JPH0372203A - Checking method of outer appearance of soldering part - Google Patents
Checking method of outer appearance of soldering partInfo
- Publication number
- JPH0372203A JPH0372203A JP20832489A JP20832489A JPH0372203A JP H0372203 A JPH0372203 A JP H0372203A JP 20832489 A JP20832489 A JP 20832489A JP 20832489 A JP20832489 A JP 20832489A JP H0372203 A JPH0372203 A JP H0372203A
- Authority
- JP
- Japan
- Prior art keywords
- area
- soldering
- wiring board
- printed wiring
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims description 13
- 238000007689 inspection Methods 0.000 claims description 60
- 238000005259 measurement Methods 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 239000000758 substrate Substances 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
本発明は、印刷配線基板に挿入されたリードの半田付は
部の外観検査により半田付は状態の良否を判定する半田
付は部の外観検査方法に関するものである。The present invention relates to a method for visually inspecting a soldering part of a lead inserted into a printed wiring board to determine whether the condition of the soldering part is good or bad by visually inspecting the soldering part.
従来より、リードを有する部品の半田付は状部の検査方
法として、半田付は部を照射する光源を設け、半田付は
部での反射光をＩＴＶカメラで検出することにより、半
田付は部の外観を検査方法が知られている（特開昭６２
−２９９７０９号公報参照）。すなわち、光源からの光
線の入射角度に対する半田付は部の傾斜角度の変化に基
づく反射光量の変化を測定して半田付は状態の良否を判
定するのである。Conventionally, soldering of parts with leads has been inspected by installing a light source that illuminates the parts, and by detecting the reflected light from the soldering parts with an ITV camera. There is a known method for inspecting the appearance of
(Refer to Publication No.-299709). That is, the quality of the soldering is determined by measuring the change in the amount of reflected light based on the change in the angle of inclination of the soldering part with respect to the incident angle of the light beam from the light source.
上記検査方法によると、半田付は部からの反射光量の変
化に基づいて半田付は状態の良否判定を行うから、半田
付は部の３次元形状が完全に把握できるものではなく、
判定精度が低いという問題がある。この問題を解決する
ために、光源の形状や配置位置などが工夫されているが
、ＩＴＶカメラを１台用いて反射光量を測定するのみで
は、実質的には２次元の処理になるから、判定精度を高
めるのは困難である。
本発明は上記問題点を解決することを目的とするもので
あり、印刷配線基板に半田付けされたリードの周囲を３
次元計測することにより、半田付は状態の正確な良否判
定が行えるようにした半田付は部の外観検査方法を提供
しようとするものである。According to the above inspection method, the quality of soldering is judged based on the change in the amount of light reflected from the soldering part, so it is not possible to completely grasp the three-dimensional shape of the soldering part.
There is a problem that the judgment accuracy is low. In order to solve this problem, the shape and position of the light source have been devised, but simply measuring the amount of reflected light using a single ITV camera is essentially a two-dimensional process, so it is difficult to make judgments. It is difficult to improve accuracy. The purpose of the present invention is to solve the above-mentioned problems.
The present invention aims to provide a method for visually inspecting soldering parts that allows accurate determination of the quality of soldering by dimensional measurement.
上記目的を遠戚するために、請求項１の発明では、印刷
配線基板に挿入されたリードの半田付は部を含む測定領
域内の３次元計測値に基づいて、測定領域内の印刷配線
基板の表面からの最大突出寸法を求め、あらかじめ設定
された一定寸法を上記最大突出寸法から減じた寸法より
も印刷配線基板の表面からの突出寸法が小さい領域を検
査領域とし、検査領域内の半田量や半田形状に基づいて
半田付は状態の良否を判定するのである。
また、請求項２の発明では、印刷配線基板に挿入された
リードの半田付は部を含む測定領域内の３次元計測値に
基づいて、印刷配線基板の表面からの測定領域内での突
出量の変化率を求め、あらかじめ設定された基準値と上
記変化率との大小関係に基づいて検査領域を設定し、検
査領域内の半田量や半田形状に基づいて半田付は状態の
良否を判定するのである。In order to achieve the above object distantly, in the invention of claim 1, the soldering of the leads inserted into the printed wiring board is determined based on the three-dimensional measurement value within the measurement area including the printed wiring board within the measurement area. Determine the maximum protrusion dimension from the surface of the printed wiring board, and define the area where the protrusion dimension from the surface of the printed wiring board is smaller than the dimension obtained by subtracting a certain predetermined dimension from the above maximum protrusion dimension as the inspection area, and calculate the amount of solder in the inspection area. The quality of soldering is determined based on the shape of the solder and the shape of the solder. In addition, in the invention of claim 2, the amount of soldering of the leads inserted into the printed wiring board is determined based on the three-dimensional measurement value within the measurement area including the portion, and the amount of protrusion within the measurement area from the surface of the printed wiring board. The rate of change of is determined, an inspection area is set based on the magnitude relationship between a preset reference value and the rate of change, and the quality of the soldering is determined based on the amount of solder and solder shape within the inspection area. It is.
上記両方法によれば、３次元計測値を用いているから、
半田付は部の形状判定が正確に行えるのである。
しかも、請求項１によれば、測定領域内において印刷配
線基板の表面からの最大突出寸法を求め、この最大突出
寸法に基づいてリードと半田とを識別することにより検
査領域を設定するから、リードの状態に影響されない検
査領域内で半田付は状態の良否が判定でき、判定精度が
高くなるという利点を有する。
また、請求項２によれば、測定領域内での印刷配線基板
の表面からの突出量の変化率に基づいて検査領域を設定
するから、半田付は部が複雑な形状であってもリードと
識別でき、半田付は状態の良否の判定精度が一層高くな
る。According to both of the above methods, since three-dimensional measurement values are used,
Soldering allows accurate determination of the shape of parts. Moreover, according to claim 1, the maximum protrusion dimension from the surface of the printed wiring board is determined within the measurement area, and the inspection area is set by identifying leads and solder based on this maximum protrusion dimension. Soldering has the advantage of being able to determine whether the condition is good or bad within an inspection area that is not affected by the condition of the soldering device, increasing the accuracy of the determination. Further, according to claim 2, since the inspection area is set based on the rate of change in the amount of protrusion from the surface of the printed wiring board within the measurement area, soldering is possible even if the part has a complicated shape. It can be identified, and the accuracy of determining whether the soldering condition is good or bad becomes even higher.
【実施例１】
第１図に示すように、基本的には、３次元のデータが得
られるセンサ部１１と、センサ部１１で得られたデータ
に基づいて３次元の座標を演算する座標演算部１２と、
座標演算部１２で求めた３次元の座標を他のデータとと
もに記憶する記憶部１３と、求められた３次元の座標に
基づいて印刷配線基板１に挿入され半田付けされたり一
部２の半田付は部３の検査を行なう検査処理部１０とを
備えている。
検査処理部１０は、上記３次元座標に基づいて印刷配線
基板１の上に配置されリード２が半田付けされた部品の
リード２と半田付は部３を含む検査領域Ａ２（後述する
）とを識別する検査領域設定部１４と、検査領域Ａ２内
の測定データに基づいて半田付は状態の良否を判定する
良否判定部１５とで構成される。センサ部１１を除く各
処理はコンピュータ等を用いることにより実現される。
センサ部１１は、いわゆる３次元スキャナであり、たと
えば、光ビームを検査対象の表面で走査するとともに、
ＰＳＤのような位置検知素子を用いて三角測距を行なう
ことにより、３次元のデータを得るようにしたものが用
いられる。一方、印刷配線基板１の表面に沿う面内での
座標は、第２図（ｂ）に示すように、あらかじめ設定さ
れた測定領域Ａ１の中の座標として与えられる。こうし
て、座標演算部１２では、印刷配線基板■の表面に沿う
面をＸＹ平面、印刷配線基板１の表面からの高さ方向を
Ｚ方向とする３次元の座標（ｘ、ｙ、ｚ）を求めるので
ある。
次に、検査方法について説明する。まず、部品が実装さ
れた印刷配線基板１を計測ステージの所定位置にセット
し、印刷配線基板１に挿入され半田付けされたリード２
の周囲であ゛らかしめ設定された測定領域Ａ、の中につ
いて３次元計測を行う。
３次元計測値は記憶部１３に格納され、検査処理部１０
の検査領域設定部１４では、記憶部１３に格納された３
次元計測値に基づいて、第２図（ａ）に示す手順に従っ
て検査領域を設定する。すなわち、まず、測定領域Ａ、
の中で印刷配線基板１からの突出量を測定し、最大突出
量を求める。こうして得られた最大突出量を、印刷配線
基板１から突出したリード２の先端とみなす。次に、正
常に半田付けされているときに半田付は部３から突出す
るリード２の寸法に相当するようにあらかじめ設定した
一定値を、上記最大突出量から減算する。
この演算により得られた値を検査領域Ａ２の高さＨｔと
し、測定領域Ａ１内での３次元計測値のＺ座標がこの高
さトｉｔより小さくなる領域を検査領域Ａ、とする。す
なわち、第３図および第４図に示すように、測定頭域Ａ
１のうちＺ座標が上記高さＨ１ｔ！−越える領域を除く
部分が検査領域Ａ２になるのである。ここに、第４図中
の斜線部分は検査領域Ａ２として認識される部位である
。
次に、良否判定部部５では、検査領域Ａ２内において半
田付は状態の良否判定を行う。第５図に示すように、ま
ず、矩形状に設定されている測定頭域Ａ、の４隅の高さ
の平均値を求め基準値Ｈ５とする。すなわち、この基準
値Ｈｓは印刷配線基板１の表面の高さに相当する。次に
、検査領域Ａ２内でＺ座標の測定値Ｈが、Ｈ＞ Ｈｓが
っＨ＜Ｈｔとなるとき、（Ｈ−Ｈｓ）を求め、検査領域
Ａ２の中の全領域に互ってこの値を加算する。こうして
得られた加算値は半田の総量に相当するがら、この総量
が、あらかじめ適正半田量として設定された所定の範囲
内にはいるがどうがを判定することにより、適正半田量
の範囲内であれば半田量について良品と判定し、そうで
なければ半田量について不良品と判定するのである。こ
こにおいて、上記測定値Ｈは、検査領域Ａ２の中で多数
設定された検査ポイントについて求められる。検査ポイ
ントは、記憶部１３に記憶されているＸＹ平面上での最
小単位を画像処理との類似により画素と呼称することに
すれば、１画素毎ないし複数画素毎に設定されるのであ
る。
次に、半田量のみではなく半田形状についても判定を行
う。すなわち、第６図に示すように、まず、検査領域Ａ
２内で半田付は部３の周辺の適宜検査ポイントを探索始
点（Ｘ＋、３’＋、Ｚ＋）とする。
次に、探索始点と検査領域Ａ２の最大高さとなる部位と
を通る直線上で、探索始点に隣接する検査ポイント（部
２，３’２．部２）を求める。この検査ポイントのＺ座
標Ｚ２が、検査領域Ａ２の高さＨｔより小さければ、探
索始点のＺ座標Ｚｌとの差を取り、差分ｄｈ＝ｚｚ
ｚｌを求める。差分ｄｈは、あらかじめ設定された差分
規格値と比較される。すなわち、探索始点を通る上記直
線上において、半田付は部３の形状が良品であれば、第
７図（ａ）や第７図（ｂ）に示すように、半田付は部３
を上るときには差分ｄｈは正になり、半田付は部を下る
ときには差分ｄｈは負になり、Ｍ後にはＯになる。した
がって、差分ｄｈを演算した後、探索始点に隣接してい
た検査ポイントを次の探索始点として、差分ｄｈを順次
求めることにより、半田付は部の形状を検査することが
できる。すなわち、第６図に示すように、半田付は部を
上るときと下るときとを識別するフラグｆ１ｇを設けて
初期値をｆ１ｇ＝ｏとしておき、差分ｃｌｈが正の差分
規格値（差分ｄｈの正負を判定するときにはＯとしても
よいが、通常は、正負にそれぞれ差分規格値を与える）
以上である間はｆｌｇ−０に保つ。その後、差分ｄｈが
負の差分規格値より小さくなるから、その時点でｆ１ｇ
＝１とし、その後、差分ｄｈが正の差分規格値以上にな
らなければ、半田付は状態が正常であるとみなすのであ
る。
一方、半田が濡れ不足であったり、穴あきがあったりし
て半田付は状態が不良であると、差分ｄｈが一旦負の値
になり（負の差分規格値よりも小さくなり）、その後、
正の値になる〈正の差分規格値以上になる）という変化
をすることが多い。この場合には、第６図に示すように
、ｆ１ｇ＝１で半田付は部を下る状態を示しているとき
に、差分ｄｈが正の値になる（正の差分規格値以上にな
る）がら、半田付は状態が不良であると判定できる。[Embodiment 1] As shown in FIG. 1, basically a sensor unit 11 that obtains three-dimensional data, and a coordinate operation that calculates three-dimensional coordinates based on the data obtained by the sensor unit 11. Part 12 and
A storage unit 13 that stores the three-dimensional coordinates obtained by the coordinate calculation unit 12 together with other data; and a storage unit 13 that stores the three-dimensional coordinates obtained by the coordinate calculation unit 12 together with other data; is equipped with an inspection processing section 10 for inspecting the section 3. The inspection processing unit 10 inspects an inspection area A2 (described later) including the leads 2 and soldering area 3 of the component placed on the printed wiring board 1 and having the leads 2 soldered thereon based on the three-dimensional coordinates. It is comprised of an inspection area setting unit 14 that performs identification, and a quality determination unit 15 that determines whether the soldering condition is good or bad based on the measurement data within the inspection area A2. Each process except for the sensor section 11 is realized by using a computer or the like. The sensor unit 11 is a so-called three-dimensional scanner, and for example, scans the surface of the inspection target with a light beam, and
A device that obtains three-dimensional data by performing triangulation using a position detection element such as a PSD is used. On the other hand, the in-plane coordinates along the surface of the printed wiring board 1 are given as coordinates within a preset measurement area A1, as shown in FIG. 2(b). In this way, the coordinate calculation unit 12 calculates three-dimensional coordinates (x, y, z) where the plane along the surface of the printed wiring board 1 is the XY plane and the height direction from the surface of the printed wiring board 1 is the Z direction. It is. Next, the inspection method will be explained. First, the printed wiring board 1 with components mounted thereon is set at a predetermined position on the measurement stage, and the leads 2 are inserted into the printed wiring board 1 and soldered.
A three-dimensional measurement is performed within the measurement area A, which has been preliminarily set around the area. The three-dimensional measurement values are stored in the storage unit 13 and are sent to the inspection processing unit 10.
The inspection area setting unit 14 selects the 3 data stored in the storage unit 13.
Based on the dimensional measurement values, an inspection area is set according to the procedure shown in FIG. 2(a). That is, first, measurement area A,
The amount of protrusion from the printed wiring board 1 is measured, and the maximum amount of protrusion is determined. The maximum amount of protrusion thus obtained is regarded as the tip of the lead 2 protruding from the printed wiring board 1. Next, a predetermined value, which is set in advance to correspond to the dimension of the lead 2 that protrudes from the soldering portion 3 when soldering is performed normally, is subtracted from the maximum protrusion amount. The value obtained by this calculation is defined as the height Ht of the inspection area A2, and the area where the Z coordinate of the three-dimensional measurement value within the measurement area A1 is smaller than this height it is defined as the inspection area A. That is, as shown in FIGS. 3 and 4, the measurement head area A
The Z coordinate of 1 is the above height H1t! -The part excluding the area exceeding the area becomes the inspection area A2. Here, the shaded area in FIG. 4 is the area recognized as the inspection area A2. Next, the quality determining section 5 determines the quality of the soldering within the inspection area A2. As shown in FIG. 5, first, the average value of the heights of the four corners of the measurement head area A, which is set in a rectangular shape, is determined and set as a reference value H5. That is, this reference value Hs corresponds to the height of the surface of the printed wiring board 1. Next, when the measured value H of the Z coordinate in the inspection area A2 is H>Hs H<Ht, calculate (H-Hs) and apply this value to the entire area in the inspection area A2. Add. The added value obtained in this way corresponds to the total amount of solder, but by determining whether or not this total amount is within a predetermined range set in advance as the appropriate amount of solder, it is possible to determine whether the total amount is within the range of the appropriate amount of solder. If so, the solder amount is determined to be good, and if not, the solder amount is determined to be defective. Here, the measurement value H is obtained for a large number of inspection points set in the inspection area A2. If the minimum unit on the XY plane stored in the storage unit 13 is called a pixel, similar to image processing, the inspection point is set for each pixel or for each plurality of pixels. Next, not only the amount of solder but also the shape of the solder is determined. That is, as shown in FIG. 6, first, the inspection area A
For soldering in 2, appropriate inspection points around section 3 are set as search starting points (X+, 3'+, Z+). Next, inspection points (parts 2, 3' 2, 2) adjacent to the search start point are found on a straight line passing through the search start point and the part of the inspection area A2 having the maximum height. If the Z coordinate Z2 of this inspection point is smaller than the height Ht of the inspection area A2, take the difference from the Z coordinate Zl of the search starting point and calculate the difference dh=zz
Find zl. The difference dh is compared with a preset difference standard value. That is, on the straight line passing through the search starting point, if the shape of the soldering part 3 is good, the soldering will be done in the part 3 as shown in FIG. 7(a) and FIG. 7(b).
When going up the soldering section, the difference dh becomes positive, when going down the soldering section, the difference dh becomes negative, and after M, it becomes O. Therefore, after calculating the difference dh, the shape of the soldering part can be inspected by sequentially finding the differences dh using the inspection point adjacent to the search start point as the next search start point. That is, as shown in FIG. 6, a flag f1g is provided to identify when the soldering goes up and down the part, and the initial value is set as f1g=o, and the difference clh is set to a positive difference specification value (the difference dh When determining positive or negative, it may be set to O, but normally, a standard difference value is given to positive and negative respectively.)
While above, keep flg-0. After that, the difference dh becomes smaller than the negative difference standard value, so at that point f1g
= 1, and thereafter, if the difference dh does not exceed the positive difference standard value, the soldering is considered to be in a normal state. On the other hand, if the solder is in poor condition due to insufficient wetting or holes, the difference dh will temporarily become a negative value (below the negative difference standard value), and then,
It often changes to a positive value (becomes greater than the positive difference standard value). In this case, as shown in Figure 6, when f1g = 1 and the soldering is in a downward state, the difference dh becomes a positive value (becomes more than the positive difference specification value). , it can be determined that the soldering is in poor condition.
【実施例２】
本実施例では、実施例１とは検査処理部１０での処理が
異なっている。すなわち、まず実施例１と同様に測定領
域Ａ、内の検査ポインＩ・について３次元の座標を求め
る。
次に、検査領域設定部１４では、第８図（ａ）に示すよ
うにして検査領域Ａ２を設定する。すなわち、第８図（
ｂ）に示すように、測定領域Ａ、においてＸ方向とＹ方
向との中央線１．、ＩＹを設定する。
この中央線ｅｘ、ＩＹはり一部２の先端を通るように設
定される。次に、中央線１．．２Ｙ上において、隣接す
る検査ポイントの高さの差分を求める。半田１寸は部３
においては、裾付近では差分が小さく、頂上付近では差
分が大きくなるから、差分の差分ｄｈ′を求め、この差
分ｄｈ′があらかじめ設定された基準値Ｍよりも大きく
なった位置を半田付は部とリード２との境界とする。し
たがって、この位置でのＺ座標を求め、検査領域Ａ２の
高さＨｔとすれば、検査領域Ａ２が設定されるのである
。
検査領域Ａ２が設定されると、以後は実施例１と同様の
手順によって半田付は状態の良否を判定することができ
る。また、第９図に示すように、半田が濡れ不足である
場合に、検査領域Ａ２の高さＨｔは、第９図の破線の位
置になるから、検査領域外に半田が存在することを検出
すれば、半田付は状態の良否を判定することが可能にな
る。[Embodiment 2] In this embodiment, the processing in the inspection processing section 10 is different from that in the first embodiment. That is, first, as in the first embodiment, the three-dimensional coordinates of the inspection point I in the measurement area A are determined. Next, the inspection area setting section 14 sets an inspection area A2 as shown in FIG. 8(a). In other words, Fig. 8 (
As shown in b), in the measurement area A, the center line 1 in the X direction and the Y direction. , set IY. The center line ex and IY are set to pass through the tip of the beam portion 2. Next, center line 1. ．． On 2Y, find the difference in height between adjacent inspection points. 1 inch of solder is part 3
Since the difference is small near the hem and large near the top, the difference dh' is calculated, and the soldering is performed at the position where this difference dh' is larger than the preset reference value M. and lead 2. Therefore, by finding the Z coordinate at this position and setting it as the height Ht of the inspection area A2, the inspection area A2 is set. Once the inspection area A2 is set, the quality of the soldering can be determined by following the same procedure as in the first embodiment. Furthermore, as shown in Fig. 9, when the solder is insufficiently wet, the height Ht of the inspection area A2 is at the position indicated by the broken line in Fig. 9, so it is detected that solder exists outside the inspection area. Then, it becomes possible to judge whether the soldering condition is good or bad.
上述のように、請求項１の発明では、印刷配線基板に挿
入されたリードの半田付は部を含むＪｌｌｌｌ定向域内
次元計測値に基づいて、測定領域内の印刷配線基板の表
面からの最大突出寸法を求め、あらかじめ設定された一
定寸法を上記最大突出寸法から減じた寸法よりも印刷配
線基板の表面からの突出寸法が小さい領域を検査領域と
し、検査領域内の半田量や半田形状に基づいて半田付は
状態の良否を判定するものであり、３次元計測値を用い
ているから、半田付は部の形状判定が正確に行えるので
ある。しかも、測定領域内において印刷配線基板の表面
からの最大突出寸法を求め、この最大突出寸法に基づい
てリードと半田とを識別することにより検査領域を設定
するから、リードの状態に影響されない検査領域内で半
田付は状態の良否が判定でき、判定精度が高くなるとい
う利点を有する。
また、請求項２の発明では、印刷配線基板に挿入された
リードの半田付は部を含む測定領域内の３次元計測値に
基づいて、印刷配線基板の表面からの測定領域内での突
出量の変化率を求め、あらかじめ設定された基準値と上
記変化率との大小関係に基づいて検査領域を設定し、検
査領域内の半田量や半田形状に基づいて半田付は状態の
良否を判定するものであり、測定領域内での印刷配線基
板の表面からの突出量の変化率に基づいて検査領域を設
定するから、半田付は部が複雑な形状でもリードとの識
別が可能となり、半田付は状態の良否の判定精度が一層
高くなるという効果を奏するのである。As described above, in the invention of claim 1, the soldering of the leads inserted into the printed wiring board is performed based on the dimensional measurement value within the Jllll orientation area including the maximum protrusion from the surface of the printed wiring board within the measurement area. The area where the protrusion dimension from the surface of the printed wiring board is smaller than the dimension obtained by subtracting the preset constant dimension from the maximum protrusion dimension above is set as the inspection area, and based on the amount of solder and solder shape within the inspection area. Soldering is used to judge whether the condition is good or bad, and since three-dimensional measurement values are used, soldering can accurately determine the shape of a part. Moreover, since the inspection area is set by determining the maximum protrusion from the surface of the printed wiring board within the measurement area and identifying leads and solder based on this maximum protrusion, the inspection area is not affected by the condition of the leads. Among them, soldering has the advantage that it is possible to judge whether the condition is good or bad and the judgment accuracy is high. In addition, in the invention of claim 2, the amount of soldering of the leads inserted into the printed wiring board is determined based on the three-dimensional measurement value within the measurement area including the portion, and the amount of protrusion within the measurement area from the surface of the printed wiring board. The rate of change of is determined, an inspection area is set based on the magnitude relationship between a preset reference value and the rate of change, and the quality of the soldering is determined based on the amount of solder and solder shape within the inspection area. Since the inspection area is set based on the rate of change in the amount of protrusion from the surface of the printed wiring board within the measurement area, it is possible to identify the soldering part from the lead even if the part has a complicated shape. This has the effect of further increasing the accuracy of determining whether the condition is good or bad.
第１図は本発明の実施例１を示す概略構成図、第２図は
同上の動作説明図、第３図および第４図は同上における
半田付は状態と検査領域との関係を示す動作説明図、第
５図および第６図は同上の動作説明図、第７図は同上の
半田付は状態と差分の変化との関係を示す動作説明図、
第８図は本発明の実施例２を示す動作説明図、第９図は
同上における半田付は状態と検査領域との関係を示す動
作説明図である。
１・・・印刷配線基板、２・・・リード、３・・・半田
付は部、Ａ１・・・測定領域、Ａ２・・・検査領域。FIG. 1 is a schematic configuration diagram showing Embodiment 1 of the present invention, FIG. 2 is an explanatory diagram of the same operation as above, and FIGS. 3 and 4 are operation explanations showing the relationship between the soldering state and the inspection area in the same as above. 5 and 6 are explanatory diagrams of the same operation as above, and FIG. 7 is an explanatory diagram of operation showing the relationship between the soldering state and the change in difference,
FIG. 8 is an explanatory diagram of the operation showing the second embodiment of the present invention, and FIG. 9 is an explanatory diagram of the operation showing the relationship between the soldering state and the inspection area in the same as above. DESCRIPTION OF SYMBOLS 1...Printed wiring board, 2...Lead, 3...Soldering part, A1...Measurement area, A2...Inspection area.
Claims (2)
を含む測定領域内の３次元計測値に基づいて、測定領域
内の印刷配線基板の表面からの最大突出寸法を求め、あ
らかじめ設定された一定寸法を上記最大突出寸法から減
じた寸法よりも印刷配線基板の表面からの突出寸法が小
さい領域を検査領域とし、検査領域内の半田量や半田形
状に基づいて半田付け状態の良否を判定することを特徴
とする半田付け部の外観検査方法。(1) Based on the three-dimensional measurement value within the measurement area including the soldered part of the lead inserted into the printed wiring board, the maximum protrusion dimension from the surface of the printed wiring board within the measurement area is determined, and the An area where the protrusion dimension from the surface of the printed wiring board is smaller than the dimension obtained by subtracting a certain dimension from the above maximum protrusion dimension is set as an inspection area, and the quality of the soldering condition is determined based on the amount of solder and the solder shape within the inspection area. A method for inspecting the appearance of soldered parts.
を含む測定領域内の３次元計測値に基づいて、印刷配線
基板の表面からの測定領域内での突出量の変化率を求め
、あらかじめ設定された基準値と上記変化率との大小関
係に基づいて検査領域を設定し、検査領域内の半田量や
半田形状に基づいて半田付け状態の良否を判定すること
を特徴とする半田付け部の外観検査方法。(2) Based on the three-dimensional measurement value in the measurement area including the soldered part of the lead inserted into the printed wiring board, calculate the rate of change in the amount of protrusion from the surface of the printed wiring board within the measurement area, and calculate the rate of change in advance. A soldering section characterized in that an inspection area is set based on the magnitude relationship between a set reference value and the rate of change, and the quality of soldering is determined based on the amount of solder and the shape of solder in the inspection area. Appearance inspection method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20832489A JPH0739997B2 (en) | 1989-08-12 | 1989-08-12 | Appearance inspection method for soldered parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20832489A JPH0739997B2 (en) | 1989-08-12 | 1989-08-12 | Appearance inspection method for soldered parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0372203A true JPH0372203A (en) | 1991-03-27 |
| JPH0739997B2 JPH0739997B2 (en) | 1995-05-01 |
Family
ID=16554380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20832489A Expired - Fee Related JPH0739997B2 (en) | 1989-08-12 | 1989-08-12 | Appearance inspection method for soldered parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739997B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002286430A (en) * | 2001-03-23 | 2002-10-03 | Ckd Corp | Solder printing inspection apparatus |
| JP2006184022A (en) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | Visual inspection system |
| JP2006220437A (en) * | 2005-02-08 | 2006-08-24 | Omron Corp | Substrate inspection device, method and device for setting parameter |
| JP2021067538A (en) * | 2019-10-23 | 2021-04-30 | オムロン株式会社 | Visual inspection device and visual inspection method |
-
1989
- 1989-08-12 JP JP20832489A patent/JPH0739997B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002286430A (en) * | 2001-03-23 | 2002-10-03 | Ckd Corp | Solder printing inspection apparatus |
| JP2006184022A (en) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | Visual inspection system |
| JP2006220437A (en) * | 2005-02-08 | 2006-08-24 | Omron Corp | Substrate inspection device, method and device for setting parameter |
| JP2021067538A (en) * | 2019-10-23 | 2021-04-30 | オムロン株式会社 | Visual inspection device and visual inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739997B2 (en) | 1995-05-01 |
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