JP2000315896A - Surface mounting part-fitting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for manually creating and inputting part data by automatically calculating the part data for judging whether the quality of packaged electronic parts is conforming or not and detecting the attitude for creation, and then storing the created part data. SOLUTION: By storing the part data of all kinds of electronic parts being carried by the carrying device of packaged electronic parts in a memory in advance, it is judged what type of electronic parts (b) are being retained by a fitting head 2a, when the electronic parts (b) are carried from a part supply part 1 to a part-fitting part 3 by the fitting head 2a for fitting to a printed- circuit board 4. Further, it is judged whether the quality of the part shape is conforming or not, the attitude is detected, and the detected part data is automatically calculated for retention. Based on the calculated part data, the amount of deviation for the fitting head 2a is corrected, thus fitting the electronic part (b) to a given position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component mounting machine for mounting a package type electronic component having a structure of an electrode portion formed by solder bumps or spring terminals at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, an image of an electronic component having a ball shape on a solder bump portion, such as a CSP (chip size package) or a BGA (ball grid array), or an electronic component having a solder bump of another shape has been obtained. Image,
Calculate the image data, measure the position and inspect the shape,
When calculating the center position of an electronic component or determining the quality of a component shape, a surface mounting component mounting machine that mounts the electronic component at a predetermined position on a printed circuit board uses a “ball pitch”, “ball” It was necessary to provide component shape data such as "size", "number of balls", and "ball arrangement information".

In recent years, electronic components having a ball shape in a solder bump portion have been reduced in size to a ball bump shape. A ball diameter of about 0.8 mm has been reduced to about φ0.25 mm or less as compared with the related art. The ball pitch was about 1.0 mm, but became about 0.5 mm or less. The ball arrangement, which had some regularity, became irregularly arranged.

For this reason, an operator measures actual electronic components with calipers or a measure to create component shape data such as “ball pitch”, “ball size”, “number of balls”, and “ball arrangement information”. Since the operator creates component shape data by referring to a catalog of electronic components, etc., it is not possible to measure the component shape data accurately, it takes a very long time to input data, and the burden on the operator (operator) is increased. Is large and workability is poor.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, according to the present invention, there is provided an image photographed by using a camera for photographing a packaged electronic component in which an electrode portion is constituted by solder bumps or spring terminals. By automatically calculating and creating component data (data such as “bump pitch”, “bump size”, “bump number”, “bump arrangement information”) such as the shape and dimensions of the electronic component from the information, This eliminates the need for the operator to manually create and input.

Further, according to the present invention, when a package-type electronic component having a structure of an electrode portion formed by a solder bump or a spring terminal is transported and mounted at a predetermined position on a printed circuit board, the electronic component is held by a transport means. It is another object of the present invention to automatically fetch image data such as the shape and dimensions of the electronic component, determine the shape of the electronic component, and automatically detect the attitude of the electronic component with respect to a transport unit.

[0007]

According to the present invention, there is provided a package type electronic component having a structure in which an electrode portion is formed of a solder bump or a spring terminal, at a predetermined position on a printed circuit board. Image capturing means for capturing an image of the package type electronic component, and an entire image storing image information for one frame of the entire package type electronic component captured by the image capturing means. An information storage unit that reads out image information of a specific area from the image information of one frame, and reads the package information such as bump pitch, bump size, number of bumps, and bump arrangement information of a solder bump portion of the electronic component. Component data calculating means for automatically calculating and creating component data for determining the quality of the electronic component and detecting the orientation of the component; The surface mount component placement machine, characterized in that it comprises a component data storage means for storing component data generated by the component data calculation means.

Further, in a surface mount component mounting machine for mounting a package type electronic component having a structure of an electrode portion composed of solder bumps or spring terminals at a predetermined position on a printed circuit board, an image of the package type electronic component is displayed. Photographing means for photographing, whole image information storing means for storing image information for one frame of the entire packaged electronic component photographed by the photographing means, and a specific area from the image information for one frame Read out the image information of
Automatically calculate and create component data such as bump pitch, bump size, number of bumps and bump arrangement information of the solder bump portion of the electronic component, for determining the quality of the package type electronic component and detecting the attitude. Component data calculation means, component data storage means for storing the component data created by the component data calculation means, and conveyance to a predetermined position on a printed circuit board held on a stage on which the electronic components of the component supply unit are assembled Means for calculating a shift amount between a reference position of the electronic component and a reference position of the transfer means in a state where the electronic component is held by the transfer means based on the component data; Correction value calculating means for calculating a correction value for mounting the electronic component at a predetermined position on the printed circuit board based on the amount The surface mount component placement machine, characterized in that it comprises a.

Further, the multi-valued image data is binarized at a certain threshold to generate binarized image data.
The surface mount component mounting machine is characterized in that the surface mount component mounting machine further comprises a whole image information storage unit that detects a block of a bright area by performing labeling processing on the valued image data and stores image information for labeling each block. .

[0010]

In the component data recording apparatus for electronic parts having the above-mentioned structure, one frame of image information of the electronic component photographed by the photographing means is stored in the storage means, and the electronic part information is stored from the stored image information. Component data (“bump pitch”, “bump size”, “bump number”, “bump arrangement information”, etc.) for detecting the attitude of the electronic component, such as the shape and dimensions, are automatically calculated and created. . Therefore, there is no need for the operator to manually input the component data, and the efficiency of the component data creation operation can be greatly increased.

Further, in the electronic component conveying and assembling apparatus having the above-described configuration, by comparing the component data recorded in the memory with the image data of the electronic component in the process of being actually conveyed, the Automatic detection of whether electronic components of any kind are being conveyed, "whether or not the electronic components are good or bad" and "whether or not they are held in a predetermined position with respect to the conveyance means" The electronic component can be accurately positioned with respect to the printed circuit board on which the electronic component is to be mounted based on the detected shift amount.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic view showing a component transporting process in which an electronic component b is transported from a component supply unit 1 to a component mounting unit 3 by a transport unit 2. The electronic component b is formed by encapsulating an IC chip in a package of resin or ceramic. For example, as shown in FIG. 4, a square main body Ca and a large number of solder bumps Cb projecting from the lower surface thereof are formed. The electronic component b is mounted on the printed circuit board 4 held by the component mounting section 3 by the transport device 2.

The transfer device 2 has a mounting head 2a, and a suction nozzle 5 having an opening for vacuum suction is provided at the lower end surface of the mounting head 2a. As shown in (1), the electronic component b is suction-held on the lower end surface.

The transport device 2 includes a component supply unit 1 and a component mounting unit 3
And the mounting head 2a moves in the vertical direction, that is, the Z-axis direction, and moves in the vertical direction, that is, the Z-axis direction.
Move in the direction in which is rotated, that is, in the θ direction. Therefore, the electronic component b is moved as shown by the movement locus 6 in FIG.

A camera 7 for photographing the electronic component b is disposed between the component supply section 1 and the component mounting section 3 so as to face the mounting head 2a. As shown in FIGS. 2 and 3, the camera 7 is moved by the transport device 2 together with the mounting head 2a.
The mounting head 2a moving or stopping with respect to the mounting head 2a while traveling or stopping with respect to the mounting head 2a as detecting means 10 including the camera 7, the illuminating lamp 8 and the light image incident means 9;
This is for photographing the electronic component b sucked and held by the suction nozzle 5 attached to the camera.

FIG. 5 is a block diagram showing a control circuit of the component conveying apparatus. Image information from the camera 7 is processed by an image processing CPU 12 in an image processing apparatus 11 to perform signal processing.
Two-dimensional image data for a frame is stored in the image memory 13. This image processing CPU 12 is a main CPU 14.
, And further connected to a CRT 15 for image processing.

The mounting head drive unit for driving the mounting head 2a in the Z-axis direction and the θ-axis direction as described above includes:
A control signal is sent from the main CPU 14 via the motor driver 17, and the X and Y
A control signal is sent from the main CPU 14 via a motor driver 19 to a transport device drive unit 18 for driving in the axial direction.

The component data of the electronic component b mounted on the printed circuit board 4 is obtained by photographing with a camera 7 shown in FIG.
The image information for a frame is obtained by first storing the image information in the image memory 13 and processing the image information. For example, in the case of the electronic component b shown in FIG. 4, dimensions and the like indicated by reference numerals A to F are the component data to be read.

FIG. 6 is a flowchart showing a procedure for saving component data. First, in step S1, the CSP
Image data obtained by capturing image information of electronic parts having a ball shape on solder bumps, such as solder and BGA, is 25 pixels per pixel.
Since it is stored as a numerical value representing the brightness of six gradations, the multi-valued image data stored at 256 gradations is binarized by a certain threshold value to create binarized image data. .

Next, in step S2, as shown in FIG. 7 (a), the binarized image data obtained in step S1 is subjected to labeling processing to detect clusters in a bright area and label each cluster. .

In step S3, as shown in FIG. 7B, the vertical and horizontal sizes of the detected block are checked, and blocks other than the ball shape are excluded from the image data.

In step S4, as shown in FIG. 7C, the center position of each labeled block is set as the ball center position coordinates.

In step S5, as shown in FIG. 7D, the average of the vertical and horizontal sizes of all the blocks is calculated as "ball size".
Is determined.

In step S6, as shown in FIG. 7 (e), the multi-valued image data is subjected to projection processing in the vertical and horizontal directions to create projection data in the vertical and horizontal directions.

In step S7, as shown in FIG. 7 (e), a place where data other than 0 is continuous in the vertical projection data is determined as a ball, and the approximate horizontal ball pitch and the vertical Determine the ball position.

In step S8, as shown in FIG. 7 (e), a portion where data other than 0 is continuous in the horizontal projection data is determined to be a ball, and the approximate vertical ball pitch and the horizontal Determine the ball position.

In step S9, as shown in FIG. 7 (f), an area determination matrix line position is determined from the approximate horizontal ball pitch, the approximate vertical ball pitch, the vertical ball position, and the horizontal ball position. It is checked whether or not the ball center position exists in all the areas partitioned by the respective matrix lines, and the result is stored in the “ball arrangement data”.

In step S10, the "horizontal ball pitch" and the "vertical ball pitch" are calculated and determined from "ball arrangement data" and "ball center position coordinates".

In step S11, "the number of horizontal balls" and "the number of vertical balls" are determined from the "ball arrangement data".

The part data obtained in this way is
Processing is performed on the data that can be stored in step S12, and in step S13, it is determined whether the data is correct as part data.

If the component data is not accurate, an error is displayed on the CRT 15 in step S14, and if it is determined that the component is correct, the component data is displayed on the CRT 15 in step S15 and the image is displayed. It is stored in the memory 13. The component data may be saved in a storage medium such as a floppy disk without being saved in the image memory 13.

FIG. 8 shows an image processing algorithm for automatically calculating and creating component data for determining the quality of a package type electronic component and for detecting the attitude.

The component data of all types of electronic components to be transported using the electronic component transport device shown in FIG. 1 is stored in the memory in advance by the above-described procedure, and the component is supplied by the mounting head 2a. When the electronic component b is transported from the unit 1 to the component mounting unit 3 and mounted on the printed circuit board 4,
It is determined what kind of electronic component b is held by the mounting head 2a, and the quality of the component is determined. Further, the shift amount with respect to the mounting head 2a is corrected, and the electronic component b is mounted at a predetermined position.

In addition, as shown in FIGS. 9 (a) and 9 (b), the structure of the electrode portion is a wafer type CS as a package type electronic component constituted by spring terminals.
There is a "Direct Rambus" module 20 using P technology "MOST: Microspring on Silicon Technology".

The most significant feature of the MOST is that a micro-spring 21 is used on the wafer. This device is also used when the micro-spring 21 and the board 22 are connected by soldering and the module 20 is finished.

The following five effects can be obtained by the micro spring 21. (1) Due to elasticity, stress at the time of mounting the board can be reduced, and connection reliability can be improved. (2) Heat dissipation can be reduced, thereby reducing the number of heat sinks. (3) The rewiring pattern can be changed according to the S-shaped bending method. (4) The impedance can be optimized by the length and shape, and the electrical characteristics can be improved. (5) There is a possibility that soldering can be made unnecessary by metal bonding. That is the point.

[0038]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows. (1) Automatically processing image information of an electronic component obtained by photographing component data for detecting the posture of the electronic component, such as the shape and dimensions of a packaged electronic component such as a CSP or a BGA, by a photographing unit. Therefore, it is not necessary for the operator to create the component data in advance, and the efficiency of creating the component data is greatly improved, and the burden on the operator is greatly reduced. (2) From package electronic components such as CSP and BGA to be actually mounted, component data for detecting the posture of the electronic component of the shape and dimensions is automatically calculated and created. It is no longer necessary to use the input component data, and it is possible to completely avoid a trouble caused by a dimensional difference between the component data and the actual electronic component. (3) Since the transport device for transporting and assembling a package type electronic component such as a CSP or BGA onto a printed circuit board has a function of storing component data of the electronic component, the stored component data and the actually transported electronic component are stored. Compare with parts,
It is possible to determine whether the electronic component to be conveyed is appropriate. (4) By using the component data, it is determined whether the electronic component held by the transport device is held at a desired position with respect to the transport device and how much the electronic component is shifted from the desired position. The electronic component can be discriminated, and when the electronic component is mounted on the printed circuit board, the shift amount can be corrected and the electronic component can be mounted at a desired position.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an apparatus for transporting and assembling an electronic component having a ball shape on a solder bump portion such as a CSP or a BGA according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of a mounting head unit of the electronic component conveying and assembling apparatus.

FIG. 3 is a diagram showing a relationship between a mounting head and a camera in FIG. 1;

FIG. 4 is a conceptual diagram showing an example of an electronic component having a ball shape on a solder bump portion such as a CSP or BGA and a list of component data.

FIG. 5 is a block diagram showing a control circuit of the device for transporting and assembling electronic components.

FIG. 6 is a main flowchart showing a procedure for saving component data.

FIG. 7A is an explanatory diagram of step S2 in FIG.

FIG. 7B is an explanatory diagram of step S3 in FIG.

FIG. 7C is an explanatory diagram of step S4 in FIG.

FIG. 7D is an explanatory diagram of step S5 in FIG.

FIG. 7 (e) shows steps S6 to S in FIG.
FIG. 8 is an explanatory diagram of FIG.

FIG. 7 (f) is an explanatory diagram of step S9 in FIG.

FIG. 8 is a diagram illustrating an image processing algorithm.

FIG. 9 (a) is a diagram showing that a microspring and a board are soldered using a normal surface mounting line to finish the module.

FIG. 9B is an external view of a micro spring.

[Explanation of symbols]

 b Electronic component Ca Mold portion Cb Lead portion 1 Component supply portion 2 Transfer device 2a Mounting head 3 Component mounting portion 4 Printed circuit board 5 Suction nozzle 6 Movement trajectory 7 Camera (photographing means) 8 Illumination lamp 9 Optical image incidence means 10 Detection means 11 Image processing device 12 Image processing CPU 13 Image memory 14 Main CPU 15 CRT 16 Mounting head drive unit 17 Motor driver 18 Transport device drive unit 19 Motor driver 20 Module 21 Micro spring 22 Board

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F065 AA03 AA07 AA16 AA23 AA26 AA61 CC26 CC27 FF04 FF26 JJ03 JJ26 LL12 PP22 QQ04 QQ24 SS02 SS04 SS13 TT01 TT03 5E313 AA01 AA11 CC03 CC04 EE02 FF03 EE24 FF24

Claims (3)

[Claims] 1. A surface mount component mounting machine for mounting a package type electronic component having a structure of an electrode portion formed of a solder bump or a spring terminal at a predetermined position on a printed circuit board, wherein an image of the package type electronic component is displayed. Photographing means for photographing, whole image information storing means for storing image information for one frame of the entire packaged electronic component photographed by the photographing means, and a specific area from the image information for one frame Of the package-type electronic component and automatically detects component orientation data such as bump pitch, bump size, number of bumps, and bump arrangement information of the solder bump portion of the electronic component. Data calculating means for performing the computation by means of a component, and a component for storing the component data produced by the component data computing means A surface mount component mounting machine comprising: a data storage unit. 2. A surface mount component mounting machine for mounting a package type electronic component having a structure of an electrode portion formed of a solder bump or a spring terminal at a predetermined position on a printed circuit board, wherein an image of the package type electronic component is displayed. Photographing means for photographing, whole image information storing means for storing image information for one frame of the entire packaged electronic component photographed by the photographing means, and a specific area from the image information for one frame Image data of the package-type electronic component, such as the bump pitch, bump size, number of bumps, and bump arrangement information of the solder bump portion of the electronic component, and automatically detects the component data for detecting the attitude of the package-type electronic component. Data calculating means for performing the computation by means of a component, and a component for storing the component data produced by the component data computing means Data storage means, transport means for transporting electronic components of a component supply unit to a predetermined position on a printed circuit board held on a stage on which the electronic components are assembled, and a state in which the electronic components are held by the transport means based on the component data And a shift amount calculating means for calculating a shift amount between a reference position of the electronic component and a reference position of the transport means, and mounting the electronic component on a predetermined position on the printed circuit board based on the shift amount. And a correction value calculating means for calculating a correction value at the time of mounting. 3. The multi-valued image data is divided into two at a certain threshold value.
Binarizing image data by performing binarization processing, labeling processing of the binarized image data, detecting clusters of bright areas, and storing image information for labeling each cluster; The surface mount component mounting machine according to claim 1 or 2, further comprising means.