JP2587998B2 - Appearance inspection device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection device, and more particularly to a visual inspection technology for a semiconductor device, for example, a semiconductor integrated circuit device (hereinafter, referred to as a semiconductor integrated circuit device having a surface mount type package). The technology relates to a technique that is effective for performing an inspection on the appearance of an IC.

[Conventional technology]

Generally, mini square package (MSP), quad
Some packages include a package having outer leads arranged on four sides, such as a flat package (QFP) and a flat pack package (FPP).

When an appearance inspection is performed on an IC provided with such a package, an inspection is performed on a mark displayed on a front surface (first main surface) of the package, and a chip or a crack generated on the front surface of the package. Various kinds of appearance inspections such as inspection for damage such as described above, inspection for damage generated on the back surface (second main surface) of the package, and inspection for bending of the outer leads are performed. Such a visual inspection covers a wide variety of inspection items and the details of the inspection are delicate, and thus are generally performed by human observation.

As a method of automatically inspecting the appearance of the outer leads of an IC, there is a technique disclosed in Japanese Patent Application Laid-Open No. 57-91458, for example. In this visual inspection method, when transferring an IC having a plurality of leads in a chute,
In this method, the lead of the IC is orthogonal to the transfer direction, the base of the lead and the tip of the lead are detected, and the passage time of the tip with respect to the base of the lead is measured to detect the lead bending.

[Problems to be solved by the invention]

However, in the case where the visual inspection of the IC as described above is performed by human observation, the number of visual inspection personnel must be increased each time the production of the IC is increased, which causes practical difficulties.

It is an object of the present invention to provide a visual inspection apparatus capable of automatically and highly accurately performing a visual inspection on an inspection object.

[Means for solving the problem]

The outline of a representative invention among the inventions disclosed in the present application will be described as follows.

That is, the appearance inspection device is an imaging device that images a main surface of a flat-plate-shaped inspection object, and a damage inspection device that inspects the main surface for damage based on an image signal of the main surface from the imaging device. And the damage inspection device comprises:
When inspecting the main surface for damage based on the image signal from the imaging device, the binarization threshold is changed while counting the white area of a predetermined range set in advance on the main surface, and the predetermined threshold is changed. 2 when the white area of the image reaches a predetermined value set in advance
It is configured to obtain a binarized image using a binarization threshold.

In addition, the appearance inspection device inspects an imaging device that images an inspection object in which a plurality of outer leads are aligned on at least one side surface of a flat plate shape, and inspects a bending of the outer leads based on an image signal from the imaging device. A lead bending inspection device, wherein the lead bending inspection device recognizes the position and orientation of the main surface based on an image signal of the main surface including the outer lead group row from the imaging device, The virtual position of the tip of the outer lead is obtained by recognition, while the actual position of the tip of the outer lead is recognized based on the image signal from the imaging device, and the outer lead is inspected for bending by comparing both positions. It is configured to be.

[Action]

According to the first visual inspection apparatus described above, the shape of the main surface is stably measured irrespective of the state of the main surface (such as gloss or satin finish) of the object to be inspected. It can be executed with high precision. In addition, since complicated and sophisticated structures and processes such as a contrivance for the illumination system and multi-value image processing can be omitted, damage inspection can be performed quickly and easily.

According to the second visual inspection apparatus described above, the virtual position of the outer lead is obtained based on the position and orientation of the main surface of the inspection object, and the bending of the outer lead is inspected by comparing the virtual position with the actual position of the outer lead. Therefore, the accuracy of the lead bending inspection can be significantly improved as compared with the case where only the positional relationship between adjacent outer leads is measured.

〔Example〕

FIG. 1 is a perspective view of an essential part showing an appearance inspection apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the appearance, and FIG. 3 and subsequent figures are explanatory views for explaining the operation of each part. is there.

In this embodiment, the appearance inspection apparatus according to the present invention is MS
It is configured to perform an appearance inspection on P · IC1. The MSP · IC 1 as an object to be inspected includes a resin-sealed package 2 formed in a substantially square flat plate shape, and is bent and formed in a bad wing shape on four sides of the package 2. A plurality of outer leads 3 are arranged in a row in a row with their tips aligned, and one end face (hereinafter, referred to as the
The second main surface. ) Side. Also,
On the first main surface 2a of the package 2, a mark 4 for specifying the product is displayed by an appropriate means such as printing.

In the present embodiment, the MSP / IC appearance inspection apparatus 10 includes a machine base 11, and the machine base 11 is configured to be movable by casters 12. A loading device 13 is provided at one end of the machine base 11, and the loading device 13 is configured to pay out one MSP / IC1 to be inspected from now on. That is, the machine base 11 is provided so that the rotor 14 can rotate intermittently in a horizontal plane, and the rotor 14 is a magazine (hereinafter, referred to as an actual magazine) in which a number of MSPs / ICs 1 to be inspected are stored. It is configured so that a plurality of 15 can be held. The actual magazine 15 is formed in a substantially square cylindrical shape which is larger than the package 2 of the MSP / IC1 to be stored, and a large number of the MSP / IC1s, the first main surface of the package 2 (front end surface). 2a are arranged so as to face upward, and are stored so as to be stacked. A plurality of actual magazines 15 are arranged on the rotor 14 at equal intervals in the circumferential direction on a concentric circle of the rotation center of the rotor, are vertically erected, and are detachably held. Further, a push rod 16 is provided on the machine base 11 so as to face one of the actual magazines 15 held by the rotor 14 so as to move up and down. The push rod 16 is attached to the actual magazine 15. MSP ・ I inserted and stored in it
It is configured to sequentially push up C1 to one pitch corresponding to one piece.

On the machine base, a beam part 17 is installed so as to be spaced upward from the upper surface of the machine base 11, and a first handler 18 is provided on the beam part 17 for the loading device 13, a first inspection station and a reversing station described later. It is equipped to correspond.
That is, the first handler 18 is provided with an operating arm 19, which is located directly above the push rod 16, between a first inspection station and a reversing station, which will be described later, and a guide device and a suitable driving device (shown in FIG. 1). ) To move three-dimensionally. A vacuum suction head 20 is mounted on the distal end of the operation arm 19, and the head 20 is configured to hold the MSP / IC1 by vacuum-suctioning the first main surface of the package 2 of the MSP / IC1. Have been.

On the machine base 11, a first inspection station 21 is arranged and set on one side of the loading device 13. In this station 21, the first inspection station 21 of the package 2 in the MSP / IC1 is set.
The mark 4 displayed on the main surface 2a and the damage such as chipping or cracking generated on the first main surface 2a are respectively inspected.

That is, the first inspection station 21 on the machine base 11
A vacuum suction chuck 22 is provided at the corresponding position of
This chuck 22 is the second main surface 2b of the package 2 of the MSP / IC1.
Is configured so that MSP · IC1 can be retained by vacuum suction. On both sides of the chuck 22, a pair of positioning members 23, 23 are provided so as to advance and retreat in the radial direction. Both positioning members 23, 23 are formed at their distal ends in a substantially V-shape, respectively. The package 2 is configured to mechanically position the MSP · IC 1 at a preset reference position by sandwiching a pair of diagonals of the package 2 symmetrically from both sides.

Right above the vacuum suction chuck 22 of the first inspection station 21, a television camera (hereinafter, referred to as a first camera) as a first imaging device is provided.
It is called a camera. ) 24 is provided, and the first camera 24 is configured to be able to take an image of the entire first main surface side of the MSP · IC1 held by the chuck 22. The first camera 24 has the first
The damage inspection device 25 is electrically connected, and is configured to inspect the first main surface 2a of the package 2 of the MSP / IC 1 for damage such as chipping or cracking by an operation described later. Have been.

Further, a mark inspection device 26 is electrically connected to the first camera 24, and the mark inspection device 26 inspects the quality of the mark 4 displayed on the first main surface 2a of the package by an operation described later. It is configured to be.

On the machine base 11, a reversing station 30 is arranged and set on one side of the first inspection station 21 opposite to the loading device 13 side.
P · IC1 is configured to be turned upside down. That is, at a corresponding position of the reversing station 30 on the machine base 11, a rotating shaft 31 is horizontally mounted on a shaft, and is provided so as to be reciprocated 180 degrees by a suitable driving means such as a motor. A reversing arm 32 is supported by the shaft 31 so as to rotate integrally. A vacuum suction head 33 is provided at one end of the reversing arm 32, and the head 33 vacuum-adsorbs the second main surface 2b of the package 2 of the MSP / IC 1 to form a MS.
It is configured to hold P · IC1.

In the beam section 17, a second handler 34 is provided with a reversing station 30.
And it is equipped to correspond to the second and third inspection stations described later. That is, the second handler 34 includes an operation arm 35, and this arm 35 is
The position of the vacuum suction head 33 in the inverted position of the above, the position of the vacuum suction chuck of the second inspection station, and the third position
It is configured to be moved three-dimensionally between the position of the vacuum suction chuck of the station and a guide device and a suitable driving device. A vacuum suction head 36 is attached to the tip of the operation arm 35, and this head 36 is an MSP.
The configuration is such that the second main surface 2b of the package 2 of the IC1 is held by vacuum so that the MSP • IC1 can be held.

A second inspection station 40 is set on one side of the machine stand 11 and the beam portion 17 opposite to the first inspection station 21 of the reversing station 30. In this second inspection station, the MSP as the object to be inspected is set. -It is configured so that the electrical characteristics of IC1 are inspected.

That is, a socket device 41 is provided at a position corresponding to the second inspection station 40 of the beam portion 17, and the socket device 41 is provided.
A tester 42 is electrically connected to 41. This socket device 41 is an MS which is lifted by a vertical motion device described later.
By inserting the group of outer leads 3 of the PIC1, the tester 42 is electrically connected to the electronic circuit of the MSPIC1. A cylinder device 43 including a cylinder device or the like is provided immediately below the socket device 41 of the machine base 11, and a vacuum suction chuck 44 is provided at an upper end of the cylinder device 43. A pair of positioning members 45, 45 are provided on both sides of the substantially bottom dead center position of the cylinder device 43 so as to advance and retreat in the radial direction.
-It is configured to position the MSP-IC1 by sandwiching the diagonal of the package 2 of the IC1 from both sides.

Further, a third inspection station 50 is provided on
In the third inspection station 50, the second main surface 2b of the package 2 in the MSP / IC 1 as the object to be inspected is set to be arranged on one side of the inspection station 50 opposite to the reversing station 30. The generated damage such as chipping or cracking, and the bending of the outer lead 3 are each inspected.

That is, the third inspection station 50 on the machine base 11
The vacuum suction chuck 51 is installed at the corresponding position of
This chuck 51 is the first principal surface 2a of the package 2 of the MSP / IC1.
Is configured so that MSP · IC1 can be retained by vacuum suction. On both sides of the chuck 51, a pair of positioning members 52, 52 are provided so as to advance and retreat in the radial direction. Both the positioning members 52, 52 have their V-shaped ends formed substantially in a V-shape. The package 2 is configured to position the MSP · IC 1 at a preset reference position by sandwiching a pair of diagonals of the package 2 symmetrically from both sides.

Right above the vacuum chuck 51 of the third inspection station 50, a television camera (hereinafter, referred to as a second camera) as a second imaging device is provided.
It is called a camera. ) 53 is provided, and the second camera 53 is configured to photograph the MSP · IC1 held by the chuck 51. A second damage inspection device 54 is electrically connected to the second camera 53, and the inspection device 54 performs an operation described below to cause the second main surface 2b of the package 2 of the MSP / IC 1 to operate.
It is configured to inspect chips, cracks and the like in. Further, a lead bending inspection device 55 is electrically connected to the second camera 53, and the inspection device 55 is configured to inspect the bending of the outer lead 3 of the MSP IC 1 by an operation described later. I have.

The beam section 17 is provided with a third handler 61 corresponding to the third inspection station 50 and an unloading device described later. That is, the third handler is provided with an operation arm 62. The arm 62 moves between the position of the vacuum suction chuck 51 of the third inspection station 50 and the position of each empty magazine in the unloading device, and a guide device and an appropriate arm. It is configured to be appropriately moved three-dimensionally by a simple driving device. A vacuum suction chuck 63 is attached to the tip of the operation arm 62, and this chuck 63
The second main surface 2b of the package 2 of the MSP • IC1 is configured to be able to hold the MSP • IC1 by vacuum suction.

At the end opposite to the loading device 13 on the machine base 11, an unloading device 70 is provided, and the unloading device converts the MSP / IC1 that has been inspected into a non-defective product storage magazine 71 according to the inspection result. , Magazine 72 for storing lightly defective products
And it is configured to be able to pay out to the heavy defective article storage magazine 73 respectively. That is, the machine base 11 is provided with three rotors (all not shown) arranged so as not to interfere with each other and capable of intermittent rotation in a horizontal plane, and each rotor has a plurality of empty magazines. It is configured such that it can be held in the same manner as the loading device.

 Next, the operation will be described.

First, in the loading device 13, the MSP / IC 1 stored in the actual magazine 15 is pushed up to a predetermined height position by the push rod 16, and the first main surface 2 a of the package 2 is moved by the vacuum suction head 20 of the first handler 18. Is held by suction. The MSP · IC 1 held by the head 20 is transferred to the first inspection station 21 by the first handler 18.

In the first inspection station 21, the MSP IC 1 is positioned at the standard position by sandwiching the diagonal of the package 2 between the pair of positioning members 23,23. If necessary, the MSP · IC 1 is vacuum-sucked and held by the vacuum suction chuck 22.

After the positioning, the MSP / IC 1 is photographed by the first camera 24, and the first damage inspection device 25 performs the following operation based on the image signal and the first principal surface 2a of the package 2 as follows.
A visual inspection is performed for.

First, a damage inspection method for the first main surface 2a of the package 2 executed in the first inspection station 21 will be described. FIG. 3 schematically shows the procedure of this inspection method.

After the MSP / IC1 is mechanically positioned, the first camera 24
As shown in FIG. 4A, when an image signal is input to the first damage inspection device 25, the damage inspection device 25 uses a signal such as a tab suspension lead as shown in FIG. Reference positions 25a, 25a preset in
Is recognized.

Next, as shown in FIG. 4 (b), the binarization threshold is reduced until the screen in the predetermined range 25b of the package 2 becomes a white screen. Here, the present inventor
By lowering the value threshold and making the screen on the actual surface of the package 2 a white screen, we discovered a phenomenon in which the screen on the vacant part such as cracks or chips generated in the package 2 became black, and focused on this phenomenon. This was used for the damage inspection according to the present example. The optimum binarization threshold at this time is automatically set while calculating the white area of the predetermined range 25b at the center of the package 2, so that it is hardly affected by the state of the package (such as gloss or satin finish).

By the way, when the binarization threshold value is reduced below a certain level, a portion where a crack or a chip is generated also becomes a white screen.

Therefore, in the present embodiment, the area of the central portion when the entire package is properly turned into a white screen is previously determined as the predetermined range 25b by an empirical method such as an experiment or past results, and the actual 2 In the work of lowering the threshold, the white area at the center of the package is calculated, and when the counted value reaches the set value for the predetermined range 25b, the threshold is stopped from being raised, so that the optimum value is obtained. .

Subsequently, the positions of the four corner portions 25c on the first main surface 2a of the package to be inspected are calculated based on the recognized positions 25a, 25a. At this time, the reference positions 25a, 25a of the package 2 to be inspected are
The positional relationship between the first damage inspection device 25
Are registered in advance in a central processing unit (not shown).

Next, as shown in FIG. 4C, a narrow image 25d of the corner 25c is captured by the first camera 24 at each of the calculated positions.

Here, if the corner 25c of the package 2 is damaged 25e such as a crack or a chip, the surface of the package 2 becomes a white screen as shown in an image 25f shown in FIG. The portions of the damage 25e where cracks or chips have occurred appear on the black screen.

When the image of the corner portion 25c is captured, the fourth
A dictionary pattern 25g as shown in FIG. 5E and a narrow image 25d or image 2 which is an actual image from the first camera 24 are displayed.
5f is collated for image recognition. Then, the narrow image 25 shown in FIG.
When d and the dictionary pattern 25g are collated, there is no difference between the two, and therefore, it is determined to be non-defective. However, image 2 shown in FIG. 4 (d) where damage 25e has occurred in corner 25c.
When 5f and the dictionary pattern 25g are collated, there is a difference between the two, so that it is determined to be defective.

By the way, in the case of resin-encapsulated packages, the locations where damage 25e such as cracks and chips
Therefore, even if the visual inspection for the damage 25e of the package 2 is executed only for the corner portion 25c, there is hardly any trouble. However, this does not prevent the inspection according to the present embodiment from being performed at a place other than the corner portion.

In this way, the appearance inspection is performed for the damage on the first main surface 2a of the package 2, and when the damage is found and determined to be defective, it is recorded in the central processing unit as a serious defect that cannot be corrected.

By the way, conventionally, when an appearance inspection is performed for a crack or a chip of a package, the surface of the black package is image-recognized as a black as it is as a change in area or shape, and the way of applying illumination light is changed and adjusted. A technique that emphasizes the characteristics of cracks and chips is generally adopted.

However, in such a method, since the brightness level of the image captured by the TV camera changes due to a subtle difference such as the gloss of the package surface or the matte surface, it is necessary to detect a minute crack or a chip. It has been found by the present inventors that there is a problem of not being able to do this.

In the present embodiment, 2
By lowering the binarization threshold, the actual surface on the surface of the package 2 is set to a white screen, and vacant parts such as cracks and chips on the surface of the package are set to a black screen, and damage inspection is performed. The influence of the change in the luminance level due to the difference between the pears and the pear surface can be avoided.
That is, since the gloss of the package surface and the minute difference of the matte surface are substantially equalized by the lowering of the binarization threshold and absorbed, the actual surface of the package and
Only the difference between the void and the crack or chip is emphasized. And
Due to this emphasis, minute cracks, chippings, and the like are also properly determined, so that the damage inspection of the package is performed appropriately and with high precision.

 According to this embodiment, the following effects can be obtained.

(1) The shape of the package is stably measured irrespective of the state of the package surface (such as gloss or satin finish), so that damage inspection of the package can be performed with high precision and high precision.

(2) Since a complicated and sophisticated structure and processing such as a contrivance for an illumination system and multi-value image processing can be omitted, damage inspection can be performed quickly and easily.

Next, a mark inspection method executed in the first inspection station 21 will be described. The procedure of this inspection method is schematically shown in FIG.

When an image signal of the first main surface 2a to be inspected is input from the first camera 24, as shown in FIG. A preset reference mark 26a is recognized.

Subsequently, as shown in FIG. 6B, the positions 26b 'of the other marks 26b are calculated based on the position 26a' of the reference mark 26a. At this time, the positional relationship between the reference mark 26a and each of the other marks 26b is registered in the central processing unit of the mark inspection device 26 in advance.

Next, as shown in FIG. 6C, for each mark 26a or 26b whose position has been specified, the mark image and the dictionary pattern 26c are sequentially collated, whereby each mark is An inspection is performed for the quality of 26a or 26b. At this time, the dictionary pattern 26c
A mark corresponding to each mark 26a or 26b is appropriately selected. For example, it is preferable that the dictionary pattern is registered for all alphanumeric characters, and that when a product type is changed, a product name, a week code, and the like are input by operating a keyboard so as to appropriately respond.

Then, the actual mark 26a or 26b and the dictionary pattern 26
In the comparison with c, if there is a difference between the two, it is determined to be defective. Usually, a mark defect is registered in the central processing unit as a heavy defect that cannot be corrected.

When the damage and mark inspection in the first inspection station 21 is completed, the MSP in the first inspection station 21
The vacuum suction head 33 of the reversing arm 32 is vacuum-sucked to IC1. Subsequently, when the reversing arm 32 is rotated 180 degrees, M
The SP IC is inverted so that the second main surface 2b of the package 2 faces upward.

When the MSP / IC1 is turned upside down, the operation arm 35 of the second handler 34 is moved, and the vacuum suction head is moved.
36 is attracted to the second main surface 2b of the package 2 of the inverted MSP · IC1. Subsequently, the MS absorbed and held by the head 36
P · IC1 is sent to the second inspection station 40 by the second handler 34.
Transported to

In the second inspection station 40, the first main surface 2a of the package 2 with the MSP / IC1 facing downward is a vacuum chuck.
Supplied to abut 44. Subsequently, the MSP · IC 1 is mechanically positioned at the reference position by being sandwiched between the positioning members 45, 45 at the diagonal of the package 2, and is suction-held by the chuck 44.

Next, the MSP · IC1 held by the chuck 44 is raised by the operation of the cylinder device 43, and is inserted into the socket device 41 provided directly above the MSP · IC1.

When the MSP / IC1 is inserted into the socket device 41, the MSP / IC1
Is electrically connected to a tester 42 via a terminal group (not shown) of the socket device 41 and the outer lead 3. In this state, a test signal is exchanged between the MSP IC 1 and the tester 42 via the socket device 41,
A desired electrical property test is performed. If it is determined that the product is defective, the MSP / IC1 is registered in the central processing unit as a heavy defective product that cannot be corrected.

When the electrical characteristic test in the second inspection station 40 is completed, the MSP · IC1 is lowered to a predetermined position by the operation of the cylinder device 43.

Next, when the operation arm 35 of the second handler 34 is moved, the vacuum suction head 36 is lowered and the MSP · I
After being adsorbed on the second main surface 2b of the package 2 of C1, the MSP · I
C1 is transported to the third inspection station 50.

In the third inspection station 50, the MSP · IC 1 is supplied so that the first main surface 2 a facing downward contacts the vacuum suction chuck 51. Subsequently, MSP / IC1 is a positioning member 52,
After the package 2 is mechanically positioned at the reference position by sandwiching the diagonal of the package 2 by the
Held by 51.

After being positioned and held, the MSP · IC1 is photographed by the second camera 53, and the second damage inspection device 54 and the lead bending inspection device 55 use the second principal surface 2b of the package 2 based on the image signal. A damage inspection and a lead bending inspection are respectively performed.

Here, the operation of the damage inspection method on the second main surface 2b of the package 2 is similar to that of the first main surface 2a described above, and therefore, the description is omitted, and the operation of the lead bending inspection method will be described. FIG. 7 schematically shows the procedure of the lead bending inspection method.

After the MSP / IC1 is mechanically positioned, the second camera 53
As shown in FIG. 8 (a), when an image signal is input to the lead bending inspection device 55 from the base station, based on the image signal, for example, a preset reference such as a tab suspension lead or the like is used. The positions 55a, 55a are recognized.

Next, as shown in FIG. 8B, the center of the screen of the second camera 53 is determined by the recognized reference positions 55a and 55a.
The shift of the center position 55b of the package 2 from the position 53a is recognized as the XY coordinate and the inclination θ. Subsequently, the ideal position 55c of the tip of each outer lead 3 is calculated in consideration of the recognized deviation. At this time, the center position 55b of the package 2 in the MSP IC 1 to be inspected and the outer leads 3
The relationship with the ideal position 55c is registered in advance in a central processing unit (not shown) of the lead bending inspection apparatus.

When the ideal position 55c of each outer lead 3 is calculated, as shown in FIG. 8 (c), an image recognition process for each outer lead 3 is performed at each calculated ideal position 55c. In this case, the image recognition detection area 55d is set to have a relatively large area.
Then, based on this image recognition, the center of gravity position 55f of the actual outer lead image 55e in the detection area 55d is calculated.

The XY coordinates (X
f, Yf) and the YX coordinate (Xc, Yc) of the ideal position 55c are calculated, and good, light, and heavy lead bending is determined in accordance with the magnitude of the difference. Here, a light defect is a defect that can be corrected, and a heavy defect is a defect that cannot be corrected. These defective products are individually registered in the central processing unit.

When the determination of good or bad lead bending is performed by comparing dictionary patterns, as shown in FIG. 8D, the dictionary pattern 55g shown in FIG. Set aligned with 55f. Then, when the outer lead image 55e does not protrude from the range set in advance in the dictionary pattern 55g, it is determined to be good,
When it protrudes, it is determined to be defective. Also, the dictionary pattern
By changing the method of defining the range of 55 g, a light defect and a heavy defect can be distinguished.

According to the lead bending inspection method according to the present embodiment, the following effects can be obtained.

(1) Since the lead bending inspection can be realized by imaging from the side where the tip surface of the outer lead is facing, even in an IC having a surface mount type package, the lead closest to the mounting surface is used. A bend test can be performed.

(2) By detecting the reference position of the package and determining the position of the outer lead with respect to the package based on the reference position, each position of the outer lead group can be associated with the package. The amount of error can be determined, and as a result, the inspection accuracy can be dramatically increased as compared with the conventional inspection method in which only the related position between outer leads, such as the distance between adjacent outer leads, is measured. it can.

(3) The center of gravity is calculated from the actual image of the outer lead, and the deviation between the actual center of gravity position and the ideal center position of the outer lead is determined to determine the lead bending. Even if it is unstable due to variations in the cutting state of the dam or the like, this instability can be absorbed, and the accuracy of the lead bending inspection can be improved.

When the predetermined inspection is completed in the third inspection station 50 by the above-described operation, the operation of the operation arm 62 in the third handler 61 causes the vacuum suction chuck 63 to move to the second main surface 2b of the package 2 of the inspected MSP / IC1. The chuck 63 holds the MSP · IC1.

When the chuck 63 sucks and holds the MSP / IC1, the third handler 61 transfers the MSP / IC1 to the magazine 71 for storing the good product, the magazine 72 for storing the defective product, and the magazine 73 for storing the heavy product according to a command from the central processing unit. After being transported as appropriate, it is inserted into a predetermined magazine from the upper end opening and stored.

Here, as shown in FIG. 9, for example, when stored in the magazine 71, the MSP IC 1
Since the main lead 2b is inserted into the magazine 71 with the main surface 2b facing upward, the outer lead 3 is prevented from being bent and deformed. That is, as shown in FIG. 10, the first main surface
When the MSP / IC 1 is inserted into the magazine 71 with the 2a facing upward, the outer lead 3 is easily bent and deformed even if the outer lead 3 is slightly engaged with the magazine 71, but the second main surface 2b is If the MSP · IC 1 is inserted into the magazine 71 in the upward state, it is not bent even if the outer lead 3 is engaged with the magazine 71.

Thereafter, by repeating the above operation, MSP / IC
The appearance inspection for each case is performed sequentially. Incidentally, when it is determined that the first, second, and third inspection stations are severely defective, the subsequent inspection may be omitted in order to improve work efficiency.

 According to the above embodiment, the following effects can be obtained.

(1) Since the appearance inspection can be automated by performing various appearance inspections based on the image signals of the imaging device, productivity can be dramatically improved.

(2) By using the same imaging device to perform the package damage inspection and the mark inspection, it is possible to simplify the configuration of the entire device, thereby reducing equipment costs and the like. Can be

(3) In the inspection for the damage to the inspection object, when generating the image signal from the imaging device, by changing the binarization threshold while counting the white area of the actual surface of the inspection object, the optimum 2 Since a quantified image can be obtained, an inspection for damage to the inspection object can be accurately performed regardless of the state of the physical surface of the inspection object.

(4) By interposing the station for reversing the object to be inspected, the appearance inspection of the front and back surfaces of the object to be inspected can be performed as one part, so that the workability can be improved.

(5) A station for reversing an IC having a surface mount type package as an object to be inspected on a back surface is provided.
By inserting the inspected IC into the magazine with the back surface facing upward, the outer lead can be prevented from engaging with the magazine and bending when inserted, thereby suppressing the occurrence of bending failure of the outer lead. can do.

(6) By interposing an inspection station for executing the electrical characteristic test on the way, the appearance inspection and the electrical characteristic inspection can be performed as one, thereby improving workability.

(7) Recognizing the position and orientation of the inspection object based on the image signal from the imaging device, thereby obtaining the ideal position of the inspection object with respect to the leading end of the lead. On the other hand, based on the image signal from the imaging device, By recognizing the position of the lead end of the lead and checking the positions of both leads to perform the inspection for lead bending, the lead bending of the inspection object can be performed regardless of variations in the image of the lead end surface. Can be accurately performed.

Although the invention made by the inventor has been specifically described based on the embodiment, the present invention is not limited to the embodiment, and it is needless to say that various modifications can be made without departing from the gist of the invention. Nor.

For example, the mark inspection and the electrical characteristic test may be omitted.

It is desirable that the specific configuration of the handler, the positioning mechanism, the inspection object holding mechanism, and the like be appropriately selected according to the shape, structure, size, and other conditions of the inspection object.

In the above description, the case where the invention made by the present inventor is applied to the appearance inspection technology of MSP / IC, which is the application field in the background, has been mainly described. The present invention can be applied to all visual inspection devices for ICs, electronic components, electronic devices, and the like having a shape package.

〔The invention's effect〕

The effect obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows.

By performing various appearance inspections based on the image signals of the imaging device, the appearance inspections can be automated, so that productivity can be dramatically improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part showing an appearance inspection apparatus for MSP / IC according to one embodiment of the present invention, FIG. 2 is a perspective view of the appearance, FIG. 3 is a process diagram showing a damage inspection method, FIG. FIGS. (A), (b), (d), and (e) are explanatory views for explaining the operation, FIG. 5 is a process diagram showing a mark inspection method, and FIGS. 6 (a) and (b). , (C) are explanatory diagrams for explaining the operation, FIG. 7 is a process diagram showing a lead bending inspection method, and FIGS. 8 (a), (b), (c), (d), (e). 9) are explanatory diagrams for explaining the operation, and FIGS. 9 and 10 are explanatory diagrams for explaining the operation when the MSP · IC is inserted into the magazine. 1 ... MSP / IC (inspected object), 2 ... Package, 2a ...
... 1st main surface, 2b ... 2nd main surface, 3 ... outer lead, 4
... mark, 10 ... visual inspection device, 11 ... machine stand, 12 ...
Caster, 13 ... Loading device, 14 ... Rotor, 15
… Real magazine, 16… Push rod, 17… Beam,
18 first handler, 19 operating arm, 20 vacuum suction head, 21 first inspection station, 22 vacuum suction chuck, 23 positioning member, 24 first camera (first Imaging device), 25 first damage inspection device, 26 mark inspection device, 30 reversing station, 31 rotating shaft, 32 reversing arm, 33 vacuum suction head, 34
2nd handler, 35 operating arm, 36 vacuum suction head, 40 second inspection station, 41 socket device, 42 tester, 43 cylinder device, 44 vacuum chuck, 45 ...... Positioning member, 50 ... Third inspection station, 51 ... Vacuum suction chuck, 52 ... Positioning member, 53 ... Second camera, 54 ... Second damage inspection device, 55 ...
… Lead bending inspection device, 61… 3rd handler, 62 ……
Operation arm, 63 ... Vacuum suction chuck, 71: Magazine for storing good products, 72 ... Magazine for storing lightly defective products, 73 ... Magazine for storing heavy defective products.

Continuation of front page (72) Inventor Nobuo Murakami 15 Asahidai, Muroyama-cho, Iruma-gun, Saitama Prefecture Hitachi East Semiconductor Co., Ltd. (56) References JP-A-63-318748 (JP, A)

Claims (3)

(57) [Claims] An imaging device for imaging a main surface of a flat-plate-shaped object to be inspected, and a damage inspection device for inspecting the main surface for damage based on an image signal of the main surface from the imaging device. In the visual inspection device provided, when the damage inspection device inspects the main surface for damage based on an image signal from the imaging device, the damage inspection device counts a white area of a predetermined range preset on the main surface. While changing the binarization threshold value, a binarized image is obtained by the binarization threshold value when the white area of the predetermined range reaches a predetermined value. Appearance inspection equipment. 2. An imaging apparatus for imaging an object to be inspected having a plurality of outer leads arranged on at least one side surface of a flat plate, and a lead bend for inspecting the bending of the outer leads based on an image signal from the imaging apparatus. An appearance inspection device comprising: an inspection device, wherein the lead bending inspection device determines the position and orientation of the main surface based on an image signal of the main surface including the outer lead group row from the imaging device. Recognizing and finding the virtual position of the tip of the outer lead by this recognition, and recognizing the actual tip position of the outer lead based on the image signal from the imaging device, and comparing the two positions with each other to identify the outer lead. A visual inspection device configured to inspect a bending of the image. 3. A damage inspection device for inspecting the main surface for damage based on the image signal is connected to the imaging device, and the damage inspection device is configured to detect the damage based on an image signal from the imaging device. When inspecting the main surface for damage, the binarization threshold is changed while counting the white area in a predetermined range set in advance on the main surface, and the white area in this predetermined range is changed to a predetermined value set in advance. 3. The visual inspection device according to claim 2, wherein a binarized image is obtained by a binarization threshold value when the threshold value is reached.