JPWO2018100692A1 - Image processing method for electronic parts and image processing apparatus - Google Patents

Abstract

In the image processing method of the present disclosure, a figure generated when light reflected by the metal curved surface portion reaches the imaging position based on the three-dimensional CAD data of the metal curved surface portion and the direction of light irradiated to the metal curved surface portion. Create 2D data of Then, based on the two-dimensional data of the figure, the information on the metal curved surface portion obtained from the actually captured image is evaluated.

Description

  This specification discloses an image processing method and an image processing apparatus for electronic parts.

  2. Description of the Related Art Conventionally, there has been known a component mounter which samples electronic components supplied from a component supply device and mounts the collected electronic components at predetermined positions on a substrate. Among such component mounting machines, there is also known one that irradiates light onto a bump surface of an electronic component in which a plurality of bumps are arrayed to pick up an image, and obtains bump size and arrangement information from the picked up image (for example, patent document 1). On the other hand, when imaging a bump, a side-emitting light source may be used. In that case, the central portion of the bump is a curved surface, and light reflected by the central portion is difficult to enter the camera. It is also known that a part will be a dark image (for example, patent document 2).

JP 2000-315896 A JP, 2008-216140, A

  In the case of imaging a bump using a side-emitting light source, an outer peripheral portion also becomes a dark image in addition to the central portion of the bump. Therefore, in the captured image, the bumps appear as bright annular bands, but the outer diameter of the annular bands is smaller than the actual bump diameter. Because of this, the outer diameter of the annular band on the image may be uniformly set to a predetermined ratio (for example, 90%) of the actual bump diameter. However, the shape of the bumps varies depending on the type of bump. Therefore, if the outer diameter of the annular band is uniformly set to a predetermined ratio of the actual bump diameter without considering the shape of each bump, there is a possibility that the bumps on the image can not be evaluated correctly.

  The present disclosure has been made to solve the above-described problems, and has as its main object to accurately evaluate information on a metal curved portion of an electronic component.

The image processing method of the present disclosure is
The metal curved surface portion of the electronic component provided with the metal curved surface portion is irradiated with the light of the side light source and / or the inclined light source, and the metal curved surface portion irradiated with light is a predetermined imaging position facing the metal curved surface portion An image processing method for obtaining information on the metal curved surface portion based on the captured image,
Two-dimensional data of a figure generated when light reflected by the metal curved surface portion reaches the imaging position based on the three-dimensional CAD data of the metal curved surface portion and the direction of light irradiated to the metal curved surface portion And evaluating information on the metal curved surface portion obtained from the captured image based on two-dimensional data of the graphic,
It is a thing.

The image processing apparatus of the present disclosure is
The metal curved surface portion of the electronic component provided with the metal curved surface portion is irradiated with the light of the side light source and / or the inclined light source, and the metal curved surface portion irradiated with light is a predetermined imaging position facing the metal curved surface portion An image processing apparatus for obtaining information from the curved metal surface portion on the basis of the captured image;
A storage device for storing three-dimensional CAD data of the metal curved surface portion;
Two-dimensional data of a figure generated when light reflected by the metal curved surface portion reaches the imaging position based on the three-dimensional CAD data of the metal curved surface portion and the direction of light irradiated to the metal curved surface portion A controller configured to evaluate information on the metal curved surface portion obtained from the captured image based on two-dimensional data of the figure;
Equipped with

  In the image processing method and the image processing apparatus of the present disclosure, the light reflected by the metal curved surface reaches a predetermined imaging position based on the three-dimensional CAD data of the metal curved surface and the direction of the light irradiated to the metal curved surface. Create two-dimensional data of the figure to be generated when In addition, based on two-dimensional data of the figure, information on a metal curved surface portion obtained from the captured image is evaluated. The two-dimensional data of a figure is accurate data based on three-dimensional CAD data. Therefore, the information on the metal curved surface portion of the electronic component can be evaluated with high accuracy by evaluating the information on the metal curved surface portion obtained from the captured image based on the two-dimensional data of the figure.

FIG. 2 is a perspective view of the component mounting apparatus 10; FIG. 2 is a schematic explanatory view of a configuration of a part camera 40. FIG. 2 is a block diagram showing a configuration related to control of the component mounting apparatus 10. The flowchart of a component mounting process routine. Explanatory drawing of the captured image of bump 94. FIG. The flowchart of reference data creation routine. Explanatory drawing of the components 90a of the BGA package which has bump 94a. Explanatory drawing of the components 90b of the BGA package which has bump 94b. Explanatory drawing which shows the angle range of the light beam irradiated from LED48a. FIG. 14 is an explanatory view showing a state in which light irradiated to the bumps 94 a is reflected and is incident on an imaging unit 49; Explanatory drawing of the cyclic | annular band 98a. Explanatory drawing which shows a mode that the light irradiated to bump 94b is reflected and it injects into the imaging part 49. FIG. Explanatory drawing of the cyclic | annular band 98b.

  Preferred embodiments of the image processing method and image processing apparatus of the present disclosure will be described below with reference to the drawings. FIG. 1 is a perspective view of the component mounting apparatus 10, FIG. 2 is a schematic explanatory view of a configuration of the parts camera 40, and FIG. 3 is a block diagram showing a configuration related to control of the component mounting apparatus 10. In the present embodiment, the left-right direction (X axis), the front-rear direction (Y axis), and the up-down direction (Z axis) are as shown in FIG.

  The component mounting apparatus 10 includes a base 12, a mounting apparatus main body 14 installed on the base 12, and a reel unit 70 as a component supply apparatus mounted on the mounting apparatus main body 14.

  The mounting device main body 14 is exchangeably installed on the base 12. The mounting device body 14 includes a substrate transfer device 18, a head 24, a nozzle 37, a part camera 40, and a control device 60.

  The substrate transfer device 18 is a device for transferring and holding the substrate 16. The substrate transfer device 18 includes support plates 20 and 20, and conveyor belts 22 and 22 (only one is shown in FIG. 1). The support plates 20, 20 are members extending in the left-right direction, and are provided at intervals in the front and back of FIG. The conveyor belts 22, 22 are endlessly wound around drive wheels and driven wheels provided on the left and right of the support plates 20, 20. The substrates 16 are carried on the upper surfaces of the pair of conveyor belts 22, 22 and conveyed from left to right. The substrate 16 can be supported from the back side by a large number of support pins 23 set up.

  The head 24 is attached to the front of the X-axis slider 26. The X-axis slider 26 is attached to the front of the Y-axis slider 30. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. A pair of upper and lower guide rails 28, 28 extending in the left-right direction is provided on the front surface of the Y-axis slider 30. The X-axis slider 26 is slidably attached to the guide rails 28, 28. The head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26 and 30 are respectively driven by drive motors 26a and 30a (see FIG. 3). Further, the head 24 incorporates a Z-axis motor 34, and the height of the nozzle 37 attached to a ball screw 35 extending along the Z-axis is adjusted by the Z-axis motor 34. Furthermore, the head 24 incorporates a Q-axis motor 36 (see FIG. 3) for rotating the nozzle 37.

  The nozzle 37 is a member that sucks and holds components at the tip of the nozzle and releases suction of components that are sucked at the tip of the nozzle. The nozzle 37 can supply pressure from a pressure supply source (not shown), for example, suctions parts when negative pressure is supplied, and suctions parts when negative pressure supply is stopped or positive pressure is supplied. To release. The nozzle 37 protrudes downward from the bottom of the main body of the head 24. Further, the nozzle 37 is moved up and down along the Z-axis direction by the Z-axis motor 34, whereby the height of the component attracted to the nozzle 37 is adjusted. The rotation of the nozzle 37 by the Q-axis motor 36 adjusts the orientation of the component attracted to the nozzle 37.

  The parts camera 40 is disposed in front of the support plate 20 on the front side of the substrate transfer device 18. The parts camera 40 has an imaging range above the parts camera 40, and images the parts held by the nozzles 37 from below to generate a captured image. As shown in FIG. 2, the parts camera 40 includes an illumination unit 41 and an imaging unit 49.

  The illumination unit 41 emits light to the component 90 to be imaged. The illumination unit 41 includes a housing 42, a connection unit 43, an incident light source 44, a half mirror 46, and a multistage light source 47. The housing 42 is a bowl-shaped member whose upper and lower surfaces (bottom surfaces) are opened in an octagonal shape. The housing 42 has a shape in which the opening on the upper surface is larger than the opening on the lower surface, and the internal space tends to increase from the lower surface to the upper surface. The connection part 43 is a cylindrical member which connects the housing 42 and the imaging part 49. The incident light source 44 has a plurality of LEDs 45. The half mirror 46 reflects upward light from the LED 45 of the incident light source 44 in the horizontal direction. The half mirror 46 transmits light from above toward the imaging unit 49. The multistage light source 47 includes an upper stage light source 47a, a middle stage light source 47b, and a lower stage light source 47c. The upper stage light source 47a has a plurality of LEDs 48a, the middle stage light source 47b has a plurality of LEDs 48b, and the lower stage light source 47c has a plurality of LEDs 48c. The LEDs 48a to 48c all emit light in a direction inclined from the optical axis 49a. The inclination angle from the optical axis 49a in the irradiation direction of the LEDs 48a to 48c is largest for the LED 48a, and the LED 48a emits light in a substantially horizontal direction. In addition, the inclination angle of the LED 48c is the smallest. The upper-stage light source 47a emits light in a substantially horizontal direction, so it is called a side-emitting light source, and the middle-stage light source 47b emits light obliquely upward, so it is called an inclined light source.

  The imaging unit 49 generates a captured image based on the received light. The imaging unit 49 includes an optical system such as a lens (not shown) and an imaging device (for example, a CCD). When the light emitted from the incident light source 44 and the multistage light source 47 and reflected by the component to be imaged passes through the half mirror 46 and reaches the imaging unit 49, the imaging unit 49 receives this light and generates a captured image .

  As shown in FIG. 3, the control device 60 includes a CPU 61, a ROM 62, an HDD 63, a RAM 64, an input / output interface 65, and the like, which are connected via a bus 66. The control device 60 includes a substrate transfer device 18, a drive motor 26a for the X-axis slider 26, a drive motor 30a for the Y-axis slider 30, a Z-axis motor 34, a Q-axis motor 36, and pressure for the parts camera 40 and the nozzle 37. Output a drive signal to the supply source. In addition, the control device 60 inputs a captured image from the part camera 40. The controller 60 is communicably connected to the feeder controller 76 of the reel unit 70. Although not shown, each slider 26, 30 is equipped with a position sensor (not shown), and the control device 60 inputs the position information from the position sensor while the drive motor 26a of each slider 26, 30 is, Control 30a.

  The reel unit 70 includes a plurality of reels 72 and is detachably attached to the front side of the mounting apparatus main body 14. A tape is wound around each reel 72. The surface of the tape is provided with a plurality of receiving recesses along the longitudinal direction of the tape. A component is accommodated in each accommodation recess. These parts are protected by a film covering the surface of the tape. Such a tape is unwound from the reel toward the rear, and the film is peeled off at the feeder section 74 to expose the parts. The component in the exposed state is suctioned by the nozzle 37. The operation of the reel unit 70 is controlled by a feeder controller 76 (see FIG. 3).

  The management computer 80 is a computer that manages production jobs of the component mounting apparatus 10 and is communicably connected to the control device 60 of the component mounting apparatus 10. The production job is information that defines which component is mounted on which substrate 16 and in what order in the component mounting apparatus 10, and how many substrates 16 the component mounting is performed. The management computer 80 stores the production job, and outputs information included in the production job to the component mounting apparatus 10 as needed.

  Next, the operation of the component mounting apparatus 10 of the present embodiment will be described. Here, as a component, as shown in FIG. 2, a component 90 of a BGA package in which a plurality of bumps 94 are disposed on the lower surface of the main body 92 will be described as an example.

  First, the component mounting process routine will be described. FIG. 4 is a flowchart of this routine. When the component mounting processing routine is started, the CPU 61 of the control device 60 causes the component 90 to be attracted to the nozzle 37 (S100). Specifically, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 to arrange the nozzle 37 immediately above the component 90 supplied by the reel unit 70. At this time, the nozzle 37 is disposed so that the center of the nozzle 37 is right above the center of the part 90. Subsequently, the CPU 61 controls the head 24 to lower the nozzle 37 to the upper surface of the component 90 and supply a negative pressure to the nozzle 37 to cause the component 90 to be attracted to the nozzle 37.

  Next, the CPU 61 causes the part camera 40 to image the bumps 94 included in the part 90 (S110). Specifically, the CPU 61 controls the head 24 to ascend the nozzle 37 to such a height that the component 90 attracted to the nozzle 37 does not interfere with other members. Subsequently, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 to arrange the nozzles 37 on the optical axis 49 a of the part camera 40 so that the centers of the nozzles 37 coincide. Subsequently, the CPU 61 turns on only the upper light source 47a of the part camera 40, causes the part camera 40 to image the bumps 94 included in the part 90, and inputs the captured image. Since the surface of the bump 94 is a curved surface, light reflected near the center of the bump 94 does not enter the imaging unit 49. Therefore, in the image captured by the parts camera 40, as shown in FIG. 5, the bumps 94 appear as white annular bands (donut-shaped bands) 98 on the black background 96.

  Next, the CPU 61 calculates the outer diameter dr of the white annular band 98 from the captured image (S120), and uses the reference data set in advance to calculate the outer diameter dr of the annular band 98 as the outer diameter of the bumps 94. Convert to Dr (see FIG. 5) (S130). Details of the process of S130 will be described later.

  Next, the CPU 61 determines whether the converted outer diameter Dr of the bump 94 is within the appropriate range (S140). The appropriate range is a range obtained by adding an allowance set in consideration of errors, tolerances, and the like to the outer diameter of the bump 94 in design. If an affirmative determination is made in S140, the CPU 61 mounts the component 90 sucked by the nozzle 37 at a predetermined position on the substrate 16 (S150), and ends this routine. Specifically, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 to arrange the nozzles 37 immediately above the predetermined position of the substrate 16 so that the centers of the nozzles 37 coincide. Subsequently, the CPU 61 controls the head 24 to lower the component 90 absorbed by the nozzle 37 to the upper surface of the substrate 16 and supply the atmospheric pressure or positive pressure to the nozzle 37 to mount the component 90 on the substrate 16 . On the other hand, if a negative determination is made in S140, the CPU 61 displays an error message on a display not shown (S160), and ends this routine.

  Here, the reference data will be described in detail. The CPU 61 executes a reference data creation routine before executing the component mounting process routine described above. FIG. 6 is a flowchart of this routine. When the reference data creation routine is started, the CPU 61 of the control device 60 acquires three-dimensional CAD data of the component 90 stored in the HDD 63 (S200). The HDD 63 stores three-dimensional CAD data of various components (including the component 90) mounted on the substrate 16. The three-dimensional CAD data of the part 90 includes data of the outer shape of the bump 94. Data of the external shape of the bump 94 includes data (such as radius of curvature) defining the curved surface of the bump 94 in addition to the height and outer diameter of the bump 94 (diameter of a circle when the bump 94 is viewed in plan). There is. Next, the CPU 61 calculates, from the three-dimensional CAD data, an ideal image (two-dimensional data) when the light of the side-reflection light source is irradiated to the bumps 94 included in the component 90 (S210). The ideal image of the bumps 94 appears as an annular band similar to the annular band 98 of FIG. Next, the CPU 61 calculates the outer diameter of the annular band from the ideal image (S220). Next, the CPU 61 calculates the ratio of the outer diameter of the annular band to the outer diameter of the bump 94 in design as reference data, associates the reference data with the identification information of the part 90, and stores it in the HDD 63 (S230), End this routine. The identification information is information attached to distinguish the part type.

  As the component 90, for example, a component 90a of a BGA package having hemispherical bumps 94a as shown in FIG. 7 or a BGA having bumps 94b having a shape in which a semi-elliptic sphere is joined to the bottom of a cylinder as shown in FIG. There is a part 90b of the package. The bumps 94 a are formed by supplying molten solder onto the lands and solidifying them. The bumps 94 b are obtained by supplying and solidifying molten solder on a cup-shaped pan. The HDD 63 includes reference data Ra stored in association with identification information of the component 90 a and reference data Rb stored in association with identification information of the component 90 b.

  The method of obtaining the reference data Ra of the component 90a will be described below. The luminous flux emitted from the LED 48a of the upper light source 47a has a predetermined angle range as shown in FIG. Although FIG. 9 shows the light flux emitted from the LED 48a on the right side in FIG. 2 among the upper light sources 47a, the light flux emitted from the LED 48a in other places also has an angle range similar to this. When the light beam having a predetermined angle range emitted from the LED 48a is irradiated to the bump 94a, as shown in FIG. 10, only the light reflected in the direction parallel to the optical axis 49a on the surface of the bump 94a is the imaging unit 49. Incident to Therefore, the ideal image of the bumps 94a appears as a white annular band 98a on the black background 96, as shown in FIG. The outer diameter da of the annular band 98a can be accurately calculated using FIG. 10 and the three-dimensional CAD data of the bumps 94a. Therefore, the ratio Ra (reference data) of the outer diameter da of the annular band 98a to the outer diameter Da of the designed bump 94a can be accurately obtained. Here, it is assumed that Ra = da / Da = 60 (%). In the HDD 63, identification information of the component 90a and reference data Ra are stored in association with each other.

  The method of obtaining the reference data Rb of the part 90b will be described below. The luminous flux emitted from the LED 48a of the upper light source 47a has a predetermined angular range as described above. When a light beam having a predetermined angle range emitted from the LED 48a is irradiated to the bump 94b, as shown in FIG. 12, only light reflected in a direction parallel to the optical axis 49a on the surface of the bump 94b is the imaging unit 49. Incident to Therefore, the ideal image of the bumps 94b appears as a white annular band 98b on a black background 96, as shown in FIG. The outer diameter db of the annular band 98b can be accurately calculated using FIG. 12 and the three-dimensional CAD data of the bumps 94b. Therefore, the ratio Rb (reference data) of the outer diameter db of the annular band 98b to the outer diameter Db of the designed bump 94b can be accurately obtained. Here, it is assumed that Rb = db / Db = 90 (%). In the HDD 63, identification information of the component 90b and reference data Rb are stored in association with each other.

  In the above-described S130, when the identification information of the component 90 attracted to the nozzle 37 matches the identification information of the component 90a, the ratio of the outer diameter dr of the annular band 98 calculated in S120 to the reference data of the component 90a It converts into the outer diameter Dr of bump 94 of imaging object using Ra. In this case, Dr = dr / Ra ≒ 1.67 dr. In S140, it is determined whether the converted outer diameter Dr is within an appropriate range. On the other hand, when the identification information of the component 90 attracted to the nozzle 37 matches the identification information of the component 90b in S130 described above, the outer diameter dr of the annular band calculated in S120 is the reference data of the component 90b. The ratio Rb is used to convert to the outer diameter Dr of the bump 94 to be imaged. In this case, Dr = dr / Rb ≒ 1.11 dr. In S140, it is determined whether the converted outer diameter Dr is within an appropriate range.

  By the way, when the ratio of the annular belt outer diameter to the bump outer diameter is made the same in both the component 90a and the component 90b, the ratio is not a value in consideration of the actual shape of the bump. Therefore, even if the outer diameter Dr of the bump is converted from the outer diameter dr of the annular band using the ratio, the error of the outer diameter Dr of the bump becomes large. As a result, the determination accuracy as to whether the outer diameter Dr of the bump is within the appropriate range is lowered. On the other hand, in the present embodiment, the ratios Ra and Rb are values in consideration of actual bump shapes. Therefore, the outer diameter Dr of the bump obtained by converting the outer diameter Dr of the bump from the outer diameter dr of the annular band using the ratios Ra and Rb has a very small error. As a result, the determination accuracy as to whether the outer diameter Dr of the bump is within the appropriate range is enhanced.

  Here, the correspondence between the components of the present embodiment and the components of the image processing method (or the image processing apparatus) of the present disclosure will be described. The bump 94 of this embodiment corresponds to a "metal curved surface portion", the annular band 98 corresponds to a "figure", the outer diameter of the bump 94 corresponds to "information on a metal curved surface portion", and the ratios Ra and Rb are " It corresponds to "reference data".

  In the embodiment described above, based on the three-dimensional CAD data of the bumps 94 and the direction of the light irradiated to the bumps 94, an annular band 98 generated when the light reflected by the bumps 94 reaches the imaging unit 49. Create 2D data of Also, based on the two-dimensional data of the annular band 98, ratios Ra and Rb which are reference data are created. Then, the outer diameter dr of the annular band 98 obtained from the captured image is evaluated using the ratios Ra and Rb. Each ratio is accurate data based on three-dimensional CAD data of each part. Therefore, the outer diameter Dr of the bump 94 of the component 90 can be evaluated with high accuracy.

  Also, although the bumps 94 are generally hemispherical or near in shape, there are various shapes in detail. Therefore, even if the outer diameters of the three-dimensional CAD data of the plurality of types of bumps 94 are the same, the outer diameter of the annular band 98 after conversion into two-dimensional data may be different. Therefore, the significance of creating the ratios Ra and Rb using the three-dimensional CAD data of each bump 94 is high.

  It is needless to say that the present invention is not limited to the above-mentioned embodiment at all, and can be implemented in various modes within the technical scope of the present invention.

  For example, in the above-described embodiment, the bump of the BGA package component is exemplified as the metal curved portion, but the invention is not particularly limited thereto. For example, the pin electrode of the PGA package component may be used. It may be a lead (but a lead having a curved portion). Since the tip of the pin electrode is a curved surface, an annular band appears in the captured image when the side-reflection light source is irradiated, like the above-described bump. Further, since the curved portion of the lead having the curved portion is also a curved surface, a linear band appears in the captured image when the side-emitting light source is irradiated. Therefore, even in the case of adopting a lead having a pin electrode or a curved portion instead of the bump, the same effect as that of the above-described embodiment can be obtained.

  In the component mounting process routine (FIG. 4) of the embodiment described above, S130 is omitted, and instead of determining whether the outer diameter Dr of the bump 94 is within the appropriate range in S140, the outer diameter dr of the annular band is within the appropriate range It may be determined whether or not. In this case, before executing the component mounting process routine, the annular band outer diameter calculation routine is performed instead of the reference data creation routine (FIG. 6). The annular band outer diameter calculation routine is the one in which S230 of the reference data creation routine is omitted (that is, S200 to S220). Whether or not the outer diameter dr of the annular band is within the appropriate range is determined based on whether or not the outer diameter dr of the annular band is within the allowable range of the outer diameter of the annular band obtained from the ideal image. The outer diameter of the annular zone obtained from the ideal image is accurate data based on three-dimensional CAD data. Therefore, even in this manner, the component 90 can be evaluated with high accuracy.

  In the embodiment described above, only the upper light source 47a which is a side-emitting light source is turned on when photographing the bump 94, but instead of or in addition to this, the middle light source 47b which is an inclined light source may be turned on. Even when the inclined light source irradiates the bumps 94, the bumps 94 appear as an annular band in the photographed image, and therefore, the same effect as that of the above-described embodiment can be obtained. In addition, the epi-illumination light source 44 may be lit while lighting one or both of the side-reflection light source and the inclined light source. Even in this case, the same effect as that of the above-described embodiment can be obtained.

  In the embodiment described above, the reel unit 70 has been exemplified as the component supply device, but the invention is not particularly limited thereto. For example, a tray unit may be adopted in which components are placed on a tray and supplied.

  In the embodiment described above, the nozzle 37 is used as a member for picking up the part 90, but instead, a chuck of a type grasped by a claw may be adopted.

  The image processing method and the image processing apparatus of the present disclosure may be configured as follows.

  In the image processing method of the present disclosure, reference data of information on the metal curved surface portion is created based on two-dimensional data of the graphic, and information on the metal curved surface portion obtained from the captured image is used with the reference data. It may be evaluated. Further, in the image processing apparatus of the present disclosure, the control device generates reference data of information related to the metal curved surface portion based on two-dimensional data of the graphic, and relates to the metal curved surface portion obtained from the captured image. Information may be evaluated using the reference data. In this way, the reference data of the information on the metal curved surface portion becomes accurate data based on the three-dimensional CAD data. Therefore, the information on the metal curved surface portion of the electronic component can be evaluated with high accuracy by evaluating the information on the metal curved surface portion obtained from the captured image using the reference data.

  In the image processing method and the image processing apparatus of the present disclosure, the metal curved surface portion may be a bump, the graphic may be an annular band, and the information on the metal curved surface portion may be an outer diameter of the bump. The bumps are generally hemispherical or near in shape, but variously in detail. Therefore, even if the outer diameter of the three-dimensional CAD data is the same for a plurality of types of bumps, the outer diameter of the annular band after conversion into two-dimensional data may be different. Therefore, the significance of applying the image processing method and the image processing apparatus of the present disclosure is high.

  The present invention is applicable to a component mounting machine or the like for mounting a component provided with a metal surface portion such as a bump on a substrate.

DESCRIPTION OF SYMBOLS 10 component mounting apparatus, 12 base, 14 mounting apparatus main body, 16 board | substrates, 18 board | substrate conveyance apparatus, 20 support plates, 22 conveyor belts, 23 support pins, 24 heads, 26 X-axis sliders, 26a drive motor, 28 guide rails, 30 Y-axis slider, 30a drive motor, 32 guide rails, 34 Z-axis motor, 35 ball screw, 36 Q-axis motor, 37 nozzles, 40 parts camera, 41 lighting units, 42 housings, 43 connecting parts, 44 epi-illumination light sources, 45 LEDs 46 half mirror 47 multistage light source 47a upper stage light source 47b middle stage light source 47c lower stage light source 48a 48b 48c LED 49 imaging unit 49a optical axis 60 controller 61 CPU 62 ROM 63 HDD 64 RAM, 65 I / O interface, 66 Scan, 70 reel, 72 reels, 74 feeder, 76 a feeder controller, 80 control computer, 90, 90a, 90b parts, 92 body, 94,94A, 94b bump, 96 black background, 98,98A, 98b annulus.

Claims (6)

The metal curved surface portion of the electronic component provided with the metal curved surface portion is irradiated with the light of the side light source and / or the inclined light source, and the metal curved surface portion irradiated with light is a predetermined imaging position facing the metal curved surface portion An image processing method for obtaining information on the metal curved surface portion based on the captured image,
Two-dimensional data of a figure generated when light reflected by the metal curved surface portion reaches the imaging position based on the three-dimensional CAD data of the metal curved surface portion and the direction of light irradiated to the metal curved surface portion And evaluating information on the metal curved surface portion obtained from the captured image based on two-dimensional data of the graphic,
Image processing method. Reference data of information on the metal curved surface portion is created based on two-dimensional data of the graphic, and information on the metal curved surface portion obtained from the captured image is evaluated using the reference data.
The image processing method according to claim 1. The metal curved portion is a bump,
The figure is an annular band,
The information on the metal curved portion is the outer diameter of the bump,
The image processing method according to claim 1. The metal curved surface portion of the electronic component provided with the metal curved surface portion is irradiated with the light of the side light source and / or the inclined light source, and the metal curved surface portion irradiated with light is a predetermined imaging position facing the metal curved surface portion An image processing apparatus for obtaining information from the curved metal surface portion on the basis of the captured image;
A storage device for storing three-dimensional CAD data of the metal curved surface portion;
Two-dimensional data of a figure generated when light reflected by the metal curved surface portion reaches the imaging position based on the three-dimensional CAD data of the metal curved surface portion and the direction of light irradiated to the metal curved surface portion A controller configured to evaluate information on the metal curved surface portion obtained from the captured image based on two-dimensional data of the figure;
An image processing apparatus comprising: The control device creates reference data of information on the metal curved surface portion based on two-dimensional data of the figure, and evaluates information on the metal curved surface portion obtained from the captured image using the reference data ,
The image processing method according to claim 4. The metal curved portion is a bump,
The figure is an annular band,
The information on the metal curved portion is the outer diameter of the bump,
The image processing apparatus according to claim 4.

Images