KR101779020B1 - Method for mounting components - Google Patents

Abstract

A component mounting method is provided. A component mounting method according to an embodiment of the present invention includes the steps of extracting and storing first alignment data of a part using a first camera, correcting the position of the part on the substrate based on the first alignment data , Mounting the component on the substrate, determining an alignment state of the substrate and the component using a second camera based on the first alignment data to determine a deviation value, And determining an alignment state of the component based on the alignment state.

Description

{METHOD FOR MOUNTING COMPONENTS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method, and more particularly, to a component mounting method capable of quickly and accurately inspecting a mounted state of components.

The component mounting machine is a device for mounting various types and sizes of components on a printed circuit board, and is provided with a pick-up head capable of moving and rotating in the X, Y and Z axes so as to pick up various types and sizes of supplied components. Here, the component may mean an electronic component such as an integrated circuit, a diode, a capacitor, a resistor, or a transistor, which can constitute a circuit on a printed circuit board (hereinafter referred to as a "substrate").

The component mounting machine includes a component feeder for feeding a substrate so that components can be mounted and a component supplier for picking up a component to be mounted on the transferred substrate from a pickup head.

Therefore, when the substrate is transported and stopped at a predetermined position in the transfer section, the component supply section supplies the component to a position where the component can be picked up from the pickup head, and the pickup head picks up the component and mounts the component on the substrate.

After the component is mounted on the board in this manner, a vision inspection apparatus is introduced and used for inspecting the mounted state of the component. The Vision Inspection System is a system in which a computer performs automatic analysis processing of image information obtained through a camera in place of a manual inspection or a measurement operation to be performed by a human eye to correct the position of the inspection object on a printed circuit board, Means a device for detecting a defect occurring in the appearance of an object.

Such a vision inspection apparatus generally uses a pattern matching method. That is, an object to be inspected is photographed with a camera to acquire an image of the object to be inspected, a specific pattern is detected from the obtained image, and the detected pattern and pre-stored pattern (for example, shape, To correct the position of the object to be inspected or to judge whether or not the appearance is defective.

Korean Patent Publication No. 2007-0045960 Korean Patent Publication No. 2006-0104962 Japanese Laid-Open Patent Publication No. 2011-097425

There is a problem that the accuracy of the detection result is lowered when the mounting position of the component placed on the printed circuit board is detected through the vision inspection according to the conventional pattern matching method.

Also, in a system requiring high accuracy and fast recognition time, a considerable cost is required to construct a pattern matching algorithm. For example, in order to inspect a specific lead constituting a semiconductor component in detail, it is necessary to reprocess the detailed information constituting the pattern matching algorithm or to inspect it using an additional inspection algorithm. Therefore, only the pattern matching method itself Sometimes it is not always possible to obtain appropriate results.

Particularly, when a shield case for performing electromagnetic wave shielding or the like is mounted on a printed circuit board, the shield case mounted on the board covers the parts mounted on the printed circuit board, It is difficult to judge whether it is bad or not. Therefore, after the components are mounted on the chip mounter or the like and the inspection of the components is completed, the shield case is mounted on the printed circuit board in a later step. After the shield case is mounted, A separate inspection device for inspecting the state of the wafer is required, which increases the processing time and cost.

An object of the present invention is to provide a component mounting method capable of inspecting an alignment state of a shield case while mounting a shield case on a printed circuit board.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a component mounting method including extracting and storing first alignment data of a component using a first camera, Determining a deviation value by inspecting an alignment state of the substrate with the component using a second camera based on the first alignment data, correcting a position of the component on the substrate, And determining an alignment state of the component based on the deviation value.

Other specific details of the invention are included in the detailed description and drawings.

1 is a schematic view showing a configuration in which a shield case is mounted on a substrate.
2 is a diagram showing a configuration of an apparatus for performing a component mounting method according to an embodiment of the present invention.
3 is a view showing a component mounting method according to an embodiment of the present invention.
Figs. 4 to 6 are diagrams for explaining alignment data including edge information of a part in the component mounting method of Fig. 3; Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration.

In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" and the like, Lt; / RTI > can be used to easily describe the correlation between the two. Like reference numerals refer to like elements throughout the specification.

Hereinafter, a component mounting method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. FIG. 2 is a view showing a configuration of an apparatus for performing a component mounting method according to an embodiment of the present invention, and FIG. 3 is a cross- Fig. 7 is a view showing a component mounting method according to an embodiment.

Referring to FIG. 1, a shield case 120, which is one type of component, is mounted on a printed circuit board 110. A shielded case component mounted on the printed circuit board 110 protects component elements such as a semiconductor chip mounted on the printed circuit board 110 and performs functions such as electromagnetic shielding and electrical connection, Or may be used for packaging purposes for independently modularizing a packaged printed circuit board.

 In the component mounting method according to the present embodiment, the component may mean the shield case 120, but the present invention is not limited thereto, and may be a general component having a corner, for example, a semiconductor chip package or the like. Hereinafter, embodiments of the present invention will be described with reference to the case where the component is the shield case 120 for convenience of explanation.

As described above, a plurality of components can be mounted on the printed circuit board 110 on which a predetermined metal wiring or a conductive material is formed. After inspecting the mounting condition of a plurality of components, The shield case 120 is mounted and the packaging is finished.

2, there is shown the configuration of an exemplary mounting apparatus for performing a component mounting method according to an embodiment of the present invention. The mounting apparatus may include an image acquisition unit 210, a detection unit 220, a control unit 230, a storage unit 240, an input unit 250, and a display unit 260.

The image acquiring unit 210 photographs a part of the printed circuit board 110 on which a vision inspection object such as a shield case 120 is mounted on a stage of the mounting apparatus, Can be obtained. To this end, the image acquisition unit 210 may include one or more cameras. At least one of the at least one camera may be a fiducial camera that recognizes a fiducial mark of the printed circuit board 110 and aligns the substrate 110.

 In addition, the image acquisition unit 210 may further include an analog to digital converter (ADC) capable of converting the acquired image data from an analog signal to a digital signal. The image data obtained through the image obtaining unit 210 may be provided to a detecting unit 220, which will be described later.

The detection unit 220 may detect first alignment data including edge position information for the shield case 120 from the image data acquired by the image acquisition unit 210. [ To this end, the detection unit 220 can detect the shield case 120 from the image data. For example, an edge detection algorithm can be used to detect the shield case 120 from the image data. When the shield case 120 is detected from the image data, the detection unit 220 can calculate the center of gravity of the shield case 120, which is the detected object. The corner information for each vertex can be detected by calculating the position of each vertex based on the calculated center of gravity and the length of two line segments passing through each vertex. The edge information detected by the detection unit 220 may be provided to the control unit 230, which will be described later.

The controller 230 compares the corner position information detected by the detecting unit 220 with the corner position information stored in the storage unit 240 to determine whether the shield case 120 is positioned or not . In this case, the control unit 230 may refer to parameters such as the standard information of the shield case 120, in addition to the corner position information registered in the storage unit 240. In addition, the control unit 230 may connect and control other components.

The storage unit 240 may store parameters necessary for performing an inspection of the component mounting state. For example, standard information such as the length and length of the shield case 120 and the corner position information set can be stored. In addition, the storage unit 240 may store an algorithm necessary for performing the component mounting state check. The storage unit 240 may be implemented as a nonvolatile memory, a volatile memory, a hard disk drive, or a combination thereof.

The input unit 250 may receive input from the user of parameters necessary for performing inspection of the mounting state with respect to the shield case 120. Examples of parameters required for the vision inspection include standard information (e.g., width and height) of the shield case 120 and a set of edge position information for the shield case 120. [ The corner position information set may include one or more corner position information. The corner position information will be described later in detail with reference to Figs. 4 to 6. Fig.

The display unit 260 may display the image data obtained through the image obtaining unit 210 or display the result of the comparison performed by the controller 230, that is, whether the shield case 120 is positioned correctly or not, Can be displayed.

In addition, an exemplary mounting apparatus for carrying out the component mounting method according to an embodiment of the present invention may further include a head portion or the like for mounting the component, and the head portion may include a nozzle, a spindle, A driving means, and the like, so that the component can be mounted at a predetermined position on the substrate.

Referring to FIG. 3, a flowchart illustrating a component mounting method according to an embodiment of the present invention is shown.

A component mounting method according to an embodiment of the present invention includes: extracting and storing first alignment data of a component using a first camera (S110); calculating a position of the component on the substrate based on the first alignment data (S130) of mounting the component on the substrate, checking the alignment state of the substrate and the component using the second camera based on the first alignment data, (S140), and determining the alignment state of the component based on the deviation value (S150).

First, the first alignment data of the part is extracted and stored using the first camera (S110). As described above, the first camera may be a fiducial camera or another camera installed separately. As described above, it is possible to extract the first alignment data of the parts and the edge position information included therein before the parts are mounted on the printed circuit board, and to convert them into data. The specific configuration for extracting the edge position information will be described later in detail with reference to FIGS. 4 to 6. FIG. The process of extracting the first sorting data and storing it and building the database can be performed only once in the initial mounting operation if the parts have the same specifications. If the type of the mounting component is changed, The extraction process can be performed. There is no limitation on the type of the component, and it may be a shield case or another component such as a semiconductor package that covers the upper portion of the printed circuit board.

Subsequently, the position of the component on the substrate is corrected based on the first alignment data (S120). The position of the component with respect to the substrate is controlled based on the extracted corner position information so that the component can be mounted at a desired position on the substrate.

Next, the component is mounted on the substrate (S130). In the case where the component is a shield case, the method of mounting the substrate according to the present embodiment may be performed after another operation of inserting and inspecting the other components on the printed circuit board is completed, followed by a separate post-process. That is, the shield case may be mounted so as to cover the upper portion of the printed circuit board in a state where a plurality of other components are mounted on the printed circuit board.

Subsequently, based on the previously stored first alignment data, a deviation value may be determined by checking alignment of the substrate and the component using a second camera (S140). As described above, the second camera may be a fiducial camera. In the case of performing the vision inspection for checking the alignment of parts using a fiducial camera that performs the alignment process at component mounting, The mounting process and the vision inspection can be performed simultaneously in the mounting apparatus, so that the process can be shortened.

Wherein the step of determining the deviation value comprises the steps of: obtaining image information about an alignment state of the substrate and the component; detecting a position of the component from the image information; And determining a deviation value based on the alignment state of the part and the substrate.

That is, an image is acquired at the stage before mounting the component, and the new image information is acquired to perform the mounting operation and then check the mounting state again.

Further, after changing the shooting area of the second camera to the corresponding corner position based on the one or more corner positional information included in the first alignment data from the image information, the corner of the part and the substrate are aligned .

It is possible to determine whether the corner position included in the first alignment data coincides with the position in the image actually obtained from the second camera and to calculate the deviation value based on the determined position.

Subsequently, the alignment state of the component is determined based on the deviation value (S150). When the calculated deviation value exceeds the predetermined range, it is recognized that the mounted state of the component is defective, so that a predetermined message can be generated and transmitted to the operator, or can be transferred to a tray or the like for transporting the defective substrate.

Figs. 4 to 6 are diagrams for explaining alignment data including edge information of a part in the component mounting method of Fig. 3; Fig.

Fig. 4 illustrates a top view of the shield case 120. Fig. 4, when the shape of the shield case 120 is a polygon surrounded by a plurality of straight lines, the edge position information for the predetermined vertex P1 is obtained by dividing the position of the vertex P1 and the length of each of the two line segments passing through the vertex P1 which may include a 'w _1' and 'l _1'. At this time, the position of the vertex P1 can be calculated based on O (0, 0) which is the center of gravity of the polygon.

In addition, the corner position information is not necessarily defined by only the position of the vertex of the polygon and the two line segments passing through the vertex. For example, as shown in FIG. 5, a point Q1, which is a point shifted from the vertex to the outside of the polygon by a predetermined distance on a straight line connecting the center of gravity of the polygon and the vertex of the polygon, (W ₁ , l ₁ ). 6, a point R1, which is a point shifted by a predetermined distance from the vertex to the inside of the polygon on a straight line connecting the center of gravity of the polygon and the vertex, and a length of two line segments passing through the point R1 w ₁ , l ₁ ). Of the above examples, which case is set as the corner position information may be designated as the default value or may be selected by the user.

On the other hand, the user can register the corner position information set including at least two corner position information on the shield case 120 in the storage unit 240 as parameters necessary for performing the component mounting state inspection (vision inspection) have. At this time, the combination of the number of corner position information included in the corner position information set and the combination of the corner position information can be changed according to the purpose of the vision inspection.

For example, it can be seen that the shield case 120 shown in FIG. 4 includes a total of eight vertexes. This means that the shape of the shield case 120 shown in Fig. 4 can be defined as edge position information for a total of eight vertexes P1 to P8. If the purpose of the vision inspection is to determine whether or not the shield case 120 is positioned correctly, the user may select one of the vertexes P1, P2, and P3 located at the outermost position from the center of gravity of the shield case 120 Corner position information for at least two vertices can be registered as a corner position information set. For example, the user can register the corner position information for the vertex P 1 and the edge position information for the vertex P 3 in FIG. 4 with the corner position information set.

If the purpose of the vision check is to check the shape of the shield case 120, the user can not only determine the corner position information for the vertexes P1, P2, and P3 located at the outermost corner from the center of gravity of the polygon, , Corner position information for other vertexes can also be registered as a corner position information set. In particular, it is desirable for the user to register corner position information for a vertex that can be used as a feature point of the shield case 120. For example, the user can additionally register edge position information for the vertex P6 in the edge position information set, in addition to corner position information for the vertices P1 and P3 in FIG.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

110: printed circuit board
120: Shield case
210:
220:
230:
240:
250: Input
260:

Claims (8)

The first camera capturing a part and extracting first alignment data of the part;
Storing the first alignment data;
Correcting a position of the component on the substrate based on the first alignment data;
Mounting the component on the substrate;
Changing an imaging area of a second camera based on the first alignment data;
The second camera photographing the component and the substrate;
Determining an alignment state of the substrate and the component based on the first alignment data to determine a deviation value; And
And determining an alignment state of the component based on the deviation value. The method according to claim 1,
Wherein the first alignment data includes corner position information of the part,
And the corner position information is plural. The method according to claim 1,
Wherein the step of determining the deviation value comprises: obtaining image information about an alignment state of the substrate and the component;
Detecting a position of the component from the image information; And
And comparing the alignment state of the component and the substrate at the position on the first alignment data with the alignment state of the component and the substrate detected from the image information to determine the deviation value.
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