JP2010262981A - Inter-camera calibration device for electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inter-camera calibration device for an electronic component mounting device, which is adaptive to displacement due to temperature variation and secular change accompanying long-time use at any time, and allows calibration of high precision by reducing movements of an optical member and unnecessary calibration operations as much as possible. <P>SOLUTION: The inter-camera calibration device 20 includes: two optical members 21 and 22 that can move integrally with a component recognition camera 4 and have a half-mirror; and one calibration mark 23 which is recognized by two cameras 2 and 4 through the optical members 21 and 22. Then, the two optical members 21 and 22 are arranged such that when the inter-camera calibration device 20 moves to a predetermined position for the mark recognition camera 2 together with the component recognition camera 4, the total lengths of optical paths from the cameras 2 and 4 to the one calibration mark 23 have specified relation. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate, and in particular, includes a component recognition camera that recognizes an electronic component and a mark recognition camera that recognizes a recognition mark on a substrate, and these two cameras The present invention relates to an inter-camera calibration apparatus that calibrates the amount of shift in the focal height between each other.

First, a conventional electronic component mounting apparatus of this type will be described with reference to the drawings. 4 is an external perspective view of an example of a main part inside the cover of the conventional electronic component mounting apparatus, and FIG. 5 is a front view of the component mounting head.
As shown in FIG. 4, the electronic component mounting apparatus 100 includes an electronic component supply apparatus 9 installed in the electronic component mounting apparatus main body so that an electronic component (not shown) can be supplied, And a circuit board conveyance path 10 for carrying out.

In the vicinity of the electronic component supply device 9, a component recognition camera 4 capable of recognizing a suction position shift in a state where the component suction nozzle 5 sucks the electronic component is disposed in the electronic component mounting apparatus main body. This component recognition camera 4 is installed below the height of the substrate K, and can capture the lower part of the electronic component mounted upward.
A substrate K is placed on the circuit board transport path 10. The substrate K is provided with a recognition mark (not shown) for image recognition for recognizing its own position. A component mounting head 3 having a mechanism (not shown) that allows the component suction nozzle 5 to move in the vertical direction is disposed above the circuit board conveyance path 10.

  As shown in FIG. 5, the component mounting head 3 has a component suction nozzle 5 for sucking an electronic component (in the example shown in the figure, four continuous small component nozzles and one large component nozzle are provided. is doing). Further, a mark recognition camera 2 for recognizing the recognition mark on the substrate K is attached to the component mounting head 3 downward (in the example of the figure, there are two cameras on the left and right). Furthermore, an optical sensor 8 is installed in the component mounting head 3 of this example, and the optical sensor 8 attracts the component suction nozzle 5 to a relatively simple and small electronic component such as a rectangular parallelepiped. A state such as an angle can be recognized without using the component recognition camera 4. Then, the component mounting head 3 together with the mark recognition camera 2 and the component suction nozzle 5 are moved to a necessary position on the substrate K or the like based on a predetermined program, as shown in FIG. The mechanism 7 is appropriately moved in the X-axis and Y-axis directions.

  In the above configuration, in the electronic component mounting apparatus 100, first, the substrate K is carried into a predetermined place of the circuit board transport path 10 that is within the movable range of the component mounting head 3 and positioned. Next, after the component mounting head 3 sucks the electronic component B from the electronic component supply device 9, the electronic component B is mounted at a preprogrammed position on the substrate K. The component mounting head 3 repeatedly picks and mounts the components, and after all the electronic components B are mounted at positions programmed in advance, the substrate K is unloaded from the circuit board transport path 10.

Here, there are, for example, the following two mounting methods between the suction and mounting of the electronic component.
As a first method, the electronic component is adsorbed by the component adsorbing nozzle 5 of the component mounting head 3, the position of the electronic component adsorbed by the optical sensor 8 is recognized, and the amount of deviation is detected by the mark recognition camera 2. There is a method in which the electronic component is mounted at a pre-programmed position on the substrate K by correcting based on the positional deviation amount of the substrate K acquired in advance.

  As a second method, the electronic component is adsorbed by the component adsorbing nozzle 5 of the component mounting head 3, the position deviation state of the electronic component adsorbed by the component recognition camera 4 is recognized, and the deviation amount is set to the first amount. Similarly to the above method, there is a method in which the electronic component is mounted at a pre-programmed position on the substrate K by correcting based on the positional deviation amount of the substrate K acquired in advance by the mark recognition camera 2. In addition to these first and second methods, there is a technique for correcting the positional deviation of the optical device inside the camera, such as the technique described in Patent Document 1, as a method for correcting the position of the mark recognition camera 2 itself. To do.

Here, there is a market demand for high positional accuracy for mounting electronic components. For example, the following three conventional techniques are known based on the first and second methods.
For example, in the technique described in Patent Document 2, an electronic component is adsorbed by a component adsorption nozzle, the adsorbed electronic component is detected by an optical sensor and a component recognition camera, and a detection result by the optical sensor is converted into a detection result by the component recognition camera. Correction is performed based on this.

Further, for example, in the technique described in Patent Document 3, one calibration mark provided on a transparent body is arranged between a component recognition camera and a mark recognition camera, and the focal heights of the component recognition camera and the mark recognition camera are the same. In this state, the component recognition camera and the mark recognition camera make corrections by imaging the calibration marks.
Further, for example, in the technique disclosed in Patent Document 4, when the component recognition camera and the mark recognition camera are arranged at different focal heights, the imaging optical path length setting means is provided movably to the calibration position, and a 45 ° reflection prism or the like. The vertical optical path is changed to a horizontal optical path, and the horizontal optical path is changed to a vertical optical path using a 45 ° -reflecting prism other than the prism, and one calibration mark is changed to a component recognition camera. Correction is performed by taking images with a mark recognition camera.

JP 2008-270649 A JP-A-8-255999 Japanese Unexamined Patent Publication No. 7-162200 JP 2005-032988 A

  However, in the technique described in Patent Document 2, the detection result by the optical sensor can be corrected based on the detection result by the component recognition camera. On the other hand, the mutual shift amount between the optical sensor and the mark recognition camera is acquired. Requires the jig part to be sucked by the part suction nozzle, and after the imaging, the jig part needs to be returned. Therefore, when the production tact is taken into account, it is difficult to acquire the amount of deviation between the optical sensor and the mark recognition camera during production. As a result, it is difficult to cope with displacement due to temperature changes and changes with time due to long-term use. Therefore, it is insufficient for calibrating the amount of shift in the focal height between the two cameras (or sensors).

In the technique described in Patent Document 3, it is necessary to recognize the shift amount between these two cameras in a state where the focal heights of the component recognition camera and the mark recognition camera are the same. Therefore, there is a problem that the production tact becomes longer by the amount of the moving operation for making the two cameras have the same focal height.
Specifically, in order to mount an electronic component on a substrate, it is first necessary to pass the upper side of a device that fixes and carries the substrate. For this reason, in the process of mounting the electronic component on the substrate from the electronic component supply device, the electronic component to be mounted must be moved above the height of the substrate. In other words, in order to eliminate the useless operation and shorten the production tact, it is necessary to set the focus height of the component recognition camera to the height of the electronic component that is moved above the height of the substrate.

  On the other hand, the focus height of the mark recognition camera needs to be adjusted to the height of the upper surface of the substrate in order to recognize the image recognition mark on the substrate. Therefore, if the two cameras are moved to the same focal height, it is necessary to adjust the focal height of the component recognition camera to the height of the mark recognition camera every time calibration is performed. That is, in the process of imaging the electronic component to be mounted by the component recognition camera, a wasteful operation for lowering the position to a low position is required, so that it takes time for each mounting and the production tact becomes long.

  In addition, in order to prevent production tact from extending, the component recognition camera can be moved in the vertical direction so that the component recognition camera can cope with each imaging of the electronic component and the calibration mark. A configuration in which moving means is separately provided is also conceivable. However, in this case, by moving the component recognition camera in the vertical direction, the position of the component recognition camera may be shifted, and it may be difficult to mount the electronic component with high accuracy.

  On the other hand, the technique described in Patent Document 4 is provided with an imaging optical path length setting unit that can be moved to the calibration position. Therefore, although the problem of the technique described in Patent Document 3 can be solved, the imaging optical path is changed. The installation position of an optical member such as a prism required for the above is the same space as the position where the electronic component to be mounted is imaged by the component recognition camera. Therefore, the imaging optical path length setting means needs to move the optical member to the calibration position. Therefore, the movement of the optical member itself shifts the position of the optical member, resulting in a problem that the accuracy at the time of recognition of the calibration mark is lowered and it is difficult to mount the electronic component with high accuracy. .

  Therefore, the present invention has been made paying attention to such a problem, and the calibration of the shift amount of the focal height between the two cameras can be changed to a change due to a temperature change or a change over time due to a long time use. An object is to provide an inter-camera calibration apparatus for an electronic component mounting apparatus that can be adapted at any time and can perform calibration with high accuracy by minimizing movement of optical members and unnecessary calibration operations as much as possible. Yes.

  In order to solve the above-mentioned problems, the present invention has a component recognition camera that recognizes a displacement position of an electronic component and a mark recognition camera that recognizes a recognition mark position on a board, and the focal heights of these two cameras. Is used for an electronic component mounting apparatus having a different layout, and is an inter-camera calibration apparatus that calibrates the amount of deviation of the focal height between the two cameras, the inter-camera calibration apparatus comprising one calibration mark, A first optical member disposed opposite to the mark recognition camera; and a second optical member disposed between the first optical member and the calibration mark, wherein the component recognition camera recognizes an electronic component. While maintaining a possible height, the component recognition camera is provided so as to be movable to a predetermined calibration position with respect to the mark recognition camera, and the first optical member is provided from the calibration mark side. An optical path to the mark recognition camera side and an optical path from the recognition mark side to the mark recognition camera side are secured, and the second optical member is connected from the calibration mark side to the first optical member side. An optical path and an optical path from the electronic component side to the component recognition camera side, respectively, and when the inter-camera calibration device is located at the predetermined calibration position, the one calibration mark and the two The optical member is arranged so that the optical path length from the component recognition camera to the calibration mark is the same as the distance from the electronic component to be mounted to the component recognition camera, and from the mark recognition camera to the calibration mark. The optical path length is arranged to be the same as the distance from the mark recognition camera to the recognition mark on the substrate. .

  According to the inter-camera calibration apparatus for an electronic component mounting apparatus according to the present invention, the inter-camera calibration apparatus is movable together with the component recognition camera, and the first camera is moved to a predetermined calibration position with respect to the mark recognition camera. The optical member secures an optical path from the calibration mark side to the mark recognition camera side and an optical path from the recognition mark side to the mark recognition camera side, and the second optical member is from the calibration mark side to the first optical member side. Since the optical path from the electronic component side to the component recognition camera side is secured, each camera moves the two optical members themselves with respect to each camera through the inter-camera calibration device. The same calibration mark can be imaged without any problem.

  And the height of the component recognition camera is positioned at a predetermined calibration position in a state where the height capable of recognizing the electronic component is maintained, and when the inter-camera calibration device is positioned at the predetermined calibration position, One calibration mark and two optical members are arranged so that the optical path length from the component recognition camera to the calibration mark is the same as the distance from the mounted electronic component to the component recognition camera, and the calibration from the mark recognition camera. The optical path length to the mark is arranged to be the same as the distance from the mark recognition camera to the recognition mark on the substrate. Therefore, the electronic component mounting apparatus equipped with this inter-camera calibration apparatus captures one calibration mark via the first and second optical members by the two cameras and shifts the focal height between the two cameras. By recognizing the amount, the amount of displacement can be corrected when the electronic component is mounted on the board, and the amount of displacement between the two cameras can be acquired in a short time, and calibration can be performed as in the conventional technique described above. Therefore, useless operations such as changing the height are unnecessary, so that the normal production operation can be performed without delay.

  Therefore, according to the inter-camera calibration apparatus for an electronic component mounting apparatus according to the present invention, it is possible to calibrate the displacement amount of the focal height between the two cameras at any time according to a change due to a temperature change or a change with time due to long-term use. In addition, it is possible to perform calibration with high accuracy by minimizing movement of the optical member and unnecessary calibration operation as much as possible.

1 is a perspective view of an electronic component mounting apparatus including an inter-camera calibration apparatus according to the present invention. It is a schematic diagram explaining the inter-camera calibration apparatus according to the present invention. It is a schematic diagram for demonstrating the relationship of the position of a component recognition camera and a mark recognition camera. It is a perspective view of the conventional electronic component mounting apparatus. It is a front view of an example of the component mounting head of the conventional electronic component mounting apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings as appropriate. In addition, about the structure similar to the conventional electronic component mounting apparatus shown in the said FIG.4 and FIG.5, the same code | symbol is attached | subjected and the description is abbreviate | omitted suitably.
FIG. 1 shows an electronic component mounting apparatus equipped with an inter-camera calibration apparatus according to an embodiment of the present invention. As shown in the figure, this electronic component mounting apparatus 1 includes an electronic component supply device 9 installed in the electronic component mounting apparatus main body so that an electronic component (not shown) can be supplied, And a circuit board conveyance path 10 for carrying out.

In the vicinity of the electronic component supply device 9, a component recognition camera 4 capable of recognizing the electronic component is disposed on the electronic component mounting apparatus main body. As shown in FIG. 3, the component recognition camera 4 is installed below the height of the substrate K, and can capture an image of the lower part of the electronic component B mounted upward.
A substrate K is placed on the circuit board transport path 10. The substrate K is provided with a recognition mark (not shown) for image recognition for recognizing its own position. A component mounting head 3 is disposed above the circuit board conveyance path 10.

  The component mounting head 3 has a component suction nozzle 5 that sucks electronic components. Further, a mark recognition camera 2 for recognizing the recognition mark on the board K is attached to the component mounting head 3 downward. The component mounting head 3 is appropriately moved to a necessary position on the substrate K together with the mark recognition camera 2 and the component suction nozzle 5 by an X-axis moving mechanism 6 and a Y-axis moving mechanism 7 based on a predetermined program. It is moved in the X-axis and Y-axis directions.

Here, an inter-camera calibration device 20 is mounted on the component recognition camera 4 in the component mounting head 3, and the inter-camera calibration device 20 is integrated with the component recognition camera 4 and the X-axis moving mechanism 6 and The Y-axis moving mechanism 7 moves in the X-axis and Y-axis directions.
Hereinafter, the inter-camera calibration apparatus 20 will be described in detail.
FIG. 2 is a schematic diagram of the inter-camera calibration apparatus 20. The figure schematically shows a state in which the inter-camera calibration device 20 provided so as to be movable integrally with the component recognition camera 4 has moved to a predetermined calibration position with respect to the mark recognition camera 2. Here, the height of the predetermined calibration position is the height at which the component recognition camera 4 can maintain the electronic component B.

Specifically, the inter-camera calibration apparatus 20 includes a prism mirror 21 as a first optical member, a cube-type beam splatter 22 as a second optical member, and one calibration mark, as shown in FIG. 23 is built in.
The prism mirror 21 and the beam splatter 22 have a half mirror that reflects a part of the light and transmits the other part in order to change and transmit the optical path of the incident light. The half of the transmitted light is transmitted, and the other half can be reflected by 45 °. Moreover, the calibration mark 23 consists of a pinhole on the wall surface of the housing of the lighting device having illumination therein. That is, the calibration mark 23 for correcting the position of the two cameras 2 and 4 is created by irradiating the pinhole with the illumination inside the illumination device.

Here, the inter-camera calibration apparatus 20 is configured such that the beam splatter 22 is positioned when the inter-camera calibration apparatus 20 is located at the predetermined calibration position, the position of the component recognition camera 4, the position of the prism mirror 21, and the calibration mark. The optical path length from the component recognition camera 4 to the calibration mark 23 in FIG. 2 (L1 + H2 in FIG. 2) is mounted from the component recognition camera 4 in FIG. 3 without moving any of the positions 23. It is set to the same to become length as the distance D _B to the electronic component B. Further, the total optical path length from the mark recognition camera 2 to the calibration mark 23 (L1 + L2 + H1 in FIG. 2) in FIG. 2 is the same as the distance D _M from the mark recognition camera 2 to the substrate K shown in FIG. Is set.

Next, the operation, action and effect of the electronic component mounting apparatus will be described.
With the above configuration, in the electronic component mounting apparatus 1, the board K is carried into a predetermined place of the circuit board transport path 10 that is within the movable range of the component mounting head 3 and positioned. Next, after the component mounting head 3 sucks the electronic component B from the electronic component supply device 9, the electronic component B is mounted at a preprogrammed position on the substrate K. The component mounting head 3 repeatedly picks and mounts the components, and after all the electronic components B are mounted at positions programmed in advance, the substrate K is unloaded from the circuit board transport path 10.

  Here, in this electronic component mounting apparatus 1, when measuring the amount of deviation between the component recognition camera 4 and the mark recognition camera 2, first, the mark recognition camera 2 is positioned above the component recognition camera 4 shown in FIG. 2. The two cameras 2 and 4 are moved to a predetermined calibration position determined in advance for recognition of calibration marks (operation 1). Here, the height of the predetermined calibration position is maintained such that the electronic component B can be mounted on the component recognition camera 4.

Next, at this predetermined calibration position, the component recognition camera 4 images the calibration mark 23 via the prism mirror 21 and the beam splatter 22 (operation 2). Similarly, at this predetermined calibration position, the mark recognition camera 2 images the same calibration mark 23 via the beam splatter 22 (operation 3).
By the above (Operation 1) to (Operation 3), the two cameras 2 and 4 capture the same calibration mark 23, so that the shift amount between the two cameras 2 and 4 can be measured. Note that the measurement method of the deviation amount itself is the same as the conventional method, and thus the description is omitted. Thereby, according to the electronic component mounting apparatus 1 provided with the inter-camera calibration device 20, it is possible to mount with high accuracy by correcting the amount of deviation between the two cameras 2 and 4 during the production of mounting the electronic component. Become.

  As described above, according to the electronic component mounting apparatus 1, the component recognition camera 4 and the mark recognition camera 2 image one calibration mark 23 through the prism mirror 21 and the beam splatter 22 of the inter-camera calibration apparatus 20. By recognizing the shift amount of the focal height between the two cameras 2 and 4, the shift amount can be corrected at any time when the electronic component B is mounted on the substrate K. Can be acquired in a short time.

  That is, according to the inter-camera calibration device 20, the inter-camera calibration device 20 can move integrally with the component recognition camera 4, and when the inter-camera calibration device 20 moves to a predetermined calibration position with respect to the mark recognition camera 4, the prism mirror 21 An optical path from the calibration mark 23 side to the mark recognition camera 4 side and an optical path from the recognition mark side of the substrate to the mark recognition camera 4 side are ensured, and the beam splatter 22 is provided from the calibration mark 23 side to the prism mirror 21 side. Since the optical path and the optical path from the electronic component B side to the component recognition camera 4 side are respectively secured, each camera 2, 4 is connected to each camera 2, 4 via the inter-camera calibration device 20. The same calibration mark 23 can be imaged simultaneously without moving the two optical members 21 and 22 themselves.

  Therefore, the mark recognition camera 2 is moved to a predetermined calibration position above the component recognition camera 4 at a timing that does not impair the production tact such as during the loading / unloading of the substrate K. The amount of deviation can be measured. Therefore, the amount of deviation can be acquired in a short time, and the amount of deviation can be acquired using the loading / unloading time of the substrate K. Therefore, it is possible to cope with changes in the amount of deviation over time, and high-precision component mounting is always possible. Can be secured.

The predetermined calibration position is maintained at a height at which the component recognition camera 4 can mount the electronic component B. When the inter-camera calibration device 20 is located at the predetermined calibration position, one calibration is performed. mark 23 and two optical members 21 and 22, so that the optical path length from the component recognition camera 4 to the calibration mark 23 (L1 + H2) is equal to the distance D _B from the electronic component B is mounted to the component recognition camera 4 together are arranged, the optical path length from the mark recognition camera 2 to the calibration mark 23 (L1 + L2 + H1) is since it is arranged to be the same as the distance D _M from the mark recognition camera 2 to the recognition mark of the substrate, the substrate K When the electronic component mounted on the camera is imaged by the component recognition camera 4, it is not necessary to lower the electronic component to the focus height of the mark recognition camera 2. Therefore, the production tact can be shortened as much as possible. Further, since it is not necessary to move the component recognition camera 4 itself, the correction amount can be acquired with high positional accuracy, and thus the electronic component B can be mounted with high accuracy. Further, since the calibration mark 23 (inter-camera calibration device 20) is fixed on the mark recognition camera 2 side, the correction amount can be acquired with high positional accuracy, and electronic components can be mounted with high accuracy.

The inter-camera calibration apparatus for an electronic component mounting apparatus according to the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention.
For example, in the above-described embodiment, the example in which the prism mirror 21 is used as the first optical member has been described. However, the present invention is not limited thereto, and a similar effect can be obtained by performing a half mirror process on a transparent body other than the prism mirror. It is done.

  Further, for example, in the above-described embodiment, an example in which one calibration mark 23 is formed by a pinhole fixed to the illumination device is described. However, the present invention is not limited to this. For example, the illumination device remains as it is and only the calibration mark 23 is used. Can be used as coaxial epi-illumination of the mark recognition camera 2 by being provided on the optical path outside the illuminating device apart from the illuminating device.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Mark recognition camera 3 Component mounting head 4 Component recognition camera 5 Component adsorption nozzle 6 X-axis movement mechanism 7 Y-axis movement mechanism 8 Optical sensor 9 Electronic component supply apparatus 10 Circuit board conveyance path 20 Inter-camera calibration apparatus 21 Prism mirror (first optical member)
22 Beam splatter (second optical member)
23 Calibration mark B Electronic component K Substrate

Claims (1)

The component recognition camera 4 for recognizing an electronic component and the mark recognition camera 2 for recognizing a recognition mark on the board M are used in an electronic component mounting apparatus having a layout in which the focal heights of these two cameras are different from each other. An inter-camera calibration device 20 that calibrates the amount of deviation in the focal height between two cameras,
The inter-camera calibration device 20 is arranged between one calibration mark 23, a first optical member 21 arranged to face the mark recognition camera 2, and between the first optical member and the calibration mark 23. The second optical member 22 and the component recognition camera 4 can move to a predetermined calibration position with respect to the mark recognition camera 2 together with the component recognition camera 4 while maintaining a height at which the component recognition camera 4 can recognize electronic components. It is provided in
The first optical member 21 secures an optical path from the calibration mark 23 side to the mark recognition camera 2 side and an optical path from the recognition mark side to the mark recognition camera side, and the second optical member. 22 respectively secures an optical path from the calibration mark 23 side to the first optical member 21 side and an optical path from the electronic component side to the component recognition camera side 4;
Further, when the inter-camera calibration device 20 is located at the predetermined calibration position, the one calibration mark 23 and the two optical members 21 and 22 are arranged so that the optical path length from the component recognition camera to the calibration mark 23 is increased. Is arranged to be the same as the distance from the electronic component to be mounted to the component recognition camera, and the optical path length from the mark recognition camera 2 to the calibration mark 23 is the recognition of the substrate from the mark recognition camera 2 An inter-camera calibration apparatus 20 for an electronic component mounting apparatus, which is disposed so as to have the same distance as a mark.

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