JP2008216140A - Transfer material transfer inspection method in electronic component installing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer material transfer inspection method in an electronic component installing device, capable of preventing an oversight of transfer material transfer failure, and of easily determining the quality of transfer material transfer, in a short time. <P>SOLUTION: This transfer material transfer inspection method in the electronic component installing device 100 is provided for installing an electronic component 40, having a bump 42 of transferring solder 31 on a body 41 on a base board, and comprises a step S11 of transferring the solder 31 to the electronic component 40, a step S12 of positioning the electronic component 40 of transferring the solder 31, steps S13, S14 and S15 of imaging the electronic component 40, steps S16 and S17 of acquiring luminance with each bump 42, by specifying a range (a window W1) for measuring the luminance of the bump 42 based on the positional data on the electronic component 40 provided by the steps S13, S14 and S15, and a step S18 of determining the quality of solder transfer, by comparing the luminance of the bump 42 with an electrode luminance reference value by every bump 42. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection method for transferring a transfer material onto an electronic component in an electronic component mounting apparatus.

Conventionally, a flux transfer inspection method in an electronic component mounting apparatus described in Patent Document 1 is known. In the flux transfer inspection method in the electronic component mounting apparatus, the flux is transferred to the bumps of the electronic component in the electronic component mounting apparatus, and the flux transfer region is specified from the image of the flux transfer portion. Then, the quality of the flux transfer is determined from the size of the flux transfer region.
JP 2003-60398 A

  However, in the conventional flux transfer inspection method in the electronic component mounting apparatus described above, it is only necessary to determine the quality of the flux transfer from the size of the flux transfer region of one or several bumps of the electronic component. The quality of the transfer is not judged. Therefore, even if there is a bump with poor flux transfer, it may be overlooked. In addition, a side light source is usually used when imaging the bump. Here, the central part of the bump is a curved surface, and the light reflected by this part is difficult to enter the camera. Therefore, the central part of the bump becomes a dark image, but when the flux is transferred, the image becomes darker. Therefore, it is difficult to specify the flux transfer region based on the image, and it takes a lot of processing time.

  The present invention has been made in view of the above-described conventional problems, and can prevent the transfer material transfer failure from being overlooked, and can easily determine whether the transfer material transfer is good or not in a short time. A transfer inspection method is provided.

  In order to solve the above problems, the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 1 is characterized in that an electronic component mounting for mounting an electronic component having an electrode on the body to which the transfer material is transferred on a substrate. In the transfer material transfer inspection method in the apparatus, a transfer step of transferring the transfer material to the electronic component, a positioning step of positioning the electronic component to which the transfer material has been transferred, an imaging step of imaging the electronic component, Based on the position data of the electronic component obtained by the imaging process, the range for measuring the luminance of the electrode is specified, and the luminance of the electrode is obtained for each electrode, and the luminance of each electrode is obtained. And an electrode luminance reference value to determine whether the transfer material transfer is good or bad.

  The transfer material transfer inspection method in the electronic component mounting apparatus according to claim 2 is characterized in that in the transfer material transfer inspection method in the electronic component mounting apparatus for mounting an electronic component having an electrode on the body to which the transfer material is transferred, on the substrate, Based on the pre-transfer positioning step of positioning the electronic component before the transfer material is transferred, the pre-transfer imaging step of imaging the electronic component, and the position data of the electronic component obtained by the pre-transfer imaging step , The range for measuring the luminance of the electrode is specified, the pre-transfer electrode luminance acquisition step for acquiring the luminance for each electrode, the transfer step for transferring the transfer material to the electronic component, and the transfer material transferred The post-transfer positioning step for positioning the electronic component, the post-transfer imaging step for imaging the electronic component, and the luminance of the electrode specified by the pre-transfer electrode luminance acquisition step are measured. The post-transfer electrode brightness acquisition step for acquiring the brightness for each electrode based on the range, and the electrode brightness difference for acquiring the brightness difference between the brightness of the electrode before transfer and the brightness of the electrode after transfer for each of the electrodes And an electrode luminance difference determining step of comparing the luminance difference and the electrode luminance difference reference value for each electrode to determine whether the transfer material transfer is good or bad.

  The transfer material transfer inspection method in the electronic component mounting apparatus according to claim 3 is characterized in that, in claim 1 or 2, the brightness of the electrode is a distribution of brightness of pixels included in a range in which the brightness of the electrode is measured. Of these, the average or total brightness excluding a predetermined ratio from the darker side.

  A feature of the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 4 is that, in claim 1 or 2, the electrode is a bump.

  The transfer material transfer inspection method in the electronic component mounting apparatus according to claim 5 is characterized in that in the transfer material transfer inspection method in the electronic component mounting apparatus for mounting an electronic component having an electrode on the body to which the transfer material is transferred, on the substrate, A transfer step of transferring the transfer material to the electronic component; a positioning step of positioning the electronic component to which the transfer material has been transferred; an imaging step of imaging the electronic component; and the electronic component obtained by the imaging step A transfer prohibition region luminance acquisition step for identifying a range for measuring the luminance of the transfer prohibition region of the body that may cause damage to the electronic component due to transfer of the transfer material, and acquiring the luminance of the transfer prohibition region based on the position data of And a transfer prohibition region luminance determination step for comparing the transfer prohibition region luminance with a transfer prohibition region luminance reference value to determine whether the transfer material transfer is good or bad. .

  The transfer material transfer inspection method in the electronic component mounting apparatus according to claim 6 is characterized in that in the transfer material transfer inspection method in the electronic component mounting apparatus for mounting an electronic component having an electrode on the body to which the transfer material is transferred, on the substrate, Based on the pre-transfer positioning step of positioning the electronic component before the transfer material is transferred, the pre-transfer imaging step of imaging the electronic component, and the position data of the electronic component obtained by the pre-transfer imaging step Specifying a range for measuring the luminance of the transfer prohibited area of the body that may cause damage to the electronic component due to transfer of the transfer material, and acquiring the luminance of the transfer prohibited area before transfer to acquire the luminance of the transfer prohibited area; A transfer step of transferring the transfer material to the component; a post-transfer positioning step of positioning the electronic component to which the transfer material has been transferred; and a post-transfer imaging step of imaging the electronic component A post-transfer prohibition area luminance acquisition step for acquiring the luminance of the transfer prohibition area based on a range for measuring the luminance of the transfer prohibition area specified by the pre-transfer prohibition area luminance acquisition step; A transfer prohibition region luminance difference acquisition step for acquiring a luminance difference between the luminance of the transfer prohibition region and the luminance of the transfer prohibition region after the transfer is compared with the reference value of the luminance difference and the transfer prohibition region luminance difference. And a transfer prohibition region luminance difference determination step for determining transfer quality.

  A feature of the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 7 is as follows:

  The brightness of the transfer prohibited area is an average or total brightness of pixels included in a range in which the brightness of the transfer prohibited area is measured.

  A feature of the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 8 is that, in any one of claims 1 to 7, the transfer material is solder.

  A feature of the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 9 is that, in any one of claims 1 to 7, the transfer material is a flux.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 1, in the electrode brightness determination step, the transfer brightness transfer quality is determined for each electrode by comparing the brightness of the electrode with the electrode brightness reference value. Therefore, the transfer material transfer failure electrode is not overlooked. In addition, in the electrode luminance acquisition process, the range for measuring the luminance of the electrode is specified based on the position data of the electronic component, so it is easier and faster than when specifying from the image of the transfer material transfer portion. A range in which the luminance of the electrode is measured can be specified. Therefore, according to this transfer material transfer inspection method, it is possible to prevent the transfer material transfer failure from being overlooked, and to determine whether the transfer material transfer is good or not in a short time.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 2, in the electrode brightness difference determination step, the transfer material transfer is performed for each electrode by comparing the brightness difference of the electrode before and after transfer with the electrode brightness difference reference value. Therefore, the transfer material transfer failure electrode is not overlooked. In addition, in the pre-transfer electrode luminance acquisition step and the post-transfer electrode luminance acquisition step, the range for measuring the luminance of the electrode is specified based on the position data of the electronic component, so when specifying from the image of the transfer material transfer portion In comparison, it is possible to specify a range in which the luminance of the electrode is measured easily and in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent the transfer material transfer failure from being overlooked, and to determine whether the transfer material transfer is good or not in a short time.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 3, in the brightness distribution of pixels included in a range in which the luminance of the electrode is measured, the average brightness excluding a predetermined ratio from the darker one Or since the sum is made into the brightness | luminance of an electrode, the brightness of an electrode can be calculated | required more correctly.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to the fourth aspect, the electrodes are bumps, and in this case as well, the transfer material transfer inspection is suitable.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 5, in the transfer prohibition region luminance determination step, the transfer prohibition region luminance reference value is compared with the transfer prohibition region luminance reference value to determine whether the transfer material transfer is good or bad. Therefore, the body of the transfer material transfer failure is not overlooked. In addition, in the transfer prohibition area luminance acquisition step, the range for measuring the luminance of the transfer prohibition area is specified based on the position data of the electronic component, so it is easier than when specifying from the image of the transfer material transfer portion. In addition, it is possible to specify a range in which the luminance of the transfer prohibited area is measured in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent the transfer material transfer failure from being overlooked, and to determine whether the transfer material transfer is good or not in a short time.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 6, in the transfer prohibited area luminance difference determination step, the luminance difference of the transfer prohibited area before and after the transfer and the transfer prohibited area luminance difference reference value are compared, In order to determine the quality of transfer material transfer, the body of transfer material transfer failure is not overlooked. Further, in the pre-transfer prohibition area luminance acquisition step and the post-transfer prohibition area luminance acquisition step, the range for measuring the luminance of the transfer prohibition area is specified based on the position data of the electronic component. Compared with the case of specifying from the image, it is possible to specify the range in which the luminance of the transfer prohibited area is measured easily and in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent the transfer material transfer failure from being overlooked, and to determine whether the transfer material transfer is good or not in a short time.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 7, since the average or total brightness of the pixels included in the range in which the luminance of the transfer prohibited area is measured is used as the luminance of the transfer prohibited area, The brightness of the transfer prohibited area can be obtained.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to the eighth aspect, since the transfer material is solder, the quality of the solder transfer can be determined.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to the ninth aspect, since the transfer material is a flux, it is possible to determine the quality of the flux transfer.

  Embodiments 1 to 4 embodying a transfer material transfer inspection method in an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus 100 used in the transfer material transfer inspection method of Embodiment 1 includes a component supply device 70, a substrate transport device 80, and a component transfer mounting 90.

  The component supply apparatus 70 is configured by arranging a plurality of cassette type feeders 71 in parallel on a base frame 99. The cassette type feeder 71 includes a main body 72 detachably attached to the base frame 99, a supply reel 73 provided at the rear portion of the main body 72, and a component take-out portion 74 provided at the tip of the main body 72. An elongated tape (not shown) in which electronic components are enclosed at a predetermined pitch is wound and held on the supply reel 73, and this tape is pulled out at a predetermined pitch by a sprocket (not shown), so that the electronic component is released from the enclosed state. The components are sequentially sent to the component extraction unit 74.

  In addition, between the component supply device 70 and the substrate transfer device 80, an imaging device 20 including the light source device 21 and a solder tank 30 containing the solder 31 are provided. As shown in FIG. 2, the position of the imaging device 20 is an image recognition station ST1, and the position of the solder bath 30 is a solder transfer station ST2. The imaging device 20 is electrically connected to the control device 10. In the image recognition station ST <b> 1, the electronic component 40 attracted to the tip of the suction nozzle 16 of the mounting head 15 is imaged by the imaging device 20, and image data is input to the control device 10. The light source device 21 has a hemispherical shape, and includes an upper light source 22 and a lower light source 23 arranged concentrically. The upper light source 22 is disposed above the light source device 21 and illuminates the electronic component 40 sucked at the tip of the suction nozzle 16 of the mounting head 15 from the lateral direction. The lower light source 23 is disposed below the light source device 21 and illuminates the electronic component 40 sucked at the tip of the suction nozzle 16 from below. Further, in the solder transfer station ST2, the mounting head 15 is moved in the vertical direction, whereby the solder 31 in the solder bath 30 is transferred to the electronic component 40 sucked at the tip of the suction nozzle 16. The component transfer device 90 is retracted backward in FIG. 1, but when the electronic component 40 is imaged, the image recognition station ST1, and when the solder 31 is transferred to the electronic component 40, the solder transfer station ST2. Is moving above. Here, the solder 31 is a “transfer material”.

  As shown in FIG. 1, the board transport device 80 is of a so-called double conveyor type in which a printed circuit board is transported in the X-axis direction and a first transport device 81 and a second transport device 82 are arranged in two rows. The first transport device 81 (second transport device 82) has a pair of guide rails 84a and 84b (85a and 85b) arranged parallel to each other on the base 83 in parallel with each other. A pair of conveyor belts (not shown) that support and convey the printed circuit boards respectively guided by 84b (85a, 85b) are arranged to face each other. Also, the substrate transport device 80 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board transported to a predetermined position, and the printed circuit board is positioned and fixed at the mounting position by the clamp device.

  The component transfer device 90 is of the XY robot type, is mounted on the base frame 99 and disposed above the substrate transfer device 80 and the component supply device 70 and is moved in the Y-axis direction by the Y-axis motor 12. Y-axis slider 93 is provided. A mounting head 15 for attaching the electronic component 40 to the printed circuit board is attached to the Y-axis slider 93. As shown in FIG. 2, the mounting head 15 has a suction nozzle 16 that sucks the electronic component 40 at the tip, and the suction nozzle 16 can be rotated around the nozzle axis by a θ-axis motor 14. The mounting head 15 can be moved in the horizontal XY plane by the X-axis motor 11 and the Y-axis motor 12, and is moved up and down in the Z-axis direction perpendicular to the XY plane by the Z-axis motor 13. It is possible. These X-axis motor 11, Y-axis motor 12, Z-axis motor 13 and θ-axis motor 14 are electrically connected to the control device 10 and are driven by commands from the control device 10.

  3 and 4 are diagrams illustrating an image of the electronic component 40 captured by the imaging device 20 with the upper light source 22 of the light source device 21 turned on. FIG. 3 is a diagram showing an image before solder transfer, and FIG. 4 is a diagram showing an image after solder transfer. The electronic component 40 has a plurality of bumps 42 disposed on a body 41. In the image of the electronic component 40, the body 41 is dark and the bumps 42 are bright. Further, the bump 42 after the solder transfer is darker than the bump 42 before the solder transfer. An electrode luminance reference value is obtained in advance from the average value of the luminance of the bumps 42 before and after the solder transfer. When the brightness of the bump 42 is equal to or lower than the electrode brightness reference value, it is determined that the transfer of the solder 31 has been performed normally. When the brightness of the bump 42 is larger than the electrode brightness reference value, it is determined that the transfer of the solder 31 is not performed normally. Here, the bumps 42 are “electrodes”.

  Next, the transfer material transfer inspection method according to the first embodiment will be described with reference to the flowchart of the solder transfer program shown in FIG. When the execution of the solder transfer program is started, first, in step S10, the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the solder transfer station ST2. In step S 11, the mounting head 15 is moved in the vertical direction by driving the Z-axis motor 13, and the solder 31 is transferred to the electronic component 40. Here, step S11 is a “transfer process”.

  In step S12, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13, and the θ-axis motor 14 are driven to position the electronic component 40 at a predetermined position in the image recognition station ST1. Here, step S12 is a “positioning step”.

  In step S13, the upper light source 22 of the light source device 21 is turned on. In step S <b> 14, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. In step S15, the coordinate adjustment of the position of the bump 42 is performed from the image data of the entire bump 42. That is, the coordinates of the position of the bump 42 at a predetermined position of the image recognition station ST1 are stored in advance in the control device 10, and the coordinates of the actual position of the bump 42 are adjusted with reference to the image data of the entire bump 42. It is done. Instead of using the image of the entire bump 42, the coordinates of the position of the bump 42 may be adjusted based on the images of the bumps 42 at the four corners. Here, steps S13, S14, and S15 are “imaging process”.

  In step S16, as shown in FIG. 6, for one bump 42, a rectangular window W1 circumscribing the bump 42 from the calculated center position of the bump 42 is created. This window W1 is “a range in which the luminance of the electrode is measured”. However, the window W1 is not necessarily rectangular. In step S17, the brightness of the bump 42 is obtained. Specifically, the brightness distribution of all the pixels included in the window W1 is obtained, and the average of the brightness of the pixels is obtained by excluding 25% of pixels from the dark side. The average brightness of the pixels is the brightness of the bump 42. By doing in this way, the brightness | luminance of the bump 42 can be calculated | required correctly. That is, as shown in FIG. 6, the bump 42 has a spherical shape, whereas the window W1 forms a rectangle circumscribing the bump 42, and therefore, the body 41 includes a part of the four corners of the window W1. Since the upper light source 22 of the light source device 21 is turned on, a part of the body 41 is imaged darkest. Therefore, by removing 25% of pixels from the darker side, the image data of the body 41 can be excluded, and the brightness of the bumps 42 can be accurately obtained. Note that the brightness distribution of all the pixels included in the window W1 may be obtained, and 25% of the pixels from the darker side may be excluded, and the total brightness of the pixels may be used as the luminance. Here, steps S16 and S17 are the “electrode luminance acquisition step”.

  In step S18, it is checked whether or not the brightness of the bump 42 is equal to or lower than the electrode brightness reference value. When the brightness of the bump 42 is equal to or lower than the electrode brightness reference value (YES), it is determined that the transfer of the solder 31 is normally performed, and step S19 is executed. If the luminance of the bump 42 is greater than the electrode luminance reference value (NO), it is determined that the transfer of the solder 31 is not performed normally, and step S20 is executed. Here, step S18 is an “electrode brightness determination step”.

  In step S19, it is checked whether or not the luminance determination has been completed for all the bumps 42. When the luminance determination is finished for all the bumps 42 (YES), the solder transfer program is finished. If the luminance determination is not completed for all the bumps 42 (NO), the process returns to step S16, and the luminance acquisition and the luminance determination are performed for the next bump 42. In step S20, after error processing is performed, the solder transfer program is terminated.

  In the transfer material transfer inspection method according to the first embodiment, in step S18, for each bump 42, the brightness of the bump 42 and the electrode brightness reference value are compared to determine whether the transfer of the solder 31 is good. The defective bump 42 is not overlooked. In steps S16 and S17, since the range (window W1) for measuring the luminance of the bump 42 is specified based on the position data of the electronic component 40, it is simpler than the case of specifying from the image of the bump 42. In addition, it is possible to specify the range (window W1) in which the luminance of the bump 42 is measured in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent oversight of defective solder transfer, and to determine whether the solder transfer is good or not in a short time.

  Next, a transfer material transfer inspection method according to the second embodiment will be described. In the transfer material transfer inspection method according to the second embodiment, as in the first embodiment, the electronic component mounting apparatus 100 shown in FIGS. Also, an electrode luminance difference reference value, which is a difference in luminance of the bumps 42 before and after solder transfer, is obtained in advance from the image data of the electronic component 40 imaged by the imaging device 20 shown in FIGS. If the brightness difference between the bumps 42 before and after the solder transfer is equal to or greater than the electrode brightness difference reference value, it is determined that the transfer of the solder 31 has been performed normally. If the luminance difference between the bumps 42 before and after the solder transfer is smaller than the electrode luminance difference reference value, it is determined that the transfer of the solder 31 is not performed normally.

  A transfer material transfer inspection method according to the second embodiment will be described with reference to a flowchart of a solder transfer program shown in FIG. When the execution of the solder transfer program is started, first, in step S30, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the image recognition station ST1. It is positioned at a predetermined position. Here, step S30 is a “pre-transfer positioning step”.

  In step S31, the upper light source 22 of the light source device 21 is turned on. In step S <b> 32, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. In step S33, the coordinate adjustment of the position of the bump 42 is performed from the image data of the entire bump 42. The coordinate adjustment method is the same as in the first embodiment. Here, steps S31, S32, and S33 are “pre-transfer imaging process”.

  In step S34, a window W1 is created for one bump 42. Specifically, a rectangular window W1 circumscribing the bump 42 is created from the center position of the bump 42 calculated in step S33. This window W1 is “a range in which the luminance of the electrode is measured”. However, the window W1 is not necessarily rectangular. In step S35, the brightness of the bump 42 is obtained. The brightness of the bump 42 is stored in the memory of the control device 10. A specific method for obtaining the brightness of the bump 42 is the same as steps S16 and S17 of the first embodiment. Here, Steps S34 and S35 are “a pre-transfer electrode luminance acquisition step”.

  In step S36, it is checked whether or not the luminance has been obtained for all the bumps 42. When the luminance is obtained for all the bumps 42 (YES), step S37 is executed. If the luminance has not been obtained for all the bumps 42 (NO), the process returns to step S34 to create the window W1 and obtain the luminance of the bump 42 for the next bump 42.

  In step S37, the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the solder transfer station ST2. In step S <b> 38, the mounting head 15 is moved in the vertical direction by driving the Z-axis motor 13, and the solder 31 is transferred to the electronic component 40. Here, step S38 is a “transfer process”.

  In step S39, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13, and the θ-axis motor 14 are driven to position the electronic component 40 at a predetermined position in the image recognition station ST1. Here, step S39 is a “post-transfer positioning step”.

  In step S40, the upper light source 22 of the light source device 21 is turned on. In step S <b> 41, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. Here, steps S40 and S41 are “post-transfer imaging process”.

  In step S42, a window W1 is created for one bump 42 by the same method as in step S34. In step S43, the brightness of the bump 42 is obtained. The brightness of the bump 42 is stored in the memory of the control device 10. A specific method for obtaining the brightness of the bump 42 is the same as steps S16 and S17 of the first embodiment. Here, Steps S42 and S43 are “post-transfer electrode luminance acquisition step”.

  In step S44, it is checked whether or not the luminance has been obtained for all the bumps 42. When the luminance is obtained for all the bumps 42 (YES), step S45 is executed. If the brightness has not been obtained for all the bumps 42 (NO), the process returns to step S42 to create the window W1 and obtain the brightness of the bump 42 for the next bump 42.

  In step S45, the brightness difference of the bump 42 is obtained from the brightness of the bump 42 before and after the solder transfer stored in the memory of the control device 10. In step S46, it is checked whether or not the luminance difference of the bump 42 is greater than or equal to the electrode luminance difference reference value. If the brightness difference of the bump 42 is equal to or greater than the electrode brightness difference reference value (YES), it is determined that the transfer of the solder 31 is normally performed, and step S47 is executed. If the brightness difference of the bump 42 is smaller than the electrode brightness difference reference value (NO), it is determined that the transfer of the solder 31 is not performed normally, and step S48 is executed. Here, step S45 is an “electrode luminance difference acquisition step”, and step S46 is an “electrode luminance difference determination step”.

  In step S47, it is checked whether or not the luminance difference determination has been completed for all the bumps 42. When the brightness difference determination is finished for all the bumps 42 (YES), the solder transfer program is finished. If the brightness difference determination is not completed for all the bumps 42 (NO), the process returns to step S45, and the brightness difference acquisition and the brightness difference determination are performed for the next bump 42. In step S48, after error processing is performed, the solder transfer program is terminated.

  In the transfer material transfer inspection method according to the second embodiment, in step S46, for each bump 42, the brightness difference of the bump 42 before and after transfer and the electrode brightness difference reference value are compared to determine whether the transfer of the solder 31 is acceptable. Therefore, the bumps 42 with poor solder transfer are not overlooked. Further, in steps S34 and S35 and steps S42 and S43, the range (window W1) for measuring the luminance of the bump 42 is specified based on the position data of the electronic component 40. Therefore, when specifying from the image of the bump 42, In comparison, the range (window W1) in which the luminance of the bump 42 is measured can be specified easily and in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent oversight of defective solder transfer, and to determine whether the solder transfer is good or not in a short time. Other actions and effects are the same as those of the first embodiment.

  Next, a transfer material transfer inspection method according to Embodiment 3 will be described. In the transfer material transfer inspection method according to the third embodiment, as in the first embodiment, the electronic component mounting apparatus 100 shown in FIGS. FIGS. 8 and 9 are diagrams illustrating images of the electronic component 40 captured by the imaging device 20 with the lower light source 23 of the light source device 21 turned on. FIG. 8 is a diagram showing a normal image in which the solder 31 is not attached to the transfer prohibited region 45, and FIG. 9 is a diagram showing an abnormal image in which the solder 31 is attached to the transfer prohibited region 45. The transfer prohibition region 45 is a region of the body 41 that can cause the electronic component 40 to be damaged by the transfer of the solder 31. When the solder 31 is not attached to the transfer prohibited area 45, the brightness of the transfer prohibited area 45 is higher than when the solder 31 is attached. A transfer prohibition area luminance reference value is obtained in advance from the luminance of the transfer prohibition area 45 of the normal image and the abnormal image. When the luminance of the transfer prohibited area 45 is equal to or higher than the transfer prohibited area luminance reference value, it is determined to be normal. Further, when the luminance of the transfer prohibition area 45 is smaller than the transfer prohibition area luminance reference value, it is determined that there is an abnormality.

  A transfer material transfer inspection method according to the third embodiment will be described with reference to a flowchart of a solder transfer program shown in FIG. However, this solder transfer program is executed together with the solder transfer program of the first or second embodiment. When the execution of the solder transfer program is started, first, in step S50, the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the solder transfer station ST2. In step S 51, the mounting head 15 is moved in the vertical direction by driving the Z-axis motor 13, and the solder 31 is transferred to the electronic component 40. Here, step S51 is a “transfer process”.

  In step S52, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13, and the θ-axis motor 14 are driven to position the electronic component 40 at a predetermined position in the image recognition station ST1. Here, step S52 is a “positioning step”.

  In step S53, the lower light source 23 of the light source device 21 is turned on. In step S <b> 54, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. In step S55, coordinate adjustment of the transfer prohibited area 45 is performed. That is, the control device 10 stores in advance the coordinates of the position of the transfer prohibited area 45 at a predetermined position of the image recognition station ST1, and refers to the image data of the entire bump 42 acquired in the above-described step S14 or step S32. Thus, the coordinates of the actual position of the transfer prohibition area 45 are adjusted. Instead of using the image of the entire bump 42, the coordinates of the position of the transfer prohibited area 45 may be adjusted by the image of the bump 42 at the four corners. Here, steps S53, S54, and S55 are “imaging process”.

  In step S56, a window W2 is created from the coordinates of the position of the transfer prohibited area 45. This window W2 is “a range in which the luminance of the transfer prohibited area is measured”. In step S57, the brightness of the transfer prohibited area 45 is obtained. Specifically, the average brightness of all the pixels included in the window W2 is obtained. The average brightness of the pixels is the luminance of the transfer prohibited area 45. By doing in this way, the brightness | luminance of the transcription | transfer prohibition area | region 45 can be calculated | required correctly. The total brightness of all the pixels included in the window W2 may be used as the luminance of the transfer prohibited area 45. Here, steps S56 and S57 are the “transfer prohibited area luminance acquisition step”.

  In step S58, it is checked whether or not the luminance of the transfer prohibited area 45 is equal to or higher than the transfer prohibited area luminance reference value. If the brightness of the transfer prohibited area 45 is equal to or higher than the transfer prohibited area brightness reference value (YES), it is determined that there is no adhesion of the solder 31, and the solder transfer program is terminated. If the luminance of the transfer prohibited area 45 is smaller than the transfer prohibited area luminance reference value (NO), it is determined that there is adhesion of the solder 31, and step S58 is executed. In step S58, after error processing is performed, the solder transfer program is terminated. Here, step S58 is a “transfer prohibited area luminance determination step”.

  In the transfer material transfer inspection method according to the third embodiment, in step S58, the brightness of the transfer prohibited area 45 is compared with the transfer prohibited area brightness reference value to determine whether or not the solder 31 is attached. The transferred prohibition area 45 is not overlooked. In steps S56 and S57, since the range (window W2) for measuring the luminance of the transfer prohibited area 45 is specified based on the position data of the transfer prohibited area 45, when specifying from the image of the transfer prohibited area 45. In comparison, the range (window W2) in which the luminance of the transfer prohibited area 45 is measured can be specified easily and in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent oversight of defective solder transfer, and to determine whether the solder transfer is good or not in a short time.

  In the third embodiment, one transfer prohibition area 45 is provided. However, a plurality of transfer prohibition areas 45 may be provided, and the presence or absence of adhesion of the solder 31 may be determined for all the transfer prohibition areas 45.

  Next, a transfer material transfer inspection method according to Embodiment 4 will be described. In the transfer material transfer inspection method according to the fourth embodiment, as in the first embodiment, the electronic component mounting apparatus 100 shown in FIGS. In addition, a transfer prohibition area luminance difference reference value is obtained in advance based on a difference in luminance of the transfer prohibition area 45 of the electronic component 40 before and after the solder transfer imaged by the imaging device 20. When the luminance difference of the transfer prohibited area 45 before and after the solder transfer is equal to or less than the transfer prohibited area luminance difference reference value, it is determined that the solder 31 is not attached to the transfer prohibited area and is normal. If the luminance difference in the transfer prohibited area 45 before and after the solder transfer is larger than the transfer prohibited area luminance difference reference value, it is determined that the solder 31 is attached to the transfer prohibited area 45 and is abnormal. The transfer prohibition area 45 is an area of the body 41 that can cause the electronic component 40 to be damaged by the transfer of the solder 31 as in the third embodiment.

  A transfer material transfer inspection method according to the fourth embodiment will be described with reference to a flowchart of a solder transfer program shown in FIG. However, this solder transfer program is executed together with the solder transfer program of the first or second embodiment, as in the third embodiment. When the execution of the solder transfer program is started, first, in step S70, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the image recognition station ST1. It is positioned at a predetermined position. Here, step S70 is a “positioning process before transfer”.

  In step S71, the lower light source 23 of the light source device 21 is turned on. In step S <b> 72, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. In step S73, coordinate adjustment of the transfer prohibited area 45 is performed. The coordinate adjustment method is the same as the method shown in step S55 of the third embodiment. Here, steps S71, S72, and S73 are “pre-transfer imaging process”.

  In step S74, a window W2 is created from the coordinates of the position of the transfer prohibited area 45. The window W2 is the same as that in the third embodiment. In step S75, the brightness of the transfer prohibited area 45 is obtained. The specific method for obtaining the brightness of the transfer prohibited area 45 is the same as that in steps S56 and S57 of the third embodiment, and the brightness of the transfer prohibited area 45 is stored in the memory of the control device 10. Here, steps S74 and S75 are the “pre-transfer prohibition area luminance acquisition step”.

  In step S76, the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the solder transfer station ST2. In step S 77, the mounting head 15 is moved in the vertical direction by driving the Z-axis motor 13, and the solder 31 is transferred to the electronic component 40. Here, step S77 is a “transfer process”.

  In step S78, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13 and the θ-axis motor 14 are driven to position the electronic component 40 at a predetermined position in the image recognition station ST1. Here, step S78 is a “post-transfer positioning process”.

  In step S79, the lower light source 23 of the light source device 21 is turned on. In step S <b> 80, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. Here, steps S79 and S80 are “post-transfer imaging process”.

  In step S81, a window W2 is created from the coordinates of the position of the transfer prohibited area 45 adjusted in step S73. In step S82, the luminance of the transfer prohibited area 45 is obtained. The specific method for obtaining the brightness of the transfer prohibited area 45 is the same as that in steps S56 and S57 of the third embodiment, and the brightness of the transfer prohibited area 45 is stored in the memory of the control device 10. Here, steps S81 and S82 are “post-transfer prohibition area luminance acquisition step”.

  In step S83, the luminance difference of the transfer prohibited area 45 is obtained from the luminance of the transfer prohibited area 45 before and after the solder transfer stored in the memory of the control device 10. In step S84, it is checked whether or not the luminance difference in the transfer prohibited area 45 is equal to or less than the transfer prohibited area luminance difference reference value. If the luminance difference in the transfer prohibited area 45 is equal to or smaller than the transfer prohibited area luminance difference reference value (YES), it is determined that there is no adhesion of the solder 31, and the solder transfer program is terminated. If the luminance difference in the transfer prohibited area 45 is larger than the transfer prohibited area luminance difference reference value (NO), it is determined that there is adhesion of the solder 31, and step S85 is executed. In step S85, after error processing is performed, the solder transfer program is terminated. Here, step S84 is a “transfer prohibited area luminance difference determination step”.

  In the transfer material transfer inspection method according to the fourth embodiment, in step S84, the brightness difference of the transfer prohibited area 45 before and after the transfer is compared with the reference value of the transfer prohibited area brightness difference to determine whether or not the solder 31 is attached. Therefore, the transfer prohibition area 45 to which the solder is attached is not overlooked. In steps S74, S75, S81, and S82, since the range (window W2) for measuring the luminance of the transfer prohibited area 45 is specified based on the position data of the transfer prohibited area 45, the image of the transfer prohibited area 45 is used. Compared with the case of specifying, the range (window W2) for measuring the luminance of the transfer prohibited area 45 can be specified easily and in a short time. Therefore, according to this transfer material transfer inspection method, it is possible to prevent the transfer material transfer failure from being overlooked, and to determine whether the transfer material transfer is good or not in a short time. Other operations and effects are the same as those of the third embodiment.

  In the first to fourth embodiments, an electronic component whose electrode is a bump is used, but an electronic component whose electrode is a lead may be used. The transfer material may be a flux having an oxide film removing action.

  In the above, the transfer material transfer inspection method of the present invention has been described with reference to the first to fourth embodiments. However, the present invention is not limited to these, and may be modified as appropriate unless it is contrary to the technical idea of the present invention. Needless to say, this is applicable.

FIG. 6 is a perspective view of the electronic component mounting apparatus according to the transfer material transfer inspection method of the first to fourth embodiments. FIG. 5 is a block diagram of an electronic component mounting apparatus according to the transfer material transfer inspection method of the first to fourth embodiments. The figure which concerns on the transfer material transcription | transfer inspection method of Embodiment 1, 2, and shows the image before the solder transfer of an electronic component. The figure which concerns on the transfer material transcription | transfer inspection method of Embodiment 1, 2, and shows the image after the solder transfer of an electronic component. 10 is a flowchart of a solder transfer program according to the transfer material transfer inspection method of the first embodiment. FIG. 4 is an enlarged view of a solder-transferred bump according to the transfer material transfer inspection method of the first and second embodiments. 10 is a flowchart of a solder transfer program according to the transfer material transfer inspection method of the second embodiment. FIG. 6 is a diagram illustrating an image in which solder is not attached to a transfer prohibited area according to the transfer material transfer inspection method of the third and fourth embodiments. FIG. 6 is a diagram illustrating an image in which solder is attached to a transfer prohibited area according to the transfer material transfer inspection method of the third and fourth embodiments. Embodiment 3 A flowchart of a solder transfer program according to a transfer material transfer inspection method. Embodiment 4 A flowchart of a solder transfer program according to a transfer material transfer inspection method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 31 ... Transfer material (solder), 40 ... Electronic component, 41 ... Body, 42 ... Electrode (bump), 45 ... Transfer prohibition area | region, 100 ... Electronic component mounting apparatus, W1 ... The range (window) which measures the brightness | luminance of an electrode, W2: Range (window) for measuring the luminance of the transfer-prohibited area, S11, S38, S51, S77 ... Transfer process, S12, S52 ... Positioning process, S13, S14, S15, S53, S54, S55 ... Imaging process, S16, S17: Electrode luminance acquisition step, S18: Electrode luminance determination step, S30, S70 ... Pre-transfer positioning step, S31, S32, S33, S71, S72, S73 ... Pre-transfer imaging step, S34, S35 ... Pre-transfer electrode luminance acquisition step , S39, S78 ... post-transfer positioning step, S40, S41 ... post-transfer imaging step, S42, S43 ... post-transfer electrode luminance acquisition step, S45 ... electric Polar luminance difference acquisition step, S46 ... Electrode luminance difference determination step, S56, S57 ... Transfer prohibited area luminance acquisition step, S58 ... Transfer prohibited area luminance determination step, S74, S75 ... Pre-transfer transfer prohibited area luminance acquisition step, S81, S82 ... post-transfer transcription prohibited area luminance acquisition step, S83: transfer prohibited area luminance difference acquisition step, S84: transfer prohibited area luminance difference determination step.

Claims (9)

In a transfer material transfer inspection method in an electronic component mounting apparatus for mounting an electronic component having an electrode on a body to which a transfer material is transferred on a substrate,
A transfer step of transferring the transfer material to the electronic component;
A positioning step of positioning the electronic component to which the transfer material has been transferred;
An imaging step of imaging the electronic component;
Based on the position data of the electronic component obtained by the imaging step, the range for measuring the luminance of the electrode is specified, and the electrode luminance acquisition step for acquiring the luminance for each electrode;
A transfer material transfer inspection method in an electronic component mounting apparatus, comprising: an electrode brightness determination step for determining the quality of transfer material transfer by comparing the brightness of an electrode with an electrode brightness reference value for each electrode. . In a transfer material transfer inspection method in an electronic component mounting apparatus for mounting an electronic component having an electrode on a body to which a transfer material is transferred on a substrate,
A pre-transfer positioning step for positioning the electronic component before the transfer material is transferred;
A pre-transfer imaging step of imaging the electronic component;
Based on the position data of the electronic component obtained by the pre-transfer imaging step, the range for measuring the luminance of the electrode is specified, and the pre-transfer electrode luminance acquisition step for acquiring the luminance for each electrode;
A transfer step of transferring the transfer material to the electronic component;
A post-transfer positioning step for positioning the electronic component to which the transfer material has been transferred;
A post-transfer imaging step of imaging the electronic component;
Based on the range of measuring the luminance of the electrode specified by the pre-transfer electrode luminance acquisition step, the post-transfer electrode luminance acquisition step of acquiring the luminance for each electrode;
For each of the electrodes, an electrode luminance difference acquisition step for acquiring a luminance difference between the luminance of the electrode before transfer and the luminance of the electrode after transfer;
A transfer material transfer in an electronic component mounting apparatus, comprising: an electrode brightness difference determination step for determining the quality of transfer material transfer by comparing the brightness difference with an electrode brightness difference reference value for each electrode. Inspection method. In claim 1 or 2,
The brightness of the electrode is an average or total brightness obtained by removing a predetermined ratio from the darker side of the brightness distribution of pixels included in a range in which the brightness of the electrode is measured. A transfer material transfer inspection method in a mounting apparatus. In claim 1 or 2,
The transfer material transfer inspection method in an electronic component mounting apparatus, wherein the electrode is a bump. In a transfer material transfer inspection method in an electronic component mounting apparatus for mounting an electronic component having an electrode on a body to which a transfer material is transferred on a substrate,
A transfer step of transferring the transfer material to the electronic component;
A positioning step of positioning the electronic component to which the transfer material has been transferred;
An imaging step of imaging the electronic component;
Based on the position data of the electronic component obtained by the imaging process, the range for measuring the luminance of the transfer prohibited area of the body that may cause the electronic component to be damaged by the transfer of the transfer material is specified, and the transfer prohibited area A transfer prohibited area luminance acquisition step for acquiring luminance; and
A transfer material transfer in an electronic component mounting apparatus, comprising: a transfer prohibition region brightness determination step for comparing the brightness of the transfer prohibition region and a transfer prohibition region brightness reference value to determine whether the transfer material transfer is good or bad Inspection method. In a transfer material transfer inspection method in an electronic component mounting apparatus for mounting an electronic component having an electrode on a body to which a transfer material is transferred on a substrate,
A pre-transfer positioning step for positioning the electronic component before the transfer material is transferred;
A pre-transfer imaging step of imaging the electronic component;
Based on the position data of the electronic component obtained in the pre-transfer imaging step, the range for measuring the luminance of the transfer prohibited area of the body that may cause the electronic component to be damaged by the transfer of the transfer material is specified, and the transfer prohibition A pre-transfer prohibited area luminance acquisition step for acquiring the luminance of the area;
A transfer step of transferring the transfer material to the electronic component;
A post-transfer positioning step for positioning the electronic component to which the transfer material has been transferred;
A post-transfer imaging step of imaging the electronic component;
Based on a range for measuring the luminance of the transfer prohibited area specified by the pre-transfer prohibited area luminance acquisition step, a post-transfer prohibited area luminance acquisition step for acquiring the luminance of the transfer prohibited area;
A transfer prohibited area brightness difference acquisition step for acquiring a brightness difference between the brightness of the transfer prohibited area before transfer and the brightness of the transfer prohibited area after transfer;
A transfer material transfer inspection in an electronic component mounting apparatus, comprising: a transfer prohibited region brightness difference determining step for comparing the brightness difference with a transfer prohibited region brightness difference reference value to determine transfer material transfer quality Method. In claim 5 or 6,
The transfer material transfer inspection method for an electronic component mounting apparatus, wherein the brightness of the transfer prohibited area is an average or a sum of brightnesses of pixels included in a range in which the brightness of the transfer prohibited area is measured. In any one of Claims 1 thru | or 7,
A transfer material transfer inspection method in an electronic component mounting apparatus, wherein the transfer material is solder. In any one of Claims 1 thru | or 7,
The transfer material transfer inspection method in an electronic component mounting apparatus, wherein the transfer material is a flux.

Images