JPH0677689A - Recognizing method for position of circuit substrate - Google Patents

Abstract

PURPOSE:To obtain a method for recognizing a circuit substrate which can obtain the position data of a circuit substrate regardless of the base of the circuit substrate and the material of a recognition pattern, etc. CONSTITUTION:The step between a base 4 of a circuit substrate 2 and a circuit pattern 3 and a recognition mark 5a, etc., is detected by the use of a laser type displacement meter 6 and position data on the circuit substrate 2 is calculated based on the position data.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board position recognition method for obtaining position data used in a step of mounting components on a circuit board, a wire bonding step and the like.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view showing a conventional circuit board position recognition device. This position recognition device includes a table 1 on which a circuit board 2 is placed, a television camera 9 that captures an image of the circuit board 2 placed on the table 1, and the television camera 9 in the horizontal direction (X direction and A television camera supporting means for movably supporting in the Y direction), and a television camera 9
And a data processing unit that processes the video image captured by the device and detects the position data of a predetermined pattern. on the other hand,
The circuit board 2 includes a circuit pattern 3 provided on an insulating base material 4 and a plurality of recognition marks 5 having a specific shape.

In this position recognition device, the table 1
The circuit board 2 is placed on the top, and the circuit board 2 is photographed by the television camera 9. The position of the television camera 9 at this time is given to the data processing means, and the data processing means processes the image given from the television camera 9 to process each recognition mark 5
Is recognized, and the position data of the circuit board 2 in the position recognition device is calculated based on the position data (JP-A-62-62).
-2691).

This position data is used to ensure high position accuracy in the component mounting process and wire bonding process immediately after that.

It should be noted that the recognition mark 5 is usually formed in the circuit pattern 3 in order to make the positional relationship with the circuit pattern 3 accurate.
At the same time, it is formed of a conductor thin film.

[0006]

However, in the above-mentioned conventional position recognition method for the circuit board, the recognition mark 5 is detected by utilizing the difference in the light reflectance between the base material 4 and the recognition mark 5. Therefore, when the difference between the light reflectance of the base material 4 and the light reflectance of the recognition mark 5 is small, or when the light reflection on the base material 4 or the recognition mark 5 is uneven, the recognition is performed. There is a problem that the mark 5 may not be recognized accurately. It is possible to arrange a light source on the lower side of the circuit board and identify the recognition mark by the light transmitted through the base material, but in this case, there is a drawback that it cannot be applied to the base material having low light transmittance. is there.

The present invention has been made in view of the above problems, and it is possible to more reliably obtain the position data of the circuit board regardless of the material of the substrate and the recognition pattern of the circuit board. An object is to provide a position recognition method.

[0008]

A circuit board position recognizing method according to the present invention detects a predetermined unevenness provided on a circuit board and recognizes the position of the circuit board based on the position data of the unevenness. It is characterized by

[0009]

In the present invention, the predetermined unevenness provided on the circuit board is detected by displacement measurement using, for example, a laser beam, and the position of the circuit board is recognized based on the position data of the unevenness. The predetermined unevenness may be a recognition mark formed on the surface of the circuit board together with the circuit pattern by a conductive thin film, or may be a hole formed by a drill or the like.

In the present invention, since the reference pattern is not detected by utilizing the reflection or transmission of light, the circuit board is recognized by detecting irregularities selectively provided on the surface of the board. It is possible to reliably detect the predetermined irregularities regardless of the material of the substrate of the circuit board and the recognition mark.

[0011]

Embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a position recognizing device used in a position recognizing method for a circuit board according to a first embodiment of the present invention. This position recognition device includes a table 1 on which a circuit board 2 is placed, a laser displacement meter 6 arranged above the table 1 for scanning and measuring displacement (irregularities) of the surface of the circuit board 2, and Displacement gauge supporting means for movably supporting the laser displacement gauge 6 in the horizontal direction (X direction and Y direction) and a signal output from the laser displacement gauge 6 are processed to detect position data of a predetermined unevenness. And data processing means. On the other hand, the circuit board 2 includes a circuit pattern 3 provided on the insulating base material 2 and a plurality of recognition marks 5a having a specific shape. The circuit pattern 3 and the recognition mark 5a are both formed of a conductive thin film.

In this position recognition device, the table 1
The circuit board 2 is mounted on the circuit board to some extent, and the displacement of the surface of the circuit board 2 is scanned and measured by the laser displacement meter 6. The data processing means processes the output of the laser displacement meter 6 to recognize the circuit pattern 3 and the recognition mark 5a. Further, the position data of the laser displacement meter 6 is given to the data processing means, and the data processing means calculates the positions of the circuit pattern 3 and the recognition mark 5a based on the position data of the laser displacement meter 6. . Thereby, the position data of the circuit board 2 can be obtained with high accuracy.

FIG. 2 is a diagram showing changes in the output of the laser displacement meter 6 near the recognition mark. When the laser displacement meter 6 scans the substrate surface in the X direction, the output of the laser displacement meter 6 changes corresponding to the recognition mark 5a.
Similarly, when the laser displacement meter 6 scans the surface of the substrate in the Y direction, the output of the laser displacement meter 6 changes corresponding to the recognition mark 5a. The data processing means recognizes the unevenness based on the change in the output of the laser displacement meter 6 and calculates the position data.

In this embodiment, the unevenness provided on the circuit board 2 is detected by the laser displacement meter, and the position data of the circuit board is obtained based on the position data of the unevenness. Therefore, the base material, the circuit pattern and the recognition are recognized. The position data of the circuit board can be obtained with high accuracy regardless of the material of the mark. It should be noted that the scanning measurement by the laser displacement meter is preferably performed at a plurality of places where the position of the circuit board can be calculated by comparison with the data in the circuit board design even if the scanning position on the circuit board is displaced to some extent.

FIG. 3 is a perspective view showing a method of recognizing the position of a circuit board according to the second embodiment of the present invention.

The difference between this embodiment and the first embodiment is that the recognition hole 7 or the component insertion hole 8 formed by a drill or the like is used as a reference for position recognition instead of the recognition mark formed by the conductor thin film. Since the other configurations are basically the same as those of the first embodiment, the same components as those in FIG. 1 are designated by the same reference numerals in FIG. 3 and their detailed description is omitted.

In this embodiment, the laser displacement meter 6 detects a step due to the recognition hole 7 or the component insertion hole 8 formed in the circuit board 2 with a drill or the like, and the recognition hole 7 or the component insertion hole 8 is detected. The position data of the circuit board 2 is calculated based on the position data.

For example, when obtaining position data for inserting an electronic component into the component insertion hole 8 provided in the base material 4, the position data of the recognition hole 7 or the component insertion hole 8 is obtained as in this embodiment. By recognizing the position of the circuit board 2 on the basis of, it is possible to further improve the accuracy at the time of component mounting.

[0020]

As described above, according to the present invention, the predetermined unevenness provided on the circuit board is detected, and the position of the circuit board is recognized based on the position data of the unevenness. Highly accurate position recognition is possible regardless of the material of the base material and the recognition pattern.

[Brief description of drawings]

FIG. 1 is a perspective view showing a position recognition device used in a circuit board position recognition method according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a change in output of a laser displacement meter in the vicinity of a recognition mark.

FIG. 3 is a perspective view showing a method of recognizing a position of a circuit board according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional circuit board position recognition device.

[Explanation of symbols]

 1; Table 2; Circuit board 3; Circuit pattern 4; Base material 5, 5a; Recognition mark 6; Laser displacement meter 7; Recognition hole 8; Component insertion hole 9; Television camera

Claims (1)

[Claims] 1. A method for recognizing the position of a circuit board, which comprises detecting a predetermined unevenness provided on the circuit board and recognizing the position of the circuit board based on the position data of the unevenness.