JPS6375503A - Positioning device for parts with lead - Google Patents

Abstract

PURPOSE:To position a parts with a lead with high accuracy by calculating a reference line in the projection direction of the lead from an image signal obtained by picking up the image of the parts with the lead and calculating the positional relation of the parts from the intersection position of the reference line. CONSTITUTION:A four-directional flat package IC(QFP) 5 supplied from a supply part 4 is picked up by a pickup head 6 and an X-Y-Q table 7 which carries it is moved to the position where its image can be picked up by an ITV camera 9. Then the image of the QFP 5 is picked up and the output signal of the camera 9 is converted 10 into a binary image signal, which is stored in a memory 11. Then an arithmetic part 12 calculates the reference line of each projection direction of a lead of the QFP 5 from the data in the memory 11 and then calculates intersections of reference lines to find the center position and rotational quantity of the QFP 5. Then, the value of a table 7 for placing the QFP 5 at a mount position on a substrate 3 is calculated from the center position and rotational quantity and control signals SX, SY, and Stheta are impressed to the table 7 through a controller 13 to position the QFP 5 at the specific position of the substrate 3; and then the pickup is released and the QFP is mounted on the substrate 3.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to an apparatus for mounting an electronic component having leads on a board, and in particular to a device for positioning the electronic component. Regarding equipment.

(Prior Art) Conventionally, the following methods have been used for positioning an electronic component having leads, such as a four-way flat package (hereinafter referred to as QFP), on a board.

■Method of placing electronic components on a reference surface, positioning them, and mounting them on the board.

■When installing electronic components, a method of photographing the leads and patterns on the board with a TV camera, calculating the deviation, and determining the position.

■A method that uses pattern matching to detect the corners and leads of electronic components, and determine the position when mounting them on the board from these positions.

However, the above method (2) of positioning the electronic component by pressing it against the reference surface does not allow accurate positioning. Further, in the method (2) above, in which positioning is performed based on the misalignment between the leads of the electronic component and the pattern on the board, the structure around the pickup head that carries the electronic component onto the board becomes complicated. Furthermore, in the method using the pattern matching method described in ■ above,
Erroneous detection or failure to detect may occur due to corner edges, chipping, bent leads, etc.

(Problems to be Solved by the Invention) The present invention has been made in consideration of the technical problems of (1), (2), and (3) above.
It is an object of the present invention to provide a leaded component positioning device that can accurately position electronic components having leads.

a positioning means for removably supporting and positioning a component having leads protruding in at least two directions; an imaging means for imaging the component supported by the positioning means; and an image signal output from the imaging means. is input to calculate a reference line in the protruding direction of the lead, and then calculates the intersection position of these reference lines, calculates the positional relationship of the component with respect to the positioning position based on these intersection positions, and uses the positioning means based on the calculation result. It has an arithmetic control means that applies necessary control signals to enable highly accurate positioning of electronic components with leads.

(Example) As an example of the present invention, a four-way flat package IC (hereinafter referred to as QFP) will be described below.
It is abbreviated as "kape". A leaded component positioning device that performs positioning will be described with reference to the drawings.

FIG. 1 shows the configuration of this device. This device is roughly divided into a mounter section (1) that picks up the supplied QF'P and mounts it on a substrate, and a detection section (2) that detects the state of the picked up QFP. Therefore, the mounter section (1) removably holds the QFP (51) supplied from the supply section (4) in order to mount it on the board (3) which is fixed in a predetermined position with a positioning jig (not shown). Pickup head (6) and this pickup head (6)
The QFP (5) picked up by the
) is the Q picked up by the pickup head (6).
Lighting equipment to illuminate the FP! (8) and ITV (Indus
trialTelevision)-ty Meji (9)
, a binarization circuit 001 that binarizes the output signal of this ITV camera (9), an image memory circle that stores the binarized image signal from this binarization circuit (IIK), and an image memory circle that stores the binarized image signal from this binarization circuit (IIK). The position of the QFP is determined by detecting the QFP bin from the data in the arithmetic unit (121) of a microcomputer, for example, and the arithmetic result of the arithmetic unit a.
-Theta table (consists of 20 stages of table controllers that control force).

Next, the operation of the leaded component positioning device having the above configuration will be explained.

The QF P (5) supplied from the supply section (4) is picked up by the pickup head (6). Then, the picked up QFP (51) moves the X-Y-θ table (7) to a position where it can be photographed by the IT camera (9).The image of the QFP (5) at this time is taken by the ITV camera (9).
Take a photo with By the way, the illumination method can be divided into two types, reflected illumination and transmitted illumination, depending on the position of the illumination device (8). In the case of reflected illumination, the QFP (5) appears brighter than the surroundings, and in the case of transmitted illumination, the QFP (5) appears darker than the surroundings.

The case of transmitted illumination will be described below. ITV camera (
The QFP (5) image signal captured in step 9) is converted to a binary value by a binarization circuit so that QFP (51) is at low level (black, shaded area in Figure 2) and the rest are at high level (white). The image data is stored in the image memory 0υ.Based on the image data stored in the image memory αυ, the calculation unit @ performs the following calculation. As shown in Fig. 3, first, a straight line L1 in the longitudinal direction of the lead P is detected.For this purpose, the contents of the image memory 0υ are examined in the X direction, and a plurality of left edges (xl, x, , x3., , , xn) is detected,
Calculate the direct ML+ using the least squares method. Next, the longitudinal direction HL2 of the lead P is detected.

Then, the contents of the image memory θ℃ are examined in the X direction, and multiple upper edges of p (Y+, Ya, Ya, .
...Yn) is detected, and the straight line L2 is calculated using the least squares method.

Then, the intersection (CI x+ CIy) of these two orthogons ftjij, L+, and Lt is calculated. Here, the second
An enlarged view of the lower right part of the figure is shown in Part 4. The tip is straight in the longitudinal direction of lead PZ +P4, , L
, and find their intersection (Ctx.

C1,) is calculated. In other words, the contents of image memory 01) are examined in the -X direction, and the right edge of P is searched for multiple pieces (
Ql, Ql, Q8. ...Q,) is detected, and the straight line Ls is calculated using the least squares method. Next, we investigate in the -y direction and find multiple lower edges of P (R1, Rt, R
s,...几n) is detected and the straight line is calculated. This 2
Calculate the intersection (C!” + Cty ) of the straight lines of the book, ,L. Thus, (C10[,C+y) + (C
tx, 02M), the center position (OQX, OQY) of QFP (5) and the rotation amount OI can be found using the following equations (2), (2), and (2).

However, it is the angle when θch iJ QFP (5) is not rotating, and can be determined from the design value. 0 representing the location information of Big Up Santa QFP (5)
Q) If l + OQy l Os is known, this QFP
X-Y-θ for placing (5) in the mounting position of board (3)
The values in table (7) can be obtained by calculation.

Next, the calculation unit α1 outputs control signals sx, sy, s via the table controller α3) based on the calculation results.
θ is applied to the X-Y-θ table (7) and the QFP (5) is picked up by the pickup head (6).
After positioning the pickup at a predetermined position on the board (3), the pickup is released and mounted on the board (3).

The leaded component positioning device of this embodiment can position electronic components having leads on a board with high precision. Furthermore, the structure around the pickup head is also simplified. In particular, with the method using the pattern matching method, corners and leads of the electronic component may not be detected when the electronic component is rotating; however, in this embodiment, the pattern matching method is not used. There is no problem even if the lead is rotated to detect the lead.Furthermore, if the lead of an electronic component is bent for some reason (5th
), the angle α between the two straight lines M Ll and Ll is 90
Since the bending of the lead can be detected, it has a special effect.

Note that this method is not limited to transmitted illumination, but can also be applied to reflected illumination. At this time, in the image after binarization, the electronic components are at a high level (white), and the other parts are at a high level (white).
becomes. Further, in the above embodiment, the leads at the upper left and lower right of the electronic component are detected, but the position of the electronic component may be calculated by detecting the leads at the upper right and lower left. Furthermore, in the above embodiment, a plurality of edges on one side of the lead were detected and extracted, and a straight line in the longitudinal direction of the lead was calculated using the least squares method. It is also possible to detect a plurality of center points perpendicular to , and calculate a straight line in the longitudinal direction using the method of least squares. Further, the leads do not need to be exposed on the outside of the electronic component, and the present invention can be applied to devices where the leads P... are on the inside, as shown in FIG. Furthermore, regarding the above embodiment, the mounter section (1)
In this case, connect the board (3) to the pickup instead of the RAD (6) side.
-Y-θ table may be used for movement.

Further, the binarization process may be performed after the image is stored in the image memory. In this case, it is necessary to provide an analog-to-digital (A/D) converter before the image memory.

〔Effect of the invention〕

According to the present invention, electronic components having leads can be positioned on a substrate with high precision. Furthermore, the structure around the pickup head is also simplified.

The method using the pattern matching method may not be able to detect the corners or leads of the electronic component when the electronic component is rotating, but the present invention detects the leads by rotating the electronic component using the pattern matching method. Therefore, positioning can be performed reliably even when rotating. Furthermore, it has a special effect in that it can also detect bending of the IJ-card of electronic components.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a leaded component positioning device according to an embodiment of the present invention, FIGS. 2 to 5 are diagrams for explaining the operation, and FIGS. It is an explanatory diagram. (1): Mounter part (positioning means), (5): Q
FP <parts), (91: ITV camera (imaging means), sauce: calculation section (1st, 2nd, 3rd calculation means). Agent: Patent attorney Noriyuki Noriyuki Yudo Takehana Kikuo

Claims (1)

[Claims] a positioning means for removably supporting a component having leads in at least two directions and positioning it at a predetermined position; an imaging means for capturing an image of the component supported by the positioning means and converting the image into an image signal; a first calculating means for calculating a reference line for each protruding direction of the lead based on the above, and calculating an intersection point of the reference line calculated by the first calculating means, and based on the calculation result of the intersection point, the above predetermined position and a positioning control means that outputs a control signal to cause the positioning means to position the part based on the calculation result of the second calculation means. A leaded component positioning device characterized by: