JP2803427B2 - Surface mount IC lead displacement inspection equipment - Google Patents
Surface mount IC lead displacement inspection equipmentInfo
- Publication number
- JP2803427B2 JP2803427B2 JP4026340A JP2634092A JP2803427B2 JP 2803427 B2 JP2803427 B2 JP 2803427B2 JP 4026340 A JP4026340 A JP 4026340A JP 2634092 A JP2634092 A JP 2634092A JP 2803427 B2 JP2803427 B2 JP 2803427B2
- Authority
- JP
- Japan
- Prior art keywords
- inspection area
- circuit
- lead
- inspection
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は表面実装ＩＣずれ検査装
置、特に、プリント基板にはんだ付けされた表面実装Ｉ
Ｃのリードのずれを検査する表面実装ＩＣリードずれ検
査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount IC displacement inspection apparatus, and more particularly to a surface mount IC soldered to a printed circuit board.
The present invention relates to a surface mount IC lead deviation inspection apparatus for inspecting lead deviation of C.
【０００２】[0002]
【従来の技術】従来のリードずれ検査装置は検査対象部
品の隣接するリード間に斜め上方から光を照射する照明
と、検査対象部品の画像を取り込む上方に取り付けられ
たカメラと、該カメラから取り込んだ濃淡画像の明るい
部分は“１”に、暗い部分は“０”の二値化画像に変換
する二値化回路と、検査対象部品の一本のリードの両側
にリードずれの許容できる限界の座標に発生させる二つ
の検査領域を記憶する検査領域記憶回路と、前記二値化
回路より出力される二値化画像に前記検査領域記憶回路
に記憶されている検査領域を発生させる検査領域発生回
路と、該検査領域発生回路より出力される検査領域内二
値化画像より、検査領域内に“１”のエリアがあるか判
定する判定回路とを含んで構成される。2. Description of the Related Art A conventional lead misalignment inspection apparatus includes an illumination for irradiating light obliquely between adjacent leads of a component to be inspected, a camera mounted above to capture an image of the component to be inspected, and a camera for capturing images from the camera. A binarization circuit for converting a light portion of a gray-scale image into a binary image of “1” and a dark portion of the image into a binary image of “0”; An inspection area storage circuit for storing two inspection areas to be generated in coordinates, and an inspection area generation circuit for generating an inspection area stored in the inspection area storage circuit in a binarized image output from the binarization circuit And a determination circuit that determines whether there is an area of “1” in the inspection area based on the binarized image in the inspection area output from the inspection area generation circuit.
【０００３】次に従来のリードずれ検査装置について図
面を参照して詳細に説明する。図３は従来の一例を示す
ブロック図であり、図４はＩＣリードがパッドに実装さ
れた状態を示すＩＣの部分平面図である。図３の照明２
１は検査対象部品に斜め上方から光を照射する。カメラ
２２は検査対象部品の上方に取り付けられ検査対象部品
の画像を取り込み濃淡画像信号ｆを出力する。二値化回
路２３は前記濃淡画像信号ｆを入力しあらかじめ設定し
た二値化レベルにより明るい部分に対応した“１”と暗
い部分に対応した“０”に変換し、二値化画像信号ｇを
出力する。Next, a conventional lead displacement inspection apparatus will be described in detail with reference to the drawings. FIG. 3 is a block diagram showing an example of the related art, and FIG. 4 is a partial plan view of the IC showing a state where IC leads are mounted on pads. Lighting 2 of FIG.
Reference numeral 1 irradiates light to the inspection target component from obliquely above. The camera 22 is mounted above the inspection target component, takes in an image of the inspection target component, and outputs a grayscale image signal f. The binarization circuit 23 receives the grayscale image signal f and converts the grayscale image signal f into “1” corresponding to a bright portion and “0” corresponding to a dark portion by a preset binarization level, and converts the binary image signal g. Output.
【０００４】検査領域発生回路２４では、二値化画像信
号ｇを入力し検査領域記憶回路２５に記憶されている検
査領域信号ｈにより設定される検査領域２９をパッド２
７に実装されたリード２８の両側にリードずれの許容で
きる限界の座標に発生させ、該検査領域内の二値化画像
のみを抽出した検査領域内二値化画像信号ｉを出力す
る。判定回路２６では、検査領域内二値化画像信号ｉを
入力し、“１”のエリア３０があればリードずれと判定
する。In the inspection area generating circuit 24, a binary image signal g is inputted, and the inspection area 29 set by the inspection area signal h stored in the inspection area storage circuit 25 is pad 2.
7 is generated on the both sides of the lead 28 mounted on the lead 28 at the coordinates of the allowable limit of the lead deviation, and a binarized image signal i in the inspection area is output by extracting only the binarized image in the inspection area. The determination circuit 26 receives the binarized image signal i in the inspection area, and if there is an area 30 of “1”, determines that there is a read shift.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来の技術
は、検査領域を計算上リードずれが許容できる限界の座
標に発生させ、該検査領域内にリードからの反射光があ
るとリードずれと判定していたので、検査領域の座標発
生精度の影響を受けリードずれを精度よく検出できない
という欠点があった。In the above-mentioned prior art, the inspection area is generated at coordinates of a limit at which a lead deviation can be tolerated in calculation, and when there is reflected light from a lead in the inspection area, it is determined that the lead is a deviation. Therefore, there is a drawback that the lead deviation cannot be detected accurately due to the influence of the coordinate generation accuracy of the inspection area.
【０００６】[0006]
【課題を解決するための手段】本発明の表面実装ＩＣリ
ードずれ実装装置は、検査対象部品の斜め上方から光を
照射する照明と、検査対象部品の画像を取り込む情報に
取り付けられたカメラと、該カメラから取り込んだ濃淡
画像の明るい部分は“１”に、暗い部分は“０”の二値
化画像に変換する二値化回路と、検査対象リードを含む
検査領域を記憶する第一の検査領域記憶回路と、検査対
象リードより先のパッド部分の検査領域を記憶する第二
の検査領域記憶回路と、前記二値化回路より出力される
二値化画像に前記第一の検査領域記憶回路に記憶されて
いる検査領域を発生させる第一の検査領域発生回路と、
該第一の検査領域発生回路より出力される第一の検査領
域内二値化画像信号より前記検査領域内のリードからの
反射光による“１”のエリアを検出し、該エリアのリー
ドと直角の方向の“１”の範囲の中心座標を計測する第
一の計測回路と、前記二値化回路より出力される二値化
画像に前記第二の検査領域記憶回路に記憶されている検
査領域を発生させる第二の検査領域発生回路と、該第二
の検査領域発生回路より出力される第二の検査領域内二
値化画像信号より前記検査領域内のパッドからの反射光
により“１”のエリアを検出し該エリアのリードと直角
の方向の“１”の範囲の中心座標を計測する第二の計測
回路と、前記第一の計測回路からの第一の計測値と第二
の計測回路からの第二の計測値との差をとりリードずれ
量を算出しあらかじめ設定した判定値より大きければリ
ードずれと判定する判定回路とを含んで構成される。According to the present invention, there is provided a surface mount IC lead shift mounting apparatus which illuminates light from obliquely above a component to be inspected, a camera attached to information for capturing an image of the component to be inspected, A first test for storing a test area storing a test area including a lead to be tested and a binary circuit for converting a bright portion of the grayscale image captured from the camera into a binary image of “1” and a dark portion into a binary image of “0” An area storage circuit, a second inspection area storage circuit that stores an inspection area of a pad portion ahead of the inspection target lead, and a first inspection area storage circuit that stores a binary image output from the binarization circuit. A first inspection area generating circuit for generating an inspection area stored in
The area of "1" due to the reflected light from the lead in the inspection area is detected from the binarized image signal in the first inspection area output from the first inspection area generation circuit, and the area perpendicular to the lead in the area is detected. A first measurement circuit for measuring the central coordinates of the range of “1” in the direction of “1” , and an inspection area stored in the second inspection area storage circuit in the binarized image output from the binarization circuit. And a reflected light from a pad in the inspection area from a second inspection area binary image signal output from the second inspection area generation circuit. a second measuring circuit for measuring the center coordinates of the range of "1" area detects the direction of the lead at right angles with the area of "1" by a first measured value from said first measurement circuit The difference from the second measurement value from the second measurement circuit is calculated to calculate the amount of lead deviation. Greater than the determination value beforehand set configured to include a determination circuit lead deviation.
【０００７】[0007]
【実施例】次に、本発明の実施例について、図面を参照
して詳細に説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
【０００８】図１は本発明の一実施例を示すブロック図
である。図１の照明１は検査対象部品に斜め上方から光
を照射する。カメラ２は検査対象部品の上方に取り付け
られ検査対象部品の画像を取り込み濃淡画像信号ａを出
力する。二値化回路３は前記濃淡画像信号ａを入力しあ
らかじめ設定した二値化レベルにより明るい部分に対応
した“１”と暗い部分に対応した“０”に変換し、二値
化画像信号ｂ，ｂｂを出力する。FIG. 1 is a block diagram showing one embodiment of the present invention. The illumination 1 shown in FIG. 1 irradiates light to a component to be inspected from obliquely above. The camera 2 is mounted above the inspection target component, takes in an image of the inspection target component, and outputs a grayscale image signal a. The binarization circuit 3 receives the grayscale image signal a, converts the grayscale image signal a into “1” corresponding to a bright part and “0” corresponding to a dark part by a preset binarization level, and converts the binary image signal b, bb is output.
【０００９】第一の検査領域発生回路４では、前記二値
化画像信号ｂを入力し第一の検査領域記憶回路５に記憶
されている第一の検査領域信号ｃにより設定される検査
対象リードを含む検査領域を発生させ、該第一の検査領
域内の二値化画像のみを抽出した第一の検査領域内二値
化画像信号ｄを出力する。第一の計測回路６では、該第
一の検査領域内二値化画像信号ｄを入力し、リードと直
角な方向（以下Ｘ方向と呼ぶ）の“１”の範囲の中心座
標Ｘ１を“１”を最大座標と最小座標の平均より求め第
一の中心座標信号ｅを出力する。The first inspection area generating circuit 4 receives the binary image signal b and receives an inspection target read set by the first inspection area signal c stored in the first inspection area storage circuit 5. Is generated, and only the binarized image signal d in the first inspection area, which is obtained by extracting only the binarized image in the first inspection area, is output. The first measurement circuit 6 receives the first inspection area binarized image signal d and sets the center coordinate X1 of a range of “1” in a direction perpendicular to the lead (hereinafter referred to as X direction) to “1”. Is obtained from the average of the maximum coordinates and the minimum coordinates, and a first center coordinate signal e is output.
【００１０】第二の検査領域発生回路７では、前記二値
化画像信号ｂｂを入力し第二の検査領域記憶回路８に記
憶されている第二の検査領域信号ｃｃにより設定される
検査対象リードより先のパッド部分を含む検査領域を発
生させ、該第二の検査領域内の二値化画像のみを抽出し
た第二の検査領域内二値化画像信号ｄｄを出力する。第
二の計測回路９では、該第二の検査領域内二値化画像信
号ｄｄを入力し、Ｘ方向の“１”の範囲の中心座標Ｘ２
を“１”の最大座標と最小座標の平均より求め第二の中
心座標信号ｅｅを出力する。The second inspection area generating circuit 7 receives the binary image signal bb and receives an inspection target read set by the second inspection area signal cc stored in the second inspection area storage circuit 8. An inspection area including a further pad portion is generated, and a second inspection area binary image signal dd obtained by extracting only the binarized image in the second inspection area is output. The second measurement circuit 9 receives the binary image signal dd in the second inspection area and receives the center coordinate X2 of the range of “1” in the X direction.
Is obtained from the average of the maximum coordinate and the minimum coordinate of “1”, and the second center coordinate signal ee is output.
【００１１】判定回路１０では、前記中心座標信号ｅ，
ｅｅを入力し、Ｘ方向の座標Ｘ１とＸ２との差をとり、
該値があらかじめ設定した判定値より長ければ、リード
ずれと判定する。In the determination circuit 10, the center coordinate signals e,
ee is input, and the difference between the coordinates X1 and X2 in the X direction is calculated.
If the value is longer than a predetermined determination value, it is determined that a read error has occurred.
【００１２】リードずれ検出の原理を説明する。The principle of lead shift detection will be described.
【００１３】図２は二値化画像信号のパターン図であ
る。点線部はパッド１１上のリード１２を含む第一の検
査領域１３と、リード１２より先のリード１２を含む第
一の検査領域１３と、リード１２より先のリード１２を
含まない第二の検査領域１４である。照明１はパッド１
１とリード１２からの反射光がカメラ２に入射する角度
に取り付けられており、反射率の高いパッド１１とリー
ド１２からの反射光が強いため二値化画像信号“１”の
エリアを示す斜線部はリード部分のエリア１５とパッド
部分のエリア１６となる。ただしリーダ１２の側面のパ
ッド１１上にははんだフィレットが形成されているた
め、上方に取り付けられた照明１からの照明光は斜め方
向へ反射し、上方に取り付けられたカメラ２へは入射し
ない。従って、第一の計測回路６により計測されるＸ１
はリードの中心座標となり、第二の計測回路９により計
測されるＸ２はパッドの中心座標となる。FIG. 2 is a pattern diagram of a binarized image signal. The dotted lines indicate the first inspection area 13 including the lead 12 on the pad 11, the first inspection area 13 including the lead 12 before the lead 12, and the second inspection area not including the lead 12 before the lead 12. Region 14. Lighting 1 is pad 1
The light reflected from the lead 1 and the lead 12 is attached to the camera 2 at an angle such that the reflected light from the pad 11 and the lead 12 having high reflectivity is strong, and the oblique line indicating the area of the binary image signal “1”. The portion becomes the area 15 of the lead portion and the area 16 of the pad portion. However, since the solder fillet is formed on the pad 11 on the side surface of the reader 12, the illumination light from the illumination 1 mounted above is reflected obliquely, and does not enter the camera 2 mounted above. Therefore, X1 measured by the first measurement circuit 6
Is the center coordinate of the lead, and X2 measured by the second measurement circuit 9 is the center coordinate of the pad.
【００１４】従って判定値をリード中心とパッド中心と
のずれの許容限界長さに設定しておくことで、許容され
る以上ずれたリードをリードずれと検出することができ
る。Therefore, by setting the judgment value to the allowable limit length of the shift between the center of the lead and the center of the pad, it is possible to detect a lead that is shifted more than an allowable amount as a lead shift.
【００１５】[0015]
【発明の効果】本発明の表面実装ＩＣリードずれ検査装
置は、検査領域を検査対象部品のリードの両側にリード
ずれの許容できる限界の座標に発生させ検査領域内にリ
ードからの反射光が入ったら欠陥と判定していたかわり
に、リードとパッドを含んで発生させる検査領域から求
めるリード中心のＸ方向座標と、パッドのみを含んで発
生させる検査領域から求めるパッド中心のＸ方向座標と
の差から、パッド中心ととリード中心のずれ量を求め判
定するので、検査領域の座標発生制度に影響を受けずに
精度よくリードずれを検出することができるという効果
がある。According to the surface mount IC lead deviation inspection apparatus of the present invention, an inspection area is generated on both sides of the lead of the component to be inspected at coordinates of an allowable limit of the lead deviation, and the reflected light from the lead enters the inspection area. Difference between the X-direction coordinate of the lead center obtained from the inspection area including the lead and the pad and the X-direction coordinate of the pad center obtained from the inspection area including only the pad, instead of determining that the defect has occurred. Therefore, since the shift amount between the center of the pad and the center of the lead is determined and determined, there is an effect that the lead shift can be accurately detected without being affected by the coordinate generation accuracy of the inspection area.
【図１】本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing one embodiment of the present invention.
【図２】本発明の原理を説明するためのパターン図であ
る。FIG. 2 is a pattern diagram for explaining the principle of the present invention.
【図３】従来の一例を示すブロック図である。FIG. 3 is a block diagram showing an example of the related art.
【図４】従来例の原理を説明するためのパターン図であ
る。FIG. 4 is a pattern diagram for explaining the principle of a conventional example.
１ 照明 ２ カメラ ３ 二値化回路 ４ 第一の検査領域発生回路 ５ 第一の検査領域記憶回路 ６ 第一の計測回路 ７ 第二の検査領域発生回路 ８ 第二の検査領域発生回路 ９ 第二の計測回路 １０ 判定回路 １１ パッド １２ リード １３ 第一の検査領域 １４ 第二の検査領域 １５ リード部分のエリア １６ パッド部分のエリア ２１ 照明 ２２ カメラ ２３ 二値化回路 ２４ 検査領域発生回路 ２５ 検査領域記憶回路 ２６ 判定回路 ２７ パッド ２８ 検査領域 ３０ “１”のエリア ａ，ｆ 濃淡画像信号 ｂ，ｂｂ，ｇ 二値化画像信号 ｃ，ｃｃ，ｈ 検査領域信号 ｄ，ｄｄ，ｉ 検査領域内二値化画像信号 ｅ，ｅｅ 中心座標信号 DESCRIPTION OF SYMBOLS 1 Illumination 2 Camera 3 Binarization circuit 4 First inspection area generation circuit 5 First inspection area storage circuit 6 First measurement circuit 7 Second inspection area generation circuit 8 Second inspection area generation circuit 9 Second Measurement circuit 10 Judgment circuit 11 Pad 12 Lead 13 First inspection area 14 Second inspection area 15 Lead area 16 Pad area 21 Lighting 22 Camera 23 Binarization circuit 24 Inspection area generation circuit 25 Inspection area storage Circuit 26 Judgment circuit 27 Pad 28 Inspection area 30 Area “1” a, f Gray image signal b, bb, g Binarized image signal c, cc, h Inspection area signal d, dd, i Binarization in inspection area Image signal e, ee Center coordinate signal
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 13/08 Ｈ０５Ｋ 13/08 Ａ // Ｈ０１Ｌ 23/50 Ｈ０１Ｌ 23/50 Ｎ (58)調査した分野(Int.Cl.6，ＤＢ名) G01B 11/24 G01N 21/88 H05K 13/08 H01L 23/50──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification symbol FI H05K 13/08 H05K 13/08 A // H01L 23/50 H01L 23/50 N (58) Field surveyed (Int.Cl. 6 G01B 11/24 G01N 21/88 H05K 13/08 H01L 23/50
Claims (1)
る照明と、検査対象部品の画像を取り込む情報に取り付
けられたカメラと、該カメラから取り込んだ濃淡画像の
明るい部分は“１”に、暗い部分は“０”の二値化画像
に変換する二値化回路と、検査対象リードを含む検査領
域を記憶する第一の検査領域記憶回路と、検査対象リー
ドより先のパッド部分の検査領域を記憶する第二の検査
領域記憶回路と、前記二値化回路より出力される二値化
画像に前記第一の検査領域記憶回路に記憶されている検
査領域を発生させる第一の検査領域発生回路と、該第一
の検査領域発生回路より出力される第一の検査領域内二
値化画像信号より前記検査領域内のリードからの反射光
による“１”のエリアを検出し、該エリアのリードと直
角の方向の“１”の範囲の中心座標を計測する第一の計
測回路と、前記二値化回路より出力される二値化画像に
前記第二の検査領域記憶回路に記憶されている検査領域
を発生させる第二の検査領域発生回路と、該第二の検査
領域発生回路より出力される第二の検査領域内二値化画
像信号より前記検査領域内のパッドからの反射光により
“１”のエリアを検出し該エリアのリードと直角の方向
の“１”の範囲の中心座標を計測する第二の計測回路
と、前記第一の計測回路からの第一の計測値と第二の計
測回路からの第二の計測値との差をとりリードずれ量を
算出しあらかじめ設定した判定値より大きければリード
ずれと判定する判定回路とを含むことを特徴とする表面
実装ＩＣリードずれ検査装置。1. An illumination for irradiating light from obliquely above a component to be inspected, a camera attached to information for capturing an image of the component to be inspected, and a bright portion of a grayscale image captured from the camera to “1”. A dark part is a binarization circuit for converting to a binarized image of "0", a first inspection area storage circuit for storing an inspection area including a lead to be inspected, and an inspection area for a pad part earlier than the lead to be inspected. A second inspection area storage circuit for storing the first inspection area generation circuit for generating an inspection area stored in the first inspection area storage circuit in a binarized image output from the binarization circuit. A circuit, and detecting an area of “1” due to light reflected from a lead in the inspection area from a binarized image signal in the first inspection area output from the first inspection area generation circuit; "1" in the direction perpendicular to the lead A first measurement circuit for measuring the center coordinates of the range, and a second inspection for generating an inspection area stored in the second inspection area storage circuit on the binarized image output from the binarization circuit An area generating circuit, and detecting an area of "1" by reflected light from a pad in the inspection area from a binary image signal in the second inspection area output from the second inspection area generation circuit; a second measuring circuit for measuring the center coordinates of the range of the lead and the perpendicular direction "1" of the second measurement from the first measurement value and second measurement circuit from the first measurement circuit And a determination circuit for calculating a lead deviation amount by taking a difference from the value and determining a lead deviation when the lead deviation amount is larger than a predetermined judgment value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4026340A JP2803427B2 (en) | 1992-02-13 | 1992-02-13 | Surface mount IC lead displacement inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4026340A JP2803427B2 (en) | 1992-02-13 | 1992-02-13 | Surface mount IC lead displacement inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05256622A JPH05256622A (en) | 1993-10-05 |
| JP2803427B2 true JP2803427B2 (en) | 1998-09-24 |
Family
ID=12190712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4026340A Expired - Lifetime JP2803427B2 (en) | 1992-02-13 | 1992-02-13 | Surface mount IC lead displacement inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2803427B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6407433B2 (en) * | 2015-07-15 | 2018-10-17 | ヤマハ発動機株式会社 | Model data creation device, model data creation method, mounting reference point determination device, mounting reference point determination method |
-
1992
- 1992-02-13 JP JP4026340A patent/JP2803427B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05256622A (en) | 1993-10-05 |
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