JPH06260794A - Method and equipment for recognizing position of electronic part - Google Patents

Abstract

PURPOSE:To sense the position of a part accurately without decreasing the angle of view of a camera small, even when the lead pitch of an IC is reduced. CONSTITUTION:In the course of an IC11 being carried through its sucking and fastening by a robot head 15, the flat shape of the IC11 is photographed by a CCD camera 16. Based on the photographed image data, the position of the IC11 is sensed by a visual recognition controller 18 through a region setting process, a picture processing process and a data extracting process, and then, based on the sensed result, the mounting position of the IC11 is corrected. At this time, using a binary picture element data, the end parts of the leads of the IC11 are tracked in a processing region. Concurrently, the picture element data of the end parts are extracted, and the position of the center of gravity is determined in relation to the end parts. Since a center position O and an inclination angle theta of the IC11 are obtained thereby, even when the lead pitch of the IC11 is reduced, the position of the IC11 can be sensed accurately without the angle of view of the camera 16 being made small.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position of an electronic component, such as an IC, which accurately recognizes the position of the electronic component based on image data obtained by photographing an electronic component having a plurality of lead portions. The present invention relates to a recognition method and a position recognition device.

[0002]

2. Description of the Related Art For example, in an apparatus for automatically mounting electronic components such as ICs on a printed circuit board, the electronic components to be mounted are sucked and fixed to a robot head and conveyed onto the printed circuit board, and the electronic components are printed. It is necessary to properly mount the board on a predetermined mounting site.

In recent years, as the miniaturization of electronic parts such as ICs has progressed, the mounting density on a printed circuit board has increased, and high positional accuracy has been required for mounting electronic parts. In this case, considering that the relative position between the robot head and the electronic component attracted to it is deviated, the electronic component being transferred is photographed by a CCD camera or the like, and the electronic component is attracted and fixed to the reference position from the imaged data. The position shift is accurately detected, and the mounting position is corrected based on the detection result.

As a method of recognizing the position of the electronic component in this way, for example, the following method is available. That is, as an electronic component, for example, a QFP as shown in FIG.
Consider a (QuadFlat Package) type IC1. The IC 1 is composed of a flat rectangular package portion 2 in which an IC chip is sealed with resin, and a large number of lead wire portions 3a to 3d led out to the four sides. IC1
In the state of being sucked and fixed to a robot head (not shown), its planar shape is photographed by an electronic component recognition camera.

Next, the photographed image of the IC 1 is A / D converted and stored in the image memory as image data composed of a large number of elements obtained by dividing the photographed screen into meshes in the X and Y directions. Each element stored in the image memory is compared at a predetermined level, and divided into data of the IC1 portion and the background portion and I
Binarized data corresponding to the presence or absence of C1 is obtained.

Next, the extraction lines 4 and 5 and the extraction lines 6 and 7 which are parallel to the X and Y axis directions of the photographing screen are set according to the size of the IC 1. Extraction lines 4 to 7 are I
Lead wire p of the lead wire portions 3a, 3b, 3c, 3d of C1
Is set to cross all. When the binary data of each of the elements located on the extraction lines 4 to 7 is scanned, the binary data changes depending on the presence or absence of the lead line p. The coordinates of the midpoints Ma to Md of the lead wire portions 3a to 3d on the extraction lines 4 to 7 can be obtained by performing the calculation based on the changing scan data.

From the coordinate values of the respective midpoints Ma to Md, IC
At 1, the equations of the straight line m passing through the middle points Ma and Mc and the straight line n passing through the middle points Mb and Md facing each other are obtained. IC1
The center position O representing the position of is obtained as the coordinates of the intersection of the straight lines m and n, and the inclination θ of the IC1 on the XY plane is
Is obtained as an average value of the inclination θ1 of the straight line m with respect to the X axis and the inclination θ2 of the straight line n with respect to the Y axis.

When the center position O and the inclination θ of the IC1 are obtained, these data can be given to the robot head to correct the positional deviation relative to the predetermined position of the printed circuit board. Can be implemented in the right position.

[0009]

By the way, due to recent technological advances, in odd-shaped electronic parts such as QFP, those having a narrow lead pitch have been commercialized, and the tendency of high density as a whole is remarkable. Is becoming. Along with this, in the position recognition of the electronic component as described above, the lead pitch is narrowed, which causes a problem that the lead edge cannot be accurately detected.

That is, with respect to the pixel rate of the camera for recognizing electronic parts (ratio between the actual distance and the width dimension of the camera pixel),
When the pitch of the lead part of the electronic component to be detected becomes narrow, the number of pixel data corresponding to the lead part with respect to the width dimension of the lead part decreases when the image data is binarized, and the resolution decreases. Therefore, the lead edge cannot be accurately detected as a whole. In other words, the pixel data that should have the lead edge is recognized as the pixel data that does not have the lead portion due to the coarseness of the resolution, so that the dimensional accuracy to be detected deteriorates.

In order to solve such a problem, for example, if the photographing magnification of the camera is increased to increase the resolution with respect to the lead pitch, the viewing angle of the camera is reduced, and the electronic image can be photographed within the visual field. Since the size of the component becomes smaller, there is a problem that the restriction on the size of the electronic component to be recognized becomes severe.

The present invention has been made in view of the above circumstances, and an object thereof is to accurately recognize the position of an electronic component having a narrow lead pitch without reducing the viewing angle of the image pickup means for photographing the electronic component. An object of the present invention is to provide a position recognition method for an electronic component and a device therefor.

[0013]

According to the position recognition method of an electronic component of the present invention, the outer shape of the electronic component is detected in order to detect the existing position of the lead portion of the electronic component having a plurality of lead portions to be position-recognized. Based on the image data from the area setting process for setting the processing area based on the component data regarding the dimensions and the image capturing means for capturing the planar shape of the electronic component,
An image processing step of obtaining binarized pixel data corresponding to the presence or absence of the electronic component by discriminating each pixel signal by a reference value, and obtained in the image processing step in the processing area. A data extraction process for extracting pixel data corresponding to the existence state of the lead portion of the electronic component based on the pixel data, and an existence position of the pixel data extracted by the data extraction process, based on the existence position in the processing area. It is characterized in that lead position data corresponding to the barycentric position of each lead part of the electronic component is obtained, and a position detection process for recognizing the existing position of the electronic component based on the lead position data and the component data is provided. Have.

Further, the electronic component position recognition apparatus of the present invention detects the existing position of the lead portion of the electronic component based on the component data relating to the outer dimensions of the electronic component having a plurality of lead portions to be position-recognized. Area setting means for setting a processing area for performing the operation, image pickup means for photographing the planar shape of the electronic component and outputting it as image data, and each pixel signal is discriminated by a reference value based on the image data by the image pickup means. Image processing means for obtaining binarized pixel data corresponding to the presence or absence of the electronic component, and lead of the electronic component based on the pixel data obtained by the image processing means in the processing area. Based on the data extraction means for extracting pixel data corresponding to the existence state of the part, and the existence position of the pixel data extracted by the data extraction means, And a lead position data corresponding to the position of the center of gravity of each lead portion of the electronic component in the physical area, and position detecting means for recognizing the existing position of the electronic component based on the lead position data and the component data. There is a feature in the place.

In the position recognizing method of the electronic component, between the image processing step and the data extracting step, the pixel data of each of the binarized pixel data obtained in the image processing step is stored. When it is data indicating the presence of the electronic component, an expansion processing step of executing a predetermined number of times of expansion processing for rewriting eight pixel data adjacent to the periphery so as to have the same value as the same data, and the expansion processing step For each of the obtained pixel data, when even one of the eight pixel data adjacent to the periphery of the pixel data is data indicating the nonexistence of the electronic component, the pixel data is set to the nonexistence of the electronic component. It is preferable to provide a contraction process step of executing the contraction process of rewriting to data indicating

In the position recognizing device for the electronic component, for each of the binarized pixel data obtained by the image processing means, when the pixel data is data indicating the presence of the electronic component, its surroundings. Expansion processing means for executing a predetermined number of times of expansion processing for rewriting eight pixel data adjacent to each other so as to have the same value as the same data, and for each of the pixel data obtained by this expansion processing means, surrounding the pixel data. If at least one of the eight pixel data adjacent to the above is data indicating the non-existence of the electronic component, the contraction processing unit executes the shrinking process for rewriting the pixel data to the data indicating the non-existence of the electronic component a predetermined number of times. It is also possible to configure by providing and.

[0017]

According to the electronic component position recognition method of the present invention, the area setting process is based on the component data relating to the external dimensions of the electronic component, and leads of the electronic component having a plurality of position recognition target lead portions. A processing area for detecting the existing position of a copy is set. On the other hand, in the image processing process,
Binary pixel data corresponding to the presence or absence of the electronic component is obtained by discriminating each pixel signal by a reference value based on image data from an image pickup means for photographing the planar shape of the electronic component. .

After that, in the data extraction step, the presence of the lead portion of the electronic component in the pixel data in the previously set processing area with respect to the binarized pixel data obtained as described above. Pixel data corresponding to the state is extracted, and in the subsequent position detection process, based on the existing position of the extracted pixel data, the lead corresponding to the barycentric position of each lead part of the electronic component in the processing region is read. Position data is obtained, and the existing position of the electronic component is recognized based on the lead position data and the component data.

As a result, even when the pitch of the lead portions of the electronic component whose position is to be recognized is narrow, the position of the electronic component is determined by finding the center of gravity of the area of the pixel data in which the lead portion exists, instead of detecting the edge of the lead portion. Is recognized, the position of the lead portion can be accurately recognized without reducing the viewing angle of the image pickup means.

According to another aspect of the electronic component position recognizing device, the area setting means is based on the component data relating to the outer dimensions of the electronic component, and the lead of the electronic component having a plurality of position recognizing lead portions. A processing area for detecting the existing position of a copy is set. On the other hand, the image processing means, based on the image data from the image pickup means for photographing the planar shape of the electronic component, discriminates each pixel signal by the reference value, and thus the binary signal is obtained depending on the presence or absence of the electronic component. Obtain the pixelized data.

After that, the data extraction means, with respect to the binarized pixel data obtained as described above, the presence of the lead portion of the electronic component in the pixel data in the previously set processing region. Pixel data corresponding to the state is extracted, and lead position data corresponding to the barycentric position of each lead portion of the electronic component in the processing area is obtained by the position detecting means based on the existing position of the extracted pixel data. The position where the electronic component exists can be recognized based on the lead position data and the component data.

As a result, even when the pitch of the lead portions of the electronic component whose position is to be recognized is narrow, the position of the electronic component is determined by finding the center of gravity of the area of the pixel data in which the lead portion exists, instead of detecting the edge of the lead portion. Is recognized, the position of the lead portion can be accurately recognized without reducing the viewing angle of the image pickup means.

According to the position recognizing method of the electronic component of the third aspect, the binarization obtained in the image processing step is performed in the expansion processing step after the area setting step and the image processing step described above. For each piece of pixel data, when the pixel data is data indicating the existence of the electronic component, expansion processing is performed a predetermined number of times to rewrite eight pixel data adjacent to the pixel data to have the same value as the same data, Subsequently, in the contraction process step, for each of the pixel data obtained in the expansion process step, if at least one of the eight pixel data adjacent to the periphery of the pixel data is data indicating the absence of the electronic component, After the pixel data is processed by executing the contraction process for rewriting the pixel data to the data indicating the absence of the electronic component a predetermined number of times, the data extraction process is performed. So obtaining a read position data via the fine position detection stroke.

As a result, in the pixel data obtained in the image processing step, the pixel data originally having the lead portion but the non-existing pixel data are the pixel data having the lead portion. Therefore, even if the pitch of the lead part of the electronic component whose position is to be recognized is narrow, the pixel data where the lead part exists is accurately extracted and the position of the electronic component is determined by the center of gravity of the area. Can be accurately recognized.

According to the position recognizing device for electronic parts of the fourth aspect, since the same process as described above is carried out by providing the expansion processing means and the contraction processing means, the image processing step is performed in the same manner as described above. In the pixel data, the pixel data which originally had the lead portion but which was not present can be restored to the pixel data which has the lead portion, and the position is recognized. Even if the pitch of the lead portion of the electronic component to be obtained is narrow, the pixel data in which the lead portion exists can be accurately extracted, and the position of the electronic component can be accurately recognized by the center of gravity of the area.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment in which the present invention is applied to an IC mounting apparatus will be described below with reference to FIGS. As shown in FIG. 4, QFP (; which is an electronic component as a position recognition target mounted in this embodiment.
The Quad Flat Package) type IC 11 includes a rectangular resin package portion 12 in which an IC chip is encapsulated, and lead wire portions 13a to 13d each having a large number of lead wires P extending outward on each side thereof. It is configured to have. In this case, the IC 11 has a narrow lead pitch, that is, a large number of lead wires P are arranged at narrow intervals. Then, such an IC 11 is mounted at a predetermined position on the printed board 14 as shown in FIG.

Next, in FIG. 1 schematically showing the main parts of the electronic component mounting apparatus, the above-mentioned IC 11 is fixed on the printed circuit board 14 by a drive control mechanism (not shown) while being fixed by suction by the robot head 15. Be transported. An IC recognizing CCD camera 16 as an image pickup means is provided in the middle of the transportation path of the robot head 15, and the planar shape of the IC 11 illuminated from above is photographed below.

The printed circuit board 14 is designed such that its installation position is imaged by the board recognition CCD camera 17. In this case, the CCD camera 17 is the printed circuit board 1
The portion of the board recognition mark A disposed on the image pickup device 4 is imaged to detect its position.

The CCD cameras 16 and 17 are connected to a visual recognition controller 18 and process photographed image data as described later. Visual recognition controller 18
Is mounted on the robot head 15 via the mounting machine controller 19.
A drive signal is output to to control the drive. The mounting machine controller 19 is provided with a data input section relating to mounting of the IC 11, accepts such data, and
The drive mechanism (not shown) is drive-controlled based on the control signal given from the visual recognition controller 18.

Now, a block diagram of the control system is shown in FIG.
In the above, the visual recognition controller 18 described above includes an IC data receiving section 20 for inputting data from the mounting machine controller 19, the receiving section 20 and the CCD camera 16,
An arithmetic processing unit 21, which receives the image data from 17 and executes various arithmetic processes based on the data.
Then, it is composed of a transmission unit 22 that transmits a control signal based on the result calculated by the calculation processing unit 21.

The above-mentioned arithmetic processing unit 21 has an internal memory 2
In addition to having 1a, it is configured as a functional block as shown in FIG. That is, the processing area setting unit 23 as the area setting means sets the processing area of the photographed data of the IC 11 based on the data of the designated IC 11 and the data stored in the memory 21a. The image processing section 24 as an image processing means determines each pixel signal by a reference value based on the image data of the IC 11 photographed by the CCD cameras 16 and 17, and obtains binarized pixel data by calculation. .

A lead tracking section 25 as a data extracting means
Is the lead portion 1 of the IC 11 based on the obtained pixel data.
The tips of 3a to 13d are traced and extracted as described later. Then, the component position detecting unit 26 as the position detecting means calculates the central position O of the IC 11 and the inclination angle θ from the predetermined direction based on the data of the tip portions of the lead portions 13a to 13d obtained by the lead tracking unit 25. It is being sought by. The position correction amount calculation unit 27 uses the IC 11 obtained by the component position detection unit 26.
The position correction data for correcting the mounting position according to the above data is output to the mounter controller 19.

Next, the operation of this embodiment will be described with reference to FIGS. 5 and 6. When mounting the electronic components, the data of the external size of the printed circuit board 14 to be mounted and each electronic component, the mounting conditions, and the like are input in advance to the mounting machine controller 19. Therefore, when mounting the IC 11, the mounting machine controller 19 sends the external size data of the IC 11 to the visual recognition controller 18.

In the visual recognition controller 18, I
The external size data of C11 is input to the arithmetic processing unit 21 via the data receiving unit 20. The arithmetic processing unit 21 executes various arithmetic processes as follows. In addition,
The position recognition of the printed circuit board 14 by the CCD camera 17 and the position control thereof are performed by imaging the position recognition mark A provided on the printed circuit board 14 and controlling the movement to a predetermined position by the visual recognition controller 18 based on the image data. Has become.

In the arithmetic processing section 21, the lead area 13 of the IC 11 is set by the processing area setting section 23 based on the outer shape data and the data stored in the memory 21a.
The processing area setting process of calculating the areas to be image processed a to 13d is executed. In this case, the processing areas 28a to 28d to be set are the ICs of the respective mounting machines.
It is calculated from the empirical value of the deviation amount of 11 and the external size of the component.

Next, in the image processing section 24, the image data (see FIG. 4) of the planar shape of the IC 11 picked up by the position recognition CCD camera 16 is input, and this image data is A / D converted to 1 pixel. For example, 8-bit digital data of 256 gradations is stored in the memory 21a. Subsequently, an image processing step of converting each pixel of the stored digital data into binarized data according to the presence / absence of the IC 11 is performed, and the binarized data is stored again in the memory 21a as pixel data. At this time, each pixel data becomes a silhouette image in which the pixel portion where the IC 11 exists is dark data “0” and the pixel portion in the background portion is bright data “1”.

Next, the lead tracking section 25 executes a data extraction process based on the binarized data in the processing area 28a set as described above. As shown in FIG. 5, for example, in the processing area 28a, the pixel data of the portion where the IC 11 exists is shown as dark data "0", and the background portion is shown as bright data "1". This processing area 2
Within 8a, the position of the portion where the pixel value is extracted in the X-axis direction and the data value becomes "0" is stored as the tracking start point Q.

At this time, the pixel data extraction process is as shown in FIG.
Pixel data extraction lines 29a shown in FIG. 2 (for the other processing areas 28b to 28d, pixel data extraction lines 29b to 2
9d) and sequentially move the pixel data extraction line 29a toward the outside (upper part in FIG. 5) toward the inner side (lower part in FIG. 5) within the processing area 28a. It is designed to detect

Next, based on the position of the pixel data at the tracking start point Q, the existing position of the pixel data corresponding to the edge of the lead wire P is extracted in the Y-axis direction. At this time, with respect to the pixel data at the tracking start point Q, whether the dark data “0” indicating the presence of the lead line P is included as a connected component in the eight pixel data r1 to r8 adjacent to the pixel. It moves in the Y-axis direction while detecting that.

In this case, of the eight pixel data r1 to r8 adjacent to the tracking start point Q, the pixel data r4
Since the dark data “0” is detected in 5 and 6, it is determined whether or not the pixel data in which the dark data “0” is detected has the connected component also in the eight pixel data adjacent to the pixel data. Will be detected.

As a result, the dark data "0" existing on the left side of the position of the tracking start point Q in the X-axis direction can be reliably detected, and the dark data "0" can be obtained when the lead edge exists. Note that, in the case of FIG. 5, since the lead wire P is arranged at a position along the X and Y axis directions on the screen, as shown in FIG. No data will be detected to the left of it.

In this way, when the position where the dark data "0" is detected within the predetermined tracking area is obtained with the tracking start point Q as the starting point, the pixel data as shown in FIG. 5 is extracted. become. Then, for example, 5 × 4 pieces of pixel data can be detected at the tip portion of the lead wire P (indicated by diagonal lines in FIG. 5). In this case, the tracking area in the Y-axis direction is determined according to the value of the counter set according to the width of the lead wire P of the IC 11, and for example, when the width of the lead wire P is narrow, the counter value is increased. Is set to decrease the counter value when it is wide.

Note that the case shown in FIG. 5 shows a state in which the IC 11 is not deviated from the angle. As shown in FIG. 6, when the IC 11 is deviated from the angle (the actual IC 11 exists). The position is indicated by a thin solid line in the figure), and the pixel data indicating the dark data “0” extracted with respect to the position where the tracking start point Q is set is
Depending on the position where the lead wire P is inclined, its existence area (in the figure,
(A region surrounded by a thick solid line) can be reliably detected. That is, the position of the tracking start point Q is an incomplete position as a lead edge, but the lead P is detected by the extraction process of detecting the connected components of the eight adjacent pixel data r1 to r8. It is possible to accurately detect the pixel data of the existing position.

Next, in the component position detecting section 26, the position of the center of gravity is obtained from the positions of all the pixel data based on the pixel data extracted in the tracking area, and the position is determined as the lead position of the lead wire P. To detect as. Further, the coordinates of the midpoints Ma to Md of the respective lead wire portions 13a to 13d are obtained based on the data of the lead positions of the processing areas 28b to 28d obtained in the same manner (see FIG. 4).

Of the obtained midpoints Ma to Md, a straight line L1 passing through the midpoints Ma and Mc and a straight line passing through the midpoints Mb and Md corresponding to the opposite sides of the lead wire portions 13a to 13d. When L2 is calculated, the point where these straight lines L1 and L2 intersect can be calculated as the center position O of the IC 11. In addition, the tilt angle θ1 between the X axis, which is the coordinate axis on the screen, and the straight line L1 is calculated, the tilt angle θ2 between the Y axis and the straight line L2 is calculated, and the average value of these tilt angles θ1 and θ2 is calculated to determine the IC11. Find the tilt angle θ.

From the data of the center point O and the inclination θ of the IC 11 detected as described above, the deviation amount of the IC 11 with respect to a predetermined mounting position is known, and the position correction amount calculation unit 27
In step 1, the position control signal is generated by performing arithmetic processing based on these data so as to correct the deviation amount. This position control signal is transmitted to the mounting machine controller 19 via the transmission unit 22, and the movement position of the robot head 15 is controlled.

As a result, the IC 11 becomes the robot head 15
At the time when it is sucked and fixed by, it is displaced to the position indicated by the center point O and the inclination θ with respect to the predetermined mounting position, but is corrected to the predetermined mounting position by the time it is moved onto the printed circuit board 14. Thus, the printed circuit board 14 is surely mounted.

According to this embodiment, the lead wires of the lead wire portions 13a to 13d in the arithmetic processing unit 21 of the visual recognition controller 18 are based on the image data of the IC 11 as an electronic component taken by the CCD camera 16. Each of the lead wire portions 13a to 13d is traced by the lead tracer 25, the pixel data having the dark data "0" in which the lead wire P is present is extracted, and the barycentric position thereof is obtained. Since the middle points Ma to Md are obtained, even if the lead pitch of the lead wires P is narrow, the center position O and the inclination θ of the IC 11 can be obtained accurately without reducing the viewing angle of the CCD camera 16. it can.

FIGS. 7 to 10 show a second embodiment of the present invention, and the portions different from the first embodiment will be described below. FIG. 7 is a diagram showing the processing function of the arithmetic unit 21. The difference from the first embodiment is that the lead tracking unit 25 is replaced by an expansion processing unit 30 as expansion processing means and a contraction processing as contraction processing means. The part 31 is provided and configured. That is, in the present embodiment, unlike the first embodiment, when the lead pitch of the lead wires P of the IC 11 is narrow, the expansion processing section 30 performs the expansion processing step and the contraction processing section 31 performs the contraction processing step. The center position O and the tilt angle θ of the IC 11 are to be detected with high accuracy by carrying out the above step. These steps will be described below with reference to FIGS. 8 to 10.

First, similarly to the first embodiment, the processing area setting unit 23 sets the processing areas 28a to 28d for the lead wire portions 13a to 13d of the IC 11, and the image processing unit 24 causes the CCD camera 16 to operate. From the image data of the captured IC 11, the lead wire portion 13a
Pixel data in which the pixels at the positions where the lead wires P of 13 to 13d exist are dark data “0” are obtained.

At this time, the pixel data actually obtained for the actual lead wire portion 13a may include lead missing pixel data that does not exactly correspond to the outer shape of the lead wire P. Since the width of the lead wire P is narrower than the size of the pixel, the edge of the lead wire P cannot be accurately detected if there is such lead missing pixel data. For example, with respect to the actual contour line of the lead wire P, the contour line shown in the portion surrounded by the thick solid line in FIG. 8 is detected from the pixel data obtained by the image processing unit 24. That is, the pixel data k which causes the lead missing to the bright data “1” with respect to the actual lead wires P1 and P2.
That is, 1 to k13 occur.

Therefore, when the lead edge is detected based on the pixel data obtained as it is, if such lead-missing pixel data k1 to k13 exist in the portion along the line where the detection processing is performed, the lead edge detection accuracy is obtained. Therefore, the accurate center position O of the IC 11 cannot be detected. Therefore, in this embodiment, the pixel data is restored so that a more accurate lead edge can be obtained by going through the expansion process and the contraction process.

That is, in the expansion processing section 30, as the expansion processing step, for each pixel data in the processing area 28a shown in FIG. 8, when the pixel data of each pixel is dark data "0", that pixel T is selected. A process of rewriting all the pixel data of the eight pixel data t1 to t8 adjacent to each other as the center to the dark data "0" is executed. For example,
In FIG. 8, since the pixel T at the upper left of the processing area 28a has the bright data “1”, the eight adjacent pixel data t1 to t8 are not rewritten as the pixel data as they are. Further, since the pixel T1 at the upper end of the lead wire P1 has the dark data “0”, all eight adjacent pixel data t1 to t8 are rewritten to the dark data “0”.

In this way, when the above expansion processing is performed on all the pixels in the processing area 28a, it is possible to obtain expansion areas as shown by the shaded areas W1 and W2 in FIG. Lead wires P1 and P2 shown in FIG.
It can be seen that the lead missing portion is eliminated compared to the outer shape of.

Next, in the contraction processing section 31, as the contraction processing step, for each pixel data that has undergone the expansion processing within the processing area 28a, the pixel T is adjacent to the pixel data 8 as a center.
If at least one of the pixel data t1 to t8 has the bright data “1”, the pixel T
The process of rewriting the pixel data of 1 to the bright data “1” is executed. That is, this is the reverse process of the expansion process stroke described above.

In this way, by performing the above-described contraction processing on all the pixels in the processing area 28a, it is possible to obtain contraction areas as shown by the hatched areas D1 and D2 in FIG. As a result, the lead wires P1 and P shown in FIG.
It can be seen that among the pixel data k1 to k13 lacking lead as compared with the outer shape of No. 2, k5, k6, k7, k11, k12 disappear and are restored as pixel data in which the lead line P1 or P2 exists.

Based on the pixel data obtained in this way, the component position calculation unit 26 and the position correction amount calculation unit 27 perform the same arithmetic processing as in the first embodiment, thereby the image processing unit. IC based on the pixel data obtained in 24
It is possible to obtain more accurate data than the detection data of the center position O of 11 and the tilt angle θ. In the above description, the expansion and contraction process steps are performed once each, but by performing the expansion and contraction process steps twice or more, the pixel data can be restored more accurately.

According to the second embodiment described above, the expansion processing section 30 and the contraction processing section 31 perform the expansion processing step and the contraction processing step on the pixel data obtained by the image processing section 24 to determine the outer shape of the IC 11. It becomes possible to detect more accurately, and the center position O and the inclination angle θ of the IC 11 can be detected with high accuracy.

In each of the above embodiments, when the IC 11 is sucked and fixed by the robot head 15,
Although the position of is picked up by the CCD camera 16, the present invention is not limited to this.
Alternatively, the position of the IC 11 may be recognized by a CCD camera here.

Further, in the above embodiment, the IC 11
The position of the IC 11 is corrected by controlling the drive of the robot head 15 during the movement of the above. However, the present invention is not limited to this. For example, the mounting position may be corrected on the printed circuit board 14 side, or It is also possible to correct only the center position or only the tilt on the printed circuit board 14 side, and further to correct the position on the recognition stage.

[0061]

As described above, according to the position recognizing method and position recognizing apparatus for an electronic component of the present invention, the following effects can be obtained. That is, according to the position recognition method of the electronic component according to claim 1, a processing region for detecting the existence position of the lead portion of the electronic component is set in the region setting process, and binarized in the image processing process. Based on the pixel data, in the data extraction process, the pixel data corresponding to the existence state of the lead part of the electronic component is extracted, and the position detection process extracts the pixel data based on the existence position of the pixel data in the processing area. The lead position data corresponding to the barycentric position of each lead portion is obtained, and the existing position of the electronic component is recognized based on the lead position data and the component data. In contrast to the case where the lead pitch is narrow, the position of the lead section is determined from the position of the center of gravity of the area based on the pixel data of the area where the lead section exists, so that the imaging hand Accurately without reducing the viewing angle of an excellent effect of being able to detect the position of the electronic component.

According to the position recognizing device of the electronic component of the second aspect, since it is constituted by the means for carrying out each of the above-mentioned steps, unlike the conventional case of detecting the edge of the lead portion, the area where the lead portion exists. By obtaining the position of the lead portion from the position of the center of gravity based on the pixel data of 1., it is possible to accurately detect the position of the electronic component without reducing the viewing angle of the image pickup means even when the lead pitch is narrow. It has an excellent effect.

According to the position recognition method of the electronic component of the third aspect, the processing area for detecting the existence position of the lead portion of the electronic component is set in the area setting process, and binarized in the image processing process. Based on the pixel data, in the expansion process, for each of the binarized pixel data, when the pixel data is data indicating the existence of the electronic component, eight pixel data adjacent to the surrounding pixel data are generated. The expansion process of rewriting so as to have the same value as the same data is executed a predetermined number of times, and thereafter, in the contraction process step, even one of the eight pixel data adjacent to each pixel data does not have the electronic component. When the data indicating that the pixel data is present, the contraction process of rewriting the pixel data to the data indicating the nonexistence of the electronic component is performed a predetermined number of times, and the position detection process determines the existence position of the pixel data. Then, the lead position data corresponding to the barycentric position of each lead portion of the electronic component in the processing area is obtained, and the existence position of the electronic component is recognized based on the lead position data and the component data. Unlike the conventional method that detects the edge of the lead part, even if there is lead-missing pixel data in the pixel data in the area where the lead part exists, it is possible to obtain pixel data that is restored from this, and the position of the lead part can be determined from their barycentric position. Thus, even if the lead pitch is narrow, it is possible to detect the position of the electronic component with high accuracy without reducing the viewing angle of the image pickup means.

According to the position recognizing device of the electronic component of the fourth aspect, since it is constituted by the means for carrying out each of the above-mentioned steps, unlike the conventional case of detecting the edge of the lead portion, the area where the lead portion exists. Even if there is lead-missing pixel data in the pixel data of, the pixel data can be obtained by reconstructing it, and by obtaining the position of the lead portion from the barycentric position thereof, the viewing angle of the image pickup means can be obtained even when the lead pitch is narrow. The excellent effect is that the position of the electronic component can be detected accurately without reducing the value.

[Brief description of drawings]

FIG. 1 is a schematic diagram of an overall configuration showing a first embodiment of the present invention.

FIG. 2 is a block diagram of a control system

FIG. 3 is a functional block diagram of an arithmetic processing unit.

FIG. 4 is a diagram showing an image of an IC and a processing process.

FIG. 5 is a diagram (part 1) illustrating an image processing state of a lead portion of an IC.

FIG. 6 is a diagram (part 2) for explaining the image processing state of the lead portion of the IC.

FIG. 7 is a view corresponding to FIG. 3 showing a second embodiment of the present invention.

FIG. 8 is a diagram (part 1) illustrating an image processing state of a lead portion of an IC.

FIG. 9 is a diagram (part 2) for explaining the image processing state of the lead portion of the IC.

FIG. 10 is a diagram (part 3) for explaining the image processing state of the lead portion of the IC.

FIG. 11 is a view corresponding to FIG. 4 showing a conventional example.

[Explanation of symbols]

Reference numeral 11 is an IC (electronic component), 13a to 13d are lead wires (leads), 14 is a printed circuit board, 15 is a robot head, 16 is an IC recognition CCD camera (imaging means), 17 is a board recognition CCD camera, 18 is a visual recognition controller, 19 is a mounting machine controller, 20 is a receiving unit, 21 is an arithmetic processing unit, 22 is a transmitting unit, 23 is a processing region setting unit (region setting means), and 24 is an image processing unit (image processing unit). 25 is a lead tracking unit (data extracting means), 26
Is a component position detection unit (position detection unit), 27 is a position correction amount calculation unit, 28a to 28d are processing regions, 30 is an expansion processing unit (expansion processing unit), and 31 is a contraction processing unit (contraction processing unit).

Claims (4)

[Claims] 1. In order to detect the existing position of a lead portion of an electronic component having a plurality of lead portions to be position-recognized,
Based on the area setting process for setting the processing area based on the part data relating to the external dimensions of the electronic part and the image data from the image pickup means for photographing the planar shape of the electronic part, each pixel signal is discriminated by the reference value. By performing an image processing step of obtaining binarized pixel data corresponding to the presence or absence of the electronic component, by performing the electronic component of the electronic component based on the pixel data obtained in the image processing step in the processing region. Based on the data extraction process for extracting the pixel data corresponding to the existence state of the lead part and the position of the existence of the pixel data extracted by this data extraction process, the center of gravity position of each lead part of the electronic component in the processing area And a position detection process for recognizing the existing position of the electronic component based on the lead position data and the component data. Ranaru position recognition method of the electronic component. 2. An area setting means for setting a processing area for detecting the existing position of the lead portion of the electronic component based on component data relating to the outer dimensions of the electronic component having a plurality of lead portions for position recognition. And an image pickup means for photographing the planar shape of the electronic component and outputting it as image data, and corresponding to the presence or absence of the electronic component by discriminating each pixel signal by a reference value based on the image data by the image pickup means. Image processing means for obtaining binarized pixel data, and extracting pixel data corresponding to the existence state of the lead portion of the electronic component based on the pixel data obtained by the image processing means in the processing area. Based on the data extraction means and the existing position of the pixel data extracted by the data extraction means, each lead of the electronic component in the processing area is Obtains the read position data corresponding to the center of gravity of parts, the position recognition device of the electronic component formed of recognizing the position detecting means of the presence position of the electronic component on the basis of the the read position data and the part data. 3. In order to detect the existing position of the lead portion of an electronic component having a plurality of lead portions to be position-recognized,
Based on the area setting process for setting the processing area based on the part data relating to the external dimensions of the electronic part and the image data from the image pickup means for photographing the planar shape of the electronic part, each pixel signal is discriminated by the reference value. Image processing step for obtaining binarized pixel data corresponding to the presence or absence of the electronic component, and the pixel data for each of the binarized pixel data obtained in this image processing step. Is a data indicating the presence of the electronic component, the expansion processing step of executing a predetermined number of times of expansion processing for rewriting the eight pixel data adjacent to the surrounding to have the same value as the same data, and the expansion processing step For each of the pixel data obtained in step 1, even one of the eight pixel data adjacent to the pixel data indicates the absence of the electronic component. When the contraction process step of rewriting the pixel data to the data indicating the nonexistence of the electronic component is performed a predetermined number of times, and based on the pixel data obtained in the contraction process step in the processing region, Based on the data extraction process for extracting pixel data corresponding to the existence state of the lead part of the electronic component and the existence position of the pixel data extracted by this data extraction process, each lead part of the electronic component in the processing area A position recognition method of an electronic component, comprising: obtaining lead position data corresponding to the center of gravity position of the electronic component, and recognizing the existing position of the electronic component based on the lead position data and the component data. 4. A region setting means for setting a processing region for detecting the existing position of the lead portion of the electronic component based on component data relating to the outer dimensions of the electronic component having a plurality of lead portions for position recognition. And an image pickup means for photographing the planar shape of the electronic component and outputting it as image data, and corresponding to the presence or absence of the electronic component by discriminating each pixel signal by a reference value based on the image data by the image pickup means. And image processing means for obtaining binarized pixel data, and for each of the binarized pixel data obtained by the image processing means, the pixel data is data indicating the presence of the electronic component. Expansion processing means for executing a predetermined number of times of expansion processing for rewriting the eight pixel data adjacent to the pixel data so as to have the same value as the same data, and this expansion processing For each of the pixel data obtained by the step, if even one of the eight pixel data adjacent to the periphery of the pixel data is data indicating the non-existence of the electronic component, the pixel data is set to the non-existence of the electronic component. Contraction processing means for executing a contraction processing for rewriting to data indicating the existence a predetermined number of times, and pixel data corresponding to the existence state of the lead part of the electronic component based on the pixel data obtained by the contraction processing means in the processing region And a lead position data corresponding to the barycentric position of each lead part of the electronic component in the processing area based on the existence position of the pixel data extracted by the data extracting means, An electronic component including position detecting means for recognizing the existing position of the electronic component based on lead position data and the component data. Location recognition device.