JPH08236998A - Surface mounting device - Google Patents

Abstract

PURPOSE: To enable high precision recognition by providing a substrate measurement circuit for obtaining a mounting target center position and a substrate rotation angle from a pad position and a part measurement circuit for obtaining the center position and the rotating angle of an electronic part from a lead position and calculating a mounting correction amount from substrate measurement information and part measurement information. CONSTITUTION: An edge detection circuit 5 for finding an edge part of a pad 2 on a substrate 1 and a substrate measurement circuit 7 for obtaining mounting target center position and the rotation angle of the substrate 1 from a pad position detected by a pad position detection circuit 6 are provided. An edge detection circuit 12 for finding a lead edge part of an electronic part and a part measurement circuit 14 for obtaining the center position and the rotation angle of the electronic part 8 from a lead position detected by a lead position detection circuit 13 are provided. A correction amount calculation circuit 15 for calculating a mounting correction amount from substrate measurement information from the substrate measurement circuit 7 and part measurement information from the part measurement circuit 14 is further provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount device,
In particular, it relates to a surface mounting device for mounting lead components on a printed circuit board.

[0002]

2. Description of the Related Art A conventional surface mount device, when recognizing the position of a printed circuit board 102 as shown in FIG.
The position of the IC mark 103 provided above is recognized by the camera 3 and the board recognition unit 104 to obtain the mounting target position and the board rotation angle (for example, Japanese Patent Laid-Open No. 3-232300). The center and tilt angle of the electronic component from the lead position of the electronic component 101 were recognized by the camera 10 and the component recognition unit 105.

[0003]

In the above-described conventional surface mounting apparatus, there is a problem that a relative position error between the IC mark and the mounting pad is always caused and it depends on the image processing accuracy when recognizing the IC mark. there were.

[0004]

The present invention provides a surface mounting apparatus for automatically mounting a surface mounting type electronic component on a substrate,
From the board camera that images the mounting pad on the board, the board binarization circuit that binarizes the signal from this board camera, and the binarized image binarized by this board binarization circuit A pad edge detection circuit for finding an edge portion of the pad on the substrate, and a pad position detection circuit for measuring the tip center position of the pad by applying a mask of a predetermined size around the edge detected by the pad edge detection circuit, A board measurement circuit that obtains a mounting target center position and a board rotation angle from the pad position detected by the pad position detection circuit,
A component camera that captures the leads of an electronic component, a component binarization circuit that binarizes the image of the leads captured by this component camera, and a binarized signal that is binarized by this component binarization circuit. A lead edge detection circuit that finds the lead edge portion from the image, a lead position detection circuit that measures the center position of the tip of the lead by applying a mask of a predetermined size around the edge detected by this lead edge detection circuit, and this lead position A component measurement circuit that obtains the center position and rotation angle of the electronic component from the lead position detected by the detection circuit, and a mounting correction amount is calculated from the substrate measurement information from the substrate measurement circuit and the component measurement information from the component measurement circuit. And a correction amount calculating circuit.

[0005]

The present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the present invention.

In this embodiment, a camera 3 for picking up an image of the mounting pad 2 on the substrate 1, a binarization circuit 4 for binarizing a signal from the camera 3, and a binarization output from the binarization circuit 4 are provided. An edge detection circuit 5 for finding the edge portion of the pad 2 on the substrate 1 by using an image, and a pad position for measuring the tip center position of the pad by applying a mask of a predetermined size around the edge detected by the edge detection circuit 5. A detection circuit 6; and a board measurement circuit 7 for obtaining the mounting target center position and the rotation angle of the board 1 from the pad position detected by the pad position detection circuit 6,
A camera 10 for picking up an image of the lead 9 of the electronic component 8, a binarization circuit 11 for binarizing the image of the lead 9 picked up by the camera 10, and a binary image output from the binarization circuit 11 for reading An edge detection circuit 12 for finding edge parts,
A lead position detection circuit 13 for measuring the tip center position of the lead by applying a mask of a predetermined size to the periphery of the edge detected by the edge detection circuit 12, and the electronic position of the electronic component 8 from the lead position detected by the lead position detection circuit 13. The component measuring circuit 14 for obtaining the center position and the rotation angle, and the correction amount calculating circuit 15 for calculating the mounting correction amount from the substrate measuring information from the substrate measuring circuit 7 and the component measuring information from the component measuring circuit 14.
It has and.

The board recognition is performed by recognizing the position of the pad 2 on the board 1 to obtain a mounting target, and the recognition of the component 8 is performed by recognizing the position of the lead 9 and the center position of the component to perform the mounting correction calculation. Since the board pad 2 to be actually mounted is directly recognized, stable accuracy can be obtained, and since the board recognition accuracy is an average value of many pads, high accuracy recognition can be expected without depending on the image processing accuracy.

[0008]

As described above, according to the present invention, since the substrate is recognized without using the IC mark, it is not necessary to consider the error between the pad on the substrate and the IC mark, and the position of the substrate can be determined from the pad. Since it is sought, the recognition accuracy does not depend on the image processing accuracy, and high-accuracy recognition is possible.

[Brief description of drawings]

FIG. 1 is a block diagram of one embodiment of the present invention.

FIG. 2 is a configuration diagram of a conventional surface mount device.

[Explanation of symbols]

 1 board 2 mounting pad 3 camera 4 binarization circuit 5 edge detection circuit 6 pad position detection circuit 7 board measurement circuit 8 electronic component 9 lead 10 camera 11 binarization circuit 12 edge detection circuit 13 lead position detection circuit 14 component measurement circuit 15 Correction amount calculation circuit 101 Electronic component 102 Printed circuit board 103 IC mark 104 Board recognition unit 105 Component recognition unit

Claims (1)

[Claims] 1. A surface mounter for automatically mounting a surface mount type electronic component on a board, and a board camera for picking up an image of a mounting pad on the board and a board for binarizing signals from the board camera. A binarization circuit, a pad edge detection circuit that finds an edge portion of a pad on the substrate from a binary image binarized by this board binarization circuit, and a periphery of the edge detected by this pad edge detection circuit. A pad position detection circuit that measures the center position of the tip of the pad by applying a mask of a predetermined size, a board measurement circuit that determines the mounting target center position and the board rotation angle from the pad position detected by this pad position detection circuit, and an electronic A component camera that captures an image of a component lead, a component binarization circuit that binarizes the image of the lead captured by this component camera, and a binarization circuit that binarizes the image. A lead edge detection circuit for finding the lead edge portion from the binary image, and a lead position detection circuit for measuring the tip center position of the lead by applying a mask of a predetermined size around the edge detected by the lead edge detection circuit, A component measurement circuit that obtains the center position and rotation angle of the electronic component from the lead position detected by the lead position detection circuit, and board mounting information from the board measurement information from the board measurement circuit and the part measurement information from the part measurement circuit. A surface mount device comprising a correction amount calculation circuit for calculating an amount.