JP2007024510A - Inspection device of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device of a substrate capable of realizing more accurate inspection when the inspection related to the cream solder or the like provided on the substrate is performed. <P>SOLUTION: A printed board 30 is irradiated with blue light having a peak wavelength within a range more than 450 nm and less than 500 nm at an incident angle of 74° by a first ring light 12. Further, the printed board 30 is irradiated with green light having a peak wavelength within a range more than 500 nm and less than 590 nm at an incident angle of 20° by a second ring light 13 in order to specify a data region. Furthermore, the printed board 30 is irradiated with red light having a peak wavelength within a range more than 600 nm and less than 680 nm at an incident angle of 0° by a third ring light 14. Then, imaging based on respective reflected lights is performed using the CCD camera 6 provided almost just above the printed board 30 and the region of cream solder is extracted on the basis of a plurality of the image data corresponding to the respective reflected lights. At this time, a data printing region is excluded. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection performed in a printed circuit board manufacturing process, and more particularly to an inspection apparatus for a substrate for performing a predetermined inspection after extracting cream solder or the like disposed on the substrate. .

Generally, in the process of manufacturing a printed circuit board, there is a process of mounting electronic components on the board. When mounting, cream solder is first printed on a predetermined electrode pattern provided on the printed circuit board. Next, the electronic component is temporarily fixed on the printed circuit board based on the viscosity of the cream solder. Thereafter, the printed circuit board is guided to a reflow furnace, and soldering is performed through a predetermined reflow process. The printing state of the cream solder is inspected in the previous stage of being guided to the reflow furnace (for example, see Patent Document 1). In this technique, cream solder provided on an electrode of a substrate made of copper foil or the like is irradiated with light from obliquely above and imaged with a camera via a blue filter. Further, the sensitivity region of the light imaged at this time is set to be 450 nm to 550 nm at the peak wavelength.
JP-A-5-296746

  By the way, some printed boards have information on a mounted component (for example, a part number or a frame line indicating a part arrangement position) printed on a resist surface or the like. And since this print content is related to a mounted component or the like, the print area of such information is necessarily located in the vicinity of the cream solder area.

  However, in the blue wavelength region as described above, irregular reflection occurs in the information print region, and the information print region is imaged brightly. For this reason, when extracting the cream solder area, it is difficult to distinguish the cream solder area from the information print area, which may cause a problem in extracting the area.

  Further, such a problem can occur in the same manner when extracting not only cream solder but also solder bumps, silver paste, conductive adhesive and the like.

  The present invention has been made in view of the above circumstances, and provides a substrate inspection apparatus capable of realizing a more accurate inspection when performing inspection related to cream solder or the like provided on a substrate. One of the main purposes.

  In the following, each means suitable for solving the above-mentioned purpose will be described in terms of items. In addition, the effect etc. peculiar to the means to respond | correspond as needed are added.

Means 1. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
Irradiating means for irradiating the substrate with light for specifying the information printing area;
An imaging unit that is provided almost directly above the substrate and that performs imaging based on light from the substrate in response to irradiation by the irradiation unit;
Inspection means for extracting the area of the solder equivalent, excluding at least the information printing area based on image data acquired by imaging by the imaging means, and inspecting the solder equivalent. A substrate inspection apparatus.

  The inspection apparatus described in means 1 is used for a substrate provided with a solder equivalent for electrically connecting and fixing a component mounted on the substrate to an electrode disposed on the substrate. In addition, this substrate has an information printing area on which various types of information are printed.

  The solder equivalent here includes cream solder, solder bumps, silver paste, and conductive adhesive. The same applies to the following means. Further, the printing is generally performed by silk screen printing using a screen mesh such as silk, polyamide, or polyester as a printing material, or ink jet printing.

  Particularly in the means 1, the irradiating means irradiates light for specifying the information printing area. The imaging means is provided almost directly above the substrate. By this imaging means, imaging based on light from the substrate according to irradiation by the irradiation means is performed. Then, based on the image data acquired by imaging by the imaging unit, at least the information printing area is excluded by the inspection unit, the solder equivalent region is extracted, and the solder equivalent is inspected.

  The information is often printed in white, but in general, a fluorescent material is included in a material that appears white with natural light. Therefore, for example, when the ultraviolet ray is irradiated, the print area becomes fluorescent, and imaging based on the fluorescence becomes possible. Further, for example, if irradiation is performed such that irregular reflection does not occur in the solder equivalent region but irregular reflection occurs in the information printing region, imaging based on the reflected light of the irradiated light becomes possible.

  In this way, by performing imaging by irradiating light for specifying an information print area, when extracting a solder equivalent area such as cream solder, the solder equivalent area is distinguished from the information print area. The information printing area is excluded. As a result, inspection accuracy can be increased.

Mean 2. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
First irradiation means for irradiating the substrate with light from a substantially horizontal direction;
A second irradiating means for irradiating light on the substrate from obliquely above at an incident angle smaller than that of the first irradiating means;
Reflected light from the substrate that is provided almost directly above the substrate and irradiated from the substrate, and reflected light from the substrate that is irradiated from the second irradiation unit. Imaging means for performing imaging based on;
Based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, at least the information printing area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. An inspection device for a substrate, comprising: an inspection means.

  Particularly in the means 2, the first irradiating means irradiates the substrate with light from a substantially horizontal direction. The second irradiating means irradiates the substrate with light from obliquely above at an incident angle smaller than that of the first irradiating means. The imaging means is provided almost directly above the substrate. By this imaging means, imaging based on the reflected light from the substrate of the light irradiated by the first irradiation means and the reflected light from the substrate of the light irradiated by the second irradiation means is performed. Then, based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, the inspection means excludes at least the information print area, extracts the solder equivalent area, and inspects the solder equivalent. Is done.

  When the substrate is irradiated with light from a substantially horizontal direction, the region corresponding to the solder can be brightly imaged mainly by irregular reflection. However, in this case, the information print area is also brightly imaged. In this respect, according to the means 2, by irradiating the substrate from obliquely above with an incident angle smaller than that of the first irradiating means, no irregular reflection occurs in the area corresponding to the solder, and irregular reflection occurs in the information printing area. It is possible to irradiate light that causes That is, the information print area can be specified from the image data corresponding to the reflected light of the light by the first and second irradiation means. Then, when extracting the area of the solder equivalent such as cream solder, the area of the solder equivalent and the information print area are distinguished, and the information print area is excluded. As a result, inspection accuracy can be increased.

  Further, according to the means 2, the light from the electrode located around the solder equivalent is reflected by the second irradiating means irradiating light obliquely from above with a smaller incident angle than the first irradiating means, It is easier to distinguish the electrode region. Therefore, the solder equivalent and the electrode region around the solder can be clearly distinguished, and the solder equivalent region can be extracted very easily. As a result, it is possible to further improve the inspection accuracy.

  The electrodes include lands and circuit patterns made of copper foil, gold plating, and solder plating. The same applies to the following means.

Means 3. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
First irradiation means for irradiating the substrate with light from a substantially horizontal direction;
A second irradiating means for irradiating light on the substrate from obliquely above at an incident angle smaller than that of the first irradiating means;
A third irradiating means for irradiating the substrate with light from above at an incident angle smaller than that of the second irradiating means;
Reflected light from the substrate that is provided almost immediately above the substrate and irradiated by the first irradiation means, reflected light from the substrate of light irradiated by the second irradiation means, and Imaging means for performing imaging based on reflected light from the substrate of the light irradiated by the third irradiation means;
Based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, at least the information printing area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. An inspection device for a substrate, comprising: an inspection means.

  Particularly in the means 3, the first irradiating means irradiates the substrate with light from a substantially horizontal direction. The second irradiating means irradiates the substrate with light from obliquely above at an incident angle smaller than that of the first irradiating means. Furthermore, the third irradiating unit irradiates the substrate with light from above at a smaller incident angle than the second irradiating unit. The imaging means is provided almost directly above the substrate. By this imaging means, the reflected light from the substrate of the light irradiated by the first irradiation means, the reflected light of the light irradiated by the second irradiation means from the substrate, and the third irradiation means were irradiated. Imaging is performed based on light reflected from the substrate. Then, based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, the inspection means excludes at least the information print area, extracts the solder equivalent area, and inspects the solder equivalent. Is done.

  If light is irradiated onto the substrate from a substantially horizontal direction, the area corresponding to the solder can be imaged brightly as described above, but the information print area is also imaged brightly. In this respect, according to the means 3, by irradiating the substrate with light at an angle of incidence smaller than that of the first irradiating means from the upper side, irregular reflection does not occur in the solder equivalent area, and irregular reflection occurs in the information printing area. It is possible to irradiate light that causes waking. That is, the information print area can be specified from the image data corresponding to the reflected light of the light by the first and second irradiation means. Then, when extracting the area of the solder equivalent such as cream solder, the area of the solder equivalent and the information print area are distinguished, and the information print area is excluded. As a result, inspection accuracy can be increased.

  In addition, as described above, it is also possible to distinguish between the solder equivalent and the peripheral electrode region by irradiating light from obliquely above with the second irradiation means.

  However, the solder equivalent contains a flux for increasing the wettability. And when there is much content of this flux, the surface of solder equivalent may be in the state covered with the flux. The flux region that is the region covered with the flux is extracted by light irradiation from above obliquely by the second irradiation means, and the flux region (part or all of the solder equivalent region) is the electrode. May be indistinguishable from area.

  In this respect, according to the means 3, the third irradiating means emits light from above at a smaller incident angle than the second irradiating means. Since the flux region is also a solder equivalent region, it is specified by light irradiation by the first irradiation means, and is also specified by light irradiation by the second and third irradiation means. On the other hand, the electrode region is specified by light irradiation by the second and third irradiation means. Therefore, the electrode region and the flux region can be distinguished by the light irradiation by the first to third irradiation means, and the solder equivalent region can be very easily extracted. As a result, it is possible to further improve the inspection accuracy.

Means 4. In the inspection apparatus according to means 3,
The third irradiating means is set in a range in which the incident angle of the light with respect to the substrate is not less than 0 degrees and less than 10 degrees.

  According to the means 4, the incident angle of light with respect to the substrate by the third irradiating means is set in a range of 0 degree or more and less than 10 degrees. If the image data obtained by setting such an incident angle and the image data based on the irradiation by the first and second irradiation means are used together, the electrode region and the flux region can be properly distinguished. it can.

Means 5. In the inspection apparatus according to means 3 or 4,
The third irradiating means irradiates red light having a peak wavelength in a range of more than 600 nm and less than 680 nm.

Means 6. In the inspection apparatus according to means 3 or 4,
The third irradiating means irradiates green light having a peak wavelength in a range of more than 500 nm and less than 590 nm.

  As described above, the second and third irradiation means are for specifying the electrode region. By irradiating visible light having a peak wavelength in a range of 500 nm or more, the red system electrode is imaged brighter. The

  In this respect, according to the means 5, since the red light having the peak wavelength is irradiated in the range exceeding 600 nm and below 680 nm by the third irradiating means, the red system electrode is imaged brighter, and the electrode region is more imaged. Easy to distinguish.

  Further, according to the means 6, since the third irradiating means emits green light having a peak wavelength in a range of more than 500 nm and less than 590 nm, the red system electrode is imaged brighter, and the electrode region is further distinguished. It's easy to do.

Mean 7 In the inspection apparatus according to any one of means 2 to 6,
The substrate inspection apparatus, wherein the first irradiation means is set in a range in which an incident angle of the light with respect to the substrate is more than 60 degrees and less than 80 degrees.

  According to the means 7, the incident angle of light with respect to the substrate by the first irradiating means is set in a range of more than 60 degrees and less than 80 degrees. If the image data obtained by setting the incident angle and the image data based on the irradiation by the second irradiation unit are used together, it is possible to distinguish the solder equivalent region from the information printing region. it can.

Means 8. In the inspection apparatus according to any one of means 2 to 7,
The substrate irradiation apparatus characterized in that the first irradiation means irradiates ultraviolet rays having a peak wavelength in a range of more than 365 nm and less than 500 nm, or violet light or blue light.

  According to the means 8, since the first irradiation means emits ultraviolet light having a peak wavelength in the range of more than 365 nm and less than 500 nm, or violet light or blue light, for example, the second and third irradiation means are 500 nm or more. If it is set as the structure which irradiates visible light which has a peak wavelength in the range (range different from a 1st irradiation means), simultaneous irradiation with the said 2nd and 3rd irradiation means will be attained. Further, if the first irradiating means irradiates visible light of 420 nm or more, it is advantageous in that a visible light camera that is less expensive than an ultraviolet camera can be adopted as the imaging means. Further, for example, by adopting a color camera as the imaging means, for example, simultaneous irradiation with the second and third irradiation means having a peak wavelength in a range of 500 nm or more can be performed, and imaging based on each reflected light can be performed at once. it can. In this way, the irradiation / imaging control can be simplified.

  In addition, it is good also as "the said 1st irradiation means irradiates purple light thru | or blue light which has a peak wavelength in the range above 420 nm and less than 500 nm on the assumption that a visible light camera is used as an imaging means."

Means 9. In the inspection apparatus according to any one of means 2 to 8,
2. The substrate inspection apparatus according to claim 1, wherein the second irradiation means is set in a range in which an incident angle is greater than 10 degrees and less than 30 degrees.

  According to the means 9, the incident angle of light with respect to the substrate by the second irradiating means is set in a range of more than 10 degrees and less than 30 degrees. If the image data obtained by setting such an incident angle and the image data based on the irradiation by the first irradiation means are used together, it is possible to distinguish the solder equivalent area from the information printing area. it can. That is, by setting such an incident angle, it is possible to perform irradiation that causes irregular reflection in the information printing region without causing irregular reflection in the solder equivalent region.

  The reason why the above-mentioned range exists in the incident angle is that the appropriate incident angle differs somewhat depending on the sensitivity of the image pickup means, the binarization threshold when processing the image data, and the like. Experimentally, when the incident angle is near 20 degrees, the irregular reflection in the information printing region is relatively large. Therefore, “the second irradiating means may be set in a range where the incident angle is more than 12 degrees and less than 28 degrees”, or “the second irradiating means has an incident angle of more than 14 degrees and 26 degrees. It is good also as "being set to the range which falls below a degree", and "the said 2nd irradiation means should be set to the range where an incident angle exceeds 16 degree | times and is less than 24 degree | times" The second irradiating means may be set such that the incident angle exceeds 18 degrees and falls below 22 degrees. Of course, “the second irradiation means may have an incident angle set to 20 degrees”. The same applies to the following means.

Means 10. In the inspection apparatus according to any one of means 2 to 9,
The substrate irradiation apparatus, wherein the second irradiation unit irradiates green light having a peak wavelength in a range of more than 500 nm and less than 590 nm.

Means 11. In the inspection apparatus according to any one of means 2 to 9,
The substrate inspection apparatus, wherein the second irradiation means irradiates red light having a peak wavelength in a range of more than 600 nm and less than 680 nm.

  As described above, the second irradiating means is for specifying an electrode region, and by irradiating visible light having a peak wavelength in a range of 500 nm or more, the red system electrode is imaged brighter.

  In this respect, according to the means 10, since the second irradiating means emits green light having a peak wavelength in a range of more than 500 nm and less than 590 nm, the red system electrode is imaged more brightly, and the electrode region is more imaged. Easy to distinguish.

  Further, according to the means 11, since the second irradiating means emits red light having a peak wavelength in a range of more than 600 nm and less than 680 nm, the red system electrode is imaged brighter, and the electrode area is further distinguished. It's easy to do.

  In addition, it is preferable that the second irradiation unit irradiates visible light having a peak wavelength in a range different from that of the third irradiation unit. This is because simultaneous irradiation with the third irradiating means is possible, and by adopting a color camera as the imaging means, imaging based on each reflected light can be performed at a time. That is, in a configuration in which the third irradiation means emits red light having a peak wavelength in a range higher than 600 nm and lower than 680 nm, the second irradiation means irradiates green light having a peak wavelength in a range higher than 500 nm and lower than 590 nm. It is preferable to adopt the configuration to do. Similarly, in a configuration in which the third irradiating means emits green light having a peak wavelength in a range higher than 500 nm and lower than 590 nm, the second irradiating means emits red light having a peak wavelength in a range higher than 600 nm and lower than 680 nm. It is preferable to employ a configuration for irradiation. Such a technical idea is expressed as the following configuration.

Means 12. In the inspection apparatus according to any one of means 2 to 11,
Each of the irradiation means simultaneously irradiates light having a peak wavelength in different ranges,
The substrate inspection apparatus, wherein the imaging unit can acquire a plurality of image data corresponding to each reflected light by one imaging corresponding to the irradiation of the irradiation unit.

  According to the means 12, light having peak wavelengths in different ranges is simultaneously irradiated by the respective irradiation means. Then, a plurality of image data corresponding to each reflected light is acquired by one imaging by the imaging means. Therefore, the irradiation / imaging control can be simplified.

Means 13. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
First irradiation means for irradiating the substrate with purple light or blue light having a peak wavelength in a range of more than 420 nm and less than 500 nm from a substantially horizontal direction;
A second irradiating means for irradiating the substrate with green light having a peak wavelength in a range of more than 500 nm and lower than 590 nm from obliquely above at an incident angle smaller than that of the first irradiating means;
A third irradiating means for irradiating the substrate with red light having a peak wavelength in a range from above 600 nm to below 680 nm at an incident angle smaller than that of the second irradiating means;
Reflected light from the substrate that is provided almost immediately above the substrate and irradiated by the first irradiation means, reflected light from the substrate of light irradiated by the second irradiation means, and Imaging means for performing imaging based on reflected light from the substrate of the light irradiated by the third irradiation means at a time;
Based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, at least the information printing area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. An inspection apparatus for a substrate, comprising: inspection means.

  In the means 13, the first to third irradiating means irradiate light from the substantially horizontal direction, obliquely upward, and above, respectively. Therefore, as in the above configuration, the information print area can be specified from the image data corresponding to the reflected light of the light by the first and second irradiation means. Then, when extracting the area of the solder equivalent such as cream solder, the area of the solder equivalent and the information print area are distinguished, and the information print area is excluded. As a result, inspection accuracy can be increased.

  In addition, the flux region and the electrode region can be distinguished by light irradiation by the first to third irradiation means. Therefore, the solder equivalent region is very easy to extract. As a result, it is possible to further improve the inspection accuracy.

  Furthermore, since visible light having peak wavelengths in different ranges is irradiated by the first to third irradiation means, imaging based on each reflected light is performed on the premise of simultaneous irradiation by the first to third irradiation means. Done at once. Therefore, the irradiation / imaging control can be simplified.

Means 14. In the inspection apparatus according to means 13,
The first irradiation means is set in a range in which an incident angle with respect to the substrate is more than 60 degrees and less than 80 degrees,
The second irradiating means is set in a range in which an incident angle with respect to the substrate is more than 10 degrees and less than 30 degrees,
The third irradiating means is set in a range in which an incident angle with respect to the substrate is not less than 0 degrees and less than 10 degrees.

  According to the means 14, the incident angle of light with respect to the substrate by the first to third irradiation means is in the range of more than 60 degrees and less than 80 degrees, in the range of more than 10 degrees and less than 30 degrees, and in the range of 0 degrees to less than 10 degrees. Since each of the ranges is set, as described above, the solder equivalent area, the information printing area, the electrode area, and the flux area (part or all of the solder equivalent area) can be clearly distinguished. The equivalent region is very easy to extract. As a result, it is possible to further improve the inspection accuracy.

Means 15. In the inspection apparatus according to any one of means 2 to 14,
In the image data corresponding to the reflected light of the light irradiated by the first irradiation means and the image data corresponding to the reflected light of the light irradiated by the second irradiation means, the inspection means An inspection apparatus for a substrate, wherein an area composed of the above pixels is excluded as the information printing area.

  According to the means 15, in the image data corresponding to the reflected light of the light irradiated by the first irradiation means and the image data corresponding to the reflected light of the light irradiated by the second irradiation means by the inspection means. An area composed of pixels that are equal to or higher than the set luminance is excluded as an information print area. In this way, the information printing area can be excluded relatively easily.

  The set brightness is set corresponding to each image data. For example, the set luminance is set as a binarization threshold, binarization is performed on each image data, and, for example, a common area composed of pixels set to “1” is excluded. The same applies to the following means.

Means 16. In the inspection apparatus according to any one of means 2 to 15,
The inspection means includes image data corresponding to the reflected light of the light irradiated by the first irradiation means, image data corresponding to the reflected light of the light irradiated by the second irradiation means, and the third In all of the image data corresponding to the reflected light of the light irradiated by the irradiation means, the surface composed of pixels having a luminance equal to or higher than the set luminance is covered with a flux for improving the wettability of the solder equivalent. A substrate inspection apparatus characterized by specifying a flux region as a region and extracting the solder equivalent region including the flux region.

  According to the means 16, the image data corresponding to the reflected light of the light irradiated by the first irradiation means, the image data corresponding to the reflected light of the light irradiated by the second irradiation means by the inspection means, and In all of the image data corresponding to the reflected light of the light irradiated by the third irradiation means, an area composed of pixels having a set luminance or higher is specified as the flux area. Then, a solder equivalent region including this flux region is extracted. In this way, it is possible to relatively easily identify the flux region and extract the solder equivalent region.

Means 17. Obtained by imaging means for imaging a substrate provided with a solder equivalent for electrically connecting and fixing a component mounted on the substrate to an electrode disposed on the substrate, and imaging by the imaging means An inspection device including inspection means for inspecting the solder equivalent based on image data,
The substrate has an information printing area on which various types of information are printed,
The imaging means includes
A first illumination condition in which the solder equivalent region and the information printing region are imaged brighter than the electrode region;
It is possible to image at least the information printing area with the second illumination condition in which the image is brighter than the area of the solder equivalent,
The inspection means excludes at least the information printing area based on the image data as the imaging result under the first illumination condition and the image data as the imaging result under the second illumination condition, and determines the area corresponding to the solder equivalent A substrate inspection apparatus that extracts and inspects the solder equivalent.

  According to the means 17, the imaging means performs imaging under the first and second illumination conditions. Then, based on the image data as the imaging result under the first illumination condition and the image data as the imaging result under the second illumination condition, at least the information print area is excluded and the solder equivalent area is extracted by the inspection unit. The solder equivalent is inspected.

  Here, under the first illumination condition, the solder equivalent region and the information print region are imaged brighter than the electrode region. In the second illumination condition, the information printing area is imaged brighter than the area corresponding to the solder. Therefore, the information print area can be specified from the image data as the imaging result based on the first and second illumination conditions. Then, when extracting the area of the solder equivalent such as cream solder, the area of the solder equivalent and the information print area are distinguished, and the information print area is excluded. As a result, inspection accuracy can be increased.

Means 18. Obtained by imaging means for imaging a board provided with a solder equivalent for electrically connecting and fixing a component mounted on the board to an electrode disposed on the board, and imaging by the imaging means An inspection device including inspection means for inspecting the solder equivalent based on image data,
The substrate has an information printing area on which various types of information are printed,
The area of the solder equivalent is composed of a solder area where the solder equivalent is exposed, and a flux area where the surface is covered with a flux for improving the wettability of the solder equivalent. And
The imaging means includes
A first illumination condition in which the solder equivalent region and the information printing region are imaged brighter than the electrode region;
A second illumination condition in which the information printing area, the electrode area, and the flux area are imaged brighter than the solder area;
The electrode area and the flux area can be imaged under a third illumination condition where the image is brighter than the solder area and the information printing area,
The inspection means is based on image data as an imaging result under the first illumination condition, image data as an imaging result under the second illumination condition, and image data as an imaging result under the third illumination condition. An inspection apparatus for a substrate, wherein an area of the solder equivalent is extracted by excluding an information printing area, and the solder equivalent is inspected.

  According to the means 18, the imaging under the first to third illumination conditions is performed by the imaging means. And by the inspection means, at least information based on image data as an imaging result under the first illumination condition, image data as an imaging result under the second illumination condition, and image data as an imaging result under the third illumination condition The print area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. Here, the solder equivalent area is composed of a solder area where the solder equivalent is exposed, and a flux area where the surface is covered with a flux for improving the wettability of the solder equivalent. Has been.

  Under the first illumination condition, the area corresponding to the solder (solder area and flux area) and the information print area are imaged brighter than the electrode area. In the second illumination condition, the information printing area, the electrode area, and the flux area are imaged brighter than the solder area. Therefore, the information print area can be specified from the image data as the imaging result based on the first and second illumination conditions. Then, when extracting the area of the solder equivalent such as cream solder, the area of the solder equivalent and the information print area are distinguished, and the information print area is excluded. As a result, inspection accuracy can be increased.

  Further, the flux region and the electrode region can be distinguished from the image data as the imaging result under the first to third illumination conditions. Therefore, the solder equivalent region is very easy to extract. As a result, it is possible to further improve the inspection accuracy.

  Hereinafter, an embodiment will be described with reference to the drawings.

  FIG. 1 is a schematic configuration diagram schematically showing an inspection apparatus 1 as a “substrate inspection apparatus” in the present embodiment. This inspection apparatus 1 is for inspecting the printed state of solder on a printed circuit board 30 as a “substrate”. First, the printed circuit board 30 will be described.

  FIG. 2 schematically shows the configuration of the printed circuit board 30, (a) is a partially enlarged plan view of the printed circuit board 30, and (b) is a cross-sectional view taken along line AA in (a). .

  As shown in FIG. 2, the printed circuit board 30 has a flat plate shape (having a flat surface), and a base substrate 31 made of glass epoxy or the like is provided with an electrode pattern 32 made of copper foil. Of course, the electrode pattern 32 may be plated with gold or solder. On the electrode pattern 32, cream solder 33 as "solder equivalent" is printed. This cream solder 33 contains a flux for improving wettability. FIG. 2 shows a state in which the vicinity of the top of the cream solder 33 is covered with the flux film 36.

  Further, the printed circuit board 30 is coated with a translucent resist film 34 as a film so that the cream solder 33 is not applied to portions other than the predetermined wiring portion of the electrode pattern 32. The surface of the resist film 34 is a plane having a substantially constant height. Further, a printing portion 35 is formed on the resist film 34 in the vicinity of the electrode pattern 32. Although the printing unit 35 is shown in a rectangular shape in FIG. 2 for the sake of convenience, it is actually a character, a symbol, or the like, such as an electronic component number or a frame line indicating the arrangement position of the electronic component. It is information. Therefore, the printing unit 35 is inevitably printed and formed at a position close to the electrode pattern 32 to which the electronic component is connected. The printing unit 35 is formed by silk screen printing or ink jet printing using a screen mesh such as silk, polyamide, or polyester for the plate material.

  The inspection apparatus 1 according to the present embodiment inspects the printing state of the cream solder 33 on the printed circuit board 30. More specifically, after extracting the region of the cream solder 33, two-dimensional measurement is performed, the area is obtained, and then the height measurement is performed, thereby performing the three-dimensional measurement of the cream solder 33 and performing various inspections. It is embodied as something to do.

  Next, the configuration of the inspection apparatus 1 will be described.

  As shown in FIG. 1, the inspection apparatus 1 includes a base 2, and an X-axis moving mechanism 3 and a Y-axis moving mechanism 4 are provided on the base 2. A rail 10 is disposed on the Y-axis moving mechanism 4, and the printed circuit board 30 is placed on the rail 10. The printed circuit board 30 moves in the X-axis direction and the Y-axis direction by operating the X-axis moving mechanism 3 and the Y-axis moving mechanism 4.

  The inspection apparatus 1 also includes a three-dimensional measurement irradiation unit 5, a CCD camera 6 as an “imaging unit”, and a main control unit 7 electrically connected to the CCD camera 6. The three-dimensional measurement irradiating means 5 is configured to irradiate a predetermined light pattern obliquely from above to the surface of the printed circuit board 30 when the cream solder 33 is three-dimensionally measured. The CCD camera 6 is disposed directly above the printed circuit board 30 and can image the portion of the printed circuit board 30 irradiated with the light pattern. The main control means 7 performs image processing based on the image data captured by the CCD camera 6 by a three-dimensional measurement method, and performs three-dimensional measurement (mainly height measurement and volume measurement) of the cream solder 33. It has come to be.

  Further, in the present embodiment, as described above, prior to the three-dimensional measurement, the cream solder 33 is extracted and two-dimensionally measured, and the inspection related to the cream solder 33 is performed based on the various two-dimensionally measured values. Has come to do. That is, it can be said that the main control means 7 includes inspection means 8 related to the cream solder 33, and the inspection means 8 includes a two-dimensional inspection unit 8A and a three-dimensional inspection unit 8B (see FIG. 5). . Although a detailed description is not given here, any measurement method such as a phase shift method, a light cutting method, a spatial code method, a focusing method, or the like is appropriately employed for the three-dimensional measurement in the present embodiment.

  In this embodiment, since it has the characteristics in the two-dimensional measurement including the extraction regarding the cream solder 33 performed in the two-dimensional inspection unit 8A and the inspection, this extraction and the like will be described next.

  The inspection apparatus 1 includes means for extracting a region where the cream solder 33 is disposed. The means includes the solder extraction irradiation means 11, the CCD camera 6, and the like.

  The solder extraction irradiating unit 11 irradiates the printed circuit board 30 with predetermined light prior to the irradiation of the light pattern by the three-dimensional measurement irradiating unit 5. More specifically, as shown in FIGS. 3 and 4, the solder extraction irradiating means 11 includes one ring light 12 that can irradiate the printed circuit board 30 from below and two ring lights that can irradiate the printed circuit board 30 from above. 13 and 14. In the following, when distinguishing the ring lights 12 to 14, the ring light 12 located at the bottom is the first ring light 12, the ring light 13 located above the second ring light 13, and the ring light 14 located at the top is the third ring light. 14 is described.

  The first ring light 12 performs light irradiation from a substantially horizontal direction. In particular, in this embodiment, the incident angle with respect to the measurement surface of the printed circuit board 30 is set to 74 degrees (see FIG. 4). The light emitted from the first ring light 12 is blue light having a peak wavelength in a range of more than 450 nm and less than 500 nm. The first ring light 12 corresponds to “first irradiating means”.

  The second ring light 13 emits light from obliquely above at a smaller incident angle than the first ring light 12. In particular, in this embodiment, the incident angle with respect to the measurement surface of the printed circuit board 30 is set to 20 degrees (see FIG. 4). The light emitted from the second ring light 13 is green light having a peak wavelength in a range of more than 500 nm and less than 590 nm. The second ring light 13 corresponds to “second illumination means”.

  The third ring light 14 performs light irradiation (= epi-illumination) at a smaller incident angle (closer to irradiation from the orthogonal direction) than the second ring light 13. In particular, in this embodiment, the incident angle with respect to the measurement surface of the printed circuit board 30 is set to 0 degree (see FIG. 4). The light emitted from the third ring light 14 is red light having a peak wavelength in a range of more than 600 nm and less than 680 nm. The third ring light 14 corresponds to “third irradiation means”.

  The CCD camera 6 is composed of a color camera, and can perform imaging based on each reflected light at the same time after simultaneous irradiation from the first to third ringlights 12 to 14 is performed. . Of course, a monochrome camera may be adopted, but in this case, irradiation from the first to third ring lights 12 to 14 is alternately switched, and the imaging timing based on each reflected light is shifted. Become.

  Next, the electrical configuration of the inspection apparatus 1 centering on the main control means 7 will be described.

  As shown in FIG. 5, the CCD camera 6 is electrically connected to the main control means 7. As described above, the main control unit 7 includes the inspection unit 8 (two-dimensional inspection unit 8A and three-dimensional inspection unit 8B). At the same time, the main control means 7 is connected to a pattern data input means 9 for inputting rough information such as printed arrangement data of the cream solder 33 and circuit pattern data relating to the printed circuit board 30.

  An irradiation control means 21 is also connected to the main control means 7. The irradiation control means 21 is connected to the three-dimensional measurement irradiation means 5 and the solder extraction irradiation means 11 (first to third ringlights 12 to 14), and based on a control signal from the main control means 7, Execution control of irradiation of each irradiation means 5, 11 (12, 13, 14) is performed (see also FIGS. 3 and 4).

  The main control means 7 is further connected with an X-axis movement control means 22 and a Y-axis movement control means 23. These X-axis movement control means 22 and Y-axis movement control means 23 appropriately drive and control the X-axis movement mechanism 3 and the Y-axis movement mechanism 4 based on a control signal from the main control means 7. Thereby, the printed circuit board 30 is appropriately moved in the X-axis direction and the Y-axis direction.

  Next, the operation of the inspection apparatus 1 configured as described above will be described focusing on the contents of control performed by the main control means 7.

  First, the main control means 7 irradiates light from the ring lights 12, 13, 14 of the solder extraction irradiating means 11 through the irradiation control means 21 in order to perform the region extraction and two-dimensional measurement of the cream solder 33. Then, the printed circuit board 30 irradiated with light is imaged by the CCD camera 6. At this time, the region extraction and two-dimensional measurement of the cream solder 33 are performed based on the image data corresponding to each reflected light obtained by imaging. Since the first to third ring lights 12 to 14 emit blue light, green light, and red light, as described above, the image data corresponding to each reflected light is RGB luminance value data. That is, it is stored in a storage area (not shown) as red luminance value data, green luminance value data, and blue luminance value data.

  Here, the region extraction processing for extracting the region of the cream solder 33 will be described based on the flowchart of FIG. This region extraction process is executed by the two-dimensional inspection unit 8A of the inspection means 8.

  In the first step (hereinafter, the step is simply indicated by symbol S) 100, binarization is performed based on image data (blue luminance value data) corresponding to blue reflected light. By this binarization, it is possible to specify a region that causes diffuse reflection (a region that is brightly imaged) in the irradiation of the blue light by the first ring light 12. Specifically, as shown in FIG. 7A, the area corresponding to the cream solder 33 (including the area of the flux film 36) and the pixel corresponding to the printing unit 35 (the hatched portion in the figure) are set to “1”. Pixels in other areas are binarized as “0”. Hereinafter, the binarized data obtained here is described as “blue image data”.

  In subsequent S110, binarization is performed based on the image data (green luminance value data) corresponding to the green reflected light. By this binarization, it is possible to specify a region (region brightly imaged) that causes irregular reflection in the irradiation of green light by the second ring light 13. Specifically, as shown in FIG. 7B, the pixel pattern (shaded area in the drawing) of the electrode pattern 32 region, the printing unit 35, and the flux film 36 region is “1”, and other regions. This pixel is binarized as “0”. Hereinafter, the binarized data obtained here is described as “green image data”.

  In the next S120, binarization is performed based on the image data (red luminance value data) corresponding to the red reflected light. By this binarization, it is possible to specify a region that causes diffuse reflection (a region that is brightly imaged) in the irradiation of red light by the third ring light 14. Specifically, as shown in FIG. 7C, the pixels (shaded portions in the drawing) of the electrode pattern 32 and the flux film 36 are “1”, and the pixels of other regions are “1”. It is binarized as “0”. Hereinafter, the binarized data obtained here is described as “red image data”.

  The region of the cream solder 33 is extracted based on the binarized blue image data, green image data, and red image data. The area of the cream solder 33 is covered with a flux film 36 in the vicinity of the center (see FIGS. 2 and 7). Therefore, the region of the cream solder 33 to be extracted is composed of a region where the cream solder 33 is exposed (hereinafter referred to as “solder region”) and a region of the flux film 36 (hereinafter referred to as “flux region”). In the processing from S130 described below, the printing unit 35 (hereinafter referred to as “information printing region”) and the region of the electrode pattern 32 (hereinafter referred to as “electrode region”) are also specified for convenience of description.

  In the present embodiment, the solder area and the information printing area are imaged brighter than the electrode area by imaging with the CCD camera 6 based on the blue light irradiation by the first ring light 12. Therefore, the blue light irradiation by the first ring light 12 corresponds to the “first illumination condition”. Further, the information printing area, the electrode area, and the flux area are imaged brighter than the solder area by the imaging by the CCD camera 6 based on the green light irradiation by the second ring light 13. Therefore, the green light irradiation by the second ring light 13 corresponds to the “second illumination condition”. Furthermore, by the imaging of the CCD camera 6 based on the irradiation of red light by the third ring light 14, the electrode area and the flux area are imaged brighter than the solder area and the information printing area. Therefore, the irradiation of red light by the third ring light 14 corresponds to the “third illumination condition”.

  Returning to the description of the flowchart, in S130 in FIG. 6, the solder region (the region of the cream solder 33 excluding the flux region) is specified. This process specifies an area composed of pixels of “1” for blue image data, “0” for green image data, and “0” for red image data (see FIG. 7).

  In the next S140, an information print area is specified. This process specifies an area composed of pixels of “1” for blue image data, “1” for green image data, and “0” for red image data (see FIG. 7).

  In subsequent S150, an electrode region is specified. This process specifies an area composed of pixels of “0” for blue image data, “1” for green image data, and “1” for red image data (see FIG. 7).

  In next S160, a flux region is specified. This process specifies an area composed of pixels of “1” for blue image data, “1” for green image data, and “1” for red image data (see FIG. 7).

  In continuing S170, the area | region of the cream solder 33 is extracted. In this process, the solder area specified in S130 and the flux area specified in S160 are extracted.

  And after extracting the area | region of the cream solder 33, this area | region extraction process is complete | finished. And the two-dimensional measurement of the area | region of the extracted cream solder 33 is performed.

  In the region extraction process, the solder region, the information printing region, the electrode region, and the flux region are specified in order to make the explanation easy to understand, but in reality, the solder constituting the region of the cream solder 33 is specified. It is only necessary to extract the region and the flux region.

  Therefore, as a realistic process, as shown in the flowchart of FIG. 8, after the binarization process (S200 to S220), for example, an area composed of pixels that are “1” in the blue image data is first set. It is specified (S230), and among the pixels constituting the area, the area (solder area) that is “0” in the green image data, and both the green image data and the red image data are “1”. It is conceivable that the region (flux region) is extracted (S240, S250).

  Thus, in this embodiment, extraction of the area | region of the cream solder 33 which is a measurement object and two-dimensional measurement are performed prior to three-dimensional measurement. That is, the first to third ring lights 12 to 14 emit light in a predetermined wavelength range, the irradiated surface is imaged by the CCD camera 6, and image data corresponding to each reflected light obtained from the imaging by the CCD camera 6. Based on the above, the main control means 7 performs an operation of extracting and two-dimensionally measuring the area of the cream solder 33.

  And various inspections are performed about the cream solder 33 mentioned above, and a quality determination is performed. If it is determined to be defective at the stage in the two-dimensional inspection unit 8A, it is determined to be defective at the previous stage without passing through the next three-dimensional measurement. On the other hand, when it is determined that the inspection result is good, the next three-dimensional measurement is executed in the three-dimensional inspection unit 8B, and mainly the height measurement and the volume measurement are performed. Is executed. In addition, although detailed description here is abbreviate | omitted about three-dimensional measurement, as above-mentioned, arbitrary measuring methods, such as a phase shift method, a light cutting method, a space code method, a focusing method, are employ | adopted suitably. As a three-dimensional measurement procedure using the phase shift method, for example, one exemplified in Japanese Patent Application Laid-Open No. 2003-279334 can be cited.

  Next, the effect exhibited by the inspection apparatus 1 of this embodiment will be described.

  According to the present embodiment, the first ring light 12 irradiates the printed circuit board 30 with blue light having a peak wavelength in a range of more than 450 nm and less than 500 nm at an incident angle of 74 degrees. Further, the second ring light 13 emits green light having a peak wavelength in a range of more than 500 nm and less than 590 nm at an incident angle of 20 degrees smaller than that of the first ring light 12. Further, the third ring light 14 emits red light having a peak wavelength in a range of more than 600 nm and less than 680 nm at an incident angle of 0 degree smaller than that of the second ring light 13. The CCD camera 6 provided almost directly above the printed circuit board 30 performs imaging based on each reflected light from the printed circuit board 30 irradiated with blue light, green light, and red light. Then, based on a plurality of image data corresponding to each reflected light acquired in imaging by the CCD camera 6, the two-dimensional inspection unit 8A extracts a region of the cream solder 33, and a predetermined inspection is performed thereon. At this time, the information printing area (printing unit 35) is excluded when the area of the cream solder 33 is extracted.

  As described above, the first to third ring lights 12 to 14 emit light from substantially the horizontal direction (in the present embodiment, the incident angle is 74 degrees), obliquely upward (incident angle is 20 degrees), and above (incident angle is 0 degrees). Therefore, the information print area can be specified from the image data (blue image data and green image data) corresponding to the reflected light of the light from the first and second ring lights 12 and 13. And when extracting the area | region of the cream solder 33, the area | region of the said cream solder 33 and an information printing area | region can be distinguished, and the said information printing area | region is excluded. As a result, inspection accuracy can be increased.

  Further, the flux region and the electrode region can be distinguished from the image data (blue image data, green image data, red image data) corresponding to the reflected light of the first to third ring lights 12-14. Therefore, the area of cream solder 33 (including the flux area) is very easy to extract. As a result, it is possible to further improve the inspection accuracy.

  Further, visible light having peak wavelengths in different ranges is irradiated by the first to third ring lights 12 to 14. That is, the first ring light 12 is irradiated with blue light having a peak wavelength in a range higher than 450 nm and lower than 500 nm, and the second ring light 13 is irradiated with green light having a peak wavelength in a range higher than 500 nm and lower than 590 nm. The ring light 14 emits red light having a peak wavelength in a range of more than 600 nm and less than 680 nm. Thereby, simultaneous irradiation by the first to third ring lights 12 to 14 becomes possible, and imaging based on each reflected light is performed at once by the CCD camera 6. As a result, the irradiation / imaging control can be simplified.

  Note that the present invention is not limited to the description of the embodiment described above, and the present invention can be implemented in various forms without departing from the gist thereof. For example, you may implement as follows.

  (A) In the embodiment described above, the printed circuit board 30 is irradiated with blue light having a peak wavelength from the first ring light 12 in a range substantially higher than 450 nm and lower than 500 nm from an approximately horizontal direction (at an incident angle of 74 degrees). Met.

  The first ring light 12 is mainly for specifying a solder region, and may be any configuration that can image a solder region brighter.

  For example, the incident angle with respect to the measurement surface of the printed circuit board 30 may be set in a range of more than 60 degrees and less than 80 degrees. Further, it may be configured to irradiate purple light having a peak wavelength in a range higher than 420 nm and lower than 450 nm, or may be irradiated with ultraviolet light having a peak wavelength in a range higher than 365 nm and lower than 420 nm. That is, the first ring light 12 may be irradiated with ultraviolet light having a peak wavelength in a range of more than 365 nm and less than 500 nm, or violet light or blue light. In view of the fact that an ultraviolet camera is more expensive than a visible light camera, it is desirable to have a configuration that emits visible light. Moreover, if it is set as the structure which irradiates visible light, as mentioned above, the imaging based on irradiation by the 1st thru | or 3rd ring lights 12-14 can be performed at once by using the CCD camera 6 which is a color camera. .

  (B) In the said embodiment, it was the structure which irradiates green light with respect to the printed circuit board 30 from diagonally upward (at an incident angle of 20 degree | times) with the 2nd ring light 13. FIG.

  Experimentally, when the incident angle is around 20 degrees, irregular reflection in the information printing region (printing unit 35) is relatively large. However, the appropriate incident angle varies depending on the sensitivity of the CCD camera 6 and the binarization threshold value when the image data is processed.

  Therefore, the incident angle of the second ring light 13 may be set in a range exceeding 10 degrees and less than 30 degrees, may be set in a range exceeding 12 degrees and less than 28 degrees, or 14 It may be set in a range that is more than 26 degrees and less than 26 degrees, may be set in a range that is more than 16 degrees and less than 24 degrees, or may be set in a range that is more than 18 degrees and less than 22 degrees. It is good also as what is done.

  (C) In the above embodiment, the printed circuit board 30 is irradiated with green light having a peak wavelength in a range of more than 500 nm and less than 590 nm by the second ring light 13, and in a range of more than 600 nm and less than 680 nm by the third ring light 14. It was the structure which irradiates red light with a peak wavelength. Thus, if it is set as the structure which irradiates visible light of 500 nm or more, an electrode area | region etc. can be imaged brightly. The second and third ring lights 13 and 14 are configured to irradiate visible light having a peak wavelength in different ranges, so that simultaneous irradiation is possible as described above, and once by the CCD camera 6 which is a color camera. It becomes possible to perform imaging.

  In this case, if it is configured to irradiate visible light of 500 nm or more, the electrode region or the like can be brightly imaged, so one of the second and third ring lights 13 and 14 emits green light and the other is red light. Any structure may be used. That is, contrary to the configuration of the above-described embodiment, green light having a peak wavelength is irradiated by the third ring light 14 in a range higher than 500 nm and lower than 590 nm, and the second ring light 13 has a peak wavelength in a range higher than 600 nm and lower than 680 nm. It is good also as a structure which irradiates the red light which has.

  Here, in a configuration in which simultaneous irradiation or the like is not performed, such as when using a monochrome camera, the second and third ringlights 13 and 14 and further the first ringlight 12 emit visible light having a peak wavelength in the same range. It doesn't matter.

  (D) If attention is paid to the point of excluding the information printing area, it is conceivable to adopt a configuration in which light that can identify (extract) the printing unit 35 is used. For example, the printing unit 35 is often printed in white, but in general, a substance that appears white with natural light includes a fluorescent material. Therefore, for example, if the configuration is such that ultraviolet rays are irradiated, the printing unit 35 fluoresces, and imaging based on the fluorescence becomes possible. In this case, the configuration for irradiating ultraviolet rays corresponds to “irradiation means”.

  (E) Further, focusing on the point of excluding the information print area, if the flux area is not specified, the structure including the first ring light 12 and the second ring light 13 is sufficient. In this case, the first ring light 12 corresponds to a “first irradiation unit”, and the second ring light 13 corresponds to a “second irradiation unit”.

  (F) In the above embodiment, the case of inspecting the cream solder 33 prior to the height measurement (three-dimensional measurement) is specifically embodied, but the present invention can also be applied to the case where the three-dimensional measurement is not performed. Of course there is. For example, the present invention can also be embodied when only two-dimensional measurement such as area measurement of the cream solder 33 is performed. In addition, two-dimensional measurement may be performed for a certain part, and the three-dimensional measurement may be performed for another part. Further, for another portion, both two-dimensional measurement and three-dimensional measurement may be performed.

  (G) In the above embodiment, the details of the inspection contents are not particularly mentioned. For example, based on the two-dimensional measurement result, the area measurement of the cream solder 33 to be inspected, the determination of the measurement value, the position shift determination, the cream It is possible to determine whether or not there is a bridge related to the solder 33.

  (H) As an imaging unit, a line camera may be employed in addition to the CCD camera that can image an area as in the above-described embodiment. Furthermore, for example, a camera that can capture images in an area or line shape, such as a CMOS camera, may be used, and the camera is not necessarily limited to a CCD camera.

  (I) In the above-described embodiment, the case of performing the region extraction and two-dimensional measurement of the cream solder 33 is embodied. However, in the case of performing the region extraction and two-dimensional measurement of the solder bump, the silver paste, the conductive adhesive, and the inspection. It can also be embodied. In addition, the cream solder 33 in the above embodiment and the solder bump, silver paste, conductive adhesive, and the like shown here correspond to “solder equivalent”.

  (J) The light source constituting each of the irradiating means 5 and 11 (12, 13, 14) may be an LED arranged in a ring shape as shown in FIG. Other lamps may be used. Moreover, you may employ | adopt the irradiation means which can irradiate a laser beam.

It is a schematic perspective view which shows typically the inspection apparatus in embodiment. (A) is the elements on larger scale of a printed circuit board, (b) is the sectional view on the AA line of (a). It is a schematic diagram which shows arrangement | positioning structures, such as a solder extraction irradiation means. It is a cross-sectional schematic diagram which shows the arrangement configuration of the irradiation means for solder extraction. It is a block diagram for demonstrating an electrical structure and a control structure. It is a flowchart which shows an area | region extraction process. It is explanatory drawing which shows image data typically. It is a flowchart which shows the area | region extraction process of another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 6 ... CCD camera as imaging means, 7 ... Main control means, 8 ... Inspection means, 8A ... Two-dimensional inspection part, 8B ... Three-dimensional inspection part, 11 ... Solder extraction irradiation means, 12 ... No. DESCRIPTION OF SYMBOLS 1st ring light as 1 irradiation means, 13 ... 2nd ring light as 2nd irradiation means, 14 ... 3rd ring light as 3rd irradiation means, 30 ... Print board as a board | substrate, 31 ... Base substrate, 32 ... Electrode pattern 33 ... Cream solder as solder equivalent, 34 ... Resist film, 35 ... Printing section as information printing area, 36 ... Flux film.

Claims (18)

A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
Irradiating means for irradiating the substrate with light for specifying the information printing area;
An imaging unit that is provided almost directly above the substrate and that performs imaging based on light from the substrate in response to irradiation by the irradiation unit;
Based on image data acquired by imaging by the imaging means, including at least the information printing area, extracting an area of the solder equivalent, and inspecting means for inspecting the solder equivalent. A substrate inspection apparatus. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
First irradiation means for irradiating the substrate with light from a substantially horizontal direction;
A second irradiating means for irradiating the substrate with light at an angle of incidence smaller than that of the first irradiating means from above;
Reflected light from the substrate that is provided almost directly above the substrate and irradiated from the substrate, and reflected light from the substrate that is irradiated from the second irradiation unit. Imaging means for performing imaging based on;
Based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, at least the information printing area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. An inspection device for a substrate, comprising: an inspection means. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
First irradiation means for irradiating the substrate with light from a substantially horizontal direction;
A second irradiating means for irradiating light on the substrate from obliquely above at an incident angle smaller than that of the first irradiating means;
A third irradiating means for irradiating the substrate with light from above at an incident angle smaller than that of the second irradiating means;
Reflected light from the substrate that is provided almost immediately above the substrate and irradiated by the first irradiation means, reflected light from the substrate of light irradiated by the second irradiation means, and Imaging means for performing imaging based on reflected light from the substrate of the light irradiated by the third irradiation means;
Based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, at least the information printing area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. An inspection device for a substrate, comprising: an inspection means. The inspection apparatus according to claim 3, wherein
The third irradiating means is set in a range in which the incident angle of the light with respect to the substrate is not less than 0 degrees and less than 10 degrees. The inspection apparatus according to claim 3 or 4,
The third irradiating means irradiates red light having a peak wavelength in a range of more than 600 nm and less than 680 nm. The inspection apparatus according to claim 3 or 4,
The third irradiating means irradiates green light having a peak wavelength in a range of more than 500 nm and less than 590 nm. The inspection apparatus according to any one of claims 2 to 6,
The substrate inspection apparatus, wherein the first irradiation means is set in a range in which an incident angle of the light with respect to the substrate is more than 60 degrees and less than 80 degrees. The inspection apparatus according to any one of claims 2 to 7,
The substrate irradiation apparatus characterized in that the first irradiation means irradiates ultraviolet rays having a peak wavelength in a range of more than 365 nm and less than 500 nm, or violet light or blue light. The inspection apparatus according to any one of claims 2 to 8,
2. The substrate inspection apparatus according to claim 1, wherein the second irradiation means is set in a range in which an incident angle is greater than 10 degrees and less than 30 degrees. The inspection apparatus according to any one of claims 2 to 9,
The substrate irradiation apparatus, wherein the second irradiation unit irradiates green light having a peak wavelength in a range of more than 500 nm and less than 590 nm. The inspection apparatus according to any one of claims 2 to 9,
The substrate inspection apparatus, wherein the second irradiation means irradiates red light having a peak wavelength in a range of more than 600 nm and less than 680 nm. The inspection apparatus according to any one of claims 2 to 11,
Each of the irradiation means simultaneously irradiates light having a peak wavelength in different ranges,
The substrate inspection apparatus, wherein the imaging unit can acquire a plurality of image data corresponding to each reflected light by one imaging corresponding to the irradiation of the irradiation unit. A board inspection apparatus provided with a solder equivalent for electrically connecting and fixing a component mounted on a board to an electrode disposed on the board,
The substrate has an information printing area on which various types of information are printed,
First irradiation means for irradiating the substrate with purple light or blue light having a peak wavelength in a range of more than 420 nm and less than 500 nm from a substantially horizontal direction;
A second irradiating means for irradiating the substrate with green light having a peak wavelength in a range of more than 500 nm and lower than 590 nm from obliquely above at an incident angle smaller than that of the first irradiating means;
A third irradiating means for irradiating the substrate with red light having a peak wavelength in a range from above 600 nm to below 680 nm at an incident angle smaller than that of the second irradiating means;
Reflected light from the substrate that is provided almost immediately above the substrate and irradiated by the first irradiation means, reflected light from the substrate of light irradiated by the second irradiation means, and Imaging means for performing imaging based on reflected light from the substrate of the light irradiated by the third irradiation means at a time;
Based on a plurality of image data corresponding to each reflected light obtained by imaging by the imaging means, at least the information printing area is excluded, the solder equivalent area is extracted, and the solder equivalent is inspected. An inspection apparatus for a substrate, comprising: inspection means. The inspection apparatus according to claim 13, wherein
The first irradiation means is set in a range in which an incident angle with respect to the substrate is more than 60 degrees and less than 80 degrees,
The second irradiating means is set in a range in which an incident angle with respect to the substrate is more than 10 degrees and less than 30 degrees,
The third irradiating means is set in a range in which an incident angle with respect to the substrate is not less than 0 degrees and less than 10 degrees. The inspection apparatus according to any one of claims 2 to 14,
In the image data corresponding to the reflected light of the light irradiated by the first irradiation means and the image data corresponding to the reflected light of the light irradiated by the second irradiation means, the inspection means An inspection apparatus for a substrate, wherein an area composed of the above pixels is excluded as the information printing area. The inspection apparatus according to any one of claims 2 to 15,
The inspection means includes image data corresponding to the reflected light of the light irradiated by the first irradiation means, image data corresponding to the reflected light of the light irradiated by the second irradiation means, and the third In all of the image data corresponding to the reflected light of the light irradiated by the irradiation means, the area composed of pixels having a luminance equal to or higher than the set luminance is covered with a flux for improving the wettability of the solder equivalent. A substrate inspection apparatus characterized by specifying a flux region as a region and extracting the solder equivalent region including the flux region. Obtained by imaging means for imaging a board provided with a solder equivalent for electrically connecting and fixing a component mounted on the board to an electrode disposed on the board, and imaging by the imaging means An inspection device including inspection means for inspecting the solder equivalent based on image data,
The substrate has an information printing area on which various types of information are printed,
The imaging means includes
A first illumination condition in which the solder equivalent region and the information printing region are imaged brighter than the electrode region;
It is possible to image at least the information printing area with the second illumination condition in which the image is brighter than the area of the solder equivalent,
The inspection means excludes at least the information printing area based on the image data as the imaging result under the first illumination condition and the image data as the imaging result under the second illumination condition, and determines the area corresponding to the solder equivalent A substrate inspection apparatus that extracts and inspects the solder equivalent. Obtained by imaging means for imaging a board provided with a solder equivalent for electrically connecting and fixing a component mounted on the board to an electrode disposed on the board, and imaging by the imaging means An inspection device including inspection means for inspecting the solder equivalent based on image data,
The substrate has an information printing area on which various types of information are printed,
The area of the solder equivalent is composed of a solder area where the solder equivalent is exposed, and a flux area where the surface is covered with a flux for improving the wettability of the solder equivalent. And
The imaging means includes
A first illumination condition in which the solder equivalent region and the information printing region are imaged brighter than the electrode region;
A second illumination condition in which the information printing area, the electrode area, and the flux area are imaged brighter than the solder area;
The electrode area and the flux area can be imaged under a third illumination condition where the image is brighter than the solder area and the information printing area,
The inspection means is based on image data as an imaging result under the first illumination condition, image data as an imaging result under the second illumination condition, and image data as an imaging result under the third illumination condition. An inspection apparatus for a substrate, wherein an area of the solder equivalent is extracted by excluding an information printing area, and the solder equivalent is inspected.

Images