JP7423809B2 - Bump position data generation device - Google Patents

Description

The present specification relates to a device that generates bump position data representing the positional relationship of a plurality of bumps arranged on a part.

BACKGROUND ART A technology for mass-producing board products by carrying out a mounting operation in which components are mounted on a board on which printed wiring has been applied is becoming widespread. An example of various types of parts to be mounted is a bump part having a plurality of regularly arranged bumps (electrodes). Bump parts are also called BGA (Ball Grid Array) or CSP (Chip Size Package). Preliminary acquisition of data representing the regular positional relationship of the bumps is important in order to image the bump components during the installation work and detect the actual positions of the bumps through image processing. A technical example of acquiring data regarding the position of a bump is disclosed in Patent Document 1.

The component data generation device of Patent Document 1 includes means for imaging a component, means for converting the captured image into an image at a reference angle to set a measurement region, and converting specifications of electrodes in the measurement region into data. and means. Furthermore, according to the description of the embodiment, the image recognition device sequentially reads each pixel from the left side along one line of image data to detect the position of change in density, and repeats this for multiple lines to detect the ball electrode. I'm looking for the (bump) edge. According to this, it is said that component data can be reliably created even for electronic components with complicated electrode arrangements.

Japanese Patent Application Publication No. 2005-123352

Incidentally, design data representing a reference positional relationship between a plurality of bumps of a bump component is often made public by the manufacturer of the bump component. However, there are cases where manufacturers of board products are provided with sample bump parts instead of design data. In this case, the manufacturer can generate bump position data in place of design data by imaging a sample product and performing image processing, as exemplified in Patent Document 1. Furthermore, depending on the characteristics of the component mounting machine owned by the manufacturer, bump position data generated in-house may be used with priority over design data.

However, the bump position data generated from the sample product includes errors included in the sample product. This error is smaller than the tolerance specified in standards, product specifications, etc., but may be close to the tolerance limit. For example, even if three bumps are arranged in a straight line in the design data, the three bumps actually on the sample product may deviate from the linear arrangement due to errors, and the bump position data may also deviate from the linear arrangement. . If such bump position data is applied to a bump part other than a sample product, the position error of the bump located in the opposite direction of the tolerance (having an error of the opposite sign) compared to the sample product will exceed the tolerance, resulting in an image processing error. Otherwise, there is a risk of a mounting position error.

Therefore, the present specification provides a bump position data generation device that can generate bump position data with high practical accuracy in an apparatus that generates bump position data by imaging a plurality of bumps arranged on a component. The problem to be solved is to provide.

The present specification includes an imaging unit that captures images of a plurality of bumps arranged on a component to obtain image data, and an image capturing unit that performs image processing on the image data to obtain an image of each of the bumps included in the image data. an image processing unit that extracts a plurality of image bumps; a group forming unit that forms a bump group from the image bumps that have a predetermined regular image positional relationship that allows positional errors in the image data; Generating bump position data in which a design reference positional relationship of the plurality of bumps arranged on the part is estimated based on the positions of the plurality of image bumps belonging to a bump group and the regular image positional relationship. A bump position data generation device is disclosed, which includes a data generation section.

In the bump position data generation device disclosed in this specification, a bump group is formed by image bumps having a regular image positional relationship in image data, and a plurality of image bumps are generated based on a plurality of image bumps belonging to one bump group. Bump position data is generated by estimating the standard bump design positional relationship. According to this, it is possible to estimate the design reference positional relationship so as to eliminate or offset positional errors of a plurality of image bumps, and to improve the practical accuracy of bump position data compared to the conventional method. Furthermore, since bump position data with high practical accuracy can be applied to image processing during component mounting work, image processing errors and mounting position errors can be suppressed.

FIG. 3 is a bottom view showing an example of a component in which a plurality of bumps are regularly arranged. FIG. 2 is a functional block diagram of a bump position data generation device according to an embodiment. FIG. 3 is a diagram illustrating an example of image data of a component acquired by imaging by an imaging unit. FIG. 3 is a diagram of a main operation flow explaining the operation of the bump position data generation device. 4 is a sub-operation flow diagram illustrating detailed operations related to formation of bump groups in step S3 of the main operation flow of FIG. 3. FIG. 7 is a partial diagram of image data schematically showing the predetermined width set in step S12 of the sub-operation flow. FIG. FIG. 7 is a partial diagram of image data schematically showing image bumps mutually recognized in step S14 of the sub-operation flow. FIG. 6 is a partial diagram of image data schematically showing image bumps that are not mutually recognized. FIG. 3 is a partial diagram of image data schematically illustrating the function of a data generation section. FIG. 7 is a partial diagram of image data schematically showing a predetermined angle set in step S12 of the sub-operation flow. FIG. 7 is a partial diagram of image data illustrating an application mode in which an AND condition of a predetermined width and a predetermined angle is set in step S12 of the sub-operation flow. FIG. 7 is a diagram of a sub-operation flow of a modified form in which the group forming unit has a different function. FIG. 7 is a bottom view showing a second example of a component in which a plurality of bumps are regularly arranged, and in which two groups of bumps are arranged in an intricate manner. FIG. 7 is a bottom view showing a third example of a component in which a plurality of bumps are regularly arranged, and in which two groups of bumps are formed spaced apart from each other.

1. Exemplification of Components Prior to describing the bump position data generation device 1 of the embodiment, an example of a component 71 (bump component) in which a plurality of bumps 72 are regularly arranged will be described with reference to FIG. 1. The component 71 has a generally rectangular parallelepiped external shape, and has a dark color with low brightness or an appearance color close to black. The component 71 has a plurality of bumps 72 regularly arranged on its bottom surface. The shape of the bump 72 is a hemispherical shape that expands downward or a circular shape, but is not limited to this, and may be other shapes such as a square or a rectangle. The bump 72 is an electrode soldered onto the land of the printed circuit board and has high brightness.

In FIG. 1, nine bumps 72 are arranged in a regular 3×3 grid array. The design data of the component 71 shows design specifications such as the shape, size, and reference positional relationship representing the arrangement pitch of the bumps 72. Although the design data does not include errors, the bumps 72 of the actual component 71 include errors, so the size and arrangement pitch may vary. The bump position data generation device 1 images a plurality of bumps 72 arranged on a component 71, processes the acquired image data, and finally generates bumps that have estimated the design reference positional relationship of the plurality of bumps 72. Generate location data.

2. Configuration of Bump Position Data Generation Device 1 The bump position data generation device 1 will now be described. Although the bump position data generation device 1 is separate from the component mounting machine that performs the mounting work of the component 71, it can also be integrated into the component mounting machine. As shown in FIG. 2, the bump position data generation device 1 includes an imaging section 2 and a control section 3.

The imaging unit 2 images the plurality of bumps 72 arranged on the component 71 to obtain image data GD. The image data GD is digitized numerical information and can be displayed as an image as shown in FIG. The imaging unit 2 may image the component 71 placed on transparent glass from below, or may image the component 71 with the bottom facing upward from above. In the image data GD shown in FIG. 3, an image of the outer shape of the component 71 is shown in black, and an image of the bump 72 is shown in white. To simplify the following explanation, the image of the component 71 in the image data GD will be referred to as an image component 81, and the image of the bump 72 in the image data GD will be referred to as an image bump 82. Furthermore, the mutual positional relationship of members within the image data GD is referred to as an image positional relationship.

The image data GD must include the image bumps 82 of all the bumps 72. Further, it is preferable that the image data GD includes an image component 81 representing the entire outer shape of the component 71, but this is not essential. Regarding the large part 71, it is permissible to connect a plurality of image data obtained by imaging a plurality of times to form predetermined image data GD. The image data GD may be a black-and-white image or a color image as long as the outline of the image bump 82 can be detected by the difference in brightness in image processing. The acquired image data GD is transferred to the control section 3.

The control unit 3 is configured using a computer device. The control section 3 includes three functional sections realized by software, namely, an image processing section 4, a group formation section 5, and a data generation section 6. The image processing unit 4 performs image processing on the image data GD received from the image capturing unit 2, and extracts a plurality of image bumps 82, which are images of each of the bumps 72 included in the image data GD. "Extracting" includes detecting the outer shape of the image bump 82 and determining the size of the image bump 82 and the position of the center point. Known boundary detection methods, area detection methods, and the like can be applied to this image processing.

The group forming unit 5 forms a bump group using image bumps 82 having a predetermined regular image positional relationship that allows positional errors in the image data GD. The regular image positional relationship is an image positional relationship in which the parts 71 are spaced apart from each other in the first direction of the component 71 and the second direction perpendicular to the first direction, including positional errors in the image data GD. Furthermore, the group forming unit 5 makes it a necessary condition for one bump group that the image bumps 82 have the same size within a tolerance range. In other words, the group forming unit 5 forms two image bumps 82 whose sizes differ by more than an allowable error into separate bump groups.

The data generation unit 6 generates design reference positions of the plurality of bumps 72 arranged on the component 71 based on the position of the center point of the plurality of image bumps 82 belonging to one bump group and the regular image positional relationship. Generate bump position data with estimated relationships. Specifically, the data generation unit 6 generates bump position data in which the array pitch of the lattice array is made constant. The functions of the group forming section 5 and the data generating section 6 will be explained in detail in the following operation description.

3. Operation of Bump Position Data Generation Device 1 Next, the operation of the bump position data generation device 1 will be explained with reference to FIGS. 4 to 11. In step S1 of the main operation flow in FIG. 4, the imaging unit 2 images the plurality of bumps 72 arranged on the component 71 to obtain, for example, image data GD shown in FIG. 3. In the next step S2, the image processing unit 4 performs image processing on the image data GD to determine the size and center point position of the plurality of image bumps 82.

In the next step S3, the group forming unit 5 performs recognition processing to recognize other image bumps 82 spaced apart from each other in the first direction and the second direction, including a positional error, using a certain image bump 82 as a reference. The group forming unit 5 further performs a recognition process using all the image bumps 82 in order as a reference, and forms a bump group by combining mutually recognized image bumps 82. Details of step S3 are shown in the sub-operation flow of FIG.

In step S11 of FIG. 5, the group forming unit 5 determines a first direction and a second direction that are perpendicular to each other. The first direction and the second direction are directions in which the arrangement direction of the lattice arrangement of the plurality of image bumps 82 is estimated. The first direction and the second direction are two horizontal directions along the bottom surface of the component 71. Specifically, the group forming unit 5 finds the smallest rectangle RC that includes all the image bumps 82 in the image data GD, as shown by the white broken line in FIG. The group forming unit 5 then sets the directions of two adjacent sides of the rectangle RC as a first direction and a second direction.

According to this, even if there is an error in the arrangement direction of the bumps 72 with respect to the vertical and horizontal directions of the component 71, or even if the bumps 72 are arranged diagonally, the group forming section 5 can accurately adjust the arrangement direction of the lattice arrangement. It can be estimated that Note that as a simple method, the group forming unit 5 may set the directions of two adjacent sides of the rectangular image component 81 as the first direction and the second direction.

In the next step S12, the group forming section 5 sets a predetermined width W (see FIG. 6). The predetermined width W corresponds to the positional error allowed for the bump 72, in other words, it corresponds to the positional error allowed for the image bump 82 in the image data GD. Practically speaking, the predetermined width W is first set based on the size of the image bump 82 as a reference.

According to this, an appropriate predetermined width W can be set based on the actual positional error of the bump 72. For example, when it is known from past results that the positional error of the bump 72 is about ±20% of the diameter, considering a 10% margin, 50% of the diameter of the image bump 82 (= 20% × 2+10%) can be set as the predetermined width W.

Alternatively, the predetermined width W may be set based on the tolerance allowed for the positional error of the bump 72. According to this, the predetermined width W becomes a larger value than when it is set based on past results. In other words, the predetermined width W allows a positional error close to the tolerance specified in standards, product specifications, and the like. Note that in the method of setting the predetermined angle A, which will be described later, the allowable position error becomes large when the arrangement pitch of the image bumps 82 is large, but in the method of setting the predetermined width W, the allowable position error increases. This is preferable because it is constant regardless of the size of the arrangement pitch.

In the next step S13, the group forming unit 5 first sets an image bump 821 as a reference. The repeating loop consisting of step S13, step S14, and step S15 is executed for all image bumps 82, so the order of setting image bumps 82 is not important. By executing step S13, as shown in FIG. 6, a strip-shaped recognition area of a predetermined width W extending in the first direction and the second direction in the shape of a "+" is set with the center point C1 of the image bump 821 as a reference. be done.

In the next step S14, the group forming unit 5 performs recognition processing to recognize the center points of other image bumps 82 that are spaced apart from each other in the first direction and the second direction. In the example shown in FIG. 7, another image bump 822 is located to the right of the image bump 821 in the first direction. The size of image bump 822 is then equal to image bump 821 within tolerance. Therefore, the image bump 822 is a candidate for forming one bump group with the image bump 821. If the size of image bump 822 differs from image bump 821 by exceeding a tolerance, the recognition process is aborted. In this case, the group forming unit 5 determines that the image bump 822 could not be recognized from the image bump 821.

Furthermore, as shown in FIG. 7, the center point C2 of the image bump 822 is recognized within the recognition area on the right side of the image bump 821 in the first direction. Furthermore, within the recognition area on the left side of the image bump 821 in the first direction, a center point C3 of another image bump 823 whose size is within the tolerance is recognized. In this case, the group forming unit 5 determines that the image bump 822 and the image bump 823 can be recognized from the image bump 821.

Although not shown in FIG. 7, the center point of another image bump 82 may be recognized within the recognition area of the image bump 821 extending in the second direction. On the other hand, as shown in FIG. 8, the center point C4 of another image bump 824 may be out of the recognition area. In this case, the group forming unit 5 determines that the image bump 824 could not be recognized from the image bump 821.

In the next step S15, the group forming unit 5 determines whether the recognition process based on all image bumps 82 has been completed. If not, execution of the operation flow is returned to step S13. In the second step S13, another image bump 82 is set as a reference, and step S14 is executed. In the image data GD shown in FIG. 3, the repeat loop is executed nine times corresponding to nine image bumps 82.

During the repetition, the image bump 822 may become a reference. In this case, the group forming unit 5 can determine that the image bump 821 can be recognized from the image bump 822. Furthermore, there may be cases where the image bump 823 serves as a reference. In this case, the group forming unit 5 can determine that the image bump 821 has been recognized from the image bump 823.

If the recognition processing based on all image bumps 82 has been completed in step S15, execution of the operation flow proceeds to step S16. In step S16, the group forming unit 5 forms a bump group by combining the mutually recognized image bumps 82. In the example shown in FIG. 7, image bump 821 and image bump 822 are mutually recognized, and image bump 821 and image bump 823 are mutually recognized. Therefore, image bump 821, image bump 822, and image bump 823 form one bump group.

Furthermore, not only the recognition process in the first direction but also the recognition process in the second direction, which is omitted in the figure, is performed. As a result, the nine image bumps 82 shown in FIG. 3 form one bump group. Note that in the example shown in FIG. 8, a plurality of bump groups are formed. After this, execution of the operational flow proceeds to step S4 of the main operational flow in FIG.

In step S4, the data generation unit 6 generates bump position data in which the array pitch of the lattice array is made constant. Here, making the arrangement pitch constant corresponds to estimating a designed reference positional relationship so as to eliminate or cancel out positional errors of the plurality of image bumps 82. The data generation unit 6 corrects the center points C1, C2, and C3 of the three image bumps 821, 822, and 823 spaced apart from each other in the first direction so that they are aligned in a straight line, as shown by broken lines in FIG. 9, for example. do. Furthermore, the data generation unit 6 corrects the distance (array pitch) between the center point C1 and center point C2 so that it matches the distance (array pitch) between the center point C1 and center point C3.

The above correction is performed on nine image bumps 82 in the first direction and the second direction. The finally obtained bump position data is such that the center points of the nine image bumps 82 are arranged in a 3×3 pattern in the first direction and the second direction, and the arrangement pitch is 12 in total in the first direction and the second direction. are all equal data. The bump position data may further include data on the average size of the plurality of image bumps 82, in other words, the average diameter. The bump position data may be edited into part data by being combined with other data regarding the shape of the part 71, or may be used alone.

The bump position data generation device 1 can create a template for use in component mounting work based on the bump position data. The template includes, for example, data on the constant arrangement pitch and average diameter of the plurality of image bumps 82, but does not include data on the shape of the image component 81. Here, the bump position data is data with high practical accuracy that estimates the design reference positional relationship of the plurality of bumps 72, so the template does not include positional errors or diameter errors of each image bump 82, Has high accuracy. If a template is created directly from the image bumps 821, 822, and 823 shown in FIG. 7, the template will have low accuracy, including errors in the position and diameter of the bumps 72 in the specific part 71.

In the component mounting operation of the component mounting machine, the bottom surface of the component 71 picked up by the component picking tool of the mounting head is imaged and image data is acquired. This image data is subjected to image processing using a highly accurate template to accurately determine the position of the bump 72 with respect to the mounting head. Therefore, image processing errors and mounting position errors are suppressed.

Note that the group forming section 5 may set the predetermined angle A in step S12. The predetermined angle A corresponds to the positional error allowed for the image bump 82 in the image data GD. As a result, as shown in FIG. 10, a recognition area is set that extends in a fan shape toward the first direction and the second direction with the center point C5 of the image bump 825 as a reference.

Furthermore, in the application shown in FIG. 11, the group forming section 5 may set both the predetermined width W and the predetermined angle A. In the applied form, an area within a predetermined width W and within a predetermined angle A with respect to the center point C6 of the image bump 826 becomes a recognition area (hatched area). After setting the predetermined angle A or both the predetermined width W and the predetermined angle A in step S12, the group forming unit 5 performs steps S13 to S16 in the same manner as described above, except that the shape of the recognition area is different. Execute.

In the bump position data generation device 1 of the embodiment, a bump group is formed by image bumps (82, 821, 822, 823) having a regular image positional relationship in the image data GD, and a plurality of image bumps belonging to one bump group are Based on the image bumps (82, 821, 822, 823), bump position data is generated by estimating the design reference positional relationship of the plurality of bumps 72. According to this, the design reference positional relationship is estimated so as to eliminate or offset the positional errors of multiple image bumps (82, 821, 822, 823), and the practical accuracy of bump position data is improved more than before. be able to. Furthermore, since bump position data with high practical accuracy can be applied to image processing during the mounting work of the component 71, image processing errors and mounting position errors can be suppressed.

4. Modification in which the function of the group forming section 5 is different Next, a modification in which the function of the group formation section 5 is different will be described with reference to FIG. 12. In the modified form, the group forming unit 5 performs recognition processing to recognize another image bump 82 spaced apart from each other in the first direction and the second direction, including a positional error, using a certain image bump 82 as a reference, and When an image bump 82 is recognized, a process of incorporating another image bump 82 into a bump group including a certain image bump 82 is performed. The group forming unit 5 further repeats the recognition process and the incorporation process sequentially using the plurality of image bumps 82 as a reference. Details of this operation are shown in the sub-operation flow of FIG.

Steps S11 to S13 in FIG. 12 are the same as those described in the embodiment (see FIG. 5). Hereinafter, a case will be described in which the group forming unit 5 first sets the reference image bump 823 (see FIG. 7) in step S13. In this case, the group forming unit 5 sets a first bump group including the image bump 823.

In the next step S21, the group forming unit 5 selects the center point of another image bump 82 that is spaced apart from each other within the recognition area of the image bump 823 in the first direction and the second direction, and whose size is within the tolerance. Performs recognition processing to recognize. In the example shown in FIG. 7, the group forming unit 5 can recognize the center point C1 of another image bump 821 within the recognition area on the right side of the image bump 823 in the first direction.

In the next step S22, it is determined whether another image bump 82 has been recognized. In step S23 when there is a bump, the group forming unit 5 incorporates the recognized image bump 821 into the first bump group. Furthermore, when the group forming unit 5 recognizes the center point of another image bump 82 in the second direction, it incorporates another image bump 82 in the second direction into the first bump group.

In the next step S24, the group forming unit 5 determines whether the recognition process based on all image bumps 82 has been completed. If not, execution of the operation flow is returned to step S13. In the second step S13, the image bump 821 incorporated into the first bump group is set as a new reference, and step S21 is executed.

In the second step S21, the group forming unit 5 can recognize the center point C2 of another image bump 822 within the recognition area on the right side of the image bump 821 in the first direction. Therefore, in the second step S23 after passing through step S22, the group forming unit 5 incorporates the recognized image bump 822 into the first bump group. In this way, the group forming unit 5 can form the first bump group by increasing the number of image bumps 82 in a so-called potato-like manner. In the image data GD shown in FIG. 3, nine image bumps 82 are finally incorporated into the first bump group.

Note that if another image bump 82 is not recognized in step S22, the operation flow proceeds to step S24. In step S24, the group forming unit 5 determines whether the recognition process based on all image bumps 82 has been completed. If it has been completed, all the image bumps 82 have been incorporated into the first bump group, and the sub-operation flow is completed.

If it has not been completed, there are image bumps 82 that are not included in the first bump group. In this case, the group forming unit 5 sets a second bump group that includes the image bumps 82 that are not incorporated into the first bump group, and returns execution of the operation flow to step S13. Then, the group forming unit 5 performs the recognition process in step S21 and the incorporation process in step S23 using the image bump 82 that is not incorporated into the first bump group as a new reference. Further, the group forming unit 5 can form the final second bump group by changing the reference and repeating the recognition process and the incorporation process.

In the modified embodiment, the process of forming a bump group is different from the embodiment, but the formed bump group and the generated bump position data are the same as in the embodiment. Therefore, as in the embodiment, the practical accuracy of the bump position data can be improved compared to the conventional technique, and furthermore, it is possible to suppress image processing errors and mounting position errors during the mounting work of the component 71.

5. Example of Another Part Next, an example of another part (bump part) to which this embodiment can be applied will be described with reference to FIGS. 13 and 14. First, the bumps 72 may be arranged in different numbers in the first direction and in the second direction, and may be arranged in a 3×4 lattice arrangement, for example. Next, the second example component 73 shown in FIG. 13 has a total of 13 bumps (74, 75) arranged in a staggered manner on its bottom surface. The nine bumps 74 shown in circles are arranged in a regular 3×3 grid. On the other hand, the remaining four bumps 75 indicated by hatched circles are located diagonally between the nine bumps 74, and are arranged in a regular 2×2 grid.

The group forming unit 5 can determine the first direction and the second direction by finding the smallest rectangle that includes the 13 bumps (74, 75) in the image data of the component 73. Here, the bump 75 is not located in the first direction or the second direction when viewed from the bump 74, but is located in an approximately 45° diagonal direction. Therefore, the group forming unit 5 forms a first bump group with the image bumps of nine bumps 74 and forms a second bump group with the image bumps of four bumps 75.

Further, the data generation unit 6 generates bump position data for each of the first bump group and the second bump group, which are arranged in an intricate manner. Further, the data generation unit 6 generates data representing the mutual positional relationship between the two sets of bump position data. In the case of the component 73 shown in FIG. 13, mutual positional relationship data is generated in which the centers of two sets of bump position data coincide.

Next, in the third example component 76 shown in FIG. 14, six bumps 77 for input are arranged on the left side of the bottom surface, and four bumps 78 for output are arranged on the right side of the bottom surface. . The six bumps 77 are arranged in a regular 2x3 lattice, and the four bumps 78 are arranged in a regular 2x2 lattice. Bump 77 is much larger than bump 78.

In the image data obtained by imaging this part 76, the group forming unit 5 can determine the first direction and the second direction by finding the smallest rectangle that includes a total of 10 bumps (77, 78). . Here, since the image bump of the bump 77 and the image bump of the bump 78 have a difference in size that exceeds an allowable error, they automatically become separate bump groups. Therefore, the group forming unit 5 forms a first bump group by the image bumps of the six bumps 77 and forms a second bump group by the image bumps of the four bumps 78.

Further, the data generation unit 6 generates bump position data for each of the first bump group and the second bump group that are arranged apart from each other. Furthermore, the data generation unit 6 generates data representing the mutual positional relationship between the two sets of bump position data. In the case of the component 76 shown in FIG. 14, data of a separation distance in which the centers of two sets of bump position data are separated in the first direction is generated.

With respect to the parts (73, 76) illustrated in FIGS. 13 and 14, the bump position data generation device 1 of the embodiment and the modified form operates in the same manner as the part 71 illustrated in FIG. 1, and has similar effects. and the effect occurs. Furthermore, the bump position data generation device 1 can be applied to components other than the exemplified components (71, 73, 76), for example, components in which a plurality of electrodes are lined up on two opposite sides of a rectangular bottom surface.

6. Applications and Modifications of Embodiments Note that when the bumps (72, 74, 75, 77, 78) have a rectangular shape, the predetermined width W is a constant length of the long side, short side, or diagonal of the rectangle. It can be set by multiplying the ratio. Further, if the designed arrangement pitch of the bumps (72, 74, 75, 77, 78) is different between the first direction and the second direction, the data generation unit 6 Bump position data with a uniform array pitch is generated. Furthermore, it is not essential to create a template from the bump position data, and the bump position data can be applied to image processing during the mounting operation by various methods. Various other applications and modifications of the embodiments and modifications are possible.

1: Bump position data generation device 2: Imaging section 3: Control section 4: Image processing section 5: Group forming section 6: Data generation section 71: Part 72: Bump 73: Part 74: Bump 75: Bump 76: Part 77: Bump 78: Bump 81: Image parts 82, 821 to 826: Image bump GD: Image data RC: Rectangle W: Predetermined width A: Predetermined angle C1 to C6: Center point

Claims (11)

an imaging unit that captures images of a plurality of bumps arranged on the component to obtain image data;
an image processing unit that performs image processing on the image data to extract a plurality of image bumps that are images of each of the bumps included in the image data;
a group forming unit that forms a bump group by the image bumps in a predetermined regular image positional relationship that allows positional errors in the image data;
Bump position data that estimates the design reference positional relationship of the plurality of bumps arranged on the part based on the positions of the plurality of image bumps belonging to one bump group and the regular image positional relationship. a data generation unit that generates the
The regular image positional relationship includes the image positional relationship in a lattice array that includes the positional error in the image data and is spaced apart in a first direction of the part and a second direction orthogonal to the first direction. and
The group forming unit performs a recognition process of recognizing other image bumps spaced apart from each other in the first direction and the second direction while including the positional error using the certain image bump as a reference; performing the recognition process sequentially using the image bumps as a reference, and forming the bump group by a combination of the mutually recognized image bumps;
Bump position data generation device. an imaging unit that captures images of a plurality of bumps arranged on the component to obtain image data;
an image processing unit that performs image processing on the image data to extract a plurality of image bumps that are images of each of the bumps included in the image data;
a group forming unit that forms a bump group by the image bumps in a predetermined regular image positional relationship that allows positional errors in the image data;
Bump position data that estimates the design reference positional relationship of the plurality of bumps arranged on the part based on the positions of the plurality of image bumps belonging to one bump group and the regular image positional relationship. a data generation unit that generates the
The regular image positional relationship includes the image positional relationship in a lattice array that includes the positional error in the image data and is spaced apart in a first direction of the part and a second direction orthogonal to the first direction. and
The group forming unit performs a recognition process for recognizing another image bump that is spaced apart from each other in the first direction and the second direction while including the positional error using the certain image bump as a reference; When an image bump is recognized, an integration process is performed to incorporate another image bump into the bump group including a certain image bump, and further, the recognition process and the above are performed sequentially using a plurality of image bumps as a reference. repeat the transfer process,
Bump position data generation device. The bump position data generation device according to claim 1 or 2, wherein the data generation unit generates the bump position data with a constant arrangement pitch of the lattice array. The image processing unit determines a center point for each of the image bumps,
The group forming section is configured to form a plurality of image bumps that are spaced apart from each other in the first direction and the second direction while including the positional error within a predetermined width using the center point of the image bump as a reference. The bump position data generation device according to any one of claims 1 to 3 , which performs the recognition process of recognizing a center point. The image processing unit determines a center point for each of the image bumps,
The group forming section is configured to form a plurality of image bumps that are spaced apart from each other in the first direction and the second direction while including the positional error within a predetermined angle with respect to the center point of the image bump as a reference. The bump position data generation device according to any one of claims 1 to 3 , which performs the recognition process of recognizing a center point. The image processing unit determines a center point for each of the image bumps,
The group forming section includes another group forming section spaced apart from each other in the first direction and the second direction while including the positional error within a predetermined width and within a predetermined angle with respect to the center point of a certain image bump as a reference. The bump position data generation device according to any one of claims 1 to 3 , wherein the recognition process is performed to recognize the center point of the image bump. The bump position data generation device according to claim 4 or 6 , wherein the predetermined width is first set based on the size of the image bump that serves as a reference. The bump position data generation device according to claim 4 or 6 , wherein the predetermined width is set based on an allowable tolerance for a positional error of the bump. The group forming unit determines a minimum rectangle that includes all the image bumps in the image data, and sets directions of two adjacent sides of the rectangle as the first direction and the second direction. 9. The bump position data generation device according to any one of 1 to 8 . The group forming unit according to any one of claims 1 to 8 , wherein the directions of two adjacent sides of the rectangular image of the part in the image data are the first direction and the second direction. Bump position data generation device. The image processing unit determines the size of each of the image bumps,
The group forming unit forms the bump group by the image bumps having the same size within a tolerance range.
The bump position data generation device according to any one of claims 1 to 10 .

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