in the image data; a group formation unit that, within the image data, forms a bump group from the image bumps exhibiting a prescribed regular image position relationship that permits positional error; and a data generation unit that, on the basis of the positions of the plurality of image bumps belonging to the one bump group and the regular image position relationship, generates bump position data in which is estimated a reference position relationship for design of the plurality of bumps arranged on the component.

Description

Bump position data generator

The present specification relates to an apparatus that generates bump position data representing the positional relationship of a plurality of bumps arranged on a component.

The technology of mass-producing board products by mounting parts on a board with printed wiring is widespread. As an example of various types of components to be mounted, there is a bump component having a plurality of regularly arranged bumps (electrodes). Bump parts are also called BGA (Ball Grid Array) or CSP (Chip Size Package). It is important to acquire data representing the regular positional relationship of the bumps in advance in order to capture the bump component in the mounting operation and detect the actual position of the bumps by image processing. Patent Document 1 discloses a technical example of acquiring data regarding the position of a bump.

The component data generation device of Patent Document 1 converts the captured image into data, the means for converting the captured image into an image of a reference angle to set the measurement area, and the specifications of the electrodes in the measurement area. Means and. Further, according to the description of the embodiment, the image recognition device sequentially reads out from the left side for each pixel along one line of image data, detects the change position of the density, and repeats this for a plurality of lines to obtain a ball electrode. We are looking for the edge of (bump). According to this, even an electronic component having a complicated electrode arrangement can surely create component data.

Japanese Unexamined Patent Publication No. 2005-123352

By the way, design data showing the reference positional relationship of a plurality of bumps of a bump component is often disclosed by the manufacturer of the bump component. However, a sample bump component may be provided in place of the design data to the manufacturer of the board product. In this case, as illustrated in Patent Document 1, the manufacturer can generate bump position data in place of the design data by taking an image of the sample product and performing image processing. In addition, it is conceivable to preferentially use the bump position data generated by the manufacturer over the design data according to the characteristics of the component mounting machine owned by the manufacturer.

However, the bump position data generated from the sample product includes the error included in the sample product. This error is smaller than the tolerance specified in the standard or product specifications, but it may be close to the limit of the tolerance. For example, even if the three bumps are arranged in a straight line in the design data, the three bumps that actually exist on the sample product may deviate from the straight line arrangement due to an error, and the bump position data also deviates from the straight line arrangement. .. When such bump position data is applied to bump parts other than the sample product, the position error of the bump located in the opposite direction of the tolerance (having an error of different sign) exceeds the tolerance compared to the sample product, and an image processing error occurs. And there is a risk of mounting position error.

Therefore, the present specification describes a bump position data generation device capable of generating bump position data with high practical accuracy in a device of a method of capturing a plurality of bumps arranged on a component and generating bump position data. Providing is an issue to be solved.

The present specification is an image pickup unit that captures a plurality of bumps arranged on a component to acquire image data, and an image of each of the bumps included in the image data by subjecting the image data to image processing. An image processing unit that extracts a plurality of image bumps, a group forming unit that forms a bump group by the image bumps having a predetermined regular image positional relationship that allows a position error in the image data, and one of the above. Based on the positions of the plurality of image bumps belonging to the bump group and the regular image positional relationship, the bump position data that estimates the design reference positional relationship of the plurality of the bumps arranged in the component is generated. A data generation unit and a bump position data generation device including the data generation unit are disclosed.

In the bump position data generation device disclosed in the present specification, a bump group is formed by image bumps having a regular image positional relationship in the image data, and a plurality of image bumps belonging to one bump group are used. Generate bump position data that estimates the reference position relationship of the bump design. According to this, it is possible to estimate the design reference positional relationship so as to eliminate or cancel the positional error of a plurality of image bumps, and to improve the practical accuracy of the bump position data as compared with the conventional case. Further, since the bump position data having high practical accuracy can be applied in the image processing at the time of mounting the component, it is possible to suppress an image processing error and a mounting position error.

It is a bottom view which shows an example of the part which a plurality of bumps are arranged regularly. It is a functional block diagram of the bump position data generation apparatus of embodiment. It is a figure which showed the example of the image data of the component acquired by the image pickup of the image pickup part. It is a figure of the main operation flow explaining the operation of the bump position data generation apparatus. It is a figure of the sub operation flow explaining the detailed operation about the formation of the bump group of step S3 in the main operation flow of FIG. It is a partial diagram of image data which schematically shows the predetermined width set in step S12 of a sub operation flow. It is a partial view of image data which shows typically the image bump mutually recognized in step S14 of a sub operation flow. It is a partial view of image data which shows typically the image bump which was not recognized mutually. It is a partial diagram of image data which schematically explains the function of a data generation part. It is a partial view of image data which shows typically the predetermined angle set in step S12 of a sub operation flow. It is a partial diagram of image data explaining an application form in which an and condition of a predetermined width and a predetermined angle is set in step S12 of a sub-operation flow. It is a figure of the sub-operation flow of the modified form which the function of a group forming part is different. It is the second example of the component which a plurality of bumps are arranged regularly, and is the bottom view which shows the 2nd example of a component which forms two bump groups which are arranged intricately with each other. It is a bottom view which shows the 3rd example of the part which is the 3rd example of the component which a plurality of bumps are regularly arranged, and the 3rd example of a component which forms two bump groups which are arranged apart from each other.

1. 1. Example of Parts Prior to the description of the bump position data generation device 1 of the embodiment, an example of a part 71 (bump part) in which a plurality of bumps 72 are regularly arranged will be described with reference to FIG. The component 71 has a substantially rectangular parallelepiped outer shape, and has a dark color with low brightness or an appearance color close to black. A plurality of bumps 72 are regularly arranged on the bottom surface of the component 71. The shape of the bump 72 is a hemispherical shape that swells downward or a circle, and is not limited to this, and may be another shape such as a square or a rectangle. The bump 72 is an electrode soldered onto the land of the printed circuit board and has high brightness.

In FIG. 1, the nine bumps 72 are arranged in a regular 3 × 3 grid arrangement. The design data of the component 71 shows design specifications such as the shape, size, and reference positional relationship representing the arrangement pitch of the bump 72. Although the design data does not include an error, the bump 72 of the actual component 71 contains an error, so that the size and the arrangement pitch may vary. The bump position data generation device 1 takes an image of a plurality of bumps 72 arranged on the component 71, processes the acquired image data, and finally estimates the design reference position relationship of the plurality of bumps 72. Generate position data.

2. 2. Configuration of Bump Position Data Generation Device 1 The description of the bump position data generation device 1 will be given. Although the bump position data generation device 1 is separate from the component mounting machine that mounts the component 71, it can also be integrated into the component mounting machine. As shown in FIG. 2, the bump position data generation device 1 is composed of an image pickup unit 2 and a control unit 3.

The image pickup unit 2 captures a plurality of bumps 72 arranged on the component 71 to acquire image data GD. The image data GD is digitized numerical information and can be displayed as an image as shown in FIG. The image pickup unit 2 may take an image of the component 71 placed on the transparent glass from below, or may take an image of the component 71 with the bottom surface facing up from above. In the image data GD shown in FIG. 3, the image of the outer shape of the component 71 is shown in black, and the image of the bump 72 is shown in white. In order to simplify the following description, the image of the component 71 in the image data GD is referred to as an image component 81, and the image of the bump 72 in the image data GD is referred to as an image bump 82. Further, the positional relationship between the members in the image data GD is referred to as an image positional relationship.

It is essential that the image data GD includes the image bumps 82 of all the bumps 72. Further, the image data GD preferably includes an image component 81 representing the entire outer shape of the component 71, but is not essential. For the large component 71, it is permissible to connect a plurality of image data obtained by a plurality of imagings to obtain a predetermined image data GD. The image data GD may be a black-and-white image or a color image as long as the outer shape of the image bump 82 can be detected by the difference in brightness in the image processing. The acquired image data GD is transferred to the control unit 3.

The control unit 3 is configured by using a computer device. The control unit 3 includes three functional units realized by software, that is, an image processing unit 4, a group forming unit 5, and a data generation unit 6. The image processing unit 4 performs image processing on the image data GD received from the image pickup unit 2 to extract a plurality of image bumps 82 which are images of the bumps 72 included in the image data GD. "Extracting" includes detecting the outer shape of the image bump 82 and obtaining the size of the image bump 82 and the position of the center point. A known boundary detection method, region detection method, or the like can be applied to this image processing.

The group forming unit 5 forms a bump group with image bumps 82 having a predetermined regular image positional relationship that allows a position error in the image data GD. The regular image positional relationship is an image positional relationship of a lattice arrangement arranged in the image data GD separated in the first direction of the component 71 and the second direction orthogonal to the first direction while including the position error. Further, the group forming unit 5 requires that the image bumps 82 have the same size within the margin of error, which is a necessary condition for one bump group. That is, the group forming unit 5 sets two image bumps 82 having a size difference exceeding the permissible error as separate bump groups.

The data generation unit 6 is a design reference position of the plurality of bumps 72 arranged in the component 71 based on the positions of the center points of the plurality of image bumps 82 belonging to one bump group and the regular image positional relationship. Generate bump position data with estimated relationships. Specifically, the data generation unit 6 generates bump position data in which the arrangement pitch of the lattice arrangement is constant. The functions of the group forming unit 5 and the data generating unit 6 will be described in detail in the following description of the operation.

3. 3. Operation of Bump Position Data Generation Device 1 Next, the operation of the bump position data generation device 1 will be described with reference to FIGS. 4 to 11. In step S1 of the main operation flow of FIG. 4, the image pickup unit 2 takes an image of a plurality of bumps 72 arranged in the component 71, and acquires, for example, the image data GD shown in FIG. In the next step S2, the image processing unit 4 performs image processing of the image data GD to obtain the sizes of the plurality of image bumps 82 and the positions of the center points.

In the next step S3, the group forming unit 5 performs a recognition process for recognizing another image bump 82 that is separated from each other in the first direction and the second direction while including a position error with respect to a certain image bump 82. Further, the group forming unit 5 performs recognition processing on the basis of all the image bumps 82 in order, and forms a bump group by the combination of the mutually recognized image bumps 82. Details of step S3 are shown in the sub-operation flow of FIG.

In step S11 of FIG. 5, the group forming unit 5 determines the orthogonal first direction and the second direction. The first direction and the second direction are directions in which the arrangement direction of the lattice arrangement of the plurality of image bumps 82 is estimated. The first direction and the second direction are two horizontal directions along the bottom surface of the component 71. Specifically, the group forming unit 5 obtains the smallest rectangular RC including all the image bumps 82 in the image data GD, as shown by the white broken line in FIG. Then, the group forming portion 5 sets the directions of two adjacent sides of the rectangular RC as the first direction and the second direction.

According to this, even if the arrangement direction of the bumps 72 has an error with respect to the vertical and horizontal directions of the component 71, or even if the bumps 72 are arranged diagonally, the group forming unit 5 accurately arranges the arrangement direction of the lattice arrangement. Can be estimated to. As a simple method, the group forming portion 5 may have the directions of two adjacent sides of the rectangular image component 81 as the first direction and the second direction.

In the next step S12, the group forming unit 5 sets a predetermined width W (see FIG. 6). The predetermined width W corresponds to the position error allowed for the bump 72, in other words, corresponds to the position error allowed for the image bump 82 in the image data GD. Practically, the predetermined width W is initially set based on the size of the reference image bump 82.

According to this, an appropriate predetermined width W can be set based on the actual position error of the bump 72. For example, when it is known from past results that the position error of the bump 72 is about ± 20% of the diameter, 50% (= 20% ×) of the diameter of the image bump 82 is taken into consideration with a margin of 10%. 2 + 10%) can be a predetermined width W.

Alternatively, the predetermined width W may be set based on the tolerance allowed for the position error of the bump 72. According to this, the predetermined width W becomes a larger value than the case where it is set based on the past actual results. In other words, the predetermined width W allows a position error close to the tolerance specified in the standard, product specifications, or the like. In the method of setting the predetermined angle A, which will be described later, the allowable position error becomes large when the arrangement pitch of the image bumps 82 is large, but in the method of setting the predetermined width W, the allowable position error is large. It is preferable that the pitch is constant regardless of the magnitude of the arrangement pitch.

In the next step S13, the group forming unit 5 first sets the reference image bump 821. Since the iterative loop composed of step S13, step S14, and step S15 is executed for all the image bumps 82, the order of the image bumps 82 to be set is not important. By executing step S13, as shown in FIG. 6, a band-shaped recognition area having a predetermined width W extending in a “+” shape in the first direction and the second direction is set with reference to the center point C1 of the image bump 821. Will be done.

In the next step S14, the group forming unit 5 performs a recognition process for recognizing the center point of another image bump 82 that is spaced apart from each other in the first direction and the second direction. In the example shown in FIG. 7, another image bump 822 is located on the right side of the image bump 821 in the first direction. The size of the image bump 822 is equal to that of the image bump 821 within the margin of error. Therefore, the image bump 822 is a candidate for forming a bump group one with the image bump 821. If the size of the image bump 822 exceeds the margin of error and differs from the image bump 821, the recognition process is terminated. In this case, the group forming unit 5 determines that the image bump 822 could not be recognized from the image bump 821.

Further, as shown in FIG. 7, the center point C2 of the image bump 822 is recognized in the recognition area on the right side in the first direction of the image bump 821. Further, in the recognition area on the left side in the first direction of the image bump 821, the center point C3 of another image bump 823 whose size is within the tolerance is recognized. In this case, the group forming unit 5 determines that the image bump 822 and the image bump 823 can be recognized from the image bump 821.

Further, although omitted in FIG. 7, the center point of another image bump 82 may be recognized in the recognition area extending in the second direction of the image bump 821. On the other hand, as shown in FIG. 8, the center point C4 of another image bump 824 may be out of the recognition area. In this case, the group forming unit 5 determines that the image bump 824 could not be recognized from the image bump 821.

In the next step S15, the group forming unit 5 determines whether or not the recognition process based on all the image bumps 82 is completed. If no, the execution of the operation flow is returned to step S13. In the second step S13, another image bump 82 is set as a reference, and step S14 is executed. In the image data GD shown in FIG. 3, the iterative loop is executed 9 times corresponding to the 9 image bumps 82.

In the repetition, the image bump 822 may be the reference. In this case, the group forming unit 5 can determine that the image bump 821 can be recognized from the image bump 822. Further, the image bump 823 may be used as a reference. In this case, the group forming unit 5 can determine that the image bump 821 can be recognized from the image bump 823.

If the recognition process based on all the image bumps 82 is completed in step S15, the execution of the operation flow proceeds to step S16. In step S16, the group forming unit 5 forms a bump group by the combination of the mutually recognized image bumps 82. In the example shown in FIG. 7, the image bump 821 and the image bump 822 are mutually recognized, and the image bump 821 and the image bump 823 are mutually recognized. Therefore, the image bumps 821, the image bumps 822, and the image bumps 823 form one bump group.

Furthermore, not only the recognition process in the first direction but also the recognition process in the second direction omitted in the figure is performed. As a result, the nine image bumps 82 shown in FIG. 3 form one bump group. In the example shown in FIG. 8, a plurality of bump groups are formed. After that, the execution of the operation flow proceeds to step S4 of the main operation flow of FIG.

In step S4, the data generation unit 6 generates bump position data in which the arrangement pitch of the lattice arrangement is constant. Here, making the array pitch constant corresponds to estimating the design reference positional relationship so as to eliminate or cancel the positional error of the plurality of image bumps 82. The data generation unit 6 corrects so that the center points C1, C2, and C3 of the three

image bumps

821, 822, and 823 arranged apart from each other in the first direction are arranged in a straight line, for example, as shown by the broken line in FIG. do. Further, the data generation unit 6 corrects the distance between the center points C1 and the center point C2 (arrangement pitch) so as to match the distance between the center points C1 and the center point C3 (arrangement pitch).

The above correction is performed on the nine image bumps 82 in the first direction and the second direction. In the finally obtained bump position data, the center points of the nine image bumps 82 are arranged in 3 × 3 in the first direction and the second direction, and a total of 12 arrangement pitches in the first direction and the second direction are arranged. Are all equal data. The bump position data may further include an average value of the sizes of the plurality of image bumps 82, in other words, data of an average diameter. The bump position data may be edited into the component data in combination with other data regarding the shape of the component 71, or may be used alone.

The bump position data generation device 1 can create a template to be used in the component mounting work based on the bump position data. The template contains, for example, data on the constant arrangement pitch and average diameter of the plurality of image bumps 82 and does not include data on the shape of the image component 81. Here, since the bump position data is data with high practical accuracy that estimates the design reference position relationship of the plurality of bumps 72, the template does not include the position error and the diameter error of each of the image bumps 82. Has high accuracy. If a template is created as it is from the image bumps 821, 822, and 823 shown in FIG. 7, the template has low accuracy including the position error and the diameter error of the bump 72 in the specific component 71.

In the parts mounting work of the parts mounting machine, the bottom surface of the parts 71 collected by the parts collecting tool of the mounting head is imaged and image data is acquired. Image processing using a template having high accuracy is performed on this image data, and the position of the bump 72 with respect to the mounting head is accurately obtained. Therefore, image processing errors and mounting position errors are suppressed.

Note that, in step S12, the group forming unit 5 may set a predetermined angle A. The predetermined angle A corresponds to the position error allowed for the image bump 82 in the image data GD. As a result, as shown in FIG. 10, a recognition area that expands in a fan shape in the first direction and the second direction is set with reference to the center point C5 of the image bump 825.

Further, in the application mode shown in FIG. 11, the group forming unit 5 may set both a predetermined width W and a predetermined angle A. In the application form, the area within the predetermined width W and within the predetermined angle A is the recognition area (hatched area) with reference to the center point C6 of the image bump 826. After setting the predetermined angle A or both the predetermined width W and the predetermined angle A in step S12, the group forming unit 5 performs steps S13 to S16 in the same manner as described above, except that the shape of the recognition area is different. Execute.

In the bump position data generation device 1 of the embodiment, a bump group is formed by image bumps (82, 821, 822, 823) having a regular image positional relationship in the image data GD, and a plurality of bump groups belonging to one bump group are formed. Based on the image bumps (82, 821, 822, 823), the bump position data in which the design reference positional relationship of the plurality of bumps 72 is estimated is generated. According to this, the reference positional relationship in the design is estimated so as to eliminate or cancel the positional error of a plurality of image bumps (82, 821, 822, 823), and the practical accuracy of the bump position data is improved as compared with the conventional case. be able to. Further, since the bump position data having high practical accuracy can be applied in the image processing at the time of mounting the component 71, it is possible to suppress an image processing error and a mounting position error.

4. Deformation form in which the function of the group forming portion 5 is different Next, a deformation form in which the function of the group forming portion 5 is different will be described with reference to FIG. In the modified form, the group forming unit 5 performs a recognition process for recognizing another image bump 82 that is separated from each other in the first direction and the second direction while including a position error with respect to a certain image bump 82. When the image bump 82 is recognized, another image bump 82 is incorporated into a bump group including a certain image bump 82. The group forming unit 5 further repeats the recognition process and the transfer process with the plurality of image bumps 82 as a reference in order. Details of this operation are shown in the sub-operation flow of FIG.

Steps S11 to S13 of FIG. 12 are the same as the description of the embodiment (see FIG. 5). Hereinafter, in step S13, the case where the group forming unit 5 first sets the reference image bump 823 (see FIG. 7) will be described. In this case, the group forming unit 5 sets the first bump group including the image bump 823.

In the next step S21, the group forming portions 5 are arranged apart from each other in the recognition areas of the first direction and the second direction of the image bump 823, and the center point of another image bump 82 whose size is within the tolerance. Performs recognition processing to recognize. In the example shown in FIG. 7, the group forming unit 5 can recognize the center point C1 of another image bump 821 in the recognition area on the right side in the first direction of the image bump 823.

In the next step S22, it is determined whether or not another image bump 82 has been recognized. If there is, in step S23, the group forming unit 5 incorporates the recognized image bump 821 into the first bump group. Further, when the group forming unit 5 recognizes the center point of another image bump 82 in the second direction, the group forming unit 5 incorporates another image bump 82 in the second direction into the first bump group.

In the next step S24, the group forming unit 5 determines whether or not the recognition process based on all the image bumps 82 is completed. If no, the execution of the operation flow is returned to step S13. In the second step S13, the image bump 821 incorporated into the first bump group is set as a new reference, and step S21 is executed.

In the second step S21, the group forming unit 5 can recognize the center point C2 of another image bump 822 in the recognition area on the right side in the first direction of the image bump 821. Therefore, in the second step S23 via step S22, the group forming unit 5 incorporates the recognized image bump 822 into the first bump group. In this way, the group forming portion 5 can increase the image bumps 82 in a so-called potato-like manner to form the first bump group. In the image data GD shown in FIG. 3, the nine image bumps 82 are finally incorporated into the first bump group.

If another image bump 82 is not recognized in step S22, the operation flow proceeds to step S24. In step S24, the group forming unit 5 determines whether or not the recognition process based on all the image bumps 82 is completed. If it has ended, it means that all the image bumps 82 have been incorporated into the first bump group, and the sub operation flow ends.

If it has not been completed, there is an image bump 82 that is not incorporated into the first bump group. In this case, the group forming unit 5 sets a second bump group including the image bump 82 that is not incorporated into the first bump group, and returns the execution of the operation flow to step S13. Then, the group forming unit 5 performs the recognition process of step S21 and the transfer process of step S23 with the image bump 82 not incorporated into the first bump group as a new reference. Further, the group forming unit 5 can form the final second bump group by changing the reference and repeating the recognition process and the transfer process.

In the modified form, the process of forming the bump group is different from that of the embodiment, but the formed bump group and the generated bump position data are the same as those of the embodiment. Therefore, as in the embodiment, the practical accuracy of the bump position data can be improved as compared with the conventional case, and further, the image processing error and the mounting position error during the mounting work of the component 71 can be suppressed.

5. Example of Another Part Next, an example of another part (bump part) to which this embodiment can be applied will be described with reference to FIGS. 13 and 14. First, the arrangement of the bumps 72 may be different in number in the first direction and the second direction, and may be arranged in a 3 × 4 lattice arrangement, for example. Next, in the component 73 of the second example shown in FIG. 13, a total of 13 bumps (74, 75) are staggered on the bottom surface thereof. The nine bumps 74 shown in a circle have a regular 3 × 3 grid arrangement. On the other hand, the remaining four bumps 75, which are shown as circles with hatches, are located in the middle of the nine bumps 74 in the diagonal direction, and have a regular 2 × 2 grid arrangement.

In the image data obtained by imaging the component 73, the group forming unit 5 can determine the first direction and the second direction by finding the smallest rectangle containing 13 bumps (74, 75). Here, the bump 75 is not located in the first direction or the second direction when viewed from the bump 74, but is located in a direction approximately at an angle of 45 °. Therefore, the group forming portion 5 forms the first bump group by the image bumps of the nine bumps 74, and forms the second bump group by the image bumps of the four bumps 75.

Further, the data generation unit 6 generates bump position data for each of the first bump group and the second bump group, which are arranged intricately with each other. Further, the data generation unit 6 generates data representing the mutual positional relationship between the two sets of bump position data. In the case of the component 73 shown in FIG. 13, the mutual positional relationship data that the centers of the two sets of bump position data coincide with each other is generated.

Next, in the component 76 of the third example shown in FIG. 14, six bumps 77 for input are arranged on the left side of the bottom surface, and four bumps 78 for output are arranged on the right side of the bottom surface. .. The six bumps 77 have a regular 2x3 grid arrangement and the four bumps 78 have a regular 2x2 grid arrangement. The bump 77 is much larger than the bump 78.

In the image data obtained by imaging the component 76, the group forming unit 5 can determine the first direction and the second direction by finding the smallest rectangle containing a total of 10 bumps (77, 78). .. Here, since the image bump of the bump 77 and the image bump of the bump 78 have a size difference exceeding the permissible error, they are automatically formed into separate bump groups. Therefore, the group forming portion 5 forms the first bump group by the image bumps of the six bumps 77, and forms the second bump group by the image bumps of the four bumps 78.

Further, the data generation unit 6 generates bump position data for each of the first bump group and the second bump group, which are arranged apart from each other. Further, the data generation unit 6 generates data representing the mutual positional relationship between the two sets of bump position data. In the case of the component 76 shown in FIG. 14, data on the separation distance at which the centers of the two sets of bump position data are separated in the first direction is generated.

With respect to the parts (73, 76) exemplified in FIGS. 13 and 14, the bump position data generation device 1 of the embodiment and the modified form operates in the same manner as the part 71 exemplified in FIG. 1, and has the same operation. And the effect occurs. Further, the bump position data generation device 1 can be applied to, for example, a component in which a plurality of electrodes are arranged on two opposite sides of the bottom surface of a quadrangle, in addition to the illustrated components (71, 73, 76).

6. Applications and Modifications of the Embodiment When the shape of the bump (72, 74, 75, 77, 78) is rectangular, the predetermined width W is constant to the long side, the short side, or the diagonal length of the rectangle. It can be set by multiplying the ratio. Further, when the design arrangement pitches of the bumps (72, 74, 75, 77, 78) are different between the first direction and the second direction, the data generation unit 6 performs each of the first direction and the second direction. Generate bump position data with uniform arrangement pitch. Further, it is not essential to create a template from the bump position data, and the bump position data can be applied to image processing at the time of mounting work by various methods. The embodiments and modifications can be applied and modified in various other ways.

1: Bump position data generation device 2: Imaging unit 3: Control unit 4: Image processing unit 5: Group forming unit 6: Data generation unit 71: Parts 72: Bump 73: Parts 74: Bump 75: Bump 76: Parts 77: Bump 78: Bump 81: Image parts 82, 821-826: Image bump GD: Image data RC: Rectangle W: Predetermined width A: Predetermined angle C1 to C6: Center point

Claims

An image pickup unit that captures multiple bumps arranged on a component and acquires image data,
An image processing unit that performs image processing on the image data and extracts a plurality of image bumps that are images of the bumps included in the image data.
In the image data, a group forming portion that forms a bump group by the image bumps having a predetermined regular image positional relationship that allows a position error, and a group forming portion.
Bump position data that estimates the design reference positional relationship of the plurality of the bumps arranged in the component based on the positions of the plurality of image bumps belonging to the one bump group and the regular image positional relationship. And the data generator that generates
A bump position data generator comprising.
The regular image positional relationship is the image positional relationship of a lattice arrangement that is separated from the first direction of the component and the second direction orthogonal to the first direction while including the positional error in the image data. The bump position data generation device according to claim 1.
The bump position data generation device according to claim 2, wherein the data generation unit generates the bump position data in which the arrangement pitch of the lattice arrangement is constant.
The group forming unit performs recognition processing for recognizing another image bump that is separated from the first direction and the second direction while including the position error with respect to the image bump, and all of them. The bump position data generation device according to claim 2 or 3, wherein the recognition process is sequentially performed with reference to the image bumps of the above, and the bump group is formed by a combination of the image bumps recognized with each other.
The group forming unit performs a recognition process for recognizing another image bump that is separated from the first direction and the second direction while including the position error with the image bump as a reference, and another image bump is recognized. When an image bump is recognized, another image bump is incorporated into the bump group including the image bump, and further, the recognition process and the recognition process are performed with the plurality of image bumps in order as a reference. The bump position data generation device according to claim 2 or 3, which repeats the transfer process.
The image processing unit obtains a center point for each of the image bumps, and obtains a center point.
The group forming portion refers to the center point of the image bump, and is separated from the first direction and the second direction while including the position error within a predetermined width. The bump position data generation device according to claim 4 or 5, which performs the recognition process for recognizing a center point.
The image processing unit obtains a center point for each of the image bumps, and obtains a center point.
The group forming portion refers to the center point of the image bump, and is separated from the first direction and the second direction while including the position error within a predetermined angle. The bump position data generation device according to claim 4 or 5, which performs the recognition process for recognizing a center point.
The image processing unit obtains a center point for each of the image bumps, and obtains a center point.
The group forming portion is another lined up in the first direction and the second direction with respect to the center point of the image bump, including the position error within a predetermined width and within a predetermined angle. The bump position data generation device according to claim 4 or 5, wherein the recognition process for recognizing the center point of the image bump is performed.
The bump position data generation device according to claim 6 or 8, wherein the predetermined width is initially set based on the size of the image bump as a reference.
The bump position data generation device according to claim 6 or 8, wherein the predetermined width is set based on a tolerance allowed for the position error of the bump.
The group forming unit obtains the smallest rectangle including all the image bumps in the image data, and the directions of two adjacent sides of the rectangle are the first direction and the second direction. The bump position data generation device according to any one of 2 to 10.
The group according to any one of claims 2 to 10, wherein the group forming portion has the directions of two adjacent sides of the rectangular image of the component in the image data as the first direction and the second direction. Bump position data generator.
The image processing unit obtains the size of each of the image bumps, and obtains the size.
The group forming portion forms the bump group by the image bumps having the same size within the margin of error.
The bump position data generation device according to any one of claims 1 to 12.