JP2017034202A - Inspection device, mounting device, inspection method and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To highly accurately inspect whether a component is mounted on a substrate, by simple processing.SOLUTION: An inspection device (60) is configured to inspect whether a component is mounted from a pre-mounting image and a post-mounting image of the component capturing the component before and after mounting on a mounting surface of a substrate. The inspection device comprises: a threshold setting part (62) for setting a threshold capable of identifying the substrate from a luminance value of the pre-mounting image; and a mask image generation part (63) for generating a mask image that masks the other region than the substrate, from the pre-mounting image in accordance with the threshold. Specific regions of the pre-mounting images and the post-mounting images corresponding to the mounting surface of the substrate are compared by using the mask image, thereby inspecting whether the component is mounted.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an inspection apparatus, a mounting apparatus, an inspection method, and a program for inspecting whether a component is mounted on a substrate.

  As a mounting apparatus, an apparatus including an inspection apparatus that inspects whether or not a component is mounted on a substrate using an imaging apparatus mounted on a mounting head is known (see, for example, Patent Document 1). In the inspection apparatus described in Patent Document 1, a part is mounted in a mounting region of a board by imaging a mounting surface on the board before and after mounting the component and obtaining a luminance difference between the image before mounting and the image after mounting. It is inspected whether it exists. In such an inspection using the luminance difference before and after mounting, the luminance difference in a portion other than the part may be affected. For this reason, normally, a noise cut is applied to the captured image in order to remove noise around the component.

JP, 2014-110335, A

  By the way, when the body part of a component appears to have the same luminance as the board, the luminance difference between the pre-mounting image and the post-mounting image is small. In this case, the character printed on the body of the component is important in order to obtain the necessary luminance difference. However, if characters printed on the body of the component are thin or thin, the character is erased from the body of the component by applying a noise cut to the post-mounting image. For this reason, there is a possibility that a sufficient luminance difference between the pre-mounting image and the post-mounting image cannot be obtained, and it is erroneously determined that the component is not mounted even though the component is mounted on the mounting surface of the board. there were.

  The present invention has been made in view of the above points, and an object thereof is to provide an inspection apparatus, a mounting apparatus, an inspection method, and a program capable of inspecting whether a component is mounted on a substrate with high accuracy by simple processing. And

  The inspection apparatus according to the present invention is an inspection apparatus that inspects whether or not the component is mounted from the pre-mounting image and post-mounting image of the component obtained by imaging before and after mounting of the component on the mounting surface of the substrate, and the luminance of the pre-mounting image A threshold setting unit configured to set a threshold capable of identifying the substrate from the value; and a mask image generating unit configured to generate a mask image that masks other than the substrate from the pre-mounting image using the threshold, and using the mask image The presence / absence of mounting of the component is inspected by comparing a specific area corresponding to the placement surface of the board in the pre-mounting image and the post-mounting image.

  The inspection method of the present invention is an inspection method for inspecting the presence / absence of mounting of the component from the pre-mounting image and post-mounting image of the component obtained by imaging before and after mounting of the component on the mounting surface of the substrate, and the luminance of the pre-mounting image Setting a threshold that can identify the substrate from the value, generating a mask image that masks other than the substrate from the pre-mounting image by the threshold, and using the mask image, the pre-mounting image and the mounting And a step of inspecting whether or not the component is mounted by comparing a specific area corresponding to the placement surface of the substrate in the subsequent image.

  According to these configurations, since the area other than the substrate is masked by the mask image, the luminance of the area other than the substrate is compared when comparing the specific areas corresponding to the placement surfaces of the pre-mounting image and the post-mounting image. Not affected. Also, since the brightness of the entire image is not cut unlike noise cut, it is possible to appropriately compare specific areas of the pre-mounting image and the post-mounting image, and increase the presence / absence of component mounting by simple processing. It can be inspected with accuracy.

  In the inspection apparatus, the image processing apparatus includes a difference image generation unit that generates a difference image from the pre-mounting image and the post-mounting image, and a specific region extraction unit that extracts the specific region from the difference image using the mask image, Based on the luminance value of the specific area, whether or not the component is mounted is inspected. According to this configuration, the presence / absence of mounting of a component can be inspected with high accuracy from the luminance of a specific area in the difference image between the pre-mounting image and the post-mounting image.

  In the inspection apparatus, the threshold setting unit generates a histogram indicating the number of pixels for each luminance value of the pre-mounting image, and sets the threshold based on the peak value of the histogram. According to this configuration, since the pre-placement image is an image of the board before the component is mounted, the luminance value that takes the peak value of the histogram indicates the average luminance value of the board. Therefore, by setting a threshold value based on this peak value, it is possible to identify the substrate and other than the substrate.

  In the inspection apparatus, the mask image generation unit generates the mask image by binarizing the pre-mounting image using the threshold value. According to this configuration, the mask image can be generated from the pre-mounting image by simple processing.

  A mounting apparatus of the present invention includes the above-described inspection apparatus, a mounting head for mounting the component on the mounting surface, and an imaging device for imaging before and after mounting of the component by the mounting head. . According to this configuration, the mounting surface before and after the mounting of the component by the mounting head is imaged by the imaging device, and a mounting error of the component by the mounting head can be immediately detected from the pre-mounting image and the post-mounting image.

  A program according to the present invention causes an inspection apparatus to execute the above-described inspection method. According to this configuration, by installing a program in the inspection apparatus, it is possible to add a high-precision inspection function for whether or not a component is mounted to the inspection apparatus.

  According to the present invention, the specific area corresponding to the placement surface of the pre-mounting image and the post-mounting image is left and covered with the mask image, so that the specific areas of the pre-mounting image and the post-mounting image are compared with each other and the parts are mounted. Existence can be inspected with high accuracy.

It is a schematic diagram which shows the whole mounting apparatus which concerns on this Embodiment. It is a schematic diagram which shows the mounting head periphery which concerns on this Embodiment. It is a figure which shows an example of the image before mounting of the component which concerns on a comparative example, and the image after mounting. It is a block diagram of the inspection apparatus which concerns on this Embodiment. It is a flowchart which shows an example of the test | inspection process which concerns on this Embodiment. It is a figure which shows an example of the image before mounting of the component which concerns on this Embodiment, and the image after mounting. It is a figure which shows an example of the threshold value setting process which concerns on this Embodiment. It is a figure which shows an example of the mask image which concerns on this Embodiment. It is a figure which shows an example of the difference image which concerns on this Embodiment. It is a figure which shows an example of the specific area | region of the difference image which concerns on this Embodiment.

  Hereinafter, a mounting apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the entire mounting apparatus according to the present embodiment. FIG. 2 is a schematic diagram showing the periphery of the mounting head according to the present embodiment. FIG. 3 is a diagram illustrating an example of a pre-mounting image and a post-mounting image of components according to a comparative example. Note that the mounting apparatus according to the present embodiment is merely an example, and can be changed as appropriate.

  As shown in FIG. 1, the mounting apparatus 1 mounts a component P (see FIG. 2) supplied from a component supply unit 20 such as a tape feeder on the mounting surface of the substrate W by a pair of mounting heads 40. It is configured. A wiring pattern, an electrode pad, and the like are provided on the surface of the substrate W, and a solder paste for bonding to the terminal of the component P in a subsequent reflow process is attached to the wiring pattern, the electrode pad, and the like. The substrate W only needs to be capable of mounting the component P, and the shape and type are not particularly limited. Further, although an IC chip is exemplified as the component P, the component P is not limited to an electronic component as long as it is a component mounted on the substrate W.

  The mounting apparatus 1 is provided with a substrate transport unit 10 that transports the substrate W in the X-axis direction. The substrate transport unit 10 forms a transport path by a pair of conveyor belts 11 that transport the substrate W and a pair of guide rails 12 that guide the transport of the substrate W along each conveyor belt 11. The conveyor belt 11 carries the substrate W before component mounting from one end side in the X axis direction under the mounting head 40 and positions it, and carries the substrate W after component mounting to the other end side in the X axis direction. . The upper parts of the pair of guide rails 12 are bent inward (see FIG. 2). A lift mechanism (not shown) raises the substrate W and the pair of conveyor belts 11 toward the bent portion, and positions the substrate W.

  A tape reel 21 is detachably mounted on the component supply unit 20, and a carrier tape that packages a large number of components P is wound around the tape reel 21. Each component supply unit 20 feeds the components P in order toward the delivery position picked up by the mounting head 40 by the rotation of the tape reel 21. At the delivery position of the mounting head 40, the cover tape on the surface is peeled from the carrier tape, and the component P in the pocket of the carrier tape is exposed to the outside. In the present embodiment, the tape feeder is exemplified as the component supply unit 20, but the component supply unit 20 may be composed of another component supply unit 20 such as a ball feeder.

  The pair of mounting heads 40 mount the component P picked up from the component supply unit 20 on the mounting surface by moving the mounting head 40 in the X-axis direction and the Y-axis direction by the moving mechanism 30. In the moving mechanism 30, a pair of X-axis drive units 32 extending in the X-axis direction are supported by both ends on a pair of Y-axis drive units 31 extending in the Y-axis direction. A pair of X-axis drive units 32 is installed in the pair of Y-axis drive units 31 so as to be movable in the Y-axis direction, and a mounting head 40 is installed in each X-axis drive unit 32 so as to be movable in the X-axis direction. ing. The pair of mounting heads 40 are reciprocated between the component supply unit 20 and the substrate W by the X-axis drive unit 32 and the Y-axis drive unit 31.

  As shown in FIG. 2, the mounting head 40 is configured by providing a plurality of nozzles 42 (only one is shown in the present embodiment) on a head main body 41 supported by an X-axis drive unit 32 (see FIG. 1). ing. Each nozzle 42 is supported by the head main body 41 via a nozzle drive unit 43, and moves up and down in the Z-axis direction by the nozzle drive unit 43 and rotates the nozzle 42 about the Z-axis. Each nozzle 42 is connected to a suction source (not shown) and sucks and holds the component P by a suction force from the suction source. The nozzle 42 is provided with a coil spring, and the component P adsorbed by the nozzle 42 is mounted on the substrate W while the coil spring is contracted.

  The head body 41 is provided with a height sensor (not shown) for detecting the height from the substrate W and a posture recognition unit 45 for detecting the posture of the component P sucked by the nozzle 42. In the height sensor, the distance from the substrate W to the nozzle 42 is detected, and the amount of movement of the nozzle 42 in the vertical direction is controlled based on the detection result. In the posture recognition unit 45, the light emitting elements 46 and the light receiving elements 47 arranged in a horizontal row are opposed to each other in the horizontal direction, and the laser light from each light emitting element 46 is blocked by the component P and the light receiving state of each light receiving element 47 changes. Thus, the suction posture of the component P is recognized. The suction position and suction direction of the nozzle 42 are corrected based on the recognition result of the posture recognition unit 45.

  The head main body 41 includes a substrate imaging unit (not shown) that images the BOC mark on the substrate W from directly above, and a component imaging unit 48 (imaging device) that images the mounting operation of the component P by the nozzle 42 from obliquely above. Is provided. The board imaging unit recognizes the position, warpage, and the like of the substrate W based on the captured image of the BOC mark, and corrects the mounting position of the component P on the board W based on the recognition result. The component imaging unit 48 images before and after the component P is attracted to the component supply unit 20 and also images before and after the component P is mounted on the mounting surface of the substrate W. With these captured images, whether or not the component P is attracted by the nozzle 42 and whether or not the component P is mounted on the substrate W are inspected.

  In addition, the mounting apparatus 1 is provided with a control device 50 that performs overall control of each part of the device, and an inspection device 60 that inspects whether or not the component P is adsorbed by the nozzle 42 and whether or not the component P is mounted on the substrate W. These apparatuses are configured by a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application, and the control program of the mounting apparatus 1 and the inspection method are applied to the inspection apparatus 60. Various parameters such as a determination threshold for determining whether or not the component P is mounted, such as a program to be executed, are stored.

  In the mounting apparatus 1 configured as described above, the mounting head 40 is moved to the component supply unit 20 (see FIG. 1), the component P supplied from the component supply unit 20 is picked up by the nozzle 42, and the substrate W The component P is mounted on a desired mounting surface. In the mounting operation of the component P by the nozzle 42, the mounting of the component P on the substrate W may fail and the component P may not be mounted on the substrate W. Therefore, as described above, before and after the mounting of the component P on the mounting surface of the substrate W is captured as a monochrome image, and whether or not the component P is mounted on the substrate W from the pre-mounting image and the post-mounting image of the component P by the inspection device 60. Has been inspected.

  When inspecting whether or not the component P is mounted, a difference image is generated from the pre-mounting image and the post-mounting image, and whether or not the component P is mounted based on the luminance of each pixel in the determination window set for the difference image Is inspected. However, in the mounting apparatus 1, the pre-mounting image and the post-mounting image are misaligned due to vibrations of the apparatus. If there is a shift in a location where the brightness contrast is clear, such as the silk on the substrate W or the gloss of the electrode pad, the influence of locations other than the part P in the determination window of the difference image becomes large. For this reason, although the component P is not mounted in the post-mounting image, there is a possibility that a change in luminance becomes large and it is erroneously determined that the component P is mounted.

  For this reason, noise cut is generally applied to the entire determination window, and the influence of the deviation between the pre-mounting image and the post-mounting image is suppressed. Incidentally, as shown in FIG. 3A, when a relatively large component P is mounted on the substrate W, the proportion of the component P in the determination window 69 is large. Further, in the monochrome image, the body part of the component P may appear at the same brightness as the substrate W. In such a case, the luminance difference is obtained by the character 74 printed on the body part of the component P. However, as shown in FIG. 3B, when the character 74 of the component P is drawn with a thin line or a thin line, the character 74 is removed by the noise cut applied to the determination window 69, and the component P is mounted. Nevertheless, sufficient brightness cannot be obtained.

  Therefore, in the inspection apparatus 60 according to the present embodiment, instead of performing noise cutting on the difference image, a specific area corresponding to the placement surface of the component P is extracted from the difference image, and based on the luminance of the specific area. Thus, the presence or absence of the component P is inspected. Accordingly, the influence of the brightness of a portion having a clear contrast other than the component P can be suppressed without cutting the character 74 of the body portion of the component P, and the presence / absence of the component P mounted on the substrate W can be inspected with high accuracy. Is possible.

  Hereinafter, the inspection process for the presence / absence of component mounting will be described. FIG. 4 is a block diagram of the inspection apparatus according to the present embodiment. FIG. 5 is a flowchart illustrating an example of the inspection process according to the present embodiment. FIG. 6 is a diagram illustrating an example of a pre-mounting image and a post-mounting image of components according to the present embodiment. FIG. 7 is a diagram illustrating an example of threshold setting processing according to the present embodiment. FIG. 8 is a diagram illustrating an example of a mask image according to the present embodiment. FIG. 9 is a diagram illustrating an example of a difference image according to the present embodiment. FIG. 10 is a diagram illustrating an example of the specific area of the difference image according to the present embodiment.

  First, a control configuration of the inspection apparatus 60 will be briefly described with reference to FIG. The inspection device 60 is connected to the component imaging unit 48 and is configured to be able to acquire a pre-mounting image and a post-mounting image captured by the component imaging unit 48. The inspection device 60 includes a matching unit 61, a threshold setting unit 62, a mask image generation unit 63, a difference image generation unit 64, a specific area extraction unit 65, a calculation unit 66, and a determination unit 67. In the matching unit 61, matching processing for positioning the pre-mounting image and the post-mounting image is performed. In the threshold setting unit 62, a threshold setting process for identifying the mounting surface from the luminance value of the pre-mounting image is performed.

  In the mask image generation unit 63, a mask image generation process for masking other than the placement surface from the pre-mounting image with a threshold is performed. In the difference image generation unit 64, a difference image generation process is performed from the pre-mounting image and the post-mounting image. The specific area extraction unit 65 performs a process of extracting a specific area corresponding to the placement surface from the difference image using the mask image. In the calculation part 66, the calculation process of the sum of squared differences of each pixel of a specific area is implemented. In the determination unit 67, a determination process for determining whether or not a component is mounted is performed by comparing the calculation result with a determination threshold value. In addition, the inspection apparatus 60 is described in a simplified manner, and the configuration that the inspection apparatus 60 normally includes is assumed to be included.

  Next, the flow of the inspection process of the inspection apparatus will be described with reference to FIGS. In the description of the flowchart in FIG. 5, the description will be made by appropriately using the reference numerals attached to the respective blocks in FIG. 4. As shown in FIG. 5, the pre-mounting image and the post-mounting image are input to the inspection apparatus 60 from the component imaging unit 48 (step S01). As shown in FIG. 6A, the pre-mounting image is a monochrome image in which the substrate W before mounting of the component P is imaged obliquely from above by the component imaging unit 48. In the pre-mounting image, silk 71 printed on the substrate W and a mounting surface 73 on which three electrode pads 72 are disposed inside the silk 71 are shown.

  As shown in FIG. 6B, the post-mounting image is a monochrome image in which the board W after mounting the component P is imaged obliquely from above by the component imaging unit 48. In the post-mounting image, the component P placed on the electrode pad 72 of the mounting surface 73 of the substrate W is shown. Note that a monochrome image is an image represented by a single shade of achromatic or chromatic color, and includes a gray scale. Next, matching processing is performed in the matching unit 61 (step S02). In the matching processing, the pre-mounting image and the post-mounting image are aligned in consideration of the warpage and bending of the substrate W that occurs when the component P is mounted.

  Next, threshold setting processing is performed by the threshold setting unit 62 (step S03). As shown in FIG. 7, in the threshold setting process, a histogram indicating the number of pixels for each luminance value of the pre-mounting image is generated, and the threshold is set based on the peak value of the histogram. In this case, since the pre-mounting image is an image of the substrate W before mounting the component P, most of the pre-mounting image is occupied by pixels indicating the substrate W. Therefore, it is considered that the luminance value that takes the peak value of the histogram indicates the average luminance value of the substrate W. Then, a threshold value is set to a luminance value higher than the peak value by a predetermined luminance, and the substrate W and the substrate other than the substrate W are identified on the border of the mountain of the histogram.

  Next, the mask image generation unit 63 performs a mask image generation process (step S04). In the mask image generation process, for each pixel of the pre-mounting image, a pixel having a luminance value equal to or lower than the threshold is identified as the substrate W, and a pixel having a luminance value greater than the threshold is identified as other than the substrate W. Then, pixels having a luminance value equal to or lower than the threshold value are set to black, pixels having a luminance value greater than the threshold value are set to white, and the pre-mounting image is binarized in black and white. Thereafter, as shown in FIG. 8, the binarized image is subjected to noise cut and black-and-white reversal processing to generate a mask image that masks other than the substrate W from the pre-mounting image.

  Next, the difference image generation unit 64 performs a difference image generation process (step S05). As shown in FIG. 9, in the difference image generation process, the difference image is generated by taking the absolute value of the luminance difference between the pre-mounting image and the post-mounting image after matching. The difference image clearly shows the difference in the gloss 75 of the electrode pad 72 between the pre-mounting image and the post-mounting image, in addition to whether or not the component P is mounted. A determination window 69 is set for the difference image, and whether or not the component P is mounted is determined based on the luminance value in the determination window 69, but the influence of the gloss 75 of the electrode pad 72 is large. The gloss 75 of the electrode pad 72 remaining in the difference image may cause an erroneous determination as to whether or not the component P is mounted. The size of the determination window 69 is set according to the size of the component P.

  Next, a specific area extraction process is performed by the specific area extraction unit 65 (step S06). As shown in FIG. 10, in the specific area extraction process, only the specific area corresponding to the placement surface is extracted from the difference image in the determination window 69 using the mask image. That is, only the white portion of the mask image is extracted from the difference image in the determination window 69. As a result, the gloss 75 remaining in the determination window 69 is removed by the mask image, and only the component P is displayed in the determination window 69. When the part P is not shown in the post-mounting image, the determination window 69 is completely black.

  Next, a calculation process of the sum of squared differences is performed in the calculation unit 66 (step S07). In the difference square sum calculation process, the sum of the squares of the luminance values of the pixels in the specific region is calculated. As a result, the luminance difference in the specific region between the pre-mounting image and the post-mounting image is emphasized, and the difference in the calculation result between when the component P is mounted and when it is not mounted becomes clear. In this case, the calculation result is higher by the amount of the character 74 attached to the body part of the part P. Further, since the pixel indicating the gloss 75 (see FIG. 10) is removed from the specific area, the calculation result does not become higher than necessary due to the luminance value of the gloss 75 pixel.

  Next, the determination part 67 determines whether or not the component P is mounted (step S08). In the determination process of whether or not the component P is mounted, the calculation result by the calculation unit 66 is compared with a predetermined determination threshold value. If the calculation result is greater than or equal to the determination threshold, it is determined that “parts are present”, and if the calculation result is lower than the determination threshold, it is determined that “no parts”. In the present embodiment, since the part P is shown in the specific area, the calculation result by the calculation unit 66 is high and it is determined that “part is present”. In this way, focusing on the region where the body part is located after mounting the component P, the luminance difference before and after the mounting of the component P is obtained, so that the determination is facilitated by the increase in the luminance difference.

  In the above description, a configuration has been described in which a mask image is generated by setting a threshold for substrate identification from a pre-mounting image captured when the component P is mounted. However, the threshold setting timing and the mask image generation timing are as follows. It is not limited when the component P is mounted. For example, a mask image may be generated by setting a threshold value from a pre-mounting image captured in advance. That is, the threshold setting timing and the mask image generation timing may be set before the component P is mounted. The above flowchart shows an example to the last, and the order can be changed as appropriate.

  As described above, since the area other than the substrate W is masked by the mask image, the inspection apparatus 60 according to the present embodiment compares specific areas corresponding to the placement surfaces of the pre-mounting image and the post-mounting image. At this time, there is no influence of luminance such as gloss 75 of the electrode pads 72 other than the substrate W. Further, since the brightness of the entire image is not cut unlike noise cut, characters drawn with thin lines or thin lines on the body portion of the component P are not removed. Therefore, the specific areas of the pre-mounting image and the post-mounting image can be appropriately compared, and the presence / absence of mounting of the component P can be inspected with high accuracy by simple processing.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the present embodiment, a specific area is extracted with a mask image from the difference image between the pre-mounting image and the post-mounting image, and whether or not the component P is mounted is inspected by the sum of squares of the difference between the luminance values of the pixels in the specific area. However, it is not limited to this configuration. The presence / absence of the component P may be inspected by comparing specific areas of the pre-mounting image and the post-mounting image using the mask image. For example, the presence / absence of mounting of the component P may be inspected based on the correlation value calculated in the matching process (step S02) of the specific area extracted from the pre-mounting image and the post-mounting image with the mask image.

  Moreover, in this Embodiment, although the structure with which the inspection apparatus 60 was equipped in the mounting apparatus 1 was demonstrated, it is not limited to this structure. The inspection device 60 only needs to be provided in a processing device that requires inspection of whether or not a component is mounted. Further, the inspection device 60 may be a device dedicated to inspection separate from the mounting device 1.

  Moreover, in this Embodiment, although the components imaging part 48 as an imaging device was set as the structure imaged the board | substrate W from diagonally upward, it is not limited to this structure. The imaging device only needs to be able to capture the pre-mounting image and the post-mounting image in a comparable manner. For example, the substrate W may be imaged from directly above. You may image using the board | substrate imaging part which images the BOC mark on the board | substrate W provided in the head main body 41 mentioned above from right above. Note that the component imaging unit 48 that images the substrate W from diagonally above has an imaging region so that an image around the electronic component mounted on the substrate can be captured without the head body 41 moving immediately after component mounting. Is set.

  In the present embodiment, the pre-mounting image and the post-mounting image are captured as monochrome images, but the present invention is not limited to this configuration. The pre-mounting image and post-mounting image may be captured as color images. The threshold setting unit 62 designates the color of the substrate W (for example, green), and sets a threshold that can identify the substrate W in the pre-mounting image from the luminance value (green strength) of the designated color. Then, whether or not the component P is mounted is inspected based on the luminance difference of the specified color in the specific area. In this case, when the component P and the substrate W have different colors, the difference value increases depending on the presence or absence of the component P, so that the sum of squares of the difference with respect to the specific region can be omitted.

  In the present embodiment, the threshold setting unit 62 sets the threshold for substrate identification to a luminance value that is higher by a predetermined luminance than the peak value of the histogram indicating the number of pixels for each luminance value of the pre-mounting image. It is not limited to. The threshold setting unit 62 only needs to set the threshold to a luminance value that can distinguish the histogram between the substrate W and other than the substrate W. For example, in the case of a white substrate, the threshold setting unit 62 sets the threshold to a luminance value lower than a predetermined luminance than the peak value of the histogram, identifies a pixel having a luminance value equal to or higher than the threshold as the substrate W, and sets the threshold A pixel having a smaller luminance value may be identified as other than the substrate W.

  In the present embodiment, the threshold setting unit 62 sets the threshold for substrate identification from the histogram. However, the present invention is not limited to this configuration. The threshold setting unit 62 only needs to set a threshold based on the luminance value of the pre-mounting image, and does not have to generate a histogram from the pre-mounting image.

  In the present embodiment, the determination unit 67 determines whether or not the component P is mounted based on the calculation result of the sum of squared differences with respect to the luminance value of each pixel in the specific region. However, the present invention is not limited to this configuration. The determination unit 67 may be configured to determine whether or not the component P is mounted based on the luminance value of the specific area. For example, the determination unit 67 may determine whether or not the component P is mounted based on the sum of the luminance values of the pixels in the specific area, or may calculate the component P based on the calculation result of the sum of squares of differences with respect to the luminance values of the pixels in the specific area. The presence / absence of mounting may be determined.

  Moreover, in this Embodiment, the board | substrate W is not limited to a printed circuit board, The flexible substrate mounted on the jig | tool board | substrate may be sufficient.

  Furthermore, a program according to the present invention is characterized by causing an inspection apparatus to execute the above inspection method. In addition to this, it may be added as a retry process of an existing inspection program. For example, when the “no mounting” determination occurs in the existing inspection process, the inspection accuracy can be further improved by executing the program of the present invention. Whether or not the retry process is performed may be automatically selected according to the component size or shape, or may be configured so that the user can freely set it.

  As described above, the present invention has an effect that it is possible to inspect the presence / absence of mounting of a component on a substrate with a high degree of accuracy by a simple process. The present invention is useful for an inspection apparatus, a mounting apparatus, an inspection method, and a program for inspecting whether or not a drawn component is mounted.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 40 Mounting head 48 Component imaging part (imaging apparatus)
DESCRIPTION OF SYMBOLS 60 Inspection apparatus 62 Threshold setting part 63 Mask image generation part 64 Difference image generation part 65 Specific area extraction part 73 Mounting surface 74 Character 75 Gloss P Component W board | substrate

Claims (7)

An inspection apparatus for inspecting the presence / absence of mounting of the component from the pre-mounting image and post-mounting image of the component obtained by imaging before and after mounting of the component on the mounting surface of the substrate,
A threshold setting unit for setting a threshold capable of identifying the substrate from the luminance value of the pre-mounting image;
A mask image generation unit that generates a mask image for masking other than the substrate from the pre-mounting image by the threshold value,
An inspection apparatus for inspecting whether or not the component is mounted by comparing a specific area corresponding to the placement surface of the substrate in the pre-mounting image and the post-mounting image using the mask image. A difference image generation unit that generates a difference image from the pre-mounting image and the post-mounting image;
A specific area extraction unit that extracts the specific area with the mask image from the difference image,
The inspection apparatus according to claim 1, wherein the presence or absence of the component is inspected based on a luminance value of the specific area.   The threshold value setting unit generates a histogram indicating the number of pixels for each luminance value of the pre-mounting image, and sets the threshold value based on a peak value of the histogram. The inspection device described.   The inspection apparatus according to claim 1, wherein the mask image generation unit generates the mask image by binarizing the pre-mounting image using the threshold value. The inspection apparatus according to any one of claims 1 to 4,
A mounting head for mounting the component on the mounting surface;
A mounting apparatus comprising: an imaging device that images before and after mounting of a component by the mounting head. An inspection method for inspecting the presence / absence of mounting of the component from the pre-mounting image and the post-mounting image of the component obtained by imaging before and after mounting of the component on the mounting surface of the substrate,
Setting a threshold capable of identifying the substrate from the luminance value of the pre-mounting image;
Generating a mask image for masking other than the substrate from the pre-mounting image by the threshold;
A step of inspecting whether or not the component is mounted by comparing a specific area corresponding to the mounting surface of the substrate in the pre-mounting image and the post-mounting image using the mask image. Inspection method to do.   A program for causing an inspection apparatus to execute the inspection method according to claim 6.

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